WO2024007432A1

WO2024007432A1 - Intelligent power module and electrical device

Info

Publication number: WO2024007432A1
Application number: PCT/CN2022/115892
Authority: WO
Inventors: 邓新贵; 胡渊; 吴桢生
Original assignee: 苏州汇川控制技术有限公司
Priority date: 2022-06-16
Filing date: 2022-08-30
Publication date: 2024-01-11
Also published as: CN217904884U

Abstract

Disclosed in the present application are an intelligent power module and an electrical device, belonging to the electrical technical field. The intelligent power module comprises: a first circuit board (10), the first circuit board (10) being provided with at least one power chip; at least one electrical connection member (11), the electrical connection member (11) being mounted on the surface of the first circuit board (10) provided with the power chip; a second circuit board (20), the electrical connection member (11) penetrating through the second circuit board (20), and the second circuit board (20) being spaced apart from the first circuit board (10); a first filling layer (30), the first filling layer (30) being arranged on one side of the first circuit board (10), and the first filling layer (30) wrapping the power chip; and a second filling layer (40), the second filling layer (40) being arranged on the side of the first filling layer (30) facing away from the first circuit board (10), wherein the first filling layer (30) is made of a first insulation material, the second filling layer (40) is made of a second insulation material, and the hardness of the second insulation material after curing is greater than the hardness of the first insulation material after curing.

Description

Intelligent power modules and electrical equipment

This application claims priority to the Chinese patent application with application number 202221732688.9 filed on July 6, 2022.

Technical field

This application relates to the field of electrical technology, and in particular to an intelligent power module and electrical equipment.

Background technique

In related technologies, Intelligent Power Module (IPM, Intelligent Power Module) is a power switching device with the advantages of small size, high power density and low cost.

A well-known IPM includes: a power circuit substrate, a built-in functional circuit board and a packaging shell; the built-in functional circuit board is directly welded to the terminals protruding from the power circuit substrate, and then the packaging shell is placed on the built-in functional circuit board. The bottom opening of the packaging case is sealed with the power circuit substrate, and finally glue is poured and solidified to form a stacked packaging structure. During use, due to control strategies or interference, the power chips on the power circuit substrate in the IPM are at risk of exploding.

Currently, existing IPMs do not have explosion-proof functions. When the power chip on the power circuit substrate explodes, the explosion impact will destroy the insulation isolation system on the surface of the built-in functional circuit board, threatening the user's personal safety.

technical problem

The main purpose of this application is to provide an intelligent power module and electrical equipment, aiming to solve the above-mentioned problem that the existing IPM does not have an explosion-proof function. When the chip in the module explodes, it will destroy the insulation isolation system on the surface of the built-in functional circuit board. Issues that threaten users’ personal safety.

Technical solutions

In order to achieve the above purpose, this application proposes an intelligent power module, including:

a first circuit board, the first circuit board is provided with at least one power chip;

At least one electrical connector, the electrical connector is installed on the side of the first circuit board on which the power chip is provided;

a second circuit board, the second circuit board passes through the electrical connector and is spaced apart from the first circuit board;

A first filling layer, the first filling layer is provided on one side of the first circuit board, and the first filling layer wraps the power chip provided on the first circuit board;

a second filling layer, the second filling layer being disposed on a side of the first filling layer facing away from the first circuit board;

Wherein, the first filling layer is made of a first insulating material, the second filling layer is made of a second insulating material, and the hardness of the second insulating material after curing is greater than that of the first insulating material after curing. of hardness.

In one embodiment, electronic components are provided on both the upper and lower surfaces of the second circuit board; the smart power module further includes:

A third filling layer, the third filling layer is provided on a side of the second filling layer away from the first filling layer, and the third filling layer wraps the electrons provided on the lower surface of the second circuit board. components;

A fourth filling layer, the fourth filling layer is disposed on the upper surface of the second circuit board and wraps the electronic components disposed on the upper surface of the second circuit board;

Wherein, both the third filling layer and the fourth filling layer adopt a second insulating material; or, the third filling layer adopts a second insulating material, and the fourth filling layer adopts a first insulating material; or, The third filling layer and the fourth filling layer both adopt a first insulating material.

In one embodiment, the first insulating material is silicone gel.

In one embodiment, the second insulating material is resin.

In one embodiment, a plurality of power chips is provided on a side of the first circuit board facing the second circuit board, and the plurality of power chips constitute at least one power circuit;

The electronic components on the upper and lower surfaces of the second circuit board constitute a primary-side functional circuit, an isolation component and a secondary-side functional circuit. The input end of the primary-side functional circuit is electrically connected to the power circuit through the electrical connector. The output end of the primary side functional circuit is electrically connected to the secondary side functional circuit through the isolation element.

In one embodiment, at least one first through hole corresponding to at least one of the electrical connectors is opened on the second circuit board;

The electrical connector passes through the corresponding first through hole, and is electrically and mechanically connected to the second circuit board by welding or crimping at the first through hole.

In one embodiment, the electrical connector includes:

Welding seat, the bottom end of the welding seat is welded on the first circuit board;

Electrical connection terminal, the bottom end of the electrical connection terminal is located in the welding hole of the soldering base, the other end of the electrical connection terminal passes through the corresponding first through hole, and is in the first through hole The circuit board is electrically and mechanically connected to the second circuit board by welding or crimping.

In one embodiment, the intelligent power module further includes:

A housing with an opening at the bottom. The first circuit board blocks the bottom opening of the housing and defines an accommodation space with the first circuit board. The second circuit board is located in the accommodation space. Inside;

A plurality of second through holes are opened in the housing, and the top ends of some of the electrical connectors extend out of the housing through the second through holes;

A first potting hole is formed on the top plate of the housing, and a second potting hole is formed on the second circuit board at a position corresponding to the first potting hole.

In a second aspect, this application also provides an electrical device, including the intelligent power module described in any one of the above.

beneficial effects

The technical solution of the present application covers at least one electronic component on one side of the first circuit board with a first filling layer, and a second filling layer is provided on the side of the first filling layer facing away from the first circuit board, wherein the first filling layer The filling layer is made of a first insulating material, the second filling layer is made of a second insulating material, and the hardness of the second insulating material after curing is greater than the hardness of the first insulating material after curing. Therefore, in this embodiment, on the basis of the existing first filling layer formed using the first insulating material, a second insulating material with a higher hardness is used to form the first filling layer on the side away from the first circuit board. The second filling layer can play an explosion-proof role, so that when the power chip on the first circuit board explodes or other unexpected situations, the explosion shock wave is isolated on one side of the second filling layer to avoid the explosion shock wave. Destroying the reinforced insulation isolation system on the surface of the second circuit board improves the safety of the IPM.

Description of the drawings

In order to explain the embodiments of the present application or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of an embodiment of the intelligent power module of the present application;

Figure 2 is an exploded view of an embodiment of the smart power module of the present application, in which the filling layer is not shown.

Explanation of reference numbers:

标号 label	名称 name	标号 label	名称 name
10 10	第一电路板 first circuit board	20 20	第二电路板 Second circuit board
30 30	第一填充层 first filling layer	40 40	第二填充层 second filling layer
50 50	第三填充层 third filling layer	60 60	第四填充层 The fourth filling layer
70 70	壳体 case	11 11	电连接件 Electrical connectors
21 twenty one	第一通孔 first through hole	71 71	第二通孔 second through hole
22 twenty two	第二灌封孔 Second potting hole	72 72	第一灌封孔 First potting hole

The realization of the purpose, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.

Embodiments of the invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relationship between components in a specific posture (as shown in the drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

In this application, unless otherwise clearly stated and limited, the terms "connection", "fixing", etc. should be understood in a broad sense. For example, "fixing" can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In addition, if there are descriptions involving “first”, “second”, etc. in the embodiments of this application, the descriptions of “first”, “second”, etc. are only for descriptive purposes and shall not be understood as indications or implications. Its relative importance or implicit indication of the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the meaning of "and/or" appearing in the entire text includes three parallel solutions. Taking "A and/or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B at the same time. In addition, the technical solutions in various embodiments can be combined with each other, but it must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that such a combination of technical solutions does not exist. , nor is it within the scope of protection required by this application.

Existing IPMs do not have explosion-proof functions. When the power chip on the power circuit substrate explodes, the explosion impact will destroy the insulating adhesive adhesion effect between the power circuit substrate and the built-in functional circuit board. Some explosion impacts may even cause direct damage. The components on the built-in functional circuit board not only cause the loss of the entire product, but even threaten the personal safety of the user. This application provides an intelligent power module that uses a first filling layer formed of a first insulating material in the existing 30, by using a second insulating material with higher hardness to form a second filling layer 40 that wraps the second circuit board 20. The second filling layer 40 can play an insulating protection and explosion-proof role, so that the first circuit board 10 When the electronic components on the second circuit board 20 explode or other unexpected situations occur, the insulation isolation system on the second circuit board 20 and the components on the second circuit board 20 can be prevented from being affected, thereby improving the reliability of the enhanced insulation protection capability of the IPM on the one hand. and the safety of IPM, on the other hand, it reduces the losses caused by the explosion of electronic components on the first circuit board 10 .

The concept of the present application will be further elaborated below in conjunction with some specific embodiments.

This application provides an intelligent power module.

Referring to Figure 1, in this embodiment, an intelligent power module includes:

A first circuit board 10, the first circuit board 10 is provided with at least one power chip;

At least one electrical connector 11, the electrical connector 11 is installed on the side of the first circuit board 10 on which the power chip is provided;

a second circuit board 20. The second circuit board 20 is inserted through the electrical connector 11 and is spaced apart from the first circuit board 10;

A first filling layer 30 is provided on one side of the first circuit board 10, and the first filling layer 30 wraps the power chip provided on the first circuit board 10;

a second filling layer 40, the second filling layer 40 is disposed on the side of the first filling layer 30 away from the first circuit board 10;

Wherein, the first filling layer 30 is made of a first insulating material, the second filling layer 40 is made of a second insulating material, and the hardness of the second insulating material after curing is greater than that of the first insulating material. Hardness after curing.

In this embodiment, the first insulating material includes but is not limited to insulating materials with good thermal conductivity such as silicone gel; the second insulating material includes but is not limited to resin and the like and has a higher hardness after curing, making the second filling Layer 40 is an insulating material with explosion-proof function. Since the second filling layer 40 with explosion-proof function is provided on the side of the first filling layer 30 away from the first circuit board 10, the second filling layer 40 can protect the insulation isolation system on the surface of the second circuit board 20 when the chip explodes. It will not be destroyed, thereby improving the security of the intelligent function module.

In this embodiment, the intelligent power module can be formed through secondary potting or third potting. When the smart power module is formed after secondary potting, the first insulating material is used to cover the power device on the upper surface of the first circuit board 10 to form the first filling layer 30 in the primary potting, and the second insulating material is used to wrap it The electronic components on the upper and lower surfaces of the second circuit board 20 form the second filling layer 40 , the third filling layer 50 and the fourth filling layer 60 . When the smart power module is formed after three pottings, the first potting uses the first insulating material to cover the power device on the upper surface of the first circuit board 10 to form the first filling layer 30 , and the second potting uses the second insulating material to cover the first filling layer 30 . A second filling layer 40 is formed on the side of a filling layer 30 away from the first circuit board 10 and there is a gap between the second filling layer 40 and the electronic components provided on the lower surface of the second circuit board 20. The third potting uses the first filling layer 40. The insulating material forms a third filling layer 50 and a fourth filling layer 60 on the lower and upper surfaces of the second circuit board 20 respectively; or, a power device covering the upper surface of the first circuit board 10 with the first insulating material is potted to form the third filling layer 50 and the fourth filling layer 60 respectively. A filling layer 30, a second insulating material is used for the second potting to form a second filling layer 40 and a third filling layer 50 on the side of the first filling layer 30 away from the first circuit board 10, and the first insulating material is used for the third potting. A fourth filling layer 60 is formed on the upper surface of the second circuit board 20 . It should be noted that in this application, the first, second, third and fourth filling layers are used only to facilitate the description of different embodiments. In specific implementation, when two adjacent layers use the same insulating material, the The space is not actually layered, but is formed by potting at once.

In one embodiment, as shown in Figure 1 , electronic components are provided on both the upper and lower surfaces of the second circuit board 20; the smart power module also includes:

The third filling layer 50 is disposed on the side of the second filling layer 40 away from the first filling layer 30 , and the third filling layer 50 wraps the second circuit board 20 Electronic components provided on the lower surface;

The fourth filling layer 60 is provided on the upper surface of the second circuit board 20 and wraps the electronic components provided on the upper surface of the second circuit board 20;

Wherein, the third filling layer 50 and the fourth filling layer 60 are both made of a second insulating material; or the third filling layer 50 is made of a second insulating material, and the fourth filling layer 60 is made of a first insulating material. material; alternatively, both the third filling layer 50 and the fourth filling layer 60 adopt a first insulating material.

In one embodiment, a plurality of power chips is provided on the side of the first circuit board 10 facing the second circuit board 20, and the plurality of power chips constitute at least one power circuit;

The electronic components on the upper and lower surfaces of the second circuit board 20 form a primary-side functional circuit, an isolation component and a secondary-side functional circuit. The input end of the primary-side functional circuit is connected to the power through the electrical connector 11 The circuit is electrically connected, and the output end of the primary-side functional circuit is electrically connected to the secondary-side functional circuit through the isolation element.

In this embodiment, the first circuit board 10 includes but is not limited to an aluminum-based resin copper-clad laminate, a copper-based resin copper-clad laminate, or a double-sided copper-clad ceramic substrate, and multiple power chips are welded on the first circuit board 10 , multiple power chips are composed of, but are not limited to, inverter, rectifier and other power circuit units; the first filling layer 30 wraps the power circuit.

In this embodiment, the second circuit board 20 is provided with a primary-side functional circuit electrically connected to the power circuit on the first circuit board 10 through the electrical connector 11 and a primary-side functional circuit through an isolation element. The functional circuit is an electrically connected secondary side functional circuit. In one embodiment, the primary side functional circuit includes but is not limited to an inverter drive circuit and/or a rectifier drive circuit; the secondary side functional circuit includes but is not limited to a signal sampling circuit, an overcurrent/overvoltage protection circuit, etc. .

In this embodiment, the second circuit board 20 is provided with at least one first through hole 21 corresponding to at least one of the electrical connectors 11; the electrical connector 11 passes through the corresponding first through hole. hole 21, and realizes electrical connection and mechanical connection with the second circuit board 20 through welding or crimping at the first through hole 21. In one embodiment, the electrical connector 11 includes:

Welding seat, the bottom end of the welding seat is welded on the first circuit board 10;

Electrical connection terminal, the bottom end of the electrical connection terminal is located in the welding hole of the soldering base, the other end of the electrical connection terminal passes through the corresponding first through hole 21, and is in the first through hole 21. The hole 21 is electrically and mechanically connected to the second circuit board 20 by welding or crimping.

Referring to Figure 2, in one embodiment, the smart power module further includes:

The shell 70 has an opening at the bottom. The first circuit board 10 blocks the bottom opening of the shell 70 and defines a receiving space with the first circuit board 10. The second circuit board 20 is located Within the accommodation space;

A number of second through holes 71 are formed in the housing 70 , and the top ends of some of the electrical connectors 11 extend out of the housing 70 through the second through holes 71 ;

A first potting hole 72 is formed on the top plate of the housing 70 , and a second potting hole 22 is formed on the second circuit board 20 at a position corresponding to the first potting hole 72 .

In this embodiment, the intelligent power module can be formed through secondary potting or third potting.

During packaging, the electrical connector 11 on the first circuit board 10 is first passed through the through hole on the second circuit board 20, and then the second circuit board 20 is fixed to the first circuit board 10 through a supporting tool. above, the second circuit board 20 is then welded or crimped on the electrical connector 11, and then the housing 70 is installed on the first circuit board 10, and then the first potting hole 72 and the second potting hole are used. Hole 22 is potted.

It can be seen from the above that in this embodiment, on the basis of the existing first filling layer 30 formed using a first insulating material, a second insulating material with a higher hardness after curing is used in the first filling layer 30 away from the first circuit. A second filling layer 40 is formed on one side of the board 10, so that the second filling layer 40 can play an explosion-proof role, so that when the power chip on the first circuit board 10 explodes or other unexpected situations, the explosion shock wave is isolated from the first circuit board 10. The side of the second filling layer 40 prevents the explosion shock wave from destroying the reinforced insulation isolation system on the surface of the second circuit board 20, thereby improving the safety of the IPM.

In a second aspect, this application also provides an electrical device, including the intelligent power module as mentioned above. The specific structure of the smart power module refers to the above-mentioned embodiments. Since this appliance adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the functions brought by the technical solutions of the above-mentioned embodiments, which will not be described again here.

The electrical equipment includes but is not limited to frequency converters, which is not limited in this embodiment.

The above are only optional embodiments of the present application, and are not intended to limit the patent scope of the present application. Under the inventive concept of the present application, any equivalent structural transformation made by using the contents of the description and drawings of the present application, or direct/indirect Application in other related technical fields is included in the scope of patent protection of this application.

Claims

An intelligent power module includes:

a first circuit board, the first circuit board is provided with at least one power chip;

At least one electrical connector, the electrical connector is installed on the side of the first circuit board on which the power chip is provided;

a second circuit board, the second circuit board passes through the electrical connector and is spaced apart from the first circuit board;

A first filling layer, the first filling layer is provided on one side of the first circuit board, and the first filling layer wraps the power chip provided on the first circuit board;

a second filling layer, the second filling layer being disposed on a side of the first filling layer facing away from the first circuit board;

Wherein, the first filling layer is made of a first insulating material, the second filling layer is made of a second insulating material, and the hardness of the second insulating material after curing is greater than that of the first insulating material after curing. of hardness.
The smart power module according to claim 1, wherein electronic components are provided on both the upper and lower surfaces of the second circuit board; the smart power module further includes:

A third filling layer, the third filling layer is provided on a side of the second filling layer away from the first filling layer, and the third filling layer wraps the electrons provided on the lower surface of the second circuit board. components;

A fourth filling layer, the fourth filling layer is disposed on the upper surface of the second circuit board and wraps the electronic components disposed on the upper surface of the second circuit board;

Wherein, both the third filling layer and the fourth filling layer adopt a second insulating material; or, the third filling layer adopts a second insulating material, and the fourth filling layer adopts a first insulating material; or, The third filling layer and the fourth filling layer both adopt a first insulating material.
The intelligent power module according to claim 1, wherein the first insulating material is silicone gel.
The intelligent power module according to claim 1, wherein the second insulating material is resin.
The intelligent power module according to claim 2, wherein the first circuit board is provided with a plurality of power chips on a side facing the second circuit board, and the plurality of power chips constitute at least one power circuit;

The electronic components on the upper and lower surfaces of the second circuit board constitute a primary-side functional circuit, an isolation component and a secondary-side functional circuit. The input end of the primary-side functional circuit is electrically connected to the power circuit through the electrical connector. The output end of the primary side functional circuit is electrically connected to the secondary side functional circuit through the isolation element.
The smart power module according to claim 1, wherein at least one first through hole corresponding to at least one of the electrical connectors is opened on the second circuit board;

The electrical connector passes through the corresponding first through hole, and is electrically and mechanically connected to the second circuit board by welding or crimping at the first through hole.
The intelligent power module according to claim 6, wherein the electrical connector includes:

Welding seat, the bottom end of the welding seat is welded on the first circuit board;

Electrical connection terminal, the bottom end of the electrical connection terminal is located in the welding hole of the soldering base, the other end of the electrical connection terminal passes through the corresponding first through hole, and is in the first through hole The circuit board is electrically and mechanically connected to the second circuit board by welding or crimping.
The intelligent power module according to claim 1, further comprising:

A housing with an opening at the bottom. The first circuit board blocks the bottom opening of the housing and defines an accommodation space with the first circuit board. The second circuit board is located in the accommodation space. Inside;

A plurality of second through holes are opened in the housing, and the top ends of some of the electrical connectors extend out of the housing through the second through holes;

A first potting hole is formed on the top plate of the housing, and a second potting hole is formed on the second circuit board at a position corresponding to the first potting hole.
An electrical device, including the intelligent power module according to any one of claims 1 to 8.