CN221008580U - Grid type LED display screen - Google Patents

Abstract

The utility model relates to the technical field of LEDs, and discloses a grid type LED display screen, which comprises: a bottom plate with at least two wiring layers, a plurality of pixel points arranged on the surface layer of the bottom plate, a scanning chip and a driving chip; a plurality of connecting lines extending along the transverse direction, a plurality of scanning lines extending along the longitudinal direction and a plurality of driving lines are arranged on the bottom plate; the scanning lines and the driving lines and the connecting lines are respectively arranged on different wiring layers of the bottom plate; each scanning line is used for connecting the common poles of all the lamp beads of each pixel point of the corresponding column together and then connecting the common poles with the scanning chip; each connecting wire is used for connecting the independent poles of the same color lamp beads of each pixel point of the corresponding row and then connecting one end of the corresponding driving wire through the corresponding wire through hole; each driving line is used for connecting the corresponding connecting line to the driving chip of the corresponding color. The utility model fully utilizes the existing mature lamp bead packaging and chip packaging modes, and greatly reduces the realization difficulty of a transparent screen scheme while reducing investment.

Description

Grid type LED display screen

Technical Field

The utility model relates to the technical field of display screens, in particular to a grid type LED display screen.

Background

The grid-type LED display screen refers to: a through hole is formed in a bottom plate for packaging the LED lamp beads, so that the display module can have a certain permeability, and the screen can not completely shield the application of a scene behind the screen; the application is mainly applied to a transparent screen scheme, and also applied to a backlight light source, a lamp strip light source and the like.

The key characteristic of the grid-type LED display screen is the screen permeability, and the effect of the grid-type LED display screen is to represent the coverage degree of the screen to a scene behind the screen. For transparent screen applications, the lower the hiding level, the better, i.e. the permeability is as high as possible. However, in terms of screen display effect, to ensure brightness, contrast and resolution of the screen itself, the desired permeability is as low as possible, which is an contradictory requirement.

The core component forming the grid-type LED display screen comprises lamp beads, a bottom plate and a driving chip, and is mainly characterized in that a plurality of through holes penetrating through the bottom plate are distributed on the bottom plate, and the lamp beads and the driving chip consider how to avoid the through holes when laying out and wiring so that the whole display module can show a semitransparent effect.

For the grid-type LED display screen, a plurality of through holes are distributed on the bottom plate, so that a plurality of limitations are brought to the arrangement of the lamp beads and the driving wiring.

Specifically, the driving mode of the existing LED lamp beads is scanning driving, that is, on a certain number of LED arrays, for example, a 4x4 array, anodes of the lamp beads in the same row are connected together, cathodes of the lamp beads in the same column are connected together, and 4 rows and 4 columns are arranged in total in the transverse direction and the longitudinal direction. When a specific lamp bead is required to be conducted, the current row chip and the current column chip are conducted to light the lamp bead. In the form shown in figure 1. The scanning chip scans the lamp beads line by line, and the column driving chip synchronously lightens the lamp beads required to be lightened in the current line when the current line is scanned, so that the lamp beads are rapidly scanned and refreshed, and the display of one picture is completed.

Based on this, both the row scan chip and the column driver chip need to be displayed in a specific wiring arrangement with the display panel.

In the prior art, the row and column chips can be placed on the back surface of the bottom plate, the lamp beads are placed on the front surface of the bottom plate, the bottom plate is usually a PCB or an aluminum substrate, and the wiring is connected with the front surface and the back surface through the through holes penetrating through the bottom plate, so that the row and column chips are connected with the corresponding lamp beads.

The scanning driving has the advantages that a plurality of lamp beads can be driven simultaneously by using fewer driving chips, so that the number of chips can be greatly reduced, and the packaging density of the lamp beads is improved. The problem is that the number of wirings increases, and particularly, a larger space wiring is often required around the driving chip. Considering the influence of line loss, chip carrying and the like, the number of through holes on the board is also very large, which directly increases the processing difficulty of the module and also influences the stability of the module.

Based on this, current scheme also can arrange lamp pearl, driver chip etc. in same side, all put promptly in the front of module. The back of the module serves as a jumper layer to provide jumper space for conflicting lines. But is limited by a plurality of through holes formed on the bottom plate, and the arrangement positions of the chips are very limited.

Further, in order to ensure that wiring on the display module is as concise as possible, the prior scheme is that the driving chip is packaged in each lamp bead in a mode of combining the lamp beads and the driving chip, so that a space for the driving chip is not required to be reserved on a board, the lamp beads are packaged, wiring density on a bottom plate is reduced, and accordingly larger-size through holes can be formed in the bottom plate, and the permeability and resolution can be as high as possible.

However, this requires redesigning the bead package and driving architecture, directly resulting in increased cost of the whole screen, making the product itself non-competitive.

Based on this, in order to further reduce the cost, a mature and popular driving scanning form, a universal driving chip and a lamp bead packaging base are needed to be utilized, and a high-permeability and high-resolution LED display module is designed, so that the problem of a large number of layout and wiring on a bottom plate in the scanning driving form needs to be solved, and meanwhile, the problems of cost and stability are also compatible on the premise of ensuring the same or similar performances.

Disclosure of utility model

The utility model aims to provide a high-permeability and high-resolution grid type LED display screen, which solves the problem of a large number of layout and wiring on a bottom plate in a scanning driving mode, and is compatible with the problems of cost and stability on the premise of ensuring the same or similar performances.

To achieve the purpose, the utility model adopts the following technical scheme:

A grid LED display screen, comprising: a bottom plate with at least two wiring layers, a plurality of pixel points respectively arranged on the surface layer of the bottom plate, a scanning chip and a driving chip for driving the lamp beads with different colors;

The pixel points are arranged in a rectangular array, each pixel point comprises three lamp beads of red, green and blue, each lamp bead comprises an anode and a cathode, one of the anode and the cathode is a common electrode, the other is an independent electrode, and the common electrodes of all the lamp beads in the same pixel point are electrically connected;

Through holes are formed in the intersection positions of every four pixel points on the bottom plate, longitudinal wiring channels are reserved between two adjacent rows of through holes, and transverse wiring channels are reserved between two adjacent rows of through holes;

The bottom plate is provided with a plurality of connecting lines extending in the transverse direction in the transverse wiring channel, and a plurality of scanning lines and driving lines extending in the longitudinal direction in the longitudinal wiring channel; the scanning lines and the driving lines and the connecting lines are respectively arranged on different wiring layers of the bottom plate; the connecting lines are in one-to-one correspondence with the driving lines;

Each scanning line is used for connecting the common poles of all the lamp beads of each pixel point of the corresponding column together and then connecting the common poles with the scanning chip; each connecting wire is used for connecting the independent poles of the same color lamp beads of each pixel point of the corresponding row and then connecting one end of the corresponding driving wire; each driving line is used for connecting the corresponding connecting line to the driving chip of the corresponding color.

Optionally, the scan lines and the driving lines are arranged on different wiring layers of the bottom plate.

Optionally, the bottom plate includes at least four wiring layers, the scanning lines, the driving lines and the connecting lines are respectively arranged on different wiring layers, and the driving lines are separately arranged on at least two wiring layers.

Alternatively, the scan lines and the driving lines are arranged on the same wiring layer of the base plate.

Optionally, each scanning line includes a common electrode connection segment alternately arranged along a longitudinal direction and a metal conductive layer attached to an inner wall of the through hole, one end of the common electrode connection segment is connected with a common electrode of the lamp bead at a corresponding position, and the other end of the common electrode connection segment is connected with the metal conductive layer of the inner wall of the through hole at the corresponding position; and the metal conductive layers of two adjacent through holes in the same column are electrically connected through inter-hole connection wires.

Optionally, the outer layer of the metal conductive layer is covered with an insulating protective layer.

Optionally, the scanning chip and the driving chip are disposed at the same side edge of the surface layer of the bottom plate.

Alternatively, only the driving wires corresponding to the lamp beads with the same color are arranged in each wiring channel connected with the independent poles.

Optionally, in each pixel, the three red, green and blue light beads are arranged longitudinally, transversely or in a triangle.

Compared with the prior art, the utility model has the beneficial effects that:

According to the grid type LED display screen provided by the embodiment of the utility model, grid type packaging can be realized based on the existing scanning driving characteristics, namely, the layout wiring and pixel distribution of a display module are not affected when holes are punched in the bottom plate, so that specific lamp beads do not need to be customized again, the existing mature lamp bead packaging and chip packaging forms are fully utilized, and the realization difficulty of a transparent screen scheme is greatly reduced while the investment is reduced.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a conventional 4x4 bead drive array;

FIG. 2 is a schematic diagram of a grid-type LED display screen;

FIG. 3 is a schematic diagram of a single lamp module of a bead panel;

FIG. 4 is a typical layout pattern diagram of a single lamp module;

FIG. 5 is a layout pattern diagram of a 4x4 array of single lamp modules;

FIG. 6 is a wiring pattern diagram of three different lines;

FIG. 7 is a schematic diagram of the wiring of the lamp beads;

FIG. 8 is a diagram of wiring patterns within a gap;

FIG. 9 is a diagram showing a comparison of wiring patterns of wiring layers;

FIG. 10 is a pattern diagram of a routing channel fully occupied;

FIG. 11 is a bottom view of a layout of a through-hole via-covering conductive layer;

FIG. 12 is a three-layer overlay pattern of scan line layers;

fig. 13 is a two-layer board wiring pattern diagram.

Illustration of:

The pixel comprises a bottom plate 1, pixel points 2, a scanning chip 3, a driving chip 4, a wiring area A, a through hole area B, a lamp sealing area C, driving wires 5, a second layer driving wire 51, a third layer driving wire 52, a connecting wire 6, scanning wires 7, red lamp beads 21, green lamp beads 22, blue lamp beads 23, a common anode pad 24, a red lamp cathode pad 25, a green lamp cathode pad 26, a blue lamp cathode pad 27, a wire passing hole 28, a through hole 8, a wiring channel L, a metal conducting layer 9, an inter-hole connecting wire 10 and a common electrode connecting section 11.

Detailed Description

In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

The embodiment of the utility model provides a solution of a grid type LED display screen, which is mainly characterized in that LED lamp beads are driven and controlled in a scanning driving mode on a bottom plate 1 of a distributed through hole 8.

In this embodiment, a schematic structural diagram of a grid-type LED display screen is shown in fig. 2, and the grid-type LED display screen includes a base plate 1, lamp beads, a driving chip 4 and a scanning chip 3, a plurality of pixel points 2 are arranged on the base plate 1 in a matrix, each pixel point 2 includes three lamp beads of red, green and blue, and through holes 8 are formed at the intersection positions of every four pixel points 2.

In order to realize the splicing expansion function, the driving chip 4 and the scanning chip 3 can occupy only one of the four edges on the surface layer of the bottom plate, and the other three edges are not provided with the driving chip 4, so that the characteristics of the through holes 8 are still reserved, and the display module can be spliced with other modules to form a larger display module. The surface layer of the bottom plate refers to the surface of the bottom plate facing the outside, and can be the front surface of the bottom plate or the back surface of the bottom plate.

The bead panel composed of a plurality of pixel points 2 is formed by repeatedly arranging a plurality of single lamp modules, and for the single lamp modules, the single lamp modules comprise a wiring area A, a through hole 8 area B and a lamp sealing area C, and the patterns of the single lamp modules are shown in fig. 3.

For a single lamp module, the longitudinal and transverse base plates 1 on the wiring area A are all connected, namely the lines of the wiring area A extend longitudinally and transversely, a typical wiring form is shown in fig. 4, 6 vertical lines are arranged longitudinally of the lamp beads, and 3 transverse lines are arranged transversely to form a driving line of the module. After the single lamp modules are assembled into a 4x4 array, the wiring patterns are shown in fig. 5. In the array formed from single lamp modules, in its wiring, transverse and longitudinal lines can be connected with other modules to form a coherent wiring pattern.

For a single lamp bead, the electrode of the lamp bead can be divided into a cathode and an anode, and in order to realize scanning driving, the common electrode of all the lamp beads of each pixel point 2 positioned in the same column is connected with a scanning chip 3; the independent poles of the same color lamp beads of each pixel point 2 positioned in the same row are connected and then connected with the driving chips 4 corresponding to the color lamp beads, so that the fact that the row chips and the column chips can be distributed on the same side of the display module is achieved, and meanwhile through holes on the panel are reduced to the greatest extent.

That is, for a pixel 2, three beads are included, which are respectively red, green and blue, and the three pins can be longitudinally arranged, the common poles of the three beads need to be connected together, the anodes of the three beads are connected out through a scanning line 7, and the scanning line 7 is used for connecting the pixels 2 in the same row; meanwhile, the cathodes of the three lamp beads are respectively connected with corresponding connecting wires 6, each connecting wire 6 is connected with a plurality of lamp beads with the same color in the same row, namely, in the first row, the cathodes of red lamps in the same row are connected together, the cathodes of green lamps in the same row are connected together, and the cathodes of blue lamps in the same row are connected together.

For convenience of description, the line for connecting the common electrode of all the beads of each pixel point 2 of the same column is referred to as a scan line 7, the line for connecting the independent electrode of the same color bead of each pixel point 2 of the same row is referred to as a connection line 6, and the line for connecting the connection line 6 to the corresponding driving chip 4 is referred to as a driving line 5.

Based on the wiring principle of the PCB, i.e. the cross-overlapped lines cannot occur in the same wiring layer, so that the transverse lines and the longitudinal lines are not distributed in the same wiring layer of the base plate 1, and only the transverse lines or only the longitudinal lines are distributed in the same wiring layer. Meanwhile, since the connection lines 6 extend in the lateral direction and the scan lines 7 and the driving lines 5 extend in the longitudinal direction, in this embodiment, the connection lines 6, the scan lines 7 and the driving lines 5 are respectively disposed on different wiring layers of the bottom plate 1. Illustratively, the connection lines 6 occupy one wiring layer, the driving lines 5 occupy two wiring layers, and the scanning lines 7 occupy one wiring layer again.

Specifically, as shown in fig. 6, the connection lines 6 are arranged in a first-layer wiring layer, the scanning lines 7 are arranged in a fourth-layer wiring layer, and the driving lines 5 are distributed in a second-layer wiring layer (e.g., the second-layer driving lines 51) and a third-layer wiring layer (e.g., the third-layer driving lines 52). As shown in fig. 6, since each pixel 2 includes three light beads of red, green and blue, there are three connection lines 6 on one row of pixels 2. Taking the anode as a common electrode and the cathode as an independent electrode, for the red beads 21 in the first pixel point 2 of the first row, the anode is connected to the scanning line 7 positioned on the fourth layer of wiring layer, the cathode is connected to the connecting line 6 corresponding to the red beads 21 of the first row positioned on the first layer of wiring layer, and the anode is led out through the driving line 5 positioned on the first column of the second layer of wiring layer, and the pattern is shown in fig. 7.

In fig. 7, in order to connect the connection lines 6 and the driving lines 5 located in different wiring layers, a via hole 28 is formed at the cathode of the first red light bead 21 in the first row, and the via hole 28 connects the connection line 6 of the cathode of the first red light bead 21 in the first row and the driving line 5 in the first column; for the first column drive line 5 this represents the connection point of the cathodes of all red beads 21 of the first row.

It should be noted that, first, the via holes 28 need not be formed near each row of pixels, and the number of corresponding via holes 28 may be reduced in some places on the entire bottom board, even without opening the via holes 28, the wires may be directly routed from the top layer (since these places are furthest apart, the wire harness routed to the place is minimal, and thus the via holes 28 may not be used). Secondly, due to different conditions, some color beads need to be provided with the wire through holes 28, and other color beads of the same pixel point just need not be provided with the wire through holes 28.

In the driving control process, if the first red beads 21 in the first row are to be lighted, the scanning line 7 needs to be scanned to the first column, the anode electric position of the pixel points 2 in the first column is high, and then the first column driving line 5 is pulled through and connected to the cathodes of the beads in the first row, so that the cathodes and the anodes of the beads in the first row and the first column are conducted, and the beads are lighted.

Based on the wiring scheme, the cathodes and the anodes of the lamp beads can be replaced, the wiring mode is effective, the arrangement mode of the red, green and blue lamp beads on the single pixel point 2 is not limited by the method, the arrangement mode of the red, green and blue lamp beads is only required to be ensured to be connected together in a common mode among the three lamp beads, and the other electrode is only required to be led out in the longitudinal direction as the connecting end of each driving line 5.

It should be noted that the number of wiring layers occupied by the driving wires 5 depends on the pixel packing density of the corresponding display module, and in particular, since the wires on the bottom plate 1 have the minimum wire diameter limitation, the number of the overdrive wires 5 between the two through holes 8 is determined by the gap reserved between the two through holes 8. Based on this, the higher the resolution of the display module to be packaged, the larger the drive line 5 position it needs to occupy.

As shown in fig. 8, the driving line 5 is laid out in a pattern using a gap between two through holes 8. As can be seen from fig. 8, the driving wires 5 are distributed in the gaps between the two rows of through holes 8, i.e. on the PCB remaining after the through holes 8 are cut, and the number of wires that can be passed through each through hole 8 is optionally the same to ensure the uniformity of the wiring. The gap between two rows of through holes 8 may be referred to as a wiring channel L, and the maximum number of wires that can be routed in the channel depends on the size of the channel, the size of the routing wire diameter, and the number of board layers.

Specifically, taking 64x256 as an example of a display module resolution, namely 64 pixel points 2 in the horizontal direction and 256 pixel points 2 in the vertical direction, each pixel point 2 has three light beads, and at least 768 connecting lines 6 are provided.

Based on this, assuming that the two rows of through holes 8 are reserved with one layer of boards capable of passing through only 6 wires, and the module of 64 pixel points 2 is packaged, 64 longitudinally penetrating routing bands, namely 64 routing channels L, can be reserved on one layer of boards, namely one layer of 384 driving wires 5 can be routed, all the driving wires 5 are arranged, and at least the space of two layers of boards is needed. Further, if the scan lines 7 occupy one wiring layer and the lateral connecting lines 6 occupy one wiring layer, the module needs at least one four-layer board.

Specifically, a layer occupied by the scanning line 7 may be referred to as a scanning layer, and a layer occupied by the connection line 6 may be referred to as a connection layer, wherein the connection line 6 connects the pixel dots 2 laterally, so that the wirings of the connection layer are all lateral. The scanning layer connects the pixels 2 longitudinally, so that the wiring lines are all longitudinal in the scanning layer. As shown in fig. 9 from the ply pattern.

Example two

Since the driving wires 5 lead out the transverse connecting wires 6 from the longitudinal direction, the driving layers are also distributed along the longitudinal direction, and the wiring logic of the substrate and the PCB board cannot be crossed and overlapped, namely the wiring in the same board layer, and the scanning layer and the connecting layer cannot be certainly the same layer. However, the driving layer and the scanning layer are distributed in longitudinal wiring, so that the driving layer and the scanning layer have a theoretical common layer foundation.

Specifically, to make the driving layer and the scanning layer in the same layer, the main problem to be overcome is that the reserved gap between two through holes 8 in the driving layer is limited, the driving lines 5 are already arranged according to the maximum number of driving lines which can pass through in the design process, and no space is reserved for wiring the scanning lines 7, as shown in fig. 10.

Based on this, the second embodiment of the present utility model proposes another method for threading the bottom board 1:

Each scanning line 7 comprises common electrode connecting sections 11 which are alternately arranged along the longitudinal direction and metal conductive layers 9 which are attached to the inner wall of the through hole 8, one end of each common electrode connecting section 11 is connected with a common electrode of a lamp bead at a corresponding position, and the other end of each common electrode connecting section is connected with the metal conductive layer 9 of the inner wall of the through hole 8 at the corresponding position; and the metal conductive layers 9 of two adjacent through holes 8 in the same column are electrically connected through an inter-hole connecting wire 10.

Specifically, the metal conductive layer 9 may be attached to the wall of the through hole 8, and the through hole 8 may be connected by the inter-hole connection line 10, so that electrical connection may be formed by the through hole 8, and the pattern is as shown in fig. 11. Therefore, the scanning layer can be wired at the position of the through hole 8, and is laminated with the driving layer.

Furthermore, since the metal conductive layers 9 attached to the through holes 8 can be distributed on each layer of the whole PCB substrate 1, the scan lines 7 can be distributed on each layer to form a large scan bus composed of multiple layers of scan lines 7, so that the circuit loss can be further reduced, and the circuit stability can be improved. The pattern is shown in fig. 12.

In particular, fig. 12 shows only a superimposed version of the scan layer, which means that in explaining one possible routing feature in the routing method according to the utility model, no other wire layer is shown, i.e. only the routing method involving scan lines 7 in the overall board layer is shown.

Specifically, since the metal conductive layers 9 attached to the through holes 8 may be distributed on all the plate layers, the single scanning line 7 may be overlapped by multiple layers to increase the line width section and improve the system stability.

Where the through-hole 8 is not used, the through-hole 8 may be disconnected from the through-hole 8 by performing a clearance process only at the position of the through-hole 8, and the through-hole 8 may not function in this layer, which may be used in the connection layer.

Based on the method of the utility model, the following list several wiring modes based on the grid type LED display module:

First, in the form of a double-layer board, if the scan line 7 is connected to the common electrode of the lamp beads, and the driving line 5 is connected to the independent electrode of the lamp beads, the common electrode is the anode of the lamp beads, and the independent electrode is the cathode of the lamp beads, and the typical pattern is shown in fig. 13.

Specifically, in the double-layer board wiring pattern, the bottom board 1 of the display module is composed of two layers, wherein the first layer is a connecting layer which is used for transversely connecting the same-color lamp beads in the same row; the second layer is a scanning layer and a driving layer.

The connection lines 6 connect a limited number of lamp beads, the number of which depends on the carrying capacity of the driver chip 4.

The scanning lines 7 are connected in a stacked manner through the through holes 8, but on the basis of two layers, the connection lines of the two through holes 8 are distributed only on one layer, and the other layer is used for avoiding the through holes 8. The scan line 7 is connected at its end to the scan chip 3.

In practical applications, only one color of driving line 5 may be routed in each of the plurality of wiring channels L, for example: only the driving wires 5 of the red beads 21 are routed in the first wiring path L, and only the driving wires 5 of the green beads 22 are routed in the second wiring path L, so that the staggering of the wires at the arrangement positions of the driving chips 4 can be effectively reduced.

The number of vias in the routing channel L depends on the line width and the size of the through-holes 8, in the example illustrated three wires for a single channel.

Secondly, the common electrode of the lamp beads can be a cathode, can be used as wiring in a common-negative driving mode, can be an anode, and can be used as wiring in a common-positive driving mode, and the wiring method is suitable for the wiring method.

Further, on a higher board layer, for example, four board layers, the driving lines 5 and the scanning lines 7 occupy three wiring layers in the longitudinal direction, and the connecting lines 6 occupy one wiring layer.

If a single wiring path L can pass 6 wires, the thickness of the three layers at the position of one wiring path L can pass 16 wires in total, which means that 16 rows of lamp beads can be loaded.

The scanning line 7 formed by the three layers can also be connected through the conductive metal layer attached on the through hole to form a large line with three layers of plate thickness.

The connection lines 6 are always used for connecting the transverse lamp beads and are connected with the driving lines 5 through holes at proper positions.

It should be emphasized that the grid display module realized by the wiring scheme of the present utility model needs to protect the position of the through hole 8, and cover the metal surface with an insulating material, such as a solder mask, to prevent oxidation of the circuit caused by corrosion of the external environment.

In summary, the utility model designs a new layout and wiring form, which has the following characteristics:

1) On the basis of the existing scanning driving scheme, the row and column line concepts are canceled, and the scanning lines 7, the driving lines 5 and the connecting lines 6 are used instead. Wherein the scanning line is connected with the lamp bead common electrode, the connecting line 6 is connected with the lamp bead independent electrode, and the driving line 5 leads out the current row independent electrode from the longitudinal direction. Based on the wiring form, even if a plurality of through holes 8 exist on the base plate 1, the lamp beads can be lighted up in a scanning driving form;

2) Based on the wiring form, the scanning line 7 is provided with a conductive metal layer on the through hole 8, and then a connecting wire 6 of two conductive metal layers is arranged on the plate layer, and the plate layer without the conductive metal layer is subjected to avoidance treatment, so that the scanning line 7 can be provided with more space wiring on the longitudinally distributed plate layer;

3) The wiring channels L are subjected to color constraint, namely the single wiring channel L has consistent line passing color, so that the problem of line staggering of the driving end can be greatly reduced, and the driving IC package is more concentrated and efficient.

4) The conductive metal layer is arranged on the through hole 8 and used for driving the lamp beads to work, so that the conductive metal layer is subjected to protection treatment and isolated from the external environment, and the stability of the panel is further improved.

According to the grid type LED display screen provided by the embodiment of the utility model, grid type packaging can be realized based on the existing scanning driving characteristics, namely, the holes are punched in the bottom plate 1, so that the layout wiring and pixel distribution of a display module are not affected, specific lamp beads do not need to be customized again, the existing mature lamp bead packaging and chip packaging forms are fully utilized, and the realization difficulty of a transparent screen scheme is greatly reduced while the investment is reduced.

The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (9)

1. A grid LED display screen, comprising: a bottom plate (1) with at least two wiring layers, a plurality of pixel points (2) respectively arranged on the surface layer of the bottom plate (1), a scanning chip (3) and a driving chip (4) for driving the lamp beads with different colors;

The pixel points (2) are arranged in a rectangular array, each pixel point (2) comprises three lamp beads of red, green and blue, each lamp bead comprises an anode and a cathode, one of the anode and the cathode is a common electrode, the other is an independent electrode, and the common electrodes of all the lamp beads in the same pixel point (2) are electrically connected;

Through holes (8) are formed in the intersection positions of every four pixel points (2) on the bottom plate (1), longitudinal wiring channels are reserved between two adjacent rows of through holes (8), and transverse wiring channels are reserved between two adjacent rows of through holes (8);

A plurality of connecting lines (6) extending along the transverse direction are arranged in the transverse wiring channel on the bottom plate (1), and a plurality of scanning lines (7) and driving lines (5) extending along the longitudinal direction are arranged in the longitudinal wiring channel; the scanning lines (7) and the driving lines (5) and the connecting lines (6) are respectively arranged on different wiring layers of the bottom plate (1); the connecting wires (6) are in one-to-one correspondence with the driving wires (5);

Each scanning line (7) is used for connecting the common poles of all the lamp beads of each pixel point (2) of the corresponding column together and then connecting the common poles with the scanning chip (3); each connecting wire (6) is used for connecting the independent poles of the same color lamp beads of each pixel point (2) of the corresponding row and then connecting one end of the corresponding driving wire (5); each driving wire (5) is used for connecting the corresponding connecting wire (6) to the driving chip (4) of the corresponding color.

2. Grid LED display screen according to claim 1, characterized in that the scanning lines (7) and the driving lines (5) are arranged at the same wiring layer of the backplane (1).

3. A grid LED display screen according to claim 2, characterized in that each scanning line (7) comprises common electrode connection segments (11) alternately arranged in the longitudinal direction and metal conductive layers (9) attached to the inner walls of the through holes (8), one end of the common electrode connection segments (11) being connected to the common electrode of the lamp beads at the corresponding positions, and the other end being connected to the metal conductive layers (9) of the inner walls of the through holes (8) at the corresponding positions; and the metal conductive layers (9) of two adjacent through holes (8) positioned in the same column are electrically connected through an inter-hole connecting line (10).

4. Grid LED display screen according to claim 1, characterized in that the scanning lines (7) and the driving lines (5) are arranged at different wiring layers of the backplane (1).

5. The grid LED display screen according to claim 2, wherein the bottom plate (1) comprises at least four wiring layers, the scanning lines (7), the driving lines (5) and the connecting lines (6) are respectively arranged on different wiring layers, and the plurality of driving lines (5) are separately arranged on at least two wiring layers.

6. A grid LED display screen according to claim 3, characterized in that the outer layer of the metallic conductive layer (9) is covered with an insulating protective layer.

7. The grid-type LED display screen according to claim 1, wherein the scanning chip (3) and the driving chip (4) are disposed at the same side edge of the surface layer of the bottom plate (1).

8. The grid LED display screen according to claim 1, wherein only driving wires (5) corresponding to the same color beads are arranged in each wiring channel connecting the independent poles.

9. The grid LED display screen according to claim 1, wherein in each pixel (2) three beads of red, green and blue are arranged in a longitudinal, transverse or triangular arrangement.