CN111288312A - LED light bar and manufacturing method thereof - Google Patents

LED light bar and manufacturing method thereof Download PDF

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Publication number
CN111288312A
CN111288312A CN202010076137.0A CN202010076137A CN111288312A CN 111288312 A CN111288312 A CN 111288312A CN 202010076137 A CN202010076137 A CN 202010076137A CN 111288312 A CN111288312 A CN 111288312A
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CN
China
Prior art keywords
circuit board
flexible circuit
marking
unit
adjacent
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Granted
Application number
CN202010076137.0A
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Chinese (zh)
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CN111288312B (en
Inventor
郑瑛
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Chongqing Huiku Technology Co ltd
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Chongqing Huiku Technology Co ltd
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Priority to CN202010076137.0A priority Critical patent/CN111288312B/en
Publication of CN111288312A publication Critical patent/CN111288312A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention discloses an LED light bar and a manufacturing method thereof, aiming at the problems that the existing LED light bar is thick in thickness, high in cost and easy to fall off due to position deviation of a shearing mark, a marking hole or a marking notch is directly arranged on a flexible circuit board of the LED light bar manufactured by the manufacturing method of the LED light bar to mark the shearing position, and the LED light bar does not fall off due to the fact that the shearing mark is printed on the surface of a packaging glue layer of the light bar, so that the reliability is higher; because the marking holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arrangement position is more accurate and reliable, and the phenomenon that the sheared LED lamp strip cannot work normally is avoided; meanwhile, the LED lamp strip can directly arrange the first LED chip on the flexible circuit board for packaging, the manufacturing process of an LED support and an LED lamp bead can be omitted relative to the current LED lamp strip, the manufacturing efficiency is higher, the cost is lower, the obtained LED lamp strip is a COB lamp strip, the thickness is thinner, and the requirements of various application scenes can be better met.

Description

LED light bar and manufacturing method thereof
Technical Field
The invention relates to the field of COB (Chip On Board Light, high-power integrated surface Light source) lamp strips, in particular to an LED lamp strip and a manufacturing method thereof.
Background
With the increasingly wide application of the LED light bar, the thickness of the LED light bar is also required to be higher and higher. The current LED lamp strip generally comprises a flexible circuit board, LED lamp beads arranged on the flexible circuit board, and packaging glue covering the LED lamp beads on the flexible circuit board. The LED lamp bead is composed of an LED support, an LED chip arranged in the LED support and packaging glue for packaging the LED in the support, so that the thickness of the lamp strip is thick, the cost is high, and the manufacturing efficiency is low.
In the using process of the LED light bar, the light bar lengths required by different application scenes may be different, and the length of the manufactured LED light bar is constant. Therefore, in an application scene needing a shorter light bar, the LED light bar needs to be cut; in a scene requiring a longer light bar, splicing the LED light bar with other LED light bars or a part of other LED light bars is involved, and shearing of the LED light bar is also involved in the splicing process. In order to guarantee that the LED lamp strip part obtained by shearing can normally work, the current LED lamp strip is provided with an LED lamp strip subunit which has unit length and can independently work, the LED lamp strip is sheared by taking the LED lamp strip subunit as a unit when sheared, and in order to guarantee the shearing accuracy, the current LED lamp strip is printed with a corresponding shearing mark on the surface of a lamp strip packaging adhesive, and the following problem exists in at least the way:
the printed cutting mark is easy to fall off, so that subsequent cutting errors are caused;
position deviation easily appears in the printing shearing mark on the surface of the packaging adhesive, and the LED lamp strip after shearing can not work normally.
Disclosure of Invention
The invention provides an LED light bar and a manufacturing method thereof, and solves the problems that the existing LED light bar is thick in thickness, high in cost, and easy to cause position deviation and fall off in a shearing mark.
In order to solve the above problems, the present invention provides a method for manufacturing an LED light bar, comprising:
arranging at least one circuit board matrix, wherein one circuit board matrix comprises at least two tiled flexible circuit boards, and each flexible circuit board comprises a first circuit layer borne on the front surface of a flexible substrate; the first circuit layer comprises at least one first light-emitting line, wherein one first light-emitting line comprises a pair of positive power supply lines and negative power supply lines, and first light-emitting line units which are connected between the positive power supply lines and the negative power supply lines in parallel and distributed along the length direction of the flexible substrate; the flexible circuit board comprises at least two line shearing units distributed along the length direction of the flexible substrate, and each line shearing unit comprises at least one first light-emitting line unit; the flexible circuit board further comprises a marking unit arranged between the adjacent line shearing units in the width direction of the flexible circuit board; the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board;
the die bonding and welding of the first LED chip are completed on the first light emitting line unit of each flexible circuit board;
forming a first packaging adhesive layer on the front surface of each flexible circuit board, wherein the first packaging adhesive layer at least covers the first light emitting line unit and the first LED chip;
and after the first packaging adhesive layer is formed, separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED lamp strip.
In order to solve the problems, the invention provides the LED light bar manufactured by the manufacturing method of the LED light bar.
The invention has the beneficial effects that:
the invention provides an LED light bar and a manufacturing method thereof, wherein at least one circuit board matrix is arranged, the circuit board matrix comprises at least two tiled flexible circuit boards, and a marking unit is arranged on the flexible circuit board in the width direction of the flexible circuit board between adjacent circuit shearing units in at least two circuit shearing units distributed along the length direction of the flexible substrate; the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board; and then, after die bonding and welding of the first LED chips are completed on the first light emitting line units of the flexible circuit boards, after a first packaging adhesive layer at least covering the first light emitting line units and the first LED chips is formed on the front surfaces of the flexible circuit boards, separating the adjacent flexible circuit boards in the circuit board matrix to obtain the LED light bars. The flexible circuit board of the LED light bar is directly provided with a marking hole or a marking notch to mark a shearing position, and the shearing mark is printed on the surface of the packaging adhesive layer of the light bar, so that the falling-off condition is avoided, and the reliability is higher; because the marking holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arrangement position is more accurate and reliable, and the phenomenon that the sheared LED lamp strip cannot work normally is avoided;
in addition, the first LED chip is directly arranged on the flexible circuit board for packaging, so that the manufacturing process of an LED bracket and an LED lamp bead can be omitted compared with the conventional LED lamp strip, the manufacturing efficiency is higher, the cost is lower, the obtained LED lamp strip is a COB lamp strip, the thickness is thinner, and the requirements of various application scenes can be better met;
in addition, the first encapsulation adhesive layer in this embodiment may be a transparent adhesive layer, the mark hole or the mark notch on the flexible circuit board may be covered by the transparent adhesive layer, or may be located outside the transparent adhesive layer in whole or partial area for being viewed during cutting;
certainly, the first encapsulating adhesive layer in this embodiment may also be a non-transparent or semi-transparent adhesive layer, and at this time, the first encapsulating adhesive layer may not cover or not completely cover the mark hole or the mark notch on the flexible circuit board, so as to be viewed during cutting; the first packaging adhesive layer can also completely cover the front side of the covering flexible circuit board, namely completely cover the marking holes or the marking gaps, at least the marking holes or the marking gaps can be observed from the back side of the flexible circuit board, or the packaging adhesive filled in the marking gaps can be observed from the side face of the flexible circuit board, so that the cutting position of the line cutting unit can be accurately determined.
Drawings
Fig. 1 is a schematic flow chart of an LED light bar and a manufacturing method thereof according to a first embodiment of the present invention;
fig. 2A is a schematic diagram of a light-emitting circuit unit according to a first embodiment of the present invention;
fig. 2B is a schematic diagram of two light-emitting circuit units according to a first embodiment of the present invention;
fig. 2C is a schematic diagram of a three-way light-emitting circuit unit according to a first embodiment of the present invention;
fig. 3A is a schematic view of a flexible circuit board according to a first embodiment of the present invention;
FIG. 3B is an enlarged schematic view of portion A1 of FIG. 3A;
fig. 4A is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention;
FIG. 4B is an enlarged schematic view of portion A3 of FIG. 4A;
fig. 5A is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention;
fig. 5B is an enlarged schematic view of a portion a2 in fig. 5A;
fig. 6A is a fourth schematic diagram of a flexible circuit board according to a first embodiment of the present invention;
fig. 6B is an enlarged schematic view of a portion a6 in fig. 6A;
fig. 7A is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention;
fig. 7B is an enlarged schematic view of a portion a9 in fig. 7A;
fig. 8A is a sixth schematic view of a flexible circuit board according to a first embodiment of the present invention;
fig. 8B is an enlarged schematic view of a portion A8 in fig. 8A;
fig. 9A is a schematic diagram seven of a flexible circuit board according to a first embodiment of the present invention;
fig. 9B is an enlarged schematic view of a portion a7 in fig. 9A;
fig. 10A is a schematic diagram of a flexible circuit board matrix according to a second embodiment of the present invention;
fig. 10B is a second schematic diagram of a flexible circuit board matrix according to a second embodiment of the present invention;
fig. 10C is a schematic diagram of a flexible circuit board matrix provided in the second embodiment of the present invention;
fig. 10D is a schematic view of a first adhesive layer on a flexible circuit board matrix according to the second embodiment of the present invention;
fig. 10E is a schematic diagram of a second adhesive layer on the flexible circuit board matrix according to the second embodiment of the invention;
fig. 11A is a schematic view of a first LED light bar provided in a second embodiment of the present invention;
fig. 11B is a schematic view of a second LED light bar provided in the second embodiment of the present invention;
fig. 11C is a schematic view of a third LED light bar provided in the second embodiment of the present invention;
fig. 12 is a fourth schematic view of an LED light bar provided in the second embodiment of the present invention;
fig. 13A is a fifth schematic view of an LED light bar provided in the second embodiment of the present invention;
fig. 13B is an enlarged schematic view of a portion B7 in fig. 13A;
fig. 14A is a schematic view six of an LED light bar provided in the second embodiment of the present invention;
fig. 14B is an enlarged schematic view of a portion B1 in fig. 14A;
fig. 15A is a schematic diagram seven of an LED light bar according to a second embodiment of the present invention;
fig. 15B is an enlarged schematic view of a portion B5 in fig. 15A;
fig. 16 is an eighth schematic view of an LED light bar provided in the second embodiment of the present invention;
fig. 17A is a first schematic diagram illustrating matrix splicing of a flexible circuit board according to a third embodiment of the present invention;
fig. 17B is a schematic diagram of matrix splicing of a flexible circuit board according to a third embodiment of the present invention;
fig. 17C is a third schematic diagram of flexible circuit board matrix splicing according to a third embodiment of the present invention;
fig. 18A is a schematic diagram nine of an LED light bar provided in the third embodiment of the present invention;
fig. 18B is an enlarged schematic view of a portion B3 in fig. 18A;
fig. 19A is a schematic view ten of an LED light bar provided by the third embodiment of the present invention;
fig. 19B is an enlarged schematic view of a portion B9 in fig. 19A;
fig. 20 is an eleventh schematic view of an LED light bar provided by the third embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
aiming at the problems that the existing LED light bar is thick in thickness and high in cost, and a shearing mark is easy to have position deviation and fall off, the embodiment provides the LED light bar manufacturing method which can greatly reduce the thickness and the cost of the LED light bar and can set the shearing mark more accurately and reliably; because the marking holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arrangement position is more accurate and reliable, and the phenomenon that the sheared LED lamp strip cannot work normally is avoided; meanwhile, the LED lamp strip can directly arrange the first LED chip on the flexible circuit board for packaging, the manufacturing process of an LED support and an LED lamp bead can be omitted relative to the current LED lamp strip, the manufacturing efficiency is higher, the cost is lower, the obtained LED lamp strip is a COB lamp strip, the thickness is thinner, and the requirements of various application scenes can be better met. For convenience of understanding, in the present embodiment, the following description is made by taking the method for manufacturing the LED light bar shown in fig. 1 as an example, please refer to fig. 1, where the method includes:
s101: at least one circuit board matrix is provided, one circuit board matrix comprising at least two tiled flexible circuit boards.
In this embodiment, a flexible circuit board includes a first circuit layer carried on a front surface of a flexible substrate; the first circuit layer comprises at least one first light-emitting line, wherein the first light-emitting line comprises a pair of positive power supply circuits and negative power supply circuits, and first light-emitting line units which are connected between the positive power supply circuits and the negative power supply circuits in parallel and distributed along the length direction of the flexible substrate; the flexible circuit board comprises at least two line shearing units distributed along the length direction of the flexible substrate, and each line shearing unit comprises at least one first light-emitting line unit; the flexible circuit board further comprises a marking unit arranged between the adjacent line shearing units in the width direction of the flexible circuit board; the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board.
In this embodiment, a circuit board matrix may be disposed on the die bonder or other chip transfer mechanisms.
S102: and the die bonding and welding of the first LED chip are completed on the first light emitting line unit of each flexible circuit board.
In this embodiment, the die bonding of the first LED chip can be completed on the first light emitting line unit of each flexible circuit board by, but not limited to, a die bonder or other chip transfer mechanisms. And it should be understood that in the embodiment, the soldering between the first LED chip and the corresponding electrode connection point in the first light emitting line unit may be implemented by solder paste, or may be implemented by conductive adhesive (e.g., conductive silver adhesive) (or may be referred to as conductive fixed connection).
S103: and forming a first packaging adhesive layer on the front surface of each flexible circuit board, wherein the first packaging adhesive layer at least covers the first light emitting line unit and the first LED chip.
The first encapsulant layer of the present embodiment may be, but is not limited to, a luminescence conversion adhesive layer, a white adhesive layer, a transparent adhesive layer, or a semitransparent adhesive layer, wherein the luminescence conversion adhesive layer may include, but is not limited to, a fluorescent adhesive layer, and a quantum dot film adhesive layer.
In this embodiment, the first encapsulation adhesive layer may be formed on the front surface of each flexible printed circuit board by, but not limited to, dispensing, molding, printing, spraying, and bonding.
S104: after the first packaging adhesive layer is formed, separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED lamp strip. The obtained LED lamp strip is a COB lamp strip, and the flexible circuit board is provided with a marking hole or a marking notch, so that the LED lamp strip has the advantages of being thinner, lower in cost, more accurate and reliable in shearing marking and the like.
The Flexible Printed Circuit (FPC) in this embodiment can be used for, but not limited to, manufacturing an LED light bar. The flexible substrate of the flexible circuit board in this embodiment may be, but not limited to, a substrate made of polyimide or polyester film, which has the advantages of high wiring density, light weight, thin thickness, good bending property, and the like.
The marking unit in the embodiment adopts a mode of penetrating through the marking hole or the marking notch of the flexible circuit board from the thickness direction of the flexible circuit board, so that compared with the existing method of printing a cutting mark on the surface of the packaging adhesive layer of the light bar, the falling-off condition can not occur, and the reliability is higher; and because the marking holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arrangement position is more accurate and reliable, and the condition that the sheared LED lamp strip cannot normally work can be avoided. For ease of understanding, the present embodiment will now be described with reference to the following exemplary illustration of the structural composition of the flexible circuit board. And it should be understood that the following example illustrates and does not limit the flexible circuit board structure in the present embodiment.
In this embodiment, the flexible substrate included in the flexible circuit board may be understood as a carrying main body of the flexible circuit board, and when the flexible circuit board is used for manufacturing the LED light bar, the flexible circuit board is generally in a strip shape, and the form of the flexible circuit board generally determines the form of the flexible circuit board, so that the flexible circuit board used for manufacturing the LED light bar is also in a strip shape, and the length direction and the width direction of the flexible circuit board are generally the same as the length direction and the width direction of the flexible circuit board. Accordingly, the thickness direction of the flexible circuit board and the thickness direction of the flexible substrate are the same in this embodiment. It should be understood that the maximum thickness of the flexible circuit board is generally greater than the maximum thickness of the flexible substrate. Of course, in some application scenarios, the flexible substrate may not be in a strip shape, but may also be applied to the scheme of the cutting mark proposed in this embodiment as long as it also relates to the cutting mark of the line cutting unit.
In this embodiment, the first circuit layer may be formed on the front surface of the flexible substrate by, but not limited to, Electrodeposition (ED) and plating. Besides at least one first light-emitting circuit, the formed first circuit layer can optionally be provided with other functional circuits according to requirements. The first light emitting line in this embodiment is mainly used for being electrically connected to the LED chip to form a line of a corresponding light emitting unit. Of course, according to the requirement, the first light emitting line may optionally further include a line for connecting to other electronic devices besides the LED chip, and the other electronic devices may include, but are not limited to, at least one of a protection resistor and a control chip.
In this example, one path of the first light-emitting line includes a pair of positive power supply lines and negative power supply lines, and first light-emitting line units connected in parallel between the pair of positive power supply lines and the negative power supply lines and distributed along the length direction of the flexible substrate, where the first light-emitting line unit includes at least two pairs of electrode connection points for electrically connecting with the positive electrode and the negative electrode of the LED chip, respectively. And the electrical connection relationship between the at least two pairs of electrode connection points can be in series or in parallel, and when at least three pairs of electrode connection points are included, the electrical connection relationship between the three pairs of electrode connection points can also be in series and parallel combination. Correspondingly, the electrical connection relationship between the LED chips connected to the electrode connection points of each pair may be in series, parallel, or a combination of series and parallel.
In this embodiment, at least two line cutting units are disposed on the flexible circuit board along the length direction thereof, and one line cutting unit includes at least one first light-emitting line unit, but it should be understood that the number of the first light-emitting line units included in the one line cutting unit can be flexibly set according to a specific application scenario. For convenience of understanding, in the following description of the present embodiment, several examples are described in which the first line layer includes one first light-emitting line unit and more than two first light-emitting line units.
Referring to fig. 2A, in an example, the first circuit layer disposed on the front surface of the flexible substrate may include only one light-emitting circuit unit, and the one light-emitting circuit unit includes at least two first light-emitting circuit units connected in parallel between a pair of positive power supply lines and a pair of negative power supply lines corresponding to the one light-emitting circuit unit. Referring to fig. 2A, the light-emitting line unit includes at least two parallel first light-emitting line units, and the connection manners between the LED chips 13 in each first light-emitting line unit may be the same, for example, they may be parallel, serial (as shown in fig. 2A) or serial and parallel, and of course, in some applications, the connection manners between the LED chips 13 in some first light-emitting line units may be different from the connection manners between the LED chips 13 in other first light-emitting line units, for example, the LED chips 13 in some first light-emitting line units are connected in parallel, and the LED chips 13 in other first light-emitting line units are connected in series or serial and parallel.
Referring to fig. 2B, in another example, the first circuit layer disposed on the front surface of the flexible substrate may only include two light-emitting circuit units, and one of the light-emitting circuit units includes at least two first light-emitting circuit units connected in parallel between a pair of positive power supply lines and a pair of negative power supply lines corresponding to the light-emitting circuit unit. In the two light-emitting circuit units shown in fig. 2B, the two light-emitting circuit units share a positive power supply line, but in some application scenarios, the two light-emitting circuit units may also share a negative power supply line and separately use the positive power supply line, or the two light-emitting circuit units separately use the negative power supply line and the positive power supply line. Referring to fig. 2B, each light-emitting circuit unit includes at least two first light-emitting circuit units connected in parallel, and the connection manner between the LED chips 13 in each first light-emitting circuit unit may be the same, or all or part of the first light-emitting circuit units may be different, which is not described herein again. In this embodiment, the connection modes between the LED chips in the first light emitting line unit included in each light emitting line unit may also be the same or different. In this example, the color temperature of the first light emitting line unit included in each light emitting line unit may be different, and each light emitting line unit may work independently, or two light emitting line units may work in combination according to requirements, so as to obtain at least three different light emitting modes, and enrich the light emitting effect.
In another example, as shown in fig. 2C, the first circuit layer disposed on the front surface of the flexible substrate may only include three light-emitting circuit units, and each light-emitting circuit unit also includes at least two first light-emitting circuit units connected in parallel between a pair of positive power supply lines and a pair of negative power supply lines corresponding to the light-emitting circuit unit. In the three-way light-emitting circuit unit shown in fig. 2C, the two light-emitting circuit units share a negative power supply circuit, but in some application scenarios, the three-way light-emitting circuit unit may also share a positive power supply circuit and separately use a negative power supply circuit, or the three-way light-emitting circuit unit may also share a negative power supply circuit and separately use a positive power supply circuit. As shown in fig. 2C, each light-emitting circuit unit includes at least two first light-emitting circuit units connected in parallel, and the connection manner between the LED chips 13 in each first light-emitting circuit unit may be the same, or all or part of the first light-emitting circuit units may be different, which is not described herein again. In this embodiment, the connection modes between the LED chips in the first light emitting line unit included in each light emitting line unit may also be the same or different. In this example, the light emission colors of the first light emitting line units included in the respective light emitting line units may be different, for example, the first light emitting line units included in the three light emitting line units may be three kinds of first light emitting line units that emit red light, green light, and blue light, respectively.
In the above three examples, in the example shown in fig. 2A, one first light-emitting line unit is included in one line cutting unit; in the example shown in fig. 2B, two first light-emitting line units are included in one line cutting unit; in the example shown in fig. 2C, three first light-emitting line units are included in one line cutting unit; in this way, when the first circuit layer disposed on the front surface of the flexible substrate includes four or more light-emitting circuit units (e.g., four R \ G \ B + white light), one circuit cutting unit may include four or more first light-emitting circuit units. It should be understood that the light-emitting circuit units are not limited to be arranged in a row as shown in fig. 2A to 2C, and may be arranged in a plurality of rows in a staggered or matrix manner. The device can be flexibly set according to requirements.
It should be understood that the marking units in this embodiment may be disposed between adjacent line cutting units, and at any position in the width direction of the flexible circuit board, and the number, shape, size, and the like of the marking holes or the marking notches may also be flexibly set, as long as the purpose of cutting the marking is achieved. In addition, it should be understood that, in the present embodiment, an opening manner in which the mark hole or the mark notch penetrates the flexible circuit board from the thickness direction of the flexible circuit board is a preferable manner. In some examples, the marking holes or the marking notches may not penetrate through the flexible circuit board from the thickness direction of the flexible circuit board, for example, only the front side, the back side or the side of the flexible circuit board needs to penetrate through, as long as the positions of the corresponding marking holes or the marking notches can be observed from the front side, the back side or the side of the flexible circuit board by the light bar manufactured by using the flexible circuit board, so that the cutting positions can be accurately determined. For ease of understanding, the present embodiment will be described below in conjunction with several examples of the arrangement of the marking elements for ease of understanding. It should be understood that the width direction of the flexible circuit board has a first side (for example, a left side) and a second side (for example, a right side, and of course, the first side may also be the right side, and the corresponding second side is the left side), wherein several setting examples of the marking unit include:
example one: the marking unit comprises a first marking unit positioned on the first side, wherein the first marking unit can be a marking hole or a marking notch.
For example, please refer to the flexible circuit board 1 shown in fig. 3A and 3B, the flexible circuit board includes at least two adjacent circuit cutting units 11, and the circuit cutting units 11 may include at least one first circuit light emitting unit (as shown in fig. 2A to 2C, but not limited to fig. 2A to 2C), each first circuit light emitting unit includes at least two pairs of electrode connection points 14 for electrically connecting with the anode and the cathode of the LED chip, respectively, and the electrical connection relationship between the pairs of electrode connection points 14 is shown in the above example, and will not be described again. Between adjacent line cutting units 11, a mark notch 12 is provided on the first side of the flexible circuit board in the width direction, the mark notches shown in fig. 3A and 3B are triangular notches, the marks 12 at the two ends are notches after half of the flexible circuit board is cut, and other figures are similar and are not repeated herein. Of course, it should be understood that the notch may be any other notch with any shape, and the size of the notch may be flexibly set according to the specific application scenario, as long as the notch can be clearly visible to the naked eye without affecting the normal function of the flexible circuit board. For another example, as shown in fig. 4A to 4B, a mark notch 12 is disposed on a first side of the flexible circuit board in the width direction, and the mark notch 12 is a rectangular notch. It should be understood that the mark gap 12 may also be an arc-shaped gap or other irregular gap, which will not be described in detail herein.
In addition, it should be understood that the marking units including the first marking unit located on the first side may also be marking holes, and the shape of the holes may be, but is not limited to, circular, oval, triangular, polygonal (e.g., rectangular, diamond, etc.), which will not be described herein again.
Example two: the marking unit comprises a fourth marking unit and a fifth marking unit which are respectively positioned on the first side and the second side and are opposite in position. The first marking unit in this example may be a marking hole, or a marking notch.
For example, please refer to the flexible circuit board 1 shown in fig. 5A and 5B, the flexible circuit board includes at least two adjacent circuit cutting units 11, the first side and the second side of the flexible circuit board in the width direction are respectively provided with mark notches 12 with opposite positions, the mark notches shown in fig. 5A and 5B are arc notches, the marks 12 at the two ends are notches after being cut by half, and other figures are similar and will not be described herein again. Of course, it should be understood that the notch in this example may also be a notch in any other shape, such as a triangle, a polygon, etc., and the size of the notch may be flexibly set according to the specific application scenario, as long as it can be clearly seen by naked eyes and the normal function of the flexible circuit board is not affected.
In addition, it should be understood that the marking units in this example may be marking holes in addition to the marking notches of the above examples, and the shape of the holes may be, but not limited to, circular, oval, triangular, polygonal (e.g., rectangular, diamond, etc.). For example, as shown in fig. 6A and 6B, the first side and the second side of the flexible circuit board 1 in the width direction are respectively provided with mark holes 13 in opposite positions, and the mark holes shown in fig. 6A and 6B are circular holes.
Example three: the marking units comprise a sixth marking unit and a seventh marking unit which are positioned on the first side and are arranged in an isolated mode, and an eighth marking unit and a ninth marking unit which are positioned on the second side and are arranged in an isolated mode, the sixth marking unit and the seventh marking unit respectively correspond to the eighth marking unit and the ninth marking unit in position and are distributed along the length direction of the flexible circuit board, and circuit board areas for isolating the sixth marking unit and the seventh marking unit and isolating the eighth marking unit and the ninth marking unit form a shearing area.
The present example may also be configured such that the marking units are disposed on two sides of the flexible printed circuit board in the width direction, and the difference from the second example is that the cutting marking is performed on the two sides by a combination of two marking units. For example, please refer to the flexible circuit board 1 shown in fig. 7A and 7B, the flexible circuit board includes at least two adjacent circuit cutting units 11, two mark notches 12 are respectively disposed on a first side and a second side of the flexible circuit board in a width direction, the two mark notches 12 on the same side are separated and distributed along a length direction of the flexible circuit board, and a circuit board region separating the two mark notches 12 on the same side forms a cutting region.
For another example, please refer to the flexible circuit board 1 shown in fig. 9A and 9B, the flexible circuit board includes at least two adjacent line cutting units 11, two marking holes 13 are respectively disposed on a first side and a second side of the flexible circuit board in a width direction, the two marking holes 13 on the same side are separated and distributed along a length direction of the flexible circuit board, and a cutting area is formed by a circuit board area separating the two marking holes 13 on the same side.
The shapes and sizes of the mark notches 12 and the mark holes 13 in fig. 7A and 9A can be specifically set, and are not described in detail herein. And it should be understood that, when the marking of the cutting position is realized by using a plurality of marking unit combinations, the marking is not limited to the combination of two marking units shown as three in the example, and three or more marking units may be used for marking. For example, as shown in fig. 8A to 8B, three continuous marking notches 12 are respectively disposed on a first side and a second side of the flexible circuit board in the width direction, and a region where a middle one of the three continuous marking notches 12 on the same side is located forms a cutout region. And the specific combination of the marking holes and more than three marking units is analogized, and the description is omitted.
Example four: the marking unit comprises a second marking unit and a third marking unit which are positioned on the first side and are arranged in an isolated mode, the second marking unit and the third marking unit are distributed along the length direction of the flexible circuit board, and a circuit board area for isolating the second marking unit and the third marking unit forms a shearing area.
The present example is different from example three in that the cut marking is performed only on the first side in the width direction of the flexible circuit board by a combination of two marking units as compared to example three. Therefore, the specific setting mode is shown in example three, and the detailed description thereof is omitted here.
Example five: in this example, the marking units may be disposed in a manner of staggering the marking units on the first side and the second side in the width direction of the flexible circuit board, and the marking units in different positions may employ marking gaps or marking holes with the same shape and/or good size, or may employ marking gaps or marking holes with different shapes and/or sizes at least in part.
In addition, it should be understood that, in addition to this example, in each of the above examples, the marking units disposed at different positions may all be the marking holes, or the marking notches, or may be part of the marking holes, and part of the marking notches, and the shapes and the sizes of the disposed marking holes and the disposed marking notches may be the same, or may be at least part of the disposed marking holes and the disposed marking notches, and may be flexibly set according to application requirements, and are not described herein again.
Example eight: in this example, when the marking unit provided is a marking hole, the marking hole may also be provided in a middle area in the width direction of the flexible circuit board, or an area near the middle.
In addition, it should also be understood that the marking unit provided in the present embodiment may also be flexibly used in combination with existing marking lines or other marking manners for indicating the cutting position.
In addition, it should be understood that, in the embodiment, when some first light emitting line units need to connect the protection resistor, they may further include a resistor connection point 16 for electrically connecting with the protection resistor, for example, as shown in fig. 4A and fig. 5A to fig. 9A, and the resistor connection point 16 may be in the same row as the electrode connection point 14 or may be located outside the row of the electrode connection point 14. The method can be flexibly set according to requirements. In addition, it should be understood that the specific shape, size and number of the resistor connection points 16 and the electrode connection points 14 in the present embodiment can be flexibly set according to specific requirements, and no limitation is made thereto.
In some examples of this embodiment, in order to improve protection of the flexible circuit board and improve light emission efficiency of the LED light bar, the flexible circuit board further includes a reflective dielectric layer disposed on the first circuit layer, and the reflective dielectric layer may be configured to reflect visible light emitted by the LED chip and directed to the reflective dielectric toward a direction away from the flexible substrate, so as to improve light extraction efficiency of the light bar. The material, form and specific forming method of the reflective medium layer in this embodiment can be flexibly set. For example, in one application scenario, the reflective medium includes a reflective film, which is attached to the front surface of the flexible substrate by means of an attachment method; for another example, in another application scenario, the reflective medium includes a reflective film, and the reflective film can be attached to the front surface of the flexible substrate by means of attachment; for another example, in another application scenario, the reflective medium comprises a highly reflective ink and may be disposed on the front side of the flexible substrate by, but not limited to, printing or coating.
In some examples of the present embodiment, a reflective dielectric layer disposed on the front surface of the flexible circuit board may cover all of at least one of the positive power supply line and the negative power supply line, for example, as shown in fig. 3A, 5A, and 8A; and the electrode connection regions (i.e. the electrode connection points 14, the resistor connection points 14, etc.) in the first light emitting line unit for connecting with electronic devices, including but not limited to at least one of LED chips and resistors, are exposed out of the reflective medium layer. In this example, when the positive power supply line and the negative power supply line need to be electrically connected with the outside, the reflective medium layer can be removed from the corresponding positions on the positive power supply line and the negative power supply line, so that the positive power supply line and the negative power supply line are exposed, and thus, the positive power supply line and the negative power supply line are electrically connected with the outside. The arrangement mode can enable the positive power supply line and the negative power supply line to be completely covered by the reflecting medium layer, and the LED lamp is good in integrity, convenient to process, higher in safety and lower in cost.
In some examples of the present embodiment, the positive electrode power feeding course and the negative electrode power feeding course on the flexible substrate are at least partially exposed to the reflective medium layer at the corresponding regions between the adjacent course cut units to form power feeding course connection regions, as shown by, for example, reference numeral 15 (hereinafter, referred to as unit electrical connection regions 15) in fig. 4A, 6A, 7A, and 9A, and the other regions of the positive electrode power feeding course and the negative electrode power feeding course are covered with the reflective medium layer; the electrode connecting area used for being connected with the electronic device in the first light emitting line unit is exposed out of the reflecting medium layer.
On the basis of the above-mentioned flexible circuit board structure, for the convenience of understanding, the following description will be made by taking several types of circuit board matrix structure forms as examples.
Referring to the flexible circuit board matrix shown in fig. 10A, one side of each flexible circuit board is provided with a mark notch 12, and the mark notches 12 of adjacent sides of adjacent flexible circuit boards are combined into a closed hole; the marking indentations 12 are obtained after cutting along the adjacent sides after the formation of the first encapsulating glue layer.
Referring to the flexible circuit board matrix shown in fig. 10B, two sides of each flexible circuit board are provided with mark notches 12 at opposite positions, and the mark notches 12 at adjacent sides of adjacent flexible circuit boards are combined to form a closed hole; the marking indentations 12 are obtained after cutting along the adjacent sides after the formation of the first encapsulating glue layer.
Referring to the flexible circuit board matrix shown in fig. 10C, each of the flexible circuit boards has marking holes 13 disposed at opposite positions on both sides thereof.
Fig. 10D shows an exemplary form of forming a first encapsulating adhesive layer on the front surface of each flexible printed circuit board shown in the above figures, where the first encapsulating adhesive layer is a transparent full encapsulating adhesive layer 3. Another exemplary configuration is shown in fig. 10E, which shows a non-transparent or translucent full encapsulant layer 4 as the first encapsulant layer. After the first packaging adhesive layer is formed, cutting can be performed along cutting lines shown in fig. 10D and 10E when cutting is performed, so that when the mark unit is a mark notch, it is ensured that the mark notches on adjacent sides of adjacent flexible circuit boards are combined to be cut between closed holes, and a corresponding mark notch is obtained. In the application scenario, the forming of the first encapsulant layer on the front surface of each flexible circuit board may include, but is not limited to:
forming a first packaging adhesive layer which completely covers the front surface of each flexible circuit board and the boundary area between every two adjacent flexible circuit boards on the front surface of each flexible circuit board of the circuit board matrix, wherein part of the packaging adhesive forming the first packaging adhesive layer is filled in the mark gap or the mark hole; of course, the mark gap or the mark hole may not be filled.
Of course, in other application scenarios, the forming the first encapsulant layer on the front surface of each flexible circuit board may also include, but is not limited to: and forming a first packaging adhesive layer on the front surface of each flexible circuit board by taking the single flexible circuit board as a unit, wherein the formed first packaging adhesive layer does not cover or completely covers the marking unit, namely the marking unit is directly exposed out of the first packaging adhesive layer.
Therefore, the specific coverage area and the specific coverage form of the first packaging adhesive layer on the front surface of the flexible circuit board can be flexibly set, and the positions of the marking holes or the marking gaps for marking the line shearing units on the flexible circuit board can be observed as long as the LED light bars are formed. For the convenience of understanding, the present embodiment is further described below with several examples of arrangements of the first encapsulant of the manufactured LED light bar.
In one example, a first packaging adhesive layer arranged on the flexible circuit board covers the first light emitting line unit and the first LED chip, and at least part of the marking unit arranged on the flexible circuit board is exposed out of the first packaging adhesive layer. In this example, after the LED light bar is manufactured, the mark hole or the mark notch formed on the flexible circuit board can be directly viewed from the front surface or the back surface of the flexible circuit board. In the present example, the cross-sectional shape of the first encapsulant layer may be an arc shape, a rectangular shape, or other shapes according to the requirement, for example, the cross-sectional shape may even be a triangle. Fig. 11A to 11C show some specific arrangement shapes of the first encapsulant layer on the flexible circuit board in this example. In fig. 11A, the flexible circuit board 1 is provided with arc-shaped mark notches 12 on both sides in the width direction, and is also provided with a unit electrical connection region 15. In fig. 11A, the first encapsulating adhesive layer is a non-transparent or semi-transparent semi-encapsulating adhesive layer 2 (of course, the semi-encapsulating adhesive layer 2 may also be set to be transparent according to the requirement), the semi-encapsulating adhesive layer 2 covers the first light emitting circuit unit and the first LED chip, the mark notch 12 and the unit electrical connection area 15 on the flexible circuit board 1 are both exposed outside the semi-encapsulating adhesive layer 2, and the mark notch 12 can be directly observed from the front or back of the flexible circuit board 1. The cross-sectional shape of the half-encapsulating adhesive layer 2 in fig. 11A is rectangular. In fig. 11B, the flexible circuit board 1 is also provided with arc-shaped mark notches 12 on both sides in the width direction, and is also provided with another middle-shaped (circular) unit electrical connection region 15. In fig. 11B, the first encapsulant layer is also a half encapsulant layer 2, the half encapsulant layer 2 covers the first light emitting line unit and the first LED chip, the mark gap 12 and the unit electrical connection region 15 on the flexible circuit board 1 are also exposed outside the half encapsulant layer 2, and the mark gap 12 can be directly observed from the front or back of the flexible circuit board 1. The cross-sectional shape of the half-encapsulating adhesive layer 2 in fig. 11B is an arc. In fig. 11C, circular mark holes 13 are correspondingly formed in two sides of the flexible circuit board 1 in the width direction, and the cutting position is indicated by combining the two mark holes 13, for a specific indication manner, see the above embodiment, and are not described herein again. The marking hole 13 can be directly observed from the front or back surface of the flexible circuit board 1. The cross-sectional shape of the semi-encapsulating adhesive layer 2 in fig. 11C is also arc-shaped.
In another example, the first packaging adhesive layer arranged on the flexible circuit board of the obtained LED light bar can completely cover the front surface of the flexible circuit board. At the moment, when the first packaging adhesive layer is a transparent adhesive layer, the marking units arranged on the first packaging adhesive layer can still be observed from the front side or the back side of the flexible circuit board; when the first packaging adhesive layer is a non-transparent adhesive layer or semi-transparent adhesive layer, the marking unit arranged on the first packaging adhesive layer is at least observed from the back surface of the flexible circuit board, and when the marking unit is a marking notch, the position of the marking notch arranged on the flexible circuit board can be at least observed from the side surface of the flexible circuit board provided with the marking notch, so that the shearing position is determined. In this example, the encapsulation glue forming the first encapsulation glue layer may be at least partially filled into the marking unit, or may not be filled into the marking unit. For ease of understanding, the following description will be provided with reference to several specific first encapsulant placement configurations for further understanding of the present example.
Referring to the LED light bar shown in fig. 12, the flexible circuit board 1 is provided with circular mark holes 13 (alternatively, mark notches are also provided) on two sides in the width direction, and no unit electrical connection region 15 is provided. In fig. 12, the first encapsulation adhesive layer is a transparent full encapsulation adhesive layer 3, the transparent full encapsulation adhesive layer 3 covers the front surface of the flexible circuit board 1, the first light emitting line unit and the first LED chip, and the marking hole 13 are covered by the transparent full encapsulation adhesive layer 3, and the marking hole 13 can be directly observed from the front surface or the back surface of the flexible circuit board 1. The cross section of the transparent full-packaging adhesive layer 3 is rectangular, and can be set into an arc shape or other shapes according to requirements.
In other specific configuration examples, the marking unit may include a marking notch penetrating through the flexible circuit board from a thickness direction of the flexible circuit board, the first encapsulation adhesive layer covers a whole front surface of the flexible circuit board, and a portion of the encapsulation adhesive forming the first encapsulation adhesive layer is filled in the marking notch. For example, referring to the LED light bar shown in fig. 13A to 13B, the flexible circuit board 1 is provided with a mark notch 12 (or alternatively, a mark hole) on at least one side in the width direction, and a unit electrical connection area 15 may be provided or the unit electrical connection area 15 may not be provided. In fig. 13A to 13B, the first encapsulation adhesive layer is a non-transparent or semitransparent full encapsulation adhesive layer 4, the full encapsulation adhesive layer 4 covers the front surface of the flexible circuit board 1, the first light emitting line unit, the first LED chip, and the mark notch 12 are all covered by the full encapsulation adhesive layer 4, and the position of the mark notch 12 can be directly observed from the back surface and the side surface of the flexible circuit board 1, so as to determine the corresponding cutting position. The cross section of the full-encapsulation glue layer 4 is arc-shaped, and can be set to be rectangular or other shapes according to requirements. For example, please refer to fig. 14A to 14B, which are different from the LED light bars shown in fig. 13A to 13B in that the cross-sectional shape of the full encapsulant layer 4 is rectangular. In addition, in the present example, the indication of the cutting position may also be performed by at least two combinations of the marking notches 12 (or the marking holes). For example, as shown in fig. 15A to 15B, at least one side of the flexible circuit board 1 in the width direction is provided with two separated mark gaps 12, and the region of the flexible circuit board 1 separating the two mark gaps 12 forms a cut region. And the cross-sectional shape of the full encapsulating adhesive layer 4 can also be rectangular, but of course can also be arc-shaped, for example, please refer to fig. 16.
In the LED light bars shown in fig. 13A to 16, it should be understood that the marking units are filled with the packaging adhesive. However, in other examples, the encapsulation adhesive may not be filled in the marking unit.
Example two:
it should be understood that the LED light bar may also be spliced with other light bars to obtain a light bar with a set length during the manufacturing and using processes. At present, after the LED light bars are manufactured during the splicing of the LED light bars, glue layers on splicing ends of the two light bars to be spliced are removed, then a flexible circuit board of the splicing end of one light bar is superposed on a flexible circuit board of the splicing end of the other light bar, and then the flexible circuit boards are electrically welded. The splicing mode causes uneven splicing positions, and the overlapping area of the two flexible circuit boards is a display dead area, so that the display effect of the lamp strip is poor.
In view of the foregoing problems, in the method for manufacturing an LED light bar provided by an example of the present embodiment, the disposing at least one circuit board matrix may include: arranging at least two circuit board matrixes, wherein the circuit board matrixes are sequentially distributed along the length direction of the flexible circuit boards, and the flexible circuit boards included in the adjacent circuit board matrixes are in one-to-one correspondence in position; between the adjacent circuit board matrixes, the front surfaces of the two flexible circuit boards corresponding to the positions are positioned on the same surface, the end surfaces of the two adjacent ends in the length direction are mutually contacted, and the end parts of the two adjacent ends (namely two splicing ends) are provided with electric connection areas which are respectively and electrically connected with a positive power supply circuit and a negative power supply circuit; the electric connection area can be directly formed on the exposed area for the anode power supply circuit and the cathode power supply circuit, and can also be additionally provided with a bonding pad and the like which are electrically connected with the anode power supply circuit and the cathode power supply circuit.
In this example, before separating each adjacent flexible circuit board in the circuit board matrix, the method may further include:
through the electric connecting piece, the electric connection areas at the two adjacent ends in the length direction of the adjacent flexible circuit boards corresponding to the position between the adjacent circuit board matrixes are electrically connected, and the electric connecting piece is fixedly connected with the electric connection areas at the two adjacent ends. This example is making LED lamp strip in-process, directly uses adjacent circuit board matrix as singly splicing, and efficiency is higher, and the uniformity is better. And the splicing area of the two spliced LED lamp strips is positioned in one plane, and the flexible circuit boards are not needed to be overlapped in the splicing area, so that a display dead zone does not exist, and the display effect is better.
Alternatively, in this example, the electrical connection areas of the two splicing ends can be located on the front surface of the flexible circuit board; before electrically connecting the electrical connection areas at two adjacent ends in the length direction of the adjacent flexible circuit boards corresponding in position between the adjacent circuit board matrixes through the electrical connector, the method may further include: between adjacent circuit board matrixes, connecting pieces are arranged on the back faces of the adjacent flexible circuit boards corresponding in position, and the connecting pieces are bridged on the adjacent flexible circuit boards, so that the two flexible circuit boards to be spliced are mechanically connected to be spliced, and then the front electric connection areas are connected through the electric connecting pieces. The electrical connector may be, but is not limited to, a conductive adhesive, a solder paste, etc. The connecting piece can enhance the strength of a connecting area of the two lamp strips, provides mechanical support for the connecting area, and avoids the occurrence of conditions such as disconnection of a splicing part or poor conduction in the subsequent use process; but also provides guarantee for the electrical connection of the electrical connection areas at the two adjacent ends on the front surface. The connectors in this example may be various connecting films or plates that can achieve the above-mentioned purpose, and the manner of disposing the connectors on the back surfaces of the adjacent flexible circuit boards in corresponding positions may include, but is not limited to: bonding the connecting piece to the back surface of the adjacent flexible circuit board corresponding to the position; but can also be realized by welding and the like.
For ease of understanding, the present embodiment will be described below with reference to fig. 17A to 17C as an understanding example. Fig. 17A shows that the flexible printed circuit board includes two front surfaces of two circuit board matrices arranged along the length direction, the front surfaces of two corresponding flexible printed circuit boards between two adjacent circuit board matrices are located on the same surface, end surfaces of two adjacent ends in the length direction are in contact with each other, and end portions of the two adjacent ends (i.e., two splicing ends) are provided with electrical connection areas electrically connected to a positive power supply line and a negative power supply line, respectively. Referring to fig. 17B, a connector 7 is disposed between the adjacent circuit board matrixes and on the back of the adjacent flexible circuit board corresponding in position, and the connector 7 can be cut off in the subsequent cutting process, so as to obtain the light bar shown in fig. 17C (fig. 17C shows the back of the light bar). The method of the example uses the whole circuit board matrix as a unit for splicing, has high efficiency, good consistency, good strength and high reliability, and splicing parts are positioned on the same plane.
In another example of this embodiment, after separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED light bars one by one, the flexible circuit boards may be spliced, and the process may include: arranging two end parts, which are provided with electrical connection areas respectively electrically connected with an anode power supply line and a cathode power supply line, on the front surfaces of the flexible circuit boards of the two LED light bars oppositely, enabling the front surfaces of the flexible circuit boards of the two LED light bars to be positioned on the same surface, arranging a connecting piece on the back surfaces of the flexible circuit boards of the two LED light bars, and enabling the connecting piece to be in bridge connection with the flexible circuit boards of the two LED light bars; then, the electrical connection areas at the two end portions of the two LED light bars are electrically connected through the electrical connection member, and the electrical connection member is simultaneously and fixedly connected to the electrical connection areas at the two end portions, and the light bars obtained after splicing are also shown in fig. 17C, which is not described herein again.
Example three:
optionally, in this embodiment, according to requirements, the flexible circuit board may further include a second circuit layer formed on the back surface of the flexible substrate, where the second circuit layer includes at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate; and each second light-emitting circuit unit is provided with a first light-emitting circuit unit corresponding to the second light-emitting circuit unit in the length direction, so that the corresponding first light-emitting circuit unit and the corresponding second light-emitting circuit unit can work normally after the flexible circuit board is cut along the cutting mark.
It should be understood that the second light-emitting circuit units included in the second circuit layer disposed on the back side in the present embodiment may be, but are not limited to, one-to-one correspondence with the first light-emitting circuit units disposed on the front side. And the second light-emitting circuit unit and the positive power supply circuit and the negative power supply circuit used by the corresponding first light-emitting circuit unit can be connected in parallel by, but not limited to, via hole electrical connection, wire electrical connection, and the like. Of course, in this embodiment, the second light emitting circuit units included in the second circuit layer disposed on the back surface may not correspond to the first light emitting circuit units disposed on the front surface one to one, and may be flexibly disposed according to actual requirements, which is not described herein again.
In this embodiment, before separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED light bar in the above embodiment, the method may further include: the die bonding and welding of the second LED chip are completed on the second light-emitting circuit unit of each flexible circuit board; and forming a second packaging adhesive layer on the back surface of each flexible circuit board, wherein the second packaging adhesive layer at least covers the second light-emitting circuit unit and the second LED chip.
For example, in some examples of the application scenario, the second encapsulant layer may cover the second light-emitting circuit unit and the second LED chip, and the mark unit is at least partially exposed from the second encapsulant layer. The first packaging adhesive layer may be the half packaging adhesive layer of the above example, or may be the full packaging adhesive layer of the above example, and the marking unit may be a marking hole or a marking notch, and at this time, the marking unit may be at least viewed from the back of the flexible circuit board, so as to determine the cutting position.
For another example, in another example of the application scenario, the second encapsulation adhesive layer may completely cover the back surface of the flexible circuit board, the first encapsulation adhesive layer disposed on the front surface of the flexible circuit board may be the half encapsulation adhesive layer in the above example, the marking unit may be a marking hole or a marking notch, and at least the marking unit may be viewed from the front surface of the flexible circuit board, so as to determine the cutting position. When the first encapsulation adhesive layer disposed on the front side of the flexible circuit board is also the full encapsulation adhesive layer of the above example, and when at least one of the first encapsulation adhesive layer and the second encapsulation adhesive layer is a transparent adhesive layer, the marking unit at this time may also be a marking hole or a marking notch, and at this time, the marking unit may be at least viewed from the front side or the back side of the flexible circuit board. When the first packaging adhesive layer and the second packaging adhesive layer are both semitransparent adhesive layers or nontransparent adhesive layers, the marking units at the moment can at least comprise marking gaps, and the positions of the marking gaps can be observed at least from the side face of the flexible circuit board at the moment. In order to facilitate understanding of this case, several configurations of this case will be described below with reference to the drawings.
Referring to the LED light bar shown in fig. 18A and 18B, at least one side of the flexible circuit board 1 in the width direction is correspondingly provided with a mark gap, and the front surface and the back surface of the flexible circuit board 1 are both formed with a packaging adhesive layer, which is referred to as a double-layer packaging adhesive 5 in this example, and the packaging adhesive forming the double-layer packaging adhesive 5 is filled into the mark gap, so that the opening position of the mark gap (i.e., the position where the packaging adhesive is filled in the side surface of the flexible circuit board 1) can be clearly observed from the side surface of the flexible circuit board. The cross-sectional shape of the double-layer packaging adhesive 5 on the LED light bar shown in fig. 18A is rectangular, and it can be set to other shapes according to the requirement, for example, please refer to the arc shape shown in fig. 19A to 19B. In this example, the indication of the cutting position may be performed by a combination of at least two mark notches 12. For example, as shown in fig. 20, at least one side of the flexible circuit board 1 in the width direction is provided with two separated mark gaps, and the region of the flexible circuit board 1 separating the two mark gaps 12 forms a cutting region.
And it should be understood that the type and forming manner of the first encapsulating adhesive layer and the second encapsulating adhesive layer in this embodiment may be the same or different.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (10)

1. A manufacturing method of an LED light bar is characterized by comprising the following steps:
arranging at least one circuit board matrix, wherein one circuit board matrix comprises at least two tiled flexible circuit boards, and each flexible circuit board comprises a first circuit layer borne on the front surface of a flexible substrate; the first circuit layer comprises at least one first light-emitting line, wherein one first light-emitting line comprises a pair of positive power supply lines and negative power supply lines, and first light-emitting line units which are connected between the positive power supply lines and the negative power supply lines in parallel and distributed along the length direction of the flexible substrate; the flexible circuit board comprises at least two line shearing units distributed along the length direction of the flexible substrate, and each line shearing unit comprises at least one first light-emitting line unit; the flexible circuit board further comprises a marking unit arranged between the adjacent line shearing units in the width direction of the flexible circuit board; the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board;
the die bonding and welding of the first LED chip are completed on the first light emitting line unit of each flexible circuit board;
forming a first packaging adhesive layer on the front surface of each flexible circuit board, wherein the first packaging adhesive layer at least covers the first light emitting line unit and the first LED chip;
and after the first packaging adhesive layer is formed, separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED lamp strip.
2. The method for manufacturing the LED light bar of claim 1, wherein the marking unit comprises a marking notch penetrating through the flexible circuit board from the thickness direction of the flexible circuit board;
the forming of the first encapsulation glue layer on the front surface of each flexible circuit board comprises:
and forming a first packaging adhesive layer which completely covers the front surface of each flexible circuit board and the boundary area between every two adjacent flexible circuit boards on the front surface of each flexible circuit board of the circuit board matrix, wherein part of the packaging adhesive layer is filled in the mark gap.
3. The method of manufacturing an LED light bar of claim 1, wherein the forming a first encapsulant layer on the front side of each flexible circuit board comprises:
and forming a first packaging adhesive layer on the front surface of each flexible circuit board by taking a single flexible circuit board as a unit, wherein the formed first packaging adhesive layer does not cover or completely covers the marking unit.
4. The method for manufacturing the LED light bar of any one of claims 1 to 3, wherein the at least one circuit board matrix is arranged as follows: arranging at least two circuit board matrixes, wherein the circuit board matrixes are sequentially distributed along the length direction of the flexible circuit boards, and the flexible circuit boards included in the adjacent circuit board matrixes are in one-to-one correspondence in position; between the adjacent circuit board matrixes, the front surfaces of the two flexible circuit boards corresponding to the positions are positioned on the same surface, the end surfaces of the two adjacent ends in the length direction are mutually contacted, and the end parts of the two adjacent ends are provided with electric connection areas which are respectively and electrically connected with the positive power supply circuit and the negative power supply circuit;
before separating each adjacent flexible circuit board in the circuit board matrix, the method further comprises:
through the electric connecting piece, the electric connection areas at the two adjacent ends in the length direction of the adjacent flexible circuit boards corresponding to the adjacent circuit board matrixes in position are electrically connected, and the electric connecting piece is fixedly connected with the electric connection areas at the two adjacent ends.
5. The method of claim 4, wherein the electrical connection area is located on a front surface of the flexible circuit board;
through electrical property connecting piece, between with adjacent circuit board matrix, before the electrical connection district electricity connection at the adjacent both ends in the length direction of the adjacent flexible circuit board that corresponds in the position connects, still include:
and connecting pieces are arranged between the adjacent circuit board matrixes on the back surfaces of the adjacent flexible circuit boards corresponding in position, and the connecting pieces are bridged on the adjacent flexible circuit boards.
6. The method of claim 5, wherein the positioning connectors on the back surfaces of the adjacent flexible circuit boards in corresponding positions comprises: and adhering the connecting piece to the back surface of the adjacent flexible circuit board corresponding in position.
7. The method of manufacturing an LED light bar of any one of claims 1 to 3, wherein after separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED light bar, the method further comprises:
arranging two end parts, which are provided with electrical connection areas respectively electrically connected with the positive power supply line and the negative power supply line, on the front surfaces of the flexible circuit boards of the two LED light bars oppositely, enabling the front surfaces of the flexible circuit boards of the two LED light bars to be positioned on the same surface, arranging a connecting piece on the back surfaces of the flexible circuit boards of the two LED light bars, and enabling the connecting piece to be in bridge connection with the flexible circuit boards of the two LED light bars;
and the electrical connection areas at the two end parts of the two LED lamp strips are electrically connected through the electrical connection pieces, and the electrical connection pieces are fixedly connected with the electrical connection areas at the two end parts simultaneously.
8. The method for manufacturing the LED light bar of any one of claims 1 to 3, wherein the flexible circuit board further comprises a second circuit layer carried on the back surface of the flexible substrate, and the second circuit layer comprises at least one second light-emitting circuit unit connected in parallel and distributed along the length direction of the flexible substrate; each second light-emitting line unit is provided with the first light-emitting line unit corresponding to the position of the second light-emitting line unit in the length direction;
before separating each adjacent flexible circuit board in the circuit board matrix to obtain the LED light bar, the method further comprises the following steps:
the second LED chip is fixed and welded on the second light-emitting circuit units of the flexible circuit boards;
and forming a second packaging adhesive layer on the back surface of each flexible circuit board, wherein the second packaging adhesive layer at least covers the second light-emitting circuit unit and the second LED chip.
9. An LED light bar, characterized in that the LED light bar is manufactured by the LED light bar manufacturing method of any one of claims 1 to 9.
10. The LED light bar of claim 9, wherein the flexible circuit board has a width direction with opposing first and second sides;
the marking unit comprises a first marking unit positioned on the first side;
or the like, or, alternatively,
the marking units comprise a second marking unit and a third marking unit which are positioned on the first side and are arranged in an isolated mode, the second marking unit and the third marking unit are distributed along the length direction of the flexible circuit board, and circuit board areas which isolate the second marking unit and the third marking unit form a shearing area;
or the like, or, alternatively,
the marking units comprise a fourth marking unit and a fifth marking unit which are respectively positioned on the first side and the second side and are opposite in position;
or the like, or, alternatively,
the marking units comprise a sixth marking unit and a seventh marking unit which are positioned on the first side and are arranged in an isolated mode, and an eighth marking unit and a ninth marking unit which are positioned on the second side and are arranged in an isolated mode, the sixth marking unit and the seventh marking unit correspond to the eighth marking unit and the ninth marking unit in position respectively and are distributed along the length direction of the flexible circuit board, and circuit board areas for isolating the sixth marking unit and the seventh marking unit and isolating the eighth marking unit and the ninth marking unit form a shearing area.
CN202010076137.0A 2020-01-23 2020-01-23 LED light bar and manufacturing method thereof Active CN111288312B (en)

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