Classifications

• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
  • C07D209/56—Ring systems containing three or more rings
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
  • C07D209/56—Ring systems containing three or more rings
  • C07D209/80—[b, c]- or [b, d]-condensed
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
  • C07D209/56—Ring systems containing three or more rings
  • C07D209/80—[b, c]- or [b, d]-condensed
  • C07D209/82—Carbazoles; Hydrogenated carbazoles
  • C07D209/86—Carbazoles; Hydrogenated carbazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the ring system
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
  • C07D209/56—Ring systems containing three or more rings
  • C07D209/80—[b, c]- or [b, d]-condensed
  • C07D209/82—Carbazoles; Hydrogenated carbazoles
  • C07D209/88—Carbazoles; Hydrogenated carbazoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to carbon atoms of the ring system
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
  • C07D209/56—Ring systems containing three or more rings
  • C07D209/80—[b, c]- or [b, d]-condensed
  • C07D209/94—[b, c]- or [b, d]-condensed containing carbocyclic rings other than six-membered
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
  • C07D333/02—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
  • C07D333/04—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom
  • C07D333/06—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring carbon atoms
  • C07D333/08—Hydrogen atoms or radicals containing only hydrogen and carbon atoms
  • C07D333/10—Thiophene
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
  • C07D405/02—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
  • C07D405/12—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D409/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
  • C07D409/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings
  • C07D409/12—Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D471/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00
  • C07D471/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00 in which the condensed system contains two hetero rings
  • C07D471/06—Peri-condensed systems
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
  • C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
  • C07D487/06—Peri-condensed systems
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D495/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having sulfur atoms as the only ring hetero atoms
  • C07D495/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having sulfur atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
  • C07D495/04—Ortho-condensed systems
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
  • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/12—Esters of monohydric alcohols or phenols
  • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
  • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F220/1806—C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/12—Esters of monohydric alcohols or phenols
  • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
  • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
  • C08F222/02—Acids; Metal salts or ammonium salts thereof, e.g. maleic acid or itaconic acid
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F4/00—Polymerisation catalysts
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
  • C08K5/3415—Five-membered rings
  • C08K5/3417—Five-membered rings condensed with carbocyclic rings
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/02—Printing inks
  • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
  • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/02—Printing inks
  • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
  • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/02—Printing inks
  • C09D11/10—Printing inks based on artificial resins
  • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/02—Printing inks
  • C09D11/10—Printing inks based on artificial resins
  • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D11/00—Inks
  • C09D11/30—Inkjet printing inks
  • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D135/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Coating compositions based on derivatives of such polymers
  • C09D135/02—Homopolymers or copolymers of esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
  • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
  • C09D7/40—Additives
  • C09D7/60—Additives non-macromolecular
  • C09D7/61—Additives non-macromolecular inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
  • C09D7/40—Additives
  • C09D7/60—Additives non-macromolecular
  • C09D7/63—Additives non-macromolecular organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/06—Non-macromolecular additives organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J135/02—Homopolymers or copolymers of esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
  • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
  • G02B5/201—Filters in the form of arrays
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
  • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
  • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
  • G03F7/0295—Photolytic halogen compounds
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
  • G03F7/031—Organic compounds not covered by group G03F7/029
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds

Definitions

• the invention belongs to the technical field of organic chemistry and light curing, and specifically relates to a new diaroyl carbazole compound, which is used as a highly active sensitizer and a carbazolyl oxime ester together to form a photoinitiator composition, and is used in a light curing combination Among them, especially for the production of photoresist, showing high sensitivity characteristics.
• UV light curing technology Since the emergence of light curing technology in the 1970s, it has been widely used. For example, UV light curing technology is widely used in the fields of coatings, printing inks, and electronic device manufacturing. Among them, the key factor affecting curing efficiency is the photoinitiator and its use. Co-initiator components, such as sensitizers. Carbazolyl oxime ester is an important class of oxime ester photoinitiators. Because of its relatively high sensitivity, it is well known, researched and used by those skilled in the art.
• the patent publication number or announcement number is CN1922142A (Mitsubishi Chemistry), CN100528838C (02), CN101528694A (831), CN101528693A, CN101508744A (304), CN103153952A (03), CN103492948A, CN107793502A patent application documents disclose carbazolyl oxime ester compounds with various substituents, used Materials or devices such as color filters, black matrix, photo spacers, liquid crystal split orientation.
• the pigment content in the light curing formula is getting higher and higher, especially for the black photoresist with high pigment content.
• the light energy utilization rate during the curing process is also reduced due to the absorption of the pigment.
• Sensitizers described in the prior art include benzophenone and its derivatives, thioxanthone and its derivatives, anthraquinone and its derivatives, coumarin derivatives, camphorquinone, Phenothiazine and its derivatives, 3-(aroyl methylene) thiazoline, rhodanine and its derivatives, eosin, rhodamine, acridine, anthocyanins, merocyanine dyes, tertiary amine compounds; Among them, benzophenone and its derivatives, thioxanthone and its derivatives, anthraquinone and its derivatives, and coumarin derivatives are preferred.
• the inventors synthesized a new class of diaroyl carbazole compounds as shown in formula I and formula II, and unexpectedly found that they are in combination with carbazolyl oxime esters such as OXE 03 can play a significant sensitization effect when used together in a specific ratio, and the sensitization efficiency is significantly higher than those compounds disclosed in the prior art. Therefore, a kind of compound containing the above-mentioned diaroyl carbazole compound and carbazolyl oxime is proposed.
• a diaroyl carbazole compound is provided, the structure is as shown in formula I or formula II,
• R 1 , R 8 , R 11 , and R 18 are each independently H, halogen atom, C1-C8 alkyl, C1-C8 alkoxy, CN;
• R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 12 , R 13 , R 14 , R 15 , R 16 , and R 17 are each independently H, F, Cl, COOR 20 , C1- C12 linear or branched alkyl, C1-C12 linear or branched alkoxy, wherein the C1-C12 linear or branched alkyl is unsubstituted or substituted with one or more of the following groups: phenyl , C3-C6 cycloalkyl, C3-C6 heterocyclic group, F, Cl, COOR 21 , OR 21 , SR 21 , PO(OC n H 2n+1 ) 2 , Si(C n H 2n+1 ) 3 , n is an integer of 1-4;
• each benzoyl group is a fluorine atom or a group containing a fluoroalkyl group
• R 9 and R 19 are each independently a C1-C12 straight or branched chain alkyl group, C2-C12 alkenyl, C3-C12 alkenyl alkyl, in which the hydrogen on the carbon atom is unsubstituted or substituted with one or more of the following groups: phenyl, C3-C6 cycloalkyl, C3-C6 heterocycle Group, halogen, COOR 20 , OR 20 , SR 20 , PO(OC n H 2n+1 ) 2 , Si(C n H 2n+1 ) 3 , n is an integer of 1-4; or C3-C12 alkenyl alkane
• the base is separated by one or more O, S, SO, SO 2 , CO, COO;
• R 9 and R 19 are each independently a C3-C12 alkyl group, the alkyl chain of which is separated by one or more O, S, SO, SO 2 , CO;
• R 9 and R 19 are each independently a phenyl group, which is unsubstituted or substituted with one or more C1-C8 alkyl groups, halogen atoms, OR 20 , SR 20 , COR 20 , CN, or COOH;
• R 19 can be combined with the substituent R 11 , or R 19 can be combined with the substituent R 18 to form a C4-C6 heterocyclic structure;
• R 20 is C1-C12 alkyl or phenyl, which is unsubstituted or substituted with one or more of the following groups: phenyl, C3-C6 cycloalkyl, C3-C6 heterocyclyl, F, Cl, OR 21 , SR 21 ;
• R 21 is a C1-C12 alkyl group.
• the compound represented by formula I is selected from compounds represented by formula I-A and formula I-B;
• the compound represented by formula II is selected from compounds represented by II-A and II-B:
• R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 12 , R 13 , R 14 , R 15 , R 16 , and R 17 are each independently H, F, Cl, COOR 20 , C1- C12 linear or branched alkyl, C1-C12 linear or branched alkoxy, wherein C1-C12 linear or branched alkyl is unsubstituted or substituted with one or more of the following groups: phenyl, C3 -C6 cycloalkyl, C3-C6 heterocyclyl, F, Cl, COOR 21 , OR 21 , SR 21 , PO(OC n H 2n+1 ) 2 , Si(C n H 2n+1 ) 3 , n is An integer of 1-4;
• the condition is that at least one substituent on the benzene ring of each benzoyl group is a fluorine atom or a group containing a fluoroalkyl group;
• R 9 and R 19 are as defined above.
• Y 1 and Y 2 are each independently a C2-C8 linear or branched alkyl group, and the chain can be inserted by O, S, NR 21 or carbonyl group, or the hydrogen on the carbon can be replaced by OH or halogen atom.
• examples of the diaroylcarbazole compounds represented by formula I-A and I-B are:
• a preparation method of the diaroyl carbazole compound represented by formula I or formula II is provided: the compound represented by formula III-A or formula III-B is used as a raw material, and the corresponding acylation reagent such as substituted aroyl chloride Or acid anhydride undergoes one or two Friedel-Crafts acylation reactions to obtain symmetric or asymmetric diaroyl compounds; if any aryl group contains a carboxyl group or a halogen atom with resubstitution activity, it can be combined with R 20 OH alcohol compounds Esterification reaction or etherification reaction is carried out to obtain the diaroyl carbazole compound represented by formula I or formula II.
• R 1 , R 8 , R 9 , R 11 , R 18 and R 19 are as defined above.
• the present invention also provides a photoinitiator composition
• a photoinitiator composition comprising at least one diaroyl carbazole compound and at least one carbazolyl oxime ester photoinitiator, wherein the carbazolyl oxime ester photoinitiator Initiator refers to at least one oxime ester group It is directly or through a carbonyl group connected to the N-substituted carbazole parent structure; wherein R 22 is a C1-C12 alkyl group, which is unsubstituted or substituted by one or more of the following groups: halogen atom, OR 24 , SR 24 , C3-C8 cycloalkyl, phenyl, C4-C20 heteroaryl, COOR 24 ; or R 22 is C6-C20 aryl or C4-C20 heteroaryl, each of which is unsubstituted or has one or more of the following groups Group substitution: halogen atom, C1-C20 al
• NR 25 R 26 is a ring structure
• the carbazole parent structure is selected from carbazole, benzocarbazole, dibenzocarbazole, and the hydrogen atom on the parent structure can be substituted by the oxime ester group or the carbonyl substituent connected to the oxime ester group.
• C1-C20 alkyl halogen, NO 2 , CN, OR 27 , C6-C20 aroyl, C4-C20 heteroaroyl, 4,5-diphenylimidazol-2-yl
• the substituents on the parent structure can form a new five- to seven-membered ring structure when they are adjacent in space;
• the C1-C20 alkyl group is unsubstituted or substituted by one or more of the following groups: halogen, C3- C8 cycloalkyl, C3-C8 heterocycloalkyl, phenyl, COOR 27 , OR 27 , PO(OC n H 2n+1 ) 2 , Si(C n H 2n+1 ) 3 , where n is 1-4 Integer, or one or more oxygen atoms inserted when the number of carbon atoms is greater than 3;
• R 27 is C1-C8 alkyl, C1-C8 alkyl
• the carbazolyl oxime ester photoinitiator is selected from the following compounds or any mixtures thereof:
• One of the preparation methods of carbazolyl oxime ester is to use the corresponding acylcarbazole parent compound as a raw material to obtain the carbazolyl oxime ester through oximation and esterification.
• Many prior art related to this can be referred to, such as CN103153952A.
• the preparation method of the photoinitiator composition includes: taking a sensitizer compound, such as a compound of formula I-1, by 0.1 mole, and a carbazolyl oxime ester, such as a compound of formula IV-22, by 0.1 mol, and mixing uniformly The photoinitiator composition is obtained.
• a sensitizer compound such as a compound of formula I-1
• a carbazolyl oxime ester such as a compound of formula IV-22
• the preparation method of the photoinitiator composition includes: taking a sensitizer compound, such as a compound of formula I-1, by 0.1 mole, and a carbazolyl oxime ester, such as a compound of formula IV-22, by 0.1 mol, and mixing uniformly The photoinitiator composition is obtained.
• one or more sensitizer compounds and one or more carbazolyl oxime esters are mixed directly with other components, but the total molar amount of the sensitizer is compared with the carbazolyl oxime
• the present invention also provides a photocurable composition, which contains:
• a photoinitiator composition containing at least one sensitizer represented by formula I, formula IIA and IIB and at least one carbazolyl oxime ester compound represented by formula IV1-IV37; optionally, component a The ratio of the mass of the formula to the total solid mass of the formula is 1-10%, preferably 1-8%.
• At least one free-radical polymerizable compound optionally, the free-radical polymerizable compound is selected from acrylate compounds, methacrylate compounds, containing acrylate groups or methacrylate groups The resin or any mixture of them.
• examples of low molecular weight compounds include alkyl acrylate, cycloalkyl acrylate, hydroxyalkyl acrylate, dialkylaminoalkyl acrylate, alkyl methacrylate, and methacrylic acid.
• Examples of compounds containing two or more double bonds are ethylene glycol, polyethylene glycol, propylene glycol, neopentyl glycol, 1,6-hexanediol diacrylate, trihydroxymethane triacrylate, pentaerythritol tetraacrylate Esters, dipentaerythritol hexaacrylate, vinyl acrylate, triallyl cyanurate, etc.
• Examples of higher molecular weight double bond compounds include a large class of substances commonly known as oligomers, such as acrylated epoxy resins, acrylated polyester resins, unsaturated polyester resins, acrylated polyether resins, and acrylated resins.
• Polyurethane resin generally has a molecular weight of 500-3000.
• the present invention also provides an ink or coating, which, in addition to containing the above-mentioned photocurable composition, can also add other necessary components according to the performance requirements of the ink color and printing application.
• the ink or paint can be used for pattern printing, 3D printing, PCB solder mask, liquid or dry film anti-corrosive material, substrate protective coating, etc.
• the present invention also provides an adhesive.
• an adhesive In addition to containing the above-mentioned photocurable composition, other necessary components can be added according to the performance requirements of the adhesive.
• the adhesive can be used to bond glass, plastic, metal components, etc.
• the present invention also provides a photoresist, which contains:
• At least one of the above-mentioned photoinitiator compositions optionally, the mass of which accounts for 0.2-10% of the total solid mass of the formula, preferably 1-8%;
• At least one radically polymerizable compound such as a multifunctional acrylate monomer
• Examples of multifunctional acrylates in component b are dipentaerythritol hexaacrylate, pentaerythritol acrylate;
• examples of component c alkali-soluble resins are polyacrylates with carboxylic acid groups, such as methacrylic acid, itaconic acid, Copolymers obtained by copolymerizing maleic acid and common monomers in required proportions, such as methyl acrylate, butyl methacrylate, benzyl acrylate, hydroxyethyl acrylate, styrene, butadiene, and Malay Anhydrides, etc.;
• examples of copolymers are preferably methyl methacrylate and methacrylic acid copolymers, benzyl methacrylate and methacrylic acid copolymers, methyl methacrylate and butyl methacrylate, and methacrylic acid and benzene Ethylene copolymer.
• pigment of component d examples include C.I. Pigment Red 177, C.I. Pigment Green 7, C.I. Pigment Blue 15:6, Solvent Blue 25, Carbon Black, Titanium Black, C.I. Pigment Black 1.
• component b there are many existing documents on component b, component c, component d and component e, such as CN103153952A, and those skilled in the art can choose according to their needs.
• component a as a photoinitiator, other existing commercial or existing photoinitiators or co-initiators can also be added, as long as it is beneficial to the performance of the photocurable composition, especially the photoresist.
• Omnirad BDK Omnirad 369, Omnirad 379, Omnirad 389, Omnirad TPO, Omnirad 819, Omnirad ITX, Omnirad DETX, Omnirad 784.
• Omnirad is a product of IGM Resin Company.
• examples of other resins that can be added are polyalkyl methacrylate, ethyl cellulose, carboxymethyl cellulose, novolac resin, polyvinyl butyral, polyvinyl acetate, Polyester, polyimide.
• a black photoresist is provided.
• the pigment in the photoresist is a well-dispersed black pigment such as carbon black or titanium black, it becomes a black photoresist.
• Black photoresist can be used to manufacture black matrix, cell gap spacers, and microlenses.
• a color filter device can be obtained by using the photoresist and/or black photoresist of the present invention as raw materials through the processing of the color filter, which is an important part of a color display screen.
• any material containing the photoinitiator composition of the present invention such as ink, paint, adhesive, photoresist, and black photoresist as raw materials, and process any items such as color filters and color displays through necessary processes Screen.
• Omnirad EMK Photoinitiator product of IGM Resin Company
• OXE 02 compound of formula IV-1, photoinitiator product of BASF;
• OXE 03 compound of formula IV-22, photoinitiator product of BASF;
• NCI 831 compound of formula IV-9, product of ADEKA Corporation of Japan;
• PBG 304 compound of formula IV-2, product of Changzhou Qiangli Electronic New Material Co., Ltd.;
• Photomer 6010 Aliphatic polyurethane triacrylate, product of IGM Resin Company
• DPHA Dipentaerythritol penta and hexaacrylate, a product of Tianjin Tianjiao Chemical Co., Ltd.;
• HPMA Polymaleic acid, a product of Aladdin Industries, USA.
• the dichloroethane solution was distilled under reduced pressure and dichloroethane was recovered, and 80 ml of ethyl acetate was added to the residue to crystallize to obtain 30.5 g of the product, with a white powder content of 98.5% and a yield of 69.5%.
• Dichloroethane was recovered by distillation under reduced pressure, 150ml ethyl acetate and 2g activated carbon were added to the residue, heated to reflux for 1 hour, filtered the activated carbon, the filtrate was distilled under reduced pressure to remove about 100ml ethyl acetate, cooled and crystallized, filtered and dried and filtered The cake obtained 27.8 g, light yellow powder, the content was 98.5%, and the yield was 61.4%.
• Composition preparation example 1 is a composition prepared example 1:
• Composition preparation example 2 is a composition prepared example 2:
• composition preparation example 3 is a composition prepared example 3:
• Composition preparation example 4 is a composition prepared example 4:
• the examples and comparative examples were prepared according to the components described in Tables 1 to 4.
• the initiator and the sensitizer can use the composition in the preparation example of the composition or be mixed in the PMA according to the proportion in the table, and then the composition solution and the black color paste can be mixed in proportion.
• After mixing the components uniformly use a 10 ⁇ m wire rod to coat the glass slide, dry in an oven at 90°C for 5min, use a 365nm light source with a 120 ⁇ m mask for curing, use 1% NaOH solution at 25°C for development, and use pure water After soaking and cleaning for 10s, drying in a 90°C oven for 30 minutes, measure the line width of the developed image, the unit of line width is ⁇ m.
• Comparative example 10 Comparative example 11 Comparative example 12 Omnirad DETX 0.024 0 0 ESacure 3644 0 0.024 0
• Example 5 Comparative example 6 Comparative example 7 Development point/s 32 25 30 twenty two Development line width 163.0 130.0 138.0 115.0
• Comparative example 10 Comparative example 11 Comparative example 12 Development point/s twenty two 25 twenty four Development line width 112.0 118.0 109.0
• Example 11 Comparative example 13 Photomer 6010 5 5 5 5 HPMA 4.5 4.5 4.5 OXE 02 0 0 0.5 Composition preparation example 1 0.5 0 0 Composition preparation example 2 0 0.5 0
• Table 9 shows the test data of the comparative examples and the examples in Table 10. It can be seen from the data that the photocurable composition provided by the present invention is used in Example 10 and Example 11, and the conversion rate of the double bond gel in the adhesive is significantly higher than that of Comparative Example 13 using the oxime ester photoinitiator alone.
• novel diaroyl carbazole compound provided by the present invention and the carbazolyl oxime ester photoinitiator used together show a significant sensitization effect in the photoresist composition or adhesive.
• the molar ratio of the carbazole compound to the carbazolyl oxime ester photoinitiator is between 0.1 and 1.4, showing the best sensitization effect.

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Physics & Mathematics (AREA)
• Wood Science & Technology (AREA)
• Life Sciences & Earth Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Inorganic Chemistry (AREA)
• Spectroscopy & Molecular Physics (AREA)
• General Chemical & Material Sciences (AREA)
• Optics & Photonics (AREA)
• Indole Compounds (AREA)
• Materials For Photolithography (AREA)
• Polymerisation Methods In General (AREA)
• Plural Heterocyclic Compounds (AREA)
• Paints Or Removers (AREA)
• Inks, Pencil-Leads, Or Crayons (AREA)
• Optical Filters (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

Family

ID=73799005

Family Applications (1)

Country Status (7)

Families Citing this family (5)

Citations (11)

Family Cites Families (16)

• 2020
  • 2020-03-17 US US17/598,936 patent/US12172962B2/en active Active
  • 2020-03-17 CN CN202080012922.8A patent/CN113518774B/zh active Active
  • 2020-03-17 DE DE112020002202.1T patent/DE112020002202T5/de active Pending
  • 2020-03-17 KR KR1020217039140A patent/KR102711242B1/ko active Active
  • 2020-03-17 WO PCT/CN2020/079714 patent/WO2020253283A1/zh not_active Ceased
  • 2020-03-17 JP JP2021560178A patent/JP2022528738A/ja active Pending
  • 2020-03-18 TW TW109109042A patent/TWI776133B/zh active
  • 2020-03-31 CN CN202010240176.XA patent/CN112110847A/zh active Pending
  • 2020-06-19 CN CN202010565795.6A patent/CN112110848A/zh active Pending

Patent Citations (11)

Non-Patent Citations (3)

Also Published As

Similar Documents

Legal Events