CN109757033B - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN109757033B CN109757033B CN201910131652.1A CN201910131652A CN109757033B CN 109757033 B CN109757033 B CN 109757033B CN 201910131652 A CN201910131652 A CN 201910131652A CN 109757033 B CN109757033 B CN 109757033B
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- split plate
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Abstract
The invention relates to a circuit board and a manufacturing method thereof, the circuit board comprises a first split plate and a second split plate, the first split plate and the second split plate are movably connected, the first split plate can rotate relative to the second split plate, so that the circuit board can realize bendability to a certain degree, the base material of the circuit board does not need to be a material with high flexibility requirement, a common rigid material can be selected as the base material, the material selection range is wide, and the production cost is low. The manufacturing method of the circuit board is simple and easy to implement and low in manufacturing cost.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
A Printed Circuit Board (PCB) is a support for electronic components and a carrier for electrical connection. With the rapid development of electronic information technology, PCBs are widely used. In some applications, for example, in order to meet the design requirements of different electronic products, there is a certain requirement on the flexibility of the PCB. However, the conventional flexible circuit board, such as FPC, has a high requirement for the flexibility of the substrate, and the selection range of the substrate type is small, so that there is a problem of high production cost.
Disclosure of Invention
Therefore, it is necessary to provide a circuit board and a manufacturing method thereof to solve the problems of the conventional bendable circuit board that the requirement for the flexibility of the substrate is high, the selection range of the substrate is small, and the production cost is high.
A circuit board comprises a first split plate and a second split plate, wherein the first split plate comprises a first plate main body and a first connecting portion arranged at one end of the first plate main body, the second split plate comprises a second plate main body and a second connecting portion arranged at one end of the second plate main body, and the first connecting portion and the second connecting portion are movably connected so that the first split plate can rotate relative to the second split plate.
In one embodiment, the first connecting portion includes a plurality of first protrusions protruding from the edge of the first board body, the second connecting portion includes a plurality of second protrusions protruding from the edge of the second board body, and the first connecting portion and the second connecting portion form a concave-convex structure which is fitted with each other.
In one embodiment, the outermost end of the first projection is spaced from the second split plate by a first distance, and the outermost end of the second projection is spaced from the first plate body by a second distance.
In one embodiment, the first spacing is no less than 1/2 of the thickness of the first panel body.
In one embodiment, the second spacing is no less than 1/2 of the thickness of the second panel body.
In one embodiment, the first plate body and the second plate body have the same thickness.
In one embodiment, the first projection has a width that is constant as the second plate body is approached.
In one embodiment, the first projection has a width that gradually increases as it approaches the second plate body.
A manufacturing method of a circuit board comprises the following steps:
providing a substrate;
performing routing processing on the substrate to obtain a first split plate and a second split plate, wherein the first split plate comprises a first plate main body and a first connecting part arranged at one end of the first plate main body, and the second split plate comprises a second plate main body and a second connecting part arranged at one end of the second plate main body;
forming a conductive layer on the first and second split plates;
and movably connecting the first connecting part with the second connecting part to enable the first split plate to rotate relative to the second split plate.
In one embodiment, the first connecting portion and the second connecting portion are concave-convex structures capable of being mutually embedded and matched.
In one embodiment, the conductive layer is formed by performing a process including a copper deposition process and an electroplating process on the first split plate and the second split plate.
Compared with the prior art, the invention has the following beneficial effects:
above-mentioned circuit board comprises including first components of a whole that can function independently board and second components of a whole that can function independently board, swing joint between first components of a whole that can function independently board and the second components of a whole that can function independently board, first components of a whole that can function independently board can for the second components of a whole that can function independently board rotates to the circuit board can realize the bendability of certain degree, and the substrate of circuit board needn't select for use the material that flexibility requires height, and the optional rigid material that uses commonly uses is as the substrate, and.
The manufacturing method of the circuit board is simple and easy to implement and low in manufacturing cost.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board according to an embodiment;
fig. 2 is a schematic structural diagram of a circuit board according to another embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and 2, a circuit board 10 according to an embodiment of the present invention includes a first split plate 100 and a second split plate 200.
The first split plate 100 includes a first plate body 110 and a first connection portion 120 disposed at one end of the first plate body 110. The second split plate 200 includes a second plate body 210 and a second connection part 220 provided at one end of the second plate body 210. The first connecting portion 120 is movably connected to the second connecting portion 220 so that the first split plate 100 can rotate relative to the second split plate 200.
As shown in fig. 1 and 2, the first connecting portion 120 includes a plurality of first protrusions 122 protruding from the edge of the first plate body 110, the second connecting portion 220 includes a plurality of second protrusions 222 protruding from the edge of the second plate body 210, and the first connecting portion 120 and the second connecting portion 220 form a concave-convex structure which is embedded and matched with each other. The first split plate 100 and the second split plate 200 are connected by the concave-convex structure matched with each other, so that the circuit board 10 can be bent to a certain degree, the connection mode is simple, and the processing and the manufacturing are easy.
In the specific example shown in fig. 1, the width of the first protrusion 122 is constant as approaching the second plate body 210. As shown in fig. 1, in this example, the first protrusion 122 is rectangular, and correspondingly, the second protrusion 222 is also rectangular, so as to facilitate machining.
In one example, the width of the first protrusion 122 gradually increases as it approaches the second plate body 210. In the specific example shown in fig. 2, the first protrusion 122 and the second protrusion 222 are trapezoidal, and the first split plate 100 and the second split plate 200 are more firmly connected and are not easily separated from each other.
As shown in fig. 1 and 2, in one example, a first distance a is provided between the outermost end of the first protrusion 122 and the second split plate 200, and a second distance b is provided between the outermost end of the second protrusion 222 and the first plate body 110. In this way, the first split plate 100 can be rotated by a large angle with respect to the second split plate 200, so that the circuit board 10 can be bent by a large angle.
The specific values of the first and second pitches a and b may be determined according to the plate thickness, for example, the first pitch a may be 1/5, 1/4, 1/3, 1/2, etc. of the plate thickness of the first plate body 110, and the second pitch b may be 1/5, 1/4, 1/3, 1/2, etc. of the plate thickness of the second plate body 210.
In order that the rotation of the first split plate 100 is not hindered by the second split plate 200, the first pitch a is not less than 1/2 of the thickness of the first plate body 110, and the second pitch b is not less than 1/2 of the thickness of the second plate body 210. The first pitch a may be 3/5, 4/5 of the plate thickness of the first split plate 100 or the same as the plate thickness of the first plate body 110, etc., and the first pitch b may be 3/5, 4/5 of the plate thickness of the second plate body 210 or the same as the plate thickness of the second plate body 210, etc.
Preferably, the first interval a is not greater than the thickness of the first plate body 110, and the second interval b is not greater than the thickness of the second plate body 210. The first split plate 100 and the second split plate 200 are connected more tightly.
In one example, the first plate body 110 and the second plate body 210 have the same thickness.
It is understood that the circuit board 10 of the present invention includes the first split plate 100 and the second split plate 200, but is not limited to being composed of only the first split plate 100 and the second split plate 200. The circuit board 10 may further include a third split plate that is movably coupled to the first split plate 100 so that the third split plate can rotate with respect to the first split plate 100, or that is movably coupled to the second split plate 200 so that the third split plate can rotate with respect to the second split plate 200. Likewise, the third split plate and the first split plate 100 or the third split plate and the second split plate 200 may be connected in the same manner as the first split plate 100 and the second split plate 200 in the above example.
It is understood that the circuit board 10 may also include more separate boards, such as 5, 10, 15, 20, etc., and the circuit board 10 is formed by splicing a plurality of separate boards. The plurality of split boards may be arranged in the same direction, may be distributed in an array, may be distributed in any other distribution manner capable of bending the circuit board 10, and may be specifically designed according to the application. The adjacent divided plates may be connected in the same manner as the first divided plate 100 and the second divided plate 200 in the above example.
Further, the present invention provides a method for manufacturing the circuit board 10 according to any one of the above examples, which includes the following steps:
providing a substrate;
performing routing processing on the substrate to obtain a first split plate 100 and a second split plate 200, wherein the first split plate 100 comprises a first plate main body 110 and a first connecting part 120 arranged at one end of the first plate main body 110, and the second split plate 200 comprises a second plate main body 210 and a second connecting part 220 arranged at one end of the second plate main body 210;
forming a conductive layer on the first and second split plates 100 and 200;
the first connecting portion 120 is movably connected to the second connecting portion 220, so that the first split plate 100 can rotate relative to the second split plate 200.
The material of the substrate may be, but is not limited to, phenolic resin, epoxy resin, polyimide, and the like.
In the gong process, the substrate is cut into a specific shape, and a board including the first divided board 100 and the second divided board 200 is obtained. The first connecting portion 120 of the first split plate 100 and the second connecting portion 220 of the second split plate 200 are concave-convex structures capable of fitting each other, as by the gong process.
The conductive layer is formed by performing a copper deposition process and a plating process on the first and second split plates 100 and 200.
After the copper deposition process, a thin copper layer is deposited on the first split plate 100 and the second split plate 200 by using a redox reaction. The plating process may include a full-plate plating process and a pattern plating process. Through the electroplating treatment, the copper layers on the first split plate 100 and the second split plate 200 are thickened by using the electrochemical principle.
In one example, the protruding portion of the first connection portion 120 of the first separate plate 100 has a size that is 0.8mil to 1.2mil, such as 1mil, smaller than the size required for actual connection. After the first split plate 100 and the second split plate 200 are subjected to the copper deposition treatment and the electroplating treatment, the first split plate 100 and the second split plate 200 are covered with copper with a thickness controlled to be 1mil to 2mil, such as 1.5mil, so as to facilitate connection.
To facilitate control of routing tolerances, copper thickness, etc., the first body panel 100 and the second body panel 200 are preferably designed within the same large circuit board 10.
The circuit board 10 comprises a first split board 100 and a second split board 200, the first split board 100 is movably connected with the second split board 200, the first split board 100 can rotate relative to the second split board 200, and therefore the circuit board 10 can be bendable to a certain degree, the base material of the circuit board 10 does not need to be made of a material with high flexibility requirement, a common rigid material can be selected as the base material, the material selection range is wide, and the production cost is low.
The manufacturing method of the circuit board 10 is simple and easy to implement and low in manufacturing cost.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A circuit board is characterized by comprising a first split plate and a second split plate, wherein the first split plate comprises a first plate main body and a first connecting part arranged at one end of the first plate main body, the second split plate comprises a second plate main body and a second connecting part arranged at one end of the second plate main body, and the first connecting part and the second connecting part are movably connected so that the first split plate can rotate relative to the second split plate; first connecting portion include a plurality of protrusion in the first arch at first board main part edge, it is a plurality of first arch with first board main part is integrated into one piece, second connecting portion include a plurality of protrusion in the second of second board main part edge is protruding, and is a plurality of the second protruding with second board main part is integrated into one piece, first connecting portion with second connecting portion form and inlay each other and establish complex concave-convex structure, first arch with the protruding position of connecting of second is provided with the conducting layer.
2. The circuit board of claim 1, wherein the conductive layer is a copper layer.
3. The circuit board of claim 2, wherein an outermost end of the first bump is spaced apart from the second split plate by a first distance, and an outermost end of the second bump is spaced apart from the first plate body by a second distance.
4. The circuit board of claim 3, wherein the first pitch is not less than 1/2 of the thickness of the first board body; and/or
The second spacing is not less than 1/2 of the thickness of the second panel body.
5. The circuit board according to any one of claims 1 to 4, wherein the first board main body and the second board main body have the same thickness.
6. The circuit board according to any one of claims 2 to 4, wherein a width of the first projection is constant as approaching the second board main body.
7. The circuit board according to any one of claims 2 to 4, wherein a width of the first projection gradually increases as it approaches the second board main body.
8. The manufacturing method of the circuit board is characterized by comprising the following steps:
providing a substrate;
performing routing processing on the substrate to obtain a first split plate and a second split plate, wherein the first split plate comprises a first plate main body and a first connecting part arranged at one end of the first plate main body, the second split plate comprises a second plate main body and a second connecting part arranged at one end of the second plate main body, through the routing processing, the first connecting part forms a plurality of first bulges protruding out of the edge of the first plate main body, the plurality of first bulges and the first plate main body are integrally formed, the second connecting part forms a plurality of second bulges protruding out of the edge of the second plate main body, the plurality of second bulges and the second plate main body are integrally formed, and the first connecting part and the second connecting part form concave-convex structures which are mutually embedded and matched;
forming a conductive layer on the first and second split plates, and forming the conductive layer at a connection position of the concave-convex structure;
and movably connecting the first connecting part with the second connecting part through the concave-convex structure, so that the first split plate can rotate relative to the second split plate.
9. The method of claim 8, wherein the conductive layer is a copper layer.
10. The manufacturing method according to claim 8 or 9, wherein the conductive layer is formed by subjecting the first split plate and the second split plate to a process including a copper deposition process and an electroplating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910131652.1A CN109757033B (en) | 2019-02-22 | 2019-02-22 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910131652.1A CN109757033B (en) | 2019-02-22 | 2019-02-22 | Circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN109757033A CN109757033A (en) | 2019-05-14 |
| CN109757033B true CN109757033B (en) | 2020-07-10 |
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| CN201910131652.1A Active CN109757033B (en) | 2019-02-22 | 2019-02-22 | Circuit board and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206164988U (en) * | 2016-11-25 | 2017-05-10 | 湖北惠商电路科技有限公司 | Pin -connected panel circuit board |
| CN207340288U (en) * | 2017-08-24 | 2018-05-08 | 深圳市海凌科达科技有限公司 | A kind of Convenient type double-sided PCB board |
| CN207911130U (en) * | 2017-12-08 | 2018-09-25 | 东莞市久源隆电路板有限公司 | A kind of turnover pcb board |
| CN208227439U (en) * | 2018-05-02 | 2018-12-11 | 猫岐智能科技（上海）有限公司 | A kind of concave-convex complementary pcb board structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5454506A (en) * | 1994-03-01 | 1995-10-03 | International Business Machines Corporation | Structure and process for electro/mechanical joint formation |
| JP4719305B1 (en) * | 2010-08-27 | 2011-07-06 | イリソ電子工業株式会社 | connector |
| CN106461897B (en) * | 2014-02-14 | 2020-01-21 | 泰科电子英国有限公司 | Managed connection for optical distribution frame |
| CN208128631U (en) * | 2018-03-26 | 2018-11-20 | 深圳恒宝士线路板有限公司 | Wiring board with concave-convex buckle structure |
-
2019
- 2019-02-22 CN CN201910131652.1A patent/CN109757033B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206164988U (en) * | 2016-11-25 | 2017-05-10 | 湖北惠商电路科技有限公司 | Pin -connected panel circuit board |
| CN207340288U (en) * | 2017-08-24 | 2018-05-08 | 深圳市海凌科达科技有限公司 | A kind of Convenient type double-sided PCB board |
| CN207911130U (en) * | 2017-12-08 | 2018-09-25 | 东莞市久源隆电路板有限公司 | A kind of turnover pcb board |
| CN208227439U (en) * | 2018-05-02 | 2018-12-11 | 猫岐智能科技（上海）有限公司 | A kind of concave-convex complementary pcb board structure |
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| CN109757033A (en) | 2019-05-14 |
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