WO2020107796A1 - Panneau d'affichage et procédé de détection de fissures pour panneau d'affichage - Google Patents

Panneau d'affichage et procédé de détection de fissures pour panneau d'affichage Download PDF

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Publication number
WO2020107796A1
WO2020107796A1 PCT/CN2019/084501 CN2019084501W WO2020107796A1 WO 2020107796 A1 WO2020107796 A1 WO 2020107796A1 CN 2019084501 W CN2019084501 W CN 2019084501W WO 2020107796 A1 WO2020107796 A1 WO 2020107796A1
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WIPO (PCT)
Prior art keywords
ground
test
switch
display panel
display area
Prior art date
Application number
PCT/CN2019/084501
Other languages
English (en)
Chinese (zh)
Inventor
张鑫
薛景峰
苗思文
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/484,117 priority Critical patent/US11187742B2/en
Publication of WO2020107796A1 publication Critical patent/WO2020107796A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136254—Checking; Testing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits

Definitions

  • the present application relates to the field of electronic devices, and in particular to a display panel and a crack detection method of the display panel.
  • Embodiments of the present application provide a display panel and a crack detection method of the display panel to reduce the difficulty of crack detection of the display panel.
  • a display panel includes:
  • a panel body having a display area and a non-display area
  • ground wire located in the non-display area and surrounding the display area, the ground wire having a first end and a second end;
  • a first ground connection portion and a first test connection portion, the first ground connection portion and the first test connection portion are connected in parallel to the first end;
  • a second ground connection portion and a second test connection portion, the second ground connection portion and the second test connection portion are connected in parallel to the second end portion;
  • a first switch and a second switch the first switch is electrically connected to the first ground connection and the first Between the ends, the second switch is electrically connected between the second ground connection and the second end.
  • the first ground connection portion includes a first ground lead and a first ground pin, the first ground lead is electrically connected to the first switch and the Between the first ground pins, the second ground connection portion includes a second ground lead and a second ground pin, and the second ground lead is electrically connected to the second switch and the second ground pin between.
  • the first test connection portion includes a first test lead and a first test pin, the first test lead is electrically connected to the first end and Between the first test pins, the second test connection includes a second test lead and a second test pin, and the second test lead is electrically connected to the second end and the second ground Between pins.
  • the first switch and the second switch are both thin film transistor switches, and the first switch and the second switch are located in a non-display area of the panel body, so The first switch and the second switch are arranged in the same layer as the thin film transistor layer of the panel body.
  • the non-display area surrounds the display area, the non-display area includes a binding area, and the binding area is located on one side of the display area, The first ground connection, the first test connection, the second ground connection, the second test connection, the first switch, and the second switch are located in the binding area.
  • the display panel further includes a flexible circuit board, the flexible circuit board is electrically connected to one side of the panel body, the second ground connection portion and the first The second test connection is located on the flexible circuit board.
  • the display panel further includes a flexible circuit board, the flexible circuit board is electrically connected to one side of the panel body, the first ground connection portion, the first A test connection part, a second ground connection part, a second test connection part, a first switch and a second switch are located on the flexible circuit board.
  • the first end has a first electrical connection pad
  • the second end has a second electrical connection pad
  • the first ground connection and the first A test connection portion is electrically connected to the first electrical connection pad
  • the second ground connection portion and the second test connection portion are electrically connected to the second electrical connection pad
  • the first electrical connection pad and the first Two electrical connection pads are located in the non-display area.
  • a crack testing method of a display panel including: [0018] A display panel is provided, the display panel comprising:
  • a panel body having a display area and a non-display area
  • ground wire located in the non-display area and surrounding the display area, the ground wire having a first end and a second end;
  • a first ground connection portion and a first test connection portion, the first ground connection portion and the first test connection portion are connected in parallel to the first end;
  • a second ground connection portion and a second test connection portion, the second ground connection portion and the second test connection portion are connected in parallel to the second end portion;
  • a first switch and a second switch the first switch is electrically connected between the first ground connection and the first end, the second switch is electrically connected to the second ground connection Between the second end and the second end;
  • the first switch and the second switch input off voltage, so that between the first ground connection and the first end and A disconnection is formed between the second ground connection and the second end;
  • the judging whether the non-display area has a crack according to the voltage value, the resistance value or the current value includes:
  • the judging whether the non-display area has a crack according to the voltage value, the resistance value or the current value includes:
  • the judging whether the non-display area has a crack according to the voltage value, the resistance value or the current value includes:
  • the according to the voltage value or The step of determining whether there is a crack in the non-display area by the resistance value further includes:
  • the resistance value is within a preset resistance range, or the current value is within a preset current range, it is determined that the ground wire is normal and the non-display area is not Cracks
  • the first ground connection portion includes a first ground lead and a first ground pin, and the first ground lead is electrically connected to the first Between a switch and the first ground pin, the second ground connection portion includes a second ground lead and a second ground pin, and the second ground lead is electrically connected to the second switch and the first ground pin Between the two ground pins.
  • the first test connection portion includes a first test lead and a first test pin, and the first test lead is electrically connected to the first Between one end and the first test pin, the second test connection part includes a second test lead and a second test pin, and the second test lead is electrically connected to the second end and the Between the second ground pins.
  • the first switch and the second switch are both thin-film transistor switches, and the first switch and the second switch are located on the non- In the display area, the first switch and the second switch are arranged in the same layer as the thin film transistor layer of the panel body.
  • the non-display area surrounds the display area, the non-display area includes a binding area, and the binding area is located in the display area On one side, the first ground connection, the first test connection, the second ground connection, the second test connection, the first switch, and the second switch are located in the binding area.
  • the display panel further includes a flexible circuit board, the flexible circuit board is electrically connected to one side of the panel body, and the second ground The connection part and the second test connection part are located on the flexible circuit board.
  • the display panel further includes a flexible circuit board, the flexible circuit board is electrically connected to one side of the panel body, and the first ground The connection part, the first test connection part, the second ground connection part, the second test connection part, the first switch and the second switch are located on the flexible circuit board.
  • the first end has a first electrical connection pad
  • the second end has a second electrical connection pad
  • the first ground Connection and first test The connection part is electrically connected to the first electrical connection pad
  • the second ground connection part and the second test connection part are electrically connected to the second electrical connection pad
  • the first electrical connection pad and the second electrical connection pad The connection pad is located in the non-display area.
  • the present application provides a display panel and a crack detection method of the display panel.
  • the display panel includes a panel body, a ground wire, a first ground connection, a first test connection, a second ground connection, a second test connection, a first switch, and a second switch, and the panel body has a display area And a non-display area, the ground wire is located in the non-display area and is arranged around the display area, the ground wire has a first end and a second end, the first ground connection and the first test The connection portion is parallel to the first end portion, the second ground connection portion and the second test connection portion are parallel to the second end portion, and the first switch is electrically connected to the first ground connection portion and the Between the first end, the second switch is electrically connected between the second ground connection and the second end, by measuring the first test connection and the second test connection Between the voltage value, the resistance value or the current value, when the voltage value is zero, the resistance value is infinity, or the current value is zero, it is determined that there is a diss
  • FIG. 1 is a schematic structural diagram of a first implementation manner of a display panel provided by the present application.
  • FIG. 2 is a schematic structural diagram of a second implementation manner of a display panel provided by this application.
  • FIG. 3 is a schematic structural diagram of a third implementation manner of a display panel provided by this application.
  • FIG. 4 is a schematic structural diagram of a fourth implementation manner of a display panel provided by the present application.
  • the display panel 10 includes a panel body 11, a ground wire 12, a first ground connection 13, a first test connection 14, a second ground connection 15, a second test connection 16, a first switch 17, and a second switch 18.
  • the panel body 11 has a display area 11a and a non-display area 11b.
  • the display panel 10 may be a liquid crystal display panel or an organic light emitting diode display panel.
  • the ground wire 12 is located in the non-display area 11b.
  • the ground wire 12 is disposed around the display area 11a.
  • the ground wire 12 has a first end 121 and a second end 122.
  • the ground wire 12 may be provided in the same layer as the metal layer of the display panel 10.
  • the first ground connection portion 13 and the first test connection portion 14 are parallel to the first end portion 121.
  • the first end 121 is provided with a first electrical connection pad 1211.
  • the first ground connection portion 13 and the first test connection portion 14 are both electrically connected to the first electrical connection pad 1211.
  • the first switch 17 is electrically connected between the first ground connection 13 and the first end 121.
  • the first ground connection portion 13 includes a first ground lead 131 and a first ground pin 132.
  • the first ground lead 131 is electrically connected between the first switch 17 and the first ground pin 132.
  • the first test connection 14 includes a first test lead 141 and a first test pin 142.
  • the first test lead 141 is electrically connected between the first end 121 and the first test pin 142.
  • the second ground connection portion 15 and the second test connection portion 16 are parallel to the second end portion 122.
  • the second end 122 is provided with a second electrical connection pad 1221.
  • the second ground connection 15 and the second test connection 16 are both electrically connected to the second electrical connection pad 1221.
  • the second switch 18 is electrically connected between the second ground connection 15 and the second end 122.
  • the second ground connection portion 15 includes a second ground lead 151 and a second ground pin 152.
  • the second ground lead 151 is electrically connected between the second switch 18 and the second ground pin 152.
  • the second test connection 16 includes a second test lead 161 and a second test pin 162.
  • the second test lead 161 is electrically connected between the second end 122 and the second test pin 162.
  • the first switch 17 and the second switch 18 are both thin film transistor switches.
  • the first switch 17 and the second switch 18 are both arranged in the same layer as the thin film transistor layer of the display panel 10.
  • the first switch 17 may include a first switch body 171, a first switch lead 172, and a first switch pin 173.
  • the first switch body 171 is electrically connected between the first ground connection portion 13 and the first end 121.
  • the first switch lead 172 is electrically connected between the first switch body 171 and the first switch pin 173, and a control circuit is connected through the first switch pin 173 to input the first switch 17 Turn on or turn off the voltage.
  • the second switch 18 may include a second switch body 181, a second switch lead 182, and a second switch pin 183.
  • the second switch body 181 is electrically connected between the second ground connection 15 and the second end 122.
  • the second switch lead 182 is electrically connected between the second switch body 181 and the second switch pin 183, and a control circuit is connected through the second switch pin 183 to input to the second switch 18 Turn on or turn off the voltage.
  • the non-display area 11b surrounds the display area 11a.
  • the non-display area l ib includes a binding area l lbl.
  • the binding area 111b is located on one side of the display area 11a.
  • the first ground connection portion 13, the first test connection portion 14, the second ground connection portion 15, the second test connection portion 16, the first switch 17 and the second switch 18 are located in the binding area 111b.
  • the second test leads 161 can all be arranged in the same layer as the metal layer of the display panel 10.
  • the first switch body 171 and the second switch body 181 may be disposed in the same layer as the thin film transistor layer of the display panel 10.
  • the first ground pin 132, the second ground pin 152, the first test pin 142, the second test pin 162, the first switch pin 173 and the second switch pin 183 are all provided on the display panel 10 on the edge.
  • the present application also provides a display panel 10.
  • the display panel 10 shown in FIG. 2 is different from the display panel 10 shown in FIG. 1 in that it further includes a flexible circuit board 19.
  • the flexible circuit board 19 is electrically connected to one side of the display panel 10.
  • the ground wire 12, the first electrical connection pad 1211, the second electrical connection pad 1 221, a portion of the first switch lead 172, a portion of the second switch lead 182, a portion of the first ground lead 131, a portion of the second ground lead 151, test lead 141 and a first portion of the second test lead 161 can be the same layer as the metal layer is provided with the display panel 10, and is disposed on the display panel 10 of the non-display area 11b, thereby achieving a narrow border of the display panel 10.
  • the switch pin 173 and the second switch pin 183 are both provided on the display panel 10.
  • the first ground pin 132, the second ground pin 152, the first test pin 142, the second test pin 162, the first switch pin 173 and the second switch pin 183 are all provided on the display panel 10 are all disposed on the edge of the flexible circuit board 19.
  • the present application also provides a display panel 10.
  • the difference between the display panel 10 shown in FIG. 3 and the display panel 10 shown in FIG. 1 is that a flexible circuit board 19 is also included.
  • the flexible circuit board 19 is electrically connected to one side of the display panel 10.
  • the ground wire 12, the first electrical connection pad 1211, and the second electrical connection pad 1 221 can all be disposed in the same layer as the metal layer of the display panel 10, and are disposed in the non-display area 11b of the display panel 10, thereby A display panel 10 with a narrow bezel is realized.
  • the first switch 17, the second switch 18, the first ground connection 13, the second ground connection 15, the first test connection 14, and the second test connection 16 are all provided on the display panel 10, specifically ,
  • the first switch body 171, the second switch body 181, the first switch lead 172, the second switch lead 182, the first ground lead 131, the second ground lead 151, the first test lead 141, the second test lead 161, the first ground pin 132, the second ground pin 152, the first test pin 142, the second test pin 162, the first switch pin 173, and the second switch pin 183 are all provided on the display panel 10.
  • the first ground pin 132, the second ground pin 152, the first test pin 142, the second test pin 162, the first switch pin 173 and the second switch pin 183 are all provided on the display panel 10 are all disposed on the edge of the flexible circuit board 19.
  • the present application also provides a display panel 10.
  • the display panel 10 shown in FIG. 4 is different from the display panel 10 shown in FIG. 1 in that it further includes a flexible circuit board 19.
  • the flexible circuit board 19 is electrically connected to one side of the display panel 10.
  • the ground wire 12 may be disposed in the same layer as the metal layer of the display panel 10 and disposed in the non-display area 11b of the display panel 10, so as to realize a narrow-frame display panel 10.
  • the first electrical connection pad 1211, the second electrical connection pad 1221, the first switch 17, the second switch 18, the first ground connection 13, the second ground connection 15, the first test connection 14, the second test The connection portions 16 are all provided on the display panel 10.
  • the second switch lead 18 2 the first ground lead 131, the second ground lead 151, the first test lead 141, the second test lead 161, the first ground pin 132, the second ground pin 152, the first test plug Pin 142, second test pin 162
  • the first switch pin 173 and the second switch pin 183 are both provided on the display panel 10.
  • the first ground pin 132, the second ground pin 152, the first test pin 142, the second test pin 162, the first switch pin 173 and the second switch pin 183 are all provided on the display panel 10 are all disposed on the edge of the flexible circuit board 19.
  • the present application also provides a crack test method for a display panel.
  • the display panel 10 is as described above and will not be repeated here.
  • the voltage value, the resistance value, or the current value can determine whether the grounding wire 12 is broken, so as to infer whether the display panel 10 has a crack.
  • the voltmeter When a voltmeter is used to measure the voltage value, the voltmeter is electrically connected between the first test pin 142 and the second test pin 162, when the voltage value is zero, that is, the If there is a disconnection in the grounding wire 12, it is determined that there is a crack in the non-display area l ib; when the voltage value is within a preset voltage range, that is, the grounding wire 12 is in a normal conduction state, the grounding is determined The wire 12 is normal and there is no crack in the non-display area 11b.
  • the resistance meter When a resistance meter is used for resistance value measurement, the resistance meter is electrically connected between the first test pin 142 and the second test pin 162, and when the resistance value is infinite, that is, the If there is a disconnection in the ground wire 12, it is determined that there is a crack in the non-display area l ib; when the resistance value is within a preset resistance range, that is, the ground wire 12 is in a normal conduction state, the ground is determined The wire 12 is normal and there is no crack in the non-display area 11b.
  • the ammeter When an ammeter is used for current value measurement, the ammeter is electrically connected between the first test pin 142 and the second test pin 162, and when the current value is zero, that is, the ground wire If there is an open circuit in 12, it is determined that there is a crack in the non-display area l ib; when the current value is within a preset current range, also That is, the ground wire 12 is in a normal conduction state, and it is determined that the ground wire 12 is normal and that there is no crack in the non-display area 11b.
  • the present application provides a display panel and a crack detection method of the display panel.
  • the display panel includes a panel body, a ground wire, a first ground connection, a first test connection, a second ground connection, a second test connection, a first switch, and a second switch, and the panel body has a display area And a non-display area, the ground wire is located in the non-display area and is arranged around the display area, the ground wire has a first end and a second end, the first ground connection and the first test The connection portion is parallel to the first end portion, the second ground connection portion and the second test connection portion are parallel to the second end portion, and the first switch is electrically connected to the first ground connection portion and the Between the first end, the second switch is electrically connected between the second ground connection and the second end, by measuring the first test connection and the second test connection Between the voltage value, the resistance value or the current value, when the voltage value is zero, the resistance value is infinity, or the current value is zero, it is determined that there is a diss

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  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)

Abstract

L'invention concerne un panneau d'affichage (10) et un procédé de détection de fissures pour le panneau d'affichage (10). Le panneau d'affichage (10) comprend un corps principal de panneau (11), un conducteur de mise à la terre (12), une première partie de connexion à la terre (13), une première partie de connexion de test (14), une seconde partie de connexion à la terre (15), une seconde partie de connexion de test (16), un premier commutateur (17) et un second commutateur (18). Le conducteur de mise à la terre (12) entoure une zone d'affichage (11a). La première partie de connexion à la terre (13) et la première partie de connexion de test (14) sont connectées en parallèle à une extrémité du conducteur de mise à la terre (12). La seconde partie de connexion à la terre (15) et la seconde partie de connexion de test (16) sont connectées en parallèle à l'autre extrémité du conducteur de mise à la terre (12). Le premier commutateur (17) est connecté électriquement entre la première partie de connexion à la terre (13) et une extrémité du conducteur de mise à la terre (12), et le second commutateur (18) est connecté électriquement entre la seconde partie de connexion à la terre (15) et l'autre extrémité du conducteur de mise à la terre (12). Le panneau d'affichage (10) et le procédé de détection de fissures associé réduisent la difficulté de détection des fissures.
PCT/CN2019/084501 2018-11-30 2019-04-26 Panneau d'affichage et procédé de détection de fissures pour panneau d'affichage WO2020107796A1 (fr)

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