JP2016164929A - ドア開閉装置、搬送装置、ソータ装置、収納容器の開放方法 - Google Patents
ドア開閉装置、搬送装置、ソータ装置、収納容器の開放方法 Download PDFInfo
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- JP2016164929A JP2016164929A JP2015044849A JP2015044849A JP2016164929A JP 2016164929 A JP2016164929 A JP 2016164929A JP 2015044849 A JP2015044849 A JP 2015044849A JP 2015044849 A JP2015044849 A JP 2015044849A JP 2016164929 A JP2016164929 A JP 2016164929A
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- 230000007246 mechanism Effects 0.000 description 16
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- 210000000078 claw Anatomy 0.000 description 7
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- 229910001873 dinitrogen Inorganic materials 0.000 description 6
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
Abstract
Description
2…ドア開閉装置
21…フレーム
21a…開口
22…ドア部
23…載置台
26…ボトムパージ部
261…ボトムパージ注入用ノズル
3…搬送室
31…搬送ロボット
4…収納容器
4S…収納容器の内部空間
5…チャンバ
5S…チャンバの内部空間
6…圧力調整部
61…ガス排出部
62…ガス排気経路(排気チューブ)
63…ガス導入部
W…被搬送物
Claims (7)
- 搬送室に隣接して設けられ、内部空間に被搬送物を収納可能な収納容器と前記搬送室との間で前記被搬送物の出し入れを行うためのドア開閉装置であって、
前記搬送室の壁面の一部を構成し、当該搬送室内を開放するための開口が形成された板状をなすフレームと、
前記開口を開閉可能なドア部と、
前記収納容器を載置可能な載置台と、
前記搬送室側において前記開口と対向する位置に設けられ、且つ環境ガスによってパージ処理される内部空間を有するチャンバと、
前記開口とは別の経路を用いて前記チャンバの内部空間と前記収納容器の内部空間を相互に連通させる圧力調整部とを備えていることを特徴とするドア開閉装置。 - 前記圧力調整部は、前記チャンバの内部空間に供給した環境ガスを当該チャンバの外部に排出するガス排出部と、上流端を前記ガス排出部に連結させたガス排気経路と、前記ガス排気経路の下流端が連結され、且つ当該ガス排気経路を通じて前記収納容器の内部空間に前記環境ガスを導入するガス導入部とを備えている請求項1に記載のドア開閉装置。
- 前記載置台上の所定箇所に複数設けたノズルを用いて前記収納容器内の気体雰囲気を環境ガスに置換可能なボトムパージ部を備え、
前記ガス導入部を、前記ノズルとは別に設けた専用のノズルで構成している請求項1又は2に記載のドア開閉装置。 - 前記載置台上の所定箇所に複数設けたノズルを用いて前記収納容器内の気体雰囲気を環境ガスに置換可能なボトムパージ部を備え、
前記複数のノズルのうち所定数のノズルを前記ガス導入部として機能させている請求項1又は2に記載のドア開閉装置。 - 前記搬送室と、前記搬送室の壁面に設けた請求項1乃至4の何れかに記載のドア開閉装置と、前記搬送室内に設けられ、且つ前記ドア開閉装置の前記載置台上に載置された前記収納容器と前記搬送室と間で前記被搬送物を出し入れ可能な搬送ロボットとを備えていることを特徴とする搬送装置。
- 前記搬送室と、前記搬送室の壁面に複数設けた請求項1乃至4の何れかに記載のドア開閉装置と、前記搬送室内に設けられ、且つ少なくとも複数の前記ドア開閉装置の前記載置台上に載置された前記収納容器同士の間で前記被搬送物を出し入れ可能な搬送ロボットとを備えていることを特徴とするソータ装置。
- 蓋部によって内部空間が密閉されている収納容器を請求項1乃至4の何れかに記載のドア開閉装置の前記載置台上に載置した状態で、前記蓋部を前記ドア部とともに移動させて、前記開口を通じて前記収納容器の内部空間を前記チャンバの内部空間に向かって開放させる際に適用される収納容器の開放方法であり、
前記収納容器の内部空間を密閉した状態で前記チャンバの内部空間に対して環境ガスによるパージ処理を行い、当該パージ処理が施された前記チャンバの内部空間から、前記開口とは別の経路を用いた前記圧力調整部によって前記収納容器の内部空間に対して前記チャンバ内の環境ガスを導入して、前記収納容器の内部空間の圧力を前記チャンバの内部空間の圧力と均一にする圧力調整ステップに続いて、前記蓋部を前記ドア部とともに移動させて、前記開口を通じて前記収納容器の内部空間を前記チャンバの内部空間に向かって開放させることを特徴とする収納容器の開放方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015044849A JP6536090B2 (ja) | 2015-03-06 | 2015-03-06 | 搬送装置 |
TW104144483A TW201633436A (zh) | 2015-03-06 | 2015-12-30 | 門開閉裝置、搬運裝置、分類裝置、收納容器之開放方法 |
KR1020160016070A KR20160108141A (ko) | 2015-03-06 | 2016-02-12 | 도어 개폐 장치, 반송 장치, 소터 장치, 수납 용기의 개방 방법 |
US15/057,326 US20160260627A1 (en) | 2015-03-06 | 2016-03-01 | Door opening and closing apparatus, transfer apparatus, and storage container opening method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015044849A JP6536090B2 (ja) | 2015-03-06 | 2015-03-06 | 搬送装置 |
Publications (2)
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JP2016164929A true JP2016164929A (ja) | 2016-09-08 |
JP6536090B2 JP6536090B2 (ja) | 2019-07-03 |
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JP2015044849A Active JP6536090B2 (ja) | 2015-03-06 | 2015-03-06 | 搬送装置 |
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US (1) | US20160260627A1 (ja) |
JP (1) | JP6536090B2 (ja) |
KR (1) | KR20160108141A (ja) |
TW (1) | TW201633436A (ja) |
Cited By (4)
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JP2020150091A (ja) * | 2019-03-13 | 2020-09-17 | シンフォニアテクノロジー株式会社 | Efem |
KR20210029423A (ko) * | 2019-09-06 | 2021-03-16 | 세메스 주식회사 | 가스 실린더 보관 장치 |
JP2021521656A (ja) * | 2018-05-11 | 2021-08-26 | ベイジン・ナウラ・マイクロエレクトロニクス・イクイップメント・カンパニー・リミテッドBeijing NAURA Microelectronics Equipment Co.,LTD | ドアオープナ、輸送チャンバ、及び半導体処理デバイス |
JP7256574B1 (ja) | 2021-11-26 | 2023-04-12 | 上海果納半導体技術有限公司 | ウェハポッドドア用の配置システム |
Families Citing this family (13)
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KR20160058499A (ko) * | 2014-11-17 | 2016-05-25 | 삼성전자주식회사 | 반도체 소자, 및 그 반도체 소자의 제조방법과 제조장치 |
JP6451453B2 (ja) * | 2015-03-31 | 2019-01-16 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
TWI788061B (zh) * | 2015-08-04 | 2022-12-21 | 日商昕芙旎雅股份有限公司 | 門開閉系統及具備門開閉系統之載入埠 |
TWI727562B (zh) * | 2015-08-04 | 2021-05-11 | 日商昕芙旎雅股份有限公司 | 裝載埠 |
KR101756743B1 (ko) * | 2016-12-30 | 2017-07-12 | 김태훈 | 웨이퍼 가공 설비용 버퍼 챔버 유닛 |
CN106910701B (zh) * | 2017-03-10 | 2020-01-10 | 上海华力微电子有限公司 | 一种设置开闭侦测装置的处理槽 |
US11133208B2 (en) * | 2017-05-31 | 2021-09-28 | Tdk Corporation | EFEM and method of introducing dry air thereinto |
US10566216B2 (en) * | 2017-06-09 | 2020-02-18 | Lam Research Corporation | Equipment front end module gas recirculation |
KR102206194B1 (ko) * | 2017-09-26 | 2021-01-22 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치 및 반도체 장치의 제조 방법 |
JP6963179B2 (ja) * | 2018-03-15 | 2021-11-05 | シンフォニアテクノロジー株式会社 | Efem |
JP7037049B2 (ja) * | 2018-03-15 | 2022-03-16 | シンフォニアテクノロジー株式会社 | Efem |
US10403514B1 (en) * | 2018-04-12 | 2019-09-03 | Asm Ip Holding B.V. | Substrate transporting system, storage medium and substrate transporting method |
CN113396113B (zh) * | 2018-12-12 | 2023-03-28 | 未来儿股份有限公司 | 基板收纳容器 |
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2015
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- 2015-12-30 TW TW104144483A patent/TW201633436A/zh unknown
-
2016
- 2016-02-12 KR KR1020160016070A patent/KR20160108141A/ko unknown
- 2016-03-01 US US15/057,326 patent/US20160260627A1/en not_active Abandoned
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JP2021521656A (ja) * | 2018-05-11 | 2021-08-26 | ベイジン・ナウラ・マイクロエレクトロニクス・イクイップメント・カンパニー・リミテッドBeijing NAURA Microelectronics Equipment Co.,LTD | ドアオープナ、輸送チャンバ、及び半導体処理デバイス |
JP7223123B2 (ja) | 2018-05-11 | 2023-02-15 | ベイジン・ナウラ・マイクロエレクトロニクス・イクイップメント・カンパニー・リミテッド | ドアオープナ、輸送チャンバ、及び半導体処理デバイス |
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JP7256574B1 (ja) | 2021-11-26 | 2023-04-12 | 上海果納半導体技術有限公司 | ウェハポッドドア用の配置システム |
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Also Published As
Publication number | Publication date |
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KR20160108141A (ko) | 2016-09-19 |
US20160260627A1 (en) | 2016-09-08 |
TW201633436A (zh) | 2016-09-16 |
JP6536090B2 (ja) | 2019-07-03 |
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