CN206452611U - Multi-layer flexible circuit board - Google Patents
Multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN206452611U CN206452611U CN201720098430.0U CN201720098430U CN206452611U CN 206452611 U CN206452611 U CN 206452611U CN 201720098430 U CN201720098430 U CN 201720098430U CN 206452611 U CN206452611 U CN 206452611U
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- spacer sleeve
- pars intermedia
- layer
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model is related to circuit board technology field, more particularly to a kind of multi-layer flexible circuit board.A kind of multi-layer flexible circuit board of the present utility model, including：The multiple flexible circuit Slab elements being stacked；It is provided through being provided with connecting pole in multiple mounting holes of flexible circuit Slab element upper and lower surface, the mounting hole of multiple flexible circuit Slab elements in flexible circuit Slab element；Spacer sleeve is provided between two neighboring flexible circuit Slab element, spacer sleeve includes pars intermedia and is connected to the end of pars intermedia upper and lower ends, and the external diameter of end is less than the external diameter of pars intermedia, and spacer sleeve is provided centrally with through hole；Spacer sleeve is sheathed on outside connecting pole；Formed between the pars intermedia and flexible circuit Slab element of spacer sleeve in annular groove, annular groove and be provided with ring washer, by connecting pole, multiple flexible PCB units are stacked, it is simple in construction and higher with reference to precision.
Description
Technical field
The utility model is related to circuit board technology field, more particularly to a kind of multi-layer flexible circuit board.
Background technology
The core of liquid crystal display is display chip circuit board, in order to improve the performance and structure of circuit board, is generally used
Rigid PCB adds flexibility FPC circuit boards, it is had PCB intensity and FPC pliability concurrently, to improve wiring density
With assembling flexibility.The circuit board of multilayer is bonded into one for this current liquid crystal chip, plating copper technology by Microvia will
The copper foil circuit connection of each aspect, so as to improve the structural strength and wiring density of pcb board.But existing multi-layer flexible circuit
The problem of generally there is complicated and relatively low combination precision in plate.
Therefore, it is necessary to a kind of multi-layer flexible circuit board be provided, to solve the above problems.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of multi-layer flexible circuit board, soft to solve existing multilayer
Property board structure of circuit it is complicated and combine the problem of precision is relatively low.
In order to solve the above technical problems, the technical solution adopted in the utility model is：
A kind of multi-layer flexible circuit board, including：The multiple flexible circuit Slab elements being stacked；The flexible PCB list
Multiple mounting holes of the flexible circuit Slab element upper and lower surface are provided through in member, the multiple flexible circuit Slab element
Connecting pole is provided with mounting hole；Spacer sleeve is provided between two neighboring flexible circuit Slab element, during the spacer sleeve includes
Between portion and be connected to the ends of the pars intermedia upper and lower ends, the external diameter of the end is less than the external diameter of the pars intermedia, described
Spacer sleeve is provided centrally with through hole；The spacer sleeve is sheathed on outside the connecting pole；The pars intermedia of the spacer sleeve with it is described
Formed between flexible circuit Slab element and ring washer is provided with annular groove, the annular groove, outside the ring washer
Footpath is more than the external diameter of the pars intermedia of the spacer sleeve；
The flexible circuit Slab element includes flexible base board, the first copper foil layer being arranged on the flexible base board, set
In the tack coat on first copper foil layer, the second copper foil layer being arranged on the tack coat, and it is arranged at described second
Polyimide layer on copper foil layer；It is provided with the tack coat in via, the via and is provided with metal needle, the metal needle
Upper and lower side be in contact respectively with first copper foil layer and second copper foil layer.
The metal needle is riveted in the via.
The height of the spacer sleeve is more than the thickness of the flexible base board and the polyimide layer.
The utility model is had the advantage that with effect：
A kind of multi-layer flexible circuit board of the present utility model, including：The multiple flexible circuit Slab elements being stacked；It is flexible
Multiple mounting holes of flexible circuit Slab element upper and lower surface are provided through in circuit board unit, multiple flexible circuit Slab elements
Connecting pole is provided with mounting hole；Spacer sleeve is provided between two neighboring flexible circuit Slab element, spacer sleeve includes pars intermedia
With the end for being connected to pars intermedia upper and lower ends, the external diameter of end is less than the external diameter of pars intermedia, and spacer sleeve is provided centrally with through hole；
Spacer sleeve is sheathed on outside connecting pole；Annular groove is formed between the pars intermedia and flexible circuit Slab element of spacer sleeve, annular is recessed
Ring washer is provided with groove, the external diameter of ring washer is more than the external diameter of the pars intermedia of spacer sleeve；Flexible circuit Slab element includes
Flexible base board, the first copper foil layer being arranged on flexible base board, the tack coat being arranged on the first copper foil layer, it is arranged at tack coat
On the second copper foil layer, and the polyimide layer being arranged on the second copper foil layer；It is provided with via, via and sets on tack coat
Metal needle is equipped with, the upper and lower side of metal needle is in contact with the first copper foil layer and the second copper foil layer respectively；To be many by connecting pole
Individual flexible PCB unit is stacked, simple in construction and higher with reference to precision.
Brief description of the drawings
The utility model is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is a kind of cross-sectional view of multi-layer flexible circuit board of the present utility model；
Fig. 2 is the close-up schematic view of a-quadrant in Fig. 1.
In figure：Flexible base board 1, the first copper foil layer 2, tack coat 3, the second copper foil layer 4, polyimide layer 5, via 6, metal
Pin 7, mounting hole 8, connecting pole 9, flexible circuit Slab element 10, spacer sleeve 11, ring washer 12, annular groove 13, through hole 14.
Embodiment
As shown in Figure 1 to Figure 2, the utility model provides a kind of multi-layer flexible circuit board, including：What is be stacked is multiple soft
Property circuit board unit 10；The upper and lower surface of flexible circuit Slab element 10 is provided through in the flexible circuit Slab element 10
Connecting pole 9 is provided with multiple mounting holes 8, the mounting hole 8 of the multiple flexible circuit Slab element 10.Multiple flexible PCB lists
Member 10 is connected by connecting pole 9.Spacer sleeve 11, the spacer sleeve are provided between two neighboring flexible circuit Slab element 10
11 include pars intermedia and are connected to the end of the pars intermedia upper and lower ends, and the external diameter of the end is less than the outer of the pars intermedia
Footpath, the spacer sleeve 11 is provided centrally with through hole 14；The spacer sleeve 11 is sheathed on outside the connecting pole 9；The spacer sleeve
Formed between 11 pars intermedia and the flexible circuit Slab element 10 in annular groove 13, the annular groove 13 and be provided with annular
Packing ring 12, the external diameter of the ring washer 12 is more than the external diameter of the pars intermedia of the spacer sleeve 11.The flexible circuit Slab element
10 include flexible base board 1, the first copper foil layer 2 being arranged on the flexible base board 1, are arranged on first copper foil layer 2
Tack coat 3, the second copper foil layer 4 being arranged on the tack coat 3, and the polyamides being arranged on second copper foil layer 4 are sub-
Amine layer 5；It is provided with the tack coat 3 in via 6, the via 6 and is provided with metal needle 7, the upper and lower side point of the metal needle 7
It is not in contact with first copper foil layer 2 and second copper foil layer 4, for turning on the first copper foil layer 2 and second bronze medal
Layers of foil 4.The metal needle 7 is riveted in the via 6.The height of the spacer sleeve 11 is more than the flexible base board 1 and institute
State the thickness of polyimide layer 5.
As known from the above, multi-layer flexible circuit board of the present utility model, by connecting pole 9, by multiple flexible PCB lists
Member 10 is stacked, simple in construction and higher with reference to precision.
The utility model is not limited to above-described embodiment, and embodiment is exemplary, it is intended to for explaining that this practicality is new
Type, and it is not intended that to limitation of the present utility model.
Claims (3)
1. a kind of multi-layer flexible circuit board, it is characterised in that including：The multiple flexible circuit Slab elements (10) being stacked；Institute
State multiple mounting holes that flexible circuit Slab element (10) upper and lower surface is provided through in flexible circuit Slab element (10)
(8), it is provided with connecting pole (9) in the mounting hole (8) of the multiple flexible circuit Slab element (10)；Two neighboring flexible PCB
Spacer sleeve (11) is provided between unit (10), the spacer sleeve (11) includes pars intermedia and is connected to two above and below the pars intermedia
The end at end, the external diameter of the end is less than the external diameter of the pars intermedia, and the spacer sleeve (11) is provided centrally with through hole (14)；
It is outside that the spacer sleeve (11) is sheathed on the connecting pole (9)；The pars intermedia of the spacer sleeve (11) and the flexible PCB
Formed between unit (10) in annular groove (13), the annular groove (13) and be provided with ring washer (12), the air ring
Enclose the external diameter of the external diameter more than the pars intermedia of the spacer sleeve (11) of (12)；
The flexible circuit Slab element (10) includes flexible base board (1), the first copper foil layer being arranged on the flexible base board (1)
(2) tack coat (3), being arranged on first copper foil layer (2), the second copper foil layer being arranged on the tack coat (3)
, and the polyimide layer (5) that is arranged on second copper foil layer (4) (4)；Via is provided with the tack coat (3)
(6), be provided with metal needle (7) in the via (6), the upper and lower side of the metal needle (7) respectively with first copper foil layer (2)
And second copper foil layer (4) is in contact.
2. multi-layer flexible circuit board according to claim 1, it is characterised in that the metal needle (7) is riveted on the mistake
In hole (6).
3. multi-layer flexible circuit board according to claim 1, it is characterised in that the height of the spacer sleeve (11) is more than institute
State the thickness of flexible base board (1) and the polyimide layer (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720098430.0U CN206452611U (en) | 2017-01-20 | 2017-01-20 | Multi-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720098430.0U CN206452611U (en) | 2017-01-20 | 2017-01-20 | Multi-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206452611U true CN206452611U (en) | 2017-08-29 |
Family
ID=59667853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720098430.0U Expired - Fee Related CN206452611U (en) | 2017-01-20 | 2017-01-20 | Multi-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206452611U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253410A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Encapsulation structure for circuit board of intelligent power module |
| CN112954882A (en) * | 2021-01-27 | 2021-06-11 | 深圳市宏联电路有限公司 | Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode |
-
2017
- 2017-01-20 CN CN201720098430.0U patent/CN206452611U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253410A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Encapsulation structure for circuit board of intelligent power module |
| CN112954882A (en) * | 2021-01-27 | 2021-06-11 | 深圳市宏联电路有限公司 | Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170829 Termination date: 20220120 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |