CN113937204B - LED display module assembly and display device - Google Patents

LED display module assembly and display device Download PDF

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Publication number
CN113937204B
CN113937204B CN202111192853.6A CN202111192853A CN113937204B CN 113937204 B CN113937204 B CN 113937204B CN 202111192853 A CN202111192853 A CN 202111192853A CN 113937204 B CN113937204 B CN 113937204B
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China
Prior art keywords
led display
pole
display unit
pin
row
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CN113937204A (en
Inventor
王军永
陈红文
秦快
郭恒
赵强
蔡彬
李年谱
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Foshan NationStar Optoelectronics Co Ltd
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Foshan NationStar Optoelectronics Co Ltd
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Priority to CN202111192853.6A priority Critical patent/CN113937204B/en
Publication of CN113937204A publication Critical patent/CN113937204A/en
Priority to US17/936,645 priority patent/US20230111103A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses an LED display module and display equipment, wherein the LED display module comprises a plurality of LED display units and a circuit board which are arranged in an array, each LED display unit comprises m rows and n columns of pixel units, each pixel unit comprises a plurality of LED light emitting chips with different light emitting colors, the LED display units are arranged on the circuit board, the circuit board is provided with a circuit layer close to the surface of each LED display unit, the circuit layer comprises a plurality of first wiring lines and second wiring lines, the first wiring lines extend along the row direction, the second wiring lines extend along the column direction, the first wiring lines and the second wiring lines are not mutually intersected, in each row of LED display units, the electrode A of each LED light emitting chip is electrically connected with the electrode A of the pixel unit in the ith row of the previous LED display unit and the pixel unit in the jth row of the next LED display unit, and the electrode B of each LED light emitting chip with the same color is electrically connected with the electrode B of the LED light emitting chip in the jth row of the next LED display unit through the second wiring lines.

Description

LED display module assembly and display device
Technical Field
The invention relates to the technical field of LED display equipment, in particular to an LED display module and display equipment.
Background
The LED display screen has the advantages of high gray scale, large visual angle, small power consumption, customizable screen shape and the like, and is widely applied to various fields of industry, traffic, commercial advertisement, information release and the like.
The LED display screen is composed of a plurality of independent LED light emitting devices which are arranged in an array, in addition, LED display units which are formed by combining a plurality of LED light emitting devices into a plurality of groups are also arranged on the market, cathodes of all LED light emitting chips in the same row of LED light emitting devices are connected with a cathode pin corresponding to the row of LED light emitting devices, and anodes of LED light emitting chips with the same light emitting color in the same row of LED light emitting devices are connected with a corresponding anode pin. When the display module is formed, pins of a plurality of LED display units are required to be welded on a circuit board, cathode pins of two adjacent LED display units in each row are electrically connected through wiring in the circuit board, and anode pins corresponding to light emitting chips with the same light emitting color in two adjacent LED display units in each column are electrically connected.
The first wiring connected with the cathode pin in the circuit board extends along the row direction, the second wiring connected with the anode pin extends along the column direction, and if the first wiring and the second wiring are positioned on the same layer, the first wiring and the second wiring are crossed, so that the circuit is shorted. In order to avoid the shorting problem caused by the routing intersection, the first wiring and the second wiring need to be designed on different layers of the circuit board, and the design of the multi-layer wiring increases the manufacturing cost of the circuit board.
Disclosure of Invention
The embodiment of the invention provides an LED display module and display equipment, which can simplify the design of a circuit board and reduce the manufacturing cost of the circuit board.
In a first aspect, an embodiment of the present invention provides an LED display module, including:
the LED display units are arranged in an array, each LED display unit comprises m rows and n columns of pixel units, each pixel unit comprises a plurality of LED light emitting chips with different light emitting colors, each LED light emitting chip is provided with an electrode A and an electrode B with opposite polarities, and m and n are positive integers which are larger than or equal to 1;
the LED display unit comprises a circuit board, wherein the LED display unit is arranged on the circuit board, a circuit layer is arranged on the surface, close to the LED display unit, of the circuit board, the circuit layer comprises a plurality of first wires and second wires, the first wires extend along the row direction, the second wires extend along the column direction, and the first wires and the second wires are not crossed with each other;
in each row of the LED display units, in the ith row of pixel units of the former LED display unit and in the ith row of pixel units of the latter LED display unit, an electrode A of the LED light-emitting chip is electrically connected through the first wiring;
In each column of the LED display units, the electrode B of the LED light emitting chip with the same color in the pixel unit in the j column of the former LED display unit and the pixel unit in the j column of the latter LED display unit are electrically connected through the second wiring;
wherein i is more than or equal to 1 and less than or equal to m, j is more than or equal to 1 and less than or equal to n, i and j are positive integers.
Optionally, the LED display unit further includes a substrate, the substrate has a pin layer electrically connected to the pixel unit, the pixel unit and the pin layer are respectively disposed on two sides of the substrate, and the pin layer includes a plurality of a-pole pins;
each row of pixel units of the LED display unit is correspondingly provided with at least two A pole pins, each at least two A pole pins comprises a first A pole pin and a second A pole pin, the first A pole pins and the second A pole pins are arranged along the row direction, and the first A pole pins and the second A pole pins are electrically connected;
in each row of pixel units of the LED display unit, an electrode A of the LED light-emitting chip is electrically connected with the corresponding first electrode A pin and the corresponding second electrode A pin of the row of pixel units;
in each row of the LED display units, a second A pole pin corresponding to the ith row of pixel units in the former LED display unit is electrically connected with a first A pole pin corresponding to the ith row of pixel units in the latter LED display unit through the first wiring.
Optionally, the pin layer further includes a plurality of B-pole pins, and the B-pole pins include a first B-pole pin;
each column of pixel units of the LED display unit is correspondingly provided with the first B-pole pins, the quantity of which is the same as that of LED luminous chips in the pixel units;
in each column of the pixel units of the LED display unit, the B electrode of the LED light-emitting chip with the same light-emitting color is electrically connected with one first B electrode pin corresponding to the column of the pixel units;
in each row of the LED display units, the j-th row of pixel units in the former LED display unit and the j-th row of pixel units in the latter LED display unit are electrically connected through the second wiring, and the first B-pole pins corresponding to the LED light emitting chips with the same light emitting color are arranged on the first B-pole pins.
Optionally, each row of pixel units in the LED display unit is correspondingly provided with two a-pole pins, and the two a-pole pins are the first a-pole pin and the second a-pole pin respectively;
in each row of pixel units of the LED display unit, an electrode A of the LED light-emitting chip is electrically connected with the corresponding first electrode A pin and the corresponding second electrode A pin of the row of pixel units;
in each row of the LED display units, a second A pole pin corresponding to the ith row of pixel units in the former LED display unit is electrically connected with a first A pole pin corresponding to the ith row of pixel units in the latter LED display unit through the first wiring.
Optionally, the first a-pole pin and the second a-pole pin corresponding to each row of the pixel units are respectively disposed on a first edge and a second edge opposite to each other on the substrate along a row direction.
Optionally, the first B-pole pins are arranged in a staggered manner on the substrate, and the first B-pole pins are disposed in an area surrounded by the first a-pole pins and the second a-pole pins.
Optionally, the B-pole pins include a second B-pole pin, at least one first B-pole pin is correspondingly provided with one second B-pole pin, and the first B-pole pin is electrically connected with the second B-pole pin;
in at least one column of pixel units of the LED display unit, a B electrode of at least one LED light-emitting chip with the same light-emitting color is electrically connected with a first B pin and a second B pin corresponding to the column of pixel units;
in each column of the LED display units, a second B-pole pin corresponding to a j-th column of pixel units in a previous LED display unit is electrically connected with a first B-pole pin corresponding to a j-th column of pixel units in a next LED display unit through the second wiring.
Optionally, the first B-pole pin and the corresponding second B-pole pin are respectively disposed on a third edge and a fourth edge opposite to each other on the substrate along the column direction.
Optionally, the LED display unit further includes an insulating layer, where the insulating layer covers the wires on the pin layer, where the wires are connected to the a-pole pin and the B-pole pin, and exposes the a-pole pin and the B-pole pin.
Optionally, a window penetrating through the insulating layer is provided on the insulating layer, and the window exposes a part of the wiring of the pin layer.
Optionally, the first wiring is disposed between two adjacent LED display units, and the second wiring passes through a vertical projection of the LED display units on the circuit board.
In a second aspect, an embodiment of the present invention provides a display device, including an LED display module provided in the first aspect of the present invention.
The LED display module comprises a plurality of LED display units and a circuit board, wherein the LED display units are arranged in an array mode, each LED display unit comprises m rows and n columns of pixel units, each pixel unit comprises a plurality of LED light emitting chips with different light emitting colors, the LED display units are arranged on the circuit board, a circuit layer is arranged on the surface, close to the LED display units, of the circuit board, each circuit layer comprises a plurality of first wiring lines and second wiring lines, the first wiring lines extend in the row direction, the second wiring lines extend in the column direction, the first wiring lines and the second wiring lines are not intersected, in each row of LED display units, the electrode A of each LED light emitting chip is electrically connected with the electrode A of the corresponding pixel unit in the ith row of the corresponding pixel unit in the corresponding row of the corresponding LED display unit through the first wiring lines, and the electrode B of each LED light emitting chip with the same color is electrically connected with the pixel unit in the jth column of the corresponding pixel unit in the corresponding row of the corresponding LED display unit through the second wiring lines, and therefore difficulty in connecting all the LED light emitting chip electrodes of the LED light emitting chips can be arranged on the same wiring layer of the circuit board, and manufacturing cost of the circuit board is reduced.
Drawings
The invention is described in further detail below with reference to the drawings and examples.
FIG. 1 is a top view of an LED display unit of the prior art;
FIG. 2 is a bottom view of the LED display unit of FIG. 1;
FIG. 3 is a wiring diagram of a circuit board connecting common cathode pins of an LED light emitting chip;
FIG. 4 is a wiring diagram of a circuit board connecting the anode pins of the red LED light emitting chips;
FIG. 5 is a wiring diagram of a circuit board connecting anode pins of a green LED light emitting chip;
FIG. 6 is a wiring diagram of a circuit board connecting anode pins of a blue LED light emitting chip;
FIG. 7 is a wiring diagram of a circuit board in a display module according to the prior art;
fig. 8 is a schematic diagram of a partial structure of an LED display module according to an embodiment of the present invention;
fig. 9 is a top view of an LED display unit according to an embodiment of the present invention;
FIG. 10 is a bottom view of the LED display unit of FIG. 9;
FIG. 11 is a bottom view of another LED display unit according to an embodiment of the present invention;
FIG. 12 is a top view of another LED display unit according to an embodiment of the present invention;
FIG. 13 is a bottom view of the LED display unit of FIG. 12;
FIG. 14 is a top view of another LED display unit according to an embodiment of the present invention;
FIG. 15 is a bottom view of the LED display unit of FIG. 14;
Fig. 16 is a schematic diagram of a partial structure of another LED display module according to an embodiment of the present invention;
FIG. 17 is a top view of another LED display unit according to an embodiment of the present invention;
FIG. 18 is a bottom view of the LED display unit of FIG. 17;
fig. 19 is a schematic view of a partial structure of another LED display module according to an embodiment of the present invention;
FIG. 20 is a top view of another LED display unit according to an embodiment of the present invention;
fig. 21 is a bottom view of the LED display unit of fig. 20.
Detailed Description
In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.
Fig. 1 is a top view of an LED display unit in the prior art, fig. 2 is a bottom view of the LED display unit in fig. 1, and as shown in fig. 1 and 2, the LED display unit is a "four-in-one" display unit, including four pixel units, each including three LED light emitting chips of red, green and blue (R, G, B).
Illustratively, in the first row of pixel units, the cathodes of all the LED light emitting chips of both pixel units are connected to a common pad 11, and the common pad 11 is connected to a common cathode pin C12 through a metal via. In the second row of pixel units, cathodes of all LED light emitting chips of the two pixel units are connected with a common bonding pad 12, and the common bonding pad 12 is connected with a common cathode pin C34 through a metal via hole. In the first column of pixel units, the anode of the blue LED light emitting chip B is connected to the corresponding anode pad 21, and is electrically connected to the anode pin B13 corresponding to the blue LED light emitting chip B through the wiring and the via hole. In the first column of pixel units, the anode of the green LED light emitting chip G is connected to the corresponding anode pad 22, and is electrically connected to the anode pin G13 corresponding to the green LED light emitting chip G through the trace and the via hole. Similarly, in the first column of pixel units, the anode of the red LED light emitting chip R is connected to the corresponding anode pad 23, and is electrically connected to the anode pin R13 corresponding to the red LED light emitting chip R through the trace and the via. The anode pins corresponding to the blue LED light emitting chip, the green LED light emitting chip and the red LED light emitting chip in the second column of pixel units are respectively B24, G24 and R24, and the connection relationship is similar to that of the first column of pixel units, and the embodiments of the present invention are not described herein again.
As described above, when forming the display module, the pins of the plurality of LED display units need to be soldered on the circuit board, and the common cathode pins of the two adjacent LED display units in each row are electrically connected through the wiring in the circuit board, and the anode pins corresponding to the light emitting chips with the same light emitting color in the two adjacent LED display units in each column are electrically connected. Fig. 3 is a wiring diagram of a circuit board connected to a common cathode pin of an LED light emitting chip, fig. 4 is a wiring diagram of a circuit board connected to an anode pin of a red LED light emitting chip, fig. 5 is a wiring diagram of a circuit board connected to an anode pin of a green LED light emitting chip, fig. 6 is a wiring diagram of a circuit board connected to an anode pin of a blue LED light emitting chip, and fig. 7 is a wiring diagram of a circuit board in a display module of the prior art, as shown in fig. 3 to fig. 7, since the wiring connected to the common cathode pin and the wiring connected to other anode pins are crossed with each other, the circuit board needs to be provided with a multi-layer wiring layer in order to avoid a shorting problem caused by the wiring crossing, which can increase the difficulty of manufacturing the circuit board and increase the production cost.
In view of the above problems, an embodiment of the present invention provides an LED display module, so as to solve the problem that when an LED display unit is welded to a circuit board, the circuit board needs to be set into multiple circuit layers due to the intersection of wires, resulting in high manufacturing cost of the circuit board. The LED display module provided by the embodiment of the invention comprises:
The LED display units are arranged in an array, each LED display unit comprises m rows and n columns of pixel units, each pixel unit comprises a plurality of LED light emitting chips with different light emitting colors, each LED light emitting chip is provided with an electrode A and an electrode B with opposite polarities, and m and n are positive integers which are larger than or equal to 1;
the LED display unit is arranged on the circuit board, a circuit layer is arranged on the surface, close to the LED display unit, of the circuit board, the circuit layer comprises a plurality of first wiring lines and second wiring lines, the first wiring lines extend along the row direction, the second wiring lines extend along the column direction, and the first wiring lines and the second wiring lines do not cross each other;
in each row of LED display units, the electrode A of the LED light emitting chip is electrically connected with the pixel unit in the ith row of the former LED display unit and the pixel unit in the ith row of the latter LED display unit through a first wiring;
in each column of LED display units, the electrode B of the LED light-emitting chip with the same color is electrically connected with the electrode B of the pixel unit in the j column of the former LED display unit and the pixel unit in the j column of the latter LED display unit through a second wiring;
wherein i is more than or equal to 1 and less than or equal to m, j is more than or equal to 1 and less than or equal to n, i and j are positive integers.
The first wiring on the circuit layer is connected with the A electrodes of all the LED light emitting chips in the same row of pixels of each row of LED display units, the second wiring on the circuit layer is connected with the B electrodes of the LED light emitting chips with the same color in the same column of pixel units of each column of LED display units, the first wiring and the second wiring extend along the row-column direction respectively, and the first wiring and the second wiring are not intersected with each other, so that all the wirings on the circuit board for connecting the electrodes of the LED light emitting chips can be arranged on the same wiring layer on the circuit board, and the preparation difficulty and the manufacturing cost of the circuit board are reduced.
In order to enable a person skilled in the art to more clearly understand the technical solutions of the present invention, the following description will exemplify the solutions of the present invention with reference to specific examples.
Fig. 8 is a schematic diagram of a partial structure of an LED display module according to an embodiment of the present invention, fig. 9 is a top view of an LED display unit according to an embodiment of the present invention, and fig. 10 is a bottom view of the LED display unit in fig. 9, where, for simplicity of drawing, only wiring of a circuit board and pins of the LED display unit are shown in fig. 8. As shown in fig. 8 to 10, the LED display module includes: a plurality of LED display units 100 and a circuit board arranged in an array.
The LED display unit 100 is an exemplary "four-in-one" display unit, and includes 2 rows and 2 columns of four pixel units P, where the pixel units P include three LED light emitting chips with red (R), green (G), and blue (B) light emitting colors, and the LED light emitting chips have a electrode a and a electrode B with opposite polarities. Illustratively, the a electrode is a cathode and the B electrode is an anode.
The LED display unit 100 includes a substrate 110, the substrate 110 includes a pad layer and a lead layer, the pad layer and the lead layer are respectively disposed on two sides of the substrate 110, the pixel unit P is disposed on one side of the pad layer away from the substrate 110, the pixel unit P is electrically connected with the pad layer, and the pad layer is electrically connected with the lead layer.
The pin layer comprises a plurality of A pole pins, each row of pixel units of the LED display unit is correspondingly provided with at least two A pole pins, each at least two A pole pins comprises a first A pole pin and a second A pole pin, the first A pole pin and the second A pole pin are arranged along the row direction, and the first A pole pin is electrically connected with the second A pole pin.
In the embodiment of the present invention, two a-pole pins are correspondingly disposed in each row of pixel units of the LED display unit 100, and the two a-pole pins are respectively a first a-pole pin and a second a-pole pin for explanation. As illustrated in fig. 9 and 10, in the LED display unit 100, three LED light emitting chips of the pixel unit P are each fixed on the common pad 121, and cathodes of the three LED light emitting chips are each electrically connected to the common pad 121. Illustratively, the red LED light emitting chip R is a vertical type chip, and the cathode of the red LED light emitting chip R is fixed on the common pad 121 by a conductive material (e.g., tin) to achieve electrical connection. The green LED light-emitting chip G and the blue LED light-emitting chip B are forward-mounted chips, the cathode of the green LED light-emitting chip G and the cathode of the blue LED light-emitting chip B are respectively and electrically connected with the common bonding pads 121 through metal wires, and the two common bonding pads 121 in each row of pixel units are electrically connected through wiring of the bonding pad layer.
The first row of pixel units is correspondingly provided with a first A pole pin C121 and a second A pole pin C122, and the second row of pixel units is correspondingly provided with a first A pole pin C341 and a second A pole pin C342. The first A pole pin C121 and the second A pole pin C122, the first A pole pin C341 and the second A pole pin C342 are respectively and electrically connected with the corresponding public bonding pad 121 through metal through holes, so that the first A pole pin C121 and the second A pole pin C122 are electrically connected in a first row of pixel units of the LED display unit, the cathode of the LED light emitting chip is electrically connected with the first A pole pin C121 and the second A pole pin C122, the first A pole pin C341 and the second A pole pin C342 are electrically connected in a second row of pixel units, and the cathode of the LED light emitting chip is electrically connected with the first A pole pin C341 and the second A pole pin C342. It should be noted that, in other embodiments of the present invention, the two common pads in each row of pixel units may not be connected, but the first a-pole pin and the second a-pole pin are electrically connected through the wiring of the pin layer, which is not limited herein.
In the LED display module, in each row of LED display units, a second A pole pin of an ith row of pixel units in a previous LED display unit is electrically connected with a first A pole pin corresponding to the ith row of pixel units in a subsequent LED display unit through a first wiring. As shown in fig. 8, in each row of LED display units, the second a-pole pin C122 corresponding to the first row of pixel units in the previous LED display unit is electrically connected to the first a-pole pin C121 corresponding to the first row of pixel units in the next LED display unit through the first wiring L11, and the second a-pole pin C342 corresponding to the second row of pixel units in the previous LED display unit is electrically connected to the first a-pole pin C341 corresponding to the second row of pixel units in the next LED display unit through the first wiring L12.
In some embodiments of the invention, the pin layer further comprises a number of B-pole pins, the B-pole pins comprising a first B-pole pin. Each column of pixel units of the LED display unit 100 is correspondingly provided with first B-pole pins with the same number as the LED light emitting chips in the pixel units. As shown in fig. 9 and 10, each column of pixel units of the LED display unit 100 is provided with three first B-pole pins corresponding to the same number of three LED light emitting chips in the pixel unit P.
In each column of pixel units of the LED display unit 100, anodes of the LED light emitting chips of the same light emitting color are electrically connected to a corresponding one of the first B-pole pins in the column of pixel units. Illustratively, in the LED display unit 100, anodes of the red LED light emitting chip R, the green LED light emitting chip G, and the blue LED light emitting chip B are electrically connected to the corresponding anode pads 122, 123, and 124, respectively, through metal wires. The two anode bonding pads 122 corresponding to the red LED light emitting chips R of the first row of pixel units are respectively connected with the wiring of the pin layer through metal through holes, and are electrically connected with the first B-pole pin R13 corresponding to the red LED light emitting chips R, the two anode bonding pads 123 corresponding to the green LED light emitting chips G are respectively connected with the wiring of the pin layer through metal through holes, and are electrically connected with the first B-pole pin G13 corresponding to the green LED light emitting chips G, and the two anode bonding pads 124 corresponding to the blue LED light emitting chips B are respectively connected with the wiring of the pin layer through metal through holes, and are electrically connected with the first B-pole pin B13 corresponding to the blue LED light emitting chips B. The two anode bonding pads 122 corresponding to the red LED light emitting chips R of the second row of pixel units are respectively connected with the wiring of the pin layer through metal through holes, and are electrically connected with the first B-pole pins R24 corresponding to the red LED light emitting chips R, the two anode bonding pads 123 corresponding to the green LED light emitting chips G are respectively connected with the wiring of the pin layer through metal through holes, and are electrically connected with the first B-pole pins G24 corresponding to the green LED light emitting chips G, and the two anode bonding pads 124 corresponding to the blue LED light emitting chips B are respectively connected with the wiring of the pin layer through metal through holes, and are electrically connected with the first B-pole pins B24 corresponding to the blue LED light emitting chips B.
In the LED display module, in each row of LED display units, a j-th row of pixel units in a previous LED display unit and a j-th row of pixel units in a next LED display unit are electrically connected through a second wiring, and the first B-pole pins corresponding to LED light emitting chips with the same light emitting color are electrically connected through a second wiring. As shown in fig. 8, in each row of LED display units, in a first row of pixel units in a previous LED display unit and a first row of pixel units in a next LED display unit, a first B-pole pin R13 corresponding to a red LED light emitting chip R is electrically connected through a second wiring L21, a first B-pole pin G13 corresponding to a green LED light emitting chip G is electrically connected through a second wiring L22, and a first B-pole pin B13 corresponding to a blue LED light emitting chip B is electrically connected through a second wiring L23; in the second column of pixel units in the previous LED display unit and the second column of pixel units in the next LED display unit, a first B-pole pin R24 corresponding to a red LED light emitting chip R is electrically connected through a second wiring L21, a first B-pole pin G24 corresponding to a green LED light emitting chip G is electrically connected through a second wiring L22, and a first B-pole pin B24 corresponding to a blue LED light emitting chip B is electrically connected through a second wiring L23. In this way, in the LED display module, anodes of LED light emitting chips with the same color in the same column of pixel units of each column of LED display units are electrically connected.
According to the LED display module provided by the embodiment of the invention, the LED display units are arranged on the circuit board, the cathodes of the LED light emitting chips in the same row of pixels of each row of LED display units are connected through the first wiring on the circuit layer of the circuit board, the anodes of the LED light emitting chips with the same color in the same column of pixel units of each column of LED display units are connected through the second wiring on the circuit layer of the circuit board, the first wiring and the second wiring respectively extend along the row-column direction, and the first wiring and the second wiring are not intersected with each other, so that the first wiring extending along the row direction and the second wiring extending along the column direction are arranged on the same circuit layer, and the preparation difficulty and the manufacturing cost of the circuit board are reduced.
In some embodiments of the present invention, as shown in fig. 8, the first wirings L11, L12 are disposed between two adjacent LED display units 100, and the second wirings L21, L22, L23 pass through the vertical projection of the LED display units 100 on the wiring board. The first wirings L11 and L12 connecting cathodes of two LED display units adjacent in the row direction need not traverse the entire LED display unit, but need only be disposed between the adjacent two LED display units, and the second wirings L21, L22, L23 connecting anodes of the two LED display units adjacent in the column direction may pass from a vertical projection of the LED display units on the wiring board. In this way, the space occupied by the first wiring extending in the row direction and the second wiring extending in the column direction can be saved, thereby avoiding the short circuit between the first wiring extending in the row direction and the second wiring extending in the column direction due to too close distance therebetween.
In some embodiments of the present invention, the first a-pole pin and the second a-pole pin corresponding to each row of pixel units are respectively disposed on the opposite first edge and the second edge of the substrate. As shown in fig. 10, the first a-pole pin C121 and the second a-pole pin C122 corresponding to the first row of pixel units are respectively disposed on the opposite first edge M1 and the second edge M2 on the substrate 110 along the row direction, and the first a-pole pin C341 and the second a-pole pin C342 corresponding to the second row of pixel units are respectively disposed on the opposite first edge M1 and the second edge M2 on the substrate 110 along the row direction. In this manner, the spacing between the first and second a-pole pins C121 and C122 of the first row of pixel cells and between the first and second a-pole pins C341 and C342 of the second row of pixel cells may be maximized to provide sufficient wiring space for the second wiring. In this embodiment, the first a-pole pin C121, the second a-pole pin C122, the first a-pole pin C341 and the second a-pole pin C342 are respectively disposed at four corners of the substrate, and the first a-pole pin C121 and the second a-pole pin C122 are disposed on the same horizontal line, and the first a-pole pin C341 and the second a-pole pin C342 are disposed on another horizontal line, thereby facilitating the wiring connection with the first wirings L11 and L12.
In some embodiments of the present invention, the first pins B are arranged in a staggered manner on the substrate, and the first B-pole pins are disposed in a region surrounded by the first a-pole pins and the second a-pole pins. As shown in fig. 8 and 10, six first B-pole pins are arranged in a staggered manner in a middle region of the substrate 110 and are surrounded by the first a-pole pins and the second a-pole pins. Specifically, the first B-pole pins G13, B13 and R24 are arranged in a row along the row direction, the first B-pole pins R13, G24 and B24 are arranged in another row along the row direction, and the two rows of first B-pole pins are arranged in a staggered manner. In this way, in the LED display module, the second wiring connected with one first B pole pin in two adjacent LED display units can pass through two adjacent first B pole pins in the other row, so that the second wiring on the circuit board is prevented from crossing. For example, as shown in fig. 8, the second wiring L21 connecting the first B-pole pin R13 may pass through the first B-pole pin G13 and the first B-pole pin B13.
In some embodiments of the present invention, fig. 11 is a bottom view of another LED display unit provided in the embodiment of the present invention, as shown in fig. 11, on the basis of the foregoing embodiment, the LED display unit 100 further includes an insulating layer 130, where the insulating layer 130 covers the wires on the lead layer for connecting the a-pole pin and the B-pole pin, and exposes the a-pole pin and the B-pole pin, so as to avoid shorting the wires on the lead layer with the wires on the circuit board. Specifically, the material of the insulating layer 130 includes white oil, resin, green oil, etc., and plays a role in insulation and protection.
In some embodiments of the present invention, as shown in fig. 11, a window 131 penetrating the insulating layer 130 is disposed on the insulating layer 130, and the window 131 exposes a portion of the traces of the lead layer. In this way, the metal wiring with a larger color difference from the insulating layer 130 is formed at the window 131, which can perform the functions of distinguishing the orientation of the LED display unit and distinguishing the polarity of the pins of the LED display unit, and can avoid the wiring connection error between the LED display unit and the circuit board caused by the identification error of the LED display unit when the LED display unit is welded to the circuit board.
In the embodiment of the present invention, the pad and trace arrangement of the pad layer is not limited.
Fig. 12 is a top view of another LED display unit according to an embodiment of the present invention, and fig. 13 is a bottom view of the LED display unit of fig. 12, where the difference between the embodiment and the foregoing embodiment is that: the LED light-emitting chips in the pixel units are flip chips, anodes and cathodes of the flip chips are respectively fixed on corresponding anode bonding pads and cathode bonding pads through conductive materials (such as tin), three cathode bonding pads of one pixel unit are connected through wiring of a bonding pad layer and are electrically connected with corresponding first A-pole pins and second A-pole pins through metal through holes, and the first A-pole pins and the second A-pole pins corresponding to the pixel units in the same row are electrically connected through wiring of a pin layer. Illustratively, in the first row of pixel cells, the first a-pole pin C121 and the second a-pole pin C122 are electrically connected by the trace W11 of the pin layer. In the second row of pixel units, the first a-pole pin C341 and the second a-pole pin C342 are electrically connected through the trace W12 of the pin layer. And the anode bonding pads of the LED light-emitting chips with the same light-emitting color are electrically connected with the corresponding first B-pole pins through the bonding pad layers, the wiring of the pin layers and the metal through holes. The same parts of this embodiment as those of the previous embodiment will not be described here again. The LED module formed by the LED display unit of this embodiment may refer to fig. 8, and the embodiment of the present invention is not described herein again.
Fig. 14 is a top view of another LED display unit according to an embodiment of the present invention, and fig. 15 is a bottom view of the LED display unit of fig. 14, which is different from the embodiments shown in fig. 12 and 13 in that: the arrangement of the LED light emitting chips is different. In the embodiment shown in fig. 12 and 13, three LED light emitting chips in a pixel unit are arranged in the column direction. In this embodiment, three LED light emitting chips in a pixel unit are arranged in a row direction. The same parts of this embodiment as those of the previous embodiment will not be described here again. The LED module formed by the LED display unit of this embodiment may refer to fig. 8, and the embodiment of the present invention is not described herein again.
In order to facilitate the arrangement of the second wires, fig. 16 is a schematic view of a partial structure of another LED display module according to an embodiment of the present invention, fig. 17 is a top view of another LED display unit according to an embodiment of the present invention, and fig. 18 is a bottom view of the LED display unit in fig. 17.
The difference between the embodiment and the LED display module shown in fig. 8 is that the B-pole pin in the embodiment of the present invention further includes a second B-pole pin, and at least one first B-pole pin is correspondingly provided with a second B-pole pin, and the first B-pole pin is electrically connected with the second B-pole pin;
In at least one column of pixel units of the LED display unit, the B pole of at least one LED light-emitting chip with the same light-emitting color is electrically connected with a first B pin and a second B pole pin corresponding to the column of pixel units;
in each row of LED display units, the corresponding second B pole pin of the pixel unit in the j-th row in the previous LED display unit is electrically connected with the corresponding first B pole pin of the pixel unit in the j-th row in the next LED display unit through a second wiring.
As shown in fig. 17 and 18, in the first column of pixel units of the LED display unit 100, the red LED light emitting chip R is correspondingly provided with a first B-pole pin R131 and a second B-pole pin R132, and the first B-pole pin R131 and the second B-pole pin R132 are electrically connected through the wiring of the pin layer. In the first column of pixel units, the anode of the red LED light emitting chip R is electrically connected with a first B-pole pin R131 and a second B-pole pin R132.
In the second column of pixel units, a first B-pole pin G241 and a second B-pole pin G242 are correspondingly arranged on the green LED light emitting chip G. The first B-pole pin G241 and the second B-pole pin G242 are electrically connected by wiring of the pin layer. In the second column of pixel units, the anode of the green LED light emitting chip G is electrically connected to the first B-pole pin G241 and the second B-pole pin G242.
In this embodiment, as shown in fig. 16, in each row of LED display units, a second a-pole pin C122 corresponding to a first row of pixel units in a previous LED display unit is electrically connected to a corresponding first a-pole pin C121 of a first row of pixel units in a next LED display unit through a first wiring L11, and a second a-pole pin C342 corresponding to a second row of pixel units in the previous LED display unit is electrically connected to a first a-pole pin C341 corresponding to a second row of pixel units in the next LED display unit through a first wiring L12, so that cathode electrical connection of all LED light emitting chips in the same row of pixel units in each row of LED display units in the LED display module is realized.
In each row of LED display units, a second B-pole pin R132 corresponding to a red LED light emitting chip R of a first row of pixel units in a previous LED display unit is electrically connected with a first B-pole pin R131 corresponding to a red LED light emitting chip of a first row of pixel units in a next LED display unit through a second wiring L21, a first B-pole pin G13 corresponding to a green LED light emitting chip G is electrically connected with a first B-pole pin B13 corresponding to a blue LED light emitting chip B through a second wiring L22, and a second wiring L23 is electrically connected with a second B-pole pin B13 corresponding to a blue LED light emitting chip B. The second B-pole pin G242 corresponding to the green LED light emitting chip G of the second column of pixel units in the former LED display unit is electrically connected with the first B-pole pin G241 corresponding to the green LED light emitting chip G of the second column of pixel units in the latter LED display unit through a second wiring L22, the first B-pole pin R24 corresponding to the red LED light emitting chip R is electrically connected through a second wiring L21, and the first B-pole pin B24 corresponding to the blue LED light emitting chip B is electrically connected through a second wiring L23, so that the cathodes of the LED light emitting chips with the same color in the same column of pixel units of each column of LED display units in the LED display module are electrically connected.
In some embodiments of the present invention, the first B-pole pin and the corresponding second B-pole pin are respectively disposed on opposite third and fourth edges of the substrate along the column direction. As shown in fig. 18, in the LED display unit, the first and second B-pole pins R131 and R132 are disposed on the opposite third and fourth edges M3 and M4 of the substrate 110 in the column direction, respectively, and the first and second B-pole pins G241 and G242 are disposed on the opposite third and fourth edges M3 and M4 of the substrate 110 in the column direction, respectively, and the first and second B-pole pins R131 and R132 are disposed on the same horizontal line extending in the column direction, respectively, and the first and second B-pole pins G241 and G242 are disposed on the other horizontal line extending in the column direction, respectively, to facilitate connection of the wirings of the second wirings L21 and L22.
Through setting up the first B utmost point pin and the second B utmost point pin of electric connection, the positive pole of the LED luminescence chip of the same luminous colour is connected with corresponding first B utmost point pin and second B utmost point pin electricity, and the corresponding second B utmost point pin of second row pixel unit in the preceding LED display element is connected through the second wiring electricity with the first B utmost point pin that the second row pixel unit corresponds in the latter LED display element, and this second wiring can set up between adjacent two LED display element to can leave more spaces for other second wiring.
Fig. 19 is a schematic view of a partial structure of another LED display module according to an embodiment of the present invention, fig. 20 is a top view of another LED display unit according to an embodiment of the present invention, fig. 21 is a bottom view of the LED display unit in fig. 20, and the difference between the embodiment and the LED display unit shown in fig. 17 and 18 is that: in the LED display unit, a green LED light emitting chip G of a first column of pixel units is correspondingly provided with a first B-pole pin G131 and a second B-pole pin G132, and the first B-pole pin G131 and the second B-pole pin G132 are electrically connected through wiring of a pin layer; the red LED light emitting chips R of the second column of pixel units are correspondingly provided with a first B-pole pin R241 and a second B-pole pin R242, and the first B-pole pin R241 and the second B-pole pin R242 are electrically connected through wires of the pin layers. The first and second B-pole pins G131 and G132 are disposed on the opposite third and fourth edges M3 and M4 of the substrate 110 in the column direction, respectively, and the first and second B-pole pins R241 and R242 are disposed on the opposite third and fourth edges M3 and M4 of the substrate 110 in the column direction, respectively.
The difference between this embodiment and the embodiment shown in fig. 16 is that: in the LED display module, a second B-pole pin G132 corresponding to the green LED light emitting chip G of the first column of pixel units in the previous LED display unit is electrically connected to a first B-pole pin G131 corresponding to the green LED light emitting chip G of the first column of pixel units in the next LED display unit through a second wiring L22, and a second B-pole pin R242 corresponding to the red LED light emitting chip R of the second column of pixel units in the previous LED display unit is electrically connected to a corresponding first B-pole pin R241 corresponding to the red LED light emitting chip R of the second column of pixel units in the next LED display unit through a second wiring L21.
In the above embodiments, the LED display unit is exemplified by a "four-in-one" display unit formed by two rows and two columns of pixel units, and in other embodiments of the present invention, the LED display unit may include only one pixel unit or include a plurality of pixel units (e.g., 2 rows and 3 columns).
The embodiment of the invention also provides a display device, which comprises the LED display module provided by any embodiment, and the display device can be a display, a television, a smart phone or a tablet personal computer, and the like.
In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and to simplify operation, rather than to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims (12)

1. An LED display module, comprising:
the LED display units are arranged in an array, each LED display unit comprises m rows and n columns of pixel units, each pixel unit comprises a plurality of LED light emitting chips with different light emitting colors, each LED light emitting chip is provided with an electrode A and an electrode B with opposite polarities, and m and n are positive integers which are larger than or equal to 1;
The LED display unit comprises a circuit board, wherein the LED display unit is arranged on the circuit board, a circuit layer is arranged on the surface, close to the LED display unit, of the circuit board, the circuit layer comprises a plurality of first wires and second wires, the first wires extend along the row direction, the second wires extend along the column direction, and the first wires and the second wires are not crossed with each other;
in each row of the LED display units, in the ith row of pixel units of the former LED display unit and in the ith row of pixel units of the latter LED display unit, an electrode A of the LED light-emitting chip is electrically connected through the first wiring;
in each column of the LED display units, the electrode B of the LED light emitting chip with the same color in the pixel unit in the j column of the former LED display unit and the pixel unit in the j column of the latter LED display unit are electrically connected through the second wiring;
wherein i is more than or equal to 1 and less than or equal to m, j is more than or equal to 1 and less than or equal to n, i and j are positive integers.
2. The LED display module of claim 1, wherein the LED display unit further comprises a substrate having a pin layer electrically connected to the pixel unit, the pixel unit and the pin layer being disposed on two sides of the substrate, respectively, the pin layer comprising a plurality of a-pole pins;
Each row of pixel units of the LED display unit is correspondingly provided with at least two A pole pins, each at least two A pole pins comprises a first A pole pin and a second A pole pin, the first A pole pins and the second A pole pins are arranged along the row direction, and the first A pole pins are electrically connected with the second A pole pins;
in each row of pixel units of the LED display unit, an electrode A of the LED light-emitting chip is electrically connected with the corresponding first electrode A pin and the corresponding second electrode A pin of the row of pixel units;
in each row of the LED display units, a second A pole pin corresponding to the ith row of pixel units in the former LED display unit is electrically connected with a first A pole pin corresponding to the ith row of pixel units in the latter LED display unit through the first wiring.
3. The LED display module of claim 2, wherein the pin layer further comprises a plurality of B-pole pins, the B-pole pins comprising a first B-pole pin;
each column of pixel units of the LED display unit is correspondingly provided with the first B-pole pins, the quantity of which is the same as that of LED luminous chips in the pixel units;
in each column of the pixel units of the LED display unit, the B electrode of the LED light emitting chip with the same light emitting color is electrically connected with a corresponding one of the first B electrode pins in the column of the pixel units;
In each row of the LED display units, the j-th row of pixel units in the former LED display unit and the j-th row of pixel units in the latter LED display unit are electrically connected through the second wiring, and the first B-pole pins corresponding to the LED light emitting chips with the same light emitting color are arranged on the first B-pole pins.
4. The LED display module according to claim 3, wherein two a-pole pins are correspondingly provided for each row of pixel units in the LED display unit, and the two a-pole pins are the first a-pole pin and the second a-pole pin, respectively;
in each row of pixel units of the LED display unit, an electrode A of the LED light-emitting chip is electrically connected with the corresponding first electrode A pin and the corresponding second electrode A pin of the row of pixel units;
in each row of the LED display units, a second A pole pin corresponding to the ith row of pixel units in the former LED display unit is electrically connected with a first A pole pin corresponding to the ith row of pixel units in the latter LED display unit through the first wiring.
5. The LED display module of claim 4, wherein the first and second a-pole pins corresponding to each row of the pixel units are disposed on opposite first and second edges of the substrate along a row direction, respectively.
6. The LED display module of claim 5, wherein the first B-pole pins are arranged in a staggered arrangement on the substrate, and the first B-pole pins are disposed in an area surrounded by the first a-pole pins and the second a-pole pins.
7. The LED display module of claim 4, wherein the B-pole pins further comprise a second B-pole pin, at least one of the first B-pole pins being correspondingly provided with one of the second B-pole pins, the first B-pole pin being electrically connected with the second B-pole pin;
in at least one column of pixel units of the LED display unit, a B electrode of at least one LED light-emitting chip with the same light-emitting color is electrically connected with a first B pin and a second B pin corresponding to the column of pixel units;
in each column of the LED display units, a second B-pole pin corresponding to a j-th column of pixel units in a previous LED display unit is electrically connected with a first B-pole pin corresponding to a j-th column of pixel units in a next LED display unit through the second wiring.
8. The LED display module of claim 7, wherein the first B-pole pin and the corresponding second B-pole pin are disposed on opposite third and fourth edges of the substrate along a column direction, respectively.
9. The LED display module of claim 3, wherein the LED display unit further comprises an insulating layer covering the traces on the pin layer connecting the a-pole pin and the B-pole pin and exposing the a-pole pin and the B-pole pin.
10. The LED display module of claim 9, wherein a window is provided through the insulating layer, the window exposing a portion of the traces of the lead layer.
11. The LED display module of claim 1, wherein the first wiring is disposed between two adjacent LED display units, and the second wiring passes through a vertical projection of the LED display units on the wiring board.
12. A display device comprising an LED display module according to any one of claims 1-11.
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