CN211267530U - Intelligent power module and air conditioner - Google Patents

Abstract

The utility model discloses an intelligent power module, its characterized in that, intelligent power module includes: the mounting substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the mounting substrate is provided with a plurality of mounting positions; the power assembly is arranged on the mounting position corresponding to the first surface of the mounting substrate; and the high-thermal-conductivity insulating layer and the high-thermal-conductivity heat dissipation layer are sequentially stacked on the second surface of the mounting substrate. The utility model discloses high heat conduction insulating layer and high heat conduction heat dissipation layer have good thermal conductivity and electrical insulation to can improve intelligent power module's radiating efficiency and insulating nature.

Description

Intelligent power module and air conditioner

Technical Field

The utility model relates to an electronic circuit technical field, in particular to intelligent power module and air conditioner.

Background

Intelligent Power Module (IPM) is a Power-driven product that combines Power electronics and integrated circuit technology. The intelligent power module integrates a power switch device and a high-voltage driving circuit and is internally provided with fault detection circuits such as overvoltage, overcurrent and overheat. The intelligent power module has large working current and high temperature, the internal temperature of the intelligent power module can be increased in a high-temperature state, and if the intelligent power module does not dissipate heat in time, devices integrated in the intelligent power module are easy to damage.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing an intelligent power module and air conditioner aims at improving intelligent power module's ampere of efficiency.

In order to achieve the above object, the present invention provides an intelligent power module, which includes a mounting substrate, the mounting substrate having a first surface and a second surface oppositely disposed, the first surface of the mounting substrate being provided with a plurality of mounting positions;

the power assembly is arranged on a mounting position corresponding to the first surface of the mounting substrate;

and the high-thermal-conductivity insulating layer and the high-thermal-conductivity heat dissipation layer are sequentially stacked on the second surface of the mounting substrate.

Optionally, the high thermal conductivity insulating layer is an aluminum nitride film.

Optionally, the thickness of the aluminum nitride film is in a range of 5 to 15 μm.

Optionally, the high thermal conductivity heat dissipation layer includes:

a metal heat dissipation layer;

and the graphene heat dissipation layer is clamped between the high-heat-conductivity insulating layer and the metal heat dissipation layer.

Optionally, the power module further includes an encapsulation housing, and the mounting substrate, the power component, and the high thermal conductivity insulating layer are encapsulated in the encapsulation housing.

Optionally, the graphene heat dissipation layer is encapsulated in the encapsulation shell.

Optionally, the metal heat dissipation layer is exposed outside the package housing.

Optionally, the smart power module further includes a heat sink, and the heat sink is attached to the metal heat dissipation layer.

Optionally, the mounting substrate includes:

a metal heat dissipation layer;

the insulating layer is arranged on the metal heat dissipation layer and provided with a through hole;

the circuit wiring layer is arranged on the insulating layer and comprises a grounding area, and the grounding area of the circuit wiring layer is electrically connected with the metal heat dissipation layer through the through hole.

The utility model discloses still provide an air conditioner, the air conditioner includes as above intelligent power module.

The utility model discloses a set up high heat conduction insulating layer and high heat conduction heat dissipation layer in one side of mounting substrate, set up power component at mounting substrate's opposite side, at the in-process of driver chip drive power device work, the heat that the power device is given birth to is diffused fast through high heat conduction insulating layer and high heat conduction heat dissipation layer. Through the quick heat conduction effect of high heat conduction insulating layer and high heat conduction heat dissipation layer, can solve the high integration of the little space of intelligent power module, and high-power heat dissipation untimely, perhaps the relatively poor problem of radiating effect. The utility model discloses high heat conduction insulating layer and high heat conduction heat dissipation layer have good thermal conductivity and electrical insulation to can improve intelligent power module's radiating efficiency and insulating nature.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of an intelligent power module according to the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the intelligent power module of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Mounting substrate	22	Driving chip
20	Power assembly	11	Aluminum substrate
				30	High heat conduction insulating layer	12	Insulating layer
40	High heat conduction heat dissipation layer	13	Circuit wiring layer
				50	Packaging shell	41	Metal heat dissipation layer
60	Heat radiator	42	Graphene heat dissipation layer
				70	Pin	121	Through hole
21	Power device

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model provides an intelligent power module.

An intelligent Power module (ipm) is a Power driving product combining Power electronics and integrated circuit technology, and is widely applied to electric control boards of devices in the fields of driving fans, compressors, rail transit, smart grids, aerospace, electric vehicles, new energy equipment and the like. It usually integrates a plurality of IGBT chips, FRD chip, drive IC chip and MCU chip etc. in same power module, has very high power density, and its encapsulation is inside in order to promote its anti-jamming ability usually, therefore can accumulate a large amount of heats in its course of the work, need set up the radiating block at its back and dispel the heat with higher speed, this inevitable has brought noise interference for intelligent power module's normal work.

The prior art scheme usually realizes the balance of heat conduction and anti-interference capability of the intelligent power module by controlling the thickness of sealing resin on the back of the aluminum substrate, the precision requirement on packaging equipment is very high, the realization is not easy to control, in the prior art, BN or Al2O3 particles are filled by epoxy resin, the heat conductivity is usually 2W/m.K, the heat conduction efficiency is low, the heat dissipation is easily caused to be untimely, and the development requirement of the current power density gradual increase cannot be met.

In order to solve the above problem, referring to fig. 1, in an embodiment of the present invention, the intelligent power module includes:

a mounting substrate 10, wherein the mounting substrate 10 has a first surface and a second surface which are oppositely arranged, and the first surface of the mounting substrate 10 is provided with a plurality of mounting positions;

the power component 20 is mounted and arranged on a mounting position corresponding to the first surface of the mounting substrate 10;

the high thermal conductive insulating layer 30 and the high thermal conductive heat dissipation layer 40 are sequentially stacked on the second surface of the mounting substrate 10.

In this embodiment, the power module 20 includes a power device 21 and a driving chip 22, for example, the power switch may be a gallium nitride (GaN) power switch, a Si-based power switch or a SiC-based power switch, and in this embodiment, the gallium nitride (GaN) power switch is preferably used. The number of the power switch tubes can be one or a plurality of, when the number of the power switch tubes is multiple, the power switch tubes can comprise four power switch tubes, or multiples of four, or six power switch tubes, or multiples of six, the six power switch tubes form an inverter circuit, and the inverter circuit is applied to electrical equipment such as an inverter power supply, a frequency converter, refrigeration equipment, metallurgical mechanical equipment, electric traction equipment and the like, particularly frequency conversion household appliances. When the intelligent power module works, the driving chip 22 outputs a corresponding PWM control signal to drive and control the corresponding power switching tube to be turned on/off, so as to output driving electric energy to drive the motor and other loads to work.

The number of the driving chips 22 may be one, for example, the HVIC driving chip 22, and the driving chip 22 is an integrated chip, in which the driving circuits of the four-way, six-way or three-way power device 40 are integrated, and the integration may be specifically configured according to the number of the driving devices 50. The number of the driver chips 22 may also be multiple, for example, two, four, or six, and the number of the multiple driver chips 22 may correspond to the number of the power devices 40, and each driver chip 22 drives one power device 40 to operate. The driving chip 22 may also be provided with two driving chips 22, namely an upper bridge arm driving chip 22 and a lower bridge arm driving chip 22, and respectively drive the upper bridge arm power device 40 and the lower bridge arm power device 40 to work, and the power device 40 and the driving chip 22 are electrically connected through a metal lead to form a current loop. When the intelligent power module works, the driving chip 22 outputs a corresponding control signal to control the conduction of the corresponding power device 40, so as to output driving electric energy to drive a motor and other loads to work, and in the process, heat generated by the power device 40 is conducted onto the mounting substrate 10 through the heat sink 30, so as to be dissipated through the heat sink 30 and the mounting substrate 10.

The power module 20 further includes a main control chip, that is, an MCU, in which a logic controller, a memory, a data processor, etc. and a software program and/or module stored in the memory and operable on the data processor are integrated, and the MCU outputs a corresponding control signal to the driving chip 22 of the intelligent power module by operating or executing the software program and/or module stored in the memory and calling data stored in the memory, so that the driving chip 22 drives the corresponding power switching tube to be turned on/off according to the received control signal, so as to drive the fan, the compressor, the motor, etc. to work. Or the PFC module is driven to work, so that power factor correction of the accessed direct-current power supply is realized.

Each power switch tube may be a patch-type electronic component or a bare die wafer, a bonding pad is disposed on the plurality of aluminum substrates 11, and the plurality of power components may be bonded to the corresponding mounting position by solder, conductive adhesive, or the like.

The high thermal conductive insulating layer 30 can be implemented by an aluminum nitride film, and in practical applications, the aluminum nitride film can be fabricated on the metal heat dissipation layer 41, wherein the metal heat dissipation layer 41 is implemented by using an aluminum substrate 11 or a copper substrate, and when the metal heat dissipation layer is implemented by using the aluminum substrate 11, the aluminum nitride film can be fabricated on the aluminum substrate 11. For specific processing, physical vapor deposition methods such as ion beam deposition, pulsed laser deposition, filtered cathode vacuum arc, magnetron sputtering, and the like can be used. For example, when the magnetron sputtering method is used for implementation, nitrogen is sputtered as target material nitrogen to form particles, the sputtered target material particles move to the aluminum substrate 11, the nitrogen particles deposited on the aluminum substrate 11 are continuously agglomerated, nucleated and grown, and finally an aluminum nitride alloy thin film is formed. The aluminum nitride alloy film can be directly formed on the aluminum substrate 11, so that the substrate and the insulating layer 12 are contacted more tightly, the contact area between layers is increased, the thermal contact resistance between the aluminum substrate 11 and the insulating layer 12 can be reduced, the electrical insulation performance of the aluminum nitride alloy film is good, the noise interference of the radiator 60 to the module can be effectively reduced, the operation stability of the intelligent power module is improved, the aluminum nitride film layer formed on the aluminum substrate 11 is uniform in thickness and easy to control, and the heat conductivity coefficient of the aluminum nitride film layer is about 5W/M K. The thickness range of the aluminum nitride film is 5-15 mu m, optionally 10 mu m, and the thickness of the insulating layer 12 and the heat dissipation metal layer in the mounting substrate 10 can be correspondingly reduced by the arrangement of the aluminum nitride film, so that the thickness of the intelligent power module is reduced. In another embodiment, when the metal heat dissipation substrate is implemented by using a copper substrate, aluminum can be plated on the copper substrate (copper foil and copper plate) by magnetron sputtering, and then an aluminum nitride thin layer can be grown on the aluminum plated layer. The aluminum nitride alloy film grows through magnetron sputtering, and compared with the situation that AlN particles are added in epoxy resin paint, the aluminum nitride alloy film has better insulating property and better heat conducting property, and the thickness of the aluminum nitride alloy film is easier to control compared with the thickness of thermoplastic molding epoxy resin.

The utility model discloses a set up high heat conduction insulating layer 30 and high heat conduction heat dissipation layer 40 in one side of mounting substrate 10, set up power component at mounting substrate 10's opposite side, at the in-process of the work of driver chip drive power device 40, the heat that power device 21 produced diffuses fast through high heat conduction insulating layer 30 and high heat conduction heat dissipation layer 40. Through the quick heat conduction effect of the high heat conduction insulating layer 30 and the high heat conduction heat dissipation layer 40, the problems that the intelligent power module is small in space and high in integration, high-power heat dissipation is not timely, or the heat dissipation effect is poor can be solved. The utility model discloses high heat conduction insulating layer 30 and high heat conduction heat dissipation layer 40 have good thermal conductivity and electrical insulation to can improve intelligent power module's radiating efficiency and insulating nature.

Referring to fig. 1, in an embodiment, the high thermal conductivity heat dissipation layer 40 includes:

a metal heat dissipation layer 41;

and the graphene heat dissipation layer 42 is sandwiched between the high thermal conductivity insulation layer 30 and the metal heat dissipation layer 41.

In this embodiment, the metal heat dissipation layer 41 can be implemented by using copper or a copper alloy, the thermal conductivity of the graphene heat dissipation layer 42 is as high as 200W/m × K, and has a high heat dissipation capability, the graphene heat dissipation layer 42 can be formed by growing a graphene heat dissipation layer 42 on the copper heat dissipation layer with a suitable area by a CVD method, so that the graphene heat dissipation layer 42 and the copper heat dissipation layer are integrally formed, and processes such as coating and transferring are not required, the graphene heat dissipation layer 42 can be directly formed on the metal heat dissipation layer 41, so that the metal heat dissipation layer 41 and the graphene heat dissipation layer 42 are in closer contact, which is beneficial to increasing the contact area between layers, and can also reduce the thermal contact resistance between the graphene heat dissipation layer 42 and the metal heat dissipation layer 41, which is beneficial to reducing the internal resistance of heat, so that the graphene heat dissipation layer 42 and the copper heat dissipation layer form a fast heat dissipation channel together, the working temperature in the module is kept at a lower temperature. Since the thermal conductivity of the graphene heat dissipation layer 42 is as high as 5000W/m · K and the theoretical specific surface area is as high as 2630m2/g, the thermal conductivity of the power assembly 20 and the mounting substrate 10 can be improved, so that the power assembly 20 can dissipate heat quickly, an unbalanced hot spot generated by the power assembly 20 is avoided, and the heat dissipation performance and the thermal reliability of the intelligent power module 1 are improved.

Referring to fig. 1, in an embodiment, the power module further includes a package housing 50, and the mounting substrate 10, the power component 20 and the high thermal conductivity insulating layer 30 are packaged in the package housing 50.

In this embodiment, the package housing 50 may be made of epoxy resin, aluminum oxide, and a heat conductive filling material, wherein the heat conductive filling material may be boron nitride or aluminum nitride, and the insulation property of aluminum nitride and boron nitride is better, and the heat conductivity is higher, and the heat resistance and the heat conductivity are better, so that the aluminum nitride and the boron nitride have higher heat transfer capability. When the package case 50 is manufactured, materials such as epoxy resin, aluminum oxide, boron nitride or aluminum nitride can be mixed, and then the mixed package material is heated; after cooling, the packaging material is crushed, and then the packaging shell 50 material is roll-formed by an ingot molding process to form the packaging shell 50, and then the electronic component in the power assembly 20 and the mounting substrate 10 are packaged in the packaging shell 50. Or the mounting substrate 10 with the power component 20 mounted thereon is placed in a mold through an injection molding process and an encapsulation mold, and then an encapsulation material is injected into the mold to encapsulate the power component 20 and the mounting substrate 10 in the encapsulation housing 50, so as to form the encapsulation housing 50 after molding. Therefore, the chip can be subjected to insulation treatment, and the EMI performance of the intelligent power module can be improved. The smart power module may employ a full-envelope package and a half-envelope package. In order to improve the heat dissipation efficiency of the intelligent power module, when the semi-encapsulation is adopted, the heat dissipation substrate 10 of the intelligent power module can be partially exposed outside the encapsulation shell 50, which is beneficial to the contact area between the heat dissipation substrate and air and accelerates the heat dissipation of the power element.

The graphene heat dissipation layer 42 is encapsulated in the package housing 50, and the metal heat dissipation layer 41 is exposed outside the package housing 50. After the packaging is completed, a packaging shell 50 is coated on the bottom surface of the intelligent power module, which is different from the metal heat dissipation layer 41, the packaging shell 50 is hardened to form the whole intelligent power module, and at least one surface of the metal heat dissipation layer 41 of the intelligent power module is exposed outside the packaging shell 50 of the intelligent power module, in another embodiment, the metal heat dissipation layer 41 is partially protruded outside the packaging shell 50, wherein the height of the metal heat dissipation layer 41 protruded outwards from the bottom of the packaging shell 50 can be specifically set according to the practical application, and is not limited herein. So set up, can improve intelligent power module's radiating efficiency to and protection graphite alkene heat dissipation layer 42, in order to prevent that graphite alkene heat dissipation layer 42 from being damaged. When the intelligent power module is further provided with the heat sink 60, the surface of the metal heat dissipation layer 41 exposed outside the package housing 50 of the intelligent power module can be better attached to the heat sink 60, which is beneficial to further improving the heat dissipation efficiency of the intelligent power module.

Referring to fig. 2, in an embodiment, the smart power module further includes a heat sink 60, and the heat sink 60 is attached to the metal heat dissipation layer 41.

In this embodiment, the heat sink 60 may be made of high thermal conductive material with good heat dissipation effect such as aluminum, aluminum alloy, etc., so that the heat generated by the chip is conducted to the heat sink 60 through the mounting substrate 10, thereby further increasing the contact area between the heat generated by the power switch tube and the air and improving the heat dissipation rate. The heat sink 60 may further include a heat sink 60 body and a plurality of heat dissipating fins disposed at one side of the heat sink 60 body at intervals. With such an arrangement, the contact area between the heat sink 60 and the air can be increased, that is, the contact area between the heat on the heat sink 60 and the air can be increased when the heat sink 60 operates, so as to increase the heat dissipation rate of the heat sink 60. Meanwhile, the material of the radiator 60 can be reduced, and the problem that the cost is too high due to too much material application of the radiating fins is avoided.

In one embodiment, the mounting substrate 10 includes:

an aluminum substrate 11;

the insulating layer 12 is arranged on the aluminum substrate 11, and the insulating layer 12 is provided with a through hole;

and the circuit wiring layer 13 is arranged on the insulating layer 12, the circuit wiring layer 13 comprises a grounding area, and the grounding area of the circuit wiring layer 13 is electrically connected with the aluminum substrate 11 through the through hole.

In this embodiment, the shape of the aluminum substrate 11 may be determined according to the specific position, number and size of the power switch tube, and may be a square shape, but is not limited to a square shape. The circuit wiring layer 13 and the aluminum substrate 11 are separately disposed on two side surfaces of the insulating layer 12, that is, the circuit wiring layer 13 and the insulating layer 12 may be sequentially stacked on the aluminum substrate 11, or in another embodiment, the aluminum substrate 11 and the circuit wiring layer 13 are sequentially formed on the insulating layer 12. The circuit wiring layer 13 is formed with mounting locations for mounting electronic components of the smart power module, and specifically, corresponding circuit traces and mounting locations, i.e., pads, for mounting each electronic component in the power assembly 20 are formed on the mounting substrate 10 according to the circuit design of the smart power module. The power switch tube is correspondingly arranged on the installation position of the circuit wiring layer 13, and is electrically connected with the circuit wiring layer 13 through conductive materials such as soldering tin, metal binding wires and the like to form a current loop.

The insulating layer 12 can be realized by selecting the insulating layer 12 made of insulating materials such as epoxy resin, and the insulating layer 12 can be further realized by adopting materials with better heat conductivity, such as alumina, and the like, so that the diffusion of heat generated during the operation of the device is accelerated, the operation temperature of the device is favorably reduced, and the aims of improving the power load of the module, reducing the volume, prolonging the service life, improving the power output and the like are fulfilled. In manufacturing the mounting substrate 10, a copper foil may be laid on the insulating layer 12 and etched in accordance with a predetermined circuit design to form the circuit wiring layer 13. After the electronic components of the intelligent power module are integrated into the circuit wiring layer 13, the electrical connection between the circuit modules can be realized through the metal binding wires. Alternatively, the copper or copper alloy may be directly rolled to form the circuit and the mounting site, and the circuit and the mounting site are pressed on the insulating layer 12 by a hot pressing process through equipment. The insulating layer 12 is provided with a through hole 121 for communicating the circuit wiring layer 20 and the metal heat dissipation layer 30, and the through hole 121 may be formed by etching, mechanical drilling, or the like. Or, when the insulating layer 12 is manufactured, the through hole 121 may be reserved on the insulating layer 12 to achieve communication between the circuit wiring layer 20 and the ground region of the metal heat dissipation layer 30, which is beneficial to increase the area of electromagnetic shielding, and by using the metal-to-electromagnetic shielding performance, the metal heat dissipation layer 30 may be used as a shielding plate to shield electromagnetic radiation generated by circuit elements in the electromagnetic wave intelligent power module, thereby preventing radiation and interference of electromagnetic waves. Furthermore, the grounding area of the circuit wiring layer 20 is communicated with the metal heat dissipation layer 30, so that the common grounding area of the circuit wiring layer 20 can be increased, the circuit wiring layer 20 can be provided with a large-area shielding ground wire, and electromagnetic interference transmitted through the space can be effectively inhibited. Specifically, the circuit wiring layer 20 is connected to the metal heat dissipation layer 30, so that the circuit elements on the circuit wiring layer 20 have the same potential and the switching devices in the internal circuit do not interfere with each other, which is beneficial to reducing the generation of internal electromagnetic interference. The metal heat dissipation substrate can effectively absorb and shield external electromagnetic waves, so that the transmission path of the electromagnetic waves is cut off. The metal heat dissipation substrate can limit radiation of electromagnetic energy radiated inside the intelligent power module to the outside of the module, and prevent external radiation from entering the intelligent power module.

The aluminum substrate 11 may be formed by a separate aluminum substrate 11 of copper or copper alloy, aluminum or aluminum alloy, etc., and the mounting substrate 10 is manufactured by integrating the aluminum substrate 11 and the insulating layer 12 by a hot pressing process or by using a heat conductive adhesive or the like for the insulating layer 12 on which the circuit wiring layer 13 is formed. Alternatively, the aluminum substrate 11 is formed on the insulating layer 12 by a copper-clad process using copper or a copper alloy on the insulating layer 12.

Referring to fig. 1, in an embodiment, the smart power module further includes a pin 70, and the pin 70 is disposed on the circuit wiring layer 13 of the mounting substrate 10 and electrically connected to each of the chips 30 through a metal wire.

In this embodiment, a corresponding pin pad of the pin 70 is further disposed on the circuit wiring layer 13, and the pin 70 is correspondingly soldered on the pin pad.

The pin 70 can be selected as a straight pin 70, and the pin 70 is soldered at a pin pad position on the mounting position 221 corresponding to the circuit wiring layer 13 and electrically connected with the power component 20 through a metal lead. In another embodiment, one end of each pin 70 is fixed on the mounting substrate 10, the other end of each pin 70 extends in a direction away from the mounting substrate 10, and each pin 70 further includes a bent portion for being fixedly connected with the electronic control board.

The utility model relates to an air conditioner, include as above intelligent power module.

The detailed structure of the intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the utility model discloses used above-mentioned intelligent power module in the air conditioner, consequently, the utility model discloses the embodiment of air conditioner includes all technical scheme of the whole embodiments of above-mentioned intelligent power module, and the technological effect that reaches is also identical, no longer gives unnecessary details here.

In practical application, the air conditioner further comprises an electric control board, the intelligent power module is arranged on the electric control board and is electrically connected with electronic elements on the electric control board through circuit wiring.

The above is only the optional embodiment of the present invention, and not therefore the limit of the patent scope of the present invention, all of which are in the concept of the present invention, the equivalent structure transformation of the content of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims (10)

1. A smart power module, comprising:

the mounting substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the mounting substrate is provided with a plurality of mounting positions;

the power assembly is arranged on a mounting position corresponding to the first surface of the mounting substrate;

and the high-thermal-conductivity insulating layer and the high-thermal-conductivity heat dissipation layer are sequentially stacked on the second surface of the mounting substrate.

2. The smart power module of claim 1 wherein the high thermal conductivity insulating layer is an aluminum nitride film.

3. The smart power module as claimed in claim 2, wherein the aluminum nitride thin film has a thickness ranging from 5 to 15 μm.

4. The smart power module of claim 1 wherein the high thermal conductivity heat sink layer comprises:

a metal heat dissipation layer;

and the graphene heat dissipation layer is clamped between the high-heat-conductivity insulating layer and the metal heat dissipation layer.

5. The smart power module of claim 4 wherein the power module further comprises an encapsulation housing, the mounting substrate, power components and high thermal conductivity insulation layer being encapsulated within the encapsulation housing.

6. The smart power module of claim 5 wherein the graphene thermal dissipation layer is encapsulated within the encapsulation housing.

7. The smart power module of claim 5 wherein the metal heat sink layer is exposed outside the package housing.

8. The smart power module of claim 7 further comprising a heat sink attached to the metal heat sink layer.

9. The smart power module of any one of claims 1 to 8, wherein the mounting substrate comprises:

a metal heat dissipation layer;

the insulating layer is arranged on the metal heat dissipation layer and provided with a through hole;

the circuit wiring layer is arranged on the insulating layer and comprises a grounding area, and the grounding area of the circuit wiring layer is electrically connected with the metal heat dissipation layer through the through hole.

10. An air conditioner characterized in that it comprises a smart power module according to any one of claims 1 to 9.

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