WO2020249075A1 - 一种显示屏和电子设备 - Google Patents

一种显示屏和电子设备 Download PDF

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Publication number
WO2020249075A1
WO2020249075A1 PCT/CN2020/095786 CN2020095786W WO2020249075A1 WO 2020249075 A1 WO2020249075 A1 WO 2020249075A1 CN 2020095786 W CN2020095786 W CN 2020095786W WO 2020249075 A1 WO2020249075 A1 WO 2020249075A1
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WIPO (PCT)
Prior art keywords
hole
film layer
layer
display screen
display
Prior art date
Application number
PCT/CN2020/095786
Other languages
English (en)
French (fr)
Inventor
严斌
周晓东
毛春程
肖广楠
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20822923.7A priority Critical patent/EP3965095A4/en
Priority to US17/617,429 priority patent/US20220246884A1/en
Priority to BR112021025146A priority patent/BR112021025146A2/pt
Publication of WO2020249075A1 publication Critical patent/WO2020249075A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light

Definitions

  • This application relates to the field of display technology, in particular to a display screen and electronic equipment.
  • the opaque components such as light-emitting layer, support material
  • the substrate and the encapsulation layer When opening the screen, some manufacturers will remove the opaque components (such as light-emitting layer, support material) between the substrate and the encapsulation layer to form a through-hole structure with good light permeability. However, this It will result in the formation of a gap between the substrate and the packaging layer.
  • the substrate has a certain rigidity (such as the substrate is made of silicon oxide, silicon oxynitride, etc.) under the action of the internal and external pressure, the substrate and the packaging layer are prone to deformation, thereby affecting The normal operation of the camera.
  • the present application provides a display screen and electronic equipment that can effectively prevent the normal operation of the optical device from being affected by the opening of the display screen.
  • an embodiment of the present application provides a display screen, including a transparent substrate, an encapsulation film layer, and a display layer located between the transparent substrate and the encapsulation film layer; the display layer has at least one first through hole penetrating to both sides thereof ; At least one first through hole has a first transparent filler.
  • the first transparent filler may be a gaseous substance or a solid substance.
  • the air pressure in the first through hole can be effectively controlled by adjusting the amount of gas in the first through hole, so as to ensure that the pressure difference between the inside and outside of the first through hole is small.
  • the first transparent filler is a solid substance, the first pass The space in the hole is occupied to reduce the volume of gas or vacuum in the first through hole, so as to reduce the maximum pressure difference between the inside and outside of the first through hole, thereby effectively preventing the transparent substrate and the packaging film from bending deformation;
  • solid The first transparent filler can also form a support and connection between the transparent substrate and the encapsulation film layer, prevent the transparent substrate and the encapsulation film layer from bending deformation, thereby effectively preventing the deformation of the transparent substrate and the encapsulation film layer from causing the optical
  • the material of the first transparent filler can be selected with a material that is close to the refractive index of the transparent substrate or the encapsulation film layer, so as to prevent the transparent substrate and the encapsulation film layer from deforming, and reduce the first transparent filler as much as possible.
  • a first antireflection film layer may also be provided at the position of the transparent substrate corresponding to the first through hole; or on the packaging film The position of the layer corresponding to the first through hole is provided with a second antireflection coating layer to reduce the intensity of the reflected light.
  • the first transparent filler may not be provided in the first through hole, and the adverse effect of the display screen opening on the optical device caused by the opening of the display screen can be improved only by reducing the intensity of the reflected light.
  • the first antireflection coating layer can also be provided at the position of the transparent substrate corresponding to the first through hole to reduce the reflected light intensity of the transparent substrate.
  • a second antireflection film layer can be provided at the position of the packaging film layer corresponding to the first through hole to reduce the intensity of reflected light of the packaging film layer.
  • the transparent substrate and the packaging film layer in order to prevent the transparent substrate and the packaging film layer from affecting the normal operation of the camera and other optical devices, in some specific embodiments, it can also be achieved by increasing the distance between the transparent substrate and the packaging film layer.
  • the distance between the transparent substrate and the packaging film layer can be kept above 10 ⁇ m, so as to effectively avoid affecting the normal operation of optical devices such as cameras.
  • a first recess may be provided on a side surface of the transparent substrate facing the first through hole to increase the distance between the transparent substrate and the packaging film layer.
  • the first recess may be a blind hole, and the diameter of the blind hole and the diameter of the first through hole may be the same or substantially the same.
  • the first recessed portion may be formed by processes such as etching and grinding.
  • the material of the transparent substrate is silicon oxide, hydrofluoric acid or the like can be used to process the transparent substrate to form the first recess.
  • the transparent substrate can be processed by a process such as grinding to form the first recess.
  • a second recessed portion similar to the first recessed portion may also be provided in the packaging film layer.
  • a second recess may be provided on the packaging film layer facing one side surface of the first through hole to increase the distance between the transparent substrate and the packaging film layer.
  • the second recess may be a blind hole, and the diameter of the blind hole may be the same or substantially the same as the diameter of the first through hole.
  • the second recessed portion can be formed by processes such as etching and grinding.
  • the material of the packaging film layer is silicon oxide, hydrofluoric acid or the like can be used to process the packaging film layer to form the second recess.
  • the packaging film layer may be processed by a process such as grinding to form the second recess.
  • the thickness of the display layer may be appropriately increased, or a thickening film layer may be provided between the display layer and the packaging film layer.
  • the thickened film layer can be made of a material with better light-transmitting properties, or can be made of a material with better light-shielding properties.
  • the thickened film layer when the thickened film layer is made of a material with good light permeability (such as silicon oxide, polyimide, etc.), it will not affect the display effect of the light-emitting layer (that is, it will not form the light-emitting layer. Blocking) will not block the first through hole. Therefore, the through hole structure may not be provided in the region corresponding to the first through hole.
  • a material with good light permeability such as silicon oxide, polyimide, etc.
  • the thickening film layer when the thickening film layer is made of a material with good light-shielding properties, in order not to affect the display effect of the display layer, the thickening film layer can be composed of a plurality of blocks arranged at intervals, or the thickening film layer can be patterned The treatment can reduce the shielding of the display layer as much as possible, and can also increase the distance between the transparent substrate and the packaging film layer.
  • a second through hole may be provided in a region corresponding to the first through hole.
  • the projection of the second through hole on the display layer should completely cover the first through hole; that is, when the first through hole is coaxial with the second through hole, the aperture of the second through hole is not smaller than the first through hole.
  • the aperture of the hole When the first through hole and the second through hole are not coaxial, the aperture of the second through hole should be larger than the aperture of the first through hole to prevent the first through hole from being blocked by the thickened film layer.
  • the display screen may also include a polarizer, which may be located on the side of the packaging film layer away from the display layer; in order not to affect the working performance of the camera and other optical devices, the polarizer has a polarizer that faces the first The third through hole of the through hole, and the projection of the third through hole on the display layer completely covers the first through hole.
  • a polarizer which may be located on the side of the packaging film layer away from the display layer; in order not to affect the working performance of the camera and other optical devices, the polarizer has a polarizer that faces the first The third through hole of the through hole, and the projection of the third through hole on the display layer completely covers the first through hole.
  • the aperture of the third through hole should not be smaller than the aperture of the first through hole to prevent the polarizer from blocking the first through hole;
  • the aperture of the third through hole should be larger than the aperture of the first through hole to prevent the first through hole from being blocked by the light shielding sheet.
  • the camera and other optical devices installed under the display screen have an image acquisition viewing angle similar to a cone; therefore, the diameter of the third through hole may be slightly larger than the diameter of the first through hole.
  • the opening diameter of the first through hole can be minimized, so as to maximize the support effect of the display layer on the transparent substrate and the packaging film layer, and prevent the transparent substrate and the packaging film layer from being deformed.
  • the cathode layer or the wires (such as the driving circuit) in the display layer are usually made of metal materials, they have high reflective characteristics, causing users to see a circle of bright lines formed by the reflection of the cathode layer when watching the screen.
  • the region near the first through hole in the thickened film layer may be made of opaque material to shield the exposed cathode layer.
  • an additional light shielding layer can also be provided to shield the exposed cathode layer.
  • the display screen may further include a light-shielding layer, and the light-shielding layer may be disposed between the display layer and the packaging film layer and cover the projection area of the third through hole on the display layer. Since the aperture of the third through hole is larger than the aperture of the first through hole, the projection of the third through hole on the display layer is a circular ring-shaped area; in specific implementation, the light shielding layer may have a circular ring structure to prevent the exposed The cathode layer produces a good shielding effect.
  • the light-shielding layer may also be provided on a side of the packaging film layer away from the display layer, or the light-shielding layer may be provided on both sides of the packaging film layer.
  • the light-shielding layer may be ink, vinyl or other materials with good light-shielding properties.
  • the display screen may also include a transparent cover.
  • the transparent cover plate can be attached to the side of the polarizer away from the packaging film layer through materials such as OCA optical adhesive (Optically Clear Adhesive).
  • the polarizer is provided with a third through hole, in order to prevent deformation of the packaging film layer; in some specific embodiments, a second transparent filler similar to the first transparent filler may be provided in the third through hole to Effectively avoid the occurrence of rainbow patterns and other phenomena.
  • an embodiment of the present application also provides an electronic device, including an optical device and any one of the above-mentioned display screens; the optical device is arranged directly to the first through hole.
  • the optical device may be provided with a camera, a light sensor, a distance sensor, etc.
  • the optical device may be set under the display screen; at the same time, multiple devices may be set in the display screen.
  • the light-transmitting hole structure corresponding to the optical device respectively enables the external light to pass through the light-transmitting hole in the display screen and enter the light sensor and the distance sensor.
  • FIG. 1 is a schematic structural diagram of a display screen provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a mobile phone provided by an embodiment of this application.
  • FIG. 3 is a schematic structural diagram of a combination of a display screen and a camera provided by an embodiment of the application;
  • FIG. 4 is a schematic structural diagram of another display screen combined with a camera provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a display screen provided by an embodiment of the application.
  • FIG. 6 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 8 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 10 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 11 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 12 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 13 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • 15 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 16 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 17 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 18 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 19 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 20 is a schematic structural diagram of yet another display screen provided by an embodiment of the application.
  • FIG. 21 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 22 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 23 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 24 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 25 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 26 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 27 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 28 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 29 is a schematic structural diagram of a display screen and a camera combined according to an embodiment of the application.
  • FIG. 30 is a schematic structural diagram of another display screen combined with a camera provided by an embodiment of the application.
  • FIG. 31 is a schematic structural diagram of yet another combination of a display screen and a camera provided by an embodiment of the application.
  • FIG. 32 is a schematic structural diagram of a display screen provided by an embodiment of the application.
  • FIG. 33 is a schematic structural diagram of another display screen provided by an embodiment of the application.
  • FIG. 34 is a schematic structural diagram of yet another display screen provided by an embodiment of the application.
  • FIG. 35 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • an OLED display screen it mainly includes a substrate 01, an encapsulation layer 02, and a light-emitting layer 03 arranged between the substrate 01 and the encapsulation layer 02; the light-emitting layer 03 may include the substrate 01 and the encapsulation layer 02 sequentially stacked
  • the anode layer 031, the hole transport layer 032, the organic light emitting layer 033, the electron transport layer 034, the cathode layer 035, etc. are provided.
  • the OLED display screen is divided into two types: flexible OLED display screen and rigid OLED display screen.
  • the flexible OLED display can use polyimide and other materials as the substrate 01 to make the flexible OLED display have better bendability;
  • the rigid OLED display can use silicon oxide and other materials as the substrate 01 to Make the rigid OLED display screen have better rigidity.
  • optical devices such as a camera 05 (also a light sensor or a distance sensor) are also set; With a high screen-to-body ratio, a light-transmitting hole 041 can be opened in the display 04, and optical devices such as the camera 05 can be placed on the lower side of the display 04 so that external light can pass through the light-transmitting hole 041 and enter the camera 05, etc. In the optics. In practical applications, the light-transmitting hole 041 can be formed in multiple ways.
  • the light-shielding part (such as the display layer 03) may not be prepared in the area where the light-transmitting hole 041 will be formed.
  • the light-shielding component (such as the display layer 03) can be removed by etching and other processes in a later stage to form the light-transmitting hole 041.
  • a through hole 031 may be formed on the display layer 03.
  • the support between the encapsulation layer 02 and the substrate 01 at the through hole 031 is lost.
  • the display 04 as a rigid OLED display as an example, when there is a pressure difference between the through hole 031 and the outside, the encapsulation layer 02 and the substrate 01 will be deformed. At this time, the camera 05 and other optical The device causes adverse effects.
  • the embodiments of the present application provide a display screen that can effectively avoid the above-mentioned undesirable phenomena.
  • references described in this specification to "one embodiment” or “some embodiments”, etc. mean that one or more embodiments of the present application include a specific feature, structure, or characteristic described in conjunction with the embodiment. Therefore, the phrases “in one embodiment”, “in some embodiments”, “in some other embodiments”, “in some other embodiments”, etc. appearing in different places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless it is specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variations all mean “including but not limited to” unless otherwise specifically emphasized.
  • the display screen 10 includes a transparent substrate 11, an encapsulation film layer 12, and a display layer 13 located between the transparent substrate 11 and the encapsulation film layer 12; the display layer 13 has a through At least one first through hole 130 (only one is shown in the figure) to its two sides; as shown in FIG. 6, at least one first through hole 130 has a first through hole 130 for supporting the transparent substrate 11 and the packaging film layer 12.
  • the first transparent filler 14 may be a gaseous substance or a solid substance.
  • the first transparent filling 14 when it is a gaseous substance, it can be an inert gas such as nitrogen, helium, neon, etc.; in practical applications, the first through hole 130 can be effectively controlled by adjusting the amount of gas in the first through hole 130.
  • the air pressure in the hole 130 ensures that the pressure difference between the inside and the outside of the first through hole 130 is small, thereby effectively preventing the transparent substrate 11 and the packaging film layer 12 from bending and deforming, and effectively preventing the transparent substrate 11 and the packaging film layer 12 from being deformed.
  • the first transparent filler 14 when the first transparent filler 14 is a solid substance, it can be indium tin oxide (ITO), OCA optical adhesive (Optically Clear Adhesive) and other materials to be used on the transparent substrate 11 It forms a support and connection with the packaging film layer 12 to prevent the transparent substrate 11 and the packaging film layer 12 from bending and deforming, thereby effectively preventing the adverse effects of the deformation of the transparent substrate 11 and the packaging film layer 12 on the optical device;
  • the first transparent filler 14 may completely cover the first through hole 130 or may be disposed in a partial area of the first through hole 130.
  • the transparent substrate 11 can be made of materials such as silicon oxide, silicon oxynitride, etc., so that the display screen 04 has a certain rigidity;
  • the packaging film layer 12 can be made of inorganic materials such as silicon oxide and silicon oxynitride, or polyamide. Made of organic materials such as imines.
  • the first transparent filler 14 can be made of a material that is close to the refractive index of the transparent substrate 11 or the encapsulation film layer 12, so as to prevent the transparent substrate 11 and the encapsulation film layer 12 from being deformed, and reduce the thickness as much as possible.
  • a first antireflection coating layer may also be provided at the position of the transparent substrate 11 corresponding to the first through hole 130. 111;
  • the first antireflection film layer 111 may also be provided at the position of the transparent substrate 11 corresponding to the first through hole 130 to reduce the first through hole The reflected light at the interface between 130 (the vacuum inside) and the transparent substrate 11.
  • the first antireflection film layer 111 may be disposed on a side surface of the transparent substrate 11 close to the first through hole 130 to reduce the reflected light on the upper surface of the transparent substrate 11; FIG. As shown, it can also be arranged on a side of the transparent substrate 11 away from the first through hole 130 to reduce the reflected light on the lower surface of the transparent substrate 11. In some specific embodiments, as shown in FIG. Both sides of the transparent substrate 11 are provided with a first antireflection film 111 to reduce the intensity of reflected light, thereby improving the working performance of optical devices such as cameras.
  • the first transparent filler 14 may also be disposed inside the first through hole 130, and only by reducing the intensity of the reflected light, the adverse effect of the opening of the display screen on the optical device is improved.
  • a second antireflection may be provided at the position of the encapsulation film layer 12 corresponding to the first through hole 130.
  • Film layer 121 when the first transparent filler 14 is not provided in the first through hole 130, a second antireflection film layer 121 can also be provided at the position of the packaging film layer 12 corresponding to the first through hole 130 to reduce the Reflected light at the interface between a through hole 130 (vacuum inside) and the packaging film layer 121.
  • the second antireflection film layer 121 may be disposed on a side surface of the packaging film layer 12 close to the first through hole 130 to reduce the reflected light on the lower surface of the packaging film layer 121; As shown in FIG. 11, it may also be arranged on a side of the packaging film layer 12 away from the first through hole 130 to reduce the reflected light on the upper surface of the packaging film layer; in some specific embodiments, as shown in FIG. 12, The second antireflection film layer 121 may also be provided on both sides of the packaging film layer 12 to reduce the intensity of reflected light, thereby improving the working performance of optical devices such as cameras.
  • a first transparent filler 14 can also be provided in the first through hole 130 to Effectively avoid affecting the normal operation of optical devices such as cameras.
  • the transparent substrate 11 and the packaging film layer 12 can also be achieved by increasing the distance between the transparent substrate 11 and the packaging film layer 12.
  • the distance between the transparent substrate 11 and the packaging film layer 12 can be kept above 10 ⁇ m, so as to effectively avoid causing damage to the normal operation of optical devices such as cameras. influences.
  • a first recess 112 may be provided on the transparent substrate 11 facing one side of the first through hole 130 to increase (at the first through hole 130) the transparent substrate 11 and the package.
  • the first recess 112 may specifically be a blind hole, and the diameter of the blind hole may be the same or substantially the same as the diameter of the first through hole 130.
  • the bottom surface of the first recess 112 may be a flat surface or a curved surface.
  • the bottom surface of the first recessed portion 112 may be a flat surface; in a specific implementation, as shown in FIG. 15, the first through hole 130 and the first recess
  • the first transparent filler 14 is arranged in the portion 112 to effectively prevent the transparent substrate 11 and the packaging film layer 11 from bending and deforming.
  • the bottom surface of the first recessed portion 112 is a concave curved surface; in specific implementation, when the first transparent filler 14 is not provided in the first through hole 130 When the transparent substrate 11 is bent and deformed toward one side of the first through hole 130; please refer to FIG. 17, when the transparent substrate 11 is bent, the concave curved surface can be deformed to form a plane or a rough plane; through this This structural arrangement can also effectively avoid affecting the normal operation of optical devices such as cameras.
  • the curvature of the curved surface can be reasonably adjusted according to the degree of deformation that the transparent substrate 11 can produce, so as to ensure that the curved surface can form a plane as much as possible after the transparent substrate 11 is bent and deformed.
  • a raised portion 113 may also be provided on the side of the transparent substrate 11 away from the first through hole 130; in specific implementations, the curved surface of the raised portion 113 may be the same as the first through hole 130.
  • the concave curved surface in the concave portion 112 is adapted. It can be understood that the transparent substrate 11 may have a micro-arch structure in the area corresponding to the first through hole 130; please refer to FIG. 19, when the transparent substrate 11 is bent, The concave curved surface in the concave portion 112 and the convex curved surface in the raised portion 113 can be deformed to form a plane or a rough plane, thereby effectively improving the quality of light transmission.
  • the first recess 112 may be formed by processes such as etching and grinding.
  • the material of the transparent substrate 11 is silicon oxide, hydrofluoric acid or the like can be used to process the transparent substrate 11 to form the first recess 112.
  • the transparent substrate 11 can be processed by a process such as grinding to form the first recess 112.
  • a second recess portion 122 similar to the first recess portion 112 may also be provided in the packaging film layer 12.
  • a second recess 122 may be provided on a side surface of the first through hole 130 on the packaging film layer 12 to increase (at the first through hole 130). ) The distance between the transparent substrate 11 and the packaging film layer 12.
  • the second recess 122 may be a blind hole, and the diameter of the blind hole and the diameter of the first through hole 130 may be the same or substantially the same.
  • the bottom surface of the second recess 122 may be a flat surface or a curved surface.
  • the bottom surface of the second recessed portion 122 may be a flat surface; in a specific implementation, as shown in FIG. 21, the first through hole 130 and the second recessed portion
  • the first transparent filler 14 is arranged in the portion 122 to effectively prevent the packaging film layer 12 from bending and deforming.
  • the bottom surface of the second recessed portion 122 is a concave curved surface; in specific implementation, when the first transparent filler 14 is not provided in the first through hole 130 When the encapsulation film layer 12 is bent and deformed toward one side of the first through hole 130, when the encapsulation film layer 12 is bent, as shown in FIG. 23, the concave curved surface can be deformed to form a plane or a rough plane; Through this structural arrangement, it is also possible to effectively avoid affecting the normal operation of optical devices such as cameras.
  • the curvature of the curved surface can be adjusted reasonably according to the degree of deformation that the packaging film layer 12 can produce, so as to ensure that the curved surface can form a plane as much as possible after the packaging film layer 12 is bent and deformed.
  • a protruding portion 123 may also be provided on the side of the packaging film layer 12 away from the first through hole 130; in specific implementation, the arc surface of the protruding portion 123 may be the same as the first through hole 130.
  • the concave curved surfaces in the two recesses 122 are matched. It can be understood that the packaging film layer 12 may have a micro-arch structure in the area corresponding to the first through hole 130; please refer to FIG.
  • the packaging film layer 12 is curved At this time, the concave curved surface in the second concave portion 122 and the convex curved surface in the raised portion 123 can be deformed to form a plane or a rough plane, thereby effectively improving the quality of light transmission.
  • the second recessed portion 122 may be formed by processes such as etching and grinding.
  • the material of the packaging film layer 12 is silicon oxide, hydrofluoric acid or the like can be used to process the packaging film layer 12 to form the second recess 122.
  • the packaging film layer 12 may be processed by a process such as grinding to form the second recess 122.
  • the distance between the transparent substrate 11 and the packaging film layer 12 at the first through hole 130 can also be increased.
  • the thickness of the display layer 13 can be appropriately increased to keep the thickness of the display layer 13 above 10 ⁇ m.
  • the distance between the transparent substrate 11 and the packaging film layer 12 can also be increased by adding other film layers.
  • a thickening film layer 15 may be provided between the display layer 13 and the packaging film layer 12 to improve the gap between the packaging film layer 12 and the transparent substrate 11. distance.
  • the thickened film layer 15 may be made of a material with better light-transmitting properties, or may be made of a material with better light-shielding properties.
  • the thickened film layer 15 when the thickened film layer 15 is made of a material with good light permeability (such as silicon oxide, polyimide, etc.), it will not affect the display effect of the light-emitting layer 13 (that is, it will not affect the light-emitting The layer 13 forms a shield) and does not shield the first through hole 130. Therefore, a through hole structure may not be provided in the region corresponding to the first through hole 130.
  • a material with good light permeability such as silicon oxide, polyimide, etc.
  • the thickened film layer 15 When the thickened film layer 15 is made of a material with better light-shielding properties, in order not to affect the display effect of the display layer 13, as shown in FIG. 27, the thickened film layer 15 may be composed of a plurality of blocks 151 arranged at intervals. The thickening film layer 15 can also be patterned to reduce the shielding of the display layer 20 as much as possible, and at the same time, it can also increase the distance between the transparent substrate 11 and the packaging film layer 12. In addition, in order to prevent the first through hole 130 from being blocked by the thickened film layer 15, in some embodiments, the second through hole 152 may be provided in a region corresponding to the first through hole 130.
  • the projection of the second through hole 152 on the display layer 13 should completely cover the first through hole 130; that is, when the first through hole 130 and the second through hole 152 are coaxial, the second through hole 152
  • the hole diameter is not smaller than the hole diameter of the first through hole 130.
  • the aperture of the second through hole 152 should be larger than the aperture of the first through hole 130 to prevent the first through hole 130 from being blocked by the thickened film layer 15.
  • the thickened film layer 15 may also be formed by a mixture of light-transmitting materials and light-shielding materials.
  • a partial area 153 of the thickened film layer 15 has better light transmittance, and another partial area 151 of the thickened film layer 15 has better light shielding. Sex.
  • the light-transmitting area and the opaque area in the thickened film layer 15 can also be set in a targeted manner.
  • the display screen 10 further includes a polarizer 16, which is located on a side of the packaging film layer 12 away from the display layer 13; in order not to affect the camera, etc.
  • the polarizer has a third through hole 161 facing the first through hole 130, and the projection of the third through hole 161 on the display layer 13 completely covers the first through hole 130.
  • the aperture of the third through hole 161 should not be smaller than the aperture of the first through hole 130 to prevent the polarizer 16 from contacting the first through hole 130.
  • Form a shield when the first through hole 130 and the third through hole 161 are out of axis, the aperture of the third through hole 161 should be larger than the aperture of the first through hole 130 to prevent the shading sheet 16 from blocking the first through hole 130 .
  • the image capture angle of the camera 20 is similar to a conical shape; therefore, the diameter of the third through hole 161 may be slightly larger than the diameter of the first through hole 130; During implementation, the opening diameter of the first through hole 130 can be minimized to maximize the supporting effect of the display layer 13 on the transparent substrate 11 and the packaging film layer 12 and prevent the transparent substrate 11 and the packaging film layer 12 from being deformed.
  • the cathode layer 131 or the wires (such as the driving circuit) in the display layer 13 are usually made of metal materials, they have high light-reflecting characteristics, which causes the user to see a reflection formed by the cathode layer 131 when watching the screen. Circle bright lines; in order to avoid the generation of bright lines; in some embodiments, the area a of the thickened film layer 15 close to the first through hole 130 can be made of opaque material to form the exposed cathode layer 131 Occlude.
  • an additional light shielding layer 17 may also be provided to shield the exposed cathode layer 131.
  • the display screen 10 may further include a light-shielding layer 17, and the light-shielding layer 17 may be disposed between the display layer and the packaging film layer 12 and cover the third layer.
  • the projection of the third through hole 161 on the display layer 20 is a circular area (that is, the area where the cathode layer 131 is exposed);
  • the light-shielding layer 17 may have a circular ring structure, so as to have a good shielding effect on the exposed cathode layer 131.
  • the light shielding layer 17 may also be provided on a side of the packaging film layer 12 away from the display layer, or the light shielding layer 17 may be provided on both sides of the packaging film layer 12.
  • the light shielding layer 17 may be ink, vinyl or other materials with good light shielding properties.
  • the light-shielding layer 17 may also be formed on the cathode layer 131 by processes such as electroplating or spraying; or, as shown in FIG. 31, the exposed cathode layer 131 may be removed by processes such as etching.
  • the first transparent filler 14 may still be disposed in the first through hole 130 to prevent the transparent substrate 11 and the packaging film layer 12 from being deformed.
  • a light-shielding material 171 (such as vinyl) can also be provided on the inner wall of the first through hole 130 to effectively prevent the generation of bright lines, and at the same time, it can also effectively prevent The first transparent filler 14 in the first through hole 130 overflows.
  • the display screen 10 may also include a transparent cover 18.
  • the transparent cover plate 18 can be attached to the side of the polarizer 16 away from the packaging film layer 12 through materials such as OCA (Optically Clear Adhesive).
  • the transparent cover plate 18 may be a glass plate or a plate-like structure made of polyimide or other materials.
  • the polarizer 16 is provided with a third through hole 161, in order to prevent deformation of the packaging film layer 12; please refer to FIG. 34, in some specific embodiments, the third through hole 161 A second transparent filler 19 similar to the first transparent filler 14 can also be provided.
  • the second transparent filler 19 may be a gaseous substance or a solid substance.
  • the second transparent filler 19 when it is a gaseous substance, it can be an inert gas such as nitrogen, helium, or neon; in practical applications, the third through hole 161 can be adjusted to effectively control the third through hole.
  • the air pressure in the hole 161 ensures that the pressure difference between the inside and the outside of the third through hole 161 is small, thereby effectively preventing the packaging film 12 from bending and deforming, and effectively preventing the occurrence of undesirable phenomena such as rainbow patterns;
  • the second transparent filler When 19 is a solid substance, it can be indium tin oxide (Indium Tin Oxides, ITO), OCA optical adhesive (Optically Clear Adhesive) and other materials to form a support and connection between the transparent cover plate 18 and the packaging film layer 12 to prevent The transparent cover plate 18 and the packaging film layer 12 produce bending deformation, thereby effectively preventing the occurrence of undesirable phenomena such as rainbow patterns; in practical applications, the second transparent filler 19 can completely cover the third through hole 161, or it can be arranged in the first Part of the area within the three-way hole 161.
  • an embodiment of the present application also provides an electronic device 30.
  • the electronic device 30 may specifically be a mobile phone, a tablet computer, a display, a TV, and the like. Taking the electronic device 30 as a mobile phone as an example, the mobile phone may include a camera 20 and the display screen 10 in any of the foregoing embodiments.
  • the camera 20 can be installed below the display screen 10, and is arranged directly to the light transmission hole 100 (the first through hole 130 in the display layer 13) in the display screen 10 so that external light can pass through.
  • the light hole 100 enters the camera 20.
  • a light sensor 21 and a distance sensor 22 can also be provided in the mobile phone; in order to achieve a higher average ratio, the light sensor 21 and the distance sensor 22 can be installed on the display screen 10. At the same time, in order to ensure the normal operation of the light sensor 21 and the distance sensor 22, two light transmission holes 100 opposite to the light sensor 21 and the distance sensor 22 can be added to the display screen 10.
  • the number and position arrangement of the light-transmitting holes 100 can be adjusted according to actual conditions. At the same time, the size of each light-transmitting hole 100 may be the same or different.

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Abstract

一种显示屏（10）和电子设备（30），显示屏（10）包括透明基板（11）、封装膜层（12）以及位于透明基板（11）和封装膜层（12）之间的显示层（13）；显示层（13）具有贯穿至显示层（13）两侧面的至少一个第一通孔（130）；至少一个第一通孔（130）内具有第一透明填充物（14）。在显示屏（10）中，通过在第一通孔（130）内设置透明填充物（14）的形式，有效降低透明基板（11）和封装膜层（12）产生形变的现象，从而能够避免彩虹纹等不良现象的产生。

Description

一种显示屏和电子设备
本申请要求在2019年06月14日提交中国专利局、申请号为201910517884.0、发明名称为“一种硬屏OLED屏内打孔方案”的中国专利申请的优先权，在2019年9月23日提交中国专利局、申请号为201910900801.6、发明名称为“一种显示屏和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示屏和电子设备。
背景技术
在当前电子设备的发展趋势下，更高的屏占比逐渐成为消费者和各厂商的主要追求方向。以手机为例，手机的正面除了设置屏幕以外，通常还需要设置摄像头等器件，为了降低摄像头等器件对手机正面空间的占用，以实现更高的屏占比；有些厂商将摄像头设置在手机内部，并对屏幕进行开孔处理，以使摄像头能够透过屏幕上的通孔来采集外界的图像。
在对屏幕进行开孔处理时，有些厂商会对基板和封装层之间的不透光组件(例如发光层、支撑材料)进行去除，以形成具有良好透光性的通孔结构，但是，这就会导致基板和封装层之间形成间隙，当基板具备一定刚性时(如基板采用氧化硅、氮氧化硅等材料制成)在内外压差作用下，基板和封装层容易产生形变，从而影响摄像头的正常工作。
发明内容
本申请提供了一种能有效避免因显示屏开孔而影响光学器件正常工作的显示屏和电子设备。
一方面，本申请实施例提供了一种显示屏，包括透明基板、封装膜层以及位于透明基板和封装膜层之间的显示层；显示层具有贯穿至其两侧面的至少一个第一通孔；至少一个第一通孔内具有第一透明填充物。
具体来说，第一透明填充物可以是气态物质或固态物质。
例如，当第一透明填充物为气态物质时，可以通过调节第一通孔内气体的量来有效控制第一通孔内的气压，以保证第一通孔的内、外气压差较小，从而有效防止透明基板和封装膜层产生弯曲形变，以有效杜绝因透明基板和封装膜层的形变对光学器件产生的不良影响；当第一透明填充物为固态物质时，可以通过对第一通孔内空间的占用，来降低第一通孔内气体或真空的体积，以此来降低第一通孔的最大内、外气压差，从而有效防止透明基板和封装膜层产生弯曲形变；固态的第一透明填充物还可以在透明基板和封装膜层之间形成支撑和连接作用，防止透明基板和封装膜层产生弯曲形变，从而有效杜绝因透明基板和封装膜层的形变对光学器件产生的不良影响；在实际应用中，第一透明填充物可以完全布满第一通孔，也可以设置在第一通孔内的部分区域。
在具体实施时，第一透明填充物在材料选择上，可以采用与透明基板或封装膜层的折射率较为接近的材料，以在防止透明基板和封装膜层形变的基础上，尽可能降低第一透明填充物与透明基板之间交界面的反射光、第一透明填充物与封装膜层之间交界面的反射光，从而提升摄像头等光学器件的工作性能。
为了降低第一透明填充物与透明基板之间交界面的反射光，在一些具体实施方式中，也可以在透明基板对应第一通孔的位置设置第一增透膜层；也可以在封装膜层对应第一通孔的位置设置第二增透膜层，以降低反射光的强度。
另外，在一些具体实施方式中，也可以在第一通孔内不设置第一透明填充物，仅通过降低反射光强度的方式，改善因显示屏开孔对光学器件所产生的不良影响。具体来说，当第一通孔内未填充第一透明填充物时，也可以在透明基板对应第一通孔的位置设置第一增透膜层，以降低透明基板的反射光强度，相应的，也可以在封装膜层对应第一通孔的位置设置第二增透膜层，以降低封装膜层的反射光强度。
另外，为了避免透明基板和封装膜层影响摄像头等光学器件的正常工作，在一些具体实施方式中，也可以通过增加透明基板与封装膜层之间的距离的方式来实现。
例如，在第一通孔处，透明基板与封装膜层之间的距离可以保持在10μm以上，以有效避免对摄像头等光学器件的正常工作造成影响。
在具体实施时，可以在透明基板上正对于第一通孔的一侧面设置第一凹陷部，以增加透明基板与封装膜层之间的距离。第一凹陷部具体可以为盲孔，盲孔的直径与第一通孔的直径可以相同或大致相同。
在具体制作时，第一凹陷部可以采用腐蚀、磨削等工艺进行成型。例如，当透明基板的材质为氧化硅时，可以采用氢氟酸等对透明基板进行处理，以形成第一凹陷部。当透明基板的材质为聚酰亚胺时，可以采用磨削等工艺对透明基板进行处理，以形成第一凹陷部。
在另一些具体实施方式中，也可以在封装膜层中设置与第一凹陷部相类似的第二凹陷部。
具体来说，可以在封装膜层上正对于第一通孔的一侧面设置第二凹陷部，以增加透明基板与封装膜层之间的距离。第二凹陷部具体可以为盲孔，盲孔的直径与第一通孔的直径可以相同或大致相同。
在具体制作时，第二凹陷部可以采用腐蚀、磨削等工艺进行成型。例如，当封装膜层的材质为氧化硅时，可以采用氢氟酸等对封装膜层进行处理，以形成第二凹陷部。当封装膜层的材质为聚酰亚胺时，可以采用磨削等工艺对封装膜层进行处理，以形成第二凹陷部。
为了增加透明基板与封装膜层在第一通孔处的距离，还可以通过增加透明基板整体与封装膜层整体之间的距离来实现。
在具体实施时，可以适当增加显示层的厚度，也可以在显示层和封装膜层之间设置增厚膜层。
在具体实施时，增厚膜层可以由透光性较好的材质制成，也可以由遮光性较好的材质制成。
具体来说，当增厚膜层由透光性较好的材质(如氧化硅、聚酰亚胺等)制成时，由于不会影响到发光层的显示效果(即不会对发光层形成遮挡)，也不会对第一通孔形成遮挡，因此，在对应于第一通孔的区域可以不设置通孔结构。
当增厚膜层由遮光性较好的材质制成时，为了不影响显示层的显示效果，增厚膜层可以由多个间隔设置的块体组成，也可以对增厚膜层进行图案化处理，以尽可能降低对显示层的遮挡，同时也能够起到增加透明基板与封装膜层间距的效果。另外，为了使得增厚膜层不会对第一通孔形成遮挡，在一些具体实施方式中，可以在对应于第一通孔的区域设置第二通孔。在具体实施时，第二通孔在显示层上的投影应完全覆盖第一通孔；即，当第一通孔与第二通孔同轴时，第二通孔的孔径不小于第一通孔的孔径。当第一通孔与第二通孔不同轴时，第二通孔的孔径应大于第一通孔的孔径，以防止增厚膜层对第一通孔形成遮挡。
在一些具体实施方式中，显示屏中还可以包括偏光片，偏光片可以位于封装膜层的远离显示层的一侧面；为了不影响摄像头等光学器件的工作性能，偏光片中具有正对于第一通孔的第三通孔，第三通孔在显示层上的投影完全覆盖第一通孔。
具体来说，当第一通孔与第三通孔同轴设置时，第三通孔的孔径应不小于第一通孔的孔径，以防止偏光片对第一通孔形成遮挡；当第一通孔与第三通孔不同轴时，第三通孔的孔径应大于第一通孔的孔径，以防止遮光片对第一通孔形成遮挡。
在实际应用时，安装在显示屏下方的摄像头等光学器件，其图像采集视角类似于圆锥形；因此，第三通孔的直径可以略大于第一通孔的直径。在具体实施时，可以尽量减小第一通孔的开孔直径，从而尽量提升显示层对透明基板和封装膜层之间的支撑效果，防止透明基板和封装膜层产生形变。然而由于显示层中的阴极层或者导线(如驱动电路)通常由金属材料制成，因此，具有较高的反光特性，导致用户在观看屏幕时会看到由阴极层反射形成的一圈亮线；为了避免亮线的产生；在一些具体实施方式中，增厚膜层中靠近第一通孔的区域可以由不透光材料制成，以对裸露的阴极层形成遮挡。
在另一些具体实施方式中，也可以设置额外的遮光层对裸露的阴极层进行遮挡。
具体来说，显示屏中还可以包括遮光层，遮光层可以设置在显示层与封装膜层之间，且覆盖第三通孔在显示层上的投影区域。由于第三通孔的孔径大于第一通孔的孔径，因此，第三通孔在显示层上的投影为圆环形区域；在具体实施时，遮光层可以为圆环形结构，以对裸露的阴极层产生良好的遮挡作用。在其他实施例中，遮光层还可以设置在封装膜层的远离显示层的一侧面，或者在封装膜层的两侧均设置遮光层。
在具体实施时，遮光层可以为油墨、黑胶或者其他遮光性良好的材质。
另外，在一些具体实施方式中，为了使得显示屏具有良好的结构强度，防止在遭受外力时受到损坏，显示屏中还可以包括透明盖板。具体来说，透明盖板可以通过OCA光学胶(Optically Clear Adhesive)等材料贴附在偏光片的远离封装膜层的一侧面。
由于偏光片中开设有第三通孔，为了防止封装膜层产生形变；在一些具体实施方式中，第三通孔内还可以设置与第一透明填充物相类似的第二透明填充物，以有效避免彩虹纹等现象的产生。
另一方面，本申请实施例还提供了一种电子设备，包括光学器件和上述任意一种的显示屏；所述光学器件正对于所述第一通孔设置。
在一些具体实施方式中，光学器件可以设置包括摄像头、光感应器、距离传感器等，为了提升屏幕的屏占比，光学器件可以设置在显示屏的下方；同时，显示屏中也可以设置多个分别与光学器件对应的透光孔结构，以使外界光线能够透过显示屏中的透光孔射入光感应器、距离传感器中。
附图说明
图1为本申请实施例提供的一种显示屏的结构示意图；
图2为本申请实施例提供的一种手机的结构示意图；
图3为本申请实施例提供的一种显示屏与摄像头结合的结构示意图；
图4为本申请实施例提供的另一种显示屏与摄像头结合的结构示意图；
图5为本申请实施例提供的一种显示屏的结构示意图；
图6为本申请实施例提供的另一种显示屏的结构示意图；
图7为本申请实施例提供的又一种显示屏的结构示意图；
图8为本申请实施例提供的又一种显示屏的结构示意图；
图9为本申请实施例提供的另一种显示屏的结构示意图；
图10为本申请实施例提供的另一种显示屏的结构示意图；
图11为本申请实施例提供的又一种显示屏的结构示意图；
图12为本申请实施例提供的又一种显示屏的结构示意图；
图13为本申请实施例提供的又一种显示屏的结构示意图；
图14为本申请实施例提供的另一种显示屏的结构示意图；
图15为本申请实施例提供的又一种显示屏的结构示意图；
图16为本申请实施例提供的又一种显示屏的结构示意图；
图17为本申请实施例提供的又一种显示屏的结构示意图；
图18为本申请实施例提供的又一种显示屏的结构示意图；
图19为本申请实施例提供的又一种显示屏的结构示意图；
图20为本申请实施例提供的又一种显示屏的结构示意图；
图21为本申请实施例提供的又一种显示屏的结构示意图；
图22为本申请实施例提供的又一种显示屏的结构示意图；
图23为本申请实施例提供的又一种显示屏的结构示意图；
图24为本申请实施例提供的又一种显示屏的结构示意图；
图25为本申请实施例提供的又一种显示屏的结构示意图；
图26为本申请实施例提供的又一种显示屏的结构示意图；
图27为本申请实施例提供的又一种显示屏的结构示意图；
图28为本申请实施例提供的又一种显示屏的结构示意图；
图29为本申请实施例提供的一种显示屏与摄像头结合的结构示意图；
图30为本申请实施例提供的另一种显示屏与摄像头结合的结构示意图；
图31为本申请实施例提供的又一种显示屏与摄像头结合的结构示意图；
图32为本申请实施例提供的一种显示屏的结构示意图；
图33为本申请实施例提供的另一种显示屏的结构示意图；
图34为本申请实施例提供的又一种显示屏的结构示意图；
图35为本申请实施例提供的一种电子设备的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
显示屏的类型多种多样，例如，在电子设备(如手机、平板电脑、显示器、电视等)中，目前较为常用的显示屏主要包括LCD(Liquid Crystal Display)显示屏和OLED(OrganicLight-Emitting Diode)显示屏两大类。
如图1所示，在OLED显示屏中，主要包括基板01、封装层02以及设置在基板01和封装层02之间的发光层03；发光层03可以包括由基板01向封装层02依次层叠设置的阳极层031、空穴传输层032、有机发光层033、电子传输层034和阴极层035等。在阳极层031和阴极层035通电时，电子和空穴分别由电子传输层034和空穴传输层032迁移到有机发光层033，并在有机发光层033中相遇，形成激子并使发光分子激发，从而产生可见光，以达到显示的目的。按照基板01的可弯曲特性的不同，OLED显示屏又区分为柔性OLED显示屏和刚 性OLED显示屏两类。具体来说，柔性OLED显示屏可以采用聚酰亚胺等材料作为基板01，以使柔性OLED显示屏具备较好的可弯折性能；刚性OLED显示屏可以采用氧化硅等材料作为基板01，以使刚性OLED显示屏具备较好的刚性。
如图2所示，以手机为例，在实际应用中，手机的正面除了要设置显示屏04外，还要设置摄像头05(还可以是光感应器、距离传感器)等光学器件；为了实现更高的屏占比，可以在显示屏04中开设透光孔041，并将摄像头05等光学器件放置在显示屏04的下侧，以使外部光线能够透过透光孔041射入摄像头05等光学器件中。在实际应用中，透光孔041的形成方式可以为多种，例如，在对显示屏04进行制作时，可以在将要形成透光孔041的区域不制备遮光部件(如显示层03)，也可以后期采用蚀刻等工艺对遮光部件(如显示层03)进行去除，以形成透光孔041。
请结合参阅图3，在显示屏04的各组成结构中，由于显示层03的透光性较差，为了在显示屏04上形成透光孔041，可以在显示层03上开设通孔031。然而在实际应用中，对显示层03进行开孔后，在通孔031处封装层02和基板01之间失去了支撑物。如图4所示，以显示屏04为刚性OLED显示屏为例，当通孔031与外界之间存在压差时，封装层02和基板01会产生形变，此时，会对摄像头05等光学器件造成不良影响。具体来说，当外界光线射入封装层02之后，一部分光线直接经基板01射入下方的摄像头05等光学器件；另一部分光线会在封装层02和基板01之间进行两次甚至更多次反射，然后再经基板01射入下方的摄像头05等光学器件；由于在通孔031处，封装层02和基板01产生了形变，导致封装层02和基板01之间的距离不均匀，从而使得直接射入摄像头的光线与多次反射后射入摄像头的光线之间相互干涉，从而影响摄像头05等光学器件的正常工作；例如，当光学器件为摄像头05时，会出现彩虹纹等不良现象。为此，本申请实施例提供了一种能够有效避免产生上述不良现象的显示屏。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”、“一个或多个”是指一个、两个或两个以上。术语“和/或”，用于描述关联对象的关联关系，表示可以存在三种关系；例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况，其中A、B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
如图5所示，在本申请提供的一个实施例中，显示屏10包括透明基板11、封装膜层12以及位于透明基板11和封装膜层12之间的显示层13；显示层13具有贯穿至其两侧面的至少一个第一通孔130(图中仅示出了一个)；如图6所示，至少一个第一通孔130内具有用于支撑透明基板11和封装膜层12的第一透明填充物14。
具体来说，第一透明填充物14可以是气态物质或固态物质。例如，当第一透明填充物14为气态物质时，可以为氮气、氦气、氖气等惰性气体；在实际应用时，可以通过调节第一 通孔130内气体的量来有效控制第一通孔130内的气压，以保证第一通孔130的内、外气压差较小，从而有效防止透明基板11和封装膜层12产生弯曲形变，以有效杜绝因透明基板11和封装膜层12的形变对光学器件产生的不良影响；当第一透明填充物14为固态物质时，可以为氧化铟锡(Indium Tin Oxides，ITO)、OCA光学胶(Optically Clear Adhesive)等材料，以在透明基板11和封装膜层12之间形成支撑和连接作用，防止透明基板11和封装膜层12产生弯曲形变，从而有效杜绝因透明基板11和封装膜层12的形变对光学器件产生的不良影响；在实际应用中，第一透明填充物14可以完全布满第一通孔130，也可以设置在第一通孔130内的部分区域。
在具体实施时，透明基板11可以采用氧化硅、氮氧化硅等材料制成，以使显示屏04具备一定的刚性；封装膜层12可以采用氧化硅、氮氧化硅等无机材料，或聚酰亚胺等有机材料制成。第一透明填充物14在材料选择上，可以采用与透明基板11或封装膜层12的折射率较为接近的材料，以在防止透明基板11和封装膜层12形变的基础上，尽可能降低第一透明填充物14与透明基板11之间交界面的反射光、第一透明填充物14与封装膜层12之间交界面的反射光，从而提升摄像头等光学器件的工作性能；具体来说，为了提升摄像头等光学器件的工作性能，还可以通过降低经封装膜层12、透明基板11反射的光强来实现。
例如，为了降低第一透明填充物14与透明基板11之间交界面的反射光，在一些具体实施方式中，也可以在透明基板11对应第一通孔130的位置设置第一增透膜层111；另外，当第一通孔130内未设置第一透明填充物14时，也可以在透明基板11对应第一通孔130的位置设置第一增透膜层111，以降低第一通孔130(内的真空)与透明基板11之间交界面的反射光。
在具体实施时，如图7所示，第一增透膜层111可以设置在透明基板11的靠近第一通孔130的一侧面，以降低透明基板11的上表面的反射光；如图8所示，也可以是设置在透明基板11的远离第一通孔130的一侧面，以降低透明基板11的下表面的反射光；在一些具体实施方式中，如图9所示，也可以在透明基板11的两侧均设置第一增透膜层111，以降低反射光的强度，从而提升摄像头等光学器件的工作性能。
另外，在一些具体实施方式中，也可以在第一通孔130内部设置第一透明填充物14，仅通过降低反射光强度的方式，改善因显示屏开孔对光学器件所产生的不良影响。
例如，为了降低第一透明填充物14与封装膜层12之间交界面的反射光，在一些具体实施方式中，也可以在封装膜层12对应第一通孔130的位置设置第二增透膜层121；另外，当第一通孔130内未设置第一透明填充物14时，也可以在封装膜层12对应第一通孔130的位置设置第二增透膜层121，以降低第一通孔130(内的真空)与封装膜层121之间交界面的反射光。
在具体实施时，如图10所示，第二增透膜层121可以设置在封装膜层12的靠近第一通孔130的一侧面，以降低封装膜层121的下表面的返射光；如图11所示，也可以是设置在封装膜层12的远离第一通孔130的一侧面，以降低封装膜层的上表面的反射光；在一些具体实施方式中，如图12所示，也可以在封装膜层12的两侧均设置第二增透膜层121，以降低反射光的强度，从而提升摄像头等光学器件的工作性能。
如图13所示，在另一些实施方式中，在设置第一增透膜层111和第二增透膜层121的同时，第一通孔130内也可以设置第一透明填充物14，以有效避免对摄像头等光学器件的正常工作造成影响。
另外，为了避免透明基板11和封装膜层12影响摄像头等光学器件的正常工作，在一些 具体实施方式中，也可以通过增加透明基板11与封装膜层12之间的距离的方式来实现。
例如，在本申请提供的一个实施例中，在第一通孔130处，透明基板11与封装膜层12之间的距离可以保持在10μm以上，以有效避免对摄像头等光学器件的正常工作造成影响。
在具体实施时，如图14所示，可以在透明基板11上正对于第一通孔130的一侧面设置第一凹陷部112，以增加(在第一通孔130处)透明基板11与封装膜层12之间的距离。第一凹陷部112具体可以为盲孔，盲孔的直径与第一通孔130的直径可以相同或大致相同。
在一些具体实施方式中，第一凹陷部112的底面可以为平面也可以为曲面。
如图14所示，在本申请提供的一个实施例中，第一凹陷部112的底面可以为平面；在具体实施时，如图15所示，还可以在第一通孔130和第一凹陷部112内设置第一透明填充物14，以有效防止透明基板11和封装膜层11产生弯曲形变。
如图16所示，在本申请提供的另一个实施例中，第一凹陷部112的底面为内凹的曲面；在具体实施时，当第一通孔130内未设置第一透明填充物14时，可能会导致透明基板11向第一通孔130的一侧弯曲形变；请结合参阅图17，当透明基板11弯曲时，内凹的曲面可以通过形变而形成平面或大致的平面；通过这种结构设置，也能够有效避免对摄像头等光学器件的正常工作造成影响。在具体实施时，曲面的弧度可以根据透明基板11所能产生的形变程度来做合理调整，以保证在透明基板11弯曲形变后曲面能够尽可能的形成平面。另外，在一些具体实施方式中，如图18所示，在透明基板11的远离第一通孔130的侧面也可以设置隆起部113；在具体实施时，隆起部113的弧面可以与第一凹陷部112中内凹的曲面相适配，可以理解的是，透明基板11在对应于第一通孔130的区域可以为微拱形结构；请结合参阅图19，透明基板11弯曲时，第一凹陷部112中内凹的曲面以及隆起部113中凸出的弧面可以通过形变而形成平面或大致的平面，从而有效提升光线的传输质量。
在具体制作时，第一凹陷部112可以采用腐蚀、磨削等工艺进行成型。例如，当透明基板11的材质为氧化硅时，可以采用氢氟酸等对透明基板11进行处理，以形成第一凹陷部112。当透明基板11的材质为聚酰亚胺时，可以采用磨削等工艺对透明基板11进行处理，以形成第一凹陷部112。
为了增加透明基板11与封装膜层12在第一通孔130处的距离，还可以在封装膜层12中设置与第一凹陷部112相类似的第二凹陷部122。
如图20所示，在本申请提供的一个实施例中，可以在封装膜层12上正对于第一通孔130的一侧面设置第二凹陷部122，以增加(在第一通孔130处)透明基板11与封装膜层12之间的距离。第二凹陷部122具体可以为盲孔，盲孔的直径与第一通孔130的直径可以相同或大致相同。
在一些具体实施方式中，第二凹陷部122的底面可以为平面也可以为曲面。
如图20所示，在本申请提供的一个实施例中，第二凹陷部122的底面可以为平面；在具体实施时，如图21所示，还可以在第一通孔130和第二凹陷部122内设置第一透明填充物14，以有效防止封装膜层12产生弯曲形变。
如图22所示，在本申请提供的另一个实施例中，第二凹陷部122的底面为内凹的曲面；在具体实施时，当第一通孔130内未设置第一透明填充物14时，可能会导致封装膜层12向第一通孔130的一侧弯曲形变，当封装膜层12弯曲时，如图23所示，内凹的曲面可以通过形变而形成平面或大致的平面；通过这种结构设置，也能够有效避免对摄像头等光学器件的正常工作造成影响。在具体实施时，曲面的弧度可以根据封装膜层12所能产生的形变程度来做合理调整，以保证在封装膜层12弯曲形变后曲面能够尽可能的形成平面。另外，在一些具 体实施方式中，如图24所示，在封装膜层12的远离第一通孔130的侧面也可以设置隆起部123；在具体实施时，隆起部123的弧面可以与第二凹陷部122中内凹的曲面相适配，可以理解的是，封装膜层12在对应于第一通孔130的区域可以为微拱形结构；请结合参阅图25，封装膜层12弯曲时，第二凹陷部122中内凹的曲面以及隆起部123中凸出的弧面可以通过形变而形成平面或大致的平面，从而有效提升光线的传输质量。
在具体制作时，第二凹陷部122可以采用腐蚀、磨削等工艺进行成型。例如，当封装膜层12的材质为氧化硅时，可以采用氢氟酸等对封装膜层12进行处理，以形成第二凹陷部122。当封装膜层12的材质为聚酰亚胺时，可以采用磨削等工艺对封装膜层12进行处理，以形成第二凹陷部122。
为了增加透明基板11与封装膜层12在第一通孔130处的距离，还可以通过增加透明基板11整体与封装膜层12整体之间的距离来实现。
例如，可以适当增加显示层13的厚度，使显示层13的厚度保持在10μm以上。
在一些具体实施方式中，也可以通过添加其他膜层的形式来增加透明基板11与封装膜层12之间的距离。
例如，如图26所示，在本申请提供的一个实施例中，可以在显示层13与封装膜层12之间设置增厚膜层15，以提升封装膜层12与透明基板11之间的距离。
在具体实施时，增厚膜层15可以由透光性较好的材质制成，也可以由遮光性较好的材质制成。
具体来说，当增厚膜层15由透光性较好的材质(如氧化硅、聚酰亚胺等)制成时，由于不会影响到发光层13的显示效果(即不会对发光层13形成遮挡)，也不会对第一通孔130形成遮挡，因此，在对应于第一通孔130的区域可以不设置通孔结构。
当增厚膜层15由遮光性较好的材质制成时，为了不影响显示层13的显示效果，如图27所示，增厚膜层15可以由多个间隔设置的块体151组成，也可以对增厚膜层15进行图案化处理，以尽可能降低对显示层20的遮挡，同时也能够起到增加透明基板11与封装膜层12间距的效果。另外，为了使得增厚膜层15不会对第一通孔130形成遮挡，在一些具体实施方式中，可以在对应于第一通孔130的区域设置第二通孔152。在具体实施时，第二通孔152在显示层13上的投影应完全覆盖第一通孔130；即，当第一通孔130与第二通孔152同轴时，第二通孔152的孔径不小于第一通孔130的孔径。当第一通孔130与第二通孔152不同轴时，第二通孔152的孔径应大于第一通孔130的孔径，以防止增厚膜层15对第一通孔130形成遮挡。
在一些具体实施方式中，增厚膜层15还可以由透光材料和遮光材料混合形成。
例如，如图28所示，在本申请提供的一个实施例中，增厚膜层15的部分区域153具有较好的透光性，增厚膜层15的另一部分区域151具有较好的遮光性。
在一些具体实施方式中，增厚膜层15中的透光区域和不透光区域还可以进行针对性设置。
例如，如图29所示，在本申请提供的一个实施例中，显示屏10中还包括偏光片16，偏光片16位于封装膜层12的远离显示层13的一侧面；为了不影响摄像头等光学器件的工作性能，偏光片中具有正对于第一通孔130的第三通孔161，第三通孔161在显示层13上的投影完全覆盖第一通孔130。
具体来说，当第一通孔130与第三通孔161同轴设置时，第三通孔161的孔径应不小于第一通孔130的孔径，以防止偏光片16对第一通孔130形成遮挡；当第一通孔130与第三通孔161不同轴时，第三通孔161的孔径应大于第一通孔130的孔径，以防止遮光片16对第一 通孔130形成遮挡。
请继续参阅图29，以摄像头20为例，在实际应用时，摄像头20的图像采集视角类似于圆锥形；因此，第三通孔161的直径可以略大于第一通孔130的直径；在具体实施时，可以尽量减小第一通孔130的开孔直径，从而尽量提升显示层13对透明基板11和封装膜层12之间的支撑效果，防止透明基板11和封装膜层12产生形变。然而由于显示层13中的阴极层131或者导线(如驱动电路)通常由金属材料制成，因此，具有较高的反光特性，导致用户在观看屏幕时会看到由阴极层131反射形成的一圈亮线；为了避免亮线的产生；在一些具体实施方式中，增厚膜层15中靠近第一通孔130的区域a可以由不透光材料制成，以对裸露的阴极层131形成遮挡。
在另一些具体实施方式中，也可以设置额外的遮光层17对裸露的阴极层131进行遮挡。
具体的，如图30所示，在本申请提供的一个实施例中，显示屏10中还可以包括遮光层17，遮光层17可以设置在显示层与封装膜层12之间，且覆盖第三通孔161在显示层13上的投影区域。
具体来说，由于第三通孔161的孔径大于第一通孔130的孔径，因此，第三通孔161在显示层20上的投影为圆环形区域(即阴极层131裸露的区域)；在具体实施时，遮光层17可以为圆环形结构，以对裸露的阴极层131产生良好的遮挡作用。
在其他实施例中，遮光层17还可以设置在封装膜层12的远离显示层的一侧面，或者在封装膜层12的两侧均设置遮光层17。
在具体实施时，遮光层17可以为油墨、黑胶或者其他遮光性良好的材质。
在一些具体实施方式中，也可以采用电镀或喷涂等工艺在阴极层131上形成遮光层17；或者，如图31所示，采用蚀刻等工艺对裸露的阴极层131进行去除。
可以理解的是，在上述实施例中，仍可以在第一通孔130内设置第一透明填充物14，以防止透明基板11和封装膜层12产生形变。
另外，在一些具体实施方式中，如图32所示，也可以在第一通孔130的内壁上设置遮光材料171(如黑胶)，以有效防止亮线的产生，同时，还能够有效防止第一通孔130中的第一透明填充物14外溢。
另外，在一些具体实施方式中，为了使得显示屏10具有良好的结构强度，防止在遭受外力时受到损坏，显示屏10中还可以包括透明盖板18。
如图33所示，透明盖板18可以通过OCA光学胶(Optically Clear Adhesive)等材料贴附在偏光片16的远离封装膜层12的一侧面。在具体实施时，透明盖板18可以为玻璃板或者由聚酰亚胺等材料制成的板状结构。
另外，在一些具体实施方式中，由于偏光片16中开设有第三通孔161，为了防止封装膜层12产生形变；请结合参阅图34，在一些具体实施方式中，第三通孔161内还可以设置与第一透明填充物14相类似的第二透明填充物19。具体来说，第二透明填充物19可以是气态物质或固态物质。例如，当第二透明填充物19为气态物质时，可以为氮气、氦气、氖气等惰性气体；在实际应用时，可以通过调节第三通孔161内气体的量来有效控制第三通孔161内的气压，以保证第三通孔161的内、外气压差较小，从而有效防止封装膜层12产生弯曲形变，以有效杜绝彩虹纹等不良现象的产生；当第二透明填充物19为固态物质时，可以为氧化铟锡(Indium Tin Oxides，ITO)、OCA光学胶(Optically Clear Adhesive)等材料，以在透明盖板18和封装膜层12之间形成支撑和连接作用，防止透明盖板18和封装膜层12产生弯曲形变，从而有效杜绝彩虹纹等不良现象的产生；在实际应用中，第二透明填充物19可以完全布满第 三通孔161，也可以设置在第三通孔161内的部分区域。
此外，如图35所示，本申请实施例还提供了一种电子设备30，电子设备30具体可以为手机、平板电脑、显示器、电视等。以电子设备30为手机为例，手机中可以包括摄像头20和上述任意实施例中的显示屏10。
在具体实施时，摄像头20可以安装在显示屏10的下方，且正对于显示屏10中的透光孔100(显示层13中的第一通孔130)设置，以使外界光线能够透过透光孔100射入摄像头20中。
在其它实施方式中，手机中除了可以设置摄像头20外，还可以设置光感应器21和距离传感器22；为了实现较高的平占比，光感应器21和距离传感器22可以安装在显示屏10的下方，同时，为了保证光传感器21和距离传感器22的正常工作，显示屏10中可以增设两个分别与光传感器21和距离传感器22相对的透光孔100。
在具体实施时，透光孔100的数量和位置排布可以根据实际情况作相应调整，同时，每个透光孔100的大小可以相同也可以不同。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (16)

  1. 一种显示屏，其特征在于，包括透明基板、封装膜层以及位于所述透明基板和所述封装膜层之间的显示层；
    所述显示层具有贯穿至所述显示层两侧面的至少一个第一通孔；
    所述至少一个第一通孔内具有第一透明填充物。
  2. 根据权利要求1所述的显示屏，其特征在于，所述第一透明填充物用于支撑所述透明基板和所述封装膜层。
  3. 根据权利要求2所述的显示屏，其特征在于，所述第一透明填充物布满所述第一通孔。
  4. 根据权利要求1至3中任意一项所述的显示屏，其特征在于，所述透明基板正对于所述第一通孔的区域设有第一增透膜层。
  5. 根据权利要求1至4中任意一项所述的显示屏，其特征在于，所述封装膜层正对于所述第一通孔的区域设有第二增透膜层。
  6. 根据权利要求1至5中任意一项所述的显示屏，其特征在于，在所述第一通孔处，所述透明基板与所述封装膜层之间的距离不小于10μm。
  7. 根据权利要求6所述的显示屏，其特征在于，所述透明基板正对于所述第一通孔的侧面具有第一凹陷部。
  8. 根据权利要求6或7所述的显示屏，其特征在于，所述封装膜层正对于所述第一通孔的侧面具有第二凹陷部。
  9. 根据权利要求6所述的显示屏，其特征在于，所述显示屏还包括增厚膜层；
    所述增厚膜层设置在所述显示层与所述封装膜层之间。
  10. 根据权利要求9所述的显示屏，其特征在于，所述增厚膜层具有第二通孔，所述第二通孔在所述显示层上的投影完全覆盖所述第一通孔。
  11. 根据权利要求1至10中任意一项所述的显示屏，其特征在于，所述显示屏还包括偏光膜层；
    所述偏光膜层设置在所述封装膜层的远离所述显示层的侧面，所述偏光膜层具有正对于所述第一通孔的第三通孔；
    其中，所述第三通孔在所述显示层上的投影完全覆盖所述第一通孔。
  12. 根据权利要求11所述的显示屏，其特征在于，所述显示屏还包括遮挡层；
    所述遮挡层设置在所述显示层与所述封装膜层之间，且覆盖所述第三通孔在所述显示层上的投影区域。
  13. 根据权利要求11或12所述的显示屏，其特征在于，所述显示屏还包括透明盖板；
    所述透明盖板贴附在所述封装膜层的远离所述显示层的侧面。
  14. 根据权利要求13所述的显示屏，其特征在于，所述显示屏还包括第二透明填充物；
    所述第二透明填充物位于所述第三通孔内，用于支撑所述透明盖板和所述封装膜层。
  15. 一种电子设备，其特征在于，包括光学器件和如权利要求1至14中任意一项所述的显示屏；
    所述光学器件正对于所述第一通孔设置。
  16. 根据权利要求15所述的电子设备，其特征在于，所述光学器件包括光感应器、距离传感器或摄像头。
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CN113991037B (zh) * 2021-10-25 2023-11-14 昆山国显光电有限公司 显示面板及其制作方法、显示装置
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