CN208000917U - The encapsulating structure and electronic equipment of series diode - Google Patents
The encapsulating structure and electronic equipment of series diode Download PDFInfo
- Publication number
- CN208000917U CN208000917U CN201820484023.8U CN201820484023U CN208000917U CN 208000917 U CN208000917 U CN 208000917U CN 201820484023 U CN201820484023 U CN 201820484023U CN 208000917 U CN208000917 U CN 208000917U
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- Prior art keywords
- pin
- backlight unit
- diode chip
- encapsulating structure
- packaging body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
The utility model, which relates to, provides a kind of encapsulating structure and electronic equipment of series diode, and encapsulating structure includes:Packaging body and cooling fin;Metal framework, the first diode chip for backlight unit, the second diode chip for backlight unit are provided in packaging body;Metal framework includes the first pin, second pin and auxiliary pin, is both exposed to the outside of packaging body;The back side setting of packaging body is fluted, and cooling fin is set in groove;One pole of the first diode chip for backlight unit is attached on auxiliary pin, the opposite polarity pole of second diode chip for backlight unit is electrically connected with auxiliary pin, the identical pole of second diode chip for backlight unit polarity is attached on one of the first pin and second pin pin, and another pole of the first diode chip for backlight unit is electrically connected with another pin in the first pin and second pin.The utility model, which can alleviate series diode encapsulation existing in the prior art, to solve the bad technical problem that radiates by way of limiting electric current.
Description
Technical field
The utility model is related to electronic component technology fields, more particularly, to the encapsulating structure and electricity of a kind of series diode
Sub- equipment.
Background technology
The series connection of diode can achieve the purpose that rated insulation voltage is added, highly practical, often be used in circuit design
It arrives, if prodigious facility will be brought to actual circuit design by being encapsulated use, without using two individual diodes
To realize cascaded structure.
However, the Series Package structure of existing diode, usually single-side pin encapsulation, this encapsulating structure heat dissipation is not
It is good, in order to avoid chip overheating, the electric current use scope of chip can be limited, causing chip to cannot be satisfied powerful application needs
It asks.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of encapsulating structure of series diode and electronic equipment,
By alleviate series diode existing in the prior art encapsulation can only by limiting electric current in a manner of solve the undesirable technology that radiates
Problem.
In a first aspect, the utility model embodiment provides a kind of encapsulating structure of series diode, including:Packaging body and
Cooling fin;Metal framework, the first diode chip for backlight unit, the second diode chip for backlight unit are provided in packaging body;Metal framework includes first
Pin, second pin and auxiliary pin, are both exposed to the outside of packaging body;The distance between the back side of packaging body and metal framework
More than the distance between the front of packaging body and metal framework, the back side setting of packaging body is fluted, and cooling fin is set to groove
It is interior;One pole of the first diode chip for backlight unit is attached on auxiliary pin, and the opposite polarity pole of the second diode chip for backlight unit is drawn with auxiliary
Foot is electrically connected, and the identical pole of the second diode chip for backlight unit polarity is attached to one of the first pin and second pin pin
On, another pole of the first diode chip for backlight unit is electrically connected with another pin in the first pin and second pin.
With reference to first aspect, the utility model embodiment provides the first possible embodiment of first aspect,
In, at least two dumpings for liquid extra between groove and cooling fin or gas to be discharged is provided on the cell wall of groove
Slot.
With reference to first aspect, the utility model embodiment provides second of possible embodiment of first aspect,
In, the thickness of cooling fin is identical as the depth of groove of packaging body.
With reference to first aspect, the utility model embodiment provides the third possible embodiment of first aspect,
In, the shape of cooling fin is identical as the region shape that the groove inner wall of packaging body surrounds.
With reference to first aspect, the utility model embodiment provides the 4th kind of possible embodiment of first aspect,
In, the first pin, second pin and auxiliary pin are arranged side by side, and the first pin and second pin are arranged the two of auxiliary pin
Side.
With reference to first aspect, the utility model embodiment provides the 5th kind of possible embodiment of first aspect,
In, the through-hole for mechanical connection is provided at the top of metal framework.
With reference to first aspect, the utility model embodiment provides the 6th kind of possible embodiment of first aspect,
In, metal framework includes mechanical connection area, chip region and pin area, the first diode chip for backlight unit, second successively from top to bottom end
Diode chip for backlight unit and electric wire setting are in chip region, and through-hole setting is in mechanical connection area.
With reference to first aspect, the utility model embodiment provides the 7th kind of possible embodiment of first aspect,
In, chip region is encapsulated in the epoxy resin ontology of insulation, exposes mechanical connection area and pin area.
With reference to first aspect, the utility model embodiment provides the 8th kind of possible embodiment of first aspect,
In, it is mechanically connected area and chip region is encapsulated in the epoxy resin ontology of insulation, expose pin area and through-hole.
Second aspect, the utility model embodiment provide a kind of electronic equipment, including two pole of series connection described in first aspect
The encapsulating structure of pipe.
The utility model embodiment brings following advantageous effect:
The encapsulating structure for the series diode that the utility model embodiment provides, including packaging body and cooling fin;Packaging body
Inside it is provided with metal framework, the first diode chip for backlight unit, the second diode chip for backlight unit;Metal framework includes the first pin, second pin
With auxiliary pin, it is both exposed to the outside of packaging body;The distance between the back side of packaging body and metal framework are more than packaging body
The back side setting in the distance between front and metal framework, packaging body is fluted, and cooling fin is set in groove;First diode
One pole of chip is attached on auxiliary pin, and the opposite polarity pole of the second diode chip for backlight unit is electrically connected with auxiliary pin, and second
The identical pole of diode chip for backlight unit polarity is attached on one of the first pin and second pin pin, the first diode core
Another pole of piece is electrically connected with another pin in the first pin and second pin.The utility model embodiment is by encapsulating
The groove for accommodating cooling fin is arranged in the back side of body, and cooling fin is set in the groove, since cooling fin, institute is arranged
The heat-sinking capability of the encapsulating structure of series diode can be improved, and then the limitation work electricity of the encapsulating structure can be improved
Stream so that the encapsulating structure of series diode disclosure satisfy that significant power demand.
Other feature and advantage of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.The purpose of this utility model and other advantages are illustrating
Specifically noted structure is realized and is obtained in book, claims and attached drawing.
To enable the above objects, features, and advantages of the utility model to be clearer and more comprehensible, preferred embodiment cited below particularly, and
The appended attached drawing of cooperation, is described in detail below.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of overall structure diagram of the encapsulating structure for series diode that the utility model embodiment provides;
Fig. 2 is a kind of internal structure schematic diagram of the encapsulating structure for series diode that the utility model embodiment provides;
Fig. 3 is a kind of Diode series schematic diagram that the utility model embodiment provides;
Fig. 4 is a kind of three parts structural representation of the encapsulating structure for series diode that the utility model embodiment provides
Figure.
Specific implementation mode
To keep the purpose, technical scheme and advantage of the utility model embodiment clearer, below in conjunction with attached drawing to this
The technical solution of utility model is clearly and completely described, it is clear that described embodiment is that the utility model part is real
Example is applied, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
The every other embodiment obtained under the premise of creative work, shall fall within the protection scope of the present invention.
Currently, the Series Package structure of existing diode, usually single-side pin encapsulation, this encapsulating structure heat dissipation is not
It is good, in order to avoid chip overheating, the electric current use scope of chip can be limited, causing chip to cannot be satisfied powerful application needs
It asks.
Based on this, the utility model embodiment provides a kind of encapsulating structure and electronic equipment of series diode, with slow
The bad technical problem that radiates can only be solved by way of limiting electric current by solving series diode encapsulation existing in the prior art.
Embodiment one:
The utility model embodiment provides a kind of encapsulating structure of series diode, shown referring to Fig. 1 and Fig. 2, the envelope
Assembling structure includes:Packaging body 11 and cooling fin;Metal framework 13, the first diode chip for backlight unit 14, second are provided in packaging body 11
Diode chip for backlight unit 15;Metal framework 13 includes the first pin 133, second pin 131 and auxiliary pin 132, is both exposed to encapsulate
The outside of body 11;The distance between the back side of packaging body 11 and metal framework 13 are more than front and the metal framework 13 of packaging body 11
The distance between, the back side setting fluted 12 of packaging body 11, cooling fin is set in groove 12;First diode chip for backlight unit 14
One pole is attached on auxiliary pin 132, and a 15 opposite polarity pole of the second diode chip for backlight unit is electrically connected with auxiliary pin 132, the
The identical pole of two diode chip for backlight unit, 15 polarity is attached on one of the first pin 133 and second pin 131 pin, the
Another pole of one diode chip for backlight unit 14 is electrically connected with another pin in the first pin 133 and second pin 131.
In practical applications, the groove 12 at the back side of packaging body 11 forms to the back side of packaging body 11 and is recessed, and groove 12 has
There are four cell wall, four cell walls are respectively perpendicular to the back side of packaging body 11.
The utility model embodiment will be dissipated by the way that the groove 12 for accommodating cooling fin is arranged at the back side of packaging body 11
Backing is set in the groove 12, since cooling fin is arranged, it is possible to improve the heat dissipation of the encapsulating structure of series diode
Ability, and then the limitation operating current of the encapsulating structure can be improved so that the encapsulating structure of series diode disclosure satisfy that greatly
Power demand.
In practical applications, cooling fin (not marked in figure) can be fixed by the bottom of liquid glue and groove 12,
Since the distance between cell wall of cooling fin and groove 12 is needed in 0.1mm or so, in order to ensure cooling fin and groove 12
There is no bubble between bottom, and glue is evenly, so that the two is fixed more securely, in the another embodiment of the utility model
In, at least two are provided on the cell wall of the groove 12 for liquid extra between the groove 12 and the cooling fin to be discharged
The dumping slot of body or gas.
In order to avoid cooling fin can be higher than the cell wall of groove 12 after in groove 12, in the another of the utility model
In embodiment, the thickness of the cooling fin is identical as 12 depth of groove of the packaging body 11.
In the another embodiment of the utility model, 12 inner wall of groove of the shape of the cooling fin and the packaging body 11
The region shape surrounded is identical, and such cooling fin can be in close contact with 12 inner wall of groove.
In the another embodiment of the utility model, since the heat dissipation effect of aluminium is relatively good, so the cooling fin is aluminium
Cooling fin processed.For example, 12 depth of groove of packaging body 11 is 0.5 millimeter, the thickness of cooling fin is 0.5 millimeter.
The quantity of above-mentioned groove 12 is two as a preferred implementation manner, and the quantity of groove 12 is even number, can be with
It is uniformly discharged convenient for extra liquid or gas.
In the another embodiment of the utility model, the cooling fin and 12 bottom of the groove are fixed by glue,
In practical application, cooling fin and 12 bottom of the groove can also be fixed otherwise, for example, screw is fixed, clamping is solid
Fixed etc. mode.
In the present embodiment, packaging body 11 includes the first diode chip for backlight unit 14, the second diode chip for backlight unit 15 and metal frame
Frame 13, metal framework 13 include three pins independent of each other, respectively the first pin 133, second pin 131 and auxiliary pin
132, a pole of first diode chip for backlight unit 14 is attached on the auxiliary pin 132,15 pole of the second diode chip for backlight unit
Property an opposite pole be electrically connected with the auxiliary pin 132, the identical pole of 15 polarity of the second diode chip for backlight unit is attached to
On one of first pin 133 and second pin 131 pin, another pole of first diode chip for backlight unit 14
It is electrically connected with another pin in first pin 133 and second pin 131.
The difference same pole of first diode chip for backlight unit 14 and the second diode chip for backlight unit 15 being attached on metal framework 13
On pin, another pole of the second diode chip for backlight unit 15 is electrically connected with the pin that the first diode chip for backlight unit 14 attaches, that is, is realized
One pole of the first diode chip for backlight unit 14 is connect with the electrode of 15 opposite polarity of the second diode chip for backlight unit.Again by the first diode chip for backlight unit
14 and second another pole for not being electrically connected between diode chip for backlight unit 15 draw the electrode as the encapsulating structure, that is, realize
The series connection of two diodes.Patch mode of two diode chip for backlight unit on the metal framework 13 is consistent, simplifies encapsulation side
Formula is particularly suitable for producing in batches, during patch, it is only necessary to attach each diode chip for backlight unit in the same way
On metal framework 13, automation mechanized operation may be used to realize, it is simple and reliable, save cost.
Shown in Figure 2 in one of the embodiments, first diode chip for backlight unit 14 is attached to the auxiliary pin
An extremely cathode on 132.The auxiliary that the cathode of first diode chip for backlight unit 14 is attached to metal material by welding is drawn
On foot 132, a 15 opposite polarity pole of the second diode chip for backlight unit, i.e. anode is electrically connected with the auxiliary pin 132, that is, realizes
The cathode of one diode chip for backlight unit 14 is electrically connected with the anode of the second diode chip for backlight unit 15.Second diode chip for backlight unit, 15 polarity is identical
One pole, i.e. cathode are attached in second pin 131, and the anode of the first diode chip for backlight unit 14 is electrically connected with the first pin 133.By
The anode of one diode chip for backlight unit 14 draws the anode for being used as encapsulating structure by the first pin 133, by the second diode chip for backlight unit 15
Cathode drawn by second pin 131 and be used as the cathode of the encapsulating structure.Referring to Fig. 3, that is, realize the string of two diodes
Connection encapsulation, patch mode of two diode chip for backlight unit on the metal framework 13 is consistent, is that cathode attaches, easy to operate.
Likewise, the anode of two diode chip for backlight unit can also be attached on different pins, Series Package is realized.
Though Diode series use can increase reverse voltage endurance capability, in practice, concatenated two diodes by
Pressure may be unequal, and the terminal of two diode connections is drawn as auxiliary pin 132, can be used for testing two two poles
The terminal voltage of pipe, and the reversed pressure resistance actually born, and then can be external according to actual operating state and concrete application demand
The buffer circuits such as resistance and capacitance adjust the partial pressure situation of two diode chip for backlight unit, and can adjust to partial pressure can also uniformly adjust
It is whole to unbalanced-voltage-division, determined according to actual demand.
In a preferred embodiment, 13 top of the metal framework is provided with the through-hole for mechanical connection.It can be with
Encapsulating structure lock on a heat sink radiates to the encapsulating structure by the through-hole, or acts on other application scene
In.
First pin 133, second pin 131 and the auxiliary pin 132 are set side by side in one of the embodiments,
It sets, first pin 133 and second pin 131 are arranged in the both sides of the auxiliary pin 132.The metal framework 13 can be with
Metal framework 13 for planar structure, plane facilitates production, patch, processing to be convenient for mass production.Three pins are only each other
Vertical, mutually insulated realizes the series connection of diode as the carrier of diode chip for backlight unit by way of wiring.
Shown in Figure 4 in one of the embodiments, the metal framework 13 includes machinery successively from top to bottom end
Bonding pad 21, chip region 22 and pin area 23, first diode chip for backlight unit 14, the second diode chip for backlight unit 15 and the electric wire are set
It sets in the chip region 22, the through-hole is arranged in the mechanical connection area 21, and the chip region 22 is encapsulated in the epoxy of insulation
In resin body.
By being partially encapsulated in the epoxy resin ontology of insulation for encapsulating structure electrical connection so that the encapsulating structure becomes one
A entirety being connected to each other, and protect the part of the electrical connection not by external influence, enhance the stability of the encapsulating structure
And reliability, and the top of the metal framework 13 where through-hole is exposed outside, the heat dissipation performance of the encapsulating structure can be enhanced.
The mechanical connection area 21 and chip region 22 are encapsulated in the epoxy of the insulation in one of the embodiments,
In resin body, expose the through-hole.If the top due to the encapsulating structure is exposed, when electrical body contacts above-mentioned through-hole or top
When other positions in portion, the operating condition of circuit where influencing whether the encapsulating structure.The top of metal framework 13 is led to this
The inside in hole is encapsulated in epoxy resin ontology, can preferably protect the part of above-mentioned electrical connection not by extraneous shadow
It rings, enhances the stability and reliability of the encapsulating structure.
The surface area and second diode for the pin that the first diode chip for backlight unit 14 attaches in one of the embodiments,
The difference of the surface area for the pin that chip 15 attaches is within a preset range.The surface area for the pin that first diode chip for backlight unit 14 is attached
The surface area of the pin attached with second diode chip for backlight unit 15 is set as being equal or approximately equal so that two diode cores
The heat dissipation of piece is uniform as possible, and the partial pressure of the two is average as possible, improves its Performance And Reliability in a particular application.In the two point
On the basis of pressure is uniform, circuit design is carried out to it, it can be further adjusted according to actual demand and divides situation.
Further, it is also possible to there is following two realization methods, the first diode chip for backlight unit 14 is attached to the auxiliary of metal framework 13
On pin 132, the second diode chip for backlight unit 15 is attached in the second pin 131 of metal framework 13, and auxiliary pin 132 and second draws
The surface area approximately equal of foot 131;Alternatively, the first diode chip for backlight unit 14 is attached on the auxiliary pin 132 of metal framework 13, the
Two diode chip for backlight unit 15 are attached on the first pin 133 of metal framework 13, assist the surface of pin 132 and the first pin 133
Product approximately equal.Pin area approximation where two diode chip for backlight unit is equal so that and two diode chip for backlight unit heat dissipations are uniform, point
Pressure is impartial, enhances its reliability in practical applications.
The same pole of two diode chip for backlight unit is attached to the only of metal framework 13 by the encapsulating structure of above-mentioned series diode
On vertical pin, and another pole of the two diode chip for backlight unit and each individual pin are electrically connected, two diode chip for backlight unit of realization
Series connection, the same of the two diode chip for backlight unit extremely can be cathode, and corresponding there are two types of the encapsulating structures of series diode.In addition,
According to the demand of practical application, if desired enhance the anti-interference ability of the encapsulating structure, the top of metal framework 13 can be sealed
In epoxy resin, only expose the connection terminal of each pin front end;If desired enhance the heat-sinking capability of the encapsulating structure, it can be with
The top of the category frame is exposed outside, likewise, corresponding, there are two types of encapsulating structures.In order to enable two diode chip for backlight unit dissipate
It is hot uniform, the surface area for the metal pins that it is respectively attached can be designed as being equal or approximately equal, enhance the encapsulating structure
Reliability in actual use.The encapsulating structure of the series diode is simple, easy to process, can with automatic batch production,
Cost is saved.
Embodiment two:
The utility model embodiment also provides a kind of electronic equipment, including series diode as in the foregoing embodiment
Encapsulating structure.
In the electronic equipment that the utility model embodiment is provided, and one technical characteristic having the same of embodiment, therefore,
Above-mentioned function equally may be implemented.The specific work process of this electronic equipment, details are not described herein.
In addition, in the description of the utility model embodiment unless specifically defined or limited otherwise, term " installation ",
" connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects;It can be mechanical connection, can also be electrical connection;It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, it can understand above-mentioned term with concrete condition
Concrete meaning in the present invention.
It is in the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
Finally it should be noted that:Embodiment described above, only specific embodiment of the present utility model, to illustrate this
The technical solution of utility model, rather than its limitations, the scope of protection of the utility model is not limited thereto, although with reference to aforementioned
The utility model is described in detail in embodiment, it will be understood by those of ordinary skill in the art that:It is any to be familiar with this skill
The technical staff in art field within the technical scope disclosed by the utility model, still can be to the skill recorded in previous embodiment
Art scheme modify or can readily occur in variation or equivalent replacement of some of the technical features;And these modifications,
Variation is replaced, the spirit and model of the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution
It encloses, should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model is answered described is wanted with right
Subject to the protection domain asked.
Claims (10)
1. a kind of encapsulating structure of series diode, which is characterized in that including:Packaging body and cooling fin;It is set in the packaging body
It is equipped with metal framework, the first diode chip for backlight unit, the second diode chip for backlight unit;The metal framework includes the first pin, second pin
With auxiliary pin, it is both exposed to the outside of the packaging body;The distance between the back side of the packaging body and the metal framework
More than the distance between the front of the packaging body and described metal framework, the back side setting of the packaging body is fluted, described
Cooling fin is set in the groove;One pole of first diode chip for backlight unit is attached on the auxiliary pin, and described second
The opposite polarity pole of diode chip for backlight unit is electrically connected with the auxiliary pin, the identical pole of the second diode chip for backlight unit polarity
Be attached on one of first pin and second pin pin, another pole of first diode chip for backlight unit with it is described
Another pin electrical connection in first pin and second pin.
2. the encapsulating structure of series diode according to claim 1, which is characterized in that be arranged on the cell wall of the groove
There is at least two dumping slots for liquid extra between the groove and the cooling fin or gas to be discharged.
3. the encapsulating structure of series diode according to claim 1, which is characterized in that the thickness of the cooling fin and institute
The depth of groove for stating packaging body is identical.
4. the encapsulating structure of series diode according to claim 1, which is characterized in that the shape of the cooling fin and institute
It is identical to state the region shape that the groove inner wall of packaging body surrounds.
5. the encapsulating structure of series diode according to claim 1, which is characterized in that first pin, second are drawn
Foot and the auxiliary pin are arranged side by side, and first pin and second pin are arranged in the both sides of the auxiliary pin.
6. the encapsulating structure of series diode according to claim 5, which is characterized in that setting at the top of the metal framework
It is useful for the through-hole of mechanical connection.
7. the encapsulating structure of series diode according to claim 6, which is characterized in that the metal framework from top to
Bottom end includes mechanical connection area, chip region and pin area, first diode chip for backlight unit, the second diode chip for backlight unit and electric wire successively
Setting is arranged in the chip region, the through-hole in the mechanical connection area.
8. the encapsulating structure of series diode according to claim 7, which is characterized in that the chip region is encapsulated in insulation
Epoxy resin ontology in, expose the mechanical connection area and pin area.
9. the encapsulating structure of series diode according to claim 7, which is characterized in that the mechanical connection area and chip
Qu Jun is encapsulated in the epoxy resin ontology of insulation, exposes the pin area and through-hole.
10. a kind of electronic equipment, which is characterized in that include the encapsulation knot of claim 1-9 any one of them series diodes
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820484023.8U CN208000917U (en) | 2018-04-04 | 2018-04-04 | The encapsulating structure and electronic equipment of series diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820484023.8U CN208000917U (en) | 2018-04-04 | 2018-04-04 | The encapsulating structure and electronic equipment of series diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208000917U true CN208000917U (en) | 2018-10-23 |
Family
ID=63839356
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820484023.8U Active CN208000917U (en) | 2018-04-04 | 2018-04-04 | The encapsulating structure and electronic equipment of series diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208000917U (en) |
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2018
- 2018-04-04 CN CN201820484023.8U patent/CN208000917U/en active Active
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