WO2020215479A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2020215479A1
WO2020215479A1 PCT/CN2019/092945 CN2019092945W WO2020215479A1 WO 2020215479 A1 WO2020215479 A1 WO 2020215479A1 CN 2019092945 W CN2019092945 W CN 2019092945W WO 2020215479 A1 WO2020215479 A1 WO 2020215479A1
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Prior art keywords
insulating layer
layer
organic insulating
fabricating
metal layer
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PCT/CN2019/092945
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English (en)
French (fr)
Inventor
余佩
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武汉华星光电半导体显示技术有限公司
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Publication of WO2020215479A1 publication Critical patent/WO2020215479A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate

Definitions

  • the invention relates to the field of display, in particular to a display panel and a manufacturing method thereof.
  • the flexible display panel 90 includes a display area 91 and a non-display area 92, and the non-display area 92 includes a peripheral area 921 surrounding the display area 91. , Bending area 922 and circuit board area 923.
  • the flexible display panel 90 usually adopts a soft and bendable plastic substrate, which is suitable for manufacturing a narrow-frame display device.
  • the flexible display panel 90 designs a bending area 922 in the peripheral signal routing area, thereby folding the signal routing area and the circuit board area 923 on the side or below the flexible display panel 90, thereby reducing the occupation of the non-display area 92 Than, to achieve a narrow bezel design.
  • FIGS. 3 and 4 it is a schematic diagram of the structure of the bending area 922, which includes: a flexible substrate 901, a first inorganic insulating layer 902, a first organic insulating layer 903, and a first metal layer 904 (including A plurality of first signal lines 914), a second inorganic insulating layer 905, a second organic insulating layer 906, a second metal layer 907 (including a plurality of second signal lines 917), and a third organic insulating layer 908.
  • the first inorganic insulating layer 902 has a laminated structure, and is the same film layer as the buffer layer, barrier layer, gate insulating layer, interlayer insulating layer, etc. in the display area 91.
  • the purpose of the second inorganic insulating layer 905 is to keep the first metal layer 904 and the second metal layer 907 insulated from each other in a partial area without the second organic insulating layer 906.
  • the first inorganic insulating layer 902 and the second inorganic insulating layer 905 are all etched and removed in the bending area 912.
  • the first signal line 914 and the second signal line 917 are data signal lines and power signal lines.
  • circular through holes 93 are provided on the first signal line 914 and the second signal line 917 to reduce the bending stress experienced by the signal line when it is bent and reduce the risk of bending failure.
  • this opening design is likely to cause another problem, that is, the residue 94 of the second inorganic insulating layer 905 is generated at the through hole 93 of the first signal line 904.
  • the residue 94 has an adverse effect on the stress release of the signal line and deteriorates the adhesion between the second organic insulating layer 906 and the first signal line 914.
  • the purpose of the present invention is to provide a display panel and a manufacturing method thereof to solve the problem of the residue of the second inorganic insulating layer generated at the through hole of the first signal line in the prior art. This prevents the risk of stress concentration or film peeling of the first signal line under bending stress, and improves product yield.
  • the present invention provides a display panel, which is defined with a display area and a bending area.
  • the display panel includes a flexible substrate, a first inorganic insulating layer, a first organic insulating layer, and a first metal layer arranged in a stack. , A second organic insulating layer, a second inorganic insulating layer, a second metal layer and a third organic insulating layer.
  • the first inorganic insulating layer is provided on the flexible substrate; the first organic insulating layer is provided on the first inorganic insulating layer in the bending area; the first metal layer Is provided on the first organic insulating layer, the first metal layer of the bending area is provided with first through holes arranged at intervals; the second organic insulating layer is provided on the first metal layer , The first through hole is filled with the second organic insulating layer; the second inorganic insulating layer is provided on the second organic insulating layer of the display area; the second metal layer is provided on the On the second inorganic insulating layer, the second metal layer of the bending area is provided with second through holes arranged at intervals; the third organic insulating layer is provided on the second metal layer, and the first The second organic insulating layer is filled in the two through holes.
  • first through hole and the second through hole are both circular.
  • the second through hole is arranged opposite to the first through hole.
  • the first inorganic insulating layer includes a buffer layer, a barrier layer, a gate insulating layer, and an interlayer insulating layer stacked in sequence.
  • the buffer layer is provided on the flexible substrate; the barrier layer is provided on the buffer layer; the gate insulating layer is provided on the barrier layer; the interlayer insulating layer is provided On the gate insulating layer.
  • the first metal layer includes a plurality of first signal lines, and the first signal lines are arranged at equal intervals.
  • the second metal layer includes a plurality of second signal lines, and the second signal lines are arranged at equal intervals.
  • the first inorganic insulating layer in the bending area further includes a third through hole, and the first organic insulating layer is provided in the third through hole; the first organic insulating layer is connected to the third through hole.
  • the thickness of the first inorganic insulating layer is equal.
  • the present invention also provides a manufacturing method of a display panel, including the following steps:
  • a first organic insulating layer is made, a third through hole is made by etching on the first inorganic insulating layer in the bending region, and the first organic insulating layer is made by coating organic matter in the third through hole Floor;
  • fabricating the second organic insulating layer on the first metal layer by coating and patterning, and filling the second organic insulating layer in the first through hole;
  • fabricating a second inorganic insulating layer fabricating the second inorganic insulating layer on the second organic insulating layer by deposition, and removing the second organic insulating layer in the bending area by etching;
  • fabricating the second metal layer on the second inorganic insulating layer by deposition and patterning the second metal layer is provided with second through holes arranged at intervals;
  • a third organic insulating layer is fabricated, the third organic insulating layer is fabricated on the second metal layer by coating and patterning, and the second organic insulating layer is filled in the second through hole.
  • the manufacturing of the first inorganic insulating layer specifically includes the following steps:
  • An interlayer insulating layer is fabricated, and the interlayer insulating layer is fabricated on the gate insulating layer by deposition.
  • first metal layer is patterned to form a plurality of first signal lines; the second metal layer is patterned to form a plurality of second signal lines.
  • the step of making the first metal layer further includes the step of passing oxygen gas to the first metal layer after the first metal layer is patterned for treatment to oxidize the surface layer of the first metal layer.
  • the beneficial effect of the present invention is to provide a display panel and a manufacturing method of the display panel, by arranging the second inorganic insulating layer in the bending area on the second organic insulating layer to avoid the through holes in the first metal layer Generate residues of the second inorganic insulating layer, thereby preventing the risk of stress concentration or film peeling of the first signal line under bending stress, and improving product yield.
  • FIG. 1 is a schematic diagram of a plan structure of an existing flexible display panel
  • FIG. 2 is a cross-sectional view of the flexible display panel in FIG. 1;
  • FIG. 3 is a schematic diagram of the structure of the bending area of the flexible display panel in FIG. 1;
  • Figure 4 is a cross-sectional view along the A-A direction in Figure 3;
  • FIG. 5 is a schematic structural diagram of a display panel in an embodiment of the invention.
  • Figure 6 is a cross-sectional view in the direction of B-B in Figure 5;
  • Figure 7 is a cross-sectional view in the direction of C-C in Figure 5;
  • FIG. 8 is a manufacturing flow chart of a display panel in an embodiment of the invention.
  • Fig. 9 is a production flowchart of step S2 in Fig. 8.
  • Display panel 10. Display area, 20. Bending area;
  • the second organic insulating layer 6.
  • the second inorganic insulating layer 7.
  • the second metal layer 8.
  • the first signal line 71.
  • the second signal line 71.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, “plurality” means two or more than two, unless specifically defined otherwise.
  • the present invention provides a display panel 100 defined with a display area 10 and a bending area 20.
  • the display panel 100 includes a flexible substrate 1, a first inorganic insulating layer 2, a first The organic insulating layer 3, the first metal layer 4, the second organic insulating layer 5, the second inorganic insulating layer 6, the second metal layer 7, and the third organic insulating layer 8.
  • the first inorganic insulating layer 2 is provided on the flexible substrate 1; the first organic insulating layer 3 is provided on the first inorganic insulating layer 2 in the bending area 20;
  • the first metal layer 4 is provided on the first organic insulating layer 3, wherein the first metal layer 4 of the bending area 20 is provided with first through holes 11 arranged at intervals;
  • the second The organic insulating layer 5 is provided on the first metal layer 4, the first through hole 11 is filled with the second organic insulating layer 5;
  • the second inorganic insulating layer 6 is provided on all of the display area 10
  • the second organic insulating layer 5; the second metal layer 7 is provided on the second inorganic insulating layer 6, wherein the second metal layer 7 of the bending area 20 is provided with spaced
  • the third organic insulating layer 8 is provided on the second metal layer 7, and the second through hole 12 is filled with the second organic insulating layer 5.
  • the purpose of providing the second inorganic insulating layer 6 is to
  • the first through hole 11 and the second through hole 12 are both circular.
  • the purpose of providing the first through hole 11 and the second through hole 12 is to reduce the bending stress of the first metal layer 4 and the second metal layer 7 during bending, and reduce the bending failure. risk.
  • the second through hole 12 is disposed opposite to the first through hole 11.
  • the first inorganic insulating layer 2 of the bending area 20 further includes a third through hole 13, and the first organic insulating layer 3 is provided in the third through hole 13, or It is said that the first organic insulating layer 3 is filled in the third through hole 13; the thickness of the first organic insulating layer 3 and the first inorganic insulating layer 2 are equal.
  • the first inorganic insulating layer 2 includes a buffer layer 21, a barrier layer 22, a gate insulating layer 23, and an interlayer insulating layer 24 stacked in sequence.
  • the buffer layer 21 is provided on the flexible substrate 1;
  • the barrier layer 22 is provided on the buffer layer 21;
  • the gate insulating layer 23 is provided on the barrier layer 22;
  • the interlayer insulating layer 24 is provided on the gate insulating layer 23.
  • the first metal layer 4 includes a plurality of first signal lines 41, and the first signal lines 41 are arranged at equal intervals.
  • the first signal line 41 is a data signal line to realize data signal transmission. Although only two first signal lines 41 are shown in the figure, in fact, the number of the first signal lines 41 can be changed according to actual needs.
  • the second metal layer 7 includes a plurality of second signal lines 71, and the second signal lines 71 are arranged at equal intervals.
  • the second signal line 71 is a Power signal line, which realizes scanning signal transmission.
  • the number of the second signal lines 71 can be changed according to actual needs.
  • the present invention also provides a manufacturing method of the display panel 100, including the following steps:
  • the first metal layer 4 is fabricated.
  • the first metal layer 4 is fabricated on the first organic insulating layer 3 by deposition and patterning.
  • the first metal layer 4 is provided with spaced first vias. Hole 11;
  • a second metal layer 7 is fabricated, and the second metal layer 7 is fabricated on the second inorganic insulating layer 6 by deposition and patterning.
  • the second metal layer 7 is provided with spaced second vias. Hole 12; and
  • the step S2 of fabricating the first inorganic insulating layer 2 specifically includes the following steps:
  • the first metal layer 4 is patterned to form a plurality of first signal lines 41; the second metal layer 7 is patterned to form a plurality of first signal lines 41; A second signal line 71.
  • the step S4 of fabricating the first metal layer further includes oxygen gas for treatment after the first metal layer 4 is patterned, so as to oxidize the surface layer of the first metal layer 4 and prevent short circuits. .
  • the beneficial effect of the present invention is to provide a display panel 100 and a manufacturing method of the display panel 100, by disposing the second inorganic insulating layer 6 in the bending area 20 on the second organic insulating layer 5, so as to avoid Residues of the second inorganic insulating layer 6 are generated in the first through holes 11 of the first signal line 41 on the metal layer 4, thereby preventing stress concentration or film peeling of the first signal line 41 under bending stress, and improving Product yield.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明提供一种显示面板及其制作方法。显示面板定义有显示区和弯折区，所述显示面板包括层叠设置的柔性衬底、第一无机绝缘层、第一有机绝缘层、第一金属层、第二有机绝缘层、第二无机绝缘层、第二金属层和第三有机绝缘层。显示面板制作方法包括步骤：提供一柔性衬底、制作第一无机绝缘层、制作第一有机绝缘层、制作第一金属层、制作第二有机绝缘层、制作第二无机绝缘层、制作第二金属层和制作第三有机绝缘层。本发明通过将弯折区的第二无机绝缘层设于第二有机绝缘层上，来避免第一金属层的通孔内产生第二无机绝缘层的残留物，从而防止应力集中或膜层剥离的风险，提高产品良率。

Description

显示面板及其制作方法 技术领域
本发明涉及显示领域，尤其涉及一种显示面板及其制作方法。
 背景技术
如图1、图2所示，为现有的柔性显示面板平面结构和截面结构示意图，柔性显示面板90包括显示区91和非显示区92，非显示区92包括围绕显示区91的外围区921、弯折区922和电路板区923。柔性显示面板90通常采用柔软可弯曲的塑料基板，适合窄边框显示设备的制作。柔性显示面板90通过在外围讯号走线区设计一个弯折区922，从而将讯号走线区和电路板区923折叠置于柔性显示面板90侧方或下方，从而减小非显示区92的占比，实现窄边框设计。
如图3、图4所示，为弯折区922的结构示意图，从下至上依次包括：柔性衬底901、第一无机绝缘层902、第一有机绝缘层903、第一金属层904（包含多条第一讯号线914）、第二无机绝缘层905、第二有机绝缘层906、第二金属层907（包含多条第二讯号线917）、第三有机绝缘层908。其中，第一无机绝缘层902为叠层结构，与显示区91内缓冲层、阻隔层、栅极绝缘层、层间绝缘层等为相同膜层。第二无机绝缘层905目的是在无第二有机绝缘层906的部分区域仍然保持第一金属层904和第二金属层907的相互绝缘。第一无机绝缘层902和第二无机绝缘层905在弯折区912被全部蚀刻移除。第一讯号线914、第二讯号线917为数据讯号线和Power讯号线。且在第一讯号线914和第二讯号线917上设置有圆形通孔93，目的是减小讯号线弯曲时所受的弯曲应力，减小其弯曲失效的风险。
然而，这种开孔设计却容易引发另一个问题，即在第一讯号线904的通孔93处产生第二无机绝缘层905的残留物94。该残留物94对讯号线的应力释放起到反作用，且会恶化第二有机绝缘层906和第一讯号线914的附着力。从而导致在弯曲应力下，第一讯号线914的应力集中或膜层剥离的风险，降低产品良率。
因此，亟待提供一种显示面板及其制作方法，以克服现有技术中存在的问题。
 技术问题
本发明的目的在于，提供一种显示面板及其制作方法，来解决现有技术中第一讯号线的通孔处产生第二无机绝缘层的残留物的问题。从而防止在弯曲应力下第一讯号线产生应力集中或膜层剥离的风险，提高产品良率。
 技术解决方案
为了解决上述问题，本发明提供一种显示面板，定义有显示区和弯折区，所述显示面板包括层叠设置的柔性衬底、第一无机绝缘层、第一有机绝缘层、第一金属层、第二有机绝缘层、第二无机绝缘层、第二金属层和第三有机绝缘层。具体地讲，所述第一无机绝缘层设于所述柔性衬底上；所述第一有机绝缘层设于所述弯折区的所述第一无机绝缘层上；所述第一金属层设于所述第一有机绝缘层上，所述弯折区的所述第一金属层上设有间隔设置的第一通孔；所述第二有机绝缘层设于所述第一金属层上，所述第一通孔内填充所述第二有机绝缘层；所述第二无机绝缘层设于所述显示区的所述第二有机绝缘层上；所述第二金属层设于所述第二无机绝缘层上，所述弯折区的所述第二金属层上设有间隔设置的第二通孔；所述第三有机绝缘层设于所述第二金属层上，所述第二通孔内填充所述第二有机绝缘层。
进一步的，其中所述第一通孔、所述第二通孔均呈圆形。
进一步的，其中所述第二通孔与所述第一通孔相对设置。
进一步的，其中所述第一无机绝缘层包括依次层叠设置的缓冲层、阻隔层栅极绝缘层和层间绝缘层。具体地讲，所述缓冲层设于所述柔性衬底上；所述阻隔层设于所述缓冲层上；所述栅极绝缘层设于所述阻隔层上；所述层间绝缘层设于所述栅极绝缘层上。
进一步的，其中所述第一金属层包括多条第一讯号线，所述第一讯号线等距离间隔设置。
进一步的，其中所述第二金属层包括多条第二讯号线，所述第二讯号线等距离间隔设置。
进一步的，其中所述弯折区的所述第一无机绝缘层还包括第三通孔，所述第一有机绝缘层设于所述第三通孔内；所述第一有机绝缘层与所述第一无机绝缘层的厚度相等。
本发明还提供一种显示面板的制作方法，包括以下步骤：
提供一柔性衬底；
制作第一无机绝缘层，在所述柔性衬底上通过沉积方式制作所述第一无机绝缘层；
制作第一有机绝缘层，在所述弯折区的所述第一无机绝缘层上蚀刻制作第三通孔，并通过在所述第三通孔内涂布有机物方式制作所述第一有机绝缘层；
制作第一金属层，在所述第一有机绝缘层上通过沉积和图形化方式制作所述第一金属层，所述第一金属层上设有间隔设置的第一通孔；
制作第二有机绝缘层，在所述第一金属层上通过涂布和图形化方式制作所述第二有机绝缘层，所述第一通孔内填充所述第二有机绝缘层；
制作第二无机绝缘层，在所述第二有机绝缘层上通过沉积方式制作所述第二无机绝缘层，通过蚀刻移除所述弯折区的所述第二有机绝缘层；
制作第二金属层，在所述第二无机绝缘层上通过沉积和图形化方式制作所述第二金属层，所述第二金属层上设有间隔设置的第二通孔；以及
制作第三有机绝缘层，在所述第二金属层上通过涂布和图形化方式制作所述第三有机绝缘层，所述第二通孔内填充所述第二有机绝缘层。
进一步的，其中所述制作第一无机绝缘层具体包括以下步骤：
制作缓冲层，在所述柔性衬底上通过沉积方式制作所述缓冲层；
制作阻隔层，在所述缓冲层上通过沉积方式制作所述阻隔层；
制作栅极绝缘层，在所述阻隔层上通过沉积方式制作所述栅极绝缘层；以及
制作层间绝缘层，在所述栅极绝缘层上通过沉积方式制作所述层间绝缘层。
进一步的，其中所述第一金属层通过图形化方式形成多条第一讯号线；所述第二金属层通过图形化方式形成多条第二讯号线。
进一步的，其中所述制作第一金属层步骤还包括在所述第一金属层被图形化方式后通氧气进行处理，用于氧化所述第一金属层表层。
 有益效果
本发明的有益效果是：提供一种显示面板及其显示面板的制作方法，通过将弯折区的第二无机绝缘层设于第二有机绝缘层上，来避免第一金属层的通孔内产生第二无机绝缘层的残留物，从而防止在弯曲应力下第一讯号线产生应力集中或膜层剥离的风险，提高产品良率。
 附图说明
图1为现有的柔性显示面板平面结构示意图；
图2为图1中的柔性显示面板截面图；
图3为图1中的柔性显示面板的弯折区结构示意图；
图4为图3中A-A方向截面图；
图5为本发明一实施例中的显示面板的结构示意图；
图6为图5中B-B方向截面图；
图7为图5中C-C方向截面图；
图8为本发明一实施例中的显示面板的制作流程图；
图9为图8中步骤S2的制作流程图。
图中部件标识如下：
100、显示面板，10、显示区，20、弯折区；
1、柔性衬底，2、第一无机绝缘层，3、第一有机绝缘层,4、第一金属层，
5、第二有机绝缘层，6、第二无机绝缘层，7、第二金属层,
8、第三有机绝缘层，11、第一通孔，12、第二通孔，13、第三通孔，
21、缓冲层，22、阻隔层，23、栅极绝缘层，24、层间绝缘层,
41、第一讯号线，71、第二讯号线。
 本发明的实施方式
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
请参阅图5所示，本发明提供一种显示面板100，定义有显示区10和弯折区20，所述显示面板100包括层叠设置的柔性衬底1、第一无机绝缘层2、第一有机绝缘层3、第一金属层4、第二有机绝缘层5、第二无机绝缘层6、第二金属层7和第三有机绝缘层8。具体地讲，所述第一无机绝缘层2设于所述柔性衬底1上；所述第一有机绝缘层3设于所述弯折区20的所述第一无机绝缘层2上；所述第一金属层4设于所述第一有机绝缘层3上，其中在所述弯折区20的所述第一金属层4上设有间隔设置的第一通孔11；所述第二有机绝缘层5设于所述第一金属层4上，所述第一通孔11内填充所述第二有机绝缘层5；所述第二无机绝缘层6设于所述显示区10的所述第二有机绝缘层5上；所述第二金属层7设于所述第二无机绝缘层6上，其中在所述弯折区20的所述第二金属层7上设有间隔设置的第二通孔12；所述第三有机绝缘层8设于所述第二金属层7上，所述第二通孔12内填充所述第二有机绝缘层5。设置所述第二无机绝缘层6目的是在无所述第二有机绝缘层5的部分区域仍然保持所述第一金属层4和所述第二金属层7的相互绝缘。
在本发明实施例中，所述第一通孔11、所述第二通孔12均呈圆形。设置所述第一通孔11、所述第二通孔12目的是减小所述第一金属层4和所述第二金属层7在弯曲时所受的弯曲应力，减小其弯曲失效的风险。
在本发明实施例中，所述第二通孔12与所述第一通孔11相对设置。
在本发明实施例中，所述弯折区20的所述第一无机绝缘层2还包括第三通孔13，所述第一有机绝缘层3设于所述第三通孔13内，或称所述第一有机绝缘层3填充于所述第三通孔13内；所述第一有机绝缘层3与所述第一无机绝缘层2的厚度相等。
请参阅图5所示，在本发明实施例中，所述第一无机绝缘层2包括依次层叠设置的缓冲层21、阻隔层22、栅极绝缘层23和层间绝缘层24。具体地讲，所述缓冲层21设于所述柔性衬底1上；所述阻隔层22设于所述缓冲层21上；所述栅极绝缘层23设于所述阻隔层22上；所述层间绝缘层24设于所述栅极绝缘层23上。
请参阅图6所示，在本发明实施例中，所述第一金属层4包括多条第一讯号线41，所述第一讯号线41等距离间隔设置。所述第一讯号线41为数据讯号线，实现数据信号传输。尽管图中只表现出两条第一讯号线41，但实际上，可以根据实际需要而改变所述第一讯号线41的数量。
请参阅图7所示，在本发明实施例中，所述第二金属层7包括多条第二讯号线71，所述第二讯号线71等距离间隔设置。所述第二讯号线71为Power讯号线，实现扫描信号传输。同样地，尽管图中只表现出两条第二讯号线71，但实际上，可以根据实际需要而改变所述第二讯号线71的数量。
请参阅图8所示，本发明还提供一种显示面板100的制作方法，包括以下步骤：
S1、提供一柔性衬底1；
S2、制作第一无机绝缘层2，在所述柔性衬底1上通过沉积方式制作所述第一无机绝缘层2；
S3、制作第一有机绝缘层3，在所述弯折区20的所述第一无机绝缘层2上蚀刻制作第三通孔13，并通过在所述第三通孔13内涂布有机物方式制作所述第一有机绝缘层3；
S4、制作第一金属层4，在所述第一有机绝缘层3上通过沉积和图形化方式制作所述第一金属层4，所述第一金属层4上设有间隔设置的第一通孔11；
S5、制作第二有机绝缘层5，在所述第一金属层4上通过涂布和图形化方式制作所述第二有机绝缘层5，所述第一通孔11内填充所述第二有机绝缘层5；
S6、制作第二无机绝缘层6，在所述第二有机绝缘层5上通过沉积方式制作所述第二无机绝缘层6，通过蚀刻移除所述弯折区20的所述第二有机绝缘层5；
S7、制作第二金属层7，在所述第二无机绝缘层6上通过沉积和图形化方式制作所述第二金属层7，所述第二金属层7上设有间隔设置的第二通孔12；以及
S8、制作第三有机绝缘层8，在所述第二金属层7上通过涂布和图形化方式制作所述第三有机绝缘层8，所述第二通孔12内填充所述第二有机绝缘层5。
请参阅图9所示，在本发明实施例中，所述制作第一无机绝缘层2步骤S2具体包括以下步骤：
S21、制作缓冲层21，在所述柔性衬底1上通过沉积方式制作所述缓冲层21；
S22、制作阻隔层22，在所述缓冲层21上通过沉积方式制作所述阻隔层22；
S23、制作栅极绝缘层23，在所述阻隔层22上通过沉积方式制作所述栅极绝缘层23；以及
S24、制作层间绝缘层24，在所述栅极绝缘层23上通过沉积方式制作所述层间绝缘层24。
请参阅图6、图7所示，在本发明实施例中，所述第一金属层4通过图形化方式形成多条第一讯号线41；所述第二金属层7通过图形化方式形成多条第二讯号线71。
在本发明实施例中，所述制作第一金属层步骤S4还包括在所述第一金属层4被图形化方式后通氧气进行处理，用于氧化所述第一金属层4表层,杜绝短路。
本发明的有益效果是：提供一种显示面板100及其显示面板100的制作方法，通过将弯折区20的第二无机绝缘层6设于第二有机绝缘层5上，来避免在第一金属层4上的第一讯号线41的第一通孔11内产生第二无机绝缘层6的残留物，从而防止在弯曲应力下第一讯号线41产生应力集中或膜层剥离的风险，提高产品良率。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种显示面板，定义有显示区和弯折区，其中，所述显示面板包括：
    柔性衬底；
    第一无机绝缘层，设于所述柔性衬底上；
    第一有机绝缘层，设于所述弯折区的所述第一无机绝缘层上；
    第一金属层，设于所述第一有机绝缘层上，其中在所述弯折区的所述第一金属层上设有间隔设置的第一通孔；
    第二有机绝缘层，设于所述第一金属层上，所述第一通孔内填充所述第二有机绝缘层；
    第二无机绝缘层，设于所述显示区的所述第二有机绝缘层上；
    第二金属层，设于所述第二无机绝缘层上，其中在所述弯折区的所述第二金属层上设有间隔设置的第二通孔；以及
    第三有机绝缘层，设于所述第二金属层上，所述第二通孔内填充所述第二有机绝缘层。
  2. 根据权利要求1所述的显示面板，其中，
    所述第一通孔、所述第二通孔均呈圆形。
  3. 根据权利要求1所述的显示面板，其中，
    所述第二通孔与所述第一通孔相对设置。
  4. 根据权利要求1所述的显示面板，其中，
    所述第一无机绝缘层包括
    缓冲层，设于所述柔性衬底上；
    阻隔层，设于所述缓冲层上；
    栅极绝缘层，设于所述阻隔层上；以及
    层间绝缘层，设于所述栅极绝缘层上。
  5. 根据权利要求1所述的显示面板，其中，所述第一金属层包括多条第一讯号线，所述第一讯号线等距离间隔设置。
  6. 根据权利要求1所述的显示面板，其中，所述第二金属层包括多条第二讯号线，所述第二讯号线等距离间隔设置。
  7. 根据权利要求1所述的显示面板，其中，所述弯折区的所述第一无机绝缘层还包括第三通孔，所述第一有机绝缘层设于所述第三通孔内；所述第一有机绝缘层与所述第一无机绝缘层的厚度相等。
  8. 一种如权利要求1所述的显示面板的制作方法，包括以下步骤：
    提供一柔性衬底；
    制作第一无机绝缘层，在所述柔性衬底上通过沉积方式制作所述第一无机绝缘层；
    制作第一有机绝缘层，在所述弯折区的所述第一无机绝缘层上蚀刻制作第三通孔，并通过在所述第三通孔内涂布有机物方式制作所述第一有机绝缘层；
    制作第一金属层，在所述第一有机绝缘层上通过沉积和图形化方式制作所述第一金属层，所述第一金属层上设有间隔设置的第一通孔；
    制作第二有机绝缘层，在所述第一金属层上通过涂布和图形化方式制作所述第二有机绝缘层，所述第一通孔内填充所述第二有机绝缘层；
    制作第二无机绝缘层，在所述第二有机绝缘层上通过沉积方式制作所述第二无机绝缘层，通过蚀刻移除所述弯折区的所述第二有机绝缘层；
    制作第二金属层，在所述第二无机绝缘层上通过沉积和图形化方式制作所述第二金属层，所述第二金属层上设有间隔设置的第二通孔；以及
    制作第三有机绝缘层，在所述第二金属层上通过涂布和图形化方式制作所述第三有机绝缘层，所述第二通孔内填充所述第二有机绝缘层。
  9. 根据权利要求8所述的显示面板的制作方法，其中，所述制作第一无机绝缘层具体包括以下步骤：
    制作缓冲层，在所述柔性衬底上通过沉积方式制作所述缓冲层；
    制作阻隔层，在所述缓冲层上通过沉积方式制作所述阻隔层；
    制作栅极绝缘层，在所述阻隔层上通过沉积方式制作所述栅极绝缘层；以及
    制作层间绝缘层，在所述栅极绝缘层上通过沉积方式制作所述层间绝缘层。
  10. 根据权利要求8所述的显示面板的制作方法，其中，所述制作第一金属层步骤还包括在所述第一金属层被图形化方式后通氧气进行处理，用于氧化所述第一金属层表层。
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