JP2012059556A - Connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector which is capable of improving the peel strength.SOLUTION: A connector 10 comprises a reinforcing fitting 20 fixed on a circuit board 50. The reinforcing fitting 20 is formed by molding a holding part 30 which holds a shield case 12 surrounding a housing 11, integrally with a pair of pedestal parts 40 sandwiching the holding part 30 therebetween and fixed to the circuit board 50. Each of the pedestal parts 40 comprises: a soldering surface 41 to be soldered to an upper surface 50a of the circuit board 50; a protrusion 42 to be inserted into a through-hole 51 formed in the circuit board 50; and a recess 43 formed on a base portion of the protrusion 42.

Description

  The present invention relates to a connector used in, for example, a mobile phone or a digital camera.

  In recent years, electronic devices equipped with HDMI (High Definition Multimedia Interface) (registered trademark) have become widespread. The HDMI standard connector type includes a standard terminal type A and a mini terminal called type C, which is a miniaturized type A, and further miniaturization for portable devices such as mobile phones and digital cameras. There are plans to add micro terminals called type D in the future.

  The shape of the connector is roughly divided into a receptacle and a plug. In general, a miniaturized receptacle has a structure that is fixed by soldering to a circuit board on which an electric circuit is formed by surface mounting technology (see, for example, Patent Document 1).

  As shown in FIG. 8A, the receptacle 1 shown in Patent Document 1 includes a housing 2 provided with a terminal, and a shield case 3 manufactured by stamping and bending using a press working technique. . The shield case 3 has a lead frame 3a that is soldered to a land portion of the substrate by surface mounting technology, and a joint portion 3b that joins one end and the other end of the metal plate. The receptacle 1 is called a top mount type and is disposed on the upper surface of the substrate.

  On the other hand, as shown in FIG. 8B, a so-called mid-mount type in which a main body is dropped into a notch portion of a substrate is known as a means for reducing the dimension in the height direction as compared with the top-mount type. . The receptacle 4 shown in FIG. 8B includes a housing 5 having a terminal, and a shield case 6 manufactured by stamping and bending using a pressing technique. The shield case 6 is formed with a lead frame 6a. The lead frame 6 a is fixed by soldering to a land portion provided on the upper surface of the substrate 7.

Utility Model Registration No. 3114089

  However, in the conventional device, when a load (for example, a “koji load”) is applied when the plug is attached or detached, peeling from the end portion (A and B in FIG. 8) of the soldering portion of the lead frame occurs. There was a problem.

  The present invention has been made to solve the conventional problems, and an object of the present invention is to provide a connector capable of improving the peel strength.

  The connector of the present invention is a connector that includes a connector housing and is soldered and fixed to a predetermined land portion on a circuit board, and includes a pedestal portion including a soldering surface to be soldered to the land portion, A holding portion that is supported by a pedestal portion and holds the connector housing, and a protrusion portion that is provided on the soldering surface and is inserted into at least one through hole formed in the land portion, are integrally molded. The reinforcing metal fitting has a configuration in which the reinforcing metal fitting is molded from any one material of die-cast metal, cast metal, and sintered metal.

  The present invention can provide a connector having an effect that the peel strength can be improved.

It is a block diagram in 1st Embodiment of the connector which concerns on this invention. It is a perspective view in a 1st embodiment of a connector concerning the present invention. It is a figure which shows the circuit board in 1st Embodiment, and the conventional board | substrate. It is a block diagram in the other aspect of the connector which concerns on this invention. It is a block diagram in the other aspect of the connector which concerns on this invention. It is a block diagram in the other aspect of the connector which concerns on this invention. It is a block diagram in 2nd Embodiment of the connector which concerns on this invention. It is a block diagram of the conventional connector.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. An example in which the connector of the present invention is applied to an HDMI standard type D receptacle-type connector will be described.

(First embodiment)
The structure in 1st Embodiment of the connector which concerns on this invention is demonstrated based on FIG. 1, FIG. 1A is a front view of the connector 10 in the present embodiment, FIG. 1B is a bottom view of the connector 10, and FIG. 2 is a perspective view of the connector 10 in the present embodiment.

  As shown in FIGS. 1 and 2, the connector 10 in the present embodiment is a mid-mount type connector, and includes a reinforcing metal fitting 20 fixed on a circuit board 50. The circuit board 50 has an upper surface 50a to which the reinforcing metal fitting 20 is soldered and a lower surface 50b on the opposite side.

  The reinforcing metal fitting 20 is formed by integrally molding a holding portion 30 that holds the shield case 12 surrounding the housing 11 and a pair of pedestal portions 40 that are fixed to the circuit board 50 across the holding portion 30. This reinforcing metal fitting 20 is produced by die molding other than press working, for example, zinc die casting. The material of the reinforcing metal fitting 20 may be a die cast metal other than the zinc die cast, or may be a cast metal, a sintered metal, or the like.

  The housing 11 includes a resin housing fitting portion 11a to be fitted to a plug of a mating connector housing (not shown), and terminals 11b and 11c provided on the upper and lower surfaces of the housing fitting portion 11a, respectively.

  The shield case 12 is produced by punching and bending a thin plate of stainless steel, for example, by a press working technique, and has a joint 12a that joins one end and the other end of the thin plate. Note that the shield case 12 may not be provided.

  The holding part 30 has a shape surrounding the outer periphery of the shield case 12, and a fitting part 31 for fitting and fixing the shield case 12 is formed on the inner wall of the holding part 30. The fitting portion 31 has, for example, a shape that extends linearly in a direction in which the shield case 12 is inserted into the holding portion 30. The holding part 30 is provided with a caulking part 32 for caulking and fixing the shield case 12 protruding from the rear of the holding part 30 (FIG. 2B).

  With this configuration, the holding part 30 fits the shield case 12 and surrounds the outer periphery thereof, so that the joint part 12a is separated as in the conventional case even if a “koji load” is applied. There is no.

  The pedestal 40 is formed on the soldering surface 41 to be soldered to the upper surface 50 a of the circuit board 50, the protrusion 42 inserted into the through hole 51 formed in the circuit board 50, and the base of the protrusion 42. And a recess 43. In the present embodiment, the number of protrusions 42 per side is four, but is not limited to this, and it is sufficient that there is at least one. As shown in FIG. 2 (b), it is preferable that the pedestal portion 40 is provided with a lightening portion 44 for preventing meat sinks (dent-like deformation). The thinned portion 44 also facilitates raising and lowering of the temperature of the pedestal portion 40 during soldering described later.

  The soldering surface 41 is also formed with a pair of shield case protrusions 12b configured by a part of the shield case 12 protruding from the rear of the holding portion 30 (FIG. 2B). The shield case 12 can be connected to the ground by soldering the shield case protrusion 12b to the ground land.

  The protrusion 42 has a rectangular parallelepiped shape, and has a long side in a direction in which the plug is attached to and detached from the connector 10 (hereinafter referred to as “plug attachment / detachment direction”) when viewed from the lower surface side (FIG. 1B).

  Further, the protruding portion 42 has a configuration in which the tip portion protrudes from the lower surface 50b of the circuit board 50 (FIG. 1A). In addition, it is good also as a structure which the front-end | tip part of the projection part 42 does not protrude from the lower surface 50b of the circuit board 50. FIG.

  The recess 43 is formed around the base of each protrusion 42. With this configuration, the solder used when the connector 10 is surface-mounted is heated and spreads into the recess 43, so that a solder fillet is reliably formed. Therefore, the peel strength between the connector 10 and the circuit board 50 is increased. Can be higher. In addition, although it is preferable to set it as the structure which forms the recessed part 43, you may make it the structure which does not form the recessed part 43. FIG.

  Next, a circuit board on which the mid-mount type connector 10 is arranged will be described by comparing the circuit board 50 in the present embodiment with a conventional circuit board.

  First, the circuit board 50 in the present embodiment has, for example, the configuration shown in FIG. That is, the circuit board 50 is formed with a notch 50c in which the holding unit 30 is disposed. Further, on the upper surface 50a of the circuit board 50, land portions 53 are formed in a region surrounding the four through holes 51 per one side into which each projection 42 is inserted and the through hole 52 into which the shield case projection 12b is inserted. Has been. Furthermore, land portions 54 and 55 for soldering the terminals 11b and 11c are formed on the upper surface 50a of the circuit board 50, respectively. When the connector 10 is soldered to the circuit board 50 by surface mounting, after the cream solder is applied to the land portions 53, 54 and 55, the connector 10 is placed at a predetermined position by the chip mounter and passed through the high temperature furnace. After cooling, the connector 10 is fixed to the circuit board 50 by soldering.

  Next, the conventional circuit board has, for example, the configuration shown in FIG. That is, the conventional circuit board 8 has, for example, two land portions 9a per side to which the lead frame 6a shown in FIG. 8B is soldered and a land portion 9b to which terminals are soldered. And 9c are formed, and a notch 8b is formed.

  As can be seen by comparing FIG. 3A and FIG. 3B, the area of the land portion 53 in this embodiment is 5 to 6 times the area of the conventional land portion 9a. That is, in this embodiment, since the soldering area 5 to 6 times that of the prior art can be obtained, the connection strength by soldering can be significantly increased as compared with the prior art.

  In addition, the connector 10 according to the present embodiment includes the pedestal portion 40 that is significantly more rigid than the plate-like lead frame formed by the conventional press working. Therefore, when a “squeeze load” is applied, the soldering surface 41 is provided. The conventional phenomenon that the peeling starts from the end of the solder does not occur, and the peeling strength can be improved to the strength at which the entire soldering surface 41 is peeled off.

  Furthermore, the connector 10 according to the present embodiment has four protrusions 42 per side and one shield case protrusion 12b soldered to the land portion 53, so that the protrusion 42 and the shield case protrusion 12b are connected to the bases. Will form a solder fillet.

  Here, since the concave portion 43 is formed at the base portion of the protruding portion 42, the solder fillet is easily formed along the periphery of the protruding portion 42. In particular, the solder fillet formed along the longitudinal direction of each protrusion 42 is exceptionally resistant to stress in the vertical direction of the connector 10 (in the thickness direction of the circuit board 50 in FIG. 1A) and in the plug attachment / detachment direction. Has an effect.

  As described above, according to the connector 10 in the present embodiment, since the base portion 40 with increased rigidity is provided and the protruding portion 42 is formed on the base portion 40, the peel strength can be improved. .

Further, in the connector 10 according to the present embodiment, since the solder fillet is easily formed along the periphery of the protrusion 42 by forming the recess 43 at the base of the protrusion 42, the peel strength can be further improved. it can.
(Other aspects)
Next, in the above-described embodiment, the description has been given by taking as an example a rectangular parallelepiped shape in which the protrusion 42 has a long side in the plug attaching / detaching direction, but the present invention is not limited to this, and the following configuration may also be adopted. Good.

  For example, as shown in FIG. 4A, a configuration may be adopted in which a protrusion 61 having a long side in a direction orthogonal to the plug attaching / detaching direction and a recess 62 at the base of the protrusion 61 are formed.

  Further, for example, as shown in FIG. 4B, a cylindrical protrusion 63 and a recess 64 may be formed at the base of the protrusion 63. In addition, the protrusion may be a polygonal columnar shape.

  Furthermore, the configuration shown in FIG. 5 may be adopted. That is, the cylindrical protrusion 65 is provided on the pedestal 40, and the recess 66 is formed at the base of the protrusion 65 (FIG. 5B). In this configuration, as shown in FIG. 5A, after the protrusion 65 is inserted into the through hole 51 of the circuit board 50 and soldered, the tip of the protrusion 65 is crimped and expanded from the direction of the arrow in the figure. As a result, the protrusion 65 is fixed to the circuit board 50. As a result, the peel strength can be further improved. The fixing method by caulking is possible even if the shape of the protruding portion is a columnar shape, a triangular shape, or the like, but it is easy and preferable to apply to the cylindrical protruding portion 65.

  Next, in consideration of the heat resistance of the housing 11 made of resin, as shown in FIG. 6, a groove portion 67 may be formed in the vicinity of the boundary portion between the holding portion 30 and the pedestal portion 40. This configuration is preferable because the heat resistance from the soldering surface 41 to the housing 11 can be increased and heat transfer to the housing 11 can be suppressed. Instead of the groove portion 67, for example, a configuration in which a concave portion such as the lightening portion 44 shown in FIG. 2B may be provided near the boundary portion between the holding portion 30 and the pedestal portion 40. That is, these groove part 67 and a recessed part comprise the thermal resistance part which concerns on this invention.

  In the above-described embodiment, the connector of the present invention is described as an example applied to an HDMI standard type D receptacle type connector. However, the present invention is not limited to this, and the circuit board is soldered. It can be applied to various connectors to be attached.

  In the above-described embodiment, the configuration in which the pair of pedestal portions 40 sandwich the holding portion 30 has been described as an example. However, the present invention is not limited to this, and the holding portion 30 is configured by one pedestal portion. It can also be set as the structure which supports the holding | maintenance part 30 by the structure supported, or three or more base parts.

(Second Embodiment)
Next, a second embodiment of the connector according to the present invention will be described. As shown in FIG. 7, the connector 70 in this embodiment is a top mount type connector. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment, and the overlapping description is abbreviate | omitted.

  The connector 70 has a reinforcing metal fitting 100 fixed on the circuit board 80. The circuit board 80 has an upper surface 80a to which the reinforcing metal fitting 100 is soldered and a lower surface 80b.

  The reinforcing metal fitting 100 is formed by integrally molding a holding portion 90 that holds the shield case 12 surrounding the housing 11 and a pair of pedestal portions 40 that are fixed to the circuit board 80 with the holding portion 90 interposed therebetween. This reinforcing metal fitting 100 is produced by die molding other than press work, as in the first embodiment.

  The holding portion 90 has a shape opened on the circuit board 80 side, and a fitting portion 91 for fitting and fixing the shield case 12 is formed on the inner wall thereof. In the configuration shown in FIG. 7, the joint portion 12a of the shield case 12 is provided on the opening side of the holding portion 90, but may be provided on the opposite side.

  Since the connector 70 according to the present embodiment is configured as described above, the connector 70 has a pedestal portion 40 with increased rigidity corresponding to the shape of the top mount type, and the projection portion 42 is formed on the pedestal portion 40. Therefore, the peel strength can be improved.

  Further, in the connector 70 according to this embodiment, the solder fillet is easily formed along the periphery of the protrusion 42 by forming the recess 43 at the base of the protrusion 42, so that the peel strength can be further improved. it can.

  As described above, the connector according to the present invention has an effect that the peel strength can be improved, and is useful as a connector used in a mobile phone, a digital camera, and the like.

10, 70 Connector 11 Housing (Connector housing)
11a Housing fitting portion 11b Terminal 12 Shield case 12a Joint portion 12b Shield case projection 20, 100 Reinforcing bracket 30, 90 Holding portion 31, 91 Fitting portion 32 Caulking portion 40 Base portion 41 Soldering surfaces 42, 61, 63, 65 Projection 43, 62, 64, 66 Recess 44 Recessed portion 50, 80 Circuit board 50a, 80a Circuit board upper surface 50b, 80b Circuit board lower surface 50c Notch 51, 52 Through hole 53, 54 Land part 67 Groove part

Claims (5)

A connector comprising a connector housing and soldered and fixed to a predetermined land portion on a circuit board,
A pedestal portion including a soldering surface to be soldered to the land portion; a holding portion supported by the pedestal portion to hold the connector housing; and at least a land portion provided on the soldering surface. A protrusion that is inserted into each through-hole, and a reinforcing metal fitting that is integrally molded,
The reinforcing metal fitting is a connector formed of any one of a die-cast metal, a cast metal, and a sintered metal.   The connector according to claim 1, wherein the reinforcing metal fitting has a recess recessed from the soldering surface at a base portion of each protrusion. Each of the protrusions protrudes from the surface opposite to the surface of the circuit board on which the land portion is formed,
The connector according to claim 1, wherein the reinforcing metal fitting is fixed to the circuit board by caulking the tip portion. A shield case surrounding the connector housing;
The connector according to any one of claims 1 to 3, wherein the shield case has a shield case protrusion that is inserted into one through hole formed in the land portion.   The connector according to any one of claims 1 to 4, wherein the reinforcing metal fitting has a thermal resistance portion formed on a surface of a boundary portion between the pedestal portion and the holding portion.

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