CN204046434U - 三相整流桥功率模块 - Google Patents
三相整流桥功率模块 Download PDFInfo
- Publication number
- CN204046434U CN204046434U CN201420046329.7U CN201420046329U CN204046434U CN 204046434 U CN204046434 U CN 204046434U CN 201420046329 U CN201420046329 U CN 201420046329U CN 204046434 U CN204046434 U CN 204046434U
- Authority
- CN
- China
- Prior art keywords
- copper
- ceramic substrate
- rectifier diode
- reflow soldering
- dbc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010949 copper Substances 0.000 claims abstract description 98
- 229910052802 copper Inorganic materials 0.000 claims abstract description 92
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000919 ceramic Substances 0.000 claims abstract description 48
- 238000005476 soldering Methods 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920003023 plastic Polymers 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 239000000565 sealant Substances 0.000 claims abstract description 6
- 239000010959 steel Substances 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract 1
- 239000000499 gel Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Rectifiers (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420046329.7U CN204046434U (zh) | 2014-01-25 | 2014-01-25 | 三相整流桥功率模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420046329.7U CN204046434U (zh) | 2014-01-25 | 2014-01-25 | 三相整流桥功率模块 |
Publications (1)
Publication Number | Publication Date |
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CN204046434U true CN204046434U (zh) | 2014-12-24 |
Family
ID=52247057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420046329.7U Expired - Lifetime CN204046434U (zh) | 2014-01-25 | 2014-01-25 | 三相整流桥功率模块 |
Country Status (1)
Country | Link |
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CN (1) | CN204046434U (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103795272A (zh) * | 2014-01-25 | 2014-05-14 | 嘉兴斯达半导体股份有限公司 | 一种三相整流桥功率模块 |
CN107635387A (zh) * | 2017-08-16 | 2018-01-26 | 中国电子科技集团公司第十八研究所 | 一种防电磁干扰功率调节电路集成模块及装联方法 |
CN108233820A (zh) * | 2016-12-16 | 2018-06-29 | 上海电驱动股份有限公司 | 一种bsg电机控制器用集成电气模块 |
CN108598067A (zh) * | 2018-04-19 | 2018-09-28 | 如皋市大昌电子有限公司 | 一种半导体整流桥及其制备方法 |
US10403558B2 (en) | 2017-08-23 | 2019-09-03 | Ford Global Technologies, Llc | Power module with multi-layer substrate |
CN111162051A (zh) * | 2019-12-23 | 2020-05-15 | 湖南国芯半导体科技有限公司 | 功率端子、功率模块封装结构及封装方法 |
CN113141122A (zh) * | 2020-01-20 | 2021-07-20 | 珠海格力电器股份有限公司 | 一种智能功率模块及其制备方法 |
CN113824337A (zh) * | 2021-09-16 | 2021-12-21 | 捷捷半导体有限公司 | 一种三相整流模块及其制作方法 |
-
2014
- 2014-01-25 CN CN201420046329.7U patent/CN204046434U/zh not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103795272A (zh) * | 2014-01-25 | 2014-05-14 | 嘉兴斯达半导体股份有限公司 | 一种三相整流桥功率模块 |
CN108233820A (zh) * | 2016-12-16 | 2018-06-29 | 上海电驱动股份有限公司 | 一种bsg电机控制器用集成电气模块 |
CN108233820B (zh) * | 2016-12-16 | 2024-06-11 | 上海电驱动股份有限公司 | 一种bsg电机控制器用集成电气模块 |
CN107635387A (zh) * | 2017-08-16 | 2018-01-26 | 中国电子科技集团公司第十八研究所 | 一种防电磁干扰功率调节电路集成模块及装联方法 |
CN107635387B (zh) * | 2017-08-16 | 2019-12-27 | 中国电子科技集团公司第十八研究所 | 一种防电磁干扰功率调节电路集成模块及装联方法 |
US10403558B2 (en) | 2017-08-23 | 2019-09-03 | Ford Global Technologies, Llc | Power module with multi-layer substrate |
CN108598067A (zh) * | 2018-04-19 | 2018-09-28 | 如皋市大昌电子有限公司 | 一种半导体整流桥及其制备方法 |
CN111162051A (zh) * | 2019-12-23 | 2020-05-15 | 湖南国芯半导体科技有限公司 | 功率端子、功率模块封装结构及封装方法 |
CN111162051B (zh) * | 2019-12-23 | 2021-08-03 | 湖南国芯半导体科技有限公司 | 功率端子、功率模块封装结构及封装方法 |
CN113141122A (zh) * | 2020-01-20 | 2021-07-20 | 珠海格力电器股份有限公司 | 一种智能功率模块及其制备方法 |
CN113824337A (zh) * | 2021-09-16 | 2021-12-21 | 捷捷半导体有限公司 | 一种三相整流模块及其制作方法 |
CN113824337B (zh) * | 2021-09-16 | 2023-12-12 | 捷捷半导体有限公司 | 一种三相整流模块及其制作方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Three-phase rectifier bridge power module Effective date of registration: 20151209 Granted publication date: 20141224 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2015990001099 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20161212 Granted publication date: 20141224 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2015990001099 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Three-phase rectifier bridge power module Effective date of registration: 20161216 Granted publication date: 20141224 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2016330000098 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180904 Granted publication date: 20141224 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2016330000098 |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20141224 |