WO2020038481A1 - 一种眼镜 - Google Patents

一种眼镜 Download PDF

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Publication number
WO2020038481A1
WO2020038481A1 PCT/CN2019/102391 CN2019102391W WO2020038481A1 WO 2020038481 A1 WO2020038481 A1 WO 2020038481A1 CN 2019102391 W CN2019102391 W CN 2019102391W WO 2020038481 A1 WO2020038481 A1 WO 2020038481A1
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WO
WIPO (PCT)
Prior art keywords
vibration
circuit board
rotating shaft
spectacle
magnetic
Prior art date
Application number
PCT/CN2019/102391
Other languages
English (en)
French (fr)
Inventor
王跃强
张浩锋
李永坚
陈云斌
游芬
张磊
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810975515.1A external-priority patent/CN108873372A/zh
Priority claimed from CN201920031804.6U external-priority patent/CN209267805U/zh
Priority claimed from CN201910009904.3A external-priority patent/CN109495809B/zh
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Publication of WO2020038481A1 publication Critical patent/WO2020038481A1/zh
Priority to US17/172,034 priority Critical patent/US20210165249A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/10—Electronic devices other than hearing aids
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/14—Side-members
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/06—Hearing aids
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/14—Side-members
    • G02C5/143—Side-members having special ear pieces
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/22—Hinges
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/22—Hinges
    • G02C5/2218—Resilient hinges
    • G02C5/2254—Resilient hinges comprising elastic means other than coil spring
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C5/00—Constructions of non-optical parts
    • G02C5/22—Hinges
    • G02C5/2281—Special hinge screws
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1033—Cables or cables storage, e.g. cable reels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083—Reduction of ambient noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65—Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/107—Monophonic and stereophonic headphones with microphone for two-way hands free communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/066—Loudspeakers using the principle of inertia
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]

Definitions

  • the present application relates to the field of glasses, and in particular, to glasses with speakers.
  • speakers can have different product forms.
  • the speaker may be integrated on the glasses (sunglasses, swimming glasses, etc.), or may be fixed in or near the user's ear by a special structure (for example, an ear hook).
  • a special structure for example, an ear hook.
  • the complicated wiring greatly occupies the internal space of the product, and the unreasonable wire distribution will cause the wires to affect each other, which will cause abnormal noise and affect the sound quality of the speaker. Therefore, it is necessary to provide a more efficient wiring technology, simplify the speaker wiring, and improve the sound quality of the speaker.
  • the glasses include: a spectacle frame.
  • the spectacle frame includes a spectacle frame and two spectacle legs.
  • the two spectacle legs are rotatably connected to the spectacle frame.
  • Two speaker components include a headphone core, and the two speaker components are connected to the two temples through hinge components on the two temples, respectively, and the hinge components can be rotated to change each The position of the speaker assembly relative to the spectacle legs to which it is connected;
  • the spectacle legs contain a control circuit or a battery, and the control circuit or battery drives the earphone core to vibrate to generate sound.
  • FIG. 1 is a structural module diagram of a speaker according to some embodiments of the present application.
  • FIG. 2 is a schematic structural diagram of a flexible circuit board according to some embodiments of the present application.
  • FIG. 3 is an exploded view of a partial structure of a speaker according to some embodiments of the present application.
  • FIG. 4 is a partial structural cross-sectional view of a speaker according to some embodiments of the present application.
  • FIG. 5 is a partial cross-sectional view of a speaker according to some embodiments of the present application.
  • FIG. 6 is a partial enlarged view of a portion F in FIG. 5 of a speaker according to some embodiments of the present application.
  • FIG. 7 is an exploded view of a speaker according to some embodiments of the present application.
  • FIG. 8 is a schematic structural diagram of a nose pad in a speaker according to some embodiments of the present application.
  • FIG. 9 is a schematic partial cross-sectional view of a spectacle frame and a spectacle lens in a speaker according to some embodiments of the present application.
  • FIG. 10 is an enlarged view of a portion A in FIG. 9 of a speaker according to some embodiments of the present application.
  • FIG. 11 is a schematic diagram of a partial structure of a connection line in a speaker according to some embodiments of the present application.
  • FIG. 12 is a partial structural schematic diagram of a speaker B in FIG. 7 according to some embodiments of the present application.
  • FIG. 13 is an enlarged schematic cross-sectional view of a partial structure of glasses in a speaker according to some embodiments of the present application.
  • FIG. 14 is a schematic structural diagram of a speaker shaft assembly and a connecting wire according to some embodiments of the present application.
  • FIG. 15 is a schematic structural diagram of a first rotating shaft in a speaker according to some embodiments of the present application.
  • 16 is a partial exploded view of a speaker according to some embodiments of the present application.
  • 17 is a schematic structural diagram of an eyeglass frame and an eyeglass lens in a speaker according to some embodiments of the present application.
  • FIG. 18 is a schematic diagram showing a partial structure of a temple of a speaker according to some embodiments of the present application.
  • FIG. 19 is a schematic structural diagram of a headset provided according to some embodiments of the present application.
  • FIG. 20 is an exploded structural diagram of a headset provided according to some embodiments in the present application.
  • 21 is an equivalent model of a speaker vibration generation and transmission system provided according to some embodiments of the present application.
  • 22 is a structural diagram of a composite vibration device of a speaker according to an embodiment of the present application.
  • FIG. 23 is a structural diagram of a composite vibration device of a speaker provided according to an embodiment of the present application.
  • FIG. 24 is a frequency response curve of a speaker applicable according to an embodiment in the present application.
  • 25 is a structural diagram of a composite vibration device of a loudspeaker provided according to some embodiments of the present application.
  • FIG. 26 is a vibration response curve of a speaker provided according to some embodiments of the present application.
  • FIG. 27 is a structural diagram of a speaker vibration generating section provided according to some embodiments in the present application.
  • FIG. 28 is a vibration response curve of a speaker vibration generating portion provided according to some embodiments of the present application.
  • FIG. 29 is a vibration response curve of a speaker generating part according to some embodiments in the present application.
  • FIG. 30 is a schematic structural diagram of a bone conduction speaker assembly provided according to some embodiments of the present application.
  • FIG. 31 is a schematic longitudinal sectional view of a magnetic circuit assembly 2100 according to some embodiments of the present application.
  • FIG. 32 is a schematic longitudinal sectional view of a magnetic circuit assembly 2600 according to some embodiments of the present application.
  • FIG. 33 is a schematic longitudinal sectional view of a magnetic circuit assembly 2700 according to some embodiments of the present application.
  • FIG. 34 is a schematic longitudinal sectional view of a magnetic circuit assembly 2900 according to some embodiments of the present application.
  • 35 is a schematic longitudinal sectional view of a magnetic circuit assembly 3000 according to some embodiments of the present application.
  • FIG. 36 is a schematic longitudinal sectional view of a magnetic circuit assembly 3100 according to some embodiments of the present application.
  • FIG. 37 is a schematic diagram of an application scenario and a structure of glasses provided according to some embodiments of the present application.
  • FIG. 38 is a schematic diagram of an included angle direction according to some embodiments of the present application.
  • 39 is a schematic structural diagram of a bone conduction speaker component acting on human skin and bone according to some embodiments of the present application.
  • FIG. 40 is an angle-relative displacement relationship diagram of a bone conduction speaker assembly provided according to some embodiments of the present application.
  • 41 is a schematic diagram of a low-frequency part of a frequency response curve of a bone conduction speaker component at different included angles ⁇ according to some embodiments of the present application;
  • FIG. 42 is a schematic longitudinal sectional view of a bone conduction speaker assembly according to some embodiments of the present application.
  • FIG. 43 is a schematic structural diagram of a bone conduction speaker assembly provided according to some embodiments of the present application.
  • FIG. 44 is a schematic structural diagram of another bone conduction speaker assembly according to some embodiments of the present application.
  • 46 is a schematic structural diagram of a shell of a bone conduction speaker assembly according to some embodiments of the present application.
  • FIG. 47A is a schematic structural diagram of a speaker assembly provided according to some embodiments in the present application.
  • 47B is a schematic structural diagram of a speaker assembly provided according to some embodiments in the present application.
  • FIG. 48 is a noise suppression effect diagram of the speaker assembly provided according to FIGS. 28A and 28B of the present application.
  • FIG. 49 is a vibration response curve of a bone conduction speaker assembly under different pressures between a contact surface and a user according to some embodiments of the present application.
  • 51 is a schematic diagram of a contact surface of a vibration unit of a speaker assembly component provided according to some embodiments of the present application.
  • FIG. 52 is a vibration response curve of a speaker assembly provided according to some embodiments of the present application.
  • FIG. 53 is a schematic diagram of a contact surface of a vibration unit of a speaker assembly according to some embodiments of the present application.
  • FIG. 54 is a top view of a bonding manner of a speaker module panel according to some embodiments of the present application.
  • FIG. 55 is a top view of a bonding manner of a speaker module panel according to some embodiments of the present application.
  • FIG. 56 is a structural diagram of a vibration generating portion of a speaker assembly provided according to some embodiments of the present application.
  • 57 is a vibration response graph of a vibration generating part of a speaker assembly provided according to some embodiments of the present application.
  • 58 is a structural diagram of a vibration generating portion of a speaker assembly provided according to some embodiments of the present application.
  • 59 is an exploded structural view of a speaker provided according to some embodiments of the present application.
  • 60 is a partial cross-sectional view of glasses provided according to some embodiments in the present application.
  • FIG. 61 is an enlarged view of part A in FIG. 60 according to the present invention.
  • FIG. 62 is a cross-sectional view of the electronic components of the glasses provided in accordance with some embodiments of the present application along the A-A axis in FIG. 19 in a combined state; FIG.
  • FIG. 63 is an enlarged view of a portion B in FIG. 62; FIG.
  • 64 is a partial cross-sectional view provided according to some embodiments in the present application.
  • FIG. 65 is a cross-sectional view of the electronic components of the glasses provided in accordance with some embodiments of the present application along the B-B axis in FIG. 59 in a combined state;
  • FIG. 66 is a schematic structural diagram of an embodiment in which the first circuit board and the second circuit board of the present application have different angles from FIG. 65; FIG.
  • FIG. 67 is a cross-sectional view of the electronic components of the glasses provided in accordance with some embodiments of the present application along the C-C axis in FIG. 19 in a combined state;
  • FIG. 68 is a cross-sectional view of the electronic components of the glasses provided in accordance with some embodiments in the present application along the A-A axis in FIG. 59 in a combined state; FIG.
  • FIG. 69 is a cross-sectional view of the electronic components of the glasses provided in accordance with some embodiments of the present application along the B-B axis in FIG. 59 in a combined state;
  • 70 is a partial structural cross-sectional view of a glasses speaker assembly provided according to some embodiments of the present application.
  • FIG. 71 is a partially enlarged view of a portion C in FIG. 66; FIG.
  • FIG. 72 is a partial structural diagram of a movement case of a glasses speaker assembly according to some embodiments of the present application.
  • FIG. 73 is a partially enlarged view of a portion D in FIG. 72; FIG.
  • FIG. 74 is a partial cross-sectional view of a movement case of a glasses speaker assembly according to some embodiments of the present application.
  • FIG. 75 is a schematic diagram of transmitting sound by means of air conduction in the present application.
  • eyeglasses or “sunglasses” with speaker components.
  • glasseses or “sunglasses” can also be replaced with other similar words, such as “eye protection device”, “eye wearable device”, and the like.
  • Sounding device can also be replaced by other similar words, such as “hearing aid”, “player”, “playing device” and so on.
  • Ambient sound pickup and processing functions are added to the glasses, so that the glasses can realize the function of hearing aids.
  • a microphone such as a microphone can pick up the sound of the user / wearer's surroundings and, under a certain algorithm, transmit the sound processing (or the generated electrical signal) to the speaker component part in the glasses. That is, the glasses can be modified to include the function of picking up ambient sounds, and after certain signal processing, the sound is transmitted to the user / wearer through the speaker component part, thereby realizing the function of the hearing aid.
  • the algorithms mentioned here may include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active noise reduction, directional processing, tinnitus processing, multi-channel wide dynamic range compression, and active howling A combination of one or more of suppression, volume control, etc.
  • FIG. 1 is a structural block diagram of a speaker according to some embodiments of the present application.
  • the speaker 100 may include at least a headphone core 102, an auxiliary function module 104, and a flexible circuit board 106.
  • the headphone core 102 may receive audio electrical signals and convert the audio signals into sound signals.
  • the flexible circuit board 106 provides electrical connections between different modules / components.
  • the flexible circuit board 106 may provide an electrical connection between the headphone core 102 and an external control circuit and auxiliary function module 104.
  • the earphone core 102 may include at least a magnetic circuit component, a vibration component, and a bracket for receiving the magnetic circuit component and the vibration component.
  • the magnetic circuit component is used to provide a magnetic field
  • the vibration component is used to convert an electrical signal input to the vibration component into a mechanical vibration signal, and thereby generate a sound.
  • the vibration assembly may include at least a coil and an internal lead.
  • the earphone core 102 further includes an external lead, which is capable of transmitting audio current to a coil in the vibration component.
  • One end of the external wire can be connected to the internal lead of the headphone core, and one end can be connected to the flexible circuit board of the speaker.
  • the bracket may have a buried wire groove, and the external wires and / or the internal wires may be partially disposed in the buried wire groove.
  • the auxiliary function module 104 is configured to receive auxiliary signals and perform auxiliary functions.
  • the auxiliary function module 104 may be a module for performing auxiliary functions different from the headphone core for receiving auxiliary signals.
  • converting an audio signal into a sound signal may be considered as a main function of the speaker 100, and other functions different from the main function may be considered as auxiliary functions of the speaker 100.
  • the auxiliary functions of the speaker 100 may include receiving a user and / or an ambient sound through a microphone, and controlling a playback process of the sound signal through a key, and the like.
  • the corresponding auxiliary function module can be a microphone, a key switch, etc., which can be set according to actual needs.
  • the auxiliary signal may be a combination of one or more of electric signals, optical signals, acoustic signals, and vibration signals related to auxiliary functions.
  • the speaker 100 further includes a movement case 108 for receiving the headphone core 102, the auxiliary function module 104 and the flexible circuit board 106.
  • the inner wall of the movement case 108 may be directly or indirectly connected to the vibration component in the earphone core.
  • the outer wall of the movement case 108 is connected to The user contacts and transmits the mechanical vibration of the vibration component to the auditory nerve through the bone, so that the human body hears the sound.
  • the speaker may include a headphone core 102, an auxiliary function module 104, a flexible circuit board 106, and a movement case 108.
  • the flexible circuit board 106 may be a flexible printed circuit (FPC), and is accommodated in an internal space of the movement case 108.
  • the flexible circuit board 106 can have high flexibility and can adapt to the internal space of the movement case 108.
  • the flexible circuit board 106 may include a first board body and a second board body. The flexible circuit board 106 can be bent at the first plate body and the second plate body to adapt to its position in the movement case 108 and the like.
  • FPC flexible printed circuit
  • the speaker 100 transmits sound through bone conduction.
  • the outer surface of the movement case 108 may have a conforming surface.
  • the fitting surface is an outer surface of the speaker 100 that is in contact with a human body when the user wears the speaker 100.
  • the speaker 100 can press the fitting surface against a preset area (the front of the tragus, the position of the skull, or the back of the auricle), thereby effectively transmitting vibration signals to the user's auditory nerve through the bones, and improving the sound quality of the speaker 100.
  • the conforming surface may conform to the back of the auricle.
  • the mechanical vibration signal is transmitted from the earphone core to the movement case, and is transmitted to the back of the auricle through the fitting surface of the movement case, and then the vibration signal is transmitted to the auditory nerve by the bone near the back of the auricle.
  • the bone near the back of the auricle is closer to the auditory nerve, which has a better conduction effect, which can improve the efficiency of the speaker 100 transmitting sound to the auditory nerve.
  • the speaker 100 further includes a fixing mechanism 110.
  • the fixing mechanism 110 is externally connected to the movement case 108 for supporting and maintaining the position of the movement case 108.
  • a battery assembly and a control circuit may be disposed in the fixing mechanism 110.
  • the battery component can provide power to any electronic component in the speaker 100.
  • the control circuit can control any functional component in the speaker 100, and the functional component includes, but is not limited to, a headphone core, an auxiliary function module, and the like.
  • the control circuit can be connected to the battery and other functional components through a flexible circuit board, and can also be connected to the battery and other functional components through wires.
  • the fixing mechanism 110 may be one or a combination of spectacle frames, hats, headwear, or other headwear.
  • the fixing mechanism 110 may be a spectacle frame.
  • a cavity is formed inside the spectacle frame, which can accommodate battery components, flexible circuit boards and control circuits.
  • the earphone core 102 may be located at the tail end of the spectacle legs, and located at the ear when the user wears the glasses, and provides a sound signal.
  • FIG. 2 is a schematic structural diagram of a flexible circuit board inside a movement case according to some embodiments of the present application.
  • the flexible circuit board 44 includes at least a plurality of first pads 45 and a plurality of second pads (not shown in the figure).
  • the flexible circuit board 44 in FIG. 2 corresponds to the flexible circuit board 106 in FIG. 1. At least one first pad 45 of the first pads 45 is electrically connected to the auxiliary function module.
  • the at least one first pad 45 is connected to at least one of the at least one first pad 45 through the first flexible lead 47 on the flexible circuit board 44.
  • One of the second pads is electrically connected, and the at least one second pad is electrically connected to the headphone core (not shown in the figure) through an external wire (not shown in the figure).
  • At least another first pad 45 of the first pads 45 is electrically connected to an auxiliary signal wire, and the at least another first pad 45 and the auxiliary function module are connected to each other through the flexible circuit board 44.
  • the second flexible lead 49 is electrically connected.
  • At least one first pad 45 is electrically connected to the auxiliary function module, at least one second pad is electrically connected to the headphone core through an external wire, and then the at least one first pad is connected to the at least one first pad through a first flexible lead 47.
  • One of 45 is electrically connected to one of the at least one second pad, so that the external audio signal wire and the auxiliary signal wire are electrically connected to the headphone core and multiple auxiliary function modules through a flexible circuit board at the same time, which simplifies the wiring.
  • the audio signal wire may be a wire electrically connected to the headphone core and transmitting an audio signal to the headphone core.
  • the auxiliary signal wire may be a wire that is electrically connected to the auxiliary function module and performs signal transmission with the auxiliary function module.
  • the flexible circuit board 44 is provided with a plurality of pads 45 and two pads (not shown in the figure).
  • the disks 45 are located on the same side of the flexible circuit board 44 and are spaced apart. And the two pads are connected to corresponding two pads 45 of the plurality of pads 45 through a flexible lead 47 on the flexible circuit board 44.
  • the movement case 41 also contains two external wires, one end of each of the external wires is welded to the corresponding pad, and the other end is connected to the earphone core, so that the earphone core is connected to the pad through the external wire.
  • the auxiliary function module can be mounted on the flexible circuit board 44 and connected to other pads of the plurality of pads 45 through flexible leads 49 on the flexible circuit board 44.
  • a conducting wire is provided in the fixing mechanism 110 of the speaker 100, and the conducting wire includes at least an audio signal wire and an auxiliary signal wire.
  • the wires in the fixing mechanism 110 may be multiple, including at least two audio signal wires and at least two auxiliary signal wires.
  • the fixing mechanism 110 may be a spectacle frame, the spectacle frame is connected to the movement case 41, and the lead may be a lead provided in the spectacle frame. One end of the lead in the spectacle frame is soldered to the control circuit board, and the other end enters the inside of the movement case 41 and is soldered to the pad 45 on the flexible circuit board 44.
  • one end of the two audio signal wires in the wires in the eyeglass frame which is located in the movement case 41, is welded to two pads 45 welded by two flexible leads 47, and the other end can be directly or indirectly connected to the control
  • the two pads 45 are further connected to the headphone core through the welding of the flexible lead 49 and the two pads 46 and the welding of the two external wires to the pads, thereby transmitting audio signals to the headphone core.
  • auxiliary signal wires located in the movement case 41 is soldered to the solder pad 45 to which the flexible lead 49 is soldered, and the other end can be directly or indirectly connected to the control circuit board, so as to provide the control circuit (not (Shown in the figure) transfers auxiliary signals received and converted by auxiliary function modules.
  • a flexible circuit board 44 is provided in the movement case 41, and corresponding pads are further provided on the flexible circuit board 44, so that a lead wire (not shown in the figure) enters the movement case 41. It is soldered to the corresponding pads and connected to the corresponding auxiliary function modules through the flexible leads 47 and 49 on the pads, thereby avoiding connecting multiple wires directly to the auxiliary function modules.
  • the lead in the spectacle frame is welded to the soft Further connecting the corresponding auxiliary function module to the sex circuit board 44 can reduce the situation that the wire is suspended and affect the quality of the headphone core, thereby improving the sound quality of the headphone core to a certain extent.
  • the flexible circuit board (also referred to as the flexible circuit board 44) may be further partitioned to divide the flexible circuit board into at least two regions. Each zone can be provided with an auxiliary function module, so that at least two auxiliary function modules can be provided on the flexible circuit board, and audio signal wires and auxiliary signal wires and at least two auxiliary function modules can be realized through the flexible circuit board. Between the lines.
  • the flexible circuit board may include at least a main circuit board and a first branch circuit board. The first branch circuit board is connected to the main circuit board and extends away from the main circuit board along one end of the main circuit board.
  • the auxiliary function module may include at least a first auxiliary function module and a second auxiliary function module.
  • a first auxiliary function module may be provided on the main circuit board, and a second auxiliary function module may be provided on the first branch circuit board.
  • a plurality of first pads may be provided on the main circuit board, and a second pad may be provided on the first branch circuit board.
  • the first auxiliary function module may be a key switch, and the key switch may be disposed on the main circuit board, and the first pad is provided corresponding to the key switch.
  • the second auxiliary function module may be a microphone.
  • the microphone is disposed on the first branch circuit board, and a second pad corresponding to the microphone is provided on the first branch circuit board.
  • the second flexible lead is used to connect the first pad corresponding to the key switch on the main circuit board and the second pad corresponding to the microphone on the first branch circuit board.
  • the key switch can be electrically connected to the microphone to make the key The switch can control or operate the microphone.
  • the flexible circuit board may further include a second branch circuit board, and the second branch circuit board is connected to the main circuit board and is far from the main circuit board along the main circuit board. The other end extends and is spaced from the first branch circuit board.
  • the auxiliary function module may further include a third auxiliary function module, and the third auxiliary function module is disposed on the second branch circuit board.
  • the plurality of first pads are disposed on the main circuit board, at least one of the second pads is disposed on the first branch circuit board, and the other second pads are disposed on the second branch.
  • the third auxiliary function module may be a second microphone.
  • the second branch circuit board extends perpendicular to the main circuit board.
  • the second microphone is mounted on the end of the second branch circuit board away from the main circuit board.
  • a plurality of pads are provided on the end of the main circuit board far from the second branch circuit board. unit.
  • the second auxiliary function module may be a first microphone 432a
  • the third auxiliary function module may be a second microphone 432b.
  • the first microphone 432a and the second microphone 432b can both be MEMS (micro-electromechanical system) microphone 432, which has a small working current, relatively stable performance, and high voice quality.
  • the two microphones 432 may be disposed at different positions of the flexible circuit board 44 according to actual needs.
  • the flexible circuit board 44 includes a main circuit board 441 (also referred to as a main circuit board) and a branch circuit board 442 (or a first branch circuit board) and a branch circuit board 443 (or a branch circuit board) connected to the main circuit board 441.
  • a main circuit board 441 also referred to as a main circuit board
  • a branch circuit board 442 or a first branch circuit board
  • a branch circuit board 443 or a branch circuit board
  • the branch circuit board 442 extends in the same direction as the main circuit board 441, the first microphone 432a is mounted on the end of the branch circuit board 442 away from the main circuit board 441, and the branch circuit board 443 and the main circuit board 441 Extending vertically, the second microphone 432b is mounted on the end of the branch circuit board 443 away from the main circuit board 441, and a plurality of pads 45 are disposed on the end of the main circuit board 441 away from the branch circuit board 442 and the branch circuit board 443.
  • the movement case 41 includes a peripheral side wall 411 and a bottom end wall 412 connected to one end surface of the peripheral side wall 411 to form an accommodation space with an open end.
  • the earphone core is placed in the accommodation space through the open end, the first microphone 432a is fixed on the bottom end wall 412, and the second microphone 432b is fixed on the peripheral side wall 411.
  • the branch circuit board 442 and / or the branch circuit board 443 may be appropriately bent to adapt to the position of the sound inlet hole corresponding to the microphone 432 on the movement case 41.
  • the flexible circuit board 44 can be disposed in the movement case 41 in a manner that the main circuit board 441 is parallel to the bottom end wall 412, so that the first microphone 432a can correspond to the bottom end wall 412 without the need for the main circuit board. 441 is bent. Since the second microphone 432b is fixed on the peripheral side wall 411 of the movement case 41, it is necessary to bend the second main circuit board 441.
  • the branch circuit board 443 can be located at an end away from the main circuit board 441.
  • the pad 45, the pad, the first microphone 432a, and the second microphone 432b may be disposed on the same side of the flexible circuit board 44, and the pad is disposed adjacent to the second microphone 432b.
  • the pads may be specifically disposed at the end of the branch circuit board 443 away from the main circuit board 441, and the same orientation as the second microphone 432b is provided at intervals, so as to be perpendicular to the orientation of the pad 45 as the branch circuit board 443 is bent .
  • the plate surface of the branch circuit board 443 may not be perpendicular to the plate surface of the main circuit board 441 after being bent, and may be determined according to the arrangement manner between the peripheral side wall 411 and the bottom end wall 412.
  • the other side of the flexible circuit board 44 is provided with a rigid support plate 4a for supporting the pad 45 and a microphone rigid support plate 4b.
  • the microphone rigid support plate 4b includes a rigid support plate 4b1 for supporting the first microphone 432a. And a rigid support plate 4b2 for supporting the pad 46 and the second microphone 432b together.
  • the rigid support plate 4a, the rigid support plate 4b1, and the rigid support plate 4b2 are mainly used to support the corresponding pads and the microphone 432, and therefore need to have a certain strength.
  • the materials of the three may be the same or different. Specifically, they may be polyimide films (PI), or other materials capable of supporting strength, such as polycarbonate and polyvinyl chloride.
  • the thickness of the three rigid support plates can be set according to the strength of the rigid support plate itself and the actual strength required by the pads 45, the pads, and the first microphone 432a and the second microphone 432b, which are not specified here. limited.
  • the rigid support plate 4a, the rigid support plate 4b1, and the rigid support plate 4b2 may be three different regions of the entire rigid support plate, or may be three independent entire bodies spaced apart from each other, which are not specifically limited herein.
  • the first microphone 432a and the second microphone 432b respectively correspond to two microphone assemblies (not shown in the figure).
  • the structure of the two microphone components is the same.
  • a sound inlet hole 413 is provided on the movement case 41.
  • the speaker device is further provided with a movement case integrally formed on the movement case 41
  • the annular blocking wall 414 on the inner surface of the body 41 is disposed on the periphery of the sound entrance hole 413, and further defines an accommodation space (not shown in the figure) in communication with the sound entrance hole 413.
  • the flexible circuit board 44 may be disposed between the rigid support plate (eg, the rigid support plate 4a, the rigid support plate 4b1, and the rigid support plate 4b2) and the microphone 432, and corresponding to the microphone rigid support plate 4b.
  • a sound inlet hole 444 is provided at a position of the sound inlet hole 4b3 of the sound inlet hole 4b3.
  • the flexible circuit board 44 further extends away from the microphone 432 to connect with other functional elements or wires to achieve corresponding functions.
  • the rigid support plate 4b of the microphone also extends a distance from the microphone 432 along with the flexible circuit board.
  • a notch matching the shape of the flexible circuit board 44 is provided on the annular blocking wall 414 to allow the flexible circuit board 44 to extend from the accommodation space.
  • a sealant may be further filled in the notch to further improve the sealability.
  • the flexible circuit board 44 may include a main circuit board 445 and a branch circuit board 446, wherein the branch circuit board 446 may extend along an extending direction perpendicular to the main circuit board 445.
  • a plurality of pads 45 are disposed on the end of the main circuit board 445 away from the branch circuit board 446
  • a key switch is mounted on the main circuit board 445
  • the pads 46 are disposed on the end of the branch circuit board 446 away from the main circuit board 445.
  • the first auxiliary function module may be a key switch 431
  • the second auxiliary function module may be a microphone 432.
  • the board surface of the flexible circuit board 44 is disposed parallel to the bottom end wall 412 so that the key switch can be disposed toward the bottom end wall 412 of the movement case 41.
  • the headphone core may include a magnetic circuit component, a vibration component, an external wire, and a bracket.
  • the vibration component includes a coil and an inner lead
  • the external lead can transmit audio current to the coil in the vibration component.
  • One end of the external wire can be connected to the internal lead of the headphone core, and one end can be connected to the flexible circuit board of the speaker.
  • the bracket may have a buried wire groove, and at least a part of the external wire and / or the internal wire may be disposed in the buried wire groove.
  • the inner lead and the outer lead are soldered to each other, and the welding position may be located in the buried wire slot.
  • the earphone core includes a bracket 421, a coil 422, and an external wire 48.
  • the bracket 421 is used for supporting and protecting the entire headphone core structure.
  • the bracket 421 is provided with a buried wire slot 4211, which can be used to receive the line of the earphone core.
  • the coil 422 may be disposed on the bracket 421 and has at least one internal lead 423. One end of the internal lead 423 is connected to a main line in the coil 422 to lead the main line and transmit audio current to the coil 422 through the internal lead 423. .
  • One end of the external lead 48 is connected to the internal lead 423. Further, the other end of the external lead 48 may be connected to a control circuit (not shown) to transmit audio current to the coil 422 through the control circuit through the internal lead 423.
  • the length of the wire cannot be exactly the same as the length of the channel. There are extra length lines. However, if the extra length of the wire cannot be placed reasonably, it will vibrate with the vibration of the coil 422, thereby emitting abnormal sounds, affecting the sound quality of the headphone core.
  • At least one of the external lead 48 and the internal lead 423 can be wound and set in the buried wire slot 4211.
  • the welding position between the internal lead 423 and the external lead 48 can be set to the buried wire.
  • a portion of the outer lead 48 and the inner lead 423 near the welding position is wound in the buried wire groove 4211.
  • a sealant may be further filled in the buried groove 4211 to fix the wiring in the buried groove 4211.
  • a buried wire slot 4211 is provided on the bracket 421, so that at least one of the external lead wire 48 and the internal lead wire 423 is wound and set in the buried wire slot 4211 to accommodate the excess length of the wire, thereby weakening it in the channel.
  • the vibration generated during it reduces the influence of the abnormal sound caused by the vibration on the sound quality emitted by the headphone core.
  • the bracket 421 includes an annular main body 4212, a support flange 4213, and an outer blocking wall 4214.
  • the annular main body 4212, the support flange 4213, and the outer blocking wall 4214 can be obtained by integral molding.
  • the ring-shaped body 4212 is disposed on the inner side of the entire bracket 421 and is used to support the coil 422. Specifically, the cross-section of the ring-shaped body 4212 in a direction perpendicular to the radial direction of the ring is consistent with the coil 422, and the coil 422 is disposed at an end of the ring-shaped body 4212 facing the inner portion of the movement case, and the inner side wall of the ring-shaped body 4212 and The outer side wall can be flush with the inner side wall and the outer side wall of the coil 422, so that the inner side wall of the coil 422 and the inner side wall of the ring body 4212 are coplanar, and the outer side wall of the coil 422 and the outer side wall of the ring body 4212 are coplanar. .
  • the supporting flange 4213 is protruded on the outer side wall of the ring-shaped body 4212 and extends to the outside of the ring-shaped body 4212. Specifically, the support flange 4213 may extend to the outside in a direction perpendicular to the outer wall of the ring-shaped body 4212. Wherein, the support flange 4213 may be provided at a position between two ends of the ring-shaped body 4212. In this embodiment, the support flange 4213 may protrude around the outer side wall of the ring-shaped body 4212 to form a ring-shaped support flange 4213. In other embodiments, only a part of the outer side wall of the annular main body 4212 may be formed in a protruding manner according to requirements.
  • the outer baffle wall 4214 is connected to the support flange 4213 and is spaced apart from the ring body 4212 along the side of the ring body 4212.
  • the outer baffle wall 4214 can be sleeved on the periphery of the ring-shaped body 4212 and / or the coil 422 at intervals. Specifically, it can be partially sleeved on the periphery of the ring-shaped body 4212 and the coil 422 according to actual needs, and partly on the ring-shaped body 4212 periphery.
  • a portion of the outer blocking wall 4214 near the buried wire groove 4211 is sleeved on the periphery of a part of the annular main body 4212.
  • the outer baffle wall 4214 is disposed on a side of the support flange 4213 away from the movement case.
  • the outer side wall of the ring-shaped body 4212 and the side wall of the support flange 4213 far from the movement case and the inner side wall of the outer blocking wall 4214 jointly define the buried groove 4211.
  • a wiring channel 424 is provided on the ring-shaped body 4212 and the supporting flange 4213, and the inner lead 423 extends into the buried groove 4211 through the wiring channel 424.
  • the routing channel 424 includes a sub routing channel 4241 on the ring-shaped body 4212 and a sub routing channel 4242 on the support flange 4213.
  • the sub-routing channel 4241 is provided through the inner side wall and the outer side wall of the annular main body 4212, and a wiring opening 42411 communicating with one end of the sub-routing channel 4241 is provided on the side of the annular main body 4212 near the coil 422.
  • a wiring opening 42412 communicating with the other end of the sub routing passage 4241 is provided; the sub routing passage 4242 penetrates the support flange 4213 in a direction toward the outside of the movement case, and
  • the supporting flange 4213 is provided with a wiring opening 42421 on one side facing the inner part of the movement case, which communicates with one end of the sub wiring passage 4242, and a wiring connecting the other end of the sub wiring passage 4242, which is away from the inside of the movement case, Mouth 42422.
  • the wiring opening 42412 and the wiring opening 42421 communicate with each other through a space between the support flange 4213 and the ring-shaped body 4212.
  • the inner lead 423 can enter the wiring opening 42411, extend along the sub-routing channel 4241, and exit from the wiring opening 42412 to enter the area between the ring-shaped body 4212 and the support flange 4213, and further from the wiring opening 42421 enters the sub-travel channel 4242, and extends into the buried groove 4211 after passing through the trace opening 42422.
  • a slot 42141 is provided at the top of the outer baffle wall 4214, and the external wire 48 can extend into the buried wire slot 4211 through the slot 42141.
  • One end of the external lead 48 is disposed on the flexible circuit board 44, and the flexible circuit board 44 is specifically disposed on a side of the earphone core that faces the inside of the movement case.
  • the support flange 4213 is further extended to a side of the outer blocking wall 4214 away from the annular main body 4212 to form an outer edge. Further, the outer edge surrounds the inner side wall of the movement case. Specifically, the outer edge of the support flange 4213 is provided with a slot 42131, so that the external wire 48 located on the side of the earphone core facing the inside of the movement case can extend through the slot 42131 to the support flange 4213. Facing the outer side of the movement case, it further extends to the slot 42141, and enters the buried slot 4211 through the slot 42141.
  • an inner side wall of the movement case is provided with one end on the flexible circuit board 44 side, and the other end communicates with the guide groove 416 of the slot 42131 extending in a direction toward the outside of the movement case, so that external wires 48 extends from the flexible wiring board to the second wiring groove 3331 through the guide groove 416.
  • the bracket 421 further includes two side walls 4215 spaced apart from each other along the circumferential direction of the ring body 4212 and connecting the ring body 4212, the support flange 4213, and the outer wall 4214, and further the two side walls 4215 A buried wire slot 4211 is defined therebetween.
  • the two side retaining walls 4215 are oppositely disposed on the support flange 4213 and protrude toward the outer side of the movement case along the support flange 4213.
  • the side of the two side retaining walls 4215 facing the annular body 4212 is connected to the outer side wall of the annular body 4212, and the side far from the annular body 4212 terminates at the outer side wall of the outer retaining wall 4214, and the wiring opening 42422 and the opening
  • the groove 42141 is defined between the two side retaining walls 4215, so that the inner lead 423 passing through the wiring opening 42422 and the outer wire 48 entered through the slot 42141 extend into the buried wire groove 4211 defined by the two side retaining walls 4215. among.
  • FIG. 7 is a schematic structural diagram of a speaker according to some embodiments of the present application.
  • the speaker may be glasses.
  • the fixing mechanism may be a spectacle frame.
  • the fixing mechanism may have at least one rotating shaft component, which is used to connect the spectacle frame and the spectacle legs, the spectacle frame and the spectacle legs can rotate around the rotating shaft component, and the rotating shaft component has a rotating shaft routing channel arranged along the axis. .
  • a connecting wire may be provided in the fixing mechanism.
  • the connecting wire is an electric connecting wire.
  • the connecting wire is penetrated in the rotating shaft routing channel, and the two ends respectively extend into the spectacle frame and the spectacle leg.
  • a control circuit and a battery component may be respectively accommodated in the temples on both sides, and a connecting wire in the spectacle frame is electrically connected to the control circuit and the battery component.
  • connection line may include the audio signal line and the auxiliary signal line.
  • the connecting wire can be electrically connected to the flexible circuit board (ie, the flexible circuit board 106) inside the movement case (ie, the movement case 108), and the earphone core (ie, the earphone core 102) and auxiliary functions through the flexible circuit board.
  • the modules ie, the auxiliary function module 104) are electrically connected.
  • the spectacles of the present application may be spectacles worn to correct vision and protect eyes in the daily life and work of people, or a certain circuit structure and electronics are further added to the glasses. Components, etc., to further achieve specific functions through these circuit structures and electronic components.
  • the glasses in this application may be smart glasses, virtual reality glasses, holographic glasses, augmented reality glasses, glasses with other functional structures (such as glasses with bone conduction headphones or air conduction headphones, etc.).
  • the spectacle frame may include: a spectacle frame 11, a nose pad 12, a spectacle lens 13, and a spectacle leg 15.
  • the spectacle frame 11 is used to carry at least part of the spectacle lenses 13, and the nose pad 12 is used to support the spectacles on the bridge of the user's nose when the user wears them.
  • the nose pad 12 is disposed in the middle of the spectacle frame 11 and is integrally formed with the spectacle frame 11.
  • the spectacle frame 11 and the nose pad 12 are usually formed separately.
  • the middle part of the spectacle frame 11 is provided with a structure connected to the nose pad 12.
  • the nose pad 12 is installed on the connection structure of the spectacle frame 11. .
  • the spectacle frame 11 and the nose pad 12 are integrally formed into a single structure.
  • a corresponding mold can be used to integrally form the mold by injection molding or the like.
  • the spectacle frame 11 and the nose pad 12 in this embodiment do not need to be mounted further after being formed, so that the manufacturing process of the spectacles can be simplified.
  • the spectacle lens 13 also adopts an integrated design, and the spectacle lens 13 is fixed by the spectacle frame 11 and the nose pad 12 in a snap-fit manner.
  • the spectacle frame 11 and the nose pad 12 are respectively provided with a structure for clamping the spectacle lens 13.
  • the integrally designed spectacle lens 13 is directly connected to the integral molding through the corresponding clamping structure.
  • the spectacle frame 11 and the nose pad 12 are integrally formed, and the spectacle lens 13 is also integrally designed, so that the entire spectacle structure is simple and the manufacturing process of the spectacles can be simplified.
  • the spectacle lens 13 includes a top-side edge 131 and two outer edges 132 that are connected to both ends of the top-side edge 131 and are disposed away from the nose pad 12, and each of the outer edges 132 is respectively provided with a first buckle.
  • the spectacle frame 11 is provided with a first mounting groove 111 for receiving the top side edge 131 and at least a part of the outer edge 132, and a first buckling groove 112 communicating with the first mounting groove 111 and for receiving the first buckle 1321.
  • the top edge 131 is located on the upper side of the spectacle lens 13, the outer edge is located on both sides of the lens 13 near the user's ear, and the top edge 131 and the two outer edges 132 are connected to each other.
  • the first mounting groove 111 is provided on the side of the spectacle frame 11 facing the spectacle lens 13 and has a size matching the top side edge 131 and the two outer edges 132 of the corresponding spectacle lens 13 so that the spectacle lens 13 can pass the top side
  • the edge 131 and at least a part of the outer edge 132 are mounted in the first mounting groove 111 and further mounted on the eyeglass frame 11.
  • the first buckle 1321 is formed by further extending at least part of the outer edge 131 of the spectacle lens 13 to both sides away from the nose pad 12, and the first buckle groove 112 is corresponding to the first buckle in the first mounting groove 111.
  • the position of 1321 is formed to be recessed in a direction away from the lens 13.
  • the shape and size of the first buckle groove 112 are matched with the first buckle 1321, so that the spectacle lens 13 can be further mounted on the eyeglass frame 11 by snapping the first buckle 1321 into the first buckle groove 112.
  • the spectacle lens 13 can be fixed to the spectacle frame 11 more firmly.
  • the spectacle lens 13 further includes an inner edge 133 abutting the nose pad 12, and the nose pad 12 is provided with a second mounting groove 121 for receiving the inner edge 133.
  • the spectacle lens 13 includes a left spectacle lens and a right spectacle lens, and the inner edge 133 of the spectacle lens 13 is disposed at the connection point and the vicinity of the connection point between the left spectacle lens and the right spectacle lens.
  • the second mounting groove 121 is disposed opposite to the first mounting groove 111 so that opposite sides of the spectacle lens 13 are respectively received and fixed in the accommodation space formed by the spectacle frame 11 and the nose pad 12.
  • the two sides of the inner edge 133 are respectively provided with second buckle positions 1331, and the nose pad 12 is further provided with a second buckle position connected to the second mounting groove 121 and used to receive the second buckle position 1331.
  • Slot 122 is provided on the two sides of the inner edge 133.
  • the inner edge 133 includes two parts connected to each other, which are respectively disposed on a side of the left eyeglass lens facing the right eyeglass lens and a side of the right eyeglass lens facing the left eyeglass lens.
  • the nose pad 12 is also divided into two parts, which are respectively supported on the left and right nose bridges of the user when being worn by the user. Accordingly, in the present embodiment, the number of the second buckle slots 122 and the second buckle slots 1331 are also two.
  • the shape and size of the second buckle 1331 are matched with the corresponding second buckle slots 122, so that the second buckle 1331 is respectively installed in the corresponding second buckle slots 122.
  • the spectacle lens 13 is provided with an inner edge 133 near both sides of the second fastening position 1331, so that both sides of the second fastening position 1331 can be installed in the second mounting groove 121, so that the spectacle lens 13 can be It is more firmly fixed to the nose pad 12.
  • the spectacle lens 13 is mounted on the spectacle frame 11 and the nose pad 12 through the top edge 131, the outer edge 132, the inner edge 133, and the first buckle 1321 and the second buckle 1331, respectively.
  • the spectacle lens 13 is further provided with ventilation holes 134.
  • the number of the ventilation holes may be two, and the spectacle lenses 13 on the left and right sides are respectively disposed near the top edge 131.
  • the ventilation holes 134 are provided so that when the user wears the glasses, the inner and outer sides of the spectacle lens 13 can achieve air circulation, so as to reduce the phenomenon of fogging of the spectacle lens 13 caused by local overheating caused by user movement and the like.
  • FIG. 7 is an exploded view of a speaker according to some embodiments of the present application
  • FIG. 8 is a structure of a nose pad cover in an embodiment of the glasses of the present application.
  • the nose pad 12 includes a connection portion 123 connected to the eyeglass frame 11 on the user side or away from the user's side of the first mounting groove 111 in the wearing state, and the connection portion 123 is far from the eyeglass frame 11.
  • Two support portions 124 connected in an inverted Y shape to the connection portion 123 on the side, the support portion 124 is used to support the glasses on the bridge of the user's nose when worn.
  • the connecting portion 123 is integrally connected with the spectacle frame 11, and when the user wears the connecting portion 123, the connecting portion 123 is disposed on a side of the first mounting groove 111 close to the user.
  • An I-shaped hook 1241 protrudes from a side of each support portion 124 facing the user's nose bridge, and the glasses further include a nose pad cover 14 detachably sleeved on the hook 1241.
  • the nose pad cover 14 can be made of soft rubber.
  • the number of I-shaped hooks 1241 may be two, corresponding to the left and right nose bridges of the user, respectively.
  • the nose pad 14 includes two sleeve bodies 141 and a connecting portion 142 connecting the two sleeve bodies 141.
  • the connecting portion 142 is connected above the bridge of the user's nose.
  • the sleeve body 141 is correspondingly provided with an I-shaped accommodating groove 1411 matching the hook 1241, and a side of the sleeve body 141 facing the user's nose bridge may further be provided with a non-slip portion 1412 composed of a plurality of grooves.
  • the nose pad 14 is detachably provided, thereby facilitating cleaning and replacement of the nose pad 14.
  • a side of the two support portions 124 facing away from the hook 1241 is protrudingly provided with a strip-shaped rib 1242, and the strip-shaped rib 1242 cooperates with the two support portions 124 to form a second mounting groove.
  • the strip-shaped ribs 1242 are protruded along the edge of the two support portions 124 away from the spectacle lens 13, thereby forming a second mounting groove 121 that receives the inner edge 133 of the spectacle lens 13.
  • the strip-shaped convex rib 1242 is further recessed to form a second buckling slot 122.
  • the spectacle frame further includes an spectacle leg 15, a functional component 16, and a connecting wire 17.
  • the temple 15 includes a first temple 151 and a second temple 152
  • the functional component 16 includes a first functional component 161 and a second functional component 162.
  • first spectacle leg 151 and the second spectacle leg 152 are connected to the spectacle frame 11, respectively, and the first functional component 161 and the second functional component 162 are disposed on the first spectacle leg 151 and the second spectacle leg 152, respectively. At least one cavity is respectively disposed on the temple 15 for receiving the corresponding functional component 16.
  • the connecting line 17 is disposed in the first mounting groove 111 and is interposed between the bottom of the first mounting groove 111 and the top side edge 131 of the spectacle lens 13 and further extends to the first spectacle leg 151 and the second spectacle leg 152.
  • the first functional component 161 and the second functional component 162 are electrically connected.
  • the functional components 16 respectively provided on the two temples 15 need to be electrically connected through the connecting wire 17 so that the glasses can achieve a specific function.
  • the first functional component 161 is a battery component
  • the second functional component 162 is a control circuit component.
  • the control circuit component is connected to the battery component through a connection line 17 so that the battery component provides power to the control circuit component. From the control circuit components to achieve specific functions.
  • the connecting wire 17 is disposed in the first mounting groove 111 along the top side edge 131 of the spectacle lens 13 and is accommodated in the first mounting groove 111 and the top side edge 131 of the spectacle lens 13. So that the connecting wire 17 is neither exposed on the outer surface of the glasses nor takes up extra space.
  • the connecting line 17 may further extend along the outer edge 132 of the spectacle lens 13 in the first mounting groove 111.
  • the spectacle frame 11 and the first spectacle leg 151 and the second spectacle leg 152 may further be provided with a connecting cable channel, so that the connecting wire 17 can be passed through the corresponding cable channel by the first mounting groove of the glass frame 11.
  • 111 enters the first temple 151 and the second temple 152 to connect the first functional component 161 and the second functional component 162.
  • connection line 17 has a function of electrical connection. In other embodiments, the connection line 17 may also have a function of mechanical connection.
  • the first functional component 161 and the second functional component 162 are respectively disposed on the first temple 151 and the second temple 152, and the connecting wire 17 electrically connecting the first function component 161 and the second function component 162 is provided.
  • the first mounting groove 111 receiving the top side edge 131 of the spectacle lens 13 on the spectacle frame 11 so that the connection line 17 is interposed between the bottom of the first mounting groove 111 and the top side edge 131 of the spectacle lens and further extends To the first spectacle legs 151 and the second spectacle legs 152, so that the connecting wire 17 is not exposed, and there is no need to add extra space for the setting of the connecting wire 17, so that the beauty and lightness of the glasses can be maintained.
  • FIG. 9 is a schematic partial cross-sectional view of an eyeglass frame and spectacle lens in an embodiment of the glasses of the present application.
  • FIG. 10 is an enlarged view of part A in FIG. 9.
  • the connecting wire 17 includes a wire body 171 and a wire protection sleeve 172 that is disposed around the periphery of the wire body 171.
  • the cross-sectional shape of the wire protective sleeve 172 matches the cross-sectional shape of the first mounting groove 111 so that the wire protective sleeve 172 is held in the first mounting groove 111 in a surface contact manner.
  • the wire protection sleeve 172 is made of soft rubber, so that the connecting wire 17 can be bent to match the shape of the first mounting groove 111. It is easy to understand that the wire body 171 is thin, and if it is directly installed in the first mounting groove 111, the contact area with the bottom of the first mounting groove 111 is small, and it is difficult to be firmly fixed therein.
  • a wire protection sleeve 172 wrapped around the wire body 171 is further provided to protect the wire body 171 on the one hand, and to increase the connection wires 17 and 17 by adjusting the surface area of the wire protection sleeve 172 on the other hand.
  • the contact area of the first mounting groove 111 is used to securely fix the wire body 171 in the first mounting groove 111.
  • the cross-sectional shape of the first mounting groove 111 is a shape such that the wire protective sleeve 172 can be held in the first mounting groove 111 with a large-area surface contact.
  • it may be U-shaped, rectangular, or wavy, and is not specifically limited herein.
  • the shape of the side of the wire protective sleeve 172 facing the bottom of the first mounting groove 111 corresponds to the above shape, so that the wire protective sleeve 172 can be directly or indirectly attached to the bottom of the first mounting groove 111.
  • an adhesive layer 18 is provided between the line protective sleeve 172 and the spectacle frame 11, so that the line protective sleeve 172 is fixed in the first installation groove 111 through the adhesive layer 18.
  • the adhesive layer 18 may be disposed on the bottom of the first installation groove 111, or may be further extended to both sides on the side wall near the bottom of the first installation groove 111, so that the adhesive layer 18 can be wound and protected.
  • the sleeve 172 is used to more firmly fix the connecting wire 17 in the first mounting groove 111.
  • the cross-section of the first mounting groove 111 is rectangular, and the bottom of the first mounting groove 111 and the side of the line protective sleeve 172 facing the bottom of the first mounting groove 111 are both flat, and the adhesive layer 18 It is a double-sided adhesive layer disposed between the two.
  • a side of the wire protective sleeve 172 facing the top side edge 131 of the eyeglass lens 13 is provided with a protrusion 1721 corresponding to the wire body 171, and the top side edge 131 of the eyeglass lens 13 is provided for The avoidance groove 1311 receiving the protrusion 1721.
  • the cross section of the wire body 171 may be circular, and the wire protective sleeve 172 may be flush with the wire body 171 on the side of the wire body 171 facing the bottom of the first mounting groove 111, and the wire body 171 faces away from the first mounting groove 111.
  • One side of the bottom still shows the shape of the wire body 171, so that a corresponding convex portion 1721 is formed.
  • the top side edge 131 of the spectacle lens 13 needs to be further disposed in the first mounting groove 111.
  • the top side edge 131 is further provided with an escape groove 1311 for receiving the protrusion 1721, so that the The connecting wire 17 installed in a mounting groove 111 is at least partially accommodated in the avoidance groove 1311 corresponding to the top side edge 131.
  • the protruding portion 1721 is located in the middle region of the line protective sleeve 172 along the width direction of the line protective sleeve 172 to form abutting portions 1722 on both sides of the protruding portion 1721, and the two abutting portions 1722 and the avoidance groove 1311 are respectively formed.
  • the top-side edges 131 on both sides abut.
  • the width direction of the wire protective sleeve 172 refers to a direction perpendicular to the direction of the wire protective sleeve 172 along the first mounting groove 111, and is specifically a direction indicated by W in FIG. 10.
  • the depth of the first mounting groove 111 is limited. If the top edge 131 of the spectacle lens 13 is flush with the convex portion 1721 of the connecting wire 17, or the wire protective sleeve 172 and the wire body 171 face away from the first mounting groove If one side of the bottom of the 111 is arranged flush with the wire body 171, the insertion depth of the top side edge 131 of the spectacle lens 13 in the first mounting groove 111 is reduced, which is not conducive to the stable installation of the spectacle lens 13 in the spectacle frame 11.
  • the top edge 131 of the spectacle lens 13 avoids part of the connecting line 17 through the avoidance groove 1311, so that the top edge 131 can further extend toward the bottom of the first mounting groove 111 relative to the avoidance groove 1311 and Abutting with the abutting portions 1722 on both sides of the protruding portion 1721 can reduce the space occupied by the connecting wire 17 in the first mounting groove 111 to a certain extent, so that the spectacle lens 13 can be installed deeper in the first
  • the mounting groove 111 is used to improve the stability of the spectacle lens 13 in the spectacle frame 11.
  • the spectacle frame 11 is thin, and at least part of the convex portion 1721 is exposed outside the first mounting groove 111 to reduce the space of the spectacle frame occupied by the connecting wire 17, thereby reducing the first mounting groove 111. To improve the stability of the spectacle frame 11.
  • FIG. 12 is a partial structural schematic diagram of part B in FIG. 7.
  • the first buckle 1321 includes a first sub-edge 13211, a second sub-edge 13212, and a third sub-edge 13213.
  • the first sub-edge 13211 is disposed adjacent to the top-side edge 131
  • the second sub-edge 13212 is located away from the top-side edge 131 and is opposite to the first sub-edge 13211
  • the third sub-edge 13213 is disposed between the first sub-edge 13211 and the first sub-edge 13211.
  • the side of the two sub-edges 13212 that is far from the spectacle lens 13 connects the first sub-edge 13211 and the second sub-edge 13212.
  • the line protective sleeve 172 further extends into the first buckling groove 112 along the first sub-edge 13211.
  • the wire protective sleeve 172 is held in the first installation groove 111 and extended to the first buckling groove 112 to be hidden in the eyeglass frame 11, so that when the user removes and attaches the eyeglass lens 13 during use, the wire protective sleeve 172 will not be exposed after the spectacle lens 13 is removed to maintain the beauty of the glasses.
  • the line protective sleeve 172 when the line protective sleeve 172 extends toward the first buckling groove 112, it ends at a connection between the first sub-edge 13211 and the third sub-edge 13213.
  • the wire protection sleeve 172 may also continue to extend with the wire body 171 without being cut off, as long as the wire protection sleeve 172 is not exposed when the eyeglass lens 13 is removed.
  • FIG. 13 is an enlarged schematic cross-sectional view of a partial structure of an embodiment of the glasses of the present application.
  • the glasses in this embodiment further include a shaft assembly 19.
  • the number of the rotating shaft components 19 is two, which are respectively used to connect the spectacle frame 11 and the two spectacle legs 15 so that the spectacle frame 11 and the spectacle legs 15 can be relatively rotated around the rotating shaft component 19.
  • the shaft assembly 19 is provided with a shaft routing channel 1901 in the axial direction, and the connecting wire 17 is passed through the shaft routing channel 1901 and extends to the spectacle frame 11 and the spectacle leg 15 respectively.
  • one end directly extends to one spectacle leg 15 and the other end enters the spectacle frame 11 and further extends to the other spectacle leg along the first mounting groove 111. 15, and further electrically connect the two functional components 16 respectively located in the two temples 15.
  • connection wire 17 near the shaft routing channel may not include a wire protection sleeve 172.
  • the shaft routing channel 1901 may pass through the shaft assembly 19.
  • the rotation shaft assembly 19 is provided with a rotation shaft cable channel 1901 in the axial direction, and the connecting wire 17 located at the connection between the spectacle frame 11 and the temple 15 passes through the rotation shaft cable channel 1901 so that When folding occurs with the temples 15, the connecting wire 17 located in the rotating shaft routing channel 1901 will only generate a certain amount of rotation with the rotation of the rotating shaft assembly 19, so as to reduce the folding squeezing or pulling of the connecting wire 17, thereby It plays a certain role in protecting the connection line 17, improves the stability of the connection line 17, and prolongs the service life of the connection line 17.
  • the inner diameter of the rotating shaft cable channel 1901 in this embodiment is larger than the outer diameter of the connecting wire 17.
  • the inner diameter of the shaft routing channel 1901 may be twice the outer diameter of the connecting wire 17. Therefore, the restraining effect of the inner side wall of the rotating shaft cable routing channel 1901 on the connecting wire 17 can be reduced, so as to reduce the rotation range of the connecting wire 17 when the eyeglass frame 11 and the temple 15 are folded.
  • FIG. 14 is a schematic structural diagram of a hinge assembly and a connecting line in an embodiment of the glasses of the present application.
  • the rotating shaft assembly 19 includes a first rotating shaft 1902, and two ends of the first rotating shaft 1902 are respectively connected to the spectacle frame 11 and the spectacle legs 15.
  • the rotating shaft routing channel 1901 is provided along the axial direction of the first rotating shaft 1902.
  • the rotating shaft routing channel 1901 communicates with the outside through a wiring opening 19021 provided on at least one end surface of the first rotating shaft 1902, and the connecting wire 17 extends to the spectacle frame 11 or the temple 15 through the wiring opening 19021.
  • the first rotating shaft 1902 may be rotatably connected to one of the spectacle frame 11 and the spectacle leg 15 and fixedly connected to the other one, so that the spectacle frame 11 and the spectacle leg 15 are around the first rotating shaft 1902 Turns the connection.
  • the rotating shaft routing channel 1901 is disposed in the first rotating shaft 1902, and further communicates with the outside through the wiring opening 19021.
  • the rotating shaft routing channel 1901 penetrates at least one end surface of the first rotating shaft 1902 to form a routing opening 19021 of the rotating shaft routing channel 1901, so that the connecting wire 17 can pass through the rotating shaft routing channel through at least one end surface of the first rotating shaft 1902. 1901 extends out to the spectacle frame 11 or the temple 15. It is easy to understand that the periphery of the end surface of the first rotating shaft 1902 has a large movable space.
  • the connection line 17 extending from the end surface of the first rotating shaft 1902 can be accommodated in the movable space.
  • the rotation axis 1902 is rotationally connected to the corresponding spectacle frame 11 or spectacle leg 15.
  • connection line 17 near the wiring opening 19021 on the end surface follows the first rotation axis.
  • the movable space can be appropriately buffered, and the twisting can be changed into movement, thereby further reducing the twisting degree of the connecting wire 17 and improving the stability of the connecting wire 17.
  • FIG. 15 is a schematic structural diagram of a first rotating shaft in an embodiment of the glasses of the present application.
  • the cable routing port 19021 includes a first cable routing port 190211 and a second cable routing port 190212, and is respectively disposed on both ends of the first rotation shaft 1902.
  • the rotation axis routing channel 1901 passes through the two cable routing ports 19021 and 1921, respectively.
  • the connecting wire 17 penetrates both end surfaces of the first rotating shaft 1902 and extends to the spectacle frame 11 and the spectacle leg 15 through the first and second wiring openings 190211 and 190212, respectively.
  • connection line 17 at the connection between the spectacle frame 11 and the spectacle leg 15 is disposed in the rotation axis routing channel 1901 in the first rotation axis 1902, and passes through both end surfaces of the first rotation axis 1902, respectively. Extending from the shaft routing channel 1901. At this time, since there is a large space for movement on the periphery of both end surfaces of the first rotation shaft 1902, the connecting wire 17 extending from the both end surfaces of the first rotation shaft 1902 only occurs when the relative rotation occurs between the eyeglass frame 11 and the temple 15 There is no movement or small twist without deformation.
  • the wiring port 19021 includes a first wiring port 190213 and a second wiring port 190214.
  • the first wiring opening 190213 is provided on the end surface of the first rotating shaft 1902
  • the second wiring opening 190214 is provided on the side wall of the first rotating shaft 1902, so that one end of the rotating shaft routing channel 1901 passes through the first walking along the axial direction.
  • the cable opening 190213 penetrates the end surface of the first rotating shaft 1902, and the other end penetrates the side wall of the first rotating shaft 1902 through the second wiring opening 190214, and further communicates with the outside.
  • the connecting line 17 passes through the first wiring opening 190213 and the second wiring opening.
  • 190214 extends to the spectacle frame 11 and the spectacle legs 15 respectively.
  • the first rotating shaft 1902 is fixedly connected to one of the spectacle frame 11 and the spectacle leg 15 provided near the second cable opening 190214, and is connected to the spectacle frame 11 and the spectacle leg 15 near the first cable opening 19213.
  • the first rotating shaft 1902 is rotatably connected to one of the spectacle frame 11 or the temple 15 at a wire opening 19021 provided on the end surface, and the first rotating shaft 1902 is connected to the glasses at a wire opening 19021 provided on the side wall.
  • the other of the frame 11 or the temple 15 is fixedly connected.
  • the first rotating shaft 1902 is near the spectacle frame 11 at the first cable opening 190213 and is rotatably connected to the spectacle frame 11.
  • the first rotating shaft 1902 is near the spectacle leg 15 at the second cable opening 190214 and is The temples 15 are fixedly connected.
  • the first rotating shaft 1902 is rotationally connected to the spectacle frame 11, a relative rotation between the spectacle frame 11 and the spectacle legs 15 will drive the connection line 17 to occur at the first routing port 190213. Relative movement, but since the first cable opening 190213 is provided on the end surface of the first rotating shaft 1902, similar to the above embodiment, the end surface of the first rotating shaft 1902 has a large space for movement.
  • the connecting wire 17 near the wire opening 19021 on the end surface is twisted to a certain degree with the rotation of the first rotation shaft 1902, and the buffer can be appropriately buffered through the movable space, and
  • the twist is a movement or a small twist, without squeezing or pulling the connecting line, so as to improve the stability of the connecting line and extend the service life of the connecting line.
  • the first rotating shaft 1902 is fixedly connected to the temple 15 at the second cable opening 190214. It is easy to understand that when the relative rotation occurs between the spectacle frame 11 and the temple 15, the temple 11 and the first rotating shaft 1902 Synchronization is maintained. Therefore, the connecting wire 17 in the shaft cable routing channel 1901 extending into the temple 11 through the second wire opening 190214 will not be twisted, squeezed or pulled. Therefore, at this time, whether the second wiring port 190214 is provided on the end surface of the first rotating shaft 1902 or the side wall of the first rotating shaft 1902, the relative rotation between the spectacle frame 11 and the spectacle legs 15 will not affect this.
  • the connecting wire 17 at the place causes the above-mentioned twisting, squeezing, pulling, and the like.
  • first rotation shaft 1902 and the temple 15 are rotationally connected at the second wiring opening 190214, when the relative rotation occurs between them and the connection line 17 is moved, the second wiring will be subjected to the second wiring.
  • the side wall of the first rotation shaft 1902 is restrained at the mouth 190214, so that the connecting wire 17 is squeezed between the side wall of the first rotation shaft 1902 and the temple 15.
  • first rotation shaft 1902 is close to the temple 15 at the first cable opening 190213 and is rotationally connected to the temple 15, the first rotation shaft 1902 is close to the glasses frame 11 at the second cable opening 190214 and fixedly connected to the glasses frame 11.
  • the connecting line 17 in the shaft cable routing channel 1901 and near the first cable port 190213 and the second cable port 190214 is still only slightly changed. Twist or move.
  • the rotating shaft assembly 19 further includes a second rotating shaft 1903 which is coaxial with and spaced from the first rotating shaft 1902.
  • the second rotating shaft 1903 is disposed on a side of the first rotating shaft 1902 near the first wiring opening 190213.
  • the second rotating shaft 1903 may also be disposed on a side of the first rotating shaft 1902 near the second wiring opening 190214.
  • the eyeglass frame 11 includes first lugs 113.
  • the number of the first lugs 113 is two, which are respectively disposed at two ends of the eyeglass frame 11 connecting the two eyeglass legs 15 and respectively protrude toward each other.
  • the temple 15 includes a second lug 1501 and a third lug 1502 disposed at intervals.
  • the second lugs 1501 and the third lugs 1502 face the ends of the spectacle frame 11 to which the spectacle legs 15 are located.
  • the second lugs 1501 and the third lugs 1502 are connected to a side far from the user's head, thereby making the glasses more overall and more beautiful in appearance.
  • the second lugs 1501 and the third lugs 1502 that are spaced apart are formed by providing a groove in the middle of the end of the spectacle leg 15 facing the spectacle frame 11.
  • first rotating shaft 1902 and the second rotating shaft 1903 that are close to each other are connected to the first lug 113, and the ends of the first rotating shaft 1902 and the second rotating shaft 1903 that are away from each other are respectively the second lugs 1501 and the third The lugs 1502 are connected to hold the first lug 113 between the second lug 1501 and the third lug 1502.
  • the first wiring opening 190213 is disposed on an end surface of the first rotation shaft 1902 near the second rotation shaft 1903, and the second wiring opening 190214 is disposed on the first rotation shaft 1902 near the second protrusion.
  • the first rotating shaft 1902 is rotatably connected with the first lug 113, and is fixedly connected with the second lug 1501.
  • one end of the connecting wire 17 in the rotating shaft routing channel 1901 is extended from the first wiring opening 190213 and the interval between the first rotating shaft 1902 and the second rotating shaft 1903.
  • the first lug 113 is provided with a wiring channel communicating with the first wiring port 190213, so that the connecting wire 17 further enters the eyeglass frame 11 through the first lug 113.
  • the other end of the connecting wire 17 in the shaft routing channel 1901 extends from the second wiring port 190214.
  • the third lug 1502 is provided with a wiring channel communicating with the second wiring port 190214, so that the connecting wire 17 can further enter the temple 15 through the wiring channel of the third lug 1502. .
  • the second wiring opening 190214 may be a through hole that is disposed on a side wall of the first rotating shaft 1902 and does not penetrate the end of the first rotating shaft 1902 and communicates with the rotating shaft routing channel 1901. In this embodiment, the second wiring opening 190214 further penetrates along the side wall of the first rotating shaft 1902 to an end of the first rotating shaft 1902 far from the first wiring opening 190213. It is easy to understand that the second wiring port 190214 in this embodiment has a larger space, so that when the connection line 17 moves due to some reasons, the restriction on the connection line 17 can be further reduced, further Damage caused by blocking of the side wall of the first rotating shaft 1902 is reduced.
  • FIG. 17 is a schematic structural diagram of an eyeglass frame and a spectacle lens in an embodiment of the glasses of the present application
  • FIG. 18 is a partial structural diagram of an eyeglasses leg in an embodiment of the glasses of the present application.
  • the first and second lugs 113 and 1501 are coaxially provided with a first receiving hole 1131 and a second receiving hole 15011, respectively.
  • the first receiving hole 1131 and the second receiving hole 15011 are disposed coaxially.
  • the size is set to allow the first rotation shaft 1902 to be inserted into the first accommodation hole 1131 from the outside of the temple 15 through the second accommodation hole 15011, and to make the first rotation shaft 1902 and the second accommodation hole 15011 interference fit and the first accommodation shaft A receiving hole 1131 is fitted with clearance.
  • the second accommodating hole 15011 is a through hole penetrating through the second lug 1501
  • the first accommodating hole 1131 corresponds to the second accommodating hole 15011 and penetrates at least part of the first lug 113.
  • the inner diameter of the first receiving hole 1131 is larger than the second receiving hole 15011, and the outer diameter of the first rotating shaft is between the first receiving hole 1131 and the second receiving hole 15011, so that the first rotating shaft 1902 and
  • the spectacle legs 15 are fixedly connected, and are rotatably connected to the spectacle frames 11, so that the spectacle frames 11 and the spectacle legs 15 can be rotated around the first rotation axis 1902 to be folded or opened.
  • the first and second lugs 113 and 1502 are coaxially provided with a third receiving hole 1132 and a fourth receiving hole 15021, respectively, wherein the third receiving hole 1132 and the fourth receiving hole 1502 are coaxially provided.
  • the size of the receiving hole 15021 is set to allow the second rotating shaft 1903 to be inserted into the third receiving hole 1132 from the outside of the temple 15 through the fourth receiving hole 15021, and the second rotating shaft 1903 and the third receiving hole 1132 are in interference.
  • the second rotation shaft 1903 and the third accommodation hole 1132 are clearance-fitted and fit into the fourth accommodation hole 15021 in an interference fit with the fourth accommodation hole 15021.
  • the third receiving hole 1132 and the fourth receiving hole 15021 are both coaxially disposed with the first receiving hole 1131 and the second receiving hole 15011.
  • the third receiving hole 1132 penetrates at least part of the first lug 113.
  • the first receiving hole 1131 and the third receiving hole 1132 are coaxially and penetrated.
  • the first lug 113 of the spectacle frame 11 is provided with a wiring channel communicating with the first wiring opening 190213, and the first receiving hole 1131 and the third receiving hole 1132 are respectively provided.
  • the two sides of the wiring channel located in the first lug 113 penetrate through the wiring channel.
  • the fourth accommodating hole 15021 is provided through the third lug 1502.
  • the outer diameter of the second rotating shaft 1903 is between the inner diameter of the third receiving hole 1132 and the fourth receiving hole 15021, and the inner diameter of the third receiving hole 1132 is larger than the fourth receiving hole 15021.
  • the four receiving holes 15021 have an inner diameter larger than the third receiving hole 1132, so that the second rotating shaft 1903 is fixedly connected to the spectacle leg 15 and is rotatably connected to the spectacle frame 11 or the second rotating shaft 1903 is fixedly connected to the spectacle frame 11 and
  • the spectacle legs 15 are rotationally connected, so that the spectacle frames 11 and the spectacle legs 15 can be rotated around the first rotation axis 1902 to be folded or opened.
  • the second rotating shaft 1903 may be a solid shaft, and its diameter is smaller than the diameter of the first rotating shaft 1902. In the wearing state, the second rotating shaft 1903 is located on the upper side of the temple 15, and the first rotating shaft 1902 is located on the lower side of the temple 15.
  • the rotating shaft routing channel 1901 is disposed inside the first rotating shaft 1902, the outer diameter of the first rotating shaft 1902 is large, which is not conducive to satisfying the aesthetic needs of users. Therefore, in this embodiment, a second rotating shaft 1903 with a smaller outer diameter is further provided, so that when the user wears glasses, the second rotating shaft 1903 is provided on the upper part which is easy to be found, and the first rotating shaft 1902 is provided on the part which is not easily accessible.
  • the first rotating shaft 1902 and the second rotating shaft 1903 may be other cases.
  • the second rotating shaft 1903 may also be a hollow shaft, and the diameter of the second rotating shaft 1903 may be larger than that of the first rotating shaft 1902. The diameter, or, in the worn state, the second rotating shaft 1903 is located on the lower side of the temple 15, the first rotating shaft 1902 is located on the upper side of the temple 15, and the like, which are not limited herein.
  • connection between the end surface 19022 of the first rotation shaft 1902 for setting the first wire opening 190213 and the inner wall surface 19903 of the first rotation shaft 1902 for defining the shaft routing channel 1901 is arc-shaped. . It is easy to understand that when the rotation between the spectacle frame 11 and the spectacle leg 15 is performed by the rotating shaft assembly 190, the first connecting shaft 1902 and the spectacle frame 11 are rotationally connected, which will drive the connecting line at the first wiring port 190213. 17 movement.
  • connection between the above-mentioned end surface 19022 of the first rotation shaft 1902 and the inner wall surface 19223 is designed in an arc shape, which can prevent the connection line 17 at the first wiring opening 190213 from moving and connecting with the first rotation shaft 1902. When the contact is too sharp, the connection wire 17 is cut during contact, thereby further protecting the connection wire 17.
  • connection between the end face of the first rotation shaft 1902 for setting the second wiring opening 190214 and the inner wall surface of the first rotation shaft 1902 for defining the rotation shaft routing channel 1901 is also curved.
  • the ground can also further protect the connection line 17 in this way.
  • the speaker component of the glasses may include an earphone core 102 and a movement case 108.
  • the speaker component may be a separate, directly-usable headset, or may be plugged in
  • the bone conduction earphone in this embodiment is one of the speaker components in the foregoing glasses embodiment.
  • audio headphone cores will be further described below based on bone conduction headphones. What needs to be known is that the content described below can also be applied to the air-conducted speaker component without violating the principle.
  • FIG. 19 is a schematic structural diagram of an embodiment of an earphone of the present application
  • FIG. 20 is an exploded structural view of an embodiment of an earphone of the present application
  • FIG. 30 is a cross-sectional view taken along a symmetry plane of the earphone of FIG. 19.
  • the speaker module includes a headphone housing 212, a transducing device 213, a vibration transmitting plate 214, and a vibration transmitting layer 215.
  • the movement case 212 and the vibration transmission layer 215 correspond to the vibration transmission layer 2320 in FIG. 25 of the present application.
  • the transducing device 213 may include a vibration component and a magnetic circuit component.
  • the earphone housing 212 is used to define a earphone accommodating cavity 2122 having an opening 2121, and can be used to receive related functional structures of the earphone.
  • the transducing device 213 can be accommodated in the earphone accommodating cavity 2122.
  • the transducing device 213 is configured to generate vibration according to an audio signal.
  • the audio signal may be an audio signal directly stored in the transducing device 213, or an audio signal input to the transducing device 213 through a signal line or the like by a storage device or a communication circuit, etc., which is not limited herein.
  • the vibration transmitting plate 214 is connected to the energy conversion device 213 and is exposed through the opening 2121 of the receiving cavity 2122 to transmit vibration.
  • the transducing device 213 can convert the audio signal into a corresponding vibration signal, and further transmit the vibration signal through the vibration transmitting plate 214 to transmit the vibration signal to the earphone shell from the accommodation cavity 2122 of the earphone housing 212 Other than the body 212 to further transmit the vibration signal to a user directly or indirectly in contact with the vibration transmitting plate 214.
  • the vibration transmission layer 215 is coated on the outer surface of the vibration transmission plate 214, so that the vibration signal generated by the energy conversion device 213 can be transmitted to the transmission layer of the vibration transmission plate 214 through the vibration transmission plate 214, and further through the transmission layer with the user.
  • the vibration signal is transmitted to the user by contacting the specific part.
  • the vibration transmitting layer 215 is further connected to the earphone housing 212 to cover the opening 2121 of the accommodation cavity 2122, thereby further protecting the devices in the accommodation cavity 2122 of the earphone housing 212.
  • the vibration transmitting layer 215 can be connected to the earphone housing 212 by means of plugging, buckling, and bonding.
  • the vibration transmitting layer 215 can be fastened to the periphery of the earphone housing 212 by means of buckling.
  • the vibration transmitting plate 214 is a hard material, such as hard plastic, to better transmit vibration signals
  • the vibration transmitting layer 215 is a soft material, such as soft silicone. It is covered on the outer surface of the vibration transmitting plate 214, so that the bone conduction earphone further transmits the vibration signal to the user through the vibration transmission layer 215, so that the user has a better touch when using the bone conduction earphone.
  • the vibration transmission layer 215 in this embodiment is coated on the outer surface of the vibration transmission plate 214 by an integral injection molding method, so that the vibration transmission layer 215 and the vibration transmission plate 214 are an integrated structure, and then the headset is processed. During assembly, there is no need to further glue the vibration transmitting layer 215 and the vibration transmitting plate 214 together by means of dispensing, etc., thereby simplifying the assembly steps of the earphone.
  • the vibration transmission plate 214 and the vibration transmission layer 215 are an integrated structure, which can avoid the adverse effect on the vibration transmission effect caused by the uneven thickness of the adhesive layer between the vibration transmission plate 214 and the vibration transmission layer 215 caused by the dispensing.
  • the conduction effect of vibration is improved, and the sound transmission quality of the bone conduction earphone is improved.
  • the vibration transmitting plate 214 is protruded from the opening 2121 to transmit the vibration signal generated by the transducer 213 located in the receiving cavity 2122 of the earphone housing 212 to the outside of the receiving cavity 2122. It is then transmitted to the user through the vibration transmission layer 215.
  • the vibration transmission layer 215 and the outer surface of the vibration transmission plate 214 are fully attached to each other through the exposed portion of the opening 2121 and are integrally injection-molded. Specifically, in an application scenario, an exposed portion of the outer surface of the vibration transmitting plate 214 through the opening 2121 is an arc surface protruding away from the receiving cavity 2122. Correspondingly, the vibration transmitting layer 215 communicates with the vibration transmitting plate through the arc surface. 214 full paste and integrated injection molding. It should be pointed out that if the vibration transmission plate 214 and the vibration transmission layer 215 are fully bonded by using the method of dispensing, first, as described above, it is difficult to control the adhesive formed due to the influence of air and dispensing technology.
  • the uniformity of the layer reduces the vibration transmission effect; secondly, if the full bonding is performed by the dispensing method, because the full dispensing is easy to overflow, the uniformity of the adhesive layer is further reduced on the one hand, and the other On the one hand, it also brings inconvenience to the assembly of the headset.
  • the vibration transmission plate 214 and the vibration transmission layer 215 are fully bonded to each other by integral injection molding, so that the adverse effects caused by the full bonding achieved by the above-mentioned dispensing can be avoided, and on the one hand, Increase the area where the vibration transmission layer 215 is attached to the vibration transmission plate 214 to improve the transmission of vibration.
  • the arc surface can also increase the contact area between the vibration transmission layer 215 and the user's skin, thereby further increasing the vibration. Delivery effect.
  • the exposed portion of the outer surface of the vibration transmitting plate 214 through the opening 2121 may be a flat surface in the middle portion and a curved surface in the peripheral portion.
  • the vibration transmitting plate 214 is spaced from the earphone housing 212 at the opening 2121 so as to form an annular space around the vibration transmitting plate 214, and the vibration transmitting layer 215 is provided in a corresponding area of the annular space.
  • Through hole 2151 the vibration transmitting plate 214 is spaced from the earphone housing 212 at the opening 2121 so as to form an annular space around the vibration transmitting plate 214, and the vibration transmitting layer 215 is provided in a corresponding area of the annular space.
  • the vibration transmitting plate 214 is not connected to the earphone housing 212. Specifically, both the inner side of the earphone housing 212 and the outer side of the vibration transmitting plate 214 at the opening 2121 are circular or quasi-circular. As a result, the earphone housing 212 and the vibration transmitting plate 214 together form an annular space.
  • the vibration transmitting layer 215 is disposed on the outer surface of the vibration transmitting plate 214 and is connected to the earphone housing 212 to cover the opening 2121 of the receiving cavity 2122. Therefore, the direction of the annular space away from the receiving cavity 2122 is covered by The vibration transmission layer 215.
  • a through hole 2151 is further provided in an area of the vibration transmission layer 215 corresponding to the annular spacer.
  • the shape of the through hole 2151 may be a circle, an oval, or the like, and the number may be one or more.
  • No restrictions. When a plurality of through holes 2151 are provided, they can be arranged at intervals around the vibration transmitting plate 214.
  • the arrangement of the through hole 2151 can communicate the accommodation cavity 2122 with the outside of the earphone housing 212, thereby further reducing sound leakage through vibration cancellation, thereby further improving the sound conduction effect of the bone conduction earphone. .
  • each component part of the speaker unit itself includes a component that generates vibration (such as, but not limited to, a transducer inside the headphone core 102), a fixed component of the speaker (such as, but not limited to, an eyeglass frame), and a component that transmits vibration. (Such as, but not limited to, a panel inside the headphone core 102, a vibration transmission layer, etc.).
  • the vibration transmission relationship between the components and the vibration transmission relationship between the speaker and the outside world are determined by the contact mode (such as, but not limited to, clamping force, contact area, and contact shape) between the speaker and the user.
  • FIG. 21 is an equivalent model of a speaker vibration generation and transmission system according to some embodiments of the present application.
  • the speaker in this embodiment includes a fixed end 1101, a sensing terminal 1102, a vibration unit 1103, and energy conversion. Device 1104.
  • the fixed end 1101 is connected to the vibration unit 1103 through a transmission relationship K1 (k 4 in FIG. 21), and the sensing terminal 1102 is connected to the vibration unit 1103 through a transmission relationship K2 (R 3 , k 3 in FIG. 21).
  • the transfer relationship K3 (R 4 , k 5 in FIG. 21) is connected to the transducing device 1104.
  • the vibration unit referred to here is a vibrating body composed of a panel and a transducing device, and the transmission relationships K1, K2, and K3 are descriptions of the functional relationships between corresponding parts in the speaker equivalent system (which will be described in detail below).
  • the vibration equation of an equivalent system can be expressed as:
  • m 3 is the equivalent mass of the vibration unit 1103
  • m 4 is the equivalent mass of the transducer 1104
  • x 3 is the equivalent displacement of the vibration unit 1103
  • x 4 is the equivalent displacement of the transducer 1104
  • k 3 Is the equivalent elastic coefficient between the sensing terminal 1102 and the vibration unit 1103
  • k 4 is the equivalent elastic coefficient between the fixed end 1101 and the vibration unit 1103
  • k 5 is the equivalent between the transducer 1104 and the vibration unit 1103
  • Effective elastic coefficient R 3 is the equivalent damping between the sensing terminal 1102 and the vibration unit 1103
  • R 4 is the equivalent damping between the transducer 1104 and the vibration unit 1103
  • f 3 and f 4 are the vibration unit 1103, respectively Interaction force with the transducing device 1104.
  • the equivalent amplitude A 3 of the vibration unit in the system is:
  • f 0 represents a unit driving force
  • ⁇ represents a vibration frequency
  • the factors affecting the frequency response of the bone conduction speaker include the part that generates the vibration (such as, but not limited to, the vibration unit, the transducing device, the housing, and the interconnection method, such as m 3 , m 4 , and k 5 in formula (3), R 4 etc.), vibration transmission part (such as, but not limited to, the manner of contact with the skin, the properties of the spectacle frame, such as k 3 , k 4 , R 3, etc. in formula (3)).
  • the fixed end 1101 may be a point or a region where the bone conduction speaker is relatively fixed during vibration, and these points or areas may be regarded as a fixed end of the bone conduction speaker during vibration.
  • the fixed end may be composed of specific components or a position determined according to the overall structure of the bone conduction speaker.
  • the bone conduction speaker can be hung, bonded, or adsorbed near the human ear by a specific device, or the structure and shape of the bone conduction speaker can be designed so that the bone conduction site can be attached to the human skin.
  • the sensing terminal 1102 is a hearing system for the human body to receive sound signals.
  • the vibration unit 1103 is a part of a bone conduction speaker for protecting, supporting, and connecting a transducing device, and includes a vibration transmission layer or panel that transmits vibration to a user. The parts directly or indirectly contacted by the user, and the housing that protects and supports other vibration-generating components.
  • the transducing device 1104 is a sound vibration generating device, and may be one or a combination of the transducing devices discussed above.
  • the transmission relationship K1 is connected to the fixed end 1101 and the vibration unit 1103, and indicates the vibration transmission relationship between the vibration generating part and the fixed end of the bone conduction speaker during operation.
  • K1 depends on the shape and structure of the bone conduction device.
  • bone conduction speakers can be fixed to the human head in the form of U-shaped headphone holders / headphone straps, and can also be installed on helmets, fire masks or other special-purpose masks, glasses and other equipment.
  • the shape of different bone conduction speakers Both the structure and the structure will affect the vibration transmission relationship K1.
  • the speaker structure also includes physical properties such as the composition material and quality of different parts of the bone conduction speaker.
  • the transmission relationship K2 connects the sensing terminal 402 and the vibration unit 1103.
  • K2 depends on the composition of the transmission system including, but not limited to, transmitting sound vibrations to the hearing system through user tissues. For example, when sound is transmitted to the hearing system through the skin, subcutaneous tissue, bones, etc., the physical properties of different human tissues and their interconnections will affect K2. Further, the vibration unit 1103 is in contact with human tissue. In different embodiments, the contact surface on the vibration unit may be a vibration transmission layer or a side of the panel. The surface shape, size, and interaction between the contact surface and the human tissue Force and so on will affect the transmission coefficient K2.
  • the transmission relationship K3 between the vibration unit 1103 and the transducing device 1104 is determined by the internal connection properties of the bone conduction speaker vibration generating device.
  • the transducing device and the vibrating unit are connected in a rigid or elastic manner, or the connection between the transducing device and the vibrating unit is changed The relative position between them will change the transmission efficiency of the transducing device to the vibration unit, especially the transmission efficiency of the panel, thereby affecting the transmission relationship K3.
  • K1, K2, and K3 are only a representation of the connection modes of different device parts or systems involved in the vibration transmission process, and can include, but are not limited to, physical connection methods, force transmission methods, and sound transmission efficiency. Wait.
  • K1, K2, and K3 described above may be a simple vibration or mechanical transmission mode, or may include a complex non-linear transmission system.
  • the transmission relationship may be formed by directly connecting the various parts, or it may be performed in a non-contact manner. transfer.
  • FIG. 22 is a structural diagram of a speaker composite vibration device according to an embodiment of the present application.
  • a composite vibration device is provided on the glasses.
  • the composite vibration device in FIG. 22 may be a vibration portion that provides sound inside the headphone core.
  • the composite vibration device in the embodiment of the present application is equivalent to the specific embodiment of the transmission relationship K3 between the vibration unit 1103 and the transducing device 1104 in FIG. 21.
  • An embodiment of a composite vibration device for a speaker is shown in FIG. 22 and FIG. 23.
  • a vibration transmitting plate 1801 and a vibration plate 1802 constitute a composite vibration device.
  • the vibration transmitting plate 1801 is provided as a first annular body 1813, Three first poles 1814 which are radiated toward the center are arranged in a ring body, and the position of the radiated center is fixed to the center of the vibration plate 1802.
  • the center of the vibration plate 1802 is a groove 1820 matching the center of the spoke and the first support rod.
  • the vibration plate 1802 is provided with a second annular body 1821 having a radius different from that of the vibration transmitting plate 1801, and three second struts 1822 different in thickness from the first strut 1814.
  • the first rod 1814 and the second rod 1822 are staggered, and may be, but not limited to, an angle of 60 degrees.
  • Both the first and second poles can be straight rods or other shapes that meet specific requirements.
  • the number of poles can be set to two or more, and symmetrical or asymmetrical arrangements are used to meet economic and practical effects.
  • the vibration transmitting plate 1801 has a thin thickness and can increase elastic force.
  • the vibration transmitting plate 1801 is clamped in the center of the groove 1820 of the vibration plate 1802.
  • a voice coil 1808 (that is, a coil 422 in FIG. 5) is attached to the lower side of the second annular body 1821 of the vibration plate 1802.
  • the composite vibration device further includes a bottom plate 1812 on which an annular magnet 1810 is disposed, and an inner magnet 1811 is concentrically disposed in the annular magnet 1810.
  • An inner magnetic plate 1809 is provided on the top surface of the inner magnet 1811, and a ring magnetic plate 1807 is provided on the ring magnet 1810.
  • a washer 1806 is fixedly disposed above the ring magnetic plate 1807.
  • the first annular body 1813 of the vibration transmitting plate 1801 is fixedly connected to the washer 1806.
  • the entire composite vibration device is connected to the outside through a panel 1830.
  • the panel 1830 is fixedly connected to the center of the spoke of the vibration transmitting plate 1801, and is fixed to the center of the vibration transmitting plate 1801 and the vibration plate 1802.
  • the resonance peaks can be caused to appear at different positions, for example, the low-frequency resonance peaks can appear at a lower-frequency moving position, and / or the high-frequency resonance peaks can appear at more High frequency location.
  • the stiffness coefficient of the vibration plate is greater than the stiffness coefficient of the vibration transmitting plate, the vibration plate generates a high frequency resonance peak among the two resonance peaks, and the vibration transmission plate generates a low frequency resonance peak among the two resonance peaks.
  • the range of these resonance peaks may be set within or outside the frequency range of sounds audible by the human ear.
  • neither of the resonance peaks is within the frequency range of sounds audible by the human ear; more preferably , One resonance peak is within the frequency range of the sound audible by the human ear, and the other resonance peak is outside the frequency range of the sound audible by the human ear; more preferably, both resonance peaks are audible by the human ear To the frequency range of the sound.
  • the description of the composite vibration device composed of a vibration plate and a transmission plate appeared in a patent application named "a bone conduction speaker and its composite vibration device" disclosed in Chinese Patent Application No. 201110438083.9 filed on December 23, 2011. This patent document is hereby incorporated by reference in its entirety.
  • FIG. 25 is a structural diagram of a composite vibration device of a speaker provided by some embodiments of the present application.
  • the headphone core may include the composite vibration device.
  • the composite vibration device of the speaker includes a vibration plate 2002, a first vibration transmitting plate 2003, and a second vibration transmitting plate 2001.
  • the first vibration transmitting plate 2003 fixes the vibration plate 2002 and the second vibration transmitting plate 2001 on the movement case 2219.
  • the composite vibration device composed of the vibration plate 2002, the first vibration transmitting plate 2003 and the second vibration transmitting plate 2001 can Generate no less than two resonance peaks, produce a flatter frequency response curve in the audible range of the hearing system, thereby improving the sound quality of the speaker.
  • the number of resonance peaks generated in the triple compound vibration system of the first vibration transmitting plate is greater than that of the composite vibration system without the first vibration transmitting plate.
  • the triple compound vibration system can generate at least three resonance peaks; more preferably, at least one resonance peak is not within the range audible to the human ear; more preferably, all resonance peaks are audible to the human ear Within range.
  • the frequency response shown in FIG. 26 can be obtained, and three distinct resonance peaks can be generated.
  • the sensitivity of the speaker's frequency response in the low frequency range (about 600 Hz) is greatly improved, and the sound quality is improved.
  • the resonance peak can be moved, and finally a more ideal frequency response can be obtained.
  • the first vibration transmitting sheet is an elastic sheet.
  • the elasticity is determined by various aspects such as the material, thickness, and structure of the first vibration transmitting plate.
  • the material of the first vibration transmitting plate such as, but not limited to, steel (such as, but not limited to, stainless steel, carbon steel, etc.), light alloy (such as, but not limited to, aluminum alloy, beryllium copper, magnesium alloy, titanium alloy, etc.), plastic (Such as, but not limited to, high-molecular polyethylene, blown nylon, engineering plastics, etc.), or other single or composite materials that can achieve the same performance.
  • the thickness of the first vibration transmitting plate is not less than 0.005mm, preferably, the thickness is 0.005mm-3mm, more preferably, the thickness is 0.01mm-2mm, even more preferably, the thickness is 0.01mm-1mm, and even more preferably, the thickness is It is 0.02mm-0.5mm.
  • the structure of the first vibration transmitting plate may be set in a ring shape, preferably, it includes at least one ring, preferably, it includes at least two rings, which may be concentric rings or non-concentric rings. At least two struts are connected, and the struts radiate from the outer ring to the center of the inner ring, further preferably including at least one elliptical ring, further preferably including at least two elliptical rings, and different elliptical rings have different curvatures Radius, the rings are connected by a support rod, and further preferably, the first vibration transmitting plate includes at least one square ring.
  • the structure of the first vibration transmitting sheet may also be set in a sheet shape.
  • a hollow pattern is provided on the top, and the area of the hollow pattern is not smaller than the area without the hollow.
  • materials, thicknesses, and structures can be combined into different vibration-transmitting sheets.
  • the ring-shaped vibration transmitting plate has different thickness distributions.
  • the thickness of the support rod is equal to the thickness of the ring. Further preferably, the thickness of the support rod is greater than the thickness of the ring. More preferably, the thickness of the inner ring is greater than the thickness of the outer ring. .
  • FIG. 27 is a vibration generating portion of a speaker according to some embodiments of the application. Structure diagram.
  • the energy conversion device includes a magnetic circuit system composed of a magnetically permeable plate 2710, a magnet 2711, and a magnetically permeable plate 2712, a vibration plate 2714, a coil 2715, a first vibration transmitting plate 2716, and a second vibration transmitting plate 2717.
  • the panel 2713 protrudes from the movement case 2719 and is bonded to the vibration piece 2714 by glue.
  • the first vibration transmission piece 2716 connects and fixes the transducer to the movement case 2719 to form a suspension structure.
  • the triple vibration system composed of the vibration plate 2714, the first vibration transmitting plate 2716 and the second vibration transmitting plate 2717 can generate a flatter frequency response curve, thereby improving the sound quality of the speaker.
  • the first vibration transmitting piece 2716 elastically connects the transducing device to the movement case 2719, which can reduce the vibration transmitted from the transducing device to the casing, thereby effectively reducing the sound leakage caused by the casing vibration, and also reducing the casing's The effect of vibration on speaker sound quality.
  • Figure 28 shows the response curves of the vibration intensity of the casing and the vibration intensity of the panel with frequency.
  • the thick line shows the frequency response of the vibration generating portion after the first vibration transmitting plate 2716 is used
  • the thin line shows the frequency response of the vibration generating portion after the first vibration transmitting plate 2716 is not used. It can be seen that in the frequency range above 500 Hz, the vibration of the speaker housing without the first vibration transmitting plate 2716 is significantly greater than that of the speaker housing with the first vibration transmitting plate 2716.
  • FIG. 29 shows a comparison of the sound leakage in the case where the first vibration transmitting plate 2716 is included and the case where the first vibration transmitting plate 2716 is not included.
  • the leakage sound of the device containing the first vibration transmitting plate 2716 in the range of the intermediate frequency is smaller than that of the device without the first vibration transmitting plate 2716 in the corresponding frequency range. It can be seen that after the first vibration transmitting plate is used between the panel and the casing, the vibration of the casing can be effectively reduced, thereby reducing the sound leakage.
  • the first vibration transmitting plate may include, but is not limited to, stainless steel, beryllium copper, plastic, and polycarbonate materials, and the thickness is in the range of 0.01 mm-1 mm.
  • FIG. 30 is a schematic longitudinal sectional view of a speaker assembly according to some embodiments of the present application.
  • the speaker assembly 300 may include a first magnetic element 302, a first magnetically permeable element 304, a second magnetically permeable element 306, a first vibration plate 308, a voice coil 310, a second vibration plate 312, and a vibration panel 314.
  • the speaker module 300 corresponds to the magnetic circuit module 210 in FIG. 19. .
  • the magnetic circuit assembly may include a first magnetic element 302, a first magnetically permeable element 304, and a second magnetically permeable element 306.
  • the magnetic circuit component can generate a first full magnetic field (also referred to as "total magnetic field of the magnetic circuit component" or "first magnetic field").
  • the magnetic element described in this application refers to an element that can generate a magnetic field, such as a magnet.
  • the magnetic element may have a magnetization direction, and the magnetization direction refers to a direction of a magnetic field inside the magnetic element.
  • the first magnetic element 302 may include one or more magnets, and the first magnetic element may generate a second magnetic field.
  • the magnet may include a metal alloy magnet, ferrite, or the like.
  • the metal alloy magnet may include neodymium iron boron, samarium cobalt, aluminum nickel cobalt, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or a combination thereof.
  • the ferrite may include barium ferrite, ferrite, ferromanganese ferrite, lithium manganese ferrite, or the like, or a combination thereof.
  • the lower surface of the first magnetically conductive element 304 may be connected to the upper surface of the first magnetic element 302.
  • the second magnetically conductive element 306 can be connected to the first magnetic element 302.
  • the permeable magnet mentioned here can also be called a magnetic field concentrator or an iron core.
  • the magnetizer can adjust the distribution of a magnetic field (for example, a second magnetic field generated by the first magnetic element 302).
  • the magnetizer may include an element processed from a soft magnetic material.
  • the connection manner between the first magnetically permeable element 304, the second magnetically permeable element 306, and the first magnetic element 302 may include one or more combinations such as bonding, snapping, welding, riveting, and bolting.
  • the first magnetic element 302, the first magnetically permeable element 304, and the second magnetically permeable element 306 may be configured as an axisymmetric structure.
  • the axisymmetric structure may be a ring structure, a columnar structure, or other axisymmetric structures.
  • a magnetic gap may be formed between the first magnetic element 302 and the second magnetically permeable element 306.
  • the voice coil 310 may be disposed in the magnetic gap.
  • the voice coil 310 may be connected to the first vibration plate 308.
  • the first vibration plate 308 may be connected to the second vibration plate 312, and the second vibration plate 312 may be connected to the vibration panel 314.
  • the voice coil 310 is located in a magnetic field formed by the first magnetic element 302, the first magnetically permeable element 304, and the second magnetically permeable element 306, and will be subjected to ampere force.
  • the ampere force drives the voice coil 310 to vibrate, and the vibration of the voice coil 310 will drive the vibration of the first vibration plate 308, the second vibration plate 312, and the vibration panel 314.
  • the vibration panel 314 transmits the vibration to the auditory nerve through tissues and bones, so that a person hears sound.
  • the vibration panel 314 may be in direct contact with human skin, or may be in contact with the skin through a vibration transmission layer composed of a specific material.
  • the magnetic induction lines passing through the voice coil are not uniform and divergent.
  • magnetic leakage may be formed in the magnetic circuit, that is, more magnetic lines of induction leak out of the magnetic gap and fail to pass through the voice coil, thereby reducing the magnetic induction strength (or magnetic field strength) at the position of the voice coil and affecting the speaker components The sensitivity. Therefore, the speaker assembly 300 may further include at least one second magnetic element and / or at least one third magnetically conductive element (not shown).
  • the at least one second magnetic element and / or the at least one third magnetically permeable element can suppress the leakage of the magnetic induction lines and restrict the shape of the magnetic induction lines passing through the voice coil, so that more magnetic induction lines pass through the sound as horizontally and densely as possible.
  • FIG. 31 is a schematic longitudinal sectional view of a magnetic circuit assembly 2100 according to some embodiments of the present application.
  • the magnetic circuit assembly 2100 may include a first magnetic element 2102, a first magnetically permeable element 2104, a second magnetically permeable element 2106, and a second magnetic element 2108.
  • the first magnetic element 2102 and / or the second magnetic element 2108 may include any one or several magnets described in this application.
  • the first magnetic element 2102 may include a first magnet
  • the second magnetic element 2108 may include a second magnet
  • the first magnet and the second magnet may be the same or different.
  • the first magnetically permeable element 2104 and / or the second magnetically permeable element 2106 may include any one or several magnetically permeable materials described in this application.
  • the processing method of the first magnetically permeable element 2104 and / or the second magnetically permeable element 2106 may include any one or several processing methods described in this application.
  • the first magnetic element 2102 and / or the first magnetically permeable element 2104 may be provided as an axisymmetric structure.
  • the first magnetic element 2102 and / or the first magnetically permeable element 2104 may be a cylinder, a rectangular parallelepiped, or a hollow ring (for example, the cross-section is the shape of a racetrack).
  • the first magnetic element 2102 and the first magnetically permeable element 2104 may be coaxial cylinders containing the same or different diameters.
  • the second magnetically permeable element 2106 may be a groove-type structure.
  • the groove-shaped structure may include a U-shaped cross section (as shown in FIG. 30).
  • the groove-shaped second magnetically permeable element 2106 may include a bottom plate and a side wall.
  • the bottom plate and the side wall may be integrally formed.
  • the side wall may be formed by extending the bottom plate in a direction perpendicular to the bottom plate.
  • the bottom plate may be connected to the side wall by any one or several connection methods described in this application.
  • the second magnetic element 2108 may be set in a ring shape or a sheet shape.
  • the second magnetic element 2108 may be annular.
  • the second magnetic element 2108 may include an inner ring and an outer ring.
  • the shape of the inner ring and / or the outer ring may be a circle, an ellipse, a triangle, a quadrangle or any other polygon.
  • the second magnetic element 2108 may be composed of multiple magnets arranged. Both ends of any one of the plurality of magnets may be connected to two ends of adjacent magnets or there may be a certain distance. The spacing between the plurality of magnets may be the same or different.
  • the second magnetic element 2108 may be formed by equidistantly arranging two or three sheet-shaped magnets.
  • the shape of the sheet-shaped magnet may be a fan shape, a quadrangular shape, or the like.
  • the second magnetic element 2108 may be coaxial with the first magnetic element 2102 and / or the first magnetically permeable element 2104.
  • the upper surface of the first magnetic element 2102 may be connected to the lower surface of the first magnetically conductive element 2104.
  • the lower surface of the first magnetic element 2102 can be connected to the bottom plate of the second magnetically conductive element 306.
  • a lower surface of the second magnetic element 2108 is connected to a side wall of the second magnetic conductive element 2106.
  • the connection manner between the first magnetic element 2102, the first magnetically permeable element 2104, the second magnetically permeable element 2106, and / or the second magnetic element 2108 may include one of bonding, snapping, welding, riveting, bolting, and the like, or Multiple combinations.
  • a magnetic gap is formed between the first magnetic element 2102 and / or the first magnetically permeable element 2104 and the inner ring of the second magnetic element 2108.
  • a voice coil 2128 may be disposed in the magnetic gap.
  • the height of the second magnetic element 2108 and the voice coil 2128 relative to the bottom plate of the second magnetically conductive element 2106 are equal.
  • the first magnetic element 2102, the first magnetically permeable element 2104, the second magnetically permeable element 2106, and the second magnetic element 2108 may form a magnetic circuit.
  • the magnetic circuit component 2100 may generate a first full magnetic field (also may be referred to as "total magnetic field of the magnetic circuit component” or "first magnetic field”), and the first magnetic element 2102 may generate a second magnetic field.
  • the first full magnetic field is a magnetic field generated by all components in the magnetic circuit assembly 2100 (for example, the first magnetic element 2102, the first magnetically permeable element 2104, the second magnetically permeable element 2106, and the second magnetic element 2108). Together.
  • the magnetic field strength of the first full magnetic field in the magnetic gap (also referred to as magnetic induction intensity or magnetic flux density) is greater than the magnetic field strength of the second magnetic field in the magnetic gap.
  • the second magnetic element 2108 may generate a third magnetic field, and the third magnetic field may increase the magnetic field strength of the first full magnetic field at the magnetic gap.
  • the third magnetic field increasing the magnetic field strength of the first full magnetic field here means that the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that when there is a third magnetic field (ie, the second magnetic element 2108 is present).
  • the first full magnetic field when the third magnetic field is present ie, the second magnetic element 2108 is not present.
  • the magnetic circuit component indicates a structure including all magnetic elements and magnetically permeable elements
  • the first total magnetic field indicates a magnetic field generated by the entire magnetic circuit component
  • the second magnetic field and the third magnetic field ...
  • the N-th magnetic field represents the magnetic field generated by the corresponding magnetic element.
  • the magnetic elements that generate the second magnetic field may be the same or different.
  • the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the second magnetic element 2108 is between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the second magnetic element 2108 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the second magnetic element 2108 is equal to or greater than 90 degrees.
  • the magnetization direction of the first magnetic element 2102 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 vertically upward (as shown in the direction a in the figure), and the magnetization direction of the second magnetic element 2108 is The inner ring of the two magnetic elements 2108 points toward the outer ring (as shown by the direction b in the figure, on the right side of the first magnetic element 2102, the magnetization direction of the first magnetic element 2102 is deflected 90 degrees in a clockwise direction).
  • the included angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 2108 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 2108, the angle between the direction of the magnetic field generated by the first magnetic element 2102 and the direction of the magnetization of the second magnetic element 2108 may be 0 degrees, 10 degrees, and 20 degrees Angles that are less than or equal to 90 degrees.
  • the second magnetic component 2108 can increase the total magnetic flux in the magnetic gap in the magnetic circuit component 2100, thereby increasing the magnetic induction intensity in the magnetic gap.
  • the originally scattered magnetic induction lines will converge to the position of the magnetic gap, further increasing the magnetic induction intensity in the magnetic gap.
  • FIG. 32 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 2600 according to some embodiments of the present application.
  • the magnetic circuit component 2600 differs from the magnetic circuit component 2100 in that it may further include at least one conductive element (for example, a first conductive element 2118, a second conductive element 2120, and a third conductive element 2122). .
  • the conductive element may include a metal material, a metal alloy material, an inorganic non-metal material, or other conductive materials.
  • Metal materials may include gold, silver, copper, aluminum, etc .; metal alloy materials may include iron-based alloys, aluminum-based alloy materials, copper-based alloys, zinc-based alloys, etc .; inorganic non-metal materials may include graphite and the like.
  • the conductive element may be in a sheet shape, a ring shape, a mesh shape, or the like.
  • the first conductive element 2118 may be disposed on an upper surface of the first magnetically conductive element 2104.
  • the second conductive element 2120 can be connected to the first magnetic element 2102 and the second magnetic conductive element 2106.
  • the third conductive element 2122 may be connected to a sidewall of the first magnetic element 2102.
  • the first magnetically conductive element 2104 may protrude from the first magnetic element 2102 to form a first recessed portion, and the third conductive element 2122 is disposed in the first recessed portion.
  • the first conductive element 2118, the second conductive element 2120, and the third conductive element 2122 may include the same or different conductive materials.
  • the first conductive element 2118, the second conductive element 2120, and the third conductive element 2122 may be connected to the first magnetically conductive element 2104, the second magnetically conductive element 2106, and / or by any one or more of the connection methods described in this application.
  • a magnetic gap is formed between the first magnetic element 2102, the first magnetically permeable element 2104, and the inner ring of the second magnetic element 2108.
  • a voice coil 2128 may be disposed in the magnetic gap.
  • the first magnetic element 2102, the first magnetically permeable element 2104, the second magnetically permeable element 2106, and the second magnetic element 2108 may form a magnetic circuit.
  • the conductive element can reduce the inductive reactance of the voice coil 2128. For example, if the voice coil 2128 passes a first alternating current, a first alternating induced magnetic field is generated near the voice coil 2128.
  • the first alternating induced magnetic field will cause inductive reactance of the voice coil 2128 and hinder the movement of the voice coil 2128.
  • a conductive element for example, a first conductive element 2118, a second conductive element 2120, and a third conductive element 2122
  • the conductive element can be induced by the first alternating induced magnetic field.
  • Second alternating current A third alternating current in the conductive element can generate a second alternating induced magnetic field near the third alternating current.
  • the second alternating induced magnetic field is opposite to the first alternating induced magnetic field in the direction, which can weaken the first alternating current. Changing the induced magnetic field, thereby reducing the inductive reactance of the voice coil 2128, increasing the current in the voice coil, and improving the sensitivity of the speaker component.
  • FIG. 33 is a schematic longitudinal sectional view of a magnetic circuit assembly 2700 according to some embodiments of the present application.
  • the magnetic circuit assembly 2700 differs from the magnetic circuit assembly 2500 in that the magnetic circuit assembly 2700 may further include a third magnetic element 2110, a fourth magnetic element 2112, a fifth magnetic element 2114, and a third guide.
  • the third magnetic element 2110, the fourth magnetic element 2112, the fifth magnetic element 2114, the third magnetically permeable element 2116, and / or the sixth magnetic element 2124, and the seventh magnetic element 2126 may be provided as coaxial circular cylinders.
  • the upper surface of the second magnetic element 2108 is connected to the seventh magnetic element 2126, and the lower surface of the second magnetic element 2108 may be connected to the third magnetic element 2110.
  • the third magnetic element 2110 can be connected to the second magnetically conductive element 2106.
  • the upper surface of the seventh magnetic element 2126 may be connected to the third magnetically conductive element 2116.
  • the fourth magnetic element 2112 can be connected to the second magnetically permeable element 2106 and the first magnetic element 2102.
  • the sixth magnetic element 2124 can be connected to the fifth magnetic element 2114, the third magnetically permeable element 2116, and the seventh magnetic element 2126.
  • the third magnetically conductive element 2116, the sixth magnetic element 2124, and the seventh magnetic element 2126 may form a magnetic circuit and a magnetic gap.
  • the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the sixth magnetic element 2124 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the sixth magnetic element 2124 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the sixth magnetic element 2124 is not higher than 90 degrees.
  • the magnetization direction of the first magnetic element 2102 is perpendicular to the lower surface or the upper surface of the first magnetic element 2102 vertically upward (as shown in the direction a), and the magnetization direction of the sixth magnetic element 2124 is changed from the sixth The outer ring of the magnetic element 2124 points toward the inner ring (as shown in the direction g in the figure, on the right side of the first magnetic element 2102, the magnetization direction of the first magnetic element 2102 is deflected 270 degrees in the clockwise direction).
  • the magnetization direction of the sixth magnetic element 2124 and the magnetization direction of the fourth magnetic element 2112 may be the same in the same vertical direction.
  • the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 2700 and the magnetization direction of the sixth magnetic element 2124 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 2124, the angle between the direction of the magnetic field generated by the first magnetic element 2102 and the magnetization direction of the sixth magnetic element 2124 may be 0 degrees, 10 degrees, and 20 degrees Angles that are less than or equal to 90 degrees.
  • an included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the seventh magnetic element 2126 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the seventh magnetic element 2126 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2102 and the magnetization direction of the seventh magnetic element 2126 is not higher than 90 degrees.
  • the magnetization direction of the first magnetic element 2102 is perpendicular to the lower surface or the upper surface of the first magnetic element 2102 vertically upward (as shown in the direction a), and the magnetization direction of the seventh magnetic element 2126 is changed from the seventh The lower surface of the magnetic element 2126 points to the upper surface (as shown in the direction f in the figure, on the right side of the first magnetic element 2102, the magnetization direction of the first magnetic element 2102 is deflected 360 degrees in a clockwise direction). In some embodiments, the magnetization direction of the seventh magnetic element 2126 and the magnetization direction of the third magnetic element 2110 may be opposite.
  • the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 2700 and the magnetization direction of the seventh magnetic element 2126 is not higher than 90 degrees. In some embodiments, at the position of the seventh magnetic element 2126, the angle between the direction of the magnetic field generated by the first magnetic element 2102 and the magnetization direction of the seventh magnetic element 2126 may be 0 degrees, 10 degrees, and 20 degrees Angles that are less than or equal to 90 degrees.
  • the third magnetically permeable element 2116 can close the magnetic circuit generated by the magnetic circuit component 2700, so that more magnetic induction lines are concentrated in the magnetic gap, thereby achieving a place where the magnetic leakage is suppressed and the magnetic gap is increased. Magnetic induction strength, and the effect of improving the sensitivity of speaker components.
  • FIG. 34 is a schematic longitudinal sectional view of a magnetic circuit assembly 2900 according to some embodiments of the present application.
  • the magnetic circuit assembly 2900 may include a first magnetic element 2902, a first magnetically permeable element 2904, a first full magnetic field changing element 2906, and a second magnetic element 2908.
  • the upper surface of the first magnetic element 2902 may be connected to the lower surface of the first magnetically conductive element 2904, and the second magnetic element 2908 may be connected to the first magnetic element 2902 and the first full magnetic field changing element 2906.
  • the connection manner between the first magnetic element 2902, the first magnetically permeable element 2904, the first full magnetic field changing element 2906, and / or the second magnetic element 2908 may be based on any one or several connection manners described in this application.
  • the first magnetic element 2902, the first magnetically permeable element 2904, the first full magnetic field changing element 2906, and / or the second magnetic element 2908 may form a magnetic circuit and a magnetic gap.
  • the magnetic circuit assembly 2900 may generate a first full magnetic field, and the first magnetic element 2902 may generate a second magnetic field.
  • the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field.
  • the second magnetic element 2908 may generate a third magnetic field, which may increase the magnetic field strength of the second magnetic field at the magnetic gap.
  • the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the second magnetic element 2908 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the second magnetic element 2908 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the second magnetic element 2908 may not be higher than 90 degrees.
  • the included angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 2908 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 2908, the included angle between the direction of the magnetic field generated by the first magnetic element 2902 and the magnetization direction of the second magnetic element 2908 may be 0 degrees, 10 degrees, and 20 degrees Angles that are less than or equal to 90 degrees.
  • the magnetization direction of the first magnetic element 2902 is perpendicular to the lower surface or the upper surface of the first magnetic element 2902 vertically upward (as shown in the direction of a). The outer ring is pointed toward the inner ring (as shown by the direction c in the figure, on the right side of the first magnetic element 2902, the magnetization direction of the first magnetic element 2902 is deflected 270 degrees clockwise).
  • the first full magnetic field changing element 2906 in the magnetic circuit component 2900 can increase the total magnetic flux in the magnetic gap, thereby increasing the magnetic induction intensity in the magnetic gap.
  • the originally scattered magnetic flux lines will converge to the position of the magnetic gap, further increasing the magnetic induction intensity in the magnetic gap.
  • FIG. 35 is a schematic longitudinal sectional view of a magnetic circuit assembly 3000 according to some embodiments of the present application.
  • the magnetic circuit assembly 3000 may include a first magnetic element 2902, a first magnetically permeable element 2904, a first full magnetic field changing element 2906, a second magnetic element 2908, and a third magnetic element 2910.
  • the first full magnetic field changing element 2906 and / or the second annular element 2922 may include an annular magnetic element or an annular magnetically permeable element.
  • the ring-shaped magnetic element may include any one or several kinds of magnetic materials described in this application, and the ring-shaped magnetically permeable element may include any one or several types of magnetically conductive materials described in this application.
  • the sixth magnetic element 2918 may be connected to the fifth magnetic element 2916 and the second ring element 2922
  • the seventh magnetic element 2920 may be connected to the third magnetic element 2910 and the second ring element 2922.
  • the first magnetic element 2902, the fifth magnetic element 2916, the second magnetic element 2908, the third magnetic element 2910, the fourth magnetic element 2912, the sixth magnetic element 2918, and / or the seventh magnetic element 2920 and The first magnetically permeable element 2904, the first full magnetic field changing element 2906, and the second annular element 2922 may form a magnetic circuit.
  • an included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the sixth magnetic element 2918 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the sixth magnetic element 2918 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the sixth magnetic element 2918 is not higher than 90 degrees.
  • the magnetization direction of the first magnetic element 2902 is perpendicular to the lower surface or the upper surface of the first magnetic element 2902 vertically upward (as shown in the direction a), and the magnetization direction of the sixth magnetic element 2918 is changed from the sixth The outer ring of the magnetic element 2918 points to the inner ring (as shown in the direction f in the figure, on the right side of the first magnetic element 2902, the magnetization direction of the first magnetic element 2902 is deflected 270 degrees clockwise). In some embodiments, in the same vertical direction, the magnetization direction of the sixth magnetic element 2918 and the magnetization direction of the second magnetic element 2908 may be the same.
  • the magnetization direction of the first magnetic element 2902 is perpendicular to the lower surface or the upper surface of the first magnetic element 2902 vertically upward (as shown in the direction a), and the magnetization direction of the seventh magnetic element 2920 is changed from the seventh The lower surface of the magnetic element 2920 points to the upper surface (as shown by the direction e in the figure, on the right side of the first magnetic element 2902, the magnetization direction of the first magnetic element 2902 is deflected 360 degrees in a clockwise direction).
  • the magnetization direction of the seventh magnetic element 2920 and the magnetization direction of the fourth magnetic element 2912 may be the same.
  • the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 2900 and the magnetization direction of the sixth magnetic element 2918 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 2918, the included angle between the direction of the magnetic field generated by the first magnetic element 2902 and the magnetization direction of the sixth magnetic element 2918 may be 0 degrees, 10 degrees, and 20 degrees Angles that are less than or equal to 90 degrees.
  • an included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the seventh magnetic element 2920 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the seventh magnetic element 2920 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 2902 and the magnetization direction of the seventh magnetic element 2920 is not higher than 90 degrees.
  • the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 3000 and the magnetization direction of the seventh magnetic element 2920 is not higher than 90 degrees. In some embodiments, at the position of the seventh magnetic element 2920, the included angle between the direction of the magnetic field generated by the first magnetic element 2902 and the magnetization direction of the seventh magnetic element 2920 may be 0 degrees, 10 degrees, and 20 degrees Angles that are less than or equal to 90 degrees.
  • the first full magnetic field changing element 2906 may be a ring-shaped magnetic element.
  • the magnetization direction of the first full magnetic field changing element 2906 may be the same as that of the second magnetic element 2908 or the fourth magnetic element 2912.
  • the magnetization direction of the first full magnetic field changing element 2906 may be directed from the outer ring of the first full magnetic field changing element 2906 to the inner ring.
  • the second ring element 2922 may be a ring magnetic element.
  • the magnetization direction of the second ring element 2922 may be the same as that of the sixth magnetic element 2918 or the seventh magnetic element 2920.
  • the magnetization direction of the second ring element 2922 may be directed from the outer ring of the second ring element 2922 to the inner ring.
  • multiple magnetic elements can increase the total magnetic flux, and the interaction of different magnetic elements can suppress the leakage of magnetic induction lines, increase the magnetic induction strength at the magnetic gap, and increase the sensitivity of the speaker assembly.
  • FIG. 36 is a schematic longitudinal sectional view of a magnetic circuit assembly 3100 according to some embodiments of the present application.
  • the magnetic circuit assembly 3100 may include a first magnetic element 3102, a first magnetically permeable element 3104, a second magnetically permeable element 3106, and a second magnetic element 3108.
  • the first magnetic element 3102 and / or the second magnetic element 3108 may include any one or several magnets described in this application.
  • the first magnetic element 3102 may include a first magnet
  • the second magnetic element 3108 may include a second magnet
  • the first magnet and the second magnet may be the same or different.
  • the first magnetically permeable element 3104 and / or the second magnetically permeable element 3106 may include any one or several magnetically permeable materials described in this application.
  • the processing method of the first magnetically permeable element 3104 and / or the second magnetically permeable element 3106 may include any one or several processing methods described in this application.
  • the first magnetic element 3102, the first magnetically permeable element 3104, and / or the second magnetic element 3108 may be provided as an axisymmetric structure.
  • the first magnetic element 3102, the first magnetically permeable element 3104, and / or the second magnetic element 3108 may be a cylinder.
  • the first magnetic element 3102, the first magnetically permeable element 3104, and / or the second magnetic element 3108 may be coaxial cylinders containing the same or different diameters.
  • the thickness of the first magnetic element 3102 may be greater than or equal to the thickness of the second magnetic element 3108.
  • the second magnetically permeable element 3106 may be a groove-type structure.
  • the groove structure may include a U-shaped cross section.
  • the groove-shaped second magnetically conductive element 3106 may include a bottom plate and a side wall.
  • the bottom plate and the side wall may be integrally formed.
  • the side wall may be formed by extending the bottom plate in a direction perpendicular to the bottom plate.
  • the bottom plate may be connected to the side wall by any one or several connection methods described in this application.
  • the second magnetic element 3108 may be set in a ring shape or a sheet shape. Regarding the shape of the second magnetic element 3108, reference may be made to the description elsewhere in the specification.
  • the second magnetic element 3108 may be coaxial with the first magnetic element 3102 and / or the first magnetically permeable element 3104.
  • An upper surface of the first magnetic element 3102 may be connected to a lower surface of the first magnetically conductive element 3104.
  • the lower surface of the first magnetic element 3102 can be connected to the bottom plate of the second magnetically conductive element 3106.
  • the lower surface of the second magnetic element 3108 is connected to the upper surface of the first magnetically conductive element 3104.
  • the connection manner between the first magnetic element 3102, the first magnetically permeable element 3104, the second magnetically permeable element 3106, and / or the second magnetic element 3108 may include one of bonding, snapping, welding, riveting, bolting, etc. or Multiple combinations.
  • a magnetic gap is formed between the first magnetic element 3102, the first magnetically permeable element 3104 and / or the second magnetic element 3108 and the side wall of the second magnetically permeable element 3106.
  • a voice coil may be provided in the magnetic gap.
  • the first magnetic element 3102, the first magnetically permeable element 3104, the second magnetically permeable element 3106, and the second magnetic element 3108 may form a magnetic circuit.
  • the magnetic circuit assembly 3100 may generate a first full magnetic field, and the first magnetic element 3102 may generate a second magnetic field.
  • the first full magnetic field is a magnetic field generated by all components in the magnetic circuit assembly 3100 (for example, the first magnetic element 3102, the first magnetically permeable element 3104, the second magnetically permeable element 3106, and the second magnetic element 3108). Together.
  • the magnetic field strength of the first full magnetic field in the magnetic gap (also referred to as magnetic induction intensity or magnetic flux density) is greater than the magnetic field strength of the second magnetic field in the magnetic gap.
  • the second magnetic element 3108 may generate a third magnetic field, and the third magnetic field may increase the magnetic field strength of the second magnetic field at the magnetic gap.
  • the included angle between the magnetization direction of the second magnetic element 3108 and the magnetization direction of the first magnetic element 3102 is between 90 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the second magnetic element 3108 and the magnetization direction of the first magnetic element 3102 is between 150 degrees and 180 degrees. In some embodiments, the magnetization direction of the second magnetic element 3108 is opposite to that of the first magnetic element 3102 (as shown in the figure, the a direction and the b direction).
  • the magnetic circuit assembly 3100 adds a second magnetic element 3108.
  • the magnetization direction of the second magnetic element 3108 is opposite to the magnetization direction of the first magnetic element 3102.
  • the magnetic leakage of the first magnetic element 3102 in the magnetization direction can be suppressed, so that the magnetic field generated by the first magnetic element 3102 can be more compressed to magnetic In the gap, the magnetic induction intensity in the magnetic gap is thus increased.
  • the mechanism diagram shown in FIG. 37 is a speaker assembly, which includes the earphone core 102 and the movement case 108 in FIG. 1.
  • the following uses the bone conduction speaker component as an example to explain the application scenario and structure of the speaker component.
  • the bone conduction speaker assembly may include a driving assembly 3701, a transmission assembly 3702, a panel 3703 (the panel 3703 may also be referred to as a shell panel, and is a side of the movement case facing the human body). Panel), and housing 3704. Referring to FIG.
  • the panel 3703 and the housing 3704 are consistent with the movement case 108 (FIG. 1), and the driving component 3701 and the transmission component 3702 are consistent with the earphone core 102 (FIG. 1).
  • the housing 3704 may include a housing back and a housing side, and the housing 3704 is connected to the panel 3703 through the housing back through the housing side.
  • the driving component 3701 can transmit the vibration signal to the panel 3703 and / or the casing 3704 through the transmission component 3702, so as to transmit sound to the human body through contact with the panel 3703 or the casing 3704 and human skin.
  • the panel 3703 and / or the housing 3704 of the bone conduction speaker assembly may be in contact with human skin at the tragus, thereby transmitting sound to the human body.
  • the panel 3703 and / or the housing 3704 may also be in contact with human skin on the back side of the auricle.
  • the straight line B (or the vibration direction of the driving device) of the driving force generated by the driving component 3701 has an included angle ⁇ with the normal line A of the panel 3703. In other words, straight line B is not parallel to straight line A.
  • the panel has an area in contact with or against the user's body, such as human skin. It should be understood that when the panel is covered with other materials (such as soft materials such as silicone) to enhance the user's wearing comfort, the relationship between the panel and the user's body is not direct contact, but against each other.
  • the bone conduction speaker assembly is worn on the user's body, the entire area of the panel is in contact with or against the user's body. In some embodiments, after the bone conduction speaker assembly is worn on the user's body, a partial area of the panel is in contact with or against the user's body.
  • the area on the panel for contact or abutment with the user's body may occupy more than 50% of the entire panel area, and more preferably, it may occupy more than 60% of the panel area.
  • the area on the panel that comes into contact with or abuts the user's body can be flat or curved.
  • the normal thereof when the area on the panel for contacting or abutting the user's body is a plane, the normal thereof satisfies the general definition of the normal, that is, a dashed line perpendicular to the plane.
  • its normal when the area on the panel for contacting or abutting the user's body is a curved surface, its normal is the average normal of the area. Among them, the definition of the average normal is as follows:
  • the curved surface is a quasi-plane close to a plane, that is, a surface whose angle between the normal of any point in at least 50% of the area and its average normal is smaller than a set threshold.
  • the set threshold is less than 10 °. In some embodiments, the set threshold may be further less than 5 °.
  • the line B where the driving force is located and the normal A 'of the area on the panel 3703 for contacting or abutting the user's body have the included angle ⁇ .
  • the value range of the included angle ⁇ may be 0 ⁇ ⁇ 180 °, and further the value range may be 0 ⁇ ⁇ 180 ° and not equal to 90 °.
  • the setting line B has a positive direction pointing out of the bone conduction speaker module, and the setting line 3703's normal A (or the normal line A 'of the contact surface of the panel 3703 and the human skin) also has pointing bone conduction.
  • the angle ⁇ formed by the normal line A or A ′ and the straight line B in the positive direction is an acute angle, that is, 0 ⁇ ⁇ 90 °. More descriptions of the normal line A and the normal line A 'can be found in FIG. 39 and related descriptions, and will not be repeated here.
  • FIG. 38 is a schematic diagram of an included angle direction provided by some embodiments of the present application.
  • the driving force generated by the driving device has a component in the first quadrant and / or the third quadrant of the XOY plane coordinate system.
  • the XOY plane coordinate system is a reference coordinate system.
  • the origin O is located on the contact surface between the panel and / or the shell and the human body after the bone conduction speaker assembly is worn on the human body.
  • the X axis is parallel to the human body coronal axis and the Y axis is The sagittal axis of the human body is parallel, and the positive direction of the X axis is toward the outside of the human body, and the positive direction of the Y axis is toward the front of the human body.
  • the quadrant should be understood as four regions divided by the horizontal axis (such as the X axis) and the vertical axis (such as the Y axis) in the plane rectangular coordinate system, and each region is called a quadrant. The quadrant is centered on the origin and the X and Y axes are the dividing lines.
  • the upper right (the area enclosed by the positive semi-axis of the X axis and the positive semi-axis of the Y axis) is called the first quadrant, and the upper left (the area enclosed by the negative semi-axis of the X axis and the positive semi-axis of the Y axis) is called The second quadrant, the lower left (the area enclosed by the negative semi-axis of the X axis and the negative semi-axis of the Y axis) is called the third quadrant, and the lower right (the positive semi-axis of the X axis is enclosed by the negative semi-axis of the Y axis) Area) is called the fourth quadrant.
  • the points on the coordinate axis do not belong to any quadrant.
  • the driving force in this embodiment may be directly located in the first quadrant and / or the third quadrant of the XOY plane coordinate system, or the driving force is directed in other directions, but in the XOY plane coordinate system,
  • the projection or component in the first quadrant and / or the third quadrant is not 0, and the projection or component in the Z-axis direction may be 0 or not 0.
  • the Z axis is perpendicular to the XOY plane and passes through the origin O.
  • the minimum included angle ⁇ between the straight line where the driving force is located and the normal on the panel that is in contact or abutment with the user ’s body may be any acute angle.
  • the range of the included angle ⁇ is preferably 5 ° ⁇ 80 °; more preferably 15 ° to 70 °; still more preferably 25 ° to 60 °; still more preferably 25 ° to 50 °; still more preferably 28 ° to 50 °; still more preferably 30 ° to 39 °; even more preferably It is 31 ° to 38 °; more preferably 32 ° to 37 °; more preferably 33 ° to 36 °; more preferably 33 ° to 35.8 °; and more preferably 33.5 ° to 35 °.
  • the included angle ⁇ can be 26 °, 27 °, 28 °, 29 °, 30 °, 31 °, 32 °, 33 °, 34 °, 34.2 °, 35 °, 35.8 °, 36 °, 37 ° or 38 °, the error is controlled within 0.2 degrees.
  • the driving force may also have a component in the second and fourth quadrants of the XOY plane coordinate system. , Even the driving force can be located on the Y axis and so on.
  • FIG. 39 is a schematic structural diagram of a bone conduction speaker component acting on human skin and bone according to some embodiments of the present application.
  • the straight line on which the driving force is located is collinear or parallel to the straight line on which the driving device vibrates.
  • the direction of the driving force may be the same as or opposite to the vibration direction of the coil and / or the magnetic circuit component.
  • the panel can be flat or curved, or the panel has several protrusions or grooves.
  • the normal of the area on the panel that is in contact with or against the user's body is not parallel to the straight line where the driving force is located.
  • the area on the panel that is in contact with or abuts the user's body is relatively flat, which can be a flat surface or a quasi-plane with little curvature change.
  • any normal point on the panel can be used as the normal line of the area.
  • the normal line A of the panel 3703 and the panel 3703 and The normal A 'of the human skin contact surface may be parallel or coincident.
  • the normal of the area may be its average normal. For the detailed definition of the average normal, refer to the related description in FIG. 37, which is not repeated here.
  • the normal of the area when the panel is used for contacting the user's body with a panel that is non-planar, the normal of the area may also be determined as follows: a certain point in an area when the panel is in contact with human skin is selected, A tangent plane of the panel at the point is determined, a straight line passing through the point and perpendicular to the tangent plane is determined, and the straight line is used as the normal line of the panel.
  • the panel is used to make contact with human skin, the panel is non-planar, the selected point is different, the tangent plane of the panel at that point is different, and the normals determined will also be different. At this time, the normal A 'and The normal A of the panel is not parallel.
  • the straight line where the driving force is located (or the straight line where the driving device is vibrating) has an included angle ⁇ with the normal of the region, and the included angle is 0 ⁇ ⁇ 180 °.
  • the designated driving force line has a positive direction pointing out of the bone conduction speaker component via the panel (or the surface of the panel and / or the shell contacting the human skin)
  • the designated panel or the panel and / or the shell is in contact with the human body
  • the skin contact surface) normal has a positive direction pointing out of the bone conduction speaker module, and the angle formed by the two straight lines in the positive direction is an acute angle.
  • the bone conduction speaker assembly includes a driving device (also referred to as a transducing device in other embodiments), a transmission component 1803, a panel 1801, and a housing 1802.
  • the coil 1804 and the magnetic circuit component 1807 are both ring structures.
  • the driving device is a moving coil driving method, and includes a coil 1804 and a magnetic circuit component 1807.
  • the coil 1804 and the magnetic circuit assembly 1807 have mutually parallel axes, and the axis of the coil 1804 or the magnetic circuit assembly 1807 is perpendicular to the radial plane of the coil 1804 and / or the radial plane of the magnetic circuit assembly 1807. In some embodiments, the coil 1804 and the magnetic circuit assembly 1807 have the same central axis. The central axis of the coil 1804 is perpendicular to the radial plane of the coil 1804 and passes through the geometric center of the coil 1804. The central axis of the magnetic circuit assembly 1807 and the magnetic circuit The radial plane of the component 1807 is perpendicular and passes through the geometric center of the magnetic circuit component 1807. The axis ⁇ of the coil 1804 or the magnetic circuit assembly 1807 and the normal line of the panel 1801 have the aforementioned angle ⁇ .
  • the relationship between the driving force F and the skin deformation S will be described below with reference to FIG. 39.
  • the driving force generated by the driving device is parallel to the panel 1801 normal (that is, the included angle ⁇ is zero)
  • the relationship between the driving force and the total skin deformation is:
  • F ⁇ is the driving force
  • S ⁇ is the total deformation of the skin in the vertical skin direction
  • E is the elastic modulus of the skin
  • A is the contact area of the panel and the skin
  • h is the total thickness of the skin (that is, the panel and the bone the distance between).
  • F // is the driving force
  • S // is the total deformation of the skin in the direction parallel to the skin
  • G is the shear modulus of the skin
  • A is the contact area between the panel and the skin
  • h is the total thickness of the skin (that is, Panel to bone).
  • ⁇ is the Poisson's ratio of skin 0 ⁇ ⁇ 0.5, and thus the shear modulus G is less than the modulus of elasticity E, corresponding to the total deformation of the skin S //> under the same driving force S ⁇ .
  • the Poisson's ratio of the skin is close to 0.4.
  • FIG. 40 is an angle-relative displacement relationship diagram of a bone conduction speaker assembly provided according to some embodiments of the present application.
  • the relationship between the included angle ⁇ and the total skin deformation is that the larger the included angle ⁇ and the larger the relative displacement, the larger the total skin deformation S.
  • the volume of the bone conduction speaker component at low frequencies is positively related to the total skin deformation S.
  • the greater the S the greater the volume of bone conduction low frequencies.
  • the greater S ⁇ the greater the volume of the low frequency of bone conduction.
  • the relationship between the included angle ⁇ and the total skin deformation S is that the larger the included angle ⁇ , the larger the total skin deformation S, and the louder the low-frequency part of the corresponding bone conduction speaker component is.
  • the relationship between the included angle ⁇ and the skin deformation S ⁇ in the vertical skin direction is that the larger the included angle ⁇ , the smaller the skin deformation S ⁇ in the vertical skin direction, corresponding to the high-frequency part of the bone conduction speaker component The lower the volume.
  • the included angle ⁇ should be at a proper size.
  • the range of ⁇ is 5 ° to 80 °, or 15 ° to 70 °, or 25 ° to 50 °, or 25 ° to 35 °, or 25 ° to 30 °, and so on.
  • FIG. 41 is a schematic diagram of a low-frequency portion of a frequency response curve of a bone conduction speaker assembly at different angles ⁇ provided according to the present application.
  • the panel is in contact with the skin and transmits vibration to the skin.
  • the skin also affects the vibration of the bone conduction speaker component, which affects the frequency response curve of the bone conduction speaker component. From the above analysis, we found that the larger the angle, the greater the total deformation of the skin under the same driving force, and the corresponding bone conduction speaker component, which is equivalent to the skin's reduced elasticity relative to its panel portion.
  • the frequency response can be changed.
  • the resonance peaks in the low frequency region of the curve are adjusted to the lower frequency region, which makes the low frequency dive deeper and the low frequency increased.
  • setting the included angle can effectively suppress the increase in vibration while increasing the low-frequency energy, thereby reducing the vibration.
  • the low-frequency sensitivity of the bone conduction speaker component is significantly improved, and the sound quality and the human experience are improved.
  • the increase in low frequency and less vibration can be expressed as the increase in the angle ⁇ in the range of (0, 90 °), the energy in the low frequency range in the vibration or sound signal increases, and Vibration is also increased, but the increase in energy in the low frequency range is greater than the increase in vibration. Therefore, the relative effect is relatively reduced. It can be seen from FIG. 41 that when the included angle is large, the resonance peaks in the low frequency region appear at lower frequency bands, and the flat portion of the frequency curvature can be prolonged in disguise, thereby improving the sound quality of the speaker component.
  • FIG. 42 is a schematic longitudinal sectional view of a bone conduction speaker assembly according to some embodiments of the present application.
  • the bone conduction speaker assembly 200 in FIG. 42 corresponds to the headphone core 102 and the movement case 108 in FIG. 1
  • the earphone case 220 corresponds to the movement case 108 in FIG. 1.
  • the bone conduction speaker assembly 200 may include a magnetic circuit assembly 210, a coil 212, a vibration transmitting sheet 214, a connector 216, and an earphone housing 220.
  • the magnetic circuit assembly 210 may include a first magnetic element 202, a first magnetically permeable element 204, and a second magnetically permeable element 206.
  • the earphone housing 220 may include a housing panel 222, a housing back 224, and a housing side 226.
  • the housing back surface 224 is located on a side opposite to the housing panel 222 and is respectively disposed on both end surfaces of the housing side surface 226.
  • the casing panel 222, the casing back surface 224, and the casing side surface 226 form an integrated structure with a certain accommodation space.
  • the magnetic circuit assembly 210, the coil 212, and the vibration transmitting sheet 214 are fixed inside the earphone housing 220.
  • the bone conduction speaker assembly 200 may further include a housing support 228, the vibration transmitting sheet 214 may be connected to the earphone housing 220 through the housing support 228, and the coil 212 may be fixed on the housing support 228 and through the housing support 228 Drive the casing 220 to vibrate.
  • the housing bracket 228 may be a part of the earphone housing 220 or a separate component, which is directly or indirectly connected to the interior of the earphone housing 220.
  • the housing bracket 228 may be fixed on the inner surface of the housing side 226.
  • the housing bracket 228 may be adhered to the earphone housing 220 by glue, and may also be fixed to the housing 220 by stamping, injection molding, snap-fitting, riveting, screwing or welding.
  • connection manner of the casing panel 222, the casing back surface 224, and the casing side surface 226 can be used to ensure that the earphone casing 220 has greater rigidity.
  • the case panel 222, the case back 224, and the case side 226 may be integrally formed.
  • the housing back surface 224 and the housing side surface 226 may be a one-piece structure.
  • the outer shell panel 222 and the outer shell side 226 can be directly fixed by glue, or fixed by means of snapping, welding or screwing.
  • the glue may be a glue with strong viscosity and high hardness.
  • the casing panel 222 and the casing side surface 226 may be an integrally formed structure.
  • the casing back surface 224 and the casing side surface 226 may be directly fixed and fixed by glue, or may be fixed by snapping, welding, or screwing.
  • the housing panel 222, the housing back surface 224, and the housing side surface 226 are independent components, and the three can be performed by one or any combination of glue, snap, welding, or screw connection.
  • Fixed connection For example, the shell panel 222 and the shell side 226 are connected by glue, and the shell back surface 224 and the shell side 226 are connected by snapping, welding, or screwing. Or the shell back surface 224 and the shell side surface 226 are connected by glue, and the shell panel 222 and the shell side surface 226 are connected by snapping, welding or screwing.
  • the shells described in this application can be made by different assembly methods.
  • the housing may be a one-piece molding method, a split combination method, or a combination of the two.
  • the different splits can be fixed with glue or fixed by snapping, welding or screwing.
  • FIGS. 43-24 describe examples of several assembly manners of the shell.
  • the bone conduction speaker assembly mainly includes a magnetic circuit assembly 2210 and a housing.
  • the magnetic circuit assembly 2210 may include a first magnetic element 2202, a first magnetically permeable element 2204, and a second magnetically permeable element 2206.
  • the housing may include a housing panel 2222, a housing back 2224, and a housing side 2226.
  • the housing side surface 2226 and the housing back surface 2224 are made in an integrated manner, and the housing panel 2222 is connected to one end of the housing side surface 2226 by a combination of parts.
  • the method of combining the pieces includes using glue to fix or fix the shell panel 2222 to one end of the side 2226 of the shell by means of snapping, welding or screwing.
  • the case panel 2222 and the case side 2226 may be made of different, the same, or partially the same materials.
  • the shell panel 2222 and the shell side 2226 are made of the same material, and the Young's modulus of the same material is greater than 2000 MPa. More preferably, the Young's modulus of the same material is greater than 4000 MPa. More preferably, the Young's modulus of the same material is greater than 6000 MPa. More preferably, the Young's modulus of the material of the earphone housing 220 is greater than 8000 MPa.
  • the Young's modulus of the same material is greater than 12000 MPa, more preferably, the Young's modulus of the same material is greater than 15000 MPa, and even more preferably, the Young's modulus of the same material is greater than 18000 MPa.
  • the shell panel 2222 and the shell side 2226 are made of different materials, and the Young's modulus of the different materials is greater than 4000 MPa. More preferably, the Young's modulus of the different materials is greater than 6000 MPa, more preferably, the Young's modulus of the different materials is greater than 8000 MPa, and even more preferably, the Young's modulus of the different materials is greater than 12000 MPa.
  • the Young's modulus of the different materials is greater than 15000 MPa, and even more preferably, the Young's modulus of the different materials is greater than 18000 MPa.
  • the material of the shell panel 2222 and / or the shell side 2226 includes, but is not limited to, acrylonitrile-butadiene-styrene copolymer (AcrYlonitrile butadiene stYrene, ABS), polystyrene (PolYstYrene, PS), high Impact polystyrene (High impact polYstYrene, HIPS), polypropylene (PolYpropYlene, PP), polyethylene terephthalate (PolYethYlene terephthalate, PET), polyester (PolYester, PES), polycarbonate (PolYcarbonate, PC ), Polyamide (PolYamides, PA), Polyvinyl chloride (PolYvinYlchloride, PVC), Polyurethane (PolYurethanes
  • the material of the shell panel 2222 is any combination of glass fiber, carbon fiber, and materials such as polycarbonate (PolYcarbonate, PC) and polyamide (PolYamides, PA).
  • the material of the shell panel 2222 and / or the shell side 2226 may be made of carbon fiber and polycarbonate (PolYcarbonate, PC) according to a certain ratio.
  • the material of the shell panel 2222 and / or the shell side 2226 may be made of carbon fiber, glass fiber and polycarbonate (PolYcarbonate, PC) according to a certain ratio.
  • the material of the shell panel 2222 and / or the shell side 2226 may be made of glass fiber and polycarbonate (PolYcarbonate, PC) according to a certain ratio, and glass fiber and polyamide (PolYamides, PA) may also be used. Made by mixing in a certain proportion.
  • the casing panel 2222, the casing back surface 2224, and the casing side surface 2226 form an integrated structure with a certain accommodation space.
  • the vibration transmitting sheet 2214 is connected to the magnetic circuit assembly 2210 through a connecting member 2216.
  • the two sides of the magnetic circuit assembly 2210 are connected to the first magnetically permeable element 2204 and the second magnetically permeable element 2206, respectively.
  • the vibration transmitting sheet 2214 is fixed to the inside of the integrated structure through a housing support 2228.
  • the housing side 2226 has a step structure for supporting the housing support 2228.
  • the shell panel 2222 may be fixed to the shell bracket 2228 and the shell side 2226 at the same time, or may be separately fixed to the shell bracket 2228 or the shell side 2226.
  • the housing side 2226 and the housing bracket 2228 may be integrally formed.
  • the housing bracket 2228 may be directly fixed on the housing panel 2222 (for example, by means of glue sticking, snapping, welding or screwing).
  • the fixed shell panel 2222 and the shell bracket 2228 are then fixed to the side of the shell (for example, by means of glue sticking, snapping, welding or screwing).
  • the case bracket 2228 and the case panel 2222 may be integrally formed.
  • the bone conduction speaker assembly mainly includes a magnetic circuit assembly 2240 and a housing.
  • the magnetic circuit assembly 2240 may include a first magnetic element 2232, a first magnetically conductive element 2234, and a second magnetically conductive element 2236.
  • the vibration transmitting plate 2244 is connected to the magnetic circuit assembly 2240 through a connecting member 2246.
  • This embodiment is different from the embodiment provided in FIG. 43 in that the housing bracket 2258 and the housing side 2256 are integrally formed.
  • the housing panel 2252 is fixed on the side of the housing side 2256 that is connected to the housing bracket 2258 (for example, by means of glue sticking, snapping, welding or screwing), and the housing back 2254 is fixed on the other side of the housing side 2256 (for example, (Through glue sticking, snapping, welding or screwing).
  • the shell bracket 2258 and the shell side 2256 are separate structures, and the shell panel 2252, the shell back 2254, and the shell bracket 2258 and the shell side 2256 are all pasted and snapped together by glue. , Welding or threaded connection for fixed connection.
  • the bone conduction speaker assembly in this embodiment mainly includes a magnetic circuit assembly 2270 and a housing.
  • the magnetic circuit assembly 2270 may include a first magnetic element 2262, a first magnetically conductive element 2264, and a second magnetically conductive element 2266.
  • the vibration transmitting plate 2274 is connected to the magnetic circuit assembly 2270 through a connecting member 2276.
  • This embodiment is different from the embodiment provided in FIG. 44 in that the housing panel 2282 and the housing side 2286 are integrally formed.
  • the case back 2284 is fixed on the side of the case side 2286 opposite to the case panel 2282 (for example, by means of glue sticking, snapping, welding or screwing).
  • the shell bracket 2288 is fixed on the shell panel 2282 and / or the shell side 2286 by means of glue sticking, snap-fitting, welding or screwing.
  • the housing bracket 2288, the housing panel 2282, and the housing side 2286 are integrally formed structures.
  • FIG. 46 is a schematic structural diagram of a shell of a bone conduction speaker assembly according to some embodiments of the present application.
  • the case 700 may include a case panel 710, a case back 720, and a case side 730.
  • the shell panel 710 is in contact with the human body, and transmits the vibration of the bone conduction speaker component to the human auditory nerve.
  • the amplitude and phase of the vibration of the housing panel 710 and the housing back 720 remain the same or substantially the same (the side 730 of the housing does not compress air and therefore does not Generating sound leakage), so that the first sound leakage signal generated by the housing panel 710 and the second sound leakage signal generated by the back surface 720 of the housing can be superimposed on each other.
  • the superimposition can reduce the amplitude of the first leaky sound wave or the second leaky sound wave, thereby achieving the purpose of reducing the sound leakage of the housing 700.
  • the certain frequency range includes at least a portion with a frequency greater than 500 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 600 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 800 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 1000 Hz.
  • the certain frequency range includes at least a part with a frequency greater than 2000 Hz. More preferably, the certain frequency range includes at least a portion whose frequency is greater than 5000 Hz. More preferably, the certain frequency range includes at least a portion having a frequency greater than 8000 Hz. Further preferably, the certain frequency range includes at least a portion having a frequency greater than 10000 Hz.
  • the rigidity of the shell of the bone conduction speaker assembly can affect the amplitude and phase of the vibration of different parts of the shell (for example, the shell panel, the back of the shell, and / or the side of the shell), thereby affecting the bone conduction speaker assembly. Sound leakage.
  • the shell panel and the back of the shell can maintain the same or substantially the same amplitude and phase of vibration at a higher frequency, thereby significantly reducing bone Conductive sound leakage from headphones.
  • the higher frequency may include a frequency of not less than 1000 Hz, for example, a frequency between 1000 Hz-2000 Hz, a frequency between 1100 Hz-2000 Hz, a frequency between 1300 Hz-2000 Hz, and a frequency between 1500 Hz-2000 Hz.
  • the higher frequency mentioned herein may include a frequency of not less than 2000 Hz, for example, a frequency between 2000 Hz and 3000 Hz, a frequency between 2100 Hz and 3000 Hz, a frequency between 2300 Hz and 3000 Hz, and a frequency between 2500 Hz and 3000 Hz.
  • Frequency between 2700Hz-3000Hz, or between 2900Hz-3000Hz.
  • the higher frequency may include a frequency of not less than 4000 Hz, for example, a frequency between 4000 Hz and 5000 Hz, a frequency between 4100 Hz and 5000 Hz, a frequency between 4300 Hz and 5000 Hz, a frequency between 4500 Hz and 5000 Hz, and 4700 Hz.
  • Frequency between -5000Hz, or between 4900Hz-5000Hz.
  • the higher frequency may include a frequency not less than 6000 Hz, for example, a frequency between 6000 Hz-8000 Hz, a frequency between 6100 Hz-8000 Hz, a frequency between 6300 Hz-8000 Hz, and a frequency between 6500 Hz-8000 Hz, Frequency between 7000Hz-8000Hz, frequency between 7500Hz-8000Hz, or frequency between 7900Hz-8000Hz.
  • the higher frequency may include a frequency not less than 8000 Hz, for example, a frequency between 8000 Hz-12000 Hz, a frequency between 8100 Hz-12000 Hz, a frequency between 8300 Hz-12000 Hz, and a frequency between 8500 Hz-12000 Hz, Frequency between 9000Hz-12000Hz, frequency between 10000Hz-12000Hz, or frequency between 11000Hz-12000Hz.
  • the ratio of the vibration amplitude of the shell panel and the back of the shell is within a certain range.
  • the ratio of the amplitude of the vibration between the shell panel and the back of the case is between 0.3 and 3.
  • the ratio of the amplitude of the vibration between the shell panel and the back of the case is between 0.4 and 2.5, preferably, the amplitude of the vibration between the shell panel and the back of the shell.
  • the ratio of the vibration amplitude is between 0.5 and 1.5. More preferably, the ratio of the vibration amplitude of the case panel and the back of the case is between 0.6 and 1.4.
  • the ratio of the vibration amplitude of the case panel and the back of the case is between 0.7 and 1.2. , More preferably, the ratio of the amplitude of the vibration between the case panel and the back of the case is between 0.75 and 1.15, more preferably, the ratio of the amplitude of the vibration between the case panel and the back of the case is between 0.8 and 1.1, more preferably, the case panel and The ratio of the amplitude of the vibration on the back of the case is between 0.85 and 1.1, and further preferably, the ratio of the amplitude of the vibration on the case panel and the back of the case is between 0.9 and 1.05.
  • the vibrations of the housing panel and the back of the housing may be expressed by other physical quantities capable of characterizing the amplitude of the vibrations.
  • the sound pressure generated by the shell panel and the back of the shell at one point in the space can be used to characterize the vibration amplitude of the shell panel and the back of the shell.
  • Maintaining the same or substantially the same vibration phase between the shell panel and the back of the shell means that the difference between the vibration phases of the shell panel and the back of the shell is within a certain range.
  • the difference between the vibration phase of the case panel and the back of the case is between -90 ° and 90 °, preferably, the difference of the vibration phase of the case panel and the back of the case is between -80 ° and 80 °, preferably,
  • the difference between the vibration phase of the housing panel and the back of the housing is between -60 ° and 60 °, preferably, the difference between the vibration phase of the housing panel and the back of the housing is between -45 ° and 45 °, and more preferably, the housing
  • the difference between the vibration phase of the panel and the back of the case is between -30 ° and 30 °, more preferably, the difference of the vibration phase of the case panel and the back of the case is between -20 ° and 20 °, and more preferably, the case The difference between the vibration phase of the panel and the back
  • the difference between the vibration phase of the panel and the back of the case is between -12 ° and 12 °. More preferably, the case The difference between the vibration phase of the panel and the back of the case is between -10 ° and 10 °, more preferably, the difference of the vibration phase between the case panel and the back of the case is between -8 ° and 8 °, and more preferably, the case The difference between the vibration phase of the panel and the back of the housing is between -6 ° and 6 °, more preferably, the housing panel The difference between the vibration phase on the back of the case is between -5 ° and 5 °. More preferably, the difference between the vibration phase on the case panel and the back of the case is between -4 ° and 4 °.
  • the difference between the case panel and the The difference between the vibration phase on the back of the housing is between -3 ° and 3 °, and more preferably, the difference between the vibration phase on the back of the housing panel and the back of the housing is between -2 ° and 2 °.
  • the difference between the vibration phases on the back of the case is between -1 ° and 1 °. Further preferably, the difference between the vibration phases on the back of the case panel and the back of the case is 0 °.
  • the speaker assembly includes a movement case 4710, a vibration panel 4721, and a transducing device 4722.
  • the movement case 4710 is consistent with the movement case 4710 (FIG. 27).
  • the transducing device 4722 is housed inside the movement case 4710 and generates vibration. The vibration of the energy conversion device 4722 will cause the movement of the movement case 4710, and thereby push the air outside the case to vibrate and generate sound leakage.
  • At least a part of the movement case 4710 is provided with at least one sound introduction hole 4730, and the sound introduction hole 4730 is used for drawing out the sound waves in the case formed by the air vibration inside the movement case 4710 to the machine.
  • the outside of the core case 4710 interferes with the leakage sound wave formed by the movement of the movement case 4710 to push the air outside the case. In some embodiments, the interference may reduce the amplitude of the leaky sound wave.
  • the vibration panel 4721 is fixedly connected to the transducing device 4722, and is synchronously vibrated by the transducing device 4722.
  • the vibration panel 4721 protrudes from the opening of the movement case 4710 and fits at least partially with human skin. The vibration is transmitted to the auditory nerve through human tissues and bones, thereby making people hear sound.
  • the transducing device 4722 and the movement case 4710 may be connected through a connecting member 4723.
  • the connecting member 4723 positions the transducing device 4722 in the movement case 4710.
  • the connecting member 4723 may be one or more independent components, and may also be provided integrally with the transducing device 4722 or the movement case 4710. In some embodiments, in order to reduce the constraint on vibration, the connecting member 4723 may be made of an elastic material.
  • the sound introduction hole 4730 may be provided at the upper part of the side wall height, for example, from the top (vibration panel) to a part of the side wall height direction 1/3 height.
  • the sound introduction hole 4730 may be opened in a side wall 4711 and / or a bottom wall 4712 of the shell.
  • the sound introduction hole 4730 is opened at an upper part and / or a lower part of the casing side wall 4711.
  • the number of the sound introduction holes provided in the side wall 4711 of the casing may be at least two, and is preferably uniformly distributed in a circular circumferential direction.
  • the number of sound introduction holes provided in the bottom wall 4712 of the housing may be at least two, and the center of the bottom wall is a circle center, and is uniformly distributed in a ring shape.
  • the sound introduction holes distributed in a ring shape may be provided at least one circle.
  • the number of sound introduction holes provided in the bottom wall 4712 of the housing may be only one, and the sound introduction holes are provided at the center of the bottom wall 4712.
  • the number there may be one or more sound guiding holes, preferably a plurality of sound holes, and they are evenly arranged.
  • the number of sounding holes per circle can be, for example, 6-8.
  • the shape of the sound introduction hole can be circular, oval, rectangular, or long.
  • a long bar generally refers to a bar shape along a straight line, curve or arc.
  • the sound introduction holes of various shapes may be the same or different on a speaker component.
  • a penetrating sound introduction hole 4730 is provided in the lower part of the side wall of the movement case 4710 (the part from the height of the side wall in the height direction from the 2/3 to the bottom).
  • the number of the sound introduction holes 4730 may be, for example, eight, and the shape may be, for example, a rectangle.
  • Each sound guiding hole 4730 is uniformly distributed in a ring shape on the side wall of the movement case 4710.
  • the movement case 4710 is cylindrical, and a sound guide hole 4730 is formed in the middle of the side wall of the movement case 4710 (a portion of the side wall height direction from 1/3 to 2/3 height). .
  • the number of the sound introduction holes 4730 may be, for example, eight, and the shape may be, for example, a rectangle.
  • Each sound guiding hole 4730 is uniformly distributed in a ring shape on the side wall of the movement case 4710.
  • a sound guide hole 4730 is formed in the circumferential direction of the bottom wall of the movement case 4710.
  • the number of the sound introduction holes 4730 may be, for example, eight, and the shape may be, for example, a rectangle.
  • Each sound guiding hole 4730 is uniformly distributed in a ring shape on the side wall of the movement case 4710.
  • penetrating sound introduction holes 4730 are respectively formed in the upper and lower portions of the side wall of the movement case 4710.
  • the sound introduction holes 4730 are evenly distributed in the upper part and the lower part of the side wall of the movement case 4710 in a ring shape.
  • the number of sound introduction holes 4730 per circle is eight.
  • the sound introduction holes 4730 provided at the upper and lower portions are symmetrically disposed with respect to the middle section of the movement case 4710.
  • the shape of each sound guiding hole 4730 is circular.
  • penetrating sound introduction holes 4730 are respectively formed in the upper and lower portions of the side wall of the movement case 4710 and the bottom wall of the movement case 4710.
  • the sound introduction holes 4730 opened on the side wall are evenly distributed in the upper part and the lower part of the side wall of the movement case 4710 in a ring shape.
  • the number of each circle is 8 and the sound introduction holes 4730 provided in the upper and lower parts are relative to the movement case 4710.
  • the middle section is symmetrically set.
  • Each sound introduction hole 4730 opened on the side wall is rectangular.
  • the shape of the sound guide holes 4730 opened on the bottom wall is an elongated shape arranged along an arc, the number of which is 4, and they are uniformly distributed in a ring shape with the center of the bottom wall as the circle center.
  • the sound introduction hole 4730 opened on the bottom wall also includes a circular through hole opened at the center.
  • penetrating sound introduction holes 4730 are opened on the upper part of the side wall of the movement case 4710, and they are uniformly distributed in a ring shape on the upper part of the side wall of the movement case 4710.
  • the number is, for example, eight.
  • the shape of 4730 is circular.
  • sound induction holes 4730 are uniformly distributed in the upper, middle, and lower portions of the side wall 4711, and are also circumferentially opened in the bottom wall 4712 of the movement case 4710. There is a circle of sound holes 4730. The pore size and the number of holes of each sound guiding hole 4730 are the same.
  • the sound guiding hole 4730 may be an unobstructed through hole.
  • a damping layer (not shown in the description of the specification) can be provided at the opening of the sound hole 4730 to adjust the phase and amplitude of the sound wave, thereby correcting the guidance The effect of sound waves inside the shell.
  • the damping layer is made of tuning paper, tuning cotton, non-woven fabric, silk, cotton, sponge, or rubber, which has a certain damping effect on sound quality transmission.
  • a damping layer is attached to the inner wall of the sound introduction hole 4730, or a damping layer is arranged on the outside of the opening of the sound introduction hole 4730.
  • the corresponding damping layers may be set to have the same phase difference between the different sounding holes 4730 between corresponding sounding holes to suppress leakage sound at the same wavelength, or set to different ones.
  • the sound holes 4730 have different phase differences between them to suppress leakage sounds of different wavelengths (that is, leakage sounds in a specific band).
  • different parts of the same sound hole 4730 are set to have the same phase (for example, using a pre-designed step or step-shaped damping layer) to suppress the leaky sound waves of the same wavelength; or, Different parts of the same sound hole 4730 are set to have different phases, so as to suppress leakage sound waves of different wavelengths.
  • the transducing device 4722 not only drives the vibration panel 4721 to vibrate, but also the transducing device 4722 itself is a vibration source, which is housed inside the movement case 4710.
  • the surface vibration of the transducing device 4722 causes the air in the casing to vibrate accordingly, forming sound waves It is inside the movement case 4710, which can be called sound in the case.
  • the vibration panel 4721 and the transducing device 4722 are positioned on the movement case 4710 through the connecting member 4723. It is inevitable that vibration will be applied to the movement case 4710.
  • the motivated case 4710 vibrates synchronously. 4710 pushes the air outside the shell to vibrate to form a leaky sound wave. Leaked sound waves propagate outward, forming a leaked sound.
  • the reduction in leakage is proportional to:
  • the S opening is the opening area of the sound hole
  • the S shell is the area of the shell that does not contact the human face.
  • P a , P b , P c , and P e are the sound pressures generated by the a-plane, b-plane, c-plane, and e-plane at any point in the shell space.
  • r is the sound damping per unit length
  • r ′ is the sound mass per unit length
  • z a is the distance from the observation point to the sound source on the a plane
  • z b is the distance from the observation point to the sound source on the b plane
  • z c is The distance from the observation point to the c-plane sound source
  • z e is the distance from the observation point to the e-plane sound source.
  • W a (x, y), W b (x, y), W c (x, y), We e (x, y), and W d (x, y) are a, b, c, e, and d, respectively
  • the sound source intensity per unit area can be derived from the following formula group (14):
  • F is the driving force converted by the transducer
  • F a , F b , F c , F d , and F e are the driving forces of a, b, c, d, and e, respectively
  • S d is the housing (d Face) Area
  • f is the viscous resistance formed by the small gap in the side wall
  • f ⁇ s (dv / dy)
  • L is the equivalent load of the face when the vibration plate acts on the face
  • ⁇ is the elastic element 2 Dissipated energy
  • k 1 and k 2 are the elastic coefficients of elastic element 1 and elastic element 2 respectively
  • ⁇ is the fluid viscosity coefficient
  • dv / dy is the velocity gradient of the fluid
  • ⁇ s is the cross-sectional area of the object (plate)
  • A is the amplitude.
  • Is the area of the sound field
  • ⁇ is a high-order quantity (derived from the incomplete symmetry of the shape of the casing
  • P a , P b , P c , and P e are all functions of position.
  • the vibration panel 221 on the movement case 210 is closely attached to the human body tissue, and its output energy is absorbed by the human body tissue, then only the d-plane pushes the air outside the shell to vibrate, forming a sound leak.
  • our goal is to make versus The size is the same, and the directions are opposite, so as to reduce the effect of leakage.
  • the phase, amplitude, and shell size of the speaker component, the vibration frequency of the transducer, the opening position, shape, number, size of the sound hole, and whether there is damping on the hole are all closely related. This allows us to achieve the purpose of suppressing sound leakage by adjusting the opening position, shape and number of sound introduction holes and / or increasing damping and / or adjusting damping materials.
  • a penetrating sound guide hole 4730 is provided on the wall surface of the housing, which can guide and propagate the sound waves inside the housing to the outside of the housing, and propagate in the air with the leaked sound waves, and interfere with each other, thereby reducing the leaked sound waves.
  • the amplitude which reduces the sound leakage. Therefore, the technical solution of the present application, through the convenient improvement of opening sound introduction holes in the housing, solves the problem of sound leakage to a certain extent without increasing the volume and weight of the speaker component.
  • the phase at which the leaky sound wave is transmitted to the target area, and the sound wave in the shell propagates to the target area through the sound introduction hole.
  • the phase difference is close to 180 degrees. With this setting, the leakage sound waves generated by the shell can be significantly reduced or even eliminated in the target area.
  • the leakage sound wave is significantly suppressed.
  • the suppressed leakage sound basically exceeds 10dB.
  • the sound leakage is reduced by more than 20dB compared with the scheme without opening the sound hole after opening the sound hole in the upper part of the side of the shell.
  • the spectacle frame may include: a spectacle frame 11, a nose pad 12, a spectacle lens 13, and a spectacle leg 15. Said temple 15 is connected.
  • the structure of the speaker assembly is shown in FIG. 47A and FIG. 47B.
  • the speaker assembly includes a vibration unit and a transducing device 4722.
  • the vibration unit includes a movement case 4710, a vibration panel 4721, and a transducing device 4722 is located inside and connected to the vibration unit.
  • the vibration unit includes the panel and the vibration transmission layer described above, and the contact panel 4721 is a surface where the vibration unit 1202 is in contact with the user, and is preferably an outer surface of the vibration transmission layer.
  • connection component fixes the speaker component to a specific part of the user (for example, the head), and provides a clamping force between the vibration unit and the user.
  • the touch panel 4721 is connected to the transducing device 4722 and keeps contact with the user, and transmits sound to the user through vibration.
  • a person of ordinary skill in the art may select connection components having different shapes and structures according to actual conditions.
  • the clamping force of the temple 15 not only affects the efficiency of sound transmission, but also affects the user's sound experience in the bass frequency range.
  • the clamping force referred to here is the pressure between the contact panel 4721 and the user.
  • the clamping force is between 0.1N-5N, more preferably, the clamping force is between 0.1N-4N, and even more preferably , The clamping force is between 0.2N-3N, still more preferably, the clamping force is between 0.2N-1.5N, and even more preferably, the clamping force is between 0.3N-1.5N.
  • 49 and 50 are vibration response curves of the bone conduction speaker assembly under different pressures between the contact surface and the user in one embodiment.
  • the clamping force is lower than a certain threshold, it is not conducive to the transmission of high-frequency vibration.
  • the intermediate frequency and high frequency part of the vibration (sound) received by the wearer is significantly less than the clamping force of 0.2N
  • the vibration (sound) received at 1.5N that is, in the sound quality, when the clamping force is 0.1N, the performance of the intermediate frequency and high frequency part is weaker than the performance of the clamping force at 0.2N-1.5N.
  • the pressure between the contact surface and the user is kept in a proper range.
  • the pressure between the contact surface and the user is greater than a certain threshold, preferably, the threshold is 0.1N, more preferably, the threshold is 0.2N, even more preferably, the threshold is 0.3N, and even more preferably, the threshold is 0.5N.
  • the pressure between the contact surface and the user is less than another threshold.
  • the threshold is 5.0N, more preferably, the threshold is 4N, even more preferably, the threshold is 3N, and even more preferably, the threshold is 1.5N. .
  • the speaker components on the glasses include an earphone core 102 and a movement case 108, such as a bone conduction speaker component, an air conduction speaker component, and the like.
  • bone conduction is a sound transmission method, which converts sound into mechanical vibrations of different frequencies, and transmits sound waves through the skull, bone labyrinth, inner ear lymph fluid transmission, spiral, auditory nerve, and auditory center.
  • the transmission relationship K2 between the sensing terminal 1102 and the vibration unit 1103 also affects the frequency response of the bone conduction system.
  • the sound heard by the human ear depends on the energy received by the cochlea. This energy is affected by different physical quantities during the transmission process and can be expressed by the following formula:
  • P is proportional to the energy received by the cochlea
  • S is the area where the contact surface 502a is in contact with the human face
  • ⁇ is a dimensional conversion coefficient
  • f (a, R) represents the acceleration a at the contact surface and the contact surface and The effect of skin contact tightness R on energy transfer
  • L is the impedance of mechanical wave transmission at any contact point, that is, the transmission impedance per unit area.
  • the transmission of sound is affected by the transmission impedance L.
  • the vibration transmission efficiency of the bone conduction system is related to L.
  • the frequency response curve of the bone conduction system is the superposition of the frequency response curve of each point on the contact surface.
  • Factors that affect impedance include the size, shape, roughness, force distribution, or force distribution of the energy transfer area.
  • the sound transmission effect is changed by changing the structure and shape of the vibration unit, thereby changing the sound quality of the bone conduction speaker component.
  • changing the corresponding physical characteristics of the contact surface of the vibration unit can achieve the effect of changing the sound transmission.
  • FIG. 51 is a schematic diagram of a contact surface of a vibration unit of a speaker assembly according to an embodiment of the present application.
  • the contact surface of the vibration unit of the speaker assembly in FIG. 51 is equivalent to the outer wall of the functional module in FIG. 1 in contact with the human body.
  • the embodiment is a specific embodiment of the transmission relationship K2 between the sensing terminal 1102 and the vibration unit 1103.
  • a carefully designed surface of a contact surface is provided with a gradient structure, and the gradient structure refers to an area where the surface of the contact surface has a high change.
  • the contact surface mentioned here is the side of the movement case close to the user.
  • the gradient structure can be a protrusion / concave or stepped structure on the outside of the contact surface (the side that is in contact with the user), or a protrusion / inside of the contact surface (the side facing away from the user). Sunken or stepped structures.
  • the contact surface of the vibration unit can be attached to any position of the user's head, for example, the top of the head, forehead, cheeks, hips, auricles, back of auricles, and the like. As shown in FIG. 51, the contact surface 1601 (outside of the contact surface) is convex or concave (not shown in FIG. 51).
  • the convex or concave portion is in contact with the user, and the pressure when the contact surface 1601 contacts the human face is changed.
  • the raised part is in closer contact with the human face, and the skin and subcutaneous tissue that comes into contact with it are more stressed than other parts; correspondingly, the skin and subcutaneous tissue that are in contact with the concave part are subjected to less pressure than other parts.
  • the clamping force on the skin at three points A, B, and C is FC> FA> FB.
  • the clamping force of the point B is 0, that is, the point B is not in contact with the skin.
  • Human skin and subcutaneous tissue show different impedance and response to sound under different pressures.
  • the impedance ratio is small in the part with high pressure, which has a high-pass filtering characteristic for sound waves, and the impedance ratio is large in the part with a low pressure, which has a low-pass filtering characteristic.
  • the impedance characteristics L of the various parts of the contact surface 1601 are different. According to formula (16), different parts respond differently to the frequency of sound transmission.
  • the effect of sound transmission through the full contact surface is equivalent to the sum of the sound transmission of each part.
  • the sound is transmitted to the brain.
  • the material and thickness of the contact surface 1601 will also affect the sound transmission, thereby affecting the sound quality effect. For example, when the material of the contact surface is soft, the sound wave transmission effect in the low frequency range is better than that in the high frequency range. When the material of the contact surface is hard, the sound wave transmission effect in the high frequency range is better than that in the low frequency range.
  • Figure 52 shows the frequency response of a speaker component with different contact surfaces.
  • the dotted line corresponds to the frequency response of a speaker component with a convex structure on the contact surface
  • the solid line corresponds to the frequency response of a speaker component without a convex structure on the contact surface.
  • the vibration of the bumpless structure is significantly weakened compared to the vibration of the bumpy structure, forming a "deep pit" on the frequency response curve, which is expressed as Less than ideal frequency response, which affects the sound quality of the speaker components.
  • FIG. 52 is only an explanation for a specific example.
  • various modifications and modifications can be made to the structure and components of the speaker component. Change to obtain different frequency response effects.
  • the shape and structure of the contact surface 1601 is not limited to the above description, and may meet other specific requirements.
  • the convex or concave portions on the contact surface may be distributed on the edge of the contact surface, or may be distributed in the middle of the contact surface.
  • the contact surface may include one or more convex or concave portions, and the convex and concave portions may be distributed on the contact surface at the same time.
  • the material of the convex or concave portion of the contact surface may be other materials than the material of the contact surface, which may be flexible, rigid, or a material more suitable for generating a specific pressure gradient; it may be a memory material, or It is a non-memory material; it can be a single material or a composite material.
  • the structural graphics of the convex or concave part of the contact surface include, but are not limited to, axisymmetric graphics, center-symmetric graphics, rotationally-symmetric graphics, and asymmetric graphics.
  • the structure pattern of the raised or recessed part of the contact surface may be one kind of pattern, or two or more kinds of patterns in combination.
  • the contact surface includes, but is not limited to, a certain degree of smoothness, roughness, and waviness.
  • the position distribution of the convex or concave portion of the contact surface includes, but is not limited to, axisymmetric, center-symmetric, rotationally-symmetric, and asymmetric distribution.
  • the convex or concave part of the contact surface may be at the edge of the contact surface or may be distributed inside the contact surface.
  • FIG. 53 is a schematic diagram of a contact surface of a vibration unit of a speaker assembly provided by some embodiments of the present application. As shown in FIG. 53, various exemplary contact surface structures are shown.
  • 1704 shows an example in which the contact surface includes a plurality of protrusions with similar shapes and structures.
  • the protrusions can be made of the same or similar materials as the other parts of the panel, or they can be made of different materials from the other parts.
  • the protrusion may be composed of a memory material and a vibration transmitting layer material, wherein the proportion of the memory material is not less than 10%, and preferably, the proportion of the memory material in the protrusion is not less than 50%.
  • the area of a single protrusion occupies 1% -80% of the total area, preferably, the proportion of the total area is 5% -70%, and more preferably, the proportion of the total area is 8% -40%.
  • the area of all the protrusions collectively accounts for 5% to 80% of the total area, and preferably, the ratio is 10% to 60%.
  • the shape of the protrusions can be circular, oval, triangular, rectangular, trapezoidal, irregular polygon, or other similar graphics.
  • the structure of the protrusions can be symmetrical or asymmetric, and the location distribution of the protrusions can also be Symmetric or asymmetric, the number of raised portions may be one or more, the height of the raised portions may be the same or different, and the height and distribution of the raised portions may form a certain gradient.
  • Shown at 1705 in the figure is an example in which the structure of the convex portion of the contact surface is a combination of two or more graphics, and the number of protrusions of different graphics may be one or more.
  • the two or more convex shapes may be any two or more combinations of circles, ovals, triangles, rectangles, trapezoids, irregular polygons, or other similar figures.
  • the material, number, area, and symmetry of the protrusions are similar to 1704 in the figure.
  • 1706 is an example in which convex portions of the contact surface are distributed on the edges and inside of the contact surface, and the number of convex portions is not limited to that shown in the figure.
  • the number of protrusions at the edge of the contact surface accounts for 1% -80% of all protrusions, preferably, the ratio is 5% -70%, more preferably, the ratio is 10% -50%, and even more preferably, the The proportion is 30% -40%.
  • the material, number, area, shape, and symmetry of the protrusions are similar to 1704 in the figure.
  • 1707 is a structural pattern of the concave portion of the contact surface.
  • the structure of the concave portion can be symmetrical or asymmetric, the position distribution of the concave portion can also be symmetrical or asymmetric, and the number of concave portions can be One or more, the shapes of the concave portions may be the same or different, and the concave portions may be hollow.
  • the area of a single recess occupies 1% -80% of the total area, preferably, the proportion of the total area is 5% -70%, and more preferably, the proportion of the total area is 8% -40%.
  • the total area of all the recesses accounts for 5% to 80% of the total area, and preferably, the ratio is 10% to 60%.
  • the concave shape may be a circle, an oval, a triangle, a rectangle, a trapezoid, an irregular polygon, or other similar graphics.
  • 1708 is an example in which both the convex portion and the concave portion exist on the contact surface, and the number of convex and concave portions is not limited to one or more.
  • the ratio of the number of depressions to the number of protrusions is 0.1-100, preferably, the ratio is 1-80, more preferably, the ratio is 5-60, and even more preferably, the ratio is 10-20.
  • the single raised / recessed material, area, shape, symmetry, etc. are similar to those in FIG. 5104.
  • the corrugation is formed by two or more protrusions / recesses or a combination of two.
  • the distance between adjacent protrusions / recesses is equal, and more preferably, the distance between the protrusions / recesses is equal. arrangement.
  • 1710 in the figure is an example of a large area of protrusions on the contact surface.
  • the raised area accounts for 30% -80% of the total area of the contact surface.
  • a part of the edge of the protrusion and a part of the edge of the contact surface are substantially in contact with each other.
  • 1711 is a contact surface with a first bump having a larger area and a second bump having a smaller area on the first bump.
  • the protrusions with a larger area account for 30% -80% of the total area of the contact surface, and the protrusions with a smaller area account for 1% -30% of the total area of the contact surface.
  • the proportion is 5% -20%.
  • the smaller area occupies 5% -80% of the larger area, and preferably, the ratio is 10% -30%.
  • the side of the movement case close to the user is composed of a panel and a vibration transmission layer.
  • Fig. 54 is a front view and a side view of a panel connected to a vibration transmitting layer.
  • the vibration transmitting layer may be provided at an outer surface of a side wall of the movement case that contacts the human body.
  • the vibration transmission layer in this embodiment is a specific embodiment of changing the physical characteristics of the contact surface of the vibration unit to change the sound transmission effect. Different areas on the vibration transmission layer have different transmission effects on vibration. For example, there are a first contact surface region and a second contact surface region on the vibration transmission layer.
  • the first contact surface region is not attached to the panel, and the second contact surface region is attached to the panel; more preferably, the vibration transmission layer
  • the clamping force on the first contact surface area is smaller than the clamping force on the second contact surface area (here, the clamping force refers to the contact surface between the contact surface of the vibration unit and the user Pressure); further preferably, the first contact surface area is not in direct contact with the user, and the second contact surface area is in direct contact with the user and transmits vibration.
  • the area of the first contact area is different from the area of the second contact area.
  • the area of the first contact area is smaller than the area of the second contact area. More preferably, the area of the first contact area is small.
  • the outer surface of the vibration transmission layer (that is, the surface facing the user) may be flat or uneven, preferably, the first contact area and the second contact surface
  • the regions are not on the same plane; more preferably, the second contact surface region is higher than the first contact surface region; further preferably, the second contact surface region and the first contact surface region constitute a stepped structure; even more preferably, the first contact
  • the surface area is in contact with the user, and the second contact surface area is not in contact with the user.
  • the constituent materials of the first contact surface area and the second contact surface area may be the same or different, and may be a combination of one or more of the vibration transmission layer materials described above.
  • the vibration transmission layer may not be necessary, the panel may directly contact the user, and different contact surface regions may be provided on the panel.
  • the different contact surface regions have similarities to the first and second contact surface regions described above. Nature.
  • a third contact surface area may be provided on the contact surface, and a structure different from the first contact surface area and the second contact surface area may be provided on the third contact surface area, and these structures can reduce the shell vibration and suppress leakage. Sound, improve the frequency response curve of the vibration unit and other aspects to obtain a certain effect.
  • the panel 501 and the vibration transmitting layer 503 are bonded by glue 502, the glue bonding points are located at both ends of the panel 501, and the panel 501 is located between the vibration transmitting layer 503 and the casing 504.
  • the projection of the panel 501 on the vibration transmission layer 503 is a first contact surface area, and a region located around the first contact surface area is a second contact surface area.
  • the energy conversion device includes a magnetic circuit system composed of a magnetically permeable plate 2310, a magnet 2311, and a magnetically permeable plate 2312, a vibration plate 2314, a coil 2315, a first vibration transmitting plate 2316, a first Second vibration piece 2317 and washer 2318.
  • the panel 2313 protrudes the housing 2319 and the vibrating piece 2314 through glue, and the first vibration transmitting piece 2316 connects and fixes the transducer to the housing 2319 to form a suspension structure.
  • a vibration transmission layer 2320 (such as, but not limited to, silica gel) is added to the panel 2313, and the vibration transmission layer 2320 can generate a certain deformation to adapt to the shape of the skin.
  • the vibration transmitting layer 2320 is equivalent to the vibration transmitting plate 214 and the vibration transmitting layer 215.
  • a portion of the vibration transmission layer 2320 that is in contact with the panel 2313 is higher than a portion of the vibration transmission layer 2320 that is not in contact with the panel 2313, forming a stepped structure.
  • One or more small holes 2321 are designed in a portion of the vibration transmission layer 2320 that is not in contact with the panel 2313 (a portion of the vibration transmission layer 2320 in FIG. 56 that does not protrude).
  • Designing small holes in the vibration transmission layer can reduce sound leakage: the connection between the panel 2313 and the housing 2319 through the vibration transmission layer 2320 is weakened, and the vibration transmitted from the panel 2313 to the housing 2319 through the vibration transmission layer 2320 is reduced, thereby reducing the vibration of the housing 2319
  • the area of the non-protruding part of the vibration transmission layer 2320 is reduced by providing small holes 2321, and the air that can be driven is reduced, and the sound leakage caused by air vibration is reduced; the small hole 2321 is provided for the non-protruding part of the vibration transmission layer 2320. After that, the air vibration in the casing is guided out of the casing, and the air vibration caused by the casing 2319 cancels each other out, and reduces the sound leakage.
  • the small hole 2321 can lead out the sound wave in the composite vibration device casing and superimpose it with the sound leakage sound wave to reduce the sound leakage, the small hole can also be called a sound hole.
  • the panel protrudes from the speaker component shell and the first vibration transmitting sheet is used to connect the panel to the speaker component shell, the degree of coupling between the panel and the shell is greatly reduced, and the first The vibration-transmitting sheet can provide certain deformation, so that the panel has a higher degree of freedom when it is attached to the user, and can better adapt to complex bonding surfaces.
  • the first vibration-transmitting sheet can make the panel generate relative to the housing. Angled tilt. Preferably, the inclination angle does not exceed 5 °.
  • the vibration efficiency of the speaker assembly varies with the bonding state.
  • Good bonding state has higher vibration transmission efficiency.
  • the thick line shows the vibration transmission efficiency in the state of good bonding
  • the thin line shows the vibration transmission efficiency in the state of poor bonding. It can be seen that the vibration transmission efficiency of the better bonding state is more high.
  • FIG. 58 is a structural diagram of a vibration generating part of a speaker assembly provided by some embodiments of the present application.
  • the energy conversion device includes a magnetic circuit system composed of a magnetically permeable plate 2520, a magnet 2511, and a magnetically permeable plate 2512, a vibration plate 2514, a coil 2515, and a first The vibration transmitting plate 2516, the second vibration transmitting plate 2517, and the washer 2518.
  • the panel 2513 protrudes from the casing 2519, and is bonded to the vibration plate 2514 by glue.
  • the first vibration transmitting plate 2516 connects and fixes the transducer to the casing 2519 to form a suspension structure.
  • a surrounding edge is added to the edge of the shell.
  • the surrounding edge can make the force distribution more uniform and increase the wearing of the speaker component. Comfort.
  • the force of the skin on the panel 2513 reduces the distance d between the panel 2513 and the surrounding edge 2510.
  • FIG. 59 is an exploded structural view of a speaker provided according to some embodiments of the present application
  • FIG. 60 is a partial cross-sectional view of the speaker provided according to some embodiments of the present application
  • FIG. 61 is an enlarged view of part A in FIG. 60.
  • the speaker may include a component body, and a cavity 1911 is formed inside the component body. It should be noted that the component body may be located in the temple 15 (FIG. 7) in the foregoing embodiment. In some embodiments, at least two dual microphones may also be disposed in the temple 15.
  • auxiliary function module 104 may be located in the movement case 108 or in the fixing mechanism 110, for example, in the temple 15 (FIG. 7).
  • the component body may be a structure composed of at least two parts; it may also be a structure manufactured by an integral molding technology, such as a structure integrally formed by an integral injection molding process.
  • the space shape of the component body includes, but is not limited to, a cuboid, a cube, an ellipsoid, a sphere, a cone, and other irregular space shapes.
  • the material of the component body includes, but is not limited to, one or more combinations of plastic, silicone, rubber, plastic, glass, ceramic, alloy, stainless steel, and the like.
  • the component body may include a receiving body 1910 and a cover 1920; the inside of the receiving body 1920 is hollow to form the cavity 1911, and the receiving body 1910 is provided with a communication with the cavity 1911.
  • the opening 1912 covers the opening 1912 and closes the cavity 1911.
  • the cavity 1911 may be an internal cavity formed when two or more components are assembled together, or may be an internal cavity formed according to the shape of a molding die during the integral molding process.
  • the cavity 1911 may be used to receive a plurality of electronic components and circuit structures of the speaker.
  • the component body may be used to seal the cavity 1911, and the cavity 1911 may be completely sealed by the component body, or may be sealed by the component body and other accessories on the component body.
  • the receiving body 1910 may be at least a part of a speaker.
  • the accommodating body 1910 in this embodiment may specifically be a structure for containing, for example, a circuit board, a battery 52, and electronic components in the speaker, and may be, for example, the whole or a part of a housing of the speaker.
  • the accommodating body 1910 is provided with a cavity 1911 having an opening 1912 for accommodating the above-mentioned circuit board, battery, and electronic components.
  • the opening 1912 is in communication with the cavity and is used for the mounting and unloading channels of the circuit board, the battery, and the electronic components.
  • the number of the openings 1912 may be one or plural, which is not limited herein.
  • the shape of the cover 1920 is at least partially matched with the opening 1912, so that the cover 1920 is placed on the opening 1912 to seal the cavity 1911.
  • the material of the cover 1920 may be different from the housing body 1910, or at least partially the same.
  • the cover body 1920 includes a rigid support 1921 and a soft cover layer 1922.
  • the hard support 1921 is used for mechanical connection with the receiving body 1910, and the soft cover layer 1922 is integrally injection-molded on the surface of the hard support 1921, and is used as a cavity after the hard support 1921 is connected to the receiving body 1910.
  • 1911 provides a seal.
  • the material of the rigid support 1921 may be hard plastic, and the material of the soft cover layer 1922 may be soft silicone or rubber.
  • the shape of the rigid bracket 1921 facing the receiving body 1910 can be matched with the opening 1912, and fixed to the opening 1912 of the cavity 1911 by means of plugging, buckling, etc., so as to be mechanically connected with the receiving body 1910.
  • the joint between the rigid support 1921 and the accommodating body 1910 is easy to form a gap to reduce the sealing of the cavity 1911.
  • the soft cover layer 1922 is integrally injection-molded and formed on the outer surface of the rigid support 1921 away from the accommodating body 1910. , Can further cover the connection between the rigid support 121 and the accommodating body 1910, so as to achieve the sealing of the cavity 1911.
  • the cover 1920 includes a hard support 1921 and a soft cover 1922 integrally injection-molded on the surface of the hard support 1921.
  • the hard support 1921 is mechanically connected to the receiving body 1910.
  • the soft cover 1922 further After the hard support 1921 is connected to the accommodating body 1910, a seal is provided for the cavity 1911, and the soft cover layer 1922 is more conducive to fit the gap between the hard support 1921 and the accommodating body 1910 to further improve the electronic component. Sealability, thereby improving the waterproof effect of electronic components.
  • the rigid bracket 1921 and the soft cover layer 1922 are integrally injection molded, which can simplify the assembly process of the electronic components.
  • the rigid support 1921 includes an inserting portion 19211 and a covering portion 19212.
  • the covering portion 19212 is disposed on the opening 1912.
  • the inserting portion 19211 is disposed on one side of the covering portion 19212 and extends along the inner wall of the cavity 1911. Inside the cavity 1911 to fix the covering portion 19212 on the opening 1912.
  • the insertion portion 19211 may not be inserted through the inner wall of the cavity 1911.
  • the inside of the cavity 1911 may further be provided with an insertion portion that matches the shape of the insertion portion 19211 of the rigid bracket 1921.
  • the insertion portion 19211 can be inserted into the insertion portion, and the insertion portion is fixed inside the cavity 1911.
  • the shape of the insertion portion 19211 is a cylindrical body.
  • the insertion portion may be a circular ring that can surround the cylindrical insertion portion.
  • the inner diameter of the circular insertion portion may be smaller than that of the cylindrical insertion portion.
  • the outer diameter of the rigid support 1921 allows the rigid support 1921 to be stably connected to the cavity 1911 when the insertion portion 19211 is inserted into the insertion portion.
  • other plug-in methods can also be used, as long as the insertion portion 19211 can be inserted into the cavity 1911 and fixed to the cavity 1911.
  • the covering portion 19212 is disposed on a side of the insertion portion 19211 facing away from the cavity 1911, and covers the opening 1912 after the insertion portion 19211 is inserted into the cavity 1911.
  • the covering portion 19212 may be a complete structure, or some holes may be further provided on the covering portion 1921 to achieve a certain function.
  • FIG. 62 is a cross-sectional view of the speaker of the present application in the combined state along the A-A axis in FIG. 59.
  • the receiving body 1910 includes an opening edge 1913 for defining the opening 1912, the covering portion 19212 is pressed against the inner region 19131 of the opening edge 1913 near the opening 1912, and the soft cover layer 1922 covers the covering portion 19212 away from
  • the outer surface of the main body 1910 is accommodated and pressed against the outer region 19132 at the periphery of the inner region 19131 of the opening edge 1913 to achieve sealing with the opening edge 1913.
  • the inner region 19131 and the outer region 19132 of the opening edge 1913 both belong to the opening edge 1913 and are not other regions than the opening edge 1913.
  • the inner region 19131 of the opening edge 1913 is a region near the opening 1912 of the opening edge 1913, and the outer region 19132 of the opening edge 1913 is a region of the opening edge 1913 away from the opening 1912.
  • the covering portion 19212 of the rigid support 1921 is pressed against the inner region 19131 of the opening edge 1913 near the opening 1912, so that the covering portion 19212 can initially seal the opening edge 1913.
  • the housing body 1910 and the rigid support 1921 are both hard materials, the connection between the two and the further covering of the covering portion 19212 cannot achieve a good sealing effect.
  • the covering portion 19212 is pressed against the opening. An end of the edge 1913 that is far from the opening 1912 is likely to generate a gap with the opening edge 1913, and further penetrates the cavity 1911 through the gap, thereby reducing the sealability.
  • the soft cover layer 1922 covers the outer surface of the covering portion 19212 away from the accommodating body 1910, and is further pressed against the outer region 19132 on the periphery of the inner region 19131 of the opening edge 1913, so that the hard
  • the gap between the covering portion 19212 and the opening edge 1913 of the quality support 1921 is further covered, and the soft cover layer 1922 is a soft material, which can further improve the sealing effect of the speaker and make the speaker more waterproof.
  • FIG. 63 is an enlarged view of the structure at B in FIG. 62.
  • the periphery of the covering portion 19212 covers the inner region 19131 of the opening edge 1913, and The inner region 19131 of the opening edge 1913 is in contact; and the soft cover layer 1922 is disposed on the side of the covering portion 19212 away from the housing body 1910, so that the covering portion 19212 of the inner region 19131 of the opening edge 1913 is sandwiched between the opening edge 1913 Between the inner region 19131 and the soft cover layer 1922, the soft cover layer 1922 further extends in a direction away from the opening 1912 and a direction toward the opening edge 1913 of the covering portion 19212 until it contacts the outer region 19132 of the opening edge 1913, so that The contact end surface of the covering portion 1912 and the opening edge 1913 and the contact end surface of the soft cover layer 1922 and the opening edge 1913 are flush with each other, and are formed on the inner region 19131
  • FIG. 64 is a partial cross-sectional view of a speaker embodiment of the present application.
  • the soft cover layer 1922 after the soft cover layer 1922 extends to contact the outer region 19132 of the opening edge 1913, it further extends to the inner region 19131 of the opening edge 1913 along the area between the covering portion 19212 and the opening edge 1913.
  • the inside area 19131 of the opening edge 1913 and the covering portion 19212 are pressed by the covering portion 19212 on the inside area 19131 of the opening edge 1913 to form an "opening edge 1913-a soft cover layer 1922-a covering portion 19212-a soft cover” Layer 1922 "structure.
  • the soft cover layer 1922 is further extended between the hard support 1921 and the opening edge 1913 on the basis of the covering portion 19212 of the hard support 1921, thereby further improving the distance between the cavity 1911 and the cover 1920. Seal, and further improve the waterproof effect of the speaker.
  • the speaker further includes a circuit component 1930 disposed in the cavity 1911, and the circuit component 1930 is provided with a switch 19311.
  • the circuit component 1930 may include a first circuit board 1931, and the switch 19311 is disposed on an outer side of the first circuit board 1931 facing the opening 1912 of the cavity 1911.
  • the number of the switches 19311 may be one or multiple. When the number of the switches 19311 is plural, the switches 1911 may be disposed on the first circuit board 1931 at intervals.
  • the first circuit board 1931 is equivalent to the first branch circuit board in the foregoing embodiment.
  • the hard bracket 1921 is provided with a switch hole 19213 corresponding to the switch 19311, the soft cover layer 1922 further covers the switch hole 19213, and a pressing portion 19221 is provided at a position corresponding to the switch hole 19213.
  • the switch hole 19213 extends toward the inside of the cavity 1911.
  • the pressing portion 19221 provided on the soft cover layer 1922 is formed by protruding the side of the soft cover layer 1922 toward the bracket 1921 toward the switch hole 19213 and the switch 19311.
  • the shape of the pressing portion 19221 matches the switch hole 19213. Therefore, when the corresponding position of the soft cover layer 1922 is pressed, the pressing portion 19221 can pass through the switch hole 19213 to reach the corresponding switch 19311 on the first circuit board 1931.
  • the length of the pressing portion 19221 along the direction of the switch 19311 can be set such that the switch 19311 is not pressed when the position corresponding to the soft cover layer 1922 is not pressed, and the corresponding switch 19311 can be pressed when pressed.
  • the position of the soft cover layer 1922 corresponding to the pressing portion 19221 is further protruded to form a protruding pressing portion 19222 toward the side facing away from the hard support 1921, so that the user can determine the position of the switch 19311. , And by pressing the corresponding pressing portion 19222, the starting circuit component 1930 performs a corresponding function.
  • the auxiliary function module 204 is configured to receive auxiliary signals and perform auxiliary functions.
  • the auxiliary function module 204 may be a module for performing an auxiliary function different from a headphone core for receiving an auxiliary signal.
  • the auxiliary function module 204 can implement one or more functions of an image function, a voice function, an auxiliary control function, and a switch control function; in this application, converting an audio signal into a sound signal may be considered as the main function of the speaker , And other functions that are different from the main function can be considered as auxiliary functions of the speaker.
  • the auxiliary function of the speaker may include receiving a user and / or an ambient sound through a microphone, and controlling a playback process of the sound signal through a key, and the like.
  • auxiliary function module may include at least a first auxiliary function module and a second auxiliary function module.
  • a first auxiliary function module may be disposed on the main circuit board 445, and a second auxiliary function module may be disposed on the first branch circuit board 442.
  • auxiliary function module may further include a third auxiliary function module, and the third auxiliary function module is disposed on the second branch circuit board.
  • the second auxiliary function module may be a first microphone element 19312, and the third auxiliary function module may be a second microphone element 19321.
  • the first microphone element 19312 and the second microphone element 19321 can both be MEMS (micro-electromechanical system) microphones, which have a small working current, relatively stable performance, and high voice quality.
  • first microphone element 19312 and the second microphone element 19321 are equivalent to the microphone 432 in the foregoing embodiment.
  • the first microphone and the second microphone are distributed in the speaker in a specific manner, so that a main sound source (for example, a person's mouth) is located at the second microphone element 19321 and points to the The direction of the first microphone element 19312.
  • a main sound source for example, a person's mouth
  • the first microphone element 19312 is disposed on a side of the first circuit board 1931 facing the cover 1920
  • the second microphone element 19321 is disposed on the second circuit board 132 facing the accommodation One side of the body.
  • the distance between the mouth (the main sound source) relative to the first microphone element 19312 and the second microphone element 1321 is larger than other sound sources (for example, noise sources) in the environment relative to the first microphone element 19312 and
  • the distance between the second microphone element 1321 is short, and the mouth can be considered as the near-field sound source of the first microphone element 19312 and the second microphone element 19321.
  • the size of the sound received by the two microphone elements is related to the distance from the sound source.
  • the first microphone element 1312 Since the first microphone element 1312 is closer to the main sound source, the first microphone element 19312 will receive a larger audio signal V J1 ; the second microphone element 1321 is far away from the main sound source, so the second microphone element 1321 will receive To the smaller audio signal V J2 . That is, V J1 > V J2 .
  • the noise source in the environment is relatively far away from the first microphone element 19312 and the second microphone element 19321, the noise source in the environment can be considered as the far-field sound source of the first microphone element 19312 and the second microphone element 19321.
  • the noise signals received by the two sets of microphone elements are similar, that is, V Y1 ⁇ V Y2 .
  • the total sound signal received by the first microphone element 19312 is:
  • V 1 V J1 + V Y1 (17)
  • the total sound signal received by the second group of microphone elements is:
  • V 2 V J2 + V Y2 (18)
  • a differential processing may be performed on the total sound signal of the first microphone element 1312 and the total sound signal of the second microphone element 19321.
  • the form of difference processing can be as follows:
  • the difference result of the signal obtained in formula (19) should be made as large as possible, namely V J1 >> V J2 .
  • this effect can be achieved by making the installation position of the first microphone element 19312 as close as possible to the main sound source (such as a person's mouth); It may be far away from the main sound source (such as a person's mouth); isolate the two microphone spaces; place a sound blocking member between the two microphone elements, etc. It should be noted that all the above methods can achieve the effect of improving the quality of the audio signal, and these methods can be used alone or in combination.
  • the first circuit board 1931 and the first microphone element 19312 mounted thereon may be set to be inclined of.
  • the second circuit board 132 and the second microphone element 19321 installed thereon can be set to be inclined for flexible adjustment of the required installation distance.
  • a corresponding sound guide channel and sound blocking member can be set in each microphone element installation area.
  • the second circuit board 1932 is equivalent to the second branch circuit board in the foregoing embodiment.
  • the first circuit board 1931 includes a first microphone element 19312. Specifically, the first circuit board 1931 is disposed facing the cover 1920, and the first microphone element 19312 is disposed on a side of the first circuit board 1931 facing the cover 1920. For example, the first microphone element 19312 may be disposed on the first circuit board 1931 at a distance from the switch 19311 in the above embodiment. Specifically, the first microphone element 19312 is configured to receive a sound signal from outside the speaker, and convert the sound signal into an electrical signal for analysis and processing.
  • a bracket 1921 is provided corresponding to the first microphone element 19312, and a soft cover layer 1922 is provided with a first sound guide hole 19223 corresponding to the first microphone hole 19214.
  • the first sound guide hole 19223 may be provided corresponding to the first microphone element 19312.
  • the first sound guide hole 19223 is provided on the cover 1920, one end of the first sound guide hole 19223 is connected to the first microphone hole 19214 on the cover 1920, and the other end of the first sound guide hole 19223 faces
  • the first microphone element 19312 can shorten the guiding distance and improve the guiding effect.
  • the first circuit board 1931 faces the cover 1920 in a manner parallel or inclined to the cover 1920, and the first sound guide hole 19223 is perpendicular or inclined to a surface of the cover 1920.
  • the depth direction of the opening 1912 may be vertical or inclined with respect to the bottom of the receiving body 1910.
  • the cover 1920 is horizontal with respect to the accommodating body 1910 when it is closed; when the opening 1912 is inclined, the cover 1920 is closed with respect to the accommodating body. 1910 is inclined.
  • the inclination is inclined toward the side of the mouth of the human body. This method can make the first sound guide hole 19223 directly face the mouth or face of the person, and improve the effect of the microphone component acquiring the sound of the main sound source.
  • the angle between the plane where the opening 1912 is located and the plane where the housing body is located in the width direction is within a range of 10 ° to 30 °, so that the first sound guide hole 19223 further faces the mouth area of a person.
  • the included angle between the plane where the opening 1912 is located and the plane where the housing body is located in the width direction may be any angle within the above range, such as 10 °, 15 °, 20 °, 23 °, 27 °, 30 ° and so on are not limited here.
  • the first sound guide hole 19223 is provided through the soft cover layer 1922.
  • the first sound guide hole 19223 is perpendicular to the cover 1920
  • the first sound guide hole 19223 is vertical; when the opening 1912 is vertical and the first circuit board 1931 is inclined to the cover 1920, the first sound guide hole 19223 is inclined to the cover 1920, that is, The first sound guide hole 19223 is inclined; when the opening 1912 is inclined and the first circuit board 1931 is parallel to the cover 1920, the first sound guide hole 19223 is disposed perpendicular to the cover 1920, that is, the first sound guide hole 19223 is inclined; when the opening 1912 is inclined and the first circuit board 1931 is inclined to the cover 1920, the first sound guide hole 19223 may also be provided inclined to the cover 1920, that is, the first sound guide hole 19223 may be Vertical or inclined.
  • an included angle between the first circuit board 1931 and a plane where the cover 1920 is located is in a range of 5 ° -20 °.
  • the included angle between the first circuit board 1931 and the plane where the cover 1920 is located may be within an included angle range, such as 5 ° Any angle of, 8 °, 10 °, 15 °, 20 ° is not specifically limited here.
  • the first sound guide hole 19223 corresponds to the first microphone hole 19214 on the support 1921, and then the first microphone element 19312 is communicated with the outside of the speaker, so that sound outside the speaker can pass through the first sound hole 19223 and the first The microphone hole 19214 is received by the first microphone element 19312.
  • the central axis of the first sound guiding hole 19223 coincides with the main axis of the sound receiving area 193121 of the first microphone element 19312.
  • the sound receiving area 193121 of the first microphone element 19312 refers to a region (eg, a diaphragm) on the first microphone element 19312 that receives sound waves.
  • the sound of the main sound source is collected by the first microphone hole 19214, and can be directly passed through the first sound guide hole 19223 Guide to the receiving area 193121 of the first microphone element 19312 to further reduce the sound propagation path, which can prevent the main sound source from repeatedly transmitting in the cavity to cause loss and echo, and can also prevent the main sound source from passing into the cavity through the channel in the cavity.
  • the cover body 1920 is arranged in a strip shape, wherein the main axis of the first sound guide hole 19223 and the main axis of the sound receiving area 193121 of the first microphone element 19312 are in the width direction of the cover body 1920. coincide.
  • the main axis of the sound receiving area 193121 of the first microphone element 19312 refers to the main axis of the sound receiving area 193121 of the first microphone element 19312 in the width direction of the cover 1920.
  • the first guide The main axis of the sound hole 1223 is shown as the axis m in FIG. 65, and the axis n and the axis m coincide.
  • the shape of the first sound guide hole 19223 may be any shape, as long as the sound from the outside of the speaker can be input.
  • the first sound guide hole 19223 is a circular hole with a relatively small size, and is disposed in a region of the cover 1920 corresponding to the first microphone hole 19214.
  • the small-sized first sound guide hole 19223 can reduce the communication between the first microphone element 19312 and the like in the speaker and the outside, thereby improving the closedness of the speaker.
  • the sound guide channel 192241 may be provided in a curved shape.
  • a main axis of the first sound guide hole 19223 is disposed in a middle portion of the cover body 1920 in a width direction of the cover body 1920.
  • the soft cover layer 1922 of the cover 1920 is also provided with a first sound blocking member 19224 at a position corresponding to the first sound guide hole 19223.
  • the first sound blocking member 19224 extends through the microphone hole 19214 toward the inside of the cavity 1911, which limits The sound is transmitted in the transmission direction of the first microphone element 19312.
  • the sound guide channel 192241 is defined. One end of the sound guide channel 192241 is in communication with the first sound guide hole 19223 on the soft cover layer 1922.
  • the first microphone element 19312 is inserted into the sound guide channel 192241 from the other end of the sound guide channel 192241.
  • the switch hole 19213 and the first microphone hole 19214 may be disposed on the rigid support 1921 at intervals.
  • the distance between the switch hole 19213 and the first microphone hole 19214 may be 10-20 mm, and specifically, may be 10 mm, 15 mm, 20 mm, and the like.
  • the first sound blocking member 19224 is formed by a soft cover layer 1922 from the periphery of the first sound guide hole 19223, passes through the first microphone hole 19214, and extends into the cavity 1911 to the periphery of the first microphone element 19312, thereby forming The sound guide channel 192241 from the first sound guide hole 19223 to the first microphone element 19312, so that the sound signal of the speaker entering the sound guide hole can directly reach the first microphone element 19312 through the sound guide channel 12241.
  • the shape of the sound guide channel 192241 in a cross section perpendicular to the length direction thereof may be the same as the shape of the first microphone hole 19214 or the first microphone element 19312, but may not be the same.
  • the cross-sectional shapes of the first microphone hole 19214 and the first microphone element 19312 in a direction perpendicular to the bracket 1921 toward the cavity 1911 are square, and the size of the first microphone hole 19214 is slightly larger than the sound guide channel.
  • the external dimensions of 192241 and the internal dimensions of the sound guide channel 192241 are not smaller than the external dimensions of the first microphone element 19312, so that the sound guide channel 192241 can pass through the first sound guide hole 19223 to the first microphone element 19312 and be wrapped in the first The periphery of a microphone element 19312.
  • the soft cover layer 1922 of the speaker is provided with the first sound guide hole 19223 and the first sound guide hole 19223 passes through the first microphone hole 19214 to reach the first microphone element 19312 and is wrapped in the first microphone element.
  • the sound guide channel 192241 on the periphery of 19312.
  • the sound guide channel 192241 is provided so that the sound signal entering through the first sound guide hole 19223 can reach the first microphone element 19312 through the first sound guide hole 19223 and is received by the first microphone element 19312. Reception, which can reduce the leakage of the sound signal during the propagation process, thereby improving the efficiency of the sound signal received by the speaker.
  • the speaker further includes a waterproof mesh 194 disposed in the sound guide channel 192241.
  • the waterproof mesh 194 is resisted by the first microphone element 19312 on the side of the soft cover 1922 facing the microphone element. And cover the first sound guide hole 19223.
  • an accessible position bracket 1921 in the sound guide channel 192241 protrudes to form an opposite convex surface, so that the waterproof mesh 194 is sandwiched between the first microphone element 19312 and the convex surface, or it can also be directly bonded to
  • the specific arrangement of the periphery of the first microphone element 1312 is not limited here.
  • the waterproof mesh cloth 194 in this embodiment may also have a function of sound transmission and the like, so as to avoid the sound receiving effect of the sound receiving area 193121 of the first microphone element 19312. Negative Effects.
  • the first microphone element 19312 may be disposed at the first position of the first circuit board 1931, and when the first sound guide hole 19223 is provided, it is also beautiful and convenient, etc. It is necessary to set the first sound guide hole 19223 at the second position of the cover 1920. In this embodiment, the first position and the second position may not correspond in the width direction of the cover 1920, thereby causing the first The main axis of the sound guide hole 19223 and the main axis of the sound receiving area 193121 of the first microphone element 13912 are spaced from each other in the width direction of the cover 1920, so that the sound input through the first sound hole 19223 may not be able to reach in a straight line. The sound receiving area 193121 of the first microphone element 19312.
  • the cover 1920 may be a part of the outer shell of the speaker, and in order to meet the overall aesthetic requirements of the speaker, the first sound guide hole 19223 may be provided in the middle in the width direction of the cover 1920 so that the first guide The sound hole 19223 looks more symmetrical and meets people's visual needs.
  • the corresponding sound guide channel 1992241 can be set to be stepped in cross section along the BB axis in FIG. 59, so that the sound signal introduced by the first sound guide hole 19223 is transmitted to the first sound guide channel 192241 through the stepped sound guide channel 192241.
  • a microphone element 19312 is received by the first microphone element 19312.
  • the speaker further includes a light emitting element 19313.
  • the light emitting element 19313 may be disposed on the first circuit board 1931 of the circuit component 1930 to be accommodated in the cavity 1911.
  • the light emitting element 19313 may be disposed on the first circuit board 19931 in a certain arrangement together with the switch 19311 and the first microphone element 1312 in the above embodiment.
  • the circuit component 1930 may be equivalent to the control circuit in the foregoing embodiment.
  • the hard bracket 1921 is provided with a light emitting hole 19215 corresponding to the light emitting element 19313, a soft cover layer 1922 covers the light emitting hole 19215, and the thickness of the region of the soft cover layer 1922 corresponding to the light emitting hole 19215 is set to allow light emitting elements
  • the light generated by 19313 is transmitted through the soft cover layer 1922.
  • the light-emitting element 19313 may be a light-emitting diode, and the number of light-emitting elements 19313 may be one or more.
  • the number of light-emitting holes 19215 on the rigid support 1921 may be the same as that of the light-emitting element 19313.
  • the number of light-emitting elements 19313 is multiple. In this case, there are different light emitting holes 19215, and different signals can be transmitted through different light emitting elements 19313.
  • the soft cover layer 1922 can still transmit the light emitted by the light emitting element 19313 to the outside of the speaker by covering the light emitting hole 19215 with a certain method.
  • the thickness of the entire or partial area of the soft cover layer 1922 corresponding to the light exit hole 19215 may be set to be smaller than the thickness of the area of the soft cover layer 1922 corresponding to the periphery of the light exit hole 19215 so that The light emitted by the light-emitting element 19313 can pass through the light-out hole 19215 and is further transmitted through the soft cover layer 1922.
  • other areas can also be used to enable light to be transmitted through the area covered by the soft cover layer 1922 with the light hole 19215, which is not specifically limited herein.
  • a soft cover layer 1922 is provided corresponding to the whole area or a part of the light emitting hole 19215, and a window is covered with a layer of transparent or light-transmitting material (for example, film, quartz, etc.) so that the light emitted by the light-emitting element 19313 The light can pass through the light emitting hole 19215 and be transmitted through the window.
  • a layer of transparent or light-transmitting material for example, film, quartz, etc.
  • the soft cover layer 1922 is further provided on the basis of covering the light emitting hole 19215 corresponding to the light emitting element 19313, so that the light emitted by the light emitting element 19313 can be transmitted from the soft cover layer 1922 to the outside of the speaker, thereby enabling The light-emitting element 19313 is sealed by a soft cover layer 1922 without affecting the light-emitting function of the speaker, so as to improve the sealing performance and waterproof performance of the speaker.
  • the hard bracket 1921 is further provided with a light blocking member 19216 extending toward the inside of the cavity 1911 on the periphery of the light emitting hole 19215.
  • the light blocking member 19216 limits the transmission direction of the light generated by the light emitting element 19313. .
  • the shape of the light emitting hole 19215 can be any shape capable of transmitting light emitted by the light emitting element 19313, such as a circle, a square, a triangle, etc. In this embodiment, the shape of the light emitting hole 19215 is circular.
  • the setting of the light blocking member 19216 in this embodiment can limit the transmission direction of the light generated by the light emitting element 19313 to reduce light leakage, thereby improving the brightness of the light transmitted through the light emitting hole 19215.
  • the light blocking member 19216 in this embodiment may be partially or entirely formed by a rigid bracket 1921, for example, the rigid bracket 1921 may extend along the periphery of the light exit hole 19215 to the inside of the cavity 1911 and surround the light emitting element 19313, Thereby, a light channel through which light is transmitted is formed. Through the light channel, the light generated by the light-emitting element 19313 can propagate directly to the light exit hole 19215 along the setting direction of the channel; or the rigid support 1921 may not form a light channel, but The light transmission is restricted from only one direction or several directions.
  • the rigid support 1921 may extend from one side of the light emitting hole 19215 into the cavity 1911 to form a light blocking member 1216 that blocks the light emitting element 19313 on one side. Or you can further cooperate with other components to limit the spread of light.
  • the rigid support 1921 extends from one side of the light emitting hole 19215 into the cavity 1911 to form a light blocking member 19216 that blocks the light emitting element 19313 on one side.
  • the light blocking member 19216 further cooperates with the inner wall of the cavity 1911 or the rigid support 1921.
  • the transmission direction of light generated by the light-emitting element 19313 is restricted from multiple directions.
  • the light-emitting element 19313 is disposed adjacent to the first microphone element 19312 on the first circuit board 1931, and the corresponding light-out hole 19215 and the first microphone hole 19214 are disposed on the rigid support 1921 at intervals, as in the above embodiment.
  • a first sound blocking member 19224 defined by a soft cover layer 1922 and defining a sound guiding channel 192241 is provided on the periphery of the first microphone element 19312.
  • the first sound blocking member 19224 passes through the first microphone hole.
  • 19214 is provided, so that the first microphone element 19312 and the light emitting element 19313 and the first microphone hole 19214 and the light emitting hole 19215 are spaced apart.
  • the light blocking member 19216 formed by the rigid support 1921 cooperates with a side wall of the first sound blocking member 19224 near the light emitting element 19313, and both of them limit the transmission direction of the light generated by the light emitting element 19313.
  • the cavity 1911 is arranged in a strip shape on a cross section perpendicular to the direction of the opening 1912.
  • the rigid support 1921 is also elongated and inserted into the cavity 1911 through the insertion portion 19211 through the opening 1912.
  • Insertion portions 19211 are provided on both sides in the length direction of the rigid support 1921, so that the light emitting element 19313 is also provided with corresponding insertion portions 19211 of the rigid support 1921 on both sides in the length direction of the rigid support 1921.
  • the light blocking member 19216 is further disposed on a side of the light emitting element 19313 perpendicular to the length direction of the rigid support 1921, and the first sound blocking
  • the side wall of the piece 19224 is disposed on the other side of the light-emitting element 19313 perpendicular to the length of the rigid support 1921.
  • the two can be parallel plates and are further restricted by the insertion portions 19211 on both sides of the light-emitting element 19313. Transmission direction of light generated by the light emitting element 19313.
  • the circuit component 1930 in the speaker includes the first circuit board 1931 in the above-mentioned speaker embodiment, and may further include a second circuit board 1932.
  • the circuit component 1930 in the speaker includes the first circuit board 1931 in the above-mentioned speaker embodiment, and may further include a second circuit board 1932.
  • the second circuit board 1932 is equivalent to the second branch circuit board in the foregoing embodiment.
  • the second circuit board 1932 is disposed facing the accommodating body 1910, and the second circuit board 1932 is inclined at the first circuit board 1931 and disposed in the cavity 1911, and the second circuit board 1932 faces the accommodating body
  • a second microphone element 19321 is provided on one side of 1910.
  • the second microphone element 19321 is disposed facing the side wall of the accommodating body 1910, so that there is a large space near the second microphone element 19321, and functional parts corresponding to the second microphone element 19321 can be conveniently provided on the accommodating body 1910.
  • the second circuit board 1932 is disposed obliquely to the first circuit board 1931, and the functional components on the two circuit boards can be offset from each other and can also reduce the distance between the functional components, which can further save and compress the internal space of the speaker. .
  • the side wall of the receiving body 1910 opposite to the cover 1920 or the first sound guide hole 19223 is further provided with a second sound guide hole 1914.
  • a second sound guide hole 1914 is correspondingly provided on a side wall of the accommodating body 1910, and the second sound guide hole 1914 and the first sound guide hole 19223 are far away from each other.
  • the opening 1912 of the receiving body 1910 is an inclined opening
  • the cover 1920 is inclined relative to the receiving body 1910
  • the side wall of the receiving body 1910 opposite to the first sound guide hole 19223 is the cavity 1911.
  • the second sound guide hole 1914 is disposed on one side of the receiving body 1910.
  • the second sound guide hole 1914 is disposed on a side surface of the receiving body 1910 within a range of 3 to 6 mm from the top of the receiving body 1910. Specifically, it can be 3mm, 4mm, 5mm, 6mm, and the like.
  • the cover 1920 when the depth direction of the opening 1912 of the accommodating body 1910 is vertical with respect to the bottom of the accommodating body, the cover 1920 is horizontally disposed relative to the accommodating body 1910.
  • the side wall of the accommodating body 1910 is the top of the cavity 1911, and the sound guide hole 1914 is provided at the top of the accommodating body 1910. Further, the second sound guide hole 1914 may be disposed at a middle position on the top of the receiving body 1910.
  • the above method can make the second sound guide hole 1914 away from the main sound source, reduce the sound of the main sound source received by the second sound guide hole 1914, increase the ratio of the second sound guide hole 1914 to receive environmental noise, and enhance the noise reduction effect.
  • the cover 1920 is provided with a first sound guide hole 19223 corresponding to the first microphone element 19312 and the first microphone hole 19214.
  • the first microphone element 19312 is used for receiving The sound input through the first sound guide hole 19223
  • the second microphone element 19321 is used to receive the sound input through the second sound guide hole 1914.
  • the central axis of the second sound guide hole 1914 coincides with the main axis of the sound receiving area of the second microphone element 19321.
  • noise can be directly guided to the sound receiving area of the second microphone element 19321 through the second sound guide hole 1914, reducing noise in the Propagation inside cavity 1911.
  • the noise can be directly guided to the sound receiving area 193121 of the first microphone element 19312 through the first sound guide hole 19223.
  • the noise received by the first microphone element 19312 and the second microphone element 19321 is approximately the same, which is beneficial to eliminate noise in subsequent processing and improve the quality of the main sound source.
  • the center axis of the second sound guide hole 1914 coincides with or is parallel to the center axis of the first sound guide hole 19223.
  • the second sound guide hole 1914 and the first sound guide hole 19223 have the same central axis direction, that is, the central axes of the two are coincident or parallel.
  • the sound inlet of the second sound guide hole 1914 and the sound inlet of the first sound hole 19223 are facing in opposite directions, reducing the main sound source received by the second sound hole 1914, which is beneficial to eliminate noise in subsequent processing and improve Main sound source quality.
  • the main axis of the sound receiving area of the second microphone element 19321 coincides with or is parallel to the main axis of the sound receiving area 193121 of the first microphone element 19312.
  • the sound receiving area of the second microphone element 19321 receives the sound signal through the second sound guide hole 1914, and the sound receiving area 193121 of the first microphone element 19312 receives the sound signal through the first sound hole 19223. Because the main sound source signal through the second sound guide hole 1914 is small, the main sound source signal received by the sound receiving area of the second microphone element 19321 is small, which is beneficial to the effect of improving the quality of the audio signal.
  • the first circuit board 1931 may be disposed parallel to the opening plane of the opening 1912 and close to the opening 1912.
  • the first circuit board 1931 may be inclined to the opening plane of the opening 1912 and disposed near the opening 1912.
  • the first circuit board 1931 may further be provided with the switch 19311, the light-emitting element 19313, and the like described above.
  • the switch 19311, the light-emitting element 19313, and the first microphone element 19312 may be provided on the first circuit board in a certain arrangement.
  • a switching hole 19213, a light emitting hole 19215, a first microphone hole 19214, and the like are separately provided on the cover 1920 to transmit signals to the outside of the speaker through the corresponding holes.
  • the first microphone hole 19214 may be provided at a center position of the middle of the cover 1920, and the switch hole 19213 and the light exit hole 19215 may be respectively provided on both sides of the first microphone hole 19214 in the length direction of the cover 1920.
  • the distance between the switch hole 19213 and the light emitting hole 19215 from the first microphone hole 19214 may be in a range of 5 to 10 mm, and specifically, may be 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, and the like.
  • the distance between the switch hole 19213 and the light emitting hole 19215 from the first microphone hole 19214 may be equal to or different from each other.
  • the receiving body 1910 extends from the opening 1912 in a direction perpendicular to the plane of the opening to form a cavity 1911 having a certain width.
  • the second circuit board 1932 may be parallel to the width direction of the cavity 1911 and perpendicular to the opening. Flat set.
  • the second circuit board 1932 may also be inclined to the width direction of the cavity 1911 and disposed at an angle to the plane of the opening 1912.
  • the second circuit board 1932 is inclined to the first circuit board 1931 and is disposed in the cavity 1911.
  • the second circuit board 1932 may further be provided with a main control chip and an antenna.
  • the second circuit board 1932 is inclined to the width direction of the cavity 1911 and is disposed to be inclined to the plane of the opening 1912.
  • An included angle between the second circuit board 1932 and the width direction of the cavity 1911 is in a range of 5 ° -20 °.
  • the included angle between the second circuit board 1932 and the cavity 1911 in the width direction may be any angle within the above range, such as 5 °, 10 °, 15 °, 20 °, etc., and is not specifically limited herein.
  • the main axis of the sound receiving area of the second microphone element 19321 coincides with the main axis of the sound receiving area 193121 of the first microphone element 19312, and the first microphone element 19312 and the second microphone element 19321 are aligned with the user's mouth.
  • a first microphone element 19312 and a second microphone element 19321 are provided on two circuit boards, and the two microphone elements receive sound signals through the first sound guide hole 19223 and the second sound guide hole 1914, respectively.
  • the microphone element can be used to collect the main sounds such as human voice, while the other microphone element can have a background noise acquisition function to facilitate the collection of surrounding environmental noise.
  • the two cooperate with the received sound signal to analyze and process it, which can play a role in reducing noise, etc. , Thereby improving the processing quality of the sound signal.
  • FIG. 66 is a schematic structural diagram of an embodiment of the speaker of the present application in a combined state with an angle different from that of FIG. 65.
  • the first circuit board 1931 and the second circuit board 1932 are mutually
  • the oblique arrangement in the same cavity 1911 can make the installation of the two circuit boards more flexible.
  • the angle between the two circuit boards can be adjusted according to the size and position of the electronic components on the two circuit boards, thereby improving the speaker's performance.
  • the space utilization rate is further applied to the speaker, the space of the speaker can be saved, so as to facilitate the thinning and thinning of the speaker.
  • an included angle between the first circuit board 1931 and the second circuit board 1932 is within a range of 50 ° to 150 °, and a specific included angle between the first circuit board 1931 and the second circuit board 1932 may be any angle within the above range. , Such as 70 °, 80 °, 90 °, 100 °, 110 °, etc.
  • the opening 1912 and the cover 1920 are arranged in a corresponding strip shape, the shape of the first circuit board 1931 matches the shape of the opening 1912, and the width d 1 of the first circuit board 1931 is not greater than
  • the dimension of the opening plane along the width direction of the opening 1912, so that the first circuit board 1931 (parallel or inclined to the plane where the opening is located) can be accommodated in the cavity 1911 near the opening 1912, that is, the first circuit board 1931 is also long.
  • the switches 19311, the light emitting element 19313, and the first microphone element 19312 may be disposed on the first circuit board 1931 at intervals along the length direction of the first circuit board 1931, that is, the length direction of the cover 1920.
  • the second microphone element 13921 is a bone conduction microphone, and the bone conduction microphone extends out of the accommodation body 1910 through the second sound guide hole 1914.
  • the bone conduction microphone is mounted on a side wall of the receiving body 1910.
  • the side wall is a side wall that fits the user's body when the user wears the speaker, so that the bone conduction microphone can better receive the vibration signal of the main sound source.
  • the second microphone element 19321 will mainly collect the vibration signal of the main sound source, and the vibration signal and the sound signal (including audio signal and noise) collected by the first microphone element 19312 (air conduction). )comparing.
  • the sound signal collected by the first microphone element 19312 may be optimized based on the above comparison result to obtain a high-quality audio signal.
  • the component body is provided with a second sound guide hole 1914 penetrating the side wall of the cavity 1911, and a second sound blocking member 1915 and a second sound blocking member are provided at positions corresponding to the second sound guiding hole 1914.
  • 1915 extends through the second sound guide hole 1914 toward the inside of the cavity 1911 to limit the transmission of sound to the transmission direction of the second microphone element 19321.
  • a second sound guide hole 1914 corresponding to the second microphone element 19321 is provided on the component body and penetrates the cavity 1911 to communicate the second microphone element 19321 with the outside world so that the second microphone element 19321 can receive external sound signals.
  • the second sound-blocking member 1915 may be a hard material or a soft material.
  • the second sound-blocking member 1915 may be formed by the receiving body 1910 on the inner side of the cavity 1911 along the periphery of the second sound guide hole 1914 toward the cavity.
  • the body 1911 is formed by extending inside.
  • the second sound-blocking member 1914 can be formed by the soft rubber integrally injection-molded with the accommodating body 1910 on the inner side of the cavity 1911 and extending along the periphery of the second sound guide hole 1914 toward the inside of the cavity 1911.
  • the second sound blocking member 1915 may extend along the periphery of the second sound guide hole 1914 toward the interior of the cavity 1911, and extend to the second microphone element 19321, and then surround the sound receiving area of the second microphone element 19321. To form a channel connecting the second sound guide hole 1914 and the second microphone element 19321, so that the sound signal input from the outside to the second sound guide hole 1914 directly passes through the channel and is received by the sound receiving area of the second microphone element 19321 .
  • the second sound blocking member 1915 may not completely surround the second sound guide hole 1914, but extends only along one side or both sides of the second sound guide hole 1914 to the inside of the cavity 1911. And extends to the second microphone element 19321 to guide the sound input through the second sound guide hole 1914 to the second microphone element 19321 and be received by the sound receiving area thereof.
  • the electronic component (also referred to as a circuit case or a component body) may include a receiving body 1910 and a cover 1920.
  • the receiving body 1910 is provided with a cavity 1911 having at least one opening 1912.
  • the cover 1920 is disposed on the opening 1912 of the cavity 1911 and is used to seal the cavity 1911.
  • the electronic component in this embodiment is consistent with the component body in the previous embodiment.
  • the electronic components in this application can be applied to electronic devices.
  • the electronic device can be any electronic device that needs to seal the internal structure, such as headphones, MP3 players, hearing aids, mobile phones, tablet computers, or devices with circuit components and electronic devices. Glasses and the like are not specifically limited here.
  • the electronic component may be disposed at the temple 15 of FIG. 7.
  • the electronic component may also be referred to as a circuit housing in some embodiments.
  • the receiving body 1910 may be at least a part of an electronic device (eg, a speaker).
  • the circuit components correspond to the control circuit in FIG. 2.
  • FIG. 68 is a cross-sectional view of the electronic component of the present application in an assembled state along the A-A axis in FIG. 59.
  • the receiving body 1910 includes an opening edge 1913 for defining the opening 1912, and the covering part 1912 is pressed against the inner area 19131 of the opening edge 1913 near the opening 1912, and the cover layer 1922 covers the The covering portion 19212 is far from the outer surface of the accommodating body 1910, and is pressed against the outer region 19132 at the periphery of the inner region 19131 of the opening edge 1913, thereby achieving a seal with the opening edge 1913.
  • FIG. 69 is a cross-sectional view of the electronic component of the present application in the assembled state along the B-B axis in FIG. 59.
  • the electronic component may include a first microphone element 19312.
  • the first microphone element 19312 may also be disposed on the first circuit board 1931 of the circuit assembly 1930 to be received in the cavity 1911.
  • the first microphone element 19312 may be disposed on the first circuit board 1931 at a distance from the switch 19311 in the above embodiment.
  • the first microphone element 19312 can be used to receive a sound signal from outside the electronic component, and convert the sound signal into an electrical signal for analysis and processing.
  • a microphone hole 19214 corresponding to the first microphone element 19312 is provided on the bracket 1921, and a first sound guide hole 19223 corresponding to the microphone hole 19214 is provided on the cover layer 1922, and at a position corresponding to the microphone hole 19214 A first sound blocking member 19224 is provided.
  • the first sound blocking member 19224 extends toward the inside of the cavity 1911 through the microphone hole 19214 and defines a sound guiding channel 192241.
  • the first sound guide hole 19223 is provided through the cover layer 1922 and corresponds to the position of the first microphone element 19312.
  • the first sound guide hole 19223 corresponds to the microphone hole 19214 on the support 1921, and further the first microphone
  • the component 19312 communicates with the outside of the electronic component, so that the sound outside the electronic component can be received by the first microphone component 19312 through the first sound guide hole 19223 and the microphone hole 19214.
  • FIG. 2 is a partial structural diagram of an embodiment of a speaker module of the present application
  • FIG. 3 is an exploded view of a local structure of an embodiment of a speaker module of the present application
  • FIG. 70 is a partial structural cross-sectional view of an embodiment of a speaker module of the present application.
  • the auxiliary function module may include microphones 432.
  • the number of the microphones 432 is two, which are the first microphone 432a and the second microphone 432b.
  • the first microphone 432a and the second microphone 432b can both be MEMS (micro-electromechanical system) microphone 432, which has a small working current, relatively stable performance, and high voice quality.
  • the two microphones 432 may be disposed at different positions of the flexible circuit board 44 according to actual needs.
  • the flexible circuit board 44 may be disposed in the speaker in FIG. 1, which corresponds to the flexible circuit board 106 in FIG. 1.
  • the flexible circuit board 44 may include a main circuit board 441 and a branch circuit board 442 and a branch circuit board 443 connected to the main circuit board 441.
  • the branch circuit board 442 extends in the same direction as the main circuit board 441, and the first microphone 432a is mounted on the branch.
  • the circuit board 442 is far from the end of the main circuit board 441.
  • the branch circuit board 443 extends perpendicular to the main circuit board 441.
  • the second microphone 432b is mounted on the end of the branch circuit board 443 away from the main circuit board 441.
  • the main circuit board 441 is provided at an end of the main circuit board 441 away from the branch circuit board 442 and the branch circuit board 443.
  • the movement case 41 includes a peripheral side wall 411 and a bottom end wall 412 connected to one end surface of the peripheral side wall 411 to form an accommodation space with an open end.
  • the earphone core 42 is placed in the accommodation space through the open end, the first microphone 432a is fixed on the bottom end wall 412, and the second microphone 432b is fixed on the peripheral side wall 411.
  • the branch circuit board 442 and / or the branch circuit board 443 may be appropriately bent to adapt to the setting of the position of the sound input hole corresponding to the microphone 432 on the movement case 41.
  • the flexible circuit board 44 can be disposed in the movement case 41 in a manner that the main circuit board 441 is parallel to the bottom end wall 412, so that the first microphone 432a can correspond to the bottom end wall 412 without the need for the main circuit board. 441 is bent. Since the second microphone 432b is fixed on the peripheral side wall 411 of the movement case 41, it is necessary to bend the second main circuit board 441.
  • the branch circuit board 443 can be located at an end away from the main circuit board 441.
  • the pad 45, the pad 46, the first microphone 432a, and the second microphone 432b may be disposed on the same side of the flexible circuit board 44, and the pad 46 is disposed adjacent to the second microphone 432b.
  • the pad 46 may be specifically disposed at an end of the branch circuit board 443 away from the main circuit board 441, and the same direction as and spaced from the second microphone 432b, so as to be perpendicular to the bending of the branch circuit board 443 The orientation of the pad 45. It should be noted that the plate surface of the branch circuit board 443 may not be perpendicular to the plate surface of the main circuit board 441 after being bent, and may be determined according to the arrangement manner between the peripheral side wall 411 and the bottom end wall 412.
  • the other side of the flexible circuit board 44 is provided with a rigid support plate 4a for supporting the pad 45 and a microphone rigid support plate 4b.
  • the microphone rigid support plate 4b includes rigidity for supporting the first microphone 432a.
  • the rigid support plate 4a, the rigid support plate 4b1, and the rigid support plate 4b2 are mainly used to support the corresponding pads and the microphone 432, so they need to have a certain strength.
  • the materials of the three may be the same or different. Specifically, they may be polyimide films (PI), or other materials capable of supporting strength, such as polycarbonate and polyvinyl chloride.
  • the thickness of the three rigid support plates can be set according to the strength of the rigid support plate itself and the actual strength required by the pads 45, 46, and the first microphone 432a and the second microphone 432b, which are not described here. Specific limitations.
  • the first microphone 432a and the second microphone 432b correspond to the two microphone assemblies 4c, respectively.
  • the structure of the two microphone components 4c is the same.
  • a sound inlet hole 413 is provided on the movement case 41.
  • the speaker assembly is further provided with a movement integrally formed on the movement case 41
  • An annular blocking wall 414 on the inner surface of the casing 41 is disposed on the periphery of the sound inlet hole 413, and further defines an accommodation space 415 that is in communication with the sound inlet hole 413.
  • the microphone assembly 4 c further includes a waterproof membrane assembly 4 c 1.
  • the waterproof membrane module 4c1 is disposed in the accommodating space 415 and covers the sound inlet hole 413.
  • the microphone rigid support plate 4b is disposed in the accommodating space 415 and is located on a side of the waterproof membrane module 4c1 away from the sound inlet hole 413, so as to hold the waterproof membrane module 4c1 on the inner surface of the movement case 41.
  • the microphone rigid support plate 4b is provided with a sound inlet hole 4b3 corresponding to the sound inlet hole 413.
  • the microphone 432 is disposed on a side of the microphone rigid support plate 4b away from the waterproof membrane module 4c1 and covers the sound hole 4b3.
  • the waterproof membrane module 4c1 has the function of waterproof and sound transmission, and closely fits the inner surface of the movement case 41 to prevent the liquid outside the movement case 41 from entering the inside of the movement case 41 through the sound entry hole 413 and Affects the performance of the microphone 432.
  • the axial directions of the sound inlet hole 4b3 and the sound inlet hole 413 may overlap, or they may intersect at a certain angle according to the actual needs of the microphone 432 and the like.
  • the microphone rigid support plate 4b is disposed between the waterproof membrane module 4c1 and the microphone 432.
  • the waterproof membrane module 4c1 is pressed and pressed so that the waterproof membrane module 4c1 is closely attached to the inner surface of the movement case 41;
  • the microphone rigid support plate 4b has a certain strength, so as to support the microphone 432.
  • the material of the microphone rigid support plate 4b may be polyimide film (PolyimiceFilm, PI), or other materials capable of supporting strength, such as polycarbonate, polyvinyl chloride, and the like.
  • the thickness of the microphone rigid support plate 4b can be set according to the strength of the microphone rigid support plate 4b and the strength actually required by the microphone 432, which is not specifically limited here.
  • FIG. 71 is a partially enlarged view of a portion C in FIG. 70.
  • the waterproof membrane module 4c1 may include a waterproof membrane body 4c11 and a ring-shaped rubber pad 4c12.
  • the annular rubber pad 4c12 is disposed on the side of the waterproof membrane body 4c11 facing the rigid support plate 4b of the microphone, and is further disposed on the periphery of the sound entrance hole 413 and the sound entrance hole 4b3.
  • the microphone rigid support plate 4b is pressed against the annular rubber pad 4c12, so that the waterproof membrane module 4c1 and the microphone rigid support plate 4b are bonded and fixed together.
  • the annular rubber pad 4c12 is provided to form a sealed cavity between the waterproof membrane body 4c11 and the rigid support plate, which is connected to the microphone 432 only through the sound inlet hole 4b3, that is, the waterproof membrane module 4c1 and the microphone rigid support plate 4b. There is no gap between the connections, so that the space around the annular rubber pad 4c12 between the waterproof membrane body 4c11 and the microphone rigid support plate 4b is isolated from the sound inlet hole 4b3.
  • the waterproof film body 4c11 may be a waterproof sound-transmitting film, which is equivalent to the eardrum of a human ear.
  • the waterproof film body 4c11 vibrates, which causes the air pressure in the sealed cavity to change, and causes a sound to be emitted from the microphone 432.
  • the waterproof membrane body 4c11 causes a change in the air pressure in the sealed cavity during vibration, the air pressure needs to be controlled within an appropriate range, and if it is too large or too small, it will affect the sound quality.
  • the distance between the waterproof membrane body 4c11 and the rigid support plate may be 0.1-0.2mm, specifically 0.1mm, 0.15mm, 0.2mm, etc., so that the sealed cavity caused by the vibration of the waterproof membrane body 4c11 is in the sealed cavity. The change in air pressure is within a proper range, thereby improving the sound quality.
  • the waterproof membrane module 4c1 further includes an annular rubber pad 4c13 disposed on the waterproof membrane body 4c11 facing the inner surface side of the movement case 41 and overlapping with the annular rubber pad 4c12.
  • the waterproof membrane module 4c1 can be closely adhered to the inner surface of the movement case 41 around the sound input hole 413, thereby reducing the loss of sound entering through the sound input hole 413, and improving the sound into a waterproof film Conversion rate of vibration of the body 4c11.
  • the ring-shaped rubber pad 4c12 and the ring-shaped rubber pad 4c13 may be double-sided tape, or a sealant, respectively.
  • a sealant may be further coated on the periphery of the annular blocking wall 414 and the microphone 432 to further improve the sealing performance, thereby improving the sound conversion rate, and further improving the sound quality.
  • the flexible circuit board 44 may be disposed between the rigid support plate and the microphone 432, and a sound input hole 444 is provided at a position corresponding to the sound input hole 4b3 of the microphone rigid support plate 4b, so that external sound The resulting vibration of the waterproof film body 4c11 passes through the sound inlet hole 444 and further affects the microphone 432.
  • the flexible circuit board 44 further extends away from the microphone 432 to connect with other functional elements or wires to achieve corresponding functions.
  • the rigid support plate 4b of the microphone also extends a distance from the microphone 432 along with the flexible circuit board.
  • FIG. 72 is a partial structural diagram of a movement case of a speaker assembly provided according to some embodiments of the present application
  • FIG. 73 is a partial enlarged view of part D in FIG. 72
  • FIG. 74 is a speaker provided according to some embodiments of the present application Partial sectional view of the movement case of the module.
  • the movement case may include a main case 2825 (that is, the movement case 108 in FIG. 1) and a partition assembly 2826, where the partition assembly 2826 is located at the main case 2825. It is internally connected to the main casing 2825, and further divides the internal space 2827 of the main casing 2825 into a first accommodation space 271 and a second accommodation space 272 on the side close to the socket 2822.
  • the main casing 2825 includes a peripheral side wall 251 and a bottom end wall 252 connected to one end surface of the peripheral side wall 251. The peripheral side wall 251 and the bottom end wall 252 collectively surround the interior of the main casing 2825. Space 2827.
  • the partition assembly 2826 is located on a side of the main casing 2825 near the connection hole 2822 and includes a side partition 261 and a bottom partition 262.
  • the side partition plate 261 may be disposed in a direction perpendicular to the bottom end wall 252, and both ends of the side partition plate 261 are connected to the peripheral side wall 251, so as to partition the internal space 2827 of the main casing 2825.
  • the bottom partition plate 262 may be arranged parallel to or close to the bottom end wall 252 and spaced apart, and further connected to the peripheral side wall 251 and the side partition plate 261, respectively, so that the internal space 2827 formed by the main casing 2825 is divided into two and A first accommodating space 271 surrounded by the side partition plate 261, the bottom partition plate 262, the peripheral side wall 251 and the bottom end wall 252 remote from the connection hole 2822 is formed, and the bottom partition plate 262 and the side partition plate 261 and A second accommodation space 272 formed by the peripheral side walls 251 adjacent to the connection hole 2822.
  • the second accommodation space 272 may be smaller than the first accommodation space 271.
  • the partition assembly 2826 may also divide the internal space 2827 of the main casing 2825 by other setting methods, which is not specifically limited herein.
  • the partition assembly 2826 further includes an inner partition 263, which further divides the second accommodation space 272 into two sub-accommodation spaces 2721.
  • the inner partition plate 263 is disposed perpendicular to the bottom end wall 252 of the main casing 2825, and is connected to the side partition plate 261 and the peripheral side wall 251, respectively, and further extends to the wiring hole 2621, so that the second container While the placement space 272 is divided into two sub-accommodation spaces 2721, the routing holes 2621 are further divided into two, and the two routing holes 2621 can communicate with the corresponding sub-accommodation spaces 2721.
  • the second receiving space 272 may be further filled with a sealant.
  • the lead wire 2812 and the lead wire 80 accommodated in the second accommodation space 272 can be further fixed, so as to further reduce the adverse effect on the sound quality caused by the lead wire vibration, thereby improving the sound quality of the speaker component.
  • the welding point between the lead wire 2812 and the lead wire 80 can be protected.
  • sealing the second accommodation space 272 can also achieve the purpose of waterproof and dustproof.
  • the speaker assembly described above may also transmit sound to the user by means of air conduction.
  • the speaker assembly may include one or more sound sources.
  • the sound source may be located at a specific position of the user's head, for example, the top of the head, forehead, cheeks, cheek horns, auricle, back of auricle, etc., without blocking or covering the ear canal.
  • FIG. 75 shows a schematic diagram of transmitting sound through air conduction.
  • the sound source 2810 and the sound source 2820 can generate sound waves with opposite phases ("+" and "-" in the figure indicate opposite phases).
  • the sound source referred to here refers to a sound output hole on the speaker component for outputting sound.
  • the sound source 2810 and the sound source 2820 may be two sound output holes respectively located at specific positions on the speaker assembly (for example, the movement case 108 or the temple 15).
  • the sound source 2810 and the sound source 2820 may be generated by the same vibration device 2801.
  • the vibration device 2801 includes a diaphragm (not shown in the figure). When the diaphragm is driven by electric signals to vibrate, the front face of the diaphragm drives air to vibrate, and a sound source 2810 is formed at the sound outlet through the sound guide channel 2812. A sound source 2820 is formed at the hole.
  • the sound conducting channel refers to a sound propagation path from the diaphragm to the corresponding sound emitting hole.
  • the sound guiding channel is a path surrounded by a specific structure (for example, the movement case 108 or the temple 15) on the speaker assembly. It should be known that, in some alternative embodiments, the sound source 2810 and the sound source 2820 may also be generated by different vibration devices through different diaphragm vibrations.
  • the sound transmitted to the user's ear may be referred to as near-field sound
  • the leaked sound transmitted to the environment may be referred to as far-field sound.
  • the near-field / far-field sounds of different frequencies generated by the speaker assembly are related to the distance between the sound source 2810 and the sound source 2820.
  • the near-field sound generated by the speaker component will increase as the distance between the two sound sources increases, and the far-field sound (leakage) generated will increase as the frequency increases.
  • the distance between the sound source 2810 and the sound source 2820 can be designed separately, so that the low-frequency near-field sound (for example, a sound with a frequency less than 800 Hz) generated by the speaker component is as large as possible, and the high-frequency far-field sound (for example , Sounds with a frequency greater than 2000Hz) as small as possible.
  • the speaker assembly may include two or more sets of dual sound sources. Each set of dual sound sources includes two sound sources similar to sound source 2810 and sound source 2820, and generates sounds with specific frequencies, respectively. . Specifically, the first group of dual sound sources may be used to generate low-frequency sounds, and the second group of dual sound sources may be used to generate high-frequency sounds.
  • the distance between two sound sources in the first set of dual sound sources can be set to a larger value.
  • the low-frequency signal has a longer wavelength, a larger distance between the two sound sources will not cause an excessive phase difference in the far field, and therefore will not form too much sound leakage in the far field.
  • the distance between the two sound sources in the second set of dual sound sources can be set to a smaller value. Because the high-frequency signal has a shorter wavelength, a smaller distance between the two sound sources can prevent a large phase difference from being formed in the far field, and thus can prevent a large sound leakage.
  • the distance between the second group of dual sound sources is smaller than the distance between the first group of dual sound sources.
  • the beneficial effects that the embodiments of the present application may bring include, but are not limited to: (1) the eyeglass frame and the eyeglasses can be connected through the hinge assembly, protecting the connecting wire in the glasses, and extending the life of the connecting wire; (2) through the flexible circuit Board, which can simplify the wiring in the speaker; (3) through the sound introduction hole, can reduce the shell vibration and suppress leakage; (4) through the composite vibration device, can improve the sound quality of speaker components; (5) the second Filling the accommodating space with a sealant can fix the internally-set wires, reducing the effect of the wire vibration on the sound quality, thereby improving the sound quality of the speaker.
  • the sealant filled in the second accommodating space can seal the space between the wires.
  • the rigid membrane is used to hold and cover the waterproof membrane module with waterproof and sound-transmitting effect on the first incoming sound. Hole, and closely fit the inner surface of the movement case to prevent the liquid outside the movement case from entering the inside of the movement case through the first sound entry hole, thereby improving the waterproof performance of the microphone; (7) High sound source microphone assembly obtain the primary sound effect; (8) by the addition of the magnetic element in the magnetic circuit assembly, magnetic and conductive elements, can improve the sensitivity of the speaker. It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the foregoing, or any other beneficial effects that may be obtained.

Abstract

一种眼镜，包括：眼镜架（110），眼镜架包括眼镜框（11）以及两条眼镜腿（15），两条眼镜腿(15)分别与眼镜框(11)转动连接；两个扬声组件（200），两个扬声组件（200）包括耳机芯（42），两个扬声组件（200）分别通过两条眼镜腿（15）上的铰链组件连接到两条眼镜腿（15）上，且铰链组件能够转动以改变每个扬声组件（200）相对于其所连接的眼镜腿（15）的位置；眼镜腿（15）中容纳控制电路（162）或电池（161），控制电路（162）或电池（161）驱动耳机芯（42，102）振动以产生声音。该眼镜通过软性电路板（44，106）简化了扬声器（100）内的走线方式，还通过转轴组件（19，190）连接眼镜框（11）和眼镜腿（15），保护了眼镜中的连接线（17），延长了连接线（17）的寿命。

Description

一种眼镜
优先权信息
本申请要求于2018年8月24日提交的中国申请号为201810975515.1，2019年1月5日提交的中国申请号为201910009904.3，2019年1月5日提交的中国申请号为201920031804.6的优先权，其全部内容通过引用的方式并入本文。
技术领域
本申请涉及眼镜领域，特别涉及一种带有扬声器的眼镜。
背景技术
随着扬声器技术的发展，如耳机、MP3等电子产品得到了非常广泛的应用，扬声器可以具有不同的产品形态。例如，扬声器可以集成在眼镜(太阳眼镜、游泳眼镜等)上，也可以通过特殊结构(例如，耳挂)固定在用户耳朵内或耳朵附近。随着产品的功能更加多样化，扬声器的内部模块和走线越来越多，布线也越来越复杂。复杂的布线大大占用产品的内部空间，而且不合理的导线分布会使得导线之间相互影响，从而带来异响影响扬声器的发声质量。因此，有必要提供一种更加高效的布线技术，简化扬声器的走线方式，提高扬声器的音质。
发明内容
本说明书实施例提供一种眼镜，所述眼镜包括：眼镜架，所述眼镜架包括眼镜框以及两条眼镜腿，所述两条眼镜腿分别与所述眼镜框转动连接；两个扬声组件，所述两个扬声组件包括耳机芯，所述两个扬声组件分别通过所述两条眼镜腿上的铰链组件连接到两条眼镜腿上，且所述铰链组件能够转动以改变每个扬声组件相对于其所连接的眼镜腿的位置；所述眼镜腿中容纳控制电路或电池，所述控制电路或电池驱动所述耳机芯振动以产生声音。
附图说明
本申请将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1为根据本申请一些实施例提供的一种扬声器的结构模块图；
图2为根据本申请一些实施例所示的一种软性电路板的结构示意图；
图3为根据本申请一些实施例所示的一种扬声器的局部结构爆炸图；
图4为根据本申请一些实施例所示的一种扬声器的局部结构截面图；
图5为根据本申请一些实施例所示的一种扬声器的局部截面图；
图6为根据本申请一些实施例所示的一种扬声器图5中F部分的局部放大图；
图7为根据本申请一些实施例所示的一种扬声器的爆炸图；
图8为根据本申请一些实施例所示的一种扬声器中鼻托套的结构示意图；
图9为根据本申请一些实施例所示的一种扬声器中眼镜框与眼镜片的局部截面示意图；
图10为根据本申请一些实施例所示的一种扬声器图9中A部分的放大图；
图11为根据本申请一些实施例所示的一种扬声器中连接线的局部结构示意图；
图12为根据本申请一些实施例所示的一种扬声器图7中B部分的局部结构示意图；
图13为根据本申请一些实施例所示的一种扬声器中眼镜的局部结构的截面放大示意图；
图14为根据本申请一些实施例所示的一种扬声器中转轴组件与连接线结构示意图；
图15为根据本申请一些实施例所示的一种扬声器中第一转轴的结构示意图；
图16所示为根据本申请一些实施例所示的一种扬声器的局部爆炸图；
图17所示为根据本申请一些实施例所示的一种扬声器中眼镜框与眼镜片的结构示意图；
图18所示为根据本申请一些实施例所示的一种扬声器中眼镜腿的局部结构示意图。
图19是根据本申请中一些实施例提供的耳机结构示意图；
图20是根据本申请中一些实施例提供的耳机爆炸结构图；
图21是根据本申请中一些实施例提供的扬声器振动产生和传递系统的等效模型；
图22是根据本申请中实施例提供的扬声器的复合振动装置的结构图；
图23是根据本申请中实施例提供的扬声器的复合振动装置的结构图；
图24是根据本申请中实施例所适用的扬声器的频率响应曲线；
图25是根据本申请中一些实施例提供的扬声器的复合振动装置的结构图；
图26是根据本申请中一些实施例提供的扬声器的振动响应曲线；
图27是根据本申请中一些实施例提供的扬声器振动产生部分的结构图；
图28是根据本申请中一些实施例提供的扬声器振动产生部分的振动响应曲线；
图29是根据本申请中一些实施例提供的扬声器产生部分的振动响应曲线；
图30是根据本申请一些实施例提供的骨传导扬声组件的结构示意图；
图31是根据本申请的一些实施例所示的一种磁路组件2100的纵截面示意图；
图32是根据本申请的一些实施例所示的磁路组件2600的纵截面示意图；
图33是根据本申请的一些实施例所示的一种磁路组件2700的纵截面示意图；
图34是根据本申请的一些实施例所示的一种磁路组件2900的纵截面示意图；
图35是根据本申请的一些实施例所示的一种磁路组件3000的纵截面示意图；
图36是根据本申请的一些实施例所示的一种磁路组件3100的纵截面示意图；
图37是根据本申请一些实施例提供的眼镜的应用场景及结构示意图；
图38根据是本申请一些实施例提供的一种夹角方向的示意图；
图39根据是本申请一些实施例提供的骨传导扬声组件作用于人体皮肤、骨骼的结构示意图；
图40是根据本申请一些实施例提供的骨传导扬声组件的夹角-相对位移关系图；
图41是根据本申请一些实施例提供的不同夹角θ时骨传导扬声组件的频率响应曲线低频段部分的示意图；
图42是根据本申请的一些实施例所示的骨传导扬声组件的纵截面示意图；
图43是根据本申请一些实施例提供的一个骨传导扬声组件的结构示意图；
图44是根据本申请一些实施例提供的另一个骨传导扬声组件的结构示意图；
图45是根据本申请一些实施例提供的又一个骨传导扬声组件的结构示意图；
图46是根据本申请一些实施例提供的骨传导扬声组件的壳体结构示意图；
图47A是根据本申请中一些实施例提供的扬声组件的结构示意图；
图47B是根据本申请中一些实施例提供的扬声组件的结构示意图；
图48是根据本申请图28A和28B提供的扬声组件的抑制漏音效果图；
图49是根据本申请中一些实施例提供的接触面与使用者之间不同压力下的骨传导扬声组件的振动响应曲线；
图50根据本申请中一些实施例提供的接触面与使用者之间不同压力下的骨传导扬声组件的振动响应曲线；
图51是根据本申请中一些实施例提供的扬声组件扬声器振动单元接触面的示意图；
图52是根据本申请中一些实施例提供的扬声组件的振动响应曲线；
图53是根据本申请中一些实施例提供的扬声组件振动单元接触面的示意图；
图54是根据本申请中一些实施例提供的扬声组件面板粘结方式的俯视图；
图55是根据本申请中一些实施例提供的扬声组件面板粘结方式的俯视图；
图56是根据本申请中一些实施例提供的扬声组件振动产生部分的结构图；
图57是根据本申请中一些实施例提供的扬声组件振动产生部分的振动响应曲线图；
图58是根据本申请中一些实施例提供的扬声组件振动产生部分的结构图；
图59是根据本申请一些实施例提供的扬声器的爆炸结构图；
图60是根据本申请中一些实施例提供的眼镜局部截面图；
图61是根据本图60中A部分的放大图；
图62是根据本申请中一些实施例提供的眼镜的电子组件在组合状态下沿图19中的A-A轴线的截面图；
图63是图62中B部分的放大图；
图64是根据本申请中一些实施例提供的局部截面图；
图65是根据本申请中一些实施例提供的眼镜的电子组件在组合状态下沿图59中的B-B轴线的截面图；
图66是本申请第一电路板和第二电路板与图65不同夹角的实施例的结构示意图；
图67是根据本申请中一些实施例提供的眼镜的电子组件在组合状态下沿图19中的C-C轴线的截面图；
图68是根据本申请中一些实施例提供的眼镜的电子组件在组合状态下沿图59中的A-A轴线的截面图；
图69是根据本申请中一些实施例提供的眼镜的电子组件在组合状态下沿图59中的B-B轴线的截面图；
图70是根据本申请中一些实施例提供的眼镜扬声组件的局部结构截面图；
图71是图66中C部分的局部放大图；
图72是根据本申请中一些实施例提供的眼镜扬声组件的机芯壳体的部分结构示意图；
图73是图72中D部分的局部放大图；
图74是根据本申请中一些实施例提供的眼镜扬声组件的机芯壳体的局部截面图；
图75是本申请一种通过气传导的方式传递声音的示意图。
具体实施方式
为了更清楚地说明本申请的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本发明，而并非以任何方式限制本发明的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。其他术语的相关定义将在下文描述中给出。以下，不失一般性，本申请中描述的“眼镜”或“太阳镜”表示的是带有扬声组件的“眼镜”或“太阳镜”。对于该领域的普通技术人员来说，“眼镜”或“太阳镜”也可用其他同类词语代替，比如“护目装置”、“眼部可穿戴装置”等。“扬声装置”也可用其他同类词语代替，比如“助听器”、“播放器”、“播放装置”等。对于本领域的专业人员来说，在了解眼镜的基本原理后，可能在不背离这一原理的情况下，对实施眼镜的具体方式与步骤进行形式和细节上的各种修正和改变，特别地，在眼镜中加入环境声音拾取和处理功能，使该眼镜实现助听器的功能。例如，麦克风等传声器可以拾取使用者/佩戴者周围环境的声音，在一定的算法下，将声音处理后(或者产生的电信号)传送至眼镜中的扬声组件部分。即，眼镜可以经过一定的修改，加入拾取环境声音的功能，并经过一定的信号处理后通过扬声组件部分将声音传递给使用者/佩戴者，从而实现助听器的功能。作为举例，这里所说的算法可以包括噪声消除、自动增益控制、声反馈抑制、宽动态范围压缩、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制等一种或多种的组合。
图1所示为根据本申请一些实施例所示的一种扬声器的结构模块图。
扬声器100可以至少包括耳机芯102、辅助功能模块104和软性电路板106。
在一些实施例中，耳机芯102可以接收音频电信号并将音频信号转换为声音信号。软性电路板106为不同模块/组件之间提供电连接。例如，软性电路板106可以提供耳机芯102与外部控制电路和辅助功能模块104之间的电连接。
在一些实施例中，耳机芯102可以至少包括磁路组件、振动组件以及容纳磁路组件和振动组件的支架。磁路组件用于提供磁场，振动组件用于将输入至振动组件的电信号转化为机械振动信号，并由此产生声音。在一些实施例中，振动组件可以至少包括线圈和内部引线。在一些实施例中，耳机芯102还包括外部导线，外部导线能够将音频电流传输至振动组件中的线圈。外部导线可以一端连接耳机芯的内部引线，一端连接扬声器的软性电路板。在一些实施例中，支架可以具有埋线槽，所述外部导线和/或所述内部导线可以部分设置于所述埋线槽内，具体详见本申请其他部分的描述。
在一些实施例中，辅助功能模块104用于接收辅助信号，执行辅助功能。辅助功能模块104可以为区别于耳机芯之外的用于接收辅助信号而执行辅助功能的模块。在本申请中，将音频信号转换为声音信号可以认为是扬声器100的主要功能，而不同于主要功能的其他功能可以认为是扬声器100的辅助功能。例如，扬声器100的辅助功能可以包括通过麦克风接收用户和/或环境声音，通过按键控制所述声音信号的播放过程等。其对应的辅助功能模块可以是麦克风、按键开关等，具体可根据实际需求设置。所述辅助信号可以是与辅助功能相关的电信号、光信号、声信号和振动信号中的一种或多种的组合。
扬声器100还包括用于容纳所述耳机芯102、所述辅助功能模块104和所述软性电路板106的机芯壳体108。当扬声器100是一种骨传导耳机时，机芯壳体108的内壁可以和耳机芯中的振动组件直接或者间接相连接，当用户佩戴所述骨传导耳机时，机芯壳体108的外壁与用户接触并将振动组件的机械振动经由骨骼传递到听觉神经，使人体听到声音。在一些实施例中，扬声器可以包括耳机芯102、辅助功能模块104、软性电路板106和机芯壳体108。
在一些实施例中，所述软性电路板106可以是柔性电路板(Flexible Printed Circuit，FPC)，并容置于机芯壳体108的内部空间。所述软性电路板106可以具有高可挠性，能够适应机芯壳体108内部空间。具体的，在一些实施例中，软性电路板106可以包括第一板体和第二板体。所述软性电路板106可以在第一板体和第二版体处进行弯折，从而适应其在机芯壳体108中的位置等。更具体的内容请参见本申请中其他部分的描述。
在一些实施例中，扬声器100通过骨传导方式传递声音。机芯壳体108外表面可以具有贴合面。所述贴合面为当用户佩戴扬声器100时，扬声器100的与人体相接触的外表面。扬声器100能够将贴合面压紧在预设区域(耳屏前端、头骨位置或耳廓背面)，从而有效地将振动信号经由骨骼传递给用户的听觉神经，提高扬声器100的音质。在一些实施例中，贴合面可以与耳廓背面贴合。机械振动信号由耳机芯传导至机芯壳体，并通过机芯壳体的贴合面传导至耳廓背面，进而由耳廓背面附近的骨骼将振动信号传至听神经。在这种情况下，耳廓背面附近骨骼更接近听神经，具有更好的传导效果，可以提高扬声器100向听神经传递声音的效率。
在一些实施例中，扬声器100还包括固定机构110。固定机构110与所述机芯壳体108外 部连接，用于支撑并保持所述机芯壳体108的位置。在一些实施例中，所述固定机构110内可以设置有电池组件和控制电路。所述电池组件可以为扬声器100中的任意电子组件提供电能。所述控制电路可以控制扬声器100中的任意功能组件，所述功能组件包括但不限于耳机芯、辅助功能模块等。所述控制电路可以通过软性电路板与电池及其他功能组件连接，也可以通过导线与电池及其他功能组件连接。
在一些实施例中，固定机构110可以为眼镜架、帽子、头饰或其他头戴用品中的一种或几种的组合。例如，固定机构110可以是眼镜架。眼镜架内部形成空腔，可以容纳电池组件、软性电路板和控制电路。在这种情况下，耳机芯102可以位于眼镜腿的尾端，在用户佩戴眼镜时位于耳边并提供声音信号。
图2所示为根据本申请一些实施例所示的一种位于机芯壳体内部的软性电路板的结构示意图。
在一些实施例中，软性电路板上可以设置多个焊盘，并通过若干不同的软性引线将不同的信号导线(例如，音频信号导线、辅助信号导线)与不同的焊盘分别电连接，以避免音频信号导线和辅助信号导线都需要与耳机芯或辅助功能模块连接，产生的内部导线众多并且繁杂的问题。如图2和图3所示，软性电路板44至少包括多个第一焊盘45和多个第二焊盘(未在图中示出)。在一些实施例中，图2中的软性电路板44与图1中软性电路板106相对应。所述第一焊盘45中的至少一个第一焊盘45与辅助功能模块电连接，所述至少一个第一焊盘45通过所述软性电路板44上的第一软性引线47与至少一个所述第二焊盘电连接，所述至少一个第二焊盘通过外部导线(未在图中示出)与所述耳机芯(未在图中示出)电连接。所述第一焊盘45中的至少另一个第一焊盘45与辅助信号导线电连接，所述至少另一个第一焊盘45与所述辅助功能模块通过所述软性电路板44上的第二软性引线49电连接。在本实施例中，至少一个第一焊盘45与辅助功能模块电连接，至少一个第二焊盘通过外部导线和耳机芯电连接，再通过第一软性引线47将至少一个第一焊盘45中的一个与至少一个第二焊盘中的一个进行电连接，使得外部音频信号导线和辅助信号导线同时通过软性电路板与耳机芯和多个辅助功能模块电连接，简化了走线的排布。
在一些实施例中，所述音频信号导线可以是与耳机芯电连接并向耳机芯传输音频信号的导线。所述辅助信号导线可以是与辅助功能模块电连接并与辅助功能模块进行信号传输的的导线。
在一些实施例中，参见图2，具体地，所述软性电路板44上设置有多个焊盘45以及两个焊盘(未在图中标出)，该两个焊盘与多个焊盘45位于软性电路板44的同一侧并间隔设置。且两个焊盘通过软性电路板44上的软性引线47连接至多个焊盘45中对应的两个焊盘45上。进一步地，该机芯壳体41内还容纳有两条外部导线，每条外部导线的一端焊接在对应的焊盘上，另一端连接至耳机芯，从而使得耳机芯通过外部导线与焊盘连接。辅助功能模块可贴装于该软性电路板44上，并通过该软性电路板44上的软性引线49连接至多个焊盘45中的其它焊盘上。
在一些实施例中，扬声器100的固定机构110中设置有导线，导线至少包括音频信号导线和辅助信号导线。在一些实施例中，固定机构110中的导线可以是多条，包括至少两条音频信号导 线和至少两条辅助信号导线。例如，固定机构110可以是眼镜架，眼镜架与机芯壳体41连接，导线可以是设置在眼镜架中的导线。眼镜架中的导线的一端焊接至控制电路板上，另一端则进入机芯壳体41内部，并与软性电路板44上的焊盘45焊接。
其中，眼镜架中的导线中的两条音频信号导线的位于机芯壳体41内的一端焊接至两条软性引线47所焊接的两个焊盘45，另一端可直接或间接连接在控制电路板上，该两个焊盘45进一步通过软性引线49与两个焊盘46的焊接，以及两条外部导线与焊盘的焊接而连接耳机芯，从而向耳机芯传递音频信号。
至少两条辅助信号导线的位于机芯壳体41内的一端焊接至软性引线49所焊接的焊盘45上，另一端则可直接或间接连接在控制电路板上，从而向控制电路(未在图中示出)传递由辅助功能模块接收并转化得到的辅助信号。
上述方式中，在机芯壳体41内设置软性电路板44，并在软性电路板44上进一步设置相应的焊盘，从而将导线(未在图中示出)进入机芯壳体41内后焊接在相应的焊盘上，并进一步通过焊盘上的软性引线47、软性引线49进一步再连接相应的辅助功能模块，从而避免将多个导线均直接连接在的辅助功能模块上而使得机芯壳体41内的走线繁杂的情况，从而能够优化走线的排布，并节约机芯壳体41空间的占用；而且将多个眼镜架导线均直接连接在的辅助功能模块上时，眼镜架导线的中间部位悬挂于机芯壳体41内而容易造成的振动，从而带来异响以影响耳机芯的发声质量，而按照上述方式中将眼镜架中的导线焊接在软性电路板44上而进一步连接相应的辅助功能模块则能够减少导线悬挂而影响耳机芯发生质量的情况，从而在一定程度上能够提高耳机芯的发声质量。
在一些实施例中，可以进一步在软性电路板(或称为软性电路板44)上进行分区，将软性电路板划分成至少两个区域。每一分区上可以设置有一个辅助功能模块，以使得软性电路板上可以设置有至少两个辅助功能模块，通过软性电路板实现音频信号导线和辅助信号导线与至少两个辅助功能模块之间的走线。在一些实施例中，所述软性电路板可以至少包括主体电路板和第一分支电路板。所述第一分支电路板和所述主体电路板相连，并远离所述主体电路板沿所述主体电路板的一端延伸。辅助功能模块可以至少包括第一辅助功能模块和第二辅助功能模块。第一辅助功能模块可以设置于所述主体电路板上，第二辅助功能模块可以设置于所述第一分支电路板上。多个第一焊盘可以设置于所述主体电路板上，第二焊盘可以设置于所述第一分支电路板上。在一些实施例中，所述第一辅助功能模块可以为按键开关，所述按键开关可以设置于所述主体电路板上，并对应于按键开关设置所述第一焊盘。所述第二辅助功能模块可以为麦克风，所述麦克风设置于第一分支电路板上，并在第一分支电路板上设置有对应于麦克风的第二焊盘。通过第二软性引线连接所述主体电路板上对应于按键开关的第一焊盘与第一分支电路板上对应于麦克风的第二焊盘，可以将按键开关与麦克风进行电连接，使按键开关可以对麦克风进行控制或操作。
在一些实施例中，所述软性电路板还可以包括第二分支电路板，所述第二分支电路板和所述主体电路板相连，并远离所述主体电路板沿所述主体电路板的另一端延伸，并与所述第一分支电路板间隔设置。所述辅助功能模块还可以包括第三辅助功能模块，所述第三辅助功能模块设置在所 述第二分支电路板上。所述多个第一焊盘设置于所述主体电路板上，至少一个所述第二焊盘设置于所述第一分支电路板上，其他所述第二焊盘设置与所述第二分支电路上。在一些实施例中，所述第三辅助功能模块可以是第二麦克风。第二分支电路板与主体电路板垂直延伸，第二麦克风贴装于第二分支电路板远离主体电路板的端部，多个焊盘则设置于主体电路板远离和第二分支电路板的端部。
具体地，如图2和图3所示，第二辅助功能模块可以是第一麦克风432a，第三辅助功能模块可以是第二麦克风432b。其中，第一麦克风432a和第二麦克风432b都可以是MEMS(微型机电系统)麦克风432，工作电流小，性能较为稳定，且产生的语音质量高。两个麦克风432根据实际需求可设置在软性电路板44的不同位置上。
其中，软性电路板44包括主体电路板441(或称为主体电路板)以及与主体电路板441连接的分支电路板442(或称为第一分支电路板)和分支电路板443(或称为第二分支电路板)，分支电路板442与主体电路板441同向延伸，第一麦克风432a贴装于分支电路板442远离主体电路板441的端部，分支电路板443与主体电路板441垂直延伸，第二麦克风432b贴装于分支电路板443远离主体电路板441的端部，多个焊盘45则设置于主体电路板441远离分支电路板442和分支电路板443的端部。
在一实施方式中，机芯壳体41包括环绕设置的周侧壁411以及与周侧壁411的一端面连接的底端壁412，进而形成具有一开口端的容置空间。其中，耳机芯经开口端放置于容置空间内，第一麦克风432a固定于底端壁412上，第二麦克风432b固定于周侧壁411上。
本实施方式中，可以适当对分支电路板442和/或分支电路板443进行弯折，以适应麦克风432对应的入声孔在机芯壳体41上的位置的设置。具体地，软性电路板44可以主体电路板441平行于底端壁412的方式设置于机芯壳体41内，从而能够使得第一麦克风432a对应于底端壁412，而无需对主体电路板441进行弯折。而第二麦克风432b由于固定于机芯壳体41的周侧壁411上，因此需要对第二主体电路板441进行弯折设置，具体可将分支电路板443在远离主体电路板441的端部弯折设置，以使得分支电路板443的板面垂直于主体电路板441和分支电路板442的板面，并进而使得第二麦克风432b朝向背离主体电路板441和分支电路板442的方向而固定于机芯壳体41的周侧壁411上。
在一实施方式中，焊盘45、焊盘、第一麦克风432a和第二麦克风432b均可设置于软性电路板44的同一侧，焊盘与第二麦克风432b相邻设置。
其中，焊盘可具体设置于分支电路板443远离主体电路板441的端部，并与第二麦克风432b朝向相同并间隔设置，从而随分支电路板443的弯折而垂直于焊盘45的朝向。需要指出的是，分支电路板443在弯折后其板面也可以不垂直于主体电路板441的板面，具体可根据周侧壁411与底端壁412之间的设置方式而定。
进一步地，软性电路板44的另一侧设置有用于支撑焊盘45的刚性支撑板4a、麦克风刚性支撑板4b，该麦克风刚性支撑板4b包括用于支撑第一麦克风432a的刚性支撑板4b1以及用于共同支撑焊盘46与第二麦克风432b的刚性支撑板4b2。
其中，刚性支撑板4a、刚性支撑板4b1和刚性支撑板4b2主要用于对相应的焊盘和麦克风432起支撑作用，从而需具有一定的强度。三者的材质可以相同或者不同，具体可以为聚酰亚胺(PolyimideFilm，PI)，或者其它能够起到强度支撑作用的材质，如聚碳酸酯、聚氯乙烯等。另外，三个刚性支撑板的厚度可以根据刚性支撑板本身所具有的强度以及焊盘45、焊盘以及第一麦克风432a、第二麦克风432b所实际需求的强度进行设定，此处不做具体限定。
其中，刚性支撑板4a、刚性支撑板4b1和刚性支撑板4b2可以为一个刚性支撑板整体的三个不同区域，或者也可以是三个彼此间隔设置的独立的整体，此处不做具体限定。
在一实施方式中，第一麦克风432a和第二麦克风432b分别对应于两个麦克风组件(未在图中示出)。在一实施方式中，两个麦克风组件的结构相同，机芯壳体41上设置有入声孔413，进一步地，该扬声装置在机芯壳体41处还设置有一体成型于机芯壳体41的内表面的环形挡壁414，并设置于入声孔413的外围，进而定义一与入声孔413连通的容置空间(未在图中示出)。
在一实施方式中，软性电路板44可设置于刚性支撑板(如，刚性支撑板4a、刚性支撑板4b1和刚性支撑板4b2)和麦克风432之间，并在对应于麦克风刚性支撑板4b的入声孔4b3的位置设置有入声孔444。
进一步地，软性电路板44进一步向远离麦克风432的方向延伸，以与其它功能元件或导线连接而实现相应的功能。对应地，麦克风刚性支撑板4b上也随着软性电路板向远离麦克风432的方向延伸出一段距离。
对应地，环形挡壁414上设置有与软性电路板44的形状匹配的缺口，以允许该软性电路板44从容置空间延伸而出。另外，可在该缺口处进一步填充密封胶，以进一步提高密封性。
在一些实施例中，如图4所示，软性电路板44可包括主体电路板445以及分支电路板446，其中，该分支电路板446可沿垂直于主体电路板445的延伸方向而延伸。其中多个焊盘45设置于主体电路板445远离分支电路板446的端部，按键开关贴装于主体电路板445上，焊盘46设置于分支电路板446远离主体电路板445的端部。第一辅助功能模块可以是按键开关431，第二辅助功能模块可以是麦克风432。
本实施方式中，软性电路板44的板面与底端壁412平行间隔设置，以使得按键开关可朝向机芯壳体41的底端壁412设置。
如前所述，耳机芯(或称为耳机芯102)可以包括磁路组件、振动组件、外部导线、支架。其中，振动组件包括线圈和内部引线，外部导线能够将音频电流传输至振动组件中的线圈。外部导线可以一端连接耳机芯的内部引线，一端连接扬声器的软性电路板。支架可以具有埋线槽，至少部分所述外部导线和/或所述内部导线可以设置于所述埋线槽内。在一些实施例中，内部引线和外部引线彼此焊接连接，焊接位置可以位于所述埋线槽内。
具体的，参见图5和图6，耳机芯包括支架421、线圈422以及外部导线48。支架421用于对整个耳机芯结构起支撑以及保护作用。本实施方式中，支架421上设置有埋线槽4211，可用于容纳耳机芯的线路。
线圈422可设置于支架421上，并具有至少一个内部引线423，该内部引线423的一端与线圈422中的主线路连接，以将主线路引出，并通过该内部引线423向线圈422传输音频电流。
外部导线48一端与内部引线423进行连接，进一步地，该外部导线48另一端可连接至控制电路(未在图中标出)，以通过控制电路而藉由内部引线423向线圈422传输音频电流。
具体地，在装配阶段，需要将外部导线48和内部引线423通过焊接等方式连接在一起，由于结构等因素的限制，在焊接完成后，不能使得线的长度与通道的长度恰好一致，通常会有多余长度的线。而多余长度的线若不能够得到合理的放置，则会随线圈422的振动而振动，从而发出异响，影响耳机芯所发出的声音质量。
进一步地，可将外部导线48和内部引线423中的至少一个卷绕设置于埋线槽4211内，在一个应用场景中，可将内部引线423和外部导线48之间的焊接位置设置于埋线槽4211内，从而将外部导线48和内部引线423位于焊接位置附近的部分卷绕于埋线槽4211内。另外，为了保持稳定，可进一步在埋线槽4211内填充密封胶，从而对埋线槽4211中的走线起固定作用。
上述方式中，在支架421上设置埋线槽4211，从而将外部导线48和内部引线423中的至少一个卷绕设置于埋线槽4211内，以收纳多余长度的走线，从而减弱其在通道当中所产生的振动，进而减少由于振动产生异响而对耳机芯所发出的声音质量的影响。
在一实施方式中，支架421包括环形主体4212、支撑凸缘4213以及外挡壁4214。其中，环形主体4212、支撑凸缘4213以及外挡壁4214可通过一体成型得到。
其中，环形主体4212设置于整个支架421的内侧，用于支撑线圈422。具体地，环形主体4212的沿垂直于环形径向的方向上的横截面与线圈422一致，线圈422设置于该环形主体4212的朝向机芯壳体内部一端，且该环形主体4212的内侧壁和外侧壁可分别与线圈422的内侧壁与外侧壁平齐，从而使得线圈422的内侧壁与环形主体4212的内侧壁共面设置，以及线圈422的外侧壁与环形主体4212的外侧壁共面设置。
进一步地，支撑凸缘4213凸出设置于环形主体4212的外侧壁上，并向环形主体4212的外侧延伸，具体可沿垂直于环形主体4212的外侧壁的方向向外侧延伸。其中，该支撑凸缘4213可设置于环形主体4212的两端部之间的位置。本实施方式中，该支撑凸缘4213可以环绕环形主体4212的外侧壁凸出形成一环状的支撑凸缘4213。在其它实施方式中，也可以根据需求而仅在环形主体4212的外侧壁的部分位置凸出形成。
外挡壁4214与支撑凸缘4213连接并沿环形主体4212的侧向与环形主体4212间隔设置。其中，外挡壁4214可间隔套设于环形主体4212和/或线圈422的外围，具体可根据实际需求而部分套设于环形主体4212和线圈422的外围，而部分套设于环形主体4212的外围。需要指出的是，本实施方式中，外挡壁4214靠近埋线槽4211的部分套设于部分环形主体4212的外围。具体地，外挡壁4214设置于支撑凸缘4213的远离机芯壳体的一侧。其中，环形主体4212的外侧壁与支撑凸缘4213远离机芯壳体的侧壁以及外挡壁4214的内侧壁共同定义该埋线槽4211。
在一实施方式中，环形主体4212和支撑凸缘4213上设置有走线通道424，内部引线423 经走线通道424延伸至埋线槽4211内。
其中，该走线通道424包括位于环形主体4212上的子走线通道4241和位于支撑凸缘4213上的子走线通道4242。子走线通道4241贯穿环形主体4212的内侧壁和外侧壁设置，并在环形主体4212于靠近线圈422的一侧设置有连通该子走线通道4241一端的走线口42411，在靠近支撑凸缘4213的朝向机芯壳体内部一侧设置有连通该子走线通道4241另一端的走线口42412；子走线通道4242则沿朝向机芯壳体外部的方向贯通支撑凸缘4213，并在支撑凸缘4213朝向机芯壳体内部一侧设置有连通该子走线通道4242一端的走线口42421，在远离机芯壳体内部一侧设置有连通子走线通道4242另一端的走线口42422。其中，走线口42412与走线口42421通过支撑凸缘4213与环形主体4212之间的空间连通。
进一步地，内部引线423可进入走线口42411，并沿子走线通道4241延伸，并从走线口42412穿出而进入环形主体4212与支撑凸缘4213之间的区域，进一步由走线口42421进入子走线通道4242，在由走线口42422穿出后延伸入埋线槽4211。
在一实施方式中，外挡壁4214的顶端设置有开槽42141，外部导线48可经开槽42141延伸至埋线槽4211内。
其中，外部导线48的一端设置于柔性电路板44上，该柔性电路板44具体设置于耳机芯的朝向机芯壳体内部一侧。
本实施方式中，支撑凸缘4213进一步延伸至外挡壁4214的远离环形主体4212的一侧，以形成一外边缘。进一步地，该外边缘环绕抵接于机芯壳体的内侧壁。具体地，支撑凸缘4213的外边缘设置有开槽42131，从而使得位于耳机芯的朝向机芯壳体内部一侧的外部导线48能够通过该经开槽42131延伸至而由支撑凸缘4213的朝向机芯壳体外部一侧，进而延伸至开槽42141，并由开槽42141而进入埋线槽4211。
进一步地，机芯壳体内侧壁上设置有一端位于软性电路板44一侧，另一端连通开槽42131的沿朝向机芯壳体外部的方向延伸的导引槽416，以使得在外部导线48通过该导引槽416而由软性线路板延伸至第二走线槽3331。
在一实施方式中，支架421进一步包括沿环形主体4212的周向间隔设置且连接环形主体4212、支撑凸缘4213和外挡壁4214的两个侧挡壁4215，进而在两个侧挡壁4215之间定义埋线槽4211。
具体地，两个侧挡壁4215相对设置于支撑凸缘4213上，沿支撑凸缘4213朝向机芯壳体外部一侧凸出。其中，两个侧挡壁4215的朝向环形主体4212的一侧与环形主体4212的外侧壁连接，远离环形主体4212的一侧终止于外挡壁4214的外侧壁，并将走线口42422以及开槽42141限定于两个侧挡壁4215之间，从而使得由走线口42422穿出的内部引线423以及由开槽42141进入的外部导线48延伸入两个侧挡壁4215定义的埋线槽4211当中。
图7所示为根据本申请一些实施例所示的一种扬声器的结构示意图。
在一些实施例中，扬声器可以为眼镜。在一些实施例中，固定机构为可以是眼镜架。固定 机构可以具有至少一个转轴组件，所述转轴组件用于连接眼镜框和眼镜腿，所述眼镜框和所述眼镜腿能够围绕所述转轴组件转动，转轴组件具有沿轴线设置的转轴走线通道。固定机构中可以设置有连接线，连接线为电连接线，连接线穿设于所述转轴走线通道内，两端分别延伸至所述眼镜框内和所述眼镜腿内。在一些实施例中，两侧的眼镜腿内可以分别容纳有控制电路和电池组件，所述眼镜框内的连接线电连接所述控制电路和所述电池组件。连接线可以包括所述音频信号导线和所述辅助信号导线。连接线可以与机芯壳体(即机芯壳体108)内的软性电路板(即软性电路板106)电连接，通过软性电路板与耳机芯(即耳机芯102)和辅助功能模块(即辅助功能模块104)电连接。
在一些实施例中，本申请的眼镜可以是在人们日常生活、工作过程中所佩戴的用以矫正视力、保护眼睛的眼镜，或者是在上述眼镜的基础上进一步加设一定的电路结构、电子元件等，以进一步通过这些电路结构和电子元件等以实现特定功能的眼镜。具体地，本申请中的眼镜可以是智能眼镜、虚拟现实眼镜、全息眼镜、增强现实眼镜、带有其他功能结构的眼镜(如带有骨传导耳机或者气传导耳机的眼镜等)。
在一些实施例中，如图7所示，所述眼镜架可以包括：眼镜框11、鼻托12、眼镜片13以及眼镜腿15。
其中，眼镜框11用于承载至少部分眼镜片13，鼻托12用于在用户佩戴时，将眼镜支撑于用户的鼻梁上。
鼻托12设置于眼镜框11的中部，并和眼镜框11一体成型。现有技术当中，眼镜框11与鼻托12通常分别成型，其中，眼镜框11的中部设置有与鼻托12连接的结构，在成型后，将鼻托12安装在眼镜框11的连接结构上。而本实施方式中则直接形成结构为一体的眼镜框11和鼻托12，具体地，可采用对应的模具，通过注塑等方式一体成型。本实施方式中的眼镜框11和鼻托12在形成之后无需再进一步进行安装，从而能够简化眼镜的制作工序。
另外，眼镜片13也采用一体设计，并由眼镜框11和鼻托12以卡接方式对眼镜片13进行固定。
进一步地，眼镜框11和鼻托12上分别设置有对眼镜片13进行卡接的结构，在对眼镜进行组装时，将一体设计的眼镜片13直接通过对应的卡接结构卡接在一体成型的眼镜框11和鼻托12上即可。
上述实施方式中，眼镜框11和鼻托12一体成型，且眼镜片13也采用一体设计，从而使得整个眼镜结构简单，且能够简化眼镜的制作工序。
请进一步参阅图7，图7是本申请眼镜一实施方式的爆炸图。本实施方式中，眼镜片13包括一顶侧边缘131以及与顶侧边缘131的两端连接且远离鼻托12设置的两个外侧边缘132，每个外侧边缘132分别凸出设置有第一扣位1321，眼镜框11设置有用于接收顶侧边缘131和至少部分外侧边缘132的第一安装槽111以及与第一安装槽111连通并用于接收第一扣位1321的第一扣位槽112。
其中，在眼镜处于佩戴状态时，顶侧边缘131位于眼镜片13的上侧，外侧边缘位于眼镜片 13靠近用户耳朵的两侧，顶侧边缘131与两个外侧边缘132互相连接在一起。第一安装槽111设置于眼镜框11朝向眼镜片13的一侧，其尺寸与对应的眼镜片13的顶侧边缘131和两个外侧边缘132相匹配，以使得眼镜片13能够通过将顶侧边缘131和至少部分的外侧边缘132安装在第一安装槽111内进而安装在眼镜框11上。
进一步地，第一扣位1321由眼镜片13的至少部分外侧边缘131进一步向远离鼻托12的两侧延伸而形成，第一扣位槽112则由第一安装槽111中对应第一扣位1321的位置朝远离镜片13的方向凹陷而形成。其中，第一扣位槽112的形状尺寸与第一扣位1321匹配，使得眼镜片13能够进一步通过将第一扣位1321卡接在第一扣位槽112内而安装在眼镜框11上。
需要指出的是，至少部分外侧边缘132位于第一扣位1321远离顶侧边缘131的一侧，以使得第一扣位1321沿眼镜片13的边缘的两侧附近的眼镜片13均容置于第一安装槽111内，从而使得眼镜片13能够更加牢固得固定在眼镜框11上。
在一实施方式中，眼镜片13还包括与鼻托12抵接的内侧边缘133，鼻托12设置有用于接收内侧边缘133的第二安装槽121。
需要指出的是，眼镜片13包括左眼镜片和右眼镜片，眼镜片13的内侧边缘133设置于左眼镜片与右眼镜片的连接处及连接处的附近。相应地，第二安装槽121与第一安装槽111相对设置从而使得眼镜片13的相对两侧分别收容并固定于眼镜框11和鼻托12所构成的容置空间中。
在一实施方式中，内侧边缘133的两侧分别凸出设置有第二扣位1331，鼻托12上进一步设置有与第二安装槽121连接并用于接收第二扣位1331的第二扣位槽122。
其中，内侧边缘133包括互相连接的两部分，分别设置于左眼镜片朝向右眼镜片的一侧，以及右眼镜片朝向左眼镜片的一侧。鼻托12也分为两部分，在用户佩戴时，分别对应支撑在用户的左右两侧鼻梁上。相应地，本实施方式中，第二扣位槽122与第二扣位1331的数量也均为两个。第二扣位1331的形状尺寸与对应的第二扣位槽122相匹配，以将第二扣位1331分别安装在对应的第二扣位槽122中。
另外，眼镜片13在第二扣位1331的两侧附近均设置有内侧边缘133，从而使得第二扣位1331的两侧附近均能够安装在第二安装槽121中，以使得眼镜片13能够更加牢固得固定在鼻托12上。
通过上述方式，眼镜片13分别通过顶侧边缘131、外侧边缘132、内侧边缘133以及第一扣位1321和第二扣位1331将眼镜片13安装在眼镜框11和鼻托12上。
在一个应用场景中，眼镜片13上还设置有透气孔134，具体地，透气孔的数量可以为两个，分别设置在左右两侧的眼镜片13靠近顶侧边缘131的位置。透气孔134的设置，能够使得用户在佩戴眼镜时，眼镜片13的内外两侧能够实现空气流通，以减少由于用户运动等原因造成的局部过热而引起的眼镜片13起雾的现象。
具体地，请进一步一并参阅图7和图8，其中，图7为根据本申请一些实施例所示的一种扬声器的爆炸图，图8为本申请眼镜一实施方式中鼻托套的结构示意图。在一实施方式中，鼻托12 包括在佩戴状态下的第一安装槽111的靠近用户一侧或远离用户一侧与眼镜框11连接的连接部123，以及在连接部123远离眼镜框11一侧与连接部123呈倒Y字连接的两个支撑部124，支撑部124用于在佩戴时将眼镜支撑在用户的鼻梁上。
在一个应用场景中，连接部123与眼镜框11为一体连接，且在用户佩戴时，连接部123设置在第一安装槽111靠近用户的一侧。
每个支撑部124朝向用户鼻梁的一侧凸出设置有工字形卡勾1241，眼镜进一步包括以可拆卸方式套设在卡勾1241上的鼻托套14。
其中，鼻托套14可由软胶制成。具体地，工字形卡勾1241的数量可为两个，分别对应于用户的左右鼻梁，鼻托套14包括两个套本体141，以及连接两个套本体141的连接部142，其中，连接部142于用户的鼻梁上方连接在一起。套本体141对应设置有与卡勾1241匹配的工字形容置槽1411，且套本体141朝向用户鼻梁的一侧还可设置由多个凹槽组成的防滑部1412。本实施方式中，鼻托套14可拆卸设置，从而方便鼻托套14的清洗以及更换。
进一步地，在一实施方式中，两个支撑部124背离卡勾1241的一侧凸出设置有条状凸肋1242，条状凸肋1242与两个支撑部124配合，以形成第二安装槽121和第二扣位槽122。
其中，条状凸肋1242沿两个支撑部124远离眼镜片13的边沿凸出设置，从而形成接收眼镜片13的内侧边缘133的第二安装槽121。在对应于眼镜片13的第二扣位1331的位置，条状凸肋1242进一步凹陷形成第二扣位槽122。
请一并参阅图7，在一实施方式中，眼镜架进一步还包括眼镜腿15、功能组件16以及连接线17。其中，眼镜腿15包括第一眼镜腿151和第二眼镜腿152，功能组件16包括第一功能组件161和第二功能组件162。
具体地，第一眼镜腿151和第二眼镜腿152分别与眼镜框11连接，第一功能组件161和第二功能组件162分别设置于第一眼镜腿151和第二眼镜腿152上，两条眼镜腿15上分别设置至少一腔体，以用来容置对应的功能组件16。
连接线17设置于第一安装槽111内，且介于第一安装槽111的底部与眼镜片13的顶侧边缘131之间，并进一步延伸至第一眼镜腿151和第二眼镜腿152，以电连接第一功能组件161与第二功能组件162。
本实施方式中，分别设置于两条眼镜腿15的功能组件16需要通过连接线17进行电性连接，以使眼镜实现特定功能。具体地，在一个应用场景中，第一功能组件161为电池组件，第二功能组件162为控制电路组件，控制电路组件通过连接线17与电池组件连接，以使得电池组件为控制电路组件提供电量，从使控制电路组件实现特定功能。
为了眼镜的美观、轻便等需求，连接线17沿眼镜片13的顶侧边缘131设置于第一安装槽111内，并容置于第一安装槽111与眼镜片13的顶侧边缘131所形成的空间内，从而使得连接线17既不会露出于眼镜的外表面，也不会额外占用空间。在一个应用场景中，连接线17还可在第一安装槽111内沿眼镜片13的外侧边缘132进一步延伸。
具体地，眼镜框11分别和第一眼镜腿151、第二眼镜腿152还可设置有连通的走线通道，从而使得连接线17能够通过对应的走线通道由眼镜框11的第一安装槽111进入第一眼镜腿151、第二眼镜腿152从而连接第一功能组件161与第二功能组件162。
本实施方式中，连接线17具有电性连接的功能，在其它实施方式中，连接线17还可以具有机械连接功能。
上述实施方式中，第一功能组件161和第二功能组件162分别设置在第一眼镜腿151和第二眼镜腿152上，电连接第一功能组件161与第二功能组件162的连接线17设置于眼镜框11上接收眼镜片13的顶侧边缘131的第一安装槽111内，以使连接线17介于第一安装槽111的底部与眼镜片的顶侧边缘131之间，并进一步延伸至第一眼镜腿151和第二眼镜腿152，从而连接线17不会外露，且不需要为连接线17的设置增设额外的空间，从而能够保持眼镜的美观以及轻便。
请进一步一并参阅图9、图10和图11，图9是本申请眼镜一实施方式中眼镜框与眼镜片的局部截面示意图，图10是图9中A部分的放大图，图11是本申请眼镜一实施方式中连接线的局部结构示意图。本实施方式中，连接线17包括线本体171及包覆设置在线本体171外围的线保护套172。线保护套172的截面形状与第一安装槽111的截面形状匹配，以使得线保护套172以面接触方式保持在第一安装槽111中。
其中，线保护套172为软胶材质，使得连接线17能够进行折弯以匹配第一安装槽111的形状。容易理解地，线本体171较细，若直接安装在第一安装槽111内，与第一安装槽111的底部的接触面积较小，难以牢固得固定在其中。本实施方式中，进一步在线本体171外围设置包绕的线保护套172，一方面能够起到保护线本体171的作用，另一方面还能够通过调节线保护套172的表面积来增大连接线17与第一安装槽111的接触面积，以将线本体171可靠得固定在第一安装槽111内。
进一步地，第一安装槽111的截面形状为使得线保护套172能够以较大面积的面接触的方式保持在第一安装槽111中的形状。例如可以为U形、矩形或者波浪形等，此处不做具体限定。对应地，线保护套172朝向第一安装槽111的底部的一侧的形状则与上述形状对应，以使得线保护套172能够直接或者间接得贴合在第一安装槽111的底部。
在一个应用场景中，请进一步结合图7，线保护套172与眼镜框11之间设置有粘胶层18，以通过粘胶层18将线保护套172固定于第一安装槽111内。
其中，粘胶层18可以设置在第一安装槽111的底部，也可以进一步向两侧延伸设置在第一安装槽111的底部附近的侧壁上，从而能够使得粘胶层18包绕线保护套172，以将连接线17更加牢固的固定在第一安装槽111内。
具体地，本应用场景中，第一安装槽111的截面为矩形，第一安装槽111的底部和线保护套172朝向第一安装槽111的底部的一侧均为平面设置，粘胶层18为设置于二者之间的双面胶层。
进一步地，在一实施方式中，线保护套172朝向眼镜片13的顶侧边缘131的一侧设置有与线本体171对应的凸起部1721，眼镜片13的顶侧边缘131上设置有用于接收凸起部1721的避位 槽1311。
具体地，线本体171的截面可以为圆形，线保护套172可在线本体171朝向第一安装槽111的底部的一侧与线本体171平齐，而在线本体171背离第一安装槽111的底部的一侧仍然呈现出线本体171的形状，从而形成对应的凸起部1721。
进一步地，眼镜片13的顶侧边缘131需进一步设置于第一安装槽111内，本实施方式中进一步在顶侧边缘131上设置用于接收突起部1721的避位槽1311，从而使得在第一安装槽111内装设的连接线17至少部分容置于顶侧边缘131对应的避位槽1311中。
进一步地，凸起部1721沿线保护套172的宽度方向位于线保护套172的中间区域，以在凸起部1721的两侧形成抵接部1722，两个抵接部1722分别与避位槽1311两侧的顶侧边缘131抵接。其中，线保护套172的宽度方向是指垂直于线保护套172沿第一安装槽111的走向的方向，具体如图10中的W所指示的方向。
容易理解地，第一安装槽111的深度有限，若将眼镜片13的顶侧边缘131与连接线17的凸起部1721平齐设置，或者线保护套172与线本体171背离第一安装槽111底部的一侧与线本体171平齐设置，则会减小眼镜片13的顶侧边缘131在第一安装槽111中的插入深度，从而不利于眼镜片13在眼镜框11中稳固安装。而本实施方式中，眼镜片13的顶侧边缘131通过避位槽1311避过部分连接线17，使得顶侧边缘131能够相对于避位槽1311进一步朝向第一安装槽111的底部方向延伸并与凸起部1721两侧的抵接部1722抵接在一起，从而能够在一定程度上减小连接线17占用第一安装槽111内的空间，使得眼镜片13能够更加深得安装在第一安装槽111内，从而提高眼镜片13在眼镜框11中安装的稳定性。
在一个应用场景中，眼镜框11较薄，至少部分的凸起部1721露出于第一安装槽111的外部，以减少连接线17所占用的眼镜框的空间，从而减小第一安装槽111的深度，提高眼镜框11的稳定性。
其中，请进一步结合图2、图12，图12是图7中B部分的局部结构示意图。在一实施方式中，第一扣位1321包括第一子边缘13211、第二子边缘13212和第三子边缘13213。
其中，第一子边缘13211与顶侧边缘131相邻设置，第二子边缘13212远离顶侧边缘131且与第一子边缘13211相对设置，第三子边缘13213则于第一子边缘13211和第二子边缘13212远离眼镜片13的一侧连接第一子边缘13211和第二子边缘13212。
本实施方式中，线保护套172进一步沿第一子边缘13211延伸至第一扣位槽112内。
通过上述方式，将线保护套172保持在第一安装槽111内并延伸至第一扣位槽112以隐藏在眼镜框11中，从而在用户使用过程中拆装眼镜片13时，线保护套172不会在眼镜片13拆卸下来后外露出来，以保持眼镜的美观。
进一步地，线保护套172在向第一扣位槽112延伸时，截止于第一子边缘13211与第三子边缘13213的连接处。当然，线保护套172也可以不截止而随线本体171继续延伸，只要使得在拆卸眼镜片13时线保护套172不会露出即可。
请进一步一并参阅图13，图13是本申请眼镜一实施方式的局部结构的截面放大示意图。本实施方式中的眼镜进一步包括转轴组件19。
其中，转轴组件19的数量为两个，分别用于连接眼镜框11和两条眼镜腿15，以使得眼镜框11和眼镜腿15能够绕转轴组件19进行相对转动。其中，转轴组件19沿轴向设置有转轴走线通道1901，连接线17穿设于转轴走线通道1901内并分别延伸至眼镜框11及眼镜腿15。
具体地，本实施方式中的连接线17通过转轴走线通道1901后，一端直接延伸至一条眼镜腿15，另一端进入至眼镜框11，并沿第一安装槽111进一步延伸至另一条眼镜腿15，进而电连接分别位于两条眼镜腿15内的两个功能组件16。
本实施方式中，转轴走线通道附近的连接线17可以不包括线保护套172。转轴走线通道1901可以贯穿转轴组件19。
容易理解地，眼镜框11和眼镜腿15之间发生折叠时，转轴组件19附近的结构的相对位置会产生改变，而此时，若位于眼镜框11和眼镜腿15之间的连接处的连接线17直接绕转轴组件19的外围设置，那么此处的连接线17将会随着眼镜框11或者眼镜腿15的折叠而发生挤压或拉扯，甚至变形、断裂，从而影响连接线17的稳定性，缩短连接线17的使用寿命。
而本实施方式中，转轴组件19沿轴向设置有转轴走线通道1901，位于眼镜框11和眼镜腿15的连接处的连接线17贯穿于该转轴走线通道1901内部，从而在眼镜框11与眼镜腿15之间发生折叠时，位于转轴走线通道1901内的连接线17仅会随转轴组件19的转动而产生一定量的旋转，以减少对连接线17的折叠挤压或拉扯，从而对连接线17起到一定的保护作用，提高连接线17的稳定性，延长连接线17的使用寿命。
其中，本实施方式中转轴走线通道1901的内径大于连接线17的外径。例如，转轴走线通道1901的内径可以为连接线17的外径的两倍。从而能够减小转轴走线通道1901的内侧壁对连接线17的束缚作用，以在眼镜框11与眼镜腿15之间发生折叠时减小连接线17的转动幅度。
请进一步一并参阅图13和图14，图14是本申请眼镜一实施方式中转轴组件的与连接线结构示意图。本实施方式中，转轴组件19包括第一转轴1902，第一转轴1902的两端分别连接眼镜框11和眼镜腿15，转轴走线通道1901沿第一转轴1902的轴向设置，转轴走线通道1901通过设置于第一转轴1902的至少一端面上的走线口19021与外部连通，连接线17经走线口19021延伸至眼镜框11或眼镜腿15。
需要指出的是，本实施方式中第一转轴1902可与眼镜框11和眼镜腿15的其中之一转动连接，并与其中另一固定连接，以使得眼镜框11和眼镜腿15绕第一转轴1902转动连接。
具体地，本实施方式中，转轴走线通道1901设置于第一转轴1902内，并进一步通过走线口19021与外部连通。
具体地，转轴走线通道1901贯穿第一转轴1902的至少一端面而形成转轴走线通道1901的走线口19021，从而使连接线17能够通过第一转轴1902的至少一端面由转轴走线通道1901延伸而出，进而延伸至眼镜框11或眼镜腿15。容易理解地，第一转轴1902的端面外围具有较大的活动空 间，由该第一转轴1902的端面延伸而出的连接线17能够容置于该活动空间之内，而若该端面处第一转轴1902与对应的眼镜框11或眼镜腿15是转动连接，那么当眼镜框11和眼镜腿15之间发生折叠转动时，该端面上的走线口19021附近的连接线17随着第一转轴1902的转动而发生一定的程度的扭转时能够通过该活动空间进行适当的缓冲，并能够变扭转为移动，从而进一步降低连接线17的扭转程度，提高连接线17的稳定性。
请参阅图15，图15是本申请眼镜一实施方式中第一转轴的结构示意图。本实施方式中，走线口19021包括第一走线口190211和第二走线口190212，并分别设置于第一转轴1902的两端面，转轴走线通道1901分别通过两个走线口19021与外部连通，从而使得连接线17贯穿第一转轴1902的两端面并经第一走线口190211和第二走线口190212分别延伸至眼镜框11和眼镜腿15。
也就是说，本应用场景中，眼镜框11和眼镜腿15之间的连接处的连接线17设置于第一转轴1902内的转轴走线通道1901中，并分别通过第一转轴1902的两端面由转轴走线通道1901延伸而出。此时，由于第一转轴1902的两端面外围均有较大的活动空间，因此由第一转轴1902两端面延伸而出的连接线17在眼镜框11与眼镜腿15之间发生相对转动时仅发生移动或小幅度扭转而均不会发生挤压拉扯而变形。
请继续参阅图14，本实施方式中，走线口19021包括第一走线口190213和第二走线口190214。其中，第一走线口190213设置于第一转轴1902的端面上，第二走线口190214则设置于第一转轴1902的侧壁上，使得转轴走线通道1901一端沿轴向通过第一走线口190213贯通第一转轴1902的端面，另一端通过第二走线口190214贯通第一转轴1902的侧壁，进而与外部连通，连接线17经第一走线口190213和第二走线口190214分别延伸至眼镜框11和眼镜腿15。
同样地，设置第一走线口190213的第一转轴1902端面附近具有较大的活动空间，在眼镜框11和眼镜腿15之间发生相对运动时，第一走线口190213附近的连接线17仅发生相对移动，或者小幅度的扭转。
在一个应用场景中，第一转轴1902与眼镜框11和眼镜腿15中靠近第二走线口190214设置的一者固定连接，且与眼镜框11和眼镜腿15中靠近第一走线口19213设置的另一者转动连接。也就是说，第一转轴1902在设置于端面的走线口19021处与眼镜框11或眼镜腿15中的一个转动连接，而第一转轴1902在设置于侧壁的走线口19021处与眼镜框11或眼镜腿15中的另一个固定连接。
在一个应用场景中，第一转轴1902在第一走线口190213处靠近眼镜框11，并与眼镜框11转动连接，第一转轴1902在第二走线口190214处靠近眼镜腿15，并与眼镜腿15固定连接。
需要指出的是，本应用场景中，虽然第一转轴1902与眼镜框11转动连接，在眼镜框11与眼镜腿15之间发生相对转动时会带动连接线17在第一走线口190213处发生相对运动，但是由于第一走线口190213设置于第一转轴1902的端面上，与上述实施方式中类似，第一转轴1902的端面处具有较大的活动空间，而当眼镜框11和眼镜腿15之间发生折叠转动时，该端面上的走线口19021附近的连接线17随着第一转轴1902的转动而发生一定的程度的扭转时能够通过该活动空间 进行适当的缓冲，并能够变扭转为移动，或者小幅度的扭转，而不会对连接线产生挤压或拉扯，从而能够提高连接线的稳定性以及延长连接线的使用寿命。
另外，第一转轴1902在第二走线口190214处与眼镜腿15固定连接，容易理解地，在眼镜框11与眼镜腿15之间发生相对转动时，眼镜腿11与第一转轴1902之间保持同步，因此，转轴走线通道1901内的连接线17经第二走线口190214延伸入眼镜腿11的连接线17不会发生扭转、挤压、拉扯。因此，此时第二走线口190214无论是设置在第一转轴1902的端面上还是设置在第一转轴1902的侧壁上，眼镜框11和眼镜腿15之间的相对转动均不会对此处的连接线17产生上述扭转、挤压、拉扯等。
而在其它实施方式中，若在第二走线口190214处第一转轴1902与眼镜腿15转动连接，在二者之间发生相对转动而带动连接线17发生移动时，会受到第二走线口190214处第一转轴1902的侧壁的约束，从而使得连接线17受到第一转轴1902的侧壁与眼镜腿15之间的挤压。
若第一转轴1902在第一走线口190213处靠近眼镜腿15，并与眼镜腿15转动连接，第一转轴1902在第二走线口190214处靠近眼镜框11，并与眼镜框11固定连接，同样的道理，在眼镜框11与眼镜腿15之间发生折叠时，转轴走线通道1901内及第一走线口190213和第二走线口190214附近的连接线17仍然仅是发生小幅度扭转或者移动。
请继续参阅图14，在一实施方式中，转轴组件19进一步包括与第一转轴1902同轴且间隔的第二转轴1903。
本实施方式中，第二转轴1903设置在第一转轴1902靠近第一走线口190213的一侧。当然，在其他实施方式中，第二转轴1903也可以设置在第一转轴1902靠近第二走线口190214的一侧。
请进一步参阅图16，图16是本申请眼镜一实施方式的局部爆炸图。本实施方式中，眼镜框11包括第一凸耳113，具体地，第一凸耳113的数量为两个，分别设置在眼镜框11连接两条眼镜腿15的两端，并分别凸出朝向对应的眼镜腿15。
眼镜腿15包括间隔设置的第二凸耳1501和第三凸耳1502。其中，第二凸耳1501和第三凸耳1502均朝向所在的眼镜腿15所连接的眼镜框11的端部。且在用户佩戴该眼镜时，第二凸耳1501和第三凸耳1502于远离用户头部的一侧连接在一起，从而使得眼镜在外观上更加整体更加美观。在一个应用场景中，间隔设置的第二凸耳1501和第三凸耳1502通过在眼镜腿15朝向眼镜框11的一端的中部设置凹槽而形成。
进一步地，第一转轴1902和第二转轴1903互相靠近的端部均与第一凸耳113连接，第一转轴1902和第二转轴1903互相远离的端部分别与第二凸耳1501和第三凸耳1502连接，以将第一凸耳113保持在第二凸耳1501与第三凸耳1502之间。
其中，请继续参阅图14，在一实施方式中，第一走线口190213设置于第一转轴1902靠近第二转轴1903的端面，第二走线口190214设置于第一转轴1902靠近第二凸耳1501的侧壁上，第一转轴1902与第一凸耳113转动连接，并与第二凸耳1501固定连接。
具体地，本实施方式中，转轴走线通道1901内的连接线17的一端由第一走线口190213并经过第一转轴1902与第二转轴1903之间的间隔延伸而出。进一步地，在一应用场景中，第一凸耳113设置有与第一走线口190213连通的走线通道，从而使得连接线17进一步由第一凸耳113进入眼镜框11。
另外，转轴走线通道1901内的连接线17的另一端由第二走线口190214延伸而出。进一步地，在一应用场景中，第三凸耳1502设置有与第二走线口190214连通的走线通道，从而使得连接线17能够进一步经由第三凸耳1502的走线通道进入眼镜腿15。
其中，第二走线口190214可以为设置在第一转轴1902的侧壁上而不与第一转轴1902的端部贯通的一与转轴走线通道1901连通的通孔。本实施方式中，第二走线口190214进一步沿第一转轴1902的侧壁贯通至第一转轴1902远离第一走线口190213的端部。容易理解地，本实施方式中的第二走线口190214处具有更大的空间，从而在此处的连接线17因一些原因而产生移动时，能够进一步减小对连接线17的限制，进一步减少因第一转轴1902的侧壁的阻挡而受到的损伤。
请进一步一并参阅图16、图17和图18，图17为本申请眼镜一实施方式中眼镜框与眼镜片的结构示意图，图18为本申请眼镜一实施方式中眼镜腿的局部结构示意图。本实施方式中，第一凸耳113和第二凸耳1501分别同轴设置有第一容置孔1131和第二容置孔15011，其中第一容置孔1131和第二容置孔15011的尺寸设置成允许第一转轴1902从眼镜腿15的外部经第二容置孔15011插入到第一容置孔1131内，并且使得第一转轴1902与第二容置孔15011过盈配合且与第一容置孔1131间隙配合。
具体地，第二容置孔15011为贯通第二凸耳1501的通孔，第一容置孔1131则对应于第二容置孔15011贯穿至少部分第一凸耳113。其中，第一容置孔1131的内径大于第二容置孔15011，第一转轴的外径尺寸介于第一容置孔1131与第二容置孔15011之间，从而使得第一转轴1902与眼镜腿15固定连接，而与眼镜框11转动连接，从而使得眼镜框11与眼镜腿15之间能够绕第一转轴1902转动而折叠或打开。
进一步地，在一实施方式中，第一凸耳113和第三凸耳1502分别同轴设置有第三容置孔1132和第四容置孔15021，其中第三容置孔1132和第四容置孔15021的尺寸设置成允许第二转轴1903从眼镜腿15的外部经第四容置孔15021插入到第三容置孔1132内，并且使得第二转轴1903与第三容置孔1132过盈配合且与第四容置孔15021间隙配合，或使得第二转轴1903与第三容置孔1132间隙配合且与第四容置孔15021过盈配合。
本实施方式中，第三容置孔1132和第四容置孔15021均与第一容置孔1131和第二容置孔15011同轴设置。其中，第三容置孔1132贯穿至少部分第一凸耳113，在一个应用场景中，第一容置孔1131与第三容置孔1132同轴且贯通设置。具体地，如上述实施方式中所述，眼镜框11的第一凸耳113设置有与第一走线口190213连通的走线通道，第一容置孔1131与第三容置孔1132分别设置于该位于第一凸耳113内的走线通道的两侧，并均贯通该走线通道。第四容置孔15021贯通第三凸耳1502设置。其中，第二转轴1903的外径尺寸介于第三容置孔1132与第四容置孔15021的 内径之间，且第三容置孔1132的内径大于第四容置孔15021，或者，第四容置孔15021的内径大于第三容置孔1132，从而使得第二转轴1903与眼镜腿15固定连接，而与眼镜框11转动连接，或者第二转轴1903与眼镜框11固定连接，而与眼镜腿15转动连接，进而使得眼镜框11与眼镜腿15之间能够绕第一转轴1902转动而折叠或打开。
其中，在一实施方式中，第二转轴1903可以为实心轴，其直径小于第一转轴1902的直径。在佩戴状态下，第二转轴1903位于眼镜腿15的上侧，第一转轴1902位于眼镜腿15的下侧。
需要指出的是，由于转轴走线通道1901设置在第一转轴1902的内部，从而使得第一转轴1902的外径较大，而不利于满足用户在美观上的需求。因此，本实施方式中进一步设置具有较小外径的第二转轴1903，并使得在用户佩戴眼镜时，第二转轴1903设置在容易被发现的上部，而第一转轴1902则设置在不容易被观察到的下部，由于第二转轴1903的外径较小，从而能够在一定程度上改善眼镜的整体美观效果。
当然，在其它实施方式中，第一转轴1902和第二转轴1903也可以为其它情况，例如，第二转轴1903还可以为空心轴，且第二转轴1903的直径也可以大于第一转轴1902的直径，或者，在佩戴状态下，第二转轴1903位于眼镜腿15的下侧，第一转轴1902位于眼镜腿15的上侧等，此处不做限定。
另外，请继续参阅图14，第一转轴1902的用于设置第一走线口190213的端面19022与第一转轴1902的用于定义转轴走线通道1901的内壁面19023的连接处呈弧形设计。容易理解地，在眼镜框11与眼镜腿15之间通过转轴组件190进行转动时，由于第一转轴1902与眼镜框11之间为转动连接，从而会带动第一走线口190213处的连接线17移动，本实施方式中，将第一转轴1902的上述端面19022与内壁面19023的连接处进行弧形设计，能够避免在第一走线口190213处的连接线17移动并与第一转轴1902接触时因上述连接处过于尖锐而割伤连接线17，从而进一步对连接线17起到保护作用。
在一个应用场景中，第一转轴1902的用于设置第二走线口190214的端面与第一转轴1902的用于定义转轴走线通道1901的内壁面19023的连接处也呈弧形设计，同样地，通过这种方式也能够进一步对连接线17起到保护作用。
在一些实施方式中，结合图1，眼镜的扬声组件可以包括耳机芯102和机芯壳体108，所述扬声组件可以为单独的、可直接使用的耳机，或者还可以是插接在电子设备上使用的耳机，在一个应用场景中，本实施方式中的骨传导耳机为上述眼镜实施方式中的扬声组件的一种。
仅仅为了说明的目的，以下将基于骨传导耳机进一步描述音耳机芯。需要知道的是，在不违背原理的情况下，以下描述的内容也可以同样适用于气导扬声组件。
在一些实施例中，图19是本申请耳机一实施方式的结构示意图，图20是本申请耳机一实施方式的爆炸结构图，图30是沿图19中耳机的对称面的截面图。本实施方式中，扬声组件包括：耳机壳体212、换能装置213、传振板214及振动传递层215。此处机芯壳体212和振动传递层215相当于本申请图25中的振动传递层2320。在一些实施例中，换能装置213可以包括振动组件和磁 路组件。
其中，耳机壳体212用于定义具有一开口2121的耳机容置腔2122，可用于容置耳机的相关功能结构。例如，换能装置213即可容置于该耳机容置腔2122内。
具体地，换能装置213用于根据音频信号产生振动。其中，音频信号可以是直接存储在换能装置213当中的音频信号，也可以通过信号线等由存储装置或者通信电路等向换能装置213输入的音频信号，此处不做限定。
进一步地，传振板214与换能装置213连接，并经容置腔2122的开口2121外露，以传递振动。具体地，换能装置213能够将音频信号转换成相应的振动信号，并进一步经过传振板214对该振动信号进行传递，以将其由耳机壳体212的容置腔2122内传输到耳机壳体212以外，以进一步向直接或者间接与该传振板214接触的用户传递该振动信号。
另外，振动传递层215包覆在传振板214的外表面上，从而能够通过传振板214将换能装置213所产生的振动信号传递至传振板214传递层，并进而通过与用户的特定部位接触而将振动信号传递给用户。本实施方式中，振动传递层215进一步与耳机壳体212连接，以封盖容置腔2122的开口2121，进而对耳机壳体212的容置腔2122内的器件起到一定的保护作用。具体地，振动传递层215可通过插接、扣合以及粘接等方式与耳机壳体212连接在一起，例如可通过扣合的方式将振动传递层215扣合在耳机壳体212的外围。
在一个应用场景中，传振板214为硬质材质，例如可以为硬质的塑胶，以能够较好的传导振动信号，振动传递层215则为软质材质，例如可以为软质的硅胶，包覆在传振板214的外表面上，以使得骨传导耳机进一步通过振动传递层215向用户传递振动信号，从而使得用户在使用骨传导耳机时具有较为良好的触感。
需要指出的是，本实施方式中的振动传递层215以一体注塑方式包覆在传振板214的外表面上，从而使得振动传递层215与传振板214为一体结构，进而在对耳机进行装配时，无需再进一步通过点胶等方式将振动传递层215与传振板214粘接在一起，从而能够简化耳机的装配步骤。同时，传振板214与振动传递层215为一体结构，能够避免因点胶而带来的传振板214与振动传递层215之间的胶层厚度不均匀而对振动传递效果的不利影响，从而提高对振动的传导效果，进而提升骨传导耳机的声音传递质量。
其中，在一实施方式中，传振板214突出于开口2121设置，以将位于耳机壳体212的容置腔2122内的换能装置213所产生的振动信号传递至容置腔2122的外部，并进而通过振动传递层215传递给用户。
振动传递层215与传振板214的外表面经开口2121外露的部分全贴合设置，并一体注塑。具体地，在一个应用场景中，传振板214的外表面经开口2121外露的部分为背离容置腔2122凸出设置的弧面，对应地，振动传递层215通过该弧面与传振板214全贴合并一体注塑而成。需要指出的是，若传振板214与振动传递层215之间采用点胶的方式进行全贴合，首先，如上所述，由于受到空气以及点胶技术等的影响从而难以控制所形成的胶层的均匀性，从而降低振动传递效果；其次， 若通过点胶的方式进行全贴合，则由于为了实现全贴合，则点胶易过量溢出，一方面进一步降低胶层的均匀性，另一方面还为耳机的装配带来不便。而本实施方式中，通过一体注塑的方式使得传振板214与振动传递层215之间全贴合设置，从而能够避免上述点胶实现的全贴合所带来的不利影响，且一方面能够增大振动传递层215与传振板214贴合的面积，从而提高振动的传递效果，另一方面弧面的设置还能够增大振动传递层215与用户的皮肤的接触面积，从而进一步提高振动的传递效果。具体地，传振板214的外表面经开口2121外露的部分可以为中间部位为平面，而周边部分为弧面。
其中，在一实施方式中，传振板214在开口2121处相对于耳机壳体212间隔设置，以绕传振板214形成一环形间隔区，振动传递层215在环形间隔区的对应区域设置有通孔2151。
本实施方式中，传振板214与耳机壳体212不连接，具体地，在开口2121处耳机壳体212的内侧边与传振板214的外侧边均为圆形或类圆形，从而使得耳机壳体212与传振板214共同形成一环形间隔区。
而振动传递层215包覆设置在传振板214的外表面上，并与耳机壳体212连接以封盖容置腔2122的开口2121，因此，环形间隔区背离容置腔2122的方向覆盖由振动传递层215。
本实施方式中，进一步在振动传递层215对应于环形间隔区的区域设置通孔2151，具体地，通孔2151的形状可以为圆形、椭圆形等，数量可以为一个或多个，此处不做限定。在设置有多个通孔2151时，可绕传振板214间隔设置。
需要指出的是，本实施方式中，通孔2151的设置能够将容置腔2122与耳机壳体212的外界连通，从而通过振动相消进一步减少漏音，从而进一步提高骨传导耳机的声音传导效果。
正常情况下，扬声器的音质受到扬声器本身各组成部分的物理性质、各组成部分间振动传递关系、扬声器与外界的振动传递关系以及振动传递系统在传递振动时的效率等多方面的影响因素。联系图1，扬声组器本身的各组件部分包括产生振动的组件(例如但不限于耳机芯102内部的换能装置)，扬声器的固定组件(例如但不限于眼镜架)，传递振动的组件(例如但不限于耳机芯102内部的面板、振动传递层等)。各组成部分间振动传递关系以及扬声器与外界的振动传递关系由扬声器与使用者间的接触方式(例如但不限于夹紧力、接触面积、接触形状等)决定。
仅仅为了说明的目的，以下将基于扬声器进一步描述音质和扬声器各组成部分的关系。需要知道的是，在不违背原理的情况下，以下描述的内容也可以同样适用于气导扬声器。图21是根据本申请一些实施例提供的扬声器振动产生和传递系统的等效模型，如图21所示，本实施例中扬声器包括固定端1101，传感终端1102，振动单元1103，以及换能装置1104。其中，固定端1101通过传递关系K1(图21中k 4)与振动单元1103相连，传感终端1102通过传递关系K2(图21中R 3，k 3)与振动单元1103相连，振动单元1103通过传递关系K3(图21中R 4，k 5)与换能装置1104相连。
这里所说的振动单元是面板和换能装置组成的振动体，传递关系K1，K2和K3是扬声器等效系统中相应部分之间作用关系的描述(将在下文中详细描述)。等效系统的振动方程可以表示为：
m 3x″ 3+R 3x′ 3-R 4x′ 4+(k 3+k 4)x 3+k 5(x 3-x 4)＝f 3  (1)
m 4x″ 4+R 4x″ 4-k 5(x 3-x 4)＝f 4    (2)
其中，m 3是振动单元1103的等效质量，m 4是换能装置1104的等效质量，x 3是振动单元1103的等效位移，x 4是换能装置1104的等效位移，k 3是传感终端1102和振动单元1103之间的等效弹性系数，k 4是固定端1101和振动单元1103之间的等效弹性系数，k 5是换能装置1104和振动单元1103之间的等效弹性系数，R 3是传感终端1102和振动单元1103之间的等效阻尼，R 4是换能装置1104和振动单元1103之间的等效阻尼，f 3和f 4分别是振动单元1103和换能装置1104之间的相互作用力。系统中振动单元的等效振幅A 3为：
Figure PCTCN2019102391-appb-000001
其中，f 0表示单位驱动力，ω表示振动频率。由此可见，影响骨传导扬声器频率响应的因素包括振动的产生部分(例如但不限于振动单元、换能装置、外壳以及相互连接方式，如公式(3)中m 3，m 4，k 5，R 4等)，振动传递部分(例如但不限于，与皮肤接触方式，眼镜架的属性，如公式(3)中k 3，k 4，R 3等)。改变扬声器各部分的结构和各组件之间连接的参数，例如，改变夹紧力的大小相当于改变k 4的大小、改变胶水的粘结方式相当于改变R 4和k 5的大小、改变相关材料的硬度、弹性、阻尼等相当于改变k 3和R 3的大小，这些都可以改变骨传导扬声器的频率响应和音质。
在一个具体的实施例中，固定端1101可以是骨传导扬声器在振动过程中位置相对固定的点或者位置相对固定的区域，这些点或区域可以看做是骨传导扬声器在振动过程中的固定端，固定端可以是由特定的部件组成，也可以是根据骨传导扬声器整体结构确定的位置。例如，可以通过特定的装置将骨传导扬声器悬挂、粘接或吸附在人耳附近，也可以设计骨传导扬声器的结构和外形使得骨传导部位能够贴住人体皮肤。
传感终端1102是人体接收声音信号的听力系统，振动单元1103是骨传导扬声器上用于保护、支撑、连接换能装置的部分，包含将振动传递给使用者的振动传递层或者面板等与使用者直接或间接接触的部分，以及保护、支撑其他振动产生元件的外壳等。换能装置1104是声音振动的产生装置，可以是以上讨论的换能装置中一种或几种的组合。
传递关系K1连接固定端1101和振动单元1103，表示骨传导扬声器在工作过程中振动产生部分和固定端的振动传递关系，K1取决于骨传导装置的形状和构造。例如，骨传导扬声器可以以U型耳机架/耳机挂带形式固定在人体头部，也可以装置在头盔、消防面罩或者其他特殊用途的面具、眼镜等设备上使用，不同的骨传导扬声器的形状和构造都会对振动传递关系K1产生影响，进一步地，扬声器的构造还包括骨传导扬声器不同部分的组成材质、质量等物理性能。传递关系K2连接传感终端402和振动单元1103。
K2取决于传递系统的组成，所述传递系统包括但不限于将声音振动通过使用者组织传递给听力系统。例如，声音通过皮肤、皮下组织、骨骼等传递给听力系统时，不同人体组织的物理性质以及相互连接关系都会对K2产生影响。进一步地，振动单元1103和人体组织接触，在不同实施例中，振动单元上的接触面可以是振动传递层或者是面板的一个侧面，接触面的表面形状、大小、与人体组织间的相互作用力等都会影响传递系数K2。
振动单元1103和换能装置1104的传递关系K3是由骨传导扬声器振动产生装置内部的连接属性决定，换能装置和振动单元通过刚性或弹性方式相连，或者改变连接件在换能装置和振动单元间的相对位置，都会改变换能装置将振动传递给振动单元，尤其是面板的传递效率，从而影响传递关系K3。
在骨传导扬声器的使用过程中，声音的产生和传递过程都会影响到最终人体感受到的音质。例如以上提到的固定端、人体感觉终端、振动单元、换能装置以及传递关系K1、K2和K3等，都可能对骨传导扬声器的音效质量产生影响。需要注意的是，此处K1、K2、K3只是对振动传递过程中涉及到不同装置部分或系统连接方式的一种表示，可以包含但不限于物理连接方式、力的传导方式、声音的传递效率等。
以上对骨传导扬声组件等效系统的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解骨传导扬声组件的基本原理后，可能在不背离这一原理的情况下，对影响骨传导扬声组件振动传递的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，以上描述的K1、K2、K3可以是简单的振动或者力学传递方式，也可以包含复杂的非线性传递系统，传递关系可以是由各个部分直接连接形成，也可以是通过非接触式方式进行传递。
图22是本申请实施例提供的一种扬声器复合振动装置的结构图。
在一些实施例中，所述眼镜上设置有复合振动装置。在一些实施例中，图22中的复合振动装置可以是耳机芯内部提供声音的振动部分。具体的，本申请实施例中的复合振动装置相当于图21中的振动单元1103和换能装置1104的传递关系K3的具体体现。扬声器的复合振动装置的实施例如图22和图23所示，传振片1801和振动板1802组成一个复合振动装置，所述传振片1801设置为一第一圆环体1813，并在该第一圆环体内设置有向中心辐辏的三个第一支杆1814，其辐辏中心位置与所述振动板1802的中心固定。所述振动板1802的中心为配合所述辐辏中心及第一支杆的凹槽1820。所述振动板1802设置具有与所述传振片1801半径不同的第二圆环体1821，以及与所述第一支杆1814不同粗厚的三个第二支杆1822，在装配时所述第一支杆1814和所述第二支杆1822错开设置，可以但不限于呈60度角。
上述第一支杆和第二支杆都可以采用直杆或者设置成其它符合特定要求的形状，支杆数目可以设置为两个以上，采用对称或非对称排布，以满足经济、实用效果等方面的要求。所述传振片1801具有薄的厚度并且可增加弹力，传振片1801是卡在振动板1802的凹槽1820中心的。在振动板1802的第二圆环体1821下侧粘结设置有音圈1808(即为图5中的线圈422)。所述复合振动装置还包括底板1812，在该底板1812上设置有环形磁体1810，在该环形磁体1810内同心设置有内磁体1811。在所述内磁体1811的顶面设置有内导磁板1809，同时在所述环形磁体1810上设置有环形导磁板1807，在所述环形导磁板1807上方固定设置有垫圈1806，所述传振片1801的第一圆环体1813与该垫圈1806相固定连接。该整个复合振动装置通过一面板1830与外部连接，所述面板1830固连所述传振片1801的辐辏中心位置，并卡合固定在传振片1801和振动板1802的中心位 置。利用上述振动板和传振片组成的复合振动装置，可以得到如图23所示的频率响应，产生了两个谐振峰。通过调节两个部件的尺寸和材料等参数，可以使得让谐振峰出现在不同的位置，例如，使得低频的谐振峰出现在更低频移动的位置，和/或使得高频的谐振峰出现在更高频的位置。优选地，振动板的劲度系数大于传振片的劲度系数，所述振动板产生两个谐振峰中的高频谐振峰，所述传振片产生两个谐振峰中的低频谐振峰。这些谐振峰的范围可以设置在人耳可听到的声音的频率范围之内，也可以不在其中，优选地，两个谐振峰都不在人耳可听到的声音的频率范围内；更优选地，一个谐振峰在人耳可听到的声音的频率范围之内，另一个谐振峰在人耳可听到的声音的频率范围之外；更优选的，两个谐振峰都在人耳可听到的声音的频率范围内。关于振动板和传振片构成的复合振动装置的描述出现于2011年12月23日提交的中国专利申请号201110438083.9中披露的，名称为“一种骨传导扬声器及其复合振动装置”的专利申请中，该专利文献全文引用在此作为参考。
图25是本申请一些实施例提供的一种扬声器的复合振动装置的结构图。在一些实施例中，耳机芯可以包括所述复合振动装置。在另一个实施例中，如图25所示，扬声器的复合振动装置包括一个振动板2002，第一传振片2003和第二传振片2001。第一传振片2003将振动板2002和第二传振片2001固定在机芯壳体2219上，由振动板2002、第一传振片2003和第二传振片2001组成的复合振动装置可以产生不少于两个谐振峰，在听力系统可听范围内产生更加平坦的频率响应曲线，从而改善扬声器的音质。
在第一传振片的三重复合振动系统产生的谐振峰数多于没有第一传振片的复合振动系统产生的谐振峰。优选地，所述三重复合振动系统可以产生至少有三个谐振峰；更优选地，至少有一个谐振峰不在人耳可听到的范围之内；更优选地，谐振峰都在人耳可听到的范围之内。在一个实施例中，通过利用振动板、第一传振片和第二传振片组成的三重复合振动系统，可以得到如图26所示的频率响应，产生了三个明显的谐振峰，能够使扬声器频响在低频范围(600Hz左右)的灵敏度得到较大提升，提高了音质。
通过改变第一传振片的尺寸和材料等参数，可以让谐振峰发生移动，最终获得更理想的频率响应。优选地，第一传振片为一弹性片。该弹性由第一传振片的材料、厚度、结构等多方面决定。第一传振片的材料，例如但不限于，钢材(例如但不限于不锈钢、碳素钢等)、轻质合金(例如但不限于铝合金、铍铜、镁合金、钛合金等)、塑胶(例如但不限于高分子聚乙烯、吹塑尼龙、工程塑料等)，也可以是能达到同样性能的其他单一或复合材料。对于复合材料，例如但不限于玻璃纤维、碳纤维、硼纤维、石墨纤维、石墨烯纤维、碳化硅纤维或芳纶纤维等增强材料，也可以是其它有机和/或无机材料的复合物，例如玻璃纤维增强不饱和聚酯、环氧树脂或酚醛树脂基体组成的各类玻璃钢。第一传振片的厚度不低于0.005mm，优选地，厚度为0.005mm-3mm，更优选地，厚度为0.01mm-2mm，再优选地，厚度为0.01mm-1mm，进一步优选地，厚度为0.02mm-0.5mm。第一传振片的结构可以设定成环状，优选地，包含至少一个圆环，优选地，包含至少两个圆环，可以是同心圆环，也可以是非同心圆环，圆环间通过至少两个支杆相连，支杆从外环向内环中心辐射，进一步优选地，包含至少一个椭圆圆环，进一步优选地，包含至少两个椭圆圆环，不同的椭圆圆环有不同 的曲率半径，圆环之间通过支杆相连，更进一步优选地，第一传振片包含至少一个方形环。第一传振片结构也可以设定成片状，优选地，上面设置镂空图案，镂空图案的面积不小于没有镂空的面积。以上描述中材料、厚度、结构可以组合成不同的传振片。例如，环状传振片具有不同的厚度分布，优选地，支杆厚度等于圆环厚度，进一步优选地，支杆厚度大于圆环厚度，更进一步优选地，内环的厚度大于外环的厚度。
本申请中针对上述的内容还公开了关于振动板、第一传振片、第二传振片的具体的实施例，图27是根据本申请一些实施例提供的一种扬声器的振动产生部分的结构图。如图27所示，换能装置包括由导磁板2710，磁铁2711和导磁体2712组成的磁路系统，振动板2714，线圈2715，第一传振片2716和第二传振片2717。面板2713突出机芯壳体2719，和振动片2714通过胶水粘结，第一传振片2716将换能装置连接固定在机芯壳体2719上，形成悬挂结构。
在扬声器工作的过程中，由振动板2714，第一传振片2716和第二传振片2717组成的三重振动系统能够产生更为平坦的频率响应曲线，从而改善扬声器的音质。第一传振片2716将换能装置弹性连接在机芯壳体2719上，可以减少换能装置传递给外壳的振动，从而有效地降低由于壳体振动导致的漏音，也减少了壳体的振动对扬声器音质的影响。图28所示是外壳振动强度和面板振动强度随着频率的响应曲线。其中，粗线显示的是使用第一传振片2716后振动产生部分的频率响应，细线显示的是不使用第一传振片2716后振动产生部分的频率响应。可以看出，在500Hz以上的频率范围，不含有第一传振片2716的扬声器外壳的振动明显大于含有第一传振片2716的扬声器的外壳的振动。图29所示是含有第一传振片2716和不含有第一传振片2716两种情况下的漏音比较。其中，含有第一传振片2716的装置在中频(例如1000Hz左右)范围的漏音小于不含有第一传振片2716的装置在对应频率范围的漏音。由此可以看出，面板和外壳间使用第一传振片后可以有效地降低外壳的振动，从而降低漏音。在一些实施例中，第一传振片可以采用包括但不限于不锈钢、铍铜、塑胶、聚碳酸酯材料，其厚度在0.01mm-1mm的范围内。
图30是根据本申请的一些实施例所示的一种扬声组件的纵截面示意图。如图30所示，扬声组件300可以包括第一磁性元件302、第一导磁元件304、第二导磁元件306、第一振动板308、音圈310、第二振动板312以及振动面板314。其中，扬声组件300与图19中磁路组件210向对应。。在一些实施例中，磁路组件可以包括第一磁性元件302、第一导磁元件304、第二导磁元件306。磁路组件可以产生第一全磁场(也可被称为“磁路组件的总磁场”或“第一磁场”)。
在本申请中描述的磁性元件是指可以产生磁场的元件，例如磁铁等。所述磁性元件可以具有磁化方向，所述磁化方向是指在所述磁性元件内部的磁场方向。在一些实施例中，第一磁性元件302可以包括一个或多个磁铁，第一磁性元件可以产生第二磁场。在一些实施例中，所述磁铁可以包括金属合金磁铁，铁氧体等。其中，金属合金磁铁可以包括钕铁硼、钐钴、铝镍钴、铁铬钴、铝铁硼、铁碳铝，或类似的，或其中多种的组合。铁氧体可以包括钡铁氧体，钢铁氧体，美锰铁氧体，锂锰铁氧体，或类似的，或其中多种组合。
在一些实施例中，第一导磁元件304的下表面可以连接第一磁性元件302的上表面。第二 导磁元件306可以连接第一磁性元件302。需要注意的是，这里所说的导磁体也可以称为磁场集中器或铁芯。导磁体可以调整磁场(例如，第一磁性元件302产生的第二磁场)的分布。所述导磁体可以包括由软磁材料加工而成的元件。第一导磁元件304、第二导磁元件306与第一磁性元件302之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。在一些实施例中，第一磁性元件302、第一导磁元件304和第二导磁元件306可以设置为轴对称结构。所述轴对称结构可以是环状结构、柱状结构或是其它具有轴对称结构。
在一些实施例中，第一磁性元件302与第二导磁元件306之间可以形成磁间隙。音圈310可以设置于所述磁间隙中。音圈310可以与第一振动板308连接。第一振动板308可以连接第二振动板312，第二振动板312可以连接振动面板314。当所述音圈310内通入电流后，所述音圈310位于在第一磁性元件302、第一导磁元件304和第二导磁元件306形成的磁场，会受到安培力作用，所述安培力驱动音圈310振动，音圈310的振动会带动第一振动板308、第二振动板312和振动面板314的振动。振动面板314将所述振动通过组织与骨骼传递到听觉神经，从而使人听到声音。所述振动面板314可以直接与人体皮肤接触，或可以通过由特定材料组成的振动传递层与皮肤接触。
在一些实施例中，对于具有单一磁性元件的扬声组件，通过音圈处的磁感线并不均匀，呈发散状。同时磁路中可能会形成漏磁，即较多的磁感线泄漏至磁间隙以外，未能穿过音圈，从而使得音圈位置处的磁感应强度(或磁场强度)下降，影响扬声组件的灵敏度。因此，扬声组件300可以进一步包括至少一个第二磁性元件和/至少一个第三导磁元件(图中未示)。所述至少一个第二磁性元件和/至少一个第三导磁元件可以抑制磁感线的泄露，约束穿过音圈的磁感线形态，使得较多的磁感线尽量水平密集地穿过音圈，增强音圈位置处的磁感应强度(或磁场强度)，从而提高扬声组件300的灵敏度，进而提高扬声组件300的机械转化效率(即，将输入扬声组件300的电能转化为音圈振动的机械能的效率)。
图31是根据本申请的一些实施例所示的一种磁路组件2100的纵截面示意图。如图31所示，磁路组件2100可以包括第一磁性元件2102、第一导磁元件2104、第二导磁元件2106以及第二磁性元件2108。在一些实施例中，第一磁性元件2102和/或第二磁性元件2108可以包括本申请中描述的任意一种或几种磁铁。在一些实施例中，第一磁性元件2102可以包括第一磁铁，第二磁性元件2108可以包括第二磁铁，所述第一磁铁与所述第二磁铁可以相同或不同。第一导磁元件2104和/或第二导磁元件2106可以包括本申请中描述的任意一种或几种导磁材料。第一导磁元件2104和/或第二导磁元件2106的加工方法可以包括本申请中描述的任意一种或几种加工方式。在一些实施例中，第一磁性元件2102和/或第一导磁元件2104可以设置为轴对称结构。例如，第一磁性元件2102和/或第一导磁元件2104可以是圆柱体，长方体，或者中空的环状(例如，横截面为跑道的形状)。在一些实施例中，第一磁性元件2102和第一导磁元件2104可以是共轴的圆柱体，含有相同或者不同的直径。在一些实施例中，第二导磁元件2106可以是凹槽型结构。所述凹槽型结构可以包含U型的剖面(如图30所示)。所述凹槽型的第二导磁元件2106可以包括底板和侧壁。在一些实施例中，所述底板和所述侧壁可以是一体成型的，例如，所述侧壁可以由底板在垂直于底板的方向 进行延伸形成。在一些实施例中，所述底板可以通过本申请中描述的任意一种或几种连接方式连接所述侧壁。第二磁性元件2108可以设定为环状或片状。在一些实施例中，第二磁性元件2108可以是环状的。第二磁性元件2108可以包括内环以及外环。在一些实施例中，所述内环和/或外环的形状可以是圆形、椭圆、三角形、四边形或其它任意多边形在一些实施例中，第二磁性元件2108可以由多个磁体排列组成。所述多个磁体的任意一个磁体的两端可以与相邻的磁体的两端连接或存在一定的间距。多个磁体之间的间距可以相同或不同。在一些实施例中，所述第二磁性元件2108可以由2个或3个片状的磁体等距排列构成。所述片状的磁体的形状可以是扇形、四边形等。在一些实施例中，第二磁性元件2108可以与第一磁性元件2102和/或第一导磁元件2104共轴。
在一些实施例中，第一磁性元件2102的上表面可以连接第一导磁元件2104的下表面。第一磁性元件2102的下表面可以连接第二导磁元件306的底板。第二磁性元件2108的下表面连接第二导磁元件2106的侧壁。第一磁性元件2102、第一导磁元件2104、第二导磁元件2106和/或第二磁性元件2108之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在一些实施例中，第一磁性元件2102和/或第一导磁元件2104与第二磁性元件2108的内环之间形成磁间隙。音圈2128可以设置于所述磁间隙中。在一些实施例中，所述第二磁性元件2108与所述音圈2128相对于第二导磁元件2106的底板的高度相等。在一些实施例中，第一磁性元件2102、第一导磁元件2104、第二导磁元件2106以及第二磁性元件2108可以形成磁回路。在一些实施例中，磁路组件2100可以产生第一全磁场(也可被称为“磁路组件的总磁场”或“第一磁场”)，第一磁性元件2102可以产生第二磁场。所述第一全磁场由所述磁路组件2100中的所有组分(例如，第一磁性元件2102，第一导磁元件2104、第二导磁元件2106以及第二磁性元件2108)产生的磁场共同形成。所述第一全磁场在所述磁间隙内的磁场强度(也可以被称为磁感应强度或者磁通量密度)大于所述第二磁场在所述磁间隙内的磁场强度。在一些实施例中，第二磁性元件2108可以产生第三磁场，所述第三磁场可以提高所述第一全磁场在所述磁间隙处的磁场强度。这里所说的第三磁场提高第一全磁场的磁场强度指的是，在有第三磁场存在(即，存在第二磁性元件2108)时第一全磁场在所述磁间隙的磁场强度大于没有第三磁场存在(即，不存在第二磁性元件2108)时第一全磁场的。在本说明书中的其他实施例中，除非特别说明，磁路组件表示包含所有磁性元件和导磁元件的结构，第一全磁场表示由磁路组件整体产生的磁场，第二磁场、第三磁场、……、第N磁场分别表示由相应的磁性元件所产生的磁场。在不同的实施例中，产生所述第二磁场(或者第三磁场、……、第N磁场)的磁性元件可以是相同的，也可以不同。
在一些实施例中，第一磁性元件2102的磁化方向与第二磁性元件2108的磁化方向之间的夹角在0度与180度之间。在一些实施例中，第一磁性元件2102的磁化方向与第二磁性元件2108的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件2102的磁化方向与第二磁性元件2108的磁化方向之间的夹角等于或大于90度。在一些实施例中，第一磁性元件2102的磁化方向垂直于第一磁性元件302的下表面或上表面竖直向上(如图中a所示方向)，第二磁性元件2108的磁化方向由第二磁性元件2108的内环指向外环(如图中b所方向示，在第一磁性 元件2102的右侧，第一磁性元件2102的磁化方向沿着顺时针方向偏转90度)。
在一些实施例中，在第二磁性元件2108的位置，所述第一全磁场的方向与第二磁性元件2108的磁化方向之间的夹角不高于90度。在一些实施例中，在第二磁性元件2108的位置处，第一磁性元件2102产生的磁场的方向与第二磁性元件2108的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
与单一磁性元件的磁路组件相比，第二磁性元件2108可以提高磁路组件2100中磁间隙内总磁通量，进而增加磁间隙中的磁感应强度。并且，在第二磁性元件2108的作用下，原本发散的磁感线会向磁间隙所在位置收敛，进一步增加磁间隙中的磁感应强度。
图32是根据本申请的一些实施例所示的磁路组件2600的纵截面示意图。如图32所示，磁路组件2600与磁路组件2100的不同之处在于，其可以进一步包括至少一个导电元件(例如，第一导电元件2118、第二导电元件2120以及第三导电元件2122)。
所述导电元件可以包括金属材料、金属合金材料、无机非金属材料或其它导电材料。金属材料可以包括金、银、铜、铝等；金属合金材料可以包括铁基合金、铝基合金材料、铜基合金、锌基合金等；无机非金属材料可以包括石墨等。所述导电元件可以是片状、环状、网状等。第一导电元件2118可以设置于第一导磁元件2104的上表面。第二导电元件2120可以连接第一磁性元件2102以及第二导磁元件2106。第三导电元件2122可以连接第一磁性元件2102的侧壁。在一些实施例中，第一导磁元件2104可以凸出于第一磁性元件2102形成第一凹部，第三导电元件2122设置于所述第一凹部。在一些实施例中，第一导电元件2118、第二导电元件2120以及第三导电元件2122可以包括相同或不同的导电材料。第一导电元件2118、第二导电元件2120以及第三导电元件2122可以通过本申请中描述的任意一种或多种连接方式分别连接第一导磁元件2104、第二导磁元件2106和/或第一磁性元件2102。
第一磁性元件2102、第一导磁元件2104与第二磁性元件2108的内环之间形成磁间隙。音圈2128可以设置于所述磁间隙中。第一磁性元件2102、第一导磁元件2104、第二导磁元件2106以及第二磁性元件2108可以形成磁回路。在一些实施例中，所述导电元件可以降低音圈2128的感抗。例如，若音圈2128通入第一交变电流时，音圈2128附近会产生第一交变感应磁场。第一交变感应磁场在所述磁回路中磁场的作用下，会使音圈2128产生感抗，阻碍音圈2128的运动。当在音圈2128附近设置导电元件(例如，第一导电元件2118、第二导电元件2120以及第三导电元件2122)，在所述第一交变感应磁场作用下，所述导电元件可以感生出第二交变电流。所述导电元件内的第三交变电流可以在其附近产生第二交变感应磁场，所述第二交变感应磁场与所述第一交变感应磁场方向相反，可以减弱所述第一交变感应磁场，从而减小音圈2128的感抗，增大音圈中的电流，提高扬声组件的灵敏度。
图33是根据本申请的一些实施例所示的一种磁路组件2700的纵截面示意图。如图33所示，磁路组件2700与磁路组件2500的不同之处在于，磁路组件2700可以进一步包括第三磁性元件2110、第四形磁性元件2112、第五磁性元件2114、第三导磁元件2116、第六磁性元件2124以及 第七磁性元件2126。第三磁性元件2110、第四磁性元件2112、第五磁性元件2114、第三导磁元件2116和/或第六磁性元件2124以及第七磁性元件2126可以设置为共轴的环形柱体。
在一些实施例中，第二磁性元件2108的上表面连接第七磁性元件2126，第二磁性元件2108的下表面可以连接第三磁性元件2110。第三磁性元件2110可以连接第二导磁元件2106。第七磁性元件2126的上表面可以连接第三导磁元件2116。第四磁性元件2112可以连接第二导磁元件2106以及第一磁性元件2102。第六磁性元件2124可以连接第五磁性元件2114、第三导磁元件2116以及第七磁性元件2126。在一些实施例中，第一磁性元件2102、第一导磁元件2104、第二导磁元件2106、第二磁性元件2108、第三磁性元件2110、第四磁性元件2112、第五磁性元件2114、第三导磁元件2116、第六磁性元件2124以及第七磁性元件2126可以形成磁回路以及磁间隙。
在一些实施例中，第一磁性元件2102的磁化方向与第六磁性元件2124的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件2102的磁化方向与第六磁性元件2124的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件2102的磁化方向与第六磁性元件2124的磁化方向之间的夹角不高于90度。在一些实施例中，第一磁性元件2102的磁化方向垂直于第一磁性元件2102的下表面或上表面竖直向上(如图a方向所示)，第六磁性元件2124的磁化方向由第六磁性元件2124的外环指向内环(如图中g方向所示，在第一磁性元件2102的右侧，第一磁性元件2102的磁化方向沿着顺时针方向偏转270度)。在一些实施例中，在同一竖直方向上，第六磁性元件2124的磁化方向与第四磁性元件2112的磁化方向可以相同。
在一些实施例中，在第六磁性元件2124的位置处，磁路组件2700产生的磁场的方向与第六磁性元件2124的磁化方向之间的夹角不高于90度。在一些实施例中，在第六磁性元件2124的位置处，第一磁性元件2102产生的磁场的方向与第六磁性元件2124的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在一些实施例中，所述第一磁性元件2102的磁化方向与第七磁性元件2126的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件2102的磁化方向与第七磁性元件2126的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，所述第一磁性元件2102的磁化方向与第七磁性元件2126的磁化方向之间的夹角不高于90度。在一些实施例中，第一磁性元件2102的磁化方向垂直于第一磁性元件2102的下表面或上表面竖直向上(如图a方向所示)，第七磁性元件2126的磁化方向由第七磁性元件2126的下表面指向上表面(如图中f方向所示，在第一磁性元件2102的右侧，第一磁性元件2102的磁化方向沿着顺时针方向偏转360度)。在一些实施例中，第七磁性元件2126的磁化方向与第三磁性元件2110的磁化方向可以相反。
在一些实施例中，在第七磁性元件2126处，磁路组件2700产生的磁场的方向与所述第七磁性元件2126的磁化方向之间的夹角不高于90度。在一些实施例中，在第七磁性元件2126的位置处，第一磁性元件2102产生的磁场的方向与第七磁性元件2126的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在磁路组件2700中，第三导磁元件2116可以将磁路组件2700产生的磁路封闭，使得较 多的磁感线集中于所述磁间隙内，从而达到抑制漏磁、增加磁间隙处的磁感应强度、及提高扬声组件的灵敏度的功效。
图34是根据本申请的一些实施例所示的一种磁路组件2900的纵截面示意图。如图34所示，磁路组件2900可以包括第一磁性元件2902、第一导磁元件2904、第一全磁场改变元件2906以及第二磁性元件2908。
第一磁性元件2902的上表面可以连接第一导磁元件2904的下表面，第二磁性元件2908可以连接第一磁性元件2902以及第一全磁场改变元件2906。第一磁性元件2902、第一导磁元件2904、第一全磁场改变元件2906和/或第二磁性元件2908之间的连接方式可以基于本申请中描述的任意一种或几种连接方式。在一些实施例中，第一磁性元件2902、第一导磁元件2904、第一全磁场改变元件2906和/或第二磁性元件2908可形成磁回路及磁间隙。
在一些实施例中，磁路组件2900可以产生第一全磁场，第一磁性元件2902可以产生第二磁场，所述第一全磁场在所述磁间隙内的磁场强度大于所述第二磁场在所述磁间隙内的磁场强度。在一些实施例中，第二磁性元件2908可以产生第三磁场，所述第三磁场可以提高所述第二磁场在所述磁间隙处的磁场强度。
在一些实施例中，第一磁性元件2902的磁化方向与第二磁性元件2908的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件2902的磁化方向与第二磁性元件2908的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，第一磁性元件2902的磁化方向与第二磁性元件2908的磁化方向之间的夹角可以不高于90度。
在一些实施例中，在第二磁性元件2908的位置处，所述第一全磁场的方向与第二磁性元件2908的磁化方向之间的夹角不高于90度。在一些实施例中，在第二磁性元件2908的位置处，第一磁性元件2902产生的磁场的方向与第二磁性元件2908的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。又例如，第一磁性元件2902的磁化方向垂直于第一磁性元件2902的下表面或上表面竖直向上(如图a方向所示)，第二磁性元件2908的磁化方向由第二磁性元件2908的外环指向内环(如图中c方向所示，在第一磁性元件2902的右侧，第一磁性元件2902的磁化方向沿着顺时针方向偏转270度)。
与单一磁性元件的磁路组件相比，磁路组件2900中的第一全磁场改变元件2906可以提高磁间隙中的总磁通量，进而增加磁间隙中的磁感应强度。并且，在第一全磁场改变元件2906的作用下，原本发散的磁感线会向磁间隙所在位置收敛，进一步增加磁间隙中的磁感应强度。
图35是根据本申请的一些实施例所示的一种磁路组件3000的纵截面示意图。如图35所示，在一些实施例中，磁路组件3000可以包括第一磁性元件2902、第一导磁元件2904、第一全磁场改变元件2906、第二磁性元件2908、第三磁性元件2910、第四磁性元件2912、第五磁性元件2916、第六磁性元件2918、第七磁性元件2920以及第二环形元件2922。第一磁性元件2902、第一导磁元件2904、第一全磁场改变元件2906、第二磁性元件2908、第三磁性元件2910、第三磁性元件2910、第四磁性元件2912以及第五磁性元件2916。在一些实施例中，第一全磁场改变元件2906和/或第 二环形元件2922可以包括环形磁性元件或环形导磁元件。所述环形磁性元件可以包括本申请中描述的任意一种或几种磁铁材料，所述环形导磁元件可以包括本申请中描述的任意一种或几种导磁材料。
在一些实施例中，第六磁性元件2918可以连接第五磁性元件2916以及第二环形元件2922，第七磁性元件2920可以连接第三磁性元件2910以及第二环形元件2922。在一些实施例中，第一磁性元件2902、第五磁性元件2916、第二磁性元件2908、第三磁性元件2910、第四磁性元件2912、第六磁性元件2918和/或第七磁性元件2920与所述第一导磁元件2904、第一全磁场改变元件2906以及第二环形元件2922可以形成磁回路。
在一些实施例中，所述第一磁性元件2902的磁化方向与第六磁性元件2918的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件2902的磁化方向与第六磁性元件2918的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，所述第一磁性元件2902的磁化方向与第六磁性元件2918的磁化方向之间的夹角不高于90度。在一些实施例中，第一磁性元件2902的磁化方向垂直于第一磁性元件2902的下表面或上表面竖直向上(如图a方向所示)，第六磁性元件2918的磁化方向由第六磁性元件2918的外环指向内环(如图中f方向所示，在第一磁性元件2902的右侧，第一磁性元件2902的磁化方向沿着顺时针方向偏转270度)。在一些实施例中，在同一竖直方向上，第六磁性元件2918的磁化方向与第二磁性元件2908的磁化方向可以相同。在一些实施例中，第一磁性元件2902的磁化方向垂直于第一磁性元件2902的下表面或上表面竖直向上(如图a方向所示)，第七磁性元件2920的磁化方向由第七磁性元件2920的下表面指向上表面(如图中e方向所示，在第一磁性元件2902的右侧，第一磁性元件2902的磁化方向沿着顺时针方向偏转360度)。在一些实施例中，第七磁性元件2920的磁化方向与第四磁性元件2912的磁化方向可以相同。
在一些实施例中，在第六磁性元件2918的位置处，磁路组件2900产生的磁场的方向与所述第六磁性元件2918的磁化方向之间的夹角不高于90度。在一些实施例中，在第六磁性元件2918的位置处，第一磁性元件2902产生的磁场的方向与第六磁性元件2918的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在一些实施例中，所述第一磁性元件2902的磁化方向与第七磁性元件2920的磁化方向之间的夹角可以在0度与180度之间。在一些实施例中，第一磁性元件2902的磁化方向与第七磁性元件2920的磁化方向与之间的夹角在45度与135度之间。在一些实施例中，所述第一磁性元件2902的磁化方向与第七磁性元件2920的磁化方向之间的夹角不高于90度。
在一些实施例中，在第七磁性元件2920的位置处，磁路组件3000产生的磁场的方向与所述第七磁性元件2920的磁化方向之间的夹角不高于90度。在一些实施例中，在第七磁性元件2920的位置处，第一磁性元件2902产生的磁场的方向与第七磁性元件2920的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
在一些实施例中，第一全磁场改变元件2906可以是环形磁性元件。在这种情况下，第一全 磁场改变元件2906的磁化方向可以与第二磁性元件2908或第四磁性元件2912的磁化方向相同。例如，在第一磁性元件2902的右侧，第一全磁场改变元件2906的磁化方向可以由第一全磁场改变元件2906的外环指向内环。在一些实施例中，第二环形元件2922可以是环形磁性元件。在这种情况下，第二环形元件2922的磁化方向可以与第六磁性元件2918或第七磁性元件2920的磁化方向相同。例如，在第一磁性元件2902的右侧，第二环形元件2922的磁化方向可以由第二环形元件2922的外环指向内环。
在磁路组件3000中，多个磁性元件可以提高总的磁通量，不同磁性元件相互作用，可以抑制磁感线泄漏，提高磁间隙处的磁感应强度，提高扬声组件的灵敏度。
图36是根据本申请的一些实施例所示的一种磁路组件3100的纵截面示意图。如图36所示，磁路组件3100可以包括第一磁性元件3102、第一导磁元件3104、第二导磁元件3106以及第二磁性元件3108。
在一些实施例中，第一磁性元件3102和/或第二磁性元件3108可以包括本申请中描述的任意一种或几种磁铁。在一些实施例中，第一磁性元件3102可以包括第一磁铁，第二磁性元件3108可以包括第二磁铁，所述第一磁铁与所述第二磁铁可以相同或不同。第一导磁元件3104和/或第二导磁元件3106可以包括本申请中描述的任意一种或几种导磁材料。第一导磁元件3104和/或第二导磁元件3106的加工方法可以包括本申请中描述的任意一种或几种加工方式。在一些实施例中，第一磁性元件3102、第一导磁元件3104和/或第二磁性元件3108可以设置为轴对称结构。例如，第一磁性元件3102、第一导磁元件3104和/或第二磁性元件3108可以是圆柱体。在一些实施例中，第一磁性元件3102、第一导磁元件3104和/或第二磁性元件3108可以是共轴的圆柱体，含有相同或者不同的直径。第一磁性元件3102的厚度可以大于或等于第二磁性元件3108的厚度。在一些实施例中，第二导磁元件3106可以是凹槽型结构。所述凹槽型结构可以包含U型的剖面。所述凹槽型的第二导磁元件3106可以包括底板和侧壁。在一些实施例中，所述底板和所述侧壁可以是一体成型的，例如，所述侧壁可以由底板在垂直于底板的方向进行延伸形成。在一些实施例中，所述底板可以通过本申请中描述的任意一种或几种连接方式连接所述侧壁。第二磁性元件3108可以设定为环状或片状。关于第二磁性元件3108的形状可参考说明书中其他地方的描述。在一些实施例中，第二磁性元件3108可以与第一磁性元件3102和/或第一导磁元件3104共轴。
第一磁性元件3102的上表面可以连接第一导磁元件3104的下表面。第一磁性元件3102的下表面可以连接第二导磁元件3106的底板。第二磁性元件3108的下表面连接第一导磁元件3104的上表面。第一磁性元件3102、第一导磁元件3104、第二导磁元件3106和/或第二磁性元件3108之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
第一磁性元件3102、第一导磁元件3104和/或第二磁性元件3108与第二导磁元件3106的侧壁之间形成磁间隙。音圈可以设置于所述磁间隙中。在一些实施例中，第一磁性元件3102、第一导磁元件3104、第二导磁元件3106以及第二磁性元件3108可以形成磁回路。在一些实施例中，磁路组件3100可以产生第一全磁场，第一磁性元件3102可以产生第二磁场。所述第一全磁场由所述 磁路组件3100中的所有组分(例如，第一磁性元件3102，第一导磁元件3104、第二导磁元件3106以及第二磁性元件3108)产生的磁场共同形成。所述第一全磁场在所述磁间隙内的磁场强度(也可以被称为磁感应强度或者磁通量密度)大于所述第二磁场在所述磁间隙内的磁场强度。在一些实施例中，第二磁性元件3108可以产生第三磁场，所述第三磁场可以提高所述第二磁场在所述磁间隙处的磁场强度。
在一些实施例中，第二磁性元件3108的磁化方向与第一磁性元件3102的磁化方向之间的夹角在90度与180度之间。在一些实施例中，第二磁性元件3108的磁化方向与第一磁性元件3102的磁化方向之间的夹角在150度与180度之间。在一些实施例中，第二磁性元件3108的磁化方向与第一磁性元件3102的磁化方向相反(如图所示，a方向与b方向)。
与单一磁性元件的磁路组件相比，磁路组件3100增加了第二磁性元件3108。第二磁性元件3108磁化方向与第一磁性元件3102磁化方向相反，可以抑制第一磁性元件3102在磁化方向上的漏磁，从而使第一磁性元件3102产生的磁场可以较多地被压缩到磁间隙中，因而提高磁间隙内的磁感应强度。
图37是本申请一些实施例提供的骨传导扬声组件的应用场景及结构示意图。请参照图37和图1，图37中所述的机构示意图是一种扬声组件，包括图1中的耳机芯102和机芯壳体108。下面仅以骨传导扬声组件作为示例对扬声组件的应用场景及结构进行阐述。在一些实施例中，如图37所示，骨传导扬声组件可以包括驱动组件3701、传动组件3702、面板3703(面板3703也可以称为外壳面板，为机芯壳体上面向人体一侧的面板)、以及外壳3704等。参照图1，面板3703和外壳3704与机芯壳体108(图1)相一致，驱动组件3701和传动组件3702与耳机芯102(图1)相一致。在一些实施例中，外壳3704可以包括外壳背面和外壳侧面，通过外壳背面通过外壳侧面与面板3703相连。驱动组件3701可以通过传动组件3702将振动信号传送至面板3703和/或外壳3704，从而通过与面板3703或外壳3704与人体皮肤的接触，将声音传送至人体。在一些实施例中，骨传导扬声组件的面板3703和/或外壳3704可以在耳屏处与人体皮肤接触，从而将声音传递至人体。在一些实施例中，面板3703和/或外壳3704也可以在耳廓后侧与人体皮肤接触。
在一些实施例中，驱动组件3701产生的驱动力所在直线B(或者说驱动装置的振动方向)，与面板3703的法线A具有一个夹角θ。或者说，直线B与直线A不平行。
面板上具有与使用者身体，如人体皮肤，接触或抵靠的区域。应当理解为，当面板上覆盖有其他材料(如硅胶等软性材料)以增强用户佩戴舒适感时，面板与使用者身体的关系则不为直接接触，而是相互抵靠。在一些实施例中，当骨传导扬声组件佩戴在使用者身体上后，面板的全部区域与使用者身体接触或抵靠。在一些实施例中，当骨传导扬声组件佩戴在使用者身体上后，面板的部分区域与使用者身体接触或抵靠。在一些实施例中，面板上用于与使用者身体接触或抵靠的区域可以占整个面板面积的50％以上，更优选的，可以占面板面积的60％以上。一般来说，面板上与使用者身体接触或抵靠的区域可以是平面或者曲面。
在一些实施例中，当面板上用于与使用者身体接触或抵靠的区域为平面时，其法线满足法 线的一般定义，即为垂直于该平面的虚线。在一些实施例中，当面板上用于与使用者身体接触或抵靠的区域为曲面时，其法线为该区域的平均法线。其中，平均法线的定义如下：
Figure PCTCN2019102391-appb-000002
其中，
Figure PCTCN2019102391-appb-000003
为平均法线；
Figure PCTCN2019102391-appb-000004
为曲面上任意一点的法线，ds为面元。
更进一步地，所述曲面为接近平面的准平面，即所述曲面上至少50％区域内任意一点的法线与其平均法线的夹角小于设定阈值的面。在一些实施例中，所述设定阈值小于10°。在一些实施例中，所述设定阈值可以进一步小于5°。
在一些实施例中，所述驱动力所在直线B与面板3703上用于与使用者身体接触或抵靠的区域的法线A’具有所述夹角θ。所述夹角θ的数值范围可以为0＜θ＜180°，进一步其数值范围可以为0＜θ＜180°且不等于90°。在一些实施例中，设定直线B具有指向骨传导扬声组件外的正方向，设定面板3703的法线A(或者面板3703与人体皮肤接触面的法线A’)也具有指向骨传导扬声组件外的正方向，则法线A或A’与直线B在其正方向上形成的夹角θ为锐角，即0＜θ＜90°。关于法线A与法线A’的更多描述，可以在图39及其相关描述中找到，在此不做赘述。
图38是本申请一些实施例提供的一种夹角方向的示意图。如图38所示，在一些实施例中，驱动装置产生的驱动力在XOY平面坐标系的第一象限和/或第三象限内具有分量。其中，XOY平面坐标系为一个参考坐标系，其原点O位于骨传导扬声组件佩戴在人体上后，面板和/或外壳与人体的接触面上，X轴与人体冠状轴平行，Y轴与人体矢状轴平行，且X轴正方向朝向人体外侧，Y轴正方向朝向人体前方。象限应当被理解为平面直角坐标系中的横轴(如X轴)和纵轴(如Y轴)所划分的四个区域，每一个区域叫做一个象限。象限以原点为中心，X、Y轴为分界线。右上的(X轴的正半轴与Y轴的正半轴围成的区域)称为第一象限，左上的(X轴的负半轴与Y轴的正半轴围成的区域)称为第二象限，左下的(X轴的负半轴与Y轴的负半轴围成的区域)称为第三象限，右下的(X轴的正半轴与Y轴的负半轴围成的区域)称为第四象限。其中，坐标轴上的点不属于任何象限。应当理解为，本实施例所述驱动力可以直接位于所述XOY平面坐标系的第一象限和/或第三象限中，或者所述驱动力朝向其他方向，但是在所述XOY平面坐标系的第一象限和/或第三象限中的投影或分量不为0，以及在Z轴方向的投影或分量可以为0或不为0。其中，Z轴垂直于所述XOY平面，且经过所述原点O。在一些具体实施例中，驱动力所在直线与面板上与使用者身体接触或抵靠的区域的法线之间的最小夹角θ可以为任意锐角，例如夹角θ的范围优选为5°～80°；更优选为15°～70°；再优选为25°～60°；再优选为25°～50°；再优选为28°～50°；再优选为30°～39°；再优选为31°～38°；更优选为32°～37°；更优先选为33°～36°；更优先选为33°～35.8°；更优先选为33.5°～35°。具体的，夹角θ可以是26°、27°、28°、29°、30°、31°、32°、33°、34°、34.2°、35°、35.8°、36°、37°或38°等，误差控制在0.2度以内。需要说明的是，上述对驱动力方向的说明不应理解为本申请中驱动力的限制，在其他实施例中，所述驱动力还可以在XOY平面坐标系中的第二、四象限具有分量，甚至所述驱动力还可以位于Y轴上等等。
图39是本申请一些实施例提供的骨传导扬声组件作用于人体皮肤、骨骼的结构示意图。
在一些实施例中，驱动力所在的直线与驱动装置振动所在的直线共线或平行。例如，在动圈原理的驱动装置中，驱动力的方向可以与线圈和/或磁路组件的振动方向相同或相反。面板可以为平面，也可以为曲面，或者面板上具有若干凸起或凹槽。在一些实施例中，当骨传导扬声组件佩戴在使用者身体上后，面板上与使用者身体接触或抵靠的区域的法线与所述驱动力所在的直线不平行。一般来说，面板上与使用者身体接触或抵靠的区域较为平坦，具体可以是平面，或者曲度变化不大的准平面。当面板上用于与使用者身体接触或抵靠的区域为平面时，其上任意一点的法线均可以作为所述区域的法线，此时，上述面板3703的法线A与面板3703与人体皮肤接触面的法线A’可以为平行或重合。当面板上用于与使用者身体接触面板为非平面时，所述区域的法线可以为其平均法线。关于平均法线的详细定义可以参见图37中的相关描述，在此不再赘述。在其他一些实施例中，当面板上用于与使用者身体接触面板为非平面时，所述区域的法线还可以如下确定，选定面板与人体皮肤接触时的一个区域中的某一点，确定面板在该点处的切平面，再确定过该点且与所述切平面垂直的直线，将该直线作为所述面板的所述法线。当面板上用于与人体皮肤接触面板为非平面时，所选的点不同，面板在该点出的切平面不同，所确定的法线也会有所差异，此时的法线A’与面板的法线A是不平行的。根据本申请一个具体实施例，所述驱动力所在直线(或驱动装置振动所在直线)与所述区域的法线具有夹角θ，所述夹角0＜θ＜180°。在一些实施例中，当指定驱动力所在直线具有经面板(或者面板和/或外壳与人体皮肤接触面)指向骨传导扬声组件外的正方向，指定面板(或者面板和/或外壳与人体皮肤接触面)法线具有指向骨传导扬声组件外的正方向，这两条直线在正方向上形成的夹角为锐角。
如图39所示，所述骨传导扬声组件包括驱动装置(在其他实施例中也可称为换能装置)，传动组件1803，面板1801，以及外壳1802。在一些实施例中，线圈1804与磁路组件1807均为环状结构。在一些实施例中，驱动装置为动圈驱动方式，包括线圈1804及磁路组件1807。
在一些实施例中，线圈1804与磁路组件1807具有相互平行的轴线，线圈1804或磁路组件1807的轴线与线圈1804径向平面和/或磁路组件1807径向平面垂直。在一些实施例中，线圈1804与磁路组件1807具有相同的中心轴线，线圈1804的中心轴线与线圈1804径向平面垂直，且经过线圈1804的几何中心，磁路组件1807的中心轴线与磁路组件1807径向平面垂直，且经过磁路组件1807的几何中心。线圈1804或磁路组件1807的轴线与面板1801的法线具有前述夹角θ。
仅仅作为示例，下面结合图39，阐述驱动力F与皮肤变形S之间的关系。当驱动装置产生的驱动力所在直线与面板1801法线平行时(也就是夹角θ为零)，驱动力与皮肤总形变的关系为：
F ⊥＝S ⊥×E×A/h   (2)
其中，F ⊥为驱动力大小，S ⊥为皮肤在垂直皮肤方向的总形变，E为皮肤的弹性模量，A为面板与皮肤的接触面积，h为皮肤的总厚度(也即面板与骨骼之间的距离)。
当驱动装置的驱动力所在直线与面板上与使用者身体接触或抵靠的区域的法线垂直时(也就是夹角θ为90度)，垂直方向的驱动力与皮肤总形变的关系可以如公式(3)所示：
F //＝S //×G×A/h   (3)
其中，F //为驱动力大小，S //为皮肤在平行皮肤方向的总形变，G为皮肤的剪切模量，A为面板与皮肤的接触面积，h为皮肤的总厚度(也即面板与骨骼之间的距离)。
剪切模量G与弹性模量E之间的关系为：
G＝E/2(1+γ)    (4)
其中，γ为皮肤的泊松比0<γ<0.5，因而剪切模量G小于弹性模量E，对应在相同的驱动力下皮肤的总形变S //>S ⊥。通常，皮肤的泊松比接近0.4。
当驱动装置产生驱动力所在直线与面板与使用者身体接触的区域的法线不平行时，水平方向驱动力与垂直方向的驱动力分别表示为以下的公式(5)和公式(6)：
F ⊥＝F×cos(θ)   (5)
F //＝F×sin(θ)   (6)
其中，驱动力F与皮肤变形S之间的关系可由以下公式表示：
Figure PCTCN2019102391-appb-000005
当皮肤的泊松比为0.4时，夹角θ与皮肤总形变之间的关系的详细描述可以参考本申请的其它地方的具体内容。
图40是根据本申请一些实施例提供的骨传导扬声组件的夹角-相对位移关系图。如图40所示，夹角θ与皮肤总形变之间的关系为夹角θ越大，相对位移越大，则皮肤总形变S越大。皮肤在垂直皮肤方向形变S ⊥随着夹角θ的变大，相对位移变小，皮肤在垂直皮肤方向形变S ⊥变小；并且在夹角θ接近90度时，皮肤在垂直皮肤方向形变S ⊥逐渐趋向于0。
骨传导扬声组件在低频部分的音量与皮肤总变形S正相关。S越大，骨传导低频的音量越大。骨传导扬声组件在高频部分的音量与皮肤在垂直皮肤方向形变S ⊥正相关。S ⊥越大，骨传导低频的音量越大。
当皮肤的泊松比为0.4时，夹角θ与皮肤总形变S，皮肤在垂直皮肤方向形变S ⊥之间的关系的详细描述可以在图40中找到。如图40所示，夹角θ与皮肤总形变S之间的关系为夹角θ越大，皮肤总形变S越大，对应骨传导扬声组件的低频部分音量越大。如图40所示，夹角θ与皮肤在垂直皮肤方向形变S⊥之间的关系为夹角θ越大，皮肤在垂直皮肤方向形变S⊥越小，对应骨传导扬声组件的高频部分音量越小。
通过方程(7)以及图40的曲线可以看出，随着夹角θ的增大，皮肤总形变S增大的速度与皮肤在垂直皮肤方向形变S ⊥减小的速度不同。皮肤总形变S增大的速度先变快后变慢，皮肤在垂直皮肤方向形变S ⊥减小的速度越来越快。为平衡骨传导扬声组件低频与高频的音量，夹角θ要在一个合适的大小。例如θ的范围为5°～80°，或者为15°～70°，或者为25°～50°，或者为25°～35°，或者为25°～30°等等。
图41是根据本申请提供的不同夹角θ时骨传导扬声组件的频率响应曲线低频段部分的示 意图。如图41所示，面板与皮肤接触，将振动传递到皮肤。在这个过程中，皮肤也会影响骨传导扬声组件的振动，从而影响到骨传导扬声组件的频率响应曲线。从上面的分析中，我们发现夹角度越大，相同的驱动力下皮肤的总形变越大，而对应骨传导扬声组件来说，相当于皮肤相对其面板部分的弹性减小。进一步地可以理解为，在驱动装置的驱动力所在直线与面板上与使用者身体接触或抵靠区域的法线形成一定夹角θ时，尤其是当夹角θ加大时，可以将频率响应曲线中的低频区域的谐振峰调节至更低频的区域，使低频下潜更深，低频增多。相对于其他提高声音中低频成分的技术手段，如在骨传导扬声组件中增设传振片，设置所述夹角能够在提高低频能量的同时有效抑制振动感的增加，进而使振动感相对减少，使得骨传导扬声组件低频灵敏度显著提高，提高音质和人体的体验感。应当注意的是，在一些实施例中，低频增多，振动感少可以表现为夹角θ在(0，90°)范围内增大时，振动或声音信号中的低频范围的能量增加了，同时振动感也增加了，但是低频范围的能量增加的程度比振动感增加的程度更大，因此，在相对效果上，振动感相对减小了。从图41可以看出，夹角较大时，低频区的谐振峰出现在更低频段处，可以变相地延长频率曲率平坦的部分，从而提高扬声组件的音质。
图42是根据本申请的一些实施例所示的骨传导扬声组件的纵截面示意图。需要注意的是，图42中骨传导扬声组件200与图1中的耳机芯102和机芯壳体108项相对应，耳机壳体220与图1中的机芯壳体108向对应。如图42所示，在一些实施例中，骨传导扬声组件200可以包括磁路组件210、线圈212、传振片214、连接件216以及耳机壳体220。磁路组件210可以包括第一磁性元件202、第一导磁元件204和第二导磁元件206。
在一些实施例中，耳机壳体220可以包括外壳面板222、外壳背面224和外壳侧面226。外壳背面224位于与外壳面板222相对的一面，并分别设置在外壳侧面226的两端面上。外壳面板222、外壳背面224和外壳侧面226形成具有一定容置空间的整体结构。在一些实施例中，磁路组件210、线圈212和传振片214固定在耳机壳体220内部。在一些实施例中，骨传导扬声组件200还可以包括外壳支架228，传振片214可以通过外壳支架228与耳机壳体220连接，线圈212可以固定在外壳支架228上，并通过外壳支架228带动外壳220振动。在一些实施例中，外壳支架228可以是耳机壳体220的一部分，也可以是单独的组件，直接或者间接连接于耳机壳体220的内部。在一些实施例中，外壳支架228可以固定在外壳侧面226的内表面上。在一些实施例中，外壳支架228可以通过胶水粘贴在耳机壳体220上，也可以通过冲压、注塑、卡接、铆接、螺纹连接或焊接固定在壳体220上。
在一些实施例中，可以通过设计外壳面板222、外壳背面224和外壳侧面226的连接方式确保耳机壳体220具有较大的刚度。例如，外壳面板222、外壳背面224和外壳侧面226可以是一体成型。又例如，外壳背面224和外壳侧面226可以是一体成型结构。外壳面板222和外壳侧面226可以通过胶水直接粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。所述胶水可以是粘性强、硬度较大的胶水。再例如，外壳面板222和外壳侧面226可以是一体成型结构，外壳背面224和外壳侧面226之间可以通过胶水直接粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。 在一些实施例中，外壳面板222、外壳背面224和外壳侧面226都是独立的部件，三者之间可以通过胶水、卡接、焊接或螺纹连接方式中的一种或任意几种的组合进行固定连接。例如，外壳面板222和外壳侧面226之间通过胶水连接，外壳背面224和外壳侧面226之间通过卡接、焊接或螺纹连接进行连接。或是外壳背面224和外壳侧面226之间通过胶水连接，外壳面板222和外壳侧面226之间通过卡接、焊接或螺纹连接进行连接。
在不同的应用场景中，本申请中所描述的壳体可以通过不同的装配方式制成。例如，如本申请中其他地方的描述，壳体可以是一体成型的方式，也可以是分体组合的方式，或者两者相结合的方式。在分体组合的方式中，不同分体之间可以采用胶水粘贴固定，或是通过卡接、焊接或螺纹连接的方式进行固定。具体地，为了更好地理解本申请中骨传导耳机的壳体的装配方式，图43-24描述了几种壳体的装配方式的示例。
如图43所示，骨传导扬声组件主要包括磁路组件2210和壳体。在一些实施例中，磁路组件2210可以包括第一磁性元件2202、第一导磁元件2204和第二导磁元件2206。壳体可以包括外壳面板2222，外壳背面2224和外壳侧面2226。外壳侧面2226和外壳背面2224由一体成型的方式制成，外壳面板2222通过分件组合的方式连接到外壳侧面2226的一端。所述分件组合的方式包括使用胶水粘结固定，或是通过卡接、焊接或螺纹连接的方式将外壳面板2222固定在外壳侧面2226的一端。外壳面板2222和外壳侧面2226(或者外壳背面2224)可以采用不同、相同或者部分相同的材料制成。在一些实施例中，外壳面板2222和外壳侧面2226采用相同的材料制成，且所述相同材料的杨氏模量大于2000MPa。更优选地，所述相同材料的杨氏模量大于4000MPa，更优选地，所述相同材料的杨氏模量大于6000MPa，更优选地，耳机壳体220材料的杨氏模量大于8000MPa，更优选地，所述相同材料的杨氏模量大于12000MPa，更优选地，所述相同材料的杨氏模量大于15000MPa，进一步优选地，所述相同材料的杨氏模量大于18000MPa。在一些实施例中，外壳面板2222和外壳侧面2226采用不同的材料制成，所述不同材料的杨氏模量都大于4000MPa。更优选地，所述不同材料的杨氏模量都大于6000MPa，更优选地，所述不同材料的杨氏模量都大于8000MPa，更优选地，所述不同材料的杨氏模量都大于12000MPa，更优选地，所述不同材料的杨氏模量都大于15000MPa，进一步优选地，所述不同材料的杨氏模量都大于18000MPa。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料包括但不限于丙烯腈-丁二烯-苯乙烯共聚物(AcrYlonitrile butadiene stYrene,ABS)、聚苯乙烯(PolYstYrene,PS)、高冲击聚苯乙烯(High impact polYstYrene,HIPS)、聚丙烯(PolYpropYlene,PP)、聚对苯二甲酸乙二酯(PolYethYlene terephthalate,PET)、聚酯(PolYester,PES)、聚碳酸酯(PolYcarbonate,PC)、聚酰胺(PolYamides,PA)、聚氯乙烯(PolYvinYl chloride,PVC)、聚氨酯(PolYurethanes,PU)、聚二氯乙烯(PolYvinYlidene chloride)、聚乙烯(PolYethYlene,PE)、聚甲基丙烯酸甲酯(PolYmethYl methacrYlate,PMMA)、聚醚醚酮(PolYetheretherketone,PEEK)、酚醛树脂(Phenolics,PF)、尿素甲醛树脂(Urea-formaldehYde,UF)、三聚氰胺-甲醛树脂(Melamine formaldehYde,MF)以及一些金属、合金(如铝合金、铬钼钢、钪合金、镁合金、钛合金、镁锂合金、镍合金等)、玻璃纤维或碳纤维中的任意材料或上述任意材料的 组合。在一些实施例中，外壳面板2222的材料为玻璃纤维、碳纤维与聚碳酸酯(PolYcarbonate,PC)、聚酰胺(PolYamides,PA)等材料的任意组合。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是碳纤维和聚碳酸酯(PolYcarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是碳纤维、玻璃纤维和聚碳酸酯(PolYcarbonate,PC)按照一定比例混合制成。在一些实施例中，外壳面板2222和/或外壳侧面2226的材料可以是玻璃纤维和聚碳酸酯(PolYcarbonate,PC)按照一定比例混合制成，也可以使玻璃纤维和聚酰胺(PolYamides,PA)按照一定比例混合制成。
在一些实施例中，外壳面板2222、外壳背面2224和外壳侧面2226形成具有一定容置空间的整体结构。在所述整体结构内，传振片2214通过连接件2216与磁路组件2210连接。磁路组件2210的两侧分别连接第一导磁元件2204和第二导磁元件2206。传振片2214通过外壳支架2228固定在所述整体结构的内部。在一些实施例中，外壳侧面2226上具有用于支撑外壳支架2228的台阶结构。在外壳支架2228固定于外壳侧面2226后，外壳面板2222可以同时固定在外壳支架2228和外壳侧面2226上，或者单独固定在外壳支架2228或外壳侧面2226上。在这种情况下，可选地，外壳侧面2226和外壳支架2228可以一体成型。在一些实施例中，外壳支架2228可以直接固定在外壳面板2222上(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。固定后的外壳面板2222和外壳支架2228再与外壳侧面固定(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。在这种情况下，可选地，外壳支架2228和外壳面板2222可以一体成型。
在另一具体的实施例中，如图44所示，骨传导扬声组件主要包括磁路组件2240和壳体。其中，磁路组件2240可以包括第一磁性元件2232、第一导磁元件2234和第二导磁元件2236。在整体结构内，传振片2244通过连接件2246与磁路组件2240连接。该实施例与图43提供的实施例不同之处在于，外壳支架2258和外壳侧面2256一体成型。外壳面板2252固定在外壳侧面2256上与外壳支架2258连接的一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)，外壳背面2254固定在外壳侧面2256的另一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。在这种情况下，可选地，外壳支架2258和外壳侧面2256是分体组合的结构，并且外壳面板2252，外壳背面2254，外壳支架2258和外壳侧面2256之间都是通过胶水粘贴、卡接、焊接或螺纹连接的方式进行固定连接。
在另一具体的实施例中，如图45所示，该实施例中的骨传导扬声组件主要包括磁路组件2270和壳体。其中，磁路组件2270可以包括第一磁性元件2262、第一导磁元件2264和第二导磁元件2266。在整体结构内，传振片2274通过连接件2276与磁路组件2270连接。该实施例与图44提供的实施例的不同之处在于，外壳面板2282和外壳侧面2286一体成型。外壳背面2284固定在外壳侧面2286上相对于外壳面板2282的一侧(例如，通过胶水粘贴、卡接、焊接或螺纹连接等方式)。外壳支架2288通过胶水粘贴、卡接、焊接或螺纹连接的方式固定在外壳面板2282和/或外壳侧面2286上。在这种情况下，可选地，外壳支架2288，外壳面板2282和外壳侧面2286是一体成型的结构。
图46是根据本申请一些实施例所示的一种骨传导扬声组件的壳体结构示意图。如图46所示，壳体700可以包括外壳面板710、外壳背面720和外壳侧面730。外壳面板710与人体接触，将骨传导扬声组件的振动传递给人体的听觉神经。在一些实施例中，当壳体700的整体刚度较大时，在一定的频率范围内，外壳面板710和外壳背面720的振动幅度和相位保持相同或基本相同(外壳侧面730不压缩空气因而不产生漏音)，使得外壳面板710产生的第一漏音信号和外壳背面720产生的第二漏音信号能够相互叠加。所述叠加可以减小第一漏音声波或第二漏音声波的幅值，从而达到降低壳体700漏音的目的。在一些实施例中，所述的一定频率范围至少包括频率大于500Hz的部分。优选地，所述的一定频率范围至少包括频率大于600Hz的部分。优选地，所述的一定频率范围至少包括频率大于800Hz的部分。优选地，所述的一定频率范围至少包括频率大于1000Hz的部分。优选地，所述的一定频率范围至少包括频率大于2000Hz的部分。更优选地，所述的一定频率范围至少包括频率大于5000Hz的部分。更优选地，所述的一定频率范围至少包括频率大于8000Hz的部分。进一步优选地，所述的一定频率范围至少包括频率大于10000Hz的部分。
在一些实施例中，骨传导扬声组件的壳体的刚度会影响壳体上不同部位(例如，外壳面板、外壳背面和/或外壳侧面)的振动幅度和相位，从而影响骨传导扬声组件的漏音。在一些实施例中，当骨传导扬声组件的壳体具有比较大的刚度时，外壳面板和外壳背面能够在较高的频率下保持相同或者基本相同的振动幅度和相位，从而显著减小骨传导耳机的漏音。
在一些实施例中，较高的频率可以包括不小于1000Hz的频率，例如，1000Hz-2000Hz之间的频率，1100Hz-2000Hz之间的频率，1300Hz-2000Hz之间的频率，1500Hz-2000Hz之间的频率，1700Hz-2000Hz之间的频率，1900Hz-2000Hz之间的频率。优选地，这里所说的较高的频率可以包括不小于2000Hz的频率，例如，2000Hz-3000Hz之间的频率，2100Hz-3000Hz之间的频率，2300Hz-3000Hz之间的频率，2500Hz-3000Hz之间的频率，2700Hz-3000Hz之间的频率，或者2900Hz-3000Hz之间的频率。优选地，较高的频率可以包括不小于4000Hz的频率，例如，4000Hz-5000Hz之间的频率，4100Hz-5000Hz之间的频率，4300Hz-5000Hz之间的频率，4500Hz-5000Hz之间的频率，4700Hz-5000Hz之间的频率，或者4900Hz-5000Hz之间的频率。更优选地，较高的频率可以包括不小于6000Hz的频率，例如，6000Hz-8000Hz之间的频率，6100Hz-8000Hz之间的频率，6300Hz-8000Hz之间的频率，6500Hz-8000Hz之间的频率，7000Hz-8000Hz之间的频率，7500Hz-8000Hz之间的频率，或者7900Hz-8000Hz之间的频率。进一步优选地，较高的频率可以包括不小于8000Hz的频率，例如，8000Hz-12000Hz之间的频率，8100Hz-12000Hz之间的频率，8300Hz-12000Hz之间的频率，8500Hz-12000Hz之间的频率，9000Hz-12000Hz之间的频率，10000Hz-12000Hz之间的频率，或者11000Hz-12000Hz之间的频率。
外壳面板和外壳背面保持相同或者基本相同的振动幅度是指所述外壳面板和外壳背面的振动幅度的比值在一定的范围之内。例如，外壳面板和外壳背面的振动幅度的比值在0.3到3之间，优选地，外壳面板和外壳背面的振动幅度的比值在0.4到2.5之间，优选地，外壳面板和外壳背面的振动幅度的比值在0.5到1.5之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.6到1.4 之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.7到1.2之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.75到1.15之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.8到1.1之间，更优选地，外壳面板和外壳背面的振动幅度的比值在0.85到1.1之间，进一步优选地，外壳面板和外壳背面的振动幅度的比值在0.9到1.05之间。在一些实施例中，外壳面板和外壳背面的振动可以用其他能够表征其振动幅度的物理量来表示。例如，可以分别用空间中一点处由外壳面板和外壳背面产生的声压来表征外壳面板和外壳背面的振动幅度。
外壳面板和外壳背面保持相同或者基本相同的振动相位是指所述外壳面板和外壳背面的振动相位的差值在一定的范围之内。例如，外壳面板和外壳背面的振动相位的差值在-90°到90°之间，优选地，外壳面板和外壳背面的振动相位的差值在-80°到80°之间，优选地，外壳面板和外壳背面的振动相位的差值在-60°到60°之间，优选地，外壳面板和外壳背面的振动相位的差值在-45°到45°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-30°到30°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-20°到20°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-15°到15°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-12°到12°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-10°到10°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-8°到8°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-6°到6°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-5°到5°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-4°到4°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-3°到3°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-2°到2°之间，更优选地，外壳面板和外壳背面的振动相位的差值在-1°到1°之间，进一步优选地，外壳面板和外壳背面的振动相位的差值为0°。
图47A和47B是根据本申请的一些实施例所示的扬声组件的示意图。在本实施例中，所述扬声组件包括机芯壳体4710、振动面板4721和换能装置4722。结合图25，所述机芯壳体4710和所述机芯壳体4710(图27)相一致。在一些实施例中，换能装置4722容置在所述机芯壳体4710的内部并产生振动。所述换能装置4722的振动会引起所述机芯壳体4710的振动，并由此推动壳外空气振动而产生漏音。所述机芯壳体4710的至少一部分上开设有至少一个引声孔4730，所述引声孔4730用于将所述机芯壳体4710内部空气振动所形成的壳内声波引出至所述机芯壳体4710的外部，与所述机芯壳体4710振动推动壳外空气所形成的漏音声波发生干涉。在一些实施例中个，所述干涉可以降低所述漏音声波的振幅。
振动面板4721与换能装置4722固定相连，在换能装置4722的带动下同步振动。振动面板4721从机芯壳体4710的开口伸出机芯壳体4710，至少部分与人体皮肤贴合，振动通过人体组织与骨骼传递到听觉神经，从而使人听到声音。在换能装置4722与机芯壳体4710之间可以通过连接件4723相连，连接件4723将换能装置4722定位在机芯壳体4710中。
连接件4723可以为一个或多个独立的部件，也可以与换能装置4722或机芯壳体4710一体设置。在一些实施例中，为了减小对振动的约束，连接件4723可以选择弹性材料制成。
在一些实施例中，引声孔4730可以设置在侧壁高度的上部，例如，从顶部(振动面板)到侧壁高度方向1/3高度的部分。
以圆柱形外壳为例，对于设置位置，根据不同的需求，引声孔4730可以开设于所述外壳的侧壁4711和/或底壁4712。优选所述引声孔4730开设在所述外壳侧壁4711的上部和/或下部。开设在所述外壳侧壁4711的引声孔数量可以为至少两个，优选是呈环状周向均匀分布。开设在所述外壳底壁4712的引声孔数量可以为至少两个，以底壁的中心为圆心，呈环状均匀分布。呈环状分布的所述引声孔可以设置至少一圈。开设在所述外壳底壁4712的引声孔数量可以为仅有一个，该引声孔设置在底壁4712的中心处。
对于数量，引声孔可以为一个或多个，优选是有多个，均匀布设。对于环状布设的引声孔，每圈引声孔的数量例如可以为6-8个。
引声孔的形状可以为圆形、椭圆形、矩形或长条形等。长条形一般是指沿直线、曲线或弧线的条状。各种形状的引声孔在一个扬声组件上可以相同或不同。
在一些实施例中，在机芯壳体4710的侧壁下部(侧壁高度方向2/3高度到底部的部分)开设有贯通的引声孔4730。引声孔4730的数量可以是，例如，8个，形状可以是，例如，矩形。各引声孔4730呈环形均匀分布在机芯壳体4710的侧壁上。
在一些实施例中，机芯壳体4710为圆柱状，在机芯壳体4710的侧壁中部(侧壁高度方向1/3高度到2/3高度的部分)开设有贯通的引声孔4730。引声孔4730的数量可以是，例如，8个，形状可以是，例如，矩形。各引声孔4730呈环形均匀分布在机芯壳体4710的侧壁上。
在一些实施例中，在机芯壳体4710的底壁的周向开设有贯通的引声孔4730。引声孔4730的数量可以是，例如，8个，形状可以是，例如，矩形。各引声孔4730呈环形均匀分布在机芯壳体4710的侧壁上。
在一些实施例中，在机芯壳体4710侧壁的上部和下部分别开设有贯通的引声孔4730。引声孔4730呈环状均匀分布在机芯壳体4710侧壁的上部和下部，每圈引声孔4730的数量为8个。且上部和下部设置的引声孔4730相对于机芯壳体4710的中截面对称设置。每个引声孔4730的形状为圆形。
在一些实施例中，在机芯壳体4710侧壁的上部和下部，以及机芯壳体4710的底壁分别开设有贯通的引声孔4730。侧壁开设的引声孔4730呈环状均匀分布在机芯壳体4710侧壁的上部和下部，每圈数量为8个，且上部和下部设置的引声孔4730相对于机芯壳体4710的中截面对称设置。侧壁开设的每个引声孔4730为矩形。底壁开设的引声孔4730的形状为沿弧线设置的长条形，数量为4个，以底壁的中心为圆心呈环形均匀分布。且底壁开设的引声孔4730还包括开设在中心处的圆形的通孔。
在一些实施例中，在机芯壳体4710侧壁的上部开设有贯通的引声孔4730，呈环状均匀分布在机芯壳体4710侧壁的上部，数量例如为8个，引声孔4730的形状为圆形。
在一些实施例中，为了显示出抑制漏音的较优效果，分别在侧壁4711的上部、中部和下部 均周向均布有引声孔4730，在机芯壳体4710底壁4712也周向开设有一圈引声孔4730。各引声孔4730的孔径大小和孔的个数均相同。
在一些实施例中，所述引声孔4730可以为无遮挡的贯通孔。
为了控制壳内声波从引声孔4730传播而出的效果，可以在引声孔4730的开口处设置阻尼层(在说明书附图中未示出)，以调节声波的相位和振幅，从而修正引导壳内声波的效果。阻尼层的材料选择和设置位置可以有多种方式，例如，阻尼层为调音纸、调音棉、无纺布、丝绸、棉布、海绵或橡胶等对音质传导具有一定阻尼的材料，可以在引声孔4730内壁贴附阻尼层，或者在引声孔4730的孔口外侧罩设阻尼层等。
在一些实施例中，对应不同引声孔之间，可以将所设置的阻尼层设置为不同引声孔4730之间具有相同的相位差以抑制相同波长的漏音，或设置为不同的所述引声孔4730之间具有不同的相位差以抑制不同波长的漏音(即特定波段的漏音)。
在一些实施例中，同一引声孔4730的不同部位之间设置为具有相同的相位(例如，使用预先设计好的阶梯或台阶状的阻尼层)，以抑制相同波长的漏音声波；或者，同一引声孔4730的不同部位之间，设置为具有不同的相位，以抑制不同波长的漏音声波。
换能装置4722不仅带动振动面板4721振动，换能装置4722自身也是一个振动源，其容置在机芯壳体4710的内部，换能装置4722表面振动使外壳内空气随之振动，形成的声波是在机芯壳体4710内部的，可称为壳内声波。振动面板4721和换能装置4722通过连接件4723定位在机芯壳体4710上，不可避免地会将振动作用于机芯壳体4710上，带动机芯壳体4710同步振动，所以机芯壳体4710推动壳外空气振动即形成了漏音声波。漏音声波向外传播，就形成了漏音。
根据如下公式来确定引声孔的位置来抑制漏音，漏音降低量正比于：
Figure PCTCN2019102391-appb-000006
其中，S 开孔是引声孔的开孔面域，S 外壳是未与人脸接触的外壳面域，
壳内压强：
P＝P a+P b+P c+P e，   (5)
P a、P b、P c、P e分别是a面、b面、c面、e面在壳内空间任一点所生成的声压，
Figure PCTCN2019102391-appb-000007
Figure PCTCN2019102391-appb-000008
Figure PCTCN2019102391-appb-000009
Figure PCTCN2019102391-appb-000010
其中，
Figure PCTCN2019102391-appb-000011
是观测点(x,y,z)到b面声源上一点(x′,y′,0)的距离；S a、S b、S c、S e分别为a面、b面、c面、e面的面域；
Figure PCTCN2019102391-appb-000012
是观测点(x,y,z)到a面声源上一点(x′ a,y′ a,z a)的距离；
Figure PCTCN2019102391-appb-000013
是观测点(x,y,z)到c面声源上一点(x′ c,y′ c,z c)的距离；
Figure PCTCN2019102391-appb-000014
是观测点(x,y,z)到e面声源上一点(x′ e,y′ e,z e)的距离；k＝ω/u波数(u为声速)，ρ 0为空气密度，ω为振动的角频率，P a阻、P b阻、P c阻、P e阻为空气本身声阻，分别为：
Figure PCTCN2019102391-appb-000015
Figure PCTCN2019102391-appb-000016
Figure PCTCN2019102391-appb-000017
Figure PCTCN2019102391-appb-000018
其中，r为单位长度上的声阻尼，r′为单位长度上的声质量，z a为观测点到a面声源的距离，z b为观测点到b面声源的距离，z c为观测点到c面声源的距离，z e为观测点到e面声源的距离。
W a(x,y)、W b(x,y)、W c(x,y)、W e(x,y)、W d(x,y)分别是a、b、c、e、d面单位面积的声源强度，可由以下公式组(14)导出：
Figure PCTCN2019102391-appb-000019
其中，F为换能器转换成的驱动力，F a、F b、F c、F d、F e分别为a、b、c、d、e各处的驱动力，S d为外壳(d面)面域，f为侧壁的小间隙形成的粘滞阻力，f＝ηΔs(dv/dy)，L为振动板作用于人脸时，人脸的等价载荷，γ为弹性元件2上耗散能量，k 1、k 2分别是弹性元件1和弹性元件2的弹性系数，η为流体粘性系数，dv/dy为流体的速度梯度，Δs为物体(板)的截面积，A为幅度，
Figure PCTCN2019102391-appb-000020
为声场的面积，δ为高阶量(来源于外壳形状的非完全对称性)，壳体外任意一点，由壳体振动产生的声压为：
Figure PCTCN2019102391-appb-000021
其中，
Figure PCTCN2019102391-appb-000022
为观测点(x,y,z)到d面声源上一点(x′ d,y′ d,z d)的距离。
P a、P b、P c、P e全都是位置的函数，当我们在壳上任一位置开孔时，若开孔面积为S开孔，则开孔处声压的总作用为
Figure PCTCN2019102391-appb-000023
而机芯壳体210上由于振动面板221紧贴人体组织，其输出能量都被人体组织吸收，那么只有d面推动壳外空气振动，形成漏音，外壳推动壳外空气振动的总作用为
Figure PCTCN2019102391-appb-000024
在一些应用场景中，我们的目标是使
Figure PCTCN2019102391-appb-000025
与
Figure PCTCN2019102391-appb-000026
大小相等，方向相反，从而达到降低漏音的效果。一旦装置基本结构确定，
Figure PCTCN2019102391-appb-000027
是一个我们无法调整的量，那么调整
Figure PCTCN2019102391-appb-000028
使其与
Figure PCTCN2019102391-appb-000029
抵消。而
Figure PCTCN2019102391-appb-000030
上包含了完整的相位和幅度信息，其相位、幅度与扬声组件的外壳尺寸、换能装置的振动频率、引声孔的开设位置、形状、数量、尺寸及孔上是否有阻尼都有密切关系，这就使我们可以通过调整引声孔的开设位置、形状和数量和/或增加阻尼和/或调整阻尼材料来达到抑制漏音的目的。
壳内声波和漏音声波相当于中所示的两个声源。本发明实施例在外壳的壁面上开设了贯通的引声孔4730，能够将壳内声波引导传播至壳外，与漏音声波同在空气中进行传播，发生干涉，从而降低所述漏音声波的振幅，即减小了漏音。因此，本申请的技术方案，通过在外壳上开设引声孔这一便捷改进，即在一定程度上解决漏音问题，且不增加扬声组件的体积和重量。
根据发明人所推导的上述公式，本领域技术人员容易理解的是，漏音声波的消除效果，与扬声组件的外壳尺寸、换能装置的振动频率、引声孔的开设位置、形状、数量、尺寸及孔上是否有阻尼都有密切关系，所以，引声孔的开设位置、形状、数量、孔上的阻尼材料等可以根据需要有多种不同的变化方案。
在扬声组件(例如，如图47A和47B所示的扬声组件)附件的目标区域中，漏音声波传递至所述目标区域的相位，与壳内声波经引声孔传播至该目标区域的相位之间，相差接近180度。通过此设置，可使得外壳产生的漏音声波在目标区域显著降低、甚至消除。
如图29所示，在1500Hz～4000Hz频段内，漏音声波被显著抑制。其中，在1500Hz～3000Hz频段内，被抑制的漏音基本超过10dB。特别是在2000Hz～2500Hz这个频段内，在外壳侧面上部开设引声孔后，漏音比未开设引声孔的方案降低了超过20dB。
在一个具体的实施例中，结合图7、图47A和图47B所示，眼镜架可以包括：眼镜框11、鼻托12、眼镜片13以及眼镜腿15，扬声组件可以通过连接组件与所述眼镜腿15连接。在一些实施例中，扬声组件的结构如图47A和图47B所示，所述扬声组件包括振动单元和换能装置4722。振动单元包括机芯壳体4710、振动面板4721，换能装置4722位于振动单元内部并与之连接。优选地，振动单元是包括以上描述的面板和振动传递层，接触面板4721是振动单元1202与使用者接触的表面，优选地，是振动传递层的外侧表面。
在使用过程中，连接组件将扬声组件固定在使用者的特定部位(例如，头部)，为振动单元和使用者之间提供夹紧力。接触面板4721和换能装置4722连接，并与使用者保持接触，将声音 通过振动传递给使用者。为获得满足特定夹紧力条件的耳机架/耳机挂带，本领域的普通技术人员可以根据实际情况选用具有不同形状和结构的连接组件。需要注意的是，眼镜腿15的夹紧力不但会影响声音的传递效率，也会影响用户在低音频率范围内的声音感受。这里所说的夹紧力是接触面板4721与使用者之间的压力，优选地，夹紧在0.1N-5N之间，更优选地，夹紧力在0.1N-4N之间，进一步优选地，夹紧力在0.2N-3N之间，再优选地，夹紧力在0.2N-1.5N之间，更进一步优选地，夹紧力在0.3N-1.5N之间。
图49和图50为一个实施例中接触面与使用者之间不同压力下的骨传导扬声组件的振动响应曲线。在振动传递过程中，夹紧力低于一定阈值后不利于高频振动的传递。如(a)所示，对于同一振动源(声源)，当夹紧力为0.1N时，佩戴者接收到的振动(声音)中，中频和高频部分明显少于夹紧力为0.2N和1.5N时所接受到的振动(声音)，即在音质上，夹紧力在0.1N时，中频和高频部分表现弱于夹紧力在0.2N-1.5N时的表现。类似的，在振动传递过程中，夹紧力大于一定阈值后不利于低频振动的传递。如(b)所示，对于同一振动源(声源)，当夹紧力为5.0N时，佩戴者接受到的振动(声音)的中频和低频部分明显少于夹紧力为0.2N和1.5N时所接受到的振动(声音)，即在音质上，夹紧力在5.0N时，低频部分表现弱于夹紧力在0.2N-1.5N时的表现。
在具体的实施例中，通过选择合适的连接组件，使得接触面与使用者之间的压力保持在适当的范围内。接触面与使用者之间的压力大于某一阈值，优选地，该阈值为0.1N，更优选地，该阈值为0.2N，进一步优选地，该阈值为0.3N，再优选地，该阈值为0.5N。接触面与使用者之间的压力小于另一阈值，优选地，该阈值为5.0N，更优选地，该阈值为4N，进一步优选地，该阈值为3N，再优选地，该阈值为1.5N。
结合图1，在一些实施例中，所述眼镜上的扬声组件包括耳机芯102和机芯壳体108，例如骨传导扬声组件、气传导扬声组件等。其中，骨传导是一种声音传导方式，即将声音转化为不同频率的机械振动，通过人的颅骨、骨迷路、内耳淋巴液传递、螺旋器、听神经、听觉中枢等来传递声波。
再参照图21，传感终端1102和振动单元1103(即，机芯壳体)间的传递关系K2也会影响到骨传导系统的频率响应。人耳听到的声音，取决于耳蜗接收到的能量，该能量受到传递过程中不同物理量的影响，可由以下公式表示：
P＝∫∫ Sα·f(a,R)·L·ds   (16)
其中，P正比于耳蜗接收到的能量，S是接触面502a与人脸接触的面积，α是一个量纲转换的系数，f(a,R)表示接触面上一点的加速度a和接触面与皮肤接触的紧密程度R对能量传递的影响，L是任一接触点上机械波传递的阻抗，即单位面积的传递阻抗。
由(16)可知，声音的传递受到传递阻抗L的影响，骨传导系统的振动传递效率与L有关，骨传导系统的频响曲线为接触面上各点的频响曲线的叠加。改变影响阻抗的因素包括能量传递面积的大小、形状、粗糙程度、受力大小或受力分布等。例如，通过改变振动单元的结构和外形来改变声音的传递效果，进而改变骨传导扬声组件的音质。仅仅是作为示例，改变振动单元接触面的相应 物理特性，可以达到改变声音传递的效果。
图51为本申请实施例中一种扬声组件振动单元接触面的示意图。在一些实施例中，图51中的扬声组件振动单元接触面相当于图1中功能模块与人体接触的外壁。其中，该实施例是传感终端1102和振动单元1103间的传递关系K2的具体体现。如图51所示，一种精心设计的接触面表面设有梯度结构，所述梯度结构指的是接触面表面存在高度变化的区域。这里所说的接触面是机芯壳体上贴近用户的一侧。梯度结构可以是接触面外侧(与使用者贴合的一侧)存在的凸起/凹下或者台阶状等结构，也可以是接触面内侧(背向使用者的一侧)存在的凸起/凹下或者台阶状等结构。需要知道的是，所述振动单元接触面可以贴合在使用者头部的任意位置，例如，头顶、额头、脸颊、鬓角、耳廓、耳廓背面等。如图51所示，接触面1601(接触面外侧)存在凸起或凹下(未在图51中显示)。在骨传导扬声组件工作的过程中，凸起或凹下部分与使用者接触，改变接触面1601上不同位置与人脸接触时的压力。凸起部分与人脸接触更紧密，与之接触的皮肤和皮下组织受到比其它部分更大的压力；相应的，与下凹部分接触的皮肤和皮下组织受到比其它部分更小的压力。例如，图51中的接触面1601上存在A，B，C三点，分别位于接触面1601非凸起部分，凸起部分边缘和凸起部分上。在与皮肤接触的过程中，A，B，C三点处皮肤所受的夹紧力大小FC>FA>FB。在一些实施例中，B点的夹紧力大小为0，即B点不与皮肤接触。人脸皮肤与皮下组织在不同压力下表现出对声音的阻抗和响应不同。压力大的部位阻抗率小，对声波有偏向高通的滤波特性，压力小的部位阻抗率大，有偏向低通的滤波特性。接触面1601各部位的阻抗特性L不同，根据公式(16)，不同部位对声音传递时频率的响应不同，声音通过全接触面传递的效果相当于各部位声音传递的总和，最终声音传递到大脑时形成平滑的频率响应曲线，避免了在低频或高频有过高的谐振峰的出现，从而获得整个音频带宽内理想的频率响应。同样的，接触面1601的材质和厚度也会对声音的传递产生影响，从而影响音质效果。例如，接触面材质柔软时，低频范围的声波传递效果好于高频范围的声波传递，接触面材质较硬时，高频范围的声波传递效果好于低频范围的声波传递。
图52显示含有不同接触面的扬声组件的频率响应。虚线对应接触面上存在凸起结构的扬声组件的频率响应，实线对应接触面上不存在凸起结构的扬声组件的频率响应。在中低频范围内(例如，在300Hz到1000Hz的范围内)，无凸起结构的振动相对于存在凸起结构的振动有明显的削弱，在频率响应曲线上形成一个“深坑”，表现为不太理想的频率响应，从而影响扬声组件的音质。
以上对图52的描述仅仅是针对具体示例的解释，对于本领域的专业人员来说，在了解影响扬声组件频率响应的基本原理后，可以对扬声组件的结构、组件进行各种修正和改变，从而获得不同的频率响应效果。
需要注意的是，对于本技术领域的普通技术人员来说，接触面1601的形状和结构不限于以上描述，也可以是满足其它特定的要求。例如，接触面上的凸起或凹下部分可以分布在接触面的边缘，也可以分布在接触面的中间部位。接触面可能包含一个或多个凸起或凹下部分，凸起和凹下部分可以同时分布在接触面上。接触面上的凸起或凹下部分的材料可以是和接触面材料不同的其它材料，可以是柔性的、钢性的、或者更适合产生特定压力梯度的材料；可以是记忆性材料，也可以是 非记忆性材料；可以是单种性质的材料，也可以是复合材料。接触面的凸起或凹下部分的结构图形包括但不限于轴对称图形、中心对称图形、旋转对称图形、非对称图形等。接触面的凸起或凹下部分结构图形可以是一种图形，也可以是两种或者两种以上组合的图形。接触面表面包括但不限于具有一定的光滑度、粗糙度、波纹度等。接触面的凸起或凹下部分的位置分布包括但不限于轴对称、中心对称、旋转对称、非对称分布等。接触面的凸起或凹下部分可以是在接触面边缘，也可以分布在接触面内部。
图53是本申请一些实施例提供的扬声组件振动单元接触面的示意图。如图53所示，图中显示了多种示例性的接触面结构。其中，图中1704所示是接触面上包含多个形状结构相似的凸起的示例。凸起可以用与面板其它部分相同或类似的材料构成，也可以用与其它部分不同的材料。特别的，凸起可以由记忆材料和振动传递层材料共同组成，其中记忆材料的比例不少于10％，优选地，凸起中记忆材料的比例不少于50％。单个凸起的面积占总面积的1％-80％，优选的，占总面积的比例为5％-70％，更优选地，占总面积的比例为8％-40％。所有凸起的面积总合占总面积的5％-80％，优选地，该比例为10％-60％。凸起可以有至少1个，优选地，凸起为1个，更优选地，凸起有2个，进一步优选地，凸起至少有5个。凸起的形状可以是圆形、椭圆形、三角形、长方形、梯形、不规则多边形、或者其他类似图形，其中凸起部分的结构可以是对称或非对称的，凸起部分的位置分布也可以是对称或者非对称的，凸起部分的数量可以是一个或者多个，凸起部分的高度可以是相同也可以是不相同的，凸起的高度和分布可以构成一定的梯度。
图中1705所示是一种接触面凸起部分的结构是两种以上图形组合的示例，其中不同图形的凸起的数量可以是一个或者多个。两种以上的凸起形状可以是圆形、椭圆形、三角形、长方形、梯形、不规则多边形、或者其他类似图形中的任意两种或两种以上的组合。凸起的材料、数量、面积、对称性等与图中1704类似。
图中1706是一种接触面凸起部分分布在接触面边缘和内部的示例，其中凸起部分的数量不限于图中所示。位于接触面边缘的凸起数量占所有凸起数量的1％-80％，优选地，该比例为5％-70％，更优选地，该比例为10％-50％，进一步优选地，该比例为30％-40％。凸起的材料、数量、面积、形状、对称性等与图中1704类似。
图中1707是一种接触面凹下部分的结构图形，凹下部分的结构可以是对称或非对称的，凹下部分的位置分布也可以是对称或非对称的，凹下部分的数量可以是一个或多个，凹下部分的形状可以是相同或不同的，凹下的部分可以是镂空的。单个凹下的面积占总面积的1％-80％，优选的，占总面积的比例为5％-70％，更优选地，占总面积的比例为8％-40％。所有凹下的面积总合占总面积的5％-80％，优选地，该比例为10％-60％。凹下可以有至少1个，优选地，凹下为1个，更优选地，凹下有2个，进一步优选地，凹下至少有5个。凹下的形状可以是圆形、椭圆形、三角形、长方形、梯形、不规则多边形、或者其他类似图形。
图中1708是一种接触面既存在凸起部分又存在凹下部分的示例，凸起和凹下部分的数量不限于一个或多个。凹下的数量和凸起的数量的比例为0.1-100，优选地，该比例为1-80，更优选地， 该比例为5-60，进一步优选地，该比例为10-20。单个凸起/凹下的材料、面积、形状、对称性等与图5104中类似。
图中1709是一种接触面具有一定波纹度的示例。波纹由两个以上的凸起/凹下或者两个的组合排列而成，优选地，相邻凸起/凹下间的距离相等，更优选地，凸起/凹下间的距离呈等差排列。
图中1710是一种接触面存在一块较大面积的凸起的示例。凸起的面积占接触面总面积的30％-80％。优选地，凸起的一部分边缘和接触面的一部分边缘基本相互接触。
图中1711是一种接触面存在第一个面积较大的凸起，在第一个凸起上存在第二个面积较小的凸起。较大面积的凸起占接触面总面积的30％-80％，较小面积的凸起占接触面总面积的1％-30％，优选地，该比例为5％-20％。较小面积占较大面积的5％-80％，优选地，该比例为10％-30％。以上对扬声组件接触面结构的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。
在一些实施例中，机芯壳体上贴近用户的一侧由面板和振动传递层构成。图54是面板和振动传递层相连的正视图和侧视图。
在一些实施例中，振动传递层可以设置在机芯壳体与人体接触的侧壁的外表面处。其中，该实施例中的振动传递层是为了改变振动单元接触面的应物理特性以改变声音传递效果的具体体现。振动传递层上不同区域对振动的传递效果不同。例如，振动传递层上存在第一接触面区域和第二接触面区域，优选地，第一接触面区域不与面板贴合，第二接触面区域与面板贴合；更优选地，振动传递层与使用者直接或间接接触时，第一接触面区域上的夹紧力小于第二接触面区域上的夹紧力(这里所说的夹紧力是指在振动单元的接触面与使用者之间的压力)；进一步优选地，第一接触面区域不与使用者直接接触，第二接触面区域与使用者直接接触并传递振动。第一接触面区域的面积大小和第二接触面区域的面积大小不等，优选地，第一接触面区域的面积小于第二接触面区域的面积，更优选地，第一接触面区域存在小孔，进一步减小第一接触区域的面积；振动传递层的外侧表面(即面向使用者面)可以是平坦的，也可以是不平坦的，优选地，第一接触面区域和第二接触面区域不在同一平面上；更优选地，第二接触面区域高于第一接触面区域；进一步优选地，第二接触面区域和第一接触面区域构成台阶结构；更进一步优选地，第一接触面区与使用者接触，第二接触面区域不与使用者接触。第一接触面区域和第二接触面区域的组成材料可以是相同也可以是不同的，可以是以上描述的振动传递层材料中的一种或多种的组合。以上对于接触面上夹紧力的描述只是本发明的一种表现形式，本领域内的技术人员可以根据实际需要对以上描述的结构和方式进行修改，而这些修改仍然在本发明的保护范围之内。例如，振动传递层可以不是必须的，面板可以直接与使用者接触，面板上可以设置不同的接触面区域，不同的接触面区域拥有与以上描述的第一接触面区域和第二接触面区域类似的性质。再例如，接触面上可以设置第三接触面区域，第三接触面区域上可以设置不同于第一接触面区域和第二接触面区域的结构，并且这些结构能够在减小外壳振动、抑制漏音、改善振动单元的频率响应曲线等方面获得一定的效果。
如图54和图55所示，在一些实施例中，面板501与振动传递层503通过胶水502粘结，胶水粘结处位于面板501两端，面板501位于振动传递层503和壳体504形成的外壳内。优选地， 面板501在振动传递层503上的投影为第一接触面区域，位于第一接触面区域周围的区域是第二接触面区域。
作为一个具体的实施例，如图56所示，换能装置包括由导磁板2310，磁铁2311和导磁体2312组成的磁路系统，振动板2314，线圈2315，第一传振片2316，第二传振片2317和垫圈2318。面板2313突出外壳2319和振动片2314通过胶水粘结，第一传振片2316将换能装置连接固定在外壳2319上，形成悬挂结构。在面板2313上增加振动传递层2320(例如但不限于硅胶)，振动传递层2320能够产生一定的形变适应皮肤形状。联系图20，本实施例中传递振动层2320相当于传振板214和振动传递层215。振动传递层2320上与面板2313接触的部分高于振动传递层2320上不与面板2313接触的部分，形成台阶结构。在振动传递层2320不与面板2313接触的部分(图56中振动传递层2320未凸出的部分)设计一个或多个小孔2321。在振动传递层设计小孔可以降低漏音：面板2313通过振动传递层2320与外壳2319的连接变弱，面板2313通过振动传递层2320传递到外壳2319的振动减少，从而减少了外壳2319振动带来的漏音；振动传递层2320未凸出的部分设置小孔2321后面积减小，能够带动的空气减少，由空气振动引起的漏音减小；振动传递层2320未凸出部分设置小孔2321后，壳体内的空气振动被导引出壳外，与外壳2319引发的空气振动相互抵消，减小漏音。需要注意的是，由于小孔2321可以将复合振动装置外壳内的声波导出，与漏音声波叠加以减少漏音，因此小孔又可称为引声孔。
此处需要说明的是，在本实施例中，由于面板凸出扬声组件外壳，同时使用第一传振片将面板与扬声组件外壳连接，面板与外壳的耦合程度大大降低，并且第一传振片能够提供一定的形变，使得面板在与使用者贴合是具有更高的自由度，能够更好地适应复杂的贴合面，所述第一传振片可以使得面板相对于外壳产生一定角度的倾斜。优选的，倾斜角度不超过5゜。
进一步的，扬声组件的振动效率随着贴合状态的不同而不同。良好的贴合状态具有更高的振动传递效率。如图57所示，粗线显示贴合较好的状态下的振动传递效率，细线显示贴合不好的状态下的振动传递效率，可以看出，较好的贴合状态振动传递效率更高。
图58是本申请一些实施例提供的扬声组件振动产生部分的结构图。如图58所示，作为一个具体的实施例，在本实施例中，换能装置包括由导磁板2520，磁铁2511和导磁体2512组成的磁路系统，振动板2514，线圈2515，第一传振片2516，第二传振片2517和垫圈2518。面板2513突出外壳2519，和振动片2514通过胶水粘结，第一传振片2516将换能装置连接固定在外壳2519上，形成悬挂结构。
本实施例与上述图56中提供实施例的不同之处在于：在外壳的边缘增加一个围边，在外壳与皮肤接触的过程中，围边可以使得作用力分布更加均匀，增加扬声组件佩戴的舒适度。围边2510和面板2513之间存在高度差d0。皮肤作用在面板2513上的力使得面板2513与围边2510之间的距离d减小，当扬声组件与使用者间的压力大于第一传振片2516形变为d0时所受的力时，多余的夹紧力会经由围边2510传递到皮肤，而不对振动部分的夹紧里产生影响，使得夹紧力的一致性更高，从而保证音质。
图59是根据本申请一些实施例提供的扬声器的爆炸结构图，图60是根据本申请一些实施例提供的扬声器的局部截面图，图61是图60中A部分的放大图。如图59至图61所示，在一些实施例中，扬声器可以包括组件本体，组件本体内部形成腔体1911。需要说明的是，组件本体可以位于前述实施例中的眼镜腿15(图7)中。在一些实施例中，至少两个双麦克风还可以设置于眼镜腿15中。
需要说明的是，辅助功能模块104可以位于机芯壳体108内，也可以位于固定机构110内，例如，眼镜腿15中(图7)。
组件本体可以是由至少两个零部件组合而成的结构；也可以是由一体成型技术制造而成的结构，例如通过一体注塑工艺一体成型的结构。所述组件本体的空间形状包括但不限于长方体、正方体、椭球体、球体、锥体以及其他不规则空间形状等。所述组件本体的材质包括但不限于塑料、硅胶、橡胶、塑胶、玻璃、陶瓷、合金、不锈钢等的一种或多种的组合。
在一些实施例中，组件本体可以包括容置本体1910和盖体1920；所述容置本体1920内部中空形成所述腔体1911，所述容置本体1910设置有与所述腔体1911连通的开口1912，所述盖体1920盖设于所述开口1912上并将所述腔体1911封闭。所述腔体1911可以是由两个或两个以上零部件组装时共同构成的内部空腔；也可以是组件在一体成型过程中，根据成型模具形状所形成的内部空腔。所述腔体1911可以用于容纳扬声器的多个电子元件和电路结构。所述组件本体可以用于密封腔体1911，所述腔体1911可以是由组件本体完全密封的，也可以是由组件本体和组件本体上的其他配件共同密封的。
其中，容置本体1910可以为扬声器的至少一部分。本实施例中的容置本体1910具体可以为扬声器中用于盛放例如电路板、电池52以及电子元件等的结构，例如可以为扬声器的外壳等的整体或者一部分。
另外，容置本体1910通过设置具有开口1912的腔体1911用来容置上述电路板、电池以及电子元件等。所述开口1912与所述腔体连通，用于上述电路板、电池以及电子元件等的装卸通道。具体地，开口1912的数量可以为一个，也可以为多个，此处不做限定。
进一步的，盖体1920的形状至少部分与上述开口1912匹配，从而将盖体1920盖设在开口1912上对腔体1911进行密封。其中，盖体1920的材质可以与容置本体1910不同，或者至少部分相同。
本实施例中，盖体1920包括硬质支架1921以及软质盖层1922。其中，硬质支架1921用于与容置本体1910进行机械连接，软质盖层1922一体注塑于硬质支架1921的表面上，用于在硬质支架1921与容置本体1910连接后为腔体1911提供密封。
具体地，硬质支架1921的材质可以为硬质的塑胶，软质盖层1922的材质可以为软质的硅胶、橡胶等。其中，硬质支架1921朝向容置本体1910一侧的形状可与开口1912匹配，以通过插接、扣合等方式固定于腔体1911的开口1912上，从而与容置本体1910机械连接在一起。而硬质支架1921与容置本体1910连接处容易形成缝隙而降低腔体1911的密封性，进一步地，软质盖层1922 一体注塑而形成在硬质支架1921远离容置本体1910的外表面上，可进一步覆盖在硬质支架121与容置本体1910的连接处，从而实现腔体1911的密封。
上述实施例中，盖体1920包括硬质支架1921以及一体注塑于硬质支架1921的表面上的软质盖层1922，硬质支架1921与容置本体1910进行机械连接，软质盖层1922进一步在硬质支架1921与容置本体1910连接后为腔体1911提供密封，且软质盖层1922更有利于贴合硬质支架1921与容置本体1910之间的缝隙，以进一步提高电子组件的密封性，从而提高电子组件的防水效果。同时，硬质支架1921与软质盖层1922一体注塑而成，能够简化电子组件的装配工序。
在一实施例中，硬质支架1921包括插入部19211和覆盖部19212，覆盖部19212盖设在开口1912上，插入部19211设置在覆盖部19212的一侧，并沿腔体1911的内壁延伸入腔体1911内，以将覆盖部19212固定在开口1912上。
在一个应用场景中，插入部19211还可以不通过腔体1911的内壁进行插接，例如，腔体1911的内部还可设置有与硬质支架1921的插入部19211的形状匹配的插接部，使得插入部19211能够与插接部插接，将插接部固定在腔体1911内部。例如，插入部19211的形状为圆柱体，此时插接部可以为能够包绕该圆柱体插接部的圆环，其中，圆环的插接部的内径可适当小于圆柱体的插接部的外径，从而使得在插入部19211插接在插接部中时与插接部过盈配合而使得硬质支架1921能够与腔体1911稳定连接。当然，也可以采用其它的插接方式，只要能够使得插入部19211插入腔体1911内部并与腔体1911固定即可。
具体的，覆盖部19212设置在插入部19211背离腔体1911的一侧，并在插入部19211插入腔体1911后覆盖在开口1912上。其中，覆盖部19212可以为完整结构，或者还可以根据需要进一步在其上设置一些孔洞，从而实现一定的功能。
请进一步参阅图62，图62是本申请扬声器在组合状态下沿图59中的A-A轴线的截面图。在一实施例中，容置本体1910包括用于定义开口1912的开口边缘1913，覆盖部19212压合在开口边缘1913的靠近开口1912的内侧区域19131，软质盖层1922覆盖在覆盖部19212远离容置本体1910的外表面上，并压合在开口边缘1913的内侧区域19131外围的外侧区域19132上，进而实现与开口边缘1913之间的密封。
其中，开口边缘1913的内侧区域19131和外侧区域19132均属于开口边缘1913，而并非开口边缘1913之外的其它区域。其中，开口边缘1913的内侧区域19131为开口边缘1913的靠近开口1912的区域，而开口边缘1913的外侧区域19132为开口边缘1913的远离开口1912的区域。
本实施例中，硬质支架1921的覆盖部19212压合在开口边缘1913的靠近开口1912的内侧区域19131，能够使得覆盖部19212首先对开口边缘1913处进行初步密封。但是，由于容置本体1910与硬质支架1921均为硬质材质，二者之间的连接以及覆盖部19212的进一步覆盖也并不能够达到较好的密封效果，在覆盖部19212压合在开口边缘1913并远离开口1912的端部容易与开口边缘1913之间产生缝隙，并进一步通过该缝隙与腔体1911贯通，从而降低密封性。
因此，本实施例中，软质盖层1922覆盖在覆盖部19212远离容置本体1910的外表面上， 并进一步压合在开口边缘1913的内侧区域19131外围的外侧区域19132上，从而能够将硬质支架1921的覆盖部19212与开口边缘1913之间产生的缝隙进一步覆盖，且由于软质盖层1922为软质材质，从而能够进一步提高扬声器的密封效果而使得扬声器的防水性更好。
请进一步参阅图63，图63是图62中B处的结构放大图，在一个应用场景中，在盖体1920扣合状态下，覆盖部19212的外围覆盖开口边缘1913的内侧区域19131，并与开口边缘1913的内侧区域19131接触；而软质盖层1922设置在覆盖部19212远离容置本体1910的一侧，从而使得位于开口边缘1913的内侧区域19131的覆盖部19212夹设在开口边缘1913的内侧区域19131与软质盖层1922之间，且软质盖层1922进一步向覆盖部19212远离开口1912的方向以及朝向开口边缘1913的方向延伸，直至与开口边缘1913的外侧区域19132接触，从而使得覆盖部19212与开口边缘1913的接触端面和软质盖层1922与开口边缘1913的接触端面彼此平齐设置，并在开口边缘1913的内侧区域19131上从而形成“开口边缘1913-覆盖部19212-软质盖层1922”的结构。
在另一个应用场景中，请进一步参阅图64，图64是本申请扬声器实施例的局部截面图。本应用场景中，软质盖层1922在延伸至与开口边缘1913的外侧区域19132接触后，进一步沿覆盖部19212与开口边缘1913之间的区域延伸至开口边缘1913的内侧区域19131，进而假设在开口边缘1913的内侧区域19131与覆盖部19212之间，并由覆盖部19212压合在开口边缘1913的内侧区域19131上从而形成“开口边缘1913-软质盖层1922-覆盖部19212-软质盖层1922”的结构。本应用场景中，软质盖层1922在覆盖硬质支架1921的覆盖部19212的基础上进一步延伸至硬质支架1921和开口边缘1913之间，从而进一步提高腔体1911与盖体1920之间的密封，以及进一步提高扬声器的防水效果。
在一实施例中，请继续参阅图59至图64，扬声器还包括设置于腔体1911内的电路组件1930，电路组件1930上设置有开关19311。
具体地，电路组件1930可包括第一电路板1931，开关19311设置于第一电路板1931朝向腔体1911的开口1912的外部一侧。其中，开关19311的数量可以为一个，也可以为多个。在开关19311的数量为多个时，可间隔设置在第一电路板1931上。需要说明的是，第一电路板1931相当于前述实施例中的第一分支电路板。
相应地，硬质支架1921上设置有与开关19311对应的开关孔19213，软质盖层1922进一步覆盖开关孔19213，且在对应开关孔19213的位置设置有抵压部19221，抵压部19221经开关孔19213朝向腔体1911的内部延伸，在软质盖层1922的对应位置被按压时，抵压部19221抵压电路组件1930上的开关19311，从而触发电路组件1930执行预设的功能。
其中，软质盖层1922上设置的抵压部19221由软质盖层1922朝向支架1921的一侧朝向开关孔19213以及开关19311的方向凸出形成，抵压部19221的形状与开关孔19213匹配，使得在软质盖层1922对应的位置被按压时，抵压部19221能够穿过开关孔19213到达第一电路板1931上的对应的开关19311。同时抵压部19221沿朝向开关19311方向的长度设置成能够使得在软质盖层1922对应的位置无按压时不抵压开关19311，而在被按压时能够抵压对应的开关19311即可。
在一个应用场景中，软质盖层1922上对应于抵压部19221的位置朝向背离硬质支架1921的一侧进一步凸出形成以凸起的按压部19222，从而使得用户能够明确开关19311的位置，并通过按压对应的按压部19222从而出发电路组件1930执行相应的功能。
在一些实施例中，辅助功能模块204用于接收辅助信号，执行辅助功能。辅助功能模块204可以为区别于耳机芯之外的用于接收辅助信号而执行辅助功能的模块。进一步地，辅助功能模块204能够实现图像功能、语音功能、辅助控制功能、开关控制功能中的一种或几种功能；在本申请中，将音频信号转换为声音信号可以认为是扬声器的主要功能，而不同于主要功能的其他功能可以认为是扬声器的辅助功能。例如，扬声器的辅助功能可以包括通过麦克风接收用户和/或环境声音，通过按键控制所述声音信号的播放过程等。
进一步地，辅助功能模块可以至少包括第一辅助功能模块和第二辅助功能模块。第一辅助功能模块可以设置于所述主体电路板445上，第二辅助功能模块可以设置于所述第一分支电路板442上。
再进一步地，所述辅助功能模块还可以包括第三辅助功能模块，所述第三辅助功能模块设置在所述第二分支电路板上。
具体地，第二辅助功能模块可以是第一麦克风元件19312，第三辅助功能模块可以是第二麦克风元件19321。其中，第一麦克风元件19312和第二麦克风元件19321都可以是MEMS(微型机电系统)麦克风，工作电流小，性能较为稳定，且产生的语音质量高。
需要说明的是，第一麦克风元件19312和第二麦克风元件19321相当于前述实施例中的麦克风432。
在一些实施例中，所述第一麦克风和所述第二麦克风按照特定的方式分布在所述扬声器中，使得主声源(例如，人的嘴巴)位于所述第二麦克风元件19321指向所述第一麦克风元件19312的方向上。
具体的，所述第一麦克风元件19312设置于所述第一电路板1931面向所述盖体1920的一侧，所述第二麦克风元件19321设置于所述第二电路板132面向所述容置本体的一侧。
当用户佩戴所述扬声器时，由于嘴巴(主声源)相对于第一麦克风元件19312和第二麦克风元件1321的距离比环境中其他声源(例如，噪声源)相对于第一麦克风元件19312和第二麦克风元件1321的距离近，可以认为嘴巴是第一麦克风元件19312和第二麦克风元件19321的近场声源。对于近场声源，两组麦克风元件所接收到的声音大小与距声源的距离相关。由于第一麦克风元件1312距离主声源较近，因此第一麦克风元件19312将接收到较大的音频信号V J1；第二麦克风元件1321距离主声源较远，因此第二麦克风元件1321将接收到较小的音频信号V J2。即，V J1>V J2。
由于环境中的噪声源相对于第一麦克风元件19312和第二麦克风元件19321的距离较远，可以认为环境中的噪声源是第一麦克风元件19312和第二麦克风元件19321的远场声源。对于远场声源，两组麦克风元件接收到的噪声信号大小相近，即V Y1≈V Y2。
因此，第一麦克风元件19312接收到的声音总信号为：
V 1＝V J1+V Y1   (17)
第二组麦克风元件接收到的声音总信号为：
V 2＝V J2+V Y2   (18)
为排除接收到的声音信号中的噪声，可以对第一麦克风元件1312声音总信号与第二麦克风元件19321声音总信号做差分处理。差分处理的形式可以是按照如下形式：
V＝V 1-V 2＝(V J1-V J2)+(V Y1-V Y2)≈V J1-V J2  (19)
进一步地，根据公式(19)获得的信号的差分结果，结合第一麦克风元件19312和第二麦克风元件19321相对于主声源的距离，可以进一步获得第一麦克风元件19312和/或第二麦克风元件1321实际获得的主声源发出的音频信号，即V J1或V J2。
因此，为保证最终获得的音频信号的质量，应使公式(19)中获得的信号的差分结果尽可能大，即V J1>>V J2。本申请的一些实施例中，可以采用以下方式实现这一效果：使第一麦克风元件19312的安装位置尽可能靠近主声源(如人的嘴部)；使第二麦克风元件19321的安装位置尽可能远离主声源(如人的嘴部)；隔绝两个麦克风空间；在两个麦克风元件之间设置挡音件等。应当注意的是，以上手段均可以实现提高音频信号质量的效果，这些手段可以单独使用，也可以组合使用。
在一些实施例中，为使第一麦克风元件19312的安装位置尽可能靠近主声源(如人的嘴部)，可以将第一电路板1931及其上安装的第一麦克风元件19312设置为倾斜的。在一些实施例中，为使第二麦克风元件19321的安装位置尽可能远离主声源(如人的嘴部)，可以将第二电路板132及其上安装的第二麦克风元件19321设置为倾斜的，以便灵活调整所需的安装距离。同时也可以在每个麦克风元件安装区域设置相应的导音通道及挡音件。具体的安装方式可以进一步参见图65-19及其相关描述。
需要说明的是，第二电路板1932相当于前述实施例中的第二分支电路板。
第一电路板1931包括第一麦克风元件19312。具体地，所述第一电路板1931面向所述盖体1920设置，所述第一麦克风元件19312设置于第一电路板1931面向所述盖体1920的一侧。例如，第一麦克风元件19312可与上述实施例中的开关19311间隔设置在第一电路板1931上。具体地，第一麦克风元件19312用于接收来自扬声器外部的声音信号，并将声音信号转换为电信号以进行分析处理。
相应地，支架1921上设置有与第一麦克风元件19312对应的，软质盖层1922上设置有与第一麦克风孔19214对应的第一导音孔19223。第一导音孔19223可与第一麦克风元件19312对应设置。
具体的，所述第一导音孔19223设置于所述盖体1920上，第一导音孔19223的一端连接盖体1920上的第一麦克风孔19214，第一导音孔19223的另一端面向第一麦克风元件19312，从而可以缩短导音距离，提高导音效果。
具体的，第一电路板1931以平行或倾斜于所述盖体1920的方式面向所述盖体1920，且所述第一导音孔19223垂直或倾斜于所述盖体1920的表面。
在一些实施例中，所述开口1912的深度方向相对于容置本体1910的底部可以是竖直的，也可以是倾斜的。当所述开口1912是竖直的，所述盖体1920盖上后相对于容置本体1910为水平的；当所述开口1912是倾斜的，所述盖体1920盖上后相对于容置本体1910为倾斜的，所述倾斜为面向人体嘴部一侧倾斜，此方式可以使第一导音孔19223更直接的面向人的嘴部或面部，提高麦克风组件获取主声源声音的效果。
进一步的，当开口1912是倾斜的，开口1912所在平面与容置本体宽度方向所在平面的夹角位于10°～30°范围内，以使得第一导音孔19223更进一步面向人的嘴部区域。具体的，当开口1912是倾斜的，开口1912所在平面与容置本体宽度方向所在平面的夹角可以是上述范围内的任意角度，例如10°、15°、20°、23°、27°、30°等均可，此处不做具体限定。
具体地，第一导音孔19223贯通软质盖层1922设置，当所述开口1912为竖直的且第一电路板1931平行于盖体1920时，第一导音孔19223垂直于盖体1920设置，即第一导音孔19223为竖直的；当所述开口1912为竖直的且第一电路板1931倾斜于盖体1920时，第一导音孔19223倾斜于盖体1920设置，即第一导音孔19223为倾斜的；当所述开口1912为倾斜的且第一电路板1931平行于盖体1920时，第一导音孔19223垂直于盖体1920设置，即第一导音孔19223为倾斜的；当所述开口1912为倾斜的且第一电路板1931倾斜于盖体1920时，第一导音孔19223也可以倾斜于盖体1920设置，即第一导音孔19223可以是竖直，也可以是倾斜的。
进一步的，当第一电路板131以倾斜于所述盖体1920的方式面向所述盖体1920时，第一电路板1931与盖体1920所在平面的夹角位于5°～20°范围内。具体的，当第一电路板1931以倾斜于所述盖体1920的方式面向所述盖体1920时，第一电路板1931与盖体1920所在平面的夹角可以是夹角范围内如5°、8°、10°、15°、20°的任意角度，此处不做具体限定。
具体的，第一导音孔19223与支架1921上的第一麦克风孔19214对应，进而将第一麦克风元件19312与扬声器的外部连通，使得扬声器外部的声音可通过第一导音孔19223以及第一麦克风孔19214而被第一麦克风元件19312所接收。
为进一步提高导音效果，所述第一导音孔19223的中轴线与第一麦克风元件19312的受音区193121的主轴线重合。所述第一麦克风元件19312的受音区193121是指第一麦克风元件19312上接收声波的区域(例如，振膜)。当第一导音孔19223的中轴线与第一麦克风元件19312的受音区193121的主轴线重合时，主声源的声音被第一麦克风孔19214采集后，通过第一导音孔19223可以直接导向第一麦克风元件19312的受音区193121，进一步减小声音的传播路径，既可以避免主声源在腔体内反复传播造成损失和回声，又可以避免主声源通过腔体内的通道传入第二麦克风元件1321所在区域，从而起到提高音效的作用。
其中，在一实施例中，盖体1920呈长条状设置，其中第一导音孔19223的主轴线与第一麦克风元件19312的受音区193121的主轴线在盖体1920的宽度方向上彼此重合。其中，第一麦克风元件19312的受音区193121的主轴线是指第一麦克风元件19312的受音区193121在盖体1920的宽度方向上的主轴线，如图65中的轴线n，第一导音孔1223的主轴线如图65中的轴线m，轴线n 和轴线m重合。
进一步的，第一导音孔19223的形状可以为任意形状，只要能够将扬声器外界的声音输入即可。在一个应用场景中，第一导音孔19223为尺寸较小的圆孔，设置在盖体1920对应第一麦克风孔19214的区域内。小尺寸第一导音孔19223能够减少扬声器内的第一麦克风元件19312等与外界的连通，从而提高扬声器的封闭性。
再进一步地，为了将由第一导音孔19223进入的声音信号引导至第一麦克风元件19312，可将导音通道192241设置为弯曲状。
具体地，在一个应用场景中，所述第一导音孔19223的主轴线在所述盖体1920的宽度方向上设置于所述盖体1920的中部。
同时，盖体1920的软质盖层1922在对应第一导音孔19223的位置还设置有第一挡音件19224，第一挡音件19224经麦克风孔19214朝向腔体1911的内部延伸，限制声音向第一麦克风元件19312的传输方向传递。并定义导音通道192241，导音通道192241的一端与软质盖层1922上的第一导音孔19223连通，第一麦克风元件19312从导音通道192241的另一端插入至导音通道192241。
其中，扬声器还包括上述实施例中的开关19311时，开关孔19213和第一麦克风孔19214可间隔设置在硬质支架1921上。
进一步的，开关孔19213和第一麦克风孔19214的间隔距离可以是10～20mm，具体的还可以是10mm、15mm、20mm等。
对应地，第一挡音件19224由软质盖层1922自第一导音孔19223的外围，穿过第一麦克风孔19214，向腔体1911内部延伸至第一麦克风元件19312的外围，从而形成由第一导音孔19223至第一麦克风元件19312的导音通道192241，以使得扬声器进入导音孔的声音信号能够通过导音通道12241直接到达第一麦克风元件19312。
具体地，导音通道192241在垂直于其长度方向的截面上的形状可以与第一麦克风孔19214或第一麦克风元件19312的形状一致，当然也可以不一致。在一个应用场景中，第一麦克风孔19214和第一麦克风元件19312在垂直于支架1921朝向腔体1911的方向上的截面形状均为四方形，且第一麦克风孔19214的尺寸略大于导音通道192241的外围尺寸，而导音通道192241的内部尺寸也不小于第一麦克风元件19312的外围尺寸，从而使得导音通道192241能够穿过第一导音孔19223到达第一麦克风元件19312并包裹在第一麦克风元件19312的外围。
通过上述方式，扬声器的软质盖层1922上设置有第一导音孔19223以及由第一导音孔19223外围穿过第一麦克风孔19214而到达第一麦克风元件19312并包裹在第一麦克风元件19312外围的导音通道192241，该导音通道192241的设置使得由第一导音孔19223进入的声音信号能够通过该第一导音孔19223到达第一麦克风元件19312，被第一麦克风元件19312所接收，从而能够降低声音信号在传播过程中的泄露，进而提高扬声器接收声音信号的效率。
其中，在一个应用场景中，扬声器还包括设置于导音通道192241内的防水网布194，该防水网布194由第一麦克风元件19312抵持于软质盖层1922朝向麦克风元件的一侧，并覆盖第一导 音孔19223。
具体地，导音通道192241内可靠近的位置支架1921凸出形成一与相对的凸面，从而使得防水网布194夹设在第一麦克风元件19312与该凸面之间，或者还可以直接粘接在第一麦克风元件1312的外围，具体设置方式此处不做限定。
本实施例中的防水网布194除了进一步对第一麦克风元件19312起到防水作用之外，还可具有透声等作用，以避免对第一麦克风元件19312的受音区193121的受音效果产生不利影响。
需要指出的是，由于电路组件1930本身设置的需要，第一麦克风元件19312可设置在第一电路板1931的第一位置上，而在设置第一导音孔19223时，又由于美观、方便等需求，从而将第一导音孔19223设置在盖体1920的第二位置上，本实施例中，第一位置和第二位置在盖体1920的宽度方向上可并不对应，从而导致第一导音孔19223的主轴线与第一麦克风元件13912的受音区193121的主轴线在盖体1920的宽度方向上彼此间隔设置，从而由第一导音孔19223输入的声音可能不能够沿直线达到第一麦克风元件19312的受音区193121。
本实施例中，盖体1920可以为扬声器的外壳体的一部分，而为了满足扬声器的整体美观需求，第一导音孔19223可设置在盖体1920的宽度方向上的中部，以使得第一导音孔19223看上去更加对称，满足人们的视觉需求。
本应用场景中，可将对应的导音通道1992241设置为沿图59中B-B轴线的截面呈台阶状，从而将第一导音孔19223导入的声音信号通过台阶状的导音通道192241传播至第一麦克风元件19312而为第一麦克风元件19312所接收。
进一步地，请进一步参阅图67，图67是本申请扬声器在组合状态下沿图59中的C-C轴线的截面图。在一实施例中，扬声器还包括一发光元件19313。具体地，发光元件19313可设置在电路组件1930的第一电路板1931上，以容置于腔体1911内。例如，发光元件19313可与上述实施例中的开关19311、第一麦克风元件1312一起按照一定的排列方式设置在第一电路板19931上。需要说明的是，电路组件1930可以相当于前述实施例中的控制电路。
相应地，硬质支架1921上设置有与发光元件19313对应的出光孔19215，软质盖层1922覆盖出光孔19215，且软质盖层1922对应于出光孔19215的区域的厚度设置成允许发光元件19313所产生的光线经软质盖层1922透射。
其中，发光元件19313可以为发光二极管等，发光元件19313的数量可以为一个或者多个，硬质支架1921上的出光孔19215的数量可与发光元件19313一致，在发光元件19313的数量为多个时，则对应有不同的出光孔19215，进而可通过不同的发光元件19313传递不同的信号。
本实施例中，可通过一定手段将使得软质盖层1922在覆盖出光孔19215的情况下仍然能够将发光元件19313所发射出的光线透射至扬声器的外部。
具体地，在一个应用场景中，可将软质盖层1922对应于出光孔19215的整体区域或者部分区域的厚度设置成小于软质盖层1922对应于出光孔19215外围的区域的厚度，以使得发光元件19313所发出的光线能够通过出光孔19215并进一步由软质盖层1922透射出去。当然，也可以通过 其它手段使得在软质盖层1922覆盖出光孔19215的区域能够透射光线，此处不做具体限定。例如，将软质盖层1922对应于出光孔19215的整体区域或者部分区域设置一个窗口，窗口上覆盖一层透明或透光材料(例如，薄膜、石英等)，以使得发光元件19313所发出的光线能够通过出光孔19215并进一步由窗口透射出去。
通过上述方式中，软质盖层1922在覆盖对应发光元件19313的出光孔19215的基础上，进一步设置成能够使得发光元件19313所发射的光线从软质盖层1922透射至扬声器的外部，从而能够在不影响扬声器发光功能的情况下通过软质盖层1922将发光元件19313密封，以提高扬声器的密封性以及防水性能。
具体地，在一实施例中，硬质支架1921在出光孔19215的外围进一步设置有朝向腔体1911的内部延伸的挡光件19216，挡光件19216限制发光元件19313所产生的光线的传输方向。
其中，出光孔19215的形状可以为任意能够将发光元件19313所发出的光线透出的形状，如圆形、方形、三角形等，本实施例中，出光孔19215的形状为圆形。
由于发光元件19313与出光孔19215之间还存在一定的距离，因此，若不设置约束，那么发光元件19313所发射出的光线将会在到达出光孔19215的过程中泄露掉一部分，从而不能够有效的传播至出光孔19215，进而降低从扬声器外部所能够看到的光的亮度，从而不便于用户接收信号。而本实施例中挡光件19216的设置能够限制发光元件19313所产生的光线的传输方向，以减少漏光，从而提高由出光孔19215所透出的光线的亮度。
具体地，本实施例中的挡光件19216可部分或者全部由硬质支架1921形成，例如，硬质支架1921可以沿着出光孔19215的外围向腔体1911内部延伸，并包围发光元件19313，从而形成一光线传播的光通道，通过该光通道，发光元件19313所产生的光线能够沿着该通道的设置方向直接向出光孔19215传播；或者，硬质支架1921也可不形成光通道，而是仅从一个方向或者几个方向上限制光线的传播，例如硬质支架1921可以仅由出光孔19215的一侧向腔体1911内延伸而形成一侧遮挡发光元件19313的挡光件1216。或者还可以进一步配合其它部件来限制光线的传播。例如，硬质支架1921由出光孔19215的一侧向腔体1911内延伸而形成一侧遮挡发光元件19313的挡光件19216，该挡光件19216进一步配合腔体1911的内壁或者硬质支架1921的其它结构等来从多个方向限制发光元件19313所产生的光线的传输方向。
在一个应用场景中，发光元件19313与第一麦克风元件19312相邻设置在第一电路板1931上，对应的出光孔19215和第一麦克风孔19214间隔设置在硬质支架1921上，如上述实施例中所述，在第一麦克风元件19312的外围设置有由软质盖层1922所形成的定义一导音通道192241的第一挡音件19224，该第一挡音件19224穿过第一麦克风孔19214设置，从而将第一麦克风元件19312与发光元件19313以及第一麦克风孔19214与出光孔19215间隔设置。
具体地，本应用场景中，硬质支架1921形成的挡光件19216与第一挡音件19224靠近发光元件19313的一侧壁配合，二者共同限制发光元件19313所产生的光线的传输方向。
在另一个应用场景中，腔体1911在垂直于开口1912方向的截面上呈长条状设置，对应地， 硬质支架1921也呈长条状由开口1912通过插入部19211插入腔体1911内，从而与腔体1911形成机械连接。在沿硬质支架1921的长度方向上的两侧，设置有插入部19211，从而发光元件19313在沿硬质支架1921的长度方向上的两侧也设置有对应的硬质支架1921的插入部19211，以在发光元件19313的两侧限制光线，进一步地，在本应用场景中，挡光件19216进一步设置在发光元件19313的垂直于硬质支架1921长度方向上的一侧，而第一挡音件19224的侧壁则设置在发光元件19313的垂直于硬质支架1921长度方向上的另一侧，二者可为彼此并行的板体，并进一步与发光元件19313两侧的插入部19211共同限制发光元件19313所产生的光线的传输方向。
其中，在一实施例中，扬声器中的电路组件1930包括上述扬声器实施例中的第一电路板1931，且还可以进一步包括第二电路板1932，具体可参阅图59、图62、图65、图66。
需要说明的是，第二电路板1932相当于前述实施例中的第二分支电路板。
具体的，所述第二电路板1932面向所述容置本体1910设置，且第二电路板1932倾斜于第一电路板1931设置于腔体1911内，第二电路板1932面向所述容置本体1910的一侧设置有第二麦克风元件19321。
第二麦克风元件19321面向容置本体1910的侧壁设置，使得第二麦克风元件19321附近有较大空间，可以方便在容置本体1910上设置与第二麦克风元件19321相应的功能件。并且，第二电路板1932倾斜于第一电路板1931设置，两个电路板上的功能件可以相互错位设置，也可以起到缩小功能件之间间距的作用，可以进一步节约、压缩扬声器内部空间。
其中，所述盖体1920或所述第一导音孔19223相对的所述容置本体1910的侧壁上还设置有第二导音孔1914。
容置本体1910的侧壁上对应设置有第二导音孔1914，第二导音孔1914与第一导音孔19223相互远离。在一些实施例中，容置本体1910的开口1912为倾斜开口，盖体1920相对容置本体1910倾斜，与第一导音孔19223相对的所述容置本体1910的侧壁为腔体1911的一侧侧面，第二导音孔1914设置于容置本体1910的一侧侧面。进一步的，第二导音孔1914设置于容置本体1910的一侧侧面，距离容置本体1910的顶部3～6mm的范围内。具体可以为3mm、4mm、5mm、6mm等。
在一些实施例中，容置本体1910的开口1912的深度方向相对于容置本体的底部为竖直时，盖体1920相对容置本体1910水平设置，与第一导音孔19223相对的所述容置本体1910的侧壁为腔体1911的顶部，导音孔1914设置于容置本体1910的顶部。进一步的，第二导音孔1914可以设置于容置本体1910的顶部中间位置。
上述方式可以使第二导音孔1914远离主声源，减少第二导音孔1914接收到的主声源声音，提高第二导音孔1914接收环境噪声的比例，增强降噪效果。
而如上述本申请扬声器实施例中所述，盖体1920上设置有与第一麦克风元件19312以及第一麦克风孔19214对应的第一导音孔19223，其中，第一麦克风元件19312用于接收经第一导音孔19223输入的声音，第二麦克风元件19321用于接收经第二导音孔1914输入的声音。
进一步地，所述第二导音孔1914的中轴线与第二麦克风元件19321的受音区的主轴线重 合。
当第二导音孔1914的中轴线与第二麦克风元件19321的受音区的主轴线重合时，噪声通过第二导音孔1914可以直接导向第二麦克风元件19321的受音区，减少噪声在腔体1911内部的传播。同时，噪声通过第一导音孔19223可以直接导向第一麦克风元件19312的受音区193121。第一麦克风元件19312与第二麦克风元件19321接收到的噪声近似相同，有利于后续处理中消除噪声，提高主声源质量。
在一些实施例中，所述第二导音孔1914的中轴线与所述第一导音孔19223的中轴线重合或平行。
第二导音孔1914与第一导音孔19223具有相同的中轴线方向，即两者的中轴线重合或平行。并且，第二导音孔1914的声音入口和第一导音孔19223的声音入口朝向相反的方向，减小第二导音孔1914接收到的主声源，有利于后续处理中消除噪声，提高主声源质量。
在一些实施例中，所述第二麦克风元件19321的受音区的主轴线与所述第一麦克风元件19312的受音区193121的主轴线重合或平行。第二麦克风元件19321的受音区接收通过第二导音孔1914的声音信号，第一麦克风元件19312的受音区193121接收通过第一导音孔19223的声音信号。由于通过第二导音孔1914中的主声源信号较小，因此第二麦克风元件19321的受音区接收到的主声源信号较小，有利于实现提高音频信号质量的效果。
在一些实施例中，第一电路板1931可以平行开口1912的开口平面且靠近开口1912设置。可选地，第一电路板1931也可以倾斜于开口1912的开口平面且靠近开口1912设置。进一步地，第一电路板1931上还可进一步设置如上所述的开关19311、发光元件19313等，开关19311、发光元件19313以及第一麦克风元件19312等可按照一定的排列方式设置在第一电路板1931上，对应地，分别在盖体1920上间隔设置开关孔19213、出光孔19215以及第一麦克风孔19214等，以通过对应的孔与扬声器的外部进行信号的传输。
进一步的，第一麦克风孔19214可以设置在盖体1920的中部中心位置，开关孔19213和出光孔19215可以在盖体1920长度方向上分别设置于第一麦克风孔19214的两侧。开关孔19213和出光孔19215距离第一麦克风孔19214的距离可以是5～10mm的范围内，具体的可以是5mm、6mm、7mm、8mm、9mm、10mm等。开关孔19213和出光孔19215距离第一麦克风孔19214的距离可以是相等的，也可以是不相等的。
在一些实施例中，容置本体1910自开口1912沿垂直于开口平面的方向延伸以形成具有一定宽度的腔体1911，第二电路板1932可以平行于腔体1911的宽度方向，并垂直于开口平面设置。可选地，第二电路板1932也可以倾斜于腔体1911的宽度方向，并倾斜于开口1912平面设置。第二电路板1932倾斜于第一电路板1931设置于腔体1911内。其中，第二电路板1932上可进一步设置有主控芯片和天线等。
在一些实施例中，第二电路板1932倾斜于腔体1911的宽度方向，并倾斜于开口1912平面设置。第二电路板1932与腔体1911的宽度方向的夹角位于5°～20°范围内。具体的，第二电路 板1932与腔体1911的宽度方向的夹角可以是上述范围内的任意角度，例如5°、10°、15°、20°等均可，此处不做具体限定。
在一个应用场景中，在用户使用该扬声器时，所述第二麦克风元件19321的受音区的主轴线与所述第一麦克风元件19312的受音区193121的主轴线重合，且第一麦克风元件19312和第二麦克风元件19321与用户的嘴巴在一条直线上。
本实施例中，分别在两个电路板上设置第一麦克风元件19312和第二麦克风元件19321，两个麦克风元件分别通过第一导音孔19223和第二导音孔1914接收声音信号，其中一个麦克风元件可用于收集人声等主要声音，而另一个麦克风元件可具备背景噪声采集功能，方便采集周围环境噪音，二者配合对接收到的声音信号进行分析处理，能够起到降噪等的作用，从而提高声音信号的处理质量。
进一步地，如图65和图66所示，所示图66是本申请扬声器在组合状态下的与图65不同夹角的实施例的结构示意图，第一电路板1931和第二电路板1932互相倾斜设置于同一个腔体1911内，可以使两个电路板的安装方式更加灵活，可以根据两个电路板上电子元件的大小和位置调整两个电路板之间的夹角，从而提高扬声器的空间利用率，在进一步应用于扬声器时，能够节省扬声器的空间，以利于扬声器的轻薄化。
进一步的，第一电路板1931和第二电路板1932的夹角位于50°～150°范围内，具体的第一电路板1931和第二电路板1932的夹角可以是上述范围内的任意角度，例如70°、80°、90°、100°、110°等均可。
具体地，在一个应用场景中，开口1912和盖体1920呈对应的长条状设置，第一电路板1931的形状与开口1912的形状相匹配，且第一电路板1931的宽度d 1不大于开口平面沿开口1912宽度方向上的尺寸，以使得第一电路板1931(平行或倾斜于开口所在平面)能够容置于腔体1911内靠近开口1912的位置，即第一电路板1931也呈长条状设置。对应地，开关19311、发光元件19313以及第一麦克风元件19312可沿第一电路板1931的长度方向，也即盖体1920的长度方向间隔设置在第一电路板1931上。
在一些实施例中，所述第二麦克风元件13921为骨传导麦克风，所述骨传导麦克风通过第二导音孔1914伸出所述容置本体1910。所述骨传导麦克风安装于容置本体1910的一侧侧壁。所述侧壁为用户佩戴扬声器时贴合用户身体的一侧侧壁，以便所述骨传导麦克风更好地接收主声源的振动信号。当用户佩戴扬声器进行语音输入时，第二麦克风元件19321将主要采集主声源的振动信号，并将所述振动信号与第一麦克风元件19312(气导)采集的声音信号(包括音频信号与噪声)进行对比。在一些实施例中，可以基于上述对比结果，对所述第一麦克风元件19312采集的声音信号进行优化，获得高质量的音频信号。
在一些实施例中，组件本体上设置贯通腔体1911的侧壁的第二导音孔1914，且在对应第二导音孔1914的位置设置有第二挡音件1915，第二挡音件1915经第二导音孔1914朝向腔体1911的内部延伸，以限制声音向第二麦克风元件19321的传输方向传递。
具体地，本实施例中，对应于第二麦克风元件19321的第二导音孔1914设置在组件本体上，并贯通腔体1911以将第二麦克风元件19321与外界连通，以使得第二麦克风元件19321能够接收外界的声音信号。
其中，第二挡音件1915可以为硬质材料，或者软质材料，例如第二挡音件1915可以由容置本体1910在腔体1911内部一侧沿第二导音孔1914的外围向腔体1911内部延伸而形成。本实施例中，第二挡音件1914可由与容置本体1910一体注塑而成的软胶在腔体1911内部一侧沿第二导音孔1914的外围向腔体1911内部延伸而形成。在一应用场景中，第二挡音件1915可以沿第二导音孔1914的四周向腔体1911内部延伸，并延伸至第二麦克风元件19321，并进而包围第二麦克风元件19321的受音区，以形成一连接第二导音孔1914和第二麦克风元件19321的通道，使得外界输入至第二导音孔1914的声音信号直接经过该通道而被第二麦克风元件19321的受音区所接收。在另一个应用场景中，第二挡音件1915可并不完全包围在第二导音孔1914的四周，而仅沿第二导音孔1914的一侧或者两侧等向腔体1911内部延伸，并延伸至第二麦克风元件19321，以引导由第二导音孔1914输入的声音传播至第二麦克风元件19321而被其受音区所接收。
结合图59、图60和图61，在一些实施例中，电子组件(或称为电路壳体、组件本体)可以包括容置本体1910及盖体1920。其中，容置本体1910上设置有具有至少一开口1912的腔体1911，盖体1920盖设于该腔体1911的开口1912上，并用于密封腔体1911。本实施例中的电子组件与上个实施例中组件本体相一致。
本申请中电子组件可应用于电子设备当中，其中电子设备可以是任何需要对内部结构进行密封的电子设备，例如耳机、MP3播放器、助听器、手机、平板电脑、或具有电路组件、电子器件的眼镜等，此处不做具体限定。在一些实施例中，电子组件可以设置于图7的眼镜腿15处。在一些实施例中电子组件也可以称为电路壳体。
在一些实施例中，容置本体1910可以为电子设备(例如，扬声器)的至少一部分。
在一些实施例中，电路组件与图2中控制电路相对应。
图68是本申请电子组件在组合状态下沿图59中的A-A轴线的截面图。如图68所示，在一些实施例中，容置本体1910包括用于定义开口1912的开口边缘1913，覆盖部19212压合在开口边缘1913的靠近开口1912的内侧区域19131，盖层1922覆盖在覆盖部19212远离容置本体1910的外表面上，并压合在开口边缘1913的内侧区域19131外围的外侧区域19132上，进而实现与开口边缘1913之间的密封。
图69为本申请电子组件在组合状态下沿图59中的B-B轴线的截面图。如图69所示，电子组件可以包括一第一麦克风元件19312。在一些实施例中，第一麦克风元件19312也可以设置在电路组件1930的第一电路板1931上，以容置于腔体1911内。例如，第一麦克风元件19312可与上述实施方式中的开关19311间隔设置在第一电路板1931上。第一麦克风元件19312可以用于接收来自电子组件外部的声音信号，并将声音信号转换为电信号以进行分析处理。
在一些实施例中，支架1921上设置有与第一麦克风元件19312对应的麦克风孔19214，盖 层1922上设置有与麦克风孔19214对应的第一导音孔19223，且在对应麦克风孔19214的位置设置有第一挡音件19224，第一挡音件19224经麦克风孔19214朝向腔体1911的内部延伸，并定义导音通道192241。
在一些实施例中，第一导音孔19223贯通盖层1922设置，并与第一麦克风元件19312的位置对应，第一导音孔19223与支架1921上的麦克风孔19214对应，进而将第一麦克风元件19312与电子组件的外部连通，使得电子组件外部的声音可通过第一导音孔19223以及麦克风孔19214而为第一麦克风元件19312所接收。
图2是本申请扬声组件一实施方式的局部结构图，图3是本申请扬声组件一实施方式的局部结构爆炸图，图70是本申请扬声组件一实施方式的局部结构截面图。
请结合图2和图3，在一些实施例中，辅助功能模块可以包括麦克风432，该麦克风432的数量为两个，分别为第一麦克风432a和第二麦克风432b。其中，第一麦克风432a和第二麦克风432b都可以是MEMS(微型机电系统)麦克风432，工作电流小，性能较为稳定，且产生的语音质量高。两个麦克风432根据实际需求可设置在软性电路板44的不同位置上。
在一些实施例中，软性电路板44可以设置在图1中的扬声器中，如图1中软性电路板106相对应。软性电路板44可以包括主体电路板441以及与主体电路板441连接的分支电路板442和分支电路板443，分支电路板442与主体电路板441同向延伸，第一麦克风432a贴装于分支电路板442远离主体电路板441的端部，分支电路板443与主体电路板441垂直延伸，第二麦克风432b贴装于分支电路板443远离主体电路板441的端部，多个焊盘45则设置于主体电路板441远离分支电路板442和分支电路板443的端部。
在一些实施例中，机芯壳体41包括环绕设置的周侧壁411以及与周侧壁411的一端面连接的底端壁412，进而形成具有一开口端的容置空间。其中，耳机芯42经开口端放置于容置空间内，第一麦克风432a固定于底端壁412上，第二麦克风432b固定于周侧壁411上。
在一些实施例中，可以适当对分支电路板442和/或分支电路板443进行弯折，以适应麦克风432对应的入声孔在机芯壳体41上的位置的设置。具体地，软性电路板44可以主体电路板441平行于底端壁412的方式设置于机芯壳体41内，从而能够使得第一麦克风432a对应于底端壁412，而无需对主体电路板441进行弯折。而第二麦克风432b由于固定于机芯壳体41的周侧壁411上，因此需要对第二主体电路板441进行弯折设置，具体可将分支电路板443在远离主体电路板441的端部弯折设置，以使得分支电路板443的板面垂直于主体电路板441和分支电路板442的板面，并进而使得第二麦克风432b朝向背离主体电路板441和分支电路板442的方向而固定于机芯壳体41的周侧壁411上。
在一些实施例中，焊盘45、焊盘46、第一麦克风432a和第二麦克风432b均可设置于软性电路板44的同一侧，焊盘46与第二麦克风432b相邻设置。
在一些实施例中，焊盘46可具体设置于分支电路板443远离主体电路板441的端部，并与第二麦克风432b朝向相同并间隔设置，从而随分支电路板443的弯折而垂直于焊盘45的朝向。 需要指出的是，分支电路板443在弯折后其板面也可以不垂直于主体电路板441的板面，具体可根据周侧壁411与底端壁412之间的设置方式而定。
在一些实施例中，软性电路板44的另一侧设置有用于支撑焊盘45的刚性支撑板4a、麦克风刚性支撑板4b，该麦克风刚性支撑板4b包括用于支撑第一麦克风432a的刚性支撑板4b1以及用于共同支撑焊盘46与第二麦克风432b的刚性支撑板4b2。
在一些实施例中，刚性支撑板4a、刚性支撑板4b1和刚性支撑板4b2主要用于对相应的焊盘和麦克风432起支撑作用，从而需具有一定的强度。三者的材质可以相同或者不同，具体可以为聚酰亚胺(PolyimideFilm，PI)，或者其它能够起到强度支撑作用的材质，如聚碳酸酯、聚氯乙烯等。另外，三个刚性支撑板的厚度可以根据刚性支撑板本身所具有的强度以及焊盘45、焊盘46以及第一麦克风432a、第二麦克风432b所实际需求的强度进行设定，此处不做具体限定。
第一麦克风432a和第二麦克风432b分别对应于两个麦克风组件4c。在一些实施例中，两个麦克风组件4c的结构相同，机芯壳体41上设置有入声孔413，进一步地，该扬声组件在机芯壳体41处还设置有一体成型于机芯壳体41的内表面的环形挡壁414，并设置于入声孔413的外围，进而定义一与入声孔413连通的容置空间415。
请结合图2、图3和图70，在一些实施例中，麦克风组件4c还包括：防水膜组件4c1。
其中，防水膜组件4c1设置于容置空间415内，并覆盖入声孔413。麦克风刚性支撑板4b设置于容置空间415内，并位于防水膜组件4c1的远离入声孔413的一侧，以将防水膜组件4c1压持于机芯壳体41的内表面上。在一些实施例中，麦克风刚性支撑板4b上设置有与入声孔413对应的入声孔4b3。在一些实施例中，麦克风432设置于麦克风刚性支撑板4b远离防水膜组件4c1的一侧并覆盖入声孔4b3。
其中，防水膜组件4c1具有防水透声的作用，并紧密贴合于机芯壳体41的内表面，以防止机芯壳体41外部的液体由入声孔413进入机芯壳体41内部而影响麦克风432的性能。
入声孔4b3和入声孔413的轴向可以重合，也可以根据麦克风432等的实际需求而以一定的角度相交均可。
麦克风刚性支撑板4b设置于防水膜组件4c1与麦克风432之间，一方面对防水膜组件4c1进行压持，而使防水膜组件4c1紧密贴合于机芯壳体41的内表面；另一方面，麦克风刚性支撑板4b具有一定的强度，从而起到支撑麦克风432的作用。
在一些实施例中，麦克风刚性支撑板4b的材质可以为聚酰亚胺(PolyimiceFilm，PI)，或者其它能够起到强度支撑作用的材质，如聚碳酸酯、聚氯乙烯等。另外，麦克风刚性支撑板4b的厚度可以根据麦克风刚性支撑板4b的强度以及麦克风432所实际需求的强度进行设定，此处不做具体限定。
图71是图70中C部分的局部放大图。如图68所示，在一些实施例中，防水膜组件4c1可以包括防水膜本体4c11以及环形胶垫4c12。该环形胶垫4c12设置于防水膜本体4c11朝向麦克风刚性支撑板4b一侧，并进而设置于入声孔413和入声孔4b3的外围。
其中，麦克风刚性支撑板4b压持于环形胶垫4c12，从而使得防水膜组件4c1与麦克风刚性支撑板4b之间粘接固定于一起。
在一些实施例中，环形胶垫4c12设置成在防水膜本体4c11和刚性支撑板之间形成一仅通过入声孔4b3连通至麦克风432的密封腔，即将防水膜组件4c1与麦克风刚性支撑板4b之间的连接不留空隙，从而使得防水膜本体4c11和麦克风刚性支撑板4b之间的环形胶垫4c12外围的空间与入声孔4b3隔绝。
在一些实施例中，防水膜本体4c11具体可以为防水透声膜，相当于人耳的鼓膜。在有外界声音由入声孔413进入时，该防水膜本体4c11发生振动，从而导致密封腔中的气压发生变化，从而导致麦克风432中发出声音。
进一步地，由于防水膜本体4c11在振动时导致密封腔中气压发生变化，而该气压需要控制在适当的范围内，若过大或过小均为影响声音质量。本实施方式中，防水膜本体4c11和刚性支撑板之间的间距可以为0.1-0.2mm，具体可以为0.1mm、0.15mm、0.2mm等，从而使得防水膜本体4c11振动所导致的密封腔当中的气压变化在适当的范围之内，从而提高声音质量。
在一些实施例中，防水膜组件4c1进一步包括设置于防水膜本体4c11朝向机芯壳体41的内表面一侧且与环形胶垫4c12重叠设置的环形胶垫4c13。
通过这种方式，能够将防水膜组件4c1与入声孔413外围的机芯壳体41的内表面紧密贴合，从而减少由入声孔413进入的声音的散失，而提高声音转化为防水膜本体4c11的振动的转化率。
在一些实施例中，环形胶垫4c12和环形胶垫4c13可分别为双面胶，或者密封胶等。
在一些实施例中，还可以进一步在环形挡壁414以及麦克风432的外围涂覆密封胶，以进一步提高密封性，从而提高声音的转化率，进而提高声音质量。
在一些实施例中，软性电路板44可设置于刚性支撑板和麦克风432之间，并在对应于麦克风刚性支撑板4b的入声孔4b3的位置设置有入声孔444，从而使得外界声音所引起的防水膜本体4c11的振动穿过该入声孔444从而进一步影响麦克风432。
请参照图3，在一些实施例中，软性电路板44进一步向远离麦克风432的方向延伸，以与其它功能元件或导线连接而实现相应的功能。对应地，麦克风刚性支撑板4b上也随着软性电路板向远离麦克风432的方向延伸出一段距离。
图72是根据本申请一些实施例提供的扬声组件的机芯壳体的部分结构示意图，图73是图72中D部分的局部放大图，图74是根据本申请一些实施例提供的扬声组件的机芯壳体的局部截面图。
结合图72、图73、图74，本机芯壳体可包括主壳体2825(即，图1中机芯壳体108)以及隔板组件2826，其中，隔板组件2826位于主壳体2825内部，并与主壳体2825连接，进而将主壳体2825的内部空间2827分隔成第一容置空间271和靠近接插孔2822一侧的第二容置空间272。在一些实施例中，主壳体2825包括周侧壁251以及与周侧壁251的一端面连接的底端壁252，周侧 壁251与底端壁252共同围绕形成一主壳体2825的内部空间2827。
在一些实施例中，隔板组件2826位于主壳体2825的靠近接插孔2822的一侧，并包括侧隔板261以及底隔板262。其中，侧隔板261可沿垂直于底端壁252的方向设置，且侧隔板261的两端均与周侧壁251连接，从而对主壳体2825的内部空间2827进行分隔。底隔板262可与底端壁252平行或者接近平行且间隔设置，并进一步分别与周侧壁251和侧隔板261连接，从而将主壳体2825所形成的内部空间2827一分为二而形成由侧隔板261、底隔板262和远离接插孔2822的周侧壁251、底端壁252共同围成的第一容置空间271，以及由底隔板262与侧隔板261和靠近接插孔2822的周侧壁251共同围成的第二容置空间272。其中，第二容置空间272可小于第一容置空间271。在一些实施例中，隔板组件2826也可以通过其它的设置方式对主壳体2825的内部空间2827进行划分，此处不做具体限定。
在一些实施例中，隔板组件2826进一步包括内隔板263，内隔板263进一步将第二容置空间272分隔成两个子容置空间2721。具体地，该内隔板263垂直于主壳体2825的底端壁252设置，分别与侧隔板261和周侧壁251连接，并进一步延伸至走线孔2621处，从而在将第二容置空间272分隔为两个子容置空间2721的同时，还进一步将走线孔2621划分为两个，两个走线孔2621可分别与对应的子容置空间2721连通。
在一些实施例中，第二容置空间272可进一步由密封胶进行填充。通过这种方式，能够将第二容置空间272内所容置的导线2812和导线80进一步固定，以进一步降低由于导线振动而对声音质量造成的不良影响，从而提高扬声组件的声音质量，同时能够对导线2812与导线80之间的焊接点起到保护作用，另外，将第二容置空间272密封设置还能够达到防水防尘的目的。
在一些实施例中，以上描述的扬声组件也可以通过气传导的方式将声音传递给用户。当采用气传导的方式传递声音时，所述扬声组件可以包括一个或多个声源。所述声源可以位于用户头部的特定位置，例如，头顶、额头、脸颊、鬓角、耳廓、耳廓背面等，而不用堵塞或者覆盖耳道。出于描述的目的，图75显示一种通过气传导的方式传递声音的示意图。
如图75所示，声源2810和声源2820可以产生相位相反的声波(图中以“+”和“-”表示相位相反)。为简单起见，这里所说的声源指的是扬声组件上输出声音的出声孔。例如，所述声源2810和声源2820可以是分别位于扬声组件上特定位置(例如，机芯壳体108或者眼镜腿15)的两个出声孔。
在一些实施例中，声源2810和声源2820可以由同一个振动装置2801产生。所述振动装置2801包括振膜(未显示在图中)。当所述振膜受到电信号驱动而振动时，振膜正面驱动空气振动，通过导声通道2812在出声孔处形成声源2810，振膜背面驱动空气振动，通过导声通道2822在出声孔处形成声源2820。所述导声通道指的是振膜到对应出声孔的声音传播路径。在一些实施例中，所述导声通道是由扬声组件上特定结构(例如，机芯壳体108，或者眼镜腿15)围成的路径。需要知道的是，在一些可替代的实施例中，声源2810和声源2820还可以由不同的振动装置，分别通过不同的振膜振动产生。
由声源2810和声源2820产生的声音中，一部分传递给用户耳朵形成用户听到的声音，另一部分传递到环境中形成漏音。考虑到声源2810和声源2820距离用户耳朵的位置较近，为了描述方便，所述传递到用户耳朵的声音可以称为近场声音，所述传递到环境中的漏音可以称为远场声音。在一些实施例中，所述扬声组件产生的不同频率的近场/远场声音与声源2810和声源2820之间的间距有关。一般说来，扬声组件产生的近场声音会随着两个声源之间间距的增大而增大，而产生的远场声音(漏音)会随着频率的增加而增大。
针对不同频率的声音，可以分别设计声源2810和声源2820之间的间距，使得扬声组件产生的低频近场声音(例如，频率小于800Hz的声音)尽可能大，且高频远场声音(例如，频率大于2000Hz的声音)尽可能小。为了达到以上目的，所述扬声组件中可以包括两组或两组以上的双声源，每组双声源包含类似于声源2810和声源2820的两个声源，并分别产生特定频率的声音。具体地，第一组双声源可以用于产生低频声音，第二组双声源可以用产生高频声音。为了获得较大的低频近场声音，第一组双声源中两个声源之间的距离可以设置为较大的值。并且由于低频信号的波长较长，双声源之间较大的距离不会在远场形成过大的相位差，因而也不会在远场中形成过多的漏音。为了使得高频远场声音较小，第二组双声源中两个声源之间的距离可以设置为较小的值。由于高频信号的波长较短，双声源之间较小的距离可以避免在远场形成大的相位差，因而可以避免形成大的漏音。所述第二组双声源之间的距离小于所述第一组双声源之间的距离。
需要注意的是，以上对改变气传导的传导声音方法的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解气传导的基本原理后，可能在不背离这一原理的情况下，针对不同形状和结构的气传导扬声组件，但这些改变仍在以上描述的范围之内。例如，导声通道2822也可以由其他的描也可以设置在眼镜中。诸如此类的变形，均在本申请的保护范围之内。
本申请实施例可能带来的有益效果包括但不限于：(1)通过转轴组件，可以连接眼镜框和眼镜腿，保护眼镜中的连接线，延长连接线的寿命；(2)通过软性电路板，可以简化扬声器内的走线方式；(3)通过引声孔，能够减小外壳振动和抑制漏音；(4)通过复合振动装置，能够改善扬声组件的音质；(5)第二容置空间通过密封胶进行填充能够将其内部设置的导线进行固定，降低导线振动对声音质量的影响，从而提高扬声器的声音质量，另外第二容置空间内填充的密封胶可以对导线之间的焊接点进行保护，密封设置的第二容置空间可以起到防水防尘的效果；(6)通过刚性支撑板将具有防水透声作用的防水膜组件压持于并覆盖于第一入声孔，并紧密贴合于机芯壳体的内表面，以防止机芯壳体外部的液体由第一入声孔进入机芯壳体内部，从而提高麦克风的防水性能；(7)提高麦克风组件获取主声源声音的效果；(8)通过在磁路组件中增设磁性元件、导磁元件和导电元件，可以提高扬声器的灵敏度。需要说明的是，不同实施例可能产生的有益效果不同，在不同的实施例里，可能产生的有益效果可以是以上任意一种或几种的组合，也可以是其他任何可能获得的有益效果。

Claims (30)

  1. 一种眼镜，其特征在于，所述眼镜包括：
    眼镜架，所述眼镜架包括眼镜框以及两条眼镜腿，所述两条眼镜腿分别与所述眼镜框转动连接；
    两个扬声组件，所述两个扬声组件包括耳机芯，所述两个扬声组件分别通过所述两条眼镜腿上的铰链组件连接到两条眼镜腿上，且所述铰链组件能够转动以改变每个扬声组件相对于其所连接的眼镜腿的位置；
    所述眼镜腿中容纳控制电路或电池，所述控制电路或电池驱动所述耳机芯振动以产生声音。
  2. 根据权利要求1所述的眼镜，其特征在于，铰链组件包括铰链、杆状件和固定件；所述铰链包括：
    铰链座；
    铰链臂，所述铰链臂与所述铰链座通过转轴转动连接，所述铰链臂受到外力作用时能够相对所述铰链座转动，以改变所述扬声组件相对于眼镜腿的位置；
    支撑件，所述支撑件活动设置于所述铰链座上；
    弹性件，所述弹性件用于将所述支撑件朝向所述铰链臂进行弹性偏置，以使得所述支撑件能够弹性抵接于所述铰链臂上。
  3. 根据权利要求2所述的眼镜，其特征在于，
    所述铰链臂上包括彼此连接的第一支撑面和第二支撑面；
    所述支撑件上包括第三支撑面；
    所述弹性件将所述支撑件朝向所述铰链臂进行弹性偏置时，使得所述第三支撑面能够分别弹性抵接于所述第一支撑面和第二支撑面上；
    在所述铰链臂受到外力作用而相对所述铰链座进行转动时，由所述第一支撑面和所述第二支撑面的连接处推动所述支撑件克服所述弹性件的弹性偏置而反向移动，进而使得所述第三支撑面从与所述第一支撑面和所述第二支撑面中的一者弹性抵接切换到与所述第一支撑面和所述第二支撑面中的另一者弹性抵接。
  4. 根据权利要求3所述的眼镜，其特征在于，在垂直于所述转轴的中轴线的截面上，所述转轴到所述连接处的最大距离与所述转轴到所述第一支撑面的最短距离之间的比例介于1.1和1.5之间。
  5. 根据权利要求3所述的眼镜，其特征在于，当所述第三支撑面从与所述第一支撑面弹性抵接切换到与所述第二支撑面弹性抵接时，所述铰链座与所述铰链臂之间的夹角变小。
  6. 根据权利要求3所述的眼镜，其特征在于，所述第三支撑面从与所述第一支撑面弹性抵接切 换到与所述第二支撑面弹性抵接时所需的外力不同于所述第三支撑面从与所述第二支撑面弹性抵接切换到与所述第一支撑面弹性抵接时所需的外力。
  7. 根据权利要求3所述的眼镜，其特征在于，在垂直于所述转轴的中轴线的截面上，所述连接处呈弧形设置。
  8. 根据权利要求7所述的眼镜，其特征在于，所述连接处呈圆弧设置，且所述圆弧的曲率介于5与30之间。
  9. 根据权利要求3所述的眼镜，其特征在于，在垂直于所述转轴的中轴线的截面上，所述第一支撑面和所述第二支撑面之间的夹角为钝角。
  10. 根据权利要求3所述的眼镜，其特征在于，
    所述铰链座包括座本体以及从所述座本体凸出且彼此间隔设置的第一凸耳(314)和第二凸耳(315)；
    所述铰链臂包括臂本体(325)以及从所述臂本体(325)凸出设置的第三凸耳(326)，所述第三凸耳(326)插入至所述第一凸耳(314)和第二凸耳(315)之间的间隔区域，并通过所述转轴与所述第一凸耳(314)和第二凸耳(315)转动连接。
  11. 根据权利要求10所述的眼镜，其特征在于，
    所述支撑件至少部分设置于所述间隔区域内且位于所述第三凸耳(326)朝向所述座本体的一侧；
    所述座本体上设置有与所述间隔区域连通的容置腔(3121)，所述弹性件设置于所述容置腔(3121)内，并将所述支撑件朝向所述第三凸耳(326)进行弹性偏置。
  12. 根据权利要求1所述的眼镜，其特征在于，所述眼镜还包括：
    转轴组件，所述转轴组件用于连接所述眼镜框和所述眼镜腿，以使得所述眼镜框和所述眼镜腿能够绕所述转轴组件进行相对转动，所述转轴组件沿轴向设置有转轴走线通道；
    连接线，所述连接线穿设于所述转轴走线通道内并分别延伸至所述眼镜框及所述眼镜腿。
  13. 根据权利要求12所述的眼镜，其特征在于，所述转轴组件包括第一转轴，所述第一转轴的两端分别连接所述眼镜框和所述眼镜腿，所述转轴走线通道沿所述第一转轴的轴向设置，所述转轴走线通道通过设置于所述第一转轴的至少一端面上的走线口与外部连通，所述连接线经所述走线口延伸至所述眼镜框或所述眼镜腿。
  14. 根据权利要求13所述的眼镜，其特征在于，所述转轴走线通道通过分别设置于所述第一转 轴的两端面上的第一走线口和第二走线口与外部连通，所述连接线经所述第一走线口和第二走线口分别延伸至所述眼镜框和所述眼镜腿。
  15. 根据权利要求13所述的眼镜，其特征在于，所述转轴走线通道通过设置于所述第一转轴的端面上的第一走线口和设置于所述第一转轴的侧壁上的第二走线口与外部连通，所述连接线经所述第一走线口和第二走线口分别延伸至所述眼镜框和所述眼镜腿。
  16. 根据权利要求15所述的眼镜，其特征在于，所述第一转轴与所述眼镜框和所述眼镜腿中靠近所述第二走线口设置的一者固定连接，且与所述眼镜框和所述眼镜腿中靠近所述第一走线口设置的另一者转动连接。
  17. 根据权利要求15所述的眼镜，其特征在于，所述转轴组件进一步包括与所述第一转轴同轴且间隔的第二转轴；
    所述眼镜框包括第一凸耳，所述眼镜腿包括间隔设置的第二凸耳和第三凸耳，
    所述第一转轴和所述第二转轴互相靠近的端部均与所述第一凸耳连接，所述第一转轴和所述第二转轴互相远离的端部分别与所述第二凸耳和第三凸耳连接，以将所述第一凸耳保持在所述第二凸耳与所述第三凸耳之间。
  18. 根据权利要求17所述的眼镜，其特征在于，所述第一走线口设置于所述第一转轴靠近所述第二转轴的端面，所述第二走线口设置于所述第一转轴靠近所述第二凸耳的侧壁上，所述第一转轴与所述第一凸耳转动连接，并与所述第二凸耳固定连接。
  19. 根据权利要求18所述的眼镜，其特征在于，所述第一凸耳和所述第二凸耳同轴设置有第一容置孔和第二容置孔，其中所述第一容置孔和第二容置孔的尺寸设置成允许所述第一转轴从所述眼镜腿的外部经所述第二容置孔插入到所述第一容置孔内，并且使得所述第一转轴与所述第二容置孔过盈配合且与所述第一容置孔间隙配合。
  20. 根据权利要求18所述的眼镜，其特征在于，所述第一凸耳和所述第三凸耳同轴设置有第三容置孔和第四容置孔，其中第三容置孔和第四容置孔的尺寸设置成允许所述第二转轴从所述眼镜腿的外部经所述第四容置孔插入到所述第三容置孔内，并且使得所述第二转轴与所述第三容置孔过盈配合且与所述第四容置孔间隙配合，或使得所述第二转轴与所述第三容置孔间隙配合且与所述第四容置孔过盈配合。
  21. 根据权利要求20所述的眼镜，其特征在于，所述第二转轴为实心轴，所述第二转轴的直径小于所述第一转轴的直径，在佩戴状态下，所述第二转轴位于所述眼镜腿的上侧，所述第一转轴位 于所述眼镜腿的下侧；所述第一转轴的用于设置所述第一走线口的端面与所述第一转轴的用于定义所述转轴走线通道的内壁面的连接处呈弧形设计。
  22. 根据权利要求1所述的眼镜，其特征在于，所述扬声组件还包括：
    辅助功能模块，用于接收辅助信号，执行辅助功能；
    软性电路板，用于电连接所述控制电路的音频信号导线和辅助信号导线，并通过所述软性电路板将所述音频信号导线和所述辅助信号导线分别与所述耳机芯和所述辅助功能模块电连接；以及
    机芯壳体，用于容纳所述耳机芯、所述辅助功能模块和所述软性电路板。
  23. 根据权利要求22所述的眼镜，其特征在于，所述软性电路板至少包括多个第一焊盘和多个第二焊盘；
    所述多个第一焊盘中的至少一个第一焊盘与所述音频信号导线电连接，所述至少一个第一焊盘通过所述软性电路板上的第一软性引线与至少一个所述第二焊盘电连接，所述至少一个第二焊盘通过外部导线与所述耳机芯电连接；以及
    所述多个第一焊盘中的至少另一个第一焊盘与所述辅助信号导线电连接，所述至少另一个第一焊盘与所述辅助功能模块通过所述软性电路板上的第二软性引线电连接。
  24. 根据权利要求23所述的眼镜，其特征在于，
    所述软性电路板至少包括主体电路板和第一分支电路板，所述第一分支电路板和所述主体电路板相连，并远离所述主体电路板沿所述主体电路板的一端延伸；以及
    所述辅助功能模块至少包括第一辅助功能模块和第二辅助功能模块，所述第一辅助功能模块设置于所述主体电路板上，所述第二辅助功能模块设置于所述第一分支电路板上。
  25. 根据权利要求24所述的眼镜，其特征在于，所述多个第一焊盘设置于所述主体电路板上，所述至少一个第二焊盘设置于所述第一分支电路板上。
  26. 根据权利要求24所述的眼镜，其特征在于，
    所述软性电路板还包括第二分支电路板，所述第二分支电路板和所述主体电路板相连，并远离所述主体电路板沿所述主体电路板的另一端延伸，并与所述第一分支电路板间隔设置；以及
    所述辅助功能模块还包括第三辅助功能模块，所述第三辅助功能模块设置在所述第二分支电路板上。
  27. 根据权利要求26所述的眼镜，其特征在于，
    所述多个第一焊盘设置于所述主体电路板上，至少一个所述第二焊盘设置于所述第一分支电路板上，其他所述第二焊盘设置于所述第二分支电路板上。
  28. 根据权利要求22所述的眼镜，其特征在于，所述耳机芯包括：
    磁路组件，用于提供磁场；
    振动组件，所述振动组件包括线圈和内部引线，所述线圈位于所述磁场中，所述内部引线与所述线圈电连接；所述线圈能够通过所述内部引线接收音频电流，将所述音频电流在磁场的作用下转化为机械振动信号，所述外部导线，一端与所述第二焊盘电连接，另一端与所述内部引线电连接，将所述音频电流传输至所述线圈。
  29. 根据权利要求28所述的眼镜，其特征在于，所述机芯壳体内具有埋线槽，所述外部导线和/或所述内部引线线设置于所述埋线槽内。
  30. 根据权利要求29所述的眼镜，其特征在于，所述内部引线和所述外部引线彼此焊接，焊接位置位于所述埋线槽内。
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US20210072564A1 (en) 2021-03-11
US11940670B2 (en) 2024-03-26
RU2766545C1 (ru) 2022-03-15
US20210168482A1 (en) 2021-06-03
KR20210046058A (ko) 2021-04-27
WO2020038475A1 (zh) 2020-02-27
KR102528290B1 (ko) 2023-05-03
US20230152606A1 (en) 2023-05-18
EP3828620A4 (en) 2022-03-16
US20210173232A1 (en) 2021-06-10
JP7208401B2 (ja) 2023-01-18
WO2020038488A1 (zh) 2020-02-27
WO2020038480A1 (zh) 2020-02-27
US20210165249A1 (en) 2021-06-03
US20210168481A1 (en) 2021-06-03
US11940669B2 (en) 2024-03-26
WO2020038487A1 (zh) 2020-02-27
RU2022102528A (ru) 2022-03-01
WO2020038486A1 (zh) 2020-02-27
US20210116719A1 (en) 2021-04-22
BR112021003527A2 (pt) 2021-05-18
US11592690B2 (en) 2023-02-28
WO2020038478A1 (zh) 2020-02-27
US20210063774A1 (en) 2021-03-04
WO2020038485A1 (zh) 2020-02-27
US11906817B2 (en) 2024-02-20
US11899284B2 (en) 2024-02-13
US20210116723A1 (en) 2021-04-22
JP2021535701A (ja) 2021-12-16
EP3828620A1 (en) 2021-06-02
US11644692B2 (en) 2023-05-09

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