WO2020253410A1 - Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent - Google Patents

Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent Download PDF

Info

Publication number
WO2020253410A1
WO2020253410A1 PCT/CN2020/089043 CN2020089043W WO2020253410A1 WO 2020253410 A1 WO2020253410 A1 WO 2020253410A1 CN 2020089043 W CN2020089043 W CN 2020089043W WO 2020253410 A1 WO2020253410 A1 WO 2020253410A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
built
power module
circuit substrate
packaging structure
Prior art date
Application number
PCT/CN2020/089043
Other languages
English (en)
Chinese (zh)
Inventor
陈健
吴桢生
汤桂衡
杨轲
Original Assignee
深圳市汇川技术股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇川技术股份有限公司 filed Critical 深圳市汇川技术股份有限公司
Publication of WO2020253410A1 publication Critical patent/WO2020253410A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters

Definitions

  • the embodiment of the present invention relates to the technical field of smart power module packaging, in particular to a smart power module circuit board packaging structure.
  • IPM Intelligent Power Module
  • One packaging method is that the functional circuit unit exists in the form of an integrated circuit chip and is placed on the power circuit substrate in the IPM, and the functional circuit unit performs signal transmission through bonding metal wires and the power unit on the power circuit substrate.
  • This packaging method integrates the functional circuit unit and the power unit on the power circuit substrate. Since the integrated circuit chip of the functional circuit unit generates much less heat than the power unit, it results in the utilization of the power circuit substrate with good thermal conductivity. Not high, which indirectly leads to increased costs.
  • the functional circuit unit exists in the form of a built-in Printed Circuit Board (PCB). Discrete functional devices are placed on the built-in functional PCB.
  • the built-in PCB is usually assembled in the IPM shell through supporting parts on the IPM shell. In the cavity inside the body, the built-in functional PCB performs signal transmission through the bonding metal wire and the power unit on the power circuit substrate in the IPM.
  • This packaging method requires the support parts on the IPM shell to assemble or fix the functional circuit unit.
  • the IPM shell needs to be designed as a separate shell, that is, a shell frame and a cover, and the supporting parts are arranged on the four sides of the shell frame. Compared with the integrated shell, the shell material and assembly process are increased.
  • the existing IPM functional circuit unit packaging method has the problems of low utilization of power circuit substrates and the need to design a separate housing containing supporting components, which leads to increased costs and assembly procedures.
  • the purpose of the embodiments of the present invention is to provide a smart power module circuit board packaging structure to solve the low utilization rate of power circuit substrates in the prior art and the need to design a separate housing containing supporting components, resulting in cost and The problem of increased assembly processes.
  • a smart power module circuit board packaging structure including: a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts for signal transmission and fixing the built-in functional circuit board;
  • the bottom ends of the plurality of connecting posts are fixed on the power circuit substrate, the built-in function circuit board is provided with a plurality of first through holes, and the plurality of first through holes are respectively connected to the plurality of connecting posts one by one
  • the top ends of the plurality of connecting posts respectively pass through the built-in function circuit board through the plurality of first through holes, and are fixedly connected to the built-in function circuit board at the first through holes, so that all
  • the built-in function circuit board is arranged above the power circuit substrate in a stacking manner.
  • the plurality of connecting columns includes a first short connecting column and/or a second long connecting column, wherein:
  • the first short connecting post includes a first post, the bottom end of the first post is fixed on the power circuit substrate, and the top end of the first post passes through the first through hole corresponding to the first post.
  • the built-in function circuit board does not extend afterwards, and the first cylinder is fixedly connected to the built-in function circuit board at its corresponding first through hole;
  • the second long connecting column includes a second column body, the bottom end of the second column body is fixed on the power circuit substrate, and the top end of the second column body passes through the corresponding first through hole.
  • the built-in function circuit board has an extension part, and the second cylinder is fixedly connected with the built-in function circuit board at the corresponding first through hole.
  • the first short connecting column further includes a first base, the bottom surface of the first base is fixed on the power circuit substrate, and the first column is disposed on the first base on.
  • the second connecting post further includes a second base, the bottom surface of the second base is fixed on the power circuit substrate, and the second post is arranged on the second base .
  • the second long connecting pillar passes through the extension portion of the built-in function circuit board and at least one other circuit is stacked board.
  • the bottom ends of the plurality of connecting posts are fixed on the power circuit substrate by welding.
  • the multiple connecting posts are respectively fixed to the built-in functional circuit board at the corresponding first through holes by welding and/or crimping.
  • the smart power module circuit board packaging structure further includes a plurality of limit support pillars with a limit support platform, and the built-in functional circuit board is provided with a plurality of limit support pillars.
  • the bottom ends of the plurality of limit support posts are fixed on the power circuit substrate, and the top ends of the plurality of limit support posts respectively pass through the corresponding second through holes
  • the limit support platforms of the plurality of limit support columns respectively abut against the bottom surface of the built-in function circuit board to limit and support the built-in function circuit board
  • a plurality of limit support pillars are respectively fixedly connected with the built-in function circuit board at the corresponding second through holes.
  • the bottom ends of the multiple limit support columns are all fixed on the power circuit substrate by welding.
  • the plurality of limit support columns are respectively fixed to the built-in functional circuit board at the corresponding second through holes by welding and/or crimping.
  • the smart power module circuit board packaging structure provided by the embodiment of the present invention uses a plurality of connecting posts provided on the power circuit substrate with signal transmission function to fix the built-in functional circuit board, thereby improving the utilization rate of the power circuit substrate and making the
  • the shell of the power module can be designed as an integrated shell, which reduces the cost of shell design and assembly procedures; in addition, the smart power module circuit board packaging structure provided by the embodiment of the present invention has a high space utilization rate, which is beneficial to reduce the volume and size of the smart power module. Increase the power density of smart power modules.
  • FIG. 1 is a schematic structural diagram of a smart power module circuit board packaging structure provided by an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a first short connecting column and a second long connecting column in the smart power module circuit board packaging structure provided by an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a specific implementation example of a smart power module circuit board packaging structure provided by an embodiment of the present invention
  • FIG. 4 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by an embodiment of the present invention
  • FIG. 5 is a schematic structural diagram of a preferred implementation example of the smart power module circuit board packaging structure provided by the embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a packaging structure of a smart power module circuit board provided by another embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a limit support column in a smart power module circuit board packaging structure provided by another embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by another embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by another embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of a preferred implementation example of a smart power module circuit board packaging structure provided by another embodiment of the present invention.
  • Fig. 1 is a schematic structural diagram of a smart power module circuit board packaging structure provided by an embodiment of the present invention. For ease of description, only the parts related to this embodiment are shown.
  • the smart power module circuit board packaging structure includes: a power circuit substrate 1, a built-in functional circuit board 2 and multiple connecting posts for signal transmission and fixing the built-in functional circuit board 2 3; the bottom ends of the plurality of connecting posts 3 are fixed on the power circuit substrate 1, the built-in function circuit board 2 is provided with a plurality of first through holes, and the plurality of first through holes are connected to the The plurality of connecting posts 3 correspond to each other one by one.
  • the top ends of the plurality of connecting posts 3 respectively pass through the built-in function circuit board 2 through the plurality of first through holes, and are connected to the first through holes.
  • the built-in function circuit board 2 is fixedly connected so that the built-in function circuit board 2 is arranged above the power circuit substrate 1 in a stacking manner.
  • the power circuit substrate 1 includes but is not limited to aluminum-based resin copper clad laminate, copper-based resin copper clad laminate, or double-sided copper-clad ceramic substrate, and the welding function on the power circuit substrate 1 is not limited to inverter, rectifier, and manufacturing. Power switching devices such as moving and buffering 11.
  • the functions welded on the built-in functional circuit board 2 are not limited to discrete functional devices 22 such as power supply, signal sampling and conditioning, protection, driving, and Microcontroller Unit (MCU) operations.
  • MCU Microcontroller Unit
  • the bottom ends of the plurality of connecting posts 3 are fixed on the power circuit substrate 1 by welding; the plurality of connecting posts 3 are respectively located at their corresponding first through holes
  • the fixing with the built-in function circuit board 2 is realized by welding or crimping.
  • multiple connecting posts are fixed on the power circuit substrate 1 by welding, and are fixed to the built-in functional circuit board by welding and/or crimping, which can ensure that the connecting posts and the power circuit substrate
  • the plurality of connecting pillars 3 include a first short connecting pillar 31 and/or a second long connecting pillar 32, wherein:
  • the first short connecting post 31 includes a first post 311, the bottom end of the first post 311 is fixed on the power circuit substrate 1, and the top end of the first post 311 passes through the corresponding first post.
  • the through hole no longer extends after passing through the built-in function circuit board 2, and the first post 311 is fixedly connected to the built-in function circuit board 2 at the corresponding first through hole;
  • the second long connecting post 32 includes a second post 321, the bottom end of the second post 321 is fixed on the power circuit substrate 1, and the top end of the second post 321 passes through the corresponding first
  • the through hole passes through the built-in function circuit board 2 and has an extension, and the second post 321 is fixedly connected to the built-in function circuit board 2 at the corresponding first through hole.
  • the bottom end of the first pillar 311 is fixed on the power circuit substrate 1 by welding, and the first pillar 311 is welded and/or at its corresponding first through hole.
  • the crimping method realizes a fixed connection with the built-in function circuit board 2.
  • the bottom end of the second pillar 321 is fixed on the power circuit substrate 1 by welding, and the second pillar 321 is welded and/or at its corresponding first through hole.
  • the crimping method realizes a fixed connection with the built-in function circuit board 2.
  • the top ends of the first cylinder 311 and the second cylinder 322 can be set in a needle-like shape, which is convenient for the first cylinder 311 and the second cylinder 322 to quickly pass through.
  • the first through hole on the built-in function circuit board 2 is convenient for assembly.
  • the appearance realization form of the first column 311 and the second column 321 is not limited by a certain fixed shape.
  • the first column Specific implementation forms of 311 and the second column 321 include but are not limited to cylindrical terminals, regular polygon terminals and/or flat terminals.
  • the first short connecting post 31 may further include a first base 312, the bottom surface of the first base 312 is fixed on the power circuit substrate 1, and the first post 311 Set on the first base 312.
  • the bottom surface of the first base 312 is soldered on the power circuit substrate 2.
  • the first base 312 and the first post 311 may be integrally formed terminals, or may be two separate parts.
  • the first base 312 and the first column 311 are two separate parts, the first base 312 has a first insertion hole, and the bottom end of the first column 311 passes through the first The jack is plugged into the first base 312.
  • the second connecting post may further include a second base 322 with a second insertion hole, the bottom surface of the second base 322 is fixed on the power circuit substrate 1, and the second base 322 The bottom end of the two pillars 321 is inserted into the second base 322 through the second socket.
  • the bottom surface of the second base 322 is soldered on the power circuit substrate 1.
  • the second base 322 and the second post 321 may be integrally formed terminals, or may be two separate parts.
  • the second base 322 and the second cylinder 321 are two separate parts, the second base 322 has a second insertion hole, and the bottom end of the second cylinder 321 passes through the second The jack is plugged into the second base 322.
  • the arrangement of the first base 312 and the second base 322 can improve the stability of the connection between the connecting post 3 and the power circuit substrate 1.
  • the first base 312 and the second base 322 can be soldered to the power circuit substrate 1 during packaging.
  • the second long connecting pillars 32 pass through the extension portion of the built-in function circuit board 2 to at least stack One other circuit board is stacked.
  • a plurality of first through holes corresponding to the second long connecting post 32 are opened on the other circuit board, and the extension portion of the second long connecting post 32 passes through the corresponding first through hole.
  • the plurality of connection posts 3 between the power circuit substrate 1 and the built-in function circuit board 2 includes a first short connection post 31 and a second long connection post 32, wherein the power circuit substrate 1 Each side contains at least one connection post, and the first short connection post 31 and the second long connection post 32 are distributed around the power circuit substrate 1 and the central area as required to establish the built-in
  • the functional circuit board 2 and the power circuit substrate 1 transmit power or signal, and at the same time support and fix the built-in functional circuit board 2.
  • the extended portion of the second long connecting post 32 passing through the built-in function circuit board 2 can stack more circuit boards.
  • the multiple connecting posts 3 between the power circuit substrate 1 and the built-in function circuit board 2 are the first short connecting posts 31, and each side of the power circuit substrate 1 At least one of the first short connecting posts 31 is included, and the first short connecting posts 31 are distributed around and in the central area of the power circuit substrate 1 as required to establish the built-in functional circuit board 2 and the power
  • the power or signal transmission function between the circuit boards 1 also supports and fixes the built-in function circuit board 2.
  • the multiple connecting posts 3 between the power circuit substrate 1 and the built-in function circuit board 2 are the second long connecting posts 32, and each side of the power circuit substrate 1 At least one second long connecting post 32 is included, and the second long connecting post 32 is distributed around and the central area of the power circuit substrate 1 as required to establish the built-in functional circuit board 2 and the power
  • the power or signal transmission function between the circuit boards 1 also supports and fixes the built-in function circuit board 2.
  • the extension part after the second long connecting post 32 passes through the built-in function circuit board 2 can be stacked with more circuit boards.
  • first short connecting post 31 and the second long connecting post 32 in the smart power module circuit board packaging structure shown in FIGS. 1 to 5 respectively include a first base 312 and a second base 322
  • first short connecting column 31 and the second long connecting column 32 may not include a base.
  • the above three specific implementation manners are only three preferred implementation manners exemplified by the present invention, and are not used to limit the protection scope of the present invention.
  • the smart power module circuit board packaging structure provided by this embodiment adopts a plurality of connecting posts provided on the power circuit substrate with signal transmission functions to fix the built-in functional circuit board, thereby improving the utilization rate of the power circuit substrate.
  • the shell of the smart power module to be designed as an integrated shell, reducing shell design costs and assembly procedures;
  • the smart power module circuit board packaging structure provided by the embodiment of the present invention makes the shell design free from the built-in functional circuit board assembly method This reduces the workload of module design, and the stacked stacked package structure of the embodiment of the present invention has a high space utilization rate, which is beneficial to reduce the volume of the smart power module and increase the power density of the smart power module.
  • Fig. 6 is a schematic structural diagram of a smart power module circuit board packaging structure provided by another embodiment of the present invention. For convenience of description, only the parts related to this embodiment are shown.
  • the smart power module circuit board packaging structure provided in this embodiment further includes a plurality of limit support columns 4 having a limit support platform 41, and the limit support columns
  • the built-in function circuit board 2 is provided with second through holes corresponding to a plurality of limit support columns 4 one-to-one; the bottom ends of the plurality of limit support columns 4 Are fixed on the power circuit substrate 1, and the top ends of the plurality of limit support posts 4 respectively pass through the built-in function circuit board 2 through the corresponding second through holes, so that the plurality of limit support posts
  • the limit support platform 41 of 4 respectively abuts against the bottom surface of the built-in function circuit board 2 to limit and support the built-in function circuit board 2, and the plurality of limit support posts 4 respectively correspond to
  • the second through hole is fixedly connected to the built-in function circuit board 2.
  • the bottom ends of the plurality of limit support posts 4 are fixed on the power circuit substrate 1 by welding; the plurality of limit support posts 4 are respectively located in their corresponding second through holes The location is fixed to the built-in functional circuit board 2 by welding and/or crimping.
  • a plurality of connection posts 3 and a plurality of limit support posts 4 are provided between the power circuit substrate 1 and the built-in function circuit board 2, wherein the plurality of connection posts 3 include first short The connecting pillars 31 and the second long connecting pillars 32, the plurality of limit support pillars 4 are evenly distributed on the four sides of the power circuit substrate 1, and each side of the power circuit substrate 1 contains at least one limiter.
  • the position support column 4 plays a role of limiting, supporting and fixing the built-in function circuit board 2; the first short connecting column 31 and the second long connecting column 32 are distributed on the power circuit substrate as required Any area of 1 plays a role in establishing power or signal transmission between the built-in functional circuit board 2 and the power circuit board 1, and at the same time supports and fixes the built-in functional circuit board 2.
  • the second long connecting post 32 passes through the extended portion of the built-in function circuit board 2 to allow more circuit boards to be stacked.
  • a plurality of connection posts 3 and a plurality of limit support posts 4 are provided between the power circuit substrate 1 and the built-in function circuit board 2, wherein the plurality of connection posts 3 are all first The short connecting post 31, wherein the multiple limit support posts 4 are evenly distributed on the four sides of the power circuit substrate 1, and each side of the power circuit substrate 1 contains at least one limit support post 4. Play the role of limiting, supporting and fixing the built-in function circuit board 2; the first short connecting posts 31 are distributed in any area of the built-in function circuit board 2 according to needs to establish the The function of power or signal transmission between the built-in function circuit board 2 and the power circuit substrate 1, while supporting and fixing the built-in function circuit board 2.
  • a plurality of connection posts 3 and a plurality of limit support posts 4 are provided between the power circuit substrate 1 and the built-in function circuit board 2, wherein the plurality of connection posts 3 are all second Long connecting post 32, wherein the plurality of limit support posts 4 are evenly distributed on the four sides of the power circuit substrate 1, and each side of the power circuit substrate 1 contains at least one limit support post 4.
  • Play the role of limiting, supporting and fixing the built-in function circuit board 2; the second long connecting posts 32 are distributed in any area of the built-in function circuit board 2 according to needs to establish the The function of power or signal transmission between the built-in function circuit board 2 and the power circuit substrate 1, while supporting and fixing the built-in function circuit board 2.
  • the extended portion of the second long connecting post 32 passing through the built-in function circuit board 2 can stack more circuit boards.
  • the first short connecting post 31 and the second long connecting post 32 respectively include a first base 312 and a second base 312
  • the second base 322 in specific implementation, the first short connecting column 31 and the second long connecting column 32 may not include a base.
  • the above three specific implementation manners are only three preferred implementation manners exemplified by the present invention, and are not used to limit the protection scope of the present invention.
  • the smart power module circuit board packaging structure provided in this embodiment can also increase the utilization rate of the power circuit substrate, reduce the shell design cost and assembly process of the smart power packaging module, reduce the workload of the module design, and reduce the smart power The volume of the module and increase the power density of the smart power module.
  • the smart power module circuit board packaging structure provided in this embodiment is provided between the power circuit substrate and the built-in functional circuit board for limiting the built-in functional circuit board. Position, support and fixed limit support column, which can further improve the stability of the built-in functional circuit board packaging.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une structure d'encapsulation pour une carte de circuit imprimé d'un module de puissance intelligent, se rapportant au domaine technique de l'encapsulation de module de puissance intelligent. La structure comprend : un substrat de circuit de puissance, une carte de circuit imprimé fonctionnel intégrée, et une pluralité de bornes de connexion pour transmettre des signaux et fixer la carte de circuit imprimé fonctionnel intégrée, les extrémités inférieures de la pluralité de bornes de connexion étant fixées sur le substrat de circuit de puissance ; une pluralité de premiers trous traversants sont ménagés dans la carte de circuit imprimé fonctionnel intégrée, et la pluralité de premiers trous traversants correspondent respectivement à la pluralité de bornes de connexion d'une manière biunivoque ; et les extrémités supérieures de la pluralité de bornes de connexion s'étendent respectivement à travers la carte de circuit imprimé fonctionnel intégrée par la pluralité de premiers trous traversants, et sont reliées de manière fixe à la carte de circuit imprimé fonctionnel intégrée au niveau des premiers trous traversants, de telle sorte que la carte de circuit imprimé fonctionnel intégrée est agencée au-dessus du substrat de circuit de puissance d'une manière empilée. Selon les modes de réalisation de la présente invention, le taux d'utilisation du substrat de circuit de puissance peut être amélioré, les coûts de conception de boîtier et les processus d'assemblage de module de puissance intelligent peuvent être réduits, et une réduction du volume du module de puissance intelligent et une augmentation de la densité de puissance du module de puissance intelligent peuvent être facilitées.
PCT/CN2020/089043 2019-06-20 2020-05-07 Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent WO2020253410A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910537615.0 2019-06-20
CN201910537615.0A CN110213929A (zh) 2019-06-20 2019-06-20 智能功率模块电路板封装结构

Publications (1)

Publication Number Publication Date
WO2020253410A1 true WO2020253410A1 (fr) 2020-12-24

Family

ID=67793710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/089043 WO2020253410A1 (fr) 2019-06-20 2020-05-07 Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent

Country Status (2)

Country Link
CN (1) CN110213929A (fr)
WO (1) WO2020253410A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110213929A (zh) * 2019-06-20 2019-09-06 深圳市汇川技术股份有限公司 智能功率模块电路板封装结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120320545A1 (en) * 2011-06-20 2012-12-20 Stmicroelectronics S.R.L. Intelligent power module and related assembling method
US20160218454A1 (en) * 2015-01-22 2016-07-28 Delta Electronics, Inc. Package structure of power module
CN206452611U (zh) * 2017-01-20 2017-08-29 深圳市鹏博辉电子有限公司 多层柔性电路板
CN208623979U (zh) * 2018-08-03 2019-03-19 西安艾克普斯电子科技有限公司 一种双层电路板及具有该双层电路板的开关电源
CN110197824A (zh) * 2019-06-20 2019-09-03 深圳市汇川技术股份有限公司 智能功率模块封装结构
CN110213929A (zh) * 2019-06-20 2019-09-06 深圳市汇川技术股份有限公司 智能功率模块电路板封装结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103140103B (zh) * 2013-01-28 2015-12-23 台达电子企业管理（上海）有限公司 智能功率模块的封装结构
CN203378132U (zh) * 2013-06-03 2014-01-01 广州金升阳科技有限公司 一种单元电路板组装结构
CN105870073B (zh) * 2015-01-22 2019-02-15 台达电子工业股份有限公司 功率模块的封装结构
CN210781761U (zh) * 2019-06-20 2020-06-16 深圳市汇川技术股份有限公司 智能功率模块电路板封装结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120320545A1 (en) * 2011-06-20 2012-12-20 Stmicroelectronics S.R.L. Intelligent power module and related assembling method
US20160218454A1 (en) * 2015-01-22 2016-07-28 Delta Electronics, Inc. Package structure of power module
CN206452611U (zh) * 2017-01-20 2017-08-29 深圳市鹏博辉电子有限公司 多层柔性电路板
CN208623979U (zh) * 2018-08-03 2019-03-19 西安艾克普斯电子科技有限公司 一种双层电路板及具有该双层电路板的开关电源
CN110197824A (zh) * 2019-06-20 2019-09-03 深圳市汇川技术股份有限公司 智能功率模块封装结构
CN110213929A (zh) * 2019-06-20 2019-09-06 深圳市汇川技术股份有限公司 智能功率模块电路板封装结构

Also Published As

Publication number Publication date
CN110213929A (zh) 2019-09-06

Similar Documents

Publication Publication Date Title
CN201323341Y (zh) 线缆连接器组件
JP2002076252A (ja) 半導体装置
JP2002151648A (ja) 半導体モジュール
WO2017092373A1 (fr) Structure de connexion électrique intégrée pour lampe à del
WO2020253411A1 (fr) Structure de conditionnement de module de puissance intelligent
US7196269B2 (en) Mounting structure for circuit board terminal
WO2020253410A1 (fr) Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent
CN210781761U (zh) 智能功率模块电路板封装结构
CN205692826U (zh) 芯片封装用垂直过渡连接器、基板结构
CN210042212U (zh) 一种mems麦克风
JP4208490B2 (ja) 半導体電力用モジュール及びその製造方法
CN105742274B (zh) 芯片封装用垂直过渡连接器、基板结构及制作方法
JP2006303248A (ja) 三次元基板間接続部品、電子機器及び電子機器の製造方法
CN220493246U (zh) 焊盘、电路板封装组件和电子设备
JP2649252B2 (ja) 多層プリント配線板
CN216015356U (zh) 功率模块的Pressfit端子连接结构及功率模块
CN216162929U (zh) 一种改善emi的led驱动电路结构
CN212676245U (zh) 叠层板及无表面镀层的立体封装结构
CN210110755U (zh) 封装结构
CN216123003U (zh) 一种具有自主散热功能的双层pcb板
WO2011020341A1 (fr) Module électronique et procédé de mise sous boîtier de celui-ci
CN201845771U (zh) 一种新型封装结构的大功率模块
JPH07221419A (ja) 混成集積回路装置
US20020190367A1 (en) Slice interconnect structure
JPH0343728Y2 (fr)

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20826286

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20826286

Country of ref document: EP

Kind code of ref document: A1