CN113777113A - Optical detection method of lamp panel and lamp panel manufacturing method - Google Patents
Optical detection method of lamp panel and lamp panel manufacturing method Download PDFInfo
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- CN113777113A CN113777113A CN202110883039.2A CN202110883039A CN113777113A CN 113777113 A CN113777113 A CN 113777113A CN 202110883039 A CN202110883039 A CN 202110883039A CN 113777113 A CN113777113 A CN 113777113A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 52
- 238000001514 detection method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000011324 bead Substances 0.000 claims abstract description 79
- 238000000034 method Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000004381 surface treatment Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The application provides an optical detection method of a lamp panel and a manufacturing method of the lamp panel; the optical detection method of the lamp panel comprises the following steps: setting a mark pattern in a process edge area of a circuit substrate, wherein the circuit substrate comprises at least one lamp bead setting area and the process edge area surrounding the periphery of the lamp bead setting area, the lamp bead setting area is provided with a plurality of lamp bead bonding pads, and the mark pattern is different from the lamp bead bonding pads; and carrying out optical detection on the lamp panel by taking the identification graph as an initial position. According to the optical detection method of the lamp panel and the lamp panel manufacturing method, when AOI (automated optical inspection) identification is carried out on the lamp panel, the initial position of the identification can be accurately positioned, the problems of machine identification obstacles, optical scanning identification errors and jamming can be avoided, and the AOI identification efficiency can be improved.
Description
Technical Field
The application relates to the technical field of production and manufacturing of circuit boards, in particular to an optical detection method of a lamp panel and a lamp panel manufacturing method.
Background
With the development of light-emitting diode (LED) technology, the proportion of LED lamp panels in the circuit board market is higher and higher. The LED lamp panel is divided into an element surface and a lamp bead surface generally, and the lamp bead surface is composed of a plurality of LED bonding pads with the same size.
When the LED lamp panel is produced, Automatic Optical Inspection (AOI) is required to scan and detect the bead surface of the LED lamp panel to determine the abnormal or defective LED bonding pad.
However, because the lamp bead surface has a plurality of LED pads with the same size, the same LED pad is likely to cause abnormal problems such as machine identification failure, optical scanning identification error, and card jamming when performing AOI identification.
Disclosure of Invention
The application provides an optical detection method of a lamp panel and a lamp panel manufacturing method, which can accurately position an initial position of recognition when AOI recognition is carried out on the lamp panel, can avoid the problems of machine recognition obstacles, optical scanning recognition errors and card jamming, and can improve the recognition efficiency of AOI.
According to a first aspect of the application, an optical detection method of a lamp panel is provided, which includes:
setting an identification pattern in a process edge area of a circuit substrate, wherein the circuit substrate comprises at least one lamp bead setting area and the process edge area surrounding the periphery of the lamp bead setting area, the lamp bead setting area is provided with a plurality of lamp bead bonding pads, and the identification pattern is different from the lamp bead bonding pads;
and carrying out optical detection on the lamp panel by taking the identification graph as an initial position.
In one possible design mode, the circuit substrate comprises a first lamp bead arrangement area and a second lamp bead arrangement area adjacent to the first lamp bead arrangement area; setting a mark pattern in the process edge area, comprising the following steps:
arranging a first sub-identification graph on the process side area of the first lamp bead arrangement area;
and arranging a second sub-identification graph on the process edge area of the second lamp bead arrangement area, wherein the second sub-identification graph is different from the first sub-identification graph, and the identification graph comprises the first sub-identification graph and the second sub-identification graph.
In a possible design, the first sub identification pattern includes a plurality of first graphic units, and the second sub identification pattern includes a plurality of second graphic units; the number of the first graphic units is different from the number of the second graphic units.
In one possible embodiment, the first graphic element has a different shape than the second graphic element.
In one possible design, the first sub identification pattern includes a plurality of first graphic elements with different shapes, and the second sub identification pattern includes a plurality of second graphic elements with different shapes; the first graphic units of a plurality of different shapes are arranged in a different order from the second graphic units of a plurality of different shapes.
In one possible design, the setting of the identification pattern in the process margin includes:
and etching the circuit substrate under the protection of a protective film to form the identification pattern on the circuit substrate.
In a possible design mode, the identification pattern and the edge of the lamp bead setting area are arranged at intervals.
According to a second aspect of the present application, a method for manufacturing a lamp panel is provided, which includes:
setting an identification pattern in a process edge area of a circuit substrate, wherein the circuit substrate comprises at least one lamp bead setting area and the process edge area surrounding the periphery of the lamp bead setting area, the lamp bead setting area is provided with a plurality of lamp bead bonding pads, and the identification pattern is different from the lamp bead bonding pads;
carrying out optical detection on the lamp panel by taking the identification graph as an initial position;
performing surface treatment on the lamp bead bonding pad;
and cutting off the process edge area to obtain the lamp panel.
In one possible design, the setting of the identification pattern in the process margin includes:
and when the lamp bead setting area is used for manufacturing the circuit, the process edge area is used for manufacturing the identification graph.
In a possible design, the identification pattern with the lamp pearl sets up the border interval setting in district, the excision technology limit district obtains the lamp plate, includes:
and cutting off the process edge area along the interval between the identification pattern and the edge of the lamp bead setting area to obtain the lamp panel.
This application embodiment sets up the identification pattern through the technology limit district at circuit substrate to set up the identification pattern to the figure that is different from the lamp pearl pad, like this, when carrying out optical detection scanning to the lamp plate, just can carry out accurate location to the initial position through the identification pattern. Compared with the prior art, the method can accurately position the initial position of the identification, and can avoid the problems of machine identification obstacles, optical scanning identification errors and card jamming, thereby improving the identification efficiency of AOI.
The construction of the present application and other objects and advantages thereof will be apparent from the following detailed description taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart of an implementation of a method for optically detecting a lamp panel according to an embodiment of a first aspect of the present application;
fig. 2 is a schematic view of a first structure of a lamp panel in a method for optically detecting the lamp panel according to an embodiment of a first aspect of the present application;
fig. 3 is a schematic view of a second structure of the lamp panel in the optical detection method for the lamp panel according to the first aspect of the present application;
fig. 4 is a schematic structural diagram of a third example of the lamp panel in the optical detection method for the lamp panel according to the first aspect of the present application;
fig. 5 is a schematic diagram of a fourth structure of the lamp panel in the optical detection method for the lamp panel according to the first aspect of the present application;
fig. 6 is a schematic structural diagram of a fifth kind of lamp panel in the optical detection method for a lamp panel according to the first aspect of the present application;
FIG. 7 is an enlarged partial view taken at A in FIG. 2;
fig. 8 is a flowchart of an implementation of a lamp panel manufacturing method according to an embodiment of the second aspect of the present application.
Description of reference numerals:
1-a circuit substrate;
10-process edge zone; 20-lamp bead setting area;
11-identification graphics; 21-a first lamp bead setting area; 22-a second lamp bead setting area;
111-a first sub-identification graphic; 112-a second sub-identification graphic;
201-lamp bead pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description of the present application, it is to be understood that the terms "inner," "outer," "upper," "bottom," "front," "back," and the like, when used in the orientation or positional relationship indicated in FIG. 1, are used solely for the purpose of facilitating a description of the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
To solve the technical problems in the related art, referring to fig. 1 and fig. 2, fig. 1 is a flowchart illustrating an implementation of an optical detection method for a lamp panel according to an embodiment of a first aspect of the present application, and fig. 2 is a schematic diagram illustrating a first structure of the lamp panel in the optical detection method for a lamp panel according to the embodiment of the first aspect of the present application. The embodiment of the first aspect of the application provides an optical detection method for a lamp panel, which can be particularly applied to AOI detection of a lamp bead bonding pad 201 of the LED lamp panel in the production process of the LED lamp panel, so that the quality of the lamp bead bonding pad 201 is ensured. The optical detection method of the lamp panel comprises the following steps:
Wherein, circuit substrate 1 includes that at least one lamp pearl sets up district 20 and surrounds in the technology limit district 10 of lamp pearl setting area 20 periphery, and lamp pearl setting area 20 has a plurality of lamp pearl pads 201, and sign figure 11 is different from lamp pearl pad 201.
Specifically, in the embodiment of the present application, the circuit substrate 1 may be a Printed Circuit Board (PCB). Referring to fig. 2, generally, the PCB has two opposite surfaces, one of which is printed with an outer layer circuit, and the other surface is provided with a lamp bead setting area 20 for welding the LED lamp, and the lamp bead setting area 20 is provided with a plurality of lamp bead pads 201. In the art, the bead pads 201 are commonly referred to as bead pads. Wherein, lamp pearl pad can be in lamp pearl setting zone 20 the mode of arranging that is the array and arranges.
It should be noted that the technical edge area 10 is usually an area surrounding the periphery of the lamp bead setting area 20, and in the manufacturing process of the LED lamp panel, the technical edge area 10 can be used as an area clamped by a pressing plate or a mechanical arm, and when the manufacturing is completed, the technical edge area 10 is removed by cutting or routing and the like, so as to obtain a finished LED lamp panel.
In the specific manufacturing, the identification pattern 11 may be manufactured together with the outer layer circuit, for example, when the outer layer circuit is etched to form a pattern, the identification pattern 11 is etched and formed together.
The technical personnel in the field can understand that, in the manufacturing process of the LED lamp panel, after the manufacture of the outer layer circuit is completed, AOI scanning needs to be carried out on the lamp bead pad so as to check the quality of the lamp bead pad, and the pad with defects is screened out in time to be repaired. For the convenience to AOI scanning apparatus fix a position, in this application embodiment, set up the shape of identification graph 11 into the shape different with lamp pearl pad. For example, referring to fig. 2, the lamp bead pad is a circle, and the identification pattern 11 is a square, a triangle, or a combination of a square and a triangle.
It should be noted that the shape of the identification pattern 11 shown in fig. 2 is merely described as a specific example, and the specific shape of the identification pattern 11 is not limited.
And 102, carrying out optical detection on the lamp panel by taking the identification graph 11 as an initial position.
Specifically, when AOI optical scanning inspection is performed on a lamp bead surface, the optical scanning equipment is subjected to positioning inspection through the identification pattern 11 different from the lamp bead pad.
Therefore, the accuracy of the initial position positioning of the AOI optical scanning equipment can be ensured, and the problem of fault shutdown caused by scanning dislocation can be avoided.
This application embodiment sets up identification pattern 11 through the technology limit 10 at circuit substrate 1 to set up identification pattern 11 to the figure that is different from lamp pearl pad 201, like this, when carrying out the optical detection scanning to the lamp plate, just can carry out accurate location to initial position through identification pattern 11. Compared with the prior art, the method can accurately position the initial position of the identification, and can avoid the problems of machine identification obstacles, optical scanning identification errors and card jamming, thereby improving the identification efficiency of AOI.
As will be appreciated by those skilled in the art, when manufacturing LED lamp panels, a plurality of LED lamp panels, for example, two, four, or even six, or eight LED lamp panels, are usually manufactured simultaneously on one PCB production imposition according to the size requirement of the LED lamp panels. Referring to fig. 3, fig. 3 is a schematic view of a second structure of the lamp panel in the optical detection method of the lamp panel provided in the embodiment of the first aspect of the present application. In the embodiment of the present application, circuit substrate 1 includes first lamp pearl setting zone 21 and second lamp pearl setting zone 22 adjacent to first lamp pearl setting zone 21.
And when carrying out AOI optical scanning inspection to the LED lamp plate, each LED lamp plate all needs the inspection, and the lamp pearl that for the ease of distinguishing the location difference sets up district 20. In the embodiment of the present application, the setting of the identification pattern 11 in the process edge area 10 includes:
a first sub-identification pattern 111 is arranged on the process edge area 10 of the first lamp bead arrangement area 21.
And a second sub-identification graph 112 is arranged on the process edge area 10 of the second lamp bead arrangement area 22, the second sub-identification graph 112 is different from the first sub-identification graph 111, and the identification graph 11 comprises the first sub-identification graph 111 and the second sub-identification graph 112.
In some specific examples, the first sub identification pattern 111 may be a different shape than the second sub identification pattern 112, for example, the first sub identification pattern 111 may be a pentagon, a hexagon, etc., and the second sub identification pattern 112 may be a square, a pentagon, etc.
Like this, can conveniently fix a position when carrying out AOI scanning inspection to the lamp pearl pad in a plurality of lamp pearl setting areas 20 on the PCB, can avoid the condition of the accurate fault shutdown that takes place in AOI optical scanning equipment location, can effectively improve AOI optical scanning efficiency.
Referring to FIG. 3, in one possible example, the first sub identification graphic 111 includes a plurality of first graphic elements and the second sub identification graphic 112 includes a plurality of second graphic elements; the number of first graphical units is different from the number of second graphical units.
For example, as shown in fig. 3, the first sub-identification pattern 111 may be one square, and the second sub-identification pattern 112 may be two squares.
It should be noted that the shapes of the first sub-identification pattern 111 and the second sub-identification pattern 112 in fig. 3 are only described as a specific example, and a person skilled in the art may set any identification pattern 11 different from the bead pad according to actual needs.
It is understood that, in the case that there are more bead setting regions 20, for example, four bead setting regions shown in fig. 3, the identification patterns 11 for different bead setting regions 20 may also be different, for example, three or four square identification patterns 11 shown in fig. 3.
In this way, the shape of the first sub identification pattern 111 and the shape of the second sub identification pattern 112 are set to be the same, and the number of the first sub identification pattern 111 and the second sub identification pattern 112 is set to be different, so that the shapes of the first sub identification pattern 111 and the second sub identification pattern 112 do not need to be designed for many times during specific design, and only the number of the first sub identification pattern 111 and the second sub identification pattern 112 needs to be adjusted, thereby improving the design efficiency.
In some optional examples, referring to fig. 4, fig. 4 is a schematic view of a third structure of the lamp panel in the optical detection method of the lamp panel provided in the embodiment of the first aspect of the present application. The first graphical element is shaped differently than the second graphical element.
For example, in one specific example, the first graphical element may be a triangle, while the second graphical element may be a square, a hexagon, or the like.
Like this for first graphic element and second graphic element's shape is different, can increase the difference degree between the sign figure 11 that the lamp pearl of difference set up district 20 corresponds, can improve the degree of accuracy to AOI optical scanning equipment location, improves AOI scanning efficiency.
Optionally, referring to fig. 5, fig. 5 is a schematic view of a fourth structure of the lamp panel in the optical detection method of the lamp panel provided in the embodiment of the first aspect of the present application. In the embodiment of the present application, the first sub identification pattern 111 includes a plurality of first graphic elements with different shapes, and the second sub identification pattern 112 includes a plurality of second graphic elements with different shapes; the arrangement order of the plurality of differently shaped first graphic elements is different from that of the plurality of differently shaped second graphic elements.
Specifically, in the embodiment of the present application, the shape of the first graphic element and the shape of the second graphic element may be the same.
For example, in one specific example, the first sub-identification pattern 111 includes three first pattern elements, which are circular, circular and triangular, respectively, and may be arranged in order of circular, circular and triangular (i.e., a circle Δ); the second sub-identification pattern 112 includes three second graphic elements, which may be circular, circular and triangular, respectively, and may be arranged in a circular, triangular, circular (i.e., Δ θ) or triangular, circular and circular (i.e., Δ θ), such that the first sub-identification pattern 111 is distinguished from the second sub-identification pattern 112.
Like this, can increase the distinguishability between the identification pattern 11 that the lamp pearl of difference set up district 20 to correspond, can improve the degree of accuracy to AOI optical scanning equipment location, improve AOI scanning efficiency.
It should be noted that, as shown in fig. 5, the first sub-identification pattern 111 and the second sub-identification pattern 112 may be formed by arranging a plurality of completely different pattern units in different order.
In other possible examples, referring to fig. 6, fig. 6 is a schematic diagram of a fifth structure of the lamp panel in the optical detection method of the lamp panel according to the embodiment of the first aspect of the present application. In the embodiment of the present application, the first sub identification pattern 111 and the second sub identification pattern 112 may be formed by arranging graphic units having the same shape in different orientations. For example, as shown in fig. 6, triangles are arranged in the square, the first sub identification patterns 111 are arranged in a manner that the vertex angles of a group of triangles are opposite to each other, and the vertex angles of a group of triangles are arranged in a manner that the vertex angles of a group of triangles are opposite to each other, and the second sub identification patterns 112 are arranged in a manner that the vertex angles of two groups of triangles are opposite to each other and the vertex angles of two groups of triangles are opposite to each other, so that the identification patterns 11 in more bead setting areas 20 can be analogized by the rule.
It should be noted that, in the embodiment of the present application, the identification pattern 11 is disposed in the process margin 10, specifically, after the outer layer pretreatment of the PCB is completed, the PCB is subjected to film pasting, and then exposure and development are performed by using a Laser Direct Imaging (LDI) technique, where positions where the outer layer circuit and the identification pattern 11 need to be manufactured are protected by using a dry film, and are not developed.
The circuit substrate 1 is etched under the protection of the protective film to form the logo pattern 11 on the circuit substrate 1.
It will be appreciated that during etching, the outer layer of circuitry is etched simultaneously. Specifically, the PCB may be etched by acid etching, and then the dry film is removed to obtain the outer layer circuit and the identification pattern 11.
Therefore, the processing procedure can be saved, and the production efficiency can be improved.
It should be noted that, since the identification pattern 11 is formed by etching together with the outer layer circuit in the embodiment of the present application, that is, the identification pattern 11 is mainly a copper layer. When the technical edge area 10 is cut or milled, in order to protect the cutting knife or milling knife and prolong the service life of the cutting knife or milling knife, referring to fig. 7, fig. 7 is a partially enlarged view of a position a in fig. 2. In the embodiment of the application, the identification pattern 11 and the lamp bead are arranged at the interval of the edge of the region 20.
Specifically, the interval between the identification pattern 11 and the edge of the lamp bead setting area 20 is greater than or equal to 4 mm.
Like this, can effectively protect cutting knife or gong sword not damaged by the sign figure 11 of metallic copper layer, can prolong the life of cutting knife or gong sword.
According to an embodiment of the second aspect of the present application, referring to fig. 8, fig. 8 is a flowchart illustrating an implementation of a lamp panel manufacturing method provided in the embodiment of the second aspect of the present application, and a lamp panel manufacturing method is provided, which includes the following steps:
in step 801, a logo pattern 11 is disposed on the process margin 10 of the circuit substrate 1.
Wherein, circuit substrate 1 includes that at least one lamp pearl sets up district 20 and surrounds in the technology limit district 10 of lamp pearl setting area 20 periphery, and lamp pearl setting area 20 has a plurality of lamp pearl pads 201, and sign figure 11 is different from lamp pearl pad 201.
Specifically, in the embodiment of the present application, the circuit substrate 1 may be a circuit substrate 1 that has been manufactured by a previous process, for example, the manufacturing steps of cutting, manufacturing an inner layer circuit, performing AOI optical scanning inspection on the inner layer circuit, pressing, drilling, depositing a copper plate, thickening a full graphic plate, and the like are completed. It should be noted that, the manufacturing steps and the process parameters of the previous processes of the circuit substrate 1 may refer to the manufacturing steps and the process parameters in the related art, and are not described in detail in this embodiment of the application.
The specific manufacturing steps of the foregoing embodiment can be referred to for the manufacturing of the identification pattern 11, which is not described in detail in this embodiment.
And step 802, carrying out optical detection on the lamp panel by taking the identification graph 11 as an initial position.
And step 803, performing surface treatment on the lamp bead bonding pad 201.
Specifically, in the embodiment of the application, the surface treatment mainly comprises chemically depositing nickel gold, chemically depositing silver, depositing tin or protecting copper agent (Organic solder resist Preservatives, OSP) on the lamp bead pad, so that the lamp bead pad is protected, the good weldability and conductivity of the lamp bead pad are ensured, and the situation that the lamp bead pad is oxidized before welding can be avoided. Optionally, if the surface treatment is electroless nickel gold plating or electroless silver plating, the mark pattern 11 may be covered and adhered with a dry film or adhesive tape resistant to an electroless nickel gold plating/electroless silver plating solution, and then the surface treatment is performed on the PCB. Through covering identification pattern 11, also sink gold/silver on can avoiding identification pattern 11, can material saving, avoid extravagant. If the surface treatment is tin deposition or OSP, the surface treatment can be directly performed without covering the identification pattern 11, so that the operation flow is saved, and the production efficiency is improved.
As will be appreciated by those skilled in the art, prior to surface treatment, the PCB is typically solder resist treated, for example, by printing, pre-baking, exposing, and developing a lamp panel that is free of abnormalities for AOI optical inspection to obtain solder resist protected PCB. The specific treatment process and the process parameters can refer to the treatment mode and the process parameters in the related technology.
And step 804, cutting off the process edge area 10 to obtain the lamp panel.
Specifically, can set up interval excision technology limit district 10 between the border in district 20 through aforementioned cutting knife or gong sword along identification pattern 11 and lamp pearl, obtain the lamp plate.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An optical detection method of a lamp panel is characterized by comprising the following steps:
setting an identification pattern in a process edge area of a circuit substrate, wherein the circuit substrate comprises at least one lamp bead setting area and the process edge area surrounding the periphery of the lamp bead setting area, the lamp bead setting area is provided with a plurality of lamp bead bonding pads, and the identification pattern is different from the lamp bead bonding pads;
and carrying out optical detection on the lamp panel by taking the identification graph as an initial position.
2. The optical detection method of a lamp panel according to claim 1, wherein the circuit substrate includes a first lamp bead setting region and a second lamp bead setting region adjacent to the first lamp bead setting region; setting a mark pattern in the process edge area, comprising the following steps:
arranging a first sub-identification graph on the process side area of the first lamp bead arrangement area;
and arranging a second sub-identification graph on the process edge area of the second lamp bead arrangement area, wherein the second sub-identification graph is different from the first sub-identification graph, and the identification graph comprises the first sub-identification graph and the second sub-identification graph.
3. The optical detection method for the lamp panel according to claim 2, wherein the first sub-logo comprises a plurality of first graphic units, and the second sub-logo comprises a plurality of second graphic units; the number of the first graphic units is different from the number of the second graphic units.
4. The method for optically inspecting a lamp panel of claim 3, wherein the first graphic unit has a different shape than the second graphic unit.
5. The optical detection method for the lamp panel according to claim 2, wherein the first sub-logo comprises a plurality of first graphic units with different shapes, and the second sub-logo comprises a plurality of second graphic units with different shapes; the first graphic units of a plurality of different shapes are arranged in a different order from the second graphic units of a plurality of different shapes.
6. The optical detection method for the lamp panel according to any one of claims 1 to 5, wherein the step of arranging the identification pattern in the process border area comprises:
and etching the circuit substrate under the protection of a protective film to form the identification pattern on the circuit substrate.
7. The optical detection method for the lamp panel according to any one of claims 1 to 5, wherein the identification pattern is arranged at an interval from an edge of the lamp bead arrangement region.
8. A lamp panel manufacturing method is characterized by comprising the following steps:
setting an identification pattern in a process edge area of a circuit substrate, wherein the circuit substrate comprises at least one lamp bead setting area and the process edge area surrounding the periphery of the lamp bead setting area, the lamp bead setting area is provided with a plurality of lamp bead bonding pads, and the identification pattern is different from the lamp bead bonding pads;
carrying out optical detection on the lamp panel by taking the identification graph as an initial position;
performing surface treatment on the lamp bead bonding pad;
and cutting off the process edge area to obtain the lamp panel.
9. The method for manufacturing a lamp panel according to claim 8, wherein the process edge area is provided with a logo pattern, and the method comprises the following steps:
and when the lamp bead setting area is used for manufacturing the circuit, the process edge area is used for manufacturing the identification graph.
10. The method for manufacturing the lamp panel according to claim 8 or 9, wherein the identification pattern is arranged at an interval with the edge of the lamp bead arrangement area, and the process edge area is cut off to obtain the lamp panel, including:
and cutting off the process edge area along the interval between the identification pattern and the edge of the lamp bead setting area to obtain the lamp panel.
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| CN202110883039.2A CN113777113A (en) | 2021-08-02 | 2021-08-02 | Optical detection method of lamp panel and lamp panel manufacturing method |
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