JP2513416B2 - Semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to a TAB (Tape Au).
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device of a tomated bonding type, and particularly to a semiconductor device having a structure that can be mounted on a circuit wiring board by solder reflow.

[0002]

2. Description of the Related Art Conventionally, in a TAB type semiconductor device which can be mounted on a circuit wiring board by this solder reflow, a semiconductor chip cut from a semiconductor wafer is inserted into a hole of a resin sheet of a TAB tape, and a peripheral edge of the hole is formed. Therefore, one end of the lead extending outward is connected to the bump-shaped electrode pad on the periphery of the semiconductor chip corresponding to this lead, and the semiconductor chip mounted on this resin sheet via the lead is housed in the case. It was a structure in which an external terminal led out to the outside and a lead were connected.

FIG. 3 is a sectional view of a conventional semiconductor device. This type of semiconductor device is disclosed in, for example, Japanese Patent Laid-Open No. 63-87730. In this semiconductor device, as shown in FIG. 3, one end of a lead frame 4 cut and molded from a TAB tape is connected to an electronic component 1 which is a semiconductor chip placed on a case 2, and the other end of the lead frame 4 is connected. This is a structure in which the external terminal 6 at the bottom of the drawer case 2 is connected to the outside of the case 2 with a solder 7. Also,
The opening of the case 2 is closed with a cap 3 and fixed with a sealing resin 5.

In this semiconductor device, an electronic component 1 is housed in a case 2 having no wiring instead of a case in which inner layers are made of ceramics, etc., thereby reducing the price of the case itself and reducing the number of connection points to reduce the number of assembling steps. It was a thing.

[0005]

However, in the above-mentioned conventional semiconductor device, although the case has no inner layer wiring and the number of connection points is small, the step of forming the external terminal on the bottom of the case and the step of peeling the external terminal from the TAB tape are performed. Or
A step of connecting the lead frame and the external terminal is required. Further, in the semiconductor device, the cap and the case form a space that closes the electronic component that is the semiconductor chip, so that moisture in the space may adhere to the surface of the semiconductor chip,
Alternatively, there is a problem in that moisture enters through the interface between the sealing resin for fixing the cap and the case, corrodes the electrode pads exposed on the surface of the semiconductor chip, and significantly impairs reliability.

Therefore, an object of the present invention is to provide a cheaper and more reliable TAB semiconductor device.

[0007]

A feature of the present invention is that a semiconductor chip having an integrated circuit formed on one main surface and a plurality of electrode pads on the periphery, a first hole into which the semiconductor chip is inserted, and the first hole . And a thin plate-shaped resin member for holding the semiconductor chip by connecting one end of the conductive member and the electrode pad with each other, and a plurality of conductive members extending outwardly from the periphery of the hole. a resin coating member covering only said one main surface of the semiconductor chip held, peripheral a circumference seen interpolation of the semiconductor chip in which the one main surface is covered with the resin coating member
Has a second hole that is inserted and exposes the back surface of the semiconductor chip.
In addition, the thin plate resin member is attached to the front and upper surfaces, the side surfaces, and the back surface, and the insulating plate member exposes the other end of the conductive member to the back surface.

[0008]

The present invention will be described below with reference to the drawings.

1A and 1B are a plan view and a sectional view taken along line AA of a semiconductor device showing an embodiment of the present invention.
In this semiconductor device, as shown in FIG. 1, a semiconductor chip 1a having an integrated circuit formed on one main surface and a plurality of bumps 11 which are electrode pads on the periphery, a hole into which this semiconductor chip 1a is inserted, and this hole A plurality of leads 9 extending outwardly from the peripheral edge of the resin sheet 10 and connecting one end of the leads 9 to the bump 11 to hold the semiconductor chip 1a; and a semiconductor chip held by the resin sheet 10. The resin coating member 12 that covers the circuit forming surface of the resin layer 1a and the other end of the lead 9 that is attached so as to surround the semiconductor chip 1a that is covered with the resin coating member 12 so as to be covered with the resin sheet 10 over the front surface, the side surface, and the back surface. And the insulating plate 8 exposing the terminal portion 9a on the back surface.

Here, the insulating plate 8 uses an alumina nitride ceramic material having high thermal conductivity in order to have a function of radiating heat generated from the semiconductor chip 1a. However, in the case of a large size, considering the price, it is better to use a metal such as aluminum having a high thermal conductivity coated with an electrically insulating material having a high thermal conductivity.
In addition, the resin sheet 10 and the leads 9 attached to the resin sheet 10
Uses a TAB tape in which a lead member is attached to an ordinary polyimide resin tape. Then, if necessary, a double-sided adhesive tape for thermocompression bonding with the insulating plate 8 is attached to the adhered surface of the TAB tape. If you want to omit the step of attaching this adhesive tape, use a thermosetting resin material that has an adhesive function on the TAB tape itself and a metal plate with high heat conductivity instead of the insulating plate to directly attach and perform the adhesion and insulation treatment. It is more advantageous to carry out the above at the same time from the viewpoint of reducing the number of assembly steps and material costs.

2A to 2D are sectional views showing the semiconductor device of FIG. 1 in the order of assembling. Next, in order to facilitate understanding of the structure of the above-described semiconductor device, description will be given in the order of assembling. First, as shown in FIG. 2A, a TAB tape having leads 9 attached to a resin sheet 10 is prepared. Next, FIG.
As shown in (b), the holes 13 of the TAB tape are formed in the semiconductor chip 1a positioned on the stage of the bonding apparatus.
According to. Then, using a therma tool, bump the lead 9 to the bump 11.
Press to connect. Next, the TAB tape holding the semiconductor chip 1a is fed to the resin potting device,
As shown in (c), epoxy resin containing a filler is dropped from a nozzle to cover the semiconductor chip with the resin coating member 12. At this time, the TAB tape is cut into a required length.
Next, as shown in FIG. 2D, the TAB tape cut on the insulating plate 8 held by the inner diameter fixing holder and cut to a required length is arranged around the inner diameter fixing holder. The resin sheet 10 is pressed and temporarily adhered to the upper surface, the side surface, and the back surface of the insulating plate 8 with the heated tool. Then, the semiconductor device temporarily assembled in this way is put into a curing furnace, and the resin material 12
Then, the resin sheet 10 is cured of the adhesive to complete the assembly.

[0012]

As described above, according to the present invention, the TAB tape for holding the semiconductor chip is attached so as to be wound around the outer peripheral surface of the insulating plate surrounding the semiconductor chip, and one end of the lead of the TAB tape is attached to the insulating plate. By exposing the external terminals to the back surface to form the external terminals, it is not necessary to previously provide the external terminals on the insulating plate as in the conventional case, and the step of partially peeling the insulating sheet from the TAB tape is also eliminated. Further, by covering the circuit forming surface of the semiconductor chip with the resin coating member, not only the conventional case for housing the semiconductor chip in the closed space becomes unnecessary, but also the closed space containing water disappears. Therefore, according to the present invention, there is an effect that a material cost and man-hours can be reduced, and a cheaper and more reliable TAB semiconductor device can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view and a sectional view taken along line AA of a semiconductor device showing an embodiment of the present invention.

2 is a cross-sectional view showing the semiconductor device of FIG. 1 in the assembling order.

FIG. 3 is a sectional view of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Semiconductor chip 2 Case 3 Cap 4 Lead frame 5 Sealing resin 6 External terminal 7 Solder 8 Insulating plate 9 Lead 9a Terminal part 10 Resin sheet 11 Bump 12 Resin coating member

Claims (2)

(57) [Claims] 1. A semiconductor chip having an integrated circuit formed on one main surface and having a plurality of electrode pads on the periphery, a first hole into which the semiconductor chip is inserted, and a plurality of holes extending outward from the periphery of the first hole. A thin plate-shaped resin member for holding the semiconductor chip by connecting one end of the conductive member to the electrode pad, and the main part of the semiconductor chip held by the thin plate-shaped resin member. a resin coating member which covers the surface only, the one major surface to the periphery of the insertion enclose the semiconductor chip covered with the resin coating member and the back surface of the semiconductor chip
An insulating plate member having a second hole to be exposed and being covered with the thin plate-shaped resin member over a front surface, a side surface and a back surface, and exposing the other end of the conductive member to the back surface. Semiconductor device. 2. The semiconductor device according to claim 1, wherein the insulating plate member is a metal plate whose surface is electrically insulated.