WO2020063712A1

WO2020063712A1 - Led display unit group and display panel

Info

Publication number: WO2020063712A1
Application number: PCT/CN2019/108030
Authority: WO
Inventors: 顾峰; 刘传标; 秦快; 范凯亮
Original assignee: 佛山市国星光电股份有限公司
Priority date: 2018-08-10
Filing date: 2019-09-26
Publication date: 2020-04-02
Also published as: US20210398954A1; KR102495024B1; CN109147584A; CN109147584B; KR20210049165A

Abstract

Disclosed is an LED display unit group, comprising an insulation substrate (100), a front circuit board (200) and a back circuit board (300), wherein the insulation substrate (100) is provided with a metal via hole for connecting the front circuit board (200) and the back circuit board (300); the front circuit board (200) is divided into pixel areas (P) arranged in an array of 2m rows and 2n columns; each pixel area (P) comprises three A electrode pads (201, 202, 203), three LED light-emitting chips (101, 102, 103) of different light emission colours, and a B electrode pad (205) corresponding to the three LED light-emitting chips (101, 102, 103) of different light emission colours; in each pixel area (P), an electrode A of each of the three LED light-emitting chips (101, 102, 103) is electrically connected to the corresponding A electrode pad (201, 202, 203); an electrode B of each of the three LED light-emitting chips (101, 102, 103) is electrically connected to the corresponding B electrode pad (205); in the same column of pixel areas (P), B electrode pads (205) corresponding to all LED light-emitting chips (101, 102, 103) are electrically connected; and in the same row of pixel areas (P), A electrode pads (201, 202, 203) corresponding to LED light-emitting chips (101, 102, 103) of the same light emission colour and are electrically connected.

Description

LED display unit group and display panel

This application claims priority from a Chinese patent application filed with the Chinese Patent Office on September 30, 2018 with application number 201811162175.7, the entire contents of which are incorporated herein by reference.

Technical field

The embodiments of the present application relate to LED display technologies, such as an LED display unit group and a display panel.

Background technique

With the continuous improvement of indoor display application technology, indoor small-pitch light-emitting diode (LED) displays have become the main technological development space in the future. In order to replace liquid crystal displays (LCDs) and digital light processing (Digital Light Processing) , DLP) indoor high-definition display products, indoor small-pitch LED display pixel unit density requirements are getting higher and higher, that is, the pixel unit pitch is getting smaller and smaller.

The LED display screen is composed of multiple independent LED light emitting units arranged in an array. FIG. 1 is a front wiring diagram of a related art light emitting unit. As shown in FIG. 1, each light emitting unit includes an insulating substrate 10 and four metal pads. , One anode pin, three cathode pins, and three color chips of red, green, and blue. The three LED chips are fixed on the first die-bonding pad 11, the second die-bonding pad 12, and the third die, respectively. On the die pad 13, the anodes of the three LED chips are connected to the common anode pad 14, and are connected to the anode pins on the back of the insulating substrate 10 through metal vias; the cathodes of the three LED chips are connected to their respective cathodes. Disks and connected to their respective cathode pins. In FIG. 1, the LED chips on the second die-bonding pad 12 and the third die-bonding pad 13 are vertical chips, and the cathode is directly fixed to the second die-bonding pad 12 and the third die-bonding through a conductive material, respectively. On the pad 13, the second die-bonding pad 12 and the third die-bonding pad 13 are simultaneously used as the cathode pads of the two chips thereon, and a part of the first die-bonding pad 11 is used as the cathode pads of the chip thereon, The three cathode pads are respectively connected to three cathode pins on the back of the insulating substrate through metal vias. It can be seen from FIG. 1 that the area of the die-bonding pad set to fix the LED chip is relatively large, and the four metal pads and metal traces occupy most of the area of the front surface of the insulating substrate 10. The reduction in size will lead to an increase in line resistance; at the same time, due to the high density of light-emitting units on the display panel and the excessive number of pins, it is difficult to control the design and layout of circuit circuits by the PCB board factory in the subsequent panel manufacturing process, resulting in a high degree of complexity. Poor stability. Therefore, it is difficult to reduce the size of the light emitting unit. Therefore, it is difficult for the light emitting unit using the related technology to realize an LED display with a pixel unit pitch of 1.0 mm or less.

Summary of the Invention

The present application provides an LED display unit group and a display panel, which avoids the situation that the structure of the light emitting unit in the related art cannot reduce the size of the display unit. On the premise of ensuring reliability and low cost, LEDs with a pixel unit pitch of 1.0 mm or less are realized. Display.

In a first aspect, an embodiment of the present application provides an LED display unit group including an insulating substrate, a front circuit board on a front surface of the insulating substrate, and a back circuit board on a back surface of the insulating substrate. Metal vias on the back circuit board; the front circuit board is divided into 2m rows and 2n columns of pixel areas. Each pixel area includes a first A pole pad, a second A pole pad, and a third A Electrode pads, three LED light emitting chips of different light emitting colors, and B pole pads corresponding to the three LED light emitting chips of different light emitting colors; wherein the three LED light emitting chips of different light emitting colors are first LEDs, respectively Light-emitting chip, second LED light-emitting chip, and third LED light-emitting chip, each of said LED light-emitting chips includes A and B poles with opposite polarities, n is a positive integer greater than or equal to 1, and m is a greater than or equal to 1. Positive integers; in each pixel area, the A poles of the three LED light emitting chips are electrically connected to the corresponding A pole pads; the B poles of the three LED light emitting chips are electrically connected to the corresponding B pole pads; the pixels in the same column region All LED chips emitting a corresponding electrode pad electrically connected to B; the same row in a pixel region, LED chips emitting the same light emission color corresponding to the A electrode pads are electrically connected.

In one embodiment, the thickness of the front circuit board is 0.1 mm-0.3 mm.

In one embodiment, the back circuit board includes 6m A-pole pins and 2n common B-pole pins; in the same pixel area, the A-pole pads corresponding to the LED light-emitting chips of the same light-emitting color are electrically connected to the The A pole pins corresponding to the same light emitting color LED light emitting chip in the row pixel area are electrically connected; in the same column pixel area, the B pole pads corresponding to all the LED light emitting chips are electrically connected, and a total of B corresponding to the pixel area in the column The pole pins are electrically connected.

In an embodiment, in each pixel region, the B-pole pads corresponding to the three LED light-emitting chips are different parts of the first metal pad, and the B-poles of the three LED light-emitting chips are respectively corresponding to the corresponding first metal pad. The different parts are electrically connected.

In an embodiment, in the same column of pixel areas, the B pole pads corresponding to all the LED light emitting chips are different parts of the second metal pad, and the B poles of all the LED light emitting chips are different from the corresponding second metal pads, respectively. Partial electrical connection.

In one embodiment, n = 1 and m = 1; in the pixel area of the same column, all the B-pole pads are arranged in a “1” shape along the column direction, and the two-row B-pole pads are located opposite each other on the front circuit board. In the edge area on both sides, the A-pole pad is located between two columns of B-pole pads.

In one embodiment, in the pixel region of the same row, the A-pole pads corresponding to the LED light-emitting chips of the same emission color are different parts of the third metal pad, and the third metal pads are arranged along the row direction.

In one embodiment, the second metal pad is directly connected to the common B-pole pin corresponding to the pixel region of the column through a metal via.

In one embodiment, the third metal pad is directly electrically connected to the corresponding A-pole pin through a metal via, or extends to the back circuit board through the metal via, and is connected to the corresponding The A pole pin is electrically connected.

In one embodiment, the front surface of the insulating substrate is provided with a first identification mark for position identification.

In one embodiment, an ink layer is provided in at least one of the adjacent pixel regions and the adjacent pixel regions.

In one embodiment, the three LED light emitting chips with different light emitting colors include a red LED light emitting chip, a green LED light emitting chip, and a blue LED light emitting chip.

In one embodiment, an insulating layer is provided on the back of the insulating substrate, and the insulating layer covers the back metal traces of the back circuit board and metal vias electrically connected to the metal traces.

In one embodiment, a second identification mark is provided on the back of the insulating substrate to identify the polarity of the pins.

In an embodiment, the insulating layer includes two different-colored insulating materials, and the dividing line between the two different-colored insulating materials divides the insulating layer into two different-color portions to form a second identification mark.

In a second aspect, an embodiment of the present invention further provides a display panel including the LED display unit group according to any one of the first aspect of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a front wiring diagram of a light emitting unit in the related art;

2 is a front view of an LED display unit group according to an embodiment of the present application;

3 is a schematic circuit structure diagram of an LED display unit group according to an embodiment of the present application;

4 is a wiring diagram of a front circuit board in an LED display unit group according to an embodiment of the present application;

5 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application;

6 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 5;

7 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application;

8 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 7;

9 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application;

10 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 9;

11 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application;

12 is a wiring diagram of a rear circuit board of the LED display unit group in FIG. 11;

FIG. 13 is a top view of an LED light emitting unit group according to an embodiment of the present application.

detailed description

In the embodiments of the present application, unless otherwise stated, the orientation words such as "up, down, top, and bottom" are usually used for the directions shown in the drawings or for vertical, vertical, or The description of the positional relationship of the components in the direction of gravity.

An embodiment of the present application provides an LED display unit group. FIG. 2 is a front view of an LED display unit group according to an embodiment of the present application. As shown in FIG. 2, the LED display unit group includes an insulating substrate 100 and The front wiring board 200 on the front of the substrate and the back wiring board 300 on the back of the insulating substrate. The insulating substrate 100 is provided with metal vias for connecting the front wiring board 200 and the back wiring board 300.

The front circuit board is divided into 2m rows and 2n columns of pixel areas, where n and m are both positive integers greater than or equal to 1. For example, in this embodiment, m = 1 and n = 1 For example, the scheme of the present application will be described. Exemplarily, the LED light emitting chips may all be flip-chip LED chips, including A pole and B pole; the polarities of A pole and B pole are opposite, and A pole and B pole are located on the side opposite to the light emitting side of the LED light emitting chip. The A pole and the B pole of the light emitting chip are respectively fixed on the A pole pad and the B pole pad through a conductive material. Because a flip chip is used, there is no need for a bonding wire that connects the electrodes and pads of the light emitting chip, which simplifies the process and reduces costs. In this embodiment and subsequent embodiments, the anode of the A chip and the cathode of the B chip are described as examples. The corresponding A pole pads are anode pads and the B pole pads are Cathode pad.

FIG. 3 is a schematic diagram of a circuit structure of an LED display unit group according to an embodiment of the present application. As shown in FIG. 3, each pixel area includes three LED light emitting chips of different light emitting colors, which are sequentially the first LED light emitting chip. 101. A second LED light emitting chip 102 and a third LED light emitting chip 103. In each pixel region, the cathodes of all the LED light emitting chips in the two pixel regions are connected together. In each pixel region, the anodes of two first LED light emitting chips 101 are connected together; the anodes of two second LED light emitting chips 102 are connected together; and the anodes of two third LED light emitting chips 103 are connected together.

FIG. 4 is a wiring diagram of a front circuit board in an LED display unit group according to an embodiment of the present application. As shown in FIG. 4, the LED display unit group includes four pixel areas P arranged in an array, and each pixel area P includes a first anode pad 201, a second anode pad 202, a third anode pad 203, and a first metal pad 204, and three LED light emitting chips of different light emitting colors, which are the first LEDs, respectively. The light emitting chip 101, the second LED light emitting chip 102, and the third LED light emitting chip 103.

In each pixel area, the anodes of the three LED light emitting chips are electrically connected to the corresponding anode pads respectively, that is, the anode of the first LED light emitting chip 101 is fixed on the first anode pad 201 by a conductive material, and the second LED emits light. The anode of the chip 102 is fixed to the second anode pad 202 by a conductive material, and the anode of the third LED light emitting chip 103 is fixed to the third anode pad 203 by a conductive material; the cathodes of the three LED light emitting chips are all connected to the first metal pad 204 is electrically connected, that is, the cathode pads corresponding to the three LED light emitting chips are different parts of the first metal pad 204, and the cathodes of the three LED light emitting chips are respectively fixed to different parts of the corresponding first metal pad 204 through conductive materials. . It should be noted that in this embodiment, the cathode pads may also be in the form of three separate cathode pads electrically connected. In each pixel area, the cathodes of the three LED light emitting chips are electrically connected to the corresponding cathode pads, respectively. The three cathode pads are electrically connected.

The common cathode pads corresponding to all the LED light-emitting chips in the same column of pixel areas are electrically connected and connected to the common cathode pins corresponding to the pixel units in the column; in the same row of pixel areas, the anode welding corresponding to the same light-emitting color LED light-emitting chips The panel is electrically connected, and is electrically connected to the corresponding anode pin of the same LED light emitting chip in the row of pixel units. Exemplarily, the common cathode pads corresponding to all the LED light-emitting chips in a certain pixel region may be electrically connected to the common cathode pins corresponding to the pixel units in the column; in a pixel region of a row, the The anode pad corresponding to the LED light emitting chip is electrically connected to the anode pin corresponding to the LED light emitting chip of the same light emitting color in the row of pixel units. In the related art, four separate light-emitting units require 16 pins. In the embodiment of the present application, a display unit group includes four light-emitting units, but the number of pins is greatly reduced.

The LED display unit group provided in the embodiment of the present application packages 2m × 2n pixel areas together to form a display unit group. Each pixel area includes a first A-pole pad, a second A-pole pad, and a third A pole pads, and three LED light emitting chips with different light emitting colors, and B pole pads corresponding to three LED light emitting chips with different light emitting colors, and the B pole pads corresponding to all LED light emitting chips in the same pixel region. Connection; in the pixel area of the same row, the A pole pads of the same light emitting color LED chip are electrically connected. When the display panel is subsequently formed, the number of pins is reduced, which simplifies the circuit design of the PCB circuit board and ensures reliability and reliability. Under the premise of low cost, the LED display with a pixel unit pitch of 1.0 mm or less can be realized.

In one embodiment, the thickness of the front circuit board is 0.1-0.3 mm. The front circuit board is formed by etching the metal foil located on the front surface of the insulating substrate. Because the metal foil is thick, the accuracy of the line width of the etched circuit board is poor, and it is applied to small-pitch display screens (for example, the pixel pitch is less than 1.0mm). When the display unit is displayed, it is easy to cause the line string and the improper position of the solid crystal to cause the LED light-emitting chip to be firmly fixed. In the embodiment of the present application, before the metal foil is etched to form a front circuit board, the surface of the metal foil is etched to reduce the thickness of the metal foil; after the metal vias are drilled and electroplated with copper to form metal vias, the metal foil is etched again Surface, reducing copper thickness. In this way, in the process of forming a metal circuit by subsequent etching, the accuracy of etching can be improved. The accuracy of the line width of the front circuit board after etching is high, and the thickness of the front circuit board formed after etching is 0.1-0.3 mm. In the related art, the thickness of the front circuit board is 0.3-0.5 mm.

FIG. 5 is a wiring diagram of a front circuit board in another LED display unit group provided by an embodiment of the present application. As shown in FIG. 5, in an embodiment, in the same column of pixel regions, the cathodes corresponding to all LED light-emitting chips The pads are different parts of the second metal pad 205, and the cathodes of all the LED light emitting chips are electrically connected to different parts of the corresponding second metal pad 205, respectively. The second metal pads 205 are elongated and distributed along the column direction. In each pixel region, three anode pads are arranged parallel to the second metal pad 205 in the column direction, and are located on the same side of the second metal pad 205.

The cathodes of all the first LED light-emitting chips 101, the second LED light-emitting chips 102, and the third LED light-emitting chips 103 in the same pixel region are fixed at different positions of the corresponding second metal pads 205 through conductive materials. In each pixel region, the anodes of the first LED light emitting chip 101, the second LED light emitting chip 102, and the third LED light emitting chip 103 are fixed to the first anode pad 201, the second anode pad 202, and the third electrode by a conductive material, respectively. On the anode pad 203.

In one embodiment, as shown in FIG. 4 and FIG. 5, in the pixel area of the same column, all the cathode pads are arranged in a “1” shape along the column direction. Side edge area, the anode pad is located between the two columns of cathode pads. Such a pad arrangement makes the arrangement of the LED light-emitting chip and the pad compact and reduces the size of the display unit group.

FIG. 6 is a wiring diagram of the rear circuit board of the LED display unit group in FIG. 5. In one embodiment, as shown in FIG. 5 and FIG. 6, the rear circuit board includes 6 anode pins and 2 common cathode pins. In each row of pixel areas, the first anode pads 201 of the two pixel areas are electrically connected and electrically connected to the first anode pins corresponding to the corresponding row of pixel areas; the second anode pads 202 of the two pixel areas are electrically connected. And is electrically connected to the second anode pin corresponding to the corresponding row pixel area; the third anode pad 203 of the two pixel areas is electrically connected, and is electrically connected to the third anode pin corresponding to the corresponding row pixel area. The second metal pads 205 in each column of pixel regions are directly connected to the common cathode pins corresponding to the corresponding column of pixel regions through metal vias.

In an embodiment, referring to FIG. 4 and FIG. 5, in the same row of pixel areas, the anode pads of two LED light-emitting chips of the same light emission color are different parts of the third metal pad, and the third metal pad is along the row direction. Arrange. Taking the pixel region of the first row as an example, the third metal pad is in a strip shape or an approximately strip shape and is arranged along the row direction. The two first anode pads 201 are two ends of the third metal pad. The second anode pad 202 and the third anode pad 203 are similar to the first anode pad 201, and are not described herein again.

The third metal pad is electrically connected directly to the corresponding anode pin through a metal via, or extends to the back circuit board through the metal via, and is electrically connected to the corresponding anode pin through a metal trace on the back circuit board. In an embodiment, as shown in FIG. 5 and FIG. 6, in the first row of pixel regions, the third metal pad where the two first anode pads 201 are located passes through a metal via located in the middle of the third metal pad. The first anode pin 311 directly corresponding to the pixel region of the row is electrically connected; the third metal pad where the two second anode pads 202 are located extends through the metal via to the back circuit board 300 and passes through the back circuit board 300 The first metal trace 341 is electrically connected to the second anode pin 312 corresponding to the pixel region of the row; the third metal pad where the two third anode pads 203 are extended to the back circuit board 300 through metal vias, and The second metal trace 342 on the rear circuit board 300 is electrically connected to the third anode pin 313 corresponding to the pixel region of the row. In the pixel region of the second row, the third metal pads where the two first anode pads 201 are located extend to the back circuit board 300 through metal vias, and pass through the third metal trace 343 on the back circuit board 300 to the row. The first anode pin 321 corresponding to the pixel area is electrically connected; the third metal pad where the two second anode pads 202 are located extends to the back circuit board 300 through a metal via, and passes through the fourth metal on the back circuit board 300 The trace 344 is electrically connected to the second anode pin 322 corresponding to the pixel region of the row; the third metal pad where the two third anode pads 203 are located is directly connected to the third metal pad through a metal via in the middle of the third metal pad. The first anode pin 323 corresponding to the row pixel region is electrically connected. In the first column of pixel regions, the second metal pads 205 where all the cathode pads are located are directly connected to the common cathode pins 331 corresponding to the pixel regions of the column through metal vias; in the second column of pixel regions, all the cathode pads are electrically connected. The second metal pad 205 is directly connected to the common cathode pin 332 corresponding to the pixel region of the column through a metal via. The eight pins are evenly distributed along the edge region of the back circuit board 300, and the two

common cathode pins

331 and 332 are respectively located in the areas where two opposite corners of the back circuit board 300 are located.

It should be noted that the metal pad where the anode pad is located in the above embodiment may also be approximately long, and the position of each pin may be changed correspondingly according to the position of the metal via. FIG. 7 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application, and FIG. 8 is a wiring diagram of a rear circuit board in the LED display unit group in FIG. 7. As shown in FIG. 7, the two ends of the third metal pad fix the position of the LED light emitting chip, that is, the

anode pads

201, 202, and 203 are slightly larger than other areas, or are bent at a certain angle to facilitate the fixing of the LED light emitting chip. The positions of the metal vias on the metal pads can be slightly larger than other areas, which is convenient for drilling. As shown in FIG. 7 and FIG. 8, the position of the

common cathode pins

331 and 332 changes from the area where two diagonal corners are located to the other two diagonal corners due to the change in the position of the metal vias on the second metal pad 205. The location of the anode leads 312 and 322 changes. FIG. 9 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application. FIG. 10 is a wiring diagram of a back circuit board in the LED display unit group in FIG. 9. Referring to FIGS. 9 and 10, The metal vias on the second metal pad 205 are located in the middle of the second metal pad 205. The second metal pad 205 is electrically connected directly to the common cathode pin through the metal via, and the two

common cathode pins

331 and 332 are located The edge region of the back circuit board is located on the bisector of two rows of pixel regions, and is arranged symmetrically with respect to the column bisector of the pixel regions.

FIG. 11 is a wiring diagram of a front circuit board in another LED display unit group according to an embodiment of the present application, and FIG. 12 is a wiring diagram of a rear circuit board in the LED display unit group in FIG. 11. In an embodiment, in this embodiment, in the first row of pixel regions, the first anode pads 201 of the two first LED light emitting chips 101 are different parts of the same metal pad, and the metal pads are passed through the metal. The holes are directly connected to the corresponding first anode pins 311; the second anode pads 202 of the two second LED light emitting chips 102 respectively extend to the back circuit board through metal vias, and pass through the fifth metal on the back circuit board. The line 345 is electrically connected to the corresponding second anode pin 312; the third anode pads 203 of the two third LED light-emitting chips 103 respectively extend to the back circuit board through metal vias, and are routed through the sixth metal on the back circuit board. The line 346 is electrically connected to the corresponding third anode pin 313.

In the pixel region of the second row, the first anode pads 201 of the two first LED light emitting chips 101 respectively extend to the back circuit board through metal vias, and the seventh metal trace 347 on the back circuit board and the corresponding first The anode pin 321 is electrically connected; the second anode pads 202 of the two second LED light emitting chips 102 respectively extend to the back circuit board through metal vias, and the eighth metal trace 348 on the back circuit board and the corresponding second The anode pins 322 are electrically connected; the third anode pads 203 of the two third LED light emitting chips 103 are different parts of the same metal pad, and the metal pads are directly electrically connected to the corresponding third anode pins 323 through metal vias. .

In the first column of pixel regions, the second metal pads 205 where all the cathode pads are located are directly connected to the common cathode pins 331 corresponding to the pixel regions of the column through metal vias; in the second column of pixel regions, all the cathode pads are electrically connected. The second metal pad 205 is directly connected to the common cathode pin 332 corresponding to the pixel region of the column through a metal via.

In an embodiment, referring to FIGS. 4, 5, 9, and 11, in the above embodiment, the front surface of the insulating substrate 100 is provided with a first identification mark 110 for position identification, and the first identification mark 110 may be located on the insulation substrate 100. Some edge area of the front. In the process of fixing the LED light-emitting chip to the front circuit board 200, it is necessary to use a clamping tool to fix the insulating substrate including the circuit board at a certain position. For example, after the first identification mark is fixed to the right, the fixed crystal position is avoided. Something went wrong. The first identification mark 110 is set to quickly identify whether the position of the insulating substrate is correct.

FIG. 13 is a plan view of an LED light emitting unit group provided in an embodiment of the present application. As shown in FIG. 13, in an embodiment, an ink layer 120 is provided between adjacent row pixel regions and adjacent column pixel regions. The ink can be black ink or other inks with darker colors, which are formed by inkjet printing technology to improve the contrast of the surface of the device, thereby improving the degree of fidelity of display colors. Further, in some embodiments, an ink layer may be provided only between pixel regions of adjacent rows or an ink layer may be provided only between pixel regions of adjacent columns.

In one embodiment, the metal via is filled with a first insulating material, and the first insulating material does not exceed the upper and lower surfaces of the insulating substrate. The first insulating material includes resin or green oil. The first insulating material does not exceed the upper and lower surfaces of the insulating substrate. The advantage of this filling is that when the device is packaged later, the contact area between the packaging material and the insulating substrate 100 is increased, thereby enhancing the packaging. The bonding force between the material and the insulating substrate 100 improves the sealing performance.

In one embodiment, the three LED light emitting chips with different light emitting colors are a red LED light emitting chip, a green LED light emitting chip, and a blue LED light emitting chip. In order to meet different routing requirements on the PCB, the first LED light-emitting chip, the second LED light-emitting chip, and the third LED light-emitting chip can be red, green, and blue LED light-emitting chips, respectively; they can also be blue, green, and Red LED light-emitting chip; other arrangements are also possible, which are not limited in this application.

In one embodiment, an insulating layer is provided on the back of the insulating substrate 100, and the insulating layer covers the back metal traces of the back circuit board and metal vias electrically connected to the back metal traces. The material of the insulation layer includes white oil, resin, or green oil, etc., for the purpose of insulation and protection.

In one embodiment, a second identification mark is provided on the back of the insulating substrate 100 for identifying the polarity of the pins. In the embodiment of the present application, the insulating layer includes two different colors of insulating

materials

401 and 402, such as white oil and green oil. The dividing line of the two different colors of insulating

materials

401 and 402 divides the insulating layer into two different colors. Partly, a second identification mark for identifying the polarity of the pin is formed. In another embodiment of the present application, an insulating layer (such as white oil) may be coated on the insulating substrate 100 to cover the back metal traces on the back circuit board and metal vias electrically connected to the back metal traces. , And then apply an insulating material (such as green oil) with a large difference in color from the insulating layer on the surface of the insulating layer, the shape of which can be a triangle or other shapes that have the polarity of the identifying pin; ) Half of the surface is coated with green oil, and the dividing line between white oil and green oil divides the back of the LED display unit group into two parts with different colors to form identification marks as shown in FIGS. 6, 8 and 10.

An embodiment of the present application further provides a display panel including the LED display unit group described in any of the foregoing embodiments of the present application.

Claims

An LED display unit group includes an insulating substrate, a front circuit board on the front of the insulating substrate, and a back circuit board on the back of the insulating substrate. The insulating substrate is provided with a connection for connecting the front circuit board and the back circuit. Metal vias on the board;

The front circuit board is divided into 2m rows and 2n columns of pixel areas arranged in an array. Each pixel area includes a first A pole pad, a second A pole pad, and a third A pole pad. Three LED light-emitting chips of different light-emitting colors and B-pole pads corresponding to the three LED light-emitting chips of different light-emitting colors; wherein the three LED light-emitting chips of different light-emitting colors are a first LED light-emitting chip and a second LED, respectively A light emitting chip and a third LED light emitting chip, each of the LED light emitting chips includes A and B poles with opposite polarities, n is a positive integer greater than or equal to 1, and m is a positive integer greater than or equal to 1;

In each pixel area, the A poles of the three LED light emitting chips are electrically connected to the corresponding A pole pads respectively; the B poles of the three LED light emitting chips are electrically connected to the corresponding B pole pads, respectively;

The B pole pads corresponding to all the LED light emitting chips in the same pixel area are electrically connected;

In the pixel region of the same row, the A pole pads corresponding to the LED light emitting chips of the same light emitting color are electrically connected.
The LED display unit group according to claim 1, wherein a thickness of the front circuit board is 0.1 mm-0.3 mm.
The LED display unit group according to claim 1, wherein the back circuit board includes 6m A-pole pins and 2n common B-pole pins;

In the pixel area of the same row, the A pole pads corresponding to the LED light emitting chips of the same light emitting color are electrically connected to the A pole pins corresponding to the LED light emitting chips of the same light emitting color in the row pixel area;

In the pixel region of the same column, the B-pole pads corresponding to all the LED light-emitting chips are electrically connected, and are electrically connected to the common B-pole pins corresponding to the pixel regions of the column.
The LED display unit group according to claim 3, wherein, in each of the pixel regions, the B-pole pads corresponding to the three LED light-emitting chips are different parts of the first metal pad, and the B of the three LED light-emitting chips is different The poles are electrically connected to different portions of the corresponding first metal pads, respectively.
The LED display unit group according to claim 3, wherein in the pixel region of the same column, the B-pole pads corresponding to all the LED light-emitting chips are different parts of the second metal pad, and the B-poles of all the LED light-emitting chips are respectively corresponding to Different parts of the second metal pad are electrically connected.
The LED display unit group according to claim 4 or 5, wherein n = 1 and m = 1;

In the pixel area of the same column, all the B-pole pads are arranged in a "1" shape along the column direction, and the two columns of B-pole pads are respectively located at the edge regions on opposite sides of the front circuit board, and the A-pole pads Located between the two columns of B-pole pads.
The LED display unit group according to claim 6, wherein in the same row of pixel areas, the A-pole pads corresponding to the LED light-emitting chips of the same emission color are different parts of the third metal pad, and the third metal pad is along Arrange in row direction.
The LED display unit group according to claim 5, wherein the second metal pad is electrically connected directly to a common B-pole pin corresponding to the pixel region of the column through a metal via.
The LED display unit group according to claim 7, wherein the third metal pad is directly electrically connected to the corresponding A-pole pin through a metal via, or extends to the back circuit board through the metal via, and passes through the back circuit The metal traces on the board are electrically connected to the corresponding A-pole pins.
The LED display unit group according to claim 1, wherein a front surface of the insulating substrate is provided with a first identification mark for position identification.
The LED display unit group according to claim 1, wherein at least one of between adjacent row pixel regions and between adjacent column pixel regions is provided with an ink layer.
The LED display unit group according to claim 1, wherein the three LED light emitting chips of different light emitting colors include a red LED light emitting chip, a green LED light emitting chip, and a blue LED light emitting chip.
The LED display unit group according to claim 3, wherein an insulating layer is provided on a back surface of the insulating substrate, and the insulating layer covers a back metal trace of the back circuit board and a metal electrically connected to the back metal trace. Vias.
The LED display unit group according to claim 13, wherein a second identification mark for identifying the polarity of the pin is provided on the back surface of the insulating substrate.
The LED display unit group according to claim 14, wherein the insulating layer includes two different-colored insulating materials, and a dividing line of the two different-colored insulating materials divides the insulating layer into two parts of different colors to form The second identification mark.
A display panel comprising the LED display unit group according to any one of claims 1-15.