CN113841469B - Electronic control device - Google Patents
Electronic control device Download PDFInfo
- Publication number
- CN113841469B CN113841469B CN202080036380.8A CN202080036380A CN113841469B CN 113841469 B CN113841469 B CN 113841469B CN 202080036380 A CN202080036380 A CN 202080036380A CN 113841469 B CN113841469 B CN 113841469B
- Authority
- CN
- China
- Prior art keywords
- cover
- circuit board
- electronic component
- electronic control
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000005611 electricity Effects 0.000 claims abstract description 26
- 230000003068 static effect Effects 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 8
- 239000003566 sealing material Substances 0.000 claims description 7
- 230000015556 catabolic process Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 230000002401 inhibitory effect Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000010354 integration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Abstract
The invention provides an electronic control device capable of inhibiting the failure of an electronic component due to static electricity. The electronic control device (100) comprises a circuit board (10), an electronic component (1) mounted on the circuit board (10), a base (20) for maintaining the insulativity of the circuit board (10), a conductive fixing member (2) for fixing the circuit board (10) on the base (20), and a conductive cover (30) for covering the base (20). A distance (D1) between the fixture (2) and the cover (30) (boss (32)) is not more than a distance (D2) between the electronic component (1) and the cover (30) (boss (31)).
Description
Technical Field
The present invention relates to an electronic control device.
Background
In recent years, in-vehicle electronic control devices, electromechanical integration has been advanced in the background of an increase in the number of electronic control devices mounted in a vehicle, a reduction in the length of a connection cable between a control device and a sensor, between actuators, and the like. Specifically, the present invention relates to an integration of an engine control actuator and an electronic control device, an integration of a transmission and an electronic control device, and the like.
Here, the surface temperature of the engine, the transmission, and the like is 130 to 140 ℃, whereas the heat-resistant temperature of the electronic component used in the electronic control device is about 150 ℃.
When the electronic control apparatus is operated in such a severe environment, there is a risk that heat of the engine, the transmission, and the like is transferred to electronic components on a circuit board held by the mount via the mount (housing) of the electronic control apparatus, and that the temperature of the electronic components exceeds the heat-resistant temperature.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2014-075496
Disclosure of Invention
Problems to be solved by the invention
In the electronic control device disclosed in patent document 1, the chassis holding the circuit board is made of metal (made of alloy), so that heat of the engine, the transmission, and the like is easily transferred to the electronic component via the chassis (housing). In order to suppress the temperature rise of electronic components due to heat of an engine, a transmission, and the like, it is considered to use a resin for a base of an electronic control device.
However, there is a new problem that static electricity applied to the metal cover by a user's hand or the like cannot be discharged to the resin base. In addition, there is a concern that static electricity is discharged to the electronic component and the electronic component malfunctions.
The invention aims to provide an electronic control device capable of inhibiting the failure of an electronic component due to static electricity.
Means for solving the problems
In order to achieve the above object, the present invention is an electronic control device comprising: a circuit board; an electronic component mounted on the circuit board; a base for maintaining the insulation of the circuit board; a conductive fixing member for fixing the circuit board to the base; and a cover that covers the base, wherein a distance D1 between the fixture and the cover is equal to or less than a distance D2 between the electronic component and the cover.
Effects of the invention
According to the present invention, it is possible to suppress occurrence of failure of an electronic component due to static electricity. The problems, structures, and effects other than those described above will be described by the following description of the embodiments.
Drawings
Fig. 1 is a cross-sectional view showing the overall structure of an electronic control device according to a first embodiment.
Fig. 2 is an enlarged cross-sectional view showing the structure of the periphery of the boss of the electronic control apparatus shown in fig. 1.
Fig. 3 is an enlarged cross-sectional view showing the structure of the periphery of the boss of the electronic control device of the second embodiment.
Fig. 4 is a diagram for explaining the size relationship of the area in the case where the electronic component does not have the bare pad.
Fig. 5 is an enlarged cross-sectional view showing the structure of the periphery of a boss of the electronic control device of the third embodiment.
Fig. 6 is a diagram for explaining the size relationship of the areas.
Fig. 7A is an enlarged cross-sectional view showing the structure of the periphery of the boss opposing the mount in the electronic control device according to the modification of the third embodiment.
Fig. 7B is a plan view of the circuit board shown in fig. 7A.
Fig. 8A is a schematic diagram showing an example of connecting the fixing member to the ground.
Fig. 8B is a schematic view showing a modification of connecting the fixing member to the ground.
Fig. 9 is an enlarged cross-sectional view showing the structure of the periphery of the boss of the electronic control device according to the modification of the first embodiment.
Fig. 10 is a diagram for explaining static electricity accumulated in a portion of the cover opposed to the mount.
Detailed Description
The configuration of the electronic control device according to the first to third embodiments of the present invention will be described below with reference to the drawings. The electronic control device controls, for example, an actuator of an engine, a transmission, or the like. In the drawings, like reference numerals denote like parts.
(first embodiment)
First, the structure of the electronic control device 100 according to the first embodiment will be described with reference to fig. 1. Fig. 1 is a cross-sectional view showing the overall structure of an electronic control device 100 according to a first embodiment of the present invention.
The electronic control device 100 mainly includes a circuit board 10, an electronic component 1 mounted on the circuit board 10, a base 20 for maintaining insulation of the circuit board 10, a conductive fixing member 2 for fixing the circuit board 10 to the base 20, and a cover 30 for covering the base 20.
The insulating base 20 is formed of, for example, an insulating resin, and is directly attached to an engine, a transmission, or the like. By using a resin for the mount 20, heat from an engine, a transmission, or the like is less likely to be transmitted to the electronic component 1. The thermal conductivity of the base 20 is smaller than that of the cover 30 and also smaller than that of the housing of the engine, transmission, etc.
The conductive fixing member 2 (bolt, rivet, caulking portion, etc.) is formed of, for example, conductive metal or resin. The conductive cover 30 is formed of, for example, conductive metal (aluminum, steel plate, or the like) or conductive resin, and is formed by casting, pressing, injection molding, or the like.
The electronic component 1 is mounted on the circuit board 10. The electronic component 1 is constituted by, for example, a semiconductor element. Specific examples of the electronic component 1 include a processor that calculates a control amount of an actuator based on output values of various sensors (a temperature sensor, a pressure sensor, and the like), a drive circuit that supplies a drive current to the actuator via a switch, and the like.
The drive circuit may be mounted on the actuator. The electronic component 1 is electrically connected to actuators such as an engine and a transmission via wiring patterns of the circuit board 10, pins of the connector 40, and the like.
In the present embodiment, the electronic component 1 has the conductive bare pads 5 facing the cover 30. The bare pads 5 are, for example, conductive metal plates, also known as heat spreader or heat sink. The bare pads 5 transfer heat generated by the electronic component 1 to the electrically conductive cover 30 via the thermally conductive material 3. Then, the heat transferred to the cover 30 is radiated to the atmosphere. In the present embodiment, the heat conductive material 3 includes ceramics or the like.
A boss 31 opposed to the electronic component 1 and a boss 32 opposed to the conductive holder 2 are formed on the cover 30. A heat conductive material 3 is disposed between the boss 31 and the electronic component 1.
The sealing material 4 seals between the cover 30 and the base 20, and prevents water from entering the case formed by the cover 30 and the base 20. The sealing material 4 is, for example, a silicone adhesive.
In the present embodiment, the plurality of sets of bosses 32 and the fixing members 2 are arranged at the corners and the like of the circuit board 10.
Next, the features of the electronic control device 100 according to the present embodiment will be described with reference to fig. 2. Fig. 2 is an enlarged cross-sectional view showing the structure of the periphery of boss 32 of electronic control device 100 shown in fig. 1.
In the present embodiment, the distance D1 between the holder 2 and the cover 30 (boss 32) is equal to or smaller than the distance D2 between the electronic component 1 and the cover 30 (boss 31). Thus, static electricity applied to the conductive cover 30 is more easily discharged to the fixture 2 than the electronic component 1. Therefore, the electronic component 1 can be prevented from malfunctioning due to static electricity. In addition, the electronic component 1 can be prevented from malfunctioning due to static electricity.
In addition, a gap is provided between the boss 32, which is a portion of the cover 30 facing the mount 2, and the mount 2. Thus, the boss 32 does not contact the mount 2, so the circuit board 10 is not deformed by the boss 32. As a result, occurrence of cracks in solder (bonding member) that bonds the terminals of the electronic component 1 and the wiring pattern can be suppressed.
As described above, according to the present embodiment, the occurrence of a failure of the electronic component 1 due to static electricity can be suppressed. In addition, the electronic component 1 can be prevented from malfunctioning due to static electricity. Further, occurrence of cracks in solder joining the terminals of the electronic component 1 and the wiring pattern can be suppressed.
(second embodiment)
Next, the structure of the electronic control device 100 according to the second embodiment will be described with reference to fig. 3. Fig. 3 is an enlarged cross-sectional view showing the structure of the periphery of boss 32 of electronic control device 100 according to the second embodiment of the present invention.
In the present embodiment, the boss 32, which is a portion of the cover 30 facing the holder 2, has a recess 32a covering the head of the holder 2. This can increase the area of the portion of the cover 30 facing the fixture 2. As a result, the electrostatic capacitance between the boss 32 and the mount 2 increases, and thus, the static electricity applied to the conductive cap 30 is more easily discharged to the mount 2 than the electronic component 1.
In detail, the concave portion 32a of the boss 32 is constituted by a face following the head of the mount 2. For example, in the case where the heads of the fixture 2 are cylindrical, hexagonal prism, or dome-shaped, the concave portions 32a are formed by surfaces corresponding to the shapes of the heads. Thereby, the portion of the cover 30 facing the holder 2 can be made to approach the surface of the head of the holder 2 as a whole. As a result, the electrostatic capacitance between the boss 32 and the mount 2 can be further increased.
In the present embodiment, the head of the holder 2 is dome-shaped, and accordingly, the recess 32a is dome-shaped. This can increase the capacitance of the portion (dome-shaped concave portion 32 a) of the cover 30 facing the fixture 2.
In the present embodiment, the electronic component 1 has the conductive bare pads 5 facing the cover 30. The area S2 of the portion (recess 32 a) of the cap 30 opposing the mount 2 is equal to or larger than the area S1 of the bare pad 5. Thereby, the electrostatic capacitance between the boss 32 and the fixture 2 can be further increased.
In the case where the electronic component 1 does not have the bare pads 5, as shown in fig. 4, the area S2 of the portion (the concave portion 32 a) of the cover 30 facing the mount 2 may be equal to or larger than the area S3 of the portion where the electronic component 1 contacts or is bonded to the heat conductive material 3. Thereby, the electrostatic capacitance between the boss 32 and the fixture 2 can be further increased.
(third embodiment)
Next, the structure of the electronic control device 100 according to the third embodiment will be described with reference to fig. 5. Fig. 5 is an enlarged cross-sectional view showing the structure of the periphery of boss 32 of electronic control device 100 according to the third embodiment of the present invention.
The present embodiment differs from the second embodiment in that the dielectric 6 is disposed between the boss 32 and the mount 2.
As described above, the heat conductive material 3 is disposed between the cover 30 and the electronic component 1. The sealing material 4 seals the space between the cover 30 and the base 20. Here, the dielectric 6 is disposed between a portion (recess 32 a) of the cover 30 facing the mount 2 and the head of the mount 2. The dielectric material 6 has a relative dielectric constant ε 3 that is equal to or greater than a relative dielectric constant ε 1 of the heat conductive material 3 or a relative dielectric constant ε 2 of the sealing material 4. Thereby, the electrostatic capacitance between the boss 32 and the fixture 2 can be further increased.
In the present embodiment, the electronic component 1 has the conductive bare pads 5 facing the cover 30. As shown in fig. 6, the area s2_1 of the portion (recess 32 a) of the cap 30 that faces the mount 2 and is in contact with or joined to the dielectric 6 is equal to or larger than the area S1 of the bare pad 5. Thereby, the electrostatic capacitance between the boss 32 and the fixture 2 can be further increased.
(modification)
Next, a modification of the electronic control device 100 will be described with reference to fig. 7A and 7B. Fig. 7A is an enlarged cross-sectional view showing the structure of the periphery of boss 32 of electronic control device 100 according to the modification of the third embodiment. Fig. 7B is a plan view of the circuit board 10 shown in fig. 7A.
In the example of fig. 7B, the fixing member 2 (2 1 ～2 5 ) There are a plurality (5). Further, the electronic component 1 and the fixture 2 (2 1 ～2 5 ) Distance L (L1 to L5), L5<L1<L4<L2<L3 holds. That is, the portion (boss 32) of the cover 30 opposed to the mount 2 is opposed to the mount 2 (mount 2) closest to the electronic component 1 among the plurality of mounts 2 5 ) Opposite to each other.
Thereby, static electricity applied to the conductive cover 30 and the fixing member 2 1 ～2 4 Is easier to be directed towards the fixture 2 than 5 And (5) discharging.
In this modification, at least 1 set of bosses 32 and the mount 2 are arranged near the electronic component 1 in the third embodiment, but at least 1 set of bosses 32 and the mount 2 may be arranged near the electronic component 1 in the first to second embodiments.
(Electrical Structure)
Next, a common electrical structure in the first to third embodiments will be described with reference to fig. 8A. Fig. 8A is a schematic diagram showing an example of connecting the mount 2 to the ground.
The circuit board 10 has a wiring pattern 11. The fixing member 2 is connected to the ground via the wiring pattern 11. Thereby, the static electricity discharged from the boss 32 to the fixture 2 is discharged to the ground. That is, a discharge path of static electricity to the circuit ground can be ensured.
(modification)
Fig. 8B is a schematic diagram showing a modification of connecting the fixture 2 to the ground. In this modification, the circuit board 10 includes a wiring pattern 11 and a circuit element (resistor R) connected to the wiring pattern 11. The mount 2 is connected to ground via the wiring pattern 11 and the circuit element (resistor R).
This converts static electricity into heat energy by the circuit element (resistor R), and suppresses the variation in the potential of the ground. In addition, a switching element, a capacitor, or the like may be used as a circuit element instead of the resistor R.
(others)
Fig. 9 is an enlarged cross-sectional view showing the structure of the periphery of boss 32 of electronic control device 100 according to the modification of the first embodiment.
In this modification, the area S2 of the portion (boss 32) of the cover 30 facing the mount 2 is equal to or larger than the area S0 of the portion of the cover 30 facing the electronic component 1 or equal to or larger than the area S3 of the portion of the electronic component 1 in contact with or bonded to the heat conductive material 3. Thereby, the electrostatic capacitance between the boss 32 and the fixture 2 can be further increased.
As shown in fig. 10, the static electricity 7a applied to the cover 30 is accumulated in a portion (boss 32) of the cover 30 facing the fixture 2, and the fixture 2 is discharged due to dielectric breakdown.
Thus, for example, when a small amount (a predetermined amount or less) of static electricity is applied to the cover 30, the static electricity is not discharged from the boss 32 to the fixture 2, but is accumulated in the boss 32. Further, on the surface of the head of the fastener 2, the electric charges 7b having a polarity different from that of the static electricity 7a are attracted by the static electricity 7a due to coulomb force. On the other hand, when a large amount (more than a predetermined amount) of static electricity is applied to the cover 30 and the electric field between the boss 32 and the fixture 2 exceeds the insulation resistance, the static electricity is discharged to the fixture 2.
In addition, by providing a plurality of sets of bosses 32 and fixtures 2 in the electronic control device 100, electrostatic capacitances between the bosses 32 and the fixtures 2 are combined. As a result, more static electricity 7a can be accumulated in the portion of the cover 30 facing the mount 2.
The present invention is not limited to the above-described embodiments, and includes various modifications. For example, the above-described embodiments are described in detail for the purpose of easily understanding the present invention, and are not limited to all the configurations that are required to be described. In addition, a part of the structure of one embodiment may be replaced with the structure of another embodiment, and the structure of another embodiment may be added to the structure of one embodiment. In addition, other structures may be added, deleted, or replaced for a part of the structures of the respective embodiments.
Description of the reference numerals
1 … electronic component
2 … fixing piece
3 … heat conducting material
4 … sealing material
5 … bare bonding pad
6 … dielectric
7a … static electricity
7b … charge
10 … circuit board
11 … Wiring pattern
20 … base
30 … cover
31 32, … boss
32a … recess
100 … electronic control device.
Claims (12)
1. An electronic control device, comprising:
a circuit board;
an electronic component mounted on the circuit board;
a base for maintaining the insulation of the circuit board;
a conductive fixing member for fixing the circuit board to the base; and
a conductive cover covering the base,
the distance (D1) between the fixture and the cover is below the distance (D2) between the electronic component and the cover,
the electronic control device is characterized in that:
the part of the cover opposite the fixture has a boss integrally formed with a recess which is not in contact with the fixture but covers it and is constituted by a face emulating the head of the fixture,
a dielectric is disposed between the recess formed in the boss and the fixture.
2. The electronic control apparatus according to claim 1, wherein:
the recess is dome-shaped.
3. The electronic control apparatus according to claim 1, wherein:
the fixing member is provided with a plurality of fixing members,
the portion of the cover opposite to the mount is opposite to a mount closest to the electronic component among the plurality of mounts.
4. The electronic control apparatus according to claim 1, wherein:
the circuit board has a wiring pattern and is provided with a plurality of wiring patterns,
the fixing member is connected to a ground line via the wiring pattern.
5. The electronic control apparatus according to claim 4, wherein:
the circuit board has circuit elements connected to the wiring patterns,
the fixing member is connected to the ground line via the wiring pattern and the circuit element.
6. The electronic control apparatus according to claim 5, wherein:
the circuit element is a resistor.
7. The electronic control apparatus according to claim 1, wherein:
static electricity (7 a) carried by the cover is accumulated in a portion of the cover opposite to the fixing member, and the fixing member is discharged in the event of dielectric breakdown.
8. An electronic control device, comprising:
a circuit board;
an electronic component mounted on the circuit board;
a base for maintaining the insulation of the circuit board;
a conductive fixing member for fixing the circuit board to the base; and
a conductive cover covering the base,
the distance (D1) between the fixture and the cover is below the distance (D2) between the electronic component and the cover,
the portion of the cover opposite the mount has a recess covering the head of the mount,
the electronic control device is characterized in that:
the electronic component has conductive bare pads opposite the cover,
an area (S2) of a portion of the cover opposite the mount is greater than an area (S1) of the bare pad.
9. An electronic control device, comprising:
a circuit board;
an electronic component mounted on the circuit board;
a base for maintaining the insulation of the circuit board;
a conductive fixing member for fixing the circuit board to the base; and
a conductive cover covering the base,
the distance (D1) between the fixture and the cover is below the distance (D2) between the electronic component and the cover,
the portion of the cover opposite the mount has a recess covering the head of the mount,
the electronic control device is characterized in that:
an area (S2) of a portion of the cover facing the fixing member is equal to or larger than an area (S3) of a portion of the electronic component in contact with or bonded to the heat conductive material (3).
10. An electronic control device, comprising:
a circuit board;
an electronic component mounted on the circuit board;
a base for maintaining the insulation of the circuit board;
a conductive fixing member for fixing the circuit board to the base; and
a conductive cover covering the base,
the distance (D1) between the fixture and the cover is below the distance (D2) between the electronic component and the cover,
the portion of the cover opposite the mount has a recess covering the head of the mount,
the electronic control device is characterized by comprising:
a heat conductive material disposed between the cover and the electronic component;
a sealing material sealing between the cover and the base; and
and a dielectric disposed between a portion of the cover facing the fixture and a head of the fixture, the dielectric having a relative permittivity equal to or greater than that of the heat conductive material or the sealing material.
11. The electronic control apparatus according to claim 10, wherein:
the electronic component has conductive bare pads opposite the cover,
an area (s2_1) of a portion of the cap opposite the mount and in contact with or bonded to the dielectric is above an area (S1) of the bare pad.
12. An electronic control device, comprising:
a circuit board;
an electronic component mounted on the circuit board;
a base for maintaining the insulation of the circuit board;
a conductive fixing member for fixing the circuit board to the base; and
a conductive cover covering the base,
the distance (D1) between the fixture and the cover is below the distance (D2) between the electronic component and the cover,
the electronic control device is characterized in that:
an area (S2) of a portion of the cover facing the mount is not less than an area (S0) of a portion of the cover facing the electronic component, or not less than an area (S3) of a portion of the electronic component in contact with or bonded to the heat conductive material (3).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019102441 | 2019-05-31 | ||
| JP2019-102441 | 2019-05-31 | ||
| PCT/JP2020/020238 WO2020241474A1 (en) | 2019-05-31 | 2020-05-22 | Electronic control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113841469A CN113841469A (en) | 2021-12-24 |
| CN113841469B true CN113841469B (en) | 2024-01-02 |
Family
ID=73553444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080036380.8A Active CN113841469B (en) | 2019-05-31 | 2020-05-22 | Electronic control device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7210722B2 (en) |
| CN (1) | CN113841469B (en) |
| WO (1) | WO2020241474A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020241474A1 (en) | 2020-12-03 |
| CN113841469A (en) | 2021-12-24 |
| WO2020241474A1 (en) | 2020-12-03 |
| JP7210722B2 (en) | 2023-01-23 |
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