CN112954882A - Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode - Google Patents
Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode Download PDFInfo
- Publication number
- CN112954882A CN112954882A CN202110112713.7A CN202110112713A CN112954882A CN 112954882 A CN112954882 A CN 112954882A CN 202110112713 A CN202110112713 A CN 202110112713A CN 112954882 A CN112954882 A CN 112954882A
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- base plate
- flexible
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- plate
- column
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application discloses a flexible printed circuit board and a method for manufacturing the circuit board by adopting an ion implantation mode, which comprises a first basal plate and a second basal plate, wherein a deformation gap is formed between the first basal plate and the second basal plate, connecting columns are arranged on the first basal plate and the second basal plate in a penetrating way, a first limiting head and a second limiting head are respectively arranged at two ends of the connecting column, a flexible base plate is arranged on the connecting column, a deformation gap is formed between the first base plate and the second base plate, the connecting column comprises a first column body and a second column body, the flexible base plate is arranged at one end of the first column body, a flexible ring pad is sleeved outside the first column body, an axial through groove is arranged on the first column body, a connecting block is arranged on the flexible ring pad, an elastic piece is arranged in the first column body, the first base plate is fixedly connected with the flexible cushion plate, and the second base plate is fixedly connected with the flexible ring cushion. The problem that the existing double-layer flexible printed circuit board is easy to separate or break can be improved.
Description
Technical Field
The present disclosure relates to printed circuit boards, and particularly to a flexible printed circuit board and a method for manufacturing the same by ion implantation.
Background
A flexible printed wiring board (FPC), also called a "flexible board", is a printed wiring board made of a flexible insulating base material. At present, a flexible printed circuit board is manufactured by manufacturing a flexible copper clad laminate by adopting a polyimide film and a polyester film, manufacturing a circuit diagram on the flexible copper clad laminate and carrying out processes of exposure, development, copper etching and the like.
For some double-sided flexible printed circuit boards, the two sides are generally bonded together. However, in such a double-sided flexible printed wiring board, the double-layer wiring board having the flexible active region is easily separated or broken during the bending process.
Disclosure of Invention
In order to solve the problem that the existing double-layer flexible printed circuit board is easy to separate or break, the application provides the flexible printed circuit board and the method for manufacturing the circuit board by adopting an ion implantation mode.
In a first aspect, the present application provides a flexible printed circuit board, which adopts the following technical scheme:
a flexible printed circuit board comprises a first base plate and a second base plate, wherein a deformation gap is formed between the first base plate and the second base plate, communicated mounting holes are formed in the first base plate and the second base plate, a connecting column penetrates through the mounting holes, a first limiting head and a second limiting head which limit the separation of the first base plate and the second base plate are respectively arranged at two ends of the connecting column, a flexible base plate positioned between the first base plate and the second base plate is arranged on the upper peripheral side of the connecting column, a deformation gap is formed between the first base plate and the second base plate through the flexible base plate, the connecting column comprises a first column body and a second column body, a through hole is formed inside the first column body, the second column body movably penetrates through the through hole, the flexible base plate is arranged at one end of the first column body, a flexible annular cushion is further sleeved outside the first column body, the flexible ring cushion is characterized in that an axial through groove communicated into the through hole is formed in the first column body, a connecting block penetrating the axial through groove and connected with the second column body is arranged on the flexible ring cushion, an elastic piece for driving the second column body and the flexible ring cushion to be close to the flexible base plate is arranged in the first column body all the time, the first base plate is fixedly connected with the flexible base plate, and the second base plate is fixedly connected with the flexible ring cushion.
Through adopting above-mentioned technical scheme, first base plate and second base plate are fixed mutually with flexible backing plate and flexible ring pad respectively, because flexible backing plate and flexible ring pad link to each other with first cylinder and second cylinder respectively, under the effect of elastic component, flexible backing plate and flexible ring pad can be close to each other, thereby make first base plate and second base plate be close to each other, when buckling, first base plate and second base plate can warp flexible through the deformation clearance, the elastic component can avoid first base plate and second base plate excessive separation for it provides elasticity simultaneously.
Optionally, a ring piece with the same cross section as the perforated cross section is further arranged in the first column body, and the elastic piece applies force to the second column body through the annular gasket.
Through adopting above-mentioned technical scheme, through being provided with annular gasket, the elastic component can be through annular gasket application of force in flexible ring pad and second cylinder steadily.
Optionally, a clamping groove for clamping the connecting block is formed in the second column, and the depth of the clamping groove is not smaller than the thickness of the connecting block.
Through adopting above-mentioned technical scheme, back in the draw-in groove is gone into to the connecting block card, annular gasket can the butt in the second cylinder to control the second cylinder better and remove.
Optionally, the first limiting head is provided with a limiting plate in threaded connection with the inside of the first column body, the elastic part is a spring, one end of the spring abuts against the limiting plate, and the other end of the spring abuts against the annular gasket.
Through adopting above-mentioned technical scheme, through with the spring butt in ring piece and limiting plate, the spring can apply elasticity for the ring piece steadily.
Optionally, be provided with on the limiting plate and supply the reference column that the spring was around establishing, the inside guiding hole that supplies the reference column to wear to establish of second cylinder is seted up and has, the reference column passes the inner circle of annular gasket and penetrates in the guiding hole, the diameter of guiding hole is greater than the diameter of reference column.
Through adopting above-mentioned technical scheme, the spring is around establishing outside the reference column to promoted the stability of its setting, the guide effect that can play in the removal of first cylinder of second cylinder when using in the guiding hole that the reference column penetrated, and the diameter of guiding hole is greater than the diameter of reference column and can makes and can produce the bending of certain degree between second cylinder and the first cylinder.
Optionally, the second limiting head is an annular structure which is connected outside the second column body in a threaded manner, and a separation gap for separating the first base plate from the second base plate is formed between the second limiting head and the first base plate.
Through adopting above-mentioned technical scheme, through adjusting the position of first stopper on the second post, can realize the adjustment in deformation clearance between first base plate and the second base plate, can adjust it through flexible line way board degree of need buckling.
Optionally, the first base plate is fixedly connected with the flexible backing plate through bonding, the second base plate is fixedly connected with the flexible ring pad through bonding, the flexible backing plate is fixed with the flexible ring pad through bonding, and the bonding force between the flexible backing plate and the flexible ring pad is smaller than the bonding force between the first base plate and the flexible backing plate and between the second base plate and the flexible ring pad.
Through adopting above-mentioned technical scheme, at the in-process that the flexible printed circuit board buckled, the power of dragging that can appear a separation between flexible backing plate and the flexible ring pad, along with the grow of degree of buckling, this tensile force also can not constantly increase, thereby after this power of dragging is greater than the adhesion force of flexible ring pad and flexible backing plate and the elasticity that the spring was applyed, thereby flexible ring pad and flexible backing plate can separate and make the flexible printed circuit board can further produce the deformation of bigger degree through the separation clearance.
In a second aspect, the present application provides a method for manufacturing a circuit board by using an ion implantation method, which adopts the following technical solution.
A method for manufacturing the circuit board by adopting an ion implantation mode comprises the following specific steps:
(1) mixing alumina, titanium dioxide and silicon dioxide mixed ceramic powder and polytetrafluoroethylene powder, forming and sintering to form a blank, and turning the blank into a first base plate and a second base plate;
(2) drilling circuit holes on the first base plate and the second base plate according to the circuit design requirements, and simultaneously drilling mounting holes;
(3) copper ions are injected into the first base plate and the second base plate, and copper ions are injected into the surface layer in the circuit hole; depositing copper on the first base plate and the second base plate with copper ions by using an electroplating mode to form a circuit diagram;
(4) the first column and the second column are assembled in the mounting hole.
Through adopting above-mentioned technical scheme, through being equipped with first cylinder and second cylinder, first base plate and second base plate are fixed mutually with flexible backing plate and flexible ring pad respectively, under the effect of elastic component, flexible backing plate and flexible ring pad can be close to each other to make first base plate and second base plate be close to each other, when buckling, first base plate and second base plate can warp flexible through the deformation clearance, and the elastic component can avoid first base plate and second base plate excessive separation for it provides elasticity simultaneously.
In summary, the present application includes at least one of the following benefits:
1. a deformation gap is formed between the first base plate and the second base plate, so that the deformation capacity between the first base plate and the second base plate can be improved, and meanwhile, the elastic piece can provide elasticity to avoid excessive separation of the first base plate and the second base plate;
2. in the process of bending the flexible printed circuit board, a separated pulling force can occur between the flexible base plate and the flexible ring pad, the pulling force can not be continuously increased along with the increase of the bending degree, and the pulling force is larger than the bonding force of the flexible ring pad and the flexible base plate and the elastic force exerted by the spring, so that the flexible ring pad and the flexible base plate can be separated, and the flexible printed circuit board can be further deformed to a greater extent through a separation gap.
Drawings
Fig. 1 is a sectional view of a flexible printed circuit board in an embodiment of the present application;
FIG. 2 is a schematic view illustrating a connection structure of a first column and a second column according to an embodiment of the present disclosure;
fig. 3 is an exploded view of the first cylinder and the second cylinder in the embodiment of the present application.
Description of reference numerals: 1. a first base layer board; 11. mounting holes; 2. a second base layer board; 3. connecting columns; 31. a first column; 311. perforating; 312. an axial through slot; 32. a second cylinder; 321. a card slot; 322. a guide hole; 33. a first stopper; 331. a limiting plate; 332. a positioning column; 34. a second limiting head; 4. a flexible backing plate; 5. a flexible ring pad; 51. connecting blocks; 6. an elastic member; 7. an annular gasket.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses a flexible printed circuit board. Referring to fig. 1 and 2, the flexible printed circuit board includes a first base plate 1 and a second base plate 2, a plurality of communicated mounting holes 11 are arranged in an array on the first base plate 1 and the second base plate 2, a connecting column 3 is arranged in the mounting holes 11 in a penetrating manner and connects the first base plate 1 and the second base plate 2, and a first limiting head 33 and a second limiting head 34 for limiting the separation of the first base plate 1 and the second base plate 2 are respectively arranged at two ends of the connecting column 3.
Referring to fig. 2 and 3, the connecting column 3 includes a first cylinder 31 having a through hole 311 and a second cylinder 32 movably inserted in the through hole 311, and the first cylinder 31 and the second cylinder 32 are both made of a plastic material having a certain elasticity. Wherein one end of the first cylinder 31 is integrally provided with a flexible mat 4 between the first and second base sheets 1 and 2. The first column 31 is provided with two axial through grooves 312 connected to the through hole 311 along the axial direction thereof, the axial through grooves 312 are symmetrically formed on the first column 31, one axial end of the first column 31 of the axial through groove 312 penetrates through the first column 31, and the other axial end is formed to be flush with the flexible backing plate 4. The cover is equipped with flexible ring pad 5 on the first cylinder 31, is provided with on the flexible ring pad 5 to lead to the groove 312 through the axial and wear to establish connecting block 51 in the perforation 311, and the draw-in groove 321 that supplies connecting block 51 card to go into is seted up to the one end that the second cylinder 32 penetrated in the perforation 311, and the degree of depth of draw-in groove 321 is the same with the thickness of connecting block 51.
The first column 31 is also provided with an elastic element 6 which drives the second column 32 to move towards the direction far away from the first column 31 all the time. The first column 31 is threaded on the wall of the through hole 311, and the first stopper 33 has a stopper 331 threaded inside the first column 31. The first column 31 is further provided with an annular gasket 7 inside, in the embodiment of the present application, the elastic element 6 is a spring, one end of the spring abuts on the limiting plate 331, and the other end of the spring abuts on the annular gasket 7. The ring width of the ring-shaped gasket 7 is equal to or more than the length of the connecting block 51 penetrating into the through hole 311, and the ring-shaped gasket 7 drives the second cylinder 32 and the ring-shaped gasket 7 to move towards the direction of the flexible backing plate 4 under the action of the spring.
The limiting plate 331 is provided with a positioning post 332 for a spring to wind, the positioning post 332 penetrates into the inner ring of the annular gasket 7 and is inserted into the second post 32, the second post 32 is provided with a guide hole 322 for the positioning post 332 to penetrate through along the axial direction of the second post, the diameter of the guide hole 322 is slightly larger than that of the positioning post 332, and the depth of the guide hole 322 is the same as that of the positioning post 332.
First base plate 1 is through bonding and flexible backing plate 4 fixed connection, second base plate 2 is through bonding and flexible ring pad 5 fixed connection, flexible backing plate 4 with flexible ring pad 5 is fixed through bonding, and the adhesion between flexible backing plate 4 and the flexible ring pad 5 is less than the adhesion between first base plate 1 and flexible backing plate 4 and second base plate 2 and the flexible ring pad 5. A deformation gap is formed between the first base plate 1 and the second base plate 2 through a flexible backing plate 4 and a flexible annular pad 5.
The outer side wall of the second column body 32 is provided with threads, the second limiting head 34 is of an annular structure which is in threaded connection with the outside of the second column body 32, and a separation gap which is used for separating and adjusting the first base plate 1 and the second base plate 2 is formed between the second limiting head 34 and the first base plate 1.
The implementation principle of the flexible printed circuit board in the embodiment of the application is as follows:
when the use environment of the flexible printed circuit board is in a flat state or does not need to be bent greatly, the second limiting head 34 is abutted against the first base plate 1, so that the first base plate 1 and the second base plate 2 cannot be separated, and the stability between the first base plate 1 and the second base plate 2 is kept;
when the flexible printed circuit board needs to be bent greatly in the use environment, a certain separation gap is left between the second limiting head 34 and the first base plate 1. In the process that the flexible printed circuit board is buckled, the pulling force of a separation can appear between the flexible backing plate 4 and the flexible ring pad 5, along with the increase of the bending degree, the pulling force can not be continuously increased, and after the pulling force is greater than the bonding force of the flexible ring pad 5 and the flexible backing plate 4 and the elastic force exerted by the spring, the flexible ring pad 5 and the flexible backing plate 4 can be separated, so that the flexible printed circuit board can further generate deformation of a larger degree through a separation gap.
The embodiment of the application also discloses a method for manufacturing the flexible printed circuit board by adopting an ion implantation mode, which comprises the following specific steps:
(1) mixing alumina, titanium dioxide and silicon dioxide mixed ceramic powder and polytetrafluoroethylene powder, forming and sintering to form a blank, and turning the blank into a first base plate 1 and a second base plate 2;
(2) drilling circuit holes on the first base plate 1 and the second base plate 2 according to circuit design requirements, and simultaneously drilling mounting holes 11;
(3) copper ions are injected into the first base plate 1 and the second base plate 2, and copper ions are injected into the surface layer in the circuit hole; depositing copper on the first base plate 1 and the second base plate 2 where copper ions exist by utilizing an electroplating mode to form a circuit diagram;
(4) the first cylinder 31 and the second cylinder 32 are fitted in the mounting hole 11.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. A flexible printed wiring board characterized in that: including first base plate (1) and second base plate (2), be formed with the deformation clearance between first base plate (1) and second base plate (2), set up mounting hole (11) of intercommunication on first base plate (1) and the second base plate (2), wear to be equipped with spliced pole (3) in mounting hole (11) simultaneously, the both ends of spliced pole (3) are provided with first spacing head (33) and second spacing head (34) of restriction first base plate (1) and second base plate (2) separation respectively, week side is provided with and is located flexible backing plate (4) between first base plate (1) and second base plate (2) on spliced pole (3), form a deformation clearance through flexible backing plate (4) between first base plate (1) and the second base plate (2), spliced pole (3) include first cylinder (31) and second cylinder (32), the flexible base plate comprises a first cylinder (31), a through hole (311) is formed in the first cylinder (31), a second cylinder (32) is movably arranged in the through hole (311) in a penetrating mode, a flexible base plate (4) is arranged at one end of the first cylinder (31), a flexible ring pad (5) is further sleeved on the first cylinder (31), an axial through groove (312) communicated with the through hole (311) is formed in the first cylinder (31), a connecting block (51) penetrating through the axial through groove (312) and connected with the second cylinder (32) is arranged on the flexible ring pad (5), an elastic piece (6) driving the second cylinder (32) and the flexible ring pad (5) to be close to the flexible base plate (4) is further arranged in the first cylinder (31), the first base plate (1) is fixedly connected with the flexible base plate (4), and the second base plate (2) is fixedly connected with the flexible ring pad (5).
2. The flexible printed wiring board according to claim 1, wherein: an annular gasket (7) matched with the cross section of the through hole (311) is further arranged in the first cylinder (31), and the elastic piece (6) applies force to the second cylinder (32) through the annular gasket (7).
3. The flexible printed wiring board according to claim 2, wherein: two axial through grooves (312) are formed in the first column body (31), the two axial through grooves (312) are symmetrically distributed on the first column body (31), and the length of the connecting block (51) extending into the through hole (311) is not greater than the ring width of the annular gasket (7).
4. The flexible printed wiring board according to claim 3, wherein: and a clamping groove (321) for clamping the connecting block (51) is formed in the second column body (32), and the depth of the clamping groove (321) is not smaller than the thickness of the connecting block (51).
5. The flexible printed wiring board according to claim 4, wherein: the first limiting head (33) is provided with a limiting plate (331) which is in threaded connection with the inside of the first column body (31), the elastic piece (6) is a spring, one end of the spring abuts against the limiting plate (331), and the other end of the spring abuts against the annular gasket (7).
6. The method of flexible printed wiring board according to claim 5, characterized in that: be provided with on limiting plate (331) and supply the spring around reference column (332) of establishing, inside offering of second cylinder (32) has guiding hole (322) that supply reference column (332) to wear to establish, in inner circle that reference column (332) passed annular gasket (7) penetrated guiding hole (322), the diameter of guiding hole (322) was greater than the diameter of reference column (332).
7. The method of flexible printed wiring board according to claim 6, characterized in that: the second limiting head (34) is of an annular structure which is in threaded connection with the outside of the second column body (32), and a separation gap for separating the first base plate (1) from the second base plate (2) is formed between the second limiting head (34) and the first base plate (1).
8. The flexible printed wiring board according to claim 7, wherein: first base plate board (1) is through bonding and flexible backing plate (4) fixed connection, second base plate board (2) are through bonding and flexible ring pad (5) fixed connection, flexible backing plate (4) with flexible ring pad (5) are fixed through bonding, and the adhesion force between flexible backing plate (4) and flexible ring pad (5) is less than the adhesion force between first base plate board (1) and flexible backing plate (4) and second base plate board (2) and flexible ring pad (5).
9. A method of manufacturing the flexible printed wiring board according to any one of claims 1 to 8 by ion implantation, characterized in that: the method comprises the following specific steps:
(1) mixing alumina, titanium dioxide and silicon dioxide mixed ceramic powder and polytetrafluoroethylene powder, forming and sintering to form a blank, and turning the blank into a first base plate (1) and a second base plate (2);
(2) drilling circuit holes on the first base plate (1) and the second base plate (2) according to the circuit design requirements, and simultaneously drilling mounting holes (11);
(3) copper ions are implanted into the first base plate (1) and the second base plate (2), and copper ions are implanted into the surface layer in the circuit hole; depositing copper on the first base plate (1) and the second base plate (2) where copper ions exist in an electroplating mode to form a circuit diagram;
(4) a first column (31) and a second column (32) are fitted in the mounting hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110112713.7A CN112954882B (en) | 2021-01-27 | 2021-01-27 | Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110112713.7A CN112954882B (en) | 2021-01-27 | 2021-01-27 | Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112954882A true CN112954882A (en) | 2021-06-11 |
| CN112954882B CN112954882B (en) | 2022-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110112713.7A Active CN112954882B (en) | 2021-01-27 | 2021-01-27 | Flexible printed circuit board and method for manufacturing circuit board by adopting ion implantation mode |
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| CN (1) | CN112954882B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189560A (en) * | 1999-12-28 | 2001-07-10 | Alps Electric Co Ltd | Flexible multilayer wiring board and manufacturing method therefor |
| CN202488868U (en) * | 2011-12-30 | 2012-10-10 | 深圳市三德冠精密电路科技有限公司 | Reinforced flexible printed circuit board |
| CN206452611U (en) * | 2017-01-20 | 2017-08-29 | 深圳市鹏博辉电子有限公司 | Multi-layer flexible circuit board |
| CN107172819A (en) * | 2017-06-22 | 2017-09-15 | 庐江县典扬电子材料有限公司 | The method that high frequency flexible print circuit board is made using ion implanting and plating mode |
| CN210075686U (en) * | 2019-01-21 | 2020-02-14 | 东莞联桥电子有限公司 | Anti-vibration and anti-collision multilayer PCB |
| CN210183634U (en) * | 2019-06-28 | 2020-03-24 | 石艳 | High-resistance flexible circuit board |
| CN211047375U (en) * | 2019-11-13 | 2020-07-17 | 江西省鑫诚辉电路有限公司 | Flexible anti type circuit board that falls |
-
2021
- 2021-01-27 CN CN202110112713.7A patent/CN112954882B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189560A (en) * | 1999-12-28 | 2001-07-10 | Alps Electric Co Ltd | Flexible multilayer wiring board and manufacturing method therefor |
| CN202488868U (en) * | 2011-12-30 | 2012-10-10 | 深圳市三德冠精密电路科技有限公司 | Reinforced flexible printed circuit board |
| CN206452611U (en) * | 2017-01-20 | 2017-08-29 | 深圳市鹏博辉电子有限公司 | Multi-layer flexible circuit board |
| CN107172819A (en) * | 2017-06-22 | 2017-09-15 | 庐江县典扬电子材料有限公司 | The method that high frequency flexible print circuit board is made using ion implanting and plating mode |
| CN210075686U (en) * | 2019-01-21 | 2020-02-14 | 东莞联桥电子有限公司 | Anti-vibration and anti-collision multilayer PCB |
| CN210183634U (en) * | 2019-06-28 | 2020-03-24 | 石艳 | High-resistance flexible circuit board |
| CN211047375U (en) * | 2019-11-13 | 2020-07-17 | 江西省鑫诚辉电路有限公司 | Flexible anti type circuit board that falls |
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| Publication number | Publication date |
|---|---|
| CN112954882B (en) | 2022-09-30 |
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