CN114867199A - Intelligent power module and electrical equipment - Google Patents
Intelligent power module and electrical equipment Download PDFInfo
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- CN114867199A CN114867199A CN202210683517.XA CN202210683517A CN114867199A CN 114867199 A CN114867199 A CN 114867199A CN 202210683517 A CN202210683517 A CN 202210683517A CN 114867199 A CN114867199 A CN 114867199A
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- circuit board
- power module
- explosion
- support
- plate body
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- 238000003466 welding Methods 0.000 claims description 26
- 238000004880 explosion Methods 0.000 claims description 20
- 229920000784 Nomex Polymers 0.000 claims description 12
- 238000002955 isolation Methods 0.000 claims description 12
- 239000004763 nomex Substances 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 238000004382 potting Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000035939 shock Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000003292 glue Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses an intelligent power module and electrical equipment, and belongs to the field of electrical equipment. The intelligent power module includes: a first circuit board; at least one electrical connector mounted on the first circuit board; the second circuit board penetrates through the electric connecting piece and is arranged at an interval with the first circuit board; one surface of the first circuit board facing the second circuit board is provided with a power chip; and the explosion-proof piece is used for avoiding the electric connecting piece and is arranged between the first circuit board and the second circuit board. The application improves the security of the IPM.
Description
Technical Field
The invention relates to the field of electrical equipment, in particular to an intelligent power module and electrical equipment.
Background
In the related art, an Intelligent Power Module (IPM) is a Power switch device, and has the advantages of small size, high Power density, and low cost.
One known IPM includes: the power circuit comprises a power circuit substrate, a built-in functional circuit board and a packaging shell; the built-in functional circuit board is directly welded on a terminal extending out of the power circuit substrate, then the packaging shell is covered on the built-in functional circuit board, the bottom opening of the packaging shell is blocked through the power circuit substrate, and finally glue is poured and cured to form a stack laminated packaging structure. During use, the power chip on the power circuit substrate in IPM is at risk of explosion due to control strategy or interference.
At present, the existing IPM does not have an explosion-proof function, and when a power chip on a power circuit substrate explodes, explosion impact can damage an insulation isolation system on the surface of the circuit board with a built-in function, so that personal safety of a user is threatened.
Disclosure of Invention
The invention mainly aims to provide an intelligent power module and electrical equipment, and aims to solve the problems that the conventional IPM does not have an explosion-proof function, and when a power chip on a power circuit substrate explodes, explosion impact can damage an insulation isolation system on the surface of a circuit board with a built-in function, and the personal safety of a user is threatened.
In order to achieve the above object, the present invention provides an intelligent power module, including:
a first circuit board;
at least one electrical connector mounted on the first circuit board;
the second circuit board penetrates through the electric connecting piece and is arranged at an interval with the first circuit board; one surface of the first circuit board facing the second circuit board is provided with a power chip; and the number of the first and second groups,
the explosion-proof piece is used for avoiding the electric connecting piece and is arranged between the first circuit board and the second circuit board.
In one embodiment, a plurality of power chips are arranged on one surface of the first circuit board facing the second circuit board, and the plurality of power chips form at least one power circuit;
the second circuit board is provided with a primary side functional circuit electrically connected with at least one power circuit through the electric connector and a secondary side functional circuit connected with the primary side functional circuit through an isolation element.
In one embodiment, the orthographic projection area of the explosion-proof piece on the second circuit board at least covers the secondary side functional circuit area.
In one embodiment, the explosion-proof part is made of plastic parts, PCB bare boards or NOMEX insulating paper.
In one embodiment, when the explosion-proof component is a plastic component, the explosion-proof component includes:
the plate body, the plate body orientation the one side of second circuit board is provided with first support piece, first support piece butt in the second circuit board.
In one embodiment, the first support comprises:
the top ends of the plurality of supporting flanges abut against the second circuit board; and/or the presence of a gas in the gas,
at least one first support column, the one end setting of first support column is in the plate body orientation the one side of second circuit board, the other end butt of first support column in the second circuit board.
In an embodiment, when the first supporting member includes a plurality of supporting flanges arranged at intervals along the circumferential direction of the plate body, the first supporting member further includes a reinforcing rib arranged along the circumferential direction of the plate body, and the bottom ends of the plurality of supporting flanges are arranged at intervals on the reinforcing rib.
In an embodiment, the second circuit board is provided with a positioning hole, and the plate body is provided with a positioning column matched with the positioning hole.
In one embodiment, the board body is provided with a guiding hole for avoiding the electrical connector, and the electrical connector includes:
the bottom end of the welding seat is welded on the first circuit board;
the bottom end of the electric connecting terminal is arranged in the welding hole of the welding seat, and the other end of the electric connecting terminal passes through the corresponding guide hole on the plate body and then penetrates through the second circuit board;
one surface of the plate body facing to the first circuit board is abutted or fixed on the welding seat.
In one embodiment, a supporting portion is formed on one surface of the plate body facing the first circuit board along the periphery of the guide hole;
one end of the supporting part, which is far away from the plate body, is abutted against the upper surface of the welding seat; or,
one end of the supporting part, which is far away from the plate body, is in interference fit with the welding seat.
In an embodiment, a second supporting member is disposed on a surface of the board body facing the first circuit board, and the second supporting member abuts against an upper surface of the first circuit board.
In an embodiment, the second supporting member includes at least one second supporting pillar, one end of the second supporting pillar is disposed on a surface of the board body facing the first circuit board, and the other end of the second supporting pillar abuts against the first circuit board.
In an embodiment, the smart power module further includes:
the bottom of the shell is provided with an opening, the first circuit board blocks the opening at the bottom of the shell and defines an accommodating space with the shell, and the second circuit board and the explosion-proof piece are both positioned in the accommodating space; a plurality of second through holes are formed in a top plate of the shell, and the top end of part of the electric connecting piece penetrates through the second through holes and extends out of the shell;
potting holes for potting insulating media are formed in the shell, the second circuit board and the explosion-proof piece, and the insulating media are filled in the gaps of the accommodating space.
In one embodiment, a gap is provided between the outer periphery of the explosion proof member and the inner wall of the housing.
In one embodiment, when the explosion-proof component is a bare PCB, the bare PCB is provided with a welding hole for penetrating the electrical connector;
and at least one electric connector on the first circuit board penetrates through a corresponding welding hole on the PCB bare board and is welded with the welding hole, so that the PCB bare board is fixed between the first circuit board and the second circuit board.
In one embodiment, when NOMEX insulating paper is adopted as the explosion-proof piece, an adhesive part is arranged on the electric connecting piece, and the electric connecting piece penetrates through the NOMEX insulating paper and is adhered with the NOMEX insulating paper through the adhesive part.
In a second aspect, the present application also provides an electrical device comprising the smart power module of any one of the above.
According to the technical scheme, the explosion-proof piece is additionally arranged between the first circuit board and the second circuit board, so that the explosion shock wave can be isolated on one side of the explosion-proof piece when the power chip explodes, the explosion shock wave is prevented from damaging an insulation isolation system on the other side of the explosion-proof piece, and the safety of the intelligent power module is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is an exploded view of one embodiment of a smart power module of the present invention;
FIG. 2 is a front view of another embodiment of a smart power module of the present invention;
FIG. 3 is a front view of an explosion proof member of the smart power module of the present invention;
fig. 4 is a schematic structural diagram of an explosion-proof member of the smart power module of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
24 | |
| 20 | Explosion- |
25 | Avoiding |
| 30 | |
26、33、41 | |
| 40 | |
27 | |
| 11 | |
28 | Supporting |
| 111 | |
29 | |
| 112 | |
31 | Locating |
| 21 | |
32 | First through |
| 22 | Reinforcing |
50 | Insulating |
| 23 | Support flange | 42 | Second through hole |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise explicitly stated or limited, the terms "connected", "fixed", and the like are to be understood broadly, for example, "fixed" may be fixedly connected, may be detachably connected, or may be integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
To current IPM do not have explosion-proof function, when the power chip on the power circuit substrate explodes, the insulating isolation system on built-in function circuit board surface can be destroyed in the explosion impact, threaten user's personal safety's problem, the application provides an intelligent power module, through add an explosion-proof piece 20 between first circuit board 10 and second circuit board 30, can be when the power chip explodes, with explosion shock wave isolation in one side of explosion-proof piece 20, avoid explosion shock wave to destroy the insulating isolation system on explosion-proof piece 20 opposite side second circuit board 30 surface, the security of IPM has been improved.
The concept of the present application is further illustrated below with reference to some specific embodiments.
Referring to fig. 1, an embodiment of the present invention provides an intelligent power module including:
a first circuit board 10;
at least one electrical connector 11, said electrical connector 11 being mounted on said first circuit board 10;
the second circuit board 30 is arranged through the electric connector 11, and the second circuit board 30 is arranged at intervals with the first circuit board 10; a power chip is arranged on one surface of the first circuit board 10 facing the second circuit board 30; and the number of the first and second groups,
and the explosion-proof piece 20 is arranged between the first circuit board 10 and the second circuit board 30, and the explosion-proof piece 20 is arranged to avoid the electric connecting piece 11.
The first circuit board 10 includes, but is not limited to, an aluminum-based resin copper clad laminate, a copper-based resin copper clad laminate, or a double-sided copper clad ceramic substrate, and one side of the first circuit board 10 facing the second circuit board 30 is provided with a plurality of power chips, and the plurality of power chips constitute at least one power circuit, for example: the plurality of power chips form power circuit units including but not limited to inversion, rectification and the like.
The second circuit board 30 is provided with a plurality of first through holes 32, the electrical connector 11 correspondingly penetrates through the first through holes 32, and the electrical connector is electrically and mechanically connected with the second circuit board 30 at the first through holes 32 by welding or crimping. The second circuit board 30 is provided with a primary side functional circuit electrically connected to the power circuit on the first circuit board 10 through the electrical connector 11, and a secondary side functional circuit electrically connected to the primary side functional circuit through an isolation element. The forward projection area of the explosion proof member 20 on the second circuit board 30 covers at least the secondary side functional circuit area. Wherein the primary side functional circuit includes, but is not limited to, an inverter driving circuit and/or a rectifier driving circuit; the secondary side functional circuit includes, but is not limited to, a signal sampling circuit, an overcurrent/overvoltage protection circuit, etc.
Wherein, intelligent power module still includes: a housing 40 with an opening at the bottom, wherein the first circuit board 10 blocks the opening at the bottom of the housing 40 and defines an accommodating space with the housing 40, and the second circuit board 30 and the explosion-proof part 20 are both located in the accommodating space; a plurality of second through holes 42 are formed in a top plate of the housing 40, and the top end of a part of the electric connector 11 passes through the second through holes 42 and extends out of the housing 40.
Wherein, an avoiding part for avoiding the electric connector 11 is arranged on the explosion-proof piece 20. In one embodiment, as shown in fig. 1, the relief portion is at least one relief hole 25 corresponding to the at least one electrical connector 11. Of course, in other implementation examples, when the electrical connector 11 is only located near the peripheral side of the first circuit board 10, the avoiding portion may also be a concave portion disposed around the explosion-proof member 20 to avoid the electrical connector. Preferably, the explosion-proof member 20 includes, but is not limited to, a plastic member, a PCB bare board, or NOMEX insulating paper.
Preferably, potting holes 26, 33, 41 for potting insulating media 50 are formed in the housing 40, the second circuit board 30 and the explosion-proof piece 20, and the insulating media 50 are filled in the gap of the accommodating space. In the present embodiment, the gaps between the first circuit board 10 and the explosion-proof member 20, between the explosion-proof member 20 and the second circuit board 30, and between the second circuit board 30 and the top plate of the housing 40 are filled with insulating media 50. Wherein the insulating medium 50 includes, but is not limited to, silicone gel. The insulating medium can play a role in enhancing the insulating isolation. Preferably, a gap is formed between the outer circumference of the explosion-proof member 20 and the inner wall of the housing 40. So on the one hand be convenient for the encapsulating, on the other hand is convenient for discharge smoothly the bubble that produces when encapsulating, improves embedment effect. In this embodiment, the explosion-proof component 20 can isolate the explosion shock wave at one side of the explosion-proof component 20 when the power chip on the first circuit board 10 explodes, so as to prevent the explosion-proof component 20 from damaging the adhesive effect of the insulating adhesive on the surface of the second circuit board, thereby improving the safety of the intelligent functional module.
Of course, in other implementation examples, when the area of the second circuit board 30 is large enough to meet the requirements of the creepage distance and the electrical gap between the components on the second circuit board 30, the insulating medium 50 may not be filled between the explosion-proof member 20 and the second circuit board 30, and at this time, the explosion-proof member 20 may isolate the explosion shock wave at one side of the explosion-proof member 20, so as to prevent the carbide generated by the explosion from covering the surface of the second circuit board 30 and damaging the insulating isolation system on the surface of the second circuit board 30, thereby improving the safety of the intelligent power module.
Wherein, the installation manner of the explosion-proof piece 20 in the intelligent power module includes but is not limited to: the explosion-proof piece 20 is abutted between the first circuit board 10 and the second circuit board 30 by providing a support structure on the explosion-proof piece 20 or the first circuit board 10 and the second circuit board 30; or, the explosion-proof piece 20 is fixed on the first circuit board 10 or the second circuit board 30 by arranging fixing pieces on the explosion-proof piece 20 or the first circuit board 10 and the second circuit board 30; alternatively, the explosion-proof component 20 can be fixed on the housing 40, and even when the housing 40 is a split housing 40, that is, the frame of the housing 40 and the top plate of the housing 40 are in a split structure, the explosion-proof component 20 can be designed to be integrally formed with the housing 40.
Preferably, when the explosion-proof component 20 is a bare PCB, the bare PCB is provided with a solder hole for penetrating the electrical connector; at least one of the electrical connectors 11 of the first circuit board 10 passes through and is soldered to a corresponding solder hole of the bare PCB, so as to fix the bare PCB between the first circuit board 10 and the second circuit board 30.
Preferably, when the explosion-proof member 20 is made of NOMEX insulating paper, an adhesive part is provided on the electrical connecting member 11, and the electrical connecting member 11 passes through the NOMEX insulating paper and is adhered to the NOMEX insulating paper through the adhesive part.
Preferably, in a preferred implementation example, the explosion-proof component is a plastic component, and the specific manner thereof is as shown in fig. 2:
when the explosion-proof member 20 is a plastic member, the explosion-proof member 20 includes:
the printed circuit board comprises a board body 21, wherein a first supporting piece is arranged on one surface of the board body 21 facing the second circuit board 30, and the first supporting piece abuts against the second circuit board 30.
Preferably, the first support comprises:
a plurality of supporting ribs 23 arranged at intervals along the circumferential direction of the plate body 21, wherein top ends of the supporting ribs 23 abut against the second circuit board 30; and/or the presence of a gas in the gas,
at least one first supporting column 24, one end of the first supporting column 24 is disposed on one surface of the board body 21 facing the second circuit board 30, and the other end of the first supporting column 24 abuts against the second circuit board 30.
In the present embodiment, the height of the supporting rib 23 is the same as the height of the first supporting pillar 24, so that the second circuit board 30 can be supported together with the first supporting pillar 24, so that a certain gap is formed between the second circuit board 30 and the board body 21, and the insulating medium 50 is filled between the two. In addition, since the supporting rib 23 and the upper surface of the first supporting pillar 24 are abutted against the lower surface of the second circuit board 30, when the power chip on the first circuit board 10 explodes, the supporting rib 23 and the first supporting pillar 24 can uniformly disperse and transmit the impact force of the explosion to the second circuit board 30, thereby preventing the deformation of the board body 21. Simultaneously, it is a plurality of support shelves 23 interval sets up for have certain clearance between the adjacent support shelves 23, when being convenient for the encapsulating like this and being convenient for evacuation behind the encapsulating, make the bubble that the encapsulating produced discharge smoothly.
Preferably, when the first support piece includes along a plurality of that plate body 21 circumference interval set up support shelves 23, the first support piece still includes along strengthening rib 22 that plate body 21 circumference set up, it is a plurality of the bottom interval of supporting shelves 23 sets up on strengthening rib 22.
In this embodiment, the reinforcing ribs are arranged below the supporting rib, so that the strength of the explosion-proof part can be improved, and the explosion-proof part is prevented from deforming. When the reinforcing rib 22 is not disposed under the supporting rib 23, the height of the supporting rib 23 is the same as that of the first supporting column, and both the supporting ribs and the first supporting column are abutted against the second circuit board 30; when the reinforcing rib 22 is disposed under the supporting rib 23, the height of the first supporting column 24 is equal to the sum of the heights of the reinforcing rib 22 and the supporting rib 23, and the first supporting column 24 and the plurality of supporting ribs 23 are abutted to the second circuit board 30.
Preferably, the second circuit board 30 is provided with a positioning hole 31, and the plate body 21 is provided with a positioning column 29 matched with the positioning hole 31.
In this embodiment, the upper surface of the plate body 21 is formed with the positioning columns 29, and the positioning columns 29 at least include 2, for example, two positioning columns 29 are respectively disposed at the upper left corner and the lower right corner of the plate body 21. It is understood that positioning pillars 29 may be provided in 3 or more, and the embodiment is not limited thereto. And the positioning column 29 penetrates through the second circuit board 30, so that the second circuit board 30 is positioned on the horizontal plane where the board body 21 is located, and the orthographic projection of the board body 21 on the second circuit board 30 at least covers the area occupied by the secondary side circuit on the second circuit board 30.
Preferably, said electrical connection means 11 comprise:
a solder socket 111, a bottom end of the solder socket 111 being soldered on the first circuit board 10;
the bottom end of the electric connecting terminal 112 is arranged in the welding hole of the welding seat 111, and the other end of the electric connecting terminal 112 passes through the corresponding guide hole on the board body and then penetrates through the second circuit board 30;
the plate 21 is abutted against or fixed to the solder socket 111 on a surface facing the first circuit board 10.
In this embodiment, the soldering socket 111 is located between the first circuit board 10 and the board body 21, one surface of the board body 21 facing the first circuit board 10 abuts against or is fixed on the soldering socket 111, and the soldering socket has a certain height, so that a certain distance is provided between the board body 21 and the first circuit board 10, and the insulating medium 50 can completely cover devices such as the binding line on the first circuit board 10 during glue pouring.
Preferably, a support portion 28 is formed along the outer circumference of the guide hole on a surface of the plate body 21 facing the first circuit board 10; one end of the supporting part 28 far away from the plate body is abutted against the upper surface of the welding seat 11; alternatively, one end of the supporting portion 28, which is far away from the plate body, is in interference fit with the welding seat 11.
In an embodiment, when the height of the soldering nest 111 is lower, a supporting portion 28 may be further disposed on a surface of the board body 21 facing the first circuit board 10, and the supporting portion 28 is disposed corresponding to the soldering nest 111 to increase a distance between the board body 21 and the first circuit board 10, so as to ensure that the insulating glue can completely cover devices such as the bonding wire on the first circuit board 10 during glue pouring. Wherein, the height of the supporting portion 28 can be set according to actual requirements.
Preferably, the supporting part can be a circular bulge, and the inner diameter and the outer diameter of the end part of the supporting part are respectively equal to those of the upper surface of the welding seat so as to be abutted against the upper surface of the welding seat; or the supporting part is of a cylindrical structure with a mounting hole, and the mounting hole is in interference fit with the welding seat.
Preferably, a second supporting member is disposed on a surface of the plate body 21 facing the first circuit board 10, and the second supporting member abuts against an upper surface of the first circuit board 10.
In this embodiment, when the board body 21 and the second circuit board 30 are pressed down together and mounted on the first circuit board 10, the second supporting member may abut against the first circuit board 10, so as to prevent the board body 21 from deforming during the pressing down mounting process, and prevent the board body 21 from deforming to press components such as the binding line on the first circuit board 10 during the pressing down mounting process. Preferably, the second supporting member includes at least one second supporting pillar 27, one end of the second supporting pillar 27 is disposed on a surface of the board body 21 facing the first circuit board 10, and the other end of the second supporting pillar 27 abuts against the first circuit board 10.
As can be seen from the above, in the intelligent power module provided in the embodiment of the present invention, the explosion-proof member 20 is additionally disposed between the first circuit board 10 and the second circuit board 30, so that when the power chip explodes, the explosion shock wave can be isolated at one side of the explosion-proof member 20, the explosion shock wave is prevented from damaging the insulation isolation system at the other side of the explosion-proof member 20, and the safety of the IPM is improved.
In a second aspect, the present application also provides an electrical device comprising the smart power module as above. The specific structure of the intelligent power module refers to the above embodiments, and since the electrical device adopts all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated here.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (17)
1. A smart power module, comprising:
a first circuit board;
at least one electrical connector mounted on the first circuit board;
the second circuit board penetrates through the electric connecting piece and is arranged at intervals with the first circuit board; one surface of the first circuit board facing the second circuit board is provided with a power chip; and the number of the first and second groups,
the explosion-proof piece is used for avoiding the electric connecting piece and is arranged between the first circuit board and the second circuit board.
2. The intelligent power module as claimed in claim 1, wherein a plurality of power chips are disposed on a side of the first circuit board facing the second circuit board, and the plurality of power chips constitute at least one power circuit;
the second circuit board is provided with a primary side functional circuit electrically connected with at least one power circuit through the electric connector and a secondary side functional circuit connected with the primary side functional circuit through an isolation element.
3. The smart power module of claim 2 wherein an orthographic area of the explosion proof member on the second circuit board covers at least the secondary side functional circuit area.
4. The intelligent power module as claimed in claim 1, wherein the explosion-proof member is plastic, PCB or NOMEX insulating paper.
5. The smart power module of claim 1, wherein when the explosion-proof member is a plastic member, the explosion-proof member comprises:
the plate body, the plate body orientation the one side of second circuit board is provided with first support piece, first support piece butt in the second circuit board.
6. The smart power module of claim 5, wherein the first support comprises:
the top ends of the plurality of supporting flanges abut against the second circuit board; and/or the presence of a gas in the gas,
at least one first support column, the one end setting of first support column is in the plate body orientation the one side of second circuit board, the other end butt of first support column in the second circuit board.
7. The smart power module as recited in claim 6, wherein when said first support member includes a plurality of said support ribs circumferentially spaced along said plate body, said first support member further includes a reinforcing rib circumferentially spaced along said plate body, a bottom end of said plurality of said support ribs being disposed on said reinforcing rib.
8. The intelligent power module as claimed in claim 5, wherein the second circuit board is provided with a positioning hole, and the plate body is provided with a positioning post matched with the positioning hole.
9. The smart power module as recited in claim 5 wherein the board body defines a guide hole for avoiding the electrical connector, the electrical connector comprising:
the bottom end of the welding seat is welded on the first circuit board;
the bottom end of the electric connecting terminal is arranged in the welding hole of the welding seat, and the other end of the electric connecting terminal passes through the corresponding guide hole on the plate body and then penetrates through the second circuit board;
one surface of the plate body facing to the first circuit board is abutted or fixed on the welding seat.
10. The smart power module according to claim 9, wherein a support portion is formed along an outer circumference of the guide hole on a surface of the board body facing the first circuit board;
one end of the supporting part, which is far away from the plate body, is abutted against the upper surface of the welding seat; or,
one end of the supporting part, which is far away from the plate body, is in interference fit with the welding seat.
11. The smart power module as recited in claim 5, wherein a second support is disposed on a side of the board body facing the first circuit board, the second support abutting against an upper surface of the first circuit board.
12. The smart power module of claim 11, wherein the second support comprises at least one second support pillar, one end of the second support pillar is disposed on a surface of the board body facing the first circuit board, and the other end of the second support pillar abuts against the first circuit board.
13. The smart power module of claim 1, further comprising:
the first circuit board blocks the bottom opening of the shell and defines an accommodating space with the shell, and the second circuit board and the explosion-proof piece are both positioned in the accommodating space; a plurality of second through holes are formed in a top plate of the shell, and the top end of part of the electric connecting piece penetrates through the second through holes and extends out of the shell;
potting holes for potting insulating media are formed in the top plate of the shell, the second circuit board and the explosion-proof piece, and the insulating media are filled in the gaps of the accommodating space.
14. The smart power module of claim 13, wherein a gap is provided between an outer periphery of the explosion proof member and an inner wall of the housing.
15. The intelligent power module as claimed in claim 4, wherein when the explosion-proof component is a bare PCB, the bare PCB is provided with a solder hole for passing through the electrical connector;
and at least one electric connector on the first circuit board penetrates through a corresponding welding hole on the PCB bare board and is welded with the welding hole, so that the PCB bare board is fixed between the first circuit board and the second circuit board.
16. The smart power module of claim 4 wherein when the explosion proof member is NOMEX insulation paper, an adhesive is disposed on the electrical connector, and the electrical connector passes through the NOMEX insulation paper and is adhered to the NOMEX insulation paper by the adhesive.
17. An electrical device comprising the smart power module of any one of claims 1 to 16.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210683517.XA CN114867199A (en) | 2022-06-16 | 2022-06-16 | Intelligent power module and electrical equipment |
| PCT/CN2022/108591 WO2023240759A1 (en) | 2022-06-16 | 2022-07-28 | Intelligent power module and electrical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210683517.XA CN114867199A (en) | 2022-06-16 | 2022-06-16 | Intelligent power module and electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114867199A true CN114867199A (en) | 2022-08-05 |
Family
ID=82624044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210683517.XA Pending CN114867199A (en) | 2022-06-16 | 2022-06-16 | Intelligent power module and electrical equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114867199A (en) |
| WO (1) | WO2023240759A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161879A (en) * | 2015-09-24 | 2015-12-16 | 上海埃而生电气有限公司 | Multilayer PCB (Printed Circuit Board) central distribution box |
| CN208240652U (en) * | 2018-06-20 | 2018-12-14 | 广东美的制冷设备有限公司 | Power module and air conditioner |
| CN214481499U (en) * | 2020-04-03 | 2021-10-22 | 北京六十六号互动科技有限公司 | Controller and electric scooter |
| CN112722142B (en) * | 2020-12-04 | 2022-07-29 | 北京零极创新科技有限公司 | Controller, manufacturing method thereof and electric scooter |
| CN217904884U (en) * | 2022-06-16 | 2022-11-25 | 苏州汇川控制技术有限公司 | Intelligent power module and electrical equipment |
| CN217721597U (en) * | 2022-06-16 | 2022-11-01 | 苏州汇川控制技术有限公司 | Explosion-proof piece and intelligent power module |
-
2022
- 2022-06-16 CN CN202210683517.XA patent/CN114867199A/en active Pending
- 2022-07-28 WO PCT/CN2022/108591 patent/WO2023240759A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023240759A1 (en) | 2023-12-21 |
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