CN209183542U - Intelligent power module and equipment - Google Patents
Intelligent power module and equipment Download PDFInfo
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- CN209183542U CN209183542U CN201822185742.2U CN201822185742U CN209183542U CN 209183542 U CN209183542 U CN 209183542U CN 201822185742 U CN201822185742 U CN 201822185742U CN 209183542 U CN209183542 U CN 209183542U
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Abstract
The utility model embodiment provides intelligent power module and equipment, and wherein intelligent power module includes at least two (PCC) powers: each (PCC) power includes substrate；The substrate of any two (PCC) power is arranged in Different Plane；Each (PCC) power is packaged into an entirety, and each substrate is provided with the one side of electronic component and is sealed.The utility model embodiment effectively prevent the beneficial effect of bending with that can play reduction intelligent power module.
Description
Technical field
The utility model embodiment is related to electronic circuit technology field more particularly to a kind of intelligent power module and equipment.
Background technique
Intelligent power module, i.e. IPM (Intelligent Power Module) are a kind of by power electronics and integrated electricity
The power drive class product that road technique combines.Intelligent power module is electronic components such as device for power switching and high-voltage driving circuits
It integrates, compared with traditional discrete scheme, intelligent power module is won more next with advantages such as its high integration, high reliability
Bigger market is particularly suitable for the frequency converter and various inverters of driving motor, is frequency control, metallurgical machinery, electric power
Traction, servo-drive, a kind of desired power level electronic device of frequency-conversion domestic electric appliances.
Currently, the prior art is mostly by multiple (PCC) powers when integrated by multiple (PCC) powers in intelligent power module
Power component, driving circuit and MCU etc. be integrated on same substrate.Multiple (PCC) powers, which are placed on same substrate, will lead to
The area of intelligent power module increases, and is easy to happen bending and curling.
Utility model content
The utility model embodiment provides a kind of intelligent power module and equipment, to solve existing intelligent power module skill
In art when integrated by multiple (PCC) powers in intelligent power module, the area of intelligent power module increases, to play reduction intelligence
Energy power module, effectively prevent the beneficial effect of bending.
According to the first aspect of the utility model embodiment, a kind of intelligent power module, including at least two function are provided
Rate component:
Each (PCC) power includes substrate；
The substrate of any two (PCC) power is arranged in Different Plane；
Each (PCC) power is packaged into an entirety, and each substrate is provided with the one side of electronic component and is sealed.
Further, the substrate of any two (PCC) power is not in contact with each other.
Further, the one side that each substrate is not provided with electronic component is contacted with air.
Further, including two (PCC) powers；The substrate-parallel of two (PCC) powers, and each substrate is provided with electronic component
Be oppositely arranged on one side.
Further,
Each (PCC) power further includes insulating layer, circuit-wiring layer and electronic component；
The insulating layer is set on the substrate；
The circuit-wiring layer is formed in the surface of the insulating layer, and the circuit-wiring layer has installation position；
The electronic component is set on the corresponding installation position of the circuit-wiring layer.
Further, the electronic component includes power component and main control chip.
Further, the power component of each (PCC) power and the main control chip pass through metal wire and the circuit respectively
Corresponding installation position electrical connection on wiring layer.
Further, the intelligent power module further includes pin, and the pin is set on each circuit-wiring layer, and
It is electrically connected by metal wire with the power component and the main control chip.
Further, the electronic component is high voltage integrated circuit, insulated gate bipolar transistor or fast recovery diode.
According to the first aspect of the utility model embodiment, a kind of electric appliance is provided, including any of the above-described intelligent power
Module.
The utility model embodiment intelligent power module and equipment, wherein intelligent power module includes at least two power packages
Part: each (PCC) power includes substrate；The substrate of any two (PCC) power is arranged in Different Plane；Each (PCC) power is packed
At an entirety, and each substrate is provided with the one side of electronic component and is sealed.The utility model embodiment has and can rise
To intelligent power module is reduced, it effectively prevent the beneficial effect of bending.
Detailed description of the invention
In order to illustrate more clearly of the utility model embodiment or art scheme in the prior art, below will to embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is this
Some embodiments of utility model, for those of ordinary skill in the art, without creative efforts, also
Other drawings may be obtained according to these drawings without any creative labor.
Fig. 1 is an example structure schematic diagram of the utility model intelligent power module；
Fig. 2 is the another example structure schematic diagram of the utility model intelligent power module；
Fig. 3 is a further embodiment structural schematic diagram of the utility model intelligent power module.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
Intelligent power module is suitable for the frequency converter of driving motor and various inverters, to realize frequency control, smelting
The functions such as golden machinery, electric propulsion, servo-drive.It is particularly suitable for the motor work of the compressors such as driving air-conditioning, refrigerator.It is answering
When in convertible frequency air-conditioner, since in most cases its algorithm has been cured frequency conversion drive substantially, in order to save volume, improve
Anti-interference ability mitigates the automatically controlled version design efforts would in periphery, can be integrated into master controller on one wiring board, form intelligent power
Module.When integrated by multiple (PCC) powers in intelligent power module, the prior art is mostly by the power member of multiple (PCC) powers
Part, driving circuit and MCU etc. are integrated on same substrate.Multiple (PCC) powers, which are placed on same substrate, will lead to intelligent power
The area of module increases, and is easy to happen bending and curling.
To solve at least one above-mentioned technical problem, the utility model embodiment provides a kind of intelligent power module, will hold
It carries multiple substrates to integrated power component to be provided separately and be packaged, plays reduction intelligent power module, effectively prevent curved
The beneficial effect of folding.
Such as Fig. 1, the structural schematic diagram of the utility model specific embodiment intelligent power module is shown.On the whole, including extremely
Few two (PCC) power A1:
Each (PCC) power includes substrate A11；
The substrate A11 of any two (PCC) power A1 is arranged in Different Plane；
Each (PCC) power A1 is packaged into an entirety, and the one side that each substrate A11 is provided with electronic component is close
Envelope.
Wherein, substrate is the rectangular plate being made of aluminium or other technologies material, this specific implementation in this specific embodiment
Example is not specifically limited herein.
Further, it is usually provided with each (PCC) power on substrate, further includes insulating layer, circuit-wiring layer and electronic component；
The circuit-wiring layer is formed in the surface of the insulating layer, and the circuit-wiring layer has installation position；The electronic component is set
It is placed on the corresponding installation position of the circuit-wiring layer.
This specific embodiment needs particular determination for the substrate setting positional relationship of each (PCC) power.Each (PCC) power
Substrate is arranged between any two in different planes, can be arranged in parallel between each other, angled setting, as long as can be real
Play the beneficial effect for reducing intelligent power module area.
Further, each (PCC) power is based on insulative potting material in the prior art and is packaged into an entirety, and each institute
It states substrate and is provided with the one side of electronic component and sealed.
The utility model embodiment provides a kind of intelligent power module, will carry multiple substrates to integrated power component point
It opens up and sets and be packaged, compared with existing power module, in the case of the (PCC) power for needing to encapsulate multiple quantity, have smaller
Length, the bending and warpage of module can be effectively reduced.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module, any two are provided
The substrate of (PCC) power is not in contact with each other.
Wherein, each electronic component short cut with each other or generate certain electromagnetism to the embodiment intelligent power module in order to prevent
Interference, guarantees that each substrate is mutually not in contact with each other.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module, each base are provided
The one side that plate is not provided with electronic component is contacted with air.
Wherein, the substrate of the present embodiment (PCC) power includes two faces, and being provided with each (PCC) power on one side further includes insulation
Layer, circuit-wiring layer and electronic component, and another side is contacted with air, is radiated conducive to intelligent power module.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module, including two are provided
(PCC) power；The substrate-parallel of two (PCC) powers, and each substrate is provided with being oppositely arranged on one side for electronic component.
Wherein, the substrate of the present embodiment (PCC) power is in the feelings being oppositely arranged on one side that are parallel, and being provided with electronic component
It most can be reduced the area of intelligent power module under condition, and can play reduce each interelement interference simultaneously, conducive to the beneficial of heat dissipation
Effect.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module is provided, such as Fig. 2 institute
Show, each (PCC) power further includes insulating layer A12, circuit-wiring layer A13 and electronic component A14；The insulating layer A12 is set to described
On substrate A11；The circuit-wiring layer A13 is formed in the surface of the insulating layer A12, and the circuit-wiring layer A13 has peace
Fill position；The electronic component A14 is set on the corresponding installation position of the circuit-wiring layer A13.
The intelligent power module further includes the insulating layer on the substrate, and the circuit-wiring layer is formed in described
The surface of insulating layer.
In the present embodiment, electronic component can include power component and main control chip, and power component can be gallium nitride
(GaN) power component, Si base power component or SiC base power component, the present embodiment preferably use gallium nitride (GaN) power component
41.Multiple power components 41, generally six form power inverting bridge circuit, load work for driving motor, compressor etc.
Make, main control chip is arranged on the installation position of circuit-wiring layer, is electrically connected by the conductive materials such as scolding tin and circuit-wiring layer realization
It connects, and forms current loop.Power component be arranged on low thermal resistance insulating layer, conduct heat on substrate, by substrate into
Row heat dissipation.Substrate can use substrate made by the materials such as lead frame, metal, cardboard, half glass-fiber-plate, glass-fiber-plate to realize,
The present embodiment preferably uses metal to realize.The shape of substrate can be according to circuit-wiring layer, main control chip and intelligent power
The specific location of other electronic components and size determine in module, can be rectangular, but be not limited to rectangular.
Circuit-wiring layer forms corresponding route and corresponding confession according to the circuit design of intelligent power module on substrate
Specifically after circuit substrate sets insulating layer, copper foil is laid on absolutely for the installation position of each electronic component installation, i.e. pad
In edge layer, and the copper foil is etched according to preset circuit design, to form circuit-wiring layer.
Solder mask refers to the part that green oil is gone up on printed circuit plank.Actually this solder mask uses negative film defeated
Out, so after on the shape map to plank of solder mask, it is not to have gone up green oil welding resistance, is to expose copper sheet instead.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module, the electronics are provided
Element includes power component and main control chip.
In intelligent power module work, the corresponding control signal of main control chip output, to control corresponding power component
Conducting, thus output driving electric energy, with loaded work pieces such as driving motors.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module is provided, such as Fig. 2 institute
Show, the power component A14 of each (PCC) power and the main control chip A14 pass through metal wire A15 and the circuit-wiring layer respectively
The upper corresponding installation position electrical connection of A13.
In the present embodiment, metal wire can be aluminum steel or gold thread, and main control chip and power component pass through metal wire and electricity
Road wiring layer realizes electrical connection, and the control signal for enabling master control chip to export is transmitted to each power component, to control
Corresponding power component conduction and cut-off.It is understood that each power component and main control chip can be in water in the present embodiment
Flat setting, to reduce the required precision of metal wire, and reduces the manufacturing process difficulty of intelligent power module, improves intelligence
The production qualification rate of energy power module, while also reducing the production cost of intelligent power module.Metal wire is by tin cream and respectively
Power component is mutually fixed with the main control chip.Tin cream English name solder paste, grey lotion.Solder(ing) paste be along with
A kind of novel welding material that SMT comes into being is by solder powder, scaling powder and other surfactant, thixotropic agent etc.
It is mixed, the paste mixture of formation.It is mainly used for the weldering of the electronic components such as SMT industry PCB surface resistance, capacitor, IC
It connects.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module, the electronics are provided
Element is high voltage integrated circuit, insulated gate bipolar transistor or fast recovery diode.
On the basis of the utility model any above-mentioned specific embodiment, as shown in Fig. 2, providing a kind of intelligent power mould
Block, sealing element A17 is provided between each (PCC) power, and the sealing element is resin seal A17.
On the basis of the utility model any above-mentioned specific embodiment, a kind of intelligent power module is provided, such as Fig. 3 institute
Show, compressor IPM and blower IPM are subjected to integrally disposed specific embodiment in air-conditioning integrated circuit.
It wherein, is air-conditioning IPM and blower IPM, compressor IPM packet including two (PCC) powers in intelligent power module 100
Aluminum substrate 103 is included, blower IPM includes aluminum substrate 203, and aluminum substrate 103 is parallel with aluminum substrate 203, and two pieces of aluminum substrates are provided with
Electronic component is oppositely arranged on one side.
It is provided with insulating layer 104 on the aluminum substrate 103 of compressor IPM, circuit-wiring layer 105 is provided on insulating layer 104,
Circuit-wiring layer 105 has installation position, and HVIC108, IGBT109 and FRD110 of compressor IPM are arranged in circuit-wiring layer 105
Corresponding installation position on, HVIC108, IGBT109 and FRD110 of compressor IPM passes through metal wire 111 and tin cream 107 each other
It connects, is provided with solder mask 106 on tin cream 107.
It is provided with insulating layer 204 on the aluminum substrate 203 of blower IPM, circuit-wiring layer 205 is provided on insulating layer 204, electricity
Road wiring layer 205 has installation position, and the phase of circuit-wiring layer 205 is arranged in HVIC208, IGBT209 and FRD210 of blower IPM
It answers on installation position, HVIC208, IGBT209 of blower IPM passes through metal wire with FRD210 each other and connect with tin cream, on tin cream
It is provided with solder mask.
The present embodiment intelligent power module further includes pin 101, and the pin is set on each circuit-wiring layer, and
It is electrically connected by metal wire with each electronic component of compressor IPM and blower IPM.
The aluminum substrate 103 and aluminum substrate 203 of two (PCC) powers are arranged in parallel, and each aluminum substrate is provided with electronic component
It is oppositely arranged on one side.Electronic component between two aluminum substrates is sealed by sealing resin 102.
The power component of compressor IPM and blower IPM are distributed in power module by the embodiment intelligent power module respectively
Two pieces of substrates on, and two pieces of substrate-parallels, and substrate is provided with being oppositely arranged on one side for electronic component, the electronics between two substrates
Element is sealed by sealing resin.The embodiment be conducive to reduce compressor IPM and blower IPM between interference, compressor IPM and
Blower IPM radiates from two substrates for being located at power module two sides respectively, improves the integral heat sink performance of module, and enhancing is reliable
Property.
On the basis of the utility model any above-mentioned specific embodiment, a kind of equipment is provided, including any of the above-described specific
Intelligent power module described in embodiment.
Wherein, it the type of the equipment and is not particularly limited, as long as can be applicable in various embodiments of the utility model
Intelligent power module.Intelligent power module is become suitable for the frequency converter of driving motor and various inverters with realizing
The functions such as frequency modulation speed, metallurgical machinery, electric propulsion, servo-drive.It is particularly suitable for the motor of the compressors such as driving air-conditioning, refrigerator
Work.When being applied in convertible frequency air-conditioner, since in most cases its algorithm has been cured frequency conversion drive substantially, in order to save
Volume improves anti-interference ability, mitigates the automatically controlled version design efforts would in periphery, can be integrated into master controller on one wiring board, shape
At intelligent power module.
Intelligent power module in compared with the prior art, the major advantage of the utility model above-described embodiment be embodied in as
Lower 3 points.
Firstly, the highly integrated intelligent power module that the utility model specific embodiment proposes divides multiple (PCC) powers respectively
Be distributed on two each substrates of power module, according to experimental results can highest reduce by 30% thermal resistance, so as to reduce power
Element temperature rise.
Secondly, the power module that the utility model specific embodiment proposes effectively solves multiple power device packages in one
Signal interference problem afterwards.
Finally, the utility model proposes intelligent power module compared with existing intelligent power module, for needing to encapsulate
In the case of the power component of identical quantity, there is smaller length, the bending and warpage of intelligent power module can be effectively reduced.
The apparatus embodiments described above are merely exemplary, wherein described, unit can as illustrated by the separation member
It is physically separated with being or may not be, component shown as a unit may or may not be physics list
Member, it can it is in one place, or may be distributed over multiple network units.It can be selected according to the actual needs
In some or all of the modules achieve the purpose of the solution of this embodiment.Those of ordinary skill in the art are not paying creativeness
Labour in the case where, it can understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It realizes by means of software and necessary general hardware platform, naturally it is also possible to pass through hardware.Based on this understanding, on
Stating technical solution, substantially the part that contributes to existing technology can be embodied in the form of software products in other words, should
Computer software product may be stored in a computer readable storage medium, such as ROM/RAM, magnetic disk, CD, including several fingers
It enables and using so that a computer equipment (can be personal computer, server or the network equipment etc.) executes each implementation
Method described in certain parts of example or embodiment.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement；And these are modified or replaceed, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (10)
1. a kind of intelligent power module, which is characterized in that including at least two (PCC) powers:
Each (PCC) power includes substrate；
The substrate of any two (PCC) power is arranged in Different Plane；
Each (PCC) power is packaged into an entirety, and each substrate is provided with the one side of electronic component and is sealed.
2. intelligent power module according to claim 1, which is characterized in that the substrate of any two (PCC) power does not connect mutually
Touching.
3. intelligent power module according to claim 1, which is characterized in that each substrate is not provided with electronic component
It is contacted on one side with air.
4. intelligent power module according to claim 1, which is characterized in that including two (PCC) powers；Two power packages
The substrate-parallel of part, and each substrate is provided with being oppositely arranged on one side for electronic component.
5. intelligent power module according to claim 1, it is characterised in that:
Each (PCC) power further includes insulating layer, circuit-wiring layer and electronic component；
The insulating layer is set on the substrate；
The circuit-wiring layer is formed in the surface of the insulating layer, and the circuit-wiring layer has installation position；
The electronic component is set on the corresponding installation position of the circuit-wiring layer.
6. intelligent power module according to claim 5, which is characterized in that the electronic component includes power component and master
Control chip.
7. intelligent power module according to claim 6, which is characterized in that the power component of each (PCC) power and institute
It states main control chip and passes through metal wire respectively and be electrically connected with installation position corresponding on the circuit-wiring layer.
8. intelligent power module according to claim 7, which is characterized in that the intelligent power module further includes pin,
The pin is set on each circuit-wiring layer, and is electrically connected by metal wire and the power component and the main control chip
It connects.
9. -8 any intelligent power module according to claim 1, which is characterized in that the electronic component is integrated for high pressure
Circuit, insulated gate bipolar transistor or fast recovery diode.
10. a kind of equipment, which is characterized in that including such as described in any item intelligent power module of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822185742.2U CN209183542U (en) | 2018-12-25 | 2018-12-25 | Intelligent power module and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822185742.2U CN209183542U (en) | 2018-12-25 | 2018-12-25 | Intelligent power module and equipment |
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| Publication Number | Publication Date |
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| CN209183542U true CN209183542U (en) | 2019-07-30 |
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ID=67377957
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| CN201822185742.2U Active CN209183542U (en) | 2018-12-25 | 2018-12-25 | Intelligent power module and equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024007432A1 (en) * | 2022-06-16 | 2024-01-11 | 苏州汇川控制技术有限公司 | Intelligent power module and electrical device |
-
2018
- 2018-12-25 CN CN201822185742.2U patent/CN209183542U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024007432A1 (en) * | 2022-06-16 | 2024-01-11 | 苏州汇川控制技术有限公司 | Intelligent power module and electrical device |
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