CN216015356U - Pressfit terminal connection structure of power module and power module - Google Patents

Pressfit terminal connection structure of power module and power module Download PDF

Info

Publication number
CN216015356U
CN216015356U CN202122138872.2U CN202122138872U CN216015356U CN 216015356 U CN216015356 U CN 216015356U CN 202122138872 U CN202122138872 U CN 202122138872U CN 216015356 U CN216015356 U CN 216015356U
Authority
CN
China
Prior art keywords
terminal
support column
pressfit
power module
curved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122138872.2U
Other languages
Chinese (zh)
Inventor
梁小广
丁烜明
洪旭
朱荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Lipus Semiconductor Co ltd
Original Assignee
Wuxi Lipus Semiconductor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Lipus Semiconductor Co ltd filed Critical Wuxi Lipus Semiconductor Co ltd
Priority to CN202122138872.2U priority Critical patent/CN216015356U/en
Application granted granted Critical
Publication of CN216015356U publication Critical patent/CN216015356U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The utility model provides a Pressfit terminal connecting structure of a power module and the power module, which comprises an insulating heat-radiating substrate and a shell, wherein the shell is covered on the insulating heat-radiating substrate; the insulating heat dissipation substrate is provided with a connecting terminal, a semiconductor chip and a binding line, and the connecting terminal is connected with the semiconductor chip through the binding line; one end of the connecting terminal, which is far away from the insulating heat-radiating substrate, penetrates through the shell, and the connecting terminal part is positioned outside the shell; the connecting terminal comprises a Pressfit terminal and a supporting component, the supporting component is connected to the Pressfit terminal, and one end of the supporting component, which is far away from the Pressfit terminal, abuts against the side wall of the bottom of the shell. The utility model provides a problem that connecting terminal holding power is not enough.

Description

Pressfit terminal connection structure of power module and power module
Technical Field
The utility model relates to a power semiconductor module encapsulates technical field, specifically, relates to a pressure terminal connection structure and power module of power module.
Background
In power supply and power electronic converter applications, power semiconductor (IGBT, MOSFET, SiC, GaN, etc.) devices are widely used, and module packaging is generally used in applications with high power. In the method of directly soldering the terminal to the insulating and heat dissipating substrate, when the terminal is subjected to relatively large vibration of the circuit board, the soldered surface is easily broken, and a defect of terminal falling occurs, so that the bottom of the terminal generally has a curved shape to absorb stress. If the terminals for connecting the external printed circuit board are used with the Press-fit technology, simple and fast mounting of the module to the PCB is ensured, a soldering process is eliminated, and assembly time and cost are reduced. The circuit board and the module can be easily disassembled, so the solderless crimping is simple to maintain. If a fault occurs, part of the part can still be reused without being discarded completely. If the Pressfit is also made in a form that the bottom has a curved shape to absorb stress, the force is large when the head of the Pressfit is pressed into the through hole, the curved shape of the bottom of the Pressfit cannot support the force and cannot be restored to deform, and certainly, the head of the Pressfit cannot be inserted into the through hole of the circuit board smoothly.
Patent document No. CN111211429A discloses a connection terminal of a power module, which belongs to the technical field of connection terminals of power modules, and includes a first support part, wherein the first support part includes a plug part, a transition part and a support leg, which are sequentially arranged from top to bottom; and a second support part located at one side of the first support part, one end of the second support part being connected to the transition part, the other end of the second support part being constructed as a connection part and located below the support leg, and a gap being present between the connection part and the support leg. However, this patent document still has a drawback that the supporting force is insufficient when the head of the connection terminal is inserted into the through hole of the circuit board.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing a Pressfit terminal connection structure and power module of power module.
According to the utility model provides a Pressfit terminal connection structure of power module, including insulating heat dissipation base plate and shell, the shell cover is established on the insulating heat dissipation base plate;
the insulating heat dissipation substrate is provided with a connecting terminal, a semiconductor chip and a binding line, and the connecting terminal is connected with the semiconductor chip through the binding line; one end of the connecting terminal, which is far away from the insulating heat-radiating substrate, penetrates through the shell, and the connecting terminal part is positioned outside the shell;
the connecting terminal comprises a Pressfit terminal and a supporting component, the supporting component is connected to the Pressfit terminal, and one end of the supporting component, which is far away from the Pressfit terminal, abuts against the side wall of the bottom of the shell.
Preferably, the support assembly comprises a first curved support column, a first straight support column and a second straight support column;
one end of the first curved support column is connected to the Pressfit terminal, one end of the first straight support column is connected to the Pressfit terminal, and one end of the second straight support column is connected to the Pressfit terminal;
the first straight supporting column and the second straight supporting column are respectively arranged on two sides of the first curved supporting column.
Preferably, one end of the first curved support column, which is far away from the Pressfit terminal, is provided with a first L-shaped support column.
Preferably, the first curved supporting column and the first L-shaped supporting column are integrally formed.
Preferably, the support assembly comprises a second curved support column, a third curved support column and a third straight support column;
one end of the second curved support column is connected to the Pressfit terminal, one end of the third curved support column is connected to the Pressfit terminal, and one end of the third straight support column is connected to the Pressfit terminal;
the second curved support column and the third curved support column are respectively arranged on two sides of the third straight support column.
Preferably, one end of the second curved support column away from the Pressfit terminal is provided with a second L-shaped support column.
Preferably, the second curved support column is integrally formed with the second L-shaped support column.
Preferably, one end of the third curved support column, which is far away from the Pressfit terminal, is provided with a third L-shaped support column.
Preferably, the third curved supporting column and the third L-shaped supporting column are integrally formed.
The utility model also provides a power module, including foretell power module's Pressfit terminal connection structure.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model solves the problem that the supporting force of the connecting terminal is not enough;
2. the utility model provides necessary supporting force by arranging the supporting columns, thereby completing the process of inserting the Pressfit head into the circuit board;
3. the utility model discloses a bottom surface of support column is higher than the bottom surface of curve shape, and then does not influence the effect of curve shape absorption stress.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural view of a terminal connection structure of a power module of the related art;
FIG. 2 is a schematic diagram of a prior art terminal;
FIG. 3 is a schematic structural diagram of a Pressfit terminal in the prior art;
FIG. 4 is a schematic drawing of a Pressfit terminal of the prior art;
fig. 5 is a schematic view of the overall structure of the utility model;
fig. 6 is a schematic perspective view of a Pressfit terminal according to the first embodiment;
fig. 7 is a front view of the Pressfit terminal according to the first embodiment;
FIG. 8 is a side view of the Pressfit terminal of the first embodiment;
fig. 9 is a schematic structural diagram of a Pressfit terminal according to the third embodiment;
fig. 10 is a schematic perspective view of a Pressfit terminal according to the second embodiment;
fig. 11 is a front view of a Pressfit terminal according to the second embodiment;
fig. 12 is a side view of the Pressfit terminal of the second embodiment;
fig. 13 is a schematic structural diagram of a Pressfit terminal according to a fourth embodiment.
The figures show that:
first L-shaped support column 3024 of insulating heat-dissipating substrate 1
Second curved support post 3025 of the housing 2
Third curved support 3026 for connection terminal 3
Pressfit terminal 301 third straight support column 3027
Support assembly 302 second L-shaped support post 3028
First curved support column 3021 third L-shaped support column 3029
First pillar 3022 semiconductor chip 4
Binding line 5 of second straight supporting column 3023
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
As shown in fig. 1 to 4, the connecting terminal of the prior art is shown, and the soldering layer is solder paste or solder sheet soldering, and is used for connecting the base plate and the insulating heat dissipation substrate with the chip; the insulating heat dissipation substrate realizes the design of a required circuit structure; the binding wire realizes the circuit connection of each part. The module external structure mainly is shell body and terminal, and the shell links to each other through some glue processes and bottom plate, and inside the terminal generally moulded plastics the shell body, links to each other or directly welds to insulating heat dissipation base plate through binding line and internal circuit. The inside silica gel that need pour into of module, its effect is anticorrosive dampproofing protection internal circuit, carries out high-pressure isolation to inside each part again simultaneously, and the terminal is used for connecting outside electric circuit.
Example 1:
as shown in fig. 5-8, the utility model provides a pair of pressure terminal connection structure of power module, including insulating heat dissipation base plate 1 and shell 2, shell 2 covers and establishes on insulating heat dissipation base plate 1, be provided with connecting terminal 3 on the insulating heat dissipation base plate 1, semiconductor chip 4 and binding line 5, connecting terminal 3 and semiconductor chip 4 are connected through binding line 5, connecting terminal 3 keeps away from the one end of insulating heat dissipation base plate 1 and runs through shell 2, connecting terminal 3 part is located outside shell 2, connecting terminal 3 includes pressure terminal 301 and supporting component 302, supporting component connects and sets up on pressure terminal 301, supporting component 302 keeps away from the one end butt of pressure terminal 301 on the bottom lateral wall of shell 2.
The support assembly 302 includes a first curved support column 3021, a first straight support column 3022, and a second straight support column 3023, wherein one end of the first curved support column 3021 is connected to the pressure terminal 301, one end of the first straight support column 3022 is connected to the pressure terminal 301, one end of the second straight support column 3023 is connected to the pressure terminal 301, and the first straight support column 3022 and the second straight support column 3023 are respectively disposed on two sides of the first curved support column 3021.
In a preferred embodiment, at least two supporting columns are processed on two sides of the curved shape of the bottom, and the bottom surfaces of the supporting columns should be higher than the bottom surface of the curved shape so as not to influence the action of stress absorption of the curved shape. When the head of the Pressfit is inserted into the circuit board, the bottom surfaces of the two support posts contact the surface of the insulating substrate, providing the necessary support force to complete the process of inserting the Pressfit head into the circuit board.
Example 2:
as shown in fig. 9, the difference from embodiment 1 is that a first L-shaped support column 3024 is provided at an end of the first curved support column 3021 away from the pressure terminal 301, and the first curved support column 3021 is integrally provided with the first L-shaped support column 3024.
Example 3:
as shown in fig. 10 to 12, the difference from embodiment 1 is that the support assembly 302 includes a second curved support column 3025, a third curved support column 3026, and a third straight support column 3027, one end of the second curved support column 3025 is connected to the pressure terminal 301, one end of the third curved support column 3026 is connected to the pressure terminal 301, one end of the third straight support column 3027 is connected to the pressure terminal 301, and the second curved support column 3025 and the third curved support column 3026 are respectively disposed on two sides of the third straight support column 3027.
In a preferred embodiment, at least 1 supporting column is processed in the middle of two sides of the curve shape of the bottom, and the bottom surface of each supporting column is higher than the bottom surface (0.1mm-0.4mm) of the curve shape so as not to influence the action of stress absorption of the curve shape. When the head of the Pressfit is inserted into the circuit board, the bottom surface of the support post contacts the surface of the insulating substrate, providing the necessary support force to complete the process of inserting the Pressfit head into the circuit board.
Example 4:
as shown in fig. 13, the difference from embodiment 3 is that a second L-shaped support column 3028 is provided at an end of the second curved support column 3025 away from the pressure terminal 301, the second curved support column 3025 is integrally provided with the second L-shaped support column 3028, a third L-shaped support column 3029 is provided at an end of the third curved support column 3026 away from the pressure terminal 301, and the third curved support column 3026 is integrally provided with the third L-shaped support column 3029.
In a preferred example, the Pressfit terminal connection structures of examples 2 and 4 can be prepared by the following method:
step 1: the Pressfit is mounted on the insulating heat dissipation substrate by soldering or sintering. Pressfit can be in the form of one support column or in the form of two support columns;
step 2: installing a shell;
step 3: epoxy is poured and cured, and the epoxy needs to be lower than the curved portion and the support post.
The bottom of Pressfit is more stable due to the curing effect of the epoxy resin, and in addition, the support column contacts the surface of the epoxy resin instead of the surface of the insulating heat dissipation substrate, so that the risk of damage caused by stress of the heat dissipation material in the insulating heat dissipation substrate is reduced. The method realizes the reliable connection of the Pressfit terminal and the insulating heat-radiating bottom plate, prevents the base from falling off caused by the vibration of the application environment or other stress, increases the welding area or injects epoxy resin around the metal base by forming a structure of the supporting column, and the cured epoxy resin strengthens the connection between the base and the insulating heat-radiating bottom plate, and prevents the base from falling off caused by the vibration of the application environment or other stress.
The utility model also provides a power module, including foretell power module's Pressfit terminal connection structure.
The utility model provides a problem that connecting terminal holding power is not enough.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (10)

1. A Pressfit terminal connecting structure of a power module is characterized by comprising an insulating heat-radiating substrate (1) and a shell (2), wherein the shell (2) is covered on the insulating heat-radiating substrate (1);
the insulating heat dissipation substrate (1) is provided with a connecting terminal (3), a semiconductor chip (4) and a binding line (5), and the connecting terminal (3) is connected with the semiconductor chip (4) through the binding line (5); one end, far away from the insulating heat-radiating substrate (1), of the connecting terminal (3) penetrates through the shell (2), and the connecting terminal (3) is partially positioned outside the shell (2);
the connecting terminal (3) comprises a Pressfit terminal (301) and a supporting component (302), the supporting component is connected to the Pressfit terminal (301), and one end, far away from the Pressfit terminal (301), of the supporting component (302) abuts against the side wall of the bottom of the shell (2).
2. The Pressfit terminal connection structure of a power module according to claim 1, wherein said support assembly (302) includes a first curved support column (3021), a first straight support column (3022), and a second straight support column (3023);
one end of the first curved support column (3021) is connected and arranged on the Pressfit terminal (301), one end of the first straight support column (3022) is connected and arranged on the Pressfit terminal (301), and one end of the second straight support column (3023) is connected and arranged on the Pressfit terminal (301);
the first straight supporting column (3022) and the second straight supporting column (3023) are respectively disposed at both sides of the first curved supporting column (3021).
3. Pressure terminal connection structure of a power module according to claim 2, characterized in that an end of the first curved support post (3021) remote from the pressure terminal (301) is provided with a first L-shaped support post (3024).
4. The Pressfit terminal connection structure of a power module according to claim 3, wherein the first curved support post (3021) is integrally provided with the first L-shaped support post (3024).
5. The Pressfit terminal connection structure of a power module according to claim 1, wherein said support assembly (302) includes a second curved support column (3025), a third curved support column (3026), and a third straight support column (3027);
one end of the second curved support column (3025) is connected to the Pressfit terminal (301), one end of the third curved support column (3026) is connected to the Pressfit terminal (301), and one end of the third straight support column (3027) is connected to the Pressfit terminal (301);
the second curved support column (3025) and the third curved support column (3026) are respectively disposed at both sides of the third straight support column (3027).
6. Pressfit terminal connection structure of a power module according to claim 5, characterized in that the end of the second curved support post (3025) remote from the Pressfit terminal (301) is provided with a second L-shaped support post (3028).
7. The Pressfit terminal connection structure of a power module according to claim 6, wherein the second curved support post (3025) is integrally provided with the second L-shaped support post (3028).
8. Pressfit terminal connection structure of a power module according to claim 6, characterized in that the end of the third curved support column (3026) remote from the Pressfit terminal (301) is provided with a third L-shaped support column (3029).
9. The Pressfit terminal connection structure of a power module according to claim 8, wherein said third curved support column (3026) is provided integrally with said third L-shaped support column (3029).
10. A power module characterized by comprising the Pressfit terminal connection structure of the power module according to any one of claims 1 to 9.
CN202122138872.2U 2021-09-06 2021-09-06 Pressfit terminal connection structure of power module and power module Active CN216015356U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122138872.2U CN216015356U (en) 2021-09-06 2021-09-06 Pressfit terminal connection structure of power module and power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122138872.2U CN216015356U (en) 2021-09-06 2021-09-06 Pressfit terminal connection structure of power module and power module

Publications (1)

Publication Number Publication Date
CN216015356U true CN216015356U (en) 2022-03-11

Family

ID=80593908

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122138872.2U Active CN216015356U (en) 2021-09-06 2021-09-06 Pressfit terminal connection structure of power module and power module

Country Status (1)

Country Link
CN (1) CN216015356U (en)

Similar Documents

Publication Publication Date Title
CN102456652B (en) Power semiconductor arrangement
JP2001189416A (en) Power module
CN103887273A (en) Semiconductor module
CN101577262A (en) Power semiconductor module system
JP2009512203A (en) IC component with cooling assembly
US10555418B2 (en) Component module
JP2007027467A (en) Semiconductor module
US8426746B2 (en) Electronic device and power converter
CN216015356U (en) Pressfit terminal connection structure of power module and power module
CN113035826A (en) Packaging module, manufacturing method of packaging module and electronic equipment
CN113571484A (en) Connection structure for power module, preparation method of connection structure and power module
US7794287B1 (en) Electrical connector configured by wafer having coupling foil and method for making the same
CN113838825A (en) Pressfit terminal connection structure of power module and power module
CN215815851U (en) Connection structure for power module and power module
JP2012059556A (en) Connector
CN111769090A (en) Plastic packaging power module, plastic packaging mold and plastic packaging method
CN214848606U (en) High heat dissipation intelligent power module
CN216213410U (en) Power device mounting structure and power module
JP2004207565A (en) Structure for connecting substrates and power supply device employing the same
CN106601694B (en) Stack structure and manufacturing method thereof
JP3156630B2 (en) Power circuit mounting unit
JP2015002323A (en) Electronic device
CN114203642A (en) Power semiconductor packaging structure
EP4123696A2 (en) Power module
CN217426745U (en) Pin type high-power module

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant