JP7210722B2 - 電子制御装置 - Google Patents

電子制御装置 Download PDF

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Publication number
JP7210722B2
JP7210722B2 JP2021522305A JP2021522305A JP7210722B2 JP 7210722 B2 JP7210722 B2 JP 7210722B2 JP 2021522305 A JP2021522305 A JP 2021522305A JP 2021522305 A JP2021522305 A JP 2021522305A JP 7210722 B2 JP7210722 B2 JP 7210722B2
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Japan
Prior art keywords
fixture
cover
electronic control
control device
substrate
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JP2021522305A
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English (en)
Japanese (ja)
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JPWO2020241474A1 (enrdf_load_html_response
Inventor
義夫 河合
諒 秋葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
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Hitachi Astemo Ltd
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Publication of JPWO2020241474A1 publication Critical patent/JPWO2020241474A1/ja
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Publication of JP7210722B2 publication Critical patent/JP7210722B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
JP2021522305A 2019-05-31 2020-05-22 電子制御装置 Active JP7210722B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019102441 2019-05-31
JP2019102441 2019-05-31
PCT/JP2020/020238 WO2020241474A1 (ja) 2019-05-31 2020-05-22 電子制御装置

Publications (2)

Publication Number Publication Date
JPWO2020241474A1 JPWO2020241474A1 (enrdf_load_html_response) 2020-12-03
JP7210722B2 true JP7210722B2 (ja) 2023-01-23

Family

ID=73553444

Family Applications (1)

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JP2021522305A Active JP7210722B2 (ja) 2019-05-31 2020-05-22 電子制御装置

Country Status (3)

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JP (1) JP7210722B2 (enrdf_load_html_response)
CN (1) CN113841469B (enrdf_load_html_response)
WO (1) WO2020241474A1 (enrdf_load_html_response)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368436A (ja) 2001-06-11 2002-12-20 Kenwood Corp 電子機器
JP2008090437A (ja) 2006-09-29 2008-04-17 Toshiba Corp 電子機器
JP2014120677A (ja) 2012-12-18 2014-06-30 Aisin Seiki Co Ltd 電子機器
JP2019133858A (ja) 2018-01-31 2019-08-08 株式会社アドヴィックス 電子制御装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131198U (enrdf_load_html_response) * 1987-02-17 1988-08-26
JPH08316662A (ja) * 1995-05-24 1996-11-29 Fujitsu Ltd 電子装置
JP2001332832A (ja) * 2000-05-19 2001-11-30 Olympus Optical Co Ltd 医用電気機器
JP2006196664A (ja) * 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 基板へのシールドケース取付構造及び携帯電話
JP2007258615A (ja) * 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
JP4923712B2 (ja) * 2006-05-02 2012-04-25 日立電線株式会社 光モジュール及びその製造方法
JP5287492B2 (ja) * 2009-05-18 2013-09-11 株式会社デンソー 電子装置
CN201854514U (zh) * 2010-11-01 2011-06-01 国营第三八八厂 一种具有电磁屏蔽和散热功能的高频地波雷达机箱
JP2012238821A (ja) * 2011-05-13 2012-12-06 Tdk Corp シールドケース固定構造及びそれを備える電子装置
CN202799558U (zh) * 2012-07-16 2013-03-13 苏州东福电子有限公司 一种条状铝箔
JP2014033025A (ja) * 2012-08-01 2014-02-20 Alps Electric Co Ltd 電子回路モジュール
JP2014075496A (ja) * 2012-10-05 2014-04-24 Hitachi Automotive Systems Ltd 車載電子制御装置
CN102943969A (zh) * 2012-11-21 2013-02-27 深圳华瀚新能源材料有限公司 使用导热高分子材料散热的led灯
JP5998084B2 (ja) * 2013-03-15 2016-09-28 日立オートモティブシステムズ株式会社 蓄電モジュール
JP2014203998A (ja) * 2013-04-05 2014-10-27 日立オートモティブシステムズ株式会社 車載電子制御装置
JP6387278B2 (ja) * 2014-09-30 2018-09-05 太陽誘電株式会社 回路モジュール及びその製造方法
CN204598570U (zh) * 2015-04-10 2015-08-26 广东昕海科技有限公司 一种抗干扰屏蔽装置
CN204668299U (zh) * 2015-06-18 2015-09-23 厦门华联电子有限公司 一种红外线接收头
EP3358925A4 (en) * 2015-09-29 2019-05-22 Hitachi Automotive Systems, Ltd. ELECTRONIC CONTROL DEVICE
KR102481868B1 (ko) * 2016-05-04 2022-12-28 삼성전자주식회사 이종의 회로 소자군용 중공 차폐구조 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368436A (ja) 2001-06-11 2002-12-20 Kenwood Corp 電子機器
JP2008090437A (ja) 2006-09-29 2008-04-17 Toshiba Corp 電子機器
JP2014120677A (ja) 2012-12-18 2014-06-30 Aisin Seiki Co Ltd 電子機器
JP2019133858A (ja) 2018-01-31 2019-08-08 株式会社アドヴィックス 電子制御装置

Also Published As

Publication number Publication date
CN113841469B (zh) 2024-01-02
WO2020241474A1 (ja) 2020-12-03
JPWO2020241474A1 (enrdf_load_html_response) 2020-12-03
CN113841469A (zh) 2021-12-24

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