WO2020067232A1 - 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法 - Google Patents

導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法 Download PDF

Info

Publication number
WO2020067232A1
WO2020067232A1 PCT/JP2019/037746 JP2019037746W WO2020067232A1 WO 2020067232 A1 WO2020067232 A1 WO 2020067232A1 JP 2019037746 W JP2019037746 W JP 2019037746W WO 2020067232 A1 WO2020067232 A1 WO 2020067232A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
conductive member
group
plating
precursor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/037746
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
岳史 成田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to CN201980062390.6A priority Critical patent/CN112740157B/zh
Priority to JP2020549321A priority patent/JP7031006B2/ja
Publication of WO2020067232A1 publication Critical patent/WO2020067232A1/ja
Priority to US17/205,693 priority patent/US11385745B2/en
Anticipated expiration legal-status Critical
Priority to JP2022024539A priority patent/JP7402908B2/ja
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
    • B29C39/20—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
    • B32B23/04—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
    • B32B23/04—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B23/08—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/752—Measuring equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the present invention relates to a method for manufacturing a conductive member, a touch panel sensor, a touch panel, and a molded body.
  • a conductive film in which a metal layer (preferably a patterned metal layer) is disposed on a substrate is used for various applications. For example, in recent years, with an increase in the mounting rate of a touch panel on a mobile phone, a mobile game device, or the like, demand for a conductive film for a capacitive touch panel sensor capable of detecting multiple points has been rapidly expanding.
  • Patent Document 1 Various methods for producing a conductive film have been proposed, and for example, a method using plating has been proposed.
  • a pattern formed using a composition for forming a plated layer containing a resin having a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof and a polyfunctional acrylamide compound is described.
  • a method is disclosed in which a conductive layer is formed by forming a plate-like layer to be plated and forming a metal layer on the layer to be plated by plating.
  • Patent Document 1 also discloses a method of manufacturing a three-dimensional wiring board by further applying a resin layer to the conductive film by insert injection molding in order to improve the self-supporting property of the obtained conductive film. doing.
  • the present inventors made a study on a conductive film (conductive member) and a molded product in which a resin layer was laminated on the conductive member with reference to Patent Literature 1, and examined a pattern-like plating target layer.
  • the metal layer disposed thereon is in the form of a mesh in which a plurality of thin metal wires intersect
  • the thin metal wires may be formed during a process in which a conductive member such as insert injection molding is exposed to a high-temperature and / or high-pressure environment. It was clarified that there was a possibility of disconnection.
  • the conductive member is also required to be hard to break the thin metal wires in the conductive member even when subjected to an impact (in other words, to be excellent in impact resistance).
  • an object of the present invention is to provide a conductive member that suppresses breakage of fine metal wires when applied to a process that is exposed to a high-temperature and / or high-pressure environment, and that also has excellent impact resistance.
  • Another object of the present invention is to provide a touch panel sensor and a touch panel using the conductive member.
  • Another object of the present invention is to provide a method for producing a molded article using the conductive member.
  • the present inventors have conducted intensive studies to achieve the above object, and as a result, have found that a conductive member having a predetermined configuration can solve the above object, and have completed the present invention.
  • a base material An intermediate layer disposed on at least one surface of the base material, A patterned plated layer having a functional group that interacts with the plating catalyst or a precursor thereof, which is arranged in a mesh on the intermediate layer, A mesh-shaped metal layer arranged on the pattern-form plated layer and having a plurality of thin metal wires crossing each other, And a protective layer disposed on the metal layer, a conductive member having: When the elastic modulus at 25 ° C. of the base material is a and the elastic modulus at 25 ° C.
  • the intermediate layer is b, the following formula A is satisfied; Formula A: 0.010 ⁇ b / a ⁇ 0.500
  • the area ratio of the metal layer is 0.2 to 60%
  • the conductive member according to [1] or [2], wherein the thickness of the intermediate layer is 0.2 to 5.0 ⁇ m.
  • the pattern-like plated layer is A layer to be formed by forming a plating layer precursor layer containing the following compound X or composition Y on the intermediate layer, and subjecting the plating layer precursor layer to an exposure treatment in a mesh shape.
  • the conductive member according to any one of [1] to [3].
  • Compound X a compound having a functional group that interacts with a plating catalyst or a precursor thereof, and a polymerizable group.
  • Composition Y a compound having a functional group that interacts with a plating catalyst or a precursor thereof, and a polymerizable group.
  • COMPOSITION CONTAINING COMPOUND HAVING [5]
  • the metal layer is formed by applying a plating catalyst or a precursor thereof to the patterned plating layer and performing a plating treatment on the patterned plating layer to which the plating catalyst or the precursor thereof is applied.
  • the conductive member according to any one of [1] to [6] which satisfies the following formula B.
  • a touch panel sensor including the conductive member according to any one of [1] to [7].
  • a touch panel including the conductive member according to any one of [1] to [7].
  • a method for producing a molded article using the conductive member according to any one of [1] to [7] The conductive member is disposed on one of the first mold and the second mold such that the base material and the one mold face each other. The second mold is clamped, and a resin is injected into a mold cavity formed by the first mold and the second mold to obtain a molded body including the conductive member and the resin layer.
  • a method for producing a molded article comprising:
  • the disconnection of a thin metal wire is suppressed when applied to the process exposed to a high temperature and / or a high pressure environment, and it can provide the conductive member excellent also in impact resistance.
  • a touch panel sensor and a touch panel using the conductive member can be provided.
  • the present invention can provide a method for producing a molded article using the above-mentioned conductive member.
  • FIG. 3 is a cross-sectional view of a conductive member 12.
  • FIG. 3 is a cross-sectional view of the conductive member 12 taken along line AA.
  • FIG. 3 is a cross-sectional view of the conductive member 12 taken along line BB.
  • FIG. 4 is a schematic diagram illustrating a method for measuring an area ratio (%) of a metal layer 8 of a conductive member 12. It is a schematic diagram which shows an example of the aspect which applies a conductive member to a touch panel sensor.
  • a numerical range represented by using “to” means a range including numerical values described before and after “to” as a lower limit and an upper limit.
  • actinic ray or “radiation” refers to, for example, an emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV: Extreme ultraviolet lithography light), X-rays, and the like. Means electron beam and the like.
  • light means actinic rays and radiation.
  • exposure in the present specification means not only exposure with far-ultraviolet rays such as mercury lamps and excimer lasers, X-rays, and EUV light, but also particle beams such as electron beams and ion beams. Also includes drawing by.
  • (meth) acryl represents either acryl or methacryl.
  • the present inventors examined the cause of breakage of a mesh-like metal layer in a conductive member in a process exposed to a high-temperature and / or high-pressure environment (hereinafter, also referred to as a “high-temperature and high-pressure process”). If the area ratio of the metal layer is less than or equal to a predetermined value, and a conductive member having the mesh-like metal layer disposed between the intermediate layer and the protective layer, each of which is adjusted to a predetermined elastic modulus, a high-temperature high-pressure process It has been found that disconnection of a thin metal wire is suppressed. Furthermore, according to the above configuration, it has been clarified that the conductive member is also excellent in impact resistance.
  • the conductive member does not easily break the thin metal wires constituting the mesh-like metal layer even when subjected to an impact.
  • preferred embodiments of the conductive member of the present invention will be described with reference to the drawings.
  • FIG. 1 is a schematic cross-sectional view of a first embodiment of the conductive member of the present invention.
  • the conductive member 12 according to the first embodiment includes a substrate 2, an intermediate layer 4 disposed on at least one surface of the substrate 2, and a patterned plated member disposed on the intermediate layer in a mesh shape.
  • a protective layer 10 arranged to cover the protective layer 8.
  • the conductive member 12 satisfies the following formula A, where a represents the elastic modulus at 25 ° C. of the substrate 2 and b represents the elastic modulus of the intermediate layer 4 at 25 ° C.
  • Formula A 0.010 ⁇ b / a ⁇ 0.500
  • the elastic modulus at 25 ° C. of the base material 2 means that the conductive member 12 is cut using an ultramicrotome, and the area of the base material 2 in the cut-out cross section is measured in a 25 ° C. environment. Values measured by AFM (atomic force microscope). Further, the elastic modulus at 25 ° C.
  • the conductive member 12 is cut using an ultramicrotome, and the region of the intermediate layer 4 in the cut-out cross section is used as a measurement surface under an environment of 25 ° C.
  • the value measured by AFM is intended.
  • the AFM for example, an MFP-3D Infinity type AFM manufactured by Asylum can be used.
  • the unit of the elastic modulus a and the elastic modulus b is GPa.
  • the value represented by b / a is preferably 0.400 or less, more preferably 0.300 or less, in that the breaking of the thin metal wire in the high-temperature and high-pressure process is more suppressed and / or the impact resistance is more excellent. Is more preferable, and 0.200 or less is still more preferable. That is, it is preferable to satisfy Expression B.
  • Formula B 0.010 ⁇ b / a ⁇ 0.200
  • the area ratio of the metal layer 8 is 0.2 to 60%, and the elastic modulus at 25 ° C. of the protective layer 10 is 0.10 to 5.00 GPa.
  • the configuration of the conductive member 12 will be described in detail.
  • the type of the substrate 2 is not particularly limited as long as it has a main surface and supports the intermediate layer 4.
  • a flexible substrate preferably an insulating substrate
  • a resin substrate is more preferable.
  • the transmittance of the substrate 2 to visible light (wavelength: 400 to 800 nm) is preferably 60% or more, more preferably 80% or more, still more preferably 90% or more, and 95% or more. It is particularly preferable that the above is satisfied.
  • the upper limit of the transmittance is 100% or less.
  • the material constituting the resin base material examples include a polycarbonate resin, a polyether sulfone resin, a poly (meth) acrylic resin, a polyurethane resin, a polyester resin (such as polyethylene terephthalate and polyethylene naphthalate), and a polysulfone resin. Resins, polyamide resins, polyarylate resins, polyolefin resins (for example, polypropylene resin (PP)), cellulose resins, polyvinyl chloride resins, cycloolefin resins, and the like. As a material constituting the resin base material, a polycarbonate resin is particularly preferable.
  • the thickness of the substrate 2 is not particularly limited, but is preferably 0.01 to 0.5 mm, more preferably 0.03 to 0.2 mm, from the viewpoint of balance between handleability and thinning.
  • the base material 2 may have a multi-layer structure, and for example, may include a functional film as one layer thereof.
  • the base material itself may be a functional film.
  • the elastic modulus of the base material 2 at 25 ° C. is preferably 0.10 to 20.0 GPa in that the breaking of the thin metal wire in the high-temperature and high-pressure process is further suppressed and / or the impact resistance is more excellent. 0.10 to 10.0 GPa is more preferable, and 1.00 to 7.00 GPa is still more preferable.
  • the method of measuring the elastic modulus of the substrate 2 at 25 ° C. is as described above.
  • the intermediate layer 4 is a layer for improving the adhesion between the base material 2 and the patterned plated layer 6.
  • the elastic modulus of the intermediate layer 4 at 25 ° C. is preferably 0.005 to 5.00 GPa in that the breaking of the thin metal wire in the high-temperature and high-pressure process is further suppressed and / or the impact resistance is more excellent.
  • 0.05 to 1.00 GPa is more preferable, 0.10 to 1.00 GPa is further preferable, and 0.10 to 0.50 GPa is particularly preferable.
  • the method for measuring the elastic modulus of the intermediate layer 4 at 25 ° C. is as described above.
  • the thickness of the intermediate layer 4 is not particularly limited, and is generally preferably 0.01 to 50 ⁇ m, more preferably 0.1 to 15 ⁇ m, and still more preferably 0.2 to 5.0 ⁇ m.
  • the material of the intermediate layer 4 is not particularly limited, and includes a resin having good adhesion to a base material.
  • a resin having good adhesion to a base material examples include isocyanate resins, phenoxy resins, polyether sulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenyl ether, polyether imide, and ABS resins (acrylonitrile-butadiene-styrene copolymer).
  • the material of the intermediate layer 4 is preferably a polyurethane-based resin and a poly (meth) acryl-based resin, more preferably a polyurethane-based resin, in that the disconnection of the thin metal wire in the high-temperature and high-pressure process is further suppressed.
  • the material for forming the polyurethane resin include AITRON Z-913-3 (manufactured by Aika Kogyo Co., Ltd.).
  • Examples of the material for forming the poly (meth) acrylic resin include polyethylene glycol diacrylate.
  • Aronix M240 manufactured by Toagosei Co., Ltd.
  • the patterned plating layer 6 is disposed on the intermediate layer 4 and has a mesh pattern (mesh pattern). As will be described later, the patterned plating layer 6 has a functional group that interacts with the plating catalyst or its precursor. Therefore, the metal layer 8 can be formed on the patterned plated layer 6 by performing the plating process on the patterned plated layer 6. That is, the metal layer 8 having a mesh pattern can be formed.
  • FIG. 2 is a partially enlarged view of a section taken along line AA in FIG.
  • patterned to be plated layer 6 is composed of a plurality of thin wires 14 are disposed on the intermediate layer 4 as a mesh-like pattern comprising a plurality of openings T A by thin lines 14 intersecting .
  • FIG. 2 shows the pattern-form plated layer 6 in which four thin lines 14 extend from one intersection, the present invention is not limited to this mode, and three or five or more from one intersection are shown. May be a mode in which the thin wire 14 extends.
  • the average thickness of the patterned plating layer 6 is not particularly limited, but is preferably 0.05 to 100 ⁇ m, more preferably 0.07 to 10 ⁇ m, and still more preferably 0.1 to 3 ⁇ m.
  • the average thickness is an average value obtained by observing a vertical cross section of the patterned plating layer 6 with an electron microscope (for example, a scanning electron microscope), measuring thicknesses at arbitrary 10 points, and arithmetically averaging them. is there.
  • the thickness is preferably 30 ⁇ m or less, more preferably 15 ⁇ m or less, still more preferably 10 ⁇ m or less, particularly preferably 5 ⁇ m or less, preferably 0.5 ⁇ m or more, and more preferably 1.0 ⁇ m or more.
  • the opening T A has the shape of a substantially rhombic not limited to this shape, other polygonal shapes (e.g., triangular, square, hexagonal, random polygon) may be .
  • the shape of one side may be a curved shape or an arc shape in addition to the linear shape.
  • an arc shape for example, two opposing sides may be formed into an outwardly convex arc shape, and the other two opposing sides may be formed into an inwardly convex arc shape.
  • the shape of each side may be a wavy line shape in which an outwardly projecting arc and an inwardly projecting arc are continuous.
  • the shape of each side may be a sine curve.
  • the length L A of one side of the aperture T A is not particularly limited, is preferably from 1500 .mu.m, more preferably at most 1300 [mu] m, more preferably 1000 ⁇ m or less, is preferably at least 5 [mu] m, more preferably at least 30 [mu] m, further preferably not less than 80 ⁇ m .
  • the transparency of the conductive member 12 is more excellent.
  • FIG. 3 is a partially enlarged view of a section taken along line BB in FIG. As described above, the metal layer 8 is disposed on the patterned plated layer 6. As shown in FIG. 3, the metal layer 8 is composed of a plurality of thin metal wires 16, a mesh-like pattern comprising a plurality of openings T B by thin metal wires 16 intersect. Although FIG. 3 illustrates a metal layer in which four thin metal wires 16 extend from one intersection, the present invention is not limited to this embodiment, and three or five or more thin metal wires from one intersection are illustrated. 16 may be extended.
  • the average thickness of the metal layer 8 is not particularly limited, but may be selected from, for example, 0.00001 to 0.2 mm from the viewpoint of conductivity, but is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and 0.01 to 9 ⁇ m Is more preferably, and particularly preferably 0.05 to 3 ⁇ m.
  • the average thickness of the metal layer 8 is an average value obtained by observing a vertical cross section of the metal layer 8 with an electron microscope (for example, a scanning electron microscope), measuring thicknesses at arbitrary 10 points, and arithmetically averaging them. is there.
  • the line width of the fine metal wires 16 constituting the mesh of the metal layer 8 is not particularly limited, but is preferably 1000 ⁇ m or less, more preferably 500 ⁇ m or less, further preferably 300 ⁇ m or less, more preferably 2 ⁇ m or more, and still more preferably 5 ⁇ m or more. Note that the line width of the thin metal wire 16 is obtained by observing the transmitted light with an optical microscope.
  • the opening T B has the shape of a substantially rhombic not limited to this shape, other polygonal shapes (e.g., triangular, square, hexagonal, random polygon) may be .
  • the shape of one side may be a curved shape or an arc shape in addition to the linear shape.
  • an arc shape for example, two opposing sides may be formed into an outwardly convex arc shape, and the other two opposing sides may be formed into an inwardly convex arc shape.
  • the shape of each side may be a wavy line shape in which an outwardly projecting arc and an inwardly projecting arc are continuous.
  • the shape of each side may be a sine curve.
  • Length of one side of the opening T B L B is not particularly limited, is preferably from 1500 .mu.m, more preferably at most 1300 [mu] m, more preferably 1000 ⁇ m or less, is preferably at least 5 [mu] m, more preferably at least 30 [mu] m, further preferably not less than 80 ⁇ m . If the length of a side of the opening T B is in the above range, the transparency of the conductive member 12 to be described later more excellent.
  • the area ratio of the metal layer 8 is 60% or less in that the breaking of the thin metal wire in the high-temperature and high-pressure process is further suppressed.
  • the lower limit is 0.2% or more in that a conductive member having more excellent conductivity can be formed.
  • the area ratio of the metal layer 8 is determined by observing the conductive member 12 with an optical microscope using transmitted light. Specifically, as shown in FIG. 4, the mesh pattern of the metal layer 8 in the conductive member 12 corresponds to an area ten times the maximum area of the opening region (hereinafter, also referred to as “area X”).
  • area is divided into square areas, and the area of the dark field portion is divided by the area X for each area to calculate a value (%) multiplied by 100.
  • the numerical value of the highest area ratio is defined as the area ratio (%) of the metal layer 8 of the conductive member 12.
  • the area ratio (%) of the metal layer 8 of the conductive member 12 is preferably from 10 to 60%, more preferably from 20 to 60%, and still more preferably from 30 to 60%, from the viewpoint of more excellent conductivity.
  • the metal contained in the metal layer 8 is not particularly limited, and a known metal can be used.
  • a main component (so-called main metal) contained in the metal layer 8 for example, metals such as copper, nickel, chromium, lead, gold, silver, tin, and zinc, and alloys of these metals are preferable.
  • the said main component intends the metal whose content (mass) is largest among the metals contained in the metal layer 8.
  • the metal layer 8 preferably contains at least one metal selected from the group consisting of copper, nickel, and gold in that a conductive member having better conductivity is obtained, and the metal layer 8 contains the metal as a main component. More preferably, it is included.
  • the content of the metal constituting the main component in the metal layer 8 is not particularly limited, but generally, the content of the metal is preferably 80% by mass or more, more preferably 85% by mass or more based on the total mass of the metal layer 8. More preferably, 90 mass% or more is further preferable.
  • the protective layer 10 is mainly formed by improving the strength of the conductive member 12 itself, protecting the mesh-like metal layer 8, and / or by applying a resin by injection when producing a molded body using the conductive member 12. This is a layer that contributes to improving the adhesiveness with the layer.
  • a protective layer 10 is disposed so as to cover the intermediate layer 4, the patterned plated layer 6, and the mesh-shaped metal layer 8.
  • the elastic modulus at 25 ° C. of the protective layer 10 is 0.10 to 5.00 GPa, and the breaking of the thin metal wire in the high-temperature and high-pressure process is further suppressed, and / or the impact resistance is more excellent.
  • the elastic modulus at 25 ° C. of the protective layer 10 means that the conductive member 12 is cut using an ultramicrotome, and the area of the protective layer 10 in the cut-out cross section is used as a measurement surface under an environment of 25 ° C. The value measured by AFM is intended.
  • the protective layer 10 is preferably a layer containing a resin.
  • the type of the resin forming the protective layer 10 is not particularly limited, and includes a known thermoplastic resin.
  • a known thermoplastic resin for example, polycarbonate resin, ABS resin (acrylonitrile-butadiene-styrene copolymer), polystyrene resin, polyether sulfone resin, poly (meth) acrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate, polyethylene na Phthalate), a polysulfone resin, a polyamide resin, a polyarylate resin, a polyolefin resin, a cellulose resin, a polyvinyl chloride resin, a cycloolefin resin, and the like.
  • the thickness of the protective layer 10 is not particularly limited, but is generally preferably 0.05 to 10 mm, more preferably 0.5 to 5 mm, and still more preferably 1 to 2 mm.
  • the resin forming the protective layer 10 may be a fiber reinforced resin (Fiber Reinforced Plastics) containing fibers such as glass reinforced fibers and carbon fibers.
  • Fiber Reinforced Plastics Fiber Reinforced Plastics
  • the method for forming the intermediate layer 4 is not particularly limited. For example, there is a method in which a composition for forming an intermediate layer containing a material for forming an intermediate layer (for example, the urethane-based resin described above) is brought into contact with the base material 2 to form a coating film on the base material 2. .
  • a composition for forming an intermediate layer contains a photocurable or thermosetting material, it is preferable to further cure the coating film.
  • examples of the polymerization initiator and the solvent that can be contained in the composition for forming an intermediate layer include the same ones as the polymerization initiator and the solvent contained in the composition for forming a layer to be plated described below.
  • the substrate 2 is as described above.
  • the method of forming the patterned plating layer 6 is not particularly limited, but a plating layer forming composition containing the following compound X or composition Y is coated on the base material 2 on which the intermediate layer 4 is disposed (hereinafter, referred to as “intermediate layer”).
  • intermediate layer a plating layer forming composition containing the following compound X or composition Y is coated on the base material 2 on which the intermediate layer 4 is disposed.
  • Compound X a functional group that interacts with a plating catalyst or a precursor thereof (hereinafter, also simply referred to as an “interactive group”), and a compound composition having a polymerizable group Y: interacts with a plating catalyst or a precursor thereof Composition containing a functional group having a functional group and a compound having a polymerizable group
  • Compound X is a compound having an interactive group and a polymerizable group.
  • the interactive group is intended to mean a functional group capable of interacting with a plating catalyst or a precursor thereof provided to a patterned plating target layer, for example, a functional group capable of forming an electrostatic interaction with a plating catalyst or a precursor thereof.
  • ionic polar groups such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group, an ether group, or A cyano group is preferred, and a carboxylic acid group or a cyano group is more preferred.
  • Compound X may contain two or more types of interactive groups.
  • the polymerizable group is a functional group capable of forming a chemical bond by applying energy, and includes, for example, a radical polymerizable group and a cationic polymerizable group. Among them, a radically polymerizable group is preferable because reactivity is more excellent.
  • the radical polymerizable group include an acrylate group (acryloyloxy group), a methacrylate group (methacryloyloxy group), an itaconate group, a crotonic ester group, an isocrotonic ester group, and a maleic ester group.
  • examples include an unsaturated carboxylic acid ester group, a styryl group, a vinyl group, an acrylamide group, and a methacrylamide group.
  • Compound X may contain two or more polymerizable groups.
  • the number of polymerizable groups contained in the compound X is not particularly limited, and may be one or two or more.
  • the compound X may be a low molecular compound or a high molecular compound.
  • a low molecular compound is intended for a compound having a molecular weight of less than 1,000, and a high molecular compound is intended for a compound having a molecular weight of 1,000 or more.
  • the weight average molecular weight of the polymer is not particularly limited, but is preferably from 1,000 to 700,000, more preferably from 2,000 to 200,000, from the viewpoint of more excellent handling properties such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is more preferably 20,000 or more.
  • Composition Y is a composition containing a compound having an interactive group and a compound having a polymerizable group. That is, the plating layer precursor layer contains two types of compounds having an interactive group and compounds having a polymerizable group. The definitions of the interactive group and the polymerizable group are as described above.
  • the compound having an interactive group is a compound having an interactive group. The definition of the interactive group is as described above. Such a compound may be a low molecular compound or a high molecular compound.
  • Preferred forms of the compound having an interactive group include, for example, unsaturated carboxylic acids (eg, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, etc.) and unsaturated carboxylic acids.
  • unsaturated carboxylic acids eg, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, etc.
  • unsaturated carboxylic acids eg, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, etc.
  • unsaturated carboxylic acids eg, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, etc.
  • the compound having a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer having two or more polymerizable groups from the viewpoint that the hardness of the patterned plated layer to be formed is more excellent.
  • the polyfunctional monomer specifically, it is preferable to use a monomer having 2 to 6 polymerizable groups.
  • the molecular weight of the polyfunctional monomer used is preferably from 150 to 1,000, and more preferably from 200 to 800, from the viewpoint of the mobility of the molecule during the crosslinking reaction which affects the reactivity.
  • the compound having a polymerizable group may contain an interactive group.
  • the mass ratio of the compound having an interactive group to the compound having a polymerizable group is not particularly limited, but the pattern formed is not limited.
  • the thickness is preferably 0.1 to 10, and more preferably 0.5 to 5.
  • composition for forming a layer to be plated if necessary, other components (for example, a polymerization initiator, a solvent, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, particles, Flame retardants, lubricants, plasticizers, etc.).
  • a polymerization initiator for example, a solvent, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, particles, Flame retardants, lubricants, plasticizers, etc.
  • a method for producing the composition for forming a layer to be plated is not particularly limited, and a known method can be used. For example, a method of collectively mixing the above-described components, a method of mixing the components in a stepwise manner, and the like can be given.
  • composition for forming layer to be plated preferably contains a polyfunctional radical polymerizable monomer and a polymer having a functional group that interacts with a plating catalyst or a precursor thereof.
  • the polyfunctional radical polymerizable monomer intends a compound having two or more radical polymerizable groups.
  • the number of radically polymerizable groups in the polyfunctional radically polymerizable monomer is not particularly limited, but is preferably 2 to 10, more preferably 2 to 5, and still more preferably 2.
  • the radical polymerizable group is not particularly limited, and includes, for example, an acryloyloxy group, a methacryloyloxy group, an acrylamide group, a methacrylamide group, a vinyl group, a styryl group, and the like, and an acryloyloxy group, a methacryloyloxy group, an acrylamide group, Alternatively, a methacrylamide group is preferable, and an acrylamide group or a methacrylamide group is more preferable.
  • the acryloyloxy group is a group represented by the following formula (A)
  • the methacryloyloxy group is a group represented by the following formula (B)
  • the acrylamide group is a group represented by the following formula (C).
  • the methacrylamide group is a group represented by the following formula (D).
  • * represents a bonding position.
  • R represents a hydrogen atom or a substituent.
  • the type of the substituent is not particularly limited, and may be a known substituent (for example, an aliphatic hydrocarbon group (for example, an alkyl group) which may contain a hetero atom, and an aromatic hydrocarbon group (for example, an aryl group)). Are mentioned.).
  • R is preferably a hydrogen atom.
  • the polyfunctional radical polymerizable monomer preferably has a polyoxyalkylene group.
  • the polyoxyalkylene group is a group having an oxyalkylene group as a repeating unit.
  • a group represented by the formula (E) is preferable.
  • Formula (E) — (A ⁇ O) m ⁇ A represents an alkylene group.
  • the number of carbon atoms in the alkylene group is not particularly limited, but is preferably from 1 to 4, more preferably from 2 to 3.
  • A is an alkylene group having 1 carbon atom
  • -(A-0)- represents an oxymethylene group (-CH 2 O-)
  • A is an alkylene group having 2 carbon atoms
  • A is an alkylene group having 3 carbon atoms
  • the alkylene group may be linear or branched.
  • m represents the number of repeating oxyalkylene groups and represents an integer of 2 or more. The number of repetitions is not particularly limited, but is preferably 2 to 10, more preferably 2 to 6.
  • the carbon number of the alkylene group in the plurality of oxyalkylene groups may be the same or different.
  • a plurality of repeating units represented by — (A—O) — are included, and the number of carbon atoms in the alkylene group in each repeating unit is different even if they are the same. Is also good.
  • — (A—O) m — may contain an oxymethylene group and an oxypropylene group.
  • their bonding order is not particularly limited, and may be a random type or a block type.
  • the polyfunctional radical polymerizable monomer a bifunctional acrylamide compound or a bifunctional methacrylamide compound is preferable, and the compound represented by the formula (1) is more preferable.
  • R 1 and R 2 each independently represent a hydrogen atom or a methyl group.
  • the definitions of A and m are the same as the definitions of A and m in the above formula (E).
  • R 3 and R 4 represent a hydrogen atom or a substituent.
  • the types of the substituents represented by R 3 and R 4 have the same meanings as the substituents represented by R in formulas (C) and (D) described above, and the preferred embodiments are also the same.
  • R 3 and R 4 a hydrogen atom is particularly preferred.
  • L 1 and L 2 each independently represent a single bond or a divalent linking group.
  • the type of the divalent linking group represented by L 1 and L 2 is not particularly limited.
  • a divalent hydrocarbon group (even a divalent saturated hydrocarbon group,
  • the divalent saturated hydrocarbon group may be linear, branched, or cyclic, and preferably has 1 to 20 carbon atoms, for example, an alkylene group.
  • R 10 represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).
  • the hydrogen atom in the divalent linking group may be substituted with another substituent such as a halogen atom.
  • the polyfunctional radical polymerizable monomer only one kind may be used, or two or more kinds may be combined.
  • the content of the polyfunctional radically polymerizable monomer in the composition for forming a layer to be plated is not particularly limited, and may be 10 to 90% by mass based on the total solid content. Although it is large, it is preferably 15 to 85% by mass with respect to the total solid content in that the tackiness of the layer to be plated precursor layer described later is further suppressed, and 15 to 75% by mass in terms of more excellent plating deposition property. Is more preferable, and 15 to 65% by mass is further preferable.
  • a solid content intends the component which comprises the pattern-shaped to-be-plated layer 6, and does not contain a solvent. In addition, if it is a component which comprises the pattern-form plated layer 6, even if the property is liquid, it is contained in solid content.
  • the definition of the interactive group is as described above.
  • ionic groups such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boronic acid group are particularly preferred because of their high polarity and high adsorption ability to a plating catalyst or a precursor thereof.
  • a polar group or a cyano group is preferred, and a carboxylic acid group or a cyano group is more preferred.
  • the polymer may have two or more types of interactive groups.
  • the weight average molecular weight of the polymer is not particularly limited, but is preferably from 1,000 to 700,000, more preferably from 2,000 to 200,000 from the viewpoint of more excellent handleability.
  • the polymer preferably contains a repeating unit having an interactive group.
  • One preferred embodiment of the repeating unit having an interactive group includes a repeating unit represented by the formula (F).
  • R 5 represents a hydrogen atom or an alkyl group (for example, a methyl group, an ethyl group, and the like).
  • L 5 represents a single bond or a divalent linking group.
  • the definition of the divalent linking group is the same as the definition of the divalent linking group represented by L 1 and L 2 in the formula (1).
  • X represents an interactive group. The definition of the interactive group is as described above.
  • Another preferred embodiment of the repeating unit having an interactive group includes a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof.
  • An unsaturated carboxylic acid is an unsaturated compound having a carboxylic acid group (—COOH group).
  • Examples of the derivative of an unsaturated carboxylic acid include an anhydride of an unsaturated carboxylic acid, a salt of an unsaturated carboxylic acid, and a monoester of an unsaturated carboxylic acid.
  • the unsaturated carboxylic acid include acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid.
  • the content of the repeating unit having an interactive group in the polymer is not particularly limited, the content of the repeating unit having an interactive group is 1 to 100 mol per 1 mol of all the repeating units in view of the balance between the stretchability of the patterned plating layer 6 and the plating deposition property. %, More preferably 10 to 100 mol%.
  • Preferred embodiments of the polymer include a repeating unit derived from a conjugated diene compound, and a polymer derived from an unsaturated carboxylic acid or a derivative thereof in that the patterned plating layer 6 is easily formed with a small amount of applied energy (for example, an exposure amount).
  • Polymer X having a repeating unit is exemplified. The description of the repeating unit derived from an unsaturated carboxylic acid or a derivative thereof is as described above.
  • the conjugated diene compound is not particularly limited as long as it is a compound having a molecular structure having two carbon-carbon double bonds separated by one single bond.
  • Examples of the conjugated diene compound include isoprene, 1,3-butadiene, 1,3-pentadiene, 2,4-hexadiene, 1,3-hexadiene, 1,3-heptadiene, 2,4-heptadiene, 1,3- Octadienes, 2,4-octadienes, 3,5-octadienes, 1,3-nonadienes, 2,4-nonadienes, 3,5-nonadienes, 1,3-decadienes, 2,4-decadienes, 3,5-decadienes, 2,3-dimethyl-butadiene, 2-methyl-1,3-pentadiene, 3-methyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 2-phenyl-1,3-butadiene, 2- Phenyl-1,
  • the repeating unit derived from the conjugated diene compound is derived from a compound having a butadiene skeleton represented by the following formula (2) in that the synthesis of the polymer X is easy and the characteristics of the patterned plating layer 6 are more excellent. It is preferably a repeating unit.
  • R 6 independently represents a hydrogen atom, a halogen atom or a hydrocarbon group.
  • the hydrocarbon group include an aliphatic hydrocarbon group (eg, an alkyl group, an alkenyl group, etc., preferably having 1 to 12 carbon atoms) and an aromatic hydrocarbon group (eg, a phenyl group, a naphthyl group, etc.).
  • An aliphatic hydrocarbon group eg, an alkyl group, an alkenyl group, etc., preferably having 1 to 12 carbon atoms
  • an aromatic hydrocarbon group eg, a phenyl group, a naphthyl group, etc.
  • Examples of the compound having a butadiene skeleton represented by the formula (2) include, for example, 1,3-butadiene, isoprene, 2-ethyl-1,3-butadiene, 2-n-propyl -1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 1-phenyl-1,3-butadiene, 1- ⁇ -naphthyl-1,3-butadiene, 1- ⁇ -naphthyl-1,3 -Butadiene, 2-chloro-1,3-butadiene, 1-bromo-1,3-butadiene, 1-chlorobutadiene, 2-fluoro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, Examples thereof include 1,1,2-trichloro-1,3-butadiene and 2-cyano-1,3-butadiene.
  • the content of the repeating unit derived from the conjugated diene compound in the polymer X is preferably 25 to 75 mol% based on all repeating units.
  • the content of the repeating unit derived from the unsaturated carboxylic acid or its derivative in the polymer X is preferably from 25 to 75 mol% based on all repeating units.
  • the content of the polymer in the composition for forming a plating layer is not particularly limited, and is often 10 to 90% by mass with respect to the total solid content, but the tackiness of the plating layer precursor layer described later is further suppressed. 15 to 85% by mass with respect to the total solid content, and more preferably 25 to 75% by mass, from the viewpoint that the balance between the stretchability of the layer to be plated and the plating deposition property is more excellent. % Is more preferred.
  • the ratio of the mass of the polymer to the mass of the polyfunctional radically polymerizable monomer is not particularly limited, and is often 0.1 to 10; It is preferably from 3 to 3, more preferably from 0.4 to 1.5.
  • composition for forming a layer to be plated may include components other than the above-described polyfunctional radically polymerizable monomer and polymer.
  • optional components will be described in detail.
  • the composition for forming a layer to be plated may contain a surfactant.
  • the type of the surfactant is not particularly limited, and examples thereof include a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant. Among them, a fluorine-based surfactant or a silicone-based surfactant is preferred, and a fluorine-based surfactant is more preferred, in that the tackiness of the plated layer precursor layer is further suppressed.
  • One surfactant may be used alone, or two or more surfactants may be used in combination.
  • fluorinated surfactant examples include W-AHE, W-AHI (all of which are manufactured by FUJIFILM Corporation), Megafac F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F569, F780, F781F (all manufactured by DIC Corporation), Florard FC430, FC431, FC171 (Above, manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC-383, SC-383 S393, KH-40 (all manufactured by Asahi Glass Co., Ltd.), PF636, PF656, PF6320, PF6520, PF7 02 (OMNOVA Co., Ltd.), and the like.
  • the content of the surfactant in the composition for forming a layer to be plated is not particularly limited, but is preferably 0.005 to 0.5% by mass, and more preferably 0.01 to 0.5% by mass based on 100% by mass of the total composition for forming a layer to be plated. -0.2% by mass is more preferable, and 0.01-0.1% by mass is further preferable.
  • the composition for forming a layer to be plated may contain a polymerization initiator.
  • the type of the polymerization initiator is not particularly limited, and includes a known polymerization initiator (preferably, a photopolymerization initiator).
  • Examples of the polymerization initiator include benzophenones, acetophenones, ⁇ -aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzylketals, oxsumesters, bisacylphosphinoxides, Acylphosphine oxides, anthraquinones, and azos.
  • the content of the polymerization initiator in the composition for forming a layer to be plated is not particularly limited, but is preferably 0.1 to 20% by mass based on 100% by mass of the compound having a polymerizable group in the composition for forming a layer to be plated. Preferably, it is 0.5 to 10% by mass.
  • the composition for forming a layer to be plated may contain a solvent.
  • the type of the solvent is not particularly limited, and includes water and an organic solvent.
  • the organic solvent include known organic solvents (for example, alcohol solvents, ester solvents, ketone solvents, halogen solvents, and hydrocarbon solvents).
  • the composition for forming a layer to be plated may include, if necessary, other components (for example, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, a flame retardant, a lubricant, a plasticizer, or (A plating catalyst or a precursor thereof).
  • other components for example, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, a flame retardant, a lubricant, a plasticizer, or (A plating catalyst or a precursor thereof).
  • the patterned plating layer 6 can be formed using the above-described composition for forming a plating layer.
  • a method for forming the patterned plating layer 6 a method having the following steps is preferable.
  • Step 1-1 Step 1 of contacting the base material with an intermediate layer with the composition for forming a plated layer to form a plated layer precursor layer on the surface of the base material with an intermediate layer on the side of the intermediate layer 4 -2: Step of subjecting the plated layer precursor layer to exposure processing in a pattern step 1-3: Step of performing development processing on the exposed plated layer precursor layer to form a patterned plated layer 6 Steps 1-1 to 1-3 will be described in detail.
  • Step 1-1 is a step of contacting the substrate with an intermediate layer with the composition for forming a layer to be plated to form a precursor layer for a layer to be plated on the substrate with an intermediate layer.
  • a substrate with a plating target layer precursor layer having a substrate with an intermediate layer and a plating target layer precursor layer disposed on the surface on the intermediate layer 4 side of the substrate with an intermediate layer Is obtained.
  • the plating target layer precursor layer is a layer in a state before being subjected to the exposure treatment.
  • the method of contacting the base material with an intermediate layer and the composition for forming a plating layer is not particularly limited, for example, a method of applying the composition for forming a plating layer on a base material with an intermediate layer, or forming a plating layer.
  • a method of immersing the base material with the intermediate layer in the composition for use may be performed, if necessary, to remove the solvent from the precursor layer for the plated layer.
  • Step 1-2 is a step in which the plating target layer precursor layer and a mask having an opening having a predetermined shape are brought into close contact with each other, and the plating target layer precursor layer is exposed in a mesh pattern. .
  • the exposure treatment the polymerizable group contained in the compound in the plating target layer precursor layer is activated, cross-linking between the compounds occurs, and curing of the layer proceeds. Note that heat treatment may be performed during the exposure processing.
  • the exposure processing light source examples include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp. Further, electron beams, X-rays, ion beams, far-infrared rays, and the like can also be used.
  • the exposure time is not particularly limited, and is, for example, 10 seconds to 5 hours.
  • the exposure energy is not particularly limited, and may be about 10 to 8000 mJ.
  • Step 1-3 is a step of performing development processing on the plating target layer precursor layer that has been subjected to exposure processing in a mesh pattern. Through the steps 1-3, the patterned plated layer 6 is formed.
  • the method of the development processing is not particularly limited, and the optimum development processing is performed according to the type of the material used. Examples of the developer include an organic solvent, pure water, and an alkaline aqueous solution.
  • the patterned plated layer 6 obtained by curing the composition for forming the plated layer is placed on the base material with the intermediate layer. That is, a base material with a plating target layer having the base material with the intermediate layer and the patterned plating target layer 6 arranged on the surface of the intermediate layer 4 of the base material with the intermediate layer is formed.
  • the pattern-shaped plated layer 6 is formed of a plurality of fine lines, and has a mesh-like pattern including a plurality of openings formed by intersecting fine lines.
  • the method of forming the patterned plating layer 6 is not limited to the method described above.
  • a method of forming the patterned plating target layer 6 a plating target layer precursor layer is arranged in a pattern on the base material 2 and the pattern plating target layer precursor layer is subjected to a curing treatment to obtain a patterned plating target layer.
  • a method of forming the plated layer 6 may be used.
  • a method of arranging the plating layer precursor layer in a pattern for example, a method of applying a plating layer forming composition to a predetermined position on the base material 2 by a screen printing method or an inkjet method is exemplified. Can be
  • Step 2-1 Step of applying a plating catalyst or a precursor thereof to the patterned plating layer 6
  • Step 2-2 Applying a plating treatment to the patterned plating layer 6 to which the plating catalyst or the precursor thereof is applied Steps Steps 2-1 and 2-2 will be described in detail below.
  • Step 2-1 is a step of applying a plating catalyst or a precursor thereof to the patterned plated layer 6. Since the pattern-form plated layer 6 contains the above-mentioned interactive group, the interactive group adheres (adsorbs) the applied plating catalyst or its precursor according to its function.
  • the plating catalyst or its precursor functions as a plating treatment catalyst or electrode. Therefore, the type of plating catalyst or its precursor to be used is appropriately determined depending on the type of plating treatment.
  • the plating catalyst or a precursor thereof is preferably an electroless plating catalyst or a precursor thereof.
  • the electroless plating catalyst is not particularly limited as long as it becomes an active nucleus at the time of electroless plating.
  • a metal having a catalytic ability for a self-catalytic reduction reaction (a metal having a lower ionization tendency than Ni and capable of electroless plating) is known. That can be used).
  • Pd, Ag, Cu, Pt, Au, Co and the like can be mentioned.
  • a metal colloid may be used as the electroless plating catalyst.
  • the electroless plating catalyst precursor is not particularly limited as long as it becomes an electroless plating catalyst by a chemical reaction, and includes, for example, ions of the metals mentioned above as the electroless plating catalyst.
  • a method of applying a plating catalyst or a precursor thereof to a plating target layer for example, a solution in which a plating catalyst or a precursor thereof is dispersed or dissolved in a solvent is prepared, and the solution is applied onto the patterned plating target layer 6. Or a method of immersing a substrate with a plating target layer in a solution thereof.
  • the solvent include water and an organic solvent.
  • Step 2-2 is a step of performing plating on the patterned plating target layer 6 to which the plating catalyst or a precursor thereof has been applied.
  • the plating method is not particularly limited, and examples thereof include electroless plating and electrolytic plating (electroplating).
  • the electroless plating treatment may be performed alone, or the electroless plating treatment may be further performed after the electroless plating treatment.
  • the procedure of the electroless plating process and the electrolytic plating process will be described in detail.
  • the electroless plating process is a process of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as plating are dissolved.
  • a procedure of the electroless plating process for example, after removing the excess electroless plating catalyst by washing the substrate with a plating target layer to which the electroless plating catalyst has been applied, immersing the substrate in an electroless plating bath.
  • the electroless plating bath used a known electroless plating bath can be used.
  • a general electroless plating bath mainly contains, in addition to a solvent (eg, water), a metal ion for plating, a reducing agent, and an additive (stabilizer) for improving the stability of the metal ion. It is.
  • the electrolytic plating treatment is performed on the patterned plating layer 6 to which the catalyst or the precursor is applied. be able to. Note that, as described above, after the electroless plating, the electrolytic plating can be performed as necessary. In such an embodiment, the thickness of the formed metal layer 8 can be adjusted as appropriate.
  • the step 2-1 may not be performed when the plating catalyst or a precursor thereof is included in the layer 6 to be plated.
  • the metal layer 8 is formed on the patterned plated layer 6. That is, a base material with a metal layer including the base material with the plating target layer and the mesh-like metal layer 8 arranged on the patterned plating target layer 6 in the base material with the plating target layer is obtained.
  • a conductive member having a three-dimensional shape is obtained.
  • the method for forming the protective layer 10 is not particularly limited.
  • a composition for forming a protective layer containing the above-mentioned resin and additives (for example, light-transmitting particles and a solvent) used as necessary is brought into contact with a base material having a metal layer to form a metal layer.
  • a method of forming a protective film by forming a coating film on the surface of the base material on the side of the metal layer 8 and curing the coating film if necessary.
  • the conductive member of the present invention is not limited to the first embodiment described above.
  • the intermediate layer, the pattern-plated layer, the metal layer, and the protective layer have been shown on the form disposed on one surface of the substrate, the conductive member of the present invention, the intermediate layer, A configuration in which the patterned plating layer, the metal layer, and the protective layer are arranged on both surfaces of the substrate may be employed.
  • a resin layer may be laminated on the protective layer of the conductive member from the viewpoint of imparting strength.
  • a molded article having a conductive member and a resin layer disposed on a protective layer of the conductive member will be described.
  • the resin forming the resin layer is not particularly limited, and a known resin can be used.
  • polyether sulfone resin poly (meth) acrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate, polyethylene naphthalate), polycarbonate resin, polysulfone resin, polyamide resin, polyarylate resin, polyolefin Resins, cellulose resins, polyvinyl chloride resins, cycloolefin resins, and the like.
  • the method of forming the molded body is such that the base of the conductive member and the one mold face each other on one of the first mold and the second mold capable of forming the mold cavity. (In other words, so that the base material of the conductive member faces one mold side), the conductive member is arranged, the first mold and the second mold are clamped, and the first mold and the first mold are closed. It is preferable to include a step of injecting a resin into a mold cavity formed by the second mold and obtaining a molded body including a conductive member and a resin layer.
  • the resin is usually heated by a known heating means, and the molten resin is injected into the mold cavity.
  • the mold (the first mold and / or the second mold) may also be heated by a known heating unit.
  • the resin is as described above.
  • the mold is cooled to solidify the resin, and the molded body is removed from the mold.
  • the shape of the mold is not particularly limited, and a mold having an optimal shape is selected according to the shape of the conductive member. For example, when the shape of the conductive member is a three-dimensional shape (three-dimensional shape), a mold having a shape corresponding to the three-dimensional shape of the conductive member is selected.
  • the conductive member can be applied to various uses.
  • the present invention can be applied to various uses such as a touch panel sensor, a semiconductor chip, an FPC (Flexible printed circuits), a COF (Chip on Film), a TAB (Tape Automated Bonding), an antenna, a multilayer wiring board, and a motherboard.
  • a touch panel sensor especially, a capacitance type touch panel sensor.
  • the mesh-shaped metal layer 20 in the conductive member is electrically connected to the electrode pattern 22 and the end of the electrode pattern 22. Function as the electrode terminal 24.
  • a touch panel sensor can be suitably applied to a touch panel.
  • the conductive member can also be used as a heating element. For example, by passing a current through the metal layer, the temperature of the metal layer increases, and the metal layer functions as a heat wire.
  • composition A for forming layer to be plated The following components were mixed to obtain a composition A for forming a layer to be plated.
  • the bifunctional acrylamide monomer used was a product synthesized by the method described in paragraph [0099] of JP-A-2014-193851.
  • composition A for forming intermediate layer [Preparation of composition A for forming intermediate layer] The following components were mixed to obtain a composition A for forming an intermediate layer.
  • ITRON Z-913-3 manufactured by Aika Kogyo
  • IPA isopropanol
  • MFG mass ratio
  • composition A for forming protective layer [Preparation of composition A for forming protective layer] The following components were mixed to obtain a composition A for forming a protective layer.
  • IMB-006 manufactured by Teikoku Ink
  • the composition A for forming an intermediate layer was applied on a substrate (PC (polycarbonate resin) film manufactured by Teijin, Panlite PC, thickness: 250 ⁇ m) using a bar coater. Thereafter, the formed intermediate layer forming composition layer was irradiated with UV (ultraviolet light) to form an intermediate layer (0.8 ⁇ m in thickness). That is, a substrate with an intermediate layer having a substrate and an intermediate layer disposed on the substrate was obtained. Next, the composition for forming a plating target layer was applied onto the intermediate layer by a bar coater so as to have a thickness of 0.8 ⁇ m to obtain a plating target layer precursor layer.
  • PC polycarbonate resin
  • UV ultraviolet
  • a substrate with a plating layer precursor layer having a substrate with an intermediate layer and a plating layer precursor layer disposed on the intermediate layer was obtained.
  • the plating layer precursor layer is exposed to light (0.2 J / cm) with a metal halide light source through a quartz mask having a predetermined opening pattern so that the area ratio of the metal layer becomes a mesh pattern of 60%. 2 ) I did.
  • the exposed plating layer precursor layer is washed with water at room temperature, shower-washed and developed, and the plating layer formed in a square pattern with a line width of 10 ⁇ m (patterned plating layer). I got
  • the substrate with a patterned plating layer was immersed in a 1% by mass aqueous solution of sodium carbonate at room temperature for 5 minutes, and the substrate with a plating layer taken out was washed twice with pure water.
  • a Pd catalyst application liquid (Omnishield 1573 activator, manufactured by Rohm and Haas Electronic Materials) for 5 minutes at 30 ° C.
  • the substrate was washed twice with pure water.
  • the obtained base material with a plating layer is immersed in a reducing solution (Circuposit P13 Oxide Converter 60C, manufactured by Rohm and Haas Electronic Materials) at 30 ° C. for 5 minutes.
  • the attached substrate was washed twice with pure water.
  • the obtained substrate with a plating layer is immersed in an electroless plating solution (Circuposit 4500, manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 45 ° C. for 15 minutes.
  • the substrate was washed with pure water to obtain a substrate having a metal layer having a thickness of 3 ⁇ m and a metal layer having an area ratio of 60%.
  • the obtained substrate with a metal layer was cut in cross section with a microtome, and the layer to be plated, which was the lower layer of the metal layer, was evaluated by a microscopic infrared absorption spectrum.
  • the plating catalyst contained in the composition for forming a layer to be plated was Alternatively, a functional group interacting with its precursor was detected.
  • the composition A for forming a protective layer was applied on the metal layer side surface of the base material with a metal layer with a bar coater to a thickness of 5 ⁇ m to obtain a protective layer. That is, a conductive member having a base material with a metal layer and a protective layer disposed on the metal layer was obtained.
  • composition B for forming intermediate layer [Preparation of composition B for forming intermediate layer] The following components were mixed to obtain a composition B for forming an intermediate layer.
  • Example 2 A conductive member of Example 2 was produced in the same manner as in Example 1, except that the composition A for forming an intermediate layer was changed to the composition B for forming an intermediate layer.
  • Example 3 In the ⁇ Formation of the patterned plating layer>, the plating layer precursor layer is formed with a metal halide light source through a quartz mask having a predetermined opening pattern so that the area ratio of the metal layer becomes a mesh pattern of 40%.
  • a conductive member of Example 3 was produced in the same manner as in Example 1 except that the exposure was performed (0.2 J / cm 2 ).
  • Example 4 A conductive member of Example 4 was prepared in the same manner as in Example 1 except that the protective layer was changed to a polystyrene-isoprene copolymer (trade name: Septon 2104 (manufactured by Kuraray Co., Ltd.)).
  • Example 5 A conductive member of Example 5 was prepared in the same manner as in Example 1 except that the protective layer was changed to a glass-reinforced fiber-containing thermoplastic resin (Reference Patent JP201025891A).
  • Example 6 A conductive member of Example 6 was prepared in the same manner as in Example 1 except that the protective layer was changed to polystyrene (trade name: Dick Styrene GPPS-CR3500 (manufactured by DIC)).
  • polystyrene trade name: Dick Styrene GPPS-CR3500 (manufactured by DIC)
  • Example 7 A conductive member of Example 7 was prepared in the same manner as in Example 1 except that the protective layer was changed to transparent ABS (trade name: TE30S (manufactured by DENKA)).
  • the conductive member of Example 8 was produced in the same manner as in Example 1 except that the substrate was changed to PP (Pure Thermo AG356AS (manufactured by Idemitsu Unitech)), and the intermediate layer forming composition C was used for the intermediate layer. It was created.
  • PP Purrmo AG356AS (manufactured by Idemitsu Unitech)
  • Example 9 A method similar to that of Example 1 except that when forming a patterned plating layer, a quartz mask having a predetermined opening pattern was changed so that the area ratio of the metal layer became a mesh pattern of 0.2%. Thus, the conductive member of Example 9 was produced.
  • Example 10 A conductive member of Example 10 was prepared in the same manner as in Example 1, except that the thickness of the intermediate layer was changed to 0.2 ⁇ m.
  • Example 11 A conductive member of Example 11 was prepared in the same manner as in Example 1, except that the thickness of the intermediate layer was changed to 5 ⁇ m.
  • a conductive member of Comparative Example 1 was produced in the same manner as in Example 1 except that the composition A for forming an intermediate layer was changed to the composition C for forming an intermediate layer.
  • HNBR Hydrogenated nitrile rubber
  • IPA isopropanol
  • MFG mass ratio
  • a conductive member of Comparative Example 2 was produced in the same manner as in Example 1 except that the composition A for forming an intermediate layer was changed to the composition D for forming an intermediate layer.
  • the plating layer precursor layer is formed with a metal halide light source through a quartz mask having a predetermined opening pattern so that the area ratio of the metal layer becomes a mesh pattern of 90%.
  • a conductive member of Comparative Example 3 was produced in the same manner as in Example 1 except that the exposure was performed (0.2 J / cm 2 ).
  • composition B for forming protective layer [Comparative Example 4] [Preparation of composition B for forming protective layer] The following components were mixed to obtain a composition B for forming a protective layer.
  • SilFort PHC587 manufactured by Momentive
  • a conductive member of Comparative Example 4 was produced in the same manner as in Example 1, except that the composition A for forming a protective layer was changed to the composition B for forming a protective layer.
  • the area ratio of the metal layer in the conductive member was determined by observing the mesh-like metal layer formed by crossing a plurality of fine metal wires in each conductive member of the example and the comparative example using transmitted light with an optical microscope. %) was measured. Specifically, the mesh pattern forming the metal layer of the conductive member is divided into square-shaped regions corresponding to ten times the maximum area of the opening region (“area X”), and each region is darkened. A value (%) is calculated by dividing the area of the field of view by the area X and multiplying by 100. At this time, the numerical value having the highest area ratio is defined as the area ratio (%) of the metal layer of the conductive member.
  • ⁇ Shock resistance> A 500 g steel ball was dropped from the base material side from a height of 50 cm on each conductive member of the example and the comparative example. Then, the mesh-like metal layer of each conductive member was arbitrarily observed at 10 points to confirm the presence or absence of disconnection, and evaluated according to the following evaluation criteria. Practically, a rating of B or more is preferable. "A”: No disconnection occurs. “B”: No disconnection occurred, but some damage was observed. “C”: Disconnection occurred.
  • Table 1 is shown below.
  • “elastic modulus ratio of base material and intermediate layer (b / a)” means “elastic modulus of intermediate layer at 25 ° C (b) / elastic modulus of base material at 25 ° C (a ) ".
  • “PC” means a polycarbonate resin
  • “PP” means a polypropylene resin.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Position Input By Displaying (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Of Switches (AREA)
  • Push-Button Switches (AREA)
PCT/JP2019/037746 2018-09-28 2019-09-26 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法 Ceased WO2020067232A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201980062390.6A CN112740157B (zh) 2018-09-28 2019-09-26 导电性部件、触摸面板传感器、触摸面板、成型体的制造方法
JP2020549321A JP7031006B2 (ja) 2018-09-28 2019-09-26 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法
US17/205,693 US11385745B2 (en) 2018-09-28 2021-03-18 Conductive member, touch panel sensor, touch panel, and method for manufacturing molded article
JP2022024539A JP7402908B2 (ja) 2018-09-28 2022-02-21 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-185566 2018-09-28
JP2018185566 2018-09-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/205,693 Continuation US11385745B2 (en) 2018-09-28 2021-03-18 Conductive member, touch panel sensor, touch panel, and method for manufacturing molded article

Publications (1)

Publication Number Publication Date
WO2020067232A1 true WO2020067232A1 (ja) 2020-04-02

Family

ID=69949615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/037746 Ceased WO2020067232A1 (ja) 2018-09-28 2019-09-26 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法

Country Status (5)

Country Link
US (1) US11385745B2 (enExample)
JP (2) JP7031006B2 (enExample)
CN (1) CN112740157B (enExample)
TW (1) TWI795599B (enExample)
WO (1) WO2020067232A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114003148A (zh) * 2020-05-01 2022-02-01 未来科技基金有限责任公司 用于金属网格触摸传感器的保护膜
WO2023048204A1 (ja) * 2021-09-27 2023-03-30 富士フイルム株式会社 積層体の製造方法、積層体
WO2023136185A1 (ja) * 2022-01-11 2023-07-20 富士フイルム株式会社 積層体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060103632A1 (en) * 2004-11-12 2006-05-18 Eastman Kodak Company Integral spacer dots for touch screen
JP2009006698A (ja) * 2007-03-30 2009-01-15 Fujifilm Corp 両面金属膜付きフィルムの製造方法、及び両面金属膜付きフィルム
JP2011222797A (ja) * 2010-04-12 2011-11-04 Konica Minolta Ij Technologies Inc 触媒パターン製造方法および金属パターン製造方法
JP2012238467A (ja) * 2011-05-11 2012-12-06 Nitto Denko Corp 透明導電性積層体及びタッチパネル
WO2018012203A1 (ja) * 2016-07-15 2018-01-18 富士フイルム株式会社 配線基板の製造方法、及び、配線基板
WO2018034291A1 (ja) * 2016-08-19 2018-02-22 富士フイルム株式会社 被めっき層形成用組成物、被めっき層、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
WO2018047493A1 (ja) * 2016-09-12 2018-03-15 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル
JP2018147855A (ja) * 2017-03-09 2018-09-20 富士フイルム株式会社 導電性積層体の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5258489B2 (ja) * 2008-09-30 2013-08-07 富士フイルム株式会社 金属膜形成方法
JP2010258791A (ja) 2009-04-24 2010-11-11 Kyocera Corp 基地局装置および空きチャネル判定方法
US20110047384A1 (en) 2009-08-21 2011-02-24 Qualcomm Incorporated Establishing an ad hoc network using face recognition
JP5740890B2 (ja) 2010-09-29 2015-07-01 凸版印刷株式会社 保護フィルムおよびタッチパネル表示装置
JP5760804B2 (ja) * 2011-07-27 2015-08-12 東洋紡株式会社 ポリエステル樹脂成形フィルム
JP5992463B2 (ja) 2013-02-28 2016-09-14 富士フイルム株式会社 多官能（メタ）アクリルアミド化合物の製造方法
KR101802690B1 (ko) * 2014-06-10 2017-11-28 후지필름 가부시키가이샤 터치 패널용 도전성 적층체, 터치 패널, 투명 도전성 적층체
JP6204887B2 (ja) 2014-08-19 2017-09-27 富士フイルム株式会社 積層体、転写フィルム、積層体の製造方法、導電膜積層体、静電容量型入力装置および画像表示装置
JP6490194B2 (ja) * 2015-03-31 2019-03-27 富士フイルム株式会社 被めっき層形成用組成物、被めっき層前駆体層付きフィルム、パターン状被めっき層付きフィルム、導電性フィルム、タッチパネル
JP6388558B2 (ja) * 2015-05-29 2018-09-12 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル
JP6611396B2 (ja) * 2016-03-11 2019-11-27 富士フイルム株式会社 被めっき層形成用組成物、被めっき層前駆体層付きフィルム、パターン状被めっき層付きフィルム、導電性フィルム、タッチパネル
JPWO2018012535A1 (ja) 2016-07-15 2019-06-20 富士フイルム株式会社 配線基板の製造方法、配線基板
JP6833011B2 (ja) 2017-03-15 2021-02-24 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、及び、タッチセンサ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060103632A1 (en) * 2004-11-12 2006-05-18 Eastman Kodak Company Integral spacer dots for touch screen
JP2009006698A (ja) * 2007-03-30 2009-01-15 Fujifilm Corp 両面金属膜付きフィルムの製造方法、及び両面金属膜付きフィルム
JP2011222797A (ja) * 2010-04-12 2011-11-04 Konica Minolta Ij Technologies Inc 触媒パターン製造方法および金属パターン製造方法
JP2012238467A (ja) * 2011-05-11 2012-12-06 Nitto Denko Corp 透明導電性積層体及びタッチパネル
WO2018012203A1 (ja) * 2016-07-15 2018-01-18 富士フイルム株式会社 配線基板の製造方法、及び、配線基板
WO2018034291A1 (ja) * 2016-08-19 2018-02-22 富士フイルム株式会社 被めっき層形成用組成物、被めっき層、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
WO2018047493A1 (ja) * 2016-09-12 2018-03-15 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル
JP2018147855A (ja) * 2017-03-09 2018-09-20 富士フイルム株式会社 導電性積層体の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114003148A (zh) * 2020-05-01 2022-02-01 未来科技基金有限责任公司 用于金属网格触摸传感器的保护膜
WO2023048204A1 (ja) * 2021-09-27 2023-03-30 富士フイルム株式会社 積層体の製造方法、積層体
WO2023136185A1 (ja) * 2022-01-11 2023-07-20 富士フイルム株式会社 積層体

Also Published As

Publication number Publication date
JP7031006B2 (ja) 2022-03-07
JPWO2020067232A1 (ja) 2021-09-24
JP7402908B2 (ja) 2023-12-21
CN112740157A (zh) 2021-04-30
US11385745B2 (en) 2022-07-12
US20210208707A1 (en) 2021-07-08
JP2022078124A (ja) 2022-05-24
TW202027098A (zh) 2020-07-16
TWI795599B (zh) 2023-03-11
CN112740157B (zh) 2024-02-02

Similar Documents

Publication Publication Date Title
JP7402908B2 (ja) 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法
KR102112435B1 (ko) 도전성 적층체의 제조 방법과, 피도금층 전구체층을 구비한 입체 구조물, 패턴 형상 피도금층을 구비한 입체 구조물, 도전성 적층체, 터치 센서, 발열 부재 및 입체 구조물
JP6727309B2 (ja) 被めっき層形成用組成物、被めっき層、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
TW201707944A (zh) 導電性積層體的製造方法、導電性積層體、帶被鍍覆層前驅體層基板、帶被鍍覆層基板、觸控感測器
KR20180113605A (ko) 도전성 적층체의 제조 방법, 적층체 및 도전성 적층체
US11161331B2 (en) Plated layer forming composition, film having plated-layer precursor layer, film having patterned plated layer, electroconductive film, and touch panel
CN111902885B (zh) 导电性膜、触控面板传感器、触控面板
US11123961B2 (en) Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer
JP7041740B2 (ja) 前駆体フィルム、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル、導電性フィルムの製造方法、および被めっき層形成用組成物
JP6951312B2 (ja) 被めっき層形成用組成物、被めっき層前駆体層付き基板、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
JP7112591B2 (ja) 積層体、被めっき層付き基板の製造方法、導電性フィルムの製造方法
JP2023031084A (ja) 透明発熱体
JP2023034580A (ja) 透明発熱体、車載ヘッドランプカバーおよびセンサーカバー
JP7653781B2 (ja) 導電性光学積層体
WO2023048204A1 (ja) 積層体の製造方法、積層体

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19864034

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020549321

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19864034

Country of ref document: EP

Kind code of ref document: A1