TWM633833U - Flexible circuit board with punching recognition pattern - Google Patents

Flexible circuit board with punching recognition pattern Download PDF

Info

Publication number
TWM633833U
TWM633833U TW111207857U TW111207857U TWM633833U TW M633833 U TWM633833 U TW M633833U TW 111207857 U TW111207857 U TW 111207857U TW 111207857 U TW111207857 U TW 111207857U TW M633833 U TWM633833 U TW M633833U
Authority
TW
Taiwan
Prior art keywords
identification pattern
substrate
circuit board
identification
punched
Prior art date
Application number
TW111207857U
Other languages
Chinese (zh)
Inventor
蔡金保
鄭佩芬
Original Assignee
易華電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 易華電子股份有限公司 filed Critical 易華電子股份有限公司
Priority to TW111207857U priority Critical patent/TWM633833U/en
Publication of TWM633833U publication Critical patent/TWM633833U/en

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

一種具有沖孔識別圖案的軟性電路板,用以解決習知軟性電路板之沖孔的識別度低而導致機台誤判產品優劣的問題。係包含:一基板;一線路部,位於該基板之表面,一切割線圍繞該線路部之有效電路區域;及一識別圖案,位於該基板之表面,該識別圖案靠近該線路部且位於該切割線之外的區域,若該線路部具有缺陷,在該基板上沖設一沖孔,該沖孔的範圍涵蓋該線路部的部分區域及該識別圖案。A flexible printed circuit board with a punching hole identification pattern is used to solve the problem that the conventional flexible printed circuit board has a low degree of recognition of the punched holes, which causes the machine to misjudge the quality of the product. It includes: a substrate; a circuit part located on the surface of the substrate, a cutting line surrounding the effective circuit area of the circuit part; and an identification pattern located on the surface of the substrate, the identification pattern is close to the circuit part and located In the area other than the line, if the line portion has a defect, a punching hole is punched on the substrate, and the punching hole covers a part of the line portion and the identification pattern.

Description

具有沖孔識別圖案的軟性電路板Flexible circuit board with punched hole identification pattern

本創作係關於一種電子元件安裝基板,尤其是一種供機台正確識別沖孔的具有沖孔識別圖案的軟性電路板。The invention relates to a substrate for mounting electronic components, in particular to a flexible circuit board with a punching identification pattern for a machine to correctly identify punching holes.

請參照第1圖所示,其係一種習知的軟性電路板9,數個該軟性電路板9係依序加工成型於可撓的基板上,各該軟性電路板9係由大量的電子線路排列分布而形成一線路區域91,該數個軟性電路板9之線路區域91必須通過一系列的自動化測試,例如:自動光學檢查(Automated Optical Inspection, AOI)、電路電性測試(In-Circuit-Test, ICT)及功能驗證測試(Function Verification Test, FVT)等品質管理製程,以篩檢出各該線路區域91可能潛藏的外觀缺陷或電性不良,而在自動化品管檢驗後,被判定為不良品的軟性電路板9,會由機台在該軟性電路板9上沖設一識別孔92以標示為報廢,係可以避免在有瑕疵的軟性電路板9上焊接電子元件甚至組裝成產品,而造成組裝工時浪費及材料損失。Please refer to Figure 1, it is a known flexible circuit board 9, several flexible circuit boards 9 are sequentially processed and formed on a flexible substrate, and each flexible circuit board 9 is composed of a large number of electronic circuits Arranged and distributed to form a circuit area 91, the circuit area 91 of the several flexible circuit boards 9 must pass a series of automated tests, such as: automatic optical inspection (Automated Optical Inspection, AOI), circuit electrical test (In-Circuit- Test, ICT) and Function Verification Test (Function Verification Test, FVT) and other quality management processes to screen out possible hidden appearance defects or electrical defects in each line area 91, and after automated quality control inspection, it is judged to be Defective flexible circuit boards 9 will be stamped with an identification hole 92 on the flexible circuit board 9 by the machine to mark them as scrapped, which can avoid soldering electronic components on the defective flexible circuit board 9 or even assembling them into products. And cause waste of assembly man-hours and material loss.

上述習知的軟性電路板9,經由自動化生產及檢驗後,係連同良品及不良品的整捲電路板,以捲輪式薄膜輸送(Roll-to-Roll)進行切割、出貨及裝配等成型作業,同時以影像感應器自動篩檢並略過具有該識別孔92之不良品,係可以連續作業以節省製程時間,且透過計算該識別孔92數量還可以統計生產良率是否達標,惟,習知軟性電路板9的基板選擇使用輕薄且透明的材料時,在該軟性電路板9上沖設的該識別孔92與周遭的透明基板同樣能夠透光,係導致影像感應器難以分辨該辨識孔92與透明基板而增加誤判的機率,如此,良好的電路板可能被自動化機台誤認具有該辨識孔92而被剔除,造成電路板整體良率下降;反之,不良的電路板可能未被發現該辨識孔而能夠封裝出貨,造成品質與功能異常的產品流入市面,影響電器使用安全及減損生產者商譽。The above-mentioned conventional flexible circuit board 9, after automatic production and inspection, is a whole roll of circuit boards with good products and defective products, which are cut, shipped and assembled by roll-to-roll film transportation (Roll-to-Roll) At the same time, the image sensor is used to automatically screen and skip the defective products with the identification holes 92. It can be operated continuously to save process time, and by calculating the number of identification holes 92, it is also possible to count whether the production yield is up to standard. However, It is known that when the substrate of the flexible circuit board 9 is made of thin and transparent materials, the identification hole 92 punched on the flexible circuit board 9 can transmit light as well as the surrounding transparent substrate, which makes it difficult for the image sensor to distinguish the identification. Holes 92 and transparent substrates increase the probability of misjudgment. In this way, good circuit boards may be mistaken for having the identification holes 92 by automated machines and be rejected, resulting in a decrease in the overall yield of circuit boards; otherwise, bad circuit boards may not be found. The identification hole can be packaged and shipped, causing products with abnormal quality and function to flow into the market, affecting the safety of electrical appliances and reducing the goodwill of the manufacturer.

有鑑於此,習知的軟性電路板確實仍有加以改善之必要。In view of this, the conventional flexible circuit board still needs to be improved.

為解決上述問題,本創作的目的是提供一種具有沖孔識別圖案的軟性電路板,係可以準確辨識電路板上的沖孔。In order to solve the above problems, the purpose of this creation is to provide a flexible circuit board with a punching identification pattern, which can accurately identify the punching holes on the circuit board.

本創作的次一目的是提供一種具有沖孔識別圖案的軟性電路板,係可以節省電路板的品管測試時間。The second purpose of this creation is to provide a flexible printed circuit board with a punched hole identification pattern, which can save the time for quality control testing of the printed circuit board.

本創作的又一目的是提供一種具有沖孔識別圖案的軟性電路板,係可以避免不良產品流入市面。Another purpose of this creation is to provide a flexible printed circuit board with a punched identification pattern, which can prevent bad products from entering the market.

本創作全文所述方向性或其近似用語,例如「上(頂)」、「下(底)」、「內」、「外」、「側面」等,主要係參考附加圖式的方向,各方向性或其近似用語僅用以輔助說明及理解本創作的各實施例,非用以限制本創作。The directionality or similar terms mentioned in the full text of this work, such as "upper (top)", "lower (bottom)", "inner", "outer", "side", etc., mainly refer to the directions of the attached drawings, each Direction or similar terms are only used to assist in explaining and understanding the various embodiments of the creation, not to limit the creation.

本創作全文所記載的元件及構件使用「一」或「一個」之量詞,僅是為了方便使用且提供本創作範圍的通常意義;於本創作中應被解讀為包括一個或至少一個,且單一的概念也包括複數的情況,除非其明顯意指其他意思。The use of the quantifiers "one" or "one" in the elements and components described throughout this creation is only for convenience and to provide the usual meaning of the scope of this creation; it should be interpreted in this creation as including one or at least one, and a single The notion of also includes the plural unless it is obvious that it means otherwise.

本創作的具有沖孔識別圖案的軟性電路板,包含:一基板;一線路部,位於該基板之表面,一切割線圍繞該線路部之有效電路區域;及一識別圖案,位於該基板之表面,該識別圖案靠近該線路部且位於該切割線之外的區域,若該線路部具有缺陷,在該基板上沖設一沖孔,該沖孔的範圍涵蓋該線路部的部分區域及該識別圖案。The flexible printed circuit board with punching hole identification pattern of the present creation includes: a substrate; a circuit part located on the surface of the substrate, a cutting line surrounding the effective circuit area of the circuit part; and an identification pattern located on the surface of the substrate , the identification pattern is close to the line part and is located outside the cutting line. If the line part has a defect, a punching hole is punched on the substrate, and the scope of the punching hole covers part of the line part area and the identification pattern. pattern.

據此,本創作的具有沖孔識別圖案的軟性電路板,藉由在用於標示報廢電路板的沖孔範圍內形成該識別圖案,係可以使影像感測系統透過是否偵測到該識別圖案,判斷軟性電路板是良品或不良品,若偵測到該識別圖案則代表該軟性電路板的功能正常,若未偵測到該識別圖案則代表該軟性電路板已被沖設該沖孔而報廢,係具有提升自動化辨識的準確率、節省製程時間及避免出貨不良產品等功效。Accordingly, the flexible circuit board with a punched hole identification pattern of the present invention can make the image sensing system detect whether the identification pattern is detected by forming the identification pattern within the range of the punched hole used to mark the scrapped circuit board. , to determine whether the flexible circuit board is a good product or a defective product. If the identification pattern is detected, it means that the function of the flexible circuit board is normal. If the identification pattern is not detected, it means that the flexible circuit board has been punched with the punching hole. Scrapping can improve the accuracy of automatic identification, save process time, and prevent defective products from being shipped.

其中,該基板的材料是聚對苯二甲酸乙二酯或聚醯亞胺。如此,該基板係可以透光、電絕緣、耐衝擊,且具有輕量化及可彎折之特性,係具有應用軟性電路板於各種電子產品的功效。Wherein, the material of the substrate is polyethylene terephthalate or polyimide. In this way, the substrate can be light-transmitting, electrically insulated, impact-resistant, and has the characteristics of light weight and bendability, and has the effect of applying flexible circuit boards to various electronic products.

其中,該線路部係包含數個緊密排列的金屬導線,該識別圖案及該數個金屬導線為相同材料,且以相同製程形成。如此,用於檢測該金屬導線圖案的影像感測系統可以同步偵測該識別圖案,而不需要調整影像感測參數,係具有節省測試時間及提升辨識準確度的功效。Wherein, the circuit part includes several closely arranged metal wires, and the identification pattern and the several metal wires are made of the same material and formed by the same manufacturing process. In this way, the image sensing system for detecting the metal wire pattern can detect the recognition pattern synchronously without adjusting the image sensing parameters, which has the effects of saving test time and improving recognition accuracy.

為讓本創作之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本創作之較佳實施例,並配合所附圖式作詳細說明;此外,在不同圖式中標示相同符號者視為相同,會省略其說明。In order to make the above and other purposes, features and advantages of this creation more obvious and easy to understand, the preferred embodiments of this creation are specially cited below, and explained in detail with the accompanying drawings; in addition, the same symbols are marked in different drawings are considered the same, and their descriptions will be omitted.

請參照第2圖所示,其係本創作具有沖孔識別圖案的軟性電路板的較佳實施例,係包含一基板1、一線路部2及一識別圖案3,該線路部2及該識別圖案3係位於該基板1同側之表面,該識別圖案3靠近該線路部2,且該識別圖案3不重疊於該線路部2。Please refer to Fig. 2, which is a preferred embodiment of the flexible printed circuit board with a punching identification pattern in this invention, which includes a substrate 1, a circuit part 2 and an identification pattern 3, the circuit part 2 and the identification pattern The pattern 3 is located on the surface of the same side of the substrate 1 , the identification pattern 3 is close to the circuit portion 2 , and the identification pattern 3 does not overlap the circuit portion 2 .

該基板1係可撓而能夠被捲收的帶狀載板,該基板1係可以透過捲輪輸送逐步展開,並依序在該基板1表面上連續加工形成數個電路板之導電線路、焊盤及電子元件等結構,該基板1的材料可以是聚對苯二甲酸乙二酯(Polyethylene Terephthalate, PET)或聚醯亞胺(Polyimide, PI)等聚合物,係具有透明、電絕緣、耐衝擊、質輕及堅韌等特性,所製造的電路板係可以應用於顯示器、可折疊或穿戴的輕量化電子產品。The substrate 1 is a strip-shaped carrier board that is flexible and can be rolled up. The substrate 1 can be gradually unfolded through the roller transport, and sequentially processed on the surface of the substrate 1 to form several conductive circuits of circuit boards. Disk and electronic components and other structures, the material of the substrate 1 can be polyethylene terephthalate (Polyethylene Terephthalate, PET) or polyimide (Polyimide, PI) and other polymers, which are transparent, electrically insulating, resistant Impact, light weight and toughness, the manufactured circuit boards can be applied to displays, foldable or wearable lightweight electronic products.

該線路部2係包含數個緊密排列的金屬導線,該數個金屬導線係透過曝光、腐蝕及電鍍等製程形成於該基板1表面,又,一切割線C圍繞該線路部2的大部分區域,沿該切割線C裁切該基板1係可以保留該數個金屬導線排列而成的有效電路區域,並將該基板1在該切割線C之外的區域,連同傳動孔、對位記號、支撐塊及末端線路等無電路功能區域切割排除。The circuit part 2 includes several closely arranged metal wires, which are formed on the surface of the substrate 1 through processes such as exposure, corrosion and electroplating, and a cutting line C surrounds most of the circuit part 2 Cutting the substrate 1 along the cutting line C can retain the effective circuit area formed by the arrangement of the several metal wires, and the area of the substrate 1 outside the cutting line C, together with the transmission holes, alignment marks, Cut and exclude areas without circuit functions such as support blocks and terminal lines.

請參照第2及3圖所示,該識別圖案3位於該切割線C之外的區域,該識別圖案3係由不透光材料形成,該識別圖案3係可以與該數個金屬導線以相同製程一起形成於該基板1表面,則該識別圖案3與該數個金屬導線為相同的金屬導電材料,如此,用於檢測該線路部2的影像感測系統亦能夠偵測到該識別圖案3。如第2圖所示,通過外觀、電性及功能測試的該線路部2,係可以在該線路部2旁邊看到可辨識的該識別圖案3,代表該線路部2可以在接下來的切割封裝製程中,分割成為電路板產品;另外,如第3圖所示,未能通過測試的該線路部2,會由自動化機台在該基板1上沖設一沖孔H,該沖孔H的範圍係包含該線路部2的部分區域及該識別圖案3,則影像感測系統未能偵測到該識別圖案3,可認定該線路部2為不良品而跳過裁切步驟,使有缺陷之該線路部2與切割剩餘之該基板1一起被排除廢棄。Please refer to Figures 2 and 3, the identification pattern 3 is located outside the cutting line C, the identification pattern 3 is formed of an opaque material, and the identification pattern 3 can be the same as the plurality of metal wires. The manufacturing process is formed on the surface of the substrate 1 together, so the identification pattern 3 and the plurality of metal wires are made of the same metal conductive material, so that the image sensing system used to detect the circuit portion 2 can also detect the identification pattern 3 . As shown in Figure 2, after the circuit part 2 has passed the appearance, electrical and functional tests, the recognizable identification pattern 3 can be seen next to the circuit part 2, which means that the circuit part 2 can be cut in the next step. In the packaging process, it is divided into circuit board products; in addition, as shown in Figure 3, for the circuit part 2 that failed the test, a punching hole H will be punched on the substrate 1 by an automated machine, and the punching hole H The range includes the partial area of the circuit part 2 and the identification pattern 3, then the image sensing system fails to detect the identification pattern 3, and it can be determined that the circuit part 2 is a defective product and the cutting step is skipped, so that there are The defective circuit portion 2 is discarded together with the remaining substrate 1 after cutting.

在本實施例中,該識別圖案3係與該沖孔H同樣為長方形,惟,本創作不以該識別圖案3及該沖孔H的形狀為限,其中,該沖孔H之範圍必須涵蓋整個該識別圖案3,以避免影像感測系統偵測到該識別圖案3而誤判不良品為良品;該沖孔H之範圍還可以涵蓋部分之該線路部2,係能夠進一步破壞該線路部2的電性功能,可以避免誤用有缺陷之該線路部2而影響用電安全;又,該識別圖案3與該線路部2之間為電性絕緣,較佳具有一安全間隔距離,以避免針對該線路部2的電性測試結果受到該識別圖案3的金屬導電材質干擾而發生誤判。In this embodiment, the identification pattern 3 is rectangular like the punched hole H, but this creation is not limited to the shape of the identification pattern 3 and the punched hole H, wherein the scope of the punched hole H must cover The entire identification pattern 3 is used to prevent the image sensing system from detecting the identification pattern 3 and misjudging the defective product as a good product; the range of the punching hole H can also cover part of the circuit part 2, which can further damage the circuit part 2 The electrical function can avoid the misuse of the defective circuit part 2 and affect the safety of electricity use; moreover, the identification pattern 3 and the circuit part 2 are electrically insulated, and preferably have a safe distance to avoid The electrical test result of the line part 2 is interfered by the metal conductive material of the identification pattern 3 , which leads to misjudgment.

綜上所述,本創作的具有沖孔識別圖案的軟性電路板,藉由在用於標示報廢電路板的沖孔範圍內形成該識別圖案,係可以使影像感測系統透過是否偵測到該識別圖案,判斷軟性電路板是良品或不良品,若偵測到該識別圖案則代表該軟性電路板的功能正常,若未偵測到該識別圖案則代表該軟性電路板已被沖設該沖孔而報廢,係具有提升自動化辨識的準確率、節省製程時間及避免出貨不良產品等功效。To sum up, the flexible printed circuit board with the punching hole identification pattern of the present invention, by forming the identification pattern within the range of the punching hole used to mark the scrapped circuit board, can make the image sensing system detect whether the Identify the pattern to judge whether the flexible circuit board is a good product or a defective product. If the identification pattern is detected, it means that the function of the flexible circuit board is normal. If the identification pattern is not detected, it means that the flexible circuit board has been punched. Rejection due to holes has the functions of improving the accuracy of automatic identification, saving process time, and avoiding the shipment of defective products.

雖然本創作已利用上述較佳實施例揭示,然其並非用以限定本創作,任何熟習此技藝者在不脫離本創作之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本創作所保護之技術範疇,因此本創作之保護範圍當包含後附之申請專利範圍所記載的文義及均等範圍內之所有變更。Although this creation has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit this creation. Anyone who is familiar with this technology can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall include all changes within the meaning and equivalent scope recorded in the appended scope of patent application.

﹝本創作﹞ 1:基板 2:線路部 3:識別圖案 C:切割線 H:沖孔 ﹝習用﹞ 9:軟性電路板 91:線路區域 92:識別孔 ﹝This creation﹞ 1: Substrate 2: Line department 3: Identify patterns C: cutting line H: punching ﹝used to use﹞ 9: Flexible circuit board 91: Line area 92: Identification hole

[第1圖] 一種習知軟性電路板。 [第2圖] 本創作較佳實施例的電路板配置平面圖。 [第3圖] 如第2圖所示的電路板沖設沖孔情形圖。 [Picture 1] A conventional flexible circuit board. [Fig. 2] It is a plan view of the layout of the circuit board of the preferred embodiment of the invention. [Picture 3] As shown in the 2nd picture, the circuit board is punched and punched.

1:基板 1: Substrate

2:線路部 2: Line Department

3:識別圖案 3: Identify patterns

C:切割線 C: cutting line

Claims (3)

一種具有沖孔識別圖案的軟性電路板,包含: 一基板; 一線路部,位於該基板之表面,一切割線圍繞該線路部之有效電路區域;及 一識別圖案,位於該基板之表面,該識別圖案靠近該線路部且位於該切割線之外的區域,若該線路部具有缺陷,在該基板上沖設一沖孔,該沖孔的範圍涵蓋該線路部的部分區域及該識別圖案。 A flexible printed circuit board with a punching identification pattern, comprising: a substrate; a circuit part located on the surface of the substrate, a dicing line surrounding the effective circuit area of the circuit part; and An identification pattern, located on the surface of the substrate, the identification pattern is close to the circuit part and located in the area outside the cutting line, if the circuit part has a defect, a punching hole is punched on the substrate, and the scope of the punching hole covers A partial area of the line portion and the identification pattern. 如請求項1之具有沖孔識別圖案的軟性電路板,其中,該基板的材料是聚對苯二甲酸乙二酯或聚醯亞胺。According to claim 1, the flexible printed circuit board with punched identification patterns, wherein the material of the substrate is polyethylene terephthalate or polyimide. 如請求項1之具有沖孔識別圖案的軟性電路板,其中,該線路部係包含數個緊密排列的金屬導線,該識別圖案及該數個金屬導線為相同材料,且以相同製程形成。According to claim 1, the flexible printed circuit board with punched identification patterns, wherein the circuit portion includes several closely arranged metal wires, the identification pattern and the plurality of metal wires are made of the same material and formed by the same process.
TW111207857U 2022-07-21 2022-07-21 Flexible circuit board with punching recognition pattern TWM633833U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111207857U TWM633833U (en) 2022-07-21 2022-07-21 Flexible circuit board with punching recognition pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111207857U TWM633833U (en) 2022-07-21 2022-07-21 Flexible circuit board with punching recognition pattern

Publications (1)

Publication Number Publication Date
TWM633833U true TWM633833U (en) 2022-11-01

Family

ID=85784324

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111207857U TWM633833U (en) 2022-07-21 2022-07-21 Flexible circuit board with punching recognition pattern

Country Status (1)

Country Link
TW (1) TWM633833U (en)

Similar Documents

Publication Publication Date Title
JP4757083B2 (en) Wiring circuit board assembly sheet
US7358619B2 (en) Tape carrier for TAB
JP4939583B2 (en) Suspension board assembly sheet with circuit and manufacturing method thereof
JP4640815B2 (en) Wiring circuit board assembly sheet and manufacturing method thereof
JP2007201085A (en) Wiring circuit board assembly sheet
US6756606B2 (en) Apparatus and method for marking defective sections of laminate substrates
CN105472864B (en) Printed circuit board and its manufacturing method with degradation wiring pattern
CN103796417B (en) Circuit board and preparation method thereof
US20100175913A1 (en) Wired circuit board assembly sheet
TWM633833U (en) Flexible circuit board with punching recognition pattern
KR100797690B1 (en) Printed circuit board
JP4319726B2 (en) Non-contact type IC card manufacturing method
JP4922666B2 (en) Printed wiring board manufacturing method and printed wiring board inspection pattern unit
KR100796172B1 (en) Non-contact type single side probe construction
KR20050055991A (en) Printed circuit board where the test coupon of the micro-via is had and the manufacturing method
CN101969738B (en) Coupon board and manufacturing method of printed circuit board
JP3714828B2 (en) Defective method for printed circuit board and mark used for this determination
JP2010192610A (en) Method of manufacturing and method of inspecting base material for printed wiring board having multiple development patterns formed, method of manufacturing and method of inspecting multiple-patterned printed wiring board, method of manufacturing semiconductor device, and exposure mask
TWM589950U (en) Printed circuit board with punch hole alignment mark
JPH09214080A (en) Printed wiring board
KR20180075277A (en) Printed circuit board
KR101004950B1 (en) Circuit board for mounting electronic elements
KR101251852B1 (en) Method for inspecting defect of multiple printed circuit board
TWM586032U (en) Flexible circuit board
CN113777113A (en) Optical detection method of lamp panel and lamp panel manufacturing method