WO2020253410A1

WO2020253410A1 - Encapsulation structure for circuit board of intelligent power module

Info

Publication number: WO2020253410A1
Application number: PCT/CN2020/089043
Authority: WO
Inventors: 陈健; 吴桢生; 汤桂衡; 杨轲
Original assignee: 深圳市汇川技术股份有限公司
Priority date: 2019-06-20
Filing date: 2020-05-07
Publication date: 2020-12-24
Also published as: CN110213929A

Abstract

Disclosed is an encapsulation structure for a circuit board of an intelligent power module, relating to the technical field of intelligent power module encapsulation. The structure comprises: a power circuit substrate, a built-in functional circuit board, and a plurality of connection posts for transmitting signals and fixing the built-in functional circuit board, wherein the bottom ends of the plurality of connection posts are fixed on the power circuit substrate; a plurality of first through holes are provided in the built-in functional circuit board, and the plurality of first through holes respectively correspond to the plurality of connection posts on a one-to-one basis; and the top ends of the plurality of connection posts respectively run through the built-in functional circuit board through the plurality of first through holes, and are fixedly connected to the built-in functional circuit board at the first through holes, such that the built-in functional circuit board is arranged above the power circuit substrate in a stacked manner. According to the embodiments of the present invention, the utilization rate of the power circuit substrate can be improved, the housing design costs and assembly processes of an intelligent power module can be reduced, and a reduction in the volume of the intelligent power module and an increase in the power density of the intelligent power module can be facilitated.

Description

Intelligent power module circuit board packaging structure

Technical field

The embodiment of the present invention relates to the technical field of smart power module packaging, in particular to a smart power module circuit board packaging structure.

Background technique

Intelligent Power Module (IPM) integrates functional circuit units on the basis of traditional power modules. Because of its high integration, high reliability and simple external supporting circuit, it is widely used in household appliances, industrial transmission and other fields. The existing IPM functional circuit unit packaging methods include two:

One packaging method is that the functional circuit unit exists in the form of an integrated circuit chip and is placed on the power circuit substrate in the IPM, and the functional circuit unit performs signal transmission through bonding metal wires and the power unit on the power circuit substrate. This packaging method integrates the functional circuit unit and the power unit on the power circuit substrate. Since the integrated circuit chip of the functional circuit unit generates much less heat than the power unit, it results in the utilization of the power circuit substrate with good thermal conductivity. Not high, which indirectly leads to increased costs.

Another packaging method is that the functional circuit unit exists in the form of a built-in Printed Circuit Board (PCB). Discrete functional devices are placed on the built-in functional PCB. The built-in PCB is usually assembled in the IPM shell through supporting parts on the IPM shell. In the cavity inside the body, the built-in functional PCB performs signal transmission through the bonding metal wire and the power unit on the power circuit substrate in the IPM. This packaging method requires the support parts on the IPM shell to assemble or fix the functional circuit unit. As a result, the IPM shell needs to be designed as a separate shell, that is, a shell frame and a cover, and the supporting parts are arranged on the four sides of the shell frame. Compared with the integrated shell, the shell material and assembly process are increased.

technical problem

In summary, the existing IPM functional circuit unit packaging method has the problems of low utilization of power circuit substrates and the need to design a separate housing containing supporting components, which leads to increased costs and assembly procedures.

Technical solutions

In view of this, the purpose of the embodiments of the present invention is to provide a smart power module circuit board packaging structure to solve the low utilization rate of power circuit substrates in the prior art and the need to design a separate housing containing supporting components, resulting in cost and The problem of increased assembly processes.

The technical solutions adopted by the embodiments of the present invention to solve the above technical problems are as follows:

According to one aspect of the embodiments of the present invention, a smart power module circuit board packaging structure is provided, including: a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts for signal transmission and fixing the built-in functional circuit board; The bottom ends of the plurality of connecting posts are fixed on the power circuit substrate, the built-in function circuit board is provided with a plurality of first through holes, and the plurality of first through holes are respectively connected to the plurality of connecting posts one by one Correspondingly, the top ends of the plurality of connecting posts respectively pass through the built-in function circuit board through the plurality of first through holes, and are fixedly connected to the built-in function circuit board at the first through holes, so that all The built-in function circuit board is arranged above the power circuit substrate in a stacking manner.

On the basis of the above technical solution, the plurality of connecting columns includes a first short connecting column and/or a second long connecting column, wherein:

The first short connecting post includes a first post, the bottom end of the first post is fixed on the power circuit substrate, and the top end of the first post passes through the first through hole corresponding to the first post. The built-in function circuit board does not extend afterwards, and the first cylinder is fixedly connected to the built-in function circuit board at its corresponding first through hole;

The second long connecting column includes a second column body, the bottom end of the second column body is fixed on the power circuit substrate, and the top end of the second column body passes through the corresponding first through hole. The built-in function circuit board has an extension part, and the second cylinder is fixedly connected with the built-in function circuit board at the corresponding first through hole.

On the basis of the above technical solution, the first short connecting column further includes a first base, the bottom surface of the first base is fixed on the power circuit substrate, and the first column is disposed on the first base on.

On the basis of the above technical solution, the second connecting post further includes a second base, the bottom surface of the second base is fixed on the power circuit substrate, and the second post is arranged on the second base .

On the basis of the above technical solution, when the plurality of connecting pillars include the second long connecting pillar, the second long connecting pillar passes through the extension portion of the built-in function circuit board and at least one other circuit is stacked board.

On the basis of the above technical solution, the bottom ends of the plurality of connecting posts are fixed on the power circuit substrate by welding.

On the basis of the above technical solution, the multiple connecting posts are respectively fixed to the built-in functional circuit board at the corresponding first through holes by welding and/or crimping.

On the basis of the above technical solution, the smart power module circuit board packaging structure further includes a plurality of limit support pillars with a limit support platform, and the built-in functional circuit board is provided with a plurality of limit support pillars. Corresponding second through holes; the bottom ends of the plurality of limit support posts are fixed on the power circuit substrate, and the top ends of the plurality of limit support posts respectively pass through the corresponding second through holes For the built-in function circuit board, the limit support platforms of the plurality of limit support columns respectively abut against the bottom surface of the built-in function circuit board to limit and support the built-in function circuit board, and A plurality of limit support pillars are respectively fixedly connected with the built-in function circuit board at the corresponding second through holes.

On the basis of the above technical solution, the bottom ends of the multiple limit support columns are all fixed on the power circuit substrate by welding.

On the basis of the above technical solution, the plurality of limit support columns are respectively fixed to the built-in functional circuit board at the corresponding second through holes by welding and/or crimping.

Beneficial effect

The beneficial effects of the embodiments of the present invention are as follows:

The smart power module circuit board packaging structure provided by the embodiment of the present invention uses a plurality of connecting posts provided on the power circuit substrate with signal transmission function to fix the built-in functional circuit board, thereby improving the utilization rate of the power circuit substrate and making the The shell of the power module can be designed as an integrated shell, which reduces the cost of shell design and assembly procedures; in addition, the smart power module circuit board packaging structure provided by the embodiment of the present invention has a high space utilization rate, which is beneficial to reduce the volume and size of the smart power module. Increase the power density of smart power modules.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only of the present application. For some embodiments, for those of ordinary skill in the art, other drawings can be obtained from these drawings without creative labor.

FIG. 1 is a schematic structural diagram of a smart power module circuit board packaging structure provided by an embodiment of the present invention;

2 is a schematic structural diagram of a first short connecting column and a second long connecting column in the smart power module circuit board packaging structure provided by an embodiment of the present invention;

3 is a schematic structural diagram of a specific implementation example of a smart power module circuit board packaging structure provided by an embodiment of the present invention;

4 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by an embodiment of the present invention;

5 is a schematic structural diagram of a preferred implementation example of the smart power module circuit board packaging structure provided by the embodiment of the present invention;

6 is a schematic structural diagram of a packaging structure of a smart power module circuit board provided by another embodiment of the present invention;

7 is a schematic structural diagram of a limit support column in a smart power module circuit board packaging structure provided by another embodiment of the present invention;

8 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by another embodiment of the present invention;

9 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by another embodiment of the present invention;

10 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by another embodiment of the present invention.

Embodiments of the invention

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following further describes the embodiments of the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention.

Example one

Fig. 1 is a schematic structural diagram of a smart power module circuit board packaging structure provided by an embodiment of the present invention. For ease of description, only the parts related to this embodiment are shown.

Referring to FIG. 1, the smart power module circuit board packaging structure provided by this embodiment includes: a power circuit substrate 1, a built-in functional circuit board 2 and multiple connecting posts for signal transmission and fixing the built-in functional circuit board 2 3; the bottom ends of the plurality of connecting posts 3 are fixed on the power circuit substrate 1, the built-in function circuit board 2 is provided with a plurality of first through holes, and the plurality of first through holes are connected to the The plurality of connecting posts 3 correspond to each other one by one. The top ends of the plurality of connecting posts 3 respectively pass through the built-in function circuit board 2 through the plurality of first through holes, and are connected to the first through holes. The built-in function circuit board 2 is fixedly connected so that the built-in function circuit board 2 is arranged above the power circuit substrate 1 in a stacking manner.

Wherein, the power circuit substrate 1 includes but is not limited to aluminum-based resin copper clad laminate, copper-based resin copper clad laminate, or double-sided copper-clad ceramic substrate, and the welding function on the power circuit substrate 1 is not limited to inverter, rectifier, and manufacturing. Power switching devices such as moving and buffering 11. The functions welded on the built-in functional circuit board 2 are not limited to discrete functional devices 22 such as power supply, signal sampling and conditioning, protection, driving, and Microcontroller Unit (MCU) operations.

Preferably, in this embodiment, the bottom ends of the plurality of connecting posts 3 are fixed on the power circuit substrate 1 by welding; the plurality of connecting posts 3 are respectively located at their corresponding first through holes The fixing with the built-in function circuit board 2 is realized by welding or crimping. In this embodiment, multiple connecting posts are fixed on the power circuit substrate 1 by welding, and are fixed to the built-in functional circuit board by welding and/or crimping, which can ensure that the connecting posts and the power circuit substrate The stability and reliability of the connection with the built-in functional circuit board, and since the power switching devices are fixed on the power circuit substrate by welding, the connecting posts can be assembled together with the power switching devices, simplifying the assembly Process.

Preferably, in this embodiment, the plurality of connecting pillars 3 include a first short connecting pillar 31 and/or a second long connecting pillar 32, wherein:

The first short connecting post 31 includes a first post 311, the bottom end of the first post 311 is fixed on the power circuit substrate 1, and the top end of the first post 311 passes through the corresponding first post. The through hole no longer extends after passing through the built-in function circuit board 2, and the first post 311 is fixedly connected to the built-in function circuit board 2 at the corresponding first through hole;

The second long connecting post 32 includes a second post 321, the bottom end of the second post 321 is fixed on the power circuit substrate 1, and the top end of the second post 321 passes through the corresponding first The through hole passes through the built-in function circuit board 2 and has an extension, and the second post 321 is fixedly connected to the built-in function circuit board 2 at the corresponding first through hole.

In a specific implementation, the bottom end of the first pillar 311 is fixed on the power circuit substrate 1 by welding, and the first pillar 311 is welded and/or at its corresponding first through hole. The crimping method realizes a fixed connection with the built-in function circuit board 2.

In a specific implementation, the bottom end of the second pillar 321 is fixed on the power circuit substrate 1 by welding, and the second pillar 321 is welded and/or at its corresponding first through hole. The crimping method realizes a fixed connection with the built-in function circuit board 2.

In a specific implementation, the top ends of the first cylinder 311 and the second cylinder 322 can be set in a needle-like shape, which is convenient for the first cylinder 311 and the second cylinder 322 to quickly pass through. The first through hole on the built-in function circuit board 2 is convenient for assembly.

It should be noted that, in the embodiment of the present invention, the appearance realization form of the first column 311 and the second column 321 is not limited by a certain fixed shape. In the specific implementation, the first column Specific implementation forms of 311 and the second column 321 include but are not limited to cylindrical terminals, regular polygon terminals and/or flat terminals.

Further, referring to FIG. 2, the first short connecting post 31 may further include a first base 312, the bottom surface of the first base 312 is fixed on the power circuit substrate 1, and the first post 311 Set on the first base 312.

In specific implementation, the bottom surface of the first base 312 is soldered on the power circuit substrate 2. The first base 312 and the first post 311 may be integrally formed terminals, or may be two separate parts. When the first base 312 and the first column 311 are two separate parts, the first base 312 has a first insertion hole, and the bottom end of the first column 311 passes through the first The jack is plugged into the first base 312.

Further, referring to FIG. 2, the second connecting post may further include a second base 322 with a second insertion hole, the bottom surface of the second base 322 is fixed on the power circuit substrate 1, and the second base 322 The bottom end of the two pillars 321 is inserted into the second base 322 through the second socket.

In specific implementation, the bottom surface of the second base 322 is soldered on the power circuit substrate 1. The second base 322 and the second post 321 may be integrally formed terminals, or may be two separate parts. When the second base 322 and the second cylinder 321 are two separate parts, the second base 322 has a second insertion hole, and the bottom end of the second cylinder 321 passes through the second The jack is plugged into the second base 322.

The arrangement of the first base 312 and the second base 322 can improve the stability of the connection between the connecting post 3 and the power circuit substrate 1. When the first base 312 and the second base 322 are separate separate parts, the first base 312 and the second base 322 can be soldered to the power circuit substrate 1 during packaging. , And then plug the first short connecting column 31 and the second long connecting column 32 on the first base 312 and the second base 322, respectively, so as to facilitate the welding of the connecting columns and simplify The welding process of the connecting column.

Preferably, in this embodiment, when the plurality of connecting pillars 3 include the second long connecting pillars 32, the second long connecting pillars 32 pass through the extension portion of the built-in function circuit board 2 to at least stack One other circuit board is stacked. In a specific implementation, a plurality of first through holes corresponding to the second long connecting post 32 are opened on the other circuit board, and the extension portion of the second long connecting post 32 passes through the corresponding first through hole. Pass through the other circuit board, and realize a fixed connection with the other circuit board by welding and/or crimping at the first through hole, so as to support, limit and fix the other circuit board , And can realize the signal transmission function between the other circuit board and the power circuit board and the built-in function circuit board, and between the power circuit board, the built-in function circuit board and the other circuit board The signal multiplexing can be realized based on the second long connecting column.

Further, in specific implementation, according to the combination of the multiple connecting posts 3 welded on the power circuit substrate 1, the specific implementation manners of the embodiment of the present invention can be divided into the following three types:

As shown in FIG. 3, the plurality of connection posts 3 between the power circuit substrate 1 and the built-in function circuit board 2 includes a first short connection post 31 and a second long connection post 32, wherein the power circuit substrate 1 Each side contains at least one connection post, and the first short connection post 31 and the second long connection post 32 are distributed around the power circuit substrate 1 and the central area as required to establish the built-in The functional circuit board 2 and the power circuit substrate 1 transmit power or signal, and at the same time support and fix the built-in functional circuit board 2. In addition, the extended portion of the second long connecting post 32 passing through the built-in function circuit board 2 can stack more circuit boards.

As shown in FIG. 4, the multiple connecting posts 3 between the power circuit substrate 1 and the built-in function circuit board 2 are the first short connecting posts 31, and each side of the power circuit substrate 1 At least one of the first short connecting posts 31 is included, and the first short connecting posts 31 are distributed around and in the central area of the power circuit substrate 1 as required to establish the built-in functional circuit board 2 and the power The power or signal transmission function between the circuit boards 1 also supports and fixes the built-in function circuit board 2.

As shown in FIG. 5, the multiple connecting posts 3 between the power circuit substrate 1 and the built-in function circuit board 2 are the second long connecting posts 32, and each side of the power circuit substrate 1 At least one second long connecting post 32 is included, and the second long connecting post 32 is distributed around and the central area of the power circuit substrate 1 as required to establish the built-in functional circuit board 2 and the power The power or signal transmission function between the circuit boards 1 also supports and fixes the built-in function circuit board 2. In addition, the extension part after the second long connecting post 32 passes through the built-in function circuit board 2 can be stacked with more circuit boards.

It should be noted that the first short connecting post 31 and the second long connecting post 32 in the smart power module circuit board packaging structure shown in FIGS. 1 to 5 respectively include a first base 312 and a second base 322 In a specific implementation, the first short connecting column 31 and the second long connecting column 32 may not include a base. The above three specific implementation manners are only three preferred implementation manners exemplified by the present invention, and are not used to limit the protection scope of the present invention.

As can be seen from the above, the smart power module circuit board packaging structure provided by this embodiment adopts a plurality of connecting posts provided on the power circuit substrate with signal transmission functions to fix the built-in functional circuit board, thereby improving the utilization rate of the power circuit substrate. , And enables the shell of the smart power module to be designed as an integrated shell, reducing shell design costs and assembly procedures; in addition, the smart power module circuit board packaging structure provided by the embodiment of the present invention makes the shell design free from the built-in functional circuit board assembly method This reduces the workload of module design, and the stacked stacked package structure of the embodiment of the present invention has a high space utilization rate, which is beneficial to reduce the volume of the smart power module and increase the power density of the smart power module.

Example two

Fig. 6 is a schematic structural diagram of a smart power module circuit board packaging structure provided by another embodiment of the present invention. For convenience of description, only the parts related to this embodiment are shown.

Referring to FIG. 6, compared to the previous embodiment, the smart power module circuit board packaging structure provided in this embodiment further includes a plurality of limit support columns 4 having a limit support platform 41, and the limit support columns For a structural schematic diagram of 4, refer to FIG. 7. The built-in function circuit board 2 is provided with second through holes corresponding to a plurality of limit support columns 4 one-to-one; the bottom ends of the plurality of limit support columns 4 Are fixed on the power circuit substrate 1, and the top ends of the plurality of limit support posts 4 respectively pass through the built-in function circuit board 2 through the corresponding second through holes, so that the plurality of limit support posts The limit support platform 41 of 4 respectively abuts against the bottom surface of the built-in function circuit board 2 to limit and support the built-in function circuit board 2, and the plurality of limit support posts 4 respectively correspond to The second through hole is fixedly connected to the built-in function circuit board 2.

In a specific implementation, the bottom ends of the plurality of limit support posts 4 are fixed on the power circuit substrate 1 by welding; the plurality of limit support posts 4 are respectively located in their corresponding second through holes The location is fixed to the built-in functional circuit board 2 by welding and/or crimping.

In specific implementation, according to the combination of the multiple connection posts 3 and the multiple limit support posts 4 welded on the power circuit substrate 1, the specific implementation manners of this embodiment can be divided into the following three types:

As shown in FIG. 8, a plurality of connection posts 3 and a plurality of limit support posts 4 are provided between the power circuit substrate 1 and the built-in function circuit board 2, wherein the plurality of connection posts 3 include first short The connecting pillars 31 and the second long connecting pillars 32, the plurality of limit support pillars 4 are evenly distributed on the four sides of the power circuit substrate 1, and each side of the power circuit substrate 1 contains at least one limiter. The position support column 4 plays a role of limiting, supporting and fixing the built-in function circuit board 2; the first short connecting column 31 and the second long connecting column 32 are distributed on the power circuit substrate as required Any area of 1 plays a role in establishing power or signal transmission between the built-in functional circuit board 2 and the power circuit board 1, and at the same time supports and fixes the built-in functional circuit board 2. In addition, the second long connecting post 32 passes through the extended portion of the built-in function circuit board 2 to allow more circuit boards to be stacked.

As shown in FIG. 9, a plurality of connection posts 3 and a plurality of limit support posts 4 are provided between the power circuit substrate 1 and the built-in function circuit board 2, wherein the plurality of connection posts 3 are all first The short connecting post 31, wherein the multiple limit support posts 4 are evenly distributed on the four sides of the power circuit substrate 1, and each side of the power circuit substrate 1 contains at least one limit support post 4. Play the role of limiting, supporting and fixing the built-in function circuit board 2; the first short connecting posts 31 are distributed in any area of the built-in function circuit board 2 according to needs to establish the The function of power or signal transmission between the built-in function circuit board 2 and the power circuit substrate 1, while supporting and fixing the built-in function circuit board 2.

As shown in FIG. 10, a plurality of connection posts 3 and a plurality of limit support posts 4 are provided between the power circuit substrate 1 and the built-in function circuit board 2, wherein the plurality of connection posts 3 are all second Long connecting post 32, wherein the plurality of limit support posts 4 are evenly distributed on the four sides of the power circuit substrate 1, and each side of the power circuit substrate 1 contains at least one limit support post 4. Play the role of limiting, supporting and fixing the built-in function circuit board 2; the second long connecting posts 32 are distributed in any area of the built-in function circuit board 2 according to needs to establish the The function of power or signal transmission between the built-in function circuit board 2 and the power circuit substrate 1, while supporting and fixing the built-in function circuit board 2. In addition, the extended portion of the second long connecting post 32 passing through the built-in function circuit board 2 can stack more circuit boards.

It should be noted that in the smart power module circuit board packaging structure shown in FIGS. 6 and 8 to 10, the first short connecting post 31 and the second long connecting post 32 respectively include a first base 312 and a second base 312 The second base 322, in specific implementation, the first short connecting column 31 and the second long connecting column 32 may not include a base. The above three specific implementation manners are only three preferred implementation manners exemplified by the present invention, and are not used to limit the protection scope of the present invention.

It can be seen from the above that the smart power module circuit board packaging structure provided in this embodiment can also increase the utilization rate of the power circuit substrate, reduce the shell design cost and assembly process of the smart power packaging module, reduce the workload of the module design, and reduce the smart power The volume of the module and increase the power density of the smart power module. In addition, compared with the previous embodiment, the smart power module circuit board packaging structure provided in this embodiment is provided between the power circuit substrate and the built-in functional circuit board for limiting the built-in functional circuit board. Position, support and fixed limit support column, which can further improve the stability of the built-in functional circuit board packaging.

Industrial applicability

The preferred embodiments of the present invention are described above with reference to the accompanying drawings, and the scope of rights of the present invention is not limited thereby. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and essence of the present invention shall fall within the scope of the rights of the present invention.

Claims

An intelligent power module circuit board packaging structure, which is characterized by comprising: a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts for signal transmission and fixing the built-in function circuit board; The bottom end is fixed on the power circuit substrate, the built-in function circuit board is provided with a plurality of first through holes, and the plurality of first through holes respectively correspond to the plurality of connecting posts one to one, and the plurality of The top ends of the connecting posts respectively pass through the built-in function circuit board through the plurality of first through holes, and are fixedly connected to the built-in function circuit board at the first through holes, so that the built-in function circuit board is The stack is arranged above the power circuit substrate.
The smart power module circuit board packaging structure according to claim 1, wherein the plurality of connecting pillars comprise a first short connecting pillar and/or a second long connecting pillar, wherein:

The first short connecting column includes a first column body, the bottom end of the first column body is fixed on the power circuit substrate, and the top end of the first column body passes through the corresponding first through hole. The built-in function circuit board does not extend afterwards, and the first cylinder is fixedly connected to the built-in function circuit board at its corresponding first through hole;

The second long connecting column includes a second column body, the bottom end of the second column body is fixed on the power circuit substrate, and the top end of the second column body passes through the corresponding first through hole. The built-in function circuit board has an extension part, and the second cylinder is fixedly connected with the built-in function circuit board at the corresponding first through hole.
The smart power module circuit board packaging structure of claim 2, wherein the first short connecting post further comprises a first base, and the bottom surface of the first base is fixed on the power circuit substrate, and The first column is arranged on the first base.
The smart power module circuit board packaging structure of claim 2, wherein the second connecting column further comprises a second base, the bottom surface of the second base is fixed on the power circuit substrate, and the first Two pillars are arranged on the second base.
The smart power module circuit board packaging structure of claim 2, wherein when the plurality of connecting posts includes the second long connecting post, the second long connecting post passes through the built-in functional circuit At least one other circuit board is stacked on the extension part of the board.
The smart power module circuit board packaging structure according to any one of claims 1 to 5, wherein the bottom ends of the plurality of connecting posts are fixed on the power circuit substrate by welding.
The smart power module circuit board packaging structure according to any one of claims 1 to 5, wherein the plurality of connecting posts are respectively connected to the corresponding first through holes by welding and/or crimping. The built-in function circuit board is fixed.
The smart power module circuit board packaging structure according to claim 1, wherein the smart power module circuit board packaging structure further comprises a plurality of limit support columns with a limit support platform, and the built-in functional circuit board There are second through holes corresponding to a plurality of limit support columns one-to-one; the bottom ends of the plurality of limit support columns are all fixed on the power circuit substrate, and the top ends of the plurality of limit support columns are respectively Through the second through hole corresponding to the built-in function circuit board, the limit support platforms of the plurality of limit support columns are respectively abutted against the bottom surface of the built-in function circuit board, so as to contact the built-in function The circuit board is limited and supported, and the plurality of limit support posts are respectively fixedly connected to the built-in function circuit board at the corresponding second through holes.
8. The smart power module circuit board packaging structure of claim 8, wherein the bottom ends of the plurality of limit support pillars are all fixed on the power circuit substrate by welding.
The smart power module circuit board packaging structure according to claim 8, wherein the plurality of limit support posts are respectively connected to the built-in via welding and/or crimping at their corresponding second through holes. The functional circuit board is fixed.