CN116598297B - Integrated display unit for blocking light color crosstalk of MinLedRGB chip and preparation method - Google Patents
Integrated display unit for blocking light color crosstalk of MinLedRGB chip and preparation method Download PDFInfo
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention provides an integrated display unit for blocking MinLedRGB light color crosstalk and a manufacturing method thereof, wherein the integrated display unit comprises a grid-shaped electrode plate and integrated display units arranged on the grid-shaped electrode plate, the integrated display units are integrated by minimum LedRGB display units which are orderly arranged in rows and columns, and LEDR, G and B chips in the minimum LedRGB display units which are adjacent left and right are alternately distributed in a positive isosceles angle shape and a side isosceles angle shape; the honeycomb light-isolating walls surrounding the LEDR, G and B chips are arranged among the LEDR, G and B chips, and the layout of the grid electrode plates correspondingly sets the rows and columns of the grid electrode plates according to the row and column distribution of the integrated display units. The honeycomb light-isolation wall blocks light color crosstalk of the LED chip and has structural strength, is favorable for high integration of LedRGB micro-distance display, reduces the packaging cost of the LED, and has reliable process and stable quality.
Description
Technical Field
The invention belongs to the field of LED display, and particularly relates to an integrated display unit capable of blocking MinLedRGB light color crosstalk and a packaging method.
Background
The conventional Mini LED (Mini Light Emitting Diode, micro light emitting diode) generally uses cob (chip On board) packaging, that is, a bare chip is directly packaged On a substrate, although the purpose of tight and rapid assembly can be achieved, the chip is not subjected to photoelectric test screening, and in addition, abnormality easily occurs during packaging, so that the yield of the packaging mode is poor, and the packaging mode is that the chip is packaged On a bracket to form a single small-size lamp bead, and then the lamp bead is mounted On the substrate.
However, under the interval that the center distance between adjacent pixels between Mini LEDs is 0.X mm, hemispherical light emitted by any pixel RGB chip can be directly radiated to the adjacent RGB pixels and is mixed with light emitted by the adjacent pixels RGB, and the mixed light color information is deviated from the original pixel light color information, so that light color crosstalk is formed; the degree of light color crosstalk becomes worse as the pixel pitch of the Mini LEDs becomes smaller.
The high-density MiniLed micro-distance display with the pixel spacing smaller than 1.0mm is the future direction of high-definition display. COB (chip on Board) and MIP (micro-fabrication interface) packaging processes are mostly adopted in the manufacturing process industry of high-density micro-distance LED display with balance of 1.0-0.4mm pixel space; as COB, MIP, miniLed interval is very close to two adjacent pixels along with the increase of density, when adjacent RGB chips emit light, serious light can be strung to peripheral RGB pixels to form light color crosstalk, and the quality of a MiniLed display picture is affected; the invention effectively blocks the light color crosstalk between MiniLed display chips under the state of high-density integrated LedRGB chips (less than or equal to 1.0), and improves the display quality of MiniLed. Provides a production process path for MiniLed display promotion, and is beneficial to industry development.
Disclosure of Invention
The invention aims to provide the LED display device capable of blocking the mutual light color crosstalk among the Mini LED pixels, effectively improving the display quality of the Mini LED, having low cost and meeting the product integration requirement.
In order to achieve the above purpose, the invention adopts the following technical scheme: an integrated display unit for blocking light color crosstalk of MinLedRGB chips, which is characterized in that: the integrated display unit is integrated by the minimum LedRGB display units which are orderly arranged in rows and columns, distances between every two adjacent columns of the minimum LedRGB display units are in inverted isosceles triangle and regular isosceles triangle alternate distribution, packaging light-isolating supports of the R, G and B chips are honeycomb structures surrounding the R, G and B chips, and electrode pins of the rows and columns of the grid electrode plates are correspondingly arranged according to the row and column distribution of the integrated display units.
Wherein, the preferable scheme is as follows: the minimum LedRGB display unit comprises R, G and B chips which are respectively arranged in a first diamond-shaped groove, a second diamond-shaped groove and a third diamond-shaped groove, wherein the first diamond-shaped groove is vertically distributed, the second diamond-shaped groove and the third diamond-shaped groove are transversely distributed, and the first diamond-shaped groove, the second diamond-shaped groove, the third diamond-shaped groove and the outer wall of the integrated display unit are integrally injection molded.
Wherein, the preferable scheme is as follows: the centers of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove are long strips, the two ends of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove are formed by combining diamond edges, and the length-width ratio of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove is slightly larger than 2:1, the left and right minimum units of the R, G and B chips placed in the array are in an isosceles triangle.
Wherein, the preferable scheme is as follows: the integrated display unit comprises integration of two columns and four rows of minimum LedRGB display units, wherein R, G and B chips of the minimum LedRGB display units at the first column position of the first row are sequentially arranged in the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove, and the R, G and B chips are distributed in an inverted isosceles triangle; the R, B and G chips of the minimum LedRGB display unit at the second column position of the first row are sequentially arranged in the first diamond-shaped groove, the second diamond-shaped groove, the third diamond-shaped groove and the R, B and G chips are distributed to form an isosceles triangle; the first columns of the second row, the first columns of the third row and the first columns of the fourth row are arranged according to a rule of simply copying the minimum LedRGB display units on the columns, and R, G, B chips R, B and G chips are distributed in an inverted isosceles triangle; the second row and the second column, the third row and the fourth row and the second column follow the regular arrangement of the minimum LedRGB display units of the second column of the first row, and the R, B and G chips are distributed in an inverted isosceles triangle.
Wherein, the preferable scheme is as follows: the B chip on the minimum LedRGB display unit on the first column and the R chip and the G chip of the minimum LedRGB display unit on the other column form an isosceles triangle; and the R chip and the G chip on the minimum LedRGB display unit on the second column and the B chip on the minimum LedRGB display unit on the second column form an inverted isosceles triangle.
The invention also comprises a manufacturing method of the integrated display unit for blocking the light color crosstalk of the MinLedRGB chip, which comprises the following steps: step one, punching a grid-shaped electrode plate by a metal substrate, wherein electrode plates of rows and columns of the grid-shaped electrode plate are correspondingly arranged according to the array distribution rule of R, G and B chips of an integrated display unit; step two, clamping and injection molding the upper part and the lower part of the grid-shaped electrode plate, wherein a light ray partition wall and an electrode sheet injection molding body are respectively formed on a light isolation bracket at the edge of the rhombic groove and the bottom of the grid-shaped electrode plate to form an integrated display unit bracket; step three, according to the regular layout of R, G and B chips which are alternately arranged at intervals of R, G, B in the two directions of rows and columns; electrode leads of the R, G and B chips are connected with the electrode plates, so that the electric polarity connection of the LED chips is realized; and fifthly, packaging and curing the R, G and B chips by using the LED packaging adhesive, and separating from the braid for mounting the display circuit board.
Wherein, the preferable scheme is as follows: in the first step, the grid-shaped electrode plate is punched into a plurality of rows of electrode plates, wherein the electrode plates comprise a first row of electrode plates, a second row of electrode plates, a third row of electrode plates, a fourth row of electrode plates, a fifth row of electrode plates, a sixth row of electrode plates, a seventh row of electrode plates and an eighth row of electrode plates, the first row of electrode plates, the third row of electrode plates, the fifth row of electrode plates and the seventh row of electrode plates of the through electrode are electrically connected with the R chip, and the second row of electrode plates, the fourth row of electrode plates, the sixth row of electrode plates and the eighth row of electrode plates and peripheral electrode connecting pins are negative electrodes.
Wherein, the preferable scheme is as follows: in the second step, the plastic is made of high-molecular high-temperature-resistant materials, the color is opaque black PPA, the glue injection machine is a high-speed glue injection machine, and the light partition wall of the thin layer is formed by glue injection.
Wherein, the preferable scheme is as follows: in the fourth step, R, G and B chips are alternately arranged at intervals of two rows and six columns; the positive electrode lead-out electrode plate of the LedRGB chip in the minimum LedRGB display unit is shared by all LedRGB chips forming the minimum LedRGB display unit of the line and is used as the line electrode lead of the line; the electrode plates with the four peripheral sides not penetrated form a LedRGB negative electrode connection lead plate, and the negative electrode lead plate can be connected with a plurality of 4 same-column same-color LED chip negative electrode leads to serve as single-color column leads of the column.
The beneficial effects of the invention are as follows: the beneficial effects of the invention include:
1. the light-isolating support is formed at the edge of the diamond-shaped groove through the structures of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove for accommodating the R, G, B chip, and then the light-isolating wall with the honeycomb-shaped structure is formed by injection molding, so that the light-isolating wall is thinner and better in stability;
2. the R, G, B chips are alternately arranged at R, G, B intervals in the two directions of rows and columns, so that the integration of small-space chips is realized, the cost is reduced, and the development requirement of the integration is better realized;
3. through the row and column arrangement of the grid-shaped electrode plates corresponding to the integrated display unit array structure, the stability of electric connection can be ensured, more electrode connection pins can be distributed in a limited space through the structure, and the integrated display unit array structure is more suitable for integration of products.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a first embodiment of a minimum unit of an integrated display unit with light color crosstalk blocking function according to the present invention;
FIG. 2 is a schematic diagram of a second embodiment of an integrated display unit with light color crosstalk blocking function according to the present invention;
FIG. 3 is a schematic diagram of a third embodiment of an integrated display unit with light color crosstalk blocking function according to the present invention;
FIG. 4 is a schematic diagram of a fourth embodiment of an integrated display unit with light color crosstalk blocking function according to the present invention;
FIG. 5 is a diagram showing a fourth embodiment of a chip with an integrated display unit for blocking light color crosstalk according to the present invention;
FIG. 6 is a schematic diagram showing a grid electrode 30 of a fourth embodiment of an integrated display unit for blocking light color crosstalk
Fig. 7 a-7 e are schematic views illustrating steps for fabricating an integrated display unit with light color crosstalk blocking function according to the present invention.
Wherein, each reference sign in the figure:
11 … first minimum LedRGB display unit;
12 … a second minimum LedRGB display unit;
121 … R chip; 122 … B chip; 123 … G chip
21 … first diamond-shaped groove; 22 … second diamond-shaped groove; 23 … third diamond-shaped groove; 30 … grid electrode plates; 1 … metal substrate; 312 … weld feet; 311 … electrode slice injection molding; 303 … electrical connection; 304 … electrode connection pins; 31 … first row electrode pads; 32 … second row electrode pads; 33 … third row electrode pad, 34 … fourth row electrode pad, 35 … fifth row electrode pad, 36 … sixth row electrode pad, 37 … seventh row electrode pad, 38 … eighth row electrode pad;
51 … light barrier wall; 61 … electrode lead; 71 ….
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Referring to fig. 1, R, G, B chips represent red, green and blue light chips, respectively. The minimum led rgb display unit 11 includes an R chip 121, a g chip 122, and a B chip 123 respectively disposed in the first rhombic groove 21, the second rhombic groove 22, and the third rhombic groove 23, where the first rhombic groove 21 is located in the first row, the second rhombic groove 22, and the third rhombic groove 23 are juxtaposed on one side of the first rhombic groove 21, the second rhombic groove 22, and the third rhombic groove 23 are in a central rectangular structure, and two ends are in a rhombic structure, and their aspect ratios are slightly greater than 2:1, the edges of the first rhombic groove 21, the second rhombic groove 22 and the third rhombic groove 23 form a light-isolating bracket, so that the light-isolating wall 51 can be conveniently formed at the edge of the light-isolating bracket in a subsequent injection molding process, and the light-isolating bracket with a honeycomb structure is formed by the first rhombic groove 21, the second rhombic groove 22 and the third rhombic groove 23, so that the thin light-isolating wall can be easily formed in injection molding. The R chip 121, the G chip 122 and the B chip 123 are respectively disposed at the appropriate positions of the first rhombic groove 21, the second rhombic groove 22 and the third rhombic groove 23, so that the R chip 121, the G chip 122 and the B chip 123 are arranged to form an inverted isosceles triangle, such as the portion connected by the dashed line in fig. 1 forms an inverted isosceles triangle, thereby meeting the chip arrangement requirement and making the light mixing more uniform.
Referring to fig. 2, on the basis of the first embodiment, an integrated arrangement is performed: the arrangement of the arrays is defined, the X-axis direction is defined as a row array, and the Y-axis direction is defined as a column array.
As shown in fig. 2: the array of columns adds another first display unit 11 on the first column of the first display unit 11 as the first column and the second row, the added first display unit 11 also has a first diamond-shaped groove 21, a second diamond-shaped groove 22 and a third diamond-shaped groove 23, the R chip 121, the g chip 122 and the B chip 123 are respectively placed in the first diamond-shaped groove 21, the second diamond-shaped groove 22 and the third diamond-shaped groove 23 in sequence, the third row and the fourth row can also be added on the first column, the arrangement mode is the same in the position relation of the R chip 121, the g chip 122 and the B chip 123, the same inverted isosceles triangle is laid out in the first display unit 11, the uniformity of light mixing is ensured, the display unit 11 of the smallest unit is not difficult to see, the plurality of the smallest first display units 11 can be continuously integrated on the basis of the above, and the positions of the R chip 121, the g chip 122 and the B chip 123 do not need to be changed.
Referring to fig. 3, if a second minimum led rgb display unit 12 is required to be added to the line, as shown in fig. 3: the added second display unit 12, the second display unit 12 also includes a first diamond-shaped groove 21, a second diamond-shaped groove 22, and a third diamond-shaped groove 23, in order that adjacent chips of the R chip 121 can form a R, G, B chip staggered arrangement of the minimum led rgb display unit, the adjacent chips are respectively and sequentially arranged in the first diamond-shaped groove 21, the second diamond-shaped groove 22, and the third diamond-shaped groove 23 are respectively an R chip 121, a B chip 123, and a G chip 122, the first diamond-shaped groove 21, the second diamond-shaped groove 22, and the R chip 121, the B chip 123, and the G chip 122 in the third diamond-shaped groove 23 are arranged in an isosceles triangle, the first diamond-shaped groove 21, the second diamond-shaped groove 22, and the R chip 121, the B chip 123, and the G chip 122 of the third diamond-shaped groove 23 are respectively, so as to ensure that the R chip 121, the B chip 123, the G chip are arranged in an isosceles triangle, the R chip 123, and the G chip 122 placed in the second display unit 12 in a horizontal arrangement are respectively, the R chip 121, the B chip 123, and the G chip 122 are arranged in a regular triangle, that the same order, that the R chip 121, the R chip 123, the B chip 123, the G chip 123, and the G chip 122 placed in the second display unit are arranged in the regular array, and the second diamond-shaped groove 12 are arranged in the same order, and the regular triangle, i.e., the first diamond-shaped groove 12 is changed, and the regular array, and the first diamond-shaped groove 11, and the first diamond-shaped groove and the R chip 23 and the second chip 11 are sequentially arranged.
From the first embodiment to the third embodiment, the smallest first display unit 11 not only can be simply duplicated and integrated and extended on the column, but also can be extended on the row following a certain rule, as shown in fig. 4: in this embodiment, the R chip 121, the G chip 122, and the B chip 123 of the minimum first display unit 11 at the first column position of the first row, and the R, B, and G chips are arranged in an inverted isosceles triangle; the R chip 121, the B chip 123 and the G chip 122 of the minimum second display unit 12 at the second column position of the first row form R, B and G chips which are distributed in an isosceles triangle; the R chip 121, the G chip 122 and the B chip 123 are distributed in an inverted isosceles triangle according to the rule of simply copying the smallest first display unit 11 on the column of the first column of the second row, and the third row, the first column and the fourth row are all arranged according to the rule of the smallest first display unit 11 on the column; similarly, the second column of the second row, the second column of the third row, and the second column of the fourth row follow the regular arrangement of the smallest second display unit 12 on the columns, that is, the R chip 121, the b chip 123, and the G chip 122 are laid out in a regular isosceles triangle. Furthermore, the B chip 123 on the smallest first display unit 11 on the first column and the R chip 121 and G chip 122 of the smallest first display unit 11 on the other first column form a regular isosceles triangle; the R chip 121 and the G chip 122 on the smallest second display unit 12 on the second column and the B chip 123 of the smallest second display unit 12 on the other form an inverted isosceles triangle. Therefore, the staggered layout of the R chip 121, the B chip 123 and the G chip 122 with a certain rule is realized, the color mixing of pixels is reduced, the pixel image information is realized, the integration of small-space chips is more favorably realized, the cost is reduced, and the development requirement of integration is better realized.
Fig. 5 is a schematic diagram of a R, G, B chip layout according to a third embodiment, in which in fig. 5, R represents an R chip, B represents a B chip, and G represents a G chip, as shown in fig. 5: a total of 24R chips 121, B chips 123 and G chips 122, R chips 121, B chips 123 and G chips 122 are arranged according to a 1:1:1, namely twelve R chips 121, twelve G chips 122 and twelve B chips 123; all the R chips 121, the B chips 123 and the G chips 122 are alternately arranged at intervals R, G, B in the two directions of rows and columns; the external drive display circuit lightens any adjacent R, G, B chips in different rows and columns under the drive of the row and column circuit, so that the mixed light and color mixing of pixels are realized, the pixel image information is restored, the light isolation support is formed at the edges of all the rhombic grooves, and then the light isolation wall 51 can be formed by injection molding, and the light isolation wall 51 with a honeycomb structure is formed by the edges of the rhombic grooves, so that the stability is better.
To match the electrical connection made under the integrated display unit shown in fig. 4, as shown in fig. 6: the grid electrode plate 30 is also composed of an array structure of rows and columns, and includes a first row electrode plate 31, a second row electrode plate 32, a third row electrode plate 33, a fourth row electrode plate 34, a fifth row electrode plate 35, a sixth row electrode plate 36, a seventh row electrode plate 37 and an eighth row electrode plate 38, where the first row electrode plate 31, the third row electrode plate 33, the fifth row electrode plate 35 and the seventh row electrode plate 37 are through electrode plates, i.e. the electrode plates are electrically connected from left to right, in this embodiment, the first row electrode plate 31, the third row electrode plate 33, the fifth row electrode plate 35 and the seventh row electrode plate 37 are correspondingly connected with the electrodes of the red chip 121 in fig. 4, of course, if the electrodes of the red chip 121 are set as the positive electrode, the first row electrode plate 31, the third row electrode plate 33, the fifth row electrode plate 35 and the seventh row electrode plate 37 of the through electrode are the positive electrode electrical connection paths, the remaining second row electrode plate 32, the fourth row electrode plate 34, the sixth row electrode plate 36, the eighth row electrode plate 38 and the peripheral electrode connection pins 304 are the negative electrode connection electrode plates, and the row-column design of the grid electrode plate 30 not only satisfies the arrangement rule of the integrated display unit of the third embodiment of fig. 4, but also ensures more connection pins while well realizing integration, and the electrode connection pins 304 on the grid electrode plate 30 in this embodiment may be provided with at least 20.
As shown in fig. 4, in order to achieve a better circuit connection: a connecting region 303 of the electrode lead 302 is arranged in the diamond-shaped groove; the grid-shaped electrode plate 30 is punched into the grid-shaped electrode plate 30 by arranging a sheet metal punching die; the surface of the electrode plate 31 needs plating treatment to facilitate chip electrode lead bonding or chip circuit soldering.
The present invention further includes a method for manufacturing an integrated display unit with light color crosstalk blocking function, please refer to fig. 7: comprising the following steps:
step one, as shown in fig. 7 a: punching a grid-shaped electrode plate 30 through a metal substrate 1, wherein electrode plates of rows and columns of the grid-shaped electrode plate 30 are correspondingly arranged according to the array distribution rule of R chips 121, B chips 123 and G chips 122 of the integrated display unit; preferably, the sheet metal is a copper sheet, and the punching die is a hardware high-speed punching die; the punched grid electrode plate 30 includes a plurality of rows of electrode plates, the plurality of rows of electrode plates punched by the grid electrode plate 30 include a first row electrode plate 31, a second row electrode plate 32, a third row electrode plate 33, a fourth row electrode plate 34, a fifth row electrode plate 35, a sixth row electrode plate 36, a seventh row electrode plate 37 and an eighth row electrode plate 38, but are not limited to 8 rows, finally welding pins 312 are formed at the edge of the grid electrode plate 30, and the surface of an electric connection area 303 of the electrode plates is silvered.
Step two, as shown in fig. 7 b: simultaneously injection molding the upper and lower sides of the grid-shaped electrode plate 30, and forming a light partition wall 51 and an electrode sheet injection molding body 311 at the edge of the diamond-shaped groove and the bottom of the metal plate 30 respectively; in the step, the plastic is preferably a high-molecular high-temperature-resistant material, and the color is opaque black PPA; the glue injection machine is a high-speed glue injection machine and meets the glue injection requirement of the thin-layer light partition wall 51.
Step three, as shown in fig. 7 c: according to the regular layout of the R chips 121, the B chips 123 and the G chips 122 which are alternately arranged at intervals R, G, B in the row direction and the column direction, the specific layout can be seen in FIG. 5;
step four, as shown in fig. 7 d: the electrode leads 302 of the R chip 121, the b chip 123 and the G chip 122 are connected to the electrode plate 30;
step five, as shown in fig. 7 e: and finally, packaging the R chip 121, the B chip 123 and the G chip 122 by using the packaging adhesive 71.
Finally, the method also comprises a plurality of conventional steps, wherein the threshing unit displays the aggregate, and finally the aggregate tests the braid patch welding display driving plate.
In the process of manufacturing the third embodiment of fig. 4, the minimum display units of R, G, B chips are distributed in four rows and two columns, and 4*6 =24 chips are shared, and the RGB chips are configured in a 1:1:1 ratio, namely, 12R chips, 12G chips and 12B chips; the chips are alternately arranged at R, G, B intervals in the two directions of rows and columns;
preferably, in the process of the method, in the second and third steps, the injection molding body 311 is arranged according to the light partition wall 51 and the connected grid-shaped electrode plate 30 of the set array rhombic groove, the connected coiled belt electrode connection area 303 is dragged into the injection molding die in a segmented manner by an injection molding machine and is injected in a segmented manner, so that the connected display unit formed by plastic and provided with the grid-shaped electrode plate 30, the electric connection area 303, the first rhombic groove 21, the second rhombic groove 22, the third rhombic groove 23 and the light partition wall 51 is integrated into a whole outer shell;
in the fourth step, R, G, B chips 121, 122, 123 are alternately arranged at intervals of four rows and six columns; wherein, the R chip 121 is stuck by conductive silver adhesive, and the B and G chips 122 and 123 are stuck by insulating adhesive; the electrode positive electrode leads of the B and G chips 122 and 123 are welded to the electric connection area 303 of the same electrode plate 30 as the positive electrode of the R chip 121 by utilizing an ultrasonic gold wire bonding machine, and serve as a row electrode lead 302 in common for the row R, G, B; the negative electrode leads of the R, G, B chips 121, 122 and 123 in the same column are bonded on the electrode plates of the chips in the same column and serve as independent negative electrode leads of the single-color R single-color G single-color B of the column; as an extension, the invention can also select any single kind of LED flip chip or RGB three-color chip, and two kinds of flip chip groups are RGB pixels; the inverted chip electrode is directly welded on two adjacent electrode plates 31 in the diamond groove to be used as the lead wire of the positive electrode and the negative electrode of the chip;
the preferred R, G, B chips 121, 122, 123 are normal chips, and the R, G, B chips 121, 122, 123DE electrode leads 302 are gold wire bonded; the anodes of the R, G, B chips 121, 122, 123 are preferably shared as row lines; the negative electrode leads of the R, G, B chips 121, 122, 123 are column lead wires.
Preferably, after the R, G, B chips 121, 122 and 123 are fixedly arranged and the electrode leads 302 are connected, encapsulating and protecting glue is dripped into the first diamond-shaped groove 21, the second diamond-shaped groove 22 and the third diamond-shaped groove 23 to solidify and protect the chips, the encapsulated integrated display unit 11 is dried and threshed, and the integrated display unit can be welded on a display lamp panel by an SMT process after braiding is detected; preferably, the encapsulation glue 71 is epoxy glue and a color dispersion agent is added.
The beneficial effects of the invention include:
1. the light-isolating bracket is formed at the edge of the diamond-shaped groove through the structures of the first diamond-shaped groove 21, the second diamond-shaped groove 22 and the third diamond-shaped groove 23 for accommodating the R, G, B chips 121, 122 and 123, and then the light-isolating wall 51 with the honeycomb structure is formed by injection molding, so that the light-isolating wall is thinner and better in stability;
2. through the arrangement of the R chip 121, the B chip 123 and the G chip 122 in the two directions of row and column, R,
G. B is alternately arranged at intervals, so that the integration of chips with small pitches is realized, the cost is reduced, and meanwhile, the development requirement of the integration is better realized;
3. by arranging the rows and columns of the grid electrode plates 30 corresponding to the integrated display cell array structure, not only can the stability of the electrical connection be ensured, more electrode connection pins 304 can be laid out in a limited space through the structure,
the method is more suitable for integration of products.
The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention, but any modifications, equivalents, improvements, etc. within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. An integrated display unit for blocking light color crosstalk of MinLEDCRGB chips, which is characterized in that: the integrated display unit is integrated by the minimum LEDRGRGB display units which are orderly arranged in rows and columns, R, G and B chip columns of the minimum LEDRGRGB display units which are adjacent left and right are distributed in an inverted isosceles triangle and an isosceles triangle alternately, packaging light-isolating supports of the R, G and B chips are honeycomb structures surrounding the R, G and B chips, and electrode pins of the rows and the columns of the grid electrode plates are correspondingly arranged according to the row and column distribution of the integrated display units; the minimum LEDRRGB display unit comprises R, G and B chips which are respectively arranged in a first diamond-shaped groove, a second diamond-shaped groove and a third diamond-shaped groove, wherein the first diamond-shaped groove is vertically arranged, the second diamond-shaped groove and the third diamond-shaped groove are transversely arranged, and the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove and the outer walls of the integrated display unit are integrally injection molded; the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove are characterized in that the centers of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove are long strips, and the two ends of the first diamond-shaped groove and the second diamond-shaped groove are diamond-shaped edges, and the length-width ratio of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove is larger than 2:1, a step of;
the integrated display unit comprises two columns and four rows of minimum LEDRGRGB display units, wherein R, G and B chips of the minimum LEDRGRGB display units at the first column position of the first row are sequentially arranged in a first diamond-shaped groove, a second diamond-shaped groove and a third diamond-shaped groove, and the R, G and B chips are distributed in an inverted isosceles triangle; the R, B and G chips of the minimum LEDRRGB display unit at the second column position of the first row are sequentially arranged in the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove, and the R, B and G chips are distributed in an isosceles triangle; the R, B and G chips are distributed in an inverted isosceles triangle shape according to the rule of simply copying the minimum LEDRGRGB display units on the first row and the first column; the second row, the second column, the third row, the second column and the fourth row follow the regular arrangement of the minimum LEDRGRGB display units on the second column of the first row, and the R, B and G chips are distributed to form an isosceles triangle;
the B chip of the minimum LEDRGRGB display unit at the first column position, the R chip and the G chip of the other minimum LEDRGRGB display unit at the first column form an isosceles triangle; the R chip and the G chip on the minimum LEDRGb display unit at the second column position and the B chip on the other minimum LEDRGb display unit at the first column position form an inverted isosceles triangle;
in order to realize electrical connection under the integrated display unit, the grid-shaped electrode plate is also composed of an array structure of rows and columns, and comprises a first row electrode plate, a second row electrode plate, a third row electrode plate, a fourth row electrode plate, a fifth row electrode plate, a sixth row electrode plate, a seventh row electrode plate and an eighth row electrode plate; the first row electrode plate, the third row electrode plate, the fifth row electrode plate and the seventh row electrode plate are through electrode plates, namely the electrode plates are electrically communicated from left to right; the first row electrode plate, the third row electrode plate, the fifth row electrode plate and the seventh row electrode plate are correspondingly connected with the electrodes of the R chip; if the electrode of the R chip is set as the positive electrode, the first row electrode plate, the third row electrode plate, the fifth row electrode plate and the seventh row electrode plate of the through electrode plate are electrical connection paths of the positive electrode, and the rest of the second row electrode plate, the fourth row electrode plate, the sixth row electrode plate, the eighth row electrode plate and peripheral electrode connection pins are negative electrode connection electrode plates;
a connecting area of the electrode lead is arranged in the diamond-shaped groove; the grid-shaped electrode plate is punched into the grid-shaped electrode plate by arranging a sheet metal punching die; the surface of the electrode plate is plated so as to be beneficial to chip electrode lead bonding or inverted chip circuit welding.
2. The manufacturing method of the integrated display unit for blocking the light color crosstalk of the MinLEDRGb chip is characterized by comprising the following steps:
step one, punching a grid-shaped electrode plate by a metal substrate, wherein electrode plates of rows and columns of the grid-shaped electrode plate are correspondingly arranged according to the array distribution rule of R, G and B chips of an integrated display unit; the integrated display unit comprises two columns and four rows of minimum LEDRGRGB display units, wherein R, G and B chips of the minimum LEDRGRGB display units at the first column position of the first row are sequentially arranged in a first diamond-shaped groove, a second diamond-shaped groove and a third diamond-shaped groove, and the R, G and B chips are distributed in an inverted isosceles triangle; the R, B and G chips of the minimum LEDRRGB display unit at the second column position of the first row are sequentially arranged in the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove, and the R, B and G chips are distributed in an isosceles triangle; the R, B and G chips are distributed in an inverted isosceles triangle shape according to the rule of simply copying the minimum LEDRGRGB display units on the first row and the first column; the second row, the second column, the third row, the second column and the fourth row follow the regular arrangement of the minimum LEDRGRGB display units on the second column of the first row, and the R, B and G chips are distributed to form an isosceles triangle;
the B chip of the minimum LEDRGRGB display unit at the first column position, the R chip and the G chip of the other minimum LEDRGRGB display unit at the first column form an isosceles triangle; the R chip and the G chip on the minimum LEDRGb display unit at the second column position and the B chip on the other minimum LEDRGb display unit at the first column position form an inverted isosceles triangle;
the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove are characterized in that the centers of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove are long strips, and the two ends of the first diamond-shaped groove and the second diamond-shaped groove are diamond-shaped edges, and the length-width ratio of the first diamond-shaped groove, the second diamond-shaped groove and the third diamond-shaped groove is larger than 2:1, a step of;
in order to realize electrical connection under the integrated display unit, the grid-shaped electrode plate is also composed of an array structure of rows and columns, and comprises a first row electrode plate, a second row electrode plate, a third row electrode plate, a fourth row electrode plate, a fifth row electrode plate, a sixth row electrode plate, a seventh row electrode plate and an eighth row electrode plate; the first row electrode plate, the third row electrode plate, the fifth row electrode plate and the seventh row electrode plate are through electrode plates, namely the electrode plates are electrically communicated from left to right; the first row electrode plate, the third row electrode plate, the fifth row electrode plate and the seventh row electrode plate are correspondingly connected with the electrodes of the R chip; if the electrode of the R chip is set as the positive electrode, the first row electrode plate, the third row electrode plate, the fifth row electrode plate and the seventh row electrode plate of the through electrode plate are electrical connection paths of the positive electrode, and the rest of the second row electrode plate, the fourth row electrode plate, the sixth row electrode plate, the eighth row electrode plate and peripheral electrode connection pins are negative electrode connection electrode plates;
a connecting area of the electrode lead is arranged in the diamond-shaped groove; the grid-shaped electrode plate is punched into the grid-shaped electrode plate by arranging a sheet metal punching die; the surface of the electrode plate is subjected to plating treatment, so that chip electrode lead bonding or inverted chip circuit welding is facilitated;
step two, clamping and injection molding the upper part and the lower part of the grid-shaped electrode plate, wherein a light ray partition wall and an electrode sheet injection molding body are respectively formed on a light isolation bracket at the edge of the rhombic groove and the bottom of the grid-shaped electrode plate to form an integrated display unit bracket;
step three, according to the regular layout of R, G and B chips which are alternately arranged at intervals of R, G, B in the two directions of rows and columns;
electrode leads of the R, G and B chips are connected with the electrode plates, so that the electric polarity connection of the LED chips is realized;
and fifthly, packaging and curing the R, G and B chips by using the LED packaging adhesive, and separating from the braid for mounting the display circuit board.
3. The method for manufacturing the integrated display unit for blocking the photochromic crosstalk of the MinLEDCRGB chip as set forth in claim 2, wherein the method comprises the steps of: in the second step, the plastic is made of high-molecular high-temperature-resistant materials, the color is opaque black PPA, the glue injection machine is a high-speed glue injection machine, and the light partition wall of the thin layer is formed by glue injection.
4. The method for manufacturing the integrated display unit for blocking the photochromic crosstalk of the MinLEDCRGB chip as set forth in claim 2, wherein the method comprises the steps of: in the fourth step, R, G and B chips are alternately arranged at intervals of two rows and six columns; the positive electrode of the LEDCRGB chip in the minimum LEDCRGB display unit leads out an electrode sheet, and all the LEDCRGB chips forming the minimum LEDCRGB display unit share the positive electrode and serve as a row electrode lead; the electrode plates with the four peripheral sides not penetrated form LEDRGb negative electrode connecting lead plates, and the negative electrode lead plates are connected with a plurality of same-column same-color LED chip negative electrode leads to serve as column single-color column leads.
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