WO2020241474A1 - 電子制御装置 - Google Patents

電子制御装置 Download PDF

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Publication number
WO2020241474A1
WO2020241474A1 PCT/JP2020/020238 JP2020020238W WO2020241474A1 WO 2020241474 A1 WO2020241474 A1 WO 2020241474A1 JP 2020020238 W JP2020020238 W JP 2020020238W WO 2020241474 A1 WO2020241474 A1 WO 2020241474A1
Authority
WO
WIPO (PCT)
Prior art keywords
control device
electronic control
fixture
cover
facing
Prior art date
Application number
PCT/JP2020/020238
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
河合　義夫
諒 秋葉
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to JP2021522305A priority Critical patent/JP7210722B2/ja
Priority to CN202080036380.8A priority patent/CN113841469B/zh
Publication of WO2020241474A1 publication Critical patent/WO2020241474A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electronic control device.
  • in-vehicle electronic control devices have been integrated into mechanical and electrical devices against the background of an increase in the number of electronic control devices mounted on vehicles and a reduction in the length of connection cables between control devices and sensors and actuators.
  • the actuator for engine control and the electronic control device are integrated, and the transmission and the electronic control device are integrated.
  • the surface temperature of the engine, the transmission, etc. is about 130 ° C. to 140 ° C.
  • the heat resistant temperature of the electronic parts used in the electronic control device is about 150 ° C.
  • the heat of the engine, transmission, etc. is transferred to the electronic components on the substrate held by the base via the base (housing) of the electronic control device.
  • the temperature of electronic components may exceed the heat resistant temperature.
  • An object of the present invention is to provide an electronic control device capable of suppressing a failure of an electronic component due to static electricity.
  • the present invention comprises a substrate, electronic components mounted on the substrate, an insulating base for holding the substrate, and a conductive fixture for fixing the substrate to the base.
  • an electronic control device including a conductive cover that covers the base, the distance D1 between the fixture and the cover is equal to or less than the distance D2 between the electronic component 1 and the cover.
  • FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss of an electronic control device according to a third embodiment. It is a figure for demonstrating the magnitude relation of area.
  • FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss facing a fixture of an electronic control device according to a modified example of the third embodiment.
  • FIG. 7A It is a top view of the substrate shown in FIG. 7A. It is a schematic diagram which shows the example which connects the fixture to the ground. It is a schematic diagram which shows the modification which connects the fixture to the ground.
  • FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss of an electronic control device according to a modified example of the first embodiment. It is a figure for demonstrating the static electricity stored in the part of a cover facing a fixture.
  • the electronic control device controls actuators such as an engine and a transmission, for example.
  • actuators such as an engine and a transmission, for example.
  • the same reference numerals indicate the same parts.
  • FIG. 1 is a cross-sectional view showing the overall configuration of the electronic control device 100 according to the first embodiment of the present invention.
  • the electronic control device 100 mainly includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating base 20 for holding the substrate 10, and a conductive fixture 2 for fixing the substrate 10 to the base 20.
  • a conductive cover 30 for covering the base 20 is provided.
  • the insulating base 20 is made of, for example, an insulating resin, and is directly attached to an engine, a transmission, or the like. By making the base 20 made of resin, it becomes difficult for heat from the engine, transmission, etc. to be transferred to the electronic component 1.
  • the thermal conductivity of the base 20 is smaller than the thermal conductivity of the cover 30, and is also smaller than the thermal conductivity of the housing of the engine, transmission, and the like.
  • the conductive fixture 2 (screws, rivets, caulking, etc.) is made of, for example, a conductive metal or resin.
  • the conductive cover 30 is made of, for example, a conductive metal (aluminum, steel, steel plate, etc.) or a conductive resin, and is molded by casting, pressing, injection molding, or the like.
  • the electronic component 1 is mounted on the substrate 10.
  • the electronic component 1 is composed of, for example, a semiconductor element.
  • Specific examples of the electronic component 1 include a processor that calculates the control amount of the actuator from the output values of various sensors (temperature sensor, pressure sensor, etc.), a driver circuit that supplies a drive current to the actuator by switching, and the like.
  • the driver circuit may be mounted on the actuator.
  • the electronic component 1 is electrically connected to an actuator such as an engine or a transmission via a wiring pattern of a substrate 10, a pin of a connector 40, or the like.
  • the electronic component 1 has a conductive exposed pad 5 facing the cover 30.
  • the exposed pad 5 is, for example, a conductive metal plate, and is also called a heat spreader or a heat sink.
  • the exposed pad 5 transfers the heat generated by the electronic component 1 to the conductive cover 30 via the heat conductive material 3. Then, the heat transferred to the cover 30 is dissipated into the atmosphere.
  • the heat conductive material 3 contains ceramics and the like.
  • the cover 30 is formed with a boss 31 facing the electronic component 1 and a boss 32 facing the conductive fixture 2.
  • a heat conductive material 3 is arranged between the boss 31 and the electronic component 1.
  • the sealing material 4 seals between the cover 30 and the base 20 and waterproofs the inside of the housing composed of the cover 30 and the base 20.
  • the sealing material 4 is, for example, a silicone adhesive.
  • the plurality of sets of bosses 32 and fixtures 2 are arranged at the corners of the substrate 10.
  • FIG. 2 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 shown in FIG.
  • the distance D1 between the fixture 2 and the cover 30 is equal to or less than the distance D2 between the electronic component 1 and the cover 30 (boss 31).
  • the static electricity applied to the conductive cover 30 is more likely to be discharged to the fixture 2 than to the electronic component 1. Therefore, it is possible to prevent the electronic component 1 from failing due to static electricity. In addition, it is possible to prevent the electronic component 1 from malfunctioning due to static electricity.
  • a gap is provided between the boss 32, which is a part of the cover 30 facing the fixture 2, and the fixture 2. As a result, the boss 32 does not come into contact with the fixture 2, so that the boss 32 does not deform the substrate 10. As a result, it is possible to prevent cracks from occurring in the solder (joining member) that joins the terminal of the electronic component 1 and the wiring pattern.
  • the present embodiment it is possible to prevent the electronic component 1 from failing due to static electricity. In addition, it is possible to prevent the electronic component 1 from malfunctioning due to static electricity. Further, it is possible to suppress the occurrence of cracks in the solder that joins the terminal of the electronic component 1 and the wiring pattern.
  • FIG. 3 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the second embodiment of the present invention.
  • the boss 32 which is a portion of the cover 30 facing the fixture 2, has a recess 32a that covers the head of the fixture 2.
  • the area of the portion of the cover 30 facing the fixture 2 can be increased.
  • the capacitance between the boss 32 and the fixture 2 becomes large, so that the static electricity applied to the conductive cover 30 is more easily discharged to the fixture 2 than the electronic component 1.
  • the recess 32a of the boss 32 is composed of a surface that imitates the head of the fixture 2.
  • the concave portion 32a is formed on a surface corresponding to the shape of each head.
  • the portion of the cover 30 facing the fixture 2 can be brought closer to the surface of the head of the fixture 2 as a whole.
  • the capacitance between the boss 32 and the fixture 2 can be further increased.
  • the head of the fixture 2 is dome-shaped, and the recess 32a is also dome-shaped accordingly.
  • the capacitance of the portion of the cover 30 (dome-shaped recess 32a) facing the fixture 2 can be increased.
  • the electronic component 1 has a conductive exposed pad 5 facing the cover 30.
  • the area S2 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 is equal to or larger than the area S1 of the exposed pad 5.
  • the area S2 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 is such that the electronic component 1 is the heat conductive material 3.
  • the area of the contacted or joined portion may be S3 or more.
  • FIG. 5 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the third embodiment of the present invention.
  • the present embodiment is different from the second embodiment in that the dielectric material 6 is arranged between the boss 32 and the fixture 2.
  • the heat conductive material 3 is arranged between the cover 30 and the electronic component 1.
  • the sealing material 4 seals between the cover 30 and the base 20.
  • the dielectric material 6 is arranged between the portion of the cover 30 (recessed portion 32a) facing the fixture 2 and the head of the fixture 2.
  • the relative permittivity ⁇ 3 of the dielectric material 6 is the same as or larger than the relative permittivity ⁇ 1 of the heat conductive material 3 or the relative permittivity ⁇ 2 of the sealing material 4. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
  • the electronic component 1 has a conductive exposed pad 5 facing the cover 30.
  • the area S2_1 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 and contacting or joining with the dielectric material 6 is equal to or larger than the area S1 of the exposed pad 5.
  • the capacitance between the boss 32 and the fixture 2 can be further increased.
  • FIG. 7A is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the modified example of the third embodiment.
  • FIG. 7B is a plan view of the substrate 10 shown in FIG. 7A.
  • the fixture 2 (2 1 to 2 5) is multiple (five). Then, L5 ⁇ L1 ⁇ L4 ⁇ L2 ⁇ L3 is established for the distance L (L1 to L5) between the electronic component 1 and the fixture 2 (2 1 to 25 ). That is, the portion of the cover 30 (boss 32) facing the fixture 2 faces the portion of the plurality of fixtures 2 closest to the electronic component 1 (fixer 25 ).
  • At least one set of bosses 32 and the fixture 2 are arranged near the electronic component 1 in the third embodiment, but at least one set of bosses 32 and the fixture 2 are arranged in the first to second embodiments.
  • the fixture 2 may be placed near the electronic component 1.
  • FIG. 8A is a schematic view showing an example of connecting the fixture 2 to the ground.
  • the substrate 10 has a wiring pattern 11.
  • the fixture 2 is connected to the ground via the wiring pattern 11.
  • the static electricity discharged from the boss 32 to the fixture 2 is discharged to the ground. That is, it is possible to secure a discharge path for static electricity to the circuit ground.
  • FIG. 8B is a schematic view showing a modified example of connecting the fixture 2 to the ground.
  • the substrate 10 has a wiring pattern 11 and a circuit element (resistor R) connected to the wiring pattern 11.
  • the fixture 2 is connected to the ground via the wiring pattern 11 and the circuit element (resistor R).
  • resistor R As a result, static electricity is converted into heat energy in the circuit element (resistor R), and fluctuations in the ground potential can be suppressed.
  • a switching element, a capacitor, or the like may be used as the circuit element instead of the resistor R.
  • FIG. 9 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the modified example of the first embodiment.
  • the area S2 of the part (boss 32) of the cover 30 facing the fixture 2 is equal to or larger than the area S0 of the part of the cover 30 facing the electronic component 1, or the electronic component 1 contacts or joins with the heat conductive material 3.
  • the area of the portion is S3 or more.
  • the static electricity 7a applied to the cover 30 is stored in the portion (boss 32) of the cover 30 facing the fixture 2, and is discharged to the fixture 2 due to dielectric breakdown.
  • the capacitance between the boss 32 and the fixture 2 is combined. As a result, more static electricity 7a can be stored in the portion of the cover 30 facing the fixture 2.
  • the present invention is not limited to the above-described embodiment, and includes various modifications.
  • the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations.
  • it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
PCT/JP2020/020238 2019-05-31 2020-05-22 電子制御装置 WO2020241474A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021522305A JP7210722B2 (ja) 2019-05-31 2020-05-22 電子制御装置
CN202080036380.8A CN113841469B (zh) 2019-05-31 2020-05-22 电子控制装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019102441 2019-05-31
JP2019-102441 2019-05-31

Publications (1)

Publication Number Publication Date
WO2020241474A1 true WO2020241474A1 (ja) 2020-12-03

Family

ID=73553444

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/020238 WO2020241474A1 (ja) 2019-05-31 2020-05-22 電子制御装置

Country Status (3)

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JP (1) JP7210722B2 (enrdf_load_html_response)
CN (1) CN113841469B (enrdf_load_html_response)
WO (1) WO2020241474A1 (enrdf_load_html_response)

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JPS63131198U (enrdf_load_html_response) * 1987-02-17 1988-08-26
JPH08316662A (ja) * 1995-05-24 1996-11-29 Fujitsu Ltd 電子装置
JP2002368436A (ja) * 2001-06-11 2002-12-20 Kenwood Corp 電子機器
JP2008090437A (ja) * 2006-09-29 2008-04-17 Toshiba Corp 電子機器
JP2014120677A (ja) * 2012-12-18 2014-06-30 Aisin Seiki Co Ltd 電子機器
JP2019133858A (ja) * 2018-01-31 2019-08-08 株式会社アドヴィックス 電子制御装置

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JP2001332832A (ja) * 2000-05-19 2001-11-30 Olympus Optical Co Ltd 医用電気機器
JP2006196664A (ja) * 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 基板へのシールドケース取付構造及び携帯電話
JP2007258615A (ja) * 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
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JP5287492B2 (ja) * 2009-05-18 2013-09-11 株式会社デンソー 電子装置
CN201854514U (zh) * 2010-11-01 2011-06-01 国营第三八八厂 一种具有电磁屏蔽和散热功能的高频地波雷达机箱
JP2012238821A (ja) * 2011-05-13 2012-12-06 Tdk Corp シールドケース固定構造及びそれを備える電子装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131198U (enrdf_load_html_response) * 1987-02-17 1988-08-26
JPH08316662A (ja) * 1995-05-24 1996-11-29 Fujitsu Ltd 電子装置
JP2002368436A (ja) * 2001-06-11 2002-12-20 Kenwood Corp 電子機器
JP2008090437A (ja) * 2006-09-29 2008-04-17 Toshiba Corp 電子機器
JP2014120677A (ja) * 2012-12-18 2014-06-30 Aisin Seiki Co Ltd 電子機器
JP2019133858A (ja) * 2018-01-31 2019-08-08 株式会社アドヴィックス 電子制御装置

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Publication number Publication date
CN113841469B (zh) 2024-01-02
JP7210722B2 (ja) 2023-01-23
JPWO2020241474A1 (enrdf_load_html_response) 2020-12-03
CN113841469A (zh) 2021-12-24

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