CN101534600A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN101534600A CN101534600A CN200810034476A CN200810034476A CN101534600A CN 101534600 A CN101534600 A CN 101534600A CN 200810034476 A CN200810034476 A CN 200810034476A CN 200810034476 A CN200810034476 A CN 200810034476A CN 101534600 A CN101534600 A CN 101534600A
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- pad
- dwindling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A printed circuit board comprises at least two adjacent through holes penetrating through the board and two bonding pads. Each bonding pad encloses the through hole and is arranged on the surface of the printed circuit board and used for welding a perforation type subassembly, wherein each bonding pad takes the shape with a tapered end so that soldering tin overflows along the direction of the tapered end in the welding process, thus further preventing the soldering tin from overflowing to an adjacent bonding pad and then causing short circuit.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), in more detail, relate to a kind of printed circuit board (PCB) that prevents adjacent pad (pad) short circuit.
Background technology
Though present most of PCB design all adopt the combined group packing technique of two-sided paster, surface mounting technology (Surface Mount Technology; SMT) become the PCB design Developing Trend in Technology, but many such as assemblies such as inductance coil, large power assembly, power modules owing to reasons such as heat radiation, assembly material, reliability still can't adopt above-mentioned surface mounting technology, adopt the perforation means assembling but in printed circuit board (PCB), offer through hole, therefore, said modules is also referred to as perforation formula assembly (Through Hole Component; THC), such perforation formula assembly still occupies certain ratio in printed circuit board (PCB), and the general welding process (wave-soldering operation) of using mobile wave-soldering tin-soldering to flow is finished the assembling between this perforation formula assembly and this printed circuit board (PCB).
In addition, along with the fast development of electronics technology and improving constantly of people's quality of life demand, more and more develop such as electronic equipments such as computer, mobile phone, PDA(Personal Digital Assistant), digital cameras towards high-quality, high precisionization and compact direction, and then cause the printed circuit board (PCB) that is assembled in the above-mentioned electronic equipment more and more to be tending towards miniaturization, and object (assembly, holding wire, pad etc.) the more miniaturization of size, the arrangement that are arranged in this printed circuit board (PCB) are more intensive.So; if pin (pin) spacing of the perforation formula assembly that desire is installed in this printed circuit board (PCB) is too small; the solder pad space length that causes corresponding each described pin of welding and be arranged in this printed circuit board (PCB) is also too small; when the pad on the printed circuit board (PCB) is tending towards the high density arrangement; in wave-soldering operation welding process; regular meeting occurs because spacing is too small, and causes the scolding tin overflow of fusion and be blended between adjacent two pads problem that causes adjacent pad to be short-circuited.This kind become the principal element that the printed circuit board (PCB) fraction defective raises because the short circuit problem that is caused is merged in the scolding tin overflow.
In sum, how to propose a kind ofly to reduce the weld defect of the perforation formula assembly with close spacing pin and prevent the printed circuit board (PCB) of adjacent pad short circuit, to avoid many disadvantages of the prior art, real be the technical problem of present anxious desire solution.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, one object of the present invention is to provide a kind of printed circuit board (PCB), produces the situation of short circuit to prevent the too small pad of spacing.
Another object of the present invention is to provide a kind of printed circuit board (PCB) that promotes the good rate of printed circuit board (PCB).
For reaching above-mentioned purpose and other purpose, the invention provides a kind of printed circuit board (PCB), comprise at least two adjacent through-holes and two pads of running through this printed circuit board (PCB), each described pad is around each described through hole and be arranged at this printed circuit board surface, in order to welding perforation formula assembly, it is characterized in that: each described pad is and has the shape of dwindling end, with in welding process for the direction overflow of dwindling end of scolding tin along this pad.
In printed circuit board (PCB) of the present invention, this perforation formula assembly is to be welded in each described pad with the wave-soldering operation, and correspondingly, the direction that this pad dwindles end is opposite with the moving direction of this printed circuit board (PCB) in the wave-soldering operation.In addition, have this bond pad shapes of dwindling end and can be for example be drops, triangle, taper or fan-shaped etc., but not as limit.
Than prior art, in the printed circuit board (PCB) of the present invention, each adjacent pad is and has the shape of dwindling end, thus in follow-up welding process, to supply the direction overflow of dwindling end of scolding tin along this pad, and then prevent that scolding tin overflow to adjacent pad from causing the situation of short circuit to take place, and also can promote the good rate of this printed circuit board (PCB) relatively.
Description of drawings
Fig. 1 shows the layout structure schematic diagram of an embodiment of printed circuit board (PCB) of the present invention.
The simple declaration of assembly label
1 printed circuit board (PCB)
11 weld zones
111,111a～111f through hole
113,113a～113f pad
S1, S2 spacing
The A direction
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.
See also Fig. 1, show the layout structure schematic diagram of printed circuit board (PCB) of the present invention.As shown in the figure, this printed circuit board (PCB) 1 is provided with at least one weld zone 11 and connects for correspondences and put perforation formula assembly (the Through-Hole Component with a plurality of pins (pin); THC), and have at least two pins of spacing in each described pin, and this weld zone 11 has and runs through this printed circuit board (PCB) 1 and connect a plurality of through holes 111 of putting each described pin and be arranged at this printed circuit board (PCB) 1 surface and a plurality of pads 113 that weld each described pin of this perforation formula assembly for correspondence are set around this through hole 111 for corresponding less than a specific range.
In more detail, in the printed circuit board (PCB) 1 of the present invention, be less than each described pad of each described pin of this specific range for corresponding weld spacing and have the shape of dwindling end, have this bond pad shapes of dwindling end and can be for example be drops, triangle, taper or fan-shaped etc., but not as limit, dwindle the direction overflow of end with confession scolding tin in follow-up welding process along this pad thus, and then prevent that scolding tin overflow to adjacent pad from causing the situation of short circuit to take place.In present embodiment, each described pin of this perforation formula assembly is to be welded in each described pad with the wave-soldering operation, and preferably, the direction that this pad dwindles end is opposite with the moving direction of this printed circuit board (PCB) in this wave-soldering operating type.
For example, as shown in Figure 1, with this printed circuit board (PCB) 1 desire install one have six pins and wherein three adjacent lead pin pitchs be example less than the perforation formula assembly of this specific range, then in the weld zone 11 of this printed circuit board (PCB) 1, need correspondence that six through holes are set and (be respectively 111a, 111b, 111c, 111d, 111e, and 111f), and six pads (are respectively 113a, 113b, 113c, 113d, 113e, and 113f), each described through hole 111a, 111b, 111c, 111d, 111e, and the spacing between the 111f has directly reflected the spacing of desiring to connect between each the described pin that is placed in one, in present embodiment, with this through hole 111a, 111b, and the interval S between the 111c 1, S2 is an example less than this specific range, then around this through hole 111a, 111b, and three pad 113a of 111c, 113b, and 113c is three pins of corresponding this spacing of welding less than this specific range, so, use printed circuit board (PCB) of the present invention, then with this pad 113a, 113b, and 113c is designed to drops (but not as limit, in other embodiment, each described pad 113a, 113b, and 113c can be have the equivalent shapes of dwindling end), and this pad 113a, 113b, and the drops of 113c to dwindle extreme direction A (lateral dimension of this pad shown in the direction of arrow of Fig. 1 dwindles direction) opposite with the moving direction of this printed circuit board (PCB) in the follow-up wave-soldering operation of adopting, to pass through this drop-shaped pad 113a, 113b, and 113c guides this scolding tin to dwindle the direction A overflow of end along this pad drops when follow-up wave-soldering operation, so to prevent that scolding tin overflow to adjacent pad from causing the situation of short circuit to take place, must be with what illustrate herein, for other pad 113d of corresponding weld spacing greater than each described pin of this specific range, 113e, and 113f still keeps original structural design, can be regular circular or square structure shape etc.
In sum, in the printed circuit board (PCB) of the present invention, each adjacent pad is and has the structure of dwindling end, in addition, dwindle end face to the direction of pad with follow-up opposite in order to weld this perforation formula assembly moving direction of this printed circuit board (PCB) to the wave-soldering operation of this printed circuit board (PCB), and the circular or square pad structure that substitutes existing regular shape designs, thus in follow-up welding process, to supply scolding tin along the direction overflow of dwindling end, and then prevent that scolding tin overflow to adjacent pad from causing the situation of short circuit to take place, thereby relatively promote the good rate of this printed circuit board (PCB).
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention, claim is listed as described later.
Claims (7)
1, a kind of printed circuit board (PCB), comprise at least two adjacent through-holes and two pads of running through this printed circuit board (PCB), each described pad is around each described through hole and be arranged at this printed circuit board surface, in order to welding perforation formula assembly, it is characterized in that: each described pad is and has the shape of dwindling end, with in welding process for the direction overflow of dwindling end of scolding tin along this pad.
2, printed circuit board (PCB) according to claim 1 is characterized in that: this perforation formula assembly is to be welded in each described pad with the wave-soldering operation.
3, printed circuit board (PCB) according to claim 2 is characterized in that: the direction that this pad dwindles end is opposite with the moving direction of this printed circuit board (PCB) in this wave-soldering operation.
4, printed circuit board (PCB) according to claim 1 is characterized in that: having this bond pad shapes of dwindling end is drops.
5, printed circuit board (PCB) according to claim 1 is characterized in that: having this bond pad shapes of dwindling end is triangle.
6, printed circuit board (PCB) according to claim 1 is characterized in that: having this bond pad shapes of dwindling end is taper.
7, printed circuit board (PCB) according to claim 1 is characterized in that: it is fan-shaped having this bond pad shapes of dwindling end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810034476A CN101534600A (en) | 2008-03-11 | 2008-03-11 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810034476A CN101534600A (en) | 2008-03-11 | 2008-03-11 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101534600A true CN101534600A (en) | 2009-09-16 |
Family
ID=41104922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810034476A Pending CN101534600A (en) | 2008-03-11 | 2008-03-11 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101534600A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760702A (en) * | 2012-07-18 | 2012-10-31 | 西安永电电气有限责任公司 | Substrate and electronic device using same |
| CN104080269A (en) * | 2013-03-27 | 2014-10-01 | 珠海格力电器股份有限公司 | PCB (Printed Circuit Board) |
| CN105682349A (en) * | 2016-03-30 | 2016-06-15 | 广东欧珀移动通信有限公司 | Pad structure, circuit board using same and mobile terminal |
| CN106102316A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN106847860A (en) * | 2013-12-03 | 2017-06-13 | 乐金显示有限公司 | Organic light emitting apparatus |
-
2008
- 2008-03-11 CN CN200810034476A patent/CN101534600A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760702A (en) * | 2012-07-18 | 2012-10-31 | 西安永电电气有限责任公司 | Substrate and electronic device using same |
| CN104080269A (en) * | 2013-03-27 | 2014-10-01 | 珠海格力电器股份有限公司 | PCB (Printed Circuit Board) |
| CN106847860A (en) * | 2013-12-03 | 2017-06-13 | 乐金显示有限公司 | Organic light emitting apparatus |
| CN106847860B (en) * | 2013-12-03 | 2020-08-07 | 乐金显示有限公司 | Organic light emitting device |
| CN105682349A (en) * | 2016-03-30 | 2016-06-15 | 广东欧珀移动通信有限公司 | Pad structure, circuit board using same and mobile terminal |
| CN106102316A (en) * | 2016-08-25 | 2016-11-09 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090916 |