WO2020207422A1 - 显示面板及其制作方法、显示装置 - Google Patents

显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2020207422A1
WO2020207422A1 PCT/CN2020/083890 CN2020083890W WO2020207422A1 WO 2020207422 A1 WO2020207422 A1 WO 2020207422A1 CN 2020083890 W CN2020083890 W CN 2020083890W WO 2020207422 A1 WO2020207422 A1 WO 2020207422A1
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WO
WIPO (PCT)
Prior art keywords
circuit
insulating substrate
display panel
display
conductor
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Application number
PCT/CN2020/083890
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English (en)
French (fr)
Inventor
李树磊
黄华
谢昌翰
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/042,625 priority Critical patent/US11538892B2/en
Publication of WO2020207422A1 publication Critical patent/WO2020207422A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the embodiments of the present disclosure relate to a display panel, a display device including the display panel, and a method of manufacturing the display panel.
  • the display panel includes many circuits to realize functions such as driving and control.
  • these circuits are provided in the non-display area at the periphery of the display area.
  • these circuits arranged at the periphery of the display area disadvantageously increase the frame area of the display panel, which goes against the development trend of increasingly miniaturized, narrow frame or even no frame in the field of display panels.
  • flexible display panels achieve a certain degree of flexibility through the use of flexible substrates, and can even be folded and curled like paper, which completely subverts people's understanding of traditional display panels and is currently one of the hot spots in the field of display technology.
  • the embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device.
  • At least one embodiment of the present disclosure provides a display panel including: an insulating substrate; a first circuit located on a first side of the insulating substrate; and a second circuit located on a second side of the insulating substrate
  • the display panel includes a display surface, the first side and the second side of the insulating substrate are opposed in a first direction perpendicular to the display surface, and the first circuit and the The second circuit is electrically connected by a conductor penetrating the insulating substrate in the first direction.
  • the display surface includes a display area and a non-display area surrounding the display area, and the conductor is located in the non-display area.
  • the display surface includes a display area, and the conductor is located in the display area.
  • the display panel further includes an insulating layer located on a side of the first circuit away from the insulating substrate and exposing a part of the first circuit; The insulating layer penetrates in the first direction.
  • the conductive body is provided in multiple; the first circuit includes a driving transistor, a light emitting unit, and gate lines and data lines extending in different directions; and the insulating layer covers The driving transistor, the gate line and the data line, and the light-emitting unit is exposed; the control terminal of the driving transistor is connected to the gate line, the first terminal of the driving transistor is connected to the data line, and the driving The second end of the transistor is connected to the first electrode of the light-emitting unit; and the gate line, the data line, and the second electrode of the light-emitting unit are electrically connected to the second circuit through a conductor.
  • the conductive body is provided in multiple;
  • the first circuit includes a driving transistor, a light emitting unit, and gate lines and data lines extending in different directions;
  • the control terminal is connected to the gate line, the first terminal of the driving transistor is connected to the data line, and the second terminal of the driving transistor is connected to the first electrode of the light-emitting unit;
  • the insulating layer covers the Gate lines, data lines, and parts of the driving transistor other than the second terminal, and expose the light-emitting unit and the second terminal of the driving transistor; and the gate line, the data line, and the The second electrode of the light-emitting unit is electrically connected to the second circuit through a conductor.
  • the conductor includes a conductive part formed by filling a conductive material in a via hole penetrating the insulating substrate in the first direction, and in the first direction
  • the conductive pillar penetrates the insulating layer, and the conductive pillar is electrically connected to the conductive portion.
  • the conductive portion is in contact with the conductive pillar.
  • the via has a shape that tapers from the second side to the first side of the insulating substrate.
  • the tapered shape has a slope angle of 45°-90°.
  • the cross-sectional area of the side of the conductive portion close to the first circuit is smaller than that of the cross-section of the side of the conductive portion close to the second circuit. area.
  • the display panel is flexible, and the insulating substrate includes a flexible insulating material.
  • the first circuit includes one or more of the following: a gate driving circuit and a driving transistor electrically connected to each other; a pixel driving circuit; a peripheral circuit; and compensation Circuit; and the second circuit includes an integrated drive circuit.
  • the first circuit is formed before the second circuit.
  • At least one embodiment of the present disclosure also provides a display device including any of the above-mentioned display panels.
  • At least one embodiment of the present disclosure further provides a method for manufacturing a display panel, including: providing a first circuit on a first side of an insulating substrate; providing a second circuit on a second side of the insulating substrate, wherein The first side and the second side of the insulating substrate are opposed to each other in a first direction, the first direction being perpendicular to the display surface of the display panel; and the insulating substrate is provided to penetrate through the insulating substrate in the first direction
  • the conductor makes the first circuit and the second circuit electrically connected through the conductor.
  • providing the first circuit, providing the second circuit, and providing the electrical conductor are sequentially performed in the following order: providing the first circuit, providing the electrical conductor, and providing The second circuit.
  • the method further includes turning over the insulating substrate and forming in the insulating substrate Via.
  • the via has a shape that tapers from the second side to the first side of the insulating substrate.
  • the method further includes: providing an insulating layer on a side of the first circuit away from the insulating substrate, the insulating layer exposing a part of the first circuit; The conductive body penetrates the insulating layer in the first direction.
  • the providing a conductor penetrating the insulating substrate in the first direction includes: forming a via hole penetrating the insulating substrate in the first direction; A conductive pillar penetrating the insulating layer is formed in the first direction; and the via hole is filled with a conductive material to form a conductive portion; the conductive pillar is in contact with the conductive portion.
  • forming the conductive pillar is performed before forming the via hole penetrating the insulating substrate.
  • the method further includes: before providing the first circuit and the second circuit, providing the insulating substrate on a first carrier, wherein the insulating substrate is The second side faces the first carrier; after the first circuit is provided and before the second circuit is provided, the insulating substrate is bonded to the second carrier, wherein the first side of the insulating substrate To the second carrier; after bonding the insulating substrate to the second carrier and before providing the second circuit, removing the first carrier; and after providing the second circuit, The second carrier is removed; the insulating substrate is made of a flexible insulating material.
  • the display surface includes a display area and a non-display area surrounding the display area, and the conductor is located in the non-display area.
  • the display surface includes a display area, and the conductor is located in the display area.
  • FIG. 1 schematically illustrates a cross-sectional view of a display panel according to an embodiment of the present disclosure.
  • Fig. 2 schematically illustrates a top view of the display panel shown in Fig. 1.
  • Fig. 3 schematically illustrates a bottom view of the display panel shown in Fig. 1.
  • FIG. 4 schematically illustrates a cross-sectional view of a display panel according to another embodiment of the present disclosure.
  • 5A-5C schematically illustrate top views of a display panel according to an embodiment of the present disclosure.
  • FIGS. 6A-6C schematically illustrate top views of a display panel according to another embodiment of the present disclosure.
  • FIG. 7 schematically illustrates a cross-sectional view of a display panel according to still another embodiment of the present disclosure.
  • FIG. 8 schematically illustrates a flowchart of a manufacturing method of a display panel according to an embodiment of the present disclosure.
  • FIGS. 9A-9L illustrate schematic cross-sectional views of various steps of a manufacturing method of a display panel according to an embodiment of the present disclosure.
  • FIG. 1 is a cross-sectional view of a display panel according to an embodiment of the present disclosure
  • FIG. 2 is a top view thereof
  • FIG. 3 is a bottom view thereof.
  • the display surface DS of the display panel 100 includes a display area A-A' and a non-display area B-B' surrounding the display area A-A'.
  • the display surface DS is the top surface of the display panel 100.
  • the non-display surface NDS is opposite to the display surface DS.
  • the display panel 100 includes an insulating substrate 101, a first circuit 102 located on a first side S1 of the insulating substrate 101, and a second circuit 103 located on a second side S2 of the insulating substrate 101.
  • the first side S1 and the second side S2 of the insulating substrate 101 are opposed to each other in a first direction D-D' perpendicular to the display surface DS, and the first circuit 102 and the second circuit 103 are electrically connected by a conductor 104 .
  • the conductor 104 penetrates the insulating substrate 101 in the first direction D-D' and is located in the non-display area B-B'.
  • the first circuit 102 and the second circuit 103 are electrically connected to the conductor 104 through wires W, respectively.
  • the cross section of the conductor 104 is shown as a circle in FIGS. 1 to 3, it is not limited thereto. In other embodiments of the present disclosure, the conductive body 104 may have a cross section of any other shape, and as will be described below, the conductive body 104 may not be a regular cylinder as shown in FIG. 1. It should also be pointed out that although the first circuit 102 and the second circuit 103 are shown as being electrically connected to the conductor 104 through a wire W in FIGS. 1 to 3, they are not limited thereto. In other embodiments of the present disclosure, the first circuit 102 and/or the second circuit 103 may be directly electrically connected to the conductor 104 without intermediate components.
  • the frame area of the display panel can be significantly reduced, and the integration of the interconnect structure in the display panel can be improved, thereby facilitating the miniaturization and narrow frame of the display panel.
  • FIG. 4 is a schematic cross-sectional view of a display panel according to another embodiment of the present disclosure.
  • the display panel shown in FIG. 4 has the same partial structure and/or configuration as the display panel shown in FIG. 1. Therefore, elements having substantially the same functions as those in the embodiment shown in FIG. 1 will be numbered the same here and will not be described and/or illustrated in detail here for the sake of brevity.
  • the display panel 400 in FIG. 4 further includes an insulating layer 405 on the side of the first circuit 102 facing away from the insulating substrate 101 and exposing a portion of the first circuit 102, and The conductor 104 also penetrates the insulating layer 405 in the first direction D-D'.
  • the display panel 500 is an OLED display panel.
  • the insulating layer 405 and above are removed in FIG. 5A, and the OLED light emitting function layer and above are removed in FIG. 5B, and FIG. 5C is Top view of the OLED display panel.
  • the first circuit 102 includes a driving transistor TFT, a light emitting unit OLED, and a gate line GATE and a data line DATA extending in different directions.
  • the insulating layer 405 covers the driving transistor TFT, the gate line GATE, and the data line DATA, and exposes the light emitting unit OLED.
  • the control terminal g of the driving transistor TFT is connected to the gate line GATE, the first terminal s is connected to the data line DATA, and the second terminal d is connected to the first electrode e1 of the light emitting unit OLED.
  • the gate line GATE, the data line DATA, and the second electrode e2 of the light-emitting unit OLED are electrically connected to the second circuit 103 through the conductor 104, and can be respectively applied with signals.
  • the light emitting unit OLED includes a first electrode e1, a second electrode e2, and a functional stack sandwiched between the first electrode e1 and the second electrode e2.
  • the functional laminate may include a light-emitting layer, and may also include at least one of an electron transport layer, a hole transport layer, an electron injection layer, and a hole injection layer.
  • the display panel 600 is an LED display panel.
  • the insulating layer 405 and above are removed in FIG. 6A
  • the light-emitting unit and above are removed in FIG. 6B
  • FIG. 6C is the LED The top view of the display panel.
  • the first circuit 102 includes a driving transistor TFT, a light emitting unit LED, and a gate line GATE and a data line DATA extending in different directions.
  • the control terminal g of the driving transistor TFT is connected to the gate line GATE, the first terminal s is connected to the data line DATA, and the second terminal d is connected to the first electrode e1 of the light emitting unit LED.
  • the insulating layer 405 covers portions of the gate line GATE, the data line DATA, and the driving transistor TFT except for the second terminal d thereof, and exposes the light emitting unit LED and the second terminal d of the driving transistor TFT.
  • the gate line GATE, the data line DATA, and the second electrode e2 of the light-emitting unit LED are electrically connected to the second circuit 103 through the conductor 104, and can be respectively applied with signals.
  • FIG. 7 is a schematic cross-sectional view of a display panel according to still another embodiment of the present disclosure.
  • the display panel shown in FIG. 7 has the same structure and/or configuration as the display panel shown in FIG. 4, except for the conductor 704. Therefore, elements having substantially the same functions as those in the embodiment shown in FIG. 4 will be numbered the same here and will not be described and/or illustrated in detail here for the sake of brevity.
  • the conductor 704 in FIG. 7 includes a conductive portion P1 penetrating the insulating substrate 101 in the first direction D-D', and in the first direction D-D'
  • the conductive pillar P penetrates the insulating layer 405.
  • the via hole V1 penetrates the insulating substrate 101 and is filled with a conductive material to form a conductive portion P1.
  • the via hole V2 penetrates the insulating layer 405 and is filled with a conductive material to form a conductive pillar P.
  • the conductive pillar P is electrically connected to the conductive portion P1. As shown in FIG. 7, the conductive portion P1 is in contact with the conductive pillar P, but it is not limited thereto.
  • the drawings of the embodiments of the present disclosure take the via hole V1 located in the non-display area B-B' as an example for description, however, it is not limited to this.
  • the via hole V1 may be located in the display area A-A', so that the conductive portion P1 is also located in the display area A-A'.
  • the drawings of the embodiments of the present disclosure take the via hole V2 located in the non-display area B-B' as an example for description, however, it is not limited to this.
  • the via hole V2 may be located in the display area A-A', so that the conductive pillar P is also located in the display area A-A'.
  • the conductive body can be provided by separately providing the conductive portion P1 and the conductive pillar P, thereby reducing process difficulty and process cost.
  • the via hole V1 has a shape tapering from the second side to the first side of the insulating substrate 101.
  • the tapered shape has a slope angle of 45°-90°.
  • the cross-sectional area of the side of the conductive part P1 close to the first circuit 102 is smaller than the area of the cross-section of the conductive part P1 close to the second circuit 103.
  • the conductive portion P1 is in contact with the sidewall where the via hole V1 is formed.
  • the first circuit includes one or more of the following: a gate driving circuit and a driving transistor electrically connected to each other; a pixel driving circuit; a peripheral circuit; and a compensation circuit.
  • the second circuit includes an integrated driving circuit, which is used to provide a gate driving signal, a source driving signal, a power level, a control signal, etc., for the display panel.
  • Another aspect of the present disclosure provides a display device including any of the above-mentioned display panels.
  • the frame area of the display device can be significantly reduced, and the integration of the interconnect structure in the display device can be improved, thereby facilitating the miniaturization and narrowing of the frame of the display device.
  • the embodiment of the present disclosure also provides a manufacturing method of the above-mentioned display panel.
  • the display surface of the display panel includes a display area and a non-display area surrounding the display area.
  • a first circuit is provided on the first side of the insulating substrate.
  • the first circuit may be a gate driving circuit and a driving transistor, a pixel driving circuit, a peripheral circuit, a compensation circuit, etc., which are electrically connected to each other, and may adopt process steps commonly used in the art to provide the first circuit, such as deposition, light Engraving, etching, sputtering, etc.
  • a second circuit is provided on the second side of the insulating substrate, wherein the first side and the second side of the insulating substrate are opposed in a first direction perpendicular to the display surface.
  • the second circuit may include an integrated driving circuit, which is used to provide a gate driving signal, a source driving signal, a power supply level, a control signal, etc., for the display panel.
  • a conductor penetrating the insulating substrate in the first direction is provided in the non-display area, so that the first circuit and the second circuit are electrically connected through the conductor.
  • the frame area of the display panel can be significantly reduced, and the integration level of the interconnection structure in the display panel can be improved, thereby facilitating the miniaturization and narrow frame of the display panel .
  • the above method further includes, at step S804, providing an insulating layer on the side of the first circuit away from the insulating substrate, and the insulating layer exposes a portion of the first circuit.
  • the conductor also penetrates the insulating layer in the first direction.
  • step S803 may include: forming a via hole V1 penetrating the insulating substrate in the first direction; forming a conductive pillar P penetrating the insulating layer in the first direction; and filling the via hole V1 with a conductive material
  • the conductive portion P1 is formed.
  • the conductive pillar P is in electrical contact with the conductive portion P1.
  • step S803 may sequentially include the following steps: forming a conductive pillar P penetrating the insulating layer in the first direction; forming a via hole V1 penetrating the insulating substrate in the first direction; and using conductive The material fills the via hole V1 to form the conductive portion P1.
  • FIGS. 9A-9L illustrate schematic cross-sectional views of various steps of a method for manufacturing a flexible display panel according to an embodiment of the present disclosure.
  • an insulating substrate 901 is first provided on the first carrier 900, wherein the second side S2 of the insulating substrate 901 faces the first carrier 900.
  • the first carrier 900 may be a glass substrate in order to provide support for the insulating substrate 901.
  • the insulating substrate 901 is made of a flexible insulating material, such as polyimide (PI), polydimethylsiloxane (PDMS), and the like.
  • a conductive material layer 902 is deposited on the insulating substrate 901.
  • the conductive material layer may have a thickness of 2-10 ⁇ m and may include copper.
  • the conductive material layer 902 is patterned to form a conductive pillar P.
  • the first portion 9031 of the first circuit is formed on the insulating substrate 901 by processes such as deposition and etching, and the first portion 9031 is in electrical contact with the conductive pillar P.
  • the first part 9031 of the first circuit may be the driving transistor TFT, the gate line GATE, and the data line DATA in the embodiments shown in FIGS. 5A-5C.
  • the first part 9031 of the first circuit may be a part of the gate line GATE, the data line DATA and the driving transistor TFT in the embodiment shown in FIGS. 6A-6C except for the second terminal d thereof.
  • an insulating layer 904 is deposited on the first portion 9031 of the first circuit, the insulating layer 904 covers the first portion 9031 of the first circuit, and the conductive pillar P is exposed.
  • the second portion 9032 of the first circuit is formed on the insulating layer 904, so that the second portion 9032 is in electrical contact with the conductive pillar P.
  • the second part 9032 of the first circuit may be the light-emitting unit OLED in the embodiment shown in FIGS. 5A-5C.
  • the second part 9032 of the first circuit may be the second terminal d of the light-emitting unit LED and the driving transistor TFT in the embodiment shown in FIGS. 6A-6C.
  • the insulating substrate 901 is bonded to the second carrier 905, wherein the first side S1 of the insulating substrate 901 faces the second carrier 905.
  • an adhesive material 907 may be used to bond the first side S1 of the insulating substrate 901 to the second carrier 905 by an adhesive method, so as to provide support for the insulating substrate 901.
  • the second carrier 905 may also be a glass substrate.
  • the first carrier 900 is removed from the insulating substrate 901, as shown in FIG. 9H.
  • the first carrier 900 can be removed from the insulating substrate 901 by means of laser lift-off.
  • a blind hole BV is formed in the insulating substrate 901 by etching. Then, a conductive material is filled into the blind hole BV, for example, by electroplating, to form a conductive portion V, as shown in FIG. 9J.
  • the blind hole BV may have a shape tapering from the second side (upper side) of the insulating substrate 901 to the first side (lower side) of the insulating substrate 901 in order to facilitate filling of the conductive material.
  • a second circuit 906 is provided on the second side S2 of the insulating substrate 901, and the second circuit 906 is in electrical contact with the conductive portion V, and may include Integrated drive circuit.
  • the second carrier 905 is removed from the insulating substrate 901, for example, by removing the viscous material 907, to finally form a flexible display panel with high-density interconnections and a narrow frame, as shown in FIG. 9L.
  • a via hole filled with a conductive material is formed, so that the removal of the first carrier is not affected by the conductive material in the conductive via hole, so that a flexible display panel is easily obtained .
  • the first circuit is provided first, and then the via hole in the insulating substrate is provided, so that the removal of the first carrier is not affected, and the flexible display panel is easily obtained.
  • FIGS. 9A-9L two elements that are electrically connected to each other are shown as direct electrical contact, this is only schematic. In other embodiments of the present disclosure, two elements that are electrically connected to each other may be electrically connected to each other through wires or other intermediate elements.
  • the concept of the present disclosure can be widely applied to various electronic systems with display functions, such as displays, mobile phones, notebook computers, televisions, navigators, and so on.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种显示面板（100）、显示面板（100）的制作方法和包括该显示面板（100）的显示装置。该显示面板（100）包括：绝缘衬底（101）；位于绝缘衬底（101）的第一侧（S1）上的第一电路（102）；以及位于绝缘衬底（101）的第二侧（S2）上的第二电路（103）。绝缘衬底（101）的第一侧（S1）和第二侧（S2）在垂直于显示面板（100）的显示面（DS）的第一方向（D-D'）上相对，并且第一电路（102）和第二电路（103）通过在第一方向（D-D'）上贯穿绝缘衬底（101）的导电体（104）电气连接。

Description

显示面板及其制作方法、显示装置
相关申请的交叉引用
本专利申请要求于2019年4月11日递交的中国专利申请第201910289059.X号的优先权，出于所有目的，在此全文引用上述中国专利申请公开的内容以作为本公开的实施例的一部分。
技术领域
本公开的实施例涉及一种显示面板、包括该显示面板的显示装置，以及制作该显示面板的方法。
背景技术
显示面板包括许多电路，以实现驱动和控制等功能。通常，为了不影响显示面板的显示功能，在显示区外围的非显示区中提供这些电路。但是，设置在显示区外围的这些电路不利地增大了显示面板的边框区域，这有悖于显示面板领域中日益小型化、窄边框或甚至无边框的发展趋势。
另一方面，柔性显示面板通过采用柔性基板来实现一定的柔性，甚至可以像纸一样折叠、卷曲，因而彻底颠覆了人们对传统显示面板的认识，是目前显示技术领域的热点之一。
发明内容
本公开的实施例提供一种显示面板及其制作方法、显示装置。
本公开的至少一实施例提供一种显示面板，包括：绝缘衬底；位于所述绝缘衬底的第一侧上的第一电路；以及位于所述绝缘衬底的第二侧上的第二电路；所述显示面板包括显示面，所述绝缘衬底的所述第一侧和所述第二侧在垂直于所述显示面的第一方向上相对，并且所述第一电路和所述第二电路通过在所述第一方向上贯穿所述绝缘衬底的导电体电气连接。
根据本公开的一些实施例提供的显示面板，所述显示面包括显示区和围绕所述显示区的非显示区，所述导电体位于所述非显示区。
根据本公开的一些实施例提供的显示面板，所述显示面包括显示区，所述导电体位于所述显示区。
根据本公开的一些实施例提供的显示面板，显示面板还包括位于所述第一电路背离所述绝缘衬底的一侧上并且暴露所述第一电路的一部分的绝缘层；所述导电体在所述第一方向上贯穿所述绝缘层。
根据本公开的一些实施例提供的显示面板，所述导电体设置为多个；所述第一电路包括驱动晶体管、发光单元，以及沿不同方向延伸的栅线和数据线；所述绝缘层覆盖所述驱动晶体管、栅线和数据线，并且暴露所述发光单元；所述驱动晶体管的控制端与所述栅线连接，所述驱动晶体管的第一端与所述数据线连接，所述驱动晶体管的第二端与所述发光单元的第一电极连接；并且所述栅线、所述数据线以及所述发光单元的第二电极分别通过导电体与所述第二电路电气连接。
根据本公开的一些实施例提供的显示面板，所述导电体设置为多个；所述第一电路包括驱动晶体管、发光单元，以及沿不同方向延伸的栅线和数据线；所述驱动晶体管的控制端与所述栅线连接，所述驱动晶体管的第一端与所述数据线连接，所述驱动晶体管的第二端与所述发光单元的第一电极连接；所述绝缘层覆盖所述栅线、数据线和所述驱动晶体管除所述第二端之外的部分，并且暴露所述发光单元和所述驱动晶体管的第二端；并且所述栅线、所述数据线以及所述发光单元的第二电极分别通过导电体与所述第二电路电气连接。
根据本公开的一些实施例提供的显示面板，所述导电体包括在所述第一方向上贯穿所述绝缘衬底的过孔中填充导电材料形成的导电部，以及在所述第一方向上贯穿所述绝缘层的导电柱，并且所述导电柱与所述导电部电气连接。
根据本公开的一些实施例提供的显示面板，所述导电部与所述导电柱接触。
根据本公开的一些实施例提供的显示面板，所述过孔具有从所述绝缘衬底的所述第二侧向所述第一侧渐缩的形状。
根据本公开的一些实施例提供的显示面板，所述渐缩的形状具有45°-90°的坡度角。
根据本公开的一些实施例提供的显示面板，所述导电部的靠近所述第一电路的一侧的横截面的面积小于所述导电部的靠近所述第二电路的一侧的横截面的面积。
根据本公开的一些实施例提供的显示面板，所述显示面板是柔性的，并且所述绝缘衬底包括柔性绝缘材料。
根据本公开的一些实施例提供的显示面板，所述第一电路包括以下各项中的一个或多个：与彼此电气连接的栅极驱动电路和驱动晶体管；像素驱动电路；外围电路；以及补偿电路；并且所述第二电路包括集成驱动电路。
根据本公开的一些实施例提供的显示面板，所述第一电路先于所述第二电路形成。
本公开的至少一实施例还提供一种显示装置，包括上述任一显示面板。
本公开的至少一实施例还提供一种显示面板的制作方法，包括：在绝缘衬底的第一侧上提供第一电路；在所述绝缘衬底的第二侧上提供第二电路，其中所述绝缘衬底的第一侧和第二侧在第一方向上相对，所述第一方向垂直于所述显示面板的显示面；以及提供在所述第一方向上贯穿所述绝缘衬底的导电体，使得所述第一电路和所述第二电路通过所述导电体电气连接。
根据本公开的一些实施例提供的方法，提供所述第一电路、提供所述第二电路以及提供所述导电体按照如下顺序依次进行：提供所述第一电路、提供所述导电体以及提供所述第二电路。
根据本公开的一些实施例提供的方法，在提供所述第一电路之后，并在提供所述导电体之前，所述方法还包括翻转所述绝缘衬底，并在所述绝缘衬底中形成过孔。
根据本公开的一些实施例提供的方法，所述过孔具有从所述绝缘衬底的所述第二侧向所述第一侧渐缩的形状。
根据本公开的一些实施例提供的方法，该方法还包括：在所述第一电路背离所述绝缘衬底的一侧上提供绝缘层，所述绝缘层暴露所述第一电路的一部分；所述导电体在所述第一方向上贯穿所述绝缘层。
根据本公开的一些实施例提供的方法，所述提供在所述第一方向上贯穿所述绝缘衬底的导电体包括：在所述第一方向上形成贯穿所述绝缘衬底的过孔；在所述第一方向上形成贯穿所述绝缘层的导电柱；以及采用导电材料填充所述过孔形成导电部；所述导电柱与所述导电部接触。
根据本公开的一些实施例提供的方法，形成所述导电柱在形成贯穿所述绝缘衬底的过孔之前进行。
根据本公开的一些实施例提供的方法，该方法还包括：在提供所述第一 电路和所述第二电路之前，在第一载体上提供所述绝缘衬底，其中所述绝缘衬底的第二侧面向所述第一载体；在提供所述第一电路之后并且在提供所述第二电路之前，将所述绝缘衬底结合到第二载体，其中所述绝缘衬底的第一侧面向所述第二载体；在将所述绝缘衬底结合到所述第二载体之后并且在提供所述第二电路之前，移除所述第一载体；以及在提供所述第二电路之后，移除所述第二载体；所述绝缘衬底由柔性绝缘材料制成。
根据本公开的一些实施例提供的方法，所述显示面包括显示区和围绕所述显示区的非显示区，所述导电体位于所述非显示区。
根据本公开的一些实施例提供的方法，所述显示面包括显示区，所述导电体位于所述显示区。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1示意性地图示了根据本公开的实施例的显示面板的截面图。
图2示意性地图示了如图1所示的显示面板的顶视图。
图3示意性地图示了如图1所示的显示面板的底视图。
图4示意性地图示了根据本公开的另一实施例的显示面板的截面图。
图5A-图5C示意性地图示了根据本公开的实施例的显示面板的顶视图。
图6A-图6C示意性地图示了根据本公开的另一实施例的显示面板的顶视图。
图7示意性地图示了根据本公开的又一实施例的显示面板的截面图。
图8示意性地图示了根据本公开的实施例的显示面板的制作方法的流程图。
图9A-图9L图示了根据本公开的实施例的显示面板的制作方法的各步骤的示意性截面图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然， 所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
图1是根据本公开的一个实施例的显示面板的截面图，图2是其顶视图，并且图3是其底视图。如图1-图3所示，显示面板100的显示面DS包括显示区A-A'和围绕显示区A-A'的非显示区B-B'。例如，如图1所示，显示面DS为显示面板100的顶表面。例如，如图1所示，非显示面NDS与显示面DS相对。例如，该显示面板100包括绝缘衬底101、位于绝缘衬底101的第一侧S1上的第一电路102，以及位于绝缘衬底101的第二侧S2上的第二电路103。绝缘衬底101的第一侧S1和第二侧S2在垂直于显示面DS的第一方向D-D'上相对，并且第一电路102和第二电路103通过导电体(conductor)104电气连接。导电体104在第一方向D-D'上贯穿绝缘衬底101，并且位于非显示区B-B'中。可选地，如图2和图3所示，第一电路102和第二电路103分别通过导线W与导电体104电气连接。
应当指出的是，尽管在图1-图3中将导电体104的截面示出为圆形，但是不限于此。在本公开的其他实施例中，导电体104可以具有其它任何形状的截面，并且如以下将描述的，导电体104可以不是如图1所示的规则圆柱体。还应当指出的是，尽管在图1-图3中将第一电路102和第二电路103示出为分别通过导线W与导电体104电气连接，但是不限于此。在本公开的其他实施例中，第一电路102和/或第二电路103可以与导电体104直接电气连接而没有中间元件。
在上述显示面板中，通过将第一电路和第二电路分别提供在显示面板的相对两侧上，并且采用导电体电气连接第一电路和第二电路，相比于其中将第一电路和第二电路均提供在显示区外围的方案而言，能够显著减小显示面板的边框区域，提高显示面板中互连结构的集成度，从而有利于显示面板的小型化和窄边框化。
图4是根据本公开的另一实施例的显示面板的示意性截面图。如图4所示的显示面板具有与如图1所示的显示面板相同的部分结构和/或配置。因此，具有与图1所示的实施例中的那些基本上相同的功能的元件在此将编号相同并且在此将为了简要起见而不再详细描述和/或说明。
与如图1所示的显示面板100相比，图4中的显示面板400还包括位于 第一电路102背离绝缘衬底101的一侧上并且暴露第一电路102的部分的绝缘层405，并且导电体104在第一方向D-D'上同样贯穿绝缘层405。
在如图4所示的实施例的一种实现方式中，如图5A-图5C所示，显示面板500是OLED显示面板。为了更清楚地示出该OLED显示面板的布置，在图5A中移除了绝缘层405及其以上的部分，在图5B中移除了OLED发光功能层及其以上的部分，而图5C是该OLED显示面板的顶视图。如图5A-图5C所示，第一电路102包括驱动晶体管TFT、发光单元OLED，以及沿不同方向延伸的栅线GATE和数据线DATA。绝缘层405覆盖驱动晶体管TFT、栅线GATE和数据线DATA，并且暴露发光单元OLED。驱动晶体管TFT的控制端g与栅线GATE连接，第一端s与数据线DATA连接，并且第二端d与发光单元OLED的第一电极e1连接。栅线GATE、数据线DATA以及发光单元OLED的第二电极e2分别通过导电体104与第二电路103电气连接，并可被分别施加信号。发光单元OLED包括第一电极e1、第二电极e2和夹在第一电极e1与第二电极e2之间的功能叠层。如本领域技术人员所知的，该功能叠层可以包括发光层，还可以包括电子传输层、空穴传输层、电子注入层和空穴注入层等至少之一。
在如图4所示的实施例的另一种实现方式中，如图6A-图6C所示，显示面板600是LED显示面板。为了更清楚地示出该LED显示面板的布置，在图6A中移除了绝缘层405及其以上的部分，在图6B中移除了发光单元及其以上的部分，而图6C是该LED显示面板的顶视图。如图6A-图6C所示，第一电路102包括驱动晶体管TFT、发光单元LED，以及沿不同方向延伸的栅线GATE和数据线DATA。驱动晶体管TFT的控制端g与栅线GATE连接，第一端s与数据线DATA连接，并且第二端d与发光单元LED的第一电极e1连接。绝缘层405覆盖栅线GATE、数据线DATA和驱动晶体管TFT除其第二端d之外的部分，并且暴露发光单元LED和驱动晶体管TFT的第二端d。栅线GATE、数据线DATA以及发光单元LED的第二电极e2分别通过导电体104与第二电路103电气连接，并可被分别施加信号。
图7是根据本公开的又一实施例的显示面板的示意性截面图。如图7所示的显示面板具有与如图4所示的显示面板相同的结构和/或配置，除了导电体704之外。因此，具有与图4所示的实施例中的那些基本上相同的功能的元件在此将编号相同并且在此将为了简要起见而不再详细描述和/或说明。
与如图4所示的显示面板400相比，图7中的导电体704包括在第一方向D-D’上贯穿绝缘衬底101的导电部P1，以及在第一方向D-D’上贯穿绝缘层405的导电柱P。过孔V1贯穿绝缘衬底101，并填充有导电材料形成导电部P1。过孔V2贯穿绝缘层405，并填充有导电材料形成导电柱P。导电柱P与导电部P1电气连接。如图7所示，导电部P1与导电柱P接触，但不限于此。
本公开的实施例的附图，以过孔V1位于非显示区B-B'为例进行说明，然而，并不限于此。例如，在一些实施例中，为了进一步减小边框，过孔V1可位于显示区A-A'，从而导电部P1也位于显示区A-A'。
本公开的实施例的附图，以过孔V2位于非显示区B-B'为例进行说明，然而，并不限于此。例如，在一些实施例中，为了进一步减小边框，过孔V2可位于显示区A-A'，从而导电柱P也位于显示区A-A'。
在本公开所提供的显示面板中，如果显示面板在第一方向上的厚度较大，则在实际工艺中一体地形成贯穿整个显示面板的导电体是相对昂贵且难以实现的。因此，可以通过分别提供导电部P1和导电柱P来提供导电体，从而降低工艺难度和工艺成本。
进一步地，如图7所示，过孔V1具有从绝缘衬底101的第二侧向第一侧渐缩的形状。通过将过孔提供成具有渐缩的形状，可以更加容易地向过孔中填充导电材料，以便避免由于导电材料未充分填充而使得过孔断路的情况。在示例性实施例中，渐缩的形状具有45°-90°的坡度角。
例如，如图7所示，导电部P1的靠近第一电路102的一侧的横截面的面积小于导电部P1的靠近第二电路103的一侧的横截面的面积。
例如，如图7所示，导电部P1与形成过孔V1的侧壁接触。
在本公开的示例性实施例中，第一电路包括以下各项中的一个或多个：与彼此电气连接的栅极驱动电路和驱动晶体管；像素驱动电路；外围电路；以及补偿电路。相应地，第二电路包括集成驱动电路，其用于为显示面板提供栅极驱动信号、源极驱动信号、电源电平、控制信号等。
本公开的另一方面提供了一种显示装置，包括上述任一种显示面板。
在这样的显示装置中，通过将第一电路和第二电路分别提供在显示面板的相对两侧上，并且采用导电体电气连接第一电路和第二电路，相比于其中将第一电路和第二电路均提供在显示区外围的方案而言，能够显著减小显示 装置的边框区域，提高显示装置中互连结构的集成度，从而有利于显示装置的小型化和窄边框化。
本公开的实施例还提供了一种上述显示面板的制作方法。该显示面板的显示面包括显示区和围绕显示区的非显示区。如图8所示，在步骤S801处，在绝缘衬底的第一侧上提供第一电路。第一电路可以是与彼此电气连接的栅极驱动电路和驱动晶体管、像素驱动电路、外围电路、补偿电路等，并且可以采用本领域中常用的工艺步骤来提供该第一电路，例如沉积、光刻、蚀刻、溅射等。
在步骤S802处，在绝缘衬底的第二侧上提供第二电路，其中绝缘衬底的第一侧和第二侧在垂直于显示面的第一方向上相对。第二电路可以包括集成驱动电路，其用于为显示面板提供栅极驱动信号、源极驱动信号、电源电平、控制信号等。
在步骤S803处，在非显示区中提供在第一方向上贯穿绝缘衬底的导电体，使得第一电路和第二电路通过导电体电气连接。
在通过上述方法制作的显示面板中，通过将第一电路和第二电路分别提供在显示面板的相对两侧上，并且采用导电体电气连接第一电路和第二电路，相比于其中将第一电路和第二电路均提供在显示区外围的方案而言，能够显著减小显示面板的边框区域，提高显示面板中互连结构的集成度，从而有利于显示面板的小型化和窄边框化。
可选地，上述方法还包括在步骤S804处，在第一电路背离绝缘衬底的一侧上提供绝缘层，绝缘层暴露第一电路的部分。导电体在第一方向上同样贯穿该绝缘层。
当包括可选步骤S804时，步骤S803可以包括：在第一方向上形成贯穿绝缘衬底的过孔V1；在第一方向上形成贯穿绝缘层的导电柱P；以及采用导电材料填充过孔V1形成导电部P1。导电柱P与导电部P1电气接触。
例如，当包括可选步骤S804时，步骤S803可以依次包括以下步骤：在第一方向上形成贯穿绝缘层的导电柱P；在第一方向上形成贯穿绝缘衬底的过孔V1；以及采用导电材料填充过孔V1形成导电部P1。
根据上述方法，可以制作刚性或柔性显示面板。例如，图9A-图9L图示了根据本公开的一个实施例的制作柔性显示面板的方法的各步骤的示意性截面图。如图9A所示，首先在第一载体900上提供绝缘衬底901，其中绝缘衬 底901的第二侧S2面向第一载体900。第一载体900可以是玻璃基板，以便为绝缘衬底901提供支撑。绝缘衬底901由柔性绝缘材料制成，例如聚酰亚胺(PI)、聚二甲基硅氧烷(PDMS)等。
接着，如图9B所示，在绝缘衬底901上沉积导电材料层902，该导电材料层的厚度可以为2-10μm，并且可以包括铜。然后，如图9C所示，对导电材料层902进行图案化，以形成导电柱P。
接着，如图9D所示，通过沉积、蚀刻等工艺在绝缘衬底901上形成第一电路的第一部分9031，第一部分9031与导电柱P电气接触。例如，第一电路的第一部分9031可以是如图5A-图5C所示实施例中的驱动晶体管TFT、栅线GATE和数据线DATA。可替换地，第一电路的第一部分9031可以是如图6A-图6C所示实施例中的栅线GATE、数据线DATA和驱动晶体管TFT除其第二端d之外的部分。
然后，如图9E所示，在第一电路的第一部分9031上沉积绝缘层904，绝缘层904覆盖第一电路的第一部分9031，并且暴露导电柱P。
接着，如图9F所示，在绝缘层904上形成第一电路的第二部分9032，使得第二部分9032与导电柱P电气接触。例如，第一电路的第二部分9032可以是如图5A-图5C所示实施例中的发光单元OLED。可替换地，第一电路的第二部分9032可以是如图6A-图6C所示实施例中的发光单元LED和驱动晶体管TFT的第二端d。
在形成了第一电路之后，如图9G所示，将绝缘衬底901结合到第二载体905，其中绝缘衬底901的第一侧S1面向第二载体905。例如，可以通过粘接的方法利用粘性材料907将绝缘衬底901的第一侧S1结合到第二载体905，以便为绝缘衬底901提供支撑。与第一载体900类似地，第二载体905也可以是玻璃基板。
此后，从绝缘衬底901移除第一载体900，如图9H所示。例如，可以利用激光剥离的方式从绝缘衬底901移除第一载体900。
接着，如图9I所示，在绝缘衬底901中通过蚀刻形成盲孔BV。然后，例如通过电镀的方式向盲孔BV中填充导电材料，以形成导电部V，如图9J所示。盲孔BV可以具有从绝缘衬底901的第二侧(上侧)向绝缘衬底901的第一侧(下侧)渐缩的形状，以便促进导电材料的填充。
在通过填充盲孔BV而形成导电部V后，如图9K所示，在绝缘衬底901 的第二侧S2上提供第二电路906，第二电路906与导电部V电气接触，并且可以包括集成驱动电路。
最后，从绝缘衬底901移除第二载体905，例如通过去除粘性材料907，以最终形成具有高密度互连和窄边框的柔性显示面板，如图9L所示。
特别地，在上述实施例中，在提供第一电路之后，形成填充有导电材料的过孔，使得第一载体的移除不受导电过孔中的导电材料的影响，从而易于得到柔性显示面板。
在通常的工艺流程中，首先在绝缘衬底中形成过孔后，然后制作该绝缘衬底上的其它电路元件。但是，如果在移除第一载体之前就形成了导电过孔，则该过孔中的导电材料将使得难以移除第一载体。有鉴于此，在本公开的实施例中，首先提供第一电路，而后提供绝缘衬底中的过孔，使得第一载体的移除不受影响，从而易于得到柔性显示面板。
应当指出的是，尽管在图9A-图9L中，将与彼此电气连接的两个元件示出为直接电气接触，但是这仅仅是示意性的。在本公开的其它实施例中，与彼此电气连接的两个元件可以通过导线或其它中间元件而与彼此电气连接。
本公开的概念可以广泛地应用于具有显示功能的各种电子系统，例如显示器、移动电话、笔记本计算机、电视机、导航仪等等。
除非另外定义，否则本公开使用的技术术语或者科学术语应当为本公开所属领域普通技术人员所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。需要注意的是，在不冲突的前提下，上述实施例中的特征可以任意组合使用。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护 范围应以所述权利要求的保护范围为准。

Claims (25)

  1. 一种显示面板，包括：
    绝缘衬底；
    位于所述绝缘衬底的第一侧上的第一电路；以及
    位于所述绝缘衬底的第二侧上的第二电路，
    其中，所述显示面板包括显示面，所述绝缘衬底的所述第一侧和所述第二侧在垂直于所述显示面的第一方向上相对，并且所述第一电路和所述第二电路通过在所述第一方向上贯穿所述绝缘衬底的导电体电气连接。
  2. 根据权利要求1所述的显示面板，其中，所述显示面包括显示区和围绕所述显示区的非显示区，所述导电体位于所述非显示区。
  3. 根据权利要求1所述的显示面板，其中，所述显示面包括显示区，所述导电体位于所述显示区。
  4. 根据权利要求1-3任一项所述的显示面板，还包括位于所述第一电路背离所述绝缘衬底的一侧上并且暴露所述第一电路的一部分的绝缘层，其中，所述导电体在所述第一方向上贯穿所述绝缘层。
  5. 根据权利要求4所述的显示面板，其中，所述导电体设置为多个，
    所述第一电路包括驱动晶体管、发光单元，以及沿不同方向延伸的栅线和数据线，
    所述绝缘层覆盖所述驱动晶体管、栅线和数据线，并且暴露所述发光单元，
    所述驱动晶体管的控制端与所述栅线连接，所述驱动晶体管的第一端与所述数据线连接，所述驱动晶体管的第二端与所述发光单元的第一电极连接，并且
    所述栅线、所述数据线以及所述发光单元的第二电极分别通过导电体与所述第二电路电气连接。
  6. 根据权利要求4所述的显示面板，其中，所述导电体设置为多个，
    所述第一电路包括驱动晶体管、发光单元，以及沿不同方向延伸的栅线和数据线，
    所述驱动晶体管的控制端与所述栅线连接，所述驱动晶体管的第一端与所述数据线连接，所述驱动晶体管的第二端与所述发光单元的第一电极连接，
    所述绝缘层覆盖所述栅线、数据线和所述驱动晶体管除所述第二端之外的部分，并且暴露所述发光单元和所述驱动晶体管的第二端，并且
    所述栅线、所述数据线以及所述发光单元的第二电极分别通过导电体与所述第二电路电气连接。
  7. 根据权利要求4-6任一项所述的显示面板，其中，所述导电体包括在所述第一方向上贯穿所述绝缘衬底的过孔中填充导电材料形成的导电部，以及在所述第一方向上贯穿所述绝缘层的导电柱，并且所述导电柱与所述导电部电气连接。
  8. 根据权利要求7所述的显示面板，其中，所述导电部与所述导电柱接触。
  9. 根据权利要求7所述的显示面板，其中，所述过孔具有从所述绝缘衬底的所述第二侧向所述第一侧渐缩的形状。
  10. 根据权利要求9所述的显示面板，其中，所述渐缩的形状具有45°-90°的坡度角。
  11. 根据权利要求7-10任一项所述的显示面板，其中，所述导电部的靠近所述第一电路的一侧的横截面的面积小于所述导电部的靠近所述第二电路的一侧的横截面的面积。
  12. 根据权利要求1-11任一项所述的显示面板，其中，所述显示面板是柔性的，并且所述绝缘衬底包括柔性绝缘材料。
  13. 根据权利要求1-12任一项所述的显示面板，其中，所述第一电路包括以下各项中的一个或多个：
    与彼此电气连接的栅极驱动电路和驱动晶体管；
    像素驱动电路；
    外围电路；以及
    补偿电路，并且
    其中，所述第二电路包括集成驱动电路。
  14. 根据权利要求1-13任一项所述的显示面板，其中，所述第一电路先于所述第二电路形成。
  15. 一种显示装置，包括根据权利要求1-14任一项所述的显示面板。
  16. 一种显示面板的制作方法，包括：
    在绝缘衬底的第一侧上提供第一电路；
    在所述绝缘衬底的第二侧上提供第二电路，其中所述绝缘衬底的第一侧和第二侧在第一方向上相对，所述第一方向垂直于所述显示面板的显示面；以及
    提供在所述第一方向上贯穿所述绝缘衬底的导电体，使得所述第一电路和所述第二电路通过所述导电体电气连接。
  17. 根据权利要求16所述的方法，其中，提供所述第一电路、提供所述第二电路以及提供所述导电体按照如下顺序依次进行：
    提供所述第一电路、提供所述导电体以及提供所述第二电路。
  18. 根据权利要求17所述的方法，其中，在提供所述第一电路之后，并在提供所述导电体之前，所述方法还包括翻转所述绝缘衬底，并在所述绝缘衬底中形成过孔。
  19. 根据权利要求18所述的方法，其中，所述过孔具有从所述绝缘衬底的所述第二侧向所述第一侧渐缩的形状。
  20. 根据权利要求16-19任一项所述的方法，还包括：
    在所述第一电路背离所述绝缘衬底的一侧上提供绝缘层，所述绝缘层暴露所述第一电路的一部分，
    其中，所述导电体在所述第一方向上贯穿所述绝缘层。
  21. 根据权利要求20所述的方法，其中，所述提供在所述第一方向上贯穿所述绝缘衬底的导电体，包括：
    在所述第一方向上形成贯穿所述绝缘衬底的过孔；
    在所述第一方向上形成贯穿所述绝缘层的导电柱；以及
    采用导电材料填充所述过孔形成导电部，
    其中，所述导电柱与所述导电部接触。
  22. 根据权利要求21所述的方法，其中，形成所述导电柱在形成贯穿所述绝缘衬底的过孔之前进行。
  23. 根据权利要求20-22任一项所述的方法，还包括：
    在提供所述第一电路和所述第二电路之前，在第一载体上提供所述绝缘衬底，其中所述绝缘衬底的第二侧面向所述第一载体；
    在提供所述第一电路之后并且在提供所述第二电路之前，将所述绝缘衬底结合到第二载体，其中所述绝缘衬底的第一侧面向所述第二载体；
    在将所述绝缘衬底结合到所述第二载体之后并且在提供所述第二电路之 前，移除所述第一载体；以及
    在提供所述第二电路之后，移除所述第二载体，
    其中，所述绝缘衬底由柔性绝缘材料制成。
  24. 根据权利要求16-23任一项所述的方法，其中，所述显示面包括显示区和围绕所述显示区的非显示区，所述导电体位于所述非显示区。
  25. 根据权利要求16-23任一项所述的方法，其中，所述显示面包括显示区，所述导电体位于所述显示区。
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CN107579075A (zh) * 2016-07-05 2018-01-12 群创光电股份有限公司 显示装置
CN108155220A (zh) * 2018-01-29 2018-06-12 武汉华星光电半导体显示技术有限公司 显示装置及其制造方法、显示面板
CN109003544A (zh) * 2018-07-24 2018-12-14 武汉华星光电技术有限公司 柔性显示装置
CN110265432A (zh) * 2019-04-11 2019-09-20 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置

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