WO2020140460A1 - 一种扬声器装置 - Google Patents

一种扬声器装置 Download PDF

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Publication number
WO2020140460A1
WO2020140460A1 PCT/CN2019/102404 CN2019102404W WO2020140460A1 WO 2020140460 A1 WO2020140460 A1 WO 2020140460A1 CN 2019102404 W CN2019102404 W CN 2019102404W WO 2020140460 A1 WO2020140460 A1 WO 2020140460A1
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WO
WIPO (PCT)
Prior art keywords
magnetic
housing
speaker device
magnetic element
panel
Prior art date
Application number
PCT/CN2019/102404
Other languages
English (en)
French (fr)
Inventor
李永坚
张浩锋
游芬
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Publication of WO2020140460A1 publication Critical patent/WO2020140460A1/zh
Priority to US17/169,586 priority Critical patent/US11336991B2/en
Priority to US17/660,414 priority patent/US11805354B2/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1025—Accumulators or arrangements for charging
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/033—Headphones for stereophonic communication
    • H04R5/0335—Earpiece support, e.g. headbands or neckrests
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07—Applications of wireless loudspeakers or wireless microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present application relates to the field of loudspeaker devices, and particularly relates to a tube-type design in a loudspeaker device.
  • the circuit case for accommodating the control circuit or the battery and the protective sleeve provided at the periphery of the circuit case may be integrally formed.
  • the control circuit or the battery is accommodated inside the circuit case, if the two are integrally formed, the high-temperature environment may easily damage the control circuit or the battery, thereby affecting the quality of the speaker device.
  • the speaker device includes: at least one speaker assembly, the speaker assembly includes an earphone core and a movement housing for accommodating the earphone core, the movement housing includes a body-facing surface A housing panel on one side and a rear surface of the housing opposite to the housing panel, and at least one key module; and a support connector, which is fixedly connected to the movement housing for contact with the head of the human body , A control circuit or a battery is accommodated in the support connector, and the control circuit or the battery drives the earphone core to vibrate to generate sound, wherein the vibration of the earphone core causes the shell panel and the back of the shell to vibrate, so
  • the vibration of the housing panel has a first phase
  • the vibration of the rear surface of the housing has a second phase.
  • FIG. 1 is a schematic structural diagram of a speaker device according to some embodiments of the present application.
  • FIG. 2 is an exploded view of a partial structure of a speaker device according to some embodiments of the present application.
  • FIG. 3 is an exploded view of a partial structure of a speaker device according to some embodiments of the present application.
  • FIG. 4 is a partial structural cross-sectional view of a speaker device provided according to some embodiments of the present application.
  • FIG. 5 is a schematic longitudinal cross-sectional view of a speaker device according to some embodiments of the present application.
  • FIG. 6 is another schematic longitudinal cross-sectional view of a speaker device according to some embodiments of the present application.
  • FIG. 7 is another schematic longitudinal cross-sectional view of a speaker device according to some embodiments of the present application.
  • FIG. 8 is another schematic longitudinal cross-sectional view of a speaker device according to some embodiments of the present application.
  • FIG. 9 is a schematic longitudinal cross-sectional view of a housing according to some embodiments of the present application.
  • FIG. 10 is a schematic diagram of an application scenario and a structure of a speaker device according to some embodiments of the present application.
  • FIG. 11 is a schematic diagram of an included angle direction according to some embodiments of the present application.
  • FIG. 12 is a schematic structural view of a speaker device acting on human skin and bones according to some embodiments of the present application.
  • FIG. 13 is an angle-relative displacement relationship diagram of a speaker device according to some embodiments of the present application.
  • FIG. 14 is a schematic diagram of a low-frequency part of a frequency response curve of a speaker device at different included angles ⁇ according to some embodiments of the present application;
  • FIG. 15 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 16 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 17 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 18 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 19 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 20 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • 21 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • Fig. 22 is a schematic diagram showing a method of transmitting sound through air conduction.
  • a microphone such as a microphone can pick up the sound of the user/wearer's surroundings, and after a certain algorithm, transmit the sound (or the generated electrical signal) to the speaker section. That is, the speaker device can be modified to include the function of picking up environmental sounds, and after certain signal processing, the sound is transmitted to the user/wearer through the speaker module, thereby simultaneously realizing the functions of the speaker and the traditional speaker device.
  • the algorithms described here may include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling One or more combinations of suppression and volume control.
  • FIG. 1 is a schematic structural diagram of a speaker device provided according to some embodiments of the present application
  • FIG. 2 is an exploded view of a partial structure of a speaker device provided according to some embodiments of the present application
  • FIG. 3 is a speaker device provided according to some embodiments of the present application Exploded view of a partial structure
  • FIG. 4 is a partial structure cross-sectional view of a speaker device provided according to some embodiments of the present application.
  • the speaker device may be based on headphones, MP3, or other devices with a speaker function.
  • the speaker device may include: a circuit case 10, an ear hanger 50, a rear hanger 30, a speaker assembly 40, a control circuit, a battery, and the like.
  • the circuit housing 10 is used to accommodate a control circuit or a battery
  • the speaker assembly 40 includes a movement housing 20 that is connected to the earhook 50 and is used to house an earphone core.
  • the number of the circuit housing 10 and the earhook 50 can be two, respectively corresponding to the left and right sides of the user.
  • the movement casing 20 and the circuit casing 10 are respectively disposed at both ends of the earhook 50, and the rear hanger 30 is further disposed at the end of the circuit casing 10 away from the earhook 50.
  • the first shell sheath 21 is injection molded on the earhook 50.
  • the earhook 50 includes a first elastic metal wire for supporting the shape of the earhook 50, and an earhook sheath 22 is injection-molded on the periphery of the first elastic metal wire.
  • the connection point of 10 further forms a first housing sheath 21 integrally formed with the earhook sheath 22, that is, the first housing sheath 21 is located on the side of the earhook sheath 22 facing the circuit housing 10.
  • a second casing sheath 31 is injection molded on the rear hanger 30.
  • the rear hanger 30 also includes a second elastic metal wire for supporting the shape of the rear hanger 30, and a rear hanger sheath 32 injection-molded on the periphery of the second elastic metal wire.
  • the connection of the circuit housing 10 further forms a second housing sheath 31 integrally formed with the rear hanging sheath 32, that is, the second housing sheath 31 is located on the side of the rear hanging sheath 32 facing the circuit housing 10 .
  • first casing sheath 21 and the ear-hanging sheath 22, the second casing sheath 31 and the rear-hanging sheath 32 can be made of a soft material with a certain elasticity, such as soft silicone, Rubber, etc., provides a better touch for users to wear.
  • the circuit case 10 is formed with the first case sheath 21 and the second case sheath 31 separately, and the shape of the inner side wall of the first case sheath 21 is close to the earloop 50 of the circuit case 10
  • the shape of at least part of the outer side wall of the second housing sheath 31 matches the shape of the inner side wall of the second housing sheath 31 to match the shape of at least part of the outer side wall of the circuit case 10 close to the rear hanger 30.
  • the first housing sheath 21 is sheathed from the side of the circuit housing 10 facing the earhook 50 on the periphery of the circuit housing 10 near the earhook 50
  • the second housing sheath 31 is sheathed Way from the side of the circuit housing 10 facing the rear hanger 30 to the outer periphery of the circuit housing 10 close to the rear hanger 30, so that the circuit housing 10 can be covered by the first housing sheath 21 and the second housing sheath 31 Coated together.
  • the circuit case 10 the first case sheath 21, and the second case sheath 31 are formed separately, and then put together, instead of the first case sheath 21 and the second
  • the casing sheath 31 is directly injection-molded on the periphery of the circuit casing 10, so as to avoid damage to the control circuit or the battery caused by high temperature during the one-piece injection molding, thereby reducing the adverse effect of the molding stage on the control circuit or the battery.
  • the circuit housing 10 includes a main side wall 11, an auxiliary side wall 12, and an end wall 13 that are connected to each other.
  • the circuit housing 10 may be a flat housing.
  • the flat circuit housing 10 includes a main side wall 11 with a large area. When the user wears the speaker device, the two opposing main side walls 11 are respectively used for A side wall abutting the head and a side wall opposite to the side wall and located away from the head. Both the auxiliary side wall 12 and the end wall 13 are used to connect the two main side walls 11.
  • the auxiliary side wall 12 is the two side walls facing the upper side and the lower side of the user's head when the user wears it;
  • the end wall 13 is the opposite side wall of the circuit housing 10 and close to the end of the ear hanger 50 and
  • the side wall near one end of the rear hanging 30 faces the front and rear sides of the user's head when worn by the user, respectively.
  • the main side wall 11, the auxiliary side wall 12 and the end wall 13 are connected to each other to collectively constitute the circuit case 10.
  • the first housing sheath 21 includes an open end 211 that is sleeved from the circuit housing 10 toward the earhook 50 side and is sleeved on the circuit housing 10 and covers the circuit housing 10 toward the earhook The end wall 13 on the 50 side, and the portions of the main side wall 11 and the auxiliary side wall 12 near the earhook 50;
  • the second housing sheath 31 includes an open end 311 that hangs from the circuit housing 10 toward the rear
  • the 30 side is further sleeved on the circuit case 10 and covers the end wall 13 of the circuit case 10 on the side facing the rear hanger 30 and the portions of the main side wall 11 and the auxiliary side wall 12 near the rear hanger 30.
  • the open end 211 and the open end 311 are butted against each other on the main side wall 11 and the auxiliary side wall 12 of the circuit case 10 to cover the circuit case 10.
  • the first housing sheath 21 and the second housing sheath 31 do not completely cover the entire circuit housing 10, for example, they can be opened at a position corresponding to a key or a position corresponding to a power interface, etc. There are exposed holes to expose the corresponding structure for user convenience.
  • the two can be further fixed on the circuit casing 10 by certain means, so as to fix the circuit casing 10 is fixed together with the corresponding casing sheath.
  • a positioning projection 215 and a positioning projection 315 are integrally formed on the inner surfaces of the first casing sheath 21 and the second casing sheath 31 corresponding to the main side wall 11 respectively, the main side A positioning groove 111 and a positioning groove 112 are respectively provided on the outer surface of the wall 11.
  • the positioning protrusion 215 is disposed on the inner side wall near the opening end 211.
  • the positioning protrusion 215 may be an annular protrusion surrounding the inner side wall of the first housing sheath 21, or may be a plurality of protrusions arranged on the inner side wall of the first housing sheath 21 at intervals, specifically Can be set according to actual needs.
  • the number of positioning bumps 215 is two, which are respectively provided on the inner side walls of the first housing sheath 21 corresponding to the two main side walls 11 of the circuit housing 10; similarly, the positioning bumps The number of 315 also corresponds to two, which are respectively disposed on the inner side walls of the second housing sheath 31 corresponding to the two main side walls 11 of the circuit housing 10.
  • the positioning protrusion 215 is further embedded in the positioning groove 111, and the positioning protrusion 315 is inserted into the positioning groove 112 so that the open end 211 of the first housing sheath 21 and the open end 311 of the second housing sheath 31 elastically abut together, thereby covering the circuit housing 10.
  • the outer side wall 313 of the area of the second housing sheath 31 that covers the end wall 13 of the circuit housing 10 is inclined relative to the auxiliary side wall 12. Specifically, when the user wears it, the side of the outer side wall 313 of the second housing sheath 31 near the upper side of the user's head to the side near the lower side of the user's head is inclined in a direction gradually away from the rear hanger 30.
  • the positioning protrusion 215 and the positioning protrusion 315 can be arranged in a strip shape along the opening end 211 and the opening end 311, respectively, and can be inclined with respect to the auxiliary side wall 12; further, the first shell sheath 21 and the second shell The joint seam of the body sheath 31 on the main side wall 11 of the circuit housing 10 may also be inclined relative to the auxiliary side wall 12.
  • the inclination directions of the positioning protrusion 215 and the positioning protrusion 315, as well as the joint seam of the first casing sheath 21 and the second casing sheath 31 on the main side wall 11 of the circuit casing 10 can
  • the inclination directions of the outer side walls 313 of the area of the body sheath 31 covering the end wall 13 of the circuit case 10 are uniform, thereby making the speaker device more uniform in appearance.
  • any one of the first housing sheath 21 and the second housing sheath 31 covers the circuit housing 10 with an area not less than the other covering the circuit housing 10 Half.
  • the covering area of the first housing sheath 21 to the circuit housing 10 is not less than half of the covering area of the second housing sheath 31 to the circuit housing 10, or the second housing sheath 31
  • the covering area of the circuit case 10 is not less than half of the covering area of the first case sheath 21 to the circuit case 10.
  • the covering area of the first housing sheath 21 to the circuit housing 10 and the covering area of the second housing sheath 31 to the circuit housing 10 and the ratio between the two can be set to other according to requirements. For example, each can be divided into half, which is not specifically limited here.
  • circuit case 10 and the rear hanger 30 can be connected together by means of plug connection, snap connection, and the like.
  • the rear hanger 30 further includes a plug end 33 disposed toward the circuit housing 10, and the second housing sheath 31 is sleeved on at least part of the outside of the plug end 33.
  • the plug end 33 can be injection-molded on the end of the second elastic wire
  • the rear hanging sheath 32 can be further injection-molded on the outside of the second elastic wire and part of the plug end 33, and integrated at the plug end 33
  • the second housing sheath 31 is molded so that the second housing sheath 31 is further sleeved around the area of the connector 33 that is not covered by the rear hanging sheath 32.
  • the circuit housing 10 is provided with a connector jack 14 facing the rear hanger 30, wherein the connector jack 14 can be disposed on the end wall 13 of the circuit housing 10 near the rear hanger 30 and on the end wall 13 The side close to the auxiliary side wall 12 extends toward the rear hanger 30.
  • the connector 33 is inserted into the connector 14 at least partially.
  • the plug end 33 are respectively provided with slots 331 which are perpendicular to the insertion direction of the plug end 33 with respect to the insertion direction of the receptacle 14, and the two slots 331 can be spaced and symmetrically arranged on the plug end 33 On both sides. Further, the two slots 331 may both communicate with the corresponding side wall of the plug end 33 in a direction perpendicular to the insertion direction.
  • the first side wall 15 defining the socket 14 is provided with first through holes 151 corresponding to the positions of the two slots 331.
  • the first side wall 15 of the socket 14 is disposed on the periphery of the socket 14 and faces the underside of the user's head in the wearing state.
  • the speaker device further includes a fixing member 53 including two pins 531 and a connecting portion 532 for connecting the pins 531 in parallel.
  • the two pins 531 are arranged in parallel, and the connecting portion 532 can be vertically connected on the same side of the two pins 531 to form a U-shaped fixing member 53.
  • the pin 531 can be inserted into the slot 331 from the outer side wall of the first side wall 15 of the connecting hole 14 through the through hole, thereby blocking the connecting portion 532 outside the connecting hole 14, thereby realizing the circuit housing 10 It is fixed with the plug of the rear hanger 30.
  • a second through-hole 161 opposite to the first through-hole 151 is further provided on the second side wall 16 opposite to the first side wall 15 defining the receptacle 14, and the pin 531 is further The slot 331 is inserted into the second through hole 161.
  • the second side wall 16 may be an auxiliary side wall 12 on the side of the circuit housing 10 close to the socket 14. When the speaker device is in a wearing state, the auxiliary side wall 12 faces the upper side of the user's head.
  • the pin 531 is inserted into the slot 331 through the first through hole 151, and further inserted into the second through hole 161 through the slot 331, that is to say, the pin 531 can connect the plug end of the rear hook 30
  • the opposite side walls of 33 and the plug ends 33 are completely penetrated and connected together, so that the plug between the circuit case 10 and the rear hanger 30 can be more stable.
  • the plug end 33 is further divided into a first plug section 332 and a second plug section 333 along the insertion direction of the plug end relative to the socket 14.
  • the cross section of the first plug section 332 is larger than the cross section of the second plug section 333.
  • the rear hanging jacket 32 can be injection molded onto the first connector section 332 of the connector, and the second housing jacket 31 can be integrally injection molded at the connection between the first connector section 332 and the second connector section 333 . Further, the slot 331 is disposed on the second plug section 333, and the second plug section 333 is inserted into the socket 14, and the plug end 33 is exposed to the outside of the socket 14.
  • the first plug section 332 is provided with a first wiring slot 3321 disposed along the insertion direction of the plug end 33 relative to the socket 14, and the second plug section 333 is away from the first
  • the outer end surface of the connecting section 332 is provided with a second wire groove 3331 extending perpendicular to the insertion direction and penetrating at least one outer side surface.
  • the first routing slot 3321 is disposed on the side of the first plug section 332 close to the auxiliary side wall 12 used to define the socket 14 and along the insertion direction of the plug end 33 relative to the socket 14
  • the two end surfaces of the first connecting section 332 are penetrated.
  • the second wiring slot 3331 can penetrate through two outer sides of the second connecting section 333 perpendicular to the extending direction of the second wiring slot 3331.
  • the inner side wall of the socket 14 is provided with a third wiring slot 162 that communicates with the first wiring slot 3321 at one end and communicates with the second wiring slot 3331 at the other end.
  • the inner wall surface of the second side wall 16 is recessed and formed.
  • the circuit housing 10 includes an inner partition wall 17 disposed inside the housing to form an accommodating cavity 18 spaced apart from the socket 14.
  • the main side wall 11, the auxiliary side wall 12, and the end wall 13 of the circuit housing 10 together form an accommodating space, and the arrangement of the inner partition wall 17 divides the accommodating space into an accommodating cavity 18 and a socket 14 Two parts.
  • the inner partition wall 17 is further provided with a wiring hole 171 for connecting the connecting hole 14 and the accommodating cavity 18 through the wiring hole 171.
  • the speaker device is further provided with a rear hanging wire 34, the rear hanging wire 34 passes through the rear hanging 30, and both ends are respectively connected with a control circuit and a battery.
  • the rear hanging wire 34 passes through the first wiring groove 3321, the third wiring groove 162 and the second wiring groove 3331 in sequence from the rear hook 30, and passes through the wiring hole 171 to enter the accommodating cavity 18, Connect with control circuit or battery.
  • the above description of the earphone core housing of the speaker device is only a specific example, and should not be regarded as the only feasible implementation.
  • the specific methods and steps of the implemented earphone core housing of the speaker device may be implemented without departing from this principle.
  • Various modifications and changes in form and details are made, but these modifications and changes are still within the scope of the above description.
  • the circuit case and the rear suspension can be integrally formed. Such deformations are within the scope of protection of this application.
  • the speaker device may further include a speaker mechanism, such as a bone conduction speaker mechanism, an air conduction speaker mechanism, or the like.
  • a speaker mechanism such as a bone conduction speaker mechanism, an air conduction speaker mechanism, or the like.
  • bone conduction is a kind of sound conduction method, that is, the sound is converted into mechanical vibration of different frequencies, and the sound waves are transmitted through the human skull, bone labyrinth, inner ear lymphatic fluid transmission, screw, auditory nerve, auditory center, etc.
  • the speaker mechanism may be an MP3 player, a hearing aid, or the like.
  • the speaker mechanism of the speaker device may be a stand-alone, directly usable player, or may also be a player plugged into an electronic device.
  • the speaker device may include a magnetic circuit assembly 210, a coil 212, a vibration transmission sheet 214, a connection member 216, and a housing 220.
  • the magnetic circuit assembly 210 may include a first magnetic element 202, a first magnetic conductive element 204, and a second magnetic conductive element 206.
  • the movement housing 20 has a structure similar to or the same as the housing 220.
  • the housing 220 may have a shell panel 222 facing the shell panel on the side of the human body, a shell back 224 and a shell side 226 opposite the shell panel.
  • the back surface 224 of the housing is located on the side opposite to the front panel 222 of the housing, and is respectively disposed on both end surfaces of the side surface 226 of the housing.
  • the housing panel 222, the housing back 224 and the housing side 226 form an overall structure with a certain accommodating space.
  • the magnetic circuit assembly 210, the coil 212, and the vibration transmitting piece 214 are fixed inside the housing 220.
  • the speaker device may further include a housing bracket 228, and the vibration transmitting piece 214 may be connected to the housing 220 through the housing bracket 228.
  • the coil 212 may be fixed on the housing bracket 228 and pass through the housing bracket 228 drives the housing 220 to vibrate.
  • the housing bracket 228 may be a part of the housing 220 or a separate component, directly or indirectly connected to the interior of the housing 220.
  • the housing bracket 228 is fixed on the inner surface of the housing side 226.
  • the housing bracket 228 may be pasted on the housing 220 by glue, or may be fixed on the housing 220 by stamping, injection molding, snapping, riveting, screw connection or welding.
  • the housing panel 222, the housing back 224, and the housing side 226 may be designed to ensure a greater rigidity of the housing 220.
  • the housing panel 222, the housing back 224, and the housing side 226 may be integrally formed.
  • the housing back 224 and the housing side 226 may be an integrally formed structure.
  • the outer shell panel 222 and the outer shell side 226 can be directly pasted and fixed by glue, or fixed by clamping, welding or screwing.
  • the glue may be a glue with strong viscosity and high hardness.
  • the housing panel 222 and the housing side 226 may be an integrally formed structure, and the housing back 224 and the housing side 226 may be directly pasted and fixed by glue, or fixed by clamping, welding, or screwing.
  • the housing panel 222, the housing back 224, and the housing side 226 are independent components, and the three may be implemented by one or any combination of glue, clamping, welding, or screw connection. Fixed connection.
  • the casing panel 222 and the casing side 226 are connected by glue, and the casing back 224 and the casing side 226 are connected by clamping, welding or screw connection.
  • the housing back 224 and the housing side 226 are connected by glue, and the housing panel 222 and the housing side 226 are connected by clamping, welding or screw connection.
  • the housing of the speaker device described in this application can be made by different assembly methods.
  • the housing of the speaker device may be formed in one piece, in a separate combination, or a combination of the two.
  • the different splits can be fixed by glue, or by clamping, welding or screwing.
  • FIGS. 6-8 describe several examples of the manner of assembling the housing of the speaker device.
  • the speaker device mainly includes a magnetic circuit assembly 2210 and a housing (as reference numeral 220 in FIG. 5).
  • the magnetic circuit assembly 2210 may include a first magnetic element 2202, a first magnetic conductive element 2204, and a second magnetic conductive element 2206.
  • the magnetic circuit components in the above embodiments may have the same structure, and all may be used to refer to structures that provide a magnetic field.
  • the housings in the above embodiments may also have the same structure. Both can be used to refer to the structure that houses the magnetic circuit assembly.
  • the housing of the speaker device may include a housing panel 2222, a housing back 2224, and a housing side 2226.
  • the shell side 2226 and the shell back 2224 are made by an integral molding method, and the shell panel 2222 is connected to one end of the shell side 2226 through a subassembly.
  • the method of assembling the parts includes fixing with glue, or fixing the shell panel 2222 to one end of the shell side 2226 by clamping, welding or screwing.
  • the housing panel 2222 and the housing side 2226 (or the housing back 2224) may be made of different, identical or partially identical materials.
  • the housing panel 2222 and the housing side 2226 are made of the same material, and the Young's modulus of the same material is greater than 2000 MPa, more preferably, the Young's modulus of the same material is greater than 4000 MPa, more preferably, the same
  • the Young's modulus of the material is greater than 6000 MPa, more preferably, the Young's modulus of the shell material is greater than 8000 MPa, more preferably, the Young's modulus of the same material is greater than 12000 MPa, and more preferably, the Young's modulus of the same material is greater than 15000MPa, further preferably, the Young's modulus of the same material is greater than 18000MPa.
  • the outer shell panel 2222 and the outer shell side 2226 are made of different materials, and the Young's modulus of the different materials are all greater than 4000 MPa, more preferably, the Young's modulus of the different materials are greater than 6000 MPa, more preferably, The Young's modulus of different materials are all greater than 8000MPa, more preferably, the Young's modulus of different materials are greater than 12000MPa, more preferably, the Young's modulus of different materials are greater than 15000MPa, further preferably, the Young's modulus of different materials The modulus is greater than 18000MPa.
  • the materials of the housing panel 2222 and/or the housing side 2226 include, but are not limited to, Acrylonitrile-butadiene-styrene (Ary), Polystyrene (PS), high High impact polystyrene (HIPS), polypropylene (Polypropylene, PP), polyethylene terephthalate (Polyethylene terephthalate, PET), polyester (Polyester, PES), polycarbonate (Polycarbonate, PC ), Polyamides (PA), Polyvinyl chloride (PVC), Polyurethanes (PU), Polyvinylidene (Polyvinylidene chloride), Polyethylene (PE), Polymethyl methacrylate (Polymethylmethacrylate (PMMA), Polyetheretherketone (PEEK), Phenolics (PF), Urea-formaldehyde (UF), Melamine-formaldehyde (MF) and some metals, Any material in alloy (such as aluminum alloy, chromium-molybden
  • the material of the housing panel 2222 is any combination of materials such as glass fiber, carbon fiber, and polycarbonate (Polycarbonate (PC), polyamide (Polyamides, PA), etc.
  • the material of the housing panel 2222 and/or the housing side 2226 may be made of carbon fiber and polycarbonate (Polycarbonate, PC) mixed according to a certain ratio.
  • the material of the housing panel 2222 and/or the housing side 2226 may be made of carbon fiber, glass fiber and polycarbonate (Polycarbonate, PC) mixed according to a certain ratio.
  • the material of the shell panel 2222 and/or the shell side 2226 may be made of glass fiber and polycarbonate (Polycarbonate, PC) mixed according to a certain ratio, or glass fiber and polyamide (Polyamides, PA) Made according to a certain ratio.
  • the housing panel 2222, the housing back 2224, and the housing side 2226 form an overall structure with a certain accommodating space.
  • the vibration transmission sheet 2214 is connected to the magnetic circuit assembly 2210 through a connection 2216.
  • the two sides of the magnetic circuit assembly 2210 are connected to the first magnetic conductive element 2204 and the second magnetic conductive element 2206 respectively.
  • the vibration-transmitting piece 2214 is fixed to the inside of the overall structure through the housing bracket 2228.
  • the housing side 2226 has a stepped structure for supporting the housing bracket 2228.
  • the shell panel 2222 may be fixed on the shell bracket 2228 and the shell side 2226 at the same time, or separately fixed on the shell bracket 2228 or the shell side 2226.
  • the housing side 2226 and the housing bracket 2228 may be integrally formed.
  • the housing bracket 2228 may be directly fixed on the housing panel 2222 (for example, by means of glue, snapping, welding, or screw connection).
  • the fixed housing panel 2222 and the housing bracket 2228 are then fixed to the side of the housing (for example, by means of glue, clamping, welding, or screw connection).
  • the housing bracket 2228 and the housing panel 2222 may be integrally formed.
  • the speaker device in this embodiment mainly includes a magnetic circuit assembly 2240 and a housing.
  • the magnetic circuit assembly 2240 may include a first magnetic element 2232, a first magnetic conductive element 2234, and a second magnetic conductive element 2236.
  • the vibration-transmitting sheet 2244 is connected to the magnetic circuit assembly 2240 through a connecting member 2246.
  • the magnetic circuit components in the above embodiments may be of the same structure, and both may be used to refer to structures that provide a magnetic field, and the housing in the above embodiments may be of the same structure, which may be used to refer to accommodating magnetic fields.
  • the structure of the circuit assembly, the vibration transmission sheet in the above embodiment may also be the same structure, which can be used to refer to the structure for adjusting the low-frequency resonance peak.
  • the connectors in the above embodiments can all be used to refer to the components connecting the vibrating plate and the magnetic circuit assembly. This embodiment differs from the embodiment provided in FIG. 6 in that the housing bracket 2258 and the housing side 2256 are integrally formed.
  • the shell panel 2252 is fixed on the side of the shell side 2256 connected to the shell bracket 2258 (for example, by means of glue, snapping, welding, or screw connection), and the back 2254 of the shell is fixed on the other side of the shell side 2256 (for example, By means of glue sticking, clamping, welding or screw connection).
  • the shell bracket 2258 and the shell side 2256 are a separate combined structure, and the shell panel 2252, the shell back 2254, the shell bracket 2258 and the shell side 2256 are all glued and snapped together by glue , Welding or screw connection for fixed connection.
  • the speaker device in this embodiment mainly includes a magnetic circuit assembly 2270 and a housing.
  • the magnetic circuit assembly 2270 may include a first magnetic element 2262, a first magnetic conductive element 2264, and a second magnetic conductive element 2266.
  • the vibration-transmitting sheet 2274 is connected to the magnetic circuit assembly 2270 through a connecting member 2276.
  • the magnetic circuit components in the above embodiments may be of the same structure, and both may be used to refer to structures that provide a magnetic field, and the housing in the above embodiments may be of the same structure, which may be used to refer to accommodating magnetic fields.
  • the structure of the circuit assembly, the vibration transmission sheet in the above embodiment may also be the same structure, which can be used to refer to the structure for adjusting the low-frequency resonance peak.
  • the difference from FIGS. 6 and 7 is that the housing panel 2282 and the housing side 2286 are integrally formed.
  • the back surface 2284 of the housing is fixed on the side of the housing side 2286 relative to the housing panel 2282 (for example, by means of glue, snapping, welding, or screw connection).
  • the housing bracket 2288 is fixed on the housing panel 2282 and/or the housing side 2286 by glue, clamping, welding or screw connection. In this case, optionally, the housing bracket 2288, the housing panel 2282 and the housing side 2286 are an integrally formed structure.
  • the housing 700 may include a housing panel 710 facing the human body side, a housing back 720 opposite to the housing panel, and a housing side 730.
  • the housing panel 710 contacts the human body and transmits the vibration of the speaker device to the auditory nerve of the human body.
  • the earphone core may cause the case panel 710 and the case back 720 to vibrate, the case panel 710 vibration has a first phase, and the case back 720 vibration has a second phase; wherein, the case panel 710 vibration and case back 720 When the vibration frequency is between 2000 Hz and 3000 Hz, the absolute value of the difference between the first phase and the second phase is less than 60 degrees.
  • the vibration amplitude and phase of the housing panel 710 and the housing back 720 remain the same or substantially the same within a certain frequency range (the housing side 730 does not compress air and thus does not Sound leakage), so that the first sound leakage sound wave generated by the housing panel 710 and the second sound leakage sound wave generated by the rear surface 720 of the housing can be superimposed on each other.
  • the superposition can reduce the amplitude of the first sound leakage sound wave or the second sound leakage sound wave, thereby reducing the sound leakage of the housing 700.
  • the certain frequency range includes at least a portion with a frequency greater than 500 Hz.
  • the certain frequency range includes at least a portion with a frequency greater than 600 Hz.
  • the certain frequency range includes at least a portion with a frequency greater than 800 Hz.
  • the certain frequency range includes at least a portion with a frequency greater than 1000 Hz.
  • the certain frequency range includes at least a portion with a frequency greater than 2000 Hz. More preferably, the certain frequency range includes at least a portion with a frequency greater than 5000 Hz. More preferably, the certain frequency range includes at least a portion with a frequency greater than 8000 Hz. Further preferably, the certain frequency range includes at least a portion with a frequency greater than 10000 Hz.
  • the rigidity of the shell of the bone conduction speaker affects the vibration amplitude and phase of different parts of the shell (for example, the shell panel, the back of the shell, and/or the side of the shell), thereby affecting the sound leakage of the bone conduction speaker.
  • the shell panel and the back of the shell can maintain the same or substantially the same vibration amplitude and phase at a higher frequency, thereby significantly reducing the bone conduction speaker Sound leakage.
  • the higher frequency may include a frequency not less than 1000 Hz, for example, a frequency between 1000 Hz-2000 Hz, a frequency between 1100 Hz-2000 Hz, a frequency between 1300 Hz-2000 Hz, and a frequency between 1500 Hz-2000 Hz Frequency, frequency between 1700Hz-2000Hz, frequency between 1900Hz-2000Hz.
  • the higher frequency mentioned here may include a frequency not less than 2000 Hz, for example, a frequency between 2000 Hz and 3000 Hz, a frequency between 2100 Hz and 3000 Hz, a frequency between 2300 Hz and 3000 Hz, and a frequency between 2500 Hz and 3000 Hz.
  • Frequency frequency between 2700Hz-3000Hz, or frequency between 2900Hz-3000Hz.
  • the higher frequency may include a frequency not less than 4000 Hz, for example, a frequency between 4000 Hz-5000 Hz, a frequency between 4100 Hz-5000 Hz, a frequency between 4300 Hz-5000 Hz, a frequency between 4500 Hz-5000 Hz, 4700 Hz -Frequency between 5000Hz or 4900Hz-5000Hz.
  • the higher frequency may include a frequency not less than 6000 Hz, for example, a frequency between 6000 Hz-8000 Hz, a frequency between 6100 Hz-8000 Hz, a frequency between 6300 Hz-8000 Hz, a frequency between 6500 Hz-8000 Hz, Frequency between 7000Hz-8000Hz, frequency between 7500Hz-8000Hz, or frequency between 7900Hz-8000Hz.
  • the higher frequency may include a frequency not less than 8000 Hz, for example, a frequency between 8000 Hz and 12000 Hz, a frequency between 8100 Hz and 12000 Hz, a frequency between 8300 Hz and 12000 Hz, a frequency between 8500 Hz and 12000 Hz, Frequency between 9000Hz-12000Hz, frequency between 10000Hz-12000Hz, or frequency between 11000Hz-12000Hz.
  • the same or substantially the same vibration amplitude means that the ratio of the vibration amplitude of the shell panel and the back of the shell is within a certain range.
  • the ratio of the vibration amplitude of the shell panel and the back of the shell is between 0.3 and 3.
  • the ratio of the vibration amplitude of the shell panel and the back of the shell is between 0.4 and 2.5.
  • the vibration amplitude of the shell panel and the back of the shell The ratio of between 0.5 to 1.5, more preferably, the ratio of the vibration amplitude of the enclosure panel and the back of the enclosure is between 0.6 and 1.4, and more preferably, the ratio of the vibration amplitude of the enclosure panel and the back of the enclosure is between 0.7 and 1.2 More preferably, the ratio of the vibration amplitude of the shell panel and the back of the shell is between 0.75 and 1.15. More preferably, the ratio of the vibration amplitude of the shell panel and the back of the shell is between 0.8 and 1.1. More preferably, the shell panel and The ratio of the vibration amplitude of the back of the casing is between 0.85 and 1.1.
  • the ratio of the vibration amplitude of the casing panel and the back of the casing is between 0.9 and 1.05.
  • the vibration of the enclosure panel and the back of the enclosure can be represented by other physical quantities that can characterize the amplitude of its vibration.
  • the sound pressure generated by the shell panel and the back of the shell at a point in the space can be used to characterize the vibration amplitude of the shell panel and the back of the shell.
  • the same or substantially the same vibration phase of the shell panel and the back of the shell means that the difference in the vibration phase of the shell panel and the back of the shell is within a certain range.
  • the difference in vibration phase between the shell panel and the back of the shell is between -90° and 90°, preferably, the difference in vibration phase between the shell panel and the back of the shell is between -80° and 80°, preferably, The difference in vibration phase between the shell panel and the back of the shell is between -60° and 60°, preferably, the difference in vibration phase between the shell panel and the back of the shell is between -45° and 45°, more preferably, the shell
  • the difference between the vibration phase of the panel and the back of the casing is between -30° and 30°, more preferably, the difference between the vibration phase of the panel and the back of the casing is between -20° and 20°, more preferably, the casing
  • the difference between the vibration phase of the panel and the back of the casing is between -15° and 15°, more preferably, the
  • the above description of the speaker device is only a specific example, and should not be regarded as the only feasible implementation.
  • the sides of the case, the back of the case, and the panel are not limited to the above-mentioned connections.
  • the side of the housing, the back of the housing, and the housing bracket are an integrally formed structure. Such deformations are within the scope of protection of this application.
  • the speaker device may include a driving device 101, a transmission component 303, a panel 301, a housing 302, and the like.
  • housing and the housing in the above embodiments may have the same structure, and both can be used to refer to the structure that houses the magnetic circuit assembly, and the panel and the housing panel can also be the same structure, which can be used to refer to the human body. Touch the structure that transmits sound.
  • the driving device 101 transmits the vibration signal to the panel 301 and/or the housing 302 through the transmission assembly 303, so that the sound is transmitted to the human body through the contact of the panel 301 or the housing 302 with the human skin.
  • the speaker's panel 301 and/or housing 302 may be in contact with human skin at the tragus, thereby transmitting sound to the human body.
  • the panel 301 and/or the housing 302 may also be in contact with human skin on the back side of the auricle.
  • the driving force generated by the driving device 101 lies on a straight line B (or a vibration direction of the driving device), which has an angle ⁇ with the normal A of the panel 301.
  • line B is not parallel to line A.
  • the panel 301 has an area that contacts or abuts the user's body, such as human skin. It should be understood that when the panel 301 is covered with other materials (such as soft materials such as silicone) to enhance the user's wearing comfort, the relationship between the panel 301 and the user's body is not direct contact, but abutting each other. In some embodiments, when the speaker is worn on the user's body, the entire area of the panel 301 contacts or abuts the user's body. In some embodiments, after the speaker is worn on the user's body, a partial area of the panel 301 contacts or abuts the user's body.
  • other materials such as soft materials such as silicone
  • the area on the panel 301 for contacting or abutting the user's body may occupy more than 50% of the area of the entire panel 301, and more preferably, may occupy more than 60% of the area of the panel.
  • the area on the panel 301 that contacts or abuts the user's body may be a flat surface or a curved surface.
  • the normal when the area on the panel 301 for contacting or abutting the user's body is a plane, its normal meets the general definition of normal. In some embodiments, when the area on the panel 301 for contacting or abutting the user's body is a curved surface, the normal is the average normal of the area.
  • the curved surface is a quasi-plane close to a flat surface, that is, a surface whose angle between the normal at any point in at least 50% of the curved surface and its average normal is less than the set threshold.
  • the set threshold is less than 10°; in some embodiments, the set threshold may be further less than 5°.
  • the straight line B where the driving force is located and the normal A'of the area on the panel 301 for contacting or abutting the user's body have an angle ⁇ .
  • the numerical range of the included angle ⁇ may be 0 ⁇ 180°, and further the numerical range may be 0 ⁇ 180° and not equal to 90°.
  • the straight line B is set to have a positive direction pointing out of the speaker, and the normal A of the panel 301 (or the normal A'of the contact surface of the panel 301 with human skin) is also set to have a positive direction pointing out of the speaker, Then, the angle ⁇ formed by the straight line A or A′ and the straight line B in the positive direction is an acute angle, that is, 0 ⁇ 90°.
  • FIG. 11 is a schematic diagram of an included angle direction according to some embodiments of the present application. As shown in FIG. 11, in some embodiments, the driving force generated by the driving device 101 has a component in the first quadrant and/or the third quadrant of the XOY plane coordinate system.
  • the XOY plane coordinate system is a reference coordinate system
  • the origin O is located after the speaker is worn on the human body, the contact surface of the panel and/or the casing and the human body
  • the X axis is parallel to the human coronal axis
  • the Y axis is parallel to the human sagittal axis Parallel, with the positive direction of the X-axis toward the outside of the human body and the positive direction of the Y-axis toward the front of the human body.
  • the quadrant should be understood as the four areas divided by the horizontal axis (such as the X axis) and the vertical axis (such as the Y axis) in the plane rectangular coordinate system, and each area is called a quadrant.
  • the quadrant is centered on the origin, and the X and Y axes are the dividing lines.
  • the upper right (the area surrounded by the positive half axis of the X axis and the positive half axis of the Y axis) is called the first quadrant, and the upper left (the area surrounded by the negative half axis of the X axis and the positive half axis of the Y axis) is called The second quadrant, the lower left (the area enclosed by the negative half axis of the X axis and the negative half axis of the Y axis) is called the third quadrant, and the lower right (the positive half axis of the X axis is surrounded by the negative half axis of the Y axis) Is called the fourth quadrant.
  • the point on the coordinate axis does not belong to any quadrant.
  • the driving force may be directly located in the first quadrant and/or third quadrant of the XOY plane coordinate system, or the driving force may be in other directions, but in the first quadrant and/or third of the XOY plane coordinate system.
  • the projection or component in the quadrant is not 0, and the projection or component in the Z-axis direction may be 0 or not 0.
  • the Z axis is perpendicular to the XOY plane and passes through the origin O.
  • the minimum angle ⁇ between the straight line where the driving force is located and the normal to the area of the panel that contacts or abuts the user's body may be any acute angle, for example, the range of the angle ⁇ is preferably 5° to 80 °; more preferably 15° to 70°; still more preferably 25° to 60°; still more preferably 25° to 50°; still more preferably 28° to 50°; still more preferably 30° to 39°; still more preferably 31° to 38°; more preferably 32° to 37°; more preferably 33° to 36°; more preferably 33° to 35.8°; more preferably 33.5° to 35°.
  • the included angle ⁇ may be 26°, 27°, 28°, 29°, 30°, 31°, 32°, 33°, 34°, 34.2°, 35°, 35.8°, 36°, 37° or 38°, etc., the error is controlled within 0.2 degrees.
  • the driving force may also have a component in the second and fourth quadrants of the XOY plane coordinate system, or even The driving force can also be located on the Y axis and so on.
  • the speaker device includes a driving device 101 (also referred to as a transducing device in other embodiments), a transmission assembly 303, a panel 301, and a housing 302.
  • a driving device 101 also referred to as a transducing device in other embodiments
  • a transmission assembly 303 also referred to as a transducing device in other embodiments
  • a panel 301 also referred to as a transducing device in other embodiments
  • the straight line where the driving force is located is collinear or parallel to the straight line where the driving device 101 vibrates.
  • the direction of the driving force may be the same as or opposite to the vibration direction of the coil and/or the magnetic circuit assembly.
  • the panel 301 may be a flat surface or a curved surface, or the panel 301 has several protrusions or grooves.
  • the normal of the area on the panel 301 that contacts or abuts the user's body is not parallel to the line where the driving force is located.
  • the area on the panel 301 that contacts or abuts the user's body is relatively flat, which may be a flat surface or a quasi-flat surface whose curvature does not change much.
  • the normal line at any point on the panel 301 can be used as the normal line of the area.
  • the normal of the area may be its average normal. For the detailed definition of the average normal, please refer to the related description in FIG. 10, which will not be repeated here.
  • the normal of the area can also be determined as follows.
  • the straight line where the driving force is located or the straight line where the driving device 101 vibrates
  • the normal of the area have an angle ⁇ , and the included angle is 0 ⁇ 180°.
  • the specified panel when the line on which the specified driving force is located has a positive direction pointing out of the speaker device through the panel (or the contact surface of the panel and/or the casing with the human skin), the specified panel (or the panel 301 and/or the casing 302 and the human body)
  • the skin contact surface) normal has a positive direction pointing out of the speaker device, and the angle formed by these two straight lines in the positive direction is an acute angle.
  • the coil 304 and the magnetic circuit assembly 307 are both ring-shaped structures. In some embodiments, the coil 304 and the magnetic circuit assembly 307 have mutually parallel axes, and the axis of the coil 304 or the magnetic circuit assembly 307 is perpendicular to the radial plane of the coil 304 and/or the radial plane of the magnetic circuit assembly 307.
  • the coil 304 and the magnetic circuit assembly 307 have the same central axis, the central axis of the coil 304 is perpendicular to the radial plane of the coil 304, and passes through the geometric center of the coil 304, the central axis of the magnetic circuit assembly 307 and the magnetic
  • the radial plane of the path assembly 307 is perpendicular and passes through the geometric center of the magnetic path assembly 307.
  • the axis of the coil 304 or the magnetic circuit assembly 307 has the aforementioned angle ⁇ with the normal line of the panel 301.
  • the magnetic circuit components in the above embodiments may be of the same structure, which may be used to refer to the structure that provides the magnetic field
  • the coils in the above embodiments may be of the same structure, which may be used to refer to the ability to receive External electrical signal, the component that converts electrical signal into mechanical vibration signal under the action of magnetic field.
  • the relationship between the driving force F and the skin deformation S will be described below in conjunction with FIG. 13.
  • the driving force generated by the driving device 101 is parallel to the normal line of the panel 301 (that is, the angle ⁇ is zero)
  • the relationship between the driving force and the total skin deformation is:
  • F ⁇ is the driving force
  • S ⁇ is the total deformation of the skin in the direction perpendicular to the skin
  • E is the elastic modulus of the skin
  • A is the contact area between the panel 301 and the skin
  • h is the total thickness of the skin (that is, the panel and bone the distance between).
  • the relationship between the driving force in the vertical direction and the total skin deformation can be As shown in the formula:
  • F // is the magnitude of the driving force
  • S // is the total deformation of the skin in the direction parallel to the skin
  • G is the shear modulus of the skin
  • A is the contact area of the panel 301 and the skin
  • h is the total thickness of the skin (ie The distance between the panel and the bone).
  • the relationship between the shear modulus G and the elastic modulus E is:
  • ⁇ is the Poisson's ratio of the skin 0 ⁇ ⁇ 0.5, so the shear modulus G is less than the elastic modulus E, corresponding to the total skin deformation S // > S ⁇ under the same driving force.
  • the Poisson's ratio of the skin is close to 0.4.
  • FIG. 13 is an angle-relative displacement relationship diagram of a speaker device according to some embodiments of the present application.
  • the relationship between the included angle ⁇ and the total skin deformation is that the greater the included angle ⁇ , the greater the relative displacement, and the greater the total skin deformation S.
  • the volume of the speaker device in the low-frequency portion is positively correlated with the total skin deformation S.
  • the volume of the speaker device in the high-frequency part is positively related to the skin deformation S ⁇ in the direction perpendicular to the skin. The larger S ⁇ , the louder the low frequency.
  • the relationship between the included angle ⁇ and the total skin deformation S, and the skin deformation S ⁇ in the vertical skin direction can be found in FIG. 14.
  • the relationship between the included angle ⁇ and the total skin deformation S is that the greater the included angle ⁇ , the larger the total skin deformation S, and the greater the volume of the low-frequency portion of the corresponding speaker device.
  • the relationship between the included angle ⁇ and the skin deformation S ⁇ in the vertical skin direction is that the greater the included angle ⁇ , the smaller the skin deformation S ⁇ in the vertical skin direction, the lower the volume of the corresponding high-frequency part of the speaker device .
  • the angle ⁇ should be at an appropriate size.
  • the range of ⁇ is 5° to 80°, or 15° to 70°, or 25° to 50°, or 25° to 35°, or 25° to 30°, and so on.
  • FIG. 14 is a schematic diagram of a low-frequency part of a frequency response curve of a speaker device at different included angles ⁇ according to some embodiments of the present application.
  • the panel 301 is in contact with the skin and transmits vibration to the skin.
  • the skin also affects the vibration of the speaker device, thereby affecting the frequency response curve of the speaker device. From the above analysis, we found that the greater the angle of the clip, the greater the total deformation of the skin under the same driving force, and corresponding to the speaker device, the elasticity of the skin relative to the portion of the panel 301 is reduced.
  • the driving force of the driving device 101 is on a straight line and the normal line on the panel 301 in contact with or against the user's body forms a certain angle ⁇ , especially when the angle ⁇ increases, the The resonance peak of the low frequency region in the frequency response curve is adjusted to a lower frequency region, so that the low frequency dives deeper and the low frequency increases.
  • setting the angle can effectively increase the low-frequency energy while suppressing the increase of the vibration sensation, thereby reducing the vibration sensation relatively, making the speaker device low-frequency Sensitivity is significantly improved, improving sound quality and human experience.
  • the increased low frequency and the less sense of vibration can be expressed as the angle ⁇ increases in the range of (0, 90°), the energy in the low frequency range of the vibration or sound signal increases, and Vibration sensation also increased, but the energy in the low-frequency range increased to a greater extent than vibration sensation. Therefore, in the relative effect, vibration sensation was relatively reduced. It can be seen from FIG. 14 that when the angle is large, the resonance peak in the low-frequency region appears at a lower frequency band, and the part where the frequency curvature is flat can be extended in disguise, thereby improving the sound quality of the speaker.
  • the minimum angle ⁇ between the straight line where the driving force is located and the normal line of the area on the panel that contacts or abuts the user's body can be any acute angle, and the acute angle here is not limited to the above 5°-80°,
  • the included angle ⁇ may be less than 5°, such as 1°, 2°, 3°, 4°, etc.
  • the included angle ⁇ may be greater than 80° and less than 90°, such as 81°, 82°, 85°, and so on.
  • the specific value of the included angle ⁇ may not be an integer (for example, 81.3°, 81.38°). Such deformations are within the scope of protection of this application.
  • FIG. 15 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application. It should be understood that, without violating the principle, the content described below can be equally applied to air conduction speaker devices and bone conduction speaker devices.
  • the speaker device may include a first magnetic element 202, a first magnetic conductive element 204, a second magnetic conductive element 206, a first vibration plate 207, a voice coil 110, and a second vibration plate 1120 ⁇ vibration panel 114 ⁇
  • some components of the earphone core in the bone conduction speaker may constitute a magnetic circuit assembly.
  • the magnetic circuit assembly may include a first magnetic element 202, a first magnetically conductive element 204, and a second magnetically conductive element 206.
  • the magnetic circuit assembly may generate a first full magnetic field (also may be referred to as "total magnetic field of the magnetic circuit assembly" or "first magnetic field").
  • the magnetic elements described in this application can be used to refer to elements that generate a magnetic field, such as magnets.
  • the magnetic element may have a magnetization direction, which refers to the direction of the magnetic field inside the magnetic element.
  • the first magnetic element 202 may include one or more magnets, and the first magnetic element 202 may generate a second magnetic field.
  • the magnet may include a metal alloy magnet, ferrite, or the like.
  • the metal alloy magnet may include neodymium iron boron, samarium cobalt, aluminum nickel cobalt, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or a combination thereof.
  • the ferrite may include barium ferrite, steel ferrite, manganese ferrite, lithium manganese ferrite, or the like, or a combination thereof.
  • the lower surface of the first magnetic element 204 may be connected to the upper surface of the first magnetic element 202.
  • the second magnetic element 206 may be connected to the first magnetic element 202.
  • the magnetizer mentioned here can also be called a magnetic field concentrator or iron core.
  • the magnetizer can adjust the distribution of the magnetic field (for example, the magnetic field generated by the first magnetic element 202).
  • the magnetizer may include elements machined from soft magnetic materials.
  • the soft magnetic material may include metal materials, metal alloys, metal oxide materials, amorphous metal materials, etc., such as iron, iron-silicon alloys, iron-aluminum alloys, nickel-iron alloys, iron-cobalt alloys , Low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc.
  • the magnetizer can be processed by one or more combinations of casting, plastic processing, cutting processing, powder metallurgy, and the like. Casting can include sand casting, investment casting, pressure casting, centrifugal casting, etc.; plastic processing can include one or more combinations of rolling, casting, forging, stamping, extrusion, drawing, etc.; cutting processing can include turning and milling , Planing, grinding, etc.
  • the processing method of the magnetizer may include 3D printing, CNC machine tools, and the like.
  • the connection manners between the first magnetically permeable element 204, the second magnetically permeable element 206 and the first magnetic element 202 may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the first magnetic element 202, the first magnetic permeable element 204, and the second magnetic permeable element 206 may be arranged in an axisymmetric structure.
  • the axisymmetric structure may be a ring structure, a columnar structure, or other axisymmetric structure.
  • a magnetic gap may be formed between the first magnetic element 202 and the second magnetic conductive element 206.
  • the voice coil 110 may be disposed in the magnetic gap.
  • the voice coil 110 may be connected to the first vibration plate 207.
  • the first vibration plate 207 may be connected to the second vibration plate 1120, and the second vibration plate 1120 may be connected to the vibration panel 114.
  • the voice coil 110 When current is applied to the voice coil 110, the voice coil 110 is located in the magnetic field formed by the first magnetic element 202, the first magnetic permeable element 204, and the second magnetic permeable element 206, which is subjected to ampere force, which drives the voice coil 110 Vibration, the vibration of the voice coil 110 will drive the vibration of the first vibration plate 207, the second vibration plate 1120 and the vibration panel 114.
  • the vibration panel 114 transmits vibration to the auditory nerve through tissues and bones, so that a person can hear sound.
  • the vibration panel 114 may directly contact the human skin, or may contact the skin through a vibration transmission layer composed of a specific material.
  • the magnetic induction lines passing through the voice coil 110 are not uniform and are divergent.
  • magnetic leakage may be formed in the magnetic circuit, that is, more magnetic induction lines leak out of the magnetic gap and fail to pass through the voice coil 110, thereby reducing the magnetic induction strength (or magnetic field strength) at the position of the voice coil 110, affecting the speaker Sensitivity. Therefore, the speaker may further include at least one second magnetic element and/or at least one third magnetic conductive element (not shown).
  • At least one second magnetic element and/or at least one third magnetic conductive element can suppress the leakage of magnetic induction lines, restrict the shape of the magnetic induction lines passing through the voice coil 110, so that more magnetic induction lines pass through the voice coil as densely as possible 110, to enhance the magnetic induction strength (or magnetic field strength) at the position of the voice coil 110, thereby improving the sensitivity of the speaker, thereby improving the mechanical conversion efficiency of the speaker (ie, the efficiency of converting the electrical energy input to the speaker 100 into the mechanical energy of the vibration of the voice coil 110) .
  • the magnetic circuit assembly 2100 may include a first magnetic element 202, a first magnetic conductive element 204, a second magnetic conductive element 206, and a second magnetic element 208.
  • the magnetic circuit components in the above embodiments may be of the same structure, and both may be used to refer to a structure that provides a magnetic field.
  • the first magnetic element 202 and/or the second magnetic element 208 may include any one or more of the magnets described in this application.
  • the first magnetic element 202 may include a first magnet
  • the second magnetic element 208 may include a second magnet
  • the first magnet and the second magnet may be the same or different.
  • the first magnetically permeable element 204 and/or the second magnetically permeable element 206 may include any one or several magnetically permeable materials described in this application.
  • the processing method of the first magnetic conductive element 204 and/or the second magnetic conductive element 206 may include any one or several processing methods described in this application.
  • the first magnetic element 202 and/or the first magnetically conductive element 204 may be configured as an axisymmetric structure.
  • the first magnetic element 202 and/or the first magnetic permeable element 204 may be a cylinder, a rectangular parallelepiped, or a hollow ring (for example, the cross-section is in the shape of a racetrack).
  • the first magnetic element 202 and the first magnetic conductive element 204 may be coaxial cylinders, containing the same or different diameters.
  • the second magnetically conductive element 206 may be a groove-type structure.
  • the groove-shaped structure may include a U-shaped profile.
  • the groove-shaped second magnetic conductive element 206 may include a bottom plate and a side wall.
  • the bottom plate and the side wall may be integrally formed, for example, the side wall may be formed by the bottom plate extending in a direction perpendicular to the bottom plate.
  • the bottom plate may be connected to the side wall by any one or several connection methods described in this application.
  • the second magnetic element 208 may be set in a ring shape or a sheet shape. In some embodiments, the second magnetic element 208 may be ring-shaped.
  • the second magnetic element 208 may include an inner ring and an outer ring.
  • the shape of the inner ring and/or outer ring may be a circle, an ellipse, a triangle, a quadrangle, or any other polygon.
  • the second magnetic element 208 may be composed of multiple magnet arrangements. The two ends of any one of the plurality of magnets may be connected to the two ends of adjacent magnets or have a certain distance. The spacing between multiple magnets may be the same or different.
  • the second magnetic element may be composed of 2 or 3 sheet-shaped magnets arranged equidistantly. The shape of the sheet-shaped magnet may be a fan shape, a quadrilateral shape, or the like.
  • the second magnetic element 208 may be coaxial with the first magnetic element 202 and/or the first magnetically conductive element 204.
  • first magnetic element 202 may be connected to the lower surface of the first magnetic conductive element 204.
  • the lower surface of the first magnetic element 202 may be connected to the bottom plate of the second magnetic element 206.
  • the lower surface of the second magnetic element 208 is connected to the side wall of the second magnetic conductive element 206.
  • the connection methods between the first magnetic element 202, the first magnetic permeable element 204, the second magnetic permeable element 206, and/or the second magnetic element 208 may include one of bonding, clamping, welding, riveting, bolting, etc. or Many combinations.
  • a magnetic gap is formed between the first magnetic element 202 and/or the first magnetically conductive element 204 and the inner ring of the second magnetic element 208.
  • the voice coil 238 may be disposed in the magnetic gap. In some embodiments, the height of the voice coil 238 of the second magnetic element 208 relative to the bottom plate of the second magnetic conductive element 206 is equal.
  • the first magnetic element 202, the first magnetic conductive element 204, the second magnetic conductive element 206, and the second magnetic element 208 may form a magnetic circuit.
  • the magnetic circuit assembly 2100 can generate a first full magnetic field (also referred to as "total magnetic field of the magnetic circuit assembly" or "first magnetic field"), and the first magnetic element 202 can generate a second magnetic field.
  • the first full magnetic field is jointly formed by the magnetic fields generated by all components in the magnetic circuit assembly 2100 (for example, the first magnetic element 202, the first magnetic permeable element 204, the second magnetic permeable element 206, and the second magnetic element 208).
  • the magnetic field strength of the first full magnetic field within the magnetic gap (which may also be referred to as magnetic induction or magnetic flux density) is greater than the magnetic field strength of the second magnetic field within the magnetic gap.
  • the second magnetic element 208 can generate a third magnetic field, which can increase the strength of the first full magnetic field at the magnetic gap.
  • the third magnetic field mentioned here improves the magnetic field strength of the first full magnetic field means that when the third magnetic field is present (ie, the second magnetic element 208 is present), the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the third magnetic field.
  • the first full magnetic field is when the magnetic field is present (ie, the second magnetic element 208 is not present).
  • the magnetic circuit assembly indicates a structure including all magnetic elements and magnetic permeable elements
  • the first full magnetic field indicates the magnetic field generated by the entire magnetic circuit assembly
  • the second magnetic field indicates the third magnetic field ,...
  • the Nth magnetic field respectively represents the magnetic field generated by the corresponding magnetic element.
  • the magnetic elements that generate the second magnetic field may be the same or different.
  • the voice coils in the above-mentioned embodiments may have the same structure and may be used to refer to components that transmit audio signals.
  • the magnetic circuit components in the above-mentioned embodiments may have the same structure and may be used to refer to providing The structure of the magnetic field.
  • the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the second magnetic element 208 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the second magnetic element 208 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the second magnetic element 208 is equal to or greater than 90 degrees.
  • the magnetization direction of the first magnetic element 202 is perpendicular to the lower surface or the upper surface of the first magnetic element 202 vertically upward (as shown in the direction of a in the figure), and the magnetization direction of the second magnetic element 208 is determined by the The inner ring of the two magnetic elements 208 points toward the outer ring (as shown in the direction of b in the figure, on the right side of the first magnetic element 202, the magnetization direction of the first magnetic element 202 is deflected 90 degrees in the clockwise direction).
  • the angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 208 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 208, the angle between the direction of the magnetic field generated by the first magnetic element 202 and the magnetization direction of the second magnetic element 208 may be 0 degrees, 10 degrees, 20 degrees Equal to or less than 90 degrees. Further, compared with the magnetic circuit assembly of a single magnetic element, the second magnetic element 208 can increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 2100, thereby increasing the magnetic induction intensity in the magnetic gap. Moreover, under the action of the second magnetic element 208, the originally divergent magnetic induction lines converge to the position of the magnetic gap, further increasing the magnetic induction intensity in the magnetic gap.
  • the magnetic circuit assembly 2600 may further include at least one conductive element (for example, the first conductive element 248, the second conductive element 250, and the third conductive element 252).
  • the conductive elements may include metallic materials, metal alloy materials, inorganic non-metallic materials, or other conductive materials.
  • Metal materials may include gold, silver, copper, aluminum, etc.; metal alloy materials may include iron-based alloys, aluminum-based alloy materials, copper-based alloys, zinc-based alloys, etc.; inorganic non-metallic materials may include graphite, etc.
  • the conductive element may be in the form of a sheet, a ring, a mesh, or the like.
  • the first conductive element 248 may be disposed on the upper surface of the first magnetic conductive element 204.
  • the second conductive element 250 may connect the first magnetic element 202 and the second magnetic conductive element 206.
  • the third conductive element 252 may be connected to the side wall of the first magnetic element 202.
  • the first magnetic conductive element 204 may protrude from the first magnetic element 202 to form a first concave portion, and the third conductive element 252 is disposed in the first concave portion.
  • the first conductive element 248, the second conductive element 250, and the third conductive element 252 may include the same or different conductive materials.
  • the first conductive element 248, the second conductive element 250 and the third conductive element 252 may be connected to the first magnetic conductive element 204, the second magnetic conductive element 206 and/or via any one or more of the connection methods described in this application First magnetic element 202.
  • a magnetic gap is formed between the inner ring of the first magnetic element 202, the first magnetic conductive element 204 and the second magnetic element 208.
  • the voice coil 238 may be disposed in the magnetic gap.
  • the first magnetic element 202, the first magnetic conductive element 204, the second magnetic conductive element 206, and the second magnetic element 208 may form a magnetic circuit.
  • the conductive element may reduce the inductive reactance of the voice coil 238. For example, if a first alternating current is applied to the voice coil 238, a first alternating induced magnetic field will be generated near the voice coil 238.
  • the first alternating induction magnetic field will cause the voice coil 238 to have an inductive reactance and hinder the movement of the voice coil 238.
  • a conductive element for example, the first conductive element 248, the second conductive element 250, and the third conductive element 252
  • the conductive element can induce a second alternating Current.
  • the third alternating current in the conductive element can generate a second alternating induced magnetic field near it.
  • the second alternating induced magnetic field is opposite to the first alternating induced magnetic field, which can weaken the first alternating induced magnetic field, thereby reducing sound
  • the inductive reactance of the coil 238 increases the current in the voice coil and improves the sensitivity of the speaker device.
  • the magnetic circuit assembly 2700 may further include a third magnetic element 510, a fourth magnetic element 512, a fifth magnetic element 514, a third magnetic conductive element 516, and a sixth magnetic element Element 524 and seventh magnetic element 526.
  • the third magnetic element 510, the fourth magnetic element 512, the fifth magnetic element 514, the third magnetic permeable element 516 and/or the sixth magnetic element 524, and the seventh magnetic element 526 may be arranged as coaxial circular cylinders.
  • the magnetic circuit components in the above embodiments can all be used to refer to a structure that provides a magnetic field.
  • the upper surface of the second magnetic element 208 is connected to the seventh magnetic element 526, and the lower surface of the second magnetic element 208 may be connected to the third magnetic element 510.
  • the third magnetic element 510 may be connected to the second magnetic conductive element 206.
  • the upper surface of the seventh magnetic element 526 may be connected to the third magnetic conductive element 516.
  • the fourth magnetic element 512 can connect the second magnetic conductive element 206 and the first magnetic element 202.
  • the sixth magnetic element 524 may be connected to the fifth magnetic element 514, the third magnetic conductive element 516, and the seventh magnetic element 526.
  • the third magnetic element 516, the sixth magnetic element 524, and the seventh magnetic element 526 may form a magnetic circuit and a magnetic gap.
  • the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the sixth magnetic element 524 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the sixth magnetic element 524 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the sixth magnetic element 524 is not higher than 90 degrees.
  • the magnetization direction of the first magnetic element 202 is perpendicular to the lower surface or the upper surface of the first magnetic element 202 vertically upward (as shown in direction a), and the magnetization direction of the sixth magnetic element 524 is determined by the sixth The outer ring of the magnetic element 524 points toward the inner ring (as shown in the direction g in the figure, on the right side of the first magnetic element 202, the magnetization direction of the first magnetic element 202 is deflected 270 degrees in the clockwise direction). In some embodiments, in the same vertical direction, the magnetization direction of the sixth magnetic element 524 and the magnetization direction of the fourth magnetic element 512 may be the same.
  • the angle between the direction of the magnetic field generated by the magnetic circuit assembly 2700 and the magnetization direction of the sixth magnetic element 524 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 524, the angle between the direction of the magnetic field generated by the first magnetic element 202 and the magnetization direction of the sixth magnetic element 524 may be 0 degrees, 10 degrees, 20 degrees Equal to or less than 90 degrees.
  • the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the seventh magnetic element 526 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the seventh magnetic element 526 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 202 and the magnetization direction of the seventh magnetic element 526 is not higher than 90 degrees.
  • the magnetization direction of the first magnetic element 202 is perpendicular to the lower surface or the upper surface of the first magnetic element 202 (as shown in direction a), and the magnetization direction of the seventh magnetic element 526 is determined by the seventh The lower surface of the magnetic element 526 points to the upper surface (as shown in the direction f in the figure, on the right side of the first magnetic element 202, the magnetization direction of the first magnetic element 202 is deflected 360 degrees in the clockwise direction).
  • the magnetization direction of the seventh magnetic element 526 and the magnetization direction of the third magnetic element 510 may be opposite.
  • the angle between the direction of the magnetic field generated by the magnetic circuit assembly 2700 and the magnetization direction of the seventh magnetic element 526 is not higher than 90 degrees. In some embodiments, at the position of the seventh magnetic element 526, the angle between the direction of the magnetic field generated by the first magnetic element 202 and the magnetization direction of the seventh magnetic element 526 may be 0 degrees, 10 degrees, 20 degrees Equal to or less than 90 degrees.
  • the third magnetic permeable element 516 can close the magnetic circuit generated by the magnetic circuit assembly 2700, so that more magnetic induction lines are concentrated in the magnetic gap, thereby suppressing magnetic leakage and increasing the magnetic induction at the magnetic gap Strength, and the effect of improving the sensitivity of the speaker.
  • the magnetic circuit assembly 3100 may include a first magnetic element 602, a first magnetic conductive element 604, a first full magnetic field changing element 606, and a second magnetic element 608.
  • the first magnetic element of the above embodiments can be used to refer to elements for energy storage, energy conversion, and electrical isolation.
  • the second magnetic element also follows this principle.
  • the magnetic conductive elements of the above embodiments can all be used to refer to elements that form a magnetic field loop.
  • the upper surface of the first magnetic element 602 may be connected to the lower surface of the first magnetic conductive element 604, and the second magnetic element 608 may be connected to the first magnetic element 602 and the first full magnetic field changing element 606.
  • the connection between the first magnetic element 602, the first magnetic permeable element 604, the first full magnetic field changing element 606 and/or the second magnetic element 608 may be based on any one or several connection methods described in this application.
  • the first magnetic element 602, the first magnetic conductive element 604, the first full magnetic field changing element 606, and/or the second magnetic element 608 may form a magnetic circuit and a magnetic gap.
  • the magnetic circuit assembly 3100 can generate a first full magnetic field, and the first magnetic element 602 can generate a second magnetic field.
  • the magnetic field strength of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap .
  • the second magnetic element 608 can generate a third magnetic field, which can increase the strength of the second magnetic field at the magnetic gap.
  • the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the second magnetic element 608 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the second magnetic element 608 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the second magnetic element 608 may not be higher than 90 degrees.
  • the angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 608 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 608, the angle between the direction of the magnetic field generated by the first magnetic element 602 and the magnetization direction of the second magnetic element 608 may be 0 degrees, 10 degrees, 20 degrees Equal to or less than 90 degrees.
  • the magnetization direction of the first magnetic element 602 is perpendicular to the lower surface or upper surface of the first magnetic element 602 vertically upward (as shown in direction a), and the magnetization direction of the second magnetic element 608 is determined by the second magnetic element 608
  • the outer ring of is directed toward the inner ring (as shown in direction c in the figure, on the right side of the first magnetic element 602, the magnetization direction of the first magnetic element 602 is deflected 270 degrees clockwise).
  • the first full magnetic field changing element 606 in the magnetic circuit assembly 3100 can increase the total magnetic flux in the magnetic gap, thereby increasing the magnetic induction intensity in the magnetic gap.
  • the originally divergent magnetic induction lines converge to the position of the magnetic gap, further increasing the magnetic induction intensity in the magnetic gap.
  • the magnetic circuit assembly 3700 may include a first magnetic element 602, a first magnetic conductive element 604, a first full magnetic field changing element 606, a second magnetic element 608, a third magnetic element 610, The fourth magnetic element 612, the fifth magnetic element 616, the sixth magnetic element 618, the seventh magnetic element 620, and the second ring element 622.
  • the first full magnetic field changing element 606 and/or the second annular element 622 may include an annular magnetic element or an annular magnetically permeable element.
  • the ring-shaped magnetic element may include any one or more of the magnet materials described in this application, and the ring-shaped magnetic permeable element may include any one or more of the magnetic materials described in this application.
  • the magnetic circuit components in the above embodiments can be used to refer to a structure that provides a magnetic field.
  • the magnetic elements of the above embodiments can be used to refer to elements for energy storage, energy conversion, and electrical isolation, and the magnetic conductive elements of the above embodiments can be used to refer to elements that form a magnetic field loop.
  • the sixth magnetic element 618 may connect the fifth magnetic element 616 and the second ring element 622
  • the seventh magnetic element 620 may connect the third magnetic element 610 and the second ring element 622.
  • the first magnetic element 602, the fifth magnetic element 616, the second magnetic element 608, the third magnetic element 610, the fourth magnetic element 612, the sixth magnetic element 618 and/or the seventh magnetic element 620 are The first magnetic conductive element 604, the first full magnetic field changing element 606, and the second annular element 622 may form a magnetic circuit.
  • the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the sixth magnetic element 618 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the sixth magnetic element 618 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the sixth magnetic element 618 is not higher than 90 degrees.
  • the magnetization direction of the first magnetic element 602 is perpendicular to the lower surface or the upper surface of the first magnetic element 602 vertically upward (as shown in the direction of a), and the magnetization direction of the sixth magnetic element 618 is determined by the sixth The outer ring of the magnetic element 618 points toward the inner ring (as shown in the direction f in the figure, on the right side of the first magnetic element 602, the magnetization direction of the first magnetic element 602 is deflected 270 degrees in the clockwise direction). In some embodiments, in the same vertical direction, the magnetization direction of the sixth magnetic element 618 and the magnetization direction of the second magnetic element 608 may be the same.
  • the magnetization direction of the first magnetic element 602 is perpendicular to the lower surface or the upper surface of the first magnetic element 602 vertically upward (as shown in the direction of a), and the magnetization direction of the seventh magnetic element 620 is determined by the seventh The lower surface of the magnetic element 620 points to the upper surface (as shown in the direction e in the figure, on the right side of the first magnetic element 602, the magnetization direction of the first magnetic element 602 is deflected 360 degrees in the clockwise direction).
  • the magnetization direction of the seventh magnetic element 620 and the magnetization direction of the fourth magnetic element 612 may be the same.
  • the angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the sixth magnetic element 618 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 618, the angle between the direction of the magnetic field generated by the first magnetic element 602 and the magnetization direction of the sixth magnetic element 618 may be 0 degrees, 10 degrees, 20 degrees Equal to or less than 90 degrees.
  • the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the seventh magnetic element 620 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the seventh magnetic element 620 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 602 and the magnetization direction of the seventh magnetic element 620 is not higher than 90 degrees.
  • the angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the seventh magnetic element 620 is not higher than 90 degrees. In some embodiments, at the position of the seventh magnetic element 620, the angle between the direction of the magnetic field generated by the first magnetic element 602 and the magnetization direction of the seventh magnetic element 620 may be 0 degrees, 10 degrees, 20 degrees Equal to or less than 90 degrees.
  • the first full magnetic field changing element 606 may be a ring-shaped magnetic element.
  • the magnetization direction of the first full magnetic field changing element 606 may be the same as the magnetization direction of the second magnetic element 608 or the fourth magnetic element 612.
  • the magnetization direction of the first full magnetic field changing element 606 may be directed from the outer ring of the first full magnetic field changing element 606 to the inner ring.
  • the second ring element 622 may be a ring magnetic element. In this case, the magnetization direction of the second ring element 622 may be the same as the magnetization direction of the sixth magnetic element 618 or the seventh magnetic element 620.
  • the magnetization direction of the second ring element 622 may be directed from the outer ring of the second ring element 622 to the inner ring.
  • multiple magnetic elements can increase the total magnetic flux. The interaction of different magnetic elements can suppress the leakage of magnetic induction lines, improve the magnetic induction intensity at the magnetic gap, and increase the sensitivity of the speaker.
  • the magnetic circuit assembly may further include a magnetic conductive cover.
  • the magnetic conductive cover may include any one or several magnetic conductive materials described in this application, for example, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, and the like.
  • the magnetic conductive cover can be connected to the first magnetic element 602, the first full magnetic field changing element 606, the second magnetic element 608, the third magnetic element 610, and the fourth magnetic element 612 through any one or several connection methods described in this application , A fifth magnetic element 616, a sixth magnetic element 618, a seventh magnetic element 620, and a second ring element 622.
  • the magnetically conductive cover may include at least one bottom plate and a side wall, and the side wall is an annular structure.
  • the bottom plate and the side wall may be integrally formed.
  • the bottom plate may be connected to the side wall by any one or several connection methods described in this application.
  • the magnetic conductive cover may include a first bottom plate, a second bottom plate, and a side wall, the first bottom plate and the side wall may be integrally formed, and the second bottom plate may be connected to the side by any one or several connection methods described in this application wall.
  • the magnetic conductive cover can close the magnetic circuit generated by the magnetic circuit assembly 3700, so that more magnetic induction lines are concentrated in the magnetic gap in the magnetic circuit assembly 3700, so as to suppress magnetic leakage and increase the magnetic gap The magnetic induction intensity and the effect of improving the sensitivity of the speaker.
  • the magnetic circuit assembly may further include one or more conductive elements (eg, a fourth conductive element, a fifth conductive element, and a sixth conductive element).
  • a fourth conductive element e.g., a fourth conductive element, a fifth conductive element, and a sixth conductive element.
  • the descriptions of the fourth conductive element, the fifth conductive element, and the sixth conductive element are similar to the conductive element 248, the conductive element 250, and the conductive element 252, and related descriptions thereof will not be repeated here.
  • the magnetic circuit assembly 4100 may include a first magnetic element 402, a first magnetic conductive element 404, a second magnetic conductive element 406, and a second magnetic element 408.
  • magnetic circuit components in the above embodiments can be used to refer to a structure that provides a magnetic field.
  • the magnetic elements of the above embodiments can be used to refer to elements for energy storage, energy conversion, and electrical isolation.
  • the magnetic conductive elements of the above embodiments can all be used to refer to elements that form a magnetic field loop.
  • the first magnetic element 402 and/or the second magnetic element 408 may include any one or more of the magnets described in this application.
  • the first magnetic element 402 may include a first magnet
  • the second magnetic element 408 may include a second magnet
  • the first magnet and the second magnet may be the same or different.
  • the first magnetically permeable element 404 and/or the second magnetically permeable element 406 may include any one or several magnetically permeable materials described in this application.
  • the processing method of the first magnetically conductive element 404 and/or the second magnetically conductive element 406 may include any one or several processing methods described in this application.
  • the first magnetic element 402, the first magnetic permeable element 404, and/or the second magnetic element 408 may be configured as an axisymmetric structure.
  • the first magnetic element 402, the first magnetic permeable element 404, and/or the second magnetic element 408 may be a cylinder.
  • the first magnetic element 402, the first magnetic permeable element 404, and/or the second magnetic element 408 may be coaxial cylinders, containing the same or different diameters.
  • the thickness of the first magnetic element 402 may be greater than or equal to the thickness of the second magnetic element 408.
  • the second magnetically conductive element 406 may be a groove type structure.
  • the groove-shaped structure may include a U-shaped cross-section
  • the groove-shaped second magnetic conductive element 406 may include a bottom plate and a side wall.
  • the bottom plate and the side wall may be integrally formed, for example, the side wall may be formed by the bottom plate extending in a direction perpendicular to the bottom plate.
  • the bottom plate may be connected to the side wall by any one or several connection methods described in this application.
  • the second magnetic element 408 may be set in a ring shape or a sheet shape. For the shape of the second magnetic element 408, reference may be made to the description elsewhere in the description.
  • the second magnetic element 408 may be coaxial with the first magnetic element 402 and/or the first magnetic conductive element 404.
  • the upper surface of the first magnetic element 402 may be connected to the lower surface of the first magnetic conductive element 404.
  • the lower surface of the first magnetic element 402 may be connected to the bottom plate of the second magnetic element 406.
  • the lower surface of the second magnetic element 408 is connected to the upper surface of the first magnetic conductive element 404.
  • the connection between the first magnetic element 402, the first magnetic permeable element 404, the second magnetic permeable element 406, and/or the second magnetic element 408 may include one of bonding, clamping, welding, riveting, bolting, etc. or Many combinations.
  • a magnetic gap is formed between the first magnetic element 402, the first magnetic conductive element 404 and/or the second magnetic element 408 and the side wall of the second magnetic conductive element 406.
  • the voice coil can be disposed in the magnetic gap.
  • the first magnetic element 402, the first magnetic conductive element 404, the second magnetic conductive element 406, and the second magnetic element 408 may form a magnetic circuit.
  • the magnetic circuit assembly 4100 can generate a first full magnetic field, and the first magnetic element 402 can generate a second magnetic field.
  • the first full magnetic field is jointly formed by the magnetic fields generated by all components in the magnetic circuit assembly 4100 (for example, the first magnetic element 402, the first magnetic conductive element 404, the second magnetic conductive element 406, and the second magnetic element 408).
  • the magnetic field strength of the first full magnetic field within the magnetic gap (which may also be referred to as magnetic induction or magnetic flux density) is greater than the magnetic field strength of the second magnetic field within the magnetic gap.
  • the second magnetic element 408 may generate a third magnetic field, and the third magnetic field may increase the strength of the second magnetic field at the magnetic gap.
  • the angle between the magnetization direction of the second magnetic element 408 and the magnetization direction of the first magnetic element 402 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the second magnetic element 408 and the magnetization direction of the first magnetic element 402 is between 150 degrees and 180 degrees. In some embodiments, the magnetization direction of the second magnetic element 408 is opposite to the magnetization direction of the first magnetic element 402 (as shown, the a direction and the b direction).
  • the magnetic circuit assembly 4100 Compared with the magnetic circuit assembly of a single magnetic element, the magnetic circuit assembly 4100 adds a second magnetic element 408.
  • the magnetization direction of the second magnetic element 408 is opposite to that of the first magnetic element 402, which can suppress the magnetic leakage of the first magnetic element 402 in the magnetization direction, so that the magnetic field generated by the first magnetic element 402 can be more compressed to the magnetic In the gap, the magnetic induction in the magnetic gap is increased.
  • the connecting surface of the first magnetic field changing element and the second magnetic element is not limited to the plane in the figure, and the connecting surface may also be a wedge-shaped cross-section, which can make the magnetic induction line smoothly turn.
  • the magnetic element in the magnetic circuit assembly is not limited to the above-mentioned first magnetic element, second magnetic element, third magnetic element, fourth magnetic element element, fifth magnetic element, sixth magnetic element, seventh magnetic element, and
  • the number of magnetic elements can be increased or decreased. Such deformations are within the scope of protection of this application.
  • the speaker device described above can transmit sound to the user through air conduction.
  • the speaker device may include one or more sound sources.
  • the sound source may be located at a specific position on the user's head, for example, the top of the head, forehead, cheeks, temples, pinna, back of the pinna, etc., without blocking or covering the ear canal.
  • FIG. 22 is a schematic diagram showing the transmission of sound through air conduction.
  • the sound source 3010 and the sound source 3020 can generate sound waves of opposite phases ("+" and "-" in the figure indicate opposite phases).
  • the sound source mentioned here refers to the sound output hole of the speaker device to output sound.
  • the sound source 3010 and the sound source 3020 may be two sound exit holes respectively located at specific positions on the speaker device (for example, the movement housing 20 or the circuit housing 10).
  • the sound source 3010 and the sound source 3020 may be generated by the same vibration device 3001.
  • the vibration device 3001 includes a diaphragm (not shown in the figure).
  • the front of the diaphragm drives the air to vibrate, and a sound source 3010 is formed at the sound hole through the sound guide channel 3012, and the air is driven to vibrate at the back of the diaphragm, and at the sound hole through the sound guide channel 3022 Sound source 3020 is formed.
  • the sound guide channel refers to a sound propagation path from the diaphragm to the corresponding sound hole.
  • the sound guide channel is a path surrounded by a specific structure on the speaker (for example, the movement housing 20, or the circuit housing 10). It should be understood that, in some alternative embodiments, the sound source 3010 and the sound source 3020 may also be generated by different vibration devices through different diaphragm vibrations.
  • the sound transmitted to the user's ear may be referred to as near-field sound
  • the leaked sound transmitted to the environment may be referred to as far-field sound.
  • the near-field/far-field sounds of different frequencies generated by the speaker device are related to the distance between the sound source 3010 and the sound source 3020.
  • the near-field sound generated by the speaker device increases as the distance between the two sound sources increases, and the generated far-field sound (leakage) increases as the frequency increases.
  • the distance between the sound source 3010 and the sound source 3020 can be designed separately so that the low-frequency near-field sounds (for example, sounds with frequencies less than 800 Hz) generated by the speaker device are as large as possible, and the high-frequency far-field sounds (for example, (Sounds with a frequency greater than 2000Hz) are as small as possible.
  • the speaker device may include two or more sets of dual sound sources.
  • Each set of dual sound sources includes two sound sources similar to the sound source 3010 and the sound source 3020, and generates sounds with specific frequencies, respectively.
  • the first set of dual sound sources can be used to generate low frequency sounds
  • the second set of dual sound sources can be used to generate high frequency sounds.
  • the distance between the two sound sources in the first set of dual sound sources can be set to a larger value. And because the wavelength of the low-frequency signal is long, the large distance between the two sound sources will not form an excessive phase difference in the far field, and therefore will not form excessive sound leakage in the far field. In order to make the high-frequency far-field sound smaller, the distance between the two sound sources in the second set of dual sound sources can be set to a smaller value. Because the wavelength of the high-frequency signal is short, the small distance between the two sound sources can avoid the formation of a large phase difference in the far field, thus avoiding the formation of large sound leakage. The distance between the second set of dual sound sources is less than the distance between the first set of dual sound sources.
  • the beneficial effects that the embodiments of the present application may bring include, but are not limited to: (1) Forming the circuit casing and the casing sheath separately to avoid damage to the control circuit or battery caused by high temperature. (2) The first casing sheath 21 and the second casing sheath 31 do not completely cover the entire circuit casing 10, and can expose components for user operation, which is convenient for the user to use. (3) The sound quality of the speaker device can be improved by adjusting the angle ⁇ between the normal A of the panel 301 or the normal A'of the contact surface of the panel 301 with the human skin and the straight line B where the driving force of the device 101 is located.
  • the housing panel and the back of the housing can maintain the same or substantially the same vibration amplitude and phase at higher frequencies, thereby reducing the sound leakage of the speaker device.
  • the sensitivity of the speaker device can be improved. It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.
  • the present application uses specific words to describe the embodiments of the present application.
  • “one embodiment”, “one embodiment” and/or “some embodiments” means a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that “one embodiment” or “one embodiment” or “an alternative embodiment” mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment .
  • certain features, structures, or characteristics in one or more embodiments of the present application may be combined as appropriate.
  • Some embodiments use numbers describing the number of components and attributes. It should be understood that such numbers used in the embodiment descriptions use the modifiers "about”, “approximately”, or “generally” in some examples. To retouch. Unless otherwise stated, “approximately”, “approximately” or “substantially” indicates that the figures allow a variation of ⁇ 20%.
  • the numerical data used in the specification and claims are approximate values, and the approximate values may be changed according to the characteristics required by individual embodiments. In some embodiments, the numerical data should consider the specified significant digits and adopt the method of general digit retention.

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  • Acoustics & Sound (AREA)
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  • Manufacturing & Machinery (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
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Abstract

一种扬声器装置，包括：容纳控制电路或电池的电路壳体(10)；分别连接在电路壳体(10)两端的耳挂(50)和后挂(30)；第一壳体护套(21)覆盖至少一部分耳挂(50)，第二壳体护套(31)覆盖至少一部分后挂(30)，并且分别从电路壳体(10)的两端以套装方式至少部分地包覆于电路壳体(10)的外围；与耳挂(50)的一端连接的扬声器组件(40)，扬声器组件(40)包括耳机芯和用于容纳耳机芯的机芯壳体(20)，机芯壳体(20)包括外壳面板(222)和与外壳面板(222)相对的外壳背面(224)；耳机芯导致外壳面板(222)和外壳背面(224)振动，外壳面板(222)的振动具有第一相位，外壳背面(224)的振动具有第二相位；其中，外壳面板(222)的振动和外壳背面(224)的振动频率在2000Hz到3000Hz时，第一相位和第二相位的差值的绝对值小于60度，该扬声器装置可以避免高温对控制电路或电池所带来的损伤。

Description

一种扬声器装置
优先权信息
本申请要求于2019年01月05日提交的中文专利申请2019100099077，其全部内容通过引用的方式并入本文。
技术领域
本申请涉及扬声器装置领域，特别涉及一种扬声器装置中的管套式设计。
背景技术
目前，扬声器装置(如耳机、MP3播放器等)在人们的生活中用途广泛(例如，播放音乐、接听电话等)，扬声器装置已经成为人们日常生活的重要物品。因此，制造音质好、质量好的扬声器装置是扬声器的发展方向之一。在扬声器装置成型阶段，用于容纳控制电路或电池的电路壳体和设置在电路壳体外围的保护套管可一体成型。然而，由于电路壳体内部容纳有控制电路或电池，若将二者一体成型，则高温环境容易对控制电路或电池带来损伤，从而影响扬声器装置的质量。
发明内容
本说明书实施例一种扬声器装置，所述扬声器装置包括：至少一个扬声器组件，所述扬声器组件包括耳机芯和用于容纳所述耳机芯的机芯壳体，所述机芯壳体包括面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，以及至少一个按键模块；以及支撑连接件，所述支撑连接件与所述机芯壳体固定连接，用于与人体头部进行接触，所述支撑连接件中容纳控制电路或电池，所述控制电路或电池驱动所述耳机芯振动以产生声音，其中，所述耳机芯的振动导致所述外壳面板和所述外壳背面振动，所述外壳面板的振动具有第一相位，所述外壳背面的振动具有第二相位，所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
附图说明
本申请将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1是根据本申请一些实施例提供的扬声器装置的结构示意图；
图2是根据本申请一些实施例提供的扬声器装置的局部结构爆炸图；
图3是根据本申请一些实施例提供的扬声器装置的局部结构爆炸图；
图4是根据本申请一些实施例提供的扬声器装置的局部结构截面图；
图5是根据本申请一些实施例提供的扬声器装置的纵截面示意图；
图6是根据本申请一些实施例提供的扬声器装置的另一纵截面示意图；
图7是根据本申请一些实施例提供的扬声器装置的又一纵截面示意图；
图8是根据本申请一些实施例提供的扬声器装置的再一纵截面示意图；
图9是根据本申请一些实施例提供的壳体的纵截面示意图；
图10是根据本申请一些实施例提供的扬声器装置的应用场景及结构示意图；
图11是根据本申请一些实施例提供的一种夹角方向的示意图；
图12是根据本申请一些实施例提供的扬声器装置作用于人体皮肤、骨骼的结构示意图；
图13是根据本申请一些实施例提供的扬声器装置的夹角-相对位移关系图；
图14是根据本申请一些实施例提供的不同夹角θ时扬声器装置的频率响应曲线低频段部分的示意图；
图15是根据本申请一些实施例提供的磁路组件的纵截面示意图；
图16是根据本申请一些实施例提供的磁路组件的纵截面示意图；
图17是根据本申请一些实施例提供的磁路组件的纵截面示意图；
图18是根据本申请一些实施例提供的磁路组件的纵截面示意图；
图19是根据本申请一些实施例提供的磁路组件的纵截面示意图；
图20是根据本申请一些实施例提供的磁路组件的纵截面示意图；
图21是根据本申请一些实施例提供的磁路组件的纵截面示意图；以及
图22是显示一种通过气传导的方式传递声音的示意图。
具体实施例
为了更清楚地说明本申请的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本发明，而并非以任何方式限制本发明的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。其他术语的相关定义将在下文描述中给出。以下，不失一般性，在描述本发明中关于传导相关技术时，将采用“扬声器装置”或“扬声器”的描述。该描述仅仅为传导应用的一种形式，对于该领域的普通技术人员来说，“扬声器装置”或“扬声器”也可用其他同类词语代替，比如“发声装置”、“助听器”或“扬声装置”等。事实上，本发明中的各种实现方式可以很方便地应用到其它非扬声器类的听力设备上。例如，对于本领域的专业人员来说，在了解扬声器装置的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的具体方式与步骤进行形式和细节上的各种修正和改变，特别地，在扬声器装置中加 入环境声音拾取和处理功能，使该扬声器装置实现助听器的功能。例如，麦克风等传声器可以拾取使用者/佩戴者周围环境的声音，在一定的算法下，将声音处理后(或者产生的电信号)传送至扬声器部分。即扬声器装置可以经过一定的修改，加入拾取环境声音的功能，并经过一定的信号处理后通过扬声器模块将声音传递给使用者/佩戴者，从而同时实现扬声器和传统扬声器装置的功能。作为举例，这里所说的算法可以包括噪声消除、自动增益控制、声反馈抑制、宽动态范围压缩、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制等一种或多种的组合。
图1是根据本申请一些实施例提供的扬声器装置的结构示意图；图2是根据本申请一些实施例提供的扬声器装置的局部结构爆炸图；图3是根据本申请一些实施例提供的扬声器装置的局部结构爆炸图；图4是根据本申请一些实施例提供的扬声器装置的局部结构截面图。请参阅图1-图4，在一些实施例中，扬声器装置可以为基于耳机、MP3或者其它具有扬声功能的装置。具体地，该扬声器装置可以包括：电路壳体10、耳挂50、后挂30、扬声器组件40、控制电路和电池等。其中，电路壳体10用于容纳控制电路或电池，扬声器组件40包括机芯壳体20，机芯壳体20与耳挂50连接，并用于容纳耳机芯。电路壳体10以及耳挂50的数量均可为两个，分别对应于用户的左侧和右侧。机芯壳体20与电路壳体10分别设置于耳挂50的两端，后挂30则进一步设置于电路壳体10远离耳挂50的一端。
如图1所示，耳挂50上注塑有第一壳体护套21。具体地，耳挂50包括用于支撑耳挂50形状的第一弹性金属丝，该第一弹性金属丝外围注塑有耳挂护套22，该耳挂护套22在耳挂50与电路壳体10的连接处进一步形成与耳挂护套22一体成型的第一壳体护套21，即该第一壳体护套21位于耳挂护套22的朝向电路壳体10的一侧。
相似地，后挂30上注塑有第二壳体护套31。具体地，后挂30也包括用于支撑后挂30形状的第二弹性金属丝，以及注塑于该第二弹性金属丝外围的后挂护套32，该后挂护套32在后挂30与电路壳体10的连接处进一步形成与后挂护套32一体成型的第二壳体护套31，即该第二壳体护套31位于后挂护套32的朝向电路壳体10的一侧。
需要指出的是，第一壳体护套21与耳挂护套22、第二壳体护套31与后挂护套32均可由具有一定弹性的软质材料制成，例如软质的硅胶、橡胶等，为用户佩戴提供较好的触感。
具体地，电路壳体10与第一壳体护套21、第二壳体护套31分别成型，并使得第一壳体护套21的内侧壁的形状与电路壳体10的靠近耳挂50的至少部分的外侧壁形状匹配，第二壳体护套31的内侧壁的形状与电路壳体10的靠近后挂30的至少部分的外侧壁形状匹配，进而在三者分别成型完成之后，将第一壳体护套21以套装的方式，从电路壳体10的朝向耳挂50的一侧套装在电路壳体10的靠近耳挂50的外围，并将第二壳体护套31以套装的方式从电路壳体10的朝向后挂30的一侧套装在电路壳体10的靠近后挂30的外围，从而使得电路壳体10可由第一壳体护套21和第二壳体护套31共同包覆。
需要指出的是，由于第一壳体护套21和第二壳体护套31成型时的环境温度较高，而高温 环境可能会对电路壳体10所容纳的控制电路或电池造成一定的损伤，因此，在成型阶段，将电路壳体10和第一壳体护套21、第二壳体护套31分别成型，然后再套装在一起，而不是将第一壳体护套21和第二壳体护套31直接注塑在电路壳体10的外围，从而能够避免一体注塑时，高温对控制电路或电池所带来的损伤，从而降低成型阶段对控制电路或电池所带来的不利影响。
在一些实施例中，电路壳体10包括彼此连接的主侧壁11、辅侧壁12以及端壁13。电路壳体10可以为扁平状的壳体，该扁平状的电路壳体10的包括面积较大的主侧壁11，在用户佩戴扬声器装置时，两个相对的主侧壁11分别为用于贴靠头部的一侧壁以及与该侧壁相对而位于远离头部的侧壁。辅侧壁12和端壁13均用于连接两个主侧壁11。其中，辅侧壁12为用户佩戴时，朝向用户头部上侧以及下侧的两个侧壁；端壁13则为电路壳体10的相对的，且分别靠近耳挂50一端的侧壁以及靠近后挂30一端的侧壁，在用户佩戴时，分别朝向用户头部的前侧以及后侧。主侧壁11、辅侧壁12以及端壁13彼此连接而共同构成电路壳体10。
具体地，第一壳体护套21包括开口端211，该开口端211自电路壳体10朝向耳挂50一侧进而套设在电路壳体10上，并覆盖电路壳体10的朝向耳挂50一侧的端壁13，以及主侧壁11和辅侧壁12的靠近耳挂50的部分；第二壳体护套31包括开口端311，该开口端311自电路壳体10朝向后挂30一侧进而套设在电路壳体10上，并覆盖电路壳体10的朝向后挂30一侧的端壁13，以及主侧壁11和辅侧壁12的靠近后挂30的部分。并进而使得开口端211和开口端311在电路壳体10的主侧壁11和辅侧壁12上彼此对接，以包覆电路壳体10。
在一个应用场景中，第一壳体护套21和第二壳体护套31并不完全包覆整个电路壳体10，例如可以在对应于按键的位置，或者对应于电源接口的位置等开设有外露孔，以将相应的结构露出而方便用户操作。
其中，第一壳体护套21和第二壳体护套31在套装在电路壳体10的外围后，可进一步通过一定的手段将二者固定在电路壳体10上，从而将电路壳体10与对应的壳体护套固定在一起。
具体地，在一些实施例中，第一壳体护套21和第二壳体护套31与主侧壁11对应的内表面上分别一体成型有定位凸块215和定位凸块315，主侧壁11的外表面上分别对应设置有定位凹槽111和定位凹槽112。
其中，定位凸块215设置在靠近开口端211的内侧壁上。其中，定位凸块215可以为环绕第一壳体护套21的内侧壁的环形凸块，或者也可以为间隔设置在第一壳体护套21的内侧壁上的多个凸块等，具体可根据实际需求设置。本实施例中，定位凸块215的数量为两个，分别设置在第一壳体护套21的对应于电路壳体10的两个主侧壁11的内侧壁上；类似地，定位凸块315的数量也对应为两个，分别设置在第二壳体护套31的与于电路壳体10的两个主侧壁11对应的内侧壁上。
具体地，在将第一壳体护套21与第二壳体护套31分别套设在电路壳体10的两侧后，进一步将定位凸块215嵌入定位凹槽111，并将定位凸块315嵌入定位凹槽112，以使得第一壳体护套21的开口端211与第二壳体护套31的开口端311弹性抵接在一起，从而包覆电路壳体10。
进一步地，在一些实施例中，第二壳体护套31的覆盖电路壳体10的端壁13的区域的外 侧壁313相对于辅侧壁12倾斜设置。具体地，在用户佩戴时，第二壳体护套31的该外侧壁313的靠近用户头部上侧的一侧到靠近用户头部下侧的一侧沿逐渐远离后挂30的方向倾斜。
其中，定位凸块215和定位凸块315可分别沿开口端211和开口端311呈条状设置，并可相对于辅侧壁12倾斜；进一步地，第一壳体护套21和第二壳体护套31在电路壳体10的主侧壁11上的接合缝也可相对于辅侧壁12倾斜设置。其中定位凸块215和定位凸块315，以及第一壳体护套21和第二壳体护套31在电路壳体10的主侧壁11上的接合缝的倾斜方向均可与第二壳体护套31的覆盖电路壳体10的端壁13的区域的外侧壁313的倾斜方向一致，从而使得扬声器装置在外观上更加一致。
在一个应用场景中，第一壳体护套21和第二壳体护套31中的任意一者对电路壳体10的包覆面积不小于另一者对电路壳体10的包覆面积的二分之一。例如，第一壳体护套21对电路壳体10的包覆面积不小于第二壳体护套31对电路壳体10的包覆面积的二分之一，或者第二壳体护套31对电路壳体10的包覆面积不小于第一壳体护套21对电路壳体10的包覆面积的二分之一。其中，第一壳体护套21对电路壳体10的包覆面积和第二壳体护套31对电路壳体10的包覆面积以及二者之间的比例可以根据需求而设置为其它，例如可以各占一半，此处不做具体限定。
其中，电路壳体10与后挂30可以通过插接、卡接等方式连接在一起。
在一些实施例中，后挂30还包括朝向电路壳体10设置的接插端33，第二壳体护套31套设于至少部分接插端33的外部。具体地，接插端33可注塑于第二弹性金属丝的端部，后挂护套32可进一步注塑于第二弹性金属丝及部分接插端33的外部，并在接插端33处一体成型第二壳体护套31，从而使得第二壳体护套31进一步套设在接插端33的没有被后挂护套32覆盖的区域的外围。
进一步地，电路壳体10设置有朝向后挂30的接插孔14，其中，该接插孔14可设置在电路壳体10的靠近后挂30的端壁13上，并于该端壁13靠近一辅侧壁12的一侧朝向后挂30延伸形成。
其中，接插端33至少部分插入至接插孔14内。其中，在接插端33的相对两侧分别设置有与接插端33相对于接插孔14的插入方向垂直设置的开槽331，两个开槽331可间隔且对称设置于接插端33的两侧。进一步地，该两个开槽331可均在垂直于插入方向上与接插端33的对应的侧壁连通。
相应地，定义接插孔14的第一侧壁15上设置有与两个开槽331位置对应的第一通孔151。其中，接插孔14的第一侧壁15设置在接插孔14外围，且在佩戴状态下，朝向用户头部下侧。
其中，扬声器装置进一步包括一固定件53，该固定件53包括两条平行设置的插脚531和用于连接插脚531的连接部532。本实施例中，两条插脚531平行设置，连接部532可垂直连接设置于两条插脚531的同一侧，从而形成U型的固定件53。
进一步地，插脚531可从由接插孔14的第一侧壁15的外侧壁经通孔插入至开槽331，进而将连接部532阻挡于接插孔14的外侧，从而实现电路壳体10与后挂30的接插固定。
进一步地，在一些实施例中，定义接插孔14的与第一侧壁15相对的第二侧壁16上进一 步设置有与第一通孔151相对的第二通孔161，插脚531进一步经开槽331插入至第二通孔161内。其中，第二侧壁16可以为电路壳体10的靠近接插孔14一侧的辅侧壁12，在扬声器装置处于佩戴状态时，该辅侧壁12朝向用户头部上侧。
在本实施例中，插脚531经第一通孔151插入至开槽331内，并进一步经开槽331插入至第二通孔161内，也就是说插脚531能够将后挂30的接插端33的相对两侧壁以及接插端33完全贯穿并连接于一起，从而能够使得电路壳体10与后挂30之间接插更加稳固。
进一步地，在一些实施例中，接插端33沿接插端相对于接插孔14的插入方向进一步划分为第一接插段332和第二接插段333。在垂直于接插端33相对于接插孔14的插入方向的截面方向上，第一接插段332的截面大于第二接插段333的截面。
其中，后挂护套32具体可注塑在接插端的第一接插段332上，并可于第一接插段332与第二接插段333的连接处一体注塑第二壳体护套31。进一步地，开槽331设置于第二接插段333上，且第二接插段333插入于接插孔14内，而接插端33暴露于接插孔14的外部。
进一步地，在一些实施例中，第一接插段332上设置有沿接插端33相对于接插孔14的插入方向设置的第一走线槽3321，第二接插段333远离第一接插段332的外端面上设置有沿垂直于插入方向延伸并贯通至少一外侧面的第二走线槽3331。具体地，第一走线槽3321设置于第一接插段332的靠近用于定义接插孔14的辅侧壁12的一侧，并沿接插端33相对于接插孔14的插入方向贯通第一接插段332的两端面。第二走线槽3331可贯通第二接插段333的垂直于该第二走线槽3331的延伸方向的外两侧面。
另外，接插孔14的内侧壁上设置有一端与第一走线槽3321连通，另一端与第二走线槽3331连通的第三走线槽162，该第三走线槽162具体由第二侧壁16的内壁面凹陷而形成。
进一步地，电路壳体10包括设置在壳体内部的内隔壁17，以形成一与接插孔14间隔设置的容置腔18。具体地，电路壳体10的主侧壁11、辅侧壁12及端壁13共同构成一容置空间，该内隔壁17的设置将该容置空间分隔为容置腔18及接插孔14两部分。其中，内隔壁17上进一步设置有一走线孔171，以通过该走线孔171将接插孔14及容置腔18连通。
该扬声装置进一步设置有后挂导线34，该后挂导线34经过后挂30，且两端分别与控制电路和电池连接。具体地，该后挂导线34由后挂30依次经过第一走线槽3321、第三走线槽162及第二走线槽3331，并穿过走线孔171而进入容置腔18，以与控制电路或电池连接。
需要注意的是，以上对扬声器装置的耳机芯壳体的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的耳机芯壳体的基本原理后，可能在不背离这一原理的情况下，对实施的扬声器装置的耳机芯壳体具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，电路壳体与后挂可以通过一体成型。诸如此类的变形，均在本申请的保护范围之内。
在一些实施例中，扬声器装置还可以包括扬声机构，例如骨传导扬声机构、气传导扬声机构等。其中，骨传导是一种声音传导方式，即将声音转化为不同频率的机械振动，通过人的颅骨、 骨迷路、内耳淋巴液传递、螺旋器、听神经、听觉中枢等来传递声波。在一些实施例中，扬声机构可以为MP3播放器、助听器等。
在一些实施例中，扬声器装置的扬声机构可以为单独的、可直接使用的播放器，或者还可以是插接在电子设备上使用的播放器。
需要知道的是，在不违背原理的情况下，以下描述的内容可以同样适用于气传导扬声器装置和骨传导扬声器装置。
图5是根据本申请一些实施例提供的扬声器装置的纵截面示意图。如图5所示，在一些实施例中，扬声器装置可以包括磁路组件210、线圈212、传振片214、连接件216、以及壳体220。进一步的，在一些实施例中，磁路组件210可以包括第一磁性元件202、第一导磁元件204和第二导磁元件206。在一些实施例中，机芯壳体20具有与壳体220相似或者相同的结构。
在一些实施例中，壳体220可以具有面向人体一侧的外壳面板的外壳面板222、与外壳面板相对的外壳背面224和外壳侧面226。外壳背面224位于与外壳面板222相对的一面，并分别设置在外壳侧面226的两端面上。外壳面板222、外壳背面224和外壳侧面226形成具有一定容置空间的整体结构。在一些实施例中，磁路组件210、线圈212和传振片214固定在壳体220内部。在一些实施例中，扬声器装置还可以包括外壳支架228，传振片214可以通过外壳支架228与壳体220连接，在一些实施例中，线圈212可以固定在外壳支架228上，并通过外壳支架228带动壳体220振动。其中，外壳支架228可以是壳体220的一部分，也可以是单独的组件，直接或者间接连接于壳体220的内部，在一些实施例中，外壳支架228固定在外壳侧面226的内表面上。在一些实施例中，外壳支架228可以通过胶水粘贴在壳体220上，也可以通过冲压、注塑、卡接、铆接、螺纹连接或焊接固定在壳体220上。
在一些实施例中，可以通过设计外壳面板222、外壳背面224和外壳侧面226的连接方式确保壳体220具有较大的刚度。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226可以是一体成型。在一些实施例中，外壳背面224和外壳侧面226可以是一体成型结构。外壳面板222和外壳侧面226可以通过胶水直接粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。胶水可以是粘性强、硬度较大的胶水。在一些实施例中，外壳面板222和外壳侧面226可以是一体成型结构，外壳背面224和外壳侧面226之间可以通过胶水直接粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。在一些实施例中，外壳面板222、外壳背面224和外壳侧面226都是独立的部件，三者之间可以通过胶水、卡接、焊接或螺纹连接方式中的一种或任意几种的组合进行固定连接。例如，外壳面板222和外壳侧面226之间通过胶水连接，外壳背面224和外壳侧面226之间通过卡接、焊接或螺纹连接进行连接。或是外壳背面224和外壳侧面226之间通过胶水连接，外壳面板222和外壳侧面226之间通过卡接、焊接或螺纹连接进行连接。
在不同的应用场景中，本申请中所描述的扬声器装置的壳体可以通过不同的装配方式制成。例如，如本申请中其他地方的描述，扬声器装置的壳体可以是一体成型的方式，也可以是分体组合的方式，或者两者相结合的方式。在分体组合的方式中，不同分体之间可以采用胶水粘贴固定，或 是通过卡接、焊接或螺纹连接的方式进行固定。具体地，为了更好地理解本申请中扬声器装置的壳体的装配方式，图6-8描述了几种扬声器装置的壳体的装配方式的示例。
如图6所示，扬声器装置主要包括磁路组件2210和壳体(如图5标号220)。其中，磁路组件2210可以包括第一磁性元件2202、第一导磁元件2204和第二导磁元件2206。
在一些实施例中，上述实施例中的磁路组件可以是同一结构，都可以用于指代提供磁场的结构，上述实施例中的壳体也可以是同一结构。都可以用于指代容纳磁路组件的结构。
在一些实施例中，扬声器装置的壳体可以包括外壳面板2222，外壳背面2224和外壳侧面2226。外壳侧面2226和外壳背面2224由一体成型的方式制成，外壳面板2222通过分件组合的方式连接到外壳侧面2226的一端。分件组合的方式包括使用胶水粘结固定，或是通过卡接、焊接或螺纹连接的方式将外壳面板2222固定在外壳侧面2226的一端。外壳面板2222和外壳侧面2226(或者外壳背面2224)可以采用不同、相同或者部分相同的材料制成。在一些实施例中，外壳面板2222和外壳侧面2226采用相同的材料制成，且相同材料的杨氏模量大于2000MPa，更优选地，相同材料的杨氏模量大于4000MPa，更优选地，相同材料的杨氏模量大于6000MPa，更优选地，壳体材料的杨氏模量大于8000MPa，更优选地，相同材料的杨氏模量大于12000MPa，更优选地，相同材料的杨氏模量大于15000MPa，进一步优选地，相同材料的杨氏模量大于18000MPa。在一些实施例中，外壳面板2222和外壳侧面2226采用不同的材料制成，不同材料的杨氏模量都大于4000MPa，更优选地，不同材料的杨氏模量都大于6000MPa，更优选地，不同材料的杨氏模量都大于8000MPa，更优选地，不同材料的杨氏模量都大于12000MPa，更优选地，不同材料的杨氏模量都大于15000MPa，进一步优选地，不同材料的杨氏模量都大于18000MPa。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料包括但不限于丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile butadiene styrene，ABS)、聚苯乙烯(Polystyrene，PS)、高冲击聚苯乙烯(High impact polystyrene，HIPS)、聚丙烯(Polypropylene，PP)、聚对苯二甲酸乙二酯(Polyethylene terephthalate，PET)、聚酯(Polyester，PES)、聚碳酸酯(Polycarbonate，PC)、聚酰胺(Polyamides，PA)、聚氯乙烯(Polyvinyl chloride，PVC)、聚氨酯(Polyurethanes，PU)、聚二氯乙烯(Polyvinylidene chloride)、聚乙烯(Polyethylene，PE)、聚甲基丙烯酸甲酯(Polymethyl methacrylate，PMMA)、聚醚醚酮(Polyetheretherketone，PEEK)、酚醛树脂(Phenolics，PF)、尿素甲醛树脂(Urea-formaldehyde，UF)、三聚氰胺-甲醛树脂(Melamine formaldehyde，MF)以及一些金属、合金(如铝合金、铬钼钢、钪合金、镁合金、钛合金、镁锂合金、镍合金等)、玻璃纤维或碳纤维中的任意材料或上述任意材料的组合。在一些实施例中，外壳面板2222的材料为玻璃纤维、碳纤维与聚碳酸酯(Polycarbonate，PC)、聚酰胺(Polyamides，PA)等材料的任意组合。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是碳纤维和聚碳酸酯(Polycarbonate，PC)按照一定比例混合制成。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是碳纤维、玻璃纤维和聚碳酸酯(Polycarbonate，PC)按照一定比例混合制成。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是玻璃纤维和聚碳酸酯(Polycarbonate，PC)按照一定比例混合制成，也可以使玻璃纤维和聚酰胺(Polyamides， PA)按照一定比例混合制成。
如图6所示，外壳面板2222、外壳背面2224和外壳侧面2226形成具有一定容置空间的整体结构。在一些实施例中，在整体结构内，传振片2214通过连接件2216与磁路组件2210连接。磁路组件2210的两侧分别连接第一导磁元件2204和第二导磁元件2206。传振片2214通过外壳支架2228固定在整体结构的内部。在一些实施例中，外壳侧面2226上具有用于支撑外壳支架2228的台阶结构。在外壳支架2228固定于外壳侧面2226后，外壳面板2222可以同时固定在外壳支架2228和外壳侧面2226上，或者单独固定在外壳支架2228或外壳侧面2226上。在这种情况下，可选地，外壳侧面2226和外壳支架2228可以一体成型。在一些实施例中，外壳支架2228可以直接固定在外壳面板2222上(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。固定后的外壳面板2222和外壳支架2228再与外壳侧面固定(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。在这种情况下，可选地，外壳支架2228和外壳面板2222可以一体成型。
如图7所示，该实施例中的扬声器装置主要包括磁路组件2240和壳体。其中，磁路组件2240可以包括第一磁性元件2232、第一导磁元件2234和第二导磁元件2236。在整体结构内，传振片2244通过连接件2246与磁路组件2240连接。
在一些实施例中，上述实施例中的磁路组件可以是同一结构，都可以用于指代提供磁场的结构，上述实施例中的壳体可以是同一结构，都可以用于指代容纳磁路组件的结构，上述实施例中的传振片也可以是同一结构，都可以用于指代调节低频谐振峰的结构。同样的，上述实施例中的连接件都可以用于指代连接传振片和磁路组件的元件。该实施例与图6提供的实施例不同之处在于，外壳支架2258和外壳侧面2256一体成型。外壳面板2252固定在外壳侧面2256上与外壳支架2258连接的一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)，外壳背面2254固定在外壳侧面2256的另一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。在这种情况下，可选地，外壳支架2258和外壳侧面2256是分体组合的结构，并且外壳面板2252，外壳背面2254，外壳支架2258和外壳侧面2256之间都是通过胶水粘贴、卡接、焊接或螺纹连接的方式进行固定连接。
如图8所示，该实施例中的扬声器装置主要包括磁路组件2270和壳体。其中，磁路组件2270可以包括第一磁性元件2262、第一导磁元件2264和第二导磁元件2266。在整体结构内，传振片2274通过连接件2276与磁路组件2270连接。
在一些实施例中，上述实施例中的磁路组件可以是同一结构，都可以用于指代提供磁场的结构，上述实施例中的壳体可以是同一结构，都可以用于指代容纳磁路组件的结构，上述实施例中的传振片也可以是同一结构，都可以用于指代调节低频谐振峰的结构。
与图6和图7的不同之处在于，外壳面板2282和外壳侧面2286一体成型。外壳背面2284固定在外壳侧面2286上相对于外壳面板2282的一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。外壳支架2288通过胶水粘贴、卡接、焊接或螺纹连接的方式固定在外壳面板2282和/或外壳侧面2286上。在这种情况下，可选地，外壳支架2288，外壳面板2282和外壳侧面2286是一体成型的结构。
图9是根据本申请一些实施例提供的壳体的纵截面示意图。如图9所示，壳体700可以包括面向人体一侧的外壳面板710、与外壳面板相对外壳背面720和外壳侧面730。外壳面板710与人体接触，将扬声器装置的振动传递给人体的听觉神经。
在一些实施例中，耳机芯可以导致外壳面板710和外壳背面720振动，外壳面板710的振动具有第一相位，外壳背面720的振动具有第二相位；其中，外壳面板710的振动和外壳背面720的振动频率在2000Hz到3000Hz时，第一相位和第二相位的差值的绝对值小于60度。
在一些实施例中，当壳体700的整体刚度较大时，在一定的频率范围内，外壳面板710和外壳背面720的振动幅度和相位保持相同或基本相同(外壳侧面730不压缩空气因而不产生漏音)，使得外壳面板710产生的第一漏音声波和外壳背面720产生的第二漏音声波能够相互叠加。叠加可以减小第一漏音声波或第二漏音声波的幅值，从而达到降低壳体700漏音的目的。在一些实施例中，所述的一定频率范围至少包括频率大于500Hz的部分。优选地，所述的一定频率范围至少包括频率大于600Hz的部分。优选地，所述的一定频率范围至少包括频率大于800Hz的部分。优选地，所述的一定频率范围至少包括频率大于1000Hz的部分。优选地，所述的一定频率范围至少包括频率大于2000Hz的部分。更优选地，所述的一定频率范围至少包括频率大于5000Hz的部分。更优选地，所述的一定频率范围至少包括频率大于8000Hz的部分。进一步优选地，所述的一定频率范围至少包括频率大于10000Hz的部分。
在一些实施例中，骨传导扬声器的壳体的刚度会影响壳体上不同部位(例如，外壳面板、外壳背面和/或外壳侧面)的振动幅度和相位，从而影响骨传导扬声器的漏音。在一些实施例中，当骨传导扬声器的壳体具有比较大的刚度时，外壳面板和外壳背面能够在较高的频率下保持相同或者基本相同的振动幅度和相位，从而显著减小骨传导扬声器的漏音。
在一些实施例中，较高的频率可以包括不小于1000Hz的频率，例如，1000Hz-2000Hz之间的频率，1100Hz-2000Hz之间的频率，1300Hz-2000Hz之间的频率，1500Hz-2000Hz之间的频率，1700Hz-2000Hz之间的频率，1900Hz-2000Hz之间的频率。优选地，这里所说的较高的频率可以包括不小于2000Hz的频率，例如，2000Hz-3000Hz之间的频率，2100Hz-3000Hz之间的频率，2300Hz-3000Hz之间的频率，2500Hz-3000Hz之间的频率，2700Hz-3000Hz之间的频率，或者2900Hz-3000Hz之间的频率。优选地，较高的频率可以包括不小于4000Hz的频率，例如，4000Hz-5000Hz之间的频率，4100Hz-5000Hz之间的频率，4300Hz-5000Hz之间的频率，4500Hz-5000Hz之间的频率，4700Hz-5000Hz之间的频率，或者4900Hz-5000Hz之间的频率。更优选地，较高的频率可以包括不小于6000Hz的频率，例如，6000Hz-8000Hz之间的频率，6100Hz-8000Hz之间的频率，6300Hz-8000Hz之间的频率，6500Hz-8000Hz之间的频率，7000Hz-8000Hz之间的频率，7500Hz-8000Hz之间的频率，或者7900Hz-8000Hz之间的频率。进一步优选地，较高的频率可以包括不小于8000Hz的频率，例如，8000Hz-12000Hz之间的频率，8100Hz-12000Hz之间的频率，8300Hz-12000Hz之间的频率，8500Hz-12000Hz之间的频率，9000Hz-12000Hz之间的频率，10000Hz-12000Hz之间的频率，或者11000Hz-12000Hz之间的频率。
外壳面板和外壳背面保持相同或者基本相同的振动幅度是指所述外壳面板和外壳背面的振动幅度的比值在一定的范围之内。例如，外壳面板和外壳背面的振动幅度的比值在0.3到3之间，优选地，外壳面板和外壳背面的振动幅度的比值在0.4到2.5之间，优选地，外壳面板和外壳背面的振动幅度的比值在0.5到1.5之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.6到1.4之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.7到1.2之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.75到1.15之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.8到1.1之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.85到1.1之间，进一步优选地，外壳面板和外壳背面的振动幅度的比值在0.9到1.05之间。在一些实施例中，外壳面板和外壳背面的振动可以用其他能够表征其振动幅度的物理量来表示。例如，可以分别用空间中一点处由外壳面板和外壳背面产生的声压来表征外壳面板和外壳背面的振动幅度。
外壳面板和外壳背面保持相同或者基本相同的振动相位是指所述外壳面板和外壳背面的振动相位的差值在一定的范围之内。例如，外壳面板和外壳背面的振动相位的差值在-90°到90°之间，优选地，外壳面板和外壳背面的振动相位的差值在-80°到80°之间，优选地，外壳面板和外壳背面的振动相位的差值在-60°到60°之间，优选地，外壳面板和外壳背面的振动相位的差值在-45°到45°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-30°到30°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-20°到20°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-15°到15°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-12°到12°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-10°到10°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-8°到8°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-6°到6°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-5°到5°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-4°到4°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-3°到3°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-2°到2°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-1°到1°之间，进一步优选地，外壳面板和外壳背面的振动相位的差值为0°。
需要注意的是，以上对扬声器装置的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的基本原理后，可能在不背离这一原理的情况下，对实施的扬声器装置的耳机芯壳体具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，外壳侧面、外壳背面与面板之间不限于上述的连接。例如，外壳侧面、外壳背面和外壳支架是一体成型结构。诸如此类的变形，均在本申请的保护范围之内。
图10是根据本申请一些实施例提供的扬声器装置的应用场景及结构示意图。如图10所示，在一些实施例中，扬声器装置可以包括驱动装置101、传动组件303、面板301、以及外壳302等。
需要说明的是，上述实施例中的壳体和外壳可以是同一结构，都可以用于指代容纳磁路组件的结构，面板和外壳面板也可以是同一结构，都可以用于指代于人体接触传送声音的结构。
在一些实施例中，驱动装置101通过传动组件303将振动信号传送至面板301和/或外壳302，从而通过面板301或外壳302与人体皮肤的接触，将声音传送至人体。在一些实施例中，扬声器的面板301和/或外壳302可以在耳屏处与人体皮肤接触，从而将声音传递至人体。在一些实施例中，面板301和/或外壳302也可以在耳廓后侧与人体皮肤接触。
如图10所示，根据本申请一些实施例提供的扬声器，驱动装置101产生的驱动力所在直线B(或者说驱动装置的振动方向)，与面板301的法线A具有一个夹角θ。或者说，直线B与直线A不平行。
进一步的，面板301上具有与使用者身体，如人体皮肤，接触或抵靠的区域。应当理解为，当面板301上覆盖有其他材料(如硅胶等软性材料)以增强用户佩戴舒适感时，面板301与使用者身体的关系则不为直接接触，而是相互抵靠。在一些实施例中，当扬声器佩戴在使用者身体上后，面板301的全部区域与使用者身体接触或抵靠。在一些实施例中，当扬声器佩戴在使用者身体上后，面板301的部分区域与使用者身体接触或抵靠。在一些实施例中，面板301上用于与使用者身体接触或抵靠的区域可以占整个面板301面积的50％以上，更优选的，可以占面板面积的60％以上。一般来说，面板301上与使用者身体接触或抵靠的区域可以是平面或者曲面。
在一些实施例中，当面板301上用于与使用者身体接触或抵靠的区域为平面时，其法线满足法线的一般定义。在一些实施例中，当面板301上用于与使用者身体接触或抵靠的区域为曲面时，其法线为该区域的平均法线。
其中，平均法线的定义如下：
Figure PCTCN2019102404-appb-000001
Figure PCTCN2019102404-appb-000002
为平均法线；
Figure PCTCN2019102404-appb-000003
为曲面上任意一点的法线，ds为面元。
更进一步地，曲面为接近平面的准平面，即曲面上至少50％区域内任意一点的法线与其平均法线的夹角小于设定阈值的面。在一些实施例中，设定阈值小于10°；在一些实施例中，设定阈值可以进一步小于5°。
在一些实施例中，驱动力所在直线B与面板301上用于与使用者身体接触或抵靠的区域的法线A’具有夹角θ。夹角θ的数值范围可以为0＜θ＜180°，进一步其数值范围可以为0＜θ＜180°且不等于90°。在一些实施例中，设定直线B具有指向扬声器外的正方向，设定面板301的法线A(或者面板301与人体皮肤接触面的法线A’)也具有指向扬声器外的正方向，则直线A或A’与直线B在其正方向上形成的夹角θ为锐角，即0＜θ＜90°。
图11是根据本申请一些实施例提供的一种夹角方向的示意图。如图11所示，在一些实施例中，驱动装置101产生的驱动力在XOY平面坐标系的第一象限和/或第三象限内具有分量。其中，XOY平面坐标系为一个参考坐标系，其原点O位于扬声器佩戴在人体上后，面板和/或外壳与人体的接触面上，X轴与人体冠状轴平行，Y轴与人体矢状轴平行，且X轴正方向朝向人体外侧，Y轴正方向朝向人体前方。象限应当被理解为平面直角坐标系中的横轴(如X轴)和纵轴(如Y轴)所 划分的四个区域，每一个区域叫做一个象限。象限以原点为中心，X、Y轴为分界线。右上的(X轴的正半轴与Y轴的正半轴围成的区域)称为第一象限，左上的(X轴的负半轴与Y轴的正半轴围成的区域)称为第二象限，左下的(X轴的负半轴与Y轴的负半轴围成的区域)称为第三象限，右下的(X轴的正半轴与Y轴的负半轴围成的区域)称为第四象限。其中，坐标轴上的点不属于任何象限。应当理解为，本实施例驱动力可以直接位于XOY平面坐标系的第一象限和/或第三象限中，或者驱动力朝向其他方向，但是在XOY平面坐标系的第一象限和/或第三象限中的投影或分量不为0，以及在Z轴方向的投影或分量可以为0或不为0。其中，Z轴垂直于XOY平面，且经过原点O。在一些实施例中，驱动力所在直线与面板上与使用者身体接触或抵靠的区域的法线之间的最小夹角θ可以为任意锐角，例如夹角θ的范围优选为5°～80°；更优选为15°～70°；再优选为25°～60°；再优选为25°～50°；再优选为28°～50°；再优选为30°～39°；再优选为31°～38°；更优选为32°～37°；更优先选为33°～36°；更优先选为33°～35.8°；更优先选为33.5°～35°。具体的，夹角θ可以是26°、27°、28°、29°、30°、31°、32°、33°、34°、34.2°、35°、35.8°、36°、37°或38°等，误差控制在0.2度以内。需要说明的是，上述对驱动力方向的说明不应理解为本申请中驱动力的限制，在其他实施例中，驱动力还可以在XOY平面坐标系中的第二、四象限具有分量，甚至驱动力还可以位于Y轴上等等。
图12是根据本申请一些实施例提供的扬声器装置作用于人体皮肤、骨骼的结构示意图。如图12所示，扬声器装置包括驱动装置101(在其他实施例中也可称为换能装置)，传动组件303，面板301，以及外壳302。
在一些实施例中，驱动力所在的直线与驱动装置101振动所在的直线共线或平行。例如，在动圈原理的驱动装置101中，驱动力的方向可以与线圈和/或磁路组件的振动方向相同或相反。面板301可以为平面，也可以为曲面，或者面板301上具有若干凸起或凹槽。在一些实施例中，当扬声器装置佩戴在使用者身体上后，面板301上与使用者身体接触或抵靠的区域的法线与驱动力所在的直线不平行。一般来说，面板301上与使用者身体接触或抵靠的区域较为平坦，具体可以是平面，或者曲度变化不大的准平面。当面板301上用于与使用者身体接触或抵靠的区域为平面时，其上任意一点的法线均可以作为区域的法线。当面板301上用于与使用者身体接触面板为非平面时，区域的法线可以为其平均法线。关于平均法线的详细定义可以参见图10中的相关描述，在此不再赘述。在其他一些实施例中，当面板上用于与使用者身体接触面板为非平面时，区域的法线还可以如下确定，选定面板301与人体皮肤接触时的一个区域中的某一点，确定面板301在该点处的切平面，再确定过该点且与切平面垂直的直线，将该直线作为面板的法线。根据本申请一个具体实施例，驱动力所在直线(或驱动装置101振动所在直线)与区域的法线具有夹角θ，夹角0＜θ＜180°。在一些具体实施例中，当指定驱动力所在直线具有经面板(或者面板和/或外壳与人体皮肤接触面)指向扬声器装置外的正方向，指定面板(或者面板301和/或外壳302与人体皮肤接触面)法线具有指向扬声器装置外的正方向，这两条直线在正方向上形成的夹角为锐角。
在一些实施例中，线圈304与磁路组件307均为环状结构。在一些实施例中，线圈304与 磁路组件307具有相互平行的轴线，线圈304或磁路组件307的轴线与线圈304径向平面和/或磁路组件307径向平面垂直。在又一些实施例中，线圈304与磁路组件307具有相同的中心轴线，线圈304的中心轴线与线圈304径向平面垂直，且经过线圈304的几何中心，磁路组件307的中心轴线与磁路组件307径向平面垂直，且经过磁路组件307的几何中心。线圈304或磁路组件307的轴线与面板301的法线具有前述夹角θ。
在一些实施例中，上述实施例中的磁路组件可以是同一结构，都可以用于指代提供磁场的结构，上述实施例中的线圈也可以是同一结构，都可以用于指代能够接收外接电信号，将电信号在磁场的作用下转化为机械振动信号的元件。
仅仅作为示例，下面结合图13，阐述驱动力F与皮肤变形S之间的关系。当驱动装置101产生的驱动力所在直线与面板301法线平行时(也就是夹角θ为零)，驱动力与皮肤总形变的关系为：
F ⊥＝S ⊥×E×A/h    (2)
其中F ⊥为驱动力大小，S ⊥为皮肤在垂直皮肤方向的总形变，E为皮肤的弹性模量，A为面板301与皮肤的接触面积，h为皮肤的总厚度(也即面板与骨骼之间的距离)。
当驱动装置101的驱动力所在直线与面板上与使用者身体接触或抵靠的区域的法线垂直时(也就是夹角θ为90度)，垂直方向的驱动力与皮肤总形变的关系可以如公式所示：
F //＝S //×G×A/h    (3)
其中F //为驱动力大小，S //为皮肤在平行皮肤方向的总形变，G为皮肤的剪切模量，A为面板301与皮肤的接触面积，h为皮肤的总厚度(也即面板与骨骼之间的距离)。剪切模量G与弹性模量E之间的关系为：
G＝E/2(1+γ)    (4)
其中γ为皮肤的泊松比0＜γ＜0.5，因而剪切模量G小于弹性模量E，对应在相同的驱动力下皮肤的总形变S //＞S ⊥。通常，皮肤的泊松比接近0.4。
当驱动装置101产生驱动力所在直线与面板301与使用者身体接触的区域的法线不平行时，水平方向驱动力与垂直方向的驱动力分别表示为以下的公式(5)和公式(6)：
F ⊥＝F×cos(θ)     (5)
F //＝F×sin(θ)   (6)
其中，驱动力F与皮肤变形S之间的关系可由以下公式(5)表示：
Figure PCTCN2019102404-appb-000004
当皮肤的泊松比为0.4时，夹角θ与皮肤总形变之间的关系的详细描述可以在图13中找到。
图13是根据本申请一些实施例提供的扬声器装置的夹角-相对位移关系图。如图13所示，夹角θ与皮肤总形变之间的关系为夹角θ越大，相对位移越大，则皮肤总形变S越大。皮肤在垂直皮肤方向形变S ⊥随着夹角θ的变大，相对位移变小，皮肤在垂直皮肤方向形变S ⊥变小；并且在夹角θ接近90度时，皮肤在垂直皮肤方向形变S ⊥逐渐趋向于0。
在一些实施例中，扬声器装置在低频部分的音量与皮肤总变形S正相关。S越大，低频的音量越大。扬声器装置在高频部分的音量与皮肤在垂直皮肤方向形变S ⊥正相关。S ⊥越大，低频的音量越大。
进一步的，当皮肤的泊松比为0.4时，夹角θ与皮肤总形变S，皮肤在垂直皮肤方向形变S ⊥之间的关系的详细描述可以在图14中找到。如图14所示，夹角θ与皮肤总形变S之间的关系为夹角θ越大，皮肤总形变S越大，对应扬声器装置的低频部分音量越大。如图13所示，夹角θ与皮肤在垂直皮肤方向形变S⊥之间的关系为夹角θ越大，皮肤在垂直皮肤方向形变S⊥越小，对应扬声器装置的高频部分音量越小。
通过方程(7)以及图13的曲线可以看出，随着夹角θ的增大，皮肤总形变S增大的速度与皮肤在垂直皮肤方向形变S ⊥减小的速度不同。皮肤总形变S增大的速度先变快后变慢，皮肤在垂直皮肤方向形变S ⊥减小的速度越来越快。为平衡扬声器低频与高频的音量，夹角θ要在一个合适的大小。例如θ的范围为5°～80°，或者为15°～70°，或者为25°～50°，或者为25°～35°，或者为25°～30°等等。
图14是根据本申请一些实施例提供的不同夹角θ时扬声器装置的频率响应曲线低频段部分的示意图。如图14所示，面板301与皮肤接触，将振动传递到皮肤。在这个过程中，皮肤也会影响扬声器装置的振动，从而影响到扬声器装置的频率响应曲线。从上面的分析中，我们发现夹角度越大，相同的驱动力下皮肤的总形变越大，而对应扬声器装置来说，相当于皮肤相对其面板301部分的弹性减小。进一步地可以理解为，在驱动装置101的驱动力所在直线与面板301上与使用者身体接触或抵靠区域的法线形成一定夹角θ时，尤其是当夹角θ加大时，可以将频率响应曲线中的低频区域的谐振峰调节至更低频的区域，使低频下潜更深，低频增多。相对于其他提高声音中低频成分的技术手段，如在扬声器装置中增设传振片，设置夹角能够在提高低频能量的同时有效抑制振动感的增加，进而使振动感相对减少，使得扬声器装置低频灵敏度显著提高，提高音质和人体的体验感。应当注意的是，在一些实施例中，低频增多，振动感少可以表现为夹角θ在(0，90°)范围内增大时，振动或声音信号中的低频范围的能量增加了，同时振动感也增加了，但是低频范围的能量增加的程度比振动感增加的程度更大，因此，在相对效果上，振动感相对减小了。从图14可以看出，夹角较大时，低频区的谐振峰出现在更低频段处，可以变相地延长频率曲率平坦的部分，从而提高扬声器的音质。
需要注意的是，以上对扬声器装置的描述仅仅是具体的示例，不应该被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的具体方式和步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，驱动力所在直线与面板上与使用者身体接触或抵靠的区域的法线之间的最小夹角θ可以为任意锐角，此处的锐角不仅仅局限于上述的5°～80°，在一些实施例中，夹角θ可以小于5°，例如1°、2°、3°、4°等。在另一些实施例中，夹角θ可以大于80°且小于90°，例如81°、82°、85°等。在一些实施例中，夹角θ的具体数值可以不 为整数(例如81.3°、81.38°)。诸如此类的变形，均在本申请的保护范围之内。
图15是根据本申请一些实施例提供的磁路组件的纵截面示意图。需要知道的是，在不违背原理的情况下，以下描述的内容可以同样适用于气传导扬声器装置和骨传导扬声器装置。
如图15所示，在一些实施例中，扬声器装置可以包括第一磁性元件202、第一导磁元件204、第二导磁元件206、第一振动板207、音圈110、第二振动板1120以及振动面板114。其中，骨传导扬声器中耳机芯的部分元件可以组成磁路组件。在一些实施例中，磁路组件可以包括第一磁性元件202、第一导磁元件204、第二导磁元件206。磁路组件可以产生第一全磁场(也可被称为“磁路组件的总磁场”或“第一磁场”)。
在本申请中描述的磁性元件都可以用于指代产生磁场的元件，例如磁铁等。磁性元件可以具有磁化方向，磁化方向是指在磁性元件内部的磁场方向。在一些实施例中，第一磁性元件202可以包括一个或多个磁铁，第一磁性元件可以产生第二磁场。在一些实施例中，磁铁可以包括金属合金磁铁，铁氧体等。其中，金属合金磁铁可以包括钕铁硼、钐钴、铝镍钴、铁铬钴、铝铁硼、铁碳铝，或类似的，或其中多种的组合。铁氧体可以包括钡铁氧体，钢铁氧体，美锰铁氧体，锂锰铁氧体，或类似的，或其中多种组合。
在一些实施例中，第一导磁元件204的下表面可以连接第一磁性元件202的上表面。第二导磁元件206可以连接第一磁性元件202。需要注意的是，这里所说的导磁体也可以称为磁场集中器或铁芯。导磁体可以调整磁场(例如，第一磁性元件202产生的磁场)的分布。导磁体可以包括由软磁材料加工而成的元件。在一些实施例中，软磁材料可以包括金属材料、金属合金、金属氧化物材料、非晶金属材料等，例如铁、铁硅系合金、铁铝系合金、镍铁系合金、铁钴系合金、低碳钢、硅钢片、矽钢片、铁氧体等。在一些实施例中，可以通过铸造、塑性加工、切削加工、粉末冶金等一种或多种组合的方法加工导磁体。铸造可以包括砂型铸造、熔模铸造、压力铸造、离心铸造等；塑性加工可以包括轧制、铸造、锻造、冲压、挤压、拔制等一种或多种组合；切削加工可以包括车削、铣削、刨削、磨削等。在一些实施例中，导磁体的加工方法可以包括3D打印、数控机床等。第一导磁元件204、第二导磁元件206与第一磁性元件202之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。在一些实施例中，第一磁性元件202、第一导磁元件204和第二导磁元件206可以设置为轴对称结构。轴对称结构可以是环状结构、柱状结构或是其它具有轴对称结构。
在一些实施例中，第一磁性元件202与第二导磁元件206之间可以形成磁间隙。音圈110可以设置于磁间隙中。音圈110可以与第一振动板207连接。第一振动板207可以连接第二振动板1120，第二振动板1120可以连接振动面板114。当音圈110内通入电流后，音圈110位于在第一磁性元件202、第一导磁元件204和第二导磁元件206形成的磁场，会受到安培力作用，安培力驱动音圈110振动，音圈110的振动会带动第一振动板207、第二振动板1120和振动面板114的振动。振动面板114将振动通过组织与骨骼传递到听觉神经，从而使人听到声音。振动面板114可以直接与人体皮肤接触，或可以通过由特定材料组成的振动传递层与皮肤接触。
在一些实施例中，对于具有单一磁性元件的扬声器装置，通过音圈110处的磁感线并不均匀，呈发散状。同时磁路中可能会形成漏磁，即较多的磁感线泄漏至磁间隙以外，未能穿过音圈110，从而使得音圈110位置处的磁感应强度(或磁场强度)下降，影响扬声器的灵敏度。因此，扬声器可以进一步包括至少一个第二磁性元件和/至少一个第三导磁元件(图中未示)。至少一个第二磁性元件和/至少一个第三导磁元件可以抑制磁感线的泄露，约束穿过音圈110的磁感线形态，使得较多的磁感线尽量水平密集地穿过音圈110，增强音圈110位置处的磁感应强度(或磁场强度)，从而提高扬声器的灵敏度，进而提高扬声器的机械转化效率(即，将输入扬声器100的电能转化为音圈110振动的机械能的效率)。
图16是根据本申请一些实施例提供的磁路组件的纵截面示意图。如图16所示，磁路组件2100可以包括第一磁性元件202、第一导磁元件204、第二导磁元件206以及第二磁性元件208。
在一些实施例中，上述实施例中的磁路组件可以是同一结构，都可以用于指代提供磁场的结构。在一些实施例中，第一磁性元件202和/或第二磁性元件208可以包括本申请中描述的任意一种或几种磁铁。在一些实施例中，第一磁性元件202可以包括第一磁铁，第二磁性元件208可以包括第二磁铁，第一磁铁与第二磁铁可以相同或不同。第一导磁元件204和/或第二导磁元件206可以包括本申请中描述的任意一种或几种导磁材料。第一导磁元件204和/或第二导磁元件206的加工方法可以包括本申请中描述的任意一种或几种加工方式。在一些实施例中，第一磁性元件202和/或第一导磁元件204可以设置为轴对称结构。例如，第一磁性元件202和/或第一导磁元件204可以是圆柱体，长方体，或者中空的环状(例如，横截面为跑道的形状)。在一些实施例中，第一磁性元件202和第一导磁元件204可以是共轴的圆柱体，含有相同或者不同的直径。在一些实施例中，第二导磁元件206可以是凹槽型结构。凹槽型结构可以包含U型的剖面。凹槽型的第二导磁元件206可以包括底板和侧壁。在一些实施例中，底板和侧壁可以是一体成型的，例如，侧壁可以由底板在垂直于底板的方向进行延伸形成。在一些实施例中，底板可以通过本申请中描述的任意一种或几种连接方式连接侧壁。第二磁性元件208可以设定为环状或片状。在一些实施例中，第二磁性元件208可以是环状的。第二磁性元件208可以包括内环以及外环。在一些实施例中，内环和/或外环的形状可以是圆形、椭圆、三角形、四边形或其它任意多边形。在一些实施例中，第二磁性元件208可以由多个磁体排列组成。多个磁体的任意一个磁体的两端可以与相邻的磁体的两端连接或存在一定的间距。多个磁体之间的间距可以相同或不同。在一些实施例中，第二磁性元件可以由2个或3个片状的磁体等距排列构成。片状的磁体的形状可以是扇形、四边形等。在一些实施例中，第二磁性元件208可以与第一磁性元件202和/或第一导磁元件204共轴。
进一步的，第一磁性元件202的上表面可以连接第一导磁元件204的下表面。第一磁性元件202的下表面可以连接第二导磁元件206的底板。第二磁性元件208的下表面连接第二导磁元件206的侧壁。第一磁性元件202、第一导磁元件204、第二导磁元件206和/或第二磁性元件208之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在一些实施例中，第一磁性元件202和/或第一导磁元件204与第二磁性元件208的内环之 间形成磁间隙。音圈238可以设置于磁间隙中。在一些实施例中，第二磁性元件208的音圈238相对于第二导磁元件206的底板的高度相等。
在一些实施例中，第一磁性元件202、第一导磁元件204、第二导磁元件206以及第二磁性元件208可以形成磁回路。在一些实施例中，磁路组件2100可以产生第一全磁场(也可被称为“磁路组件的总磁场”或“第一磁场”)，第一磁性元件202可以产生第二磁场。第一全磁场由磁路组件2100中的所有组分(例如，第一磁性元件202，第一导磁元件204、第二导磁元件206以及第二磁性元件208)产生的磁场共同形成。
在一些实施例中，第一全磁场在磁间隙内的磁场强度(也可以被称为磁感应强度或者磁通量密度)大于第二磁场在磁间隙内的磁场强度。在一些实施例中，第二磁性元件208可以产生第三磁场，第三磁场可以提高第一全磁场在磁间隙处的磁场强度。这里所说的第三磁场提高第一全磁场的磁场强度指的是，在有第三磁场存在(即，存在第二磁性元件208)时第一全磁场在磁间隙的磁场强度大于没有第三磁场存在(即，不存在第二磁性元件208)时第一全磁场的。在本说明书中的其他实施例中，除非特别说明，磁路组件表示包含所有磁性元件和导磁元件的结构，第一全磁场表示由磁路组件整体产生的磁场，第二磁场、第三磁场、......、第N磁场分别表示由相应的磁性元件所产生的磁场。在不同的实施例中，产生第二磁场(或者第三磁场、......、第N磁场)的磁性元件可以是相同的，也可以不同。
在一些实施例中，上述实施例中的音圈可以是同一结构，都可以用于指代传递音频信号的元件，上述实施例中的磁路组件可以是同一结构，都可以用于指代提供磁场的结构。
在一些实施例中，第一磁性元件202的磁化方向与第二磁性元件208的磁化方向之间的夹角在0度与180度之间。在一些实施例中，第一磁性元件202的磁化方向与第二磁性元件208的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件202的磁化方向与第二磁性元件208的磁化方向之间的夹角等于或大于90度。在一些实施例中，第一磁性元件202的磁化方向垂直于第一磁性元件202的下表面或上表面竖直向上(如图中a所示方向)，第二磁性元件208的磁化方向由第二磁性元件208的内环指向外环(如图中b所方向示，在第一磁性元件202的右侧，第一磁性元件202的磁化方向沿着顺时针方向偏转90度)。
在一些实施例中，在第二磁性元件208的位置，第一全磁场的方向与第二磁性元件208的磁化方向之间的夹角不高于90度。在一些实施例中，在第二磁性元件208的位置处，第一磁性元件202产生的磁场的方向与第二磁性元件208的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。进一步的，与单一磁性元件的磁路组件相比，第二磁性元件208可以提高磁路组件2100中磁间隙内总磁通量，进而增加磁间隙中的磁感应强度。并且，在第二磁性元件208的作用下，原本发散的磁感线会向磁间隙所在位置收敛，进一步增加磁间隙中的磁感应强度。
图17是根据本申请一些实施例提供的磁路组件的纵截面示意图。如图17所示，与磁路组件2100不同的是，磁路组件2600可以进一步包括至少一个导电元件(例如，第一导电元件248、第二导电元件250及第三导电元件252)。
在一些实施例中，导电元件可以包括金属材料、金属合金材料、无机非金属材料或其它导电材料。金属材料可以包括金、银、铜、铝等；金属合金材料看可以包括铁基合金、铝基合金材料、铜基合金、锌基合金等；无机非金属材料可以包括石墨等。导电元件可以是片状、环状、网状等。第一导电元件248可以设置于第一导磁元件204的上表面。第二导电元件250可以连接第一磁性元件202以及第二导磁元件206。第三导电元件252可以连接第一磁性元件202的侧壁。在一些实施例中，第一导磁元件204可以凸出于第一磁性元件202形成第一凹部，第三导电元件252设置于第一凹部。在一些实施例中，第一导电元件248、第二导电元件250以及第三导电元件252可以包括相同或不同的导电材料。第一导电元件248、第二导电元件250以及第三导电元件252可以通过本申请中描述的任意一种或多种连接方式分别连接第一导磁元件204、第二导磁元件206和/或第一磁性元件202。
在一些实施例中，第一磁性元件202、第一导磁元件204与第二磁性元件208的内环之间形成磁间隙。音圈238可以设置于磁间隙中。第一磁性元件202、第一导磁元件204、第二导磁元件206以及第二磁性元件208可以形成磁回路。在一些实施例中，导电元件可以降低音圈238的感抗。例如，若音圈238通入第一交变电流时，音圈238附近会产生第一交变感应磁场。第一交变感应磁场在磁回路中磁场的作用下，会使音圈238产生感抗，阻碍音圈238的运动。当在音圈238附近设置导电元件(例如，第一导电元件248、第二导电元件250以及第三导电元件252)，在第一交变感应磁场作用下，导电元件可以感生出第二交变电流。导电元件内的第三交变电流可以在其附近产生第二交变感应磁场，第二交变感应磁场与第一交变感应磁场方向相反，可以减弱第一交变感应磁场，从而减小音圈238的感抗，增大音圈中的电流，提高扬声器装置的灵敏度。
图18是根据本申请一些实施例提供的磁路组件的纵截面示意图。如图18所示，与磁路组件2600不同的是，磁路组件2700可以进一步包括第三磁性元件510、第四磁性元件512、第五磁性元件514、第三导磁元件516、第六磁性元件524以及第七磁性元件526。第三磁性元件510、第四磁性元件512、第五磁性元件514、第三导磁元件516和/或第六磁性元件524以及第七磁性元件526可以设置为共轴的环形柱体。
上述实施例中的磁路组件都可以用于指代提供磁场的结构。
在一些实施例中，第二磁性元件208的上表面连接第七磁性元件526，第二磁性元件208的下表面可以连接第三磁性元件510。第三磁性元件510可以连接第二导磁元件206。第七磁性元件526的上表面可以连接第三导磁元件516。第四磁性元件512可以连接第二导磁元件206以及第一磁性元件202。第六磁性元件524可以连接第五磁性元件514、第三导磁元件516以及第七磁性元件526。在一些实施例中，第一磁性元件202、第一导磁元件204、第二导磁元件206、第二磁性元件208、第三磁性元件510、第四磁性元件512、第五磁性元件514、第三导磁元件516、第六磁性元件524以及第七磁性元件526可以形成磁回路以及磁间隙。
在一些实施例中，第一磁性元件202的磁化方向与第六磁性元件524的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件202的磁化方向与第六磁性元件524 的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件202的磁化方向与第六磁性元件524的磁化方向之间的夹角不高于90度。在一些实施例中，第一磁性元件202的磁化方向垂直于第一磁性元件202的下表面或上表面竖直向上(如图a方向所示)，第六磁性元件524的磁化方向由第六磁性元件524的外环指向内环(如图中g方向所示，在第一磁性元件202的右侧，第一磁性元件202的磁化方向沿着顺时针方向偏转270度)。在一些实施例中，在同一竖直方向上，第六磁性元件524的磁化方向与第四磁性元件512的磁化方向可以相同。
在一些实施例中，在第六磁性元件524的位置处，磁路组件2700产生的磁场的方向与第六磁性元件524的磁化方向之间的夹角不高于90度。在一些实施例中，在第六磁性元件524的位置处，第一磁性元件202产生的磁场的方向与第六磁性元件524的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在一些实施例中，第一磁性元件202的磁化方向与第七磁性元件526的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件202的磁化方向与第七磁性元件526的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件202的磁化方向与第七磁性元件526的磁化方向之间的夹角不高于90度。在一些实施例中，第一磁性元件202的磁化方向垂直于第一磁性元件202的下表面或上表面竖直向上(如图a方向所示)，第七磁性元件526的磁化方向由第七磁性元件526的下表面指向上表面(如图中f方向所示，在第一磁性元件202的右侧，第一磁性元件202的磁化方向沿着顺时针方向偏转360度)。在一些实施例中，第七磁性元件526的磁化方向与第三磁性元件510的磁化方向可以相反。
在一些实施例中，在第七磁性元件526处，磁路组件2700产生的磁场的方向与第七磁性元件526的磁化方向之间的夹角不高于90度。在一些实施例中，在第七磁性元件526的位置处，第一磁性元件202产生的磁场的方向与第七磁性元件526的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在磁路组件2700中，第三导磁元件516可以将磁路组件2700产生的磁路封闭，使得较多的磁感线集中于磁间隙内，从而达到抑制漏磁、增加磁间隙处的磁感应强度、及提高扬声器的灵敏度的功效。
图19是根据本申请一些实施例提供的磁路组件的纵截面示意图。如图19所示，磁路组件3100可以包括第一磁性元件602、第一导磁元件604、第一全磁场改变元件606以及第二磁性元件608。
在一些实施例中，上述实施例的第一磁性元件都可以用于指代储能、能量转换及电气隔离的元件，同样的，第二磁性元件也遵循此原则。上述实施例的导磁元件都可以用于指代形成磁场回路的元件。
在一些实施例中，第一磁性元件602的上表面可以连接第一导磁元件604的下表面，第二磁性元件608可以连接第一磁性元件602以及第一全磁场改变元件606。第一磁性元件602、第一导磁元件604、第一全磁场改变元件606和/或第二磁性元件608之间的连接方式可以基于本申请中 描述的任意一种或几种连接方式。在一些实施例中，第一磁性元件602、第一导磁元件604、第一全磁场改变元件606和/或第二磁性元件608可形成磁回路及磁间隙。
在一些实施例中，磁路组件3100可以产生第一全磁场，第一磁性元件602可以产生第二磁场，第一全磁场在磁间隙内的磁场强度大于第二磁场在磁间隙内的磁场强度。在一些实施例中，第二磁性元件608可以产生第三磁场，第三磁场可以提高第二磁场在磁间隙处的磁场强度。
在一些实施例中，第一磁性元件602的磁化方向与第二磁性元件608的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件602的磁化方向与第二磁性元件608的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件602的磁化方向与第二磁性元件608的磁化方向之间的夹角可以不高于90度。
在一些实施例中，在第二磁性元件608的位置处，第一全磁场的方向与第二磁性元件608的磁化方向之间的夹角不高于90度。在一些实施例中，在第二磁性元件608的位置处，第一磁性元件602产生的磁场的方向与第二磁性元件608的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。又例如，第一磁性元件602的磁化方向垂直于第一磁性元件602的下表面或上表面竖直向上(如图a方向所示)，第二磁性元件608的磁化方向由第二磁性元件608的外环指向内环(如图中c方向所示，在第一磁性元件602的右侧，第一磁性元件602的磁化方向沿着顺时针方向偏转270度)。与单一磁性元件的磁路组件相比，磁路组件3100中的第一全磁场改变元件606可以提高磁间隙中的总磁通量，进而增加磁间隙中的磁感应强度。并且，在第一全磁场改变元件606的作用下，原本发散的磁感线会向磁间隙所在位置收敛，进一步增加磁间隙中的磁感应强度。
图20是根据本申请一些实施例提供的磁路组件的纵截面示意图。请参阅图20，在一些实施例中，磁路组件3700可以包括第一磁性元件602、第一导磁元件604、第一全磁场改变元件606、第二磁性元件608、第三磁性元件610、第四磁性元件612、第五磁性元件616、第六磁性元件618、第七磁性元件620以及第二环形元件622。第一磁性元件602、第一导磁元件604、第一全磁场改变元件606、第二磁性元件608、第三磁性元件610、第三磁性元件610、第四磁性元件612以及第五磁性元件616。在一些实施例中，第一全磁场改变元件606和/或第二环形元件622可以包括环形磁性元件或环形导磁元件。
在一些实施例中，环形磁性元件可以包括本申请中描述的任意一种或几种磁铁材料，环形导磁元件可以包括本申请中描述的任意一种或几种导磁材料。在一些实施例中，上述实施例中的磁路组件都可以用于指代提供磁场的结构。在一些实施例中，上述实施例的磁性元件都可以用于指代储能、能量转换及电气隔离的元件，上述实施例的导磁元件都可以用于指代形成磁场回路的元件。
在一些实施例中，第六磁性元件618可以连接第五磁性元件616以及第二环形元件622，第七磁性元件620可以连接第三磁性元件610以及第二环形元件622。在一些实施例中，第一磁性元件602、第五磁性元件616、第二磁性元件608、第三磁性元件610、第四磁性元件612、第六磁性元件618和/或第七磁性元件620与第一导磁元件604、第一全磁场改变元件606以及第二环形元 件622可以形成磁回路。
在一些实施例中，第一磁性元件602的磁化方向与第六磁性元件618的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件602的磁化方向与第六磁性元件618的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件602的磁化方向与第六磁性元件618的磁化方向之间的夹角不高于90度。在一些实施例中，第一磁性元件602的磁化方向垂直于第一磁性元件602的下表面或上表面竖直向上(如图a方向所示)，第六磁性元件618的磁化方向由第六磁性元件618的外环指向内环(如图中f方向所示，在第一磁性元件602的右侧，第一磁性元件602的磁化方向沿着顺时针方向偏转270度)。在一些实施例中，在同一竖直方向上，第六磁性元件618的磁化方向与第二磁性元件608的磁化方向可以相同。在一些实施例中，第一磁性元件602的磁化方向垂直于第一磁性元件602的下表面或上表面竖直向上(如图a方向所示)，第七磁性元件620的磁化方向由第七磁性元件620的下表面指向上表面(如图中e方向所示，在第一磁性元件602的右侧，第一磁性元件602的磁化方向沿着顺时针方向偏转360度)。在一些实施例中，第七磁性元件620的磁化方向与第四磁性元件612的磁化方向可以相同。
在一些实施例中，在第六磁性元件618的位置处，磁路组件3700产生的磁场的方向与第六磁性元件618的磁化方向之间的夹角不高于90度。在一些实施例中，在第六磁性元件618的位置处，第一磁性元件602产生的磁场的方向与第六磁性元件618的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在一些实施例中，第一磁性元件602的磁化方向与第七磁性元件620的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件602的磁化方向与第七磁性元件620的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件602的磁化方向与第七磁性元件620的磁化方向之间的夹角不高于90度。
在一些实施例中，在第七磁性元件620的位置处，磁路组件3700产生的磁场的方向与第七磁性元件620的磁化方向之间的夹角不高于90度。在一些实施例中，在第七磁性元件620的位置处，第一磁性元件602产生的磁场的方向与第七磁性元件620的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在一些实施例中，第一全磁场改变元件606可以是环形磁性元件。在这种情况下，第一全磁场改变元件606的磁化方向可以与第二磁性元件608或第四磁性元件612的磁化方向相同。例如，在第一磁性元件602的右侧，第一全磁场改变元件606的磁化方向可以由第一全磁场改变元件606的外环指向内环。在一些实施例中，第二环形元件622可以是环形磁性元件。在这种情况下，第二环形元件622的磁化方向可以与第六磁性元件618或第七磁性元件620的磁化方向相同。例如，在第一磁性元件602的右侧，第二环形元件622的磁化方向可以由第二环形元件622的外环指向内环。在磁路组件3700中，多个磁性元件可以提高总的磁通量，不同磁性元件相互作用，可以抑制磁感线泄漏，提高磁间隙处的磁感应强度，提高扬声器的灵敏度。
在一些实施例中，在磁路组件3700基础上，磁路组件可以进一步包括导磁罩。导磁罩可以 包括本申请中描述的任意一种或几种导磁材料，例如，低碳钢、硅钢片、矽钢片、铁氧体等。导磁罩可以通过本申请中描述的任意一种或几种连接方式连接第一磁性元件602、第一全磁场改变元件606、第二磁性元件608、第三磁性元件610、第四磁性元件612、第五磁性元件616、第六磁性元件618、第七磁性元件620以及第二环形元件622。在一些实施例中，导磁罩可以包括至少一个底板和侧壁，侧壁为环形结构。在一些实施例中，底板和侧壁可以是一体成型。在一些实施例中，底板可以通过本申请中描述的任意一种或几种连接方式连接侧壁。例如，导磁罩可以包括第一底板、第二底板以及侧壁，第一底板与侧壁可以是一体成型的，第二底板可以通过本申请中描述的任意一种或几种连接方式连接侧壁。
在磁路组件3700中，导磁罩可以将磁路组件3700产生的磁路封闭，使得较多的磁感线集中于磁路组件3700中的磁间隙内，达到抑制漏磁、增加磁间隙处的磁感应强度、及提高扬声器的灵敏度的功效。
需要说明的是，上述实施例中的磁路组件都可以用于指代提供磁场的结构。
在一些实施例中，在磁路组件3700基础上，磁路组件可以进一步包括一个或多个导电元件(例如，第四导电元件、第五导电元件以及第六导电元件)。第四导电元件、第五导电元件以及第六导电元件的描述与导电元件248，导电元件250和导电元件252类似，其相关描述在此处不再重复。
图21是根据本申请一些实施例提供的磁路组件的纵截面示意图。如图21所示，磁路组件4100可以包括第一磁性元件402、第一导磁元件404、第二导磁元件406以及第二磁性元件408。
需要说明的是，上述实施例中的磁路组件都可以用于指代提供磁场的结构。上述实施例的磁性元件都可以用于指代储能、能量转换及电气隔离的元件。上述实施例的导磁元件都可以用于指代形成磁场回路的元件。
在一些实施例中，第一磁性元件402和/或第二磁性元件408可以包括本申请中描述的任意一种或几种磁铁。在一些实施例中，第一磁性元件402可以包括第一磁铁，第二磁性元件408可以包括第二磁铁，第一磁铁与第二磁铁可以相同或不同。第一导磁元件404和/或第二导磁元件406可以包括本申请中描述的任意一种或几种导磁材料。第一导磁元件404和/或第二导磁元件406的加工方法可以包括本申请中描述的任意一种或几种加工方式。在一些实施例中，第一磁性元件402、第一导磁元件404和/或第二磁性元件408可以设置为轴对称结构。例如，第一磁性元件402、第一导磁元件404和/或第二磁性元件408可以是圆柱体。在一些实施例中，第一磁性元件402、第一导磁元件404和/或第二磁性元件408可以是共轴的圆柱体，含有相同或者不同的直径。第一磁性元件402的厚度可以大于或等于第二磁性元件408的厚度。在一些实施例中，第二导磁元件406可以是凹槽型结构。在一些实施例中，凹槽型结构可以包含U型的剖面，凹槽型的第二导磁元件406可以包括底板和侧壁。在一些实施例中，底板和侧壁可以是一体成型的，例如，侧壁可以由底板在垂直于底板的方向进行延伸形成。在一些实施例中，底板可以通过本申请中描述的任意一种或几种连接方式连接侧壁。第二磁性元件408可以设定为环状或片状。关于第二磁性元件408的形状可参考说 明书中其他地方的描述。在一些实施例中，第二磁性元件408可以与第一磁性元件402和/或第一导磁元件404共轴。
进一步的，第一磁性元件402的上表面可以连接第一导磁元件404的下表面。第一磁性元件402的下表面可以连接第二导磁元件406的底板。第二磁性元件408的下表面连接第一导磁元件404的上表面。第一磁性元件402、第一导磁元件404、第二导磁元件406和/或第二磁性元件408之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在进一步的，第一磁性元件402、第一导磁元件404和/或第二磁性元件408与第二导磁元件406的侧壁之间形成磁间隙。音圈可以设置于磁间隙中。在一些实施例中，第一磁性元件402、第一导磁元件404、第二导磁元件406以及第二磁性元件408可以形成磁回路。在一些实施例中，磁路组件4100可以产生第一全磁场，第一磁性元件402可以产生第二磁场。第一全磁场由磁路组件4100中的所有组分(例如，第一磁性元件402，第一导磁元件404、第二导磁元件406以及第二磁性元件408)产生的磁场共同形成。第一全磁场在磁间隙内的磁场强度(也可以被称为磁感应强度或者磁通量密度)大于第二磁场在磁间隙内的磁场强度。在一些实施例中，第二磁性元件408可以产生第三磁场，第三磁场可以提高第二磁场在磁间隙处的磁场强度。
在一些实施例中，第二磁性元件408的磁化方向与第一磁性元件402的磁化方向之间的夹角在90度与180度之间。在一些实施例中，第二磁性元件408的磁化方向与第一磁性元件402的磁化方向之间的夹角在150度与180度之间。在一些实施例中，第二磁性元件408的磁化方向与第一磁性元件402的磁化方向相反(如图所示，a方向与b方向)。
与单一磁性元件的磁路组件相比，磁路组件4100增加了第二磁性元件408。第二磁性元件408磁化方向与第一磁性元件402磁化方向相反，可以抑制第一磁性元件402在磁化方向上的漏磁，从而使第一磁性元件402产生的磁场可以较多地被压缩到磁间隙中，因而提高磁间隙内的磁感应强度。
以上对扬声器装置的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的具体方式形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如第一磁场改变元件与第二磁性元件的连接面不局限与图中的平面，连接面还可是楔形截面，楔形截面可以使得磁感线顺利转折。例如，磁路组件中的磁性元件不限于上述的第一磁性元件、第二磁性元件、第三磁性元件、第四磁性元元件、第五磁性元件、第六磁性元件、第七磁性元件，还可以增加或减少磁性元件的数量。诸如此类的变形，均在本申请的保护范围之内。
在一些实施例中，以上描述的扬声器装置可以通过气传导的方式将声音传递给用户。当采用气传导的方式传递声音时，扬声器装置可以包括一个或多个声源。声源可以位于用户头部的特定位置，例如，头顶、额头、脸颊、鬓角、耳廓、耳廓背面等，而不用堵塞或者覆盖耳道。出于描述的目的，图22是显示一种通过气传导的方式传递声音的示意图。
如图22所示，声源3010和声源3020可以产生相位相反的声波(图中以“+”和“-”表示 相位相反)。为简单起见，这里所说的声源指的是扬声器装置上输出声音的出声孔。例如，声源3010和声源3020可以是分别位于扬声器装置上特定位置(例如，机芯壳体20，或者电路壳体10)的两个出声孔。
在一些实施例中，声源3010和声源3020可以由同一个振动装置3001产生。振动装置3001包括振膜(未显示在图中)。当振膜受到电信号驱动而振动时，振膜正面驱动空气振动，通过导声通道3012在出声孔处形成声源3010，振膜背面驱动空气振动，通过导声通道3022在出声孔处形成声源3020。所述导声通道指的是振膜到对应出声孔的声音传播路径。在一些实施例中，所述导声通道是由扬声器上特定结构(例如，机芯壳体20，或者电路壳体10)围成的路径。需要知道的是，在一些可替代的实施例中，声源3010和声源3020还可以由不同的振动装置，分别通过不同的振膜振动产生。
由声源3010和声源3020产生的声音中，一部分传递给用户耳朵形成用户听到的声音，另一部分传递到环境中形成漏音。考虑到声源3010和声源3020距离用户耳朵的位置较近，为了描述方便，传递到用户耳朵的声音可以称为近场声音，传递到环境中的漏音可以称为远场声音。在一些实施例中，扬声器装置产生的不同频率的近场/远场声音与声源3010和声源3020之间的间距有关。一般说来，扬声器装置产生的近场声音会随着两个声源之间间距的增大而增大，而产生的远场声音(漏音)会随着频率的增加而增大。
针对不同频率的声音，可以分别设计声源3010和声源3020之间的间距，使得扬声器装置产生的低频近场声音(例如，频率小于800Hz的声音)尽可能大，且高频远场声音(例如，频率大于2000Hz的声音)尽可能小。为了达到以上目的，所述扬声器装置中可以包括两组或两组以上的双声源，每组双声源包含类似于声源3010和声源3020的两个声源，并分别产生特定频率的声音。具体地，第一组双声源可以用于产生低频声音，第二组双声源可以用产生高频声音。为了获得较大的低频近场声音，第一组双声源中两个声源之间的距离可以设置为较大的值。并且由于低频信号的波长较长，双声源之间较大的距离不会在远场形成过大的相位差，因而也不会在远场中形成过多的漏音。为了使得高频远场声音较小，第二组双声源中两个声源之间的距离可以设置为较小的值。由于高频信号的波长较短，双声源之间较小的距离可以避免在远场形成大的相位差，因而可以避免形成大的漏音。第二组双声源之间的距离小于所述第一组双声源之间的距离。
本申请实施例可能带来的有益效果包括但不限于：(1)将电路壳体和壳体护套分别成型，可以避免高温对控制电路或电池的损伤。(2)第一壳体护套21和第二壳体护套31并不完全包覆整个电路壳体10，能够露出用于用户操作的部件，方便用户使用。(3)通过调整面板301的法线A或面板301与人体皮肤接触面的法线A’与装置101驱动力所在直线B之间的夹角θ可以改善扬声器装置的音质。(4)通过提高壳体整体刚度，外壳面板和外壳背面能够在较高的频率下保持相同或者基本相同的振动幅度和相位，从而减小扬声器装置的漏音。(5)通过在磁路组件中增设磁性元件、导磁元件和导电元件，可以提高扬声器装置的灵敏度。需要说明的是，不同实施例可能产生的有益效果不同，在不同的实施例里，可能产生的有益效果可以是以上任意一种或几种的组合，也可以是 其他任何可能获得的有益效果。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述发明披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。
同时，本申请使用了特定词语来描述本申请的实施例。如“一个实施例”、“一实施例”和/或“一些实施例”意指与本申请至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一替代性实施例”并不一定是指同一实施例。此外，本申请的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
此外，本领域技术人员可以理解，本申请的各方面可以通过若干具有可专利性的种类或情况进行说明和描述，包括任何新的和有用的工序、机器、产品或物质的组合或对他们的任何新的和有用的改进。相应地，本申请的各个方面可以完全由硬件执行、可以完全由软件(包括固件、常驻软件、微码等)执行、也可以由硬件和软件组合执行。以上硬件或软件均可被称为“数据块”、“模块”、“引擎”、“单元”、“组件”或“系统”。此外，本申请的各方面可能表现为位于一个或多个计算机可读介质中的计算机产品，该产品包括计算机可读程序编码。
此外，除非权利要求中明确说明，本申请处理元素和序列的顺序、数字字母的使用或其他名称的使用，并非用于限定本申请流程和方法的顺序。尽管上述披露中通过各种示例讨论了一些目前认为有用的发明实施例，但应当理解的是，该类细节仅起到说明的目的，附加的权利要求并不仅限于披露的实施例，相反，权利要求旨在覆盖所有符合本申请实施例实质和范围的修正和等价组合。例如，虽然以上所描述的系统组件可以通过硬件设备实现，但是也可以只通过软件的解决方案得以实现，如在现有的服务器或移动设备上安装所描述的系统。
同理，应当注意的是，为了简化本申请披露的表述，从而帮助对一个或多个发明实施例的理解，前文对本申请实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本申请对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。
一些实施例中使用了描述成分、属性数量的数字，应当理解的是，此类用于实施例描述的数字，在一些示例中使用了修饰词“大约”、“近似”或“大体上”等来修饰。除非另外说明，“大约”、“近似”或“大体上”表明数字允许有±20％的变化。相应地，在一些实施例中，说明书和权利要求中使用的数值数据均为近似值，该近似值根据个别实施例所需特点可以发生改变。在一些实施例中，数值数据应考虑规定的有效数位并采用一般位数保留的方法。尽管本申请一些实施例中用于确认其范围广度的数值域和数据为近似值，在具体实施例中，此类数值的设定在可行范围内尽可能精确。最后，应当理解的是，本申请中实施例仅用以说明本申请实施例的原则。其他的变形也可能属于本申请的范围。因此，作为示例而非限制，本申请实施例的替代配置可视为与本申请的教导 一致。相应地，本申请的实施例不仅限于本申请明确介绍和描述的实施。

Claims (27)

  1. 一种扬声器装置，其特征在于，所述扬声器装置包括：
    至少一个扬声器组件，所述扬声器组件包括耳机芯和用于容纳所述耳机芯的机芯壳体，所述机芯壳体包括面向人体一侧的外壳面板和与所述外壳面板相对的外壳背面，以及至少一个按键模块；以及
    支撑连接件，所述支撑连接件与所述机芯壳体固定连接，用于与人体头部进行接触，所述支撑连接件中容纳控制电路或电池，所述控制电路或电池驱动所述耳机芯振动以产生声音，其中，
    所述耳机芯的振动导致所述外壳面板和所述外壳背面振动，所述外壳面板的振动具有第一相位，所述外壳背面的振动具有第二相位，所述外壳面板的振动和所述外壳背面的振动频率在2000Hz到3000Hz时，所述第一相位和所述第二相位的差值的绝对值小于60度。
  2. 根据权利要求1所述的扬声器装置，其特征在于，所述支撑连接件与人体头部的接触位置包含至少一个接触点，所述按键模块的中心与所述至少一个接触点之间的距离不大于所述机芯壳体的中心与所述至少一个接触点之间的距离。
  3. 根据权利要求2所述的扬声器装置，其特征在于，所述中心为质心或形心。
  4. 根据权利要求1所述的扬声器装置，其特征在于，所述机芯壳体包括远离人体头部的外侧壁和与所述外侧壁连接并环绕设置的周侧壁。
  5. 根据权利要求4所述的扬声器装置，其特征在于，
    所述周侧壁包括沿外侧壁长度方向设置的第一周侧壁和沿外侧壁宽度方向设置的第二周侧壁；
    所述外侧壁与所述周侧壁连接在一起形成一端开口并容纳所述耳机芯的空腔。
  6. 根据权利要求5所述的扬声器装置，其特征在于，所述按键模块位于外侧壁的中部位置；或者所述按键模块位于外侧壁的中部位置与顶端位置之间。
  7. 根据权利要求6所述的扬声器装置，其特征在于，所述按键模块包括按键和用于支撑所述按键的弹性承座；
    所述外侧壁上设置有按键孔，所述按键孔与所述按键相互配合。
  8. 根据权利要求1所述的扬声器装置，其特征在于，所述支撑连接件与所述机芯壳体的连接部分具有中轴线，所述中轴线的延长线在所述按键模块的外侧面所在的平面上具有投影，所述投影与所述按键模块的长轴方向之间的夹角小于10°。
  9. 根据权利要求8所述的扬声器装置，其特征在于，所述按键模块的外侧面的长轴方向和短轴方向具有交叉点，所述投影与所述交叉点之间具有最短距离，所述最短距离小于所述按键模块的外侧面在短轴方向上的尺寸。
  10. 根据权利要求2所述的扬声器装置，其特征在于，所述按键模块的中心与所述扬声器组件的所述至少一个接触点之间具有第一距离；所述机芯壳体的中心与所述扬声器组件的所述至少一个接触点之间具有第二距离；
    所述第一距离与所述第二距离之间的比例不大于0.95。
  11. 根据权利要求1所述的扬声器装置，其特征在于，所述按键模块的质量与所述扬声器组件的质量比不大于0.3。
  12. 根据权利要求1所述的扬声器装置，其特征在于，所述外壳面板的振动具有第一振幅，所述外壳背面的振动具有第二振幅，所述第一振幅和所述第二振幅的比值在0.5到1.5的范围之内。
  13. 根据权利要求1所述的扬声器装置，其特征在于，所述外壳面板的振动产生第一漏音声波，所述外壳背面的振动产生第二漏音声波，所述第一漏音声波和所述第二漏音声波相互叠加，所述叠加减小了所述第一漏音声波的幅值。
  14. 根据权利要求1所述的扬声器装置，其特征在于，所述外壳面板与所述外壳其它部分通过胶水、卡接、焊接或螺纹连接中的一种或任意几种的组合进行连接。
  15. 根据权利要求1所述的扬声器装置，其特征在于，所述外壳面板和所述外壳背面由纤维增强塑料材料制成。
  16. 根据权利要求1所述的扬声器装置，其特征在于，所述耳机芯振动能够产生驱动力；
    所述外壳面板与所述耳机芯具有传动连接；所述外壳面板的全部或局部用于与使用者身体接触或抵靠，以传导声音；
    所述外壳面板上用于与使用者身体接触或抵靠的区域具有法线，所述驱动力所在直线与所述法线不平行。
  17. 根据权利要求16所述的扬声器装置，其特征在于，设定所述驱动力所在直线具有经面板指向扬声器装置外的正方向，设定所述法线具有指向扬声器装置外的正方向，则两条直线在其正方向上的夹角为锐角。
  18. 根据权利要求16所述的扬声器装置，其特征在于，所述耳机芯包括线圈以及磁路系统，所述线圈与所述磁路系统的轴线与所述法线不平行；
    所述轴线与所述线圈径向平面和/或所述磁路系统径向平面垂直。
  19. 根据权利要求16所述的扬声器装置，其特征在于，所述驱动力在xoy平面坐标系的第一象限和/或第三象限内具有分量；其中，
    xoy平面坐标系的原点o位于扬声器装置与人体接触面上，x轴与人体冠状轴平行，y轴与人体矢状轴平行，且x轴正方向朝向人体外侧，y轴正方向朝向人体前方。
  20. 根据权利要求16所述的扬声器装置，其特征在于，所述外壳面板上用于与使用者身体接触或抵靠的区域包括平面或准平面。
  21. 根据权利要求1所述的扬声器装置，其特征在于，所述耳机芯还包括磁路组件，所述磁路组件产生第一磁场，所述磁路组件包括：
    第一磁性元件，所述第一磁性元件产生第二磁场；
    第一导磁元件；以及
    至少一个第二磁性元件，所述至少一个第二磁性元件环绕所述第一磁性元件，并与所述第一磁性元件之间形成磁间隙，所述第一磁场在所述磁间隙内的磁场强度大于所述第二磁场在所述磁间隙内的磁场强度。
  22. 根据权利要求21所述的扬声器装置，其特征在于，进一步包括：
    第二导磁元件；以及
    至少一个第三磁性元件，其中，所述至少一个第三磁性元件连接所述第二导磁元件和所述至少一个第二磁性元件。
  23. 根据权利要求22所述的扬声器装置，其特征在于，进一步包括：
    至少一个第四磁性元件，其中，所述至少一个第四磁性元件位于所述磁间隙的下方并连接所述第一磁性元件以及所述第二导磁元件。
  24. 根据权利要求21所述的扬声器装置，其特征在于，进一步包括：
    至少一个第五磁性元件，其中，所述至少一个第五磁性元件连接所述第一导磁元件的上表面。
  25. 根据权利要求24所述的扬声器装置，其特征在于，进一步包括：
    第三导磁元件，其中，所述第三导磁元件连接所述第五磁性元件的上表面，所述第三导磁元件 被配置为抑制所述第一磁场的场强泄露。
  26. 根据权利要求22所述的扬声器装置，其特征在于，所述第一导磁元件连接所述第一磁性元件的上表面，所述第二导磁元件包括底板和侧壁，以及所述第一磁性元件连接所述第二导磁元件的底板。
  27. 根据权利要求22所述的扬声器装置，其特征在于，进一步包括：
    至少一个导电元件，其中，所述导电元件连接所述第一磁性元件、所述第一导磁元件，或所述第二导磁元件中的至少一个元件。
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