JP6536090B2 - 搬送装置 - Google Patents
搬送装置 Download PDFInfo
- Publication number
- JP6536090B2 JP6536090B2 JP2015044849A JP2015044849A JP6536090B2 JP 6536090 B2 JP6536090 B2 JP 6536090B2 JP 2015044849 A JP2015044849 A JP 2015044849A JP 2015044849 A JP2015044849 A JP 2015044849A JP 6536090 B2 JP6536090 B2 JP 6536090B2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- storage container
- gas
- internal space
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Description
循環ダクトのうち、側面視における被搬送物の搬送ラインよりも下側の流路を、搬送ラインよりも上側の流路よりも広く設定していることを特徴としている。
2…ドア開閉装置
21…フレーム
21a…開口
22…ドア部
23…載置台
26…ボトムパージ部
261…ボトムパージ注入用ノズル
3…搬送室
31…搬送ロボット
4…収納容器
4S…収納容器の内部空間
5…チャンバ
5S…チャンバの内部空間
6…圧力調整部
61…ガス排出部
62…ガス排気経路(排気チューブ)
63…ガス導入部
W…被搬送物
Claims (6)
- 搬送室と、
前記搬送室の壁面に設けられ、且つ内部空間に被搬送物を収納可能な収納容器と前記搬送室との間で前記被搬送物の出し入れを行うためのドア開閉装置と、
前記搬送室内に設けられ、且つ前記ドア開閉装置に載置された前記収納容器と前記搬送室と間で前記被搬送物を出し入れ可能な搬送ロボットとを備えた搬送装置であって、
前記ドア開閉装置は、
前記搬送室の壁面の一部を構成し、当該搬送室内を開放するための開口が形成された板状をなすフレームと、
前記開口を開閉可能なドア部と、
前記収納容器を載置可能な載置台と、
前記搬送室側において前記開口と対向する位置に設けられ、且つ環境ガスによってパージ処理される内部空間を有するチャンバと、
前記開口とは別の経路を用いて前記チャンバの内部空間と前記収納容器の内部空間を相互に連通させる圧力調整部とを備えたものであり、
さらに、前記搬送室の内部空間でダウンフローを形成するガスを循環させる循環ダクトを備え、当該循環ダクトは、前記搬送室の壁面と当該搬送室の内部空間とを区画する区画壁によって形成したものであり、
前記載置台に載置した前記収納容器と前記フレームが並ぶ方向を前後方向とした場合、側面視において前記循環ダクトは上方に向かって段状に狭まる流路を有するものであり、
前記循環ダクトのうち、側面視における前記被搬送物の搬送ラインよりも下側の流路を、前記搬送ラインよりも上側の流路よりも広く設定していることを特徴とする搬送装置。 - 前記区画壁は、前記搬送室のうち前記ドア開閉装置を配置した壁面に対向する壁面と当該搬送室の内部空間とを区画するものである請求項1に記載の搬送装置。
- 前記チャンバは、当該チャンバの内部空間に環境ガスを供給するガス供給部を備えたものである請求項1又は2に記載の搬送装置。
- 前記搬送室の側面の一方または両方に、前記被搬送物の載置ステーションを配置している請求項1乃至3の何れかに記載の搬送装置。
- 前記被搬送物は半導体ウェーハであり、前記載置ステーションはバッファステーションまたはアライナである請求項4に記載の搬送装置。
- 前記ドア開閉装置が、前記載置台上の所定箇所に複数設けたノズルを用いて前記収納容器内の気体雰囲気を環境ガスに置換可能なボトムパージ部を備えたものであり、前記複数のノズルのうち所定数のノズルを前記収納容器の内部空間に前記環境ガスを導入するガス導入部として機能させている請求項1乃至5の何れかに記載の搬送装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015044849A JP6536090B2 (ja) | 2015-03-06 | 2015-03-06 | 搬送装置 |
TW104144483A TW201633436A (zh) | 2015-03-06 | 2015-12-30 | 門開閉裝置、搬運裝置、分類裝置、收納容器之開放方法 |
KR1020160016070A KR20160108141A (ko) | 2015-03-06 | 2016-02-12 | 도어 개폐 장치, 반송 장치, 소터 장치, 수납 용기의 개방 방법 |
US15/057,326 US20160260627A1 (en) | 2015-03-06 | 2016-03-01 | Door opening and closing apparatus, transfer apparatus, and storage container opening method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015044849A JP6536090B2 (ja) | 2015-03-06 | 2015-03-06 | 搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016164929A JP2016164929A (ja) | 2016-09-08 |
JP6536090B2 true JP6536090B2 (ja) | 2019-07-03 |
Family
ID=56850026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015044849A Active JP6536090B2 (ja) | 2015-03-06 | 2015-03-06 | 搬送装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160260627A1 (ja) |
JP (1) | JP6536090B2 (ja) |
KR (1) | KR20160108141A (ja) |
TW (1) | TW201633436A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160058499A (ko) * | 2014-11-17 | 2016-05-25 | 삼성전자주식회사 | 반도체 소자, 및 그 반도체 소자의 제조방법과 제조장치 |
JP6451453B2 (ja) * | 2015-03-31 | 2019-01-16 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
TWI708309B (zh) * | 2015-08-04 | 2020-10-21 | 日商昕芙旎雅股份有限公司 | 門開閉系統及具備門開閉系統之載入埠 |
TWI727562B (zh) * | 2015-08-04 | 2021-05-11 | 日商昕芙旎雅股份有限公司 | 裝載埠 |
KR101756743B1 (ko) * | 2016-12-30 | 2017-07-12 | 김태훈 | 웨이퍼 가공 설비용 버퍼 챔버 유닛 |
CN106910701B (zh) * | 2017-03-10 | 2020-01-10 | 上海华力微电子有限公司 | 一种设置开闭侦测装置的处理槽 |
US11133208B2 (en) * | 2017-05-31 | 2021-09-28 | Tdk Corporation | EFEM and method of introducing dry air thereinto |
US10566216B2 (en) * | 2017-06-09 | 2020-02-18 | Lam Research Corporation | Equipment front end module gas recirculation |
KR102206194B1 (ko) * | 2017-09-26 | 2021-01-22 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치 및 반도체 장치의 제조 방법 |
JP7037049B2 (ja) * | 2018-03-15 | 2022-03-16 | シンフォニアテクノロジー株式会社 | Efem |
JP6963179B2 (ja) * | 2018-03-15 | 2021-11-05 | シンフォニアテクノロジー株式会社 | Efem |
US10403514B1 (en) * | 2018-04-12 | 2019-09-03 | Asm Ip Holding B.V. | Substrate transporting system, storage medium and substrate transporting method |
CN110473819B (zh) * | 2018-05-11 | 2020-12-08 | 北京北方华创微电子装备有限公司 | 一种开门装置、传输腔室和半导体处理设备 |
CN113396113B (zh) * | 2018-12-12 | 2023-03-28 | 未来儿股份有限公司 | 基板收纳容器 |
JP7299474B2 (ja) * | 2019-03-13 | 2023-06-28 | シンフォニアテクノロジー株式会社 | Efem |
KR102300629B1 (ko) * | 2019-09-06 | 2021-09-09 | 세메스 주식회사 | 가스 실린더 보관 장치 |
CN114121745B (zh) | 2021-11-26 | 2022-10-11 | 上海果纳半导体技术有限公司 | 一种用于晶圆装载盒门体的摆放系统 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4927438A (en) * | 1987-12-01 | 1990-05-22 | Varian Associates, Inc. | Horizontal laminar air flow work station |
JP3425592B2 (ja) * | 1997-08-12 | 2003-07-14 | 東京エレクトロン株式会社 | 処理装置 |
JP2000150613A (ja) * | 1998-11-17 | 2000-05-30 | Tokyo Electron Ltd | 被処理体の搬送装置 |
US7135001B2 (en) | 2001-03-20 | 2006-11-14 | Ric Investments, Llc | Rebreathing methods including oscillating, substantially equal rebreathing and nonrebreathing periods |
US7314808B2 (en) * | 2004-12-23 | 2008-01-01 | Applied Materials, Inc. | Method for sequencing substrates |
JP5100265B2 (ja) * | 2007-09-03 | 2012-12-19 | 株式会社東芝 | ウエハ移送システム中の清浄度評価方法 |
JP2012146721A (ja) * | 2011-01-07 | 2012-08-02 | Hitachi High-Technologies Corp | 真空処理装置 |
JP2014116441A (ja) | 2012-12-10 | 2014-06-26 | Hitachi High-Tech Manufacturing & Service Corp | 半導体ウェーハ処理装置及び除電システム |
-
2015
- 2015-03-06 JP JP2015044849A patent/JP6536090B2/ja active Active
- 2015-12-30 TW TW104144483A patent/TW201633436A/zh unknown
-
2016
- 2016-02-12 KR KR1020160016070A patent/KR20160108141A/ko unknown
- 2016-03-01 US US15/057,326 patent/US20160260627A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2016164929A (ja) | 2016-09-08 |
TW201633436A (zh) | 2016-09-16 |
KR20160108141A (ko) | 2016-09-19 |
US20160260627A1 (en) | 2016-09-08 |
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