CN115052417A - LED circuit board and electronic device - Google Patents
LED circuit board and electronic device Download PDFInfo
- Publication number
- CN115052417A CN115052417A CN202210961304.9A CN202210961304A CN115052417A CN 115052417 A CN115052417 A CN 115052417A CN 202210961304 A CN202210961304 A CN 202210961304A CN 115052417 A CN115052417 A CN 115052417A
- Authority
- CN
- China
- Prior art keywords
- pixel region
- pole
- pixel
- electrically connected
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 44
- 238000003466 welding Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention relates to an LED circuit board and an electronic device, comprising: the first laminate has at least four pixel areas, and a first plate surface of the first laminate is provided with at least one common A pole bonding pad and a plurality of mutually independent B pole bonding pads corresponding to every two pixel areas, wherein the polarities of an A pole and a B pole are opposite; the second plate surface of the first laminate is provided with at least two public pins and a plurality of independent pins corresponding to every two pixel areas; the common pins are electrically connected with the corresponding common A pole bonding pads, and the independent pins are electrically connected with the corresponding B pole bonding pads. According to the LED circuit board and the electronic device, the number of the common pins on the second board surface is increased, so that the complexity of the layout of the conductive circuits on the circuit board can be reduced, the number of layers of a PCB can be reduced, and the cost of a client side is reduced.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to an LED circuit board and an electronic device.
Background
On the existing market, the product of unifying more is the mainstream scheme in Mini product market, wherein among the correlation technique, four unification lamp pearl schemes occupy the mainstream position in Mini market, and this scheme adopts 8 pin structures, compares traditional single lamp structure, has reduced the circuit board number of piles, but the present minimum number of piles still needs 6 layers PCB to just can satisfy the operation requirement, and PCB's the number of piles is more relatively.
Therefore, there is a need to design a new LED circuit board and electronic device to overcome the above problems.
Disclosure of Invention
The embodiment of the invention provides an LED circuit board and an electronic device, and aims to solve the problem that the use requirement can be met only by 6 layers of PCBs (printed Circuit Board) with the minimum number of layers in a four-in-one lamp bead scheme in the related technology.
In a first aspect, an LED circuit board is provided, which includes: the first laminate has at least four pixel areas, and a first plate surface of the first laminate is provided with at least one common A pole bonding pad and a plurality of mutually independent B pole bonding pads corresponding to every two pixel areas, wherein the polarities of an A pole and a B pole are opposite; the second board surface of the first laminate is provided with at least two public pins and a plurality of independent pins corresponding to every two pixel regions, wherein the second board surface and the first board surface are distributed on two opposite sides of the first laminate; the common pins are electrically connected with the corresponding common A pole bonding pads, and the independent pins are electrically connected with the corresponding B pole bonding pads.
In some embodiments, the common a-pole bonding pad includes two branch a-pole bonding pads, the two branch a-pole bonding pads are respectively and correspondingly disposed in the two pixel regions, and the two branch a-pole bonding pads are electrically connected; the first layer board is provided with a first guide hole corresponding to each branch A pole bonding pad, and two ends of the first guide hole are respectively connected with the branch A pole bonding pad and the corresponding common pin.
In some embodiments, the branch a-pole pad includes a plurality of a-pole pads independent of each other, and the a-pole pads are electrically connected to each other through a metal conductor disposed on the first board surface.
In some embodiments, the first layer board is provided with a second via corresponding to each of the B-pole pads, and one end of the second via is electrically connected to the B-pole pad, and the other end of the second via is electrically connected to the independent pin.
In some embodiments, the at least four pixel regions include a first pixel region, a second pixel region, a third pixel region, and a fourth pixel region, the first pixel region and the second pixel region share one common a-pole pad, the third pixel region and the fourth pixel region share one common a-pole pad; part of independent pins in the first pixel region are electrically connected with the corresponding B-pole bonding pads in the third pixel region; and part of independent pins in the second pixel region are electrically connected with the corresponding B-pole bonding pads in the fourth pixel region.
In some embodiments, the at least four pixel regions include a first pixel region, a second pixel region, a third pixel region, and a fourth pixel region, the first pixel region and the second pixel region share one common a-pole pad, and the third pixel region and the fourth pixel region share one common a-pole pad; part of the B pole welding discs in the first pixel area are electrically connected with corresponding independent pins in the third pixel area; and part of the B pole welding discs in the second pixel area are electrically connected with the corresponding independent pins in the fourth pixel area.
In some embodiments, a first gap region is formed between the first pixel region and the third pixel region, and between the second pixel region and the fourth pixel region; part of the second guide holes are positioned in the first gap area, one end of each second guide hole positioned in the first gap area is electrically connected with the B pole bonding pad in the first pixel area or the third pixel area through a metal conductor, and the other end of each second guide hole is electrically connected with the independent pin in the third pixel area or the first pixel area through a metal conductor; the metal conductor is arranged on the first plate surface or the second plate surface.
In some embodiments, a second gap region is formed between the first pixel region and the second pixel region, and between the third pixel region and the fourth pixel region; part of the second guide holes are positioned in the second gap area, one end of each second guide hole positioned in the second gap area is electrically connected with the B pole bonding pad in the first pixel area through a metal conductor, and is electrically connected with the B pole bonding pad in the third pixel area through the metal conductor, and the other end of each second guide hole is electrically connected with the independent pin in the third pixel area through the metal conductor; the metal conductor is arranged on the first plate surface or the second plate surface.
In some embodiments, the second plate surface is provided with a metal conductor, the metal conductor extends out of at least three connecting portions, one of the connecting portions is connected to the independent pin, and the other two connecting portions are respectively and correspondingly connected to the second vias in the first pixel region and the third pixel region.
In a second aspect, there is provided an electronic device comprising: in the LED circuit board, the public A pole bonding pad of each pixel region of the LED circuit board is fixedly provided with the plurality of LED chips, the A pole of each LED chip is electrically connected with the public A pole bonding pad, and the B pole of each LED chip is electrically connected with the corresponding B pole bonding pad.
The technical scheme provided by the invention has the beneficial effects that:
the embodiment of the invention provides an LED circuit board and an electronic device, wherein at least one public A pole welding disc is arranged on the side of a first board surface corresponding to each two pixel areas, at least two public pins are arranged on the side of a second board surface corresponding to each two pixel areas, the at least two public pins are electrically connected with the public A pole welding disc, one or more public pins with the same definition can be repeatedly etched, so that at least two public pins with the same definition exist in each two pixel areas, the complexity of the layout of conducting circuits on the circuit board can be reduced by increasing the number of the public pins, the reduction of the number of layers of a PCB can be realized, and the cost of a client side is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a front surface of an LED circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the back surface of an LED circuit board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a front surface of another LED circuit board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of the back surface of another LED circuit board according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a front surface of an electronic device according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a front side of another electronic device according to an embodiment of the present invention;
FIG. 7 is a control schematic diagram of an electronic device according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
In the figure:
100. an LED circuit board;
1. a first laminate; 11. a first board surface; 12. a second board surface; 13. a first pixel region; 14. a second pixel region; 15. a third pixel region; 16. a fourth pixel region; 17. a first gap region; 18. a second gap region;
2. a common A-pole pad; 21. a branched A-pole pad; 211. welding points of an A pole;
3. a B-pole bonding pad; 4. a common pin; 5. an independent pin; 6. a first guide hole; 7. a second guide hole; 8. a metal conductor; 81. a connecting portion;
200. an electronic device; 201. a red LED chip; 202. a blue LED chip; 203. a green LED chip; 204. a metal wire.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides an LED circuit board, which can solve the problem that the use requirement can be met only by 6 layers of PCBs (printed Circuit Board) with the least layers in a four-in-one lamp bead scheme in the related technology.
Referring to fig. 1 to 2, an LED circuit board 100 according to an embodiment of the present invention may include: the first layer board 1 is a layer of PCB, the first layer board 1 is provided with at least four pixel areas, the number of the pixel areas can be four or more than four, and a plurality of pixel areas can be arranged in a square array; the first plate surface 11 of the first plate 1 is provided with at least one common a pole pad 2 and a plurality of independent B pole pads 3 corresponding to every two pixel regions, that is, the B pole pads 3 are arranged on the first plate surface 11 at intervals, wherein the polarities of the a pole and the B pole are opposite, the a pole can be a positive pole or a negative pole, and the a pole is preferably set as a negative pole; in addition, the two pixel regions described here may be two adjacent pixel regions, or two pixel regions disposed at an interval, and a total of one common a-pole pad 2 may be disposed in the two pixel regions, or a plurality of common a-pole pads 2 may be disposed in the two pixel regions, in this embodiment, each two pixel regions are preferably disposed with one common a-pole pad 2, that is, the common a-pole pad 2 is a total pad shared by the two pixel regions.
The second plate surface 12 of the first laminate 1 is provided with at least two public pins 4 and a plurality of independent pins 5 corresponding to every two pixel areas; the second board surface 12 and the first board surface 11 are respectively disposed on two opposite sides of the first layer board 1, the first board surface 11 may be a front surface of the first layer board 1, and the second board surface 12 may be a back surface of the first layer board 1, it should be understood that two pixel regions therein may also be adjacent or spaced, and the two pixel regions therein correspond to the two pixel regions where the common a-pole pad 2 is disposed; at least one common pin 4 can be arranged in each pixel region, and the plurality of independent pins 5 arranged on the second plate surface 12 are mutually independent and arranged at intervals and do not influence each other. The common pin 4 is electrically connected with the corresponding common A pole pad 2, and the independent pin 5 is electrically connected with the corresponding B pole pad 3.
When the LED chip is fixed on the circuit board, the A pole of the LED chip can be electrically connected with the common A pole bonding pad 2, and the B pole of the LED chip can be electrically connected with the corresponding B pole bonding pad 3.
In this embodiment, at least one public a-pole pad 2 is disposed on the first board 11 side corresponding to every two pixel regions, at least two public pins 4 are disposed on the second board 12 side corresponding to every two pixel regions, the at least two public pins 4 are electrically connected to the public a-pole pad 2, one or more public pins 4 with the same definition can be etched again, so that at least two public pins 4 with the same definition exist in every two pixel regions, the complexity of the conductive circuit layout on the circuit board can be reduced by increasing the number of the public pins 4, that is, a circuit in which one layer of PCB is connected through upper and lower layers of circuits cannot be used originally, now, the communication can be realized through 2 layers of circuits, further, the reduction of the number of layers of the PCB can be realized, and the cost of a client can be reduced.
The LED circuit board 100 provided in the embodiment of the present invention may further include another second layer board, a third layer board, and a fourth layer board, and 6 layers of PCBs are required to be designed by using 8 pin structures in the related art, and in this embodiment, the number of layers of 2 layers of PCBs may be continuously reduced by increasing the number of the common pins 4 on the back surface, that is, the LED chip of the four-in-one lamp bead may be controlled by using a 4-layer PCB structure (4 layer board).
Referring to fig. 1, in some embodiments, the common a-pole pad 2 may include two branch a-pole pads 21, the two branch a-pole pads 21 are respectively disposed in two of the pixel regions, the two branch a-pole pads 21 are electrically connected, that is, one branch a-pole pad 21 is disposed in each pixel region, and then the branch a-pole pads 21 in the two pixel regions may be electrically connected through a metal wire or a conductive circuit disposed on the first board 11, so that the two branch a-pole pads 21 are connected to form an integral common a-pole pad 2. The first laminate 1 is provided with a first guide hole 6 corresponding to each branch A pole bonding pad 21, the first guide hole 6 can penetrate through the first board surface 11 and the second board surface 12 along the thickness of the first laminate 1, and two ends of the first guide hole 6 are respectively connected with the branch A pole bonding pad 21 and the corresponding common pin 4. The at least four pixel regions may include a first pixel region 13 and a second pixel region 14, the first via 6 in the first pixel region 13 correspondingly connects the branch a-pole pad 21 and the common pin 4 in the first pixel region 13, and the first via 6 in the second pixel region 14 correspondingly connects the branch a-pole pad 21 and the common pin 4 in the second pixel region 14.
In this embodiment, the common a-pole pad 2 is divided into two parts, which are respectively disposed in the two pixel regions, and then electrically connected, so that the area occupied by the common a-pole pad 2 can be reduced, and a space is provided for mounting other components.
Further, referring to fig. 3, the branch a-pole pad 21 may include a plurality of a-pole pads 211 independent of each other, that is, in other embodiments, the branch a-pole pad 21 may be a whole metal sheet, and a plurality of types of branch a-pole pads 21 may be adapted to different types of LED chip structures. The a-pole pads 211 can be electrically connected through the metal conductor 8 disposed on the first board 11. The metal conductor 8 on the first plate surface 11 may be formed on the surface of the first plate surface 11 by exposure, development, and etching.
Referring to fig. 1 to 2, in some alternative embodiments, the first laminate board 1 may be provided with a second via 7 corresponding to each of the B-pole pads 3, where the second via 7 may be disposed opposite to the B-pole pad 3, or may be disposed offset from the B-pole pad 3, that is, may be disposed on one side of the B-pole pad 3; and the second via 7 may penetrate the first plate surface 11 and the second plate surface 12 along the thickness of the first laminate 1. One end of the second via 7 is electrically connected to the B-pole pad 3, and the other end is electrically connected to the independent pin 5. One second via 7 may be electrically connected to one B-pole pad 3 on the first board 11, or may be electrically connected to a plurality of B-pole pads 3, and one second via 7 may be electrically connected to one independent pin 5 on the second board 12. In this embodiment, the second via 7 is disposed to electrically connect the pad and the pin on the two opposite surfaces of the first laminate 1.
Referring to fig. 1, further, the at least four pixel regions may include a first pixel region 13, a second pixel region 14, a third pixel region 15, and a fourth pixel region 16, where the four pixel regions may be arranged in a rectangle, for example, a first row includes the first pixel region 13 and the second pixel region 14 from left to right, and a second row includes the third pixel region 15 and the fourth pixel region 16 from left to right. The first pixel region 13 and the second pixel region 14 share one common a-pole pad 2, and the third pixel region 15 and the fourth pixel region 16 share one common a-pole pad 2; according to the arrangement, the partial independent pins 5 in the first pixel region 13 are electrically connected with the corresponding B-pole bonding pads 3 in the third pixel region 15, so that the independent pins 5 in the first pixel region 13 can be connected to the corresponding B-pole bonding pads 3 in the first pixel region 13 and can also be correspondingly connected to the B-pole bonding pads 3 in the third pixel region 15, one independent pin 5 in the first pixel region 13 can control at least two B-pole bonding pads 3 in the first pixel region 13 and the third pixel region 15, and the control of the required LED chips can be completed under the condition of reducing the number of the pins.
In addition, a part of the independent pins 5 in the second pixel region 14 may be electrically connected to the corresponding B-pole bonding pads 3 in the fourth pixel region 16. With this arrangement, the independent pin 5 in the second pixel region 14 can be connected not only to the corresponding B-pole pad 3 in the second pixel region 14, but also to the B-pole pad 3 in the fourth pixel region 16, so that one independent pin 5 in the second pixel region 14 can control at least two B-pole pads 3 in the second pixel region 14 and the fourth pixel region 16.
Part of the independent pins 5 in the third pixel region 15 may also be electrically connected to the corresponding B-pole bonding pads 3 in the first pixel region 13; part of the independent pins 5 in the fourth pixel region 16 may also be electrically connected to the corresponding B-pole bonding pads 3 in the second pixel region 14.
Referring to fig. 1 to 2, in some alternative embodiments, the at least four pixel regions may include a first pixel region 13, a second pixel region 14, a third pixel region 15, and a fourth pixel region 16, where the first pixel region 13 and the second pixel region 14 share one common a-pole pad 2, and the third pixel region 15 and the fourth pixel region 16 share one common a-pole pad 2; a part of the B-pole bonding pad 3 in the first pixel region 13 is electrically connected with the corresponding independent pin 5 in the third pixel region 15, wherein the B-pole bonding pad 3 can be electrically connected with the independent pin 5 through the second via 7 and the metal conductor 8, and the second via 7 can be arranged right opposite to the B-pole bonding pad 3, that is, directly connected with the B-pole bonding pad 3, or indirectly realize the electrical connection; a part of the B-pole pad 3 in the second pixel region 14 can be electrically connected to the corresponding independent pin 5 in the fourth pixel region 16 through the second via 7 and the metal conductor 8. With the arrangement, the independent pin 5 in one pixel region can be connected with the B-pole bonding pad 3 in two pixel regions, so that the LED chips in the two pixel regions can be controlled under the condition of reducing the number of pins.
Referring to fig. 1 to 2, in some embodiments, a first gap region 17 is formed between the first pixel region 13 and the third pixel region 15 and between the second pixel region 14 and the fourth pixel region 16, that is, the first pixel region 13 is spaced from the third pixel region 15, and the second pixel region 14 is spaced from the fourth pixel region 16; part of the second via holes 7 are located in the first gap region 17, wherein some of the second via holes 7 are located in four pixel regions, and some of the second via holes 7 are located between two adjacent pixel regions; one end of the second via 7 located in the first gap region 17 is electrically connected to the B-pole pad 3 in the first pixel region 13 or the third pixel region 15 through the metal conductor 8, and the other end is electrically connected to the independent pin 5 in the third pixel region 15 or the first pixel region 13 through the metal conductor 8; the metal conductor 8 is provided on the first plate surface 11 or the second plate surface 12. That is to say, in this embodiment, the first board surface 11 and the second board surface 12 may both be provided with the metal conductor 8, and since the second via 7 is disposed at a position between the two pixel areas, when the B-pole pad 3 and the independent pin 5 are both disposed in the corresponding pixel area, the B-pole pad 3 and the independent pin 5 will be separated from the second via 7 by a certain distance, and at this time, another conductor needs to be disposed to achieve electrical connection, in this embodiment, the B-pole pad 3 in the pixel area is connected to the second via 7 through the metal conductor 8 disposed on the first board surface 11, and the independent pin 5 in the pixel area is also connected to the second via 7 through the metal conductor 8 disposed on the second board surface 12, and the metal conductor 8 may be a circuit formed by etching. In the present embodiment, the second via 7 is disposed in the gap region between the two pixel regions, and the free position between the two pixel regions can be fully utilized to electrically connect the B-pole pad 3 and the lead between different pixel regions.
Referring to fig. 3 to 4, further, second gap regions 18 may be formed between the first pixel region 13 and the second pixel region 14, and between the third pixel region 15 and the fourth pixel region 16; a part of the second via 7 is located in the second gap region 18, one end of the second via 7 located in the second gap region 18 is electrically connected to the B-pole pad 3 in the first pixel region 13 through the metal conductor 8, and is electrically connected to the B-pole pad 3 in the third pixel region 15 through the metal conductor 8, that is, one end of the second via 7 can be simultaneously connected to at least two metal conductors 8, so as to be simultaneously connected to the B-pole pads 3 in the first pixel region 13 and the third pixel region 15; the other end of the second via 7 can be electrically connected to the independent pin 5 in the third pixel region 15 through the metal conductor 8, so that the independent pin 5 in the third pixel region 15 can control the LED chips in the first pixel region 13 and the third pixel region 15; the metal conductor 8 is provided on the first plate surface 11 or the second plate surface 12.
On the basis of the above technical solution, referring to fig. 4, the independent pin 5 in one first pixel region 13 can also be simultaneously connected to two second vias 7 through the metal conductor 8, and further connected to the B-pole pad 3 in the first pixel region 13 and the B-pole pad 3 in the third pixel region 15 through the two second vias 7; the independent pin 5 in the fourth pixel region 16 can also be connected to two second vias 7 through the metal conductor 8, and further connected to the B-pole pad 3 in the second pixel region 14 and the B-pole pad 3 in the fourth pixel region 16 through the two second vias 7.
Referring to fig. 1 to 2, in some alternative embodiments, the second plate surface 12 is provided with a metal conductor 8, the metal conductor 8 extends out of at least three connecting portions 81, one of the connecting portions 81 is connected to the independent pin 5, and the other two connecting portions 81 are correspondingly connected to the second vias 7 in the first pixel region 13 and the third pixel region 15, respectively, so that the independent pin 5 is correspondingly connected to the B-pole pad 3 in the two pixel regions through the second vias 7 in the two pixel regions. In this embodiment, the chip in different pixel regions can be controlled by one independent pin 5 by disposing a special metal conductor 8 structure on the second board surface 12 in combination with the second via 7. In this embodiment, when the first laminate 1 is provided with four pixel regions and three B-pole pads 3 are provided in each pixel region, 12 different chips can be individually controlled by 10 pins by providing unique metal conductor 8 circuit structures on the first board surface 11 and the second board surface 12 in combination with a display principle (i.e., using a dynamic scanning control method).
Referring to fig. 7, a control schematic diagram according to an embodiment of the present invention is shown, where B1 denotes a first pixel region blue LED chip 202, R1 denotes a first pixel region red LED chip 201, and G1 denotes a first pixel region green LED chip 203; b2 denotes the second pixel region blue LED chip 202, R2 denotes the second pixel region red LED chip 201, G2 denotes the second pixel region green LED chip 203; b3 denotes a third pixel region blue LED chip 202, R3 denotes a third pixel region red LED chip 201, G3 denotes a third pixel region green LED chip 203; b4 denotes a fourth pixel region blue LED chip 202, R4 denotes a fourth pixel region red LED chip 201, G4 denotes a fourth pixel region green LED chip 203; c12 denotes a common pin 4 of the first and second pixel regions, R13 denotes individual pins 5 of the first and third pixel region red LED chips 201 and 201, B24 denotes individual pins 5 of the second and fourth pixel region blue LED chips 202 and 202, G24 denotes individual pins 5 of the second and fourth pixel region green LED chips 203 and 203, R24 denotes individual pins 5 of the second and fourth pixel region red LED chips 201 and 201, G13 denotes individual pins 5 of the first and third pixel region green LED chips 203 and 203, B13 denotes individual pins 5 of the first and third pixel region blue LED chips 202 and 202, and C34 denotes a common pin 4 of the third and fourth pixel regions.
In order to save the number of control pins, the common poles of the same row are connected together, and the non-common poles of the same column are connected together, so that the control of the LED chip can be realized under the condition of reducing the number of pins.
Referring to fig. 5 to 6 and 8, an embodiment of the present invention further provides an electronic device 200, which may include: the LED circuit board 100 provided in any of the above embodiments, that is, when the electronic device 200 is manufactured, the LED circuit board 100 may be used; public A utmost point pad 2 in every pixel region of LED circuit board 100 all sets firmly a plurality of LED chips, the A utmost point of LED chip with public A utmost point pad 2 electric connection, the B utmost point of LED chip with correspond 3 electric connection of B utmost point pad. Three LED chips, such as a red LED chip 201, a blue LED chip 202, and a green LED chip 203, may be disposed in each pixel region, and of course, LED chips with more colors or LED chips with three other colors may also be disposed according to requirements.
Further, referring to fig. 5, the common a-pole pad 2 may include two branch a-pole pads 21, the two branch a-pole pads 21 are correspondingly disposed in the two pixel regions, and the two branch a-pole pads 21 are electrically connected; when the branch a pole bonding pad 21 is a whole piece of bonding pad, three types of LED chips can be fixedly arranged on the branch a pole bonding pad 21, wherein in the forward mounting structure, the red LED chip 201 is in a vertical structure, the electrodes are distributed on the top surface and the bottom surface, the top surface is an anode, the bottom surface is a cathode, the cathode is generally connected with the branch a pole bonding pad 21 through conductive adhesive, and the anode is connected to the corresponding B pole bonding pad 3 through a metal wire 204; the blue LED chip 202 and the green LED chip 203 are both in a horizontal structure, and the electrodes thereof are distributed on both sides of the top surface, and generally the positive and negative electrodes are connected to the corresponding pads in the manner of metal wires 204.
Referring to fig. 6, in some embodiments, when the positive and negative electrodes of the three LED chips are distributed on the left and right sides, a branch a-pole pad 21 having a plurality of mutually independent a-pole pads 211 may be used, at this time, the plurality of a-pole pads 211 correspond to the plurality of B-pole pads 3 one by one, and the three LED chips may be electrically connected to the a-pole pads 211 and the B-pole pads 3 respectively by using a conductive adhesive.
Further, when manufacturing the electronic device 200, a hot-pressed BT copper-clad substrate may be prepared first, wherein the BT copper-clad substrate is internally provided with a black BT material, and the upper layer and the lower layer of the black BT material are copper layers; then, the BT copper-clad substrate is subjected to etching, drilling, copper plating, circuit forming, ink covering and other processes to complete the manufacture of the LED circuit board 100; and then carrying out die bonding/wire bonding operation on the LED circuit board 100 to fix the LED chip on the LED circuit board 100, thereby forming the electronic device 200.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An LED wiring board, characterized in that it comprises:
the first laminate (1) is provided with at least four pixel areas, the first surface (11) of the first laminate (1) is provided with at least one common A pole bonding pad (2) and a plurality of mutually independent B pole bonding pads (3) corresponding to every two pixel areas, and the polarities of the A pole and the B pole are opposite;
the second board surface (12) of the first laminate (1) is provided with at least two public pins (4) and a plurality of independent pins (5) corresponding to every two pixel regions, wherein the second board surface (12) and the first board surface (11) are distributed on two opposite sides of the first laminate (1);
the common pin (4) is electrically connected with the corresponding common A pole bonding pad (2), and the independent pin (5) is electrically connected with the corresponding B pole bonding pad (3).
2. The LED wiring board of claim 1, wherein:
the common A pole bonding pad (2) comprises two branch A pole bonding pads (21), the two branch A pole bonding pads (21) are respectively and correspondingly arranged in the two pixel areas, and the two branch A pole bonding pads (21) are electrically connected;
the first laminate (1) is provided with a first guide hole (6) corresponding to each branch A pole bonding pad (21), and two ends of the first guide hole (6) are respectively connected with the branch A pole bonding pad (21) and the corresponding common pin (4).
3. The LED circuit board of claim 2, wherein:
the branch A pole welding pad (21) comprises a plurality of A pole welding spots (211) which are independent of each other, and the A pole welding spots (211) are electrically conducted through a metal conductor (8) arranged on the first board surface (11).
4. The LED circuit board of claim 1, wherein:
the first laminate (1) is provided with a second guide hole (7) corresponding to each B pole bonding pad (3), one end of each second guide hole (7) is electrically connected with the B pole bonding pad (3), and the other end of each second guide hole is electrically connected with the independent pin (5).
5. The LED wiring board of claim 4, wherein:
the at least four pixel regions include a first pixel region (13), a second pixel region (14), a third pixel region (15), and a fourth pixel region (16), the first pixel region (13) and the second pixel region (14) share one common A-pole pad (2), and the third pixel region (15) and the fourth pixel region (16) share one common A-pole pad (2);
part of independent pins (5) in the first pixel region (13) are electrically connected with corresponding B-pole bonding pads (3) in the third pixel region (15);
and part of independent pins (5) in the second pixel region (14) are electrically connected with corresponding B-pole bonding pads (3) in the fourth pixel region (16).
6. The LED wiring board of claim 4 or 5, wherein:
the at least four pixel regions include a first pixel region (13), a second pixel region (14), a third pixel region (15), and a fourth pixel region (16), the first pixel region (13) and the second pixel region (14) share one common A-pole pad (2), the third pixel region (15) and the fourth pixel region (16) share one common A-pole pad (2);
a part of the B pole bonding pad (3) in the first pixel region (13) is electrically connected with the corresponding independent pin (5) in the third pixel region (15);
and part of the B pole bonding pad (3) in the second pixel region (14) is electrically connected with the corresponding independent pin (5) in the fourth pixel region (16).
7. The LED wiring board of claim 5, wherein:
a first gap region (17) is formed between the first pixel region (13) and the third pixel region (15), and between the second pixel region (14) and the fourth pixel region (16);
part of the second guide hole (7) is positioned in the first gap area (17), one end of the second guide hole (7) positioned in the first gap area (17) is electrically connected with the first pixel area (13) or the B pole bonding pad (3) in the third pixel area (15) through a metal conductor (8), and the other end of the second guide hole is electrically connected with the third pixel area (15) or the independent pin (5) in the first pixel area (13) through the metal conductor (8);
wherein the metal conductor (8) is provided on the first plate surface (11) or the second plate surface (12).
8. The LED wiring board of claim 5, wherein:
a second gap region (18) is formed between the first pixel region (13) and the second pixel region (14), and between the third pixel region (15) and the fourth pixel region (16);
a part of the second via hole (7) is positioned in the second gap area (18), one end of the second via hole (7) positioned in the second gap area (18) is electrically connected with the B pole bonding pad (3) in the first pixel area (13) through a metal conductor (8), and is electrically connected with the B pole bonding pad (3) in the third pixel area (15) through the metal conductor (8), and the other end of the second via hole is electrically connected with the independent pin (5) in the third pixel area (15) through the metal conductor (8);
wherein the metal conductor (8) is provided on the first plate surface (11) or the second plate surface (12).
9. The LED wiring board of claim 5, wherein:
the second plate surface (12) is provided with a metal conductor (8), at least three connecting parts (81) extend from the metal conductor (8), one of the connecting parts (81) is connected with the independent pin (5), and the other two connecting parts (81) are respectively and correspondingly connected to the second guide holes (7) in the first pixel area (13) and the third pixel area (15).
10. An electronic device, characterized in that it comprises: made of the LED circuit board of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210961304.9A CN115052417A (en) | 2022-08-11 | 2022-08-11 | LED circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210961304.9A CN115052417A (en) | 2022-08-11 | 2022-08-11 | LED circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115052417A true CN115052417A (en) | 2022-09-13 |
Family
ID=83166556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210961304.9A Pending CN115052417A (en) | 2022-08-11 | 2022-08-11 | LED circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115052417A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598071A (en) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | A kind of three-primary color LED module device of TOP structures and preparation method thereof |
| CN109147584A (en) * | 2018-08-10 | 2019-01-04 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN111430342A (en) * | 2019-11-27 | 2020-07-17 | 浙江英特来光电科技有限公司 | 8-in-1 full-color SMD L ED |
| US20220029077A1 (en) * | 2020-07-27 | 2022-01-27 | Oki Electric Industry Co., Ltd. | Light-emitting device, light-emitting display, and image display device |
-
2022
- 2022-08-11 CN CN202210961304.9A patent/CN115052417A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598071A (en) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | A kind of three-primary color LED module device of TOP structures and preparation method thereof |
| CN109147584A (en) * | 2018-08-10 | 2019-01-04 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN111430342A (en) * | 2019-11-27 | 2020-07-17 | 浙江英特来光电科技有限公司 | 8-in-1 full-color SMD L ED |
| US20220029077A1 (en) * | 2020-07-27 | 2022-01-27 | Oki Electric Industry Co., Ltd. | Light-emitting device, light-emitting display, and image display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109147584B (en) | LED display unit group and display panel | |
| CN112242476B (en) | LED display unit group and display panel | |
| CN109461386B (en) | Display device | |
| CN109411455B (en) | LED display unit group and display panel | |
| US9730328B2 (en) | Printed circuit board with embedded component and method for manufacturing same | |
| US20230155092A1 (en) | Led display unit group and display panel | |
| CN108575044A (en) | Printed circuit board and its component | |
| CN111430339A (en) | L ED display unit group and display panel | |
| CN113571627A (en) | Circuit board of LED display unit | |
| CN115052417A (en) | LED circuit board and electronic device | |
| CN113937204B (en) | LED display module assembly and display device | |
| CN108987558B (en) | LED support integrated board | |
| CN216213439U (en) | Full-color LED display unit and LED circuit board | |
| CN218160373U (en) | LED lamp bead and transparent LED display screen | |
| CN213635308U (en) | Display panel and pixel packaging structure | |
| US11450795B2 (en) | Light-emitting module and surface-emitting light source including a plurality of wiring formations between two terminals | |
| CN112054043B (en) | Display panel and preparation method thereof | |
| US20020158261A1 (en) | Light emitting diode layout structure | |
| CN212967695U (en) | LED display module | |
| CN216054777U (en) | LED light-emitting device, display module and display equipment | |
| CN216120334U (en) | LED lamp bead | |
| CN220585250U (en) | Micro-spacing laminated integrated packaging LED | |
| JP3675358B2 (en) | Display body and method of manufacturing printed wiring board used therefor | |
| CN220272087U (en) | Unilateral line-outgoing Mini-LED board | |
| CN215008265U (en) | LED packaging assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220913 |