WO2020241474A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2020241474A1
WO2020241474A1 PCT/JP2020/020238 JP2020020238W WO2020241474A1 WO 2020241474 A1 WO2020241474 A1 WO 2020241474A1 JP 2020020238 W JP2020020238 W JP 2020020238W WO 2020241474 A1 WO2020241474 A1 WO 2020241474A1
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Prior art keywords
control device
electronic control
fixture
cover
facing
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PCT/JP2020/020238
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French (fr)
Japanese (ja)
Inventor
河合　義夫
諒 秋葉
Original Assignee
日立オートモティブシステムズ株式会社
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Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to CN202080036380.8A priority Critical patent/CN113841469B/en
Priority to JP2021522305A priority patent/JP7210722B2/en
Publication of WO2020241474A1 publication Critical patent/WO2020241474A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electronic control device.
  • in-vehicle electronic control devices have been integrated into mechanical and electrical devices against the background of an increase in the number of electronic control devices mounted on vehicles and a reduction in the length of connection cables between control devices and sensors and actuators.
  • the actuator for engine control and the electronic control device are integrated, and the transmission and the electronic control device are integrated.
  • the surface temperature of the engine, the transmission, etc. is about 130 ° C. to 140 ° C.
  • the heat resistant temperature of the electronic parts used in the electronic control device is about 150 ° C.
  • the heat of the engine, transmission, etc. is transferred to the electronic components on the substrate held by the base via the base (housing) of the electronic control device.
  • the temperature of electronic components may exceed the heat resistant temperature.
  • An object of the present invention is to provide an electronic control device capable of suppressing a failure of an electronic component due to static electricity.
  • the present invention comprises a substrate, electronic components mounted on the substrate, an insulating base for holding the substrate, and a conductive fixture for fixing the substrate to the base.
  • an electronic control device including a conductive cover that covers the base, the distance D1 between the fixture and the cover is equal to or less than the distance D2 between the electronic component 1 and the cover.
  • FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss of an electronic control device according to a third embodiment. It is a figure for demonstrating the magnitude relation of area.
  • FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss facing a fixture of an electronic control device according to a modified example of the third embodiment.
  • FIG. 7A It is a top view of the substrate shown in FIG. 7A. It is a schematic diagram which shows the example which connects the fixture to the ground. It is a schematic diagram which shows the modification which connects the fixture to the ground.
  • FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss of an electronic control device according to a modified example of the first embodiment. It is a figure for demonstrating the static electricity stored in the part of a cover facing a fixture.
  • the electronic control device controls actuators such as an engine and a transmission, for example.
  • actuators such as an engine and a transmission, for example.
  • the same reference numerals indicate the same parts.
  • FIG. 1 is a cross-sectional view showing the overall configuration of the electronic control device 100 according to the first embodiment of the present invention.
  • the electronic control device 100 mainly includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating base 20 for holding the substrate 10, and a conductive fixture 2 for fixing the substrate 10 to the base 20.
  • a conductive cover 30 for covering the base 20 is provided.
  • the insulating base 20 is made of, for example, an insulating resin, and is directly attached to an engine, a transmission, or the like. By making the base 20 made of resin, it becomes difficult for heat from the engine, transmission, etc. to be transferred to the electronic component 1.
  • the thermal conductivity of the base 20 is smaller than the thermal conductivity of the cover 30, and is also smaller than the thermal conductivity of the housing of the engine, transmission, and the like.
  • the conductive fixture 2 (screws, rivets, caulking, etc.) is made of, for example, a conductive metal or resin.
  • the conductive cover 30 is made of, for example, a conductive metal (aluminum, steel, steel plate, etc.) or a conductive resin, and is molded by casting, pressing, injection molding, or the like.
  • the electronic component 1 is mounted on the substrate 10.
  • the electronic component 1 is composed of, for example, a semiconductor element.
  • Specific examples of the electronic component 1 include a processor that calculates the control amount of the actuator from the output values of various sensors (temperature sensor, pressure sensor, etc.), a driver circuit that supplies a drive current to the actuator by switching, and the like.
  • the driver circuit may be mounted on the actuator.
  • the electronic component 1 is electrically connected to an actuator such as an engine or a transmission via a wiring pattern of a substrate 10, a pin of a connector 40, or the like.
  • the electronic component 1 has a conductive exposed pad 5 facing the cover 30.
  • the exposed pad 5 is, for example, a conductive metal plate, and is also called a heat spreader or a heat sink.
  • the exposed pad 5 transfers the heat generated by the electronic component 1 to the conductive cover 30 via the heat conductive material 3. Then, the heat transferred to the cover 30 is dissipated into the atmosphere.
  • the heat conductive material 3 contains ceramics and the like.
  • the cover 30 is formed with a boss 31 facing the electronic component 1 and a boss 32 facing the conductive fixture 2.
  • a heat conductive material 3 is arranged between the boss 31 and the electronic component 1.
  • the sealing material 4 seals between the cover 30 and the base 20 and waterproofs the inside of the housing composed of the cover 30 and the base 20.
  • the sealing material 4 is, for example, a silicone adhesive.
  • the plurality of sets of bosses 32 and fixtures 2 are arranged at the corners of the substrate 10.
  • FIG. 2 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 shown in FIG.
  • the distance D1 between the fixture 2 and the cover 30 is equal to or less than the distance D2 between the electronic component 1 and the cover 30 (boss 31).
  • the static electricity applied to the conductive cover 30 is more likely to be discharged to the fixture 2 than to the electronic component 1. Therefore, it is possible to prevent the electronic component 1 from failing due to static electricity. In addition, it is possible to prevent the electronic component 1 from malfunctioning due to static electricity.
  • a gap is provided between the boss 32, which is a part of the cover 30 facing the fixture 2, and the fixture 2. As a result, the boss 32 does not come into contact with the fixture 2, so that the boss 32 does not deform the substrate 10. As a result, it is possible to prevent cracks from occurring in the solder (joining member) that joins the terminal of the electronic component 1 and the wiring pattern.
  • the present embodiment it is possible to prevent the electronic component 1 from failing due to static electricity. In addition, it is possible to prevent the electronic component 1 from malfunctioning due to static electricity. Further, it is possible to suppress the occurrence of cracks in the solder that joins the terminal of the electronic component 1 and the wiring pattern.
  • FIG. 3 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the second embodiment of the present invention.
  • the boss 32 which is a portion of the cover 30 facing the fixture 2, has a recess 32a that covers the head of the fixture 2.
  • the area of the portion of the cover 30 facing the fixture 2 can be increased.
  • the capacitance between the boss 32 and the fixture 2 becomes large, so that the static electricity applied to the conductive cover 30 is more easily discharged to the fixture 2 than the electronic component 1.
  • the recess 32a of the boss 32 is composed of a surface that imitates the head of the fixture 2.
  • the concave portion 32a is formed on a surface corresponding to the shape of each head.
  • the portion of the cover 30 facing the fixture 2 can be brought closer to the surface of the head of the fixture 2 as a whole.
  • the capacitance between the boss 32 and the fixture 2 can be further increased.
  • the head of the fixture 2 is dome-shaped, and the recess 32a is also dome-shaped accordingly.
  • the capacitance of the portion of the cover 30 (dome-shaped recess 32a) facing the fixture 2 can be increased.
  • the electronic component 1 has a conductive exposed pad 5 facing the cover 30.
  • the area S2 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 is equal to or larger than the area S1 of the exposed pad 5.
  • the area S2 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 is such that the electronic component 1 is the heat conductive material 3.
  • the area of the contacted or joined portion may be S3 or more.
  • FIG. 5 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the third embodiment of the present invention.
  • the present embodiment is different from the second embodiment in that the dielectric material 6 is arranged between the boss 32 and the fixture 2.
  • the heat conductive material 3 is arranged between the cover 30 and the electronic component 1.
  • the sealing material 4 seals between the cover 30 and the base 20.
  • the dielectric material 6 is arranged between the portion of the cover 30 (recessed portion 32a) facing the fixture 2 and the head of the fixture 2.
  • the relative permittivity ⁇ 3 of the dielectric material 6 is the same as or larger than the relative permittivity ⁇ 1 of the heat conductive material 3 or the relative permittivity ⁇ 2 of the sealing material 4. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
  • the electronic component 1 has a conductive exposed pad 5 facing the cover 30.
  • the area S2_1 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 and contacting or joining with the dielectric material 6 is equal to or larger than the area S1 of the exposed pad 5.
  • the capacitance between the boss 32 and the fixture 2 can be further increased.
  • FIG. 7A is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the modified example of the third embodiment.
  • FIG. 7B is a plan view of the substrate 10 shown in FIG. 7A.
  • the fixture 2 (2 1 to 2 5) is multiple (five). Then, L5 ⁇ L1 ⁇ L4 ⁇ L2 ⁇ L3 is established for the distance L (L1 to L5) between the electronic component 1 and the fixture 2 (2 1 to 25 ). That is, the portion of the cover 30 (boss 32) facing the fixture 2 faces the portion of the plurality of fixtures 2 closest to the electronic component 1 (fixer 25 ).
  • At least one set of bosses 32 and the fixture 2 are arranged near the electronic component 1 in the third embodiment, but at least one set of bosses 32 and the fixture 2 are arranged in the first to second embodiments.
  • the fixture 2 may be placed near the electronic component 1.
  • FIG. 8A is a schematic view showing an example of connecting the fixture 2 to the ground.
  • the substrate 10 has a wiring pattern 11.
  • the fixture 2 is connected to the ground via the wiring pattern 11.
  • the static electricity discharged from the boss 32 to the fixture 2 is discharged to the ground. That is, it is possible to secure a discharge path for static electricity to the circuit ground.
  • FIG. 8B is a schematic view showing a modified example of connecting the fixture 2 to the ground.
  • the substrate 10 has a wiring pattern 11 and a circuit element (resistor R) connected to the wiring pattern 11.
  • the fixture 2 is connected to the ground via the wiring pattern 11 and the circuit element (resistor R).
  • resistor R As a result, static electricity is converted into heat energy in the circuit element (resistor R), and fluctuations in the ground potential can be suppressed.
  • a switching element, a capacitor, or the like may be used as the circuit element instead of the resistor R.
  • FIG. 9 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the modified example of the first embodiment.
  • the area S2 of the part (boss 32) of the cover 30 facing the fixture 2 is equal to or larger than the area S0 of the part of the cover 30 facing the electronic component 1, or the electronic component 1 contacts or joins with the heat conductive material 3.
  • the area of the portion is S3 or more.
  • the static electricity 7a applied to the cover 30 is stored in the portion (boss 32) of the cover 30 facing the fixture 2, and is discharged to the fixture 2 due to dielectric breakdown.
  • the capacitance between the boss 32 and the fixture 2 is combined. As a result, more static electricity 7a can be stored in the portion of the cover 30 facing the fixture 2.
  • the present invention is not limited to the above-described embodiment, and includes various modifications.
  • the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations.
  • it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

Abstract

The present invention provides an electronic control device in which it is possible to suppress the failure of electronic components due to static electricity. An electronic control device 100 is equipped with: a substrate 10; an electronic component 1 that is mounted on the substrate 10; an insulating base 20 that holds the substrate 10; a conductive fixing implement 2 that fixes the substrate 10 to the base 20; and a conductive cover 30 that covers the base 20. A distance D1 between the fixing implement 2 and the cover 30 (boss 32) is equal to or less than a distance D2 between the electronic component 1 and the cover 30 (boss 31).

Description

電子制御装置Electronic control device
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　近年、車載用電子制御装置は、車両に搭載する電子制御装置数の増大及び、制御装置とセンサ間、アクチュエータ間の接続ケーブル長さの短縮などを背景とした機電一体化が進んでいる。具体的には、エンジン制御用アクチュエータと電子制御装置の一体、変速機と電子制御装置の一体などである。 In recent years, in-vehicle electronic control devices have been integrated into mechanical and electrical devices against the background of an increase in the number of electronic control devices mounted on vehicles and a reduction in the length of connection cables between control devices and sensors and actuators. Specifically, the actuator for engine control and the electronic control device are integrated, and the transmission and the electronic control device are integrated.
　ここで、エンジン及び変速機等の表面温度は１３０℃～１４０℃程度であるが、これに対し、電子制御装置に用いられる電子部品の耐熱温度は、約１５０℃である。 Here, the surface temperature of the engine, the transmission, etc. is about 130 ° C. to 140 ° C., whereas the heat resistant temperature of the electronic parts used in the electronic control device is about 150 ° C.
　このような過酷な環境で電子制御装置を作動させると、エンジン、変速機などの熱が、電子制御装置のベース（筐体）を介して、ベースによって保持される基板上の電子部品に伝わり、電子部品の温度が耐熱温度を超えるおそれがある。 When the electronic control device is operated in such a harsh environment, the heat of the engine, transmission, etc. is transferred to the electronic components on the substrate held by the base via the base (housing) of the electronic control device. The temperature of electronic components may exceed the heat resistant temperature.
特開2014-075496号公報Japanese Unexamined Patent Publication No. 2014-075496
　特許文献１に開示されるような電子制御装置では、基板を保持するベースは金属製（合金製）であるため、エンジン、変速機などの熱がベース（筐体）を介して電子部品に伝わり易い。そこで、エンジン、変速機などの熱による電子部品の温度上昇を抑制するため、電子制御装置のベースを樹脂製とすることが考えられる。 In an electronic control device as disclosed in Patent Document 1, since the base that holds the substrate is made of metal (alloy), heat from the engine, transmission, etc. is transferred to the electronic components via the base (housing). easy. Therefore, in order to suppress the temperature rise of electronic parts due to heat of the engine, transmission, etc., it is conceivable that the base of the electronic control device is made of resin.
　しかし、ユーザの手などから金属製のカバーに付与された静電気が、樹脂製のベースに放電されないという新たな課題が生じる。また、静電気が電子部品に放電され、電子部品が故障することが懸念される。 However, there is a new problem that the static electricity applied to the metal cover from the user's hand is not discharged to the resin base. In addition, there is a concern that static electricity will be discharged to the electronic components and the electronic components will break down.
　本発明の目的は、静電気により電子部品が故障することを抑制することができる電子制御装置を提供することにある。 An object of the present invention is to provide an electronic control device capable of suppressing a failure of an electronic component due to static electricity.
　上記目的を達成するために、本発明は、基板と、前記基板に実装される電子部品と、前記基板を保持する絶縁性のベースと、前記基板を前記ベースに固定する導電性の固定具と、前記ベースを覆う導電性のカバーと、を備える電子制御装置において、前記固定具と前記カバーとの間の距離Ｄ１は、前記電子部品１と前記カバーとの間の距離Ｄ２以下である。 In order to achieve the above object, the present invention comprises a substrate, electronic components mounted on the substrate, an insulating base for holding the substrate, and a conductive fixture for fixing the substrate to the base. In an electronic control device including a conductive cover that covers the base, the distance D1 between the fixture and the cover is equal to or less than the distance D2 between the electronic component 1 and the cover.
　本発明によれば、静電気により電子部品が故障することを抑制することができる。上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。 According to the present invention, it is possible to suppress the failure of electronic components due to static electricity. Issues, configurations and effects other than those described above will be clarified by the description of the following embodiments.
第１の実施形態による電子制御装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the electronic control apparatus by 1st Embodiment. 図１に示す電子制御装置のボスの周辺の構成を示す拡大断面図である。It is an enlarged cross-sectional view which shows the structure around the boss of the electronic control apparatus shown in FIG. 第２の実施形態による電子制御装置のボスの周辺の構成を示す拡大断面図である。It is an enlarged cross-sectional view which shows the structure around the boss of the electronic control apparatus by 2nd Embodiment. 電子部品がエクスポーズドパッドを有しない場合の面積の大小関係を説明するための図である。It is a figure for demonstrating the magnitude relation of the area when an electronic component does not have an exposed pad. 第３の実施形態による電子制御装置のボスの周辺の構成を示す拡大断面図である。FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss of an electronic control device according to a third embodiment. 面積の大小関係を説明するための図である。It is a figure for demonstrating the magnitude relation of area. 第３の実施形態の変形例による電子制御装置の固定具と向き合うボスの周辺の構成を示す拡大断面図である。FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss facing a fixture of an electronic control device according to a modified example of the third embodiment. 図７Ａに示す基板の平面図である。It is a top view of the substrate shown in FIG. 7A. 固定具をグランドへ接続する例を示す模式図である。It is a schematic diagram which shows the example which connects the fixture to the ground. 固定具をグランドへ接続する変形例を示す模式図である。It is a schematic diagram which shows the modification which connects the fixture to the ground. 第１の実施形態の変形例による電子制御装置のボスの周辺の構成を示す拡大断面図である。FIG. 5 is an enlarged cross-sectional view showing a configuration around a boss of an electronic control device according to a modified example of the first embodiment. 固定具と向き合うカバーの部分に蓄えられる静電気を説明するための図である。It is a figure for demonstrating the static electricity stored in the part of a cover facing a fixture.
　以下、図面を用いて、本発明の第１～第３の実施形態による電子制御装置の構成を説明する。電子制御装置は、例えば、エンジン、変速機などのアクチュエータを制御する。なお、各図において、同一符号は同一部分を示す。 Hereinafter, the configuration of the electronic control device according to the first to third embodiments of the present invention will be described with reference to the drawings. The electronic control device controls actuators such as an engine and a transmission, for example. In each figure, the same reference numerals indicate the same parts.
　（第１の実施形態）
　はじめに、図１を用いて、第１の実施形態による電子制御装置１００の構成を説明する。図１は、本発明の第１の実施形態による電子制御装置１００の全体構成を示す断面図である。 (First Embodiment)
First, the configuration of the electronic control device 100 according to the first embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view showing the overall configuration of the electronic control device 100 according to the first embodiment of the present invention.
　電子制御装置１００は、主として、基板１０と、基板１０に実装される電子部品１と、基板１０を保持する絶縁性のベース２０と、基板１０をベース２０に固定する導電性の固定具２と、ベース２０を覆う導電性のカバー３０を備える。 The electronic control device 100 mainly includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating base 20 for holding the substrate 10, and a conductive fixture 2 for fixing the substrate 10 to the base 20. A conductive cover 30 for covering the base 20 is provided.
　絶縁性のベース２０は、例えば、絶縁性の樹脂でできており、エンジン、変速機などに直付けされる。ベース２０を樹脂製とすることで、エンジン、変速機などからの熱が電子部品１へ伝わりにくくなる。ベース２０の熱伝導率は、カバー３０の熱伝導率よりも小さく、またエンジン、変速機などのハウジングの熱伝導率よりも小さい。 The insulating base 20 is made of, for example, an insulating resin, and is directly attached to an engine, a transmission, or the like. By making the base 20 made of resin, it becomes difficult for heat from the engine, transmission, etc. to be transferred to the electronic component 1. The thermal conductivity of the base 20 is smaller than the thermal conductivity of the cover 30, and is also smaller than the thermal conductivity of the housing of the engine, transmission, and the like.
　導電性の固定具２（ネジ、リベット、カシメ等）は、例えば、導電性の金属又は樹脂でできている。導電性のカバー３０は、例えば、導電性の金属（アルミ、スチール、鋼板等）又は導電性の樹脂でできており、鋳造、プレス、射出成形等により成形される。 The conductive fixture 2 (screws, rivets, caulking, etc.) is made of, for example, a conductive metal or resin. The conductive cover 30 is made of, for example, a conductive metal (aluminum, steel, steel plate, etc.) or a conductive resin, and is molded by casting, pressing, injection molding, or the like.
　基板１０には、電子部品１が実装される。電子部品１は、例えば、半導体素子から構成される。電子部品１の具体例として、各種センサ（温度センサ、圧力センサ等）の出力値からアクチュエータの制御量を演算するプロセッサ、スイッチングによりアクチュエータに駆動電流を供給するドライバ回路等が挙げられる。 The electronic component 1 is mounted on the substrate 10. The electronic component 1 is composed of, for example, a semiconductor element. Specific examples of the electronic component 1 include a processor that calculates the control amount of the actuator from the output values of various sensors (temperature sensor, pressure sensor, etc.), a driver circuit that supplies a drive current to the actuator by switching, and the like.
　なお、ドライバ回路は、アクチュエータに搭載されてもよい。電子部品１は、基板１０の配線パターン、コネクタ４０のピン等を介して、エンジン、変速機などのアクチュエータと電気的に接続される。 The driver circuit may be mounted on the actuator. The electronic component 1 is electrically connected to an actuator such as an engine or a transmission via a wiring pattern of a substrate 10, a pin of a connector 40, or the like.
　本実施形態では、電子部品１は、カバー３０と向き合う導電性のエクスポーズドパッド５を有する。エクスポーズドパッド５は、例えば、導電性の金属板であり、ヒートスプレッダ又はヒートシンクとも呼ばれる。エクスポーズドパッド５は、電子部品１が発生する熱を、熱伝導材料３を介して導電性のカバー３０に伝える。そして、カバー３０に伝えられた熱は、大気中へ放熱される。なお、本実施形態では、熱伝導材料３にセラミックスなどが含まれている。 In the present embodiment, the electronic component 1 has a conductive exposed pad 5 facing the cover 30. The exposed pad 5 is, for example, a conductive metal plate, and is also called a heat spreader or a heat sink. The exposed pad 5 transfers the heat generated by the electronic component 1 to the conductive cover 30 via the heat conductive material 3. Then, the heat transferred to the cover 30 is dissipated into the atmosphere. In this embodiment, the heat conductive material 3 contains ceramics and the like.
　カバー３０には、電子部品１と向き合うボス３１と、導電性の固定具２に向き合うボス３２が形成される。ボス３１と電子部品１との間には熱伝導材料３が配置される。 The cover 30 is formed with a boss 31 facing the electronic component 1 and a boss 32 facing the conductive fixture 2. A heat conductive material 3 is arranged between the boss 31 and the electronic component 1.
　シール材料４は、カバー３０とベース２０との間を封止し、カバー３０とベース２０から構成される筐体の内部を防水する。シール材料４は、例えば、シリコン接着剤である。
本実施形態では、複数組のボス３２と固定具２は、基板１０の角などに配置される。 The sealing material 4 seals between the cover 30 and the base 20 and waterproofs the inside of the housing composed of the cover 30 and the base 20. The sealing material 4 is, for example, a silicone adhesive.
In the present embodiment, the plurality of sets of bosses 32 and fixtures 2 are arranged at the corners of the substrate 10.
　次に、図２を用いて、本実施形態による電子制御装置１００の特徴を説明する。図２は、図１に示す電子制御装置１００のボス３２の周辺の構成を示す拡大断面図である。 Next, the features of the electronic control device 100 according to the present embodiment will be described with reference to FIG. FIG. 2 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 shown in FIG.
　本実施形態では、固定具２とカバー３０（ボス３２）との間の距離Ｄ１は、電子部品１とカバー３０（ボス３１）との間の距離Ｄ２以下である。これにより、導電性のカバー３０に付与された静電気は、電子部品１よりも固定具２に放電され易くなる。そのため、静電気により電子部品１が故障することを抑制することができる。また、静電気により電子部品１が誤動作することを抑制することができる。 In the present embodiment, the distance D1 between the fixture 2 and the cover 30 (boss 32) is equal to or less than the distance D2 between the electronic component 1 and the cover 30 (boss 31). As a result, the static electricity applied to the conductive cover 30 is more likely to be discharged to the fixture 2 than to the electronic component 1. Therefore, it is possible to prevent the electronic component 1 from failing due to static electricity. In addition, it is possible to prevent the electronic component 1 from malfunctioning due to static electricity.
　また、固定具２と向き合うカバー３０の部分であるボス３２と固定具２との間には空隙が設けられる。これにより、ボス３２が固定具２に接触しないため、ボス３２によって基板１０が変形しない。その結果、電子部品１の端子と配線パターンとを接合する半田（接合部材）にクラックが発生することを抑制することができる。 Further, a gap is provided between the boss 32, which is a part of the cover 30 facing the fixture 2, and the fixture 2. As a result, the boss 32 does not come into contact with the fixture 2, so that the boss 32 does not deform the substrate 10. As a result, it is possible to prevent cracks from occurring in the solder (joining member) that joins the terminal of the electronic component 1 and the wiring pattern.
　以上説明したように、本実施形態によれば、静電気により電子部品１が故障することを抑制することができる。また、静電気により電子部品１が誤動作することを抑制することができる。さらに、電子部品１の端子と配線パターンとを接合する半田にクラックが発生することを抑制することができる。 As described above, according to the present embodiment, it is possible to prevent the electronic component 1 from failing due to static electricity. In addition, it is possible to prevent the electronic component 1 from malfunctioning due to static electricity. Further, it is possible to suppress the occurrence of cracks in the solder that joins the terminal of the electronic component 1 and the wiring pattern.
　（第２の実施形態）
　次に、図３を用いて、第２の実施形態による電子制御装置１００の構成を説明する。図３は、本発明の第２の実施形態による電子制御装置１００のボス３２の周辺の構成を示す拡大断面図である。 (Second Embodiment)
Next, the configuration of the electronic control device 100 according to the second embodiment will be described with reference to FIG. FIG. 3 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the second embodiment of the present invention.
　本実施形態では、固定具２と向き合うカバー３０の部分であるボス３２は、固定具２の頭部を覆う凹部３２aを有する。これにより、固定具２と向き合うカバー３０の部分の面積を大きくすることができる。その結果、ボス３２と固定具２の間の静電容量が大きくなり、これにより、導電性のカバー３０に付与された静電気は、電子部品１よりも固定具２にさらに放電され易くなる。 In the present embodiment, the boss 32, which is a portion of the cover 30 facing the fixture 2, has a recess 32a that covers the head of the fixture 2. As a result, the area of the portion of the cover 30 facing the fixture 2 can be increased. As a result, the capacitance between the boss 32 and the fixture 2 becomes large, so that the static electricity applied to the conductive cover 30 is more easily discharged to the fixture 2 than the electronic component 1.
　詳細には、ボス３２の凹部３２aは、固定具２の頭部に倣った面から構成される。例えば、固定具２の頭部が円柱状、六角柱状、ドーム状の場合に、それぞれの頭部の形状に見合った面で凹部３２aが構成される。これにより、固定具２と向き合うカバー３０の部分を全体的に固定具２の頭部の表面に近づけることができる。その結果、ボス３２と固定具２の間の静電容量をさらに大きくすることができる。 Specifically, the recess 32a of the boss 32 is composed of a surface that imitates the head of the fixture 2. For example, when the head of the fixture 2 has a columnar shape, a hexagonal columnar shape, or a dome shape, the concave portion 32a is formed on a surface corresponding to the shape of each head. As a result, the portion of the cover 30 facing the fixture 2 can be brought closer to the surface of the head of the fixture 2 as a whole. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
　本実施形態では、固定具２の頭部はドーム状であり、これに合わせて凹部３２aもドーム状である。これにより、固定具２と向き合うカバー３０の部分（ドーム状の凹部３２a）の静電容量を大きくできる。 In the present embodiment, the head of the fixture 2 is dome-shaped, and the recess 32a is also dome-shaped accordingly. As a result, the capacitance of the portion of the cover 30 (dome-shaped recess 32a) facing the fixture 2 can be increased.
　また、本実施形態では、電子部品１は、カバー３０と向き合う導電性のエクスポーズドパッド５を有する。固定具２と向き合うカバー３０の部分（凹部３２a）の面積Ｓ２は、エクスポーズドパッド５の面積Ｓ１以上である。これにより、ボス３２と固定具２の間の静電容量をさらに大きくすることができる。 Further, in the present embodiment, the electronic component 1 has a conductive exposed pad 5 facing the cover 30. The area S2 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 is equal to or larger than the area S1 of the exposed pad 5. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
　なお、電子部品１がエクスポーズドパッド５を有しない場合、図４に示すように、固定具２と向き合うカバー３０の部分（凹部３２a）の面積Ｓ２は、電子部品１が熱伝導材料３と接触または接合している部分の面積Ｓ３以上としてもよい。これにより、ボス３２と固定具２の間の静電容量をさらに大きくすることができる。 When the electronic component 1 does not have the exposed pad 5, as shown in FIG. 4, the area S2 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 is such that the electronic component 1 is the heat conductive material 3. The area of the contacted or joined portion may be S3 or more. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
　（第３の実施形態）
　次に、図５を用いて、第３の実施形態による電子制御装置１００の構成を説明する。図５は、本発明の第３の実施形態による電子制御装置１００のボス３２の周辺の構成を示す拡大断面図である。 (Third Embodiment)
Next, the configuration of the electronic control device 100 according to the third embodiment will be described with reference to FIG. FIG. 5 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the third embodiment of the present invention.
　本実施形態では、ボス３２と固定具２との間に誘電材料６が配置される点が第２の実施形態と異なる。 The present embodiment is different from the second embodiment in that the dielectric material 6 is arranged between the boss 32 and the fixture 2.
　前述したように、カバー３０と電子部品１との間には熱伝導材料３が配置される。シール材料４は、カバー３０とベース２０との間を封止する。ここで、誘電材料６は、固定具２と向き合うカバー３０の部分（凹部３２a）と固定具２の頭部との間に配置される。誘電材料６の比誘電率ε３は、熱伝導材料３の比誘電率ε１又はシール材料４の比誘電率ε２と同じもしくは大きい。これにより、ボス３２と固定具２の間の静電容量をさらに大きくすることができる。 As described above, the heat conductive material 3 is arranged between the cover 30 and the electronic component 1. The sealing material 4 seals between the cover 30 and the base 20. Here, the dielectric material 6 is arranged between the portion of the cover 30 (recessed portion 32a) facing the fixture 2 and the head of the fixture 2. The relative permittivity ε3 of the dielectric material 6 is the same as or larger than the relative permittivity ε1 of the heat conductive material 3 or the relative permittivity ε2 of the sealing material 4. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
　本実施形態では、電子部品１は、カバー３０と向き合う導電性のエクスポーズドパッド５を有する。図６に示すように、固定具２と向き合い且つ誘電材料６と接触又は接合するカバー３０の部分（凹部３２a）の面積Ｓ２＿１は、エクスポーズドパッド５の面積Ｓ１以上である。これにより、ボス３２と固定具２の間の静電容量をさらに大きくすることができる。 In the present embodiment, the electronic component 1 has a conductive exposed pad 5 facing the cover 30. As shown in FIG. 6, the area S2_1 of the portion (recessed portion 32a) of the cover 30 facing the fixture 2 and contacting or joining with the dielectric material 6 is equal to or larger than the area S1 of the exposed pad 5. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
　（変形例）
　次に、図７Ａ、７Ｂを用いて、電子制御装置１００の変形例を説明する。図７Ａは、第３の実施形態の変形例による電子制御装置１００のボス３２の周辺の構成を示す拡大断面図である。図７Ｂは、図７Ａに示す基板１０の平面図である。 (Modification example)
Next, a modification of the electronic control device 100 will be described with reference to FIGS. 7A and 7B. FIG. 7A is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the modified example of the third embodiment. FIG. 7B is a plan view of the substrate 10 shown in FIG. 7A.
　図７Ｂの例では、固定具２（２１～２５）は複数（５個）ある。そして、電子部品１と固定具２（２１～２５）との距離Ｌ（Ｌ１～Ｌ５）について、Ｌ５＜Ｌ１＜Ｌ４＜Ｌ２＜Ｌ３が成立する。すなわち、固定具２と向き合うカバー３０の部分（ボス３２）は、複数の固定具２のうち電子部品１に最も近いもの（固定具２５）と向き合う。 In the example of FIG. 7B, the fixture 2 (2 1 to 2 5) is multiple (five). Then, L5 <L1 <L4 <L2 <L3 is established for the distance L (L1 to L5) between the electronic component 1 and the fixture 2 (2 1 to 25 ). That is, the portion of the cover 30 (boss 32) facing the fixture 2 faces the portion of the plurality of fixtures 2 closest to the electronic component 1 (fixer 25 ).
　これにより、導電性のカバー３０に付与された静電気は、固定具２１～２４よりも固定具２５に放電され易くなる。 Thus, a conductive electrostatic charge applied to the cover 30 of, likely to be discharged to the fixture 2 5 than fixtures 2 1 to 2 4.
　なお、本変形例では、第３の実施形態において少なくとも１組のボス３２と固定具２を電子部品１の近くに配置したが、第１～第２の実施形態において少なくとも１組のボス３２と固定具２を電子部品１の近くに配置してもよい。 In the present modification, at least one set of bosses 32 and the fixture 2 are arranged near the electronic component 1 in the third embodiment, but at least one set of bosses 32 and the fixture 2 are arranged in the first to second embodiments. The fixture 2 may be placed near the electronic component 1.
　（電気的な構成）
　次に、図８Ａを用いて、第１～第３の実施形態に共通の電気的な構成を説明する。図８Ａは、固定具２をグランドへ接続する例を示す模式図である。 (Electrical configuration)
Next, the electrical configuration common to the first to third embodiments will be described with reference to FIG. 8A. FIG. 8A is a schematic view showing an example of connecting the fixture 2 to the ground.
　基板１０は、配線パターン１１を有する。固定具２は、配線パターン１１を介してグランドに接続される。これにより、ボス３２から固定具２へ放電された静電気は、グランドに排出される。すなわち、静電気の回路グランドへの放電経路を確保することができる。 The substrate 10 has a wiring pattern 11. The fixture 2 is connected to the ground via the wiring pattern 11. As a result, the static electricity discharged from the boss 32 to the fixture 2 is discharged to the ground. That is, it is possible to secure a discharge path for static electricity to the circuit ground.
　（変形例）
　図８Ｂは、固定具２をグランドへ接続する変形例を示す模式図である。本変形例では、基板１０は、配線パターン１１と、配線パターン１１に接続される回路素子（抵抗Ｒ）とを有する。固定具２は、配線パターン１１及び回路素子（抵抗Ｒ）を介してグランドに接続される。 (Modification example)
FIG. 8B is a schematic view showing a modified example of connecting the fixture 2 to the ground. In this modification, the substrate 10 has a wiring pattern 11 and a circuit element (resistor R) connected to the wiring pattern 11. The fixture 2 is connected to the ground via the wiring pattern 11 and the circuit element (resistor R).
　これにより、回路素子（抵抗Ｒ）で静電気が熱エネルギーに変換され、グランドの電位の変動を抑制することができる。なお、抵抗Ｒに代えてスイッチング素子、コンデンサなどを回路素子として採用してもよい。 As a result, static electricity is converted into heat energy in the circuit element (resistor R), and fluctuations in the ground potential can be suppressed. A switching element, a capacitor, or the like may be used as the circuit element instead of the resistor R.
　（その他）
　図９は、第１の実施形態の変形例による電子制御装置１００のボス３２の周辺の構成を示す拡大断面図である。 (Other)
FIG. 9 is an enlarged cross-sectional view showing the configuration around the boss 32 of the electronic control device 100 according to the modified example of the first embodiment.
　本変形例では、固定具２と向き合うカバー３０の部分（ボス３２）の面積Ｓ２は、電子部品１と向き合うカバー３０の部分の面積Ｓ０以上又は電子部品１が熱伝導材料３と接触または接合している部分の面積Ｓ３以上である。これにより、ボス３２と固定具２の間の静電容量をさらに大きくすることができる。 In this modification, the area S2 of the part (boss 32) of the cover 30 facing the fixture 2 is equal to or larger than the area S0 of the part of the cover 30 facing the electronic component 1, or the electronic component 1 contacts or joins with the heat conductive material 3. The area of the portion is S3 or more. As a result, the capacitance between the boss 32 and the fixture 2 can be further increased.
　カバー３０に付与される静電気７aは、図１０に示すように、固定具２と向き合うカバー３０の部分（ボス３２）に蓄えられ、絶縁破壊により固定具２に放電される。 As shown in FIG. 10, the static electricity 7a applied to the cover 30 is stored in the portion (boss 32) of the cover 30 facing the fixture 2, and is discharged to the fixture 2 due to dielectric breakdown.
　これにより、例えば、少量（所定量以下）の静電気がカバー３０に付与された場合、静電気はボス３２から固定具２へ放電されず、ボス３２に蓄えられる。また、固定具２の頭部の表面では、静電気７aと極性の異なる電荷７ｂがクーロン力により静電気７aに引き寄せられる。一方、多量（所定量を超える）の静電気がカバー３０に付与され、ボス３２と固定具２との間の電場が絶縁耐力を超えた場合、静電気は固定具２へ放電される。 As a result, for example, when a small amount (or less than a predetermined amount) of static electricity is applied to the cover 30, the static electricity is not discharged from the boss 32 to the fixture 2 but is stored in the boss 32. Further, on the surface of the head of the fixture 2, a charge 7b having a polarity different from that of the static electricity 7a is attracted to the static electricity 7a by the Coulomb force. On the other hand, when a large amount of static electricity (exceeding a predetermined amount) is applied to the cover 30 and the electric field between the boss 32 and the fixture 2 exceeds the dielectric strength, the static electricity is discharged to the fixture 2.
　なお、複数組のボス３２と固定具２を電子制御装置１００に設けることで、ボス３２と固定具２との間の静電容量が合成される。その結果、より多くの静電気７aを、固定具２と向き合うカバー３０の部分に蓄えることができる。 By providing the electronic control device 100 with a plurality of sets of the boss 32 and the fixture 2, the capacitance between the boss 32 and the fixture 2 is combined. As a result, more static electricity 7a can be stored in the portion of the cover 30 facing the fixture 2.
　本発明は上記した実施形態に限定されるものではなく、様々な変形例が含まれる。例えば、上述した実施形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、ある実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 The present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations. Further, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Further, it is possible to add / delete / replace a part of the configuration of each embodiment with another configuration.
１…電子部品
２…固定具
３…熱伝導材料
４…シール材料
５…エクスポーズドパッド
６…誘電材料
７ａ…静電気
７ｂ…電荷
１０…基板
１１…配線パターン
２０…ベース
３０…カバー
３１、３２…ボス
３２ａ…凹部
１００…電子制御装置 1 ... Electronic component 2 ... Fixture 3 ... Heat conductive material 4 ... Sealing material 5 ... Exposed pad 6 ... Dielectric material 7a ... Static electricity 7b ... Charge 10 ... Board 11 ... Wiring pattern 20 ... Base 30 ... Covers 31, 32 ... Boss 32a ... Recess 100 ... Electronic control device

Claims (15)

  1. 　基板と、
    　前記基板に実装される電子部品と、
    　前記基板を保持する絶縁性のベースと、
    　前記基板を前記ベースに固定する導電性の固定具と、
    　前記ベースを覆う導電性のカバーと、を備える電子制御装置において、
    　前記固定具と前記カバーとの間の距離Ｄ１は、
    　前記電子部品と前記カバーとの間の距離Ｄ２以下である
    　ことを特徴とする電子制御装置。     With the board
    Electronic components mounted on the board and
    With an insulating base that holds the substrate,
    A conductive fixture that fixes the substrate to the base,
    In an electronic control device comprising a conductive cover covering the base.
    The distance D1 between the fixture and the cover is
    An electronic control device characterized in that the distance between the electronic component and the cover is D2 or less.
  2. 　請求項１に記載の電子制御装置において、
    　前記固定具と向き合う前記カバーの部分は、
    　前記固定具の頭部を覆う凹部を有する
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 1,
    The portion of the cover facing the fixture is
    An electronic control device having a recess that covers the head of the fixture.
  3. 　請求項２に記載の電子制御装置において、
    　前記凹部は、
    　前記固定具の頭部に倣った面から構成される
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 2.
    The recess is
    An electronic control device characterized by being composed of a surface that imitates the head of the fixture.
  4. 　請求項３に記載の電子制御装置において、
    　前記凹部は、
    　ドーム状である
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 3,
    The recess is
    An electronic control device characterized by having a dome shape.
  5. 　請求項２に記載の電子制御装置において、
    　前記電子部品は、
    　前記カバーと向き合う導電性のエクスポーズドパッドを有し、
    　前記固定具と向き合う前記カバーの部分の面積Ｓ２は、
    　前記エクスポーズドパッドの面積Ｓ１以上である
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 2.
    The electronic component is
    It has a conductive exposed pad facing the cover
    The area S2 of the cover portion facing the fixture is
    An electronic control device having an area S1 or more of the exposed pad.
  6. 　請求項２に記載の電子制御装置において、
    　前記固定具と向き合う前記カバーの部分の面積Ｓ２は、
    　前記電子部品が熱伝導材料３と接触または接合している部分の
    　面積Ｓ３以上である
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 2.
    The area S2 of the cover portion facing the fixture is
    An electronic control device having an area S3 or more of a portion where the electronic component is in contact with or bonded to the heat conductive material 3.
  7. 　請求項２に記載の電子制御装置において、
    　前記カバーと前記電子部品との間に配置される熱伝導材料と、
    　前記カバーと前記ベースとの間を封止するシール材料と、
    　前記固定具と向き合う前記カバーの部分と前記固定具の頭部との間に配置され、前記熱伝導材料又は前記シール材料の比誘電率と同じもしくは大きい比誘電率を有する誘電材料と、
    　を備えることを特徴とする電子制御装置。     In the electronic control device according to claim 2.
    A heat conductive material arranged between the cover and the electronic component,
    A sealing material that seals between the cover and the base,
    A dielectric material disposed between the portion of the cover facing the fixture and the head of the fixture and having a relative permittivity equal to or greater than the relative permittivity of the heat conductive material or the sealing material.
    An electronic control device characterized by comprising.
  8. 　請求項７に記載の電子制御装置において、
    　前記電子部品は、
    　前記カバーと向き合う導電性のエクスポーズドパッドを有し、
    　前記固定具と向き合い且つ前記誘電材料と接触又は接合する前記カバーの部分の面積Ｓ２＿１は、前記エクスポーズドパッドの面積Ｓ１以上である
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 7.
    The electronic component is
    It has a conductive exposed pad facing the cover
    An electronic control device characterized in that the area S2_1 of the portion of the cover facing the fixture and contacting or joining with the dielectric material is equal to or larger than the area S1 of the exposed pad.
  9. 　請求項１に記載の電子制御装置において、
    　前記固定具は複数あり、
    　前記固定具と向き合う前記カバーの部分は、
    　複数の前記固定具のうち前記電子部品に最も近いものと向き合う
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 1,
    There are multiple fixtures
    The portion of the cover facing the fixture is
    An electronic control device characterized in that it faces one of a plurality of the fixtures closest to the electronic component.
  10. 　請求項１に記載の電子制御装置において、
    　前記基板は、
    　配線パターンを有し、
    　前記固定具は、
    　前記配線パターンを介してグランドに接続される
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 1,
    The substrate is
    Has a wiring pattern,
    The fixture is
    An electronic control device characterized in that it is connected to the ground via the wiring pattern.
  11. 　請求項１０に記載の電子制御装置において、
    　前記基板は、
    　前記配線パターンに接続される回路素子を有し、
    　前記固定具は、
    　前記配線パターン及び前記回路素子を介して前記グランドに接続される
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 10,
    The substrate is
    It has a circuit element connected to the wiring pattern and has
    The fixture is
    An electronic control device characterized in that it is connected to the ground via the wiring pattern and the circuit element.
  12. 　請求項１１に記載の電子制御装置において、
    　前記回路素子は、
    　抵抗である
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 11,
    The circuit element is
    An electronic control device characterized by being a resistor.
  13. 　請求項１に記載の電子制御装置において、
    　前記固定具と向き合う前記カバーの部分の面積Ｓ２は、
    　前記電子部品と向き合う前記カバーの部分の面積Ｓ０以上又は
    　前記電子部品が熱伝導材料３と接触または接合している部分の
    　面積Ｓ３以上である
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 1,
    The area S2 of the cover portion facing the fixture is
    An electronic control device having an area S0 or more of a portion of the cover facing the electronic component or an area S3 or more of a portion of the electronic component in contact with or bonded to the heat conductive material 3.
  14. 　請求項１に記載の電子制御装置において、
    　前記固定具と向き合う前記カバーの部分と前記固定具との間に空隙が設けられる
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 1,
    An electronic control device characterized in that a gap is provided between a portion of the cover facing the fixture and the fixture.
  15. 　請求項１に記載の電子制御装置において、
    　前記カバーに付与される静電気７aは、
    　前記固定具と向き合う前記カバーの部分に蓄えられ、絶縁破壊により前記固定具に放電される
    　ことを特徴とする電子制御装置。     In the electronic control device according to claim 1,
    The static electricity 7a applied to the cover is
    An electronic control device characterized in that it is stored in a portion of the cover facing the fixture and discharged to the fixture due to dielectric breakdown.
PCT/JP2020/020238 2019-05-31 2020-05-22 Electronic control device WO2020241474A1 (en)

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