CN210157588U - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN210157588U CN210157588U CN201920856635.XU CN201920856635U CN210157588U CN 210157588 U CN210157588 U CN 210157588U CN 201920856635 U CN201920856635 U CN 201920856635U CN 210157588 U CN210157588 U CN 210157588U
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Abstract
The present disclosure relates to a circuit board assembly and an electronic device, the circuit board assembly including: an upper circuit board, a lower circuit board and a shield. The separator of the shielding member divides the accommodating space surrounded by the side walls into a first space and a second space with opposite openings. After the shielding member is assembled with the upper circuit board and the lower circuit board, respectively, the first circuit can be packaged in the first space, and the second circuit is packaged in the second space. The shielding part comprising the first space and the second space realizes shielding of the first circuit on the upper circuit board and the second circuit on the lower circuit board, reduces the quantity of the shielding parts, can reduce the complexity of the structure and the assembly process of the circuit board assembly on the one hand, and can reduce the occupation of the assembly space between the upper circuit board and the lower circuit board by the shielding parts on the other hand. Therefore, the structure thickness of the circuit board assembly is reduced, and the space utilization rate inside the electronic equipment is improved.
Description
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to a circuit board assembly and an electronic device.
Background
In the related art, each circuit board of an electronic device such as a mobile phone is usually provided with a shielding case to shield the circuit board from external electromagnetic waves and prevent the electromagnetic waves generated by the circuit board from radiating outwards. When the circuit board is a sandwich board or the number of the circuit boards is large, the shielding covers corresponding to the corresponding side surfaces of the circuit board containing the circuit are arranged one to one, so that the problems of large occupied space, structural interference between two adjacent shielding covers and the like can be caused.
SUMMERY OF THE UTILITY MODEL
The present disclosure provides a circuit board assembly and an electronic device, which can simplify the structure of the circuit board assembly, reduce the thickness of the circuit board assembly, and improve the space utilization rate inside the electronic device.
According to a first aspect of the present disclosure, there is provided a circuit board assembly comprising: an upper circuit board, a lower circuit board and a shield;
the upper circuit board and the lower circuit board are arranged in a stacked mode, and the upper circuit board comprises a first inner side face facing the lower circuit board and a first circuit arranged on the first inner side face; the lower circuit board comprises a second inner side surface facing the upper circuit board and a second circuit arranged on the second inner side surface;
the shield is assembled between the upper circuit board and the lower circuit board and comprises a side wall and a separator; the side wall encloses an accommodating space, and the partition is arranged in the accommodating space to divide the accommodating space into a first space and a second space with opposite openings;
the opening of the first space is assembled and matched with the first inner side surface so as to package the first circuit in the first space; the opening of the second space is assembled and matched with the second inner side face so as to package the second circuit in the second space.
Optionally, the divider is integrally formed with the side wall.
Optionally, the partition is of a flat plate structure.
Optionally, the separator includes at least one groove structure, the first circuit includes at least one first electronic component, the second circuit includes at least one second electronic component, and the first electronic component and/or the second electronic component are accommodated in the groove structure.
Optionally, the partition is assembled and matched with the side wall to divide the accommodating space into the first space and the second space.
Optionally, an installation portion protruding from the inner side surface is arranged on the inner side surface of the side wall, and the partition is assembled with the installation portion.
Optionally, the separator is made of copper foil, and the edge of the copper foil is attached to the mounting portion.
Optionally, the inner side surface of the side wall includes a closed path surrounding the accommodating space, and the mounting portion is a protrusion arranged along the closed path.
Optionally, the protrusion is a continuous structure or a plurality of discrete structures arranged at intervals.
Optionally, the circuit board assembly further includes at least one electrical connector, and the electrical connector is disposed between the upper circuit board and the lower circuit board and is electrically connected to the upper circuit board and the lower circuit board, respectively.
Optionally, the electrical connector corresponds to the edge area of the upper circuit board and the lower circuit board.
Optionally, one of the first inner side surface and the second inner side surface is fixedly connected to the shielding member, and the other of the first inner side surface and the second inner side surface is detachably connected to the shielding member.
Optionally, one of the first inner side surface and the second inner side surface is in welded fit with the shielding part, and the other of the first inner side surface and the second inner side surface is in clamped fit with the shielding part.
According to a second aspect of the present disclosure, there is provided an electronic apparatus including an apparatus main body and the circuit board assembly assembled within the apparatus main body.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
the present disclosure provides a side wall and a partition for a shield member assembled between an upper layer circuit board and a lower layer circuit board, so that the partition divides an accommodating space enclosed by the side wall into a first space and a second space with opposite openings. After the shielding member is assembled with the upper circuit board and the lower circuit board, respectively, the first circuit can be packaged in the first space, and the second circuit is packaged in the second space. The shielding part comprising the first space and the second space realizes shielding of the first circuit on the upper circuit board and the second circuit on the lower circuit board, reduces the quantity of the shielding parts, can reduce the complexity of the structure and the assembly process of the circuit board assembly on the one hand, and can reduce the occupation of the assembly space between the upper circuit board and the lower circuit board by the shielding parts on the other hand. Therefore, the structure thickness of the circuit board assembly is reduced, and the space utilization rate inside the electronic equipment is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic diagram of a circuit board assembly in an exemplary embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a circuit board assembly in another exemplary embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a circuit board assembly in yet another exemplary embodiment of the present disclosure;
fig. 4 is a schematic diagram of a circuit board assembly in yet another exemplary embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
In the related art, each circuit board of an electronic device such as a mobile phone is usually provided with a shielding case to shield the circuit board from external electromagnetic waves and prevent the electromagnetic waves generated by the circuit board from radiating outwards. When the circuit board is a sandwich board or the number of the circuit boards is large, the shielding cases corresponding to each other are arranged on the corresponding side face of the circuit board containing the circuit, and a certain safety distance needs to be reserved between two adjacent shielding cases, which can cause the problems of large occupied space, structural interference between the two adjacent shielding cases and the like.
As shown in fig. 1, taking the shielding scheme of two adjacent first circuit boards a1 and second circuit boards a2 as an example in the related art, the first circuit board a1 and the second circuit board a2 are respectively provided with a first circuit a11 and a second circuit a21 on opposite inner side surfaces. The first circuit a11 on the inner side of the first circuit board a1 is shielded by the first shield A3, and the second circuit a21 on the inner side of the second circuit board a2 is shielded by the second shield a 4. As shown in fig. 1, the first shield A3 and the second shield a4 disposed between the first circuit board a1 and the second circuit board a2 need to reserve a space H therebetween in addition to their own thicknesses D1 and D2 in order to facilitate the assembly of the first shield A3 and the second shield a4 while avoiding collision. Therefore, the first shield A3 and the second shield a4 in the related art increase the space occupation between the first circuit board a1 and the second circuit board a2, causing a problem of an increase in thickness, which affects the lightweight and thin properties of the electronic device using the circuit boards.
Fig. 2 is a schematic diagram of a circuit board assembly according to an exemplary embodiment of the present disclosure. As shown in fig. 2, the circuit board assembly 1 includes: an upper circuit board 11, a lower circuit board 12, and a shield 13. The upper circuit board 11 and the lower circuit board 12 are stacked, and the upper circuit board 11 includes a first inner side 112 facing the lower circuit board 12, and a first circuit 111 disposed on the first inner side 112. The lower board 12 includes a second inner side 122 facing the upper board 11, and a second circuit 121 disposed on the second inner side 122.
The shield 13 is assembled between the upper layer circuit board 11 and the lower layer circuit board 12, and includes a sidewall 131 and a spacer 132. The side walls 131 enclose an accommodating space, and a partition 132 is disposed in the accommodating space to partition the accommodating space into a first space 1311 and a second space 1312 having opposite openings. The opening of the first space 1311 is assembled with the first inner side surface 112 to enclose the first circuit 111 in the first space 1311, and the opening of the second space 1312 is assembled with the second inner side surface 122 to enclose the second circuit 121 in the second space 1312.
By providing the side walls 131 and the partitions 132 for the shield 13 assembled between the upper layer circuit board 11 and the lower layer circuit board 12, the partitions 132 divide the accommodation space surrounded by the side walls 131 into the first space 1311 and the second space 1312 which are open oppositely. When the shield 13 is assembled with the upper and lower circuit boards 11 and 12, respectively, the first circuit 111 can be enclosed in the first space 1311 and the second circuit 121 can be enclosed in the second space 1312. The shielding member 13 including the first space 1311 and the second space 1312 realizes shielding of the first circuit 111 on the upper circuit board 11 and the second circuit 121 on the lower circuit board 12, and reduces the number of the shielding members 13, so that the complexity of the structure and the assembly process of the circuit board assembly 1 can be reduced, and the occupation of the assembly space between the upper circuit board 11 and the lower circuit board 12 by the shielding members 13 can be reduced. Therefore, the structural thickness of the circuit board assembly 1 is reduced to h as shown in fig. 2, and the space utilization rate inside the electronic device is improved.
It should be noted that the circuit board assembly 1 may be a sandwich board, or may be a structural assembly formed by stacking a plurality of circuit boards, and the disclosure is not limited thereto. The circuit board assembly 1 is exemplified as a sandwich board.
The partition 132 divides the receiving space defined by the sidewalls 131 into a first space 1311 and a second space 1312, so that one shield 13 can have a shielding function to be fitted to both the upper circuit board 11 and the lower circuit board 12. The dividing member may be integrally formed with the sidewall 131, or the structure of the independent sidewall 131 may be assembled with the sidewall 131 later. The structure of the circuit board assembly 1 is exemplarily explained below for the above two cases:
in one embodiment, the divider 132 is integrally formed with the sidewall 131. That is, the partition 132 and the sidewall 131 are integrated, and the opening of the first space 1311 and the first inner side surface 112 of the shield 13, and the opening of the second space 1312 and the second inner side surface 122 are assembled, respectively, to complete the mounting of the shield 13. Wherein, the spacers 132 and the sidewalls 131 are integrally formed without a subsequent connection node, thereby improving the structural strength of the shield 13 and also reducing the manufacturing process.
One of the first inner side surface 112 and the second inner side surface 122 may be fixedly connected to the shielding member 13, and the other of the first inner side surface 112 and the second inner side surface 122 may be detachably connected to the shielding member 13, so as to improve the installation convenience of the shielding member 13 through the detachable connection on the premise of ensuring the stability and the sealing performance of the assembly of the shielding member 13. The fixed connection may be welding, bonding, etc., and the detachable connection may be a snap connection, a threaded connection, etc., which are not limited by this disclosure. For example, the first inner side surface 112 may be in a welded fit with the shield 13, the second inner side surface 122 may be in a snap fit with the shield 13, the second inner side surface 122 may also be in a welded fit with the shield 13, and the first inner side surface 112 is in a snap fit with the shield 13 through the snap structure 14 thereon, which is not limited in this disclosure.
Alternatively, the first inner side surface 112 and the second inner side surface 122 may be fixedly connected to the shielding element 13, so as to improve the stability and the sealing property between the shielding element 13 and the upper circuit board 11 and the lower circuit board 12. The fixed connection may be welding, bonding, etc., and the disclosure is not limited thereto. The first inner side surface 112 and the second inner side surface 122 can be detachably connected to the shielding element 13, so as to further increase the installation convenience between the shielding element 13 and the upper circuit board 11 and the lower circuit board 12. Wherein the detachable connection may be a snap connection, a threaded connection, etc., and the disclosure is not limited thereto.
The material of the spacer 132 and the sidewall 131 may be the same metal material such as aluminum, iron, steel, or copper, which can shield electromagnetic signals.
In another embodiment, as shown in fig. 3, the partition 132 is assembled with the sidewall 131 to divide the receiving space into a first space 1311 and a second space 1312. The inner side surface of the sidewall 131 may be provided with a mounting portion 1313 protruding from the inner side surface, and the partition 132 may be assembled with the sidewall 131 through the mounting portion 1313. Since the mounting portion 1313 protrudes from the inner side surface of the side wall 131, the partition 132 is easily assembled in a direction perpendicular to the inner side surface of the side wall 131, and the convenience and stability of assembly are improved. Alternatively, the partition 132 may be directly assembled with the inner side surface of the sidewall 131, so as to reduce the structural complexity and the processing difficulty of the sidewall 131.
Wherein, the inner side surface of the side wall 131 includes a closed path surrounding the accommodating space, and the mounting portion 1313 is a protrusion disposed along the closed path. The protrusion may be integrally formed with the sidewall 131, or may be disposed on the inner side surface of the sidewall 131 in a subsequent assembly manner, which is not limited in the present disclosure. Further, the protrusions may be a continuous structure or a plurality of discrete structures arranged at intervals. When the protrusion is a continuous structure, the contact area between the partition 132 and the protrusion can be increased, thereby improving the stability of the fitting between the two. When the protrusions are a plurality of discrete structures arranged at intervals, the arrangement positions of the mounting portion 1313 are reduced on the premise that the partition 132 is stably mounted, so that the assembling process between the partition 132 and the mounting portion 1313 is reduced, and the material used for the mounting portion 1313 is also saved.
For example, when the cross section of the accommodating space surrounded by the side walls 131 is rectangular, the mounting portions 1313 having the protrusions may be disposed at four corners of the side walls 131, and when the partition 132 is assembled with the mounting portions 1313, only the partition 132 is assembled with the protrusions at the four corners, so that the assembly process between the partition 132 and the mounting portions 1313 is reduced, and the material used for the mounting portions 1313 is also saved.
Further, the material of the sidewall 131 and the mounting portion 1313 may be aluminum, iron, steel, copper, or other metal material, the material of the spacer 132 may be copper foil, and the edge of the copper foil is attached to the mounting portion 1313, and the copper foil has a smaller structural thickness, so that the depth of the first space 1311 and the second space 1312 is increased, and the thickness of the shield 13 between the upper circuit board 11 and the lower circuit board 12 is reduced. In addition, the process of attaching the copper foil to the mounting portion 1313 is simple, and operation and implementation are facilitated.
Also, in the above embodiments. One of the first inner side surface 112 and the second inner side surface 122 may be fixedly connected to the shielding member 13, and the other of the first inner side surface 112 and the second inner side surface 122 may be detachably connected to the shielding member 13, so as to improve the installation convenience of the shielding member 13 through the detachable connection on the premise of ensuring the assembling stability and sealing performance of the shielding member 13. The fixed connection may be welding, bonding, etc., and the detachable connection may be a snap connection, a threaded connection, etc., which are not limited by this disclosure. For example, the first inner side surface 112 may be in a welded fit with the shield 13, the second inner side surface 122 may be in a snap fit with the shield 13, the second inner side surface 122 may also be in a welded fit with the shield 13, and the first inner side surface 112 is in a snap fit with the shield 13 through the snap structure 14 thereon, which is not limited in this disclosure.
Alternatively, the first inner side surface 112 and the second inner side surface 122 may be fixedly connected to the shielding element 13, so as to improve the stability and the sealing property between the shielding element 13 and the upper circuit board 11 and the lower circuit board 12. The fixed connection may be welding, bonding, etc., and the disclosure is not limited thereto. The first inner side surface 112 and the second inner side surface 122 can be detachably connected to the shielding element 13, so as to further increase the installation convenience between the shielding element 13 and the upper circuit board 11 and the lower circuit board 12. Wherein the detachable connection may be a snap connection, a threaded connection, etc., and the disclosure is not limited thereto.
In the above embodiment, the partition 132 may be a flat plate structure to simplify the overall structure and the fitting manner of the shield 13. Alternatively, as shown in fig. 4, the partition 132 includes at least one groove structure 1321, the first circuit 111 includes at least one first electronic component 1111, the second circuit 121 includes at least one second electronic component 1211, and the first electronic component 1111 and/or the second electronic component 1211 are accommodated in the groove structure 1321. Since the first circuit 111 and the second circuit 121 both include electronic components with different heights, when the relatively higher electronic component in the first circuit 111 is staggered from the relatively higher electronic component in the second circuit 121, the groove structure 1321 is disposed on the partition 132, so that the first electronic component 1111 on the first circuit 111 and/or the second electronic component 1211 in the second circuit 121 are accommodated in the groove structure 1321, and the overall thickness of the circuit board assembly 1 is further reduced to d as shown in fig. 4, which is helpful for realizing the light weight and the thin weight of the circuit board assembly 1 and the electronic device.
In addition, the circuit board assembly 1 further includes at least one electrical connector 15, and the electrical connector 15 is disposed between the upper circuit board 11 and the lower circuit board 12 and electrically connected to the upper circuit board 11 and the lower circuit board 12, respectively. Further, the electrical connector 15 corresponds to the edge region of the upper circuit board 11 and the lower circuit board 12. The electric connecting pieces are arranged in the edge areas of the upper circuit board 11 and the lower circuit board 12, so that the electric connecting pieces are prevented from occupying the structures of the upper circuit board 11 and the lower circuit board 12, and the space arrangement is convenient to optimize.
The present disclosure further proposes an electronic apparatus including an apparatus main body and the circuit board assembly 1, the circuit board assembly 1 being assembled within the apparatus main body.
By providing the side walls 131 and the partitions 132 for the shield 13 assembled between the upper layer circuit board 11 and the lower layer circuit board 12, the partitions 132 divide the accommodation space surrounded by the side walls 131 into the first space 1311 and the second space 1312 which are open oppositely. When the shield 13 is assembled with the upper and lower circuit boards 11 and 12, respectively, the first circuit 111 can be enclosed in the first space 1311 and the second circuit 121 can be enclosed in the second space 1312. The shielding member 13 including the first space 1311 and the second space 1312 realizes shielding of the first circuit 111 on the upper circuit board 11 and the second circuit 121 on the lower circuit board 12, and reduces the number of the shielding members 13, so that the complexity of the structure and the assembly process of the circuit board assembly 1 can be reduced, and the occupation of the assembly space between the upper circuit board 11 and the lower circuit board 12 by the shielding members 13 can be reduced. The space utilization inside the electronic device containing the circuit board assembly 1 is thus improved.
It should be noted that the electronic device may be a mobile phone, a vehicle-mounted terminal, a tablet computer, a medical terminal, and the like, and the disclosure does not limit this.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (14)
1. A circuit board assembly, comprising: an upper circuit board, a lower circuit board and a shield;
the upper circuit board and the lower circuit board are arranged in a stacked mode, and the upper circuit board comprises a first inner side face facing the lower circuit board and a first circuit arranged on the first inner side face; the lower circuit board comprises a second inner side surface facing the upper circuit board and a second circuit arranged on the second inner side surface;
the shield is assembled between the upper circuit board and the lower circuit board and comprises a side wall and a separator; the side wall encloses an accommodating space, and the partition is arranged in the accommodating space to divide the accommodating space into a first space and a second space with opposite openings;
the opening of the first space is assembled and matched with the first inner side surface so as to package the first circuit in the first space; the opening of the second space is assembled and matched with the second inner side face so as to package the second circuit in the second space.
2. The circuit board assembly of claim 1, wherein the spacer is integrally formed with the sidewall.
3. The circuit board assembly of claim 1, wherein the divider is a planar structure.
4. The circuit board assembly of claim 1, wherein the partition includes at least one recess structure thereon, the first circuit includes at least one first electronic component, the second circuit includes at least one second electronic component, and the first electronic component and/or the second electronic component are received in the recess structure.
5. The circuit board assembly of claim 1, wherein the divider is in assembled engagement with the sidewall to divide the receiving space into the first space and the second space.
6. The circuit board assembly according to claim 5, wherein the side wall has a mounting portion provided on an inner side surface thereof to protrude from the inner side surface, and the partition member is assembled with the mounting portion.
7. The circuit board assembly of claim 6, wherein the spacer is made of copper foil, and an edge of the copper foil is attached to the mounting portion.
8. The circuit board assembly of claim 6, wherein the inner side of the side wall includes a closed path around the receiving space, and the mounting portion is a protrusion disposed along the closed path.
9. The circuit board assembly of claim 8, wherein the protrusion is a continuous structure or a plurality of discrete structures spaced apart.
10. The circuit board assembly of claim 1, further comprising at least one electrical connector disposed between and electrically connected to the upper and lower circuit boards, respectively.
11. The circuit board assembly of claim 10, wherein the electrical connectors correspond to edge region locations of the upper and lower circuit boards.
12. The circuit board assembly of any of claims 1-11, wherein one of the first and second inner sides is fixedly attached to the shield and the other of the first and second inner sides is removably attached to the shield.
13. The circuit board assembly of claim 12, wherein one of the first and second inner sides is solder-fit to the shield and the other of the first and second inner sides is snap-fit to the shield.
14. An electronic device comprising a device body and a circuit board assembly according to any one of claims 1 to 13, the circuit board assembly being assembled within the device body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920856635.XU CN210157588U (en) | 2019-06-05 | 2019-06-05 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920856635.XU CN210157588U (en) | 2019-06-05 | 2019-06-05 | Circuit board assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN210157588U true CN210157588U (en) | 2020-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920856635.XU Active CN210157588U (en) | 2019-06-05 | 2019-06-05 | Circuit board assembly and electronic equipment |
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| CN (1) | CN210157588U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939082A (en) * | 2021-09-18 | 2022-01-14 | 珠海杰赛科技有限公司 | Structure of crossed hole in PCB and processing method thereof |
-
2019
- 2019-06-05 CN CN201920856635.XU patent/CN210157588U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939082A (en) * | 2021-09-18 | 2022-01-14 | 珠海杰赛科技有限公司 | Structure of crossed hole in PCB and processing method thereof |
| CN113939082B (en) * | 2021-09-18 | 2023-02-07 | 珠海杰赛科技有限公司 | Structure of crossed hole in PCB and processing method thereof |
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