CN114495736A - Micro LED display panel, display module and LED display screen - Google Patents
Micro LED display panel, display module and LED display screen Download PDFInfo
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 95
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 86
- 238000003466 welding Methods 0.000 claims abstract description 12
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 12
- 238000003491 array Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000004134 energy conservation Methods 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 description 15
- 239000010439 graphite Substances 0.000 description 15
- -1 graphite alkene Chemical class 0.000 description 15
- 239000003574 free electron Substances 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/32—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Abstract
The invention relates to a micro LED display panel, a display module and an LED display screen, wherein the panel comprises: the LED lamp comprises a plurality of lamp bodies and LED pixel lamps, wherein each lamp body comprises a light-emitting surface and a welding disc surface, a wiring layer and a graphene thermoelectric conversion layer are arranged below each lamp body, and each LED chip is electrically connected with the corresponding pin welding disc through a pin; the circuit is distributed on the wiring layer, the circuit is electrically connected with the pin bonding pad, the wiring layer is insulated with the graphene thermoelectric conversion layer, the graphene thermoelectric conversion layer is electrically connected with the LED display screen power supply equipment through a thermoelectric conversion lead, and the graphene thermoelectric conversion layer is used for absorbing heat emitted by the circuit and external heat absorbed by the micro LED panel and converting the heat into electric energy. The invention has the advantages of faster heat dissipation of the LED display screen with ultra-small dot spacing, more stable system, longer service life, more energy conservation and environmental protection.
Description
Technical Field
The invention belongs to the technical field of micro LEDs, and particularly relates to a micro LED display panel, a display module and an LED display screen.
Background
The LED display screen has high brightness, energy conservation, environmental protection and high response speed, and can be used for indoor and outdoor display, advertisement display, stage set and other occasions. With the continuous development of the technology, the requirements of the LED display screen on the resolution of the image are gradually increased, and the dot pitch of the LED chip for emitting light is smaller and smaller. In order to realize a small-space LED display screen, particularly the dot space below 1.5mm, a micro LED display scheme is proposed in the industry, and LED chips with different colors are compounded on one lamp bead in groups.
When the LED lamp beads manufacture the panel of the LED display screen, the same control pin pads of the micro LED display panels in the same row are connected in series by leads, and pictures are displayed on the LED display screen through dynamic scanning.
Because the dot pitch of the Micro LED/Mini LED is smaller and smaller, the circuit layout needs to have the same time delay based on the guarantee of the display effect of the LED display screen, and the lead wires need to be arranged on the same PCB layer in the prior art. If the PCB layer is added, the design difficulty and the production cost of the PCB are inevitably greatly improved. Because the circuit is laid on same PCB layer, must lead to panel and PCB layer place base plate gathering a large amount of heat energy, be difficult to in time distribute, and current large-scale LED display screen forms by a plurality of display module concatenations in addition, and the LED display screen area is very big to probably accept outside sunshine, the heat energy that other electrical equipment brought, these all will seriously influence the heat dissipation on PCB layer or base plate, lead to Micro LED/Mini LED's LED display screen performance not good, life shortens.
Disclosure of Invention
The invention aims to provide a micro LED display panel, a display module and an LED display screen to solve the technical problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
an embodiment of the present invention provides a micro LED display panel, including:
the LED lamp comprises a plurality of lamp bodies, each lamp body comprises an LED pixel lamp, each LED pixel lamp comprises an LED chip, each lamp body comprises a light-emitting surface and a welding disc surface which are arranged oppositely, a wiring layer is further arranged below each lamp body, a graphene thermoelectric conversion layer is further arranged below each wiring layer, each LED chip is arranged on the light-emitting surface, each welding disc surface is provided with a pin welding disc, and each LED chip is electrically connected with the corresponding pin welding disc through a pin;
the LED chip comprises a red LED chip, a green LED chip and a blue LED chip, the pad surface is located on the wiring layer, the wiring layer is provided with a circuit, the circuit is electrically connected with the pin pad, the wiring layer is insulated from the graphene thermoelectric conversion layer, the graphene thermoelectric conversion layer is electrically connected with an LED display screen power supply device through a thermoelectric conversion lead, and the graphene thermoelectric conversion layer is used for absorbing heat emitted by the circuit and external heat absorbed by the micro LED panel and converting the heat into electric energy.
Preferably, a graphene pad is arranged below the pin pad, and the pin pad and the graphene pad are insulated from each other; the graphene thermoelectric conversion layer is electrically connected with the graphene pad.
Preferably, the graphene thermoelectric conversion layer comprises a graphene thermoelectric conversion film.
Preferably, the vertical central line department of lamp body, graphite alkene thermoelectric conversion layer be equipped with the recess with the light emitting area communicates with each other and the opening, the recess is square or arc, the recess is insulated with the pin, there is the pin connection in the recess the graphite alkene pad, lay graphite alkene thermoelectric conversion membrane in the recess, graphite alkene thermoelectric conversion membrane passes through thermoelectric conversion lead wire connection graphite alkene thermoelectric conversion membrane with the graphite alkene pad.
Preferably, the graphene thermoelectric conversion layer is divided into a plurality of transverse and/or longitudinal cavities, and the graphene thermoelectric conversion film is arranged in the cavities.
Preferably, at least one cavity is arranged in the graphene thermoelectric conversion layer, a micro-tube is arranged in the cavity, the micro-tube can be a circular tube with a circular cross section or a square tube with a square cross section, and a copper chloride solution is filled in the micro-tube.
Preferably, the graphene thermoelectric conversion layer is divided into a plurality of transverse or longitudinal grooves, the upper ends of the grooves are closed, the lower ends of the grooves are open, square pipes with square cross sections or circular pipes with circular cross sections are distributed in the grooves, and copper chloride solution is filled in the square pipes or the circular pipes.
Preferably, the graphene thermoelectric conversion layer is divided into a plurality of transverse or longitudinal cavities, the cavities are closed cavities, and the cavities in the micro LED panel are communicated with each other; the cavity is filled with a copper chloride solution.
Preferably, the lamp body includes the LED pixel lamp; the four LED pixel lamps are arranged on the light-emitting surface in a 2 x 2 array; the LED pixel lamp comprises the LED chips, and the LED chips comprise a red LED chip (R chip), a green LED chip (G chip) and a blue LED chip (B chip); the R chip, the G chip and the B chip comprise a first electrode and a second electrode, and the first electrode and the second electrode respectively correspond to pins of the LED pixel lamp; the pins comprise a row signal pin and a column signal pin, wherein the column signal pin comprises a red signal pin corresponding to an R chip of the LED chip, a green signal pin corresponding to a G chip and a blue signal pin corresponding to a B chip; the first electrodes of the R chip, the G chip and the B chip are connected to the same row signal pin, and the second electrodes of the R chip, the G chip and the B chip are connected to the corresponding red signal pin, green signal pin and blue signal pin; the row signal pins and the column signal pins are electrically connected with the LED chip through the circuit in the lamp body, the first electrode is a cathode, and the second electrode is an anode; the circuit is a cascode circuit; the circuit is on the routing layer.
Preferably, the lamp body includes the LED pixel lamp; the LED pixel lamp array is arranged on the light emitting surface, the arrangement formula of the array is NxM, N is a positive integer, M is a positive integer, N is M, N is the number of rows of the LED pixel lamps included in the lamp body, and M is the number of columns of the LED pixel lamps included in the lamp body.
Preferably, the array is arranged 2 × 2.
Preferably, at least one of the LED pixel lamp arrays is arranged on the light emitting surface to form one of the lamp bodies, the arrangement formula of the array is axb, where a is smaller than or equal to B, and both a and B are positive integers, a is a number of rows of the LED pixel lamps included in the lamp body, and B is a number of columns of the LED pixel lamps included in the lamp body.
The invention further provides an LED display screen, and the LED display screen comprises the micro LED display panel.
As can be seen from the above, in the solution provided in the embodiment of the present application, compared with the prior art, the present invention has the following beneficial effects: when the micro LED panel is used, the graphene thermoelectric conversion layer absorbs heat and converts the heat into electric energy; through setting up graphite alkene pad in pin pad below, and lay the insulating layer between graphite alkene pad and pin pad, not only be favorable to absorbing the circuit of little LED panel and wiring layer thereof, the heat energy in pin pad and the little LED panel, be favorable to exporting the electric energy that forms behind the heat energy conversion fast simultaneously, make heat energy change for electric energy cyclic utilization, thereby the heat dissipation problem of little LED display panel self has been solved, the electric energy is practiced thrift, the whole problem of being heated and the part problem of being heated that LED display screen received sunshine irradiation or other external environment factors to cause has still been solved simultaneously, energy-concerving and environment-protective, the life of little LED panel has been prolonged. The technical scheme of the invention is suitable for the LED display screen of the Micro LED/Mini LED, and has the beneficial effects of enabling the LED display screen with ultra-small pitch to dissipate heat faster, enabling the system to be more stable, being longer in service life, and being more energy-saving and environment-friendly.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Drawings
Fig. 1 is a schematic structural diagram of a micro LED panel according to an embodiment of the present invention;
FIG. 2 is a schematic view of a lamp body according to an embodiment of the present invention;
fig. 3a is a schematic view of a lamp body according to another embodiment of the present invention, wherein a square groove is formed in a graphene thermoelectric conversion layer at a longitudinal centerline of the lamp body;
fig. 3b is a schematic view of a lamp body according to another embodiment of the present invention, wherein the graphene thermoelectric conversion layer is provided with an arc-shaped groove at the longitudinal centerline;
fig. 4 is a schematic view of a cavity having a graphene thermoelectric conversion film in a graphene thermoelectric conversion layer according to an embodiment of the present invention;
fig. 5 is a schematic view of a groove in a graphene thermoelectric conversion layer according to yet another embodiment of the present invention;
fig. 6 is a schematic view of a cavity with square pipes in a graphene thermoelectric conversion layer according to another embodiment of the present invention;
fig. 7 is a schematic view of a closed cavity in a graphene thermoelectric conversion layer according to yet another embodiment of the present invention;
fig. 8 is a schematic diagram of a common negative circuit of the wiring layers corresponding to the lamp bodies of the micro LED panel according to another embodiment of the invention.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Please refer to fig. 1, fig. 2, and fig. 3 a; the micro LED panel 1 includes:
the LED lamp comprises a plurality of lamp bodies 110, each lamp body comprises an LED pixel lamp 10, each LED pixel lamp 10 comprises an LED chip 121, each lamp body 110 comprises a light-emitting surface 110a and a welding disc surface 110b which are arranged oppositely, a wiring layer 140 is arranged below each lamp body 110, a graphene thermoelectric conversion layer 82 is arranged below each wiring layer 140, each LED chip 121 is arranged on the light-emitting surface 110a, each pin pad 130 is arranged on the welding disc surface 110b, and each LED chip 121 is electrically connected with the corresponding pin pad 130 through a pin;
the LED pixel lamp 10 includes the LED chip 121, and the LED chip 121 includes a red LED chip 121a (R chip), a green LED chip 121B (G chip), and a blue LED chip 121c (B chip) to form a full-color display; the bonding pad surface 110b is located on the wiring layer 140, the wiring layer 140 is provided with a circuit 60, the circuit is electrically connected with the pin bonding pad 130, the circuit is used for electrically connecting a plurality of LED chips 121, a graphene thermoelectric conversion layer 82 is arranged below the wiring layer 140, the wiring layer 140 is insulated from the graphene thermoelectric conversion layer 82, and the graphene thermoelectric conversion layer 82 is electrically connected with an LED display screen power supply device through a thermoelectric conversion lead 600; the graphene thermoelectric conversion layer 82 is used for absorbing heat emitted by the circuit 60 and external heat absorbed by the micro LED panel, and converting the heat into electric energy. When the Micro LED panel 1 provided by the invention is used, the graphene thermoelectric conversion layer 82 absorbs heat, the graphene thermoelectric conversion layer 82 is beneficial to absorbing heat energy in a circuit of the wiring layer 140, the pin bonding pad 130 and the Micro LED panel 1, electric energy formed after heat energy conversion is rapidly output, and the heat energy is converted into electric energy which is transmitted to the LED display screen power supply equipment for recycling, so that the heat dissipation problem is solved, the power consumption is reduced, the service life of the Micro LED panel is prolonged, secondary damage to the Micro LED display screen caused by repeated maintenance is avoided, the cooling process is uniform and rapid, the Micro LED display screen is quiet and free of any noise, and the harsh environmental requirements of a cinema, a command center, a video shooting and other Micro LED display screens needing ultra-high definition display can be met.
As shown in fig. 3a and 3b, in some alternative embodiments, the thermoelectric conversion lead 600 is disposed on the sidewall or bottom of the graphene thermoelectric conversion layer 82 and insulated from the wiring layer 140.
In some embodiments, as shown in fig. 3a and 3b, a graphene pad 81 is disposed below the pin pad 130, and the pin pad 130 and the graphene pad 81 are insulated from each other; the graphene thermoelectric conversion layer 82 is electrically connected to the graphene pad 81. The graphene pad 81 is used for absorbing heat of the pin pad 130, and has the beneficial effects of fast heat absorption speed and no interference on a circuit of the wiring layer 140, so that the current of the micro LED display panel 1 is stable and controllable.
In some embodiments, the graphene pad 81 and the lead pad 130 may be insulated by an insulating coating or a ceramic layer, and the graphene pad 81 is wrapped outside the lead pad 130, so that the lead pad 130 and the circuit in the wiring layer 140 may be electrically connected through a lead or a lead. Therefore, the heat energy in the micro LED panel 1 and the circuit of the wiring layer 140 of the micro LED panel, the pin bonding pad 130 and the micro LED panel 1 can be absorbed more conveniently, so that the free electrons are increased continuously, most of the free electrons enter the thermoelectric conversion lead, and the electric energy formed after the heat energy conversion is output more quickly and stably.
In some embodiments, as shown in fig. 3a, 4, the graphene thermoelectric conversion layer 82, including the graphene thermoelectric conversion film 83; the heat is absorbed by the graphene thermoelectric conversion layer 82 and transferred to the graphene thermoelectric conversion film 83, so that free electrons are increased continuously, most of the free electrons enter the thermoelectric conversion lead, and electric energy formed after heat energy conversion is output more quickly and stably.
In some embodiments, as shown in fig. 1, fig. 2, fig. 3a and fig. 3b, at a longitudinal centerline of the lamp body 110, the graphene thermoelectric conversion layer 82 is provided with a groove 70 communicated with and opened to the light emitting surface 110a, the groove 70 is square or arc-shaped, in some embodiments, an inner diameter of the groove 70 at the light emitting surface 110a is smaller than an inner diameter of the graphene thermoelectric conversion layer 82, the groove 70 is insulated from a pin, the groove 70 is insulated from the wiring layer 140, for example, a square pipeline in the groove 70 is insulated from a pin, or a circular pipeline in the groove 70 is insulated from a pin, or a graphene thermoelectric conversion film 83 disposed in the groove 70 is insulated from a pin or the wiring layer 70, which has a beneficial effect of avoiding generated current from interfering with normal light emission of the LED pixel lamp. There is the pin connection in the recess 70 graphite alkene pad 81, lay graphite alkene thermoelectric conversion membrane 83 in the recess 70, graphite alkene thermoelectric conversion membrane 83 passes through thermoelectric conversion lead 600 and connects graphite alkene thermoelectric conversion membrane 83 with graphite alkene pad 81.
As shown in fig. 3a and 4, in some alternative embodiments, the thermoelectric conversion lead 600 is connected between the graphene thermoelectric conversion film 83 and the graphene pad 81 by disposing at least one thermoelectric conversion lead 600 on the wall or the bottom of the groove 70; the thermoelectric conversion lead 600 is insulated from a circuit in the micro LED panel wiring layer 140, the thermoelectric conversion lead 600 is electrically connected with the LED display screen power supply device or the LED display screen control device, and the LED display screen control device includes a power supply or a circuit control device. In some alternative embodiments the wiring layer 140 is above the graphene thermoelectric conversion layer 82 of the recess 70 (as shown in figure 3 a).
In some embodiments, as shown in fig. 4, the graphene thermoelectric conversion layer 82 is divided into several transverse and/or longitudinal cavities 84, and graphene thermoelectric conversion films 83 are disposed in the cavities 84. The cavity 84 is closed in cross-section.
When the micro LED panel 1 of the present invention is used, the graphene thermoelectric conversion layer 82 absorbs heat and transfers the heat to the graphene thermoelectric conversion film 83, which is beneficial to absorbing heat in the micro LED panel 1 and the circuits of the wiring layer 140 thereof, the pin pads 130 and the micro LED panel 1, so that the free electrons are continuously increased, most of the free electrons enter the thermoelectric conversion leads, the electric energy formed after the heat energy conversion is rapidly output, the heat energy is converted into electric energy for recycling, thereby solving the heat dissipation problem and prolonging the service life of the micro LED panel.
In some embodiments, as shown in fig. 6, at least one cavity 84 is disposed in the graphene thermoelectric conversion layer 82, a micro tube 87 is disposed in the cavity 84, the micro tube 87 may be a circular tube with a circular cross section or a square tube with a square cross section, and the micro tube 87 has a copper chloride solution therein. In some optional embodiments, the micro tubes 87 are communicated with each other, and the greening copper solution can circulate therein, so as to have the beneficial effects of balancing temperature difference, accelerating heat dissipation and enabling the process of converting heat energy into electric energy to be more uniform and lasting
In some embodiments, as shown in fig. 5, the graphene thermoelectric conversion layer 82 is divided into a plurality of transverse or longitudinal grooves 88, the upper ends of the grooves 88 are closed, the lower ends of the grooves 88 are open, square pipelines 85 with a square cross section or circular pipelines (not shown) with a circular cross section are arranged in the grooves 88, and a copper chloride solution is filled in the square pipelines 85 or the circular pipelines. In some embodiments, the square pipeline 85 or the circular pipeline can be combined with another substrate, or the square pipeline or the circular pipeline is directly prepared on another substrate, and then the micro LED panel 1 with the groove is spliced with the substrate to achieve the same technical effect. The other substrate may correspond to a number of the micro LED panels 1. Thus, the preparation is simple and convenient, and the leakage is not easy to occur.
In some embodiments, as shown in fig. 7, the graphene thermoelectric conversion layer 82 is divided into a plurality of transverse or longitudinal cavities 89, the cavities 89 are sealed at the periphery, and the cavities 89 in the micro LED panel are communicated with each other; the cavity 89 is filled with a copper chloride solution.
As shown in fig. 3, when the micro LED panel 1 of the present application is used, the graphene thermoelectric conversion layer 82 absorbs heat and transfers the heat into the copper chloride solution, and is connected to the graphene pad 81, so that the ion strength entering the graphene pad 81 is enhanced with increasing thermal energy, and the free electrons are increased, wherein a small portion of the free electrons gradually escape from the graphene pad 81 and are combined with the free copper ions in the copper chloride solution with increasing thermal energy, and a larger portion of the free electrons enter the thermoelectric conversion lead 600 through the graphene pad 81, which is determined by the material properties of the graphene material that the corresponding copper chloride is more favorable for the movement of the free electrons. Through setting up graphite alkene pad in pin pad 130 below to lay the insulating layer between graphite alkene pad 81 and pin pad 130, not only be favorable to absorbing the heat energy in little LED panel 1 and the circuit of wiring layer 140, pin pad 130 and little LED panel 1 of little LED panel, be favorable to exporting the electric energy that forms behind the heat energy conversion fast simultaneously, make heat energy change for electric energy cyclic utilization, thereby solved the heat dissipation problem, prolonged the life of little LED panel.
In some embodiments, as shown in fig. 2 and 8, the lamp body 110 includes the LED pixel lamp 10; the four LED pixel lamps 10 are arranged in a 2 × 2 array on the light emitting surface 110 a; the LED pixel lamp 10 includes the LED chip 121, and the LED chip 121 includes: a red LED chip 121a (R chip), a green LED chip 121B (G chip), and a blue LED chip 121c (B chip); the R chip 121a, the G chip 121B, and the B chip 121c include two electrodes, which are a first electrode and a second electrode respectively, and the first electrode and the second electrode correspond to pins of the LED pixel lamp 10 respectively; the pins comprise a row signal pin 210 and a column signal pin 220, and the column signal pin 220 comprises a red signal pin 221 corresponding to an R chip of a light-emitting LED chip, a green signal pin 222 corresponding to a G chip and a blue signal pin 223 corresponding to a B chip; the first electrodes of the R chip 121a, the G chip 121B and the B chip 121c are connected to the same row of signal pins 210, and the second electrodes of the R chip 121a, the G chip 121B and the B chip 121c are connected to the corresponding red signal pin 221, green signal pin 222 and blue signal pin 223; the row signal pins 210 and the column signal pins 220 are electrically connected to the LED chip 121 through the circuit inside the lamp body 10, wherein the LED chip 121 includes the R chip 121a, the G chip 121B, and the B chip 121c, a first electrode of the LED chip 121 is a cathode, and a second electrode of the LED chip 121 is an anode. The circuit is a cascode circuit; the circuit is at wiring level 140.
In some embodiments, the micro LED display panel 1 of any one of the present application, the micro LED display panel 1 includes a plurality of the lamp bodies 110, the lamp bodies 110 include the LED pixel lamps 10; the LED pixel lamps 10 are arranged in the light emitting surface 110a in an array, where the arrangement formula of the array is nxm, N is a positive integer, M is a positive integer, and N is equal to M; in some optional embodiments, N is a positive integer smaller than 10, M is a positive integer smaller than 10, N is a number of rows of the LED pixel lamps 10 included in one of the lamp bodies 110, and M is a number of columns of the LED pixel lamps 10 included in one of the lamp bodies;
the plurality of lamp bodies 110 form the micro LED panel 1, and at least one of the LED micro panels 1 may form an LED display module or an LED display screen. In some optional embodiments, a plurality of the lamp bodies 110 are regularly spliced at the same interval to form the micro LED panels 1, at least two of the micro LED panels 1 are regularly spliced at the same interval to form an LED display module, and the LED display module is regularly spliced at the same interval to form the LED display screen.
In some embodiments, the micro LED display panel 1 of any one of the present application, the array is arranged in a 2 × 2 array. For example, an embodiment in which the circuit is a cascode circuit is shown in fig. 8.
In some embodiments, in the micro LED display panel 1 of any one of the present application, at least one LED pixel lamp 10 is arranged in an array on the light emitting surface 110a to form the lamp body 110, where the arrangement formula of the array is axb, where a is smaller than or equal to B, and both a and B are positive integers, a is a row number of the LED pixel lamps 10 included in the lamp body 110, and B is a column number of the LED pixel lamps 10 included in the lamp body 110; for example, the LED pixel lamps 10 may be arranged in an array on the light emitting surface 110a, the array further including: a 1 × 2 array, a 2 × 3 array, a 2 × 4 array, a 3 × 3 array, a 4 × 4 array;
the plurality of lamp bodies 110 form the micro LED panel 1, and at least one micro LED panel 1 may form an LED display module or an LED display screen. In some optional embodiments, a plurality of the lamp bodies 1110 are regularly spliced at the same pitch to form the micro LED panels, at least two micro LED panels 1 are regularly spliced at the same pitch to form LED display modules, and the LED display modules are regularly spliced at the same pitch to form the LED display screen.
The invention further provides an LED display screen, and the LED display screen comprises the micro LED display panel.
It will be evident to those skilled in the art that the embodiments of the present invention are not limited to the details of the foregoing illustrative embodiments, and that the embodiments of the present invention are capable of being embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the embodiments being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. Several units, modules or means recited in the system, apparatus or terminal claims may also be implemented by one and the same unit, module or means in software or hardware. The terms first, second, etc. are used to denote names, but not any particular order.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A micro LED display panel, comprising:
the LED lamp comprises a plurality of lamp bodies, each lamp body comprises an LED pixel lamp, each LED pixel lamp comprises an LED chip, each lamp body comprises a light-emitting surface and a welding disc surface which are arranged oppositely, a wiring layer is further arranged below each lamp body, a graphene thermoelectric conversion layer is further arranged below each wiring layer, each LED chip is arranged on the light-emitting surface, each welding disc surface is provided with a pin welding disc, and each LED chip is electrically connected with the corresponding pin welding disc through a pin;
the LED chip comprises a red LED chip, a green LED chip and a blue LED chip, the pad surface is located on the wiring layer, the wiring layer is provided with a circuit, the circuit is electrically connected with the pin pad, the wiring layer is insulated from the graphene thermoelectric conversion layer, the graphene thermoelectric conversion layer is electrically connected with an LED display screen power supply device through a thermoelectric conversion lead, and the graphene thermoelectric conversion layer is used for absorbing heat emitted by the circuit and external heat absorbed by the micro LED panel and converting the heat into electric energy.
2. The micro LED display panel of claim 1, wherein a graphene pad is disposed under the pin pad, and the pin pad and the graphene pad are insulated from each other; the graphene thermoelectric conversion layer is electrically connected with the graphene pad.
3. The micro LED display panel of claim 1, wherein the graphene thermoelectric conversion layer comprises a graphene thermoelectric conversion film.
4. The micro LED display panel of claim 1, wherein at a longitudinal centerline of the lamp body, the graphene thermoelectric conversion layer has a groove communicating with the light emitting surface and opening, the groove is square or arc-shaped, the groove is insulated from a pin, a lead is disposed in the groove and connected to the graphene pad, a graphene thermoelectric conversion film is disposed in the groove, and the graphene thermoelectric conversion film is connected to the graphene thermoelectric conversion film and the graphene pad through the thermoelectric conversion lead.
5. The micro LED display panel of claim 1, wherein the graphene thermoelectric conversion layer is divided into a number of lateral and/or longitudinal cavities, and a graphene thermoelectric conversion film is disposed within the cavities.
6. The micro LED display panel of claim 1, wherein at least one cavity is disposed in the graphene thermoelectric conversion layer, a micro tube is disposed in the cavity, the micro tube may be a circular tube with a circular cross section or a square tube with a square cross section, and the micro tube contains a copper chloride solution.
7. The micro LED display panel of claim 1, wherein the graphene thermoelectric conversion layer is divided into a plurality of horizontal or vertical grooves, the upper ends of the grooves are closed, the lower ends of the grooves are open, square pipes with square cross-section or circular pipes with circular cross-section are arranged in the grooves, and copper chloride solution is filled in the square pipes or the circular pipes.
8. The micro LED display panel of claim 1, wherein the graphene thermoelectric conversion layer is divided into a plurality of transverse or longitudinal cavities, the cavities are closed at the periphery, and the cavities in the micro LED panel are communicated with each other; the cavity is filled with a copper chloride solution.
9. The micro LED display panel of claim 1, wherein the lamp body comprises the LED pixel lamp; the four LED pixel lamps are arranged on the light-emitting surface in a 2 x 2 array; the LED pixel lamp comprises the LED chips, and the LED chips comprise a red LED chip (R chip), a green LED chip (G chip) and a blue LED chip (B chip); the R chip, the G chip and the B chip comprise a first electrode and a second electrode, and the first electrode and the second electrode respectively correspond to pins of the LED pixel lamp; the pins comprise a row signal pin and a column signal pin, wherein the column signal pin comprises a red signal pin corresponding to an R chip of the LED chip, a green signal pin corresponding to a G chip and a blue signal pin corresponding to a B chip; the first electrodes of the R chip, the G chip and the B chip are connected to the same row signal pin, and the second electrodes of the R chip, the G chip and the B chip are connected to the corresponding red signal pin, green signal pin and blue signal pin; the row signal pins and the column signal pins are electrically connected with the LED chip through the circuit in the lamp body, the first electrode is a cathode, and the second electrode is an anode; the circuit is a cascode circuit; the circuit is on the routing layer.
10. The micro LED display panel of any one of claims 1-8, wherein the lamp body comprises the LED pixel lamp; the LED pixel lamp array is arranged on the light emitting surface, the arrangement formula of the array is NxM, N is a positive integer, M is a positive integer, N is M, N is the number of rows of the LED pixel lamps included in the lamp body, and M is the number of columns of the LED pixel lamps included in the lamp body.
11. The micro LED display panel of claim 10, wherein the array is arranged in a 2 x 2 pattern.
12. The micro LED display panel of any one of claims 1-8, wherein at least one of the LED pixel light arrays is arranged on the light emitting surface to form a lamp body, the array is arranged according to the formula of a × B, wherein a is equal to or less than B, and both a and B are positive integers, a is a number of rows of the LED pixel lights included in the lamp body, and B is a number of columns of the LED pixel lights included in the lamp body.
13. An LED display screen, characterized in that the LED display screen comprises the micro LED display panel of any one of claims 1 to 12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011265716.6A CN114495736A (en) | 2020-11-12 | 2020-11-12 | Micro LED display panel, display module and LED display screen |
| PCT/CN2021/075097 WO2022099942A1 (en) | 2020-11-12 | 2021-02-03 | Micro led display panel, display module and led display screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011265716.6A CN114495736A (en) | 2020-11-12 | 2020-11-12 | Micro LED display panel, display module and LED display screen |
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| CN114495736A true CN114495736A (en) | 2022-05-13 |
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| WO (1) | WO2022099942A1 (en) |
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