JP3842010B2

JP3842010B2 - Electronic equipment having multiple substrates

Info

Publication number: JP3842010B2
Application number: JP2000150986A
Authority: JP
Inventors: 功安積; 哲司渡辺
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2000-05-23
Filing date: 2000-05-23
Publication date: 2006-11-08
Anticipated expiration: 2020-05-23
Also published as: JP2001332868A

Description

【０００１】
【発明の属する技術分野】
この発明は、車両などに使用される耐環境性に優れた電子機器、特に複数の基板を有する電子機器に関するものである。
【０００２】
【従来の技術】
従来、車両に搭載される電子機器はプリント基板に各種の電子部品を搭載し、これをケースに収納固定してカバーなどにより密封する構成が多く使用されてきた。プリント基板に搭載される電子部品にはコンデンサや電磁コイルなどの大型電子部品と、パワートランジスタなどの発熱部品と、抵抗やチップ部品などの小型電子部品とに分類できるが、従来の電子機器ではこれらが同一のプリント基板に混在して搭載されるのが通常であった。しかし、大型電子部品に対しては耐振性に、発熱部品に対しては放熱性に、チップ部品などの小型電子部品に対しては耐湿性にと、それぞれ異なる配慮を必要とするものであり、これらを満足するために各種の方策が講じられてきた。特開平８−１８１４７１号公報には、このような電子機器の耐環境性を改善するための技術の一例が開示されている。
【０００３】
この公報に開示された技術は、各種の電子部品を搭載したプリント基板を取り付けるケース本体の側面に袋穴部を設け、この袋穴部の開口部を覆うようにプリント基板を取り付けると共に、プリント基板に取り付けられた発熱部品を袋穴部内に収納するようにし、この発熱部品が袋穴部内の周面の少なくとも二面に当接するように構成することにより、熱伝導性と耐振性とを得るように構成し、さらに、プリント基板に切り欠きを設けて弾力性を得ることにより、発熱部品とプリント基板との半田接続部に加わる応力を低減し、発熱部品と袋穴部の周面との当接を良好に保つようにしたものであり、ケースに収納されたプリント基板は上面と下面とにカバーを設けて三ピース構成として耐水性などの環境にも対処するようにしたものである。
【０００４】
上記に示したような従来例ではプリント基板に全電子部品を装着して完成品となし、しかる後にケースに収納するのが一般的であるが、近年、電子機器の制御内容の多様化に伴い、目的に応じて分割された複数のプリント基板をそれぞれ半完成品とした上でケースに組み付け、組み付け後にプリント基板間やプリント基板と端子との間をボンディングワイヤにて接続する構成の電子機器が増加してきた。このボンディングワイヤの使用は、ケースに装着後ではフロー半田が不可能であること、および、ワイヤボンディングの信頼性が向上してきたことによるものである。
【０００５】
【発明が解決しようとする課題】
このような分割された複数のプリント基板を使用し、組み付け後にプリント基板間などをボンディングワイヤにて接続する電子機器において、車両に搭載される電子機器、特に内燃機関の近傍に装着される電子機器は悪環境下で使用され、耐振性や耐湿性が強く要求される。そのために、コンデンサや電磁コイルなどの大型電子部品は、硬質充填材により部品相互間や、部品とプリント基板との間の接着固定が行われるが、充填材に使用される硬質樹脂は硬化反応する間において比較的流動性が大きくなるため、また、近接した場所にあっては充填作業中の誤った滴下などにより、ボンディングワイヤや小型チップ部品に硬質充填材が付着することがあり、この硬質充填材が使用中の熱膨張などによりボンディングワイヤとそのボンディング部や小型部品の半田接合部に繰り返し応力を加え、破損に至らしめることがあった。
【０００６】
この発明はこのような課題を解決するためになされたもので、耐振性などの耐環境性と生産性とに優れた車載用の複数基板を有する電子機器を得ることを目的とするものである。
【０００７】
【課題を解決するための手段】
この発明に係わる複数基板を有する電子機器は、耐振処理を必要とする大型電子部品を搭載すると共に、一端にボンディングワイヤ接続座を有する第一のプリント基板と、耐湿処理を必要とする小型電子部品と発熱部品とを搭載する第二のプリント基板と、第一のプリント基板と第二のプリント基板とを保持するベース部材と、このベース部材に固定され、第一のプリント基板と第二のプリント基板の周囲を取り囲むフレームと、このフレームに一体に構成され、フレーム内の空間を第一のプリント基板の大型電子部品搭載部を収納する第一の隔室と、第一のプリント基板のボンディングワイヤ接続座部と第二のプリント基板とを収納する第二の隔室とに分離する仕切壁と、フレームの反ベース部材側開口部を覆うカバーとを備え、前記フレームには一体構成されたコネクタハウジングが設けられ、このコネクタハウジングは前記第二の隔室側に配設され、ボンディングワイヤにより前記第二の隔室側で前記第一及び第二のプリント基板にそれぞれ接続され、前記第一の隔室内には硬質の充填材が充填され、第二の隔室内には軟質の充填材が充填されると共に、前記第二のプリント基板を発熱部品を搭載する高熱伝導性のプリント基板と、低発熱部品を搭載するプリント基板とに分割するようにしたものである。
【０００８】
また、第一の隔室内および第二の隔室内にそれぞれ硬質充填材、軟質充填材を充填する代わりに、第一の隔室内では大型電子部品が硬質樹脂により接着固定され、第二の隔室内には軟質樹脂が塗布されるようにしたものである。
さらにまた、第一のプリント基板と仕切壁との間に充填材の流動を防止する目張り用樹脂が塗布されるようにしたものである。
【０００９】
また、発熱部品を搭載する高熱伝導性のプリント基板が、高熱伝導性の接着材によりベース部材に接着されるようにしたものである。
さらにまた、カバーが、収納部品の高さに応じて第一の隔室側が高く、第二の隔室側が低く形成されるようにしたものである。
【００１０】
【発明の実施の形態】
実施の形態１．
図１ないし図４は、この発明の実施の形態１の複数基板を有する電子機器の構成例を示すもので、図１はその断面図、図２はカバーを除去した状態における上面図、図３と図４とは端子部の断面図である。図において、１は例えばアルミダイカストなどにより形成され、取り付け穴１ａと１ｂとを有するベース部材、２はベース部材１に接着などにより取り付けられた第一のプリント基板であり、この第一のプリント基板２は例えばガラスエポキシなどの材料により形成され、電子機器に使用される電子部品の内、例えばコンデンサや電磁コイルなどの比較的大質量の大型電子部品３、４が装着され、一端にはこの第一のプリント基板と他のプリント基板、あるいは、口出し用の端子と接続するための接続座２ａが設けられている。
【００１１】
５はベース部材１に取り付けられた第二のプリント基板であり、例えばセラミックなど熱伝導性の良好な材料にて形成され、パワートランジスタのベアチップ部品などの発熱部品６が半田付けにより搭載されると共に、ベース部材１との接着には例えば高熱伝導性のシリコン接着剤７が用いられ、発熱部品６の熱が第二のプリント基板５からベース部材１に容易に放熱されるように構成されている。８はベース部材１に接着などにより取り付けられた第三のプリント基板であり、例えば多層のガラスエポキシなどの材料により形成され、発熱の少ない小型電子部品９が半田付けにより両面実装されている。またこれらの各プリント基板５、８にも隣接するプリント基板間やプリント基板と端子とを接続するための接続座が設けられている。
【００１２】
１０はポリブチレン・テレフタレートなどの合成樹脂により成型されたフレームであり、上記のベース部材１に取り付けられた第一から第三までの各プリント基板２、５、８の周囲を囲むように構成され、ベース部材１に設けられた溝１ｃにフレーム１０の下端面に設けられたリブ１０ａが嵌り込み、溝１ｃ内に充填された接着剤により気密的にベース部材１に取り付けられている。１１はフレーム１０とは一体に設けられた仕切壁であり、フレーム１０とベース部材１とで形成された空間を、第一のプリント基板２側の第一の隔室１２と、第二と第三のプリント基板５、８側の第二の隔室１３とに分割するように構成されている。
【００１３】
第一のプリント基板２は第一の隔室１２から仕切壁１１とベース部材１との間隙を通して第二の隔室１３側に延長されており、第一の隔室１２内には大型電子部品３と４とが収納され、第二の隔室１３内には第一のプリント基板に設けられた接続座２ａと、第二のプリント基板５に搭載された発熱部品６と、第三のプリント基板８に搭載された小型電子部品９とが収納されるように構成され、第一のプリント基板２と仕切壁１１との間には目張り用樹脂１４が充填、または、塗布されて第一のプリント基板２の表面を第一の隔室１２側と第二の隔室１３側とに気密的に隔離している。
【００１４】
１５ａと１５ｂとはフレーム１０の周壁に一体構成されたコネクタハウジングであり、これらのコネクタハウジング１５ａと１５ｂとは第二の隔室１３側に設けられ、図３および図４に示すようにそれぞれが端子１６を有しており、各プリント基板２、５、８と端子１６との間はボンディングワイヤ１７ａにより接続され、また各プリント基板２、５、８間も接続座間においてボンディングワイヤ１７ｂにより接続されている。１８は第一のプリント基板２に搭載された大型電子部品３と４とを固定して耐振性を得るために第一の隔室１２内に充填された硬質充填材、１９は第二のプリント基板５に搭載された発熱部品と第三のプリント基板８に搭載された小型部品、および、ボンディングワイヤ１７ａ、１７ｂを保護するために第二の隔室１３に充填された軟質充填材である。
【００１５】
２０はフレーム１０に設けられた溝１０ｂにリブ２０ａが嵌り込み、溝１０ｂ内に充填された接着剤により気密的にフレーム１０に取り付けられたカバーであり、第一の隔室１２と第二の隔室１３との防水性を維持すると共に、大型電子部品３と４とを収納する第一の隔室１２側では収納部品の高さに合わせて高く、第二の隔室１３側では収納部品の高さに合わせて低く形成することにより、電子機器自体の容積を低減するように配慮されている。
【００１６】
このような構成を持つこの発明の実施の形態１の複数基板を有する電子機器においては、まず、各プリント基板２、５、８に電子部品を搭載して例えばフロー半田により接続固定し、これらの各プリント基板２、５、８をベース部材１の所定の場所に接着固定する。各プリント基板２、５、８の取り付けが完了するとフレーム１０をベース部材１に接着固定し、その後に各プリント基板２、５、８間と、各プリント基板２、５、８と端子１６との間を接続するワイヤボンディング作業が行われる。各ボンディングワイヤ１７ａと１７ｂとは太さが数百μｍのアルミ細線にて形成され、大電流の箇所には複数本が並列に設けられるが、振動や熱膨張によるストレスには充分な配慮が必要なものである。
【００１７】
ワイヤボンディング作業と中間チェックが完了すると第一のプリント基板２と仕切壁１１の下面との間には例えば高チキソ性シリコンゲルなど、流動性の少ない樹脂による目張り用樹脂１４が充填または塗布され、大型電子部品３と４とを収納する第一の隔室１２には熱硬化性、あるいは、常温硬化性の硬質充填材１８が充填されて耐振構造とされ、また、発熱部品６や小型電子部品９が収納されると共に、ボンディングワイヤ１７ａと１７ｂとが設けられた第二の隔室にはシリコンポッティングゲルなどの軟質充填材１９が充填されて、発熱部品６と小型電子部品９との防湿と、ボンディングワイヤ１７ａと１７ｂとの防振の処理がなされ、最後にカバー２０が熱硬化性シリコン接着剤などにより接着固定されて防水・防塵構造とされる。
【００１８】
以上のように、ベース部材１とフレーム１０とカバー２０とで形成された空間を、仕切壁１１により第一の隔室１２と第二の隔室１３とに分割し、第一の隔室１２には硬質充填材１８により耐振性を確保すべき大型電子部品３と４とを収納し、また、第二の隔室１３には硬質充填材１８が付着してはならない小型電子部品９などを隔離して収納するようにしたので、さらに、仕切壁１１と第一のプリント基板２との間に目張り用樹脂１４を塗布したので、硬質充填材１８が付着してはならない小型電子部品９やボンディングワイヤ１７ａ、１７ｂなどに硬質充填材１８を誤って滴下したり、第一の隔室１２から硬化反応中の硬質充填材１８が第二の隔室に１３流入することが確実に防止でき、また、充填作業が容易となって生産性を向上させることができるものである。
【００１９】
なお、上記の説明では第一の隔室１２と第二の隔室１３とに硬質充填材１８と軟質充填材１９とを充填するようにしたが、目的が耐振性の保持と耐湿性の保持とであるから、第一の隔室１２には硬質の樹脂を大型電子部品３と４との間に滴下して部品相互間を接着固定し、第二の隔室１３には軟質の樹脂をスプレーコーティングなどで塗布して小型電子部品９などの表面と、各プリント基板５と８との表面を覆うようにしてもよく、この場合でも仕切壁１１の存在と目張り用樹脂１４との介在により、硬質充填材１８がボンディングワイヤ１７ａ、１７ｂや小型電子部品９などに付着して断線や半田の剥離などのトラブルを生じることが防止できる。また、プリント基板は大型電子部品用ガラスエポキシの第一のプリント基板２と、発熱部品用のセラミック製第二のプリント基板５と、小型電子部品用両面実装の第三のプリント基板８とに分割したが、この分割内容は限定されるものではない。
【００２０】
【発明の効果】
以上に説明したようにこの発明の複数基板を有する電子機器によれば、電子機器内部の電子部品収納空間を仕切壁と目張り用樹脂とにより第一の隔室と第二の隔室とに分割隔離し、一方の隔室内には耐振処理を要するコンデンサや電磁コイル等の大型電子部品を搭載した第一のプリント基板の大型電子部品搭載部を収納し、且つ、硬質充填材を充填し（あるいは硬質樹脂で大型電子部品を接着固定し）、他方の隔室にはコネクタハウジングを配設すると共に、硬質充填材が付着してはならない小型の電子部品や発熱部品を搭載した第二のプリント基板及び、コネクタハウジングと第一及び第二のプリント基板とを接続するボンディングワイヤを隔離して収納し、且つ、軟質充填材を充填する（あるいは軟質樹脂を塗布する）ようにしたので、ボンディングワイヤやチップ部品などに誤って硬質充填材が付着することが防止でき、優れた耐振性と耐湿性とを持たせることができる。また、充填作業が容易となって生産性を向上させることができる。さらに、発熱部品については高熱伝導性のプリント基板を熱伝導の良好な接着剤にて接着固定するようにしたので、放熱性も良好になり、目的に応じたプリント基板の選択により低コストで耐振性など耐環境性に優れた複数基板を有する電子機器を得ることができるものである。
【図面の簡単な説明】
【図１】この発明の実施の形態１の複数基板を有する電子機器の構成を示す断面図である。
【図２】この発明の実施の形態１の複数基板を有する電子機器の構成を示す上面図である。
【図３】この発明の実施の形態１の複数基板を有する電子機器の端子部の断面図である。
【図４】この発明の実施の形態１の複数基板を有する電子機器の端子部の断面図である。
【符号の説明】
１ベース部材、２第一のプリント基板、２ａ接続座、
３、４大型電子部品、５第二のプリント基板、６発熱部品、
７高熱伝導性接着剤、８第三のプリント基板、９小型電子部品、
１０フレーム、１１仕切壁、１２第一の隔室、１３第二の隔室、
１４目張り用樹脂、１５ａ、１５ｂコネクタハウジング、
１７ａ、１７ｂボンディングワイヤ、１８硬質充填材、
１９軟質充填材、２０カバー。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device having excellent environmental resistance used for a vehicle or the like, and more particularly to an electronic device having a plurality of substrates.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electronic device mounted on a vehicle has been often used in which various electronic components are mounted on a printed circuit board, which is housed and fixed in a case and sealed with a cover or the like. Electronic components mounted on printed circuit boards can be classified into large electronic components such as capacitors and electromagnetic coils, heat generating components such as power transistors, and small electronic components such as resistors and chip components. In general, these are mounted together on the same printed circuit board. However, it requires different considerations for vibration resistance for large electronic components, heat dissipation for heat generating components, and moisture resistance for small electronic components such as chip components. Various measures have been taken to satisfy these requirements. Japanese Patent Application Laid-Open No. 8-181471 discloses an example of a technique for improving the environmental resistance of such an electronic device.
[0003]
The technology disclosed in this publication provides a bag hole on the side surface of a case body to which a printed circuit board on which various electronic components are mounted is attached, and attaches the printed circuit board so as to cover the opening of the bag hole. The heat generating component attached to the bag hole is accommodated in the bag hole portion, and the heat generating component is configured to contact at least two surfaces of the peripheral surface in the bag hole portion, thereby obtaining thermal conductivity and vibration resistance. In addition, by providing a notch in the printed circuit board to obtain elasticity, the stress applied to the solder connection between the heat generating component and the printed circuit board is reduced, and the contact between the heat generating component and the peripheral surface of the bag hole is reduced. The printed circuit board accommodated in the case is provided with a cover on the upper surface and the lower surface to cope with an environment such as water resistance.
[0004]
In the conventional example as described above, it is common to mount all electronic components on a printed circuit board to form a finished product, and then store it in a case. However, in recent years, with the diversification of control contents of electronic devices. A plurality of printed circuit boards divided according to the purpose are each semi-finished products, assembled into a case, and after assembled, an electronic device configured to connect between printed circuit boards or between a printed circuit board and terminals with bonding wires. It has increased. The use of this bonding wire is due to the fact that flow soldering is impossible after mounting on the case and the reliability of wire bonding has been improved.
[0005]
[Problems to be solved by the invention]
In an electronic device that uses a plurality of divided printed circuit boards and connects the printed circuit boards with bonding wires after assembly, an electronic device mounted on a vehicle, particularly an electronic device mounted near an internal combustion engine Is used in a hostile environment and is strongly required to have vibration resistance and moisture resistance. For this reason, large electronic components such as capacitors and electromagnetic coils are bonded and fixed between components or between a component and a printed circuit board by a hard filler, but the hard resin used for the filler undergoes a curing reaction. Because of the relatively high fluidity in between, hard filler may adhere to bonding wires and small chip parts due to accidental dripping during filling operations in close proximity. Due to thermal expansion during use of the material, the bonding wire and its bonding portion and the solder joint portion of the small component were repeatedly stressed, leading to breakage.
[0006]
The present invention has been made to solve such a problem, and an object of the present invention is to obtain an electronic apparatus having a plurality of in-vehicle boards that are excellent in environmental resistance such as vibration resistance and productivity. .
[0007]
[Means for Solving the Problems]
An electronic apparatus having a plurality of substrates according to the present invention includes a first printed circuit board having a bonding wire connection seat at one end and a small electronic component that requires a moisture-proof process while mounting a large-sized electronic part that requires a vibration-proof process. And a second printed circuit board on which the heat generating component is mounted, a base member that holds the first printed circuit board and the second printed circuit board, and the first printed circuit board and the second printed circuit board that are fixed to the base member A frame that surrounds the periphery of the substrate, a first compartment that is configured integrally with the frame and that accommodates a large electronic component mounting portion of the first printed circuit board, and a bonding wire for the first printed circuit board comprising a partition wall separating into a second compartment for accommodating a connecting base portion and a second printed circuit board, and a cover for covering the counter base member side opening of the frame, the frame The connector housing is integrally formed, and the connector housing is disposed on the second compartment side, and is bonded to the first and second printed circuit boards on the second compartment side by bonding wires. are connected, said within the first compartment filling material hard is filled, high heat within a second compartment for mounting together with a filler of soft are filled, the heat generating component to the second printed circuit board The printed circuit board is divided into a conductive printed board and a printed board on which a low heat generation component is mounted.
[0008]
Also, instead of filling the first compartment and the second compartment with hard filler and soft filler, respectively , large electronic components are bonded and fixed with hard resin in the first compartment, and the second compartment In this case, a soft resin is applied.
Furthermore, a weathering resin for preventing the flow of the filler is applied between the first printed board and the partition wall.
[0009]
Moreover, in which high thermal conductivity of the printed circuit board for mounting the heat generation part, and to be bonded to the base member by the high thermal conductivity of the adhesive.
Further, the cover is formed such that the first compartment side is high and the second compartment side is low according to the height of the storage component.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
1 to 4 show a configuration example of an electronic apparatus having a plurality of substrates according to Embodiment 1 of the present invention. FIG. 1 is a cross-sectional view thereof, FIG. 2 is a top view in a state where a cover is removed, and FIG. And FIG. 4 is a sectional view of the terminal portion. In the figure, reference numeral 1 denotes a base member formed by, for example, aluminum die casting and having mounting holes 1a and 1b. Reference numeral 2 denotes a first printed circuit board attached to the base member 1 by adhesion or the like. 2 is formed of a material such as glass epoxy, and among electronic components used in electronic equipment, large electronic components 3 and 4 having a relatively large mass such as capacitors and electromagnetic coils are mounted. A connection seat 2a is provided for connection to one printed circuit board and another printed circuit board, or a lead terminal.
[0011]
Reference numeral 5 denotes a second printed circuit board attached to the base member 1, which is formed of a material having good thermal conductivity such as ceramic, and a heat generating component 6 such as a power transistor bare chip component is mounted by soldering. For example, a high thermal conductivity silicon adhesive 7 is used for bonding to the base member 1, and the heat of the heat generating component 6 is easily radiated from the second printed circuit board 5 to the base member 1. . Reference numeral 8 denotes a third printed circuit board attached to the base member 1 by adhesion or the like. The third printed circuit board 8 is formed of a material such as multilayer glass epoxy, and a small electronic component 9 with little heat generation is mounted on both sides by soldering. Each of the printed boards 5 and 8 is also provided with a connection seat for connecting adjacent printed boards or connecting the printed boards and terminals.
[0012]
10 is a frame molded from a synthetic resin such as polybutylene terephthalate, and is configured to surround the first to third printed circuit boards 2, 5, 8 attached to the base member 1, A rib 10a provided on the lower end surface of the frame 10 is fitted into a groove 1c provided in the base member 1, and is attached to the base member 1 in an airtight manner with an adhesive filled in the groove 1c. 11 is a partition wall provided integrally with the frame 10, and a space formed by the frame 10 and the base member 1 is divided into a first compartment 12 on the first printed circuit board 2 side, a second and a second It is comprised so that it may divide | segment into the 2nd compartment 13 by the side of the three printed circuit boards 5 and 8. FIG.
[0013]
The first printed circuit board 2 extends from the first compartment 12 to the second compartment 13 through the gap between the partition wall 11 and the base member 1, and the first compartment 12 has a large electronic component. 3 and 4 are housed in the second compartment 13, a connection seat 2 a provided on the first printed circuit board, a heat generating component 6 mounted on the second printed circuit board 5, and a third printed circuit board. A small electronic component 9 mounted on the substrate 8 is accommodated, and a first resin 14 is filled or applied between the first printed circuit board 2 and the partition wall 11 to form the first electronic component 9. The surface of the printed circuit board 2 is hermetically isolated from the first compartment 12 side and the second compartment 13 side.
[0014]
15a and 15b are connector housings integrally formed on the peripheral wall of the frame 10, and these connector housings 15a and 15b are provided on the second compartment 13 side, as shown in FIG. 3 and FIG. Each printed circuit board 2, 5, 8 and the terminal 16 are connected by a bonding wire 17 a, and each printed circuit board 2, 5, 8 is also connected by a bonding wire 17 b between the connection seats. ing. Reference numeral 18 denotes a hard filler filled in the first compartment 12 in order to fix the large electronic components 3 and 4 mounted on the first printed circuit board 2 and obtain vibration resistance, and 19 denotes the second print. This is a soft filler filled in the second compartment 13 to protect the heat generating components mounted on the substrate 5 and the small components mounted on the third printed circuit board 8 and the bonding wires 17a and 17b.
[0015]
Reference numeral 20 denotes a cover in which a rib 20a is fitted in a groove 10b provided in the frame 10 and is airtightly attached to the frame 10 with an adhesive filled in the groove 10b. While maintaining the waterproof property with the compartment 13, the first compartment 12 side that accommodates the large electronic components 3 and 4 is high in accordance with the height of the storage component, while the second compartment 13 side has a storage component. Consideration is made to reduce the volume of the electronic device itself by forming it low in accordance with the height of the electronic device.
[0016]
In the electronic apparatus having a plurality of substrates according to the first embodiment of the present invention having such a configuration, first, electronic components are mounted on the respective printed circuit boards 2, 5, 8 and connected and fixed by, for example, flow soldering. Each printed circuit board 2, 5, 8 is bonded and fixed to a predetermined location of the base member 1. When the mounting of each printed circuit board 2, 5, 8 is completed, the frame 10 is bonded and fixed to the base member 1, and then between each printed circuit board 2, 5, 8, between each printed circuit board 2, 5, 8 and the terminal 16. Wire bonding work is performed to connect them. Each of the bonding wires 17a and 17b is formed of a thin aluminum wire having a thickness of several hundreds μm, and a plurality of wires are provided in parallel at a portion of a large current. However, sufficient consideration is required for stress due to vibration and thermal expansion. It is a thing.
[0017]
When the wire bonding operation and the intermediate check are completed, the weathering resin 14 is filled or applied between the first printed circuit board 2 and the lower surface of the partition wall 11 with a resin having low fluidity such as high thixotropic silicon gel, The first compartment 12 that accommodates the large electronic components 3 and 4 is filled with a thermosetting or room temperature curable hard filler 18 to have a vibration-proof structure, and the heat generating component 6 and the small electronic component are also provided. 9 and a second compartment provided with bonding wires 17a and 17b is filled with a soft filler 19 such as silicon potting gel to prevent moisture generation between the heat generating component 6 and the small electronic component 9. The bonding wires 17a and 17b are subjected to vibration isolation processing, and finally the cover 20 is bonded and fixed with a thermosetting silicone adhesive or the like to form a waterproof / dustproof structure.
[0018]
As described above, the space formed by the base member 1, the frame 10, and the cover 20 is divided into the first compartment 12 and the second compartment 13 by the partition wall 11, and the first compartment 12 is divided. Accommodates the large electronic components 3 and 4 that should ensure vibration resistance by the hard filler 18, and the small electronic component 9 to which the hard filler 18 should not adhere to the second compartment 13. Further, since the weathering resin 14 is applied between the partition wall 11 and the first printed circuit board 2, the small electronic component 9 to which the hard filler 18 should not adhere is installed. It is possible to reliably prevent the hard filler 18 from being accidentally dropped onto the bonding wires 17a and 17b or the like and the hard filler 18 during the curing reaction from flowing into the second compartment 13 from the first compartment 12. In addition, the filling operation becomes easier and the productivity is improved. It is what it is.
[0019]
In the above description, the first compartment 12 and the second compartment 13 are filled with the hard filler 18 and the soft filler 19, but the purpose is to maintain vibration resistance and moisture resistance. Therefore, a hard resin is dropped between the large electronic components 3 and 4 in the first compartment 12 to bond and fix the components together, and a soft resin is put in the second compartment 13. It may be applied by spray coating or the like so as to cover the surface of the small electronic component 9 and the surfaces of the printed boards 5 and 8. In this case as well, the presence of the partition wall 11 and the presence of the weathering resin 14 Further, it is possible to prevent the hard filler 18 from adhering to the bonding wires 17a and 17b, the small electronic component 9 and the like to cause troubles such as disconnection and solder peeling. The printed circuit board is divided into a first printed circuit board 2 made of glass epoxy for large electronic components, a second printed circuit board 5 made of ceramic for heat generating components, and a third printed circuit board 8 mounted on both sides for small electronic components. However, the content of this division is not limited.
[0020]
【The invention's effect】
As described above, according to the electronic apparatus having a plurality of substrates according to the present invention, the electronic component storage space inside the electronic apparatus is divided into the first compartment and the second compartment by the partition wall and the weather resin. One of the compartments contains a large electronic component mounting portion of the first printed circuit board on which large electronic components such as capacitors and electromagnetic coils that require vibration proofing are mounted , and is filled with a hard filler (or The second printed circuit board is equipped with a small electronic component and a heat generating component that must not have a hard filler attached to it , and a connector housing is provided in the other compartment. and, accommodated to isolate the bonding wire for connecting the connector housing and the first and second printed circuit board, and, since so as to fill the soft filling material (or coating a soft resin), Incorrectly like down loading wire and the chip component can be prevented that hard filler is attached, it can have a superior vibration resistance and moisture resistance. Further, the filling operation is facilitated and the productivity can be improved. Furthermore, for heat-generating components, a high thermal conductivity printed circuit board is bonded and fixed with an adhesive with good thermal conductivity, so heat dissipation is also improved, and vibration resistance is reduced at low cost by selecting a printed circuit board according to the purpose. It is possible to obtain an electronic device having a plurality of substrates that are excellent in environmental resistance such as the property.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of an electronic apparatus having a plurality of substrates according to Embodiment 1 of the present invention.
FIG. 2 is a top view showing a configuration of an electronic apparatus having a plurality of substrates according to Embodiment 1 of the present invention.
3 is a cross-sectional view of a terminal portion of an electronic apparatus having a plurality of substrates according to Embodiment 1 of the present invention. FIG.
4 is a cross-sectional view of a terminal portion of an electronic apparatus having a plurality of substrates according to Embodiment 1 of the present invention. FIG.
[Explanation of symbols]
1 base member, 2 first printed circuit board, 2a connection seat,
3, 4 Large electronic parts, 5 Second printed circuit board, 6 Heat generating parts,
7 High thermal conductivity adhesive, 8 Third printed circuit board, 9 Small electronic components,
10 frame, 11 partition wall, 12 first compartment, 13 second compartment,
14 weathering resin, 15a, 15b connector housing,
17a, 17b bonding wire, 18 hard filler,
19 Soft filler, 20 cover.

Claims

A first printed circuit board having a large-sized electronic component that requires vibration-proof processing and a bonding wire connection seat at one end, a second printed circuit board that has a small electronic component that requires moisture-proof processing and a heat-generating component, A base member for holding the first printed circuit board and the second printed circuit board, a frame fixed to the base member and surrounding the first printed circuit board and the second printed circuit board, and integrated with the frame A first compartment that houses a large electronic component mounting portion of the first printed circuit board, a bonding wire connection seat of the first printed circuit board, and the second printed circuit. partition wall is separated into a second compartment for accommodating a substrate, comprising a cover for covering the counter base member side opening of the frame, it is integrally configured with the frame The connector housing is provided, the connector housing is disposed in the second compartment side, are connected by the bonding wire second compartment side to the first and second printed circuit board, said first And the second compartment is filled with a hard filler, the second compartment is filled with a soft filler, and the second printed circuit board is mounted with a high thermal conductivity printed board, An electronic apparatus having a plurality of substrates, wherein the electronic device is divided into a printed circuit board on which a low heat generating component is mounted.

A first printed circuit board having a large-sized electronic component that requires vibration-proof processing and a bonding wire connection seat at one end, a second printed circuit board that has a small electronic component that requires moisture-proof processing and a heat-generating component, A base member for holding the first printed circuit board and the second printed circuit board, a frame fixed to the base member and surrounding the first printed circuit board and the second printed circuit board, and integrated with the frame A first compartment that houses a large electronic component mounting portion of the first printed circuit board, a bonding wire connection seat of the first printed circuit board, and the second printed circuit. partition wall is separated into a second compartment for accommodating a substrate, comprising a cover for covering the counter base member side opening of the frame, it is integrally configured with the frame The connector housing is provided, the connector housing is disposed in the second compartment side, are connected by the bonding wire second compartment side to the first and second printed circuit board, said first In the compartment, a large electronic component is bonded and fixed with a hard resin, a soft resin is applied in the second compartment, and the second printed circuit board is mounted with a high thermal conductivity printed board, An electronic apparatus having a plurality of substrates, wherein the electronic device is divided into a printed circuit board on which a low heat generating component is mounted.

The electronic device having a plurality of substrates according to claim 1, wherein a weathering resin for preventing a filler from flowing is applied between the first printed circuit board and the partition wall.

4. The printed circuit board having high thermal conductivity on which the heat-generating component is mounted is bonded to the base member with an adhesive having high thermal conductivity, and has a plurality of substrates according to claim 1. Electronics.

5. The multiple substrate according to claim 1, wherein the cover is formed such that the first compartment side is high and the second compartment side is low according to the height of the storage component. Electronic equipment having