CN211509415U

CN211509415U - Flexible circuit board for manufacturing LED lamp strip and LED lamp strip

Info

Publication number: CN211509415U
Application number: CN202020162661.5U
Authority: CN
Inventors: 郑瑛
Original assignee: Chongqing Huiku Technology Co ltd
Current assignee: Pingdingshan Dexin Ruishi Trading Co.,Ltd.
Priority date: 2020-01-23
Filing date: 2020-01-23
Publication date: 2020-09-15
Anticipated expiration: 2030-01-23

Abstract

The utility model discloses a flexible circuit board and LED lamp strip for making LED lamp strip, the flexible circuit board for making LED lamp strip, on this flexible circuit board, between the adjacent circuit shearing unit in at least two circuit shearing units that distribute along flexible substrate length direction, set up by the mark unit in the width direction of flexible circuit board; the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board; the cutting position is marked by directly arranging the marking hole or the marking notch on the flexible circuit board, so that the cutting mark is printed on the surface of the light bar packaging adhesive layer, the falling-off condition is avoided, and the reliability is higher; and because the mark holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arranged positions are more accurate and reliable, and the phenomenon that the sheared LED lamp strip cannot work normally is avoided.

Description

Flexible circuit board for manufacturing LED lamp strip and LED lamp strip

Technical Field

The utility model relates to a COB (Chip On Board Light, high power integrated surface Light source) lamp strip field especially relates to a flexible circuit Board and LED lamp strip for making LED lamp strip.

Background

With the increasingly wide application of the LED light bar, the thickness of the LED light bar is also required to be higher and higher. The current LED lamp strip generally comprises a flexible circuit board, LED lamp beads arranged on the flexible circuit board, and packaging glue covering the LED lamp beads on the flexible circuit board. The LED lamp bead is composed of an LED support, an LED chip arranged in the LED support and packaging glue for packaging the LED in the support.

In the using process of the LED light bar, the light bar lengths required by different application scenes may be different, and the length of the manufactured LED light bar is constant. Therefore, in an application scene needing a shorter light bar, the LED light bar needs to be cut; in a scene requiring a longer light bar, splicing the LED light bar with other LED light bars or a part of other LED light bars is involved, and shearing of the LED light bar is also involved in the splicing process. In order to guarantee that the LED lamp strip part obtained by shearing can normally work, the current LED lamp strip is provided with an LED lamp strip subunit which has unit length and can independently work, the LED lamp strip is sheared by taking the LED lamp strip subunit as a unit when sheared, and in order to guarantee the shearing accuracy, the current LED lamp strip is printed with a corresponding shearing mark on the surface of a lamp strip packaging adhesive, and the following problem exists in at least the way:

the printed cutting mark is easy to fall off, so that subsequent cutting errors are caused;

position deviation easily appears in the printing shearing mark on the surface of the packaging adhesive, and the LED lamp strip after shearing can not work normally.

SUMMERY OF THE UTILITY MODEL

The utility model provides a flexible circuit board and LED lamp strip for making LED lamp strip, it is thicker to solve current LED lamp strip and have thickness, and is with high costs, cuts the problem that positional deviation appears and drop easily in the mark.

In order to solve the above problems, the present invention provides a flexible circuit board for manufacturing an LED light bar, the flexible circuit board includes a flexible substrate, and a first circuit layer formed on a front surface of the flexible substrate;

the first circuit layer comprises at least one first light-emitting line, wherein one first light-emitting line comprises a pair of positive power supply lines and negative power supply lines, and first light-emitting line units which are connected between the positive power supply lines and the negative power supply lines in parallel and distributed along the length direction of the flexible substrate;

the flexible circuit board comprises at least two line shearing units distributed along the length direction of the flexible substrate, and each line shearing unit comprises at least one first light-emitting line unit;

the flexible circuit board further comprises a marking unit arranged between the adjacent line shearing units in the width direction of the flexible circuit board;

the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board.

Optionally, the flexible circuit board further includes a reflective dielectric layer disposed on the first circuit layer, and the reflective dielectric layer covers at least one of the positive power supply line and the negative power supply line;

and an electrode connecting area used for being connected with an electronic device in the first light emitting line unit is exposed out of the reflecting medium layer, and the electronic device comprises an LED chip.

Optionally, the flexible circuit board further includes a reflective dielectric layer disposed on the first circuit layer, at least a portion of a corresponding region of the positive power supply line and the negative power supply line between adjacent line cutting units is exposed out of the reflective dielectric layer, and other regions are covered by the reflective dielectric layer;

Optionally, the width direction of the flexible circuit board has a first side and a second side which are opposite;

the marking unit comprises a first marking unit positioned on the first side;

or the like, or, alternatively,

the marking units comprise a second marking unit and a third marking unit which are positioned on the first side and are arranged in an isolated mode, the second marking unit and the third marking unit are distributed along the length direction of the flexible circuit board, and circuit board areas which isolate the second marking unit and the third marking unit form a shearing area;

or the like, or, alternatively,

the marking units comprise a fourth marking unit and a fifth marking unit which are respectively positioned on the first side and the second side and are opposite in position;

or the like, or, alternatively,

the marking units comprise a sixth marking unit and a seventh marking unit which are positioned on the first side and are arranged in an isolated mode, and an eighth marking unit and a ninth marking unit which are positioned on the second side and are arranged in an isolated mode, the sixth marking unit and the seventh marking unit correspond to the eighth marking unit and the ninth marking unit in position respectively and are distributed along the length direction of the flexible circuit board, and circuit board areas for isolating the sixth marking unit and the seventh marking unit and isolating the eighth marking unit and the ninth marking unit form a shearing area.

Optionally, the flexible circuit board further includes a second circuit layer formed on the back surface of the flexible substrate, where the second circuit layer includes at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate; each second light-emitting line unit is provided with the first light-emitting line unit corresponding to the position of the second light-emitting line unit in the length direction.

In order to solve the above problem, the utility model also provides a LED lamp strip, include as above flexible circuit board, LED lamp strip is still including locating on the first luminous line unit with the first LED chip that first luminous line unit electricity is connected, and locate on flexible circuit board's the front, will at least first luminous line unit and the first encapsulation glue film that first LED chip covered.

Optionally, the first encapsulant layer covers only the first light emitting line unit and the first LED chip, and the mark unit is at least partially exposed out of the first encapsulant layer.

Optionally, the marking unit includes a marking notch penetrating through the flexible circuit board from the thickness direction of the flexible circuit board, the front surface of the flexible circuit board is completely covered by the first packaging adhesive layer, and part of the packaging adhesive forming the first packaging adhesive layer is filled in the marking notch.

Optionally, the flexible circuit board further includes a second circuit layer formed on the back surface of the flexible substrate, where the second circuit layer includes at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate, and each second light-emitting circuit unit has the first light-emitting circuit unit corresponding to the second light-emitting circuit unit in the length direction;

the LED lamp strip is characterized by further comprising a second LED chip arranged on the second light-emitting circuit unit and electrically connected with the second light-emitting circuit unit, and a second packaging adhesive layer arranged on the back of the flexible circuit board and covering the whole back of the flexible circuit board.

Optionally, the flexible circuit board further includes a second circuit layer formed on the back surface of the flexible substrate, where the second circuit layer includes at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate;

the LED lamp strip is characterized by further comprising a second LED chip arranged on the second light-emitting circuit unit and electrically connected with the second light-emitting circuit unit, and a second packaging adhesive layer arranged on the back face of the flexible circuit board and at least covering the second light-emitting circuit unit and the second LED chip, wherein the marking unit is at least partially exposed out of the second packaging adhesive layer.

The utility model has the advantages that:

the utility model firstly provides a flexible circuit board for manufacturing LED lamp strips, wherein a marking unit is arranged between adjacent line shearing units in at least two line shearing units distributed along the length direction of a flexible substrate on the flexible circuit board in the width direction of the flexible circuit board; the marking unit comprises a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board; the cutting position is marked by directly arranging the marking hole or the marking notch on the flexible circuit board, so that the cutting mark is printed on the surface of the light bar packaging adhesive layer, the falling-off condition is avoided, and the reliability is higher; and because the mark holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arranged positions are more accurate and reliable, and the phenomenon that the sheared LED lamp strip cannot work normally is avoided.

The utility model also provides an LED lamp strip made by the flexible circuit board, which also comprises a first LED chip arranged on the first luminous line unit and electrically connected with the first luminous line unit, and a first packaging adhesive layer arranged on the front surface of the flexible circuit board and at least covering the first luminous line unit and the first LED chip; because the first LED chip is directly arranged on the flexible circuit board for packaging, compared with the current LED lamp strip, the manufacturing process of an LED bracket and an LED lamp bead can be omitted, the manufacturing efficiency is higher, the cost is lower, the obtained LED lamp strip is a COB lamp strip, the thickness is thinner, and the requirements of various application scenes can be better met;

in addition, the first encapsulation adhesive layer in this embodiment may be a transparent adhesive layer, the mark hole or the mark notch on the flexible circuit board may be covered by the transparent adhesive layer, or may be located outside the transparent adhesive layer in whole or partial area for being viewed during cutting;

certainly, the first encapsulating adhesive layer in this embodiment may also be a non-transparent or semi-transparent adhesive layer, and at this time, the first encapsulating adhesive layer may not cover or not completely cover the mark hole or the mark notch on the flexible circuit board, so as to be viewed during cutting; the first packaging adhesive layer can also completely cover the front side of the covering flexible circuit board, namely, the marking holes or the marking gaps are completely covered, at the moment, the marking holes or the marking gaps can be observed from the back side of the flexible circuit board, or the packaging adhesive filled in the marking gaps can be observed from the side face of the flexible circuit board, so that the cutting position of the line cutting unit can be accurately determined.

Drawings

Fig. 1A is a schematic view of a light-emitting circuit unit according to a first embodiment of the present invention;

fig. 1B is a schematic diagram of two light-emitting circuit units according to a first embodiment of the present invention;

fig. 1C is a schematic diagram of a three-way light-emitting circuit unit according to a first embodiment of the present invention;

fig. 2A is a schematic view of a flexible printed circuit board according to a first embodiment of the present invention;

FIG. 2B is an enlarged schematic view of portion A1 of FIG. 2A;

fig. 3A is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention;

FIG. 3B is an enlarged schematic view of portion A3 of FIG. 3A;

fig. 4 is a schematic diagram of a flexible circuit board iii according to a first embodiment of the present invention;

fig. 5A is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention;

fig. 5B is an enlarged schematic view of a portion a6 in fig. 5A;

fig. 6A is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention;

fig. 6B is an enlarged schematic view of a portion a9 in fig. 6A;

fig. 7A is a schematic diagram six of a flexible circuit board according to a first embodiment of the present invention;

fig. 7B is an enlarged schematic view of a portion A8 in fig. 7A;

fig. 8A is a schematic diagram seven of a flexible circuit board according to a first embodiment of the present invention;

fig. 8B is an enlarged schematic view of a portion a7 in fig. 8A;

fig. 9A is a schematic view of a LED light bar provided in the second embodiment of the present invention;

fig. 9B is a schematic view of a second LED light bar provided in the second embodiment of the present invention;

fig. 9C is a schematic view of a third LED light bar provided in the second embodiment of the present invention;

fig. 10 is a schematic view of a LED light bar provided in the second embodiment of the present invention;

fig. 11A is a schematic view of a LED light bar provided in the second embodiment of the present invention;

fig. 11B is an enlarged schematic view of a portion B7 in fig. 11A;

fig. 12A is a schematic view six of an LED light bar provided in the second embodiment of the present invention;

fig. 12B is an enlarged schematic view of a portion B1 in fig. 12A;

fig. 13A is a schematic diagram seven of an LED light bar provided in the second embodiment of the present invention;

fig. 13B is an enlarged schematic view of a portion B5 in fig. 13A;

fig. 14 is an eighth schematic view of an LED light bar provided in the second embodiment of the present invention;

fig. 15A is a schematic view nine of an LED light bar provided in the second embodiment of the present invention;

fig. 15B is an enlarged schematic view of a portion B3 in fig. 15A;

fig. 16A is a schematic view ten of an LED light bar provided by the second embodiment of the present invention;

fig. 16B is an enlarged schematic view of a portion B9 in fig. 15A;

fig. 17 is an eleventh schematic view of a LED light bar provided by the second embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments, not all embodiments, in the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The first embodiment is as follows:

to there being thickness thicker, with high costs in current LED lamp strip, the shearing mark position deviation appears easily and the problem that drops easily, this embodiment provides one kind and can reduce LED lamp strip thickness and cost by a wide margin to and the shearing mark of setting is more accurate, reliable Flexible Circuit board (Flexible Printed Circuit, FPC), and this Flexible Circuit board can be used to but not limited to preparation LED lamp strip.

The flexible circuit board in the embodiment comprises a flexible substrate and a first circuit layer formed on the front surface of the flexible substrate; the flexible substrate in this embodiment may be, but is not limited to, a substrate made of polyimide or polyester film, and has the advantages of high wiring density, light weight, thin thickness, good bending property, and the like. In this embodiment, the first circuit layer disposed on the front surface of the flexible substrate includes at least one first light emitting line; the first light-emitting line comprises a pair of positive power supply lines and negative power supply lines and first light-emitting line units which are connected between the positive power supply lines and the negative power supply lines in parallel and distributed along the length direction of the flexible substrate;

the flexible circuit board further comprises at least two line shearing units distributed along the length direction of the flexible substrate, and one line shearing unit comprises at least one first light-emitting line unit; the flexible circuit board further comprises a marking unit arranged between the adjacent line cutting units in the width direction of the flexible circuit board, wherein the marking unit in the embodiment comprises but is not limited to a marking hole or a marking notch which penetrates through the flexible circuit board from the thickness direction of the flexible circuit board and is used for indicating the cutting position of the line cutting unit on the flexible circuit board. By directly arranging the marking hole or the marking notch on the flexible circuit board to mark (namely, to indicate) the cutting position of the line cutting unit, compared with the existing method of printing the cutting mark on the surface of the packaging adhesive layer of the light bar, the cutting position of the line cutting unit does not fall off, and the reliability is higher; and because the marking holes are directly formed between the adjacent line shearing units on the flexible circuit board, the arrangement position is more accurate and reliable, and the condition that the sheared LED lamp strip cannot normally work can be avoided.

For ease of understanding, the present embodiment will now be described with reference to the following exemplary illustration of the structural composition of the flexible circuit board. And it should be understood that the following example illustrates and does not limit the flexible circuit board structure in the present embodiment.

In this embodiment, the flexible substrate included in the flexible circuit board may be understood as a carrying main body of the flexible circuit board, and when the flexible circuit board is used for manufacturing the LED light bar, the flexible circuit board is generally in a strip shape, and the form of the flexible circuit board generally determines the form of the flexible circuit board, so that the flexible circuit board used for manufacturing the LED light bar is also in a strip shape, and the length direction and the width direction of the flexible circuit board are generally the same as the length direction and the width direction of the flexible circuit board. Accordingly, the thickness direction of the flexible circuit board and the thickness direction of the flexible substrate are the same in this embodiment. It should be understood that the maximum thickness of the flexible circuit board is generally greater than the maximum thickness of the flexible substrate. Of course, in some application scenarios, the flexible substrate may not be in a strip shape, but may also be applied to the scheme of the cutting mark proposed in this embodiment as long as it also relates to the cutting mark of the line cutting unit.

In this embodiment, the first circuit layer may be formed on the front surface of the flexible substrate by, but not limited to, Electrodeposition (ED) and plating. Besides at least one first light-emitting circuit, the formed first circuit layer can optionally be provided with other functional circuits according to requirements. The first light emitting line in this embodiment is mainly used for being electrically connected to the LED chip to form a line of a corresponding light emitting unit. Of course, according to the requirement, the first light emitting line may optionally further include a line for connecting to other electronic devices besides the LED chip, and the other electronic devices may include, but are not limited to, at least one of a protection resistor and a control chip.

In this example, one path of the first light-emitting line includes a pair of positive power supply lines and negative power supply lines, and first light-emitting line units connected in parallel between the pair of positive power supply lines and the negative power supply lines and distributed along the length direction of the flexible substrate, where the first light-emitting line unit includes at least two pairs of electrode connection points for electrically connecting with the positive electrode and the negative electrode of the LED chip, respectively. And the electrical connection relationship between the at least two pairs of electrode connection points can be in series or in parallel, and when at least three pairs of electrode connection points are included, the electrical connection relationship between the three pairs of electrode connection points can also be in series and parallel combination. Correspondingly, the electrical connection relationship between the LED chips connected to the electrode connection points of each pair may be in series, parallel, or a combination of series and parallel.

In this embodiment, at least two line cutting units are disposed on the flexible circuit board along the length direction thereof, and one line cutting unit includes at least one first light-emitting line unit, but it should be understood that the number of the first light-emitting line units included in the one line cutting unit can be flexibly set according to a specific application scenario. For convenience of understanding, in the following description of the present embodiment, several examples are described in which the first line layer includes one first light-emitting line unit and more than two first light-emitting line units.

Referring to fig. 1A, in an example, the first circuit layer disposed on the front surface of the flexible substrate may include only one light-emitting circuit unit, and the one light-emitting circuit unit includes at least two first light-emitting circuit units connected in parallel between a pair of positive power supply lines and a pair of negative power supply lines corresponding to the one light-emitting circuit unit. Referring to fig. 1A, the light-emitting line unit includes at least two parallel first light-emitting line units, and the connection manners between the LED chips 13 in each first light-emitting line unit may be the same, for example, they may be parallel, serial (as shown in fig. 1A), or serial and parallel, and in some applications, the connection manners between the LED chips 13 in some first light-emitting line units may be different from the connection manners between the LED chips 13 in other first light-emitting line units, for example, the LED chips 13 in some first light-emitting line units are connected in parallel, and the LED chips 13 in other first light-emitting line units are connected in series or in serial and parallel.

As shown in fig. 1B, in another example, the first circuit layer disposed on the front surface of the flexible substrate may only include two light-emitting circuit units, and one of the light-emitting circuit units includes at least two first light-emitting circuit units connected in parallel between a pair of positive power supply lines and a pair of negative power supply lines corresponding to the light-emitting circuit unit. In the two light-emitting circuit units shown in fig. 1B, the two light-emitting circuit units share a positive power supply line, but in some application scenarios, the two light-emitting circuit units may also share a negative power supply line and separately use the positive power supply line, or the two light-emitting circuit units may also share the negative power supply line and separately use the positive power supply line. As shown in fig. 1B, each light-emitting circuit unit includes at least two first light-emitting circuit units connected in parallel, and the connection manner between the LED chips 13 in each first light-emitting circuit unit may be the same, or all or part of the first light-emitting circuit units may be different, which is not described herein again. In this embodiment, the connection modes between the LED chips in the first light emitting line unit included in each light emitting line unit may also be the same or different. In this example, the color temperature of the first light emitting line unit included in each light emitting line unit may be different, and each light emitting line unit may work independently, or two light emitting line units may work in combination according to requirements, so as to obtain at least three different light emitting modes, and enrich the light emitting effect.

As shown in fig. 1C, in another example, the first circuit layer disposed on the front surface of the flexible substrate may only include three light-emitting circuit units, and each light-emitting circuit unit also includes at least two first light-emitting circuit units connected in parallel between a pair of positive power supply lines and a pair of negative power supply lines corresponding to the light-emitting circuit unit. In the three-way light-emitting circuit unit shown in fig. 1C, the two light-emitting circuit units share a negative power supply circuit, but in some application scenarios, the three-way light-emitting circuit unit may also share a positive power supply circuit and separately use a negative power supply circuit, or the three-way light-emitting circuit unit may also share a negative power supply circuit and separately use a positive power supply circuit. As shown in fig. 1C, each light-emitting circuit unit includes at least two first light-emitting circuit units connected in parallel, and the connection manner between the LED chips 13 in each first light-emitting circuit unit may be the same, or all or part of the first light-emitting circuit units may be different, which is not described herein again. In this embodiment, the connection modes between the LED chips in the first light emitting line unit included in each light emitting line unit may also be the same or different. In this example, the light emission colors of the first light emitting line units included in the respective light emitting line units may be different, for example, the first light emitting line units included in the three light emitting line units may be three kinds of first light emitting line units that emit red light, green light, and blue light, respectively.

In the above three examples, in the example shown in fig. 1A, one first light-emitting line unit is included in one line cutting unit; in the example shown in fig. 1B, two first light-emitting line units are included in one line cutting unit; in the example shown in fig. 1C, three first light-emitting line units are included in one line cutting unit; in this way, when the first circuit layer disposed on the front surface of the flexible substrate includes four or more light-emitting circuit units (e.g., four R \ G \ B + white light), one circuit cutting unit may include four or more first light-emitting circuit units. It should be understood that the light-emitting circuit units are not limited to be arranged in a row as shown in fig. 1A to 1C, and may be arranged in a plurality of rows in a staggered or matrix manner. The device can be flexibly set according to requirements.

In this embodiment, between the adjacent circuit shearing units of flexible circuit board, and the mark unit that sets up in the width direction of flexible circuit board, be used for instructing the shearing position of circuit shearing unit on the flexible circuit board, this mark unit includes but not limited to from the thickness direction of flexible circuit board run through the mark hole or the mark breach of flexible circuit board, the mark hole or the mark breach of seting up can not be ground away or ground the flower in the preparation of LED lamp strip or the use, and directly set up mark hole or mark breach between the adjacent circuit shearing unit on the flexible circuit board, the position of seting up is more direct, thereby it is more accurate to set up the precision of seting up. It should be understood that the marking units in this embodiment may be disposed between adjacent line cutting units, and at any position in the width direction of the flexible circuit board, and the number, shape, size, and the like of the marking holes or the marking notches may also be flexibly set, as long as the purpose of cutting the marking is achieved. In addition, it should be understood that, in the present embodiment, an opening manner in which the mark hole or the mark notch penetrates the flexible circuit board from the thickness direction of the flexible circuit board is a preferable manner. In some examples, the marking holes or the marking notches may not penetrate through the flexible circuit board from the thickness direction of the flexible circuit board, for example, only the front side, the back side or the side of the flexible circuit board needs to penetrate through, as long as the positions of the corresponding marking holes or the marking notches can be observed from the front side, the back side or the side of the flexible circuit board by the light bar manufactured by using the flexible circuit board, so that the cutting positions can be accurately determined. For ease of understanding, the present embodiment will be described below in conjunction with several examples of the arrangement of the marking elements for ease of understanding. It should be understood that the width direction of the flexible circuit board has a first side (for example, a left side) and a second side (for example, a right side, and of course, the first side may also be the right side, and the corresponding second side is the left side), wherein several setting examples of the marking unit include:

example one: the marking unit comprises a first marking unit positioned on the first side, wherein the first marking unit can be a marking hole or a marking notch.

For example, please refer to the flexible circuit board 1 shown in fig. 2A and 2B, the flexible circuit board includes at least two adjacent circuit cutting units 11, and the circuit cutting units 11 may include at least one first circuit light emitting unit (as shown in fig. 1A to 1C, but not limited to fig. 1A to 1C), each first circuit light emitting unit includes at least two pairs of electrode connection points 14 for electrically connecting with the anode and the cathode of the LED chip, respectively, and the electrical connection relationship between the pairs of electrode connection points 14 is shown in the above example, and will not be described again. Between adjacent line cutting units 11, a mark notch 12 is provided on the first side of the flexible circuit board in the width direction, the mark notches shown in fig. 2A and 2B are triangular notches, the marks 12 at the two ends are notches after being cut by half, and other figures are similar and are not described again. Of course, it should be understood that the notch may be any other notch with any shape, and the size of the notch may be flexibly set according to the specific application scenario, as long as the notch can be clearly visible to the naked eye without affecting the normal function of the flexible circuit board. For another example, as shown in fig. 3A to 3B, a mark notch 12 is disposed on a first side of the flexible circuit board in the width direction, and the mark notch 12 is a rectangular notch. It should be understood that the mark gap 12 may also be an arc-shaped gap or other irregular gap, which will not be described in detail herein.

In addition, it should be understood that the marking units including the first marking unit located on the first side may also be marking holes, and the shape of the holes may be, but is not limited to, circular, oval, triangular, polygonal (e.g., rectangular, diamond, etc.), which will not be described herein again.

Example two: the marking unit comprises a fourth marking unit and a fifth marking unit which are respectively positioned on the first side and the second side and are opposite in position. The first marking unit in this example may be a marking hole, or a marking notch.

For example, please refer to the flexible circuit board 1 shown in fig. 4, the flexible circuit board includes at least two adjacent circuit cutting units 11, the first side and the second side of the flexible circuit board in the width direction are respectively provided with mark notches 12 with opposite positions, the mark notches shown in fig. 4 are arc notches, the marks 12 at the two ends are notches after being cut by half, and other figures are similar and are not repeated herein. Of course, it should be understood that the notch in this example may also be a notch in any other shape, such as a triangle, a polygon, etc., and the size of the notch may be flexibly set according to the specific application scenario, as long as it can be clearly seen by naked eyes and the normal function of the flexible circuit board is not affected.

In addition, it should be understood that the marking units in this example may be marking holes in addition to the marking notches of the above examples, and the shape of the holes may be, but not limited to, circular, oval, triangular, polygonal (e.g., rectangular, diamond, etc.). For example, as shown in fig. 5A and 5B, the first side and the second side of the flexible circuit board 1 in the width direction are respectively provided with mark holes 13 in opposite positions, and the mark holes shown in fig. 5A and 5B are circular holes.

Example three: the marking units comprise a sixth marking unit and a seventh marking unit which are positioned on the first side and are arranged in an isolated mode, and an eighth marking unit and a ninth marking unit which are positioned on the second side and are arranged in an isolated mode, the sixth marking unit and the seventh marking unit respectively correspond to the eighth marking unit and the ninth marking unit in position and are distributed along the length direction of the flexible circuit board, and circuit board areas for isolating the sixth marking unit and the seventh marking unit and isolating the eighth marking unit and the ninth marking unit form a shearing area.

The present example may also be configured such that the marking units are disposed on two sides of the flexible printed circuit board in the width direction, and the difference from the second example is that the cutting marking is performed on the two sides by a combination of two marking units. For example, please refer to the flexible circuit board 1 shown in fig. 6A and 6B, the flexible circuit board includes at least two adjacent circuit cutting units 11, two mark notches 12 are respectively disposed on a first side and a second side of the flexible circuit board in a width direction, the two mark notches 12 on the same side are separated and distributed along a length direction of the flexible circuit board, and a circuit board region separating the two mark notches 12 on the same side forms a cutting region.

For another example, please refer to the flexible circuit board 1 shown in fig. 8A and 8B, the flexible circuit board includes at least two adjacent line cutting units 11, two marking holes 13 are respectively disposed on a first side and a second side of the flexible circuit board in a width direction, the two marking holes 13 on the same side are separated and distributed along a length direction of the flexible circuit board, and a cutting area is formed by a circuit board area separating the two marking holes 13 on the same side.

The shapes and sizes of the mark notches 12 and the mark holes 13 in fig. 6A and 8A can be specifically set, and are not described in detail herein. And it should be understood that, when the marking of the cutting position is realized by using a plurality of marking unit combinations, the marking is not limited to the combination of two marking units shown as three in the example, and three or more marking units may be used for marking. For example, as shown in fig. 7A to 7B, three continuous marking notches 12 are respectively disposed on a first side and a second side of the flexible circuit board in the width direction, and a region where a middle one of the three continuous marking notches 12 on the same side is located forms a cutout region. And the specific combination of the marking holes and more than three marking units is analogized, and the description is omitted.

Example four: the marking unit comprises a second marking unit and a third marking unit which are positioned on the first side and are arranged in an isolated mode, the second marking unit and the third marking unit are distributed along the length direction of the flexible circuit board, and a circuit board area for isolating the second marking unit and the third marking unit forms a shearing area.

The present example is different from example three in that the cut marking is performed only on the first side in the width direction of the flexible circuit board by a combination of two marking units as compared to example three. Therefore, the specific setting mode is shown in example three, and the detailed description thereof is omitted here.

Example five: in this example, the marking units may be disposed in a manner of staggering the marking units on the first side and the second side in the width direction of the flexible circuit board, and the marking units in different positions may employ marking gaps or marking holes with the same shape and/or good size, or may employ marking gaps or marking holes with different shapes and/or sizes at least in part.

In addition, it should be understood that, in addition to this example, in each of the above examples, the marking units disposed at different positions may all be the marking holes, or the marking notches, or may be part of the marking holes, and part of the marking notches, and the shapes and the sizes of the disposed marking holes and the disposed marking notches may be the same, or may be at least part of the disposed marking holes and the disposed marking notches, and may be flexibly set according to application requirements, and are not described herein again.

Example eight: in this example, when the marking unit provided is a marking hole, the marking hole may also be provided in a middle area in the width direction of the flexible circuit board, or an area near the middle.

In addition, it should also be understood that the marking unit provided in the present embodiment may also be flexibly used in combination with existing marking lines or other marking manners for indicating the cutting position.

In addition, it should be understood that, in the embodiment, when some first light emitting line units need to connect the protection resistor, they may further include a resistor connection point 16 for electrically connecting with the protection resistor, for example, as shown in fig. 3A and fig. 5A to 8A, and the resistor connection point 16 may be in the same row as the electrode connection point 14 or may be located outside the row of the electrode connection point 14. The method can be flexibly set according to requirements. In addition, it should be understood that the specific shape, size and number of the resistor connection points 16 and the electrode connection points 14 in the present embodiment can be flexibly set according to specific requirements, and no limitation is made thereto.

In some examples of this embodiment, in order to improve protection of the flexible circuit board and improve light emission efficiency of the LED light bar, the flexible circuit board further includes a reflective dielectric layer disposed on the first circuit layer, and the reflective dielectric layer may be configured to reflect visible light emitted by the LED chip and directed to the reflective dielectric toward a direction away from the flexible substrate, so as to improve light extraction efficiency of the light bar. The material, form and specific forming method of the reflective medium layer in this embodiment can be flexibly set. For example, in one application scenario, the reflective medium includes a reflective film, which is attached to the front surface of the flexible substrate by means of an attachment method; for another example, in another application scenario, the reflective medium includes a reflective film, and the reflective film can be attached to the front surface of the flexible substrate by means of attachment; for another example, in another application scenario, the reflective medium comprises a highly reflective ink and may be disposed on the front side of the flexible substrate by, but not limited to, printing or coating.

In some examples of the present embodiment, a reflective dielectric layer disposed on the front surface of the flexible circuit board may cover all of at least one of the positive power supply line and the negative power supply line, for example, as shown in fig. 2A, 4, and 7A; and the electrode connection regions (i.e. the electrode connection points 14, the resistor connection points 14, etc.) in the first light emitting line unit for connecting with electronic devices, including but not limited to at least one of LED chips and resistors, are exposed out of the reflective medium layer. In this example, when the positive power supply line and the negative power supply line need to be electrically connected with the outside, the reflective medium layer can be removed from the corresponding positions on the positive power supply line and the negative power supply line, so that the positive power supply line and the negative power supply line are exposed, and thus, the positive power supply line and the negative power supply line are electrically connected with the outside. The arrangement mode can enable the positive power supply line and the negative power supply line to be completely covered by the reflecting medium layer, and the LED lamp is good in integrity, convenient to process, higher in safety and lower in cost.

In some examples of the present embodiment, the positive electrode power feeding course and the negative electrode power feeding course on the flexible substrate are at least partially exposed to the reflective medium layer at the corresponding regions between the adjacent course cut units to form power feeding course connection regions, as shown by, for example, reference numeral 15 (hereinafter, referred to as unit electrical connection regions 15) in fig. 3A, 5A, 6A, and 8A, and the other regions of the positive electrode power feeding course and the negative electrode power feeding course are covered with the reflective medium layer; the electrode connecting area used for being connected with the electronic device in the first light emitting line unit is exposed out of the reflecting medium layer.

In addition, optionally, in some examples of this embodiment, according to requirements, the flexible circuit board further includes a second circuit layer formed on the back surface of the flexible substrate, where the second circuit layer includes at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate; and each second light-emitting circuit unit is provided with a first light-emitting circuit unit corresponding to the second light-emitting circuit unit in the length direction, so that the corresponding first light-emitting circuit unit and the corresponding second light-emitting circuit unit can work normally after the flexible circuit board is cut along the cutting mark.

It should be understood that the second light-emitting circuit units included in the second circuit layer disposed on the back side in the present embodiment may be, but are not limited to, one-to-one correspondence with the first light-emitting circuit units disposed on the front side. And the second light-emitting circuit unit and the positive power supply circuit and the negative power supply circuit used by the corresponding first light-emitting circuit unit can be connected in parallel by, but not limited to, via hole electrical connection, wire electrical connection, and the like. Of course, in this embodiment, the second light emitting circuit units included in the second circuit layer disposed on the back surface may not correspond to the first light emitting circuit units disposed on the front surface one to one, and may be flexibly disposed according to actual requirements, which is not described herein again.

Example two:

the present embodiment provides an LED light bar, and the flexible circuit board used in the LED light bar can be, but is not limited to, the flexible circuit board shown in the first embodiment. The LED lamp strip further comprises a first LED chip which is arranged on the first light emitting line unit on the flexible circuit board and electrically connected with the first light emitting line unit, and optionally, the first LED chip can also be fixedly connected with the first light emitting line unit at the same time. The LED light bar further comprises a first packaging adhesive layer which is arranged on the front face of the flexible circuit board and at least covers the first light emitting line unit and the first LED chip. And it should be understood that the first encapsulating adhesive layer may be a transparent adhesive layer, or may be a non-transparent or semi-transparent adhesive layer, and the first encapsulating adhesive layer may include a substance for performing luminescence conversion, such as, but not limited to, phosphor, quantum material, etc., as required.

Accordingly, the manner in which the first encapsulation adhesive layer is formed on the front surface of the flexible circuit board can also be flexibly selected, and for example, the formation can be realized by, but not limited to, dispensing, printing, molding, and bonding. And the specific coverage area and form of the first packaging adhesive layer on the front surface of the flexible circuit board can be flexibly set, so long as the position of a marking hole or a marking notch on the flexible circuit board for marking the line shearing unit can be observed after the LED light bar is formed. For the convenience of understanding, the present embodiment will be further described below with several setting examples of the first encapsulant.

In one example, a first packaging adhesive layer arranged on the flexible circuit board covers the first light emitting line unit and the first LED chip, and at least part of the marking unit arranged on the flexible circuit board is exposed out of the first packaging adhesive layer. In this example, after the LED light bar is manufactured, the mark hole or the mark notch formed on the flexible circuit board can be directly viewed from the front surface or the back surface of the flexible circuit board. In the present example, the cross-sectional shape of the first encapsulant layer may be an arc shape, a rectangular shape, or other shapes according to the requirement, for example, the cross-sectional shape may even be a triangle.

Fig. 9A to 9C show some specific arrangement shapes of the first encapsulant layer on the flexible circuit board in this example. In fig. 9A, the flexible circuit board 1 is provided with arc-shaped mark notches 12 on both sides in the width direction, and is also provided with a unit electrical connection region 15. In fig. 9A, the first encapsulating adhesive layer is a non-transparent or semi-transparent semi-encapsulating adhesive layer 2 (of course, the semi-encapsulating adhesive layer 2 may also be set to be transparent according to the requirement), the semi-encapsulating adhesive layer 2 covers the first light emitting circuit unit and the first LED chip, the mark notch 12 and the unit electrical connection area 15 on the flexible circuit board 1 are both exposed outside the semi-encapsulating adhesive layer 2, and the mark notch 12 can be directly observed from the front or back of the flexible circuit board 1. The cross-sectional shape of the half-encapsulating adhesive layer 2 in fig. 9A is rectangular. In fig. 9B, the flexible circuit board 1 is also provided with arcuate mark notches 12 on both sides in the width direction, and is also provided with another middle-shaped (circular) unit electrical connection region 15. In fig. 9B, the first encapsulant layer is also a half encapsulant layer 2, the half encapsulant layer 2 covers the first light emitting line unit and the first LED chip, the mark gap 12 and the unit electrical connection region 15 on the flexible circuit board 1 are also exposed outside the half encapsulant layer 2, and the mark gap 12 can be directly observed from the front or back of the flexible circuit board 1. The cross-sectional shape of the half-encapsulating adhesive layer 2 in fig. 9B is an arc. In fig. 9C, circular mark holes 13 are correspondingly formed in two sides of the flexible circuit board 1 in the width direction, and the cutting position is indicated by combining the two mark holes 13, and the specific indication mode is shown in the above embodiment and is not described herein again. The marking hole 13 can be directly observed from the front or back surface of the flexible circuit board 1. The cross-sectional shape of the semi-encapsulating adhesive layer 2 in fig. 9C is also arc-shaped.

In another example, the first encapsulation adhesive layer disposed on the flexible circuit board may cover the front surface of the flexible circuit board entirely. At the moment, when the first packaging adhesive layer is a transparent adhesive layer, the marking units arranged on the first packaging adhesive layer can still be observed from the front side or the back side of the flexible circuit board; when the first packaging adhesive layer is a non-transparent adhesive layer or semi-transparent adhesive layer, the marking unit arranged on the first packaging adhesive layer is at least observed from the back surface of the flexible circuit board, and when the marking unit is a marking notch, the position of the marking notch arranged on the flexible circuit board can be at least observed from the side surface of the flexible circuit board provided with the marking notch, so that the shearing position is determined. In this example, the encapsulation glue forming the first encapsulation glue layer may be at least partially filled into the marking unit, or may not be filled into the marking unit. For ease of understanding, the following description will be provided with reference to several specific first encapsulant placement configurations for further understanding of the present example.

Referring to the LED light bar shown in fig. 10, the flexible circuit board 1 is provided with circular mark holes 13 (alternatively, mark notches are also provided) on two sides in the width direction, and no unit electrical connection region 15 is provided. In fig. 10, the first encapsulation adhesive layer is a transparent full encapsulation adhesive layer 3, the transparent full encapsulation adhesive layer 3 covers the front surface of the flexible circuit board 1, the first light emitting line unit and the first LED chip, and the marking hole 13 are covered by the transparent full encapsulation adhesive layer 3, and the marking hole 13 can be directly observed from the front surface or the back surface of the flexible circuit board 1. The cross section of the transparent full-packaging adhesive layer 3 is rectangular, and can be set into an arc shape or other shapes according to requirements.

In other specific configuration examples, the marking unit may include a marking notch penetrating through the flexible circuit board from a thickness direction of the flexible circuit board, the first encapsulation adhesive layer covers a whole front surface of the flexible circuit board, and a portion of the encapsulation adhesive forming the first encapsulation adhesive layer is filled in the marking notch. For example, referring to the LED light bar shown in fig. 11A to 11B, the flexible circuit board 1 is provided with a mark notch 12 (or alternatively, a mark hole) on at least one side in the width direction, and a unit electrical connection area 15 may be provided or the unit electrical connection area 15 may not be provided. In fig. 11A to 11B, the first encapsulation adhesive layer is a non-transparent or semitransparent full encapsulation adhesive layer 4, the full encapsulation adhesive layer 4 covers the front surface of the flexible circuit board 1, the first light emitting line unit, the first LED chip, and the mark notch 12 are all covered by the full encapsulation adhesive layer 4, and the position of the mark notch 12 can be directly observed from the back surface and the side surface of the flexible circuit board 1, so as to determine the corresponding cutting position. The cross section of the full-encapsulation glue layer 4 is arc-shaped, and can be set to be rectangular or other shapes according to requirements. For example, please refer to fig. 12A to 12B, which are different from fig. 11A to 11B in that the cross-sectional shape of the full encapsulant layer 4 is rectangular. In addition, in the present example, the indication of the cutting position may also be performed by at least two combinations of the marking notches 12 (or the marking holes). For example, as shown in fig. 13A to 13B, at least one side of the flexible circuit board 1 in the width direction is provided with two separated mark gaps 12, and the region of the flexible circuit board 1 separating the two mark gaps 12 forms a cut region. And the cross-sectional shape of the full encapsulating adhesive layer 4 can also be rectangular, but of course can also be arc-shaped, for example, please refer to fig. 14.

Here, it should be understood that, in the LED light bars shown in fig. 11A to 14, the marking units are filled with the encapsulation adhesive. However, in other examples, the encapsulation adhesive may not be filled in the marking unit.

Optionally, in some application scenarios of this embodiment, according to requirements, the flexible circuit board further includes a second circuit layer formed on the back surface of the flexible substrate, where the second circuit layer includes at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate, and each second light-emitting circuit unit has a first light-emitting circuit unit corresponding to the second light-emitting circuit unit in the length direction; the specific forming manner of the second circuit layer can refer to the first circuit layer, and the shape thereof can be seen in the above embodiments, which are not described herein again.

Correspondingly, in the application scene, the LED light bar further includes a second LED chip disposed on the second light emitting circuit unit and electrically connected to the second light emitting circuit unit, and a second encapsulation adhesive layer disposed on the back surface of the flexible circuit board and at least covering the second light emitting circuit unit and the second LED chip.

For example, in some examples of the application scenario, the second encapsulant layer may cover the second light-emitting circuit unit and the second LED chip, and the mark unit is at least partially exposed from the second encapsulant layer. The first packaging adhesive layer may be the half packaging adhesive layer of the above example, or may be the full packaging adhesive layer of the above example, and the marking unit may be a marking hole or a marking notch, and at this time, the marking unit may be at least viewed from the back of the flexible circuit board, so as to determine the cutting position.

For another example, in another example of the application scenario, the second encapsulation adhesive layer may completely cover the back surface of the flexible circuit board, the first encapsulation adhesive layer disposed on the front surface of the flexible circuit board may be the half encapsulation adhesive layer in the above example, the marking unit may be a marking hole or a marking notch, and at least the marking unit may be viewed from the front surface of the flexible circuit board, so as to determine the cutting position. When the first encapsulation adhesive layer disposed on the front side of the flexible circuit board is also the full encapsulation adhesive layer of the above example, and when at least one of the first encapsulation adhesive layer and the second encapsulation adhesive layer is a transparent adhesive layer, the marking unit at this time may also be a marking hole or a marking notch, and at this time, the marking unit may be at least viewed from the front side or the back side of the flexible circuit board. When the first packaging adhesive layer and the second packaging adhesive layer are both semitransparent adhesive layers or nontransparent adhesive layers, the marking units at the moment can at least comprise marking gaps, and the positions of the marking gaps can be observed at least from the side face of the flexible circuit board at the moment. In order to facilitate understanding of this case, several configurations of this case will be described below with reference to the drawings.

Referring to the LED light bar shown in fig. 15A and 15B, at least one side of the flexible circuit board 1 in the width direction is correspondingly provided with a mark gap, and the front surface and the back surface of the flexible circuit board 1 are both formed with a packaging adhesive layer, which is referred to as a double-layer packaging adhesive 5 in this example, and the packaging adhesive forming the double-layer packaging adhesive 5 is filled into the mark gap, so that the opening position of the mark gap (i.e., the position where the packaging adhesive is filled in the side surface of the flexible circuit board 1) can be clearly observed from the side surface of the flexible circuit board. The cross-sectional shape of the double-layer packaging adhesive 5 on the LED light bar shown in fig. 15A is rectangular, and it can be set to other shapes according to the requirement, for example, please refer to the arc shape shown in fig. 16A to 16B. In this example, the indication of the cutting position may be performed by a combination of at least two mark notches 12. For example, as shown in fig. 17, at least one side of the flexible circuit board 1 in the width direction is provided with two separated mark gaps, and the region of the flexible circuit board 1 separating the two mark gaps 12 forms a cutting region.

And it should be understood that the type and forming manner of the first encapsulating adhesive layer and the second encapsulating adhesive layer in this embodiment may be the same or different.

The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. The flexible circuit board for manufacturing the LED light bar is characterized by comprising a flexible substrate and a first circuit layer formed on the front surface of the flexible substrate;

2. The flexible circuit board for manufacturing an LED light bar of claim 1, further comprising a reflective dielectric layer disposed on the first circuit layer, wherein the reflective dielectric layer covers at least one of the positive power supply line and the negative power supply line;

3. The flexible circuit board for manufacturing an LED light bar of claim 1, further comprising a reflective dielectric layer disposed on the first circuit layer, wherein corresponding regions of the positive power supply line and the negative power supply line between adjacent line cutting units are at least partially exposed out of the reflective dielectric layer, and other regions are covered by the reflective dielectric layer;

4. The flexible circuit board for manufacturing an LED light bar of any one of claims 1-3, wherein the width direction of the flexible circuit board has a first side and a second side which are opposite;

the marking unit comprises a first marking unit positioned on the first side;

or the like, or, alternatively,

5. The flexible circuit board for manufacturing an LED light bar of any one of claims 1 to 3, further comprising a second circuit layer formed on the back surface of the flexible substrate, wherein the second circuit layer comprises at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate; each second light-emitting line unit is provided with the first light-emitting line unit corresponding to the position of the second light-emitting line unit in the length direction.

6. An LED light bar, comprising the flexible circuit board according to any one of claims 1 to 5, wherein the LED light bar further comprises a first LED chip disposed on the first light emitting line unit and electrically connected to the first light emitting line unit, and a first packaging adhesive layer disposed on the front surface of the flexible circuit board and covering at least the first light emitting line unit and the first LED chip.

7. The LED light bar of claim 6, wherein the first packaging adhesive layer covers only the first light emitting line unit and the first LED chip, and the mark unit is at least partially exposed out of the first packaging adhesive layer.

8. The LED light bar of claim 6, wherein the marking unit comprises a marking notch penetrating through the flexible circuit board from the thickness direction of the flexible circuit board, the first packaging adhesive layer covers the front surface of the flexible circuit board, and a part of the packaging adhesive forming the first packaging adhesive layer is filled in the marking notch.

9. The LED light bar of any one of claims 6 to 8, wherein the flexible circuit board further comprises a second circuit layer formed on the back surface of the flexible substrate, the second circuit layer comprising at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate, each second light-emitting circuit unit having the first light-emitting circuit unit corresponding to the second light-emitting circuit unit in the length direction;

10. The LED light bar of any one of claims 6 to 8, wherein the flexible circuit board further comprises a second circuit layer formed on the back surface of the flexible substrate, the second circuit layer comprising at least one second light-emitting circuit unit connected in parallel between the positive power supply line and the negative power supply line and distributed along the length direction of the flexible substrate;