CN209896048U - Intelligent Power Module and Air Conditioner - Google Patents

Abstract

The utility model discloses an intelligent power module and an air conditioner. The intelligent power module comprises: an installation substrate, a first installation position and a plurality of second installation positions are arranged on one side surface of the installation substrate; a graphene heat dissipation installation area is arranged on On each first installation position; a plurality of power switch tubes, at least one power switch tube is arranged on a graphene heat dissipation installation area; a driver chip is arranged on the second installation position, and the driver chip is electrically connected with the plurality of power switch tubes. The utility model solves the problem that the heat dissipation is not timely or the heat dissipation effect is poor during the working process of the power module, which causes the working temperature of the power component to be too high to cause failure, and even the intelligent power module is burned in serious cases.

Description

Intelligent Power Module and Air Conditioner

technical field

The utility model relates to the technical field of electronic circuits, in particular to an intelligent power module and an air conditioner.

Background technique

At present, most of the intelligent power modules are used on a metal heat dissipation substrate, and the heat generated during the operation of the power module is radiated outward by means of a single-sided heat dissipation method of the insulating layer and the metal heat dissipation substrate. However, when the power module generates a lot of heat, this heat dissipation method may burn the power module due to the untimely heat dissipation.

Utility model content

The main purpose of the present utility model is to propose an intelligent power module and an air conditioner, which aims to solve the problem that the heat dissipation of the power module is not timely or the heat dissipation effect is poor during the operation of the power module, which causes the working temperature of the power component to be too high and malfunctions. Even the problem of burnt smart power modules.

In order to achieve the above purpose, the present invention proposes an intelligent power module, the intelligent power module includes:

an installation substrate, one side surface of the installation substrate is provided with a first installation position and a plurality of second installation positions;

a graphene heat dissipation installation area, arranged on the first installation position;

a plurality of power switch tubes, at least one of the power switch tubes is arranged on the graphene heat dissipation installation area;

The driving chip is arranged on the second mounting position, and the driving chip is electrically connected with the plurality of the power switch tubes.

Optionally, the intelligent power module further includes a heat sink, and the heat sink is disposed on a side of the mounting substrate away from the plurality of the power switch tubes and the driving chip.

Optionally, the intelligent power module further includes a graphene gasket, and the graphene gasket is sandwiched between the heat sink and the mounting substrate.

Optionally, the graphene gasket, the heat sink and the mounting substrate are fixedly connected by screws.

Optionally, the mounting substrate includes:

heat dissipation substrate;

The circuit wiring layer is disposed on one side surface of the heat dissipation substrate, and the circuit wiring layer is formed with a first mounting position for mounting the driving chip.

Optionally, the intelligent power module further includes an insulating layer sandwiched between the circuit wiring layer and the metal heat dissipation substrate.

Optionally, the power switch tube is an IGBT;

The intelligent power module further includes a fast recovery diode, and the number and position of the fast recovery diodes correspond to the IGBTs;

The fast recovery diode and the IGBT are connected in anti-parallel.

Optionally, the intelligent power module further includes a package housing for encapsulating the plurality of power switch tubes, the driving chip and the mounting substrate.

Optionally, a plurality of the power switch tubes constitute one or more combinations of the PFC power switch module, the compressor power module and the fan power module.

The present invention also provides an air conditioner, which includes the above-mentioned intelligent power module.

The heat generated when the power switch tube of the utility model works is conducted to the mounting substrate through the graphene heat dissipation mounting area, and then the heat is conducted to the outside of the intelligent power module through the mounting substrate, and the heat is directly or indirectly radiated to the air, so that the rapid Heat dissipation, in order to improve the heat dissipation speed of the power switch tube, due to the better heat conduction effect of the graphene heat dissipation installation area, it is avoided that the heat dissipation is not timely or the heat dissipation effect is poor during the working process of the power module, resulting in the high working temperature of the power switch tube And the fault occurs, and even the intelligent power module is burned in severe cases. In addition, the graphene-free heat dissipation installation area has better oxidation resistance and high temperature resistance, and has a long service life. It can be used in the high temperature environment of the power module for a long time, which is beneficial to improve the stability of the power module.

Description of drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained based on the structures shown in these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of an embodiment of an intelligent power module of the present invention;

2 is a schematic structural diagram of an embodiment in which the graphene heat dissipation installation area in the intelligent power module of the present invention is disposed on the installation substrate;

3 is a schematic structural diagram of another embodiment of an intelligent power module of the present invention;

FIG. 4 is a schematic structural diagram of another embodiment of the intelligent power module of the present invention.

Description of reference numbers:

label name label name 10 Mounting the substrate 60 Encapsulation shell 20 Graphene heat dissipation installation area 70 pin 30 driver chip 11 heat dissipation substrate 40 heat sink 12 circuit wiring layer 50 Graphene Gasket 13 Insulation

The realization, functional characteristics and advantages of the purpose of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, not all of them. Example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

The utility model provides an intelligent power module.

The intelligent power module is suitable for frequency converters and various inverter power sources that drive motors to realize functions such as frequency conversion speed regulation, metallurgical machinery, electric traction, and servo drives. It is especially suitable for driving the motors of compressors such as air conditioners and refrigerators. When applied to variable frequency air conditioners, since the algorithm of variable frequency drive is basically solidified in most cases, in order to save volume, improve anti-interference ability, and reduce the design workload of peripheral electronic control board, the main controller, namely MCU, will be integrated into the A power module is formed on a circuit board. When the power module is working, the power switch tube generates serious heat. Therefore, the structure of the power module must be resistant to high temperature and has a good anti-aging effect. At the same time, it is required to have a better heat dissipation effect to prevent the working temperature of the MCU from being overheated due to untimely heat dissipation. High and failure occurs, making the MCU easy to output wrong control signals, and control the upper and lower arms of the inverter bridge to conduct at the same time, causing a short circuit.

At present, most of the power modules are used on metal heat dissipation substrates, and single-sided wiring is used to make the substrate into a single-sided form. radiation. However, when the power module generates a lot of heat, this heat dissipation method may burn the power module due to the untimely heat dissipation.

In order to solve the above problems, referring to FIG. 1 to FIG. 4 , in an embodiment of the present invention, the intelligent power module includes:

an installation substrate 10, one side surface of the installation substrate 10 is provided with a first installation position and a plurality of second installation positions;

The graphene heat dissipation installation area 20 is arranged on the first installation position;

a plurality of power switch tubes (Q1-Q8), at least one of the power switch tubes is arranged on the graphene heat dissipation installation area 20;

The driving chip 30 is disposed on the second mounting position, and the driving chip 30 is electrically connected with the plurality of the power switch tubes.

In this embodiment, the mounting substrate 10 is the carrier of the power switch tube and the driving chip 30 . The mounting substrate 10 may be implemented by a substrate made of metal materials such as aluminum or aluminum alloy, copper or copper alloy, etc. The mounting substrate 10 may also be A substrate made of materials with high thermal conductivity and heat dissipation such as alumina (Al2O3) or aluminum nitride (AlN) ceramics, or a substrate formed by mixing the above materials. The shape of the mounting substrate 10 may be determined according to the specific position, quantity and size of the power switch tubes, and may be a square, but is not limited to a square. Of course, in other embodiments, the mounting substrate 10 may also be implemented with a lead frame.

The power switch tube may be a gallium nitride (GaN) power switch tube, a Si-based power switch tube or a SiC-based power switch tube, and a gallium nitride (GaN) power switch tube is preferably used in this embodiment. The number of the power switch tubes may be one or multiple, and when set to multiple, it may include four of the power switch tubes, or a multiple of four, or may include six of the power switch tubes, Or a multiple of six, six power switch tubes form an inverter circuit, which is used in electrical equipment such as inverter power supplies, frequency converters, refrigeration equipment, metallurgical machinery equipment, electric traction equipment, etc., especially in variable frequency household appliances. When the intelligent power module works, the driver chip 30 outputs a corresponding PWM control signal to drive and control the on/off of the corresponding power switch tube, thereby outputting driving power to drive a load such as a motor to work.

Each power switch tube can be a chip-type electronic component, or a bare die wafer. A plurality of graphene heat dissipation mounting areas 20 are provided with pads, and a plurality of power components can be bonded to each other through solder, conductive glue, etc. on the corresponding graphene heat dissipation installation area 20 .

The driver chip 30 is correspondingly disposed on the second mounting position, and the number of the driver chip 30 can be one, for example, the HVIC driver chip 30, which is an integrated chip, which integrates the drivers of four-way, six-way or three-way power switch tubes. The specific circuit can be integrated and set according to the number of driving devices. The number of the driving chips 30 may also be multiple, the number of the multiple driving chips 30 corresponds to the number of the power switch tubes, and each driving chip 30 corresponds to driving a power switch tube to work. The power switch tube and the driving chip 30 are electrically connected through the circuit wiring layer 12 and metal leads to form a current loop. When the intelligent power module is working, the driving chip 30 outputs corresponding control signals to control the conduction of the corresponding power switch tubes, thereby outputting driving electric energy to drive loads such as motors to work. During this process, the heat generated by the power switch tubes passes through the graphene. The heat dissipation mounting area 20 is conducted to the mounting substrate 10 to dissipate heat through the graphene heat dissipation mounting area 20 and the mounting substrate 10 .

The mounting substrate 10 is provided with a circuit wiring layer 12. According to the circuit design of the intelligent power module, the circuit wiring layer 12 forms a corresponding circuit on the mounting substrate 10 and a corresponding mounting position for each electronic component in the power switch tube, that is, soldering. plate. Specifically, after the insulating layer 13 is disposed on the mounting substrate 10 , copper foil is laid on the insulating layer 13 , and the copper foil is etched according to a preset circuit design, thereby forming the circuit wiring layer 12 . After the electronic components of each circuit module in the power switch tube are integrated into the circuit wiring layer 12 on the heat dissipating substrate 11 , the electrical connection between the circuit modules can also be realized by metal binding wires.

The graphene heat dissipation mounting area 20 may be formed on the mounting substrate 10 by a process such as gluing, painting or evaporation, and is integrally provided with the mounting substrate 10 . It is worth noting that the graphene heat dissipation installation area 20 has good XY plane thermal conductivity. In this embodiment, the graphene heat dissipation installation area 20 adopts a wall structure, and the ultra-high thermal conductivity of the graphene XY plane is applied to the power switch tube. On top of vertical heat dissipation. The number of layers of the graphene heat dissipation mounting area 20 may be a single-layer structure or a multi-layer structure. In addition, graphene is a microstructured carbonaceous material, and its size is mostly between hundreds of nanometers and tens of micrometers. The heat generated by the power switch tube on the intelligent power module is first conducted vertically to the graphene heat dissipation installation area 20. When this part of the heat is conducted to the graphene heat dissipation installation area 20, based on the ultra-high lateral thermal conductivity of graphene, the point-shaped heat source changes rapidly. In the form of a surface heat source, the heat source is quickly conducted to the mounting substrate 10 , and then conducted from the mounting substrate 10 to the outside of the intelligent power module. Through the rapid heat conduction effect of the graphene heat dissipation installation area 20, the problem of high integration in a small space of an intelligent power module and untimely high-power heat dissipation can be solved. In addition, heat can be released in time through the contact of the external large heat sink 40 to ensure the stable operation of the internal power switch tube, thereby effectively reducing the burning of the device due to excessive local temperature inside the intelligent power module.

In one embodiment, the number of graphene heat dissipation installation areas 20 may be set to one or more, and when there are multiple graphene heat dissipation installation areas 20 (21-28), the number of graphene heat dissipation installation areas 20 (21-28) is respectively arranged in each of the first installation areas. position; some or all of the multiple power switch tubes are arranged on the graphene heat dissipation installation area 20 , that is, any one of the multiple power switch tubes can be arranged on the graphene heat dissipation installation area 20 . Or each power switch tube can be correspondingly provided with an independent graphene heat dissipation installation area 20, and each power switch tube is installed on the corresponding graphene heat dissipation installation area 20, so as to pass through the corresponding graphene heat dissipation installation area. 20 for cooling. The number of the graphene heat dissipation installation area 20 and the number of power switch tubes disposed on the graphene heat dissipation installation area 20 can be set according to actual needs, and will not be listed one by one here.

The heat generated when the power switch tube of the present invention works is conducted to the mounting substrate 10 through the graphene heat dissipation mounting area 20, and then the heat is conducted to the outside of the intelligent power module through the mounting substrate 10, and the heat is directly or indirectly radiated to the air. Thereby, rapid heat dissipation is performed to improve the heat dissipation speed of the power switch tube. Since the heat conduction effect of the graphene heat dissipation installation area 20 is better, it is avoided that the heat dissipation is not timely during the operation of the power module, or the heat dissipation effect is poor, resulting in the power switch tube. The working temperature is too high and the fault occurs, and even the intelligent power module is burned in severe cases. In addition, the graphene heat dissipation installation area 20 has better oxidation resistance and high temperature resistance, and has a long service life, and can be used in a high temperature environment of a power module for a long time, which is beneficial to improve the stability of the power module.

Referring to FIG. 3 or FIG. 4 , in an embodiment, the intelligent power module further includes a heat sink 40 , and the heat sink 40 is disposed on the mounting substrate 10 away from the plurality of the power switch tubes and the driving chip 30 . side.

In this embodiment, the radiator 40 can be made of aluminum, aluminum alloy and other high thermal conductivity materials with good heat dissipation effect, so that the heat generated by the electronic components in the power switch tube passes through the graphene heat dissipation installation area 20 and the installation substrate 10 Conducted to the heat sink 40 to further increase the contact area between the heat generated by the power switch tube and the air, and improve the heat dissipation rate. The radiator 40 can also be provided with a body of the radiator 40 and a plurality of cooling fins, and the plurality of cooling fins are arranged on one side of the body of the radiator 40 at intervals. In this way, the contact area between the radiator 40 and the air can be increased, that is, when the radiator 40 is working, the contact area between the heat on the radiator 40 and the air can be increased to speed up the heat dissipation rate of the radiator 40 . At the same time, the material of the radiator 40 can be reduced, and the cost of the radiator fin due to excessive application of materials can be avoided.

Referring to FIG. 3 or FIG. 4 , in one embodiment, the smart power module further includes a graphene gasket 50 , and the graphene gasket 50 is sandwiched between the heat sink 40 and the mounting substrate 10 .

In this embodiment, when the heat generated by the power switch tube is longitudinally conducted to the graphene heat dissipation mounting area 20 and the mounting substrate 10 and then conducted to the graphene spacer 50, based on the ultra-high lateral thermal conductivity of graphene, the point-shaped heat source changes rapidly. In the form of a surface heat source, the heat source is quickly conducted to the heat sink 40, and then the heat sink 40 is conducted to the outside of the intelligent power module, so that the heat dissipation rate of the intelligent power module can be further improved. It can be understood that the graphene heat dissipation mounting area 20 , the mounting substrate 10 , and the graphene gasket 50 in this embodiment all have high thermal conductivity, so that the heat dissipation rate of the intelligent power module can be greatly improved.

Further, the graphene gasket 50 , the heat sink 40 and the mounting substrate 10 are fixedly connected by screws.

In this embodiment, the graphene gasket 50 , the heat sink 40 and the mounting substrate 10 all have screw holes adapted to the screws, and the three can be fixedly connected by the screws, thereby preventing relative movement between them. Of course, in some embodiments, the graphene gasket 50 can also be fixedly connected to the heat sink 40 and the mounting substrate 10 by means of double-sided adhesive, thermally conductive adhesive, etc., which is not limited here.

4, in one embodiment, the mounting substrate 10 includes:

heat dissipation substrate 11;

The circuit wiring layer 12 is disposed on one side surface of the heat dissipation substrate 11 , and the circuit wiring layer 12 is formed with a first mounting position for the driver chip 30 to be mounted.

In this embodiment, when the heat dissipation substrate 11 is implemented by an aluminum nitride ceramic substrate, the aluminum nitride ceramic substrate includes an insulating heat dissipation layer and a circuit wiring layer 12 formed on the insulating heat dissipation layer. When a substrate made of metal material is used, the substrate includes a metal heat dissipation substrate, an insulating layer laid on the metal heat dissipation substrate, and a circuit wiring layer 12 formed on the insulating layer. In this embodiment, the mounting substrate 10 can be optionally a single-sided wiring board. The insulating layer is sandwiched between the circuit wiring layer 12 and the metal heat dissipation substrate 11 . The insulating layer 13 is used to achieve electrical isolation and electromagnetic shielding between the circuit wiring layer 12 and the metal heat-dissipating substrate 11, and to reflect external electromagnetic interference, so as to avoid external electromagnetic radiation from interfering with the normal operation of the power switch tube and reduce the noise in the surrounding environment. Interference effects of electromagnetic radiation on electronic components in intelligent power modules.

In some embodiments, an insulating layer may also be provided on the heat dissipation substrate 11 according to the material of the heat dissipation substrate 11 . For example, when the heat dissipation substrate 11 is made of a conductive material such as aluminum or copper, the insulating layer may be made of thermoplastic adhesive. Alternatively, it is made of materials such as thermosetting adhesives, so as to realize the fixed connection and insulation between the heat dissipation substrate 11 and the circuit wiring layer 12 . The insulating layer can be realized by adopting a high thermal conductivity insulating layer 130 realized by mixing one or more materials of epoxy resin, aluminum oxide, and high thermal conductivity filling material.

2 and 3, in one embodiment, the power switch tube is an IGBT;

The intelligent power module further includes a fast recovery diode, and the number and position of the fast recovery diodes correspond to the IGBTs;

The fast recovery diode and the IGBT are connected in anti-parallel.

In this embodiment, the number and position of the fast recovery diodes (disposed on the graphene heat dissipation installation area 20) correspond to each power switch tube. In this embodiment, the number of fast recovery diodes can be selected as eight, eight The fast recovery diodes are labeled D1, D2, D3, D4, D5, D6, D7, D8, respectively. In this embodiment, the fast recovery diode is a high-power anti-parallel diode, which is used to realize fast turn-off of the power switch tube. Among them, when the power switch tube is set to SiC MOSFET or SiC IGBT, or GaN HEMT device, the switching loss of the intelligent power module is reduced to a lower level, which is conducive to saving power and reducing module heating. Fast recovery diodes Optionally, a fast recovery diode or a Schottky diode made of Si material can be used for implementation, which can ensure that the power consumption of the intelligent power module itself is low, and at the same time reduce the production cost of the intelligent power module.

In some embodiments, the power element can also be implemented by a reverse-conducting IGBT. The reverse-conducting IGBT is integrated on the same chip with the fast recovery diode FRD packaged in anti-parallel with the IGBT power switch, thereby reducing the power consumption of the inverter bridge circuit. volume. Such an arrangement is beneficial to improve the power density, reduce the volume, manufacturing cost and packaging process of the highly integrated intelligent power module, and at the same time is beneficial to improve the reliability of the highly integrated intelligent power module.

Referring to FIG. 1 and FIG. 4 , in one embodiment, the smart power module further includes an encapsulation housing 60 for encapsulating the plurality of power switch tubes, the driving chip 30 and the mounting substrate 10 .

In this embodiment, the package housing 60 may be made of epoxy resin, aluminum oxide, thermally conductive filling material, etc., wherein the thermally conductive filling material may be boron nitride, aluminum nitride, or a combination of aluminum nitride and boron nitride. It has better insulation, higher thermal conductivity, better heat resistance and thermal conductivity, so that aluminum nitride and boron nitride have higher heat transfer capacity. When making the package shell 60, epoxy resin, aluminum oxide, boron nitride or aluminum nitride and other materials can be mixed, and then the mixed package material can be heated; after cooling, the package material is pulverized, Then, the material of the encapsulation shell 60 is rolled and formed by the ingot forming process, so as to form the encapsulation shell 60, and then the circuit wiring layer 12, the mounting substrate 10, the graphene heat dissipation mounting area 20 and the power switch tube are encapsulated in the encapsulation shell 60. Inside. Alternatively, the circuit wiring layer 12 , the mounting substrate 10 , the graphene heat dissipation mounting area 20 and the power switch tube are packaged in the package casing 60 by an injection molding process.

In the smart power module, the package casing 60 can be covered on the mounting substrate 10 and the power component 20 . The lower surface of the aluminum substrate is exposed outside the package, and the heat dissipation of the power element is accelerated. If the intelligent power module is further provided with a heat sink 40 to dissipate heat to the power switch tube, the package casing 60 can be wrapped around the outer periphery of the mounting substrate 10 and the power component 20 so that the power switch tube and the mounting substrate 10 and The driving chip 30 is integrally formed.

Referring to FIG. 4 , in one embodiment, the intelligent power module further includes pins 70 . The pins 70 are disposed on the circuit wiring layer 12 and are connected to the power component 10 and the circuit wiring layer through metal wires. 12 Electrical connections.

In this embodiment, the pins 70 can be implemented by using gull-wing pins 70 or in-line pins 70. In this embodiment, in-line pins 70 are preferably used. The pins 70 are welded on an insulating substrate with low thermal conductivity. The pad positions on the mounting positions corresponding to the wiring layer 12 are electrically connected to the power switch tube and the driving chip 30 through metal wires.

In another embodiment, one end of each lead 70 is fixed on the mounting substrate 10 , the other end of the lead 70 extends away from the mounting substrate 10 , and the extending direction of the lead 70 is the same as the mounting substrate 10 . The plane on which 10 lies is parallel.

Compared with the gull-wing pins 70 , the pins 70 in this embodiment are arranged in parallel with the mounting substrate 10 , that is, the pins 70 are in a tiled structure, so that the heat dissipation substrate 11 of the mounting substrate 10 is embedded in the air conditioner. In the electric control board in the device, when the insulating layer 13 of the mounting substrate 10 is attached to the electric control board. The pins 70 of the intelligent power module are fixed on the electric control board by soldering and conductive glue, and the extension of the pins 70 is attached to the electric control board, thereby preventing the pins 70 from breaking when the electric control board is dropped. And the mounting substrate 10 is partially embedded in the electric control board, so that the intelligent power module is installed on the electric control board, and the fastening between the intelligent power module and the electric control board is better, thereby preventing the intelligent power module and the electric control board from being transported or moved. During the falling process, the intelligent power module and the electronic control board move relative to each other, so that the electronic control board cannot work normally, or the intelligent power module is broken and the intelligent power module is damaged.

Referring to FIG. 4 , in an embodiment, a plurality of the power switch tubes constitute one or more combinations of the PFC power switch module, the compressor power module and the fan power module.

The PFC power switch module, the compressor power module and the fan power module are arranged on the corresponding installation positions of the circuit wiring layer 12 .

In this embodiment, the PFC power switch module 10 may be implemented only by a PFC power switch tube, or may also form a PFC circuit with other components such as diodes and inductors to implement power factor correction for the DC power supply. The PFC circuit can be implemented by using a passive PFC circuit to form a boost-type PFC circuit, a buck-type PFC circuit, or a buck-boost-type PFC circuit. The PFC power switch module adjusts the power factor of the DC power output by the external rectifier bridge, and outputs the adjusted DC power to the power input terminals of each IPM module, so that each power module drives the corresponding load to work. The adjusted DC power can also generate driving voltages of various values through an external switching power supply circuit, such as 5V, 15V, etc., to supply power to the driver ICs of each IPM.

The compressor power module and the fan power module integrate multiple power switch tubes, and multiple power switch tubes form a drive inverter circuit. For example, six power switch tubes can form a three-phase inverter bridge circuit, or four power switch tubes can form a three-phase inverter bridge circuit. The switch tubes form a two-phase inverter bridge circuit. Wherein, each power switch tube can be realized by MOS tube or IGBT. Multiple power switch tubes form a power inverter bridge circuit, which is used to drive loads such as fans and compressors. After each power switch tube is installed in the corresponding installation position of the circuit wiring layer 12, it can be connected to the circuit wiring layer through conductive materials such as solder. 12 makes electrical connections and forms a current loop. Each power switch tube can also be attached to the corresponding mounting position of the circuit wiring layer 12 by a flip-chip process, and a current loop is formed between the circuit wiring layer 12 and the metal binding wires and each circuit element.

Referring to FIG. 4 , in an embodiment, the intelligent power module further includes a rectifier bridge (not shown in the figure), and the rectifier bridge is disposed on the installation position of the circuit wiring layer 12 .

In this embodiment, the rectifier bridge can be implemented by using four chip diodes. The rectifier bridge composed of four chip diodes converts the input alternating current into direct current and outputs it to the power switch tube to supply power for the power switch tube.

The present invention also provides an air conditioner, which includes the above-mentioned intelligent power module. The detailed structure of the intelligent power module can refer to the above-mentioned embodiments, which will not be repeated here; it can be understood that since the above-mentioned intelligent power module is used in the air conditioner of the present invention, the embodiments of the air conditioner of the present invention include: All the technical solutions of all the above-mentioned embodiments of the intelligent power module, and the technical effects achieved are also the same, and will not be repeated here.

The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural transformations based on the contents of the description and accompanying drawings of the present invention are based on the concept of the present invention. , or directly/indirectly applied in other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. An intelligent power module, wherein the intelligent power module comprises: an installation substrate, one side surface of the installation substrate is provided with a first installation position and a second installation position; a graphene heat dissipation installation area, arranged on the first installation position; a plurality of power switch tubes, at least one of the power switch tubes is arranged on the graphene heat dissipation installation area; The driving chip is arranged on the second mounting position, and the driving chip is electrically connected with the plurality of the power switch tubes. 2 . The intelligent power module according to claim 1 , wherein the intelligent power module further comprises a heat sink, and the heat sink is disposed on the mounting substrate away from the plurality of the power switch tubes and the driving chip. 3 . side. 3 . The intelligent power module according to claim 2 , wherein the intelligent power module further comprises a graphene gasket, and the graphene gasket is sandwiched between the heat sink and the mounting substrate. 4 . 4 . The intelligent power module according to claim 3 , wherein the graphene gasket, the heat sink and the mounting substrate are fixedly connected by screws. 5 . 5 . The intelligent power module according to claim 1 , wherein the number of the graphene heat dissipation installation areas is multiple, and a plurality of the power switch tubes are arranged one-to-one on the multiple graphene heat dissipation areas. 6 . on the installation area. 6. The intelligent power module of claim 1, wherein the mounting substrate comprises: heat dissipation substrate; The circuit wiring layer is disposed on one side surface of the heat dissipation substrate, and the circuit wiring layer is formed with a first mounting position for mounting the driving chip. 7. The intelligent power module of claim 1, wherein the power switch tube is an IGBT; The intelligent power module further includes a fast recovery diode, and the number and position of the fast recovery diodes correspond to the IGBTs; The fast recovery diode and the IGBT are connected in anti-parallel. 8. The intelligent power module according to any one of claims 1 to 7, wherein the intelligent power module further comprises an encapsulation housing for encapsulating the plurality of power switch tubes, driving chips and mounting substrates. 9. The intelligent power module according to any one of claims 1 to 7, wherein a plurality of the power switch tubes constitute one or more of a PFC power switch module, a compressor power module and a fan power module combination. 10. An air conditioner, wherein the air conditioner comprises the intelligent power module according to any one of claims 1 to 9.

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