CN105578732A - Rigid-flex board and terminal - Google Patents
Rigid-flex board and terminal Download PDFInfo
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- CN105578732A CN105578732A CN201610105725.6A CN201610105725A CN105578732A CN 105578732 A CN105578732 A CN 105578732A CN 201610105725 A CN201610105725 A CN 201610105725A CN 105578732 A CN105578732 A CN 105578732A
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- layer
- copper foil
- rigid
- rigid flex
- foil layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a rigid-flex board and a terminal. The rigid-flex board comprises a flexible substrate layer and a rigid circuit substrate, wherein the flexible substrate layer comprises a first area; the rigid circuit substrate comprises a rigid insulated layer, a circuit layer, a solder mask ink layer, a reinforcement layer and multiple soldering elements; the rigid insulated layer is fixed on the flexible substrate layer; the circuit layer is arranged on the rigid insulated layer; the solder mask ink layer covers the circuit layer; the solder mask ink layer is provided with multiple soldering holes; the multiple soldering elements are respectively soldered on the multiple soldering holes; and the reinforcement layer is fixed on the solder mask ink layer and surrounds the peripheral side of the multiple soldering elements. The reinforcement layer is used for surrounding the peripheral side of the multiple soldering elements, the strength of the rigid-flex board in the first area is increased, and the rigid assembly strength of the rigid-flex board is further improved.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of Rigid Flex and terminal.
Background technology
The application of current Rigid Flex is more and more extensive, the structure of current Rigid Flex arranges rigid insulation layer in flexible substrate layer both sides, then line layer is set on rigid insulation layer, and on line layer, cover anti-solder ink layer, thus realize the rigid circuit board structure of Rigid Flex, but Rigid Flex often needs soldering of electronic components on hard rays line structure at present, thus need to arrange welding hole on anti-solder ink layer, by welding electronic elements in welding hole, with electrical interconnection layer.Because the quantity of electronic component is usually more, these electronic components are distributed on described line layer, described rigid insulation layer is made to bear the welding stress of described electronic component, reduce the stress that rigid insulation layer bears other external parts, thus reduce the assembling intensity of described Rigid Flex on hard rays line structure.
Summary of the invention
In view of this, the invention provides a kind of Rigid Flex and the terminal that improve rigid assembling intensity.
The invention provides a kind of Rigid Flex, wherein, described Rigid Flex comprises flexible substrate layer and hard rays base board, described flexible substrate layer comprises the firstth district, described hard rays base board comprises rigid insulation layer, line layer, anti-solder ink layer, strengthening course and multiple soldered elements, described rigid insulation layer is fixed in described flexible substrate layer, and orthographic projection region in described flexible substrate layer and described firstth district coincide, described line layer is arranged on described rigid insulation layer, described anti-solder ink layer covers described line layer, described anti-solder ink layer arranges multiple welding hole, multiple described soldered elements is welded in multiple described welding hole respectively, and be electrically connected described line layer, described strengthening course is fixed on described anti-solder ink layer, and all sides enclosed in multiple described soldered elements.
Wherein, described Rigid Flex also comprises copper foil layer, and described copper foil layer is arranged in described flexible substrate layer, and is laminated between described flexible substrate layer and described rigid insulation layer.
Wherein, described rigid insulation layer arranges through hole, arranges the electric conductor of the described copper foil layer of electrical connection and described line layer in described through hole.
Wherein, described Rigid Flex comprises two-layer described copper foil layer, is the first copper foil layer and the second copper foil layer respectively, and described first copper foil layer and described second copper foil layer are arranged in the opposing both sides of described flexible substrate layer respectively.
Wherein, described first copper foil layer is provided with the through signal via to described second copper foil layer, arranges the signal conductor connecting described first copper foil layer and described second copper foil layer in described signal via.
Wherein, described first copper foil layer is provided with the through ground connection via hole to described second copper foil layer, arranges the earthing conductor connecting described first copper foil layer and described second copper foil layer in described ground connection via hole.
Wherein, described flexible substrate layer also comprises the secondth district being connected to described first area edge, described Rigid Flex also comprises the first coverlay and the second coverlay, described first coverlay and described second coverlay fit on described first copper foil layer and described second copper foil layer respectively, and orthographic projection region in described flexible substrate layer and described secondth district coincide.
Wherein, described Rigid Flex comprises two described hard rays base boards, and two described hard rays base boards are individually fixed in described flexible substrate layer both sides.
Wherein, described strengthening course is steel reinforcement.
The present invention also provides a kind of terminal, and wherein, described terminal comprises body, is located at Rigid Flex described in the mainboard of described body interior and above-mentioned any one, and described Rigid Flex is located at described body interior, and is electrically connected with described mainboard.Rigid Flex of the present invention and terminal, by fixing described strengthening course on described anti-solder ink layer, described strengthening course is utilized to enclose all sides in multiple described soldered elements, the intensity of described Rigid Flex at described first place of district is increased, and then improves the rigid assembling intensity of described Rigid Flex.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic cross-section of Rigid Flex provided by the invention;
Fig. 2 is the schematic top plan view of the Rigid Flex of Fig. 1.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1 and Fig. 2, a kind of Rigid Flex 100 provided by the invention, described Rigid Flex 100 comprises flexible substrate layer 10 and hard rays base board 20, described flexible substrate layer 10 comprises the first district 10a, and described hard rays base board 20 comprises rigid insulation layer 21, line layer 22, anti-solder ink layer 23, strengthening course 24 and multiple soldered elements 25.Described rigid insulation layer 21 is fixed in described flexible substrate layer 10, and orthographic projection region in described flexible substrate layer 10 and described first district 10a coincide.Described line layer 22 is arranged on described rigid insulation layer 21.Described anti-solder ink layer 23 covers described line layer 22, and described anti-solder ink layer 23 arranges multiple welding hole 231.Multiple described soldered elements 25 is welded in multiple described welding hole 231 respectively, and is electrically connected described line layer 22.In the form of a ring, described strengthening course 24 is fixed on described anti-solder ink layer 23 described strengthening course 24, and encloses all sides in multiple described soldered elements 25.Be understandable that, described Rigid Flex 100 is applied in terminal, and this terminal can be mobile phone, panel computer, notebook computer etc., and described Rigid Flex 100 is responsible for the conduction between the electronic component in terminal
By fixing described strengthening course 24 on described anti-solder ink layer 23, described strengthening course 24 is utilized to enclose all sides in multiple described soldered elements 25, the intensity of described Rigid Flex 100 at described first 10a place of district is increased, and then improves the rigid assembling intensity of described Rigid Flex 100.
In present embodiment, described flexible substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange Copper Foil cabling in described flexible substrate layer 10, and described flexible substrate layer 10 can provide insulation environment for Copper Foil cabling,, so that be divided into signal lead and ground connection cabling at this Copper Foil cabling.Preferably, the thickness of described flexible substrate layer 10 can be 20 μm.Described flexible substrate layer 10 can arrange the first district 10a and the second district 10b, described second district 10b is used for presenting flexibility, described Soft Bonding plate 100 is facilitated to produce deformation, and then facilitate described Rigid Flex 100 to connect external device, described first district 10a can fix hard plate, thus improve the rigidity of described Soft Bonding plate 100, thus described Soft Bonding plate 100 is facilitated to be assemblied in terminal.
In present embodiment, described rigid insulation layer 21 adopts polyethylene material, described rigid insulation layer 21 has insulating properties characteristic, and the Copper Foil cabling in described line layer 22 and described flexible substrate layer 10 is completely cut off mutually, thus facilitates the trace arrangements variation of described Rigid Flex 100.The number of plies of described rigid insulation layer 21 can be two-layer, and also can arrange individual layer, two-layer described rigid insulation layer 21 fits in the both sides of described flexible substrate layer 10 respectively, and corresponds to the first district 10a of described flexible substrate layer 10.Utilize the rigid of described rigid insulation layer 21, the intensity of described Rigid Flex 100 on described first district 10a is increased, make described Rigid Flex 100 in described first district 10a not easily bending, thus facilitate described Rigid Flex 100 to be firmly assemblied in terminal, such as get out screw hole at described rigid insulation layer 21.Meanwhile, described rigid insulation floor 21 is protected the Copper Foil cabling of described flexible substrate layer 10 at the first 10a place of district, increases the structural soundness of described Rigid Flex 100.In present embodiment, described line layer 22 can be that Copper Foil is shaping through etch process.The number of plies of described line layer 22 can two-layer or individual layer, and two-layer described line layer 22 fits on two-layer described rigid insulation layer 21 respectively.Two-layer described line layer 22 can be all arrange circuit, thus increases the circuit configuration of described Rigid Flex 100.
In present embodiment, described anti-solder ink layer 23 is protected the circuit on described line layer 22, prevents the line short on described line layer 22, and prevents the circuit on described line layer 22 from wearing and tearing, thus avoids the circuit of described line layer 22 to disconnect.
In present embodiment, described strengthening course 24 can be steel reinforcement.The rectangular ring-type of described strengthening course 24, described strengthening course 24 fits on described anti-solder ink layer 23.Described strengthening course 24 is not yielding, there is higher intensity, thus described strengthening course 24 makes described Rigid Flex 100 increase in the intensity of the first district 10a, thus makes Rigid Flex 100 be more prone to be assemblied in terminal, and can bear larger adhesive force.In other embodiments, described strengthening course 24 can also be polyester reinforcement or glass fiber-reinforced or aluminium platinum reinforcement.
Described soldered elements 25 can be the electronic components such as resistance, electric capacity or diode.All through described anti-solder ink layer 23, between multiple described soldered elements 25, there is spacing in multiple described soldered elements 25.Multiple described soldered elements 25 is utilized to be positioned at inside described strengthening course 24, make multiple described strengthening course 24 can obtain larger layout area, thus the supporting role of described strengthening course 24 is increased, thus improve the assembling intensity of described Rigid Flex 100 further.Because multiple described soldered elements 25 is positioned at inside described strengthening course 24, make the active force of multiple described soldered elements 25 to described rigid insulation layer 21 more concentrated, and described strengthening course 24 can support in peripheral region, stressed place described rigid insulation layer 21, thus make rigid insulation layer 21 not yielding, strengthen the intensity of described Rigid Flex 100 at the first district 10a.
Further, described Rigid Flex 100 also comprises copper foil layer 30, and described copper foil layer 30 is arranged in described flexible substrate layer 10, and is laminated between described flexible substrate layer 10 and described rigid insulation layer 21.
In present embodiment, described copper foil layer 30 is plate film being arranged Copper Foil, and described copper foil layer 30 can arrange ground connection cabling and signal lead, and this ground connection cabling and signal lead are Copper Foil and form through etching technics according to prescribed route structure.Ground connection cabling on described copper foil layer 30 and signal lead can be wholely set, and the signal lead on described copper foil layer 30 realizes the conduction between electric elements, and the ground connection cabling on described copper foil layer 30 carries out ground connection.Utilize described copper foil layer 30 to be etched in described flexible substrate layer 10, described copper foil layer 30 and the opposing setting of described line layer 22, thus make described Rigid Flex 100 can provide various lines structure.
Further, described rigid insulation layer 21 arranges through hole 211, arranges the electric conductor 212 of the described copper foil layer 30 of electrical connection and described line layer 22 in described through hole 211.Described to electric body 212 through described rigid insulation layer 21.Utilize the signal lead of line layer 22 described in the conducting of described electric conductor 212 and the ground connection cabling of described copper foil layer 30, thus conveniently for the circuit on described line layer 22 carries out ground connection, thus make described Rigid Flex 100 structure simple, improve electric conductivity, or can also be that the signal lead of the signal lead and described copper foil layer 30 realizing described line layer 22 is conducted, thus realize the various lines structure of described Rigid Flex 100.In other embodiments, the number of described through hole 211 can be multiple, thus realizes described line layer 22 and the conducting of described copper foil layer 30 various ways.
Further, described Rigid Flex 100 comprises two-layer described copper foil layer 30, and be the first copper foil layer 31 and the second copper foil layer 32 respectively, described first copper foil layer 31 and described second copper foil layer 32 are arranged in described flexible substrate layer 10 both sides respectively.In present embodiment, described first copper foil layer 31 and described second copper foil layer 32 are respectively equipped with different circuits, to increase the circuit layout space of described Rigid Flex 100, improve the electric conductivity of described Rigid Flex 100.Described first copper foil layer 31 is provided with the through signal via 30a to described second copper foil layer 32, arranges the signal conductor 30b connecting described first copper foil layer 31 and described second copper foil layer 32 in described signal via 30a.Described signal via 30a is opened in circuit one end of described first copper foil layer 31, and the circuit towards described second copper foil layer 32 extends.Concrete, described signal via 30a also runs through described flexible substrate layer 10, and it is copper post through described signal via 30a that described signal leads 30b.Described signal conductor 30b realizes the signal conduction of described first copper foil layer 31 and described second copper foil layer 32, thus ensure that the multi-line cabling requirement of described Rigid Flex 100.Described signal via 30a is opened in the second district 10b of the relatively described flexible substrate layer 10 of described copper foil layer 30, thus cut down the stress of described copper foil layer 30 at the second district 10a, thus make Rigid Flex 100 at the second district 10b remitted its fury, thus described Rigid Flex 100 can be made not to be weakened in the intensity of described first district 10a, thus ensure the hard rays line structure intensity of described Rigid Flex 100, thus improve the assembling intensity of described Rigid Flex 100 at the first district 10a.In other embodiments, the number of described signal via can be multiple, and multiple described signal electric conductor 212 can realize multiple signal lead mutual conduction.
Further, described first copper foil layer 31 is also provided with the through ground connection via hole 30c to described second copper foil layer 32, arranges the earthing conductor 30d connecting described first copper foil layer 31 and described second copper foil layer 32 in described ground connection via hole 30c.Described ground connection via hole 30c is opened on the ground path of described first copper foil layer 31, and the circuit towards described second copper foil layer 32 extends.Thus making described first copper foil layer 31 provide grounding electrode, the circuit of described second copper foil layer 32 is grounded.Concrete, described ground connection via hole 30c runs through described flexible substrate layer 10, and described earthing conductor 30d is the copper post through described ground connection via hole 30c.Described earthing conductor 30d realizes described second copper foil layer 32 ground connection, thus provides the various lines structure of described Rigid Flex 100.Described ground connection via hole 30c and described signal via 30a is separated from each other, and described ground connection via hole 30c is positioned at the second district 10b of described flexible substrate layer 10 equally, described ground connection via hole 30c cuts down the second district 10b stress of flexible parent metal 10, described Rigid Flex 100 is improved in the second district 10b flexibility, and then under ensureing that the first district 10a of described Rigid Flex 100 assembles strength conditions, the second district 10b is made to be easier to deformation, Rigid Flex 100 can be made to adapt to multiple terminal, improve the assembly performance of described Rigid Flex 100.In other embodiments, described flexible substrate layer 10 can also arrange two described first district 10a and arranged of being separated by and be connected to the second district 10b between two described first district 10a, thus utilize the flexibility of described second district 10b to improve, make the line layer 22 on the first district 10a described in one of them, and the electronic component on line layer 22 is used as plug port, thus improve described Rigid Flex 100 assembly performance.
Further, described Rigid Flex 100 also comprises the first coverlay 41 and the second coverlay 42, described first coverlay 41 and described second coverlay 42 fit on described first copper foil layer 31 and described second copper foil layer 32 respectively, and in described flexible substrate layer 10 orthographic projection region and described second district 10b coincide.
In present embodiment, described first coverlay 41 and described second coverlay 42 are protected described first copper foil layer 31 and described second copper foil layer 32 respectively.Described first coverlay 41 and described second coverlay 42 are all corresponding with the second district 10b of described flexible substrate layer 10.Described first coverlay 41 and described second coverlay 42 all represent flexibility, thus make described Rigid Flex 100 in the easy bending of the second district 10b, improve the flexibility of described Rigid Flex 100.Described first coverlay 41 is seamless spliced in described flexible substrate layer 10 with described rigid insulation layer 21, thus jointly the first copper foil layer 31 in described flexible substrate layer 10 is covered, and then avoid described first copper foil layer 31 to be exposed in air, prevent described first copper foil layer 31 short circuit.Concrete, it is hot-forming that described first coverlay 41 can adopt polyester material to carry out.Described first coverlay 41 by paste adhesive on described first copper foil layer 31.Concrete; described first coverlay 41 fits on described first copper foil layer 31 completely; and cover the signal lead of described first copper foil layer 31 on described second district 10b and ground connection cabling; do not lost to protect signal lead and ground connection cabling on described first copper foil layer 41 or damaged; simultaneously; adopt the mode of paste adhesive; also described first coverlay 41 can be made tightr with the connection of described first copper foil layer 31, prevent described first coverlay 41 be shifted and cannot protect the part cabling exposing described first coverlay 41.Described second coverlay 42 and the identical setting of described first coverlay 41 structure, do not repeat them here.Certainly, in other embodiments, if described Rigid Flex 100 only arranges the first copper foil layer 31 described in one deck, then described Rigid Flex 100 also only can arrange the first coverlay 41 described in one deck.
Further, described Rigid Flex 100 comprises two described hard rays base boards, 20, two described hard rays base boards 20 and is individually fixed in described flexible substrate layer 10 both sides.
In present embodiment, the rigid insulation layer 21 of two described hard rays base boards 20 fits on described first copper foil layer 21 and described second copper foil layer 22 respectively.The signal electric conductor running through two-layer described rigid insulation layer 21 and described flexible substrate layer 10 can also be set between the line layer 22 of two described hard rays base boards 20, the two ends of described signal electric conductor are utilized to be electrically connected on the signal lead of two-layer described line layer 22 respectively, thus realize the signal conduction of two-layer described line layer 22, thus make the line construction variation of described soft junction plywood 100, and soldered elements 25 mutual conduction that can make on two described hard rays base boards 20, thus make described Rigid Flex 100 structure diversification further.In other embodiments, on the line layer 22 of two described hard rays base boards 10, signal lead can arrange two kinds of different arrangement modes respectively, and the soldered elements 25 of two described hard rays base boards 10 can be different and arrange different welding position layouts with described line layer 22 signal lead arrangement mode respectively.
The present invention also provides a kind of terminal (not shown), described terminal comprises body (not shown), is located at the mainboard (not shown) of described body interior and described Rigid Flex 100, described Rigid Flex 100 is located at described body interior, and is electrically connected with described mainboard.Described terminal can be mobile phone, computer, flat board, handheld device or media player etc.
Rigid Flex of the present invention and terminal, by fixing described strengthening course on described anti-solder ink layer, described strengthening course is utilized to enclose all sides in multiple described soldered elements, the intensity of described Rigid Flex at described first place of district is increased, and then improves the rigid assembling intensity of described Rigid Flex.
Be more than the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a Rigid Flex, it is characterized in that, described Rigid Flex comprises flexible substrate layer and hard rays base board, described flexible substrate layer comprises the firstth district, described hard rays base board comprises rigid insulation layer, line layer, anti-solder ink layer, strengthening course and multiple soldered elements, described rigid insulation layer is fixed in described flexible substrate layer, and orthographic projection region in described flexible substrate layer and described firstth district coincide, described line layer is arranged on described rigid insulation layer, described anti-solder ink layer covers described line layer, described anti-solder ink layer arranges multiple welding hole, multiple described soldered elements is welded in multiple described welding hole respectively, and be electrically connected described line layer, described strengthening course is fixed on described anti-solder ink layer, and all sides enclosed in multiple described soldered elements.
2. Rigid Flex according to claim 1, is characterized in that, described Rigid Flex also comprises copper foil layer, and described copper foil layer is arranged in described flexible substrate layer, and is laminated between described flexible substrate layer and described rigid insulation layer.
3. Rigid Flex according to claim 2, is characterized in that, described rigid insulation layer arranges through hole, arranges the electric conductor of the described copper foil layer of electrical connection and described line layer in described through hole.
4. Rigid Flex according to claim 2, it is characterized in that, described Rigid Flex comprises two-layer described copper foil layer, is the first copper foil layer and the second copper foil layer respectively, and described first copper foil layer and described second copper foil layer are arranged in the opposing both sides of described flexible substrate layer respectively.
5. Rigid Flex according to claim 4, is characterized in that, described first copper foil layer is provided with the through signal via to described second copper foil layer, is provided with the signal conductor connecting described first copper foil layer and described second copper foil layer in described signal via.
6. Rigid Flex according to claim 4, is characterized in that, described first copper foil layer is provided with the through ground connection via hole to described second copper foil layer, arranges the earthing conductor connecting described first copper foil layer and described second copper foil layer in described ground connection via hole.
7. Rigid Flex according to claim 4, it is characterized in that, described flexible substrate layer also comprises the secondth district being connected to described first area edge, described Rigid Flex also comprises the first coverlay and the second coverlay, described first coverlay and described second coverlay fit on described first copper foil layer and described second copper foil layer respectively, and orthographic projection region in described flexible substrate layer and described secondth district coincide.
8. Rigid Flex according to claim 1, is characterized in that, described Rigid Flex comprises two described hard rays base boards, and two described hard rays base boards are individually fixed in described flexible substrate layer both sides.
9. Rigid Flex according to claim 1, is characterized in that, described strengthening course is steel reinforcement.
10. a terminal, is characterized in that, described terminal comprises body, is located at the mainboard of described body interior and Rigid Flex as described in claim 1 ~ 9 any one, and described Rigid Flex is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105725.6A CN105578732B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105725.6A CN105578732B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
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| Publication Number | Publication Date |
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| CN105578732A true CN105578732A (en) | 2016-05-11 |
| CN105578732B CN105578732B (en) | 2018-01-23 |
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| CN201610105725.6A Active CN105578732B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and terminal |
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| CN111425826A (en) * | 2019-01-10 | 2020-07-17 | 同扬光电（江苏）有限公司 | Soft and hard combined line structure and backlight module with same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105578732B (en) | 2018-01-23 |
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