WO2020075216A1 - 部品実装装置 - Google Patents

部品実装装置 Download PDF

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Publication number
WO2020075216A1
WO2020075216A1 PCT/JP2018/037534 JP2018037534W WO2020075216A1 WO 2020075216 A1 WO2020075216 A1 WO 2020075216A1 JP 2018037534 W JP2018037534 W JP 2018037534W WO 2020075216 A1 WO2020075216 A1 WO 2020075216A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
component
substrate
wafer
parts
Prior art date
Application number
PCT/JP2018/037534
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
大介 春日
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2018/037534 priority Critical patent/WO2020075216A1/ja
Priority to JP2020551072A priority patent/JP7159337B2/ja
Priority to CN201880098101.3A priority patent/CN112772014B/zh
Priority to KR1020217004531A priority patent/KR102493189B1/ko
Publication of WO2020075216A1 publication Critical patent/WO2020075216A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • a component mounting apparatus capable of suppressing deterioration of component quality and mounting components of the same rank in each of a plurality of package regions of a board. Can be provided.
  • FIG. 9A is a diagram showing a wafer in which components for one group according to the second embodiment are mounted
  • FIG. 8B is a diagram showing a wafer in which components are transferred to a substrate according to the second embodiment. It is the figure which showed the board
  • A) is a diagram showing a wafer in a state where components for two groups according to the second embodiment are mounted
  • (B) is a diagram in which the transfer order of the components onto the substrate according to the second embodiment is changed.
  • FIG. 1 It is the figure which showed the board
  • A is a diagram showing a wafer in a state where components for three groups according to the second embodiment are mounted
  • (B) is a diagram in which the transfer order of the components onto the substrate according to the second embodiment is changed. It is the figure which showed the board
  • FIG. 13A is a diagram showing a wafer in a state in which components for two stages according to the third embodiment are transferred
  • FIG. 9B is a diagram showing a sequence in which components are transferred to an intermediate stage according to the third embodiment. It is a figure which showed the intermediate stage of the state which transferred the components for two stages
  • (C) is the figure which showed the board
  • (D) are diagrams showing a substrate in which components for the stage 2 according to the third embodiment are mounted. It is a flow chart for explaining transfer order change processing of a component mounting device by a 3rd embodiment. It is a flow chart for explaining component mounting processing of a component mounting device by a 3rd embodiment.
  • the substrate P includes a plurality of package regions P1.
  • the package area P1 indicates a unit that becomes a product.
  • Each of the plurality of package regions P1 is divided into individual products after the production of the substrate P is completed, and individually becomes a product.
  • the same number of components E of the same type are mounted in each of the plurality of package regions P1.
  • the substrate P includes 40 package regions P1 of 4 rows ⁇ 10 columns will be described.
  • the substrate P may include a plurality of package regions P1 other than 40.
  • two components E a total of 80 components E on one board
  • three or more components E may be mounted in one package area P1.
  • the first to tenth components E from the wafer W are adsorbed in the order of arrangement of the components E.
  • the component E is mounted on the package region P1 on the first row of the substrate P.
  • the 11th to 20th parts E from the wafer W are further adsorbed in the order of arrangement of the parts E.
  • the component E is mounted not only on the package area P1 in the first row of, but also in a part of the package area P1 in the second row of the substrate P.
  • step S12 the transfer order of the components E to the board P is changed.
  • the transfer order of the parts E is changed for the remaining parts E whose transfer order has not been changed among the parts E to be sucked for one substrate.
  • the process proceeds to step S3. Then, the suction of the component E from the wafer W and the mounting of the component E on the substrate P are continued.
  • step S102 the maximum mounted number for performing the allocation is acquired.
  • the maximum mounting number is “20”.
  • step S104 the number of parts E for each rank that can be assigned to one group is acquired.
  • the number of assignable parts E is half the number of extracted parts E.
  • 6 is acquired as the number of assignable rank 1 parts E
  • 4 is acquired as the assignable rank 2 parts E.
PCT/JP2018/037534 2018-10-09 2018-10-09 部品実装装置 WO2020075216A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2018/037534 WO2020075216A1 (ja) 2018-10-09 2018-10-09 部品実装装置
JP2020551072A JP7159337B2 (ja) 2018-10-09 2018-10-09 部品実装装置
CN201880098101.3A CN112772014B (zh) 2018-10-09 2018-10-09 零件安装装置
KR1020217004531A KR102493189B1 (ko) 2018-10-09 2018-10-09 부품 실장 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/037534 WO2020075216A1 (ja) 2018-10-09 2018-10-09 部品実装装置

Publications (1)

Publication Number Publication Date
WO2020075216A1 true WO2020075216A1 (ja) 2020-04-16

Family

ID=70163669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/037534 WO2020075216A1 (ja) 2018-10-09 2018-10-09 部品実装装置

Country Status (4)

Country Link
JP (1) JP7159337B2 (zh)
KR (1) KR102493189B1 (zh)
CN (1) CN112772014B (zh)
WO (1) WO2020075216A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022139913A (ja) * 2021-03-12 2022-09-26 キヤノンマシナリー株式会社 ボンディング装置、及びボンディング方法
JP2022139910A (ja) * 2021-03-12 2022-09-26 キヤノンマシナリー株式会社 ボンディング装置、及びボンディング方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022204077A1 (de) * 2022-04-27 2023-11-02 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Ermitteln einer Abpickreihenfolge für eine Halbleiter-Bestückungseinrichtung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292933A (ja) * 1985-06-20 1986-12-23 Rohm Co Ltd ペレツトピツクアツプ方法および装置
JP2013026537A (ja) * 2011-07-25 2013-02-04 Panasonic Corp チップピックアップ方法およびチップ実装方法ならびにチップ実装装置
WO2014157134A1 (ja) * 2013-03-28 2014-10-02 東レエンジニアリング株式会社 実装方法および実装装置
WO2014207803A1 (ja) * 2013-06-24 2014-12-31 富士機械製造株式会社 部品実装システム及び部品実装方法
WO2017164254A1 (ja) * 2016-03-22 2017-09-28 株式会社新川 基板供給ユニット及びボンディング装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013108368A1 (ja) 2012-01-17 2013-07-25 パイオニア株式会社 電子部品実装装置および電子部品実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292933A (ja) * 1985-06-20 1986-12-23 Rohm Co Ltd ペレツトピツクアツプ方法および装置
JP2013026537A (ja) * 2011-07-25 2013-02-04 Panasonic Corp チップピックアップ方法およびチップ実装方法ならびにチップ実装装置
WO2014157134A1 (ja) * 2013-03-28 2014-10-02 東レエンジニアリング株式会社 実装方法および実装装置
WO2014207803A1 (ja) * 2013-06-24 2014-12-31 富士機械製造株式会社 部品実装システム及び部品実装方法
WO2017164254A1 (ja) * 2016-03-22 2017-09-28 株式会社新川 基板供給ユニット及びボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022139913A (ja) * 2021-03-12 2022-09-26 キヤノンマシナリー株式会社 ボンディング装置、及びボンディング方法
JP2022139910A (ja) * 2021-03-12 2022-09-26 キヤノンマシナリー株式会社 ボンディング装置、及びボンディング方法

Also Published As

Publication number Publication date
KR102493189B1 (ko) 2023-01-30
JPWO2020075216A1 (ja) 2021-09-02
CN112772014B (zh) 2022-10-14
JP7159337B2 (ja) 2022-10-24
KR20210027490A (ko) 2021-03-10
CN112772014A (zh) 2021-05-07

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