CN212967695U - LED display module - Google Patents

Abstract

The application discloses LED display module assembly. The display module comprises a plurality of groups of flip chip groups and a circuit board, wherein the groups of flip chip groups are attached to one side of the circuit board, the circuit board comprises a four-layer structure, each flip chip group comprises a first chip, a second chip and a third chip, the positive/negative ends of the first chip, the second chip and the third chip are respectively and electrically connected with a connecting end configured on the circuit board, the connecting ends are respectively connected to a second wiring layer and a third wiring layer through a conductive part, and the circuits on the second wiring layer and the third wiring layer are connected with pins of a fourth wiring layer through the conductive parts. Through the design, the circuit layout of the first wiring layer is simplified, and circuits welded with a chip are reduced, so that the smaller size is realized, and the circuit short circuit caused by the problems of solder paste splashing and the like possibly occurring in the production process is reduced due to the extremely simple circuit of the first wiring layer.

Description

LED display module

Technical Field

The application relates to a display module assembly, specifically relates to a LED display module assembly.

Background

Along with the continuous development of four unification type LED display module assembly techniques, surpassed traditional single RGB display lamp pearl in pasting dress efficiency and reliability, along with display pixel is higher and higher, the pixel interval constantly reduces, and the product size is also littleer and more. At present, when the dot pitch of the four-in-one display module reaches P0.7 and below, the size of the module is reduced to 1mm and 1mm, the requirement on the mounting precision of the SMT patch equipment is also increased, and if the dot pitch of the module is continuously reduced, the SMT equipment needs to be upgraded and replaced; secondly, the pin density on the lamp plate (circuit board) of module, the circuit on the lamp plate is denser like this, causes lamp plate design difficulty and is with high costs apart from improving the booth.

Therefore, the structure of the display module needs to be improved to reduce the design difficulty of the lamp panel and improve the production cost.

SUMMERY OF THE UTILITY MODEL

For overcoming above-mentioned shortcoming, the utility model aims at providing a display module assembly, its structure through to the module improves, has realized the display module assembly of super small interval.

In order to achieve the purpose, the following technical scheme is adopted in the application:

a display module, comprising: the circuit board comprises a first wiring layer, a second wiring layer, a third wiring layer and a fourth wiring layer which are sequentially stacked and electrically connected, a bonding pad area is configured on one side surface of the first wiring layer, the bonding pad area is matched for bonding the chip group, each chip group comprises a first chip, a second chip and a third chip, each bonding pad area comprises a first bonding pad area, a second bonding pad area and a third bonding pad area, the first bonding pad area, the second bonding pad area and the third bonding pad area are respectively used for matching the first chip, the second chip and the third chip,

and a side surface of the fourth wiring layer opposite to the pad region is provided with a pin. Through the design, the circuit of the first layer to be welded with the chip is simplified, so that the circuit is greatly simplified, the smaller size is realized, and the short circuit of the circuit caused by the problems of solder paste splashing and the like possibly occurring in the production process is reduced.

In a preferred embodiment, the positive terminals and the negative terminals of the first chip, the second chip and the third chip are respectively connected to the connection terminals preset on the circuit in the first wiring layer; the connecting end is connected to the second wiring layer and the third wiring layer through the copper column or the conducting layer, and the circuits of the second wiring layer and the third wiring layer are connected with the fourth wiring layer through the copper column.

In a preferred embodiment, the side of the fourth wiring layer opposite to the pad region is used for arranging pins only.

In a preferred embodiment, the chip set is a flip chip set, and the first chip, the second chip and the third chip are flip chips respectively.

In a preferred embodiment, a resin protection layer with a matte surface is disposed on the chip set. Due to the design, the surface of the resin protective layer has a matte effect, and high contrast of a display effect is realized when the chip set works (is lightened).

In a preferred embodiment, the display module comprises 16 chip sets, which are arranged in an array of 4 rows and 4 columns, and each chip set comprises a red chip, a green chip and a blue chip.

In a preferred embodiment, the anodes of each row of the red light chips, the green light chips and the blue light chips of the display module are electrically connected in series.

In a preferred embodiment, the circuit board is a printed circuit board or a flexible circuit board.

Has the advantages that:

the display module assembly that this application provided has reduced the subsides dress degree of difficulty of booth apart from the module, has promoted product reliability, has reduced manufacturing cost.

The display module that this application provided simplifies the circuit layout of first wiring layer, reduces with chip welded circuit to realized littleer size, compare with four unification LED display module with circuit arrangement in the first layer, need the further miniaturization that sufficient space wiring can't realize the material. In addition, the short circuit of the circuit caused by the problems of solder paste splashing and the like which possibly occur in the production process is reduced through the extremely simple circuit of the first wiring layer.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

fig. 1 is an equivalent schematic diagram of an LED display module according to an embodiment of the present application;

fig. 2 is an exploded schematic view of first to fourth layers of an LED display module according to an embodiment of the present disclosure;

fig. 3 is a wiring diagram of the first wiring layer in fig. 2.

Fig. 4 is a schematic diagram of a lead of the fourth wiring layer in fig. 2.

Fig. 5 is a wiring diagram of the first wiring layer of the variation of fig. 2.

Detailed Description

The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions employed in the examples may be further adjusted as determined by the particular manufacturer, and the conditions not specified are typically those used in routine experimentation.

The application provides an LED display module, which comprises a plurality of sets of chip sets and a matched circuit board, the chip group is attached to one side of the circuit board, the chip group is preferably a flip chip, the circuit board comprises a first wiring layer, a second wiring layer, a third wiring layer and a fourth wiring layer which are sequentially arranged, the first wiring layer, the second wiring layer, the third wiring layer and the fourth wiring layer are electrically connected, each chip set comprises a first chip, a second chip and a third chip, the positive/negative terminals of the first, second and third chips are electrically connected to a connection terminal (PAD) of a first wiring layer disposed on the circuit board, the connecting end is respectively connected to the second wiring layer and the third wiring layer through copper pillars, and the circuits on the second wiring layer and the third wiring layer are connected to the fourth wiring layer through copper pillars and are electrically connected with pins on the fourth wiring layer. Through such design, simplify the circuit layout of first wiring layer, reduce with the circuit of chip bonding to realized littleer size, compare with four unification LED display module with circuit arrangement in same layer, need sufficient space wiring like this and can't realize further miniaturization of material, the implementation mode that this application disclosed realizes extremely simple circuit at first wiring layer, has reduced the circuit short circuit that the tin cream scheduling problem that probably appears splashes in the production process caused like this.

The LED display module set forth in the present application is described in detail below with reference to the accompanying drawings. The following description will take an example in which the display module includes 16 sets of chip sets (also referred to as 16 in 1).

Fig. 1 is an equivalent schematic diagram of an LED display module according to an embodiment of the present invention, where the LED display module includes 16 chip sets, each chip set includes a first chip Ri, a second chip Gi, and a third chip Bi (i is between 1 to 16), where the 16 chip sets are configured into an array of 4 rows × 4 columns, in this embodiment, the C1/C2/C3/C4 end is four common cathode (anode) ports, R1 represents an anode (cathode) input port (electrode) after anodes of red light chips in a first column are connected in series, and similar R2/R3/R4 are anode (cathode) input ports after anodes (cathodes) of red light chips in a corresponding column are connected in series, respectively; similarly, the ends G1/G2/G3/G4 respectively represent the ports of the green chips corresponding to the anode (cathode) of the row connected in series; similarly, B1/B2/B3/B4 represents the port of the corresponding row of blue chips after the anodes (cathodes) are connected in series; in this embodiment, the cathode terminals of the first chip, the second chip and the third chip of each row of the chip sets are electrically connected to form a common cathode terminal.

When the LED display module works, the common electrode is electrically connected with the C1 end, the positive electrode (negative electrode) is electrically connected with the R1, and the corresponding first red light chip is lightened, and the positive electrode (negative electrode) is electrically connected with the R2, and the corresponding second red light chip is lightened; by analogy, the 16 th red light chip is lightened when the C4/R4 is respectively and electrically connected with the anode and the cathode; similarly, the electrodes of the G/B two color light chips respectively illuminate all 16 RGB chip sets in turn when the C electrodes are simultaneously turned on. In the embodiment, the wiring of the 16 chip groups is optimized, namely the positive electrode or the negative electrode of each row or each column of lamp beads is connected in series, so that the number of pins of the module is reduced when the wiring is configured on the circuit board (in the embodiment, the number of pins can be reduced to 16), and the design requirement on the circuit board is simplified. In addition, in the embodiment, the fourth wiring layer is only used for configuring the pin layer, so that the short circuit possibility generated when the fourth wiring layer is welded with the circuit board is reduced. In one embodiment, the first chip is a red chip, the second chip is a green chip, and the third chip is a blue chip. In another embodiment, when the display module is applied, a resin protective layer with a matte effect on the surface is arranged on the chip set. Due to the design, the surface of the resin protective layer has a matte effect, and high contrast of a display effect is realized when the chip set works (is lightened).

The display module of the above embodiment is also applicable to a combination of a greater or lesser number of chip sets, and is not limited to 16 RGB chips; as applicable to combinations of groups 2 and above RGB chip sets.

Next, the structure of the LED display module (abbreviated as display module) according to an embodiment of the present disclosure is described with reference to fig. 2-4, and fig. 2 is an exploded schematic view of the first to fourth layers of the display module according to an embodiment of the present disclosure; the display module 100 includes a plurality of groups of chip sets 200 and a matched circuit board, the circuit board includes a first wiring layer 110, a second wiring layer 120, a third wiring layer 130 and a fourth wiring layer 140 stacked in sequence, wherein a plurality of pad regions 111 for bonding the chip sets are configured on one side surface of the first wiring layer 110, the bonding chip sets 200 matched with the pad regions 111, each chip set 200 includes a first chip 201, a second chip 202 and a third chip 203, each pad region 111 includes a first pad region 111a, a second pad region 111b, a third pad region 111c, the first pad region 111a, the second pad region 111b and the third pad region 111c for matching the first chip, the second chip and the third chip, respectively. In this embodiment, the positive/negative terminals of the first chip, the second chip, and the third chip are respectively connected to the conductive PAD on the line in the first wiring layer; the PAD is connected to the second and/or third wiring layers through copper pillars (not shown), and the lines of the second and third wiring layers are connected to the fourth wiring layer through copper pillars. Preferably, the fourth wiring layer 140 is used to arrange only the connection terminals (also called pins) 141 (see fig. 4), sometimes called the bottom layer, and the pins are arranged on the side of the fourth wiring layer opposite to the pad region. The second wiring layer 120 is provided with a wiring 121 and a conductive PAD122, and the third wiring layer 130 is provided with a wiring 131 and a conductive PAD 132. Such design has simplified the circuit that first wiring layer need with the chip welding, thereby has simplified the circuit design and has realized littleer module size, compare with four unification LED display module with the circuit arrangement at first wiring layer, need sufficient space wiring can't realize the further miniaturization of material, this embodiment has reduced the circuit short circuit that the tin cream scheduling problem that probably appears splashes and causes in the production process through the very simple circuit design at first wiring layer. In this embodiment, the circuit board is configured to contain four layers of circuits (four layers of wiring), simplifies the circuits of the first layer to be welded with the chip, greatly simplifies the circuits, and realizes smaller size, compared with the wiring mode of the current four-in-one LED display module: the wiring is arranged entirely in the first layer, so that sufficient space is required for wiring, resulting in failure to realize a miniaturized module. In addition, by arranging the extremely simple circuit on the first layer, the short circuit of the circuit caused by the problems of solder paste splashing and the like which possibly occur in the production process is reduced. In one embodiment, the chip set is a flip chip set, and the first chip, the second chip and the third chip are flip chips.

As a modification of the embodiment of fig. 2, in actual mass production, a plurality of display modules of the above-described embodiment are arranged on the same circuit board (as shown in fig. 5, 4 first wiring layers are arranged on the circuit board), so that the economic efficiency of the display modules is improved.

The display module of the above embodiment:

in the design of the circuit board, the board comprises a first wiring layer, a second wiring layer, a third wiring layer and a fourth wiring layer which are sequentially stacked (arranged), and the first wiring layer, the second wiring layer, the third wiring layer and the fourth wiring layer are electrically connected. A very simple circuit is realized on the first wiring layer, so that the circuit short circuit caused by the problems of solder paste splashing and the like possibly occurring in the production process is reduced. The fourth wiring layer is only used for configuring connecting ends, also called pins, so that the space between the pins is optimized.

In the design of the chip group, the chip group comprises a plurality of groups of chip groups, each group of chip groups comprises a first chip, a second chip and a third chip, the positive electrode end/negative electrode end of the first chip, the second chip and the third chip are respectively and electrically connected with a connecting end (PAD) of a first wiring layer arranged on a circuit board, the connecting ends are connected to a second wiring layer and a third wiring layer through a conductive part, and lines on the second wiring layer and the third wiring layer are connected to a fourth wiring layer through the conductive part (such as a copper column or a copper line) and are electrically connected with pins on the fourth wiring layer. Through the design, the circuit layout of the first wiring layer is simplified, the circuit welded with the chip is reduced, and therefore the smaller size is achieved.

In other embodiments, the display module includes 32 flip chip sets, 64 flip chip sets, and the like. The circuit board may be a PCB (printed circuit board) or an FPC (flexible circuit board/flexible circuit board).

It should be noted that in the present application, the terms "upper", "lower", "inner", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

The above-mentioned embodiments are merely illustrative of the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present application and to implement the present application, and not to limit the scope of the present application. All equivalent changes and modifications made according to the spirit of the present application are intended to be covered by the scope of the present invention.

Claims (8)

1. A display module, comprising:

a plurality of sets of chip sets and a matched circuit board,

the circuit board comprises a first wiring layer, a second wiring layer, a third wiring layer and a fourth wiring layer which are sequentially laminated and electrically connected,

a pad region is provided on one side of the first wiring layer,

the pad regions match to bond the chipset,

the chip group comprises a first chip, a second chip and a third chip,

the pad region comprises a first pad region, a second pad region and a third pad region, the first pad region, the second pad region and the third pad region are respectively used for matching with the first chip, the second chip and the third chip,

and a side surface of the fourth wiring layer opposite to the pad region is provided with a pin.

2. The display module of claim 1,

the positive terminals and the negative terminals of the first chip, the second chip and the third chip are respectively bound with the preset connecting terminals on the circuit in the first wiring layer to be connected;

the connecting end is connected to the second wiring layer and the third wiring layer through the copper column or the conducting layer, and the circuits of the second wiring layer and the third wiring layer are connected with the fourth wiring layer through the copper column.

3. The display module according to claim 2, wherein a side of the fourth wiring layer opposite to the pad region is configured with only pins.

4. The display module of claim 1, wherein the chip set is a flip chip set, and the first chip, the second chip, and the third chip are flip chips, respectively.

5. The display module as claimed in claim 4, wherein the chip set is configured with a resin protection layer with a matte surface.

6. The display module of claim 1, comprising 16 chip sets arranged in an array of 4 rows and 4 columns, each chip set comprising a red chip, a green chip, and a blue chip.

7. The display module of claim 6, wherein the anodes of each row of red, green and blue dies are electrically connected in series.

8. The display module of claim 1, wherein the circuit board is a printed circuit board or a flexible circuit board.

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