WO2020121448A1 - 基板収納容器 - Google Patents

基板収納容器 Download PDF

Info

Publication number
WO2020121448A1
WO2020121448A1 PCT/JP2018/045728 JP2018045728W WO2020121448A1 WO 2020121448 A1 WO2020121448 A1 WO 2020121448A1 JP 2018045728 W JP2018045728 W JP 2018045728W WO 2020121448 A1 WO2020121448 A1 WO 2020121448A1
Authority
WO
WIPO (PCT)
Prior art keywords
wall
pressing
container body
lid
pressing portion
Prior art date
Application number
PCT/JP2018/045728
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
恭兵 佐藤
Original Assignee
ミライアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミライアル株式会社 filed Critical ミライアル株式会社
Priority to JP2020559615A priority Critical patent/JP7257418B2/ja
Priority to KR1020217019667A priority patent/KR102632741B1/ko
Priority to PCT/JP2018/045728 priority patent/WO2020121448A1/ja
Priority to CN201880100090.8A priority patent/CN113396113B/zh
Priority to TW108145108A priority patent/TWI816950B/zh
Publication of WO2020121448A1 publication Critical patent/WO2020121448A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate storage container used when storing, storing, transporting, transporting, etc. reticle POD and the like.
  • Containers for storing and transporting reticle pods for storing reticles used in semiconductor manufacturing are known (see, for example, Patent Documents 1 and 2).
  • One end of the container body has an opening peripheral portion where the container body opening is formed.
  • the other end of the container body has a closed cylindrical wall portion.
  • a pod storage space is formed in the container body.
  • the pod accommodating space is formed so as to be surrounded by the wall portion, and can accommodate the reticle pod.
  • the lid can be attached to and detached from the peripheral edge of the opening, and can close the opening of the container body.
  • a pod fixing member for fixing the reticle pod to the container body is provided, and the container is a reticle pod with the reticle pod fixed to the container body by the pod fixing member.
  • An object of the present invention is to provide a substrate storage container that can more smoothly carry out the storage procedure of a reticle pod in a container.
  • the present invention relates to a container main body having an opening peripheral portion in which a pod accommodating space capable of accommodating an object to be accommodated is formed, and a container main body opening communicating with the pod accommodating space is formed at one end, and the opening peripheral edge.
  • Attached to the lid body which is detachable from the lid and is capable of closing the container body opening portion in a positional relationship surrounded by the opening periphery portion, and abutting on the lid body and the opening periphery portion.
  • a sealing member that is capable of interposing between the opening peripheral edge portion and the lid body and closely contacting and contacting the opening peripheral edge portion and the lid body to close the container body opening portion together with the lid body.
  • the container body has a back wall, an upper wall, a lower wall, and a wall portion having a pair of side walls, and the other end of the wall portion is closed by the back wall,
  • the container body opening is formed by one end, one end of the lower wall, and one end of the side wall, and the lower wall is provided with a positioning portion for positioning the contained object with respect to the container body,
  • the upper wall is provided with a lower pressing portion that presses the upper portion of the contained object toward the lower wall, and the lid body is provided with the lower pressing portion when closing the container body opening portion.
  • the present invention relates to a substrate storage container that presses an upper part of an object to be stored in the direction of the lower wall.
  • the lid body has a pressing portion engaged portion with which the downward pressing portion can be engaged, and when closing the container body opening portion, the pressing portion engaged portion becomes the downward pressing portion. It is preferable that the lower pressing portion presses the upper portion of the contained object toward the lower wall by engaging with the lower pressing portion.
  • the pressing portion engaged portion of the lid body and the driving portion engaging portion of the lower pressing portion that engages with the pressing portion engaged portion have hook shapes that engage with each other. Is preferred.
  • the lower pressing portion is connected to the upper part of the contained object and presses the contained object in the direction of the lower wall, and the lower pressing part is connected to the distal end pressing part to move the lid body.
  • a pressing part driving part that moves the tip part pressing part away from the housed object when the lid body does not close the container body opening part.
  • a biasing member for biasing.
  • the lower pressing portion is connected to the upper part of the contained object and presses the contained object in the direction of the lower wall, and the lower pressing part is connected to the distal end pressing part to move the lid body.
  • a pressing unit driving unit that is movable with the pressing unit driving unit, wherein the pressing unit driving unit moves upward in a diagonal direction forming a predetermined angle with respect to a horizontal direction when the lid moves in the direction of the back wall. It is preferably movable.
  • the lower part of the tip end pressing part moves from the back wall side to the container body opening part side, It is preferable to contact the upper part of the contained object and press the upper part of the contained object toward the lower wall.
  • the material forming the wall portion is formed of a cycloolefin polymer. Further, it is preferable to have a ventilation path capable of communicating the pod accommodating space and a space outside the container body.
  • a substrate storage container that can more smoothly perform the procedure of storing a reticle pod in a container.
  • FIG. 3 is a side sectional view showing a state in which the reticle pod RP is fixed to the container body 2 in the substrate storage container 1 according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional perspective view showing a state in which the reticle pod RP is fixed to the container body 2 in the substrate storage container 1 according to the embodiment of the present invention.
  • FIG. 3 is a side sectional view showing a state where the reticle pod RP is not fixed to the container body 2 in the substrate storage container 1 according to the embodiment of the present invention.
  • FIG. 4 is a cross-sectional perspective view showing a state in which the reticle pod RP is not fixed to the container body 2 in the substrate storage container 1 according to the embodiment of the present invention.
  • FIG. 1 is a front view showing the substrate storage container 1.
  • FIG. 2 is a plan view showing the substrate storage container 1.
  • FIG. 3 is a side sectional view (side sectional view taken along the line AA of FIG. 2) showing a state where the reticle pod RP is fixed to the container body 2 in the substrate storage container 1.
  • FIG. 4 is a cross-sectional perspective view (cross-sectional perspective view taken along the line AA of FIG. 2) showing a state in which the reticle pod RP is fixed to the container body 2 in the substrate storage container 1.
  • a direction (a direction from top to bottom in FIG. 2) from the container body 2 to be described later is defined as a front direction D11, and the opposite direction is defined as a rear direction D12. These are collectively defined as the front-back direction D1.
  • a direction (upward direction in FIG. 1) from a lower wall 24 to an upper wall 23, which will be described later, is defined as an upward direction D21, and an opposite direction is defined as a downward direction D22.
  • a direction (a direction from right to left in FIG. 1) from a second side wall 26 to a first side wall 25, which will be described later is defined as a left direction D31, and an opposite direction is defined as a right direction D32. Together, it is defined as the left-right direction D3.
  • the main drawings show arrows indicating these directions.
  • the reticle pod RP stored in the substrate storage container 1 is for storing one or more reticles used for performing an exposure process in semiconductor manufacturing, and as shown in FIG. Has a substantially rectangular parallelepiped shape, and has a shape in which the central portion is thicker than the peripheral portion.
  • the container body 2 of the substrate storage container 1 can be used for accommodating a substrate together with the lid body 3, and the substrate is a disk-shaped silicon wafer, glass wafer, sapphire wafer, etc. It is a thin one used.
  • the substrate that can be stored in the container body 2 and the lid 3 in this embodiment is a silicon wafer having a diameter of 300 mm.
  • the container body 2 and the lid body 3 of the substrate storage container 1 have a structure based on the SEMI standard, and the substrate made of the silicon wafer as described above is stored in the factory. It is used as an in-process container that is transported in the process of 1) or as a shipping container for transporting substrates by transportation means such as land transportation means, air transportation means, and sea transportation means.
  • the container body 2 has a cylindrical wall portion 20 in which a container body opening 21 is formed at one end and the other end is closed.
  • a pod accommodating space 27 is formed in the container body 2.
  • the pod accommodating space 27 is formed so as to be surrounded by the wall portion 20.
  • a pod mounting portion 50 as a positioning portion and a lower pressing portion 60 are arranged in a portion of the wall portion 20 that forms the pod housing space 27.
  • the pod accommodating space 27 can accommodate a reticle pod RP as one stored object.
  • the reticle pod RP is mounted on the pod mounting portion 50 and positioned in the pod housing space 27 with respect to the container body 2.
  • the downward pressing portion 60 presses the upper portion of the reticle pod RP toward the pod mounting portion 50.
  • the lid body 3 is attachable to and detachable from the opening peripheral edge portion 28 (FIG. 1 and the like) forming the container body opening portion 21 and can close the container body opening portion 21.
  • the substrate storage container 1 is made of a resin such as a plastic material, and examples of the resin of the material include polycarbonate, cycloolefin polymer, polyetherimide, polyetherketone, polybutylene terephthalate, polyetheretherketone, liquid crystal.
  • Thermoplastic resins such as polymers and alloys of these can be used.
  • conductive substances such as carbon fibers, carbon powder, carbon nanotubes, and conductive polymers are selectively added. Further, it is possible to add glass fiber, carbon fiber or the like in order to increase the rigidity.
  • the container body 2 uses COP (cycloolefin polymer) which is a low water absorption material.
  • the container body 2 is coated with an antistatic material.
  • the wall portion 20 of the container body 2 has an inner wall 22, an upper wall 23, a lower wall 24, a first side wall 25, and a second side wall 26.
  • the inner wall 22, the upper wall 23, the lower wall 24, the first side wall 25, and the second side wall 26 are made of the above-mentioned materials, and are integrally formed.
  • the first side wall 25 and the second side wall 26 face each other, and the upper wall 23 and the lower wall 24 face each other.
  • the rear end of the upper wall 23, the rear end of the lower wall 24, the rear end of the first side wall 25, and the rear end of the second side wall 26 are all connected to the back wall 22.
  • the front end of the upper wall 23, the front end of the lower wall 24, the front end of the first side wall 25, and the front end of the second side wall 26 form an opening peripheral edge portion 28 that forms the substantially rectangular container body opening 21.
  • the opening peripheral portion 28 is provided at one end of the container body 2, and the back wall 22 is located at the other end of the container body 2.
  • the outer shape of the container body 2 formed by the outer surface of the wall portion 20 is box-shaped.
  • the inner surface of the wall portion 20, that is, the inner surface of the back wall 22, the inner surface of the upper wall 23, the inner surface of the lower wall 24, the inner surface of the first side wall 25, and the inner surface of the second side wall 26 are surrounded by these pod housing spaces. 27 are formed.
  • the container body opening 21 formed in the opening peripheral portion 28 is surrounded by the wall portion 20 and communicates with a pod accommodating space 27 formed inside the container body 2.
  • latch engagement recess In the upper wall 23 and the lower wall 24, in the vicinity of the opening peripheral edge portion 28, there is formed a latch engagement recess not shown which is recessed outward of the pod accommodating space 27.
  • latch engagement recesses are formed near the left and right ends of the upper wall 23 and the lower wall 24, one in total.
  • ribs 235 are provided integrally with the upper wall 23.
  • the rib 235 enhances the rigidity of the container body 2.
  • a top flange 236 is fixed to the center of the upper wall 23.
  • the top flange 236 is a member that is a portion to be hung and hung in the substrate storage container 1 when suspending the substrate storage container 1 in an AMHS (automatic wafer transfer system), a PGV (wafer substrate transfer trolley) or the like.
  • a bottom plate 244 is fixed to the lower wall 24 as shown in FIG.
  • the bottom plate 244 has a substantially rectangular plate shape that is arranged so as to face substantially the entire lower surface that forms the outer surface of the lower wall 24, and is fixed to the lower wall 24.
  • the two through holes in the front portion of the lower wall 24 are exhaust holes for discharging the gas inside the container body 2, and the two through holes in the rear portion are in the container body 2. It is an air supply hole for supplying gas inside.
  • An unillustrated air supply filter part as an additional part is arranged in the through hole as the air supply hole, and an unillustrated exhaust gas filter part is arranged in the through hole as the exhaust hole. That is, the gas flow passages inside the air supply filter portion and the exhaust air filter portion constitute a part of a ventilation passage that allows the pod housing space 27 and the space outside the container body 2 to communicate with each other. Further, the air supply filter portion and the exhaust air filter portion are arranged on the wall portion 20, and in the air supply filter portion and the exhaust air filter portion, the space outside the container body 2 and the pod accommodating space 27. Gas can pass between and.
  • the air supply filter section communicates with the inner space of the gas ejection nozzle section 8, and the purge gas supplied to the air supply filter section is supplied to the pod accommodating space 27 through the inner space of the gas ejection nozzle section 8. Is configured.
  • the pod mounting portion 50 has a plate shape with a through hole formed in the central portion, and is fixed to the lower wall 24.
  • the pod mounting portion 50 has a convex portion 52 projecting upward, and a total of three pin member base portions 53 are provided so as to penetrate the portion of the convex portion 52 of the pod mounting portion 50. .. 3 and 4, only one pin member base 53 is shown.
  • a kinema pin 55 is provided on the upper portion of the pin member base 53 so as to cover the upper portion of the pin member base 53.
  • the kinema pin 55 projects upward from the convex portion 52, and a total of three kinema pins 55 are provided. It should be noted that only one kinema pin 55 is shown in each of FIGS. 3 and 4.
  • the reticle pod RP is placed on the pod placement portion 50, and as shown in FIG. 3 and the like, the kinematic pin 55 is engaged with the kinematic pin engagement groove formed on the bottom surface of the reticle pod RP, thereby the reticle pod RP.
  • the kinema pin 55 is provided with an antistatic material, and, together with the antistatic material provided on the container body 2 as described above, is configured to pass static electricity from the reticle inside the reticle pod RP. ing.
  • a pressing portion support portion 61 is fixedly provided on the upper wall 23.
  • a leaf spring 611 is fixed to the pressing portion support portion 61.
  • the upper portion of the leaf spring 611 is fixed to the pressing portion support portion 61, the leaf spring 611 extends downward, bends at a right angle in the rearward direction, and the tip end portion of the leaf spring 611 protrudes downward D22. It has a convex portion 6111.
  • the pressing portion support portion 61 supports the lower pressing portion 60, and the lower pressing portion 60 includes a tip end pressing portion 63, a pressing portion driving portion 64, and a spring (not shown) as a biasing member. ing.
  • the tip pressing portion 63 is made of ultra-high molecular weight PE (polyethylene) resin having high slidability and wear resistance, and has a substantially rectangular column shape.
  • a through hole is formed in the upper end portion of the tip end pressing portion 63, and the pin member 612 penetrates the through hole.
  • a long hole 632 extending in the longitudinal direction of the tip pressing portion 63 is formed in a portion of the tip pressing portion 63 closer to the lower end than the through hole, and the pin member 613 forming the pressing portion supporting portion 61 is long. It passes through the hole 632.
  • the pin member 613 can move relatively in the long hole 632, and thus the tip end pressing portion 63 can rotate about the pin member 613 as a rotation axis and can slide with respect to the pin member 613.
  • a lower end portion of the tip end pressing portion 63 has a plate-shaped contact portion 615 that can contact the upper portion of the reticle pod RP.
  • the plate-shaped contact portion 615 contacts the upper portion of the reticle pod RP, and the tip end pressing portion 63 presses the reticle pod RP toward the lower wall 24.
  • the pressing portion drive portion 64 is made of ultra-high molecular weight PE (polyethylene) resin having high slidability and wear resistance, and has a substantially square prism shape.
  • a through hole is formed in the rear end portion of the pressing portion drive portion 64, and a pin member 612 penetrating the upper end portion of the tip end pressing portion 63 penetrates the through hole.
  • the pressing portion drive portion 64 is rotatably connected to the tip end pressing portion 63.
  • An elongated hole 642 extending in the longitudinal direction of the pressing portion driving portion 64 is formed in the pressing portion driving portion 64 closer to the front side than the through hole, and the two pin members 616 forming the pressing portion supporting portion 61 are long. It penetrates the hole 642.
  • the pin member 616 is relatively movable in the long hole 642, so that the pressing portion driving unit 64 makes a predetermined angle with the pin member 616 with respect to the front-rear direction D1 which is parallel to the horizontal direction. Can be slid upward.
  • a front concave portion 644 and a rear concave portion 645 are formed on the upper portion of the pressing portion driving portion 64.
  • the pressing portion driving portion 64 causes the plate-shaped abutting portion 615 of the pressing portion driving portion 63 to engage the plate-shaped abutting portion 615 of the reticle pod RP on the reticle pod RP.
  • the reticle pod RP is temporarily fixed so as not to move in the substantially front-back direction D1.
  • the pressing portion driving portion 64 causes the plate-shaped abutting portion 615 of the distal portion pressing portion 63 to move the reticle, as shown in FIG.
  • the reticle pod RP is temporarily temporarily fixed so that it cannot be moved in the front-back direction D1. Is configured. Note that in the cross-sectional views of FIGS. 5 and 6, the cross-section of the reticle pod RP is omitted.
  • the pressing portion drive unit 64 moves diagonally above the horizontal direction at a predetermined angle with the movement. It can be moved in any direction.
  • the front end portion of the pressing portion drive portion 64 has a hook-shaped portion 647 that constitutes a drive portion engagement portion.
  • the spring (not shown) is arranged so that the tip portion pressing portion 63 is separated from the reticle pod RP, and more specifically, the pressing portion driving portion 64 is moved in the substantially forward direction D11. Is provided by engaging with and urges the pressing portion drive portion 64.
  • the lid 3 has a substantially rectangular shape that substantially matches the shape of the opening peripheral edge portion 28 of the container body 2.
  • the lid body 3 is attachable to and detachable from the opening peripheral edge portion 28 of the container body 2, and the lid body 3 can close the container body opening portion 21 by mounting the lid body 3 on the opening peripheral edge portion 28. ..
  • An annular seal member 4 is attached to the surface facing the surface (sealing surface 281) of the formed step.
  • the seal member 4 is made of elastically deformable polyester-based or polyolefin-based thermoplastic elastomer, fluororubber, silicon rubber, or the like.
  • the seal member 4 is arranged so as to go around the outer peripheral edge portion of the lid body 3.
  • the seal member 4 When the lid body 3 is attached to the opening peripheral edge portion 28, the seal member 4 is elastically deformed by being sandwiched between the sealing surface 281 and the inner surface of the lid body 3, and the lid body 3 seals the container body opening portion 21. Closed in a closed state. By removing the lid body 3 from the opening peripheral edge portion 28, the reticle pod RP can be taken in and out of the pod accommodating space 27 in the container body 2.
  • the lid 3 is provided with a latch mechanism.
  • the latch mechanism is provided in the vicinity of both left and right ends of the lid body 3, and as shown in FIG. 5, two upper latch portions 32A capable of projecting from the upper side of the lid body 3 in the upward direction D21, and the lid body 3 of the lid body 3.
  • Two lower latch portions 32B capable of projecting from the lower side in the downward direction D22 are provided.
  • the two upper latch portions 32A, 32A are arranged near the left and right ends of the upper side of the lid body 3, and the two lower latch portions 32B, 32B are arranged near the left and right ends of the lower side of the lid body 3. ..
  • an operation portion 33 is provided on the outer surface of the lid body 3.
  • the upper latch portion 32A and the lower latch portion 32B can be made to project from the upper side and the lower side of the lid body 3, and the upper side and the lower side are not allowed to project. can do.
  • the upper latch portion 32A projects from the upper side of the lid body 3 in the upward direction D21 and engages with a latch engagement recess (not shown) of the container body 2, and the lower latch portion 32B extends from the lower side of the lid body 3 in the downward direction D22.
  • the lid body 3 is fixed to the opening peripheral edge portion 28 of the container body 2 by protruding to and engaging with a latch engagement concave portion (not shown) of the container body 2.
  • a concave portion 301 that is recessed outward of the pod housing space 27 is formed inside the lid body 3.
  • a pressing portion engaged portion 303 is fixedly provided in the concave portion 301.
  • the pressing portion engaged portion 303 is fixed to the concave portion 301 in the upper portion of the lid 3. As shown in FIG. 5, the pressing portion engaged portion 303 is composed of a member having a thickness in the front-back direction Si 1, and the lower end portion of the pressing portion engaged portion 303 has a pressing portion engaged portion 303. Has a hook-shaped portion 304. The hook-shaped portion 304 of the pressing portion engaged portion 303 can be engaged with the hook-shaped portion 647 of the pressing portion driving portion 64.
  • FIG. 5 is a side sectional view showing a state in which the reticle pod RP is not fixed to the container body 2 in the substrate storage container 1.
  • FIG. 6 is a cross-sectional perspective view showing a state in which the reticle pod RP is not fixed to the container body 2 in the substrate storage container 1.
  • the lid 3 is removed from the opening peripheral portion 28 forming the container body opening 21.
  • the reticle pod RP is inserted into the pod accommodating space 27, and the tip of the kinematic pin 55 is engaged with the kinematic pin engaging groove formed on the bottom surface of the reticle pod RP, so that the reticle pod RP is attached to the container body 2.
  • the tip of the kinematic pin 55 is engaged with the kinematic pin engaging groove formed on the bottom surface of the reticle pod RP, so that the reticle pod RP is attached to the container body 2.
  • the lid body 3 closes the container body opening 21. Then, by operating the operation portion 33 of the lid body 3, the upper latch portion 32A and the lower latch portion 32B are engaged with the latch engagement recesses (not shown) of the container body 2, whereby the lid body 3 It is fixed to the opening peripheral edge portion 28 of the main body 2.
  • the lid body 3 When taking out the reticle pod RP from the substrate storage container 1, first, by operating the operation part 33 of the lid body 3, the upper latch part 32A and the lower latch part 32B are brought into latch engagement recesses (not shown) of the container body 2. Not engaged. Next, the lid 3 is separated from the container body opening 21. Along with this, since the hook-shaped portion 304 of the pressing portion engaged portion 303 is engaged with the hook-shaped portion 647 of the pressing portion driving portion 64, the pressing portion driving portion 64 is pulled by the lid body 3, It moves obliquely downward in a predetermined angle with respect to the front direction D11.
  • the lid body 3 moves horizontally in the forward direction D11, so that the hook-shaped portion of the pressing portion drive portion 64 is formed. 647 is located below the hook-shaped portion 304 of the pressing portion engaged portion 303, and the hook-shaped portion 647 of the pressing portion driving portion 64 engages with the hook-shaped portion 304 of the pressing portion engaged portion 303. Is released, the lid 3 is separated from the pressing portion drive unit 64, and the lid 3 is removed from the container body 2.
  • the lower wall 24 is provided with the pod mounting portion 50 as a positioning portion for positioning the reticle pod RP as the contained object with respect to the container body 2, and the upper wall 23 is provided with the reticle pod RP.
  • a lower pressing portion 60 that presses the upper portion toward the lower wall 24 is provided, and when the lid 3 closes the container body opening 21, the lower pressing portion 60 pushes the upper portion of the reticle pod RP toward the lower wall 24. To press.
  • the reticle pod RP can be easily fixed to the container body 2 by closing the container body opening 21 with the lid 3, and the procedure of storing the reticle pod RP in the substrate storage container 1 can be performed. , It becomes possible to do more smoothly. Further, since the reticle pod RP is housed in the substrate housing container 1, it is possible to prevent particles from adhering to the outer surface of the reticle pod RP. As a result, when the reticle is taken out from the reticle pod RP, it is possible to prevent particles from adhering to and contaminating the reticle, thereby preventing the circuit failure of the wafer.
  • the design rules have been miniaturized, and it is necessary to more strictly control particles, but this can be sufficiently dealt with.
  • the substrate storage container 1 is used as a container for storing the reticle pod RP, the size as a container for storing the reticle pod RP is also suitable, and an automatic transfer device for transferring the substrate storage container 1 is also standard. Therefore, the reticle pod RP can be smoothly introduced into the process of transporting it.
  • the lid 3 has a pressing portion engaged portion 303 with which the downward pressing portion 60 can be engaged, and when the container body opening portion 21 is closed, the pressing portion engaged portion 303 causes the downward pressing portion 60.
  • the lower pushing portion 60 pushes the upper portion of the reticle pod RP, which is an object to be housed, toward the lower wall 24 by engaging with the hook-shaped portion 647 of the pushing portion driving portion 64 constituting the above.
  • the pressing portion engaged portion 303 of the lid body 3 and the driving portion engaging portion of the lower pressing portion 60 that engages with the pressing portion engaged portion 303 engage with each other hook-shaped portions 304 and 647. have. With this configuration, it is possible to press the reticle pod RP by the tip end pressing portion 63 of the lower pressing portion 60 as the lid 3 moves.
  • the downward pressing portion 60 biases the pressing portion driving portion 64 so that the tip end pressing portion 63 is separated from the reticle pod RP when the lid body 3 does not close the container body opening portion 21.
  • a spring (not shown) is provided as a biasing member.
  • the pressing unit driving unit 64 can move in an obliquely upward direction forming a predetermined angle with respect to the horizontal direction.
  • the hook-shaped portion 304 of the pressing portion engaged portion 303 can be engaged with the hook-shaped portion 647 of the pressing portion driving portion 64.
  • the engagement between the hook-shaped portion 304 of the pressing portion engaged portion 303 and the hook-shaped portion 647 of the pressing portion driving portion 64 is automatically performed. It is possible to cancel.
  • the upper portion of the tip end pressing portion 63 is pushed toward the back wall 22 by the pushing portion drive portion 64, so that the lower portion of the tip end pressing portion 63 moves from the back wall 22 side to the container body opening 21 side.
  • the material forming the wall portion 20 is composed of a cycloolefin polymer.
  • the pod housing space 27 has a ventilation path that allows the pod housing space 27 and the space outside the container body 2 to communicate with each other. With this configuration, the gas in the pod housing space 27 can be purged with the purge gas.
  • the container body and the lid body are composed of the container body 2 and the lid body 3 of the substrate storage container capable of housing the silicon wafer having a diameter of 300 mm, but the present invention is not limited to this.
  • Any container can be used as long as it can accommodate the reticle pod RP.
  • a container having a structure imitating a substrate storage container that is, a container body opening communicating with the pod housing space is formed at one end and the other end is formed. It may be configured by a container having a structure in which the is closed.
  • the contained object is the reticle pod RP, but it is not limited to this.
  • the configuration of each part of the substrate storage container is not limited to the configuration of each part of the substrate storage container 1 in the present embodiment.
  • the two through holes in the front portion of the lower wall 24 are exhaust holes for discharging the gas inside the container body 2, and the two through holes in the rear portion are the through holes.
  • it was an air supply hole for supplying gas into the inside of the it is not limited to this configuration.
  • at least one of the two through holes in the front portion of the lower wall may be an air supply hole for supplying gas into the container body.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
PCT/JP2018/045728 2018-12-12 2018-12-12 基板収納容器 WO2020121448A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020559615A JP7257418B2 (ja) 2018-12-12 2018-12-12 基板収納容器
KR1020217019667A KR102632741B1 (ko) 2018-12-12 2018-12-12 기판수납용기
PCT/JP2018/045728 WO2020121448A1 (ja) 2018-12-12 2018-12-12 基板収納容器
CN201880100090.8A CN113396113B (zh) 2018-12-12 2018-12-12 基板收纳容器
TW108145108A TWI816950B (zh) 2018-12-12 2019-12-10 基板收納容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/045728 WO2020121448A1 (ja) 2018-12-12 2018-12-12 基板収納容器

Publications (1)

Publication Number Publication Date
WO2020121448A1 true WO2020121448A1 (ja) 2020-06-18

Family

ID=71075306

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/045728 WO2020121448A1 (ja) 2018-12-12 2018-12-12 基板収納容器

Country Status (5)

Country Link
JP (1) JP7257418B2 (ko)
KR (1) KR102632741B1 (ko)
CN (1) CN113396113B (ko)
TW (1) TWI816950B (ko)
WO (1) WO2020121448A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023122029A1 (en) * 2021-12-22 2023-06-29 Entegris, Inc. Polymer blends for microenvironments

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002370777A (ja) * 2001-06-12 2002-12-24 Sony Corp 保管容器および保管容器の蓋体の開放構造
JP2007019328A (ja) * 2005-07-08 2007-01-25 Shin Etsu Polymer Co Ltd 基板収納容器の蓋体開閉方法
JP2016091765A (ja) * 2014-11-04 2016-05-23 リコーイメージング株式会社 電池収納機構及び撮像装置
US20180102269A1 (en) * 2016-10-07 2018-04-12 Gudeng Precision Industrial Co., Ltd Vertical fixing transmission box and transmission method using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4218260B2 (ja) * 2002-06-06 2009-02-04 東京エレクトロン株式会社 被処理体の収納容器体及びこれを用いた処理システム
JP4634772B2 (ja) * 2004-10-14 2011-02-16 ミライアル株式会社 収納容器
WO2015057739A1 (en) * 2013-10-14 2015-04-23 Entegris, Inc. Towers for substrate carriers
JP6536090B2 (ja) * 2015-03-06 2019-07-03 シンフォニアテクノロジー株式会社 搬送装置
JP6493339B2 (ja) 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
KR102050007B1 (ko) 2017-03-07 2020-01-08 서강대학교산학협력단 블록체인 기반 외부 서비스 지원 시스템 및 그 방법
KR102150670B1 (ko) * 2018-11-01 2020-09-01 세메스 주식회사 스토커

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002370777A (ja) * 2001-06-12 2002-12-24 Sony Corp 保管容器および保管容器の蓋体の開放構造
JP2007019328A (ja) * 2005-07-08 2007-01-25 Shin Etsu Polymer Co Ltd 基板収納容器の蓋体開閉方法
JP2016091765A (ja) * 2014-11-04 2016-05-23 リコーイメージング株式会社 電池収納機構及び撮像装置
US20180102269A1 (en) * 2016-10-07 2018-04-12 Gudeng Precision Industrial Co., Ltd Vertical fixing transmission box and transmission method using the same

Also Published As

Publication number Publication date
JP7257418B2 (ja) 2023-04-13
KR20210099032A (ko) 2021-08-11
TWI816950B (zh) 2023-10-01
CN113396113A (zh) 2021-09-14
CN113396113B (zh) 2023-03-28
KR102632741B1 (ko) 2024-02-01
TW202036764A (zh) 2020-10-01
JPWO2020121448A1 (ja) 2021-11-18

Similar Documents

Publication Publication Date Title
JP6450156B2 (ja) ガスパージ用フィルタ
TWI722583B (zh) 基板收納容器
WO2016002005A1 (ja) 基板収納容器
JP6854341B2 (ja) 基板収納容器
WO2020121448A1 (ja) 基板収納容器
TWI691445B (zh) 基板收納容器
TWI802650B (zh) 氣體吹掃用埠
JP7032521B2 (ja) 基板収納容器
JP2007142192A (ja) 薄板体収納容器
WO2022168287A1 (ja) 基板収納容器及びフィルタ部
WO2021020460A1 (ja) 基板収納容器及びフィルタ部
JP6498758B2 (ja) 基板収納容器
WO2022009430A1 (ja) 基板収納容器
WO2021234809A1 (ja) 基板収納容器
WO2022208602A1 (ja) 基板収納容器
WO2020122261A2 (ja) 基板収納容器
JP2016119408A (ja) 基板収納容器
TWI652211B (zh) Substrate storage container and holding member
WO2024105879A1 (ja) 収納容器及びアダプター部材
WO2021019700A1 (ja) 基板収納容器
JP7453822B2 (ja) 基板収納容器
WO2021019699A1 (ja) 基板収納容器及びフィルタ部
WO2023017591A1 (ja) 基板収納容器
WO2018154778A1 (ja) 基板収納容器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18942655

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020559615

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20217019667

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 18942655

Country of ref document: EP

Kind code of ref document: A1