CN103140103B - 智能功率模块的封装结构 - Google Patents
智能功率模块的封装结构 Download PDFInfo
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105870073B (zh) * | 2015-01-22 | 2019-02-15 | 台达电子工业股份有限公司 | 功率模块的封装结构 |
CN106558567B (zh) * | 2015-09-29 | 2020-03-31 | 比亚迪股份有限公司 | 智能功率模块及其制作方法 |
CN106783815A (zh) * | 2016-11-14 | 2017-05-31 | 广州瓦良格机器人科技有限公司 | 一种八单元igbt功率模块 |
CN106505875B (zh) * | 2016-11-14 | 2019-05-28 | 广州瓦良格机器人科技有限公司 | 一种防腐防爆智能ipm变频模块 |
CN110213929A (zh) * | 2019-06-20 | 2019-09-06 | 深圳市汇川技术股份有限公司 | 智能功率模块电路板封装结构 |
CN112467957A (zh) * | 2020-10-10 | 2021-03-09 | 山东斯力微电子有限公司 | 一种智能型大功率igbt模块 |
CN112467439A (zh) * | 2020-11-16 | 2021-03-09 | 东莞市鼎通精密科技股份有限公司 | 一种组合连接器 |
Citations (4)
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CN101453158A (zh) * | 2008-12-26 | 2009-06-10 | 南京银茂微电子制造有限公司 | 一种用于小型变频器的功率模块 |
CN102254892A (zh) * | 2011-08-10 | 2011-11-23 | 嘉兴斯达微电子有限公司 | 一种薄型大功率半导体模块 |
CN102264200A (zh) * | 2011-07-01 | 2011-11-30 | 江苏宏微科技有限公司 | 智能功率模块 |
CN202352645U (zh) * | 2011-11-30 | 2012-07-25 | 江苏宏微科技有限公司 | 半导体功率模块封装外壳结构 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101453158A (zh) * | 2008-12-26 | 2009-06-10 | 南京银茂微电子制造有限公司 | 一种用于小型变频器的功率模块 |
CN102264200A (zh) * | 2011-07-01 | 2011-11-30 | 江苏宏微科技有限公司 | 智能功率模块 |
CN102254892A (zh) * | 2011-08-10 | 2011-11-23 | 嘉兴斯达微电子有限公司 | 一种薄型大功率半导体模块 |
CN202352645U (zh) * | 2011-11-30 | 2012-07-25 | 江苏宏微科技有限公司 | 半导体功率模块封装外壳结构 |
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Inventor after: Liao Xueguo Inventor after: Yuan Dewei Inventor after: Ji Weihao Inventor after: Zhou Yikai Inventor after: Cai Mingyuan Inventor before: Nie Shiyi Inventor before: Yao Yushuang Inventor before: Ma Changsheng Inventor before: Wang Xiaobao |
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