CN203378132U - Unit circuit board assembling structure - Google Patents
Unit circuit board assembling structure Download PDFInfo
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- CN203378132U CN203378132U CN201320316587.8U CN201320316587U CN203378132U CN 203378132 U CN203378132 U CN 203378132U CN 201320316587 U CN201320316587 U CN 201320316587U CN 203378132 U CN203378132 U CN 203378132U
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Abstract
The utility model discloses a unit circuit board assembling structure comprising signal connecting pieces, fixing pieces and signal output pins. The unit circuit board assembling structure is characterized in that a unit circuit board is divided into two or more than two single boards. Each discrete single board is fixed via the fixing pieces in a vertically spacing way. The signal output pins are connected with the discrete single boards and arranged on a same vertical surface together with the connected discrete single boards. Signal connection between each discrete single board is realized via the signal connecting pieces. Under a condition of the same circuit area, distribution area of the unit circuit is effectively reduced. Compared with a single-in-line inserting type packaging structure, maximum size of the unit circuit is substantial substantially reduced. Compared with a single-in-line inserting type assembling structure without a shell, assembling stability of the unit circuit is substantially enhanced.
Description
Technical field
The utility model relates to a kind of circuit board assembly structure, particularly a kind of internal element circuit board assembly structure of module class product.
Background technology
Existing electronic equipment, basic compositional model is all that electronic device is connected on circuit board, then by board circuit, various devices is connected into to an integral body and realize certain function.For complicated large scale electronic equipment, tend to the partial function circuit is designed and produced into separately to a circuit unit and uses as electronic device of complete machine.Element circuit as herein described is the circuit unit structure that realizes independent function.The circuit board of component units circuit is the element circuit plate.Circuit unit is called to module through assembling and add the electronic device that the insulating material Reseal becomes.
Along with the development of electronic equipment, the miniaturization of product requires to improve constantly.The element circuit formed as electronic equipment is the continuous future development towards miniaturization also.Because the device of electronic equipment all is distributed on circuit board, when the height of device, when the maximum height of all fabric swatch devices is following, reducing the effective means that device takes up space is exactly the fabric swatch area that reduces device.The fabric swatch area here refers to device shared area on circuit board plane.Element circuit also is assembled on circuit board and is formed by electronic device.For the fabric swatch size of various package assemblies is described, realize for assembly ware the circuit area that the area of element circuit function is element circuit on the definition unit circuit board here.The relation of circuit area and fabric swatch area as shown in Figure 1.Circuit area is can be for the board area of cloth device on device A.The fabric swatch area is device A projection add the area that safe distance is shared on circuit board B, as shown in phantom in FIG..Owing to realizing that the required circuit area of element circuit function is substantially constant, therefore can judge by the fabric swatch size under contrast same circuits area the fabric swatch area utilization of various package assemblies.
Conventional element circuit package assembly is the dual inline type structure.The dual inline type structure as shown in Figure 2.The circuit area of this structure is in 2 times of the shared fabric swatch area of element circuit.The Typical Representative power module of element circuit product of take is example, and the brick series products package dimension of its standard defines according to the dual in-line package structure.The standard size of 1/8th brick power modules is 58mm * 23mm.Circuit area is 58 * 23 * 2=2668mm
2.For the smooth installation that guarantees the plug-in unit device and the electrical safety between each device, between each electronic device, can retain necessary safe space during the circuit board assembly ware.If in equipment, the required average safe distance of each device is 1mm, being equivalent to length and width respectively increases 2mm, and the fabric swatch area of 1/8th brick power modules is (58+2) * (23+2)=1500mm so
2.2668mm
2circuit area need 1500mm
2the fabric swatch area, such package assembly fabric swatch area utilization is very low.
In order to improve the utilance of fabric swatch area, reduce the volume of electronic equipment, the evolutionary approach occurred at present mainly contains two kinds: multilayer dual in-line package and single in-line packages.
Multilayer dual inline type structure is as shown in Fig. 3-1.The theory that this package assembly improves the fabric swatch area utilization is: the fabric swatch area of dual inline type product is very large, but element height is very low.By the stack on vertical height just can realize long-pending the reducing at same circuits area lower horizontal plane by circuit board, and then reduce the fabric swatch area of device.The problem that this assembling mode exists is: need to assemble electronic device on the circuit board of component units circuit, device itself also has certain area requirements, between device, also will be electrically connected reliably, and therefore the area of single circuit single plate can not infinitely dwindle.Because layering is more, the signal between circuit board connects and more is difficult to meet, so layering quantity is restricted.The package assembly of this form is infinitely layering in theory, but in fact generally only does the two-tier circuit plate, is no more than at most three layers.Therefore can not reduce fully the fabric swatch area.
Here 1/8th brick power modules being divided into to three layer circuit boards is the fabric swatch area that example is calculated multilayer dual inline type package assembly element circuit.In order to possess comparativity, do not change the circuit area of module here, each circuit board length and width size reduction is full-sized 0.577 times.At this moment circuit area is 0.577 * 58 * 0.577 * 23 * 2 * 3=2664.7mm
2, and original 2668mm
2substantially constant.The fabric swatch area is (0.577 * 58+2) * (0.577 * 23+2)=541.6mm
2.Fabric swatch area and original 1500mm
2had significantly and reduced.
With multilayer dual inline type structure, the utility model patent that application number is 200910307649.7 that also has of similar theory is arranged.As shown in Fig. 3-2, wherein related content is roughly taken passages as follows: when described electronic equipment can not hold the overall structure of described printed circuit board combination before not breaking into two with one's hands, for example the length of described electronic equipment can only be held a feature board 10 or at 20 o'clock, can break described two feature boards 10 and 20 into two with one's hands by the V groove, feature board 10 and 20 is overlapped, described two signal connectors 14 and 24 are coupled together by holding wire 300, then the correspondence position that described printed circuit board combination is positioned over described electronic equipment is got final product.This scheme is exactly in the situation that spatial area is inadequate a plate is divided into to two boards lays equal stress on to stack to put and realized reducing of requisite space area.This scheme is more limited for reducing the fabric swatch area.Here the circuit area of 1/8th brick power modules of take describes as example./ 8th stock mould pieces are divided into to two boards, and every plate length reduces by half, and width is constant, carries out overlapping up and down.At this moment circuit area is constant, but the fabric swatch area becomes (58 ÷ 2+2) * (23+2)=775mm
2.Although and original 1500mm
2certain reducing arranged, but effect is not as good as three layers of dual inline type structure.
Single row direct insert formula structure as shown in Figure 4.The theory that this package assembly improves the fabric swatch area utilization is: element circuit board plane area is very large, but thickness is very little.Why the fabric swatch area is very large for the dual inline type product, is because the area of plane of element circuit plate has taken most of fabric swatch area.If product is installed along element circuit plate lateral vertical, the fabric swatch area that element circuit is cast on circuit board so will dwindle greatly.At this moment the height of element circuit plate should be set as the maximum height that device allows, and by improving circuit board length, reaches required fabric swatch area.
The problem that this package assembly exists is: element circuit only is connected on circuit board by single-row pin, and therefore whole device can be along connecting axis oscillating, and as shown in Fig. 4-1, element circuit plate vertical equipment circuit board is fully fixed.In order to reduce element circuit plate tilt problem, need to install the shell mechanism as shown in Fig. 4-2 additional to the element circuit plate.By pin and the fixing problem that can effectively solve the inclination of element circuit plate of shell.Problem is to add the fabric swatch area of element circuit plate after casing also can be increased thereupon, and the actual cloth plate height of element circuit plate also can decrease.
Here do not add casing with the element circuit plate, the form that the circuit area of 1/8th brick power modules is designed to single row direct insert is example.The highest device of cloth plate height of general device is electrochemical capacitor, and the exemplary height of electrochemical capacitor is 20mm.Therefore select the maximum height of 20mm as device here.The circuit area of 1/8th bricks is 2668mm
2, so the area of element circuit plate is 2668 ÷ 2=1334mm
2.The length of element circuit plate should be designed to 1334 ÷ 20=66.7mm.The circuit board Thickness Design of general cell circuit board is 1.0mm.For the minimum fabric swatch area of single row direct insert formula product is discussed, suppose that the element circuit plate is used surface mounting component here, maximum height is 1mm.Therefore the thickness of element circuit plate is 3mm.Add the safe distance of device, the fabric swatch area of uncanned single row direct insert formula product is (3+2) * (66.7+2)=343.5mm
2.
If add casing to single row direct insert formula product, be designed to template pattern, the fabric swatch area of element circuit will further increase so.The circuit area of 1/8th bricks of still take is example.General outer casing thickness is 0.5mm, and shell and substrate command range are 0.5mm, and the element circuit plate height that adds so casing is 20-1=19mm.Element circuit plate length is 1334 ÷ 19=70.21mm.The length added after casing is 70.21+(0.5+0.5) * 2=72.21mm, width is 3+(0.5+0.5) * 2=5mm.Add the safe distance of device, the fabric swatch area of chlamydate single row direct insert formula product is (5+2) * (72.21+2)=519.47mm
2.
Above analysis is visible, although do not add the single row direct insert formula product of shell, does not possess less fabric swatch area, due to structural instability, must increase shell and just can be fixed on circuit board.Single row direct insert formula product adds after casing the increase due to width and length, with the fabric swatch area of multilayer dual inline type product big-difference too not.Can also find the another one problem that single row direct insert formula product exists in calculating.Due to height-limited system, under the prerequisite that requires the same circuits area, the length of element circuit plate will increase greatly.The circuit area of 1/8th bricks adds under casing needs 72.21mm long, the fabric swatch area that 5mm is wide.The size of equipment tends to be subject to the full-size of device to limit.Therefore the full-size of single row direct insert formula product can have a strong impact on reducing of equipment volume.
With the single in-line packages structure, the utility model patent that application number is 200920133442.8 that also has of similar theory is arranged.The problem that this utility model need to solve is upper for all be arranged on a PCB due to light source and drive circuit, causes the luminous element can't dense arrangement.Solution is for to be divided into two boards by drive circuit and luminous element and the vertical placement of drive circuit is connected on luminous element.Structure is as shown in Fig. 4-3, and 1 is luminous element, 2 circuit boards for the carrying luminous element, and 3 is light emission drive circuit, 2 ' is drive circuit bearer circuit plate.The printed circuit board (PCB) that the effect obtained is the carrying luminous element can not be subject to the impact of drive circuit width, and that can do is less, and it is tightr that luminous element is arranged, and the quantity on unit are can be more.This utility model is essentially by the vertical placement of drive circuit having been reduced to the fabric swatch area of drive circuit.Simultaneously by drive circuit and the overlapping placement of illuminating circuit have been reduced to the fabric swatch area again.The theory of the theory of overlapping placement and multilayer dual inline type package assembly is similar, just repeats no more the effect of its fabric swatch area here.
In sum, the problem that existing element circuit board assembling structure and evolutionary approach thereof exist is: under identical circuit area requires, the fabric swatch area is larger, and the fabric swatch area utilization is not high, is difficult to meet the electronic equipment requirement of miniaturization day by day.For single row direct insert formula package assembly, also exist full-size larger, hindered the problem of miniaturization design of electron equipment.For the single row direct insert formula package assembly that does not add casing, also exist Assembly stability poor, device is easily along the problem that connects axis oscillating.
The utility model content
The purpose of this utility model is to provide a kind of package assembly of element circuit plate, can effectively improve the fabric swatch area utilization of element circuit.
For solving the problems of the technologies described above, the utility model provides a kind of element circuit board assembling structure, comprise signal connector, fixture, signal output pin, described element circuit plate is discrete is the veneer more than two or two, and each discrete veneer is vertical interval through fixture to be fixed; Described signal output pin is connected on discrete veneer and be connected discrete veneer and is positioned on same perpendicular; Realize that by described signal connector signal connects between described each discrete veneer.
Preferably, fixture described in the utility model is the fit-type fixture block, the fixture block clear width is provided with caulking groove, each discrete veneer bilateral symmetry is provided with the groove laterally agreed with for described caulking groove, described fixture block is provided with two, symmetrical clamping is in each discrete veneer both sides, and described caulking groove laterally caters in groove, to fix the discrete veneer that respectively is vertical interval; Described signal connector is signal connecting line.
Further, the safe distance that the spacing distance of the inboard caulking groove of described fixture block is each discrete veneer.
Preferably, fixture described in the utility model is splicing ear, and splicing ear is at least two and be symmetrical arranged, and splicing ear laterally wears and is fixed in each discrete veneer both sides, to fix the discrete veneer that respectively is vertical interval.
Further, dispose the plastic cement piece that spacing limits on discrete veneer homonymy splicing ear, the plastic cement piece is located at respectively the two ends of homonymy splicing ear, and splicing ear is fixed on veneer through the plastic cement piece.
Further, between described each discrete veneer, be provided with elastic insulated pad, elastic insulated pad is connected on the splicing ear of discrete veneer both sides.
Further, described splicing ear is the conductivity splicing ear, and described conductivity splicing ear is simultaneously as signal connector, and the conductivity splicing ear fixedly is welded on each discrete veneer realizes that signal connects.
Preferably, signal connector described in the utility model is magnetic core magnetic coupling device, and magnetic core magnetic coupling device docks across insulation spacer at the veneer gap location; The size that insulation spacer thickness is the required air gap of magnetic core.
Preferably, fixture described in the utility model is the conduction connection folder that two ends are provided with jaws; Conduction connects folder and is at least two and be symmetrical arranged, and conduction connects folder and is fixed in each discrete veneer both sides through the horizontal clamping of jaws, to fix the discrete veneer that respectively is vertical interval; Described conduction connects folder and realizes that as signal connector each discrete single board signals connects simultaneously.
Preferably, fixture described in the utility model is to be provided with the substrate that covers the copper cabling, and the both sides of substrate are provided with draw-in groove separately; Each discrete veneer both sides correspondence is provided with and the mutually complementary chimeric draw-in groove in substrate both sides, and described substrate is provided with two, is embedded in each discrete veneer both sides, to fix the discrete veneer that respectively is vertical interval; Described substrate is simultaneously as signal connector; The copper cabling that covers on substrate realizes that each discrete single board signals connects.Why existing single row direct insert formula package assembly can not realize effective compression of fabric swatch area, its essence is because single row direct insert formula structure needs very large device clearance space.The circuit area of 1/8th brick power modules in background technology of take is example, and the projected area of single row direct insert product device on the circuitry plate of casing is not 66.7 * 3=200.1mm
2, and the fabric swatch area of actual needs is 343.5mm
2.The projected area of single row direct insert product device on the circuitry plate that adds casing is 70.21 * 3=210.63mm
2, and the fabric swatch area of actual needs is 519.47mm
2.
The utility model is based on single row direct insert formula package assembly.By single circuit board being divided into to the polylith circuit board, original circuit board space distance is cut apart.As shown in Figure 5, in three layer cross sections that solid line means, intermediate layer is circuit board thickness, and two-layer on limit is the cloth board space of device on veneer, and the space surrounded between solid line and dotted line is the safe distance that element circuit has.By original circuit board be divided into A and B two-layer after, the circuit board safe distance is also cut apart.As shown in Fig. 5-1, the overall space length of element circuit plate has increased a and b.After circuit board A and B are processed by the circuit board fixation structure lamination is fixing, under two circuit boards, safe distance is also thereupon overlapping.And overlapping safe distance can not repeat to take the fabric swatch area, this has just compressed the fabric swatch area of element circuit.As shown in Fig. 5-2, in figure, space C is the element circuit fabric swatch area reduced after compression.Due to fixed structure control circuit distance between plates being arranged between every circuit board, make the machining accuracy of every circuit board spacing greatly improve, the space length of permission shortens greatly.Therefore the spacing between the element circuit plate is as long as meet the functional insulation between two circuit boards.The air gap of 1mm can meet the insulating requirements of 420V under normal circumstances, can meet the functional insulation requirement between most of circuit.Preferably, if add the insulation spacer that 0.1mm is thick between every circuit board, with current insulating material design level of processing, the insulation that meets 420V is also no problem.This has shortened to 0.1mm with regard to the space length that makes two module unit circuit boards.This with every plate 1mm under normal circumstances altogether the spacing of 2mm require to compare greatly and shorten.In the parameter analysis of background technology, can see, the length of single row direct insert formula product is far longer than its width, therefore the element circuit plate is cut apart to the fabric swatch area a+b increased after lamination and be far smaller than the fabric swatch area c reduced, so the element circuit plate is cut apart after lamination to the fabric swatch area that has reduced generally element circuit.
From in essence, the utility model by circuit board cut apart, between circuit board fixation structure and plate insulating trip compressed device pitch in single row direct insert formula element circuit board assembling structure from, realized reducing of fabric swatch area.While, because circuit board cuts apart, makes the full-size of original single row direct insert formula package assembly effectively reduce.Owing to there being fixed structure to fix between multilayer circuit board, can the signal output pin all be installed on every layer circuit board, make the structural stability of product greatly improve.
In the utility model, need to use circuit board fixation structure to realize fixing between circuit board, use signal connection structure to realize the signal communication between the element circuit plate.Although, although that the area that these two structures take on circuit board is compared with the gross area is very little, still can increases the circuit area of element circuit, and then increase required fabric swatch area.If use the terminal linkage unit circuit board with certain structural stability and conductivity, can reduce structure devices, two plates are connected to shared circuit area and be reduced to minimum.Therefore the terminal that has certain structural stability and conductivity by use is realized described signal connection structure and described circuit board fixation structure function simultaneously, can further improve the beneficial effects of the utility model.
In the utility model, need to realize fixing between the element circuit plate by circuit board fixation structure.Wherein realize that between the element circuit plate, effective control of spacing is the key that reduces the circuit board components spacing, realizes the utility model content.At the utility model, use terminal to carry out between circuit board in the fixing scheme be connected with signal of structure, if dispose a spacing limiting structure on terminal, the spacing between two plates can effectively be processed by the spacing limiting structure.Therefore configure the difficulty of processing that a spacing limiting structure can effectively reduce the utility model product on terminal.
Because the element circuit plate is to be divided into the polylith circuit board by original single circuit board, therefore may need to have a lot of signal connecting terminals between two circuit boards in the utility model.The docking difficulty of circuit board and signal terminal when this will increase by two plates connections.If using two plastic cement structures moulds many splicing ears to be fitted together and, by the structure pitch of spacing setting for needing between the element circuit plate between two plastic cement structures, just can to effectively reduce the assembly difficulty of terminal.Because the spacing between two plastic cement structures can be processed easily, reduced the processing of spacing limiting structure on the terminal and regulated difficulty simultaneously.
In the utility model, in order effectively to realize the design of isolated product, reduce as far as possible the requisite space that insulate, signal connection structure can be realized by magnetic coupling.Conventional circuit isolation is all to reserve enough insulating tapes to carry out electric insulation on circuit board.This mode takies the circuit area of circuit board for the miniaturization product very much.But two parts circuit that needs electrical isolation in the utility model can be distinguished cloth on two different circuit boards, and carry out the signal transmission by magnetic coupling between two circuit boards, this just can eliminate the insulating tape on circuit board, effectively reduces circuit area, and then reduces the fabric swatch area.
In the utility model, if use circuit board as fixed structure between circuit board and signal connection structure, can further expand the circuit space of product.By the circuit board of appropriate design fixed structure and the dimension scale between original circuit single plate, structure that can the flexible design element circuit, reduce the fabric swatch area of element circuit.
Compared to the prior art, remarkable beneficial effect of the present utility model is: under identical circuit area, the fabric swatch area of element circuit effectively reduces.With the single in-line packages structure, compare, the full-size of element circuit significantly reduces.With the single row direct insert formula package assembly without shell type, compare, the Assembly stability of element circuit is significantly improved.
The accompanying drawing explanation
Fig. 1 is circuit area and fabric swatch area relationship schematic diagram.
Fig. 2 is existing dual inline type element circuit plate assembling mode schematic diagram.
Fig. 3-1 is existing multilayer dual inline type element circuit plate assembling mode schematic diagram.
The mode illustration is assembled for the circuit board of the utility model patent design that application number is 200910307649.7 in Fig. 3-2.
Fig. 4 is existing single row direct insert formula element circuit plate assembling mode schematic diagram.
The single row direct insert formula circuit board assembling mode structure inclination schematic diagram that Fig. 4-1 is not casing.
Fixedly schematic diagram of mode structure is assembled for single row direct insert formula circuit board after adding casing in Fig. 4-2.
The utility model patent device assembling mode illustration that Fig. 4-3 are 200920133442.8 for application number.
Fig. 5-1 is single row direct insert formula package assembly circuit board cross section and safe distance schematic diagram thereof.
The schematic diagram that increases safe distance a and b after plate is divided for single row direct insert formula package assembly in Fig. 5-2.
The schematic diagram that reduces safe distance c is divided after the plate lamination for single row direct insert formula package assembly in Fig. 5-3.
Fig. 6-1 is the utility model the first embodiment element circuit plate assembling mode vertical view.
Fig. 6-2 are the utility model the first embodiment element circuit plate assembling mode end view.
Fig. 6-3 are the utility model the first embodiment circuit single plate end view used and fixed structure perspective view.
Fig. 6-4 are the utility model the first embodiment circuit board fixation structure vertical view used.
Fig. 7-1 is the utility model the second embodiment element circuit board assembling structure schematic diagram.
Fig. 7-2 are the utility model the second embodiment element circuit board assembling structure vertical view.
Fig. 7-3 are the utility model the second embodiment element circuit board assembling structure insulation spacer end view.
Fig. 8-1 is the utility model the 3rd embodiment element circuit board assembling structure vertical view.
Fig. 8-2 are the utility model the 3rd embodiment element circuit board assembling structure circuit single plate structural representation.
Fig. 8-3 are the utility model the 3rd embodiment element circuit board assembling structure insulation spacer structural representation.
Fig. 8-4 are that the utility model the 3rd embodiment element circuit board assembling structure increases the board layer schematic diagram.
Fig. 9-1 is the utility model the 4th embodiment element circuit board assembling structure vertical view.
Fig. 9-2 are the utility model the 4th embodiment element circuit board assembling structure end view.
Figure 10-1 is the utility model the 5th embodiment element circuit board assembling structure end view.
Figure 10-2 are the utility model the 5th embodiment element circuit board assembling structure vertical view.
The circuit single plate structural representation that Figure 10-3 are the utility model the 5th embodiment element circuit board assembling structure.
The fixed structure circuit board schematic diagram that Figure 10-4 are the utility model the 5th embodiment element circuit board assembling structure.
Figure 10-5 are that the utility model the 5th embodiment is at high capacitance and high metal-oxide-semiconductor lower unit circuit board assembly structure vertical view.
Figure 10-6 are that the utility model the 5th embodiment is at high transformer lower unit circuit board assembly structure vertical view.
Embodiment
Embodiment mono-
As in Figure 6-1, end view is as shown in Fig. 6-2 for the utility model the first embodiment vertical view.The element circuit plate of the first embodiment comprises three veneers 1 that are vertical interval, and the end view of every veneer is as shown in Fig. 6-3.The both sides of circuit board are with the groove 2 of a symmetry.The degree of depth of groove equals the size C of circuit board fixation structure.The thickness that the length D of groove is the circuit board fixation structure part.The circuit board fixation structure part comprises the fit-type fixture block 3 of two band flutings, and the vertical view of each fixture block 3 is as shown in Fig. 6-4.Each fixture block clear width has three caulking grooves 4, and wherein the width of caulking groove 4 equals the thickness of circuit single plate.The degree of depth of the caulking groove needs fixing according to circuit board are chosen.In circuit board fixation structure, the distance of caulking groove is exactly the distance between circuit single plate.Two symmetrical clampings of fixture block are in each discrete veneer both sides, and the caulking groove 4 on fixture block laterally agrees with the groove 2 of each discrete veneer, realizes that the structure of element circuit is fixed.During assembling, circuit board fixation structure is assembled with shown in 6-4, two planes are vertical according to Fig. 6-3 with circuit board.Be equipped with signal connecting line between every circuit board and realize that the signal between circuit board connects.Signal output part and the stiff end of the signal output pin parallel with circuit single plate as element circuit all can be set on every circuit board.
For the improve effect of the utility model the first embodiment for element circuit fabric swatch area is described, the technical parameter of background technology of take here is that example analyzes the utility model the first embodiment.According to the background technology parameter, the thickness of circuit board is chosen 1mm.On circuit single plate, the maximum height of device is 1mm.It is that 1/8th brick power supply fabric swatch areas are 2668mm that the circuit area of element circuit plate requires
2.The maximum height of element circuit is designed to 20mm.
In the utility model the first embodiment, need to increase extra size and realize that structure between circuit board is fixing and be connected with signal.Here be each signal connecting line design 2 * 2=4mm
2bonding pad area for the welding.As in Figure 6-1, the first embodiment has designed 16 holding wire pads, altogether increases circuit area 4 * 16=64mm
2.Because circuit board need to partly be stuck in circuit board fixation structure 3, therefore can increase extra fabric swatch area.Circuit board fixation structure at the area occupied on circuit single plate as shown in the dashed rectangle in Fig. 6-3.The thickness that the length of square frame is fixed structure, equal circuit board slotting length D.The wide of square frame is the size B of fixed structure.Design size B is 3mm, and C is 2mm, and D is 3mm.At this moment the circuit area that circuit board fixation structure occupies is 3 * 3 * 12=108mm
2.Element circuit required circuit area altogether is 2668+64+108=2840mm
2.The length of element circuit is 2840 ÷ 2 ÷ 3 ÷ 20=23.67mm.Distance between the design circuit veneer is 1mm, and the width of element circuit is 3+3+3+1+1=11mm.Add the safe distance of element circuit, the fabric swatch area of the utility model the first embodiment scheme is (23.67+2) * (11+2)=333.71mm
2.
Aspect the fabric swatch area, the utility model the first embodiment is a little less than not with the single row direct insert scheme of shell, remarkable in the single row direct insert formula package assembly with shell and multilayer dual inline type package assembly.For single row direct insert formula package assembly, the full-size of the utility model the first embodiment has obtained significant reduction.Because the signal output pin can be arranged on according to square rock-steady structure on two circuit single plates, the utility model the first embodiment has obtained significant raising with respect to the assembling stable type with the single row direct insert formula package assembly of shell not.Because there is structural unstable problem in the single row direct insert formula package assembly that does not add shell and does not possess actual application value, the described scheme of the utility model the first embodiment can effectively improve the fabric swatch area utilization of element circuit in actual applications.
Embodiment bis-
The utility model the second embodiment is as shown in Fig. 7-1, and its vertical view is as shown in Fig. 7-2.The circuit board of the second embodiment comprises two circuit single plates 1.On every veneer, both sides have respectively two via holes 5 to can be used for solder terminal.The circuit board fixation structure part comprises that symmetry is fixed on two pairs of conductivity splicing ears 6 of veneer both sides, dispose the plastic cement piece 7 that spacing limits on discrete veneer homonymy splicing ear, plastic cement piece 7 is located at respectively the two ends of homonymy splicing ear, splicing ear is fixedly welded on veneer through the plastic cement piece, and two butt of homonymy are fixed together by two plastic cement pieces.During assembling, two butt of each circuit board fixation structure are horizontally through simultaneously and are welded on veneer two via holes on one side, are fixed in each discrete veneer both sides.Between the outer edge of homonymy two plastic cement pieces, distance is circuit board spacing.Because terminal possesses electric conductivity, can play the function that circuit board signal connects simultaneously.On the terminal in the middle of the circuit board fixation structure plastic cement, card has an elastic insulated pad 8, plays the function of two veneers of isolation.The end view of elastic insulated pad 8 is as shown in Fig. 7-3.Signal output part and the stiff end of the signal output pin parallel with circuit single plate as element circuit all can be set on every circuit board.
For the improve effect of the utility model the second embodiment for element circuit fabric swatch area is described, same technical parameter of take background technology is that example is analyzed the utility model the second embodiment here.According to the background technology parameter, the thickness of circuit board is chosen 1mm.On circuit single plate, the device maximum height is 1mm.It is that 1/8th brick power supply fabric swatch areas are 2668mm that element circuit plate circuit area requires
2.The maximum height of element circuit is designed to 20mm.
Needing the extra circuit area increased in the utility model the second embodiment is the circuit area that circuit board fixation structure takies.The length of design circuit board fixing structure plastic cement is 10mm, and width is 2mm, and plastic cement area occupied on veneer is 10 * 2 * 4=80mm
2.The pad size of design terminal on veneer is 2mm * 2mm.Terminal pad shared area on veneer is 2 * 2 * 8=32mm so
2.Therefore the required circuit area altogether of the utility model the second embodiment is 2668+80+32=2708mm
2.The length of element circuit plate is 2708 ÷ 20 ÷ 2 ÷ 2=33.85mm.Due to the insulation spacer isolation being arranged between two circuit single plates, the spacing that therefore can design two circuit single plates is 0.2mm.At this moment the width of element circuit is 3+3+0.2=6.2mm.Add the safe distance of element circuit, the fabric swatch area of the utility model the second embodiment scheme is (33.85+2) * (6.2+2)=293.97mm
2.
Visible by above analysis, the utility model the second embodiment is for existing element circuit board assembling structure, and the utilance of fabric swatch area has obtained significant raising.For single row direct insert formula package assembly, the full-size of the utility model the second embodiment has obtained significant reduction.Because the signal output pin can be arranged on according to square rock-steady structure on two circuit single plates, the utility model the second embodiment has obtained significant raising with respect to the assembling stable type with the single row direct insert formula package assembly of shell not.Because the second embodiment all realizes circuit board fixation structure and signal connection structure by terminal, make the circuit area of element circuit plate reduce to 2708mm
2, and the 2840mm of the first embodiment phase
2compare certain reduction has been arranged.Owing to having used the insulation plastic cement to limit circuit board spacing and having used two circuit boards of insulation spacer isolation, make the spacing of two circuit single plates be contracted to 0.2mm, effectively reduce the final fabric swatch area of element circuit.
Embodiment tri-
The vertical view of the utility model the 3rd embodiment is as shown in Fig. 8-1, and this scheme is used in the element circuit of electrical isolation requirement.The element circuit plate of the 3rd embodiment comprises two circuit single plates.The end view of every circuit single plate is as shown in Fig. 8-2.Four angles of veneer are respectively to there being four via holes 9, and centre has three square through holes 10.The plastic terminal 11 that the circuit board fixation structure part is four eradication edge.During assembling, with four plastic terminals, be connected to respectively on four via holes corresponding to four angles of veneer.The signal connection structure part is a pair of E type magnetic core 12.Three center pillars of magnetic core dock across insulation spacer 8 through veneer and at the veneer gap location by the via hole of two veneers respectively.Between two veneers and magnetic core, there is an insulation spacer to realize the veneer isolation.Insulation spacer be stuck on four plastic terminals of circuit board fixation structure and and magnetic core fully bonding.The end view of insulation spacer is as shown in Fig. 8-3.Because insulation spacer thickness can be designed to the size of the required air gap of magnetic core, therefore two veneers can pass through the reliable signal transmission of magnetic core.Signal output part and the stiff end of the signal output pin parallel with circuit single plate as element circuit all can be set on every circuit board.
The 3rd embodiment is due to the cloth plate structure that has changed circuit, therefore can not be simple contrast corresponding fabric swatch area according to circuit area.Below be arranged on a veneer and realize that with metal terminal existing magnetic core mounting means and the 3rd embodiment scheme that signal connects carry out the beneficial effect that comparative illustration is used magnetic core to carry out the signal connection by the magnetic core by the 3rd embodiment.
In order to have more contrast, the design magnetic core adopts the assembling mode of flat surface transformer, and the area coverage of flat surface transformer on veneer is 5mm * 10mm=50mm
2, the element circuit isolation voltage is the 3000V DC break down voltage.If flat surface transformer is arranged on a veneer by existing mode, on veneer, the electrical distance at isolation two ends at least will design 3mm so.According to the veneer height, be that 20mm calculates, the circuit area designed for electrical isolation on veneer is at least 20 * 3 * 2=120mm
2.Because the two-tier circuit plate all will be isolated, so the required area of electrical isolation is total up to 240mm
2.The circuit area that magnetic core of transformer takies is 50 * 2=100mm
2.The magnetic core assembling scheme of the 3rd embodiment all accounts for circuit area on two veneers, but all there is no the insulation distance requirement on every veneer.Therefore the circuit area that the 3rd embodiment magnetic core takies is 50 * 4=200mm
2.The shared circuit area of the magnetic core of visible the 3rd embodiment and electric insulation is less than existing mounting means.Along with the raising of element circuit isolation voltage, the electrical distance of isolating two ends under existing mounting means on veneer can increase thereupon, and the shared circuit area of electric insulation also can increase.Lower need of the 3rd embodiment scheme increase the isolation strength of insulation spacer, just can increase easily the isolation voltage of product.Therefore in the element circuit of high isolation design is carried out in the coupling of use magnetic core, the utility model the 3rd embodiment can effectively reduce the needed circuit area of isolation, and then reduces the fabric swatch area of element circuit.
In the application of using flat surface transformer, the element circuit isolation two ends winding of the utility model the 3rd embodiment is wound on respectively on two veneers, need the isolated windings of coiling simultaneously and have now on veneer of scheme, therefore under identical magnetic core area, the utility model the 3rd embodiment scheme can effectively reduce cell board thickness.Further, after the dashed rectangle place as shown in Fig. 8-4 superposes extra circuit board, under identical magnetic core area, the required veneer thickness of coiling same number of turns can also further reduce.And, in embodiment of the present utility model, the thickness that has reduced circuit board just means the fabric swatch area that has reduced product.
Visible by above analysis, in the application of electrical isolation is carried out in the coupling of use magnetic core, on the basis of element circuit board assembling structure of the present utility model, use the magnetic core magnetic coupling to realize signal transmission between circuit board, can further improve the fabric swatch area of element circuit.
Embodiment tetra-
The utility model the 4th embodiment vertical view is as shown in Fig. 9-1, and end view is as shown in Fig. 9-2.The circuit board of the 4th embodiment comprises two veneers.The veneer material is ceramic substrate.Two ceramic substrates are fixed by the circuit board fixation structure device shown in Fig. 9-1, and immobilising device is the conduction connection folder 14 that two ends are provided with jaws 13.Each element circuit comprises 6 circuit board holder parts, two ceramic substrate both sides symmetries, respectively blocks three, and conduction connects folder and is fixed in each discrete veneer both sides through the horizontal clamping of jaws, to fix the discrete veneer that respectively is vertical interval.Conduction connects folder 14 for using metal material to make, and realizes the function that between circuit board, signal connects simultaneously.Signal output part and the stiff end of the signal output pin parallel with circuit single plate as element circuit all can be set on every circuit board.Owing to finalizing the design by the structure of using the structural member fixing circuit board to complete element circuit in the utility model, under the effect of extraneous stress, circuit board can bear larger effect of stress.Therefore need to improve circuit board thickness to reach the Stability Analysis of Structures of element circuit in the conceptual design of larger circuit area.Circuit board in the utility model embodiment tetra-has adopted ceramic substrate, with other circuit board materials such as FR4, compares and has stable structure more, can effectively reduce circuit board thickness.Easier integrated thick-film circuit on ceramic substrate, further reduce element height simultaneously.Therefore use ceramic substrate can further improve fabric swatch area utilization of the present utility model as circuit board of the present utility model.
Embodiment five
The utility model the 5th embodiment end view is as shown in Figure 10-1, and vertical view is as shown in Figure 10-2.The circuit board of the 5th embodiment comprises two circuit single plates 1, and every circuit single plate both sides are distributed with rectangle draw-in groove 15, and end view is as shown in Figure 10-3.Circuit board fixation structure also comprises two substrates with the rectangle draw-in groove 16, and as shown in Figure 10-4, substrate has the copper of covering cabling.The rectangle draw-in groove 17 of fixing base both sides and the draw-in groove 15 of veneer are complementary structure.During assembling, two veneers and two fixed structure substrates are embedded respectively and connect to form the square structure shown in 10-2 along draw-in groove, to fix the discrete veneer that respectively is vertical interval.After connection, need base plate for fixing and circuit single plate are carried out to soldering.The 5th embodiment is by the function that between copper cabling and two veneers of connection welding implementation, signal connects of covering on the fixed structure substrate.Signal output part and the stiff end of the signal output pin parallel with circuit single plate as element circuit all can be set on every circuit single plate.In the utility model the 5th embodiment, use circuit board as the circuit single plate fixed structure, circuit board as fixed structure still can carry out circuit trace and device installation simultaneously, this has just improved the flexibility of circuit fabric swatch greatly, be conducive to element circuit according to device structure design circuit board size, reduce circuit fabric swatch area.In power module, application the utility model is designed to example.Having three higher devices in power module is metal-oxide-semiconductor, input electrochemical capacitor and output electrochemical capacitor.At this moment can carry out fabric swatch according to the mode shown in Figure 10-5, electrochemical capacitor is arranged on respectively on the circuit board of fixed structure, metal-oxide-semiconductor is arranged on the gap of two electrochemical capacitors.If low power flyback power circuit, the devices such as electric capacity and metal-oxide-semiconductor all can be used surface-mounted device, only have the volume of transformer to be difficult to dwindle.At this moment can carry out fabric swatch according to the mode shown in Figure 10-6, take full advantage of two sheet separations of being raised by transformer and carry out the circuit fabric swatch.The utility model the 5th embodiment adopts circuit board can improve greatly the fabric swatch flexibility under the utility model element circuit plate assembling mode as the fixing signal connection structure that reaches of circuit single plate as can be seen here, reduces fully the fabric swatch area of element circuit.
Execution mode of the present utility model is not limited to this; according to foregoing of the present utility model; utilize ordinary skill knowledge and the customary means of this area; do not breaking away under the above-mentioned basic fundamental thought of the utility model prerequisite; the utility model can also be made modification, replacement or the change of other various ways, within all dropping on the utility model rights protection scope.
Claims (10)
1. an element circuit board assembling structure, comprise signal connector, fixture, signal output pin, it is characterized in that: described element circuit plate is discrete is the veneer more than two or two, and each discrete veneer is vertical interval through fixture to be fixed; Described signal output pin is connected on discrete veneer and be connected discrete veneer and is positioned on same perpendicular; Realize that by described signal connector signal connects between described each discrete veneer.
2. element circuit board assembling structure according to claim 1, it is characterized in that: described fixture is the fit-type fixture block, the fixture block clear width is provided with caulking groove, each discrete veneer bilateral symmetry is provided with groove, described fixture block is provided with two, symmetrical clamping is in each discrete veneer both sides, and described caulking groove laterally caters in groove, to fix the discrete veneer that respectively is vertical interval; Described signal connector is signal connecting line.
3. element circuit board assembling structure according to claim 2, is characterized in that: the safe distance that the spacing distance of the inboard caulking groove of described fixture block is each discrete veneer.
4. element circuit board assembling structure according to claim 1, it is characterized in that: described fixture is splicing ear, splicing ear is at least two and be symmetrical arranged, and splicing ear laterally wears and is fixed in each discrete veneer both sides, to fix the discrete veneer that respectively is vertical interval.
5. element circuit board assembling structure according to claim 4, it is characterized in that: dispose the plastic cement piece that spacing limits on discrete veneer homonymy splicing ear, the plastic cement piece is located at respectively the two ends of homonymy splicing ear, and splicing ear is fixed on veneer through the plastic cement piece.
6. element circuit board assembling structure according to claim 5, it is characterized in that: be provided with elastic insulated pad between described each discrete veneer, elastic insulated pad is connected on the splicing ear of discrete veneer both sides.
7. element circuit board assembling structure according to claim 4, it is characterized in that: described splicing ear is the conductivity splicing ear, described conductivity splicing ear is simultaneously as signal connector, and the conductivity splicing ear fixedly is welded on each discrete veneer realizes that signal connects.
8. element circuit board assembling structure according to claim 4, it is characterized in that: described signal connector is magnetic core magnetic coupling device, and magnetic core magnetic coupling device docks across insulation spacer at the veneer gap location; The size that insulation spacer thickness is the required air gap of magnetic core.
9. circuit board assembly structure according to claim 1 is characterized in that: described fixture is that the conduction that two ends are provided with jaws connects folder; Conduction connects folder and is at least two and be symmetrical arranged, and conduction connects folder and is fixed in each discrete veneer both sides through the horizontal clamping of jaws, to fix the discrete veneer that respectively is vertical interval; Described conduction connects folder and realizes that as signal connector each discrete single board signals connects simultaneously.
10. circuit board assembly structure according to claim 1, it is characterized in that: described fixture is to be provided with the substrate that covers the copper cabling, and the both sides of substrate are provided with draw-in groove separately; Each discrete veneer both sides correspondence is provided with and the mutually complementary chimeric draw-in groove in substrate both sides, and described substrate is provided with two, is embedded in each discrete veneer both sides, to fix the discrete veneer that respectively is vertical interval; Described substrate is simultaneously as signal connector, and the copper cabling that covers on substrate realizes that each discrete single board signals connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320316587.8U CN203378132U (en) | 2013-06-03 | 2013-06-03 | Unit circuit board assembling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320316587.8U CN203378132U (en) | 2013-06-03 | 2013-06-03 | Unit circuit board assembling structure |
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| Publication Number | Publication Date |
|---|---|
| CN203378132U true CN203378132U (en) | 2014-01-01 |
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ID=49840632
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320316587.8U Expired - Lifetime CN203378132U (en) | 2013-06-03 | 2013-06-03 | Unit circuit board assembling structure |
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| CN (1) | CN203378132U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281862A (en) * | 2013-06-03 | 2013-09-04 | 广州金升阳科技有限公司 | Unit circuit board assembly structure |
| WO2018072532A1 (en) * | 2016-10-17 | 2018-04-26 | 匡海云 | Mounting structure of circuit board |
| CN110213929A (en) * | 2019-06-20 | 2019-09-06 | 深圳市汇川技术股份有限公司 | Intelligent power module circuit plate encapsulating structure |
-
2013
- 2013-06-03 CN CN201320316587.8U patent/CN203378132U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281862A (en) * | 2013-06-03 | 2013-09-04 | 广州金升阳科技有限公司 | Unit circuit board assembly structure |
| WO2018072532A1 (en) * | 2016-10-17 | 2018-04-26 | 匡海云 | Mounting structure of circuit board |
| CN110213929A (en) * | 2019-06-20 | 2019-09-06 | 深圳市汇川技术股份有限公司 | Intelligent power module circuit plate encapsulating structure |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140101 |