WO2020107831A1 - 柔性显示面板及其制造方法、柔性显示装置 - Google Patents

柔性显示面板及其制造方法、柔性显示装置 Download PDF

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Publication number
WO2020107831A1
WO2020107831A1 PCT/CN2019/088647 CN2019088647W WO2020107831A1 WO 2020107831 A1 WO2020107831 A1 WO 2020107831A1 CN 2019088647 W CN2019088647 W CN 2019088647W WO 2020107831 A1 WO2020107831 A1 WO 2020107831A1
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WIPO (PCT)
Prior art keywords
layer
display panel
flexible display
protective layer
trace
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2019/088647
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English (en)
French (fr)
Inventor
毛祖攀
朱阳杰
魏博
陆海峰
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Publication of WO2020107831A1 publication Critical patent/WO2020107831A1/zh
Priority to US16/997,175 priority Critical patent/US11443658B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a flexible display panel, a manufacturing method thereof, and a flexible display device.
  • the display device is a device for displaying a screen of characters, numbers, symbols, pictures, or an image formed by a combination of at least two types of characters, numbers, symbols, and pictures.
  • the display device may be a flat display device, a curved display device, a 3D display device, a near-eye display device, an AR/VR display device, etc.
  • a flexible display device including a flexible display panel, which includes a display area and a display
  • some non-display areas will be used as the bending area, and the bending area is bent to the back of the flexible display panel, for example, the area where the driving chip is located
  • There may be a large number of traces in the bending area which are used to transmit signals for realizing display, touch and other functions of the flexible display device.
  • the embodiments of the present disclosure provide a flexible display panel, a manufacturing method thereof, and a flexible display device, which are used to solve the problem that when the bending area in the flexible display panel is bent, the wiring in the bending area is likely to crack or even The technical problem that the conductive function of the trace is adversely affected by the break.
  • a first aspect of an embodiment of the present disclosure provides a flexible display panel, including a display area and a bending area located around the display area.
  • the bending area includes: a flexible substrate; an adjustment layer covering the entire flexible substrate Bottom; protective layer, located on the adjustment layer; trace, located on the protective layer; planarization layer, located above the trace, and covering the functional film layer on the flexible substrate, wherein the protection A protective layer corresponding to the traces in the bending zone, the orthographic projection of the traces in the bending zone on the flexible substrate falls into the positive plane of the protective layer on the flexible substrate In the projection; when the bending zone is bent, the bending stress is released through the interface between the adjustment layer and the protective layer, so as to alleviate what the protective layer bears when the bending zone is bent stress.
  • an adjustment layer is provided on the flexible substrate, and a protective layer is provided under the wiring, and an interface is formed between the protective layer and the adjustment layer.
  • the interface releases the bending stress when the bending zone is bent, so as to alleviate the stress on the protective layer when the bending zone is bent, so as to reduce the occurrence of cracks or even breakage of the wiring in the bending zone, and prevent the walking
  • the conductive function of the wire is adversely affected; at the same time, because the interface between the protective layer and the adjustment layer is formed, the bending stress when the bending area is bent can be released through the interface, so the thickness of the layer is adjusted within the range that can be achieved by the process
  • Both the thickness of the protective layer and the protective layer can be set to a smaller thickness, so when bending the bending area, the stress in the bending area is not easy to concentrate, and the stress in the adjustment layer and the protective layer are easier to release, so that it can be Reduce the occurrence of cracks and even break
  • the orthographic projection of the protective layer on the flexible substrate coincides with the orthographic projection of the traces in the bending region on the flexible substrate, reducing The coverage area of the protective layer under the trace is reduced.
  • stress concentration is not easy to form in the protective layer, and the stress in the protective layer is easily released, which further reduces the occurrence of cracks or even fractures in the trace. It occurs to prevent the conductive function of the trace from being adversely affected.
  • a passivation layer is further provided between the trace and the planarization layer.
  • the passivation layer bears The stress is equal to the stress sustained by the protective layer.
  • the passivation layer and the protective layer cooperate to release the stress.
  • the stress on the passivation layer is equal to the stress on the protective layer.
  • the upper and lower sides of the trace are evenly stressed, which can further reduce the occurrence of cracks or even breakage of the trace and prevent the conductive function of the trace from being adversely affected.
  • the passivation layer covers the traces in the bending area and the adjustment layer. That is, after the deposition of the passivation film is completed, no etching and other processes are performed, and the passivation layer is directly used. In this way, the process steps for manufacturing the flexible display panel can be reduced, the efficiency can be improved, and the cost can be reduced.
  • the passivation layer is located on the traces in the bending area and corresponds to the traces in the bending area. That is, after the deposition of the passivation film is completed, the passivation film is etched to form a passivation layer located on the wiring in the bending region and corresponding to the wiring in the bending region.
  • the orthographic projection on the flexible substrate coincides with the orthographic projection of the traces in the bending area on the flexible substrate.
  • the passivation layer does not cover the sides of the traces in the bending area, which can reduce the probability that stress is transmitted from the side of the traces in the bending area to the traces in the bending area, and reduce the adjacent bending area
  • the probability of stress transmission between the internal traces which can reduce the occurrence of cracks or even breakage of the traces and prevent the conductive function of the traces from being adversely affected.
  • the passivation layer is a silicon oxide passivation layer, a silicon nitride passivation layer, a silicon oxynitride passivation layer, or an organic material passivation layer.
  • the adjustment layer is an a-Si (amorphous silicon) layer.
  • the material of the adjustment layer is selected as a-Si
  • the adjustment layer and the active layer of the low-temperature polysilicon thin-film transistor can share a film structure without additional adjustment Layer, thereby reducing the process steps of manufacturing flexible display panels, improving efficiency, and reducing costs; in addition, when forming the active layer, it can be formed by directly doping on a-Si without etching, further reducing manufacturing flexibility The process steps of the display panel improve efficiency and reduce costs.
  • the thickness of the adjustment layer is less than or equal to Preferably less than or equal to The stress in the bending area is not easily concentrated.
  • the protective layer is a silicon oxide protective layer to prevent the hydrogen bonding in the material of the protective film from adversely affecting the thin film transistor in the display area when the protective film is deposited.
  • the thickness of the protective layer is less than or equal to Preferably If the thickness of the protective layer is thicker, it is easy to cause stress concentration in the protective layer.
  • a second aspect of an embodiment of the present disclosure provides a flexible display device including the flexible display panel as described in the above technical solution.
  • the flexible display device has the same advantages as the above-mentioned flexible display panel over the prior art, and will not be repeated here.
  • a third aspect of the embodiments of the present disclosure provides a method for manufacturing a flexible display panel, including:
  • planarization layer is located above the trace in the bending area and covers the functional film layer on the flexible substrate,
  • the protective layer corresponds to the wiring of the bending region in the flexible display panel, and the orthographic projection of the wiring on the flexible substrate in the bending region falls into the protection layer in the flexible Within the orthographic projection on the substrate.
  • the manufacturing method of the flexible display panel has the same advantages as the above-mentioned flexible display panel over the prior art, and will not be repeated here.
  • the manufacturing method of the flexible display panel further includes: forming a blunt ⁇ The layer.
  • the passivation layer and the protective layer cooperate to release the stress.
  • the stress on the passivation layer is equal to the stress on the protective layer.
  • the trace is under the influence of the passivation layer and the protective layer, and the upper and lower sides of the trace are evenly stressed, which can further reduce the occurrence of cracks or even breakage of the trace and prevent the conductive function of the trace from being adversely affected.
  • forming the protective layer, the trace, and the passivation layer includes: forming a protective film; etching the protective film, forming and The protective layer corresponding to the trace in the bending area; preferably, the orthographic projection of the trace in the bending area on the flexible substrate and the protective layer on the flexible substrate The orthographic projections of the two are coincident; forming the traces on the protective layer; forming the passivation layer, the passivation layer covering the traces in the bending area and the adjustment layer; or, forming the The protective layer, the trace, and the passivation layer include: forming a protective film; forming the trace on the protective film; forming a passivation film, the passivation film covering the bending area Wiring and the protective film; etching the passivation film and the protective film to form a protective layer corresponding to the wiring in the bending area and the wiring in the bending area Corresponding passivation layer; preferably, the
  • FIG. 1 is a schematic structural diagram of a flexible display panel provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of another flexible display panel provided by an embodiment of the present disclosure.
  • FIG. 3 is a schematic structural diagram of yet another flexible display panel provided by an embodiment of the present disclosure.
  • FIG. 4 is a flowchart of a method for manufacturing a flexible display panel provided by an embodiment of the present disclosure
  • FIG. 5 is a flowchart of another method for manufacturing a flexible display panel provided by an embodiment of the present disclosure
  • FIG. 6 is a flowchart of another method for manufacturing a flexible display panel provided by an embodiment of the present disclosure.
  • FIG. 7 is a flowchart of still another method for manufacturing a flexible display panel provided by an embodiment of the present disclosure.
  • the flexible display panel in the prior art has the problem that the conductive function of the wiring is easily affected by adverse effects, mainly because the wiring is prone to cracks, and the reason why the wiring is prone to cracks is mainly because, on the one hand, the bending of the flexible display panel In the zone, the bending method is not uniform and irregular. For example, the bending radius is too small, which causes stress concentration in the bending zone. There is a large stress in the bending zone and the stress area is small, resulting in bending.
  • the reason for the adverse effect of the conductive function of the trace is essentially the structural limitation of the functional film layer in the bending zone and the stress mismatch between the functional film layers, resulting in the concentration in the bending zone It is difficult to release the stress, and the traces in the bending area are likely to be cracked or even broken, which causes the conductive function of the traces to be adversely affected.
  • an embodiment of the present disclosure provides a flexible display panel, including a flexible substrate 10, an adjustment layer 11, a protective layer 12, a trace 13 and a planarization layer 15, wherein the flexible substrate 10 Carrying each functional film layer in the flexible display panel, the functional layer includes, for example, the adjustment layer 11, the protective layer 12, and the trace 13, in the case of a passivation layer, it also includes a passivation layer, and is flexible
  • the bendability of the display panel provides assurance that the flexible substrate 10 may be a single-layer structure.
  • the flexible substrate 10 may be made of polyimide (Polyimide, PI), and the flexible substrate 10 may also be a multi-layer structure At this time, at least one layer in the flexible substrate 10 may be made of polyimide (Polyimide, PI).
  • the adjustment layer 11 is located on the flexible substrate 10, and the adjustment layer 11 covers the entire flexible substrate 10; the protection layer 12 is located on the adjustment layer 11, and the protection layer 12 corresponds to the trace 13 in the bending area in the flexible display panel, specifically
  • the orthographic projection of the trace 13 on the flexible substrate 10 in the bending zone falls within the orthographic projection of the protective layer 12 on the flexible substrate 10, preferably, the orthographic projection of the protective layer 12 on the flexible substrate 10 Coincides with the orthographic projection of the trace 13 on the flexible substrate 10, an interface is formed between the protective layer 12 and the adjustment layer 11, and the bending stress when the bending area is bent can be released through the interface to relieve the bending area
  • the wire 13 may have a three-layer structure.
  • the wire 13 may adopt a sandwich structure, such as Ti/Al/Ti, Mo /Al/Mo structure, etc.;
  • the planarization layer 15 is located on the trace 13, and the planarization layer 15 covers the functional film layer on the flexible substrate 10 to protect the functional film layer on the flexible substrate 10, while facilitating subsequent film layers
  • the planarization layer 15 may be an organic material planarization layer or an inorganic material planarization layer.
  • a layer of adjustment layer 11 is provided on the flexible substrate 10, and a layer of protection layer 12 is provided below the trace 13, between the protection layer 12 and the adjustment layer 11
  • An interface is formed through which the bending stress when the bending zone is bent is released to relieve the stress that the protective layer 12 bears when the bending zone is bent, thereby reducing the occurrence of cracks or even cracks on the trace 13 in the bending zone
  • the occurrence of breakage prevents the conductive function of the trace 13 from being adversely affected; at the same time, since the interface between the protective layer 12 and the adjustment layer 11 is formed, the bending stress when the bending region is bent can be released through the interface, thus
  • Both the thickness of the adjustment layer 11 and the thickness of the protective layer 12 can be set to a smaller thickness, preferably less than or equal to Therefore, when bending the bending area, the stress is not easy to concentrate, and the stress in the adjustment layer 11 and the stress in the protective layer 12 are easier to release, which can reduce the
  • the conductive function of the wire 13 is adversely affected; and, in the flexible display panel provided by the embodiment of the present disclosure, the protective layer 12 corresponds to the wiring 13 in the bending area, and the wiring 13 in the bending area is on the flexible substrate 10
  • the orthographic projection on the falls into the orthographic projection of the protective layer 12 on the flexible substrate 10, preferably the orthographic projections of the two coincide with each other, compared with the structure with a larger coverage area of the functional film layer under the trace 13 commonly used
  • the function is adversely affected.
  • the protective layer 12 corresponds to the trace 13 in the bending area, which can be understood as the orthographic projection of the trace 13 on the flexible substrate 10 falls into the protective layer 12 in the flexible
  • the orthographic projection of the trace 13 on the flexible substrate 10 coincides with the orthographic projection of the protective layer 12 on the flexible substrate 10
  • one of the adjacent traces 13 in the bending area There is no protective layer 12 that constitutes the whole, which can prevent the stress from being transmitted to each other, further reduce the occurrence of cracks or even breakage of the trace 13, and prevent the conductive function of the trace 13 from being adversely affected.
  • an adjustment layer 11 is provided on the flexible substrate 10, and the adjustment layer 11 covers the entire flexible substrate 10, that is, FIG. 1, FIG. 2, or FIG. 3
  • the upper surface of the middle flexible substrate 10 is covered by the adjustment layer 11 and will not be exposed.
  • the material of the flexible substrate 10 can be prevented from being contaminated, for example, when etching
  • the adjustment layer 11 can serve as an etching barrier to prevent the flexible substrate 10 from being etched, thereby preventing the etching chamber Contaminated by the material of the flexible substrate 10; for another example, the material of the flexible substrate 10 is prevented from contaminating the subsequently formed functional film layer.
  • the flexible display device using the flexible display panel in the embodiments of the present disclosure can be applied to different products, for example, it can be applied to products such as mobile phones, tablet computers, e-books, and the descriptions are not listed here.
  • the protective layer 12 corresponds to the trace 13 in the bending area of the flexible display panel.
  • the orthographic projection of the protective layer 12 on the flexible substrate 10 and the trace 13 on the flexible substrate 10 coincide to further reduce the coverage area of the protective layer 12 under the trace 13, when bending the bending area, it is not easy to form stress concentration in the protective layer 12, and the stress in the protective layer 12 is easily released, further reducing The occurrence of cracks or even breakage of the trace 13 prevents the conductive function of the trace 13 from being adversely affected.
  • a passivation layer 14 may be further provided between the trace 13 and the planarization layer 15.
  • the passivation layer The stress sustained by 14 is equal to the stress sustained by the protective layer 12.
  • the passivation layer 14 and the protective layer 12 cooperate with each other to release the stress.
  • the stress on the passivation layer 14 is equal to the stress on the protection layer 12.
  • the thickness of the passivation layer 14 and the thickness of the protective layer 12 may be set to be equal, so that when the bending region is bent, the stress that the passivation layer 14 bears is equal to the stress that the protective layer 12 bears; when When the material quality of the passivation layer 14 differs greatly from the material quality of the protective layer 12, the thickness of the functional film layer needs to be determined according to the difference in material quality to achieve the passivation layer 14 when the bending area is bent The stress sustained is equal to the stress sustained by the protective layer 12.
  • the structure of the passivation layer 14 may have various types.
  • the passivation layer 14 may cover the bending area
  • the passivation layer 14 is located on the trace 13 in the bending region, and the passivation layer 14 corresponds to the trace 13 in the bending region, that is, after the deposition of the passivation film is completed,
  • the passivation layer 14 is etched to form a passivation layer 14 on the traces 13 in the bending zone and corresponding to the traces 13 in the bending zone, so that the passivation layer 14 does not cover the traces 13 in the bending zone
  • the side of the can reduce the chance of stress being transmitted from the side of the trace 13 in the bending zone to the trace 13 in the bending zone, and reduce the probability of stress conduction between adjacent traces 13, thereby reducing the trace 13
  • the occurrence of cracks or even breakages prevents the conductive function of the trace 13 from being adversely affected.
  • the passivation layer 14 When the passivation layer 14 is located on the trace 13, and the passivation layer 14 corresponds to the trace 13, when the material of the passivation layer 14 is the same as the material of the protective layer 12, or the etching to form the passivation layer 14 is etched
  • a protective film may be deposited first, then a trace 13 is formed on the protective film, then a passivation film is deposited, and then a mask is used , Etching the passivation film and the protective film in sequence to form the passivation layer 14 and the protective layer 12 to reduce the process steps of manufacturing the flexible display panel, improve efficiency, and reduce costs.
  • the material selection of the passivation layer 14 can be selected according to actual needs, on the premise that the stress to the passivation layer 14 and the stress to the protective layer 12 are equal when the bending zone is bent.
  • the material of the passivation layer 14 can be silicon oxide, silicon nitride, silicon oxynitride, organic materials, or the like.
  • the material of the adjustment layer 11 may be a-Si.
  • the thin film transistor in the display area may use a low temperature polysilicon thin film transistor.
  • the low temperature polysilicon thin film transistor includes an active layer, Source, drain, and gate, where the active layer is on a flexible substrate, the active layer is P-type Si, made of a-Si by doping, that is, the active layer is based on the adjustment layer
  • the gate is located on the active layer.
  • the source and drain are located on both sides of the gate and are formed by a-Si through ion implantation.
  • the material of the adjustment layer 11 is selected as a-Si, there is no need to form an additional adjustment layer 11, thereby reducing the process steps of manufacturing a flexible display panel, improving efficiency, and reducing costs;
  • directly in a -Si can be formed by doping on Si without etching, which further reduces the process steps of manufacturing flexible display panels, improves efficiency, and reduces costs.
  • the thickness of the adjustment layer 11 can be set according to actual needs, for example, the thickness of the adjustment layer 11 can be set to be less than or equal to Preferably less than or equal to Makes the stress difficult to concentrate.
  • the material of the protective layer 12 can be selected according to actual needs.
  • the material of the protective layer 12 can be selected from silicon oxide, silicon nitride, silicon oxynitride, or organic materials.
  • protection The material of the layer 12 is preferably silicon oxide to prevent the hydrogen bonding in the material of the protective film from adversely affecting the thin film transistor in the display area when the protective film is deposited.
  • the cooperation of the protective layer 12 and the adjustment layer 11 can reduce the occurrence of cracks or even breakage of the trace 13 and prevent the conductive function of the trace 13 from being adversely affected.
  • the thickness of the protective layer 12 can be set to be less than or equal to Preferably It is prevented that the thickness of the protective layer 12 is thick, and stress concentration in the protective layer 12 is likely to occur.
  • the material of the adjustment layer 11 is selected as a-Si, and the thickness of the adjustment layer 11 is selected as The material of the protective layer 12 is silicon oxide, and the thickness of the protective layer 12 is selected as The material of the passivation layer 14 is selected to be silicon nitride or silicon oxide.
  • the material quality of the passivation layer 14 is equal to that of the protective layer 12, and the thickness of the passivation layer 14 and the protective layer 12 are set to be the same , That is, the thickness of the passivation layer 14 is selected as
  • the material of the adjustment layer 11 is a-Si
  • the thickness is selected as
  • the material of the protective layer 12 is silicon oxide
  • the thickness is selected as It is beneficial to form an interface between the protective layer 12 and the adjustment layer 11 when the protective layer 12 is formed on the adjustment layer 11, the formation of this interface can release the bending force when the bending area is bent, and relieve the bending area The stress on the protective layer during bending can effectively release the stress, reduce the occurrence of cracks and even breakage of the trace 13 and prevent the conductive function of the trace 13 from being adversely affected; Silicon, the thickness is selected as The material of the passivation layer 14 is silicon nitride or silicon oxide, and the thickness is selected as The material quality of the passivation layer 14 is the same as the material quality of the protective layer
  • An embodiment of the present disclosure also provides a flexible display device including the flexible display panel as described in the above embodiments.
  • the flexible display device can be used in mobile phones, tablet computers, e-books and other products.
  • the flexible display device has the same advantages as the above-mentioned flexible display panel over the prior art, and will not be repeated here.
  • an embodiment of the present disclosure also provides a method for manufacturing a flexible display panel, which is used to manufacture the flexible display panel described in the above embodiment.
  • the method for manufacturing the flexible display panel includes:
  • Step S11 forming a flexible substrate. Specifically, before forming the flexible substrate, a rigid substrate is provided to carry the flexible substrate, and then the flexible substrate is formed on the rigid substrate.
  • the flexible substrate may be a single-layer structure or a multilayer structure, the flexible substrate Polyimide can be used for at least one of the layers.
  • Step S12 forming an adjustment layer on the flexible substrate, the adjustment layer covering the entire flexible substrate.
  • an adjustment layer covering the entire flexible substrate may be formed on the flexible substrate by means of magnetron sputtering, etc.
  • the adjustment layer may be an a-Si adjustment layer, and the thickness of the adjustment layer is less than or equal to Preferably less than or equal to
  • Step S13 forming a protective layer corresponding to the wiring in the bending area of the flexible display panel.
  • the orthographic projection of the protective layer on the flexible substrate coincides with the orthographic projection of the traces in the bending area on the flexible substrate.
  • Step S14 forming a trace on the protective layer. Specifically, the metal film is deposited first, and then the mask is used to etch the metal film using an etching process to form a trace.
  • Step S15 forming a planarization layer, the planarization layer is located above the traces and covers the functional film layer on the flexible substrate. Specifically, a planarization layer is formed by vapor deposition, coating, etc., the planarization layer covers the functional film layer on the flexible substrate to protect the functional film layer, and at the same time facilitate subsequent formation of the film layer.
  • the flexible display panel provided by the embodiment of the present disclosure may further include a passivation layer disposed between the protective layer and the planarization layer.
  • a passivation layer disposed between the protective layer and the planarization layer.
  • Step S14' forming a passivation layer.
  • the structure of the passivation layer can be in various forms.
  • the passivation layer can cover the traces and the adjustment layer.
  • the above steps S13, S14 and S14' can be adopted as follows: forming a protective film, etching the protective film to form a protective layer corresponding to the traces in the bending area; forming traces on the protective layer ; Form a passivation layer, which covers the routing and adjustment layer in the bending zone.
  • the manufacturing method of the flexible display panel may include:
  • Step S21 forming a flexible substrate.
  • Step S22 forming an adjustment layer on the flexible substrate, the adjustment layer covering the entire flexible substrate.
  • Step S23 forming a protective film.
  • a protective film may be formed on the adjustment layer by vapor deposition or the like.
  • the material of the protective film is silicon oxide to prevent the hydrogen bonding in the material of the protective film from adversely affecting the thin film transistor in the display area.
  • Step S24 Etching the protective film to form a protective layer corresponding to the traces in the bending area. Specifically, a mask plate is used to etch the protective film using an etching process to form a protective layer corresponding to the traces in the bending area.
  • Step S25 forming a trace on the protective layer.
  • Step S26 forming a passivation layer. Specifically, a passivation layer is formed by vapor deposition or the like, and the passivation layer covers the wiring and the adjustment layer in the bending area.
  • Step S27 forming a planarization layer, which is located above the passivation layer and covers the functional film layer on the flexible substrate.
  • the passivation layer is located on the trace, and the passivation layer corresponds to the trace in the bending area, that is, after the passivation film is deposited, the passivation film is etched to form the
  • the above steps S13, S14 and S14' can adopt the following methods: forming a protective film; forming a trace on the protective film; forming The passivation film etches the passivation film and the protection film to form a protection layer and a passivation layer corresponding to the traces in the bending area, respectively.
  • the manufacturing method of the flexible display panel may include:
  • Step S31 forming a flexible substrate.
  • Step S32 forming an adjustment layer on the flexible substrate, the adjustment layer covering the entire flexible substrate.
  • Step S33 forming a protective film.
  • a protective film may be formed on the adjustment layer by vapor deposition or the like.
  • the material of the protective film is silicon oxide to prevent the hydrogen bonding in the material of the protective film from adversely affecting the thin film transistor in the display area.
  • Step S34 forming a trace on the protective film.
  • Step S35 forming a passivation film.
  • Step S36 etching the passivation film and the protection film to form a protection layer and a passivation layer respectively corresponding to the traces in the bending area.
  • Step S37 forming a planarization layer, which is located above the passivation layer and covers the functional film layer on the flexible substrate.
  • the step of etching the protective film to form the protective layer and the step of etching the passivation film to form the passivation layer can be achieved by one etching process, reducing the process steps of manufacturing the flexible display panel and improving efficiency, Reduce the cost.
  • the flexible display panel includes a display area and a bending area.
  • the thin film transistor in the display area may adopt the structure shown in FIG. 4, and the structure in the bending area uses the structure shown in FIG. 3.
  • the manufacturing method of the flexible display panel may specifically include:
  • Step S41 forming a flexible substrate.
  • Step S42 forming an adjustment layer on the flexible substrate, the adjustment layer covering the entire flexible substrate.
  • Step S43 Doping the adjustment layer in the display area to form an active layer of the thin film transistor in the display area.
  • Step S44 forming a gate on the edged layer, and forming a source and a drain on the adjustment layer on both sides of the gate by ion implantation.
  • Step S45 forming a protective film.
  • Step S46 forming a via hole in the protective film located in the display area to realize the connection between the electrode and the trace that need to be connected to the trace under the protective film, for example, the via hole can correspond to the source electrode to realize the source electrode and the trace Connection.
  • Step S47 Perform a thinning process on the protective film located in the bending area so that the thickness of the protective film in the bending area is less than or equal to Preferably
  • Step S48 forming a trace.
  • the trace is connected to an electrode under the protective film such as the source through the via in the protective film.
  • the trace is located on the protective layer.
  • Step S49 forming a passivation film, the passivation film covers the wiring and the protection film.
  • Step S50 etching the passivation film and the protection film in the bending area to form a passivation layer and a protection layer corresponding to the traces in the bending area.
  • the orthographic projections of the wiring, the protective layer and the passivation layer on the flexible substrate in the bending area coincide.
  • Step S51 forming a planarization layer.
  • the manufacturing method of the flexible display panel provided by the embodiment of the present disclosure, compared with the prior art, in which a multilayer insulating layer is additionally formed in the bending area, the adjustment layer, the protective layer, and the passivation layer in the bending area It can be shared with the display area without additional formation. Therefore, the process steps for manufacturing the flexible display panel are reduced, the efficiency is improved, and the cost is reduced.

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Abstract

本公开提供一种柔性显示面板及其制造方法、柔性显示装置，用于解决弯折区内走线的导电功能不良的问题。该柔性显示面板包括显示区和位于显示区周边的弯折区，弯折区包括：柔性衬底；调整层，覆盖整个所述柔性衬底；保护层，位于所述调整层上；走线，位于所述保护层上；平坦化层，位于所述走线上方、且覆盖所述柔性衬底上的功能膜层；所述保护层与所述弯折区内的走线对应，所述弯折区内的走线在所述柔性衬底上的正投影落入所述保护层在所述柔性衬底上的正投影内；所述弯折区被弯折时，弯折应力通过所述调整层与所述保护层之间的界面释放，以缓解所述弯折区被弯折时所述保护层所承受的应力。

Description

柔性显示面板及其制造方法、柔性显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种柔性显示面板及其制造方法、柔性显示装置。
背景技术
显示装置是一种用于显示文字、数字、符号、图片，或者由文字、数字、符号和图片中至少两种组合形成的图像等画面的装置。显示装置可以为平面显示装置、曲面显示装置、3D显示装置、近眼显示装置、AR/VR显示装置等
目前，随着科技的快速发展，柔性显示装置逐渐走入人们的视野并受到人们的追捧，例如，现有技术存在一种柔性显示装置，包括柔性显示面板，柔性显示面板包括显示区和位于显示区周边的非显示区，为了增加柔性显示装置的屏占比，会将某些非显示区作为弯折区，并将弯折区弯折至柔性显示面板的背部，例如驱动芯片所在的区域，而弯折区内可能具有大量走线，用于传递实现柔性显示装置的显示、触摸等功能的信号。
在现有的柔性显示面板中，当将弯折区弯折时，弯折区内的走线也会随之发生弯折，走线容易产生裂纹甚至发生断裂，导致走线的导电功能受到不良影响。
发明内容
鉴于上述问题，本公开实施例提供一种柔性显示面板及其制造方法、柔性显示装置，用于解决柔性显示面板中弯折区被弯折时，弯折区内的走线容易产生裂纹甚至发生断裂而造成走线的导电功能受到不良影响的技术问题。
为了实现上述目的，本公开实施例提供如下技术方案：
本公开实施例的第一方面提供一种柔性显示面板，包括显示区和位于所述显示区周边的弯折区，所述弯折区包括：柔性衬底；调整层，覆盖整个所述柔性衬底；保护层，位于所述调整层上；走线，位于所述保护层上；平坦化层，位于所述走线上方、且覆盖所述柔性衬底上的功能膜层，其中所述保护层与所述弯折区内的走线对应的保护层，所述弯折区内的走线在所述柔性衬底上的正投影落入所述保护层在所述柔性衬底上的正投影内；所述弯折区被弯折时，弯折应力通过所述调整层与所述保护层之间的界面释放，以缓解所述弯折区被弯折时所述保护层所承受的应力。
在本公开实施例提供的柔性显示面板的弯折区内，在柔性衬底上设置一层调整层，并 在走线下方设置一层保护层，保护层与调整层之间形成界面，通过该界面释放弯折区被弯折时的弯折应力，以缓解弯折区被弯折时保护层所承受的应力，从而可以减少弯曲区内的走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响；同时，由于保护层与调整层之间形成界面，通过该界面可以释放弯折区被弯折时的弯折应力，因而在工艺能够实现的范围内调整层的厚度和保护层的厚度均可以设置为较小的厚度，因此当对弯折区进行弯折时，弯曲区的应力不易集中，且调整层中的应力和保护层中的应力较易释放，从而可以减少弯曲区内的走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响；并且，在本公开实施例提供的柔性显示面板中，保护层与弯折区内的走线对应，弯折区内的走线在柔性衬底上的正投影落入保护层在柔性衬底上的正投影内，与通常采用的走线下方的功能膜层覆盖面积较大的结构相比，当对弯折区进行弯折时，保护层内不易形成应力集中，且保护层中的应力容易释放，进一步减少走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响。
作为本公开实施例柔性显示面板的一种改进，所述保护层在所述柔性衬底上的正投影与所述弯折区内的走线在所述柔性衬底上的正投影重合，减小了走线下方的保护层的覆盖面积，当对弯折区进行弯折时，保护层内不易形成应力集中，且保护层中的应力容易释放，进一步减少走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响。
作为本公开实施例柔性显示面板的一种改进，所述弯折区内相邻的走线之间不存在构成整体的保护层，从而可以防止应力相互传导，进一步减少走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响。
作为本公开实施例柔性显示面板的一种改进，所述走线与所述平坦化层之间还设置有钝化层，所述弯折区被弯折时，所述钝化层所承受的应力与所述保护层所承受的应力相等。当对弯折区进行弯折时，钝化层与保护层相互配合，将应力释放出去，同时，钝化层所承受的应力与保护层所承受的应力相等，走线在钝化层和保护层的牵扯下，走线的上下两侧受力均匀，从而可以进一步减少走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响。
作为本公开实施例柔性显示面板的一种改进，所述钝化层覆盖所述弯折区内的走线和所述调整层。即钝化膜在沉积完成后，不再进行刻蚀等工艺，直接作为钝化层。如此，可以减少制造柔性显示面板的工艺步骤，提高效率，降低成本。
作为本公开实施例柔性显示面板的一种改进，所述钝化层位于所述弯折区内的走线上，且与所述弯折区内的走线对应。即钝化膜在沉积完成后，对钝化膜进行刻蚀，形成位于弯 折区内的走线上且与弯折区内的走线对应的钝化层，所述钝化层在所述柔性衬底上的正投影与所述弯折区内的走线在所述柔性衬底上的正投影重合。如此，钝化层不覆盖弯折区内的走线的侧面，可以减少应力由弯折区内的走线的侧面传导至弯折区内的走线的几率，并减少相邻的弯折区内的走线之间应力传导的几率，从而可以减少走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响。
作为本公开实施例柔性显示面板的一种改进，所述钝化层为氧化硅钝化层、氮化硅钝化层、氮氧化硅钝化层或有机材料钝化层。
作为本公开实施例柔性显示面板的一种改进，所述调整层为a-Si(非晶硅)层。将调整层的材料选用为a-Si的情况下，当显示区内的薄膜晶体管为低温多晶硅薄膜晶体管时，调整层与低温多晶硅薄膜晶体管的有源层可以共用一个膜层结构，无需额外形成调整层，从而减少制造柔性显示面板的工艺步骤，提高效率，降低成本；另外，在形成有源层时，直接在a-Si上进行掺杂处理形成即可，无需进行刻蚀，进一步减少制造柔性显示面板的工艺步骤，提高效率，降低成本。
作为本公开实施例柔性显示面板的一种改进，所述调整层的厚度小于或等于
Figure PCTCN2019088647-appb-000001
优选为小于或等于
Figure PCTCN2019088647-appb-000002
使得弯曲区的应力不易集中。
作为本公开柔性显示面板的一种改进，所述保护层为氧化硅保护层，防止在沉积保护膜时，保护膜的材料中的氢键对显示区内的薄膜晶体管造成不良影响。
作为本公开实施例柔性显示面板的一种改进，所述保护层的厚度小于或等于
Figure PCTCN2019088647-appb-000003
优选为
Figure PCTCN2019088647-appb-000004
若保护层的厚度更厚则易造成保护层内容易发生应力集中。
本公开实施例的第二方面提供一种柔性显示装置，所述柔性显示装置包括如上述技术方案所述的柔性显示面板。
所述柔性显示装置与上述柔性显示面板相对于现有技术所具有的优势相同，在此不再赘述。
本公开实施例的第三方面提供一种柔性显示面板的制造方法，其包括：
形成柔性衬底；
在所述柔性衬底上形成调整层，所述调整层覆盖整个所述柔性衬底；
在所述调整层上形成保护层；
在所述保护层上形成走线；
在所述走线上形成平坦化层，所述平坦化层位于弯折区的走线上方、且覆盖所述柔性衬底上的功能膜层，
所述保护层与所述柔性显示面板中所述弯折区的走线对应，所述弯折区内的走线在所述柔性衬底上的正投影落入所述保护层在所述柔性衬底上的正投影内。
所述柔性显示面板的制造方法与上述柔性显示面板相对于现有技术所具有的优势相同，在此不再赘述。
作为本公开实施例柔性显示面板的制造方法的一种改进，在所述保护层上形成所述走线之后、形成所述平坦化层之前，所述柔性显示面板的制造方法还包括：形成钝化层。当对弯折区进行弯折时，钝化层与保护层相互配合，将应力释放出去，同时，弯折区被弯折时，钝化层所承受的应力与保护层所承受的应力相等，走线在钝化层和保护层的牵扯下，走线的上下两侧受力均匀，从而可以进一步减少走线出现裂纹甚至断裂的现象的发生，防止走线的导电功能受到不良影响。
作为本公开实施例柔性显示面板的制造方法的一种改进，形成所述保护层、所述走线和所述钝化层，包括：形成保护膜；对所述保护膜进行刻蚀，形成与所述弯折区内的走线对应的所述保护层；优选的，所述弯折区内的走线在所述柔性衬底上的正投影与所述保护层在所述柔性衬底上的正投影重合；在所述保护层上形成所述走线；形成所述钝化层，所述钝化层覆盖所述弯折区内的走线和所述调整层；或者，形成所述保护层、所述走线和所述钝化层，包括：形成保护膜；在所述保护膜上形成所述走线；形成钝化膜，所述钝化膜覆盖所述弯折区内的走线和所述保护膜；对所述钝化膜和所述保护膜进行刻蚀，形成与所述弯折区内的走线对应的保护层，以及与所述弯折区内的走线对应的钝化层；优选的，所述弯折区内的走线和所述保护层以及所述钝化层三者在所述柔性衬底上的正投影重合。
此外，针对本公开第一方面的柔性显示面板描述的结构、功能等所有内容同样适用于本公开第三方面的柔性显示面板的制造方法，此处不再赘述。
除了上面所描述的本公开实施例解决的技术问题、构成技术方案的技术特征以及由这些技术方案的技术特征所带来的有益效果外，本公开实施例提供的柔性显示面板及其制造方法、柔性显示装置所能解决的其他技术问题、技术方案中包含的其他技术特征以及这些技术特征带来的有益效果，将在具体实施方式中作出进一步详细的说明。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开实施例提供的一种柔性显示面板的结构示意图；
图2为本公开实施例提供的另一种柔性显示面板的结构示意图；
图3为本公开实施例提供的又一种柔性显示面板的结构示意图；
图4为本公开实施例提供的一种柔性显示面板的制造方法的流程图；
图5为本公开实施例提供的另一种柔性显示面板的制造方法的流程图；
图6为本公开实施例提供的又一种柔性显示面板的制造方法的流程图；
图7为本公开实施例提供的再一种柔性显示面板的制造方法的流程图。
具体实施方式
为了使本公开实施例的上述目的、特征和优点能够更加明显易懂，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有付出创造性劳动的前提下所获得的所有其它实施例，均属于本公开保护的范围。
现有技术中的柔性显示面板存在走线的导电功能容易受到不良影响的问题，主要在于走线容易产生裂纹，而走线容易产生裂纹的原因主要在于，一方面弯折柔性显示面板的弯折区时，弯折手法不统一且不规范，例如弯折半径过小，造成弯折区出现应力集中的现象，弯折区存在较大的应力且该应力的受力面积较小，从而造成弯折区的走线产生裂纹甚至发生断裂，进而导致走线的导电功能受到不良影响；另一方面走线周边尤其是走线上方或下方的功能膜层的结构限制，以及功能膜层之间的应力不匹配，当弯折区被弯折时，弯折区中功能膜层内的应力难以释放，进而造成弯折区中走线容易产生裂纹甚至发生断裂，进而导致走线的导电功能受到不良影响。
针对上述第一方面，虽然是因为对弯折区进行弯折时的手法不统一且不规范导致的，但其根本原因仍然在于弯折区内功能膜层的结构限制以及功能膜层之间应力不匹配，造成集中在弯折区的应力难以释放，进而造成弯折区中走线容易产生裂纹甚至发生断裂，从而导致走线的导电功能受到不良影响。
因此，无论是上述哪个方面的原因，走线的导电功能受到不良影响的原因实质上在于弯折区内功能膜层的结构限制以及功能膜层之间应力不匹配，造成集中在弯折区的应力难以释放，进而造成弯折区的走线容易产生裂纹甚至发生断裂，导致走线的导电功能受到不良影响。
请参阅图1、图2或图3，本公开实施例提供一种柔性显示面板，包括柔性衬底10、调整层11、保护层12、走线13和平坦化层15，其中，柔性衬底10承载柔性显示面板内的各功能膜层，所述功能层包括，例如，调整层11、保护层12、走线13，在有钝化层的情况下，还包括钝化层，并为柔性显示面板的可弯折提供保证，柔性衬底10可以为单层结构，此时，柔性衬底10可以采用聚酰亚胺(Polyimide，PI)制得，柔性衬底10也可以为多层结构，此时，柔性衬底10中的至少一层可以采用聚酰亚胺(Polyimide，PI)制得。
调整层11位于柔性衬底10上，且调整层11覆盖整个柔性衬底10；保护层12位于调整层11上，且保护层12与柔性显示面板中弯折区内的走线13对应，具体的，弯折区内的走线13在柔性衬底10上的正投影落入保护层12在柔性衬底10上的正投影内，优选的，保护层12在柔性衬底10上的正投影与走线13在柔性衬底10上的正投影重合，保护层12与调整层11之间形成界面，弯折区被弯折时的弯折应力可通过该界面释放，以缓解弯折区被弯折时保护层12所承受的应力；走线13位于保护层12上，走线13用于传递柔性显示面板实现柔性显示装置的显示、触摸等功能的信号，走线13可以为金属走线13，即走线13由金属制得，例如可以为单质金属或合金制得，走线13可以为单层结构，也可以为多层结构，优选地，走线13为多层结构，且走线13至少包括三层，处于外面的两层起到保护中间层的作用，例如，走线13可以为三层结构，此时，走线13可以采用三明治结构，如Ti/Al/Ti、Mo/Al/Mo结构等；平坦化层15位于走线13上，且平坦化层15覆盖柔性衬底10上的功能膜层，以保护柔性衬底10上的功能膜层，同时方便后续膜层的形成，例如方便OLED(Organic Light-Emitting Diode，有机发光二极管)器件的形成，平坦化层15可以为有机材料平坦化层或无机材料平坦化层。
在本公开实施例提供的柔性显示面板的弯折区内，在柔性衬底10上设置一层调整层11，并在走线13下方设置一层保护层12，保护层12与调整层11之间形成界面，通过该界面释放弯折区被弯折时的弯折应力，以缓解弯折区被弯折时保护层12所承受的应力，从而可以减少弯曲区内的走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响；同时，由于保护层12与调整层11之间形成界面，通过该界面可以释放弯折区被弯折时的弯折应力，因而调整层11的厚度和保护层12的厚度均可以设置为较小的厚度，优选地小于或等于
Figure PCTCN2019088647-appb-000005
使得当对弯折区进行弯折时，应力不易集中，且调整层11中的应力和保护层12中的应力较易释放，从而可以减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响；并且，在本公开实施例提供的柔性显示面板中，保护层12与弯折区内的走线13对应，弯折区内的走线13在柔性衬底10 上的正投影落入保护层12在柔性衬底10上的正投影内，优选地两者的正投影彼此重合，与通常采用的走线13下方的功能膜层覆盖面积较大的结构相比，当对弯折区进行弯折时，保护层12内不易形成应力集中，且保护层12中的应力容易释放，进一步减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响。
另外，在本公开实施例提供的柔性显示面板中，保护层12与弯折区内的走线13对应，可以理解为走线13在柔性衬底10上的正投影落入保护层12在柔性衬底10上的正投影内，优选地走线13在柔性衬底10上的正投影与保护层12在柔性衬底10上的正投影重合，且弯折区内相邻的走线13之间不存在构成整体的保护层12，从而可以防止应力相互传导，进一步减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响。
再者，在本公开实施例提供的柔性显示面板中，在柔性衬底10上设置有调整层11，且调整层11覆盖整个柔性衬底10，也就是说，图1、图2或图3中柔性衬底10的上表面被调整层11覆盖，不会暴露在外，当后续形成调整层11上方的功能膜层时，可以防止柔性衬底10的材料带来污染，例如，当在刻蚀腔室中对调整层11上方的膜进行刻蚀，以形成对应的功能膜层时，调整层11可以作为刻蚀阻挡层，防止对柔性衬底10进行刻蚀，从而可以防止刻蚀腔室被柔性衬底10的材料污染；再例如，防止柔性衬底10的材料对后续形成的功能膜层造成污染。
应用有本公开实施例中的柔性显示面板的柔性显示装置可以应用于不同的产品中，例如可以应用在手机、平板电脑、电子书等产品中，在此不一一列举说明。
在上述实施例中，保护层12与柔性显示面板中弯折区内的走线13对应，优选的，保护层12在柔性衬底10上的正投影与走线13在柔性衬底10上的正投影重合，进一步减小走线13下方的保护层12的覆盖面积，当对弯折区进行弯折时，保护层12内不易形成应力集中，且保护层12中的应力容易释放，进一步减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响。
请继续参阅图2或图3，在本公开实施例提供的柔性显示面板中，走线13与平坦化层15之间还可以设置钝化层14，弯折区被弯折时，钝化层14所承受的应力与保护层12所承受的应力相等。当对弯折区进行弯折时，钝化层14与保护层12相互配合，将应力释放出去，同时，弯折区被弯折时，钝化层14所承受的应力与保护层12所承受的应力相等，走线13在钝化层14和保护层12的牵扯下，走线13的上下两侧受力均匀，从而可以进一步减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响。
上述实施例中，弯折区被弯折时，钝化层14所承受的应力与保护层12所承受的应力相等，此时，当钝化层14的材料品质与保护层12的材料品质相当时，可以将钝化层14的厚度与保护层12的厚度设置为相等，以实现弯折区被弯折时，使得钝化层14所承受的应力与保护层12所承受的应力相等；当钝化层14的材料品质与保护层12的材料品质相差较大时，则需要根据材料品质的差异性来确定功能膜层的厚度，以实现弯折区被弯折时，使得钝化层14所承受的应力与保护层12所承受的应力相等。当在走线13与平坦化层15之间设置有钝化层14时，钝化层14的结构可以有多种，例如，请继续参阅图2，钝化层14可以覆盖弯折区内的走线13和调整层11，即钝化膜在沉积完成后，不再进行刻蚀等工艺，直接作为钝化层14。如此，可以减少制造柔性显示面板的工艺步骤，提高效率，降低成本。
或者，请继续参阅图3，钝化层14位于弯折区内的走线13上，且钝化层14与弯折区内的走线13对应，即钝化膜在沉积完成后，对钝化膜进行刻蚀，形成位于弯折区内的走线13上且与弯折区内的走线13对应的钝化层14，如此，钝化层14不覆盖弯折区内的走线13的侧面，可以减少应力由弯折区内的走线13的侧面传导至弯折区内的走线13的几率，并减少相邻的走线13之间应力传导的几率，从而可以减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响。
当钝化层14位于走线13上，且钝化层14与走线13对应时，当钝化层14的材料与保护层12的材料相同，或者，刻蚀形成钝化层14的刻蚀工艺与刻蚀形成保护层12的刻蚀工艺相同时，在制造柔性显示面板时，可以先沉积保护膜，然后在保护膜上形成走线13，然后沉积钝化膜，然后利用一个掩膜板，依次刻蚀钝化膜和保护膜，形成钝化层14和保护层12，以减少制造柔性显示面板的工艺步骤，提高效率，降低成本。
在上述实施例中，在保证弯折区被弯折时，钝化层14所承受的应力与保护层12所承受的应力相等的前提下，钝化层14的材料选择可以根据实际需要进行，例如，钝化层14的材料可以选用氧化硅、氮化硅、氮氧化硅、有机材料等。
在上述实施例中，调整层11的材料可以选用a-Si，本公开实施例提供的柔性显示面板中，显示区内的薄膜晶体管可以采用低温多晶硅薄膜晶体管，低温多晶硅薄膜晶体管包括有源层、源极、漏极和栅极，其中，有源层位于柔性衬底上，有源层为P型Si，由a-Si经掺杂制得，也就是说，有源层在调整层的基础上形成，栅极位于有源层上，源极和漏极分设于栅极两侧，并由a-Si经离子注入形成。如此，将调整层11的材料选用为a-Si，则无需额外形成调整层11，从而减少制造柔性显示面板的工艺步骤，提高效率，降低成本； 另外，在形成有源层时，直接在a-Si上经掺杂形成即可，无需进行刻蚀，进一步减少制造柔性显示面板的工艺步骤，提高效率，降低成本。
在上述实施例中，调整层11的厚度可以根据实际需要进行设定，例如，调整层11的厚度可以设定为小于或等于
Figure PCTCN2019088647-appb-000006
优选为小于或等于
Figure PCTCN2019088647-appb-000007
使得应力不易集中。
在上述实施例中，保护层12的材料可以根据实际需要进行选择，例如，保护层12的材料可以选择为氧化硅、氮化硅、氮氧化硅或者有机材料，在本公开实施例中，保护层12的材料优选为氧化硅，以防止在沉积保护膜时，保护膜的材料中的氢键对显示区内的薄膜晶体管造成不良影响。
在上述实施例中，保护层12与调整层11的配合，可以减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响，保护层12的厚度可以设定为较小，例如，保护层12的厚度可以设定为小于或等于
Figure PCTCN2019088647-appb-000008
优选为
Figure PCTCN2019088647-appb-000009
防止保护层12的厚度较厚而造成保护层12内容易发生应力集中。
为验证上述方案的有效性，在本公开实施例中，调整层11的材料选用为a-Si，调整层11的厚度选择为
Figure PCTCN2019088647-appb-000010
保护层12的材料选用为氧化硅，保护层12的厚度选择为
Figure PCTCN2019088647-appb-000011
钝化层14的材料选用为氮化硅或氧化硅，此时，钝化层14的材料品质与保护层12的材料品质相当，钝化层14的厚度与保护层12的厚度设定为相同，即钝化层14的厚度选择为
Figure PCTCN2019088647-appb-000012
经验证，调整层11的材料选用a-Si，厚度选择为
Figure PCTCN2019088647-appb-000013
保护层12的材料选用为氧化硅，厚度选择为
Figure PCTCN2019088647-appb-000014
有利于在调整层11上形成保护层12时，保护层12与调整层11之间形成一界面，该界面的形成，可以释放弯折区被弯折时的弯折力，缓解弯折区被弯折时保护层所承受的应力，可以有效地将应力释放出去，减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响；保护层12的材料选用为氧化硅，厚度选择为
Figure PCTCN2019088647-appb-000015
钝化层14的材料选用为氮化硅或氧化硅，厚度选择为
Figure PCTCN2019088647-appb-000016
钝化层14的材料品质与保护层12的材料品质相当，钝化层14的厚度与保护层12的厚度相等，实现弯折区被弯折时，钝化层14所承受的应力与保护层12所承受的应力相等，保护层12与钝化层14的配合可以有效地将应力释放出去，同时，弯折区被弯折时，钝化层14所承受的应力与保护层12所承受的应力相等，走线13在钝化层14和保护层12的牵扯下，走线13的上下两侧受力均匀，从而可以进一步减少走线13出现裂纹甚至断裂的现象的发生，防止走线13的导电功能受到不良影响。
本公开实施例还提供一种柔性显示装置，所述柔性显示装置包括如上述实施例所述的柔性显示面板。柔性显示装置可以应用于手机、平板电脑、电子书等产品中。
所述柔性显示装置与上述柔性显示面板相对于现有技术所具有的优势相同，在此不再赘述。
请参阅图4，本公开实施例还提供一种柔性显示面板的制造方法，用于制造上述实施例所述的柔性显示面板，所述柔性显示面板的制造方法包括：
步骤S11：形成柔性衬底。具体的，在形成柔性衬底前，提供一刚性基板，以承载柔性衬底，然后在刚性基板上形成柔性衬底，柔性衬底可以是单层结构，也可以是多层结构，柔性衬底的至少一层可以选用聚酰亚胺。
步骤S12：在柔性衬底上形成调整层，调整层覆盖整个柔性衬底。具体的，可以采用磁控溅射等方式在柔性衬底上形成覆盖整个柔性衬底的调整层，调整层可以为a-Si调整层，调整层的厚度为小于或等于
Figure PCTCN2019088647-appb-000017
优选小于或等于
Figure PCTCN2019088647-appb-000018
步骤S13：形成与柔性显示面板中弯折区内的走线对应的保护层。保护层在柔性衬底上的正投影与弯折区内的走线在柔性衬底上的正投影重合。
步骤S14：在保护层上形成走线。具体的，先沉积金属膜，然后利用掩膜版，采用刻蚀工艺对金属膜进行刻蚀，形成走线。
步骤S15：形成平坦化层，平坦化层位于走线上方、且覆盖柔性衬底上的功能膜层。具体的，采用气相沉积、涂覆等方式形成平坦化层，平坦化层覆盖柔性衬底上的功能膜层，以对功能膜层进行保护，同时方便后续膜层的形成。
本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于制造方法实施例而言，由于其基本相似于面板实施例，所以描述得比较简单，相关之处参见面板实施例的部分说明即可。
本公开实施例提供的柔性显示面板还可以包括设置在保护层与平坦化层之间的钝化层，此时，请继续参阅图4，在步骤S14之后以及步骤S15之前，所述柔性显示面板的制造方法还包括：
步骤S14’：形成钝化层。
其中，钝化层的结构形式可以多种，例如，请继续参阅图2，钝化层可以覆盖走线和调整层，即钝化膜在沉积完成后，不再进行刻蚀等工艺，直接作为钝化层，上述步骤S13、步骤S14和步骤S14’可以采用如下方式：形成保护膜，对保护膜进行刻蚀，形成与弯折区的走线对应的保护层；在保护层上形成走线；形成钝化层，钝化层覆盖弯折区内的走线和调整层。此时，请参阅图5，所述柔性显示面板的制造方法可以包括：
步骤S21：形成柔性衬底。
步骤S22：在柔性衬底上形成调整层，调整层覆盖整个柔性衬底。
步骤S23：形成保护膜。具体的，可以采用气相沉积等方式在调整层上形成保护膜，保护膜的材料选择为氧化硅，以防止保护膜的材料中的氢键对显示区内的薄膜晶体管造成不良影响。
步骤S24：对所述保护膜进行刻蚀，形成与弯折区内的走线对应的保护层。具体的，利用掩膜版，采用刻蚀工艺对保护膜进行刻蚀，形成与弯折区的走线对应的保护层。
步骤S25：在保护层上形成走线。
步骤S26：形成钝化层。具体的，采用气相沉积等方式形成钝化层，钝化层覆盖弯折区内的走线和调整层。
步骤S27：形成平坦化层，平坦化层位于钝化层上方、且覆盖柔性衬底上的功能膜层。
或者，请继续参阅图3，钝化层位于走线上，且钝化层与弯折区内的走线对应，即钝化膜在沉积完成后，对钝化膜进行刻蚀，形成位于弯折区内的走线上且与弯折区内的走线对应的钝化层，上述步骤S13、步骤S14和步骤S14’可以采用如下方式：形成保护膜；在保护膜上形成走线；形成钝化膜，对钝化膜和保护膜进行刻蚀，形成分别与弯折区内的走线对应的保护层和钝化层。此时，请参阅图6，所述柔性显示面板的制造方法可以包括：
步骤S31：形成柔性衬底。
步骤S32：在柔性衬底上形成调整层，调整层覆盖整个柔性衬底。
步骤S33：形成保护膜。具体的，可以采用气相沉积等方式在调整层上形成保护膜，保护膜的材料选择为氧化硅，以防止保护膜的材料中的氢键对显示区内的薄膜晶体管造成不良影响。
步骤S34：在保护膜上形成走线。
步骤S35：形成钝化膜。
步骤S36：对钝化膜和保护膜进行刻蚀，形成分别与弯折区内的走线对应的保护层和钝化层。
步骤S37：形成平坦化层，平坦化层位于钝化层上方、且覆盖柔性衬底上的功能膜层。
如此，对保护膜进行刻蚀以形成保护层的步骤与对钝化膜进行刻蚀以形成钝化层的步骤可以通过一次刻蚀工艺实现，减少了制造柔性显示面板的工艺步骤，提高效率，减少成本。
在本公开实施例中，柔性显示面板包括显示区和弯折区，显示区内的薄膜晶体管可以 采用如图4所示的结构，弯折区内结构采用如图3所示的结构，此时，请参阅图7，所述柔性显示面板的制造方法具体可以包括：
步骤S41：形成柔性衬底。
步骤S42：在柔性衬底上形成调整层，调整层覆盖整个柔性衬底。
步骤S43：对显示区内的调整层进行掺杂处理，形成显示区内薄膜晶体管的有源层。
步骤S44：在有缘层上形成栅极，并采用离子注入的方式在调整层上且位于栅极的两侧形成源极和漏极。
步骤S45：形成保护膜。
步骤S46：在位于显示区内的保护膜形成过孔，用于实现保护膜下方需要与走线连接的电极与走线的连接，例如，过孔可以与源极对应，实现源极与走线的连接。
步骤S47：对位于弯折区内的保护膜进行减薄处理，使得弯折区内保护膜的厚度小于或等于
Figure PCTCN2019088647-appb-000019
优选为
Figure PCTCN2019088647-appb-000020
步骤S48：形成走线，显示区内，走线通过保护膜中的过孔与保护膜下方的某一电极例如源极连接，弯折区内，走线位于保护层上。
步骤S49：形成钝化膜，钝化膜覆盖走线和保护膜。
步骤S50：对弯折区内的钝化膜和保护膜进行刻蚀，形成与弯折区内的走线对应的钝化层和保护层。弯折区内的走线和保护层以及钝化层三者在柔性衬底上的正投影重合。
步骤S51：形成平坦化层。
在本公开实施例提供的柔性显示面板的制造方法中，与现有技术中需要额外在弯折区内形成多层绝缘层相比，弯折区内的调整层、保护层、钝化层均可以与显示区内的共用，无需额外形成，因此，减少了制造柔性显示面板的工艺步骤，提高了效率，降低了成本。
以上各实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述各实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。

Claims (19)

  1. 一种柔性显示面板，包括显示区和位于所述显示区周边的弯折区，所述弯折区包括：
    柔性衬底；
    调整层，覆盖整个所述柔性衬底；
    保护层，位于所述调整层上；
    走线，位于所述保护层上；
    平坦化层，位于所述走线上方、且覆盖所述柔性衬底上的功能膜层；
    所述保护层与所述弯折区内的走线对应，所述弯折区内的走线在所述柔性衬底上的正投影落入所述保护层在所述柔性衬底上的正投影内；所述弯折区被弯折时，弯折应力通过所述调整层与所述保护层之间的界面释放，以缓解所述弯折区被弯折时所述保护层所承受的应力。
  2. 根据权利要求1所述的柔性显示面板，其中，所述保护层在所述柔性衬底上的正投影与所述弯折区内的走线在所述柔性衬底上的正投影重合。
  3. 根据权利要求1所述的柔性显示面板，其中，所述走线与所述平坦化层之间设置有钝化层，所述弯折区被弯折时，所述钝化层所承受的应力与所述保护层所承受的应力相等。
  4. 根据权利要求3所述的柔性显示面板，其中，所述钝化层为氧化硅钝化层、氮化硅钝化层、氮氧化硅钝化层或有机材料钝化层。
  5. 根据权利要求3所述的柔性显示面板，其中，所述钝化层覆盖所述弯折区内的走线和所述调整层。
  6. 根据权利要求3所述的柔性显示面板，其中，所述钝化层位于所述弯折区内的走线上，且与所述弯折区内的走线对应，所述钝化层在所述柔性衬底上的正投影与所述弯折区内的走线在所述柔性衬底上的正投影重合。
  7. 根据权利要求1所述的柔性显示面板，其中，所述调整层为a-Si层。
  8. 根据权利要求1所述的柔性显示面板，其中，所述调整层的厚度小于或等于
    Figure PCTCN2019088647-appb-100001
  9. 根据权利要求8所述的柔性显示面板，其中，所述调整层的厚度小于或等于
    Figure PCTCN2019088647-appb-100002
  10. 根据权利要求1所述的柔性显示面板，其中，所述保护层为氧化硅保护层。
  11. 根据权利要求1所述的柔性显示面板，其中，所述保护层的厚度小于或等于
    Figure PCTCN2019088647-appb-100003
  12. 根据权利要求11所述的柔性显示面板，其中，所述保护层的厚度为
    Figure PCTCN2019088647-appb-100004
  13. 根据权利要求1所述的柔性显示面板，其中，所述弯折区内相邻的走线之间不存在构成整体的保护层。
  14. 一种柔性显示装置，包括如权利要求1-13任一所述的柔性显示面板。
  15. 一种柔性显示面板的制造方法，包括：
    形成柔性衬底；
    在所述柔性衬底上形成调整层，所述调整层覆盖整个所述柔性衬底；
    在所述调整层上形成保护层；
    在所述保护层上形成走线；
    在所述走线上形成平坦化层，所述平坦化层位于弯折区的走线上方、且覆盖所述柔性衬底上的功能膜层，
    所述保护层与所述柔性显示面板中所述弯折区的走线对应，所述弯折区内的走线在所述柔性衬底上的正投影落入所述保护层在所述柔性衬底上的正投影内。
  16. 根据权利要求15所述的柔性显示面板的制造方法，还包括：
    形成钝化层，所述钝化层位于所述走线与所述平坦化层之间。
  17. 根据权利要求16所述的柔性显示面板的制造方法，其中，形成所述保护层、所述走线和所述钝化层，包括：
    形成保护膜；
    对所述保护膜进行刻蚀，形成与所述弯折区内的走线对应的所述保护层，所述弯折区内的走线在所述柔性衬底上的正投影与所述保护层在所述柔性衬底上的正投影重合；
    在所述保护层上形成所述走线；
    形成所述钝化层，所述钝化层覆盖所述弯折区内的走线和所述调整层。
  18. 根据权利要求16所述的柔性显示面板的制造方法，其中，形成所述保护层、所述走线和所述钝化层，包括：
    形成保护膜；
    在所述保护膜上形成所述走线；
    形成钝化膜，所述钝化膜覆盖所述弯折区内的走线和所述保护膜；
    对所述钝化膜和所述保护膜进行刻蚀，形成与所述弯折区内的走线对应的保护层，以及与所述弯折区内的走线对应的钝化层，所述弯折区内的走线和所述保护层以及所述钝化层三者在所述柔性衬底上的正投影重合。
  19. 根据权利要求15所述的柔性显示面板的制造方法，其中，所述弯折区内相邻的 走线之间不存在构成整体的保护层。
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