CN211124837U

CN211124837U - Mini L ED lamp pearl and L ED display screen of convenient wiring

Info

Publication number: CN211124837U
Application number: CN202020089119.1U
Authority: CN
Inventors: 金重星; 何昆鹏; 吴振志; 吴涵渠
Original assignee: Shenzhen Aoto Electronics Co Ltd
Current assignee: Shenzhen Aoto Electronics Co Ltd
Priority date: 2020-01-16
Filing date: 2020-01-16
Publication date: 2020-07-28
Anticipated expiration: 2030-01-16

Abstract

The application relates to a mini L ED lamp bead and L ED display screen convenient for wiring, wherein the mini L ED lamp bead comprises a lamp body, a plurality of L ED chips and a plurality of pin bonding pads, the lamp body comprises a light-emitting surface and a bonding pad surface which are oppositely arranged, the L ED chips are arranged on the light-emitting surface, the pin bonding pads are arranged on the bonding pad surface, the L ED chips are electrically connected with the pin bonding pads, the pin bonding pads are arranged on different sides of the bonding pad surface, a wire passing region is formed between every two adjacent pin bonding pads on different sides, at least one lead wire is allowed to pass through the width of the wire passing region, at least two lead wires are allowed to pass through the space between the pin bonding pads on the same side, more lead wires can be arranged in the region of the PCB bonding pad layer corresponding to the mini L ED lamp bead, so that the lead wires between the adjacent mini L ED lamp beads can be arranged on the PCB bonding pad layer, the number of the.

Description

Mini L ED lamp pearl and L ED display screen of convenient wiring

Technical Field

The application relates to L ED lamp pearl field, especially relates to a mini L ED lamp pearl and L ED display screen of convenient wiring.

Background

L ED has high luminance, energy-conservation, environmental protection, response speed is fast, the color is beautiful and long service life, etc., have obtained extensive application in fields such as illumination, demonstration, etc. especially L ED display screen, the scene such as being used in indoor and outdoor demonstration, monitoring center, advertisement/media show, stage, etc. extensively, with the continuous development of technology, the resolution ratio of the picture is higher and higher, L ED display screen's dot interval is littleer and smaller, in order to realize the little interval L ED display screen, especially the dot interval below 1.5mm, the scheme of mini L ED has been proposed in the trade, compound multiunit L ED chip on a lamp pearl.

Fig. 1 shows a pin pad structure of an existing four-in-one mini L ED lamp bead, which can achieve a dot pitch of 1.2mm, and 8 pin pads in total, namely a common pin pad C1, a common pin pad C2, and a control pin pad R1, a common pin pad G1, a common pin pad B1, a common pin pad R2, a common pin pad G2, and a common pin pad B2, 8 pin pads are uniformly distributed in the circumferential direction of the bottom surface of the lamp bead, and the pitch between the pads is only 0.37mm when a lamp panel of a mini L ED display screen is manufactured by using the mini L ED lamp bead, the same control pin pads of the mini L lamp beads in the same column are connected in series by using leads to achieve dynamic scanning control, so as to achieve image display of a L display screen, according to the requirements of an existing PCB manufacturing process, the minimum line width and the pitch requirements are respectively 4mil, 4mil (1 is equal to 0.0254mm, 4mil is equal to equal 0.1.1 mil, equal to 0.1.1 mm, equal to 0.1mm, the lead pad.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to evenly set up the pin pad to current mini L ED lamp pearl in bottom surface circumference, can only set up a lead wire between the pin pad, need increase the PCB layer, just can lay all lead wires between the adjacent mini L ED lamp pearl, lead to the design degree of difficulty angle of PCB board, the higher problem of manufacturing cost has proposed a mini L ED lamp pearl and L ED display screen that make things convenient for the wiring.

An embodiment of the application provides a mini L ED lamp pearl of convenient wiring, including lamp body, a plurality of L ED chips and a plurality of pin pad, the lamp body includes relative light emitting surface and the solder pad face that sets up, L ED chip sets up in on the light emitting surface, the pin pad sets up in on the solder pad face, L ED chip with the pin pad electricity is connected;

the plurality of pin bonding pads are arranged on different sides of the bonding pad surface, a wire passing area is formed between every two adjacent pin bonding pads on different sides, the wire passing area has a preset width, and the width of the wire passing area allows at least one lead to pass through; the spacing between the pin pads on the same side allows at least two wires to pass through.

In some embodiments, the width of the wire passing region and the spacing between the pin pads on the same side satisfy the following requirements:

width of the line-passing region > (minimum line width of the wire +2 wire-spacing requirement);

pitch between the lead pads located on the same side > (minimum width of 2 leads + pitch requirement of 3 leads).

In some embodiments, the mini L ED lamp bead comprises a plurality of groups L ED pixels, each group L ED pixel comprises a red light L ED chip, a green light L ED chip and a blue light L ED chip, and the L ED pixel array is arranged on the light-emitting surface.

In some embodiments, the liquid crystal display comprises 4 groups of L ED pixels and 8 pin pads, wherein the pin pads comprise a control pin pad and a common electrode pin pad, a first electrode of a L ED chip of L ED pixels in the same row is connected with the same common electrode pin pad, and a second electrode of a L ED chip of the same color of L ED pixels in the same column is connected with the same control pin pad;

each side of the surface of the welding disk is provided with 2 pin welding disks, and each pin welding disk is adjacent to the wire passing area.

In some embodiments, the first pole is an anode of L ED chips and the second pole is a cathode of L ED chips.

In some embodiments, the common pole pin pads are located on the same side or different sides of the pad face.

In some embodiments, the device comprises 9 groups of L ED pixels and 12 pin pads, wherein the pin pads comprise a control pin pad and a common electrode pin pad, a first electrode of a L ED chip of a L ED pixel in the same row is connected with the same common electrode pin pad, and a second electrode of a L ED chip of the same color of a L ED pixel in the same column is connected with the same control pin pad;

each side of the surface of the welding disk is provided with 3 pin welding disks, wherein 2 pin welding disks are arranged adjacent to the wire passing area, and the rest 1 pin welding disk is arranged at the central line position.

In some embodiments, the width of the wire passing region is configured to allow at least two wires to pass through.

In some embodiments, the minimum line width and spacing requirements of the leads are 4 mils and 4 mils, respectively, the width of the wire passing region is greater than 20 mils, and the spacing between the pin pads on the same side is greater than 20 mils.

An embodiment of the application also provides an L ED display screen, uses the mini L ED lamp pearl of convenient wiring of any preceding embodiment.

In the mini L ED bead provided by the embodiment of the application, no pin pad is arranged at the corner position of the welding disk surface, the pin pads at the corner position only influence the space between the pin pads at the same side, and the space between the pin pads at the same side can be relatively increased to allow two leads to pass through, so that more leads can be arranged in the area of the PCB bead layer corresponding to the mini L ED bead, so that the arrangement of the leads between the adjacent mini L ED beads can be finished on the PCB bead layer, the number of the PCB bead layers is reduced, and the design difficulty and the production cost of the PCB are reduced.

Drawings

FIG. 1 is a schematic structural diagram of a solder pad surface of a conventional mini L ED lamp bead;

fig. 2 is a schematic structural diagram of a mini L ED lamp bead according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a solder pad surface of a mini L ED lamp bead according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a solder pad surface of a mini L ED lamp bead according to another embodiment of the present application;

FIG. 5 is a schematic structural diagram of a solder pad surface of a mini L ED lamp bead according to another embodiment of the present application;

FIG. 6 is a circuit diagram illustrating the connection between an L ED chip and a pin pad in an embodiment of the present application;

FIG. 7 is a circuit diagram of the connection between an L ED chip and a pin pad in another embodiment of the present application;

FIG. 8 is a PCB wiring diagram of a mini L ED lamp bead applying the embodiment of the present application;

FIG. 9 is a PCB wiring diagram of a mini L ED lamp bead applying another embodiment of the present application.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

As shown in fig. 2 and 3, an embodiment of the present application provides a mini L ED lamp bead 10 convenient for wiring, including a lamp body 110, a plurality of L ED chips 121 and a plurality of pin pads 130, where the lamp body 110 includes a light emitting surface 110a and a pad surface 110b that are oppositely disposed, the L ED chip 121 is disposed on the light emitting surface 110a, the pin pads 130 are disposed on the pad surface 110b, and the L ED chip 121 is electrically connected to the pin pads 130;

the pad surface 110b may be square, the plurality of pin pads 130 are disposed on different sides of the pad surface 110b, a wire passing region 111 is formed between two adjacent pin pads 130 on different sides, the wire passing region 111 has a preset width, and the width L2 of the wire passing region allows at least one lead to pass through, and the space L1 between the pin pads 130 on the same side allows at least two leads to pass through.

As shown in FIG. 3, the wire passing region 111 is disposed corresponding to a corner of the pad surface 110b, and the width L2 of the wire passing region 111 is the minimum distance between the pin pads 130 on both sides of the wire passing region 111. for example, the width L2 of the wire passing region 111 and the spacing L1 between the pin pads on the same side can satisfy the following requirements:

According to the PCB manufacturing process requirements of the conventional L ED display, the minimum line width and the pitch of one lead on the PCB of the conventional L ED display are respectively 4 mils and 4 mils (4 mils approximately equal to 0.1mm), in order to allow the lead to pass through at least 4 mils 3 to 12 mils (approximately equal to 0.3mm), the width of two leads to pass through at least 4 mils 5 to 20 mils (approximately equal to 0.5mm), for example, the width L2 of the wire passing region 111 is greater than 0.3mm, and the pitch L1 between the lead pads 130 on the same side is greater than 0.5mm under the process requirements of the minimum line width and the pitch of the leads of 4 mils and 4 mils.

It is understood that other allowable and smaller minimum line width and spacing requirements may be applied to a lead according to different process requirements, the width L2 of the wire passing region 111 and the spacing L1 between the lead pads 121 on the same side may be adjusted to corresponding sizes according to different process requirements.

In the mini L ED lamp bead provided by the embodiment of the application, no pin pad is arranged at the corner position of the welding disk surface 110, the pin pads 130 at the corner position only influence the space between the pin pads 130 at the same side, and the space between the pin pads 130 at the same side can be relatively increased to allow two leads to pass through.

L ED chip 121 can include red light L ED chip (R chip), green light L0 ED chip (G chip) and blue light L1 ED chip (B chip) specifically to form full-color display mini L ED lamp pearl 10 can be provided with a plurality of groups L ED pixel 120, each group L ED pixel 120 includes a red light L ED chip (R chip), a green light L ED chip (G chip) and a blue light L ED chip (B chip). in mini L ED lamp pearl 10, L ED pixel 120 can be arranged in array on light emitting surface 110a, such as 2 x 2, 2 x 3, 2 x 4, 3 and the like.

In some embodiments, the mini L ED light bead 10 may be provided with 4 groups L ED pixels 120 arranged in a 2 × 2 array.

As shown in fig. 3 and 6, 4 groups L ED pixels 120 are arranged in a 2 × 2 array, and each of the pin pads 130 specifically includes a control pin pad 131 and a common electrode pin pad 132, a first electrode of a L ED chip of a L ED pixel 120 in a same row is connected to a same common electrode pin pad 132-C1 or C2, and a second electrode of a L ED chip 121 of a same color of a L ED pixel 120 in a same column is connected to a same control pin pad 131-R1, G1, B1, R2, G2, and B2, so that mini L ED beads 10 have 8 pin pads 130 in total, 2 pin pads 130 are disposed on each side of the pad surface 110B, and each of the pin pads 130 is disposed adjacent to one of the line passing regions 111.

When the first electrode is the cathode of the L ED chip and the second electrode is the anode, the mini L ED lamp bead 10 adopts the scheme of common cathode connection, and when the first electrode is the anode of the L ED chip and the second electrode is the cathode, the mini L ED lamp bead 10 adopts the scheme of common anode connection.

When the mini L ED lamp beads of the embodiment are adopted to manufacture a lamp panel of a L ED display screen, the control pin bonding pads 131 of the lamp beads in the same row on the lamp panel are connected in series to be connected with a row driving module to realize scanning driving, for example, the mini L ED lamp beads are provided with 6 control pin bonding pads 131, namely R1, G1, B1, R2, G2 and B2, so that 6 leads are needed to be connected in series with the control pin bonding pads 131 of adjacent mini L ED lamp beads, and fig. 8 shows a PCB wiring diagram when the mini L ED lamp beads of the embodiment of the application are adopted, the layout of 6 leads can be realized on the bonding pad layer of a PCB, other PCB layers are not needed to be added, the leads for connecting the control pin bonding pads 131 of the adjacent mini L ED lamp beads are arranged, the PCB is reduced, and the related difficulty and the production cost of the PCB are reduced.

In the drawings 3 and 8, the common-pole pin pads 132-C and C of the mini ED lamp beads are positioned on the same side of the surface 110B of the welding disk, the up-and-down adjacent mini ED lamp beads are provided with 6 leads connected with control pin pads, the control pin pads are respectively R, G, B, R, G and B, the corresponding connection leads can be simply referred to as lead R, lead G, lead B, lead R, lead G and lead B2. As shown in the drawing 8, the 6 leads can be arranged in the region of the PCB corresponding to the mini ED on the welding disk layer, concretely, the lead G can pass through the wire passing region between the pin pads C and R of the upper lamp beads and be connected with the pin pad G of the lower lamp beads, the lead R and the lead R can pass through the space between the pin pads G and B of the lower lamp beads and be connected with the pin pads B of the lower welding disk, the lead B can pass through the wire passing region between the pin pads R and G of the lower lamp beads and be connected with the pin pad B of the lower lamp beads, and the lead B can pass through the same wire connecting region between the pin pads B of the pin pads.

In some embodiments, as shown in fig. 5 and 9, the common-pole pin pads 132-C1, C2 of the mini L ED lamp bead may also be located on different sides, such as opposite sides, of the pad surface 110B, as shown in fig. 9, the 6 leads connected with the control pin pads 132 may be arranged in a region of the pad layer of the PCB corresponding to the mini L ED, specifically, the lead G1 may pass through a space region with the left lamp bead and be connected with the pin pad G1 of the lower lamp bead, the lead R1 may pass through a wire passing region between the pin pads B1 and C1 of the lower lamp bead and be connected with the pin pad R1 of the lower lamp bead, the leads B1 and B2 may pass through a space between the pin pads R1 and R2 of the upper lamp bead and be connected with the pin pads B1 and B2 of the lower lamp bead, the lead R2 may pass through a wire passing region between the pin pad R45 and C2 of the lower lamp bead and pass through a space region between the wire bead R5 and the lead 58g 23 and connect with the right side of the lower lamp bead and the lead 58g.

In some embodiments, the mini L ED beads 10 may be provided with 9 groups L ED pixels 120 arranged in a 3 × 3 array.

As shown in fig. 4 and 7, the first poles of the L ED chips of the L ED pixels 120 in the same row are connected to the same common pole pin pad 132-C1, C2, C3, the second poles of the L ED chips 121 of the same color of the L ED pixels 120 in the same column are connected to the same control pin pad 131-R1, G1, B1, R2, G2, B2, R3, G3, B3. thus, the mini L ED lamp bead 10 has 12 pin pads 130 in total, 3 pin pads 130 are respectively disposed on each side of the pad surface 110B, wherein 2 pin pads are disposed adjacent to the line passing region 111, and the other 1 pin pad is disposed at the center line position.

To enable routing of the leads connecting the control pin pads 131 of adjacent mini L ED beads at the PCB pad layer, the width L2 of the wire passing region 111 can also be set to allow at least two leads to pass through, illustratively, when the minimum line width and pitch requirements of one lead are 4 mils and 4 mils, respectively, the width L2 of the wire passing region 111 can be set to be greater than 20 mils (approximately equal to 0.5 mm).

Another embodiment of this application still provides an L ED display screen, has used the mini L ED lamp pearl of the convenient wiring of preceding embodiment.

Because used preceding embodiment the mini L ED lamp pearl of convenient wiring, can reduce the PCB number of piles of the lamp plate of L ED display screen, reduced PCB and related degree of difficulty and manufacturing cost.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The mini L ED lamp bead convenient for wiring is characterized by comprising a lamp body, a plurality of L ED chips and a plurality of pin bonding pads, wherein the lamp body comprises a light-emitting surface and a bonding pad surface which are oppositely arranged, the L ED chips are arranged on the light-emitting surface, the pin bonding pads are arranged on the bonding pad surface, and the L ED chips are electrically connected with the pin bonding pads;

2. The mini L ED lamp bead of claim 1, wherein the width of the wire passing region and the spacing between the pin pads on the same side satisfy the following requirements:

3. The mini L ED lamp bead of claim 1 or 2, wherein the mini L ED lamp bead comprises a plurality of groups of L ED pixels, each group of L ED pixels comprises a red L ED chip, a green L ED chip and a blue L ED chip, and the L ED pixel array is arranged on the light-emitting surface.

4. The mini L ED lamp bead of claim 3, comprising 4 groups of L ED pixels and 8 pin pads, the pin pads including control pin pads and common electrode pin pads, wherein a first electrode of L ED chips of L ED pixels in a same row is connected to a same common electrode pin pad, and a second electrode of L ED chips of L ED pixels in a same column is connected to a same control pin pad;

5. The mini L ED lamp bead of claim 4, wherein the first pole is an anode of L ED chips and the second pole is a cathode of L ED chips.

6. The mini L ED lamp bead of claim 4, wherein the common pole pin pads are located on the same side or different sides of the pad surface.

7. The mini L ED lamp bead of claim 3, which includes 9 groups of the L ED pixels and 12 the pin pads, the pin pads include control pin pads and common electrode pin pads, a first electrode of L ED chips of L ED pixels in a same row is connected to a same common electrode pin pad, and a second electrode of L ED chips of the same color of L ED pixels in a same column is connected to a same control pin pad;

8. The mini L ED lamp bead of claim 7, wherein the width of the wire passing region is configured to allow at least two wires to pass through.

9. The mini L ED lamp bead of claim 8, wherein the minimum line width and the spacing requirement of the lead lines are 4mil and 4mil respectively, the width of the wire passing area is greater than 20mil, and the spacing between the pin pads on the same side is greater than 20 mil.

10. An L ED display screen, characterized in that, the mini L ED lamp bead convenient for wiring of claims 1-9 is used.